Maintenance device, vacuum processing system, and maintenance method

Abstract

To efficiently clean the inside of a processing container without opening it to the atmosphere.SOLUTION: A maintenance device includes a case that is formed with an opening having a size corresponding to a second gate of a vacuum processing device in which a first gate used for loading and unloading a substrate and a second gate different from the first gate is provided in a processing container is formed, and in which the opening can be airtightly attached to the second gate, a decompression mechanism that depressurizes the inside of the case, and a suction mechanism that is placed inside the case, enters the processing container through the opening, and suctions an object attached to the processing container.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present disclosure relates to a maintenance device, a vacuum processing system, and a maintenance method.

Background Art

[0002] A vacuum processing apparatus is known in which a substrate such as a semiconductor wafer (hereinafter referred to as "wafer") is placed in a processing container in a vacuum state and various substrate processes are performed. In such a vacuum processing apparatus, from the viewpoint of reducing downtime, it is required to clean the inside of the processing container without opening to the atmosphere.

[0003] In this regard, Patent Document 1 discloses a technique in which, separately from a first gate used for loading and unloading a substrate, a second gate to which a maintenance device having a suction unit can be attached is provided in a processing container, and unnecessary substances in the processing container are adsorbed by the suction unit to clean the inside of the processing container.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] The present disclosure provides a technique capable of efficiently cleaning the inside of a processing container without opening to the atmosphere.

Means for Solving the Problems

[0006] A maintenance device according to an aspect of the present disclosure includes a case having an opening formed in a size corresponding to a second gate of a vacuum processing apparatus in which a first gate used for loading and unloading a substrate and a second gate different from the first gate are provided in a processing container, the case being attachable to the opening in an airtight manner with respect to the second gate, a decompression mechanism for decompressing the inside of the case, and a suction mechanism disposed inside the case, entering the processing container through the opening, and sucking deposits on an object in the processing container.

Advantages of the Invention

[0007] According to the present disclosure, there is an effect that the inside of the processing container can be efficiently cleaned without opening to the atmosphere.

Brief Description of the Drawings

[0008]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7A

Figure 7B

Figure 8

Figure 9A

Figure 9B

Figure 9C

Figure 10

Figure 11

[0009] Hereinafter, embodiments of the maintenance device, vacuum processing system, and maintenance method disclosed herein will be described in detail with reference to the drawings. Note that the same or equivalent parts in each drawing will be denoted by the same reference numerals. Furthermore, the disclosed processing device is not limited to the present embodiment.

[0010] [Configuration of equipment to be maintained] The maintenance target device, which is the object of maintenance by the maintenance device, will be described below. The maintenance target device is a vacuum processing device that places substrates such as wafers in a processing vessel under vacuum and performs predetermined substrate processing. In this embodiment, the maintenance target device will be described as a plasma etching device that performs plasma etching on substrates. However, the maintenance target device is not limited to a plasma etching device.

[0011] FIG. 1 is a diagram schematically showing a plasma etching apparatus according to an embodiment. The plasma etching apparatus 10 has a processing chamber 30 that is hermetically configured and electrically grounded. The processing chamber 30 is cylindrical and made of, for example, aluminum having an anodic oxide film formed on its surface. The processing chamber 30 defines a processing space where plasma is generated. Inside the processing chamber 30, a mounting table 31 for horizontally supporting a wafer W is accommodated.

[0012] The mounting table 31 has a substantially cylindrical shape with its bottom facing in the vertical direction, and the upper surface thereof is a mounting surface 36d. The mounting surface 36d of the mounting table 31 is slightly smaller in size than the wafer W. The mounting table 31 includes a base 33 and an electrostatic chuck 36.

[0013] The base 33 is made of a conductive metal, such as aluminum. The base 33 functions as a lower electrode. The base 33 is supported by an insulator support base 34, and the support base 34 is installed at the bottom of the processing chamber 30.

[0014] The electrostatic chuck 36 has a convex substrate mounting portion formed at its upper central portion, and the upper surface of this substrate mounting portion is the mounting surface 36d on which the wafer W is mounted. The electrostatic chuck 36 is provided at the center of the mounting table 31 in a plan view. The electrostatic chuck 36 is an example of a mounting portion capable of mounting a substrate. The electrostatic chuck 36 has an electrode 36a and an insulator 36b. The electrode 36a is provided inside the insulator 36b, and a DC power supply 42 is connected to the electrode 36a. The electrostatic chuck 36 is configured to adsorb the wafer W by Coulomb force when a DC voltage is applied to the electrode 36a from the DC power supply 42. Further, a heater 36c is provided inside the insulator 36b of the electrostatic chuck 36. The heater 36c is supplied with power via a power supply mechanism described later to control the temperature of the wafer W.

[0015] Further, around the mounting surface 36d of the mounting table 31, an outer peripheral portion formed by an insulator 36b and lower than the mounting surface 36d is provided, and the upper surface of this outer peripheral portion is an ER mounting surface 36f for mounting the edge ring 35. An edge ring 35 formed of, for example, single crystal silicon is provided on the ER mounting surface 36f of the mounting table 31. The electrostatic chuck 36 has a pair of electrodes 36g, 36h at positions overlapping with the edge ring 35 in top view. The pair of electrodes 36g, 36h are provided inside the insulator 36b. The electrostatic chuck 36 is configured to adsorb the edge ring 35 by Coulomb force when a DC voltage is applied to the pair of electrodes 36g, 36h from a DC power supply (not shown). In the example of FIG. 1, the case where a pair of electrodes 36g, 36h are provided inside the electrostatic chuck 36 is shown, but a pair of electrodes 36g, 36h may be provided in a ring-shaped dielectric body separate from the electrostatic chuck 36. Also, in the example of FIG. 1, the case where the pair of electrodes 36g, 36h constitute bipolar electrodes is shown, but unipolar electrodes may be used instead of the pair of electrodes 36g, 36h. Further, a cylindrical inner wall member 37 made of, for example, quartz is provided so as to surround the periphery of the mounting table 31 and the support base 34.

[0016] A power supply rod 50 is connected to the base 33. The power supply rod 50 is connected to a first RF power supply 40a via a first matcher 41a and is also connected to a second RF power supply 40b via a second matcher 41b. The first RF power supply 40a is a power supply for plasma generation, and high-frequency power of a predetermined frequency is configured to be supplied from the first RF power supply 40a to the base 33 of the mounting table 31. Also, the second RF power supply 40b is a power supply for ion drawing (biasing), and high-frequency power of a predetermined frequency lower than that of the first RF power supply 40a is configured to be supplied from the second RF power supply 40b to the base 33 of the mounting table 31.

[0017] Inside the base 33, a flow path 33d is formed. One end of the flow path 33d is connected to a heat transfer fluid inlet pipe 33b, and the other end is connected to a heat transfer fluid outlet pipe 33c. The plasma etching apparatus 10 is configured to be able to control the temperature of the mounting table 31 by circulating a heat transfer fluid, such as a fluorine-based inert liquid or pure water with high insulation and low viscosity, in the flow path 33d. Note that the plasma etching apparatus 10 may be configured such that flow paths are separately provided inside the base 33 corresponding to the regions where the wafer W and the edge ring 35 are respectively placed, and the temperatures of the wafer W and the edge ring 35 can be individually controlled. Further, the plasma etching apparatus 10 may be configured such that a heat transfer gas is supplied to the back side of the wafer W or the edge ring 35 to enable individual temperature control. For example, a gas supply pipe for supplying a heat transfer gas (back side gas) such as helium gas to the back surface of the wafer W may be provided so as to penetrate the mounting table 31 or the like. The gas supply pipe is connected to a gas supply source. With these configurations, the wafer W adsorbed and held by the electrostatic chuck 36 on the upper surface of the mounting table 31 is controlled to a predetermined temperature.

[0018] On the other hand, above the mounting table 31, a shower head 46 having a function as an upper electrode is provided so as to face the mounting table 31 in parallel. The shower head 46 and the mounting table 31 function as a pair of electrodes (upper electrode and lower electrode).

[0019] The shower head 46 is provided on the top wall portion of the processing container 30. The shower head 46 includes a main body portion 46a and an upper top plate 46b forming an electrode plate, and is supported above the processing container 30 via an insulating member 47. The main body portion 46a is made of a conductive material, such as aluminum having an anodic oxide film formed on its surface, and is configured to be able to detachably support the upper top plate 46b below it.

[0020] Inside the main body 46a, a gas diffusion chamber 46c is provided. A large number of gas flow holes 46d are formed at the bottom of the main body 46a so as to be located below the gas diffusion chamber 46c. Further, a gas introduction hole 46e is provided in the upper top plate 46b so as to penetrate the upper top plate 46b in the thickness direction and overlap with the above-described gas flow holes 46d. With such a configuration, the processing gas supplied to the gas diffusion chamber 46c is dispersed and supplied in a shower shape into the processing container 30 through the gas flow holes 46d and the gas introduction holes 46e.

[0021] A gas inlet 46g for introducing the processing gas into the gas diffusion chamber 46c is formed in the main body 46a. One end of a gas supply pipe 45a is connected to the gas inlet 46g. The other end of the gas supply pipe 45a is connected to a processing gas supply source 45 that supplies the processing gas. A mass flow controller (MFC) 45b and an on-off valve V2 are provided in the gas supply pipe 45a in order from the upstream side. Then, the processing gas for plasma etching is supplied from the processing gas supply source 45 to the gas diffusion chamber 46c through the gas supply pipe 45a, and is dispersed and supplied in a shower shape into the processing container 30 from the gas diffusion chamber 46c through the gas flow holes 46d and the gas introduction holes 46e.

[0022] A variable DC power supply 48b is electrically connected to the shower head 46 as the above-described upper electrode through a low-pass filter (LPF) 48a. The variable DC power supply 48b is configured to be able to turn on and off the power supply by an on-off switch 48c. The current and voltage of the variable DC power supply 48b and the on-off of the on-off switch 48c are controlled by a control unit 90 described later. As will be described later, when high-frequency waves are applied from the first RF power supply 40a and the second RF power supply 40b to the mounting table 31 to generate plasma in the processing space, the on-off switch 48c is turned on by the control unit 90 as necessary, and a predetermined DC voltage is applied to the shower head 46 as the upper electrode.

[0023] Also, a cylindrical ground conductor 30a is provided so as to extend upward from the side wall of the processing container 30 above the height position of the shower head 46. This cylindrical ground conductor 30a has a top wall at its upper part.

[0024] An exhaust port 81 is formed at the bottom of the processing container 30, and an exhaust device 83 is connected to this exhaust port 81 via an exhaust pipe 82. The exhaust device 83 has a vacuum pump, and is configured such that the inside of the processing container 30 can be decompressed to a predetermined degree of vacuum by operating this vacuum pump.

[0025] On the other hand, a first gate 84 used for loading and unloading the wafer W is provided on the side wall inside the processing container 30. A gate valve G for opening and closing the first gate 84 is provided on the first gate 84. The first gate 84 is connected to the vacuum transfer chamber via the gate valve G while maintaining airtightness, and the wafer W can be loaded and unloaded from the vacuum transfer chamber while maintaining a vacuum atmosphere.

[0026] A deposition shield 86 is provided along the inner wall surface on the inner side of the side portion of the processing container 30. The deposition shield 86 prevents reaction products (deposits) generated by an etching process using plasma in the processing container 30 from adhering. The deposition shield 86 is configured to be detachable.

[0027] The operation of the plasma etching apparatus 10 having the above configuration is comprehensively controlled by a control unit 90. The control unit 90 is, for example, a computer and controls each part of the plasma etching apparatus 10. The operation of the plasma etching apparatus 10 is comprehensively controlled by the control unit 90.

[0028] Incidentally, in the plasma etching apparatus 10, reaction products, fine particles, etc. accumulate and adhere to the inside of the processing container 30 as deposits, so the inside of the processing container 30 is regularly cleaned. In the plasma etching apparatus 10, when the processing container 30 is opened to the atmosphere for cleaning, a considerable amount of time (downtime) is required until the etching process for the wafer W is restarted for temperature adjustment and moisture control inside the processing container 30. As a result, the productivity of the plasma etching apparatus 10 decreases. For this reason, from the viewpoint of reducing downtime, it is preferable to clean the inside of the processing container 30 without opening it to the atmosphere.

[0029] Also, in the plasma etching apparatus 10, there are consumable parts that are gradually consumed by repeatedly performing an etching process using plasma. The consumable part is, for example, an edge ring 35 provided on the outer periphery of the wafer W placed on the placement surface 36d of the placement table 31. Since the edge ring 35 is exposed to plasma and worn, it is periodically replaced. In general, the replacement of such consumable parts is performed with the processing container 30 opened to the atmosphere. However, in the plasma etching apparatus 10, when the processing container 30 is opened to the atmosphere for replacing the consumable parts, downtime occurs. For this reason, from the viewpoint of reducing downtime, it is preferable to replace the consumable parts without opening the atmosphere.

[0030] Therefore, in the plasma etching apparatus 10, a gate for cleaning the inside of the processing container 30 and for replacing consumable parts is provided in the processing container 30 separately from the first gate 84 used for loading and unloading the wafer W. For example, in the plasma etching apparatus 10, as shown in FIG. 1, a second gate 95 is provided on the side opposite to the first gate 84 with respect to the placement table 31 on which the wafer W is placed. The second gate 95 is hermetically closed by a lid 96. Further, a maintenance device 100 described later is detachably attached to the second gate 95. When performing maintenance such as cleaning the inside of the processing container 30 and replacing consumable parts, an operator attaches the maintenance device 100 to the plasma etching apparatus 10 that is the object of maintenance.

[0031] [Configuration of Maintenance Device] Next, the configuration of the maintenance device 100 according to the embodiment will be described. FIG. 2 is a cross-sectional view schematically showing the maintenance device 100 according to the embodiment. FIG. 2 shows a state in which the maintenance device 100 is attached to the plasma etching device 10. In each of the following figures, the plasma etching device 10 is shown in a simplified manner. Further, hereinafter, the configuration of the maintenance device 100 will be appropriately described along the flow of cleaning the mounting table 31 as an object in the processing container 30 and replacing the edge ring 35 as a consumable part.

[0032] The maintenance device 100 has a case 101 in which an opening 101A having a size corresponding to the second gate 95 of the plasma etching device 10 is formed. The size corresponding to the second gate 95 is a size that allows the suction mechanism 110 and the edge ring 35, which will be described later, to be moved or carried in and out between the case 101 and the processing container 30 through the second gate 95. Note that the size corresponding to the second gate 95 may be any size as long as it allows the suction mechanism 110 and the edge ring 35 to be moved or carried in and out between the case 101 and the processing container 30. A sealing member such as an O-ring is provided at a portion of the periphery of the opening 101A that contacts the plasma etching device 10 in the case 101. The case 101 is mounted on the transport vehicle 102. The maintenance device 100 is transported to the position of the plasma etching device 10 by the transport vehicle 102, and the opening 101A of the case 101 is arranged to correspond to the second gate 95. Then, the opening 101A of the case is airtightly attached to the second gate 95 by screwing or the like.

[0033] The case 101 is composed of a first case 101B and a second case 101C that communicates with the first case 101B via an openable and closable shutter member 101D. The first case 101B houses a suction mechanism 110, which will be described later. The opening 101A is formed in the second case 101C.

[0034] In the first case 101B, a first pipe 103A provided with a first valve 104A is connected. In the second case 101C, a second pipe 103B provided with a second valve 104B is connected. The first pipe 103A and the second pipe 103B are connected to a vacuum pump 103 via a common pipe 103C. The vacuum pump 103 is mounted on a loading platform 102A provided on a transport vehicle 102. In the middle of the second pipe 103B on the way to the common pipe 103C, a leak pipe 103D branches off. A leak valve 104D is provided in the leak pipe 103D. The vacuum pump 103, the first pipe 103A, the second pipe 103B, and the common pipe 103C constitute a decompression mechanism for decompressing the inside of the case 101. The maintenance device 100 decompresses the inside of the case 101 to a predetermined degree of vacuum by the decompression mechanism, makes the pressure equal to that inside the processing container 30, and removes the lid 96, so that the case 101 and the processing container 30 can be communicated with each other via the opening 101A and the second gate 95.

[0035] Further, the maintenance device 100 has a suction mechanism 110 inside the case 101 (the first case 101B) for sucking the deposits on the mounting table 31 inside the processing container 30.

[0036] FIG. 3 is a diagram showing details of the suction mechanism 110 according to the embodiment. The suction mechanism 110 includes a robot arm 111, and a suction port 112, a supply port 113, an irradiation unit 114, and an imaging unit 115 provided at the tip of the robot arm 111.

[0037] The robot arm 111 includes an arm 121 having two arm elements connected by a joint, a support 122 that supports the arm 121 so that it can rotate and move up and down, and a head 123 provided at the tip of the arm 121. The robot arm 111 is extendable by linearly extending the two arm elements of the arm 121 or by overlapping them. The robot arm 111 can move the head 123 at the tip of the arm 121 up and down by raising and lowering the arm 121 using the support 122. The robot arm 111 can extend the two arm elements of the arm 121 toward the opening 101A and move the head 123 toward the mounting table 31 through the opening 101A. The operation of the robot arm 111 is controlled comprehensively by a control unit (not shown). The control unit has a user interface that accepts various operation instructions and displays the operation status. The operator issues operation instructions via the user interface. The operation instruction is, for example, an operation instruction that individually specifies the movement of the robot arm 111. Note that the operation instruction may specify a series of movements. For example, the operation instruction may specify, as a suction instruction, a series of movements of the robot arm 111 when sucking up deposits on the mounting table 31.

[0038] The head unit 123 is provided with a suction port 112, a supply port 113, an irradiation unit 114, and an image capturing unit 115. The positions of the suction port 112, the supply port 113, the irradiation unit 114, and the image capturing unit 115 will be described later.

[0039] As the head unit 123 approaches the mounting table 31, the suction port 112 sucks up the deposits on the mounting table 31. That is, the suction port 112 is connected to an exhaust device 131 on the platform 102A via an exhaust pipe 131A that is provided with a valve 131B and passes through the robot arm 111, and sucks up the deposits on the mounting table 31 based on the exhaust operation of the exhaust device 131.

[0040] The supply port 113 supplies gas to the mounting table 31 when the head portion 123 approaches the mounting table 31. The gas supplied from the supply port 113 is an inert gas, a gas that reacts with the deposits to facilitate the suction of the deposits on the mounting table 31, or a gas that reacts with the deposits to gasify the deposits. As the inert gas, for example, Ar, N2, dry air, etc. are used. When an inert gas is used, the gas flow rate is appropriately set so as to blow off the deposits adhering to the mounting table 31. Examples of the gas that reacts with the deposits to facilitate the suction of the deposits from the mounting table 31 or the gas that reacts with the deposits to gasify the deposits include nitrogen trifluoride gas (NF3), fluorine gas (F2), etc. The suction port 112 sucks the deposits together with the gas supplied from the supply port 113. The supply port 113 is connected to a gas supply source (not shown) via a pipe penetrating the robot arm 111, and supplies the gas supplied from the gas supply source to the mounting table 31.

[0041] When the head unit 123 approaches the mounting table 31, the irradiation unit 114 irradiates the mounting table 31 with plasma to remove deposits from the mounting table 31. The irradiation unit 114 can reduce the adhesion force of the deposits or gasify the deposits by reacting ions and radicals in the plasma with the deposits. The deposits with reduced adhesion force or the gasified deposits are detached from the mounting table 31 and sucked from the suction port 112. The irradiation unit 114 irradiates the mounting table 31 with plasma obtained by applying high-frequency power to a gas such as an oxygen-containing gas (O2, CO2, etc.), a gas containing an oxygen-containing gas and a noble gas (a gas containing O2 and Ar, etc.), or a fluorine-containing gas (CF4, etc.). Note that the irradiation unit 114 may irradiate the mounting table 31 with a laser, or may irradiate the mounting table 31 with both plasma and a laser. The laser may be any laser that heats the deposits to reduce the adhesion force of the deposits. The laser may also be a laser having a wavelength that gasifies the deposits. For example, a semiconductor laser with a wavelength of 808 nm, a laser spot area of 0.5 to 3 mm, and a laser power of 200 W may be used. Further, the irradiation unit 114 may irradiate the mounting table 31 with a laser in an environment where there is a gas (for example, ozone gas, etc.) having an action of reducing the adhesion force of the deposits or an action of gasifying the deposits.

[0042] The imaging unit 115 is, for example, an image sensor, and images the mounting table 31 when the head unit 123 approaches the mounting table  31. Note that the imaging unit 115 may image the mounting table 31 while irradiating light as necessary. The operation of the imaging unit 115 is comprehensively controlled by a control unit (not shown). The imaging unit 115 outputs an imaging image obtained by imaging the mounting table 31 to the control unit. The control unit detects the presence or absence of deposits on the mounting table 31 from the imaging image. When deposits are detected from the imaging image, the control unit controls the exhaust device 131 to start sucking the deposits from the suction port 112.

[0043] Further, a measuring instrument 132 is provided in the exhaust pipe 131A. The measuring instrument 132 measures the diameter and number of fine particles flowing in the exhaust pipe 131A, and outputs information on the number for each predetermined particle diameter category and information on the total number of fine particles to a control unit (not shown). When suction is performed from the suction port 112, the control unit monitors whether the number for each predetermined particle diameter category and the total number of fine particles obtained from the measuring instrument 132 are equal to or less than a predetermined threshold value. When the number for each predetermined particle diameter category and the total number of fine particles are equal to or less than the predetermined threshold value, the control unit controls the exhaust device 131 to stop the suction from the suction port 112.

[0044] FIG. 4 is a diagram showing an example of the arrangement of the suction port 112, supply port 113, irradiation unit 114, and imaging unit 115 according to the embodiment. FIG. 4 shows a view of the head portion 123 of the robot arm 111 as seen from below. The head portion 123 is formed in a rectangular shape arranged such that a pair of short sides sandwich the arm portion 121 in a plan view. The suction port 112 is provided along each of the pair of short sides at positions inside the pair of short sides of the head portion 123. The supply port 113 is provided at a position adjacent to one of the two suction ports 112, and the irradiation unit 114 is provided at a position adjacent to the other of the two suction ports 112. The imaging unit 115 is provided corresponding to the position of the long side opposite to the arm portion 121 among the pair of long sides of the head portion 123. Note that the arrangement positions of the suction port 112, supply port 113, irradiation unit 114, and imaging unit 115 shown in FIG. 4 are merely examples and are not limited thereto. For example, as shown in FIG. 5, the suction port 112 may be provided at a position inside the pair of short sides of the head portion 123 and surrounding the outer circumferences of the supply port 113 and the irradiation unit 114, respectively. FIG. 5 is a diagram showing another example of the arrangement of the suction port 112, supply port 113, irradiation unit 114, and imaging unit 115 according to the embodiment.

[0045] Return to FIG. 2. The maintenance device 100 has a transport mechanism 140 inside the case 101 for carrying out the edge ring 35 from the processing container 30 and carrying the edge ring 35 into the processing container 30. The transport mechanism 140 includes a multi-joint arm portion 141, a support portion 142 that rotatably and vertically supports the arm portion 141, and a fork portion 143 provided at the tip of the arm portion 141. The transport mechanism 140 is configured to be telescopic by extending the arm portion 141 linearly or overlapping them with each other. The transport mechanism 140 can move the fork portion 143 at the tip of the arm portion 141 in the vertical direction by raising and lowering the arm portion 141 by the support portion 142. The operation of the transport mechanism 140 is comprehensively controlled by a control unit (not shown). The control unit has a user interface for receiving various operation instructions and displaying the operation state. An operator gives an operation instruction to the user interface. The operation instruction is, for example, an operation instruction for individually specifying the movement of the transport mechanism 140. Note that the operation instruction may specify a series of movements. For example, the operation instruction may specify a series of movements of the transport mechanism 140 when carrying in and out the edge ring 35 as a transport instruction.

[0046] Inside the case 101, as an example, three support bases 105 are provided at predetermined intervals in height. Replacement edge rings 35 are placed on two of the three support bases 105, respectively. The remaining one support base 105 is left empty for placing the used edge ring 35. Note that the replacement edge ring 35 is, for example, a new edge ring that has not been used. Also, the replacement edge ring 35 may be a used but relatively less consumed edge ring.

[0047] Next, with reference to FIG. 6, a specific processing operation of the vacuum processing system having the plasma etching apparatus 10 and the maintenance apparatus 100 will be described. FIG. 6 is a flowchart showing an example of the processing operation of the vacuum processing system according to the embodiment. The processing operation shown in FIG. 6 is mainly executed according to the control by a control unit (not shown).

[0048] First, dry cleaning of the processing container 30 is performed with the edge ring 35 placed on the mounting table 21 (step S101).

[0049] When the dry cleaning is completed, the maintenance device 100 is attached to the plasma etching device 10 (step S102).

[0050] When the attachment of the maintenance device 100 is completed, the edge ring 35 is carried out from the processing container 30 (step S103).

[0051] Subsequently, the mounting table 31 in the processing container 30 is cleaned by the maintenance device 100 (step S104).

[0052] When the cleaning is completed, a replacement edge ring 35 is carried into the processing container 30 (step S105).

[0053] Thereafter, the position of the edge ring 35 is corrected (step S106).

[0054] Next, with reference to FIGS. 7A, 7B, and 8, an example of the operation when the edge ring 35 is carried out from the processing container 30 and the mounting table 31 is cleaned will be described. FIGS. 6A and 6B are diagrams for explaining an example of the operation when the edge ring 35 is carried out from the processing container 30 and the mounting table 31 is cleaned. FIG. 8 is a flowchart showing an example of the process of cleaning the mounting table 31. Note that FIG. 8 corresponds to the process of step S104 in FIG. 6.

[0055] The operator moves the transport vehicle 102 to transport the maintenance device 100 to the position of the plasma etching device 10. At this time, the first valve 104A is controlled to be in an open state. Then, the vacuum pump 103 evacuates the inside of the first case 101B with the shutter member 101D closed. Note that the maintenance device 100 may be configured to be automatically transported to the position of the plasma etching device 10 based on an instruction from the control unit 90 or an instruction from a remote location. Subsequently, the opening 101A of the case 101 (second case 101C) is airtightly attached to the second gate 95. When the opening 101A of the case 101 (second case 101C) is attached to the second gate 95, the first valve 104A is switched from the open state to the closed state, and the second valve 104B is controlled to be in the open state. Then, the vacuum pump 106 evacuates the inside of the second case 101C. As a result, both the inside of the first case 101B and the inside of the second case 101C, that is, the entire inside of the case 101 is evacuated. Subsequently, the shutter member 101D is opened, and the first case 101B and the second case 101C communicate with each other. Then, the second valve 104B is switched from the open state to the closed state.

[0056] The maintenance device 100 has a removal unit (not shown) inside the case 101 for removing the lid 96 of the plasma etching device 10. When carrying out the edge ring 35 from the processing container 30, as shown in Fig. 6A, the removal unit removes the lid 96 from the second gate 95 and retracts the removed lid 96 to a retracted position inside the case 101. Thereby, the case 101 and the processing container 30 communicate with each other via the opening 101A and the second gate 95. When the case 101 and the processing container 30 communicate with each other, a lift pin (not shown) protrudes from the mounting table 31, and the edge ring 35 is disposed above the mounting table 31. When the edge ring 35 is electrostatically adsorbed, after releasing the electrostatic adsorption, the lift pin protrudes, and the edge ring 35 is disposed above the mounting table 31. The transfer mechanism 140 moves the fork portion 143 at the tip of the arm portion 141 to a height corresponding to the opening 101A by the support portion 142. The transfer mechanism 140 extends the arm portion 141 toward the opening 101A side and moves the fork portion 143 below the edge ring 35 through the opening 101A. When the lift pin descends, the transfer mechanism 140 receives the edge ring 35 supported on the lift pin with the fork portion 143. The transfer mechanism 140 contracts the arm portion 141 while holding the edge ring 35 and carries out the edge ring 35 from the processing container 30.

[0057] Next, as shown by the dashed line in Fig. 7A, the transfer mechanism 140 moves the fork portion 143 holding the edge ring 35 to a height corresponding to the empty support base 105. The transfer mechanism 140 moves the arm portion 141 toward the empty support base 105 side and moves the edge ring 35 above the empty support base 105. The transfer mechanism 140 lowers the arm portion 141 and stores the edge ring 35 in the empty support base 105.

[0058] Next, as shown in FIG. 7B, the robot arm 111 moves the head portion 123 at the tip of the arm portion 121 to a height corresponding to the opening 101A by the support portion 122. The robot arm 111 extends the arm portion 121 toward the opening 101A and brings the head portion 123 close to the mounting table 31 through the opening 101A. As shown in FIG. 8, the imaging unit 115 images the mounting table 31 from above and outputs the obtained captured image to a control unit (not shown) (step S111). That is, the imaging unit 115 outputs a captured image obtained by imaging the mounting surface 36d, the outer peripheral surface 36e, the ER mounting surface 36f, etc. of the electrostatic chuck 36 to the control unit. The control unit detects the presence or absence of deposits on the mounting table 31 by comparing the captured image with a reference image obtained by previously imaging the cleaned or new mounting table 31 (step S112). When deposits are detected from the captured image (step S113: Yes), the control unit moves the suction port 112 to the position of the deposits and controls the exhaust device 131 to start suction by the suction port 112. Thereby, the deposits on the mounting table 31 (that is, the deposits remaining on the mounting surface 36d, the outer peripheral surface 36e, the ER mounting surface 36f, etc. of the electrostatic chuck 36) are sucked by the suction port 112 (step S114). For example, when dry cleaning is performed with the edge ring 35 mounted on the mounting table 31, the reaction product remains as a deposit without being completely removed on the outer peripheral surface 36e of the electrostatic chuck 36. In such a case, the control unit sucks, for example, the deposits remaining on the outer peripheral surface 36e of the electrostatic chuck 36 from the suction port 112.

[0059] Note that the suction port 112 may suck the deposits on the mounting table 31 in a state where an inert gas is supplied from the shower head 46 of the plasma etching apparatus 10 into the processing chamber 30 and inside the case 101. As the inert gas, for example, Ar, N2, or dry air is used. Note that the supply source of the inert gas is not limited to the shower head 46, and may be, for example, a purge port (not shown) that supplies gas when the inside of the processing chamber 30 is opened to the atmosphere.

[0060] When suction is performed from the suction port 112, the control unit monitors whether the number of fine particles for each predetermined particle size range obtained from the measuring device 132 and the total number of fine particles are equal to or less than a predetermined threshold value. When the number of fine particles is equal to or less than the predetermined threshold value, the control unit controls the exhaust device 131 to stop the suction from the suction port 112.

[0061] When the suction from the suction port 112 is stopped, the imaging unit 115 images the mounting table 31 again from above and outputs the obtained captured image to the control unit (step S115). The control unit detects the presence or absence of deposits on the mounting table 31 by comparing the captured image with a reference image obtained by imaging the cleaned or new mounting table 31 in advance (step S116). When deposits are detected again from the captured image (step S117: Yes), the control unit controls the exhaust device 131 to start suction by the suction port 112. At this time, the supply port 113 supplies gas to the mounting table 31 (step S118). The suction port 112 suctions the deposits together with the gas supplied from the supply port 113. When the number of fine particles for each predetermined particle size range obtained from the measuring device 132 and the total number of fine particles are equal to or less than the threshold value, the control unit controls the exhaust device 131 to stop the suction from the suction port 112.

[0062] When the suction from the suction port 112 stops, the imaging unit 115 images the mounting table 31 again from above and outputs the obtained captured image to the control unit (step S119). The control unit detects the presence or absence of deposits on the mounting table 31 by comparing the captured image with a reference image obtained by previously imaging the cleaned or new mounting table 31 (step S120). When deposits are detected again from the captured image (step S121: Yes), the control unit controls the exhaust device 131 to start suction by the suction port 112. At this time, the irradiation unit 114 irradiates the mounting table 31 with plasma, laser, or both plasma and laser to remove the deposits from the mounting table 31 (step S122). The suction port 112 suctions the deposits removed from the mounting table 31. Note that the control unit may suction the deposits by the suction port 112 after irradiating the mounting table 31 with one or both of plasma and laser by the irradiation unit 114. When the number of fine particles obtained from the measuring instrument 132 becomes equal to or less than the threshold value, the control unit controls the exhaust device 131 to stop the suction from the suction port 112.

[0063] When the suction from the suction port 112 stops, the imaging unit 115 images the mounting table 31 again from above and outputs the obtained captured image to the control unit (step S123). The control unit detects the presence or absence of deposits on the mounting table 31 by comparing the captured image with a reference image obtained by previously imaging the cleaned or new mounting table 31 (step S124). When deposits are detected again from the captured image (step S125: Yes), the control unit notifies the operator of the vacuum processing system of an alert (step S126). The operator who has received the alert notification opens the processing chamber 30 to the atmosphere and performs maintenance including cleaning of the mounting table 31.

[0064] Also, when deposits are not detected from the captured image (step S113: No, step S117: No, step S121: No, step S125: No), the control unit ends the process of cleaning the mounting table 31. In this way, the mounting table 31 is cleaned.

[0065] When the cleaning of the mounting table 31 is completed, the robot arm 111 contracts the arm portion 121 and returns the suction port 112, the supply port 113, the irradiation unit 114, and the imaging unit 115 to their original positions inside the case 101.

[0066] Next, with reference to FIGS. 9A to 9C, an example of the operation when loading the replacement edge ring 35 into the processing container 30 will be described. FIGS. 9A to 9C are diagrams for explaining an example of the operation when loading the edge ring 35 into the processing container 30. FIG. 10 is a flowchart showing an example of the process for correcting the position of the edge ring 35 after loading. Note that FIG. 10 corresponds to the process of step S106 in FIG. 6.

[0067] When loading the replacement edge ring 35 into the processing container 30, as shown in FIG. 9A, the transfer mechanism 140 moves the fork portion 143 to a height corresponding to the support table 105 on which the replacement edge ring 35 is placed. The transfer mechanism 140 moves the arm portion 141 toward the replacement edge ring 35 side and holds the replacement edge ring 35 with the fork portion 143. The transfer mechanism 140 moves the arm portion 141 toward the opening 101A side while holding the replacement edge ring 35.

[0068] Next, as shown by the dashed line in FIG. 9A, the transfer mechanism 140 moves the fork portion 143 to a height corresponding to the opening 101A. The transfer mechanism 140 extends the arm portion 141 toward the opening 101A side and transports the replacement edge ring 35 above the mounting table 31 through the opening 101A.

[0069] When the fork portion 143 holding the replacement edge ring 35 reaches above the mounting table 31, lift pins (not shown) protrude from the mounting table 31, and the replacement edge ring 35 is transferred from the fork portion 143 to the lift pins. When the replacement edge ring 35 is transferred from the fork portion 143 to the lift pins, the transfer mechanism 140 contracts the arm portion 121 and returns the fork portion 143 to its original position inside the case 101. The lift pins supporting the replacement edge ring 35 descend, and the replacement edge ring 35 is placed on the outer peripheral portion of the mounting table 31.

[0070] Next, as shown in FIG. 9B, the robot arm 111 moves the head portion 123 to a height corresponding to the opening 101A. The robot arm 111 extends the arm portion 121 toward the opening 101A and brings the head portion 123 close to the mounting table 31 through the opening 101A. As shown in FIG. 10, the imaging unit 115 images the gap between the replacement edge ring 35 and the electrostatic chuck 36 of the mounting table 31 at a plurality of positions in the circumferential direction (step S131). For example, the imaging unit 115 sequentially images the gap between the replacement edge ring 35 and the electrostatic chuck 36 of the mounting table 31 at a plurality of imaging positions set at equal intervals in the circumferential direction of the mounting table 31.

[0071] FIG. 11 is a diagram showing an example of the imaging positions in the imaging unit 115. FIG. 11 corresponds to a top view of the replacement edge ring 35 and the electrostatic chuck 36 of the mounting table 31 as viewed from above. In FIG. 8, the mounting surface 36d of the mounting table 31 is shown in a disc shape, and the replacement edge ring 35 is shown in a ring shape around the mounting surface 36d. Four imaging positions P in the imaging unit 115 are set at equal intervals at every 90-degree angle with respect to the circumferential direction of the mounting table 31. Note that the imaging positions may be set to three or less, or may be set to five or more, with respect to the circumferential direction of the mounting table 31. Further, the imaging unit 115 may image the gap between the replacement edge ring 35 and the electrostatic chuck 36 of the mounting table 31 all at once.

[0072] Returning to FIG. 9B, the imaging unit 115 outputs the captured images obtained by imaging the gap between the replacement edge ring 35 and the electrostatic chuck 36 of the mounting table 31 at a plurality of positions in the circumferential direction to a control unit (not shown). As shown in FIG. 10, the control unit compares the captured image with a correction reference image obtained by previously imaging the edge ring 35 in a non-displaced state (step S132), and calculates the deviation amount between the width of the gap and the reference width at each of a plurality of positions in the circumferential direction (step S133). The reference width is, for example, the width of the gap measured in advance when the center of the replacement edge ring 35 and the center of the electrostatic chuck 36 coincide.

[0073] Next, the control unit determines whether or not the calculated deviation amount is within the allowable value (step S134). When the calculated deviation amount is outside the allowable value (step S)134: No), the control unit controls the transport mechanism 140 to correct the position of the replacement edge ring 35 by the calculated deviation amount (step S135). That is, when a lift pin (not shown) protrudes from the mounting table 31 and the replacement edge ring 35 is disposed above the mounting table 31, the transport mechanism 140 moves the fork portion 143 to a height corresponding to the opening 101A as shown in FIG. 9C. Then, the transport mechanism 140 extends the arm portion 141 toward the opening 101A side and moves the fork portion 143 below the replacement edge ring 35 through the opening 101A. When the lift pin descends, the transport mechanism 140 receives the replacement edge ring 35 supported on the lift pin with the fork portion 143. The transport mechanism 140 horizontally moves the arm portion 141 while holding the replacement edge ring 35 so that the calculated deviation amount becomes 0. When the replacement edge ring 35 moves and the deviation amount becomes 0, a lift pin protrudes from the mounting table 31, and the replacement edge ring 35 is transferred from the fork portion 143 to the lift pin. When the replacement edge ring 35 is transferred from the fork portion 143 to the lift pin, the transport mechanism ①40 contracts the arm portion 121 and returns the fork portion 143 to the original position inside the case 101. The lift pin supporting the replacement edge ring 35 descends, and the replacement edge ring 35 is placed on the outer peripheral portion of the mounting table 31. After correcting the deviation amount, the control unit may return the process to step S131 and image the gap between the replacement edge ring 35 and the electrostatic chuck 36 of the mounting table 31 by the imaging unit 115 to confirm that the deviation amount is within the allowable value (steps S131 to S134). Further, when the deviation amount is outside the allowable value, the control unit may correct the deviation amount of the replacement edge ring 35 to 0 again as described above (step S135).

[0074] Further, when the calculated deviation amount is within the allowable value (step S134: Yes), the control unit ends the process. Thereby, the loading of the replacement edge ring 35 into the processing container 30 is completed.

[0075] Note that when the loading of the edge ring 35 into the processing container 30 is completed, the maintenance device 100 controls the removal unit to attach the lid 96 to the second gate 95. Thereafter, with the shutter member 101D closed, the leak valve 104D is opened, and the second case 101C is vented to the atmosphere. After the maintenance inside the processing container 30 is performed in such an order, the operator moves the transport vehicle 102 to separate the maintenance device 100 from the plasma etching device 10. Note that the maintenance device 100 may be configured to be automatically separated from the plasma etching device 10 based on an instruction from the control unit 90 or a remote instruction and automatically transported to a predetermined position.

[0076] As described above, the maintenance device 100 according to the embodiment has an opening 101A formed in a size corresponding to the second gate 95 of the plasma etching device 10 and a case 101 that can be attached to the opening 101A airtightly with respect to the second gate 95. Further, the maintenance device 100 has a suction mechanism 110 disposed inside the case 101, entering the processing container 30 through the opening 101A, and sucking deposits on an object (for example, the mounting table 31) inside the processing container 30. Thereby, the maintenance device 100 can efficiently clean the inside of the processing container 30 without venting to the atmosphere.

[0077] Further, the suction mechanism 110 has a robot arm 111 whose tip can approach an object inside the processing container 30 through the opening 101A. Further, the suction mechanism 110 has a suction port 112 provided at the tip of the robot arm 111 (for example, the head portion 123) and sucking deposits on the object inside the processing container �. Thereby, the maintenance device 100 can suck deposits by the suction port 112 in the vicinity of the object inside the processing container 30.

[0078] Further, the suction port 112 sucks the deposits while an inert gas is supplied into the processing vessel 30. Thereby, the maintenance apparatus 100 can suck the deposits together with the inert gas through the suction port 112.

[0079] Further, the suction mechanism 110 is provided at the tip of the robot arm 111 and further has a supply port 113 for supplying gas to the object in the processing vessel 30. Thereby, the maintenance apparatus 100 can blow off the deposits from the object in the processing vessel 30 with the inert gas and suck the deposits together with the inert gas through the suction port 112.

[0080] Further, the suction mechanism 110 is provided at the tip of the robot arm 111 and further has an irradiation unit 114 that irradiates one or both of plasma and laser to the object in the processing vessel 30 to remove the deposits from the object in the processing vessel 30. Thereby, the maintenance apparatus 100 can suck the deposits removed from the object in the processing vessel 30 through the suction port 112.

[0081] Further, the suction mechanism 110 is provided at the tip of the robot arm 111 and further has an imaging unit 115 that images the object in the processing vessel 30. Thereby, the maintenance apparatus 100 can obtain an imaging image used for detecting the presence or absence of deposits.

[0082] Further, the maintenance apparatus 100 further includes an exhaust device 131 connected to the suction port 112 via an exhaust pipe 131A, and a measuring instrument 132 that measures the number of fine particles flowing in the exhaust pipe 131A. When the number of fine particles for each predetermined particle size classification and the total number of fine particles measured by the measuring instrument 132 are equal to or less than a predetermined threshold value, the exhaust device 131 stops the suction from the suction port 112. Thereby, the maintenance apparatus 100 can stop the suction from the suction port 112 at an appropriate timing.

[0083] Further, the object in the processing container 30 is a mounting table 31 having an electrostatic chuck 36 on which the wafer W can be mounted and an outer peripheral portion on which the edge ring 35 can be mounted, and the maintenance device 100 further includes a transfer mechanism 140. The transfer mechanism 140 is disposed inside the case 101 and performs the unloading of the edge ring 35 from the processing container 30 and the loading of the edge ring 35 into the processing container 30 through the opening 101A. Thereby, the maintenance device 100 can clean the inside of the processing container 30 and replace the edge ring 35 without opening to the atmosphere.

[0084] Further, the suction port 112 sucks the deposits on the outer peripheral surface of the mounting portion (as an example, the electrostatic chuck 36) of the mounting table 31 in a state where the edge ring 35 is unloaded from the processing container 30 by the transfer mechanism 140. Thereby, the maintenance device 100 can clean the outer peripheral surface of the mounting portion of the mounting table 31 that is exposed when the edge ring 35 is unloaded.

[0085] Further, the transfer mechanism 140 loads the replacement edge ring 35 into the processing container 30 and mounts it on the outer peripheral portion of the mounting table 31. The maintenance device 100 further includes a control unit. The control unit images the gap between the replacement edge ring 35 and the mounting portion of the mounting table 31 at a plurality of positions in the circumferential direction by the imaging unit 115 provided at the tip of the robot arm 111. The control unit calculates the deviation amount between the width of the gap and the reference width for each of the plurality of positions in the circumferential direction based on the obtained captured image. The control unit controls the transfer mechanism 140 to correct the position of the replacement edge ring 35 by the calculated deviation amount. Thereby, the maintenance device 100 can appropriately correct the position of the replacement edge ring 35 mounted on the outer peripheral portion of the mounting table 31.

[0086] (Modification example) In the above embodiment, the case of cleaning the mounting table 31 as an object in the processing container 30 has been described as an example, but the disclosed technology is not limited to this. The maintenance device 100 may clean parts other than the mounting table 31 as long as they are parts located in the processing container 3. Further, the control unit compares the captured image obtained by imaging the parts in the processing container 30 by the imaging unit 115 with the captured image obtained by imaging new parts by the imaging unit 115, and based on at least one of the surface state, shape, and size, determines the abnormality of the parts in the processing container 30. Further, when it is determined that an abnormality has occurred in the parts in the processing container 30, the control unit may output a component replacement instruction.

[0087] Also, in the above embodiment, the case of replacing the edge ring 35 as a consumable part has been described as an example, but the disclosed technology is not limited to this. The consumable part to be replaced may be, in addition to the edge ring 35, a cover ring (not shown) arranged on the outer peripheral side of the edge ring 35, or any part that can be carried into and out of the processing container 30 by a transfer mechanism such as a robot arm.

[0088] Also, in the above embodiment, the suction mechanism 110 has been described as having a suction port 112, a supply port 113, an irradiation unit 114, and an imaging unit 115 at the tip of the robot arm 111, but the supply port 113, the irradiation unit 114, and the imaging unit 115 do not have to be set with the suction port 112. For example, among the combinations of the suction port 112 and the supply port 113, the suction port 112 and the irradiation unit 114, the suction port 112 and the imaging unit 115, the suction port 112 and the supply port 113 and the irradiation unit 114, the suction port 112 and the supply port 113 and the imaging unit 115, the suction port 112 and the irradiation unit 114 and the imaging unit 115, any one combination may be provided at the tip of the robot arm 111.

[0089] In the above-described embodiment, the case where both the suction mechanism 110 and the transfer mechanism 140 are provided inside the case 101 has been described. However, the disclosed technology is not limited to this. For example, only the suction mechanism 110 may be provided inside the case 101, and a part of the robot arm 111 of the suction mechanism 110 may be replaced with a pick for edge ring replacement. Further, for example, only the suction mechanism 110 may be provided inside the case 101, and a pick for edge ring replacement may be attached to the robot arm 111 of the suction mechanism 110. In such a case, the edge ring 35 may be replaced using the pick for edge ring replacement. Note that the replacement or attachment of the pick may be performed by an operator or may be realized by automatic exchange.

[0090] It should be considered that the embodiments disclosed this time are illustrative in all respects and not restrictive. The above embodiments may be omitted, replaced, or changed in various forms without departing from the scope and gist of the appended claims.

Description of Reference Numerals

[0091] 10 Plasma etching apparatus 30 Processing container 31 Mounting table 35 Edge ring 36 Electrostatic chuck 84 First gate 95 Second gate 100 Maintenance apparatus 101 Case 101A Opening 110 Suction mechanism 111 Robot arm 112 Suction port 113 Supply port 114 Irradiation unit 115 Imaging unit 131 Exhaust apparatus I31A Exhaust pipe 132 Measuring instrument 140 Transfer mechanism

Claims

1. An opening having a size corresponding to the second gate of a vacuum processing apparatus in which a first gate used for loading and unloading a substrate and a second gate different from the first gate are provided in a processing container is formed, and a case that can be detachably and airtightly attached to the second gate; A decompression mechanism for decompressing the inside of the case; A suction mechanism disposed inside the case, entering the processing container through the opening, and sucking deposits on an object in the processing container; A transport mechanism disposed inside the case for carrying out consumable parts from the processing container and carrying consumable parts into the processing container A maintenance apparatus having the above.

2. The suction mechanism is: An arm whose tip can approach an object in the processing container through the opening; A suction port provided at the tip of the arm for sucking deposits on an object in the processing container The maintenance apparatus according to claim 1, having the above.

3. The maintenance apparatus according to claim 2, wherein the suction port sucks the deposits in a state where an inert gas is supplied into the processing container.

4. The suction mechanism is: The maintenance apparatus according to claim 2 or 3, further having a supply port provided at the tip of the arm for supplying gas to an object in the processing container.

5. The suction mechanism is: The maintenance apparatus according to any one of claims 2 to 4, further having an irradiation unit provided at the tip of the arm for irradiating one or both of plasma and laser to an object in the processing container to remove the deposits from the object in the processing container.

6. The suction mechanism is: The maintenance apparatus according to any one of claims 2 to 5, further having an imaging unit provided at the tip of the arm for imaging an object in the processing container.

7. An exhaust device connected to the suction port via an exhaust pipe; A measuring instrument for measuring the number of fine particles flowing in the exhaust pipe Further having the above, The maintenance apparatus according to any one of claims 2 to 6, wherein the exhaust device stops suction from the suction port when the number of fine particles measured by the measuring instrument is equal to or less than a predetermined threshold value.

8. The object in the processing container is a mounting table having a mounting portion on which a substrate can be mounted and an outer peripheral portion on which consumable parts can be mounted. The maintenance apparatus according to claim 1.

9. The object in the processing container is a mounting table having a mounting portion on which a substrate can be mounted and an outer peripheral portion on which consumable parts can be mounted. The maintenance apparatus according to any one of claims 2 to 7.

10. The suction port sucks deposits on the outer peripheral surface of the mounting portion of the mounting table in a state where the consumable parts are carried out from the processing container by the transfer mechanism. The maintenance apparatus according to claim 9.

11. The transfer mechanism carries a replacement consumable part into the processing container and mounts it on the outer peripheral portion of the mounting table. An imaging unit provided at the tip of the arm images the gap between the replacement consumable part and the mounting portion of the mounting table at a plurality of positions in the circumferential direction respectively. Based on the obtained imaging images, the deviation amount between the width of the gap and the reference width is calculated for each of the plurality of positions in the circumferential direction, and the transfer mechanism is controlled to correct the position of the replacement consumable part by the calculated deviation amount. The maintenance apparatus according to claim 9 or 10, further comprising a control unit.

12. The consumable part is an edge ring. The maintenance apparatus according to any one of claims 8 to 11.

13. A vacuum processing system having a vacuum processing apparatus and a maintenance apparatus, wherein the vacuum processing apparatus comprises a processing container, a first gate provided in the processing container and used for loading and unloading a substrate, and a second gate provided in the processing container to which the maintenance apparatus is detachably attached. It has The maintenance apparatus comprises a case in which an opening having a size corresponding to the second gate is formed and the opening can be attached to the second gate in an airtight manner, a decompression mechanism for decompressing the inside of the case, a suction mechanism disposed inside the case, entering the processing container through the opening, and sucking deposits on the object in the processing container, and a transfer mechanism disposed inside the case for carrying out consumable parts from the processing container and carrying consumable parts into the processing container. A vacuum processing system.

Images