Measuring apparatus, measuring method, lithography apparatus, article manufacturing method, and model

Abstract

To provide a technique which is advantageous to highly accurately measure the positional information of a measurement object.SOLUTION: A measurement device for measuring the positional information of the measurement object in a first direction includes a scope which images the measurement object and generates image data and a processor which obtains the positional information of the measurement object in the first direction on the basis of the image data. The processor determines the positional information of the measurement object in the first direction on the basis of the temporary positional information of the measurement object in the first direction obtained from the image data and a correction value outputted from a model by inputting the feature amount of the image data relating to a second direction different from the first direction to the model.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present invention relates to a metrology apparatus, a metrology method, a lithography apparatus, an article manufacturing method and a model. [Background technology]

[0002] Lithography processes for manufacturing articles such as semiconductor devices may use lithography apparatuses, such as imprint apparatuses and exposure apparatuses. The lithography apparatus may transfer a pattern from an original onto a shot area of a substrate. The imprint apparatus contacts a mold with an imprint material disposed on the shot area of the substrate and hardens the imprint material, thereby forming a pattern made of the cured imprint material on the shot area. The exposure apparatus projects the pattern from the original onto a shot area of a substrate coated with a photosensitive material, thereby forming a latent image of the pattern from the original on the photosensitive material. The latent image is converted into a physical pattern by a development process. Such lithography apparatuses require a technique for measuring the relative positions of marks on the substrate and marks on the original with high precision in order to align the shot area of the substrate with high precision. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 4601492 Summary of the Invention [Problem to be solved by the invention]

[0004] An object of the present invention is to provide an advantageous technique for measuring position information of a measurement object with high accuracy. [Means for solving the problem]

[0005] One aspect of the present invention relates to a measuring device that measures position information of a measurement object in a first direction. The measuring device includes a scope that captures an image of the measurement object to generate image data, and a processor that obtains the position information of the measurement object in the first direction based on the image data. The processor determines the position information of the measurement object in the first direction based on the provisional position information of the measurement object in the first direction obtained from the image data and a correction value output from the model by inputting a feature amount of the image data related to a second direction different from the first direction into the model.

Advantages of the Invention

[0006] According to the present invention, it is possible to provide an advantageous technique for accurately measuring the position information of a measurement object.

Brief Description of the Drawings

[0007]

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Embodiments for Carrying Out the Invention

[0008] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments do not limit the invention according to the claims. Although a plurality of features are described in the embodiments, not all of these plurality of features are essential for the invention, and the plurality of features may be arbitrarily combined. Further, in the accompanying drawings, the same or similar configurations are denoted by the same reference numerals, and redundant descriptions are omitted.

[0009] Hereinafter, an imprint apparatus will be described as an example of a lithography apparatus. However, the imprint apparatus and the exposure apparatus have many common parts regarding the alignment technology between the shot area of the substrate and the reticle. Therefore, the alignment technology described below is also applicable to the exposure apparatus.

[0010] FIG. 2(a) schematically shows the configuration of an imprint apparatus IMP according to an embodiment. The imprint apparatus IMP performs an imprint process of curing an imprint material IM in a state where the imprint material IM on the shot area of a substrate S is in contact with the pattern area MP of a mold M, and then separating the cured product of the imprint material IM from the mold M. By this imprint process, a pattern is formed on the shot area of the substrate S.

[0011] As the imprint material, a curable composition (sometimes also referred to as an uncured resin) that cures when energy for curing is applied can be used. As the energy for curing, electromagnetic waves, heat, etc. can be used. The electromagnetic waves can be, for example, light selected from the range of its wavelength being 10 nm or more and 1 mm or less, for example, infrared rays, visible light, ultraviolet rays, etc. The curable composition can be a composition that cures by irradiation with light or by heating. Among these, the photocurable composition that cures by irradiation with light contains at least a polymerizable compound and a photoinitiator, and may further contain a non-polymerizable compound or a solvent as necessary. The non-polymerizable compound is at least one selected from the group consisting of a sensitizer, a hydrogen donor, an internal release agent, a surfactant, an antioxidant, a polymer component, etc. The imprint material can be arranged on the substrate in a droplet shape, or in an island shape or a film shape formed by connecting a plurality of droplets. The viscosity of the imprint material (viscosity at 25°C) can be, for example, 1 mPa·s or more and 100 mPa·s or less. As the material of the substrate, for example, glass, ceramics, metal, semiconductor, resin, etc. can be used. As necessary, a member made of a material different from the substrate may be provided on the surface of the substrate. The substrate is, for example, a silicon wafer, a compound semiconductor wafer, or quartz glass.

[0012] In this specification and the accompanying drawings, directions are indicated in an XYZ coordinate system with the direction parallel to the surface of the substrate S being the XY plane. The directions parallel to the X-axis, Y-axis, and Z-axis in the XYZ coordinate system are defined as the X-direction, Y-direction, and Z-direction, respectively, and the rotations about the X-axis, Y-axis, and Z-axis are defined as θX, θY, and θZ, respectively. Control or drive with respect to the X-axis, Y-axis, and Z-axis means control or drive in the directions parallel to the X-axis, Y-axis, and Z-axis, respectively. Also, control or drive with respect to the θX-axis, θY-axis, and θZ-axis means control or drive for rotations about axes parallel to the X-axis, Y-axis, and Z-axis, respectively. Further, position is information that can be specified based on the coordinates of the X-axis, Y-axis, and Z-axis, and orientation is information that can be specified by the values of the θX-axis, θY-axis, and θZ-axis. Positioning means controlling the position and / or orientation. Alignment may include control of the position and / or orientation of at least one of the substrate and the mold.

[0013] The imprint apparatus IMP may include a substrate holding unit 102 that holds a substrate S, a substrate driving mechanism 105 that drives the substrate S by driving the substrate holding unit 102, a base 104 that supports the substrate holding unit 102, and a position measuring unit 103 that measures the position of the substrate holding unit 102. The substrate driving mechanism 105 may include, for example, a motor such as a linear motor. The imprint apparatus IMP may include a sensor 151 that measures the substrate driving force (alignment load) required for the substrate driving mechanism 105 to drive the substrate S (substrate holding unit 102) during alignment. The substrate driving force in the alignment performed in a state where the imprint material IM on the substrate S and the pattern region MP of the mold M are in contact corresponds to, for example, the shearing force acting between the substrate S and the mold M. The shearing force is mainly a force acting in the plane direction of the substrate S and the mold M. The substrate driving force during alignment has, for example, a correlation with the magnitude of the current supplied to the motor of the substrate driving mechanism 105 during alignment, and the sensor 151 can measure the substrate driving force based on the magnitude of the current. The sensor 151 is an example of a sensor that measures the influence (shearing force) received by the mold M in the formation of the pattern. Also, the drive request (command value) issued by the control unit 110 described later to the substrate driving mechanism 105 is called a stage control value.

[0014] The imprint apparatus IMP may include a mold holding unit 121 that holds a mold M as a master, a mold driving mechanism 122 that drives the mold M by driving the mold holding unit 121, and a support structure 130 that supports the mold driving mechanism 122. The mold driving mechanism 122 may include a motor such as a voice coil motor. The imprint apparatus IMP may include a sensor 152 that measures a release force (separation load) and / or a pressing force. The release force is the force required to separate the cured product of the imprint material IM on the substrate S from the mold M. The pressing force is the force by which the master M is pressed to bring the master M into contact with the imprint material IM on the substrate S. The release force and the pressing force are mainly forces acting in a direction perpendicular to the plane direction of the substrate S and the mold M. The release force and the pressing force are correlated with, for example, the magnitude of the current supplied to the motor of the mold driving mechanism 122, and the sensor 152 can measure the separation force and the pressing force based on the magnitude of the current. The sensor 152 is an example of a sensor that measures the influence (release force and / or pressing force) received by the mold M in pattern formation. Also, the drive request (command value) issued by the control unit 110 described later to the mold driving mechanism 122 is also called a stage control value.

[0015] The substrate driving mechanism 105 and the mold driving mechanism 122 constitute a driving mechanism that adjusts the relative position and relative posture between the substrate S and the mold M. The adjustment of the relative position between the substrate S and the mold M by the driving mechanism includes driving for the contact of the mold with the imprint material on the substrate S and the separation of the mold from the cured imprint material (pattern of the cured product). The substrate driving mechanism 105 may be configured to drive the substrate S with respect to a plurality of axes (for example, three axes of the X-axis, Y-axis, and θZ-axis, preferably six axes of the X-axis, Y-axis, Z-axis, θX-axis, θY-axis, and θZ-axis). The mold driving mechanism 122 may be configured to drive the mold M with respect to a plurality of axes (for example, three axes of the Z-axis, θX-axis, and θY-axis, preferably six axes of the X-axis, Y-axis, Z-axis, θX-axis, θY-axis, and θZ-axis).

[0016] The imprint apparatus IMP may include a mold transfer mechanism 140 that transfers the mold M and a mold cleaner 150. The mold transfer mechanism 140 may be configured to transfer the mold M to the mold holding portion 121, for example, or to transfer the mold M from the mold holding portion 121 to an original plate stocker (not shown) or the mold cleaner 150 or the like. The mold cleaner 150 cleans the mold M with ultraviolet rays, a chemical solution, or the like.

[0017] The mold holding portion 121 may include a window member 125 that forms a pressure control space CS on the side of the back surface of the mold M (the surface opposite to the pattern region MP on which the pattern to be transferred to the substrate S is formed). The imprint apparatus IMP may include a deformation mechanism 123 that deforms the pattern region MP of the mold M into a convex shape toward the substrate S by controlling the pressure in the pressure control space CS (hereinafter referred to as the cavity pressure), as schematically shown in FIG. 2(b). Further, the imprint apparatus IMP may include an alignment scope (alignment measuring instrument) 106, a curing unit 107, an imaging unit 112, and an optical member 111.

[0018] The alignment scope 106 can generate image data by illuminating the first mark on the substrate S (first member) and the second mark on the mold M (second member), and imaging the moiré fringes (object to be measured), which are optical images formed by the first mark and the second mark. Note that the marks used for alignment can be called alignment marks. The alignment scope 106 or the control unit 110 can detect the relative position information between the first mark and the second mark by processing the image data generated by imaging. Here, the relative position information between the first mark and the second mark may be measured without forming moiré fringes by the first mark and the second mark. For example, a box-in-box mark can be formed by the first mark and the second mark. The alignment scope 106 can be positioned by a drive mechanism (not shown) according to the position of the alignment mark to be observed. The position information of the first mark and / or the position information of the second mark may be individually detected using the alignment scope 106. Hereinafter, the image data generated by imaging with the alignment scope 106 is also called an alignment image. Also, the result measured using the alignment scope 106 is also called an alignment measurement value.

[0019] The curing unit 107 irradiates the imprint material IM with energy (for example, light such as ultraviolet light) for curing the imprint material IM through the optical member 111, thereby curing the imprint material IM. The imaging unit 112 images the substrate S, the mold M, and the imprint material IM through the optical member 111 and the window member 125. Hereinafter, the image data obtained by imaging with the imaging unit 112 is also called a spread image.

[0020] The imprint apparatus IMP may include a dispenser 108 that disposes an imprint material IM over a shot region of a substrate S. The dispenser 108 discharges the imprint material IM so that the imprint material IM is disposed over the shot region of the substrate S, for example, in accordance with a drop recipe indicating the disposition of the imprint material IM. The imprint apparatus IMP may include a control unit 110 that controls a substrate drive mechanism 105, a mold drive mechanism 122, a deformation mechanism 123, a mold transfer mechanism 140, a mold cleaner 150, an alignment scope 106, a curing unit 107, an imaging unit 112, a dispenser 108, etc. The control unit 110 may be configured by, for example, a PLD (abbreviation of Programmable Logic Device) such as an FPGA (abbreviation of Field Programmable Gate Array), or an ASIC (abbreviation of Application Specific Integrated Circuit), or a general-purpose computer in which a program 113 is incorporated, or a combination of all or part of these.

[0021] FIG. 3 illustrates the configuration of an article manufacturing system 1001 for manufacturing articles such as semiconductor devices. The article manufacturing system 1001 may include, for example, one or more lithography apparatuses (an imprint apparatus IMP and / or an exposure apparatus). The article manufacturing system 1001 may also include one or more inspection apparatuses 1005 (for example, an overlay inspection apparatus, a foreign matter inspection apparatus), and one or more processing apparatuses 1006 (an etching apparatus, a film forming apparatus). Further, the article manufacturing system 1001 may include a model generation apparatus (a machine learning unit) 1007 that generates a machine learning model for calculating an alignment error amount. These apparatuses are connected to a control apparatus 1003, which is one of the external systems, via a network 1002 and may be controlled by the control apparatus 1003. Examples of the control apparatus 1003 include MES, EEC, etc. The model generation apparatus 1007 may be configured by, for example, a PLD (abbreviation of Programmable Logic Device) such as an FPGA (abbreviation of Field Programmable Gate Array), or an ASIC (abbreviation of Application Specific Integrated Circuit), or a general-purpose computer in which a program is incorporated, or a combination of all or part of these. The model generation apparatus 1007 may be, for example, a server called an EdgeServer. The model generation apparatus 1007 may be incorporated into a control unit of the imprint apparatus IMP or the exposure apparatus, or the control apparatus 1003 or the like. A system including a lithography apparatus such as the imprint apparatus IMP or the exposure apparatus and the model generation apparatus 1007 may be understood as a lithography system.

[0022] The alignment scope 106 and the control unit (processor) 110 of the imprint apparatus IMP can constitute a measuring apparatus that measures or detects the position information of the object to be measured. From another perspective, the imprint apparatus IMP includes a measuring apparatus that measures or detects the position information of the object to be measured. The measuring apparatus can operate as a measuring apparatus that measures or detects the position information of the object to be measured in the diffraction direction of the diffraction grating constituting the alignment mark, that is, the first direction which is the measuring direction. The measuring apparatus can further be configured to measure the position information of the object to be measured in a direction different from the first direction which is the measuring direction, that is, the second direction (for example, a direction orthogonal to the first direction) which is the non-measuring direction. The processor can determine the position information of the object to be measured in the first direction based on the provisional position information of the object to be measured in the first direction obtained from the image data and the correction value based on the feature amount of the image data regarding the second direction different from the first direction. The second direction can be a direction orthogonal to the first direction. The measuring apparatus can further include a model for obtaining a correction value based on the feature amount. Further, the measuring apparatus can further include a machine learning unit that generates the model by machine learning. The processor may be understood to include an acquisition unit and a machine learning unit. Here, the acquisition unit can be configured to acquire the feature amount regarding the second direction different from the first direction from the image data generated by imaging the object to be measured by the scope of the measuring apparatus. The machine learning unit can be configured to perform machine learning using the feature amount acquired by the acquisition unit as input data of the model and the difference between the position information of the object to be measured measured by an external inspection apparatus and the position information acquired by the measuring apparatus as teacher data.

[0023] Hereinafter, the lithography method of the present embodiment will be described. This lithography method can include a measuring method for measuring the position information of the object to be measured, a measuring method for measuring the alignment error between the shot area of the substrate and the original plate (mold), and an alignment method for aligning the shot area of the substrate and the original plate (mold).

[0024] In this lithography method, an alignment error amount as a correction value or a correction amount is estimated from image data of an object to be inspected. Here, the object to be inspected can be a mark (optical image thereof), or an optical image (for example, moiré fringes) formed by a first mark and a second mark. The alignment error amount can be an error amount (estimated error amount) of the position (position information) of the mark calculated based on the image data of the object to be inspected, or an error amount (estimated error amount) of the relative position (relative position information) between the first mark and the second mark. (First Embodiment) FIG. 1 shows a lithography method executed in a lithography system including an imprint apparatus IMP as an embodiment of the lithography method. The operations shown in FIG. 1 can be controlled by a control unit 110. In step S101, a substrate S is conveyed from a conveyance source (for example, a relay section between a preprocessing apparatus and the imprint apparatus IMP) onto a substrate holding section 102 by a substrate conveyance mechanism (not shown).

[0025] In steps S102 to S106, imprinting (pattern formation) is performed on a selected shot area among a plurality of shot areas of the substrate S. First, in step S102, an imprint material IM is disposed by a dispenser 108 on the selected shot area among the plurality of shot areas of the substrate S. This process can be performed, for example, by discharging the imprint material IM from the dispenser 108 while driving the substrate S by a substrate driving mechanism 105. In step S103, the substrate S and the mold M are relatively driven by at least one of a mold driving mechanism 122 and a substrate driving mechanism 105 so that a pattern area MP of the mold M contacts the imprint material IM on the shot area. In one example, the mold M is driven by the mold driving mechanism 122 so that the pattern area MP of the mold M contacts the imprint material IM on the shot area. In the process of bringing the pattern area MP of the mold M into contact with the imprint material IM, the pattern area MP of the mold M can be deformed into a convex shape toward the substrate S by a deformation mechanism 123. At this time, the cavity pressure can be controlled and its value can be accumulated. Also, imaging by an imaging unit 112 is performed in the process of bringing the pattern area MP of the mold M into contact with the imprint material IM, and the captured image (spread image) can be accumulated.

[0026] In step S104, alignment between the shot area of the substrate S and the pattern area MP of the mold M can be performed. The alignment can be performed while measuring the relative positions of the first mark in the shot area and the second mark of the mold M using the alignment scope 106 so that the relative positions fall within the allowable range of the target relative positions. In the alignment, the substrate S and the mold M can be relatively driven by at least one of the mold driving mechanism 122 and the substrate driving mechanism 105. Here, the target value of the relative driving amount between the substrate S and the mold M can be obtained by correcting the provisional position information (provisional relative position information) based on the alignment error amount (correction value). The provisional position information (provisional relative position information) is information determined based on the image data obtained using the alignment scope 106 and can indicate the provisional relative position between the shot area of the substrate S and the mold M. The alignment error amount can be calculated based on the image data obtained using the alignment scope 106. The alignment error amount can be calculated using the model generated by the model generation device 1007 and provided to the control unit 110 of the imprint device IMP. The correction of the provisional position information (provisional relative position information) by the alignment error amount (correction value) may be performed throughout the execution period of the alignment, or may be performed after the relative position between the shot area and the mold M has fallen below the reference value. The control unit 110 can accumulate the image data obtained using the alignment scope 106 and provide the accumulated image data to the model generation device 1007. The model generation device 1007 can generate a model for determining the alignment error amount based on the image data thus provided from the control unit 110 of the imprint device IMP Here, a method for measuring the position of the mark will be exemplarily described. In FIG. 6A, a mark image (image data) 401 obtained by imaging a mark for measuring the position in the X direction is exemplified, and in FIG. 6(b), an alignment waveform 406 obtained from the mark image 401 is exemplified. The substrate S may have a mark corresponding to the mark image in FIG. 6(a) and a mark obtained by rotating the mark by 90 degrees. The mark corresponding to the mark image in FIG. 6(a) is used to measure the position in the X direction, and the measurement direction is the X direction. The mark obtained by rotating the mark corresponding to the mark image in FIG. 6(a) by 90 degrees is used to measure the position in the Y direction, and the measurement direction is the Y direction.

[0027] Using a first mark provided in the shot area of the substrate S for measuring the position in the X direction and a first mark provided in the shot area of the substrate S for measuring the position in the Y direction, the position in the X direction and the position in the Y direction of the shot area can be detected as provisional position information. Also, using a second mark provided in the mold M for measuring the position in the X direction and a second mark provided in the mold M for measuring the position in the Y direction, the position in the X direction and the position in the Y direction of the mold M can be detected as provisional position information. Based on the above provisional position information and the correction value as described above, the control unit 110 can determine the accurate relative position (alignment error) between the shot area of the substrate S and the mold M.

[0028] Alternatively, the relative position in the X direction between the shot area and the mold M can be detected as provisional relative position information from the moiré fringes formed by the first mark for the X direction provided in the shot area of the substrate S and the second mark for the X direction provided in the mold M. Similarly, the relative position in the Y direction between the shot area and the mold M can be detected as provisional relative position information from the moiré fringes formed by the first mark for the Y direction provided in the shot area of the substrate S and the second mark for the Y direction provided in the mold M. Based on the above provisional relative position information and the correction value as described above, the control unit 110 can determine the accurate relative position (alignment error) between the shot area of the substrate S and the mold M.

[0029] FIG. 7 shows a method of measuring the position of a mark using the alignment scope 106. Hereinafter, taking the mark image in FIG. 6(a) as an example, a method of measuring the mark position 402 will be described. The mark position 402 to be measured is the center position of the mark image in the measurement direction (the X direction in FIG. 6(a)), which is also the center position of the mark corresponding to the mark image. In this example, the measurement direction 404 is the X direction, and the non-measurement direction 405 is the Y direction.

[0030] In step S501, the control unit 110 acquires a mark image 401 (image data) by imaging the mark using the alignment scope 106. In step S502, the control unit 110 generates an alignment waveform 406 based on the mark image 401. The alignment waveform 406 can be generated, for example, by calculating the integrated value for each of the pixels having the same position in the measurement direction 404 (X direction) among the plurality of pixels constituting the measurement region 403 including the mark image 401.

[0031] In step S503, the control unit 110 calculates the mark position 402 based on the alignment waveform 406. As an example of the calculation method, there is a method of setting the center of gravity position of the alignment waveform 406 as the mark position 402. As another example, there are methods of calculating the mark position by calculating the phase of the alignment waveform by Fourier transform or the like, or methods of calculating the mark position using a pattern matching method.

[0032] Returning to FIG. 1, in step S105, energy for curing the imprint material IM is irradiated onto the imprint material IM between the substrate S and the pattern region MP of the mold M by the curing unit 107. As a result, the imprint material IM is cured, and a cured product of the imprint material IM is formed. In step S106, the substrate S and the mold M are relatively driven by at least one of the mold driving mechanism 122 and the substrate driving mechanism 105 so that the cured product of the imprint material IM and the pattern region MP of the mold M are separated. In one example, the mold M is driven by the mold driving mechanism 122 so that the cured product of the imprint material IM and the pattern region MP of the mold M are separated. Even when the cured product of the imprint material IM and the pattern region MP of the mold M are separated, the pattern region MP of the mold M can be deformed into a convex shape toward the substrate S. Further, imaging by the imaging unit 112 is executed, and the separation state between the imprint material IM and the mold M can be observed based on the captured image.

[0033] In step S107, the control unit 110 determines whether the imprint process of steps S102 to S106 has been executed for all the shot regions of the substrate S. Then, if the imprint process of steps S102 to S106 has been executed for all the shot regions of the substrate S, the control unit 110 proceeds to step S108, and if there are unprocessed shot regions, it returns to step S102. In this case, the imprint process of steps S102 to S106 is executed for the selected shot region among the unprocessed shot regions.

[0034] In step S108, the substrate S is transported from the substrate holding unit 102 to a transport destination (for example, a relay unit with a post-processing device) by a substrate transport mechanism (not shown). The operations shown in FIG. 1 are executed for each of the plurality of substrates when a lot composed of a plurality of substrates is processed.

[0035] Next, with reference to FIG. 4, a method for generating a model in the model generation device 1007 will be described. As described above, the model generation device 1007 may be incorporated in the imprint device IMP (for example, the control unit 110). In this case, the model is generated in the imprint device IMP.

[0036] In step S201, first, the model generation device 1007 acquires the measurement value of one shot area of the substrate S measured by the overlay inspection device. The measurement value to be acquired may be the result of measuring the overlay accuracy of at least one point belonging to each shot area of the substrate S. The measurement value may be, for example, the amount of misalignment between the underlying layer (overlay inspection mark) of the substrate S and the layer (overlay inspection mark) formed by the imprint device IMP thereon. In step S201, the model generation device 1007 calculates the difference between the measurement value by the overlay inspection device and the measurement value in the imprint device IMP (for example, the final alignment error in step S104) as the alignment error amount.

[0037] In step S202, the model generation device 1007 first acquires the mark image (image data) of the mark in the shot area for which the measurement value was acquired in the immediately preceding step S201. This mark image is the one acquired using the alignment scope 106 in step S104 and can be provided from the imprint device IMP to the model generation device 1007 at an arbitrary timing after the end of step S104. In step S202, the model generation device 1007 further obtains the feature amount of the acquired mark image. This feature amount includes at least the feature amount regarding the non-measurement direction and may additionally include the feature amount regarding the measurement direction. The measurement direction is the X direction in the example of FIG. 6. The non-measurement direction is the direction intersecting the X direction in the example of FIG. 6 and is, for example, the Y direction.

[0038] In step S203, the model generation device 1007 determines whether steps S201 and S202 have been executed for all of the plurality of shot areas to be considered on the substrate S. If there is an unexecuted shot area, steps S201 and S202 are executed for the unexecuted shot area. Then, when the execution of steps S201 and S202 is completed for all of the plurality of shot areas to be considered, in step S204, the model generation device 1007 generates a model for estimating the alignment error amount based on the feature amounts.

[0039] Depending on the cause of the misalignment between the measurement value by the overlay inspection device and the measurement value by the imprint device IMP, it may be possible to reduce the alignment error amount by generating a model using the feature amounts related to the non-measurement direction and the feature amounts related to the measurement direction. In such a case, it is preferable to generate a model learned using both the feature amounts related to the non-measurement direction and the feature amounts related to the measurement direction.

[0040] The generation of the model can be performed, for example, by machine learning. Specific examples are as follows. First, a new layer (pattern) is formed on a plurality of shot areas of the substrate under the same conditions by the imprint device IMP. Then, the overlay misalignment amount between the underlying layer (overlay inspection mark) and the newly formed layer (overlay inspection mark) of each shot area is measured by an external overlay inspection device. Next, the model generation device 1007 acquires the measured overlay misalignment amount of each shot area, and calculates the difference between the overlay misalignment amount and the measurement value when a new layer is formed in the shot area as the alignment error amount. Then, the model generation device 1007 performs machine learning using the feature amounts of the mark images of each shot area used when forming a new layer as the input data of the model and the calculated alignment error amount as the teacher data. At this time, when there are outliers in the input data and / or the teacher data, it is preferable to exclude the data and perform machine learning.

[0041] In machine learning, preprocessing may be performed on the alignment error amount. Examples of preprocessing include, for example, a method of adding an offset value to the alignment error amount, a method of multiplying a value by the alignment error amount to change the scale of the error amount, etc.

[0042] Examples of machine learning methods include, for example, Gaussian process regression and Bayesian estimation that perform inference considering uncertainty by treating variables as probabilities. When using Gaussian process regression and Bayesian estimation, the model is a function that inputs feature quantities and outputs the probability distribution of the alignment error amount, and the internal variables can be optimized by machine learning. The expected value of the obtained probability distribution of the error amount can be used as the inferred value of the error amount.

[0043] When it is necessary to reduce the computational complexity of inference, it is suitable to use a statistical model with low computational complexity such as multiple regression analysis. When calculating the alignment error amount using high-dimensional feature quantities such as the pixel values of the mark image as feature quantities, a method of optimizing internal variables using a neural network composed of a multi-layer perceptron is suitable. When the alignment error amount or the mark image contains many outliers, a method based on decision tree analysis robust to outliers may be applied. When using multiple regression analysis or a neural network, the model is defined to input feature quantities and output the alignment error amount, and the internal variables can be optimized by machine learning. When using decision tree analysis, the model is defined to input feature quantities and output the alignment error amount, and the decision tree can be constructed by machine learning.

[0044] In step S205, the model generation device 1007 saves the model generated in step S204. Further, the model generation device 1007 may provide the model generated in step S204 to the control unit 110 of the imprint device IMP.

[0045] Here, the reason for estimating the alignment error amount based on the feature amount of the mark image in the non-measurement direction will be explained. FIG. 14(d) shows the principle of measuring the relative position information between the shot region of the substrate S and the mold M based on the moire fringes, which are optical images formed by the first mark provided in the shot region of the substrate S and the second mark provided in the mold M. FIG. 14(d) shows the first mark 3a provided in the shot region of the substrate S and the second mark 2a provided in the mold M. The alignment scope 106 has an illumination optical system for illuminating the mark, and the illumination optical system has a pupil plane P. IL1, IL2, IL3, and IL4 indicate the illumination light from the poles formed on the pupil plane P.

[0046] For measuring the relative position in the X direction between the shot region of the substrate S and the mold M, the illumination lights IL1 and IL2 are used. As illustrated in FIG. 14(a), in the measurement of the relative position in the X direction, the illumination lights IL3 and IL4 that are not used in the measurement of the relative position in the X direction can generate scattered light at the edges of the first mark 3a and the second mark 2a. This scattered light can become flare and be mixed into the moire fringe signal (moire fringe image data). FIG. 14(c) illustrates the signal intensity distribution in the X direction of the moire fringe signal in FIG. 14(a) (the light intensity distribution on the light receiving surface of the imaging element of the alignment scope 106). It can be seen that the peaks on the left end side and the right end side in the signal intensity distribution are large due to the scattered light from the edges of the first mark 3a and the second mark 2a. Two of the four cycles of the moire fringe signal on the left end side and the right end side are affected by the scattered light, thereby affecting the measurement accuracy of the relative position. The same applies to the measurement of the relative position in the Y direction. The illumination lights IL1 and IL2 that are not used in the measurement of the relative position in the Y direction can generate scattered light at the edges of the first mark 3b and the second mark 2b. And this scattered light can become flare light and be mixed into the moire fringe signal. The above explains that the light intensity distribution in the measurement direction can be affected by flare. However, by the same principle, the light intensity distribution in the non-measurement direction can also be affected by flare and change. And the change in the light intensity distribution in the non-measurement direction can reduce the measurement accuracy of the relative position or position in the measurement direction.

[0047] FIG. 15(a) and FIG. 16(a) illustrate signal waveforms obtained by calculating integrated values of signal values of pixels having equal positions in the measurement direction (X direction) among a plurality of pixels constituting the image data obtained using the alignment scope 106. The signal waveforms in FIG. 15(a) and FIG. 16(a) can be understood as signal waveforms in the measurement direction. FIG. 15(b) and FIG. 16(b) illustrate signal waveforms obtained by calculating integrated values of signal values of pixels having equal positions in the non-measurement direction (Y direction) among a plurality of pixels constituting the image data obtained using the alignment scope 106. The signal waveforms in (b) of FIG. 15 and FIG. 16(b) can be understood as signal waveforms in the non-measurement direction. The examples in FIG. 16(a) and (b) are more affected by flare light than the examples in FIG. 15(a) and (b). The signal waveform in the measurement direction illustrated in FIG. 16(a) is more distorted than the signal waveform in the measurement direction illustrated in FIG. 15(a), and thus an error 901 may occur in the measurement result in the measurement direction. Further, the signal waveform in the non-measurement direction illustrated in FIG. 16(b) shows that it is more distorted and has a larger variation in signal values than the signal waveform in the non-measurement direction illustrated in FIG. 15(b). That is, it can be seen that the signal waveform in the non-measurement direction has a correlation with the signal waveform in the measurement direction, that is, the measurement result in the measurement direction. Therefore, by obtaining a feature amount of the image data related to the non-measurement method and correcting the provisional position information of the measurement object in the measurement direction obtained from the image data based on the feature amount, the position information of the measurement object can be determined with high accuracy.

[0048] Here, the feature amount obtained from the image data in the non-measurement direction (second direction) may include a plurality of values 603 corresponding to each of a plurality of positions in the non-measurement direction, as illustrated in FIG. 8. The plurality of values 603 may include a plurality of integrated values, and each of the plurality of integrated values may be an integrated value of the signal values of pixels having equal positions in the non-measurement direction among the plurality of pixels constituting the image data. Alternatively, the plurality of values 603 may include the signal values of a plurality of pixels on a line parallel to the non-measurement direction among the plurality of pixels constituting the image data. Alternatively, the plurality of values 603 may be a plurality of values obtained by processing the signal values of a plurality of pixels on a line parallel to the non-measurement direction among the plurality of pixels constituting the image data. Alternatively, the plurality of values 603 may be obtained by performing a basis transformation on the plurality of integrated values, and each of the plurality of integrated values may be an integrated value of the signal values of pixels having equal positions in the non-measurement direction among the plurality of pixels constituting the image data. Alternatively, the plurality of values 603 may be a value obtained by performing a basis transformation on the signal values of a plurality of pixels on a line parallel to the non-measurement direction among the plurality of pixels constituting the image data. Alternatively, the plurality of values 603 may be a value obtained by performing a basis transformation on a plurality of values obtained by processing the signal values of a plurality of pixels on a line parallel to the non-measurement direction among the plurality of pixels constituting the image data.

[0049] Alternatively, in FIG. 9, the difference between the result of integrating the signal values of pixels having equal positions in the measurement direction in region 701 and the result of integrating the signal values of pixels having equal positions in the measurement direction in region 702 may be used as the feature amount in the non-measurement direction.

[0050] An example of calculating or determining the feature amount of the image data regarding the non-measurement direction will be described below with reference to FIG. 10. In FIG. 10, x 1, x 2, ··· represent the X coordinates (pixel positions in the X direction) of the image data of the mark obtained by imaging with the alignment scope 106. Also, y 1, y 2, ··· represent the Y coordinates (pixel positions in the Y direction) of the image data. Hereinafter, the pixel value of the pixel with the X coordinate of x 1 and the Y coordinate of y 1 will be represented as x 1 y 1. Here, the coordinates x 1, x 2, ···, y 1, y 2, ··· of the pixels to be sampled or extracted, the intervals, and the number can be arbitrarily determined.

[0051] In one example, by integrating the pixel values of the pixels with equal y coordinates, such as (x 1 y 1 + x 2 y 1 + x 3 y 1 + ···), (x 1 y 2 + x 2 y 2 + x 3 y 2 ···), ···, the features of the signal waveform in the non-measurement direction can be obtained as the feature amounts. Such a method is effective when diffracted light and / or scattered light is generated along the non-measurement direction.

[0052] When diffracted light and scattered light are locally generated, the pixel values of the pixels at each coordinate such as (x1y1), (x1y2), (x1y3), (x1y4), (x1y5), (x1y6), (x2y1), (x2y2), ··· may be directly used as feature amounts in the non-measurement direction. Here, the feature amounts may be determined such as (x1y1 + x1y2), (x1y3 + x1y4), (x1y5 + x1y6), (x2y1 + x2y2), (x2y3 + x2y4), ···. In this way, the number of data indicating the feature amounts can be reduced by adding the pixel values of a plurality of pixels in the y direction, and thereby, the calculation amount in the calculation of the correction value based on the feature amounts can be reduced. The total value of the pixel values in each group may be extracted as a feature amount such that the average coordinates of the groups composed of a plurality of pixels are in ascending order, such as (x1y1 + x1y3), (x1y2 + x1y4) ···. Alternatively, the total value of the pixel values in each group may be extracted as a feature amount such that the coordinates of the groups composed of a plurality of pixels partially overlap, such as (x1y1 + x1y2 + x1y3), (x1y3 + x1y4 + x1y5) ···. Alternatively, the feature amounts may be extracted by performing addition in the x and y directions, such as (x1y1 + x1y2 + x2y1 + x2y2), (x1y2 + x1y3 + x2y2 + x2y3), (x1y3 + x1y4 + x2y3 + x2y4), ···. When diffracted light and / or scattered light are generated along an oblique direction, the feature amounts may be extracted by performing addition in the oblique direction, such as (x1y1 + x2y2), (x2y2 + x3y3), (x1y2 + x2y3), (x2y3 + x3y4), ···.

[0053] Also, constants α, β, γ, ··· may be multiplied by the pixel values of each pixel, such as (α×x1y1), (β×x1y2), (γ×x1y3), ···. By doing so, the weights of feature amounts with weak correction effects can be arbitrarily reduced. Also, feature amounts may be determined such as (α×x1y1 + β×x1y2 + γ×x1y3), (a×x1y2 + b×x1y3 + c×x1y4), (p×x1y3 + q×x1y4 + r×x1y5), ···. Here, α, β, γ, a, b, c, p, q, r are constants to be multiplied by the pixel values. If α = a = p = -1, β = b = p = 2, γ = c = r = -1, the gradient in the non-measurement direction can be obtained as a feature amount.

[0054] New feature amounts may be obtained by performing a basis transformation on the obtained feature amounts in the non-measurement direction. Examples of basis transformation include a method of performing a Fourier transform to obtain a phase and an amplitude, a method of obtaining a basis by principal component analysis and reducing the amount of information by performing a basis transformation. Also, a new feature amount can be obtained by adding or multiplying an offset value to the feature amount. In addition to the feature amounts in the non-measurement direction, the feature amounts in the measurement direction may be used to determine a correction value based on these. Any point of the waveform (image data) in the measurement direction may be sampled and used as a feature amount, and basis transformation, offset addition, and multiplication can be performed in the same way as the feature amounts in the non-measurement direction.

[0055] The process of obtaining feature amounts from image data may be executed by the control unit 110 of the imprint apparatus IMP or the like.

[0056] Hereinafter, with reference to FIG. 5, the process executed in the above-described step S104 (alignment) will be described. In this process, the alignment error amount is calculated using the above-described model, and the provisional position information regarding the measurement direction obtained based on the image data is corrected based on the alignment error amount (correction amount).

[0057] In step S301, the control unit 110 of the imprint apparatus IMP acquires the model generated by the model generation device 1007. Note that the acquisition of the model does not need to be immediately before step S302, which is the next step, and may be performed at any timing, for example, before the aforementioned step S102.

[0058] In step S302, the control unit 110 acquires the image data obtained by imaging with the alignment scope 106 in step S104, and extracts or calculates at least the feature amount related to the non-measurement direction from the image data. The method for extracting or calculating the feature amount in step S302 is the same as the method for extracting or calculating the feature amount executed by the model generation device 1007 in step S202.

[0059] In step S303, the control unit 110 calculates the alignment error amount using the model acquired in step S301 and the feature amount extracted or calculated in step S302. For example, when using Gaussian process regression as the learning means, the feature amount is input to the model acquired in step S301, and the expected value of the probability distribution output from the model can be obtained as the alignment error amount. This alignment error amount can be used as a correction value.

[0060] In step S304, the control unit 110 obtains the position information of the measurement object in the measurement direction as provisional position information based on the light intensity distribution in the measurement direction of the image data obtained by imaging with the alignment scope 106 in step S104. This provisional position information is provisional position information obtained without considering the feature amount related to the non-measurement direction of the image data.

[0061] In step S305, the control unit 110 obtains the position information of the measurement object in the measurement direction based on the provisional position information obtained in step S304 and the correction value based on the feature amount of the image data regarding the non-measurement direction obtained in step S303. Specifically, the control unit 110 can obtain the position information of the measurement object in the measurement direction by subtracting the correction value based on the feature amount of the image data regarding the non-measurement direction obtained in step S303 from the provisional position information obtained in step S304.

[0062] When using the feature amount regarding the measurement direction in addition to the feature amount regarding the non-measurement direction during model creation, the control unit 110 may extract or calculate the feature amount regarding the non-measurement direction and the feature amount regarding the measurement direction in step S302. Then, the control unit 110 inputs the feature amount regarding the non-measurement direction and the feature amount regarding the measurement direction to the model in step S303, uses the alignment error amount output from the model as the correction value, and may obtain the position information of the measurement object in step S305.

[0063] The verification results of this embodiment are shown below. In this verification, correction of the alignment error amount was performed for eight alignment marks, namely, the X-direction alignment marks 801, 803, 805, 807 and the Y-direction alignment marks 802, 804, 806, 808 within the shot area as shown in FIG. 11. 809 is a mark used in the overlay inspection apparatus. The alignment error amount of each alignment mark in this verification is calculated based on the overlay measurement result obtained from the overlay inspection mark near the alignment mark. For the learning to generate the model, data of 20 wafers × 69 shot areas was used, and correction was applied to 6 wafers × 69 shot areas different from the data used for learning. For the position and direction of the alignment mark, learning and correction were performed independently.

[0064] FIG. 12 shows the standard deviation of the alignment error amount of all data before and after correction, indicating how much the alignment error amount varies. Reducing this variation is the objective of this embodiment, and it can be confirmed from the graph that the variation in the alignment error amount is reduced by about 16% at most.

[0065] FIG. 13 is a graph showing the alignment error amounts of each data arranged horizontally before and after correction of the alignment mark 804. For example, in the portion surrounded by a circle, it can be confirmed that the variation is reduced by the correction.

[0066] As described above, as one embodiment, an example has been described in which a correction value calculated from data indicating the state of the imprint apparatus IMP during imprint processing is applied to the overlay of the shot region, but the present invention is not limited thereto. For example, the correction value may be provided from the imprint apparatus IMP to the control apparatus 1003 and used in subsequent processing. For example, the correction value obtained from information indicating the state of the imprint apparatus IMP during imprint processing may be applied at the alignment of another shot region such as the next shot region. Alternatively, the correction value may be applied at the alignment of the shot region at the same position on the next substrate. (Second Embodiment) In this embodiment, parts different from the first embodiment will be described, and description of the same parts will be omitted.

[0067] In the first embodiment, in step S201, the model generation apparatus 1007 calculates the difference between the measurement value by the overlay inspection apparatus and the measurement value in the imprint apparatus IMP (the final alignment error in step S104) as the alignment error amount. Further, in the first embodiment, the mark image acquired by the model generation apparatus 007 in step S202 is acquired by using the alignment scope 106 in the imprint apparatus IMP before the imprint material is cured, that is, in step S104.

[0068] In contrast, in the second embodiment, as the measured values and mark images in the imprint apparatus IMP, those obtained by the alignment scope 106 in the imprint apparatus IMP between step S105 and step S106, that is, after the imprint material is cured, are used.

[0069] Also, in the second embodiment, in step S202, feature amounts are obtained from the mark images captured after the imprint material is cured. This feature amount includes at least a feature amount related to the non-measurement direction, and may also include a feature amount related to the measurement direction.

[0070] The substrate S measured by an external overlay inspection apparatus is in a state after the imprint material is cured. Therefore, as in the second embodiment, by using the correction values and mark images after the imprint material is cured as the measured values and mark images in the imprint apparatus IMP, variations that occur when the imprint material is cured can be eliminated.

[0071] Correction based on the feature amount in the non-measurement direction may be applied not only to the imprint apparatus but also to other lithography apparatuses, for example, exposure apparatuses. Also in an exposure apparatus, alignment is performed between the shot area of the substrate and the reticle. In this alignment, the position of a mark provided in the shot area of the substrate is measured, and the result of the measurement can be corrected using a correction value corresponding to the feature amount in the non-measurement direction of the image data of the mark.

[0072] Hereinafter, an article manufacturing method for manufacturing an article using the above lithography apparatus will be described. The article manufacturing method includes a transfer step of transferring the pattern of the reticle onto the substrate by the above lithography apparatus, and a processing step of processing the substrate that has undergone the transfer step, and an article is obtained from the substrate that has undergone the processing step.

[0073] Hereinafter, with reference to FIG. 17, as an example, an article manufacturing method for manufacturing an article using an imprint apparatus as a lithography apparatus will be described. The pattern of the cured material formed using the imprint apparatus is permanently used for at least a part of various articles, or temporarily used when manufacturing various articles. The article is an electric circuit element, an optical element, a MEMS, a recording element, a sensor, or a mold or the like. Examples of the electric circuit element include a volatile or non-volatile semiconductor memory such as DRAM, SRAM, flash memory, MRAM, and semiconductor elements such as LSI, CCD, image sensor, and FPGA. Examples of the mold include an imprint mold and the like.

[0074] The pattern of the cured material is used as it is as at least a part of the constituent members of the above article, or temporarily used as a resist mask. After etching, ion implantation, or the like is performed in the substrate processing step, the resist mask is removed.

[0075] Next, an article manufacturing method for forming a pattern on a substrate by an imprint apparatus, processing the substrate on which the pattern is formed, and manufacturing an article from the processed substrate will be described. As shown in FIG. 17(a), a substrate 1z such as a silicon wafer having a workpiece 2z such as an insulator formed on its surface is prepared. Subsequently, an imprint material 3z is applied to the surface of the workpiece 2z by an inkjet method or the like. Here, a state in which a plurality of droplet-shaped imprint materials 3z are applied on the substrate is shown.

[0076] As shown in FIG. 17(b), an imprint mold 4z is opposed with the side on which the concavo-convex pattern is formed facing the imprint material 3z on the substrate. As shown in FIG. 17(c), the substrate 1z on which the imprint material 3z is applied and the mold 4z are brought into contact with each other and pressure is applied. The imprint material 3z is filled in the gap between the mold 4z and the workpiece 2z. When light is irradiated through the mold 4z as energy for curing in this state, the imprint material 3z cures.

[0077] As shown in Fig. 17(d), after curing the imprint material 3z and separating the mold 4z from the substrate 1z, a pattern of the cured product of the imprint material 3z is formed on the substrate 1z. The pattern of this cured product has a shape in which the concave portion of the mold corresponds to the convex portion of the cured product and the convex portion of the mold corresponds to the concave portion of the cured product. That is, the concavo-convex pattern of the mold 4z has been transferred to the imprint material 3z.

[0078] As shown in Fig. 17(e), when etching is performed using the pattern of the cured product as an etching mask, the portion of the surface of the workpiece 2z where no cured product remains or where a thin cured product remains is removed, resulting in a groove 5z. As shown in Fig. 17(f), when the pattern of the cured product is removed, an article having a groove 5z formed on the surface of the workpiece 2z can be obtained. Here, the pattern of the cured product has been removed, but it may also be used, without being removed after processing, as a film for interlayer insulation included in, for example, a semiconductor element or the like, that is, as a constituent member of the article.

[0079] The invention is not limited to the above-described embodiments, and various changes and modifications can be made without departing from the spirit and scope of the invention. Therefore, claims are attached to disclose the scope of the invention.

Explanation of Reference Numerals

[0080] IMP: Imprint apparatus, S: Substrate, M: Mold, 110: Control unit, 102: Substrate holding unit, 105: Substrate driving mechanism, 121: Mold holding unit, 122: Mold driving mechanism, 1007: Model generation apparatus

Claims

1. A measuring device for measuring position information of a measurement object in a first direction, comprising: a scope that captures an image of the measurement object to generate image data; and a processor that obtains the position information of the measurement object in the first direction based on the image data, wherein the processor determines the position information of the measurement object in the first direction based on the provisional position information of the measurement object in the first direction obtained from the image data and a correction value output from the model by inputting a feature amount of the image data regarding a second direction different from the first direction into the model. A measuring device characterized by the above.

2. The measuring device according to claim 1, wherein the processor obtains the correction value by inputting a feature amount of the image data regarding the first direction and a feature amount of the image data regarding the second direction into the model.

3. The measuring device according to claim 1, further comprising a model for obtaining the correction value based on the feature amount. A measuring device characterized by the above.

4. The measuring device according to claim 3, further comprising a machine learning unit that generates the model by machine learning. A measuring device characterized by the above.

5. The machine learning unit uses the feature amount as input data of the model and performs machine learning using, as teacher data, the difference between the position information of the measurement object measured by an external inspection device and the position information determined by the processor. A measuring device characterized by the above.

6. The machine learning is performed using at least one of Gaussian process regression, Bayesian estimation, multi-layer perceptron, multiple regression analysis, and decision tree analysis. A measuring device according to claim 4 or 5, characterized by the above.

7. The second direction is a direction orthogonal to the first direction. A measuring device according to any one of claims 1 to 6, characterized by the above.

8. The feature amount obtained from the image data regarding the second direction includes a plurality of values corresponding to a plurality of positions in the second direction, respectively. A measuring device according to any one of claims 1 to 7, characterized by the above.

9. The plurality of values include a plurality of integrated values, and each of the plurality of integrated values is an integrated value of signal values of pixels having the same position in the second direction among the plurality of pixels constituting the image data. A measuring device according to claim 8, characterized by the above.

10. The plurality of values include signal values of a plurality of pixels on a line parallel to the second direction among the plurality of pixels constituting the image data. The measuring device according to claim 8, characterized in that.

11. The plurality of values are obtained by processing signal values of a plurality of pixels on a line parallel to the second direction among the plurality of pixels constituting the image data. The measuring device according to claim 8, characterized in that.

12. The plurality of values are obtained by performing a basis transformation on a plurality of integrated values, and each of the plurality of integrated values is an integrated value of signal values of pixels having equal positions in the second direction among the plurality of pixels constituting the image data. The measuring device according to claim 8, characterized in that.

13. The plurality of values are obtained by performing a basis transformation on signal values of a plurality of pixels on a line parallel to the second direction among the plurality of pixels constituting the image data. The measuring device according to claim 8, characterized in that.

14. The plurality of values are obtained by performing a basis transformation on a plurality of values obtained by processing signal values of a plurality of pixels on a line parallel to the second direction among the plurality of pixels constituting the image data. The measuring device according to claim 8, characterized in that.

15. The basis transformation is performed using at least one of a Fourier transform and a principal component analysis. The measuring device according to claim 13 or 14, characterized in that.

16. The correction value is obtained based on a feature amount regarding the first direction of the image data in addition to a feature amount regarding the second direction of the image data. The measuring device according to any one of claims 1 to 15, characterized in that.

17. The object to be measured is a mark. The measuring device according to any one of claims 1 to 16, characterized in that.

18. The object to be measured is a moire pattern formed by a first mark of a first member and a second mark of a second member, and the position information is relative position information between the first mark and the second mark. The measuring device according to any one of claims 1 to 16, characterized in that.

19. A lithography apparatus for transferring a pattern of a master onto a substrate, comprising the measuring device according to any one of claims 1 to 18, configured to measure a relative position between a shot region of the substrate and the master. A lithography apparatus configured to perform alignment between the shot area and the reticle based on the output of the measurement device.

20. A transfer step of transferring a pattern of a reticle onto a substrate by the lithography apparatus according to claim 19, and a processing step of processing the substrate that has undergone the transfer step, and An article manufacturing method characterized by obtaining an article from the substrate that has undergone the processing step.

21. A measurement method for measuring position information of a measurement object in a first direction, including a generation step of imaging the measurement object with a scope to generate image data, and a processing step of obtaining the position of the measurement object in the first direction based on the image data, wherein the processing step includes determining the position information of the measurement object in the first direction based on provisional position information of the measurement object in the first direction obtained from the image data and a correction value output from the model by inputting a feature amount of the image data related to a second direction different from the first direction into the model. A measurement method characterized by the above.

22. A processing method in a computer for generating a model used in a measurement device for measuring position information of a measurement object in a first direction, including a step of obtaining a feature amount related to a second direction different from the first direction from image data generated by imaging a measurement object with a scope of the measurement device, and a step of performing machine learning using the obtained feature amount as input data of the model and the difference between the position information of the measurement object measured by an external inspection device and the position information obtained by the measurement device as teacher data. A processing method having the above.

23. A computer for generating a model used in a measurement device for measuring position information of a measurement object in a first direction, including an acquisition unit that obtains a feature amount related to a second direction different from the first direction from image data generated by imaging a measurement object with a scope of the measurement device, and a machine learning unit that performs machine learning using the obtained feature amount as input data of the model and the difference between the position information of the measurement object measured by an external inspection device and the position information obtained by the measurement device as teacher data. A computer having the above.

Images