Endoscope, imaging module, and method for manufacturing an endoscope

Abstract

A perspective endoscope capable of observing a predetermined direction and an imaging module of the perspective endoscope capable of observing a predetermined direction are provided. 【Solution means】In the endoscope, an imaging module 30 is fixed to the tip frame 20 of the insertion portion. The imaging module 30 includes a camera unit and a three-dimensional wiring board. The three-dimensional wiring board has a first surface, a second surface on the tip side of the first surface, and a third surface on the base end side of the first surface. The camera unit is mounted on the first surface that is inclined at a first angle with respect to the major axis direction of the tip portion 11A. The tip frame 20 has a fourth surface in contact with the second surface and a fifth surface in contact with the third surface.

Description

Technical Field

[0001] The present invention relates to an endoscope in which an imaging module is disposed at a distal end portion of an insertion portion, an imaging module disposed at a distal end portion of the insertion portion of the endoscope, and a method for manufacturing an endoscope in which an imaging module is disposed at a distal end portion of the insertion portion.

Background Art

[0002] In a forward oblique endoscope, the direction in which the imaging element images (observation direction) is inclined at a predetermined angle with respect to the major axis direction of the distal end portion of the insertion portion. If a forward oblique endoscope cannot observe a predetermined direction, for example, the position of a treatment tool protruding from the side surface of the distal end portion and performing a treatment cannot be grasped.

[0003] WO 2019 / 138606 discloses a forward oblique endoscope having an imaging module in which an imaging element is mounted on an inclined surface of a laminated substrate. The imaging element is adhesively fixed to the lens unit via a cover glass. The lens holder of the lens unit is inserted and fixed in a through hole of the distal end frame. The optical axis direction of the lens unit, that is, the observation direction of the imaging element, is fixed in the direction of the central axis of the through hole. The central axis of the through hole is inclined at a predetermined angle with respect to the distal end axis of the endoscope.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] An embodiment of the present invention aims to provide a forward oblique endoscope capable of observing a predetermined direction, an imaging module of the forward oblique endoscope capable of observing a predetermined direction, and a method for manufacturing the forward oblique endoscope capable of observing a predetermined direction.

Means for Solving the Problems

[0006] The endoscope according to an embodiment of the present invention has a tip frame at the tip of the insertion portion, an imaging module is fixed to the tip frame, the imaging module includes a camera unit and a three-dimensional wiring board, the three-dimensional wiring board has a first surface, a second surface on the tip side of the first surface, and a third surface on the base end side of the first surface, the camera unit is mounted on the first surface that is inclined at a first angle with respect to the major axis direction of the tip portion, and the tip frame has a fourth surface that contacts the second surface and a fifth surface that contacts the third surface.

[0007] The imaging module according to an embodiment of the present invention includes a camera unit, a three-dimensional wiring board having a first surface on which the camera unit is mounted, a second surface and a third surface having a first angle with the first surface, the second surface is located at one end side in the major axis direction of the three-dimensional wiring board, the third surface is located on the opposite side of the second surface with the first surface interposed therebetween, and the second surface and the third surface are arranged so as to contact with respective two surfaces of the tip frame of the endoscope.

[0008] A method for manufacturing an endoscope according to an embodiment of the present invention includes: producing a three-dimensional wiring board having a first surface, a second surface on the tip side of the first surface, and a third surface on the base end side of the first surface, the second surface and the third surface arranged with the first surface interposed therebetween and having a first angle with the first surface; mounting a camera unit on the first surface of the three-dimensional wiring board to produce an imaging module; producing a tip frame having a fourth surface and a fifth surface; bringing the second surface of the three-dimensional wiring board into contact with the fourth surface of the tip frame and bringing the third surface of the three-dimensional wiring board into contact with the fifth surface of the tip frame; injecting an adhesive into a gap between the three-dimensional wiring board and the tip frame; curing the adhesive; and fixing the imaging module to the tip of the insertion portion of the endoscope.

Advantages of the Invention

[0009] According to an embodiment of the present invention, an endoscope capable of observing a predetermined direction, an imaging module of the endoscope capable of observing a predetermined direction, and a method for manufacturing the endoscope capable of observing a predetermined direction can be provided.

Brief Description of the Drawings

[0010]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Embodiments for Carrying Out the Invention

[0011] <Embodiment> As shown in FIG. 1, an endoscope system 2 including an endoscope 10 according to an embodiment includes an endoscope 10, a processor 17, a light source device 18, and a monitor 19.

[0012] In the following description, the drawings based on each embodiment are schematic diagrams. The relationship between the thickness and width of each part, the ratio of the thickness of each part, and the relative angles are different from the actual ones. There are also parts with different relationships and ratios of dimensions to each other among the drawings. The illustration and labeling of some components are omitted.

[0013] The endoscope 10 is a perspective endoscope in which an insertion portion 11 is inserted into the body of a subject to capture an in-vivo image and output an imaging signal. At the proximal end of the insertion portion 11 of the endoscope 10, an operation portion 12 provided with various buttons for operating the endoscope 10 is disposed. The insertion portion 11 is composed of a distal end portion 11A where an imaging module 30 is disposed, a bendable bending portion 11B connected to the proximal end of the distal end portion 11A, and a flexible portion 11C connected to the proximal end of the bending portion 11B. The bending portion 11B bends by the operation of the operation portion 12.

[0014] A universal cord 13 extending from the operation portion 12 is connected to the processor 17 and the light source device 18 by a connector 14. As will be described later, a treatment instrument is inserted from a treatment instrument insertion port 12A of the operation portion 12.

[0015] The processor 17 controls the entire endoscope system 2 and performs signal processing on the imaging signal output by the imaging module 30 and outputs it as an image signal. The monitor 19 displays the image signal output by the processor 17.

[0016] The light source device 18 has, for example, white LEDs. The illumination light emitted by the light source device 18 is guided to the distal end portion 11A by a light guide 40 (see FIG. 3) that passes through the universal cord 13 and the insertion portion 11, and illuminates the subject via an illumination lens 41 (see FIG. 3).

[0017] Although the endoscope 10 is a flexible endoscope for medical use, endoscopes in other embodiments may be rigid endoscopes or industrial endoscopes.

[0018] <Tip configuration> 2 and 3, the distal end frame 20, which is the main component of the distal end portion 11A of the endoscope 10, is a hard component made of a metal such as stainless steel. A bending portion 11B is connected to the proximal end side of the distal end frame 20 disposed at the distal end of the insertion portion 11.

[0019] A raising table accommodating space S20 is formed in the distal end frame 20 to accommodate the raising table 60. Although not shown, the raising table 60 is inserted from the treatment tool insertion port 12A and is used to control the protrusion direction of the treatment tool that protrudes from the opening of the distal end portion 11A via the channel tube.

[0020] An illumination lens 41, an imaging module 30, and a cleaning nozzle 50 are arranged in this order on the tip frame 20 along the longitudinal axis direction LA of the tip portion 11A. The illumination lens 41 emits illumination light toward the subject. The cleaning nozzle 50 sprays fluid toward the illumination lens 41 and the imaging module 30 to remove deposits.

[0021] 3, the tip frame 20 has a through-hole H60 to which the channel tube is connected, a through-hole H30 to which the imaging module 30 is inserted, a through-hole H40 to which the illumination lens 41 is disposed, and a through-hole H50 to which the cleaning nozzle 50 is connected. For example, the through-hole H30 has openings on the outer surface and the inner surface of the tip frame 20. Although not shown, the tip frame 20 has a large opening on the side, and after multiple components are disposed inside, the opening is closed by a side cover.

[0022] Imaging module 30 includes three-dimensional wiring board 31 and camera unit 32. As will be described in detail later, imaging module 30 is fixed to tip frame 20 using adhesive 70.

[0023] As shown in FIG. 4, the three-dimensional wiring board 31 has a complex three-dimensional structure. The three-dimensional wiring board 31 is a MID (Molded Interconnect Device) in which a conductor pattern (not shown) is disposed on the surface of an injection-molded three-dimensional molded product. By using the three-dimensional wiring board 31, unlike a planar wiring board, the shape has a function, and furthermore, conductor patterns can be formed on inclined surfaces, vertical surfaces, curved surfaces, through holes, and the like.

[0024] The upper surface 31SA of the three-dimensional wiring board 31 includes a first surface 31S1, a second surface 31S2 on the tip side of the first surface 31S1, a third surface 31S3 on the base end side of the first surface 31S1, and a sixth surface 31S6 between the first surface 31S1 and the third surface 31S3. Further, the three-dimensional wiring board 31 is surrounded by a frame-shaped wall 31F and has a recess H31 having the first surface 31S1 as the bottom surface. Although not shown, a plurality of wirings are disposed on the lower surface 31SB of the three-dimensional wiring board 31. The elongated three-dimensional wiring board 31 is fixed to the tip frame 20 so that the major axis direction is the same as the major axis direction LA of the tip portion 11A.

[0025] The second surface 31S2 and the third surface 31S3 are located on the same plane and are parallel to each other with the first surface 31S1 interposed therebetween. On the other hand, the first surface 31S1 is inclined at a first angle θ1 with respect to the second surface 31S2 and the third surface 31S3.

[0026] As shown in the exploded view of FIG. 5, a camera unit 32 is inserted into the recess H31 of the three-dimensional wiring board 31 of the imaging module 30. That is, the camera unit 32 is mounted on the first surface 31S1 of the three-dimensional wiring board 31. The optical axis O32 of the camera unit 32 is perpendicular to the first surface 31S1. For this reason, a second angle θ2 formed by the optical axis O32 of the camera unit 32 and a line orthogonal to the major axis direction LA is the same as the first angle θ1 which is the inclination angle of the first surface 31S1. The second angle θ2 is the angle of the optical axis O32 of the camera unit 32 in the direction orthogonal to the major axis direction LA.

[0027] The second angle θ2 is, for example, from -30 degrees to 30 degrees. In order for the camera unit 32 to be able to observe a predetermined direction, the second angle θ2 needs to control the manufacturing error within, for example, ±7 degrees.

[0028] In the conventional endoscope in which the lens holder of the lens unit described in the background art is inserted into and fixed to the through hole of the tip frame, there is a gap between the outer surface of the lens holder and the inner surface of the through hole. For this reason, the optical axis of the lens unit may tilt from the central axis of the through hole, and there is a possibility that the field of view in a predetermined direction cannot be observed.

[0029] As already described, in the endoscope 10 (imaging module 30), the second surface 31S2 and the third surface 31S3 of the three-dimensional wiring board 31 are located on the same plane and are parallel to each other. The first angle θ1 formed by the second surface 31S2 and the third surface 31S3 and the first surface 31S1 is determined at the time of designing the three-dimensional wiring board 31.

[0030] On the other hand, the fourth surface 20S4 and the fifth surface 20S5 of the inner surface 20SB of the tip frame 20 are parallel to the long axis direction LA of the tip portion 11A and are located on the same plane. The three-dimensional wiring board 31 is fixed to the inner surface 20SB of the tip frame 20 using an adhesive 70 in a state where the second surface 31S2 and the third surface 31S3 are in contact with the fourth surface 20S4 and the fifth surface 20S5 of the tip frame 20. At this time, the wall 31F constituting the recess H31 of the three-dimensional wiring board 31 is inserted into the through hole H30 of the tip frame 20.

[0031] The second surface 31S2 and the third surface 31S3 of the three-dimensional wiring board 31 are in contact with the fourth surface 20S4 and the fifth surface 20S5 of the tip frame 20. Since the fourth surface 20S4 and the fifth surface 20S5 are parallel to the long axis direction LA, the second surface 31S2 and the third surface 31S3 of the three-dimensional wiring board 31 are also automatically parallel to the long axis direction LA. For this reason, the first surface 31S1 inclined at the first angle θ1 with respect to the second surface 31S2 of the three-dimensional wiring board 31 is inclined at the first angle θ1 with respect to the long axis direction LA. The optical axis O32 of the camera unit 32 is inclined at the same second angle θ2 as the first angle θ1 with respect to the long axis direction LA.

[0032] The imaging module 30 has its angle with respect to the distal end frame 20 defined by two surfaces (the second surface 31S2 on the distal end side and the third surface 31S3 on the rear end side) that are arranged with the first surface 31S1 on which the camera unit 32 is mounted therebetween. For this reason, the endoscope 10 has a higher accuracy in the angle of the optical axis O32 of the camera unit 32 with respect to the distal end frame 20, that is, the angle with respect to the major axis direction LA of the optical axis O32, than an endoscope in which the angle between the imaging module and the distal end frame is defined by one surface.

[0033] As described above, the imaging module 30 of the embodiment includes a camera unit 32 and a three-dimensional wiring board 31. The three-dimensional wiring board 31 has a first surface 31S1 on which the camera unit 32 is mounted, and a second surface 31S# and a third surface 31S3 that have a first angle θ1 with the first surface 31S1. The second surface 31S2 is located on one end side of the major axis direction LA of the three-dimensional wiring board 31, and the third surface 31S3 is located on the side opposite to the second surface 31S2 with the camera unit 32 interposed therebetween. The second surface 31S2 and the third surface 31S3 are arranged so as to be in contact with respective ones of the two surfaces of the distal end frame 20 of the endoscope 10.

[0034] The adhesive 70 is disposed in a gap G (see FIG. 9) between the sixth surface 31S6 of the three-dimensional wiring board 31 and the distal end frame 20. No adhesive 70 is disposed between the second surface 31S2 and the third surface 31S3 and the inner surfaces 20SB (the fourth surface 20S4 and the fifth surface 20S5) of the distal end frame 20. A gap G may be provided at another position between the three-dimensional wiring board 31 and the distal end frame 20, and the adhesive 70 may be disposed therein.

[0035] Since no adhesive is disposed on the contact surface for positioning (angle determination), there is no possibility that the angle of the imaging module 30 with respect to the distal end frame 20 varies due to variations in the thickness of the adhesive. For this reason, the endoscope 10 has particularly small errors during manufacturing. For example, the accuracy of the inclination angle of the optical axis O32 of the camera unit 32 with respect to the major axis direction LA is 3 degrees or less.

[0036] <Method for manufacturing an endoscope> The manufacturing method of the endoscope 10, particularly the manufacturing method of the distal end portion 11A, will be described along the flowchart of FIG. 6.

[0037] <Step S10> Fabrication of the camera unit and the three-dimensional wiring board As shown in FIG. 7, the camera unit 32 includes an imaging element 32A and an imaging optical system 32B. The imaging element 32A is a CCD, CMOS, etc. that converts the subject image collected by the imaging optical system 32B into an electrical signal. The imaging element 32A may include a cover glass. The imaging optical system 32B is composed of a plurality of optical elements (lenses, filters, etc.). The imaging optical system 32B is fabricated by cutting a stacked wafer in which a plurality of optical wafers each including a plurality of optical elements are stacked.

[0038] On the back surface of the imaging element 32A, a ball grid array composed of a plurality of bonding members 32C is disposed. The bonding member 32C is a solder ball, a gold bump, etc.

[0039] As shown in FIG. 8, a plurality of pads 31T1 are disposed on the first surface 31S1 which is the bottom surface of the recess H31 of the three-dimensional wiring board 31. The three-dimensional wiring board 31 has a through-wiring 31T2 that reaches the lower surface 31SB on the opposite side of the first surface 31S1 under the pad 31T1. The pad 31T1 and the through-wiring 31T2 are disposed by plating, screen printing, sputtering, metal evaporation, etc. Although not shown, a wiring extending from the through-wiring 31T2 is disposed on the lower surface 31SB, an electronic component such as a chip capacitor is mounted on the wiring, and a cable is joined to the end portion.

[0040] The first length L1 in the major axis direction LA between the first surface 31S1 and the second surface 31S2 is smaller than the second length L2 in the major axis direction LA between the first surface 31S1 and the third surface 31S3. By shortening the length from the camera unit 32 to the tip of the tip frame 20, the endoscope 10 becomes smaller and less invasive.

[0041] Also, in the direction orthogonal to the major axis direction LA, the positions of the second surface 31S2 and the third surface 31S3 are within the range of the depth H32 of the recess H31 (the length in the optical axis direction of the camera unit 32). Therefore, the endoscope 10 has a short length (outer diameter) in the direction orthogonal to the major axis direction LA of the distal end portion 11A and is minimally invasive.

[0042] <Step S20> Fabrication of the imaging module The camera unit 32 is inserted into the recess H31 of the three-dimensional wiring board 31, and the joining member 32C of the camera unit 32 and the pad 31T1 on the first surface 31S1 of the three-dimensional wiring board 31 are joined. The gap between the camera unit 32 housed in the recess H31 and the wall surface of the recess H31 is filled with a sealing resin 32D. Electronic components such as chip capacitors are mounted on the wiring on the lower surface 31SB of the three-dimensional wiring board 31, and a cable is joined to the end of the wiring.

[0043] <Step S30> Contact the imaging module against the distal end frame As shown in FIG. 9, the three-dimensional wiring board 31 is temporarily fixed in a state of being in contact with the inner surface of the distal end frame 20. That is, the second surface 31S of the three-dimensional wiring board 31 contacts the fourth surface 20S4 of the distal end frame 20, and the third surface 31S3 of the three-dimensional wiring board 31 is brought into contact with the fifth surface 20S5 of the distal end frame 20. A gap G is formed between the sixth surface 31S6 of the three-dimensional wiring board 31 and the distal end frame 20. The gap G may be provided at a position different from the above as long as it is between the three-dimensional wiring board 31 and the distal end frame 20.

[0044] <Step S40> Injection of the adhesive As shown in FIG. 10, an adhesive 70 is injected into the gap G between the sixth surface 31S6 of the three-dimensional wiring board 31 and the distal end frame 20. The adhesive 70 is, for example, an epoxy resin of an ultraviolet curable type, a heat curable type, or an ultraviolet heat combined curable type. The adhesive 70 is also disposed in the gap between the through hole H30 and the imaging module 30.

[0045] Between the second surface 31S2 and the fourth surface 20S4, and between the third surface 31S3 and the fifth surface 20S5, the adhesive 70 is not disposed. However, it goes without saying that there may be an inevitable gap due to manufacturing errors or the like between the two contacting surfaces, or there may be a scratch on the surface of the surface, and a small amount of the adhesive 70 may exist between the two surfaces.

[0046] <Step S50> Adhesive curing The curing process of the adhesive 70 is performed, and the imaging module 30 is fixed to the tip frame 20.

[0047] <Step S60> Illumination lens arrangement The illumination lens 41, the light guide 40, etc. are fixed to the tip frame 20. Before the imaging module 30 is fixed to the tip frame 20, the illumination lens 41 etc. may be fixed to the tip frame 20.

[0048] <Step S70> Side cover fixing For example, a side opening (not shown) of the tip frame 20 is closed by fixing a side cover. Before the imaging module 30 is fixed to the tip frame 20, the side opening may be closed by fixing a side cover.

[0049] According to the manufacturing method of the endoscope of the present embodiment, an endoscope that can accurately observe a predetermined direction can be easily manufactured. For example, an endoscope with an accuracy of an inclination angle of the optical axis O32 of the camera unit 32 with respect to the long axis direction LA of ±3 degrees or less can be easily manufactured.

[0050] <Modification> The endoscopes 10A - 10C (imaging modules 30A - 30C) of the modification are similar to the endoscope 10 and have the same effects as the endoscope 10. Therefore, in the following description, components having the same functions as those of the endoscope 10 are denoted by the same reference numerals as those of the endoscope 10, and the description is omitted.

[0051] <Modification 1> In the endoscope 10A of this modified example shown in FIG. 11, in the three-dimensional wiring board 31A of the imaging module 30A, the second surface 31S2 and the third surface 31S3 are parallel, but are not located on the same plane. That is, the third surface 31S3 is located above the second surface 31S2 in the figure. Also, the fourth surface 20S4 and the fifth surface 20S5 of the tip frame 20A are parallel, but are not located on the same plane.

[0052] However, by the second surface 31S2 abutting against the fourth surface 20S4 and the third surface 31S3 abutting against the fifth surface 20S5, the first surface 31S1 is inclined at a predetermined angle with respect to the long axis direction LA. For this reason, the optical axis O32 of the camera unit 32 is inclined at a predetermined angle with respect to the long axis direction LA.

[0053] <Modified Example 2> In the endoscope 10B of this modified example shown in FIG. 12, in the three-dimensional wiring board 31B of the imaging module 30B, the second surface 31S2 and the third surface 31S3 are not parallel to each other, and are not parallel to the long axis direction LA either. Also, the fourth surface 20S4 and the fifth surface 20S5 of the tip frame 20B are not parallel to each other, and are not parallel to the long axis direction LA either.

[0054] However, the second surface 31S2 of the three-dimensional wiring board 31B is parallel to the fourth surface 20S4 of the tip frame 20B, and the third surface 31S3 is parallel to the fifth surface *20S5. By the second surface 31S2 abutting against the fourth surface 20S4 and the third surface 31S3 abutting against the fifth surface 20S5, the first surface 31S1 is inclined at a predetermined angle with respect to the long axis direction LA. For this reason, the optical axis O32 of the camera unit 32 is inclined at a predetermined angle with respect to the long axis direction LA.

[0055] <{ <Modified Example 3> In the endoscope 10C of this modified example shown in FIG. 13, the three-dimensional wiring board 31C of the imaging module 30C does not have a recess surrounded by walls like the three-dimensional wiring board 31. The inner diameter of the through hole H20 of the tip frame 20C is slightly larger than the outer diameter of the camera unit 32.

[0056] Since the endoscope 10C has no wall forming a recess, the length of the distal end portion can be shortened. Also, like the endoscope 10, the endoscope 10C can accurately observe a predetermined direction.

[0057] Note that the numerical ranges described above are not limited to the ranges described above and can be increased or decreased as appropriate. Also, the insertion portion 11 of the endoscope 10 may be a rigid endoscope. The present invention is not limited to the above-described embodiments and the like, and various changes and modifications can be made without departing from the gist of the present invention.

Explanation of Reference Numerals

[0058] 2 ··· Endoscope system 10, 10A - 10C ··· Endoscopes 11 ··· Insertion portion 11A ··· Distal end portion 11B ··· Curved portion 11C ··· Flexible portion 12 ··· Operation portion 12A ··· Treatment instrument insertion port 13 ··· Universal cord 14 ··· Connector 17 ··· Processor 18 ··· Light source device 19 ··· Monitor 20 ··· Distal end frame 30 ··· Imaging module 31 ··· Three-dimensional wiring board 32 ··· Camera unit 40 ··· Light guide 41 ··· Illumination lens 50 ··· Cleaning nozzle 60 ··· Lifting table 70 ··· Adhesive

Claims

1. An endoscope having a tip frame at the tip of an insertion portion, wherein an imaging module is fixed to the tip frame, the imaging module includes a camera unit and a three-dimensional wiring board, the three-dimensional wiring board has a first surface, a second surface on the tip side of the first surface, and a third surface on the proximal side of the first surface, and the camera unit is mounted on the first surface inclined at a first angle with respect to the major axis direction of the tip portion. The tip frame has a fourth surface in contact with the second surface and a fifth surface in contact with the third surface. The endoscope is characterized by this.

2. The endoscope according to claim 1, wherein the second surface, the third surface, the fourth surface, and the fifth surface are parallel to the major axis direction.

3. The endoscope according to claim 1, wherein the three-dimensional wiring board is a MID.

4. The three-dimensional wiring board has a recess surrounded by a wall and having the first surface as a bottom surface, the camera unit is housed in the recess, The endoscope according to claim 3, wherein the wall constituting the recess is inserted into a through hole of the tip frame.

5. The endoscope according to claim 1, wherein a first length between the first surface and the second surface is smaller than a second length between the first surface and the third surface.

6. The endoscope according to claim 1, wherein the first angle is equal to a second angle formed by the optical axis of the camera unit and a line perpendicular to the major axis direction.

7. The endoscope according to claim 1, wherein the second surface and the third surface are located on one plane.

8. The endoscope according to claim 7, wherein the fourth surface and the fifth surface are located on the one plane.

9. The endoscope according to claim 7, wherein in a direction perpendicular to the major axis direction, positions of the second surface and the third surface are within a range of a length in the optical axis direction of the camera unit.

10. The three-dimensional wiring board has a sixth surface between the first surface and the third surface, The endoscope according to claim 1, wherein an adhesive is disposed in a gap between the sixth surface and the tip frame.

11. The endoscope according to claim 10, wherein the adhesive is not disposed between the second surface and the third surface and the tip frame.

12. Comprising a camera unit and a three-dimensional wiring board, The three-dimensional wiring board has a first surface on which the camera unit is mounted, a second surface and a third surface having a first angle with the first surface, the second surface is located on one end side in the long axis direction of the three-dimensional wiring board, the third surface is located on the opposite side of the second surface with the first surface interposed therebetween, and the second surface and the third surface are arranged so as to be in contact with respective ones of two surfaces of the tip frame of the endoscope. The imaging module is characterized by this.

13. It has a first surface, a second surface on the tip side of the first surface, and a third surface on the base end side of the first surface, and the second surface and the third surface arranged with the first surface therebetween are formed with a three-dimensional wiring board having a first angle with the first surface. A camera unit is mounted on the first surface of the three-dimensional wiring board to fabricate an imaging module. A tip frame is fabricated, and the tip frame has a fourth surface and a fifth surface. The second surface of the three-dimensional wiring board is brought into contact with the fourth surface of the tip frame, and the third surface of the three-dimensional wiring board is brought into contact with the fifth surface of the tip frame. An adhesive is injected into the gap between the three-dimensional wiring board and the tip frame. The adhesive is cured. The imaging module is fixed to the tip of the insertion portion of the endoscope. A method for manufacturing an endoscope is characterized by this.

14. The three-dimensional wiring board has a recess surrounded by a wall having the first surface as a bottom surface. The method for manufacturing an endoscope according to claim 13, wherein the camera unit including an imaging optical system and an imaging element is accommodated in the recess.

Images