Component crimping device and control method for component crimping device

Abstract

To provide a component crimping device or the like, enabling suppression of deterioration of an anisotropic electrically conductive member.SOLUTION: A component crimping device 100 comprises: a stage 110 mounted with a substrate 200 on which a component 230 is mounted via an anisotropic electrically conductive member 220; a plurality of backup units 120; a heating unit 130 heating the plurality of backup units 120; a plurality of thermal crimping heads 150; a migration portion 170 changing a relative position of the substrate 200, the plurality of backup units 120, and the plurality of thermal crimping heads 150; and a control unit. The plurality of electrodes are arranged at a first pitch. The plurality of backup units 120 are arranged at a second pitch, and are arranged in such a manner that a gap 300 making an end portion of the substrate 200 expose between the adjacent backup unit 120 is provided. The control unit makes the movement unit 170 change the relative position to perform thermal compression on the plurality of thermal crimping heads 150.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a component pressure-bonding device for thermocompression-bonding components to a substrate and a control method for the component pressure-bonding device.

Background Art

[0002] Conventionally, via an anisotropic conductive film (ACF), which is an anisotropic conductive member adhered as an adhesive member to an end portion of a substrate such as a display panel like a liquid crystal panel or an organic EL (Electro Luminescence) panel, an electronic component such as a drive circuit (hereinafter simply referred to as "component") is thermocompression-bonded to the substrate. There is a component pressure-bonding device for this purpose (see, for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] When the number of components placed on the substrate is larger than the number of pressure-bonding heads provided in the pressure-bonding device, the thermocompression-bonding of the components is performed multiple times. Here, during the thermocompression-bonding, heat also transfers to the anisotropic conductive members on which components that are not being thermocompression-bonded, that is, components not being thermocompression-bonded by the pressure-bonding head, are placed. When heat transfers to the anisotropic conductive member at a timing other than during the thermocompression-bonding of the component placed on the anisotropic conductive member, the anisotropic conductive member deteriorates due to the heat.

[0005] The present invention provides a component pressure-bonding device and the like that can suppress the deterioration of the anisotropic conductive member.

Means for Solving the Problems

[0006] A component crimping device according to one aspect of the present invention includes a stage on which a substrate having a plurality of electrode portions and on which components are placed via anisotropic conductive members on each of the plurality of electrode portions is placed, a plurality of backup portions that support an end portion of the substrate placed on the stage from below the substrate, a heating portion that heats the plurality of backup portions, a plurality of thermocompression bonding heads that are provided above each of the plurality of backup portions so as to be movable up and down and perform thermocompression bonding of the plurality of components to the substrate supported by the plurality of backup portions, a moving portion that changes a relative position between the substrate placed on the stage, the plurality of backup portions, and the plurality of thermocompression bonding heads along the arrangement direction of the plurality of electrode portions, and a control portion that controls the plurality of thermocompression bonding heads and the moving portion. The plurality of electrode portions are arranged side by side at a first pitch along an end portion of the substrate, the plurality of backup portions are arranged side by side at a second pitch that is N times (N is an integer of 2 or more) the first pitch along the arrangement direction, and are arranged so as to provide a gap that exposes an end portion of the substrate between adjacent backup portions. The control portion causes the plurality of thermocompression bonding heads to perform the thermocompression bonding a plurality of times by changing the relative position of the moving portion.

[0007] Also, a control method for a component crimping device according to an aspect of the present invention includes a stage on which a substrate having a plurality of electrode portions and having components placed thereon via anisotropic conductive members at each of the plurality of electrode portions is placed, a plurality of backup portions that support an end portion of the substrate placed on the stage from below the substrate, a heating portion that heats the plurality of backup portions, a plurality of thermocompression heads that are provided above each of the plurality of backup portions so as to be movable up and down and perform thermocompression bonding of the plurality of components to the substrate supported by the plurality of backup portions, and a moving portion that changes a relative position between the substrate placed on the stage, the plurality of backup portions, and the plurality of thermocompression heads along the arrangement direction of the plurality of electrode portions. In the control method for the component crimping device, the plurality of electrode portions are arranged side by side at a first pitch along an end portion of the substrate, the plurality of backup portions are arranged side by side at a second pitch that is N times (N is an integer of 2 or more) the first pitch along the arrangement direction, and are arranged so as to provide a gap that exposes an end portion of the substrate between adjacent backup portions, and the thermocompression bonding is performed on the plurality of thermocompression heads a plurality of times by changing the relative position by the moving portion.

[0008] These general or specific aspects may be implemented in a system, method, integrated circuit, computer program, or non-transitory recording medium such as a computer-readable CD-ROM, or may be implemented in any combination of a system, method, integrated circuit, computer program, and recording medium.

Effects of the Invention

[0009] According to the present invention, it is possible to provide a component crimping device or the like that can suppress deterioration of the anisotropic conductive member.

Brief Description of the Drawings

[0010]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

DETAILED DESCRIPTION OF THE INVENTION

[0011] Hereinafter, a component crimping device and the like according to an embodiment of the present invention will be described in detail with reference to the drawings. Note that each of the embodiments described below shows a specific example of the present invention. Therefore, the numerical values, shapes, materials, components, arrangements and connection forms of the components, steps, and the order of steps shown in the following embodiments are merely examples and are not intended to limit the present invention. Thus, among the components in the following embodiments, the components not described in the independent claims are described as optional components.

[0012] Also, each figure is a schematic diagram and is not necessarily drawn precisely. Therefore, for example, scales etc. in each figure do not necessarily match. Also, in each figure, the same reference numerals are assigned to the same components.

[0013] Also, in this specification and the drawings, the X-axis, Y-axis, and Z-axis represent the three axes of a three-dimensional orthogonal coordinate system. The X-axis and Y-axis are perpendicular to each other and both are perpendicular to the Z-axis. Also, in the following embodiments, there may be cases where the positive direction of the Z-axis is described as upward and the negative direction of the Z-axis is described as downward. Also, in the following embodiments, the case of viewing the component crimping device from the X-axis direction is described as a side view, and the case of viewing the component crimping device from the Y-axis direction is described as a front view.

[0014] Also, in this specification, terms indicating the shape of elements such as rectangles, and terms representing numerical values such as the first pitch, are not expressions representing only strict meanings, but are expressions meaning to include substantially equivalent ranges, for example, differences of about several percent.

[0015] Also, in this specification, ordinal numbers such as "first" and "second" do not mean the number or order of components unless otherwise specified, but are used for the purpose of distinguishing components to avoid confusion of the same kind of components.

[0016] (Embodiment) [Configuration] First, the configuration of the component mounting device according to the embodiment will be described.

[0017] FIG. 1 is a perspective view showing a component crimping device 100 according to the embodiment. FIG. 2 is a side view showing the component crimping device according to the embodiment.

[0018] The component crimping device 100 is a device that thermally crimps a component 230 to a substrate 200 via an anisotropic conductive member 220. Specifically, while heating the backup part 120 with the heating part 130, the component crimping device 100 presses the component 230 placed on the substrate 200 via the anisotropic conductive member 220 with a thermocompression bonding head 150 heated by a heater (not shown) or the like, thereby thermally crimping the component 230 to the substrate 200.

[0019] Each device such as the heating part 130, the thermocompression bonding head 150, and the moving part 170 included in the component crimping device 100 is communicably connected by a control part 180 (see FIG. 4) and a control line (not shown) or the like, and executes a predetermined operation for each device by being controlled by the control part 180.

[0020] The component crimping device 100 is, for example, a part of a component mounting system for producing a display panel or the like. In the component mounting system, for example, an anisotropic conductive member 220 is adhered to an electrode part 210 provided on a substrate 200, and the substrate 200 and the component 230 are thermally crimped via the anisotropic conductive member 220. Thereby, the electrode part 210 provided on the substrate 200 and the electrode part provided on the component 230 are electrically connected, and the substrate 200 and the component 230 are adhered to each other, so that the component 230 is mounted on the substrate 200.

[0021] The component crimping device 100 thermally crimps (for example, so-called main crimping) the component 230 to the substrate 200 conveyed from an upstream device by a substrate conveying device (not shown) via the anisotropic conductive member 220. The substrate 200 to which the component 230 is thermally crimped is conveyed to a downstream device by the substrate conveying device, for example.

[0022] Examples of the substrate 200 include a display panel using a glass substrate or the like.

[0023] FIG. 3 is a top view showing the substrate 200 according to the embodiment.

[0024] The substrate 200 is provided with a plurality of electrode portions 210. Further, the plurality of electrode portions 210 are arranged on the substrate 200 at a first pitch along, for example, an end portion of the substrate 200 (in this embodiment, the edge on the positive Y-axis side). In this embodiment, the substrate 200 is rectangular in a top view. Also, in this embodiment, the end portion of the substrate 200 is the edge on the positive Y-axis side.

[0025] Note that the number of electrode portions 210 arranged on the substrate 200 may be plural and is not particularly limited.

[0026] Also, the first pitch indicates, for example, the center-to-center distance between adjacent electrode portions 210 in a top view.

[0027] Examples of the anisotropic conductive member 220 include an ACF (Anisotropic Conductive Film). The anisotropic conductive member 220 is composed of, for example, a thermosetting resin and metal particles contained in the thermosetting resin. The anisotropic conductive member 220 is cured by heating to ensure conductivity between the electrode portion 210 and the component 230 and to fix the substrate 200 and the component 230.

[0028] Examples of the component 230 include flexible components such as a TCP (Tape Carrier Package) and an FPC (Flexible Printed Circuits).

[0029] FIG. 4 is a block diagram showing the functional configuration of the component pressing device 100 according to the embodiment.

[0030] The component pressing device 100 includes a stage 110, a plurality of backup portions 120, a heating portion 130, a plurality of thermocompression heads 150, a cooling portion 160, a moving portion 170, a control portion 180, and a storage portion 190.

[0031] Stage 110 is a stage for holding substrate 200. Specifically, stage 110 has a plurality of electrode portions 210, and substrate 200 on which components 230 are placed via anisotropic conductive members 220 are placed on each of the plurality of electrode portions 210. On stage 110, for example, substrate 200 conveyed by the above-described substrate transfer device is placed. On stage 110, for example, a plurality of suction holes (not shown) are formed so as to penetrate the upper surface. A vacuum pump or the like (not shown) for sucking substrate 200 placed on stage 110 is connected to the suction holes. By the suction of the vacuum pump, substrate 200 is held on stage 110.

[0032] Substrate 200 is placed on stage 110 in a state where an end portion of substrate 200 protrudes from stage 110. The end portion is supported from below by a plurality of backup portions 120.

[0033] Also, stage 110 is movably provided by moving portion 170.

[0034] The plurality of backup portions 120 are stages for supporting the end portion of substrate 200. Specifically, the plurality of backup portions 120 support the end portion of substrate 200 placed on stage 110 from below the substrate 200. Also, the plurality of backup portions 120 are arranged apart from each other. Specifically, the plurality of backup portions 120 are arranged side by side at a second pitch along the arrangement direction of the plurality of electrode portions 210 (in the Y-axis direction in the present embodiment). Also, the plurality of backup portions 120 are arranged such that a gap 300 for exposing the end portion of substrate 200 is provided between adjacent backup portions 120. Thereby, a gap 300 is provided between adjacent backup portions 120.

[0035] Note that the second pitch is a wider interval than the first pitch. In the present embodiment, the second pitch is N times (N is an integer of 2 or more) the first pitch.

[0036] The gap 300 is a space located between the plurality of backup portions 120.

[0037] Note that the plurality of backup portions 120 indicate, for example, a plurality of stages. However, it is sufficient that the portion supporting the substrate 200 is divided into a plurality, and it may be a stage in which the plurality of backup portions 120 are integrally formed and connected below, that is, a gap 300 is provided.

[0038] The heating unit 130 is a heating mechanism (heater) for heating the plurality of backup portions 120. The heating unit 130 is realized by, for example, a heating wire, but may also be realized by a Peltier element or the like.

[0039] The plurality of thermocompression bonding heads 150 are head portions for thermocompression bonding the component 230 to the substrate 200. The plurality of thermocompression bonding heads 150 are provided above each of the plurality of backup portions 120 so as to be movable up and down (that is, provided so as to be movable by vertical movement), and thermocompression bond the plurality of components 230 to the substrate 200 supported by the plurality of backup portions 120.

[0040] The plurality of thermocompression bonding heads 150 are arranged so as to face the plurality of backup portions 120. In the present embodiment, the number of the plurality of thermocompression bonding heads 150 is the same as the number of the plurality of backup portions 120, and they face the plurality of backup portions 120 one-to-one. That is, in the present embodiment, the plurality of thermocompression bonding heads 150 are arranged side by side at a second pitch.

[0041] The plurality of thermocompression bonding heads 150 thermocompression bond the component 230 to the substrate 200 through the anisotropic conductive member 220 while being heated by, for example, a heater (not shown).

[0042] Each of the plurality of thermocompression bonding heads 150 is realized by a head for pressing the component 230 against the substrate 200, a heating mechanism such as a heater for heating the head, and a driving mechanism including a guide and a motor for moving the head up and down.

[0043] The cooling unit 160 is a mechanism that cools the substrate 200 by blowing a cooling gas onto the substrate 200 while the substrate 200 is supported by the backup unit 120. Specifically, the cooling unit 160 blows the cooling gas supplied from a gas pipe out of a nozzle having a gas outlet and blows the cooling gas onto the substrate 200 to cool the substrate 200.

[0044] The cooling unit 160 is realized, for example, by a gas supply source that stores a cooling gas, a gas pipe that guides the cooling gas stored in the gas supply source to a nozzle for blowing the cooling gas onto the substrate 200, the nozzle, and an electromagnetic valve for switching whether or not to blow the cooling gas onto the nozzle.

[0045] Note that in each figure, a plurality of nozzles (a plurality of individual cooling units) are illustrated as the cooling unit 160, and illustrations of the gas pipe, the gas supply source, etc. are omitted. The cooling unit 160 includes one or more individual cooling units for blowing a cooling gas onto an end of the substrate 200 located below any of the plurality of components 230. In the present embodiment, the three individual cooling units are arranged such that the positions where the cooling gas is blown are different from each other.

[0046] Each individual cooling unit is realized, for example, by a nozzle and an electromagnetic valve, and the cooling gas is supplied from a common gas supply source via a gas pipe.

[0047] Further, the cooling unit 160 blows the cooling gas onto the end of the substrate 200 from below the substrate 200. Here, the end of the substrate 200 refers to the end where the plurality of components 230 are arranged, in other words, the end where the plurality of electrode portions 210 are provided. Specifically, the cooling unit 160 is arranged to cool the substrate 200 by blowing the cooling gas onto the substrate 200 from the side opposite to the thermocompression head 150 with respect to the substrate 200.

[0048] Also, for example, the cooling unit 160 is arranged to blow the cooling gas onto the end of the substrate 200 through the gap 300.

[0049] Note that the cooling unit 160 may be arranged to blow all the cooling gas blown onto the substrate 200 to the end of the substrate 200 through the gap 300, or the cooling unit 160 may be arranged to blow a part of the cooling gas blown onto the substrate 200 to the end of the substrate 200 through the gap 300. For example, the cooling unit 160 may be arranged to blow the other part of the cooling gas blown onto the substrate 200 to the end of the substrate 200 through the outside of the plurality of backup units 120 in the arrangement direction of the plurality of backup units 120.

[0050] For example, the cooling unit 160 is attached to the base 140 on which the backup unit 120 and the heating unit 130 are removably arranged by bolts or the like. The cooling unit 160 cools the substrate 200 from the side opposite to the thermocompression bonding head 150 with respect to the substrate 200 in a state where the substrate 200 is supported by the backup unit 120.

[0051] Note that the type of the cooling gas is not particularly limited. In the present embodiment, the cooling gas is air at room temperature of about 25°C.

[0052] Further, the cooling unit 160 may be provided with a speed controller or the like in order to adjust the gas flow rate.

[0053] The moving unit 170 is a driving unit that moves the stage 110. The moving unit 170 moves the stage 110 to a position where the substrate 200 can be placed on the stage 110 by the above-described substrate transfer device, for example. Further, the moving unit 170 moves the substrate 200 to a position where the thermocompression bonding head 150 can thermocompression bond the component 230 to the substrate 200. Further, the moving unit 170 changes the relative positions of the substrate 200 placed on the stage 110, the plurality of backup units 120, and the plurality of thermocompression bonding heads 150 along the arrangement direction of the plurality of electrode portions 210.

[0054] Note that the arrangement direction of the plurality of electrode portions 210 means the arrangement direction of the plurality of electrode portions 210 when the substrate 200 is moved directly below the plurality of thermocompression heads 150 (in other words, the position where the substrate 200 is supported by the plurality of backup portions 120, or the position where the component 230 is thermocompression-bonded to the substrate 200). In the present embodiment, the arrangement direction of the plurality of electrode portions 210 is the X-axis direction.

[0055] The moving unit 170 is configured to be able to move the stage 110 arbitrarily in the XY plane and to be able to move up and down in the Z-axis direction, for example, by a guide, a motor, and the like.

[0056] The control unit 180 is a processing unit that controls the operations of the respective devices included in the component bonding device 100, such as the plurality of thermocompression heads 150, the cooling unit 160, and the moving unit 170, and the timing of such operations. The control unit 180 is realized by, for example, a computer including a communication interface for communicating with the respective devices included in the component bonding device 100, a control program stored in a memory for controlling the respective devices included in the component bonding device 100, and a processor such as a CPU (Central Processing Unit) that executes the control program.

[0057] Note that the control unit 180 may be a processing unit that controls all the devices in the component mounting line including the component bonding device 100. For example, the control unit 180 may control a substrate transfer device that transfers the substrate 200 to the stage 110.

[0058] For example, the control unit 180 causes thermal compression bonding to be performed multiple times on the plurality of thermal compression bonding heads 150, and causes the moving unit 170 to change the relative positions of the substrate 200, the plurality of backup units 120, and the plurality of thermal compression bonding heads 150 multiple times. Specifically, after the control unit 180 thermally compression bonds the component 230 to the substrate 200 by controlling the plurality of thermal compression bonding heads 150, it controls the moving unit 170 to move the substrate 200 along the arrangement direction of the plurality of electrode units 210, and then thermally compression bonds the component 230 to the substrate 200 by controlling the plurality of thermal compression bonding heads 150. That is, the control unit 180 controls the moving unit 170 and the plurality of thermal compression bonding heads 150 to thermally compression bond one or more first components among the plurality of components 230 to the substrate 200, moves the substrate 200, and then thermally compression bonds one or more second components different from the first components among the plurality of components 230 to the substrate 200.

[0059] Note that the number of components 230 thermally compression bonded to the substrate 200 at one time may be a plurality and is not particularly limited. That is, the number of times of thermal compression bonding performed repeatedly may be a plurality and is not particularly limited. The plurality of times means, for example, N (as described above, an arbitrary integer), but it may be arbitrary.

[0060] Also, for example, the control unit 180 controls the cooling unit 160 (more specifically, the electromagnetic valve provided in the cooling unit 160 for switching whether to blow the cooling gas) to perform control for switching whether to blow the cooling gas to the cooling unit 160 (that is, turning the cooling gas on and off). For example, the control unit 180 controls the cooling unit 160 so as to reduce the area where the cooling gas is blown to the cooling unit 160 each time thermal compression bonding is performed on the plurality of thermal compression bonding heads 150. For example, when thermal compression bonding is completed for the component 230 adjacent to the component 230 where thermal compression bonding is being performed, the control unit 180 controls the cooling unit 160 not to blow the cooling gas.

[0061] FIG. 5 and FIG. 6 are front views showing the positional relationships among a plurality of backup parts 120, a plurality of thermocompression bonding heads 150, and cooling parts 161, 162, 163 and a substrate 200 included in the component compression bonding apparatus 100 according to the embodiment. Specifically, FIG. 5 is a view showing the first thermocompression bonding to the substrate 200, and FIG. 6 is a view showing the second thermocompression bonding to the substrate 200. More specifically, FIGS. 5 and 6 are an example in the case of N = 2 described above.

[0062] In FIGS. 5 and 6, in order to distinguish the cooling part 160 shown in FIG. 1 for each nozzle (specifically, individual cooling parts), the cooling parts 161, 162, 163 are denoted by reference numerals. Further, in FIGS. 5 and 6, in order to distinguish the plurality of components 230 shown in FIG. 1 for each component, the components 231, 232, 233, 234, 235, 236 are denoted by reference numerals. In the example shown in FIGS. 5 and 6, the cooling parts 161, 162 are arranged to blow cooling gas onto the end of the substrate 200 through the gap 300. Further, the cooling part 163 is arranged to blow cooling gas onto the end of the substrate 200 through the outside of the plurality of backup parts 120 without passing through the gap 300.

[0063] First, as shown in FIG. 5, for example, the control unit 180 controls the plurality of thermocompression bonding heads 150 to thermocompression bond the components 231, 233, 235 to the substrate 200 via the anisotropic conductive member 220. At this time, the control unit 180 causes the cooling parts 161, 162, 163 to blow cooling gas onto the substrate 200 by controlling the cooling parts 161, 162, 163, for example.

[0064] Next, the control unit 180 moves the substrate 200 in the negative X-axis direction by controlling the moving part 170, for example, to move the position of the substrate 200 from the position shown in FIG. 5 to the position shown in FIG. 6.

[0065] Next, as shown in FIG. 6, for example, the control unit 180 controls the plurality of thermocompression bonding heads 150 to thermocompression bond the components 232, 234, and 236 to the substrate 200 via the anisotropic conductive member 220. At this time, the control unit 180, for example, does not cause the cooling units 161, 162, and 163 to blow the cooling gas onto the substrate 200. In this way, the control unit 180 controls, for example, the individual cooling units (cooling units 161, 162, and 163) corresponding to the components 231, 233, and 235 for which thermocompression bonding has been completed so as not to perform the blowing of the cooling gas. For example, the control unit 180 controls the individual cooling units (cooling units 161, 162, and 163 in the examples shown in FIGS. 5 and 6) for blowing the cooling gas onto the end portion of the substrate 200 located below the components (for example, components 232, 234, and 236 in the state shown in FIG. 5) for which thermocompression bonding has not been completed so as to perform the blowing of the cooling gas, and controls the individual cooling units for blowing the cooling gas onto the end portion of the substrate 200 located below the components (for example, components 231, 233, and 235 in the state shown in FIG. 6) for which thermocompression bonding has been completed so as not to perform the blowing of the cooling gas.

[0066] Note that the individual cooling units corresponding to the components 231, 232, and 233 refer to the individual cooling units for cooling the end portion of the substrate 200 located directly below the corresponding component, and are, for example, the individual cooling units for blowing the cooling gas onto the end portion of the substrate 200 located directly below the components 231, 232, and 233.

[0067] The storage unit 190 is a storage device that stores various data necessary for the component compression bonding process, such as the size of the substrate 200, the types of components 230 mounted on the substrate 200, the mounting positions, the mounting directions, the operations of the respective devices, the timings of the operations, the timings of transporting the substrate 200, and the control program executed by the control unit 180.

[0068] The storage unit 190 is realized by, for example, a memory such as a ROM (Read Only Memory) or a RAM (Random Access Memory).

[0069] [Processing Procedure] Next, the processing procedure of the component crimping device 100 will be described.

[0070] FIG. 7 is a flowchart showing the processing procedure of the component crimping device 100 according to the embodiment.

[0071] First, the control unit 180 controls a substrate transfer device (not shown), the moving unit 170, etc., to place the substrate 200 on which the component 230 is placed via the anisotropic conductive member 220 on the stage 110 (step S101).

[0072] Next, the control unit 180 controls the moving unit 170 to move the stage 110 so that the end of the substrate 200 is positioned between the thermocompression head 150 and the backup unit 120, and supports the end of the substrate 200 by the backup unit 120 (S102).

[0073] Next, the control unit 180 starts the cooling unit 160 to blow cooling gas onto the substrate 200 (S103).

[0074] Next, the control unit 180 controls the thermocompression head 150 to thermocompression-bond the component 230 to the substrate 200 via the anisotropic conductive member 220 to the thermocompression head 150 (S104). For example, the control unit 180 thermocompression-bonds the component 230 with the thermocompression head 150 for a predetermined time. Note that the control unit 180 may include a timekeeping unit such as an RTC (Real Time Clock) for measuring time. Further, the control unit 180 controls the thermocompression head 150 to raise the thermocompression head 150 to end the thermocompression of the component 230.

[0075] Next, the control unit 180 determines whether or not the thermocompression of all the components placed on the substrate 200 has been completed (S105). In the storage unit 190, for example, information indicating a predetermined number of times of performing thermocompression on one substrate 200 is stored in advance. The control unit 180, for example, counts the number of times of thermocompression performed on one substrate 200 and determines whether or not the thermocompression has been executed the predetermined number of times.

[0076] When the control unit 180 determines that the thermocompression bonding of all the components placed on the substrate 200 is not completed (No in S105), it controls the moving unit 170 to move the stage 110 so that the component 230 for which the thermocompression bonding is not yet completed is positioned to face the thermocompression bonding head 150 (S106).

[0077] Next, the control unit 180 determines the position where the cooling gas is to be blown by the cooling unit 160 (S107). In the storage unit 190, for example, information indicating at which position below the end of the substrate 200 the cooling gas is to be blown, or information indicating from which individual cooling unit the cooling gas is to be blown, is stored in advance for each number of times of thermocompression bonding performed on one substrate 200. The control unit 180 counts, for example, the number of times of thermocompression bonding performed on one substrate 200, and based on the counted number, determines at which position below the end of the substrate 200 the cooling gas is to be blown, or from which individual cooling unit the cooling gas is to be blown.

[0078] Next, the control unit 180 controls the cooling unit 160 so that the cooling gas is blown at the determined blowing position (S108), and returns the process to step S104.

[0079] When the control unit 180 determines that the thermocompression bonding of all the components placed on the substrate 200 is completed (Yes in S105), if the cooling gas is being blown onto the substrate 200 by the cooling unit 160, it causes the cooling unit 160 to end the blowing of the cooling gas onto the substrate 200 (S109).

[0080] Next, the control unit 180 controls the moving unit 170 to separate the substrate 200 from the backup unit 120 (step S110).

[0081] Next, the control unit 180 controls the moving unit 170 to retract the substrate 200 from the stage 110 (step S111).

[0082] Note that in step S107, the control unit 180 may determine not to blow the cooling gas onto the cooling unit 160. In this case, the control unit 180 may control the cooling unit 160 so as not to blow the cooling gas in step S108.

[0083] [Effects, etc.] As described above, the component crimping device 100 according to the embodiment includes a stage 110 on which a substrate 200 having a plurality of electrode portions 210 and on which components 230 are placed via anisotropic conductive members 220 on each of the plurality of electrode portions 210 is placed, a plurality of backup portions 120 that support an end portion of the substrate 200 placed on the stage 110 from below the substrate 200, a heating unit 130 that heats the plurality of backup portions 120, a plurality of thermocompression heads 150 that are provided above each of the plurality of backup portions 120 so as to be movable up and down and perform thermocompression bonding of the plurality of components 230 to the substrate 200 supported by the plurality of backup portions 120, a moving unit 170 that changes the relative positions of the substrate 200 placed on the stage 110, the plurality of backup portions 120, and the plurality of thermocompression heads 150 along the arrangement direction of the plurality of electrode portions 210, and a control unit 180 that controls the plurality of thermocompression heads 150 to perform thermocompression bonding and causes the moving unit 170 to change the relative positions a plurality of times. The plurality of electrode portions 210 are arranged side by side at a first pitch along an end portion of the substrate 200. The plurality of backup portions 120 are arranged side by side at a second pitch that is N times the first pitch (N is an integer of 2 or more) along the arrangement direction, and are arranged such that a gap 300 that exposes an end portion of the substrate 200 is provided between adjacent backup portions 120. The control unit 180 causes the plurality of thermocompression heads 150 to perform thermocompression bonding and causes the moving unit 170 to change the relative positions a plurality of times.

[0084] When thermocompression-bonding the component 230 to the substrate 200, for example, the anisotropic conductive member 220 provided on the substrate 200 is heated by heating the plurality of backup portions 120 with the heating portion 130. Thereby, during thermocompression bonding, the anisotropic conductive member 220 is cured by the heat from the heating portion 130 being applied via the plurality of backup portions 120, ensuring the conductivity between the electrode portion 210 and the component 230 and fixing the substrate 200 and the component 230. Here, when thermocompression bonding is performed a plurality of times on the same substrate 200, if the backup portions 120 that support the substrate 200 are provided so as to support the entire lower part of the substrate 200, heat from the heating portion 130 is applied to all of the plurality of components. Thus, while thermocompression bonding is being performed on a certain component 230, heat is also applied to the components 230 on which thermocompression bonding is not being performed. Then, the anisotropic conductive member 220 will cure, that is, the anisotropic conductive member 220 will deteriorate, so that the substrate 200 and the component 230 will not be properly fixed when thermocompression bonding is performed. Therefore, the plurality of backup portions 120 included in the component bonding apparatus 100 are arranged side by side at a second pitch along the arrangement direction, and are arranged so that a gap 300 exposing the end portion of the substrate 200 is provided between adjacent backup portions 120. That is, a position not supported by the backup portion 120 is provided below the substrate 200. For example, the plurality of backup portions 120 are provided in a one-to-one correspondence with the plurality of thermocompression heads 150. According to this, only the location on the substrate 200 where the component 230 to be thermocompression-bonded is located is supported by the plurality of backup portions 120. That is, only the location on the substrate 200 where the component 230 to be thermocompression-bonded is located is heated by the plurality of backup portions 120 via the heating portion 130. Therefore, even during thermocompression bonding, deterioration of the anisotropic conductive member 220 located below the component 230 on which thermocompression bonding is not being performed can be suppressed.

[0085] Also, for example, the component bonding apparatus 100 further includes a cooling portion 160 that blows cooling gas from below the substrate 200 onto the end portion of the substrate 200.

[0086] According to this, even during thermocompression bonding, the cooling unit 160 can cool the end portion of the substrate 200 located below the un-thermocompression-bonded component 230, so that the deterioration of the anisotropic conductive member 220 located below the component 230 can be further suppressed.

[0087] Also, for example, the cooling unit 160 is arranged to blow a cooling gas onto the end portion of the substrate 200 through the gap 300.

[0088] According to this, in the arrangement direction of the plurality of components 230, the component 230 located on the central side among the plurality of components 230 can be easily cooled by the cooling unit 160 from below the substrate 200 through the gap 300 to the end portion of the substrate 200.

[0089] Also, for example, when the thermocompression bonding has been completed for the component adjacent to the component 230 where the thermocompression bonding is performed, the control unit 180 controls the cooling unit 160 so as not to blow the cooling gas.

[0090] For example, in the example shown in FIG. 6, since the thermocompression bonding has been completed for the components 233 and 235 adjacent to the component 234 where the thermocompression bonding is performed, the control unit 180 controls the cooling units 161 and 162 so as not to blow the cooling gas.

[0091] For the component 230 for which the thermocompression bonding has been completed, since the anisotropic conductive member 220 located below the component 230 has already been heated and cured, it will not deteriorate even if more heat is applied. Therefore, according to this, unnecessary use of the cooling gas can be suppressed.

[0092] Further, for example, the cooling unit 160 includes one or more individual cooling units for blowing cooling gas onto an end portion of the substrate 200 located below any of the plurality of components 230. Also, for example, the control unit 180 controls an individual cooling unit for blowing cooling gas onto an end portion of the substrate 200 located below a component 230 where thermocompression bonding is not completed, to cause the blowing of the cooling gas, and controls an individual cooling unit for blowing cooling gas onto an end portion of the substrate 200 located below a component 230 where thermocompression bonding is completed, not to cause the blowing of the cooling gas.

[0093] According to this, for example, even when thermocompression bonding is performed three or more times on one substrate 200, it is possible to easily blow the cooling gas to an appropriate position. Therefore, according to this, unnecessary use of the cooling gas can be suppressed.

[0094] Also, the control method of the component bonding apparatus 100 according to the embodiment includes a stage 110 on which a substrate 200 having a plurality of electrode portions 210 and on which components 230 are placed via anisotropic conductive members 220 on each of the plurality of electrode portions 210 is placed, a plurality of backup portions 120 that support an end portion of the substrate 200 placed on the stage 110 from below the substrate 200, a heating unit 130 that heats the plurality of backup portions 120, a plurality of thermocompression bonding heads 150 that are provided above each of the plurality of backup portions 120 so as to be movable up and down and perform thermocompression bonding of the plurality of components 230 to the substrate 200 supported by the plurality of backup portions 120, and a moving unit 170 that changes the relative positions of the substrate 200 placed on the stage 110, the plurality of backup portions 120, and the plurality of thermocompression bonding heads 150 along the arrangement direction of the plurality of electrode portions 210. The plurality of electrode portions 210 are arranged side by side at a first pitch along an end portion of the substrate 200. The plurality of backup portions 120 are arranged side by side at a second pitch that is N times (N is an integer of 2 or more) the first pitch along the arrangement direction, and are arranged such that a gap 300 that exposes an end portion of the substrate 200 is provided between adjacent backup portions 120. In the control method of the component bonding apparatus 100, thermocompression bonding is performed on the plurality of thermocompression bonding heads 150 a plurality of times by changing the relative positions of the moving unit 170.

[0095] According to this, the same effects as those of the component crimping device 100 are achieved.

[0096] [Modification Example] In the above example, the component crimping device 100 includes three backup parts 120, three thermocompression bonding heads 150, and three individual cooling parts. The number of the plurality of backup parts 120, the plurality of thermocompression bonding heads 150, and the individual cooling parts included in the component crimping device 100 is not particularly limited.

[0097] Hereinafter, a modification example of the component crimping device will be described. In the modification example described below, the component crimping device includes two backup parts 120, two thermocompression bonding heads 150, and four individual cooling parts (cooling parts 161, 162, 163, 164). Regarding other components, the component crimping device according to the modification example is the same as the above-described component crimping device 100.

[0098] FIG. 8, FIG. 9, and FIG. 10 are front views showing the positional relationship between a plurality of backup parts 120, a plurality of thermocompression bonding heads 150, and cooling parts 161, 162, 163, 164 included in the component crimping device according to the modification example of the embodiment and the substrate 200. Specifically, FIG. 8 is a view showing the first thermocompression bonding to the substrate 200, FIG. 9 is a view showing the second thermocompression bonding to the substrate 200, and FIG. 10 is a view showing the third thermocompression bonding to the substrate 200. More specifically, FIG. 8, FIG. 9, and FIG. 10 are an example in the case of N = 3 described above.

[0099] In FIGS. 8, 9, and 10, in order to distinguish each nozzle (specifically, the individual cooling unit) corresponding to the cooling unit 160 shown in FIG. 1, the cooling units 161, 162, 163, and 164 are denoted with reference numerals. Further, in FIGS. 8, 9, and 10, in order to distinguish a plurality of components 230 from each other, the components 231, 232, 233, 234, 235, and 236 are denoted with reference numerals. In the example shown in FIGS. 8, 9, and 10, the cooling units 161 and 162 are arranged to blow cooling gas onto the end portion of the substrate 200 through the gap 300. Further, the cooling units 163 and 164 are arranged to blow cooling gas onto the end portion of the substrate 200 through the outside of the plurality of backup units 120 without passing through the gap 300.

[0100] First, as shown in FIG. 8, for example, the control unit 180 controls the plurality of thermocompression heads 150 to thermocompression bond the components 231 and 234 to the substrate 200 via the anisotropic conductive member 220. At this time, the control unit 180 causes the cooling gas to be blown onto the substrate 200 by controlling the cooling units 161, 162, 163, and 164, for example.

[0101] Next, the control unit 180 moves the substrate 200 in the negative X-axis direction by controlling the moving unit 170, for example, to move the position of the substrate 200 from the position shown in FIG. 8 to the position shown in FIG. 9.

[0102] Next, for example, as shown in FIG. 9, the control unit 180 controls a plurality of thermocompression bonding heads 150 to thermocompression bond components 232 and 235 to the substrate 200 via the anisotropic conductive member 220. At this time, for example, the control unit 180 causes the cooling units 161 and 163 to blow cooling gas onto the substrate 200, and does not cause the cooling units 162 and 164 to blow cooling gas onto the substrate 200. In this way, for example, with respect to the individual cooling units (cooling units 161 and 163) corresponding to the components 233 and 236 for which thermocompression bonding is not yet complete, the control unit 180 controls to cause blowing of the cooling gas, and with respect to the individual cooling unit (cooling unit 162) corresponding to the component 234 for which thermocompression bonding is complete, the control unit 180 controls not to cause blowing of the cooling gas. Note that in the state shown in FIG. 9, the component bonding device does not have an individual cooling unit corresponding to the component 231 for which thermocompression bonding is complete, but may have an individual cooling unit corresponding to the component 231 in this state.

[0103] Next, for example, the control unit 180 controls the moving unit 170 to move the substrate 200 in the negative X-axis direction, thereby moving the position of the substrate 200 from the position shown in FIG. 9 to the position shown in FIG. 10.

[0104] Next, for example, as shown in FIG. 10, the control unit 180 controls a plurality of thermocompression bonding heads 150 to thermocompression bond components 233 and 236 to the substrate 200 via the anisotropic conductive member 220. At this time, for example, since thermocompression bonding of the components 231, 232, 234, and 235 is complete, the control unit 180 does not cause the cooling units 161, 162, 163, and 164 to blow cooling gas onto the substrate 200.

[0105] (Other Embodiments) As described above, the component bonding device and the like according to the present embodiment have been described based on the above embodiment, but the present invention is not limited to the above embodiment.

[0106] For example, in the above-described embodiment, the moving unit that changes the relative positions of the substrate 200 placed on the stage 110, the plurality of backup units 120, and the plurality of thermocompression heads 150 along the arrangement direction of the plurality of electrode units 210 is realized by the moving unit 170 that moves the stage 110. However, it may also be realized by a drive mechanism that moves the plurality of thermocompression heads 150 and the plurality of backup units 120.

[0107] Also, in the above-described embodiment, the cooling unit 160 has a plurality of nozzles, but it may also have a configuration in which a plurality of cooling gas ejection ports are provided in one nozzle.

[0108] Also, for example, in the above-described embodiment, all or part of the components of the control unit 180 may be configured by dedicated hardware, or may be realized by executing a software program suitable for each component. Each component may be realized by a program execution unit such as a CPU (Central Processing Unit) or a processor reading and executing a software program recorded on a non-temporary recording medium such as an HDD (Hard Disk Drive) or a semiconductor memory.

[0109] Also, the components of the control unit 180 may be configured by one or more electronic circuits. Each of the one or more electronic circuits may be a general-purpose circuit or a dedicated circuit.

[0110] One or more electronic circuits may include, for example, a semiconductor device, an IC (Integrated Circuit), or an LSI (Large Scale Integration). The IC or LSI may be integrated on one chip or on multiple chips. Here, it is called an IC or LSI, but the name may change depending on the degree of integration and may be called a system LSI, a VLSI (Very Large Scale Integration), or a ULSI (Ultra Large Scale Integration). Also, an FPGA (Field Programmable Gate Array) programmed after the manufacture of the LSI can be used for the same purpose.

[0111] In addition, forms obtained by applying various modifications that those skilled in the art can come up with for each embodiment, and forms realized by arbitrarily combining the components and functions in each embodiment without departing from the spirit of the present invention are also included in the present invention.

Industrial Applicability

[0112] The present invention can be used in a component crimping device that crimps components onto a substrate, such as a component mounting line for producing a liquid crystal panel.

Explanation of Signs

[0113] 100 Component crimping device 110 Stage 120 Backup part 130 Heating part 140 Base 150 Thermal crimping head 160, 161, 162, 163, 164 Cooling part 170 Moving part 180 Control part 190 Storage part 200 Substrate 210 Electrode part 220 Anisotropic conductive member 230, 231, 232, 233, 234, 235, 236 Components 300 voids

Claims

1. A stage on which a substrate having a plurality of electrode portions and on which components are mounted via anisotropic conductive members on each of the plurality of electrode portions is placed; A plurality of backup portions that support an end portion of the substrate placed on the stage from below the substrate; A heating portion that heats the plurality of backup portions; A plurality of thermocompression bonding heads that are provided above each of the plurality of backup portions so as to be movable up and down, and perform thermocompression bonding of the plurality of components to the substrate supported by the plurality of backup portions; A moving portion that changes a relative position among the substrate placed on the stage, the plurality of backup portions, and the plurality of thermocompression bonding heads along the arrangement direction of the plurality of electrode portions; A control portion that controls the plurality of thermocompression bonding heads and the moving portion; and the plurality of electrode portions are arranged side by side at a first pitch along an end portion of the substrate; the plurality of backup portions are arranged side by side at a second pitch that is N times (N is an integer of 2 or more) the first pitch along the arrangement direction, and are arranged such that a gap for exposing an end portion of the substrate is provided between adjacent backup portions; the control portion causes the plurality of thermocompression bonding heads to perform the thermocompression bonding a plurality of times by changing the relative position of the moving portion; A component compression bonding device.

2. The component compression bonding device according to claim 1, further comprising a cooling portion that blows cooling gas from below the substrate to an end portion of the substrate. The component compression bonding device according to claim 1.

3. The cooling portion is arranged to blow the cooling gas to the end portion of the substrate through the gap. The component compression bonding device according to claim 2.

4. When the thermocompression bonding is completed for a component adjacent to a component for which the thermocompression bonding is to be performed, the control portion controls the cooling portion so as not to blow the cooling gas. The component compression bonding device according to claim 2 or 3.

5. The cooling portion includes one or more individual cooling portions for blowing the cooling gas to an end portion of the substrate located below any of the plurality of components; the control portion controls an individual cooling portion for blowing the cooling gas to an end portion of the substrate located below a component for which the thermocompression bonding is not completed, so as to cause the cooling gas to be blown; controls an individual cooling portion for blowing the cooling gas to an end portion of the substrate located below a component for which the thermocompression bonding is completed, so as not to cause the cooling gas to be blown. The component crimping device according to any one of claims 2 to 4.

6. A stage on which a substrate having a plurality of electrode portions and on which components are placed via anisotropic conductive members on each of the plurality of electrode portions is placed; A plurality of backup portions that support an end portion of the substrate placed on the stage from below the substrate; A heating portion that heats the plurality of backup portions; A plurality of thermocompression bonding heads that are provided above each of the plurality of backup portions so as to be movable up and down and perform thermocompression bonding of the plurality of components to the substrate supported by the plurality of backup portions; A control method for a component crimping device, comprising: a moving portion that changes a relative position between the substrate placed on the stage, the plurality of backup portions, and the plurality of thermocompression bonding heads along the arrangement direction of the plurality of electrode portions; The plurality of electrode portions are arranged side by side at a first pitch along an end portion of the substrate; The plurality of backup portions are arranged side by side at a second pitch that is N times (N is an integer of 2 or more) the first pitch along the arrangement direction, and are arranged so as to provide a gap that exposes an end portion of the substrate between adjacent backup portions; Performing the thermocompression bonding on the plurality of thermocompression bonding heads a plurality of times by changing the relative position by the moving portion; A control method for a component crimping device.

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