Organic device, display device, and electronic device

Abstract

To provide an organic device with a reduced leakage current between pixels.SOLUTION: There is provided an organic device including a first element and a second element disposed adjacent to the first element. The first and second elements include a first electrode, a second electrode, an organic layer disposed between the first and second electrodes, and an insulation layer covering the first electrode. The insulation layer has an eaves shape including a protruding portion protruding from the insulation layer of the first element toward the second element. The organic layer includes a charge transport layer and a functional layer. The following factors satisfy a specific relationship: t representing a total film thickness of the organic layer in the eaves shape, t' representing a film thickness of the charge transport layer in the eaves shape, x1 representing a protruding amount of the eaves shape, x2 representing a distance between the eaves shapes of the first and second elements, and y representing a distance from a lower surface of the first electrode to the protruding portion of the eaves shape.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to an organic device with reduced inter-pixel leakage, and a display device and electronic equipment having the same. [Background technology]

[0002] In recent years, various organic devices using functional organic compounds have been developed. An organic light-emitting device is an example of an organic device having multiple light-emitting devices. An organic EL element, which is an example of a light-emitting element, is an element having an upper electrode, a lower electrode, and an organic layer disposed between them. Because organic EL elements are lightweight and thin and have few shape restrictions, light-emitting devices and display devices equipped with organic EL elements have attracted attention. It is known that display devices increase the number of pixels and achieve higher resolution in order to improve image quality.

[0003] However, as resolution increases, the distance between organic EL elements decreases, causing unintended light emission due to current flowing between adjacent organic EL elements. This unintended current is also called inter-pixel leakage. Unintended light emission due to inter-pixel leakage reduces the image quality of the display device. This impact is particularly significant when the organic layer is arranged in series with multiple organic EL elements. For this reason, there has been active research into structures for reducing inter-pixel leakage in organic EL elements.

[0004] Patent Document 1 describes a light-emitting device that has a lower electrode and a partition edge portion that covers the edge of the lower electrode, and the partition edge portion has an overhanging shape, and the overhanging shape of the partition edge portion cuts or increases the resistance of the organic layer, thereby reducing current leakage between pixels. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2014-232631 Summary of the Invention [Problem to be solved by the invention]

[0006] Patent Document 1 attempts to cut or increase the resistance of the organic layer by using a visor at the edge of the partition wall, but depending on the thickness of the organic layer and the height of the partition wall, this effect may not be achieved, and the display quality may be reduced.

[0007] The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide an organic device in which inter-pixel leakage is reduced. [Means for solving the problem]

[0008] One aspect of the present invention is an organic device including a first element and a second element disposed adjacent to the first element in a first direction, wherein the first element and the second element include a first electrode, a second electrode, an organic layer disposed between the first electrode and the second electrode, and a first electrode disposed at an end of the first electrode. Electrode an insulating layer covering an upper surface and a side surface, wherein the first electrode, the organic layer, and the second electrode are arranged in this order in a second direction perpendicular to the first direction, and the insulating layer has an eave shape with a protruding portion that protrudes from the insulating layer of the first element to the second element between the first element and the second element; the organic layer has a charge transport layer and a functional layer, and the organic layer including the charge transport layer and the functional layer in the overhanging shape 1 The total thickness of the charge transport layer in the direction of the eaves is t, 1 The thickness of the film in the direction of the eaves shape is t'. 1 The protrusion amount in the direction of the first element is x1, the distance between the eaves shape of the first element and the eaves shape of the second element is x2, and the distance from the lower surface of the first electrode to the protruding portion of the eaves shape is x3. 2 When the distance in the direction is y, the organic device satisfies the following formula (1):

[0009]

number

[0010] According to the present invention, it is possible to provide an organic device in which inter-pixel leakage is reduced. [Brief explanation of the drawings]

[0011] [Figure 1] (a) A cross-sectional view schematically showing the configuration of an organic device according to a first embodiment of the present invention. (b) A schematic diagram of the overhang shape of a partition between light-emitting elements. (c) A diagram showing parameters for expressing the overhang shape. (d) A light-emitting device according to one embodiment of the present invention shows the relationship between the overhang shape shown in FIG. 1(c), the thickness t' of the organic film 4 including the charge transport layer, and the total thickness t of the charge transport layer and the light-emitting layer, in order to reduce inter-pixel leakage. [Figure 2] (a) An example of a point source deposition apparatus. (b) An example of a line source deposition apparatus. [Figure 3] 3(a) is a diagram showing the relationship between the crucible and the shape of the eaves, and (b) is an enlarged view of O in FIG. 3(a). [Figure 4] (a) A diagram showing the state after the formation of the overhang. (b) A diagram showing the state where the charge transport region 4 is deposited on the overhang shape. (c) A diagram showing the state where the region 5 including the light-emitting layer is deposited after the deposition of the charge transport region 4. (d) A diagram showing the state where the upper electrode 6 is deposited after the deposition of the region 5 including the light-emitting layer. [Figure 5] (a) This is the case where the film thickness t' of the charge transport region 4 deposited on the overhang side surface 11b is not uniform. (b) This is an enlarged view of a portion of (a). (c) This is the case where the total film thickness t of the charge transport region 4 and the region 5 including the light-emitting layer deposited on the overhang side surface 11b is not uniform. (d) This is an enlarged view of a portion of (c). [Figure 6] 1A to 1I are schematic flow charts showing an example of a method for manufacturing an organic device according to an embodiment of the present invention. [Figure 7] FIG. 2 is an electron microscope view of the eaves shape of an organic device according to one embodiment of the present invention. [Figure 8] (a) An example of an organic device with a rectangular bottom electrode. (b) An example of an organic device with a hexagonal bottom electrode. (c) An example of an organic device with a rectangular bottom electrode and a stripe arrangement. [Figure 9] (a) An example of multiple organic devices arranged on a square substrate. (b) An example of one organic device arranged on a square substrate. (c) An example of multiple organic devices arranged on a circular substrate. [Figure 10] FIG. 1 is a cross-sectional schematic view of a conventional crucible. [Figure 11] (a) An example of a crucible with a circular top view. (b) An example of a crucible with a rectangular top view. [Figure 12] (a) to (c) Variations of the crucible that reduce splash. [Figure 13] 1(a) to 1(c) are a cross-sectional view and a top view showing a more preferred crucible for producing an organic device according to the present invention. [Figure 14] 1 is a schematic diagram illustrating an example of a display device according to an embodiment of the present invention. [Figure 15] 1A is a schematic diagram illustrating an example of an imaging device according to an embodiment of the present invention, and FIG. 1B is a schematic diagram illustrating an example of an electronic device according to an embodiment of the present invention. [Figure 16] 1A is a schematic diagram illustrating an example of a display device according to an embodiment of the present invention, and FIG. 1B is a schematic diagram illustrating an example of a foldable display device. [Figure 17] 1A and 1B are schematic diagrams illustrating an example of a wearable device according to an embodiment of the present invention, each of which has an imaging device; DETAILED DESCRIPTION OF THE INVENTION

[0012] Hereinafter, specific embodiments of the light emitting device according to the present invention will be described with reference to the accompanying drawings. In the following description and drawings, common reference numerals are used to designate components common to multiple drawings. Therefore, the common components will be described with mutual reference to multiple drawings, and descriptions of the components with common reference numerals will be omitted as appropriate.

[0013] In this specification, "upper" and "lower" refer to "upper" and "lower" on the paper, and the higher something is located on the paper, the higher it is expressed. Also, "height" refers to the distance upward from the top surface of the substrate. "Height" may be specified based on a flat portion parallel to the top surface of the substrate.

[0014] FIG. 1 is a cross-sectional view of a light-emitting device 100 according to a first embodiment of the present invention. FIG. 1(a) is a cross-sectional view taken along a plane perpendicular to the main surface of a substrate. The light-emitting device 100 includes a light-emitting element 10. The light-emitting element includes 10R, 10G, and 10B according to the light-emitting color. In other configurations, the blue light-emitting element may include the letter B in the reference symbol. When the light-emitting color of a configuration is not specified, RGB is not added. For example, the term "light-emitting element 10B" refers to a blue light-emitting element, and the term "light-emitting element 10" refers to any of the RGB light-emitting elements.

[0015] The light-emitting element 10 includes an interlayer insulating layer 1, a lower electrode 2 on the interlayer insulating layer 1, a partition 3, an organic layer 4 including a charge transport layer, an organic layer 5 including a functional layer, an upper electrode 6, a protective layer 7, a resin layer 8, a color filter 9, and a partition eaves shape 11. The light-emitting device is described as a top-emission type light-emitting device as an example, but is not limited to this. When the functional layer is a light-emitting layer, the organic device is an organic light-emitting device, and when the functional layer is an organic photoelectric conversion layer, the organic device is an organic photoelectric conversion device.

[0016] 1(b) is a schematic diagram of the overhanging portion of the partition wall between light-emitting elements. Reference numeral 11a denotes the upper portion of the overhanging portion, and 11b denotes the side portion of the overhanging portion, which are composed of the partition wall 3. Reference numeral 11c denotes the bottom portion of the overhanging portion, which is composed of the interlayer film 1. The partition wall 3 has a partition wall portion 3a and an upper partition wall portion 3b. The partition wall portion 3a and the upper partition wall portion 3b may be composed of different materials.

[0017] Figure 1(c) shows the parameters used to describe the eaves shape. The amount of protrusion of the eaves top 11a from the eaves wall surface 11b is defined as x1, and the horizontal distance between the tips of the eaves top 11a is defined as x2. In Figures 1(b) and 1(c), eaves are shaped on both sides, but if they are only present on one side, x2 is defined as the distance from the eaves top 11a to the horizontal wall surface. Also, the vertical height of the eaves top 11a from the eaves bottom 11c is defined as y.

[0018] FIG. 1(d) shows the relationship between the shape of the overhang shown in FIG. 1(c), the thickness t' of the organic film 4 including the charge transport layer, and the total thickness t of the charge transport layer and the light-emitting layer in a light-emitting device according to one embodiment of the present invention, in order to reduce inter-pixel leakage. That is, FIG. 1(d) shows the deposition state of the organic film in the overhang portion. The organic layer 4 including the charge transport layer is formed on the interlayer insulating film 1, the lower electrode 2, and the partition wall 3, but is formed in a discontinuous or reduced thickness in the overhang portion. The presence of this portion reduces crosstalk between light-emitting elements.

[0019] In the light-emitting device of this embodiment, the protrusion length x1 of the overhang is smaller than t and larger than t', where t' is the thickness of the organic film 4 including the charge transport layer and t is the total thickness of the organic layer 5 including the charge transport region and the functional layer. The distance x2 between the tips of the overhangs is smaller than twice t and larger than twice t'. The height y of the overhangs is larger than t'. In other words, all three equations included in the following equation (1) are satisfied. y can also be said to be the distance in the second direction from the overhang shape to the underside of the first electrode.

[0020]

number

[0021] By satisfying this formula, a light emitting device is obtained in which inter-pixel leakage is reduced.

[0022] When a film of the desired thickness is formed on this overhang, the charge transport region 4 is formed discontinuously, but the upper surface of the organic film 5 including the light-emitting layer has continuity above the overhang, so the upper electrode 6 above it is also formed continuously.

[0023] Furthermore, variations may occur in the process of forming the overhangs and in the process of forming the organic film 5 including the charge transport region 4 and the light-emitting layer. In such cases, the overhang portion 11 may be designed so that equation (1) holds for the maximum value of the film thickness t' of the charge transport region 4, the minimum value of the total film thickness t of the organic layer 5 including the charge transport region and the light-emitting layer, and the minimum value of the overhang height y in the same cross section. In other words, an organic device may satisfy equation (1) when t is the minimum film thickness and t' is the maximum film thickness in the same cross section.

[0024] The organic layer has a discontinuous portion in at least the shape of an overhang, but the second electrode is continuous between the first element and the second element.

[0025] If the width of the opening region 21 satisfies the condition of the distance x2 between the tips of the overhangs, the overhangs may be formed in the opening region 21, but may be larger than the total t of the charge transport region 4 and the organic film 5 including the light-emitting layer. Furthermore, the area required for the opening region 21 is often specified to obtain desired characteristics in the light-emitting device. Therefore, the overhangs may be located in a location other than the opening region 21.

[0026] In a light emitting device according to one embodiment of the present invention, at least one of the side portion 11b of the canopy, which is part of the partition wall 3, and the bottom portion 11c of the canopy, which is composed of the upper portion 11a of the canopy and the interlayer film 1, may be made of an insulating film of a different type. As an example, the upper portion 11a of the canopy may be made of an organic material, the side portion 11b of the canopy may be made of an inorganic material, and the bottom portion 11c of the canopy may be made of an inorganic material. In this case, the side portion 11b of the canopy and the bottom portion 11c of the canopy may be made of the same inorganic material or different inorganic materials.

[0027] When it is desired to increase the total thickness t of the organic film 5 including the charge transport region 4 and the light-emitting layer, it is preferable to use different types of insulating films for the upper portion 11a of the overhang, which is part of the partition wall 3, and the bottom portion 11c of the overhang, which is made of the interlayer film 1, in order to increase the height y of the overhang. In this case, the upper portion 11a, side portions 11b, and bottom portion 11c that make up the overhang are all different types of insulating films. Selecting a different type of material for at least one of them is preferable because it makes it easier to shape the overhang.

[0028] That is, an organic device according to one embodiment of the present invention is a method for manufacturing an organic device including a first element and a second light-emitting element arranged adjacent to the first element in a first direction, wherein the steps of manufacturing the first element and the second element include a step of preparing a first electrode, a step of providing an insulating layer covering an end of the first electrode, a step of providing an organic layer on the first electrode and the insulating layer, and a step of providing a second electrode on the organic layer, and the insulating layer includes a step of providing a first insulating layer on the first electrode, a step of providing a second insulating layer on the first insulating layer, and an etching step of etching the first insulating layer and the second insulating layer, and the organic device can be manufactured by a method for manufacturing an organic device in which the etching rate of the first insulating layer and the etching rate of the second insulating layer are different in the etching step.

[0029] In the manufacturing method according to this embodiment, the etching rate of the first insulating layer may be higher than that of the second insulating layer. The etching rates may be compared at 25°C. As long as the etching rate conditions are met, either a wet process or a dry process may be used.

[0030] The etching step can form an eave-like shape in the insulating layer between the first element and the second element, with a protruding portion protruding from the insulating layer of the first element toward the second element. To achieve this, the etching step may include a first etching step and a second etching step. In the second etching step, the etching rate of the first insulating layer may be smaller than the etching rate of the second insulating layer.

[0031] Fig. 2 is a schematic diagram of a vapor deposition apparatus. Fig. 2(a) shows a point source apparatus, and Fig. 2(b) shows a line source apparatus. In this embodiment, an example of (a) point source will be described, but the configuration of the vapor deposition apparatus is not limited as long as the shape of the eaves is the same as the shape of the present invention and the effect of reducing crosstalk between light-emitting elements can be obtained.

[0032] The deposition apparatus in Figure 2(a) is equipped with a vacuum chamber 102. A plurality of crucibles 104 are placed inside the vacuum chamber 102, and heaters 105 corresponding to each crucible are heated to raise the temperature of the crucible and sublimate the material placed in the crucible. The sublimated material is diffused into the vacuum chamber from a nozzle 106 and deposited on a substrate 101. When a metal mask 103 is used, the material is deposited around the openings in the metal mask.

[0033] When multiple light-emitting devices exist on a substrate, it is necessary to selectively deposit only in the areas where the light-emitting devices exist. In this case, it is advisable to use a metal mask 103 that has openings only in the areas corresponding to the light-emitting devices on the substrate. The substrate may be configured to rotate around O. Rotation can improve the uniformity of deposition of the deposition material.

[0034] Figure 2(b) shows a configuration called a line source, in which multiple evaporation sources are provided and arranged along a line. This line source may move relatively to the substrate. Relative movement may refer to a configuration in which the substrate moves, or a configuration in which the line source moves. In this figure, a configuration in which the line source moves in the direction of the arrow is shown.

[0035] Figure 3(a) shows the relationship between the crucible and the eaves. In the case of a point source, the crucible is placed at a fixed point. For example, if the crucible is placed at a position X horizontally and Y vertically away from point O, which is the center of the substrate, the deposition particles that are mainly diffused at an angle of arctan(Y / X) from the nozzle will deposit on the substrate. In the case of a line source, the nozzle also moves relative to the substrate, but the deposition particles diffused from the nozzle diffuse with a certain degree of spread, so deposition particles in an oblique direction will deposit on the substrate.

[0036] If the partition wall 3 does not have a recess like an eaves, the upper part of the partition wall is continuous, and therefore the deposited film is continuous.

[0037] Figure 3(b) is an enlarged view of O in Figure 3(a). The overhanging shape creates areas where the vapor deposition particles are blocked, resulting in discontinuous deposition on the side surfaces of the overhanging. Charge transport is prevented in the discontinuous areas, which can reduce crosstalk between light-emitting elements. To achieve this, it is preferable to satisfy the following conditions 1 to 5.

[0038] [Condition 1] If the thickness of the film deposited on the overhang side is greater than the protrusion amount x1 of the overhang, there is a possibility that the film deposited laterally at the tip of the overhang protrusion portion 11a and the film deposited on the overhang side surface 11b will be continuous. To ensure discontinuity in the charge transport region 4, the protrusion amount x1 of the overhang should be greater than the film thickness t' deposited on the overhang side surface 11b. This is called [Condition 1].

[0039] [Condition 2] If deposition is continued up to the upper electrode 6 using the vapor deposition method while satisfying condition 1, the upper electrode will also become a discontinuous film, which may result in poor light emission. To reduce the risk of discontinuity in the upper electrode, the following conditions must be met.

[0040] If the distance x2 between the tips of the overhangs is designed to be smaller than twice the total film thickness t of the charge transport region 4 and the region 5 including the light-emitting layer deposited on the overhang side portion 11b, the organic film becomes continuous between the tips of the overhangs during deposition of the region 5 including the light-emitting layer.

[0041] Figures 4(a) to (d) show the deposition process at the eaves. (a) shows the state after the eaves have been formed. An example of the eaves formation procedure will be described later. (b) shows the state where the charge transport region 4 is deposited on the eaves. (c) shows the state in which a region 5 including a light-emitting layer is deposited after the charge transport region 4 is deposited. (d) shows the state in which the upper electrode 6 is deposited after the region 5 including the light-emitting layer is deposited.

[0042] In order to form the upper electrode 6 continuously, it is sufficient to fill the distance x2 between the tips of the overhangs between Figures 4(b) and 4(c) and make the top surface of the organic layer before depositing the upper electrode 6 continuous at a position above the overhangs between the light-emitting elements.

[0043] The thickness of the film deposited in the lateral direction on the overhanging portion 11a is equal to the thickness of the film deposited on the overhanging side portion 11b.

[0044] Deposition occurs laterally on both the left and right sides of the protruding eaves. In the case of a point source, the substrate is rotated to ensure that the film deposited on the substrate is uniform. In the case of a line source, the line source itself moves parallel to the substrate, so that the film thickness deposited laterally on the left and right sides of the protruding eaves is approximately uniform.

[0045] As described above, if the distance x2 between the tips of the overhangs is designed to be smaller than twice the total film thickness t of the charge transport region 4 and the region 5 including the light-emitting layer deposited on the overhang side portion 11b, the organic film will be continuous between the tips of the overhangs during deposition of the region 5 including the light-emitting layer [Condition 2].

[0046] [Condition 3] If the distance x2 between the overhang tips is small, there is a concern that the overhang tips will be continuous when the charge transport region 4 is deposited, so x2 is set to be greater than twice the film thickness t' of the charge transport region deposited on the side of the overhang [Condition 3].

[0047] By setting x2 to a smaller value while simultaneously satisfying [Condition 2] and [Condition 3], it is possible to stably form continuity on the upper surface of region 5 including the light-emitting layer after deposition.

[0048] [Condition 4] If the overhang height y is smaller than the film thickness t' of the charge transport region, there is a concern that the charge transport region will become continuous, so the overhang height y is set to be larger than the film thickness t' of the charge transport region [Condition 4].

[0049] [Condition 5] If the gap inside the canopy is large, there is a concern that the film of region 5 including the light-emitting layer deposited at the tip of the canopy may fall into the canopy, so it is better to fill the inside of the canopy to some extent and adopt a shape that supports it from below. One method is to make the protrusion amount x1 of the canopy small relative to the total film thickness t of the charge transport region 4 and region 5 including the light-emitting layer deposited on the canopy side portion 11b [Condition 5].

[0050] Equation (1) summarizes [Condition 1] to [Condition 5].

[0051] Figure 5 shows a modified organic device according to an embodiment of the present invention. Figure 5(a) shows one deposition situation, and Figure 5(b) is an enlarged view of a portion of Figure 5(a). Figure 5(c) shows another deposition situation, and Figure 5(d) is an enlarged view of a portion of Figure 5(c).

[0052] 5(a) shows a case where the thickness t' of the charge transport region 4 deposited on the eaves-shaped side surface 11b is not uniform. FIG. 5(c) shows a case where the total thickness t of the charge transport region 4 and the region 5 including the light-emitting layer deposited on the eaves-shaped side surface 11b is not uniform.

[0053] In these cases, taking into account the conditions of continuity and discontinuity, x1, x2, and y should be determined so that the thickness t' of the charge transport region satisfies equation (1) relative to its maximum value, and the total thickness t of the region 5 including the charge transport region 4 and the light-emitting layer satisfies equation (1) relative to its minimum value.

[0054] An example of a process for producing an organic device according to the present invention will be described below with reference to FIG.

[0055] First, Figure 6(a) shows the process of forming an interlayer film 1 made of an insulating material on a substrate 101. Figure 6(b) shows the process of depositing a metal film that will become the bottom electrode 2 on the interlayer film 1 using, for example, a physical vapor deposition method (PVD method). Figure 6(c) shows the process of forming the bottom electrode 2 by protecting part of the metal film with, for example, a resist and then performing dry or wet etching.

[0056] 6(d) shows a step of depositing a material that will become a partition wall on the formed lower electrode. An insulating film that will become the side surface 11b of the canopy is deposited using an organic material such as a thermosetting or thermoplastic resin.

[0057] In this case, if a coater developer or other device is used, it is possible to deposit the desired film thickness by appropriately determining the rotation speed when applying the material. Alternatively, a film of the desired thickness may be formed and attached to the front surface.

[0058] 6(e) shows a process of depositing an insulating film that will become the upper part 11a of the overhang of the partition 3 by chemical vapor deposition (CVD) and a process of applying a resist to remove the partition other than the opening region. To define the opening region 21, a protective resist is patterned in the region other than the opening region using photolithography.

[0059] In the photolithography method, a resist containing novolac resin and an i-line exposure machine, or a chemically amplified resist and an EUV exposure machine using an ArF or KrF laser, can be used.

[0060] Since the upper electrode 6 needs to be formed continuously above the opening region 21, it is preferable that the partition wall 3 above the lower electrode 2 has a gentle forward taper.

[0061] In the case of EUV exposure, the pattern edges of the protective resist have a sharp shape that is nearly vertical, so after patterning with an i-line exposure machine, it is preferable to form the protective resist using highly anisotropic dry etching so that the side surfaces of the partition walls 3 are not etched.

[0062] FIG. 6(g) shows the pattern formation for forming the overhang portion 11. Photolithography is used to pattern the protective resist in the areas other than where the overhangs are to be formed. At this time, the exposure machine to be used is determined based on the distance x2 between the overhang tips. An i-line exposure machine can be used for thicknesses up to 0.35 μm, but for thicknesses below that, it is preferable to use an EUV exposure machine.

[0063] 6(h) shows a process of sequentially removing, by etching, the portions 3b and 3a that constitute the partition wall 3 at the locations that will become the overhanging portions. At this time, it is preferable to use highly anisotropic conditions, similar to the formation of the lower electrode 2.

[0064] 6(i) shows the process of performing additional etching on the sidewall portion 11b of the overhang to ensure the overhang protrusion amount x1. At this time, the etching can be either dry or wet, but highly isotropic conditions are used because processing is performed in the lateral direction. Furthermore, because the distance x2 between the overhang tips and the overhang height y have been determined in the above-mentioned process, the etching conditions are set so that the etching ratio of the partition 3b and interlayer film 1 is significantly smaller than that of the material constituting the partition 3a.

[0065] 6(h) to 6(i), instead of the two-step method described above, it is also possible to perform the etching in one step using dry etching. In this case, after removing the partition 3b under highly anisotropic conditions, the etching is switched to highly isotropic conditions and continued until the desired protrusion amount x1 is achieved. Because the distance x2 between the overhanging tips is determined when removing the partition 3b, when etching the partition 3b, etching conditions are used that result in a smaller etching ratio for the partition 3b than for the partition 3a.

[0066] When determining the above etching conditions, it is preferable that the insulating material of the partition 3a constituting the overhang side portion 11b is different from the insulating material of the partition 3b constituting the overhang top portion 3a and the interlayer film 1 constituting the overhang bottom portion 11c.

[0067] Furthermore, if it is desired to increase the height y of the overhang, the interlayer film 1 constituting the overhang bottom can be etched at the same time as the etching process for ensuring the protrusion amount x1. In this case, different insulating materials can be selected for the partition wall 3b constituting the overhang top surface portion 3a and the interlayer film 1 constituting the overhang bottom 11c.

[0068] 7 is an electron microscope image of the overhang shape of an organic device according to one embodiment of the present invention. The interlayer film 1 and the partition wall 3b forming the protruding portion of the overhang were made of an inorganic insulating film, while the partition wall 3a forming the side portion of the overhang was made of an organic insulating film. In this case, the overhang amount was 0.24 μm, and the overhang height was 0.8 μm.

[0069] FIG. 8 is a plan view showing an example of the shape of an organic device according to one embodiment of the present invention.

[0070] 8(a) shows an organic device in which the lower electrode is rectangular. The lower electrode is rectangular, the partition 3 is rectangular, and the opening of the partition 3 is also rectangular, resulting in a rectangular light-emitting region 14. This figure is just an example, and any of the above-mentioned components may not be rectangular.

[0071] 8(b) shows an example in which the lower electrode is hexagonal. Although the lower electrode is hexagonal in this example, it may be another polygonal shape. Although the partition wall 3 and the opening 14 in the partition wall are also hexagonal in this example, either one may be a shape other than a hexagon.

[0072] 8(c) shows an example of a rectangular lower electrode. This is a so-called stripe type arrangement. As shown in this figure, the partition wall may not cover part of the lower electrode.

[0073] Figure 9 illustrates the positional and inclusive relationships between a substrate and organic devices. In Figure 9(a), multiple organic devices are arranged on a rectangular substrate. Multiple organic devices are manufactured on one substrate. Each organic device has multiple elements arranged inside it. Although nine organic devices are shown in this figure, the number is not limited to nine.

[0074] 9(b) shows an example in which one organic device is arranged on one rectangular substrate. In this organic device as well, multiple elements are arranged on one organic device.

[0075] 9(c) shows an example in which multiple organic devices are arranged on a circular substrate. In this figure, nine organic devices are arranged, but one organic device or nine or more organic devices may be arranged.

[0076] The crucible used in this example can be a normal crucible. Examples of normal crucibles include the crucibles described in JP 2011-21223 A and JP 2014-65973 A. Of course, the crucible is not limited to these. Furthermore, if bumping of the deposition material is a concern, the following crucibles can be used. Bumping of the deposition material is also called splashing.

[0077] The conventional crucible shown in Figure 10 has one inner lid 19 to reduce the effect of splashing due to bumping. In Figure 10(a), a crucible 15 has an upper lid 16, an opening 17 in the upper lid, an inner lid 19, an opening 20 in the inner lid, a vapor deposition material 21, and a vapor deposition material supply section 22. The inner lid has one or more openings 20 through which vaporized vapor deposition particles pass. Depending on the position of the opening 20, splashing may not be sufficiently reduced, so a crucible that can further reduce splashing may be used.

[0078] FIG. 10(b) is the same as FIG. 10(a) except that the top cover opening 17 is replaced with a top cover nozzle 18.

[0079] FIG. 11 is a diagram showing the range in which an opening in the inner lid can be provided. FIG. 11(a) shows an example in which the top view of the crucible is circular. The top view is also shown below the cross-sectional view of the crucible. Points a through f in the cross-sectional view correspond to points a through f in the top view. They are connected by dotted lines to show the correspondence. The range in which an opening in the inner lid can be provided is the range connecting points c and e in FIG. 11, that is, the portion indicated by the horizontal line in the top view of the crucible also shown. Hereinafter, the range in which an opening in the inner lid can be provided is also referred to as the openable range.

[0080] The openable range of the inner lid was determined as follows. In the cross-sectional view of Figure 11, a straight line connects point a on the top lid opening and point b on the upper limit of the crucible's capacity for deposition material. When the line intersects point c with the inner lid and point e on the inner lid, the openable range is between ce. Point e is a point on the inner lid, but the edge of the inner lid is excluded. This is because a width is required to attach the inner lid to the crucible, so it is not desirable to create an opening at the edge.

[0081] FIG. 12 shows a modified example of a crucible that reduces splashing. FIG. 12(a) shows a crucible with a nozzle. In FIG. 12(a), the intersection point of the line connecting points a and b and the extension line from the upper end f of the nozzle upward is designated as g. When point g is above the upper end f of the nozzle, the openable range is determined from the line ab in the same way as when there is no nozzle.

[0082] On the other hand, if point g is below the nozzle top end f, as in Figure 12(b), the intersection point of the line connecting point a and the top end f with the inner lid is defined as h. The openable range is the area between point h and point e. Conversely, the unopenable range on the inner lid is the area without horizontal lines in the top view of the crucible in Figures 11 and 12. This is because an opening within the circle in the top view would allow the evaporation material in the crucible to reach the substrate placed above the crucible in a linear manner. If an opening is placed in an undesirable location, splashes generated by bumping or other factors would directly reach the substrate, making it difficult to form a uniform film. This would result in a reduced yield. As described above, the opening in the inner lid is limited by the horizontal cross-sectional area of the crucible and the area of the opening in the top lid.

[0083] Figure 12(c) shows an example in which multiple openings are provided in the inner lid. This is a configuration in which as many circular openings as physically possible are provided within the openable range of the inner lid. In this case, the temperature at point c' in the top view of the crucible may drop. This is because the temperature of the inner lid is determined by heat transfer from point b'. However, because as many openings as possible are provided between points b' and c', heat transfer may decrease and the temperature at the center may drop. If the temperature at the center drops, evaporation particles may adhere to the inner lid, causing crystal growth and blocking the openings. In this case, evaporation must be stopped.

[0084] FIG. 13 is a diagram showing a more preferred crucible for manufacturing an organic device according to the present invention.

[0085] 13(a) is a cross-sectional view of the crucible. It has a first inner lid 19a, a second inner lid 19b, and a third inner lid 19c, each of which has an area where they overlap each other in the vertical direction of the crucible. There are no particular restrictions on the number of inner lids as long as there are two or more, but it is preferably five or less, and more preferably three or less.

[0086] 13(b) is a cross-sectional view and a top view of a crucible having two inner lids. The upper of the two top views shows the orthogonal projection onto the bottom surface of the first inner lid 19a, with the vertically lined portion being the orthogonal projection onto the bottom surface of the first inner lid 19a. Meanwhile, the lower of the two top views shows the orthogonal projection onto the bottom surface of the second inner lid 19b, with the diagonally lined portion being the orthogonal projection of the second inner lid 19b. The combined area of the orthogonal projection of the first inner lid 19a and the orthogonal projection of the second inner lid 19b should encompass the orthogonal projection onto the bottom surface of the opening of the upper lid.

[0087] In Figure 13(b), the bottom of the crucible has a circular structure. A straight line connects the end a of the top lid opening and the portion b where the outermost surface of the vapor deposition material contacts the side of the crucible when the maximum amount of vapor deposition material that can be accommodated in the crucible is placed. The intersection of this line with the first inner lid counting from the top lid side is designated c1. The interior of the circle having c1 on its circumference is the unopenable range of the first inner lid. The first inner lid alone cannot completely cover this unopenable range. In other words, there is a portion where the vapor deposition material placed through the opening of the top lid can be directly seen. Therefore, the example structure has a second inner lid. A straight line connects the end f of the top lid opening and the portion b where the outermost surface of the vapor deposition material contacts the side of the crucible when the maximum amount of vapor deposition material that can be accommodated in the crucible is placed. The intersection of this line with the second inner lid counting from the top lid side is designated c2. The interior of the circle having c2 on its circumference is the unopenable range of the second inner lid. In other words, the non-openable area that cannot be covered by the first inner lid alone is covered by the second inner lid, and conversely, the non-openable area that cannot be covered by the second inner lid alone is covered by the first inner lid. In other words, the structure is such that the vapor deposition material contained in the top lid cannot be directly seen through the opening of the top lid. In addition, all of the multiple inner lids have a structure in which a part of the outer periphery of the inner lid does not come into contact with the inner wall of the crucible.

[0088] A preferred crucible according to this embodiment has an upper lid with an opening and a plurality of inner lids vertically below the opening of the upper lid. As shown in FIG. 13(a), the gap between the upper lid and the inner lid directly below it and the vertical gap between the plurality of inner lids are d1, d2, d3, . . . d from the upper lid side. n (d nis the gap between the n-1th and nth inner lids counting from the top lid), then d n satisfies equation (2). d n >0 [mm] (2)

[0089] Furthermore, the entire area of the opening of the top lid overlaps with the multiple inner lids in a plan view. One of the multiple inner lids may overlap the entire area of the opening of the top lid, or the overlapping areas of the multiple inner lids may be combined to overlap the entire area of the opening of the top lid. This structure can reduce the direct contact of splashes caused by the bumping of the deposition material with the substrate.

[0090] As long as the combined area of the orthogonal projection of the first inner lid 19a and the orthogonal projection of the second inner lid 19b includes the orthogonal projection of the opening of the top lid onto the bottom surface, the inner lid may not have an opening.

[0091] Specifically, by not providing an inner lid in the areas without vertical or diagonal lines in j'-k' and l'-o' of the first and second inner lids, it is possible to provide no openings in the inner lids. In this way, by providing multiple inner lids and providing areas without inner lids, it is possible to completely cover the unopenable area by combining multiple other inner lids. Furthermore, by providing an opening in the openable area on the inner lid, i.e., by providing an opening surrounding the unopenable area, the temperature drop in the center of the inner lid is small in a preferred crucible. Since a preferred crucible does not need an opening surrounding the unopenable area, a temperature drop in the center of the inner lid is avoided. It is also possible to provide an opening in the inner lid to the extent that it does not cause a temperature drop in the center.

[0092] A more preferable crucible has an opening area D of the upper cover, a horizontal cross-sectional area M of the crucible, and an inner cover area m n (n is the nth inner lid when viewed from the top lid side) satisfies the relationship of formula (3). Mm n ≧D (3)

[0093] When evaporation material is placed in a sealed container and heated, the material vaporizes and becomes evaporation particles, causing the internal pressure of the container to increase. If the container has an opening on the top surface, such as the top lid, the internal pressure decreases as the opening becomes larger at a constant heating temperature. Furthermore, in vacuum evaporation, an inner lid is typically placed vertically below the top lid to prevent splashes caused by the material's bumping from reaching the substrate. For example, when forming a film at a substrate position under conditions that achieve a certain evaporation rate, if equation (3) is satisfied, the pressure inside the crucible is significantly affected by the opening area of the top lid. On the other hand, if equation (4) is satisfied, the pressure inside the crucible is significantly affected by the opening area of the inner lid. Mm n <D (4)

[0094] In other words, when attempting to obtain the same deposition rate at the substrate position, the vaporized deposition particles reach the deposition material containing space 22 in the order of [deposition material containing space 22 - inner lid opening 20 - upper lid opening 17 - substrate], and the internal pressure of the deposition material containing space 22 is higher in the latter than in the former. This results in excessive heating of the deposition material, which causes side reactions such as decomposition of the deposition material, and leads to a decrease in the purity of the film formed on the substrate.

[0095] A preferred crucible is one that minimizes the impact of splashes on the deposition substrate even if splashes occur during deposition. When depositing a film at the same deposition rate at the substrate position, the pressure drop within the crucible, i.e., the deposition temperature, can be reduced, making it possible to suppress side reactions such as decomposition of the deposition material. [Example]

[0096] An example of a crucible is shown below. In this example, two types of evaporation material A and evaporation material B, which are relatively easily decomposed, were used. The relatively easily decomposed material is a material having a vacuum degree P of 1×10 -4 ≦P≦1×10 -3 In [Pa], this refers to a material that exhibits formula (5). Δ|T b -T s |<40[℃] (5)

[0097] In equation (4), T b is the decomposition temperature, T s indicates the sublimation start temperature. Vapor deposition material A is a compound having a carbon-nitrogen bond, and vapor deposition material B is a metal complex compound.

[0098] The crucible and inner lid used in the comparative example had the cross-sectional structure shown in Figure 10. The samples used for analysis were prepared by depositing each deposition material at the substrate position at a deposition rate of 1.0 Å / sec to a thickness of 300 Å. This single-layer film was dissolved in a soluble solvent and analyzed using high-performance liquid chromatography (hereinafter referred to as HPLC, manufactured by Shimadzu Corporation).

[0099] [Table 1]

[0100] In Examples 1 to 6, multiple openings were provided in the inner lid, but no temperature drop in the inner lid was observed. It was confirmed that when a preferred crucible was used, a single film with high purity could be obtained regardless of whether evaporation material A or B was used, relative to the initial purity of the material before deposition. On the other hand, when evaporation was performed using the conventional crucible used in the comparative example, it was confirmed that the purity of the single film and the residue remaining in the crucible was significantly lower than the initial purity of the material before deposition.

[0101] Furthermore, using a suitable crucible, the adhesion of splashes caused by the material's bumping to the substrate was checked. Mg was used as the deposition material, and a 100 nm film was formed at a deposition rate of 1.0 Å / sec at the substrate position. Measurements were performed using a WM7 (manufactured by Takano Corporation) to count the number of foreign particles 1 μm or larger.

[0102] [Table 2]

[0103] It was confirmed that the preferred crucible is also excellent in preventing splashing due to bumping.

[0104] Hereinafter, an example of an organic light-emitting device will be shown as a preferred example of an organic device according to one embodiment of the present invention, a device manufactured using a preferred crucible.

[0105] [Configuration of organic light-emitting element] The organic light-emitting element is provided by forming an insulating layer, a first electrode, an organic compound layer, and a second electrode on a substrate. A protective layer, a color filter, a microlens, etc. may be provided on the second electrode. When a color filter is provided, a planarizing layer may be provided between the color filter and the protective layer. The planarizing layer may be made of an acrylic resin, etc. The same applies when a planarizing layer is provided between the color filter and the microlens.

[0106] [substrate] Examples of the substrate include quartz, glass, a silicon wafer, a resin, and a metal. Furthermore, the substrate may be provided with a switching element such as a transistor and wiring, and an insulating layer thereon. Any material can be used for the insulating layer, as long as it allows for the formation of a contact hole so that wiring can be formed between the first electrode and the insulating layer, and ensures insulation from wiring that is not connected. For example, resins such as polyimide, silicon oxide, silicon nitride, etc. can be used.

[0107] [electrode] A pair of electrodes can be used. The pair of electrodes may be an anode and a cathode. When an electric field is applied in the direction in which the organic light-emitting element emits light, the electrode with a higher potential is the anode, and the other is the cathode. It can also be said that the electrode that supplies holes to the light-emitting layer is the anode, and the electrode that supplies electrons is the cathode.

[0108] The anode material should have as high a work function as possible. Examples include simple metals such as gold, platinum, silver, copper, nickel, palladium, cobalt, selenium, vanadium, and tungsten, mixtures containing these metals, alloys of these metals, and metal oxides such as tin oxide, zinc oxide, indium oxide, indium tin oxide (ITO), and zinc indium oxide. Conductive polymers such as polyaniline, polypyrrole, and polythiophene can also be used.

[0109] These electrode materials may be used alone or in combination of two or more. The anode may be composed of one layer or multiple layers.

[0110] When used as a reflective electrode, for example, chromium, aluminum, silver, titanium, tungsten, molybdenum, or alloys or laminates thereof can be used. The above materials can also function as a reflective film without functioning as an electrode. When used as a transparent electrode, transparent conductive oxide layers such as indium tin oxide (ITO) and indium zinc oxide can be used, but are not limited to these. Photolithography technology can be used to form the electrode.

[0111] On the other hand, materials with a low work function are preferred for the cathode. Examples include alkali metals such as lithium, alkaline earth metals such as calcium, and metals such as aluminum, titanium, manganese, silver, lead, and chromium, as well as mixtures containing these metals. Alternatively, alloys combining these metals can be used. For example, magnesium-silver, aluminum-lithium, aluminum-magnesium, silver-copper, and zinc-silver can be used. Metal oxides such as indium tin oxide (ITO) can also be used. These electrode materials can be used alone or in combination. The cathode can have either a single-layer or multi-layer structure. Among these, silver is preferred, and a silver alloy is even more preferred to reduce silver aggregation. The alloy ratio is not critical as long as silver aggregation can be reduced. For example, the silver:other metal ratio can be 1:1, 3:1, or the like.

[0112] The cathode may be a top-emission element using an oxide conductive layer such as ITO, or a bottom-emission element using a reflective electrode such as aluminum (Al), and is not particularly limited. The method for forming the cathode is not particularly limited, but DC and AC sputtering methods are more preferred because they provide good film coverage and make it easier to reduce resistance.

[0113] [Organic compound layer] The organic compound layer may be formed as a single layer or as multiple layers. When multiple layers are included, they may be called hole injection layer, hole transport layer, electron blocking layer, light-emitting layer, hole blocking layer, electron transport layer, or electron injection layer depending on their functions. The organic compound layer is mainly composed of organic compounds but may also contain inorganic atoms or inorganic compounds. For example, the organic compound layer may contain copper, lithium, magnesium, aluminum, iridium, platinum, molybdenum, zinc, or the like. The organic compound layer may be disposed between the first electrode and the second electrode, or may be disposed in contact with the first electrode and the second electrode.

[0114] [Protective layer] A protective layer may be provided on the cathode. For example, by adhering glass with a moisture absorbent on the cathode, the intrusion of water and other contaminants into the organic compound layer can be reduced, thereby reducing the occurrence of display defects. In another embodiment, a passivation film such as silicon nitride may be provided on the cathode to reduce the intrusion of water and other contaminants into the organic compound layer. For example, after forming the cathode, the cathode may be transferred to another chamber without breaking the vacuum, and a 2 μm-thick silicon nitride film may be formed by CVD to serve as a protective layer. A protective layer may be provided using atomic layer deposition (ALD) after the CVD film formation. The material of the film formed by ALD is not limited, and may be silicon nitride, silicon oxide, aluminum oxide, or the like. Silicon nitride may be further formed on the film formed by ALD by CVD. The film formed by ALD may have a thickness smaller than that of the film formed by CVD. Specifically, the thickness may be 50% or less, or even 10% or less.

[0115] [Color Filter] A color filter may be provided on the protective layer. For example, a color filter taking into consideration the size of the organic light-emitting element may be provided on a separate substrate and then bonded to the substrate on which the organic light-emitting element is provided, or a color filter may be patterned on the protective layer described above using photolithography technology. The color filter may be made of a polymer.

[0116] [Planarization layer] A planarization layer may be provided between the color filter and the protective layer. The planarization layer is provided for the purpose of reducing the unevenness of the underlying layer. It may also be called a material resin layer without limiting its purpose. The planarization layer may be composed of an organic compound, and may be either a low molecular weight or a high molecular weight, but a high molecular weight is preferred.

[0117] The planarizing layer may be provided above or below the color filter, and may be made of the same or different materials, such as polyvinyl carbazole resin, polycarbonate resin, polyester resin, ABS resin, acrylic resin, polyimide resin, phenol resin, epoxy resin, silicone resin, and urea resin.

[0118] [Microlens] The organic light-emitting device may have an optical component such as a microlens on its light-emitting side. The microlens may be made of acrylic resin, epoxy resin, or the like. The microlens may be used to increase the amount of light extracted from the organic light-emitting device and to control the direction of the extracted light. The microlens may have a hemispherical shape. When the microlens has a hemispherical shape, among the tangents to the hemisphere, there is a tangent that is parallel to the insulating layer, and the point of contact between this tangent and the hemisphere is the vertex of the microlens. The vertex of the microlens can be determined in the same way in any cross-sectional view. In other words, among the tangents to the semicircle of the microlens in the cross-sectional view, there is a tangent that is parallel to the insulating layer, and the point of contact between this tangent and the semicircle is the vertex of the microlens.

[0119] It is also possible to define the midpoint of a microlens. In the cross section of the microlens, a line segment is imagined from the point where an arc shape ends to the point where another arc shape ends, and the midpoint of this line segment can be called the midpoint of the microlens. The cross section for determining the vertex and midpoint may be a cross section perpendicular to the insulating layer.

[0120] [Counter substrate] An opposing substrate may be provided on the planarization layer. The opposing substrate is called an opposing substrate because it is provided at a position corresponding to the aforementioned substrate. The constituent material of the opposing substrate may be the same as that of the aforementioned substrate. When the aforementioned substrate is defined as a first substrate, the opposing substrate may be a second substrate.

[0121] [Organic layer] The organic compound layers (hole injection layer, hole transport layer, electron blocking layer, light emitting layer, hole blocking layer, electron transport layer, electron injection layer, etc.) constituting the organic light emitting device according to one embodiment of the present invention are formed by the method shown below.

[0122] The organic compound layer constituting the organic light-emitting device according to one embodiment of the present invention can be formed by dry processes such as vacuum deposition, ionization deposition, sputtering, plasma, etc. Alternatively to the dry process, a wet process can be used in which the compound is dissolved in an appropriate solvent and a layer is formed by a known coating method (for example, spin coating, dipping, casting, LB method, inkjet method, etc.).

[0123] Here, when a layer is formed by a vacuum deposition method or a solution coating method, crystallization is unlikely to occur and the layer has excellent stability over time. When a film is formed by a coating method, the film can be formed by combining with an appropriate binder resin.

[0124] Examples of the binder resin include, but are not limited to, polyvinylcarbazole resin, polycarbonate resin, polyester resin, ABS resin, acrylic resin, polyimide resin, phenol resin, epoxy resin, silicone resin, and urea resin.

[0125] These binder resins may be used singly or in combination as homopolymers or copolymers, and may further contain known additives such as plasticizers, antioxidants, and ultraviolet absorbers, if necessary.

[0126] [Pixel circuit] The light-emitting device may have a pixel circuit connected to the light-emitting element. The pixel circuit may be an active matrix type that controls the emission of the first light-emitting element and the second light-emitting element independently. The active matrix type circuit may be voltage-programmed or current-programmed. The drive circuit has a pixel circuit for each pixel. The pixel circuit may have a light-emitting element, a transistor that controls the emission brightness of the light-emitting element, a transistor that controls the emission timing, a capacitor that holds the gate voltage of the transistor that controls the emission brightness, and a transistor for connecting to GND without going through the light-emitting element.

[0127] The light-emitting device has a display region and a peripheral region arranged around the display region. The display region has pixel circuits, and the peripheral region has a display control circuit. The mobility of a transistor constituting the pixel circuit may be lower than the mobility of a transistor constituting the display control circuit.

[0128] The slope of the current-voltage characteristics of the transistors that make up the pixel circuit may be smaller than the slope of the current-voltage characteristics of the transistors that make up the display control circuit. The slope of the current-voltage characteristics can be measured using the so-called Vg-Ig characteristics.

[0129] The transistors that make up the pixel circuit are transistors connected to light-emitting elements such as the first light-emitting element.

[0130] [Pixels] An organic light emitting device includes a plurality of pixels, each of which includes sub-pixels that emit different colors, for example, RGB colors.

[0131] The pixel emits light from an area called the pixel aperture. This area is the same as the first area. The pixel aperture may be 15 μm or less, or 5 μm or more. More specifically, it may be 11 μm, 9.5 μm, 7.4 μm, 6.4 μm, etc.

[0132] The distance between the subpixels may be 10 μm or less, and specifically may be 8 μm, 7.4 μm, or 6.4 μm.

[0133] The pixels may be arranged in a known manner in a plan view. For example, they may be in a stripe arrangement, a delta arrangement, a pentile arrangement, or a Bayer arrangement. The shape of the subpixels in a plan view may be any known shape. For example, they may be rectangular, quadrilaterals such as diamonds, or hexagons. Of course, a shape that is close to a rectangle, rather than an exact shape, is included in the rectangle. The shape of the subpixels and the pixel arrangement may be used in combination.

[0134] [Use of the organic light-emitting device according to one embodiment of the present invention] The organic light-emitting device according to one embodiment of the present invention can be used as a component of a display device or a lighting device, and can also be used as an exposure light source for an electrophotographic image forming device, a backlight for a liquid crystal display device, a light-emitting device having a white light source and a color filter, etc.

[0135] The display device may be an image information processing device that has an image input unit that inputs image information from an area CCD, a linear CCD, a memory card, etc., has an information processing unit that processes the input information, and displays the input image on the display unit.

[0136] The display unit of the imaging device or inkjet printer may have a touch panel function. The driving method of this touch panel function may be an infrared method, a capacitance method, a resistive film method, or an electromagnetic induction method, and is not particularly limited. The display device may also be used in the display unit of a multifunction printer.

[0137] 14 is a schematic diagram illustrating an example of a display device according to this embodiment. The display device 1000 may include a touch panel 1003, a display panel 1005, a frame 1006, a circuit board 1007, and a battery 1008 between an upper cover 1001 and a lower cover 1009. The touch panel 1003 and the display panel 1005 are connected by flexible printed circuits FPCs 1002 and 1004. Transistors are printed on the circuit board 1007. The battery 1008 may not be provided if the display device is not a portable device, and may be provided in a different position even if the display device is a portable device.

[0138] The display device according to this embodiment may have color filters having red, green, and blue colors, which may be arranged in a delta arrangement.

[0139] The display device according to the present embodiment may be used as a display unit of a mobile terminal. In this case, the display device may have both a display function and an operation function. Examples of the mobile terminal include a mobile phone such as a smartphone, a tablet, and a head-mounted display.

[0140] The display device according to this embodiment may be used as a display unit of an imaging device having an optical unit with a plurality of lenses and an imaging element that receives light that has passed through the optical unit. The imaging device may have a display unit that displays information acquired by the imaging element. The display unit may be a display unit exposed to the outside of the imaging device or a display unit disposed within a viewfinder. The imaging device may be a digital camera or a digital video camera.

[0141] 15(a) is a schematic diagram showing an example of an imaging device according to this embodiment. The imaging device 1100 may have a viewfinder 1101, a rear display 1102, an operation unit 1103, and a housing 1104. The viewfinder 1101 may have a display device according to this embodiment. In this case, the display device may display not only an image to be captured, but also environmental information, imaging instructions, and the like. The environmental information may include the intensity of external light, the direction of external light, the speed at which the subject is moving, the possibility that the subject will be blocked by an obstruction, and the like.

[0142] Since the optimum timing for capturing an image is very short, it is better to display information as soon as possible. Therefore, it is preferable to use a display device using the organic light-emitting element of the present invention. This is because the organic light-emitting element has a fast response speed. A display device using an organic light-emitting element can be used more preferably than a liquid crystal display device, which requires a high display speed.

[0143] The imaging device 1100 has an optical section (not shown). The optical section has multiple lenses, which form an image on an imaging element housed in a housing 1104. The focus of the multiple lenses can be adjusted by adjusting their relative positions. This operation can also be performed automatically. The imaging device may also be called a photoelectric conversion device. Instead of sequentially capturing images, the photoelectric conversion device can include an imaging method that detects the difference from the previous image, or a method of cutting out an image from a constantly recorded image, etc.

[0144] FIG. 15(b) is a schematic diagram showing an example of an electronic device according to this embodiment. The electronic device 1200 has a display unit 1201, an operation unit 1202, and a housing 1203. The housing 1203 may have a circuit, a printed circuit board having the circuit, a battery, and a communication unit. The operation unit 1202 may be a button or a touch panel type reaction unit. The operation unit may be a biometric recognition unit that recognizes a fingerprint to unlock the device, etc. An electronic device having a communication unit can also be called a communication device. The electronic device may further have a camera function by including a lens and an image sensor. An image captured by the camera function is displayed on the display unit. Examples of the electronic device include a smartphone and a laptop computer.

[0145] Fig. 16 is a schematic diagram showing an example of a display device according to this embodiment. Fig. 16(a) shows a display device such as a television monitor or a PC monitor. The display device 1300 has a frame 1301 and a display unit 1302. The light-emitting device according to this embodiment may be used in the display unit 1302.

[0146] It has a frame 1301 and a base 1303 that supports a display unit 1302. The base 1303 is not limited to the form shown in Fig. 5(a). The bottom side of the frame 1301 may also serve as the base.

[0147] The frame 1301 and the display unit 1302 may be curved. The radius of curvature may be 5000 mm or more and 6000 mm or less.

[0148] FIG. 16(b) is a schematic diagram illustrating another example of a display device according to this embodiment. The display device 1310 in FIG. 5(b) is configured to be bendable, and is a so-called foldable display device. The display device 1310 has a first display unit 1311, a second display unit 1312, a housing 1313, and a bending point 1314. The first display unit 1311 and the second display unit 1312 may include a light-emitting device according to this embodiment. The first display unit 1311 and the second display unit 1312 may be a single, seamless display unit. The first display unit 1311 and the second display unit 1312 can be separated by the bending point. The first display unit 1311 and the second display unit 1312 may each display different images, or the first and second display units may display a single image.

[0149] An application example of the display device of each of the above-described embodiments will be described with reference to Fig. 17. The display device can be applied to a system that can be attached as a wearable device, such as smart glasses, an HMD, or a smart contact lens. An image capturing and displaying device used in such an application example includes an image capturing device capable of photoelectrically converting visible light and a displaying device capable of emitting visible light.

[0150] 17(a) illustrates glasses 1600 (smart glasses) according to one application example. An imaging device 1602 such as a CMOS sensor or SPAD is provided on the front side of a lens 1601 of the glasses 1600. Furthermore, a display device according to any of the above-described embodiments is provided on the back side of the lens 1601.

[0151] The glasses 1600 further include a control device 1603. The control device 1603 functions as a power source that supplies power to the image capture device 1602 and the display device according to each embodiment. The control device 1603 also controls the operations of the image capture device 1602 and the display device. The lens 1601 is formed with an optical system for focusing light onto the image capture device 1602.

[0152] FIG. 17(b) illustrates glasses 1610 (smart glasses) according to one application example. The glasses 1610 include a control device 1612, which is equipped with an imaging device equivalent to the imaging device 1602 and a display device. A lens 1611 includes an optical system for projecting light emitted from the imaging device and the display device within the control device 1612, and an image is projected onto the lens 1611. The control device 1612 functions as a power source for supplying power to the imaging device and the display device and controls the operation of the imaging device and the display device. The control device may also include a gaze detection unit for detecting the wearer's gaze. Infrared light may be used for gaze detection. The infrared light emitter emits infrared light toward the eyeball of a user gazing at a displayed image. An imaging unit with a light receiving element detects the reflected light of the emitted infrared light from the eyeball, thereby obtaining an image of the eyeball. A reduction unit for reducing light from the infrared light emitter to the display unit in a planar view reduces degradation of image quality.

[0153] The gaze of the user relative to the displayed image is detected from an image of the eyeball obtained by capturing infrared light. Any known method can be used for gaze detection using an image of the eyeball. One example is a gaze detection method based on the Purkinje image formed by reflection of irradiated light on the cornea.

[0154] More specifically, gaze detection processing is performed based on the pupil-corneal reflex method, which calculates a gaze vector representing the direction (rotation angle) of the eyeball based on the pupil image and Purkinje image included in the captured image of the eyeball, thereby detecting the user's gaze.

[0155] A display device according to an embodiment of the present invention may have an imaging device having a light receiving element, and may control the image displayed on the display device based on information about the user's line of sight from the imaging device.

[0156] Specifically, the display device determines a first field of view area where the user gazes and a second field of view area other than the first field of view area based on the line-of-sight information. The first field of view area and the second field of view area may be determined by a control device of the display device, or may be determined by an external control device and received. In the display area of the display device, the display resolution of the first field of view area may be controlled to be higher than the display resolution of the second field of view area. In other words, the resolution of the second field of view area may be lower than that of the first field of view area.

[0157] The display area includes a first display area and a second display area different from the first display area, and a high-priority area is determined from the first display area and the second display area based on line-of-sight information. The first field of view area and the second field of view area may be determined by a control device of the display device, or may be determined by an external control device and received. The resolution of the high-priority area may be controlled to be higher than the resolution of areas other than the high-priority area. In other words, the resolution of an area with a relatively low priority may be lowered.

[0158] Note that AI may be used to determine the first field of view area and areas with high priority. The AI may be a model configured to estimate the angle of gaze and the distance to an object in the line of sight from an image of the eyeball, using as training data an image of the eyeball and the direction in which the eyeball in the image was actually looking. The AI program may be included in the display device, the imaging device, or an external device. If included in an external device, it is transmitted to the display device via communication.

[0159] When display control is performed based on visual recognition detection, the smart glasses can be preferably applied to smart glasses that further include an imaging device for capturing images of the outside world. The smart glasses can display captured external information in real time.

[0160] As described above, by using a device using the organic light-emitting element according to this embodiment, it is possible to provide a stable display with good image quality even over a long period of time. [Explanation of symbols]

[0161] 1 Interlayer film 2 First electrode (lower electrode) 3 Partition (insulating layer) 4 Charge transport layer 5 Functional Layer 6 Second electrode (upper electrode) 7 Sealing layer 8 Adhesion layer 9 Color Filters 10 Light-emitting element 11 Eave shape 12 Contact holes x1 Eaves projection x2 Distance between eaves tips y Eaves height t Total thickness of organic layers (total thickness of layers 4 and 5) t' film thickness of charge transport region

Claims

1. An organic device including a first element and a second element disposed adjacent to the first element in a first direction, the first element and the second element each include a first electrode, a second electrode, an organic layer disposed between the first electrode and the second electrode, and an insulating layer covering an upper surface and a side surface of the first electrode at an end of the first electrode; the first electrode, the organic layer, and the second electrode are arranged in this order in a second direction perpendicular to the first direction; the insulating layer has an eave shape with a protruding portion protruding from the insulating layer of the first element to the second element between the first element and the second element, an organic device characterized in that the organic layer has a charge transport layer and a functional layer, and the following formula (1) is satisfied, where t is the total film thickness in the first direction of the organic layer including the charge transport layer and the functional layer in the overhang shape, t' is the film thickness in the first direction of the charge transport layer in the overhang shape, x1 is the protrusion amount of the overhang shape in the first direction, x2 is the distance between the overhang shape of the first element and the overhang shape of the second element, and y is the distance in the second direction from the lower surface of the first electrode to the protruding portion of the overhang shape. [Equation 1]

2. 2. The organic device according to claim 1, wherein, in the same cross section, when t is the minimum film thickness and t' is the maximum film thickness, the formula (1) is satisfied.

3. 3. The organic device according to claim 1, wherein the organic layer has a discontinuous portion at least in the protruding portion of the eaves-shaped portion, and the second electrode is continuous.

4. An organic device including a first element and a second element disposed adjacent to the first element in a first direction, the first element and the second element each include a first electrode, a second electrode, an organic layer disposed between the first electrode and the second electrode, and an insulating layer covering an upper surface and a side surface of the first electrode at an end of the first electrode; the first electrode, the organic layer, and the second electrode are arranged in this order in a second direction perpendicular to the first direction; the insulating layer has an eave shape with a protruding portion protruding from the insulating layer of the first element to the second element between the first element and the second element, The insulating layer has the protrusion only between the first element and the second element, and the constituent material of the eaves-shaped protrusion is different from the constituent material of the eaves-shaped side portion.

5. 5. The organic device according to claim 4, wherein the side portion of the eaves shape, the top portion of the eaves shape, and the bottom portion of the eaves shape are all made of different insulating materials.

6. 6. The organic device according to claim 4, wherein an upper portion of the overhanging shape is made of an organic material, and a side portion of the overhanging shape is made of an inorganic material.

7. 6. The organic device according to claim 4, wherein the side surface of the overhanging shape is made of an organic insulating material.

8. The organic device according to any one of claims 4 to 7, characterized in that the organic layer has a charge transport layer and a functional layer, and the following formula (1) is satisfied, where t is the total film thickness in the first direction of the organic layer including the charge transport layer and the functional layer in the overhanging shape, t' is the film thickness in the first direction of the charge transport layer in the overhanging shape, x1 is the protrusion amount of the overhanging shape in the first direction, x2 is the distance between the overhanging shape of the first element and the overhanging shape of the second element, and y is the distance in the second direction from the lower surface of the first electrode to the protruding portion of the overhanging shape. [Equation 2]

9. 9. The organic device according to claim 8, wherein the formula (1) is satisfied when t is the minimum film thickness and t' is the maximum film thickness in the same cross section.

10. 10. The organic device according to claim 4, wherein the organic layer has a discontinuous portion at least in the overhanging shape, and the second electrode is continuous.

11. 10. The organic device according to claim 1, wherein the functional layer is a light-emitting layer.

12. A display device comprising: the organic device according to claim 11; and a transistor connected to the organic device.

13. an optical unit having a plurality of lenses, an image pickup element that receives light that has passed through the optical unit, and a display unit that displays an image picked up by the image pickup element; An imaging device, wherein the display unit comprises the organic device according to claim 11.

14. 12. An electronic device comprising: a display unit having the organic device according to claim 11; a housing in which the display unit is provided; and a communication unit provided in the housing for communicating with an external device.

15. 1. A method for manufacturing an organic device including a first element and a second element disposed adjacent to the first element in a first direction, the method comprising: the step of manufacturing the first element and the second element includes a step of preparing a first electrode, a step of providing an insulating layer that covers an end of the first electrode, a step of providing an organic layer on the first electrode and the insulating layer, and a step of providing a second electrode on the organic layer; The insulating layer may include a step of providing a first insulating layer on the first electrode, a step of providing a second insulating layer on the first insulating layer, and an etching step of etching the first insulating layer and the second insulating layer; 4. A method for manufacturing an organic device, wherein, in the etching step, an etching rate of the first insulating layer is different from an etching rate of the second insulating layer.

16. 16. The method for manufacturing an organic device according to claim 15, wherein in the etching step, an etching rate of the first insulating layer is higher than an etching rate of the second insulating layer.

17. 17. The method for manufacturing an organic device according to claim 15, wherein the etching step forms an eave shape of the insulating layer between the first element and the second element, the eave shape having a protruding portion that protrudes from the insulating layer of the first element toward the second element.

18. A method for manufacturing an organic device as described in Claim 15, characterized in that the etching process causes the insulating layer to form an eave shape between the first element and the second element, having a protruding portion that protrudes from the insulating layer of the first element to the second element.

19. the etching step includes a first etching step and a second etching step performed after the first etching step, an etching rate of the first insulating layer in the first etching step is higher than an etching rate of the second insulating layer; 19. The method for manufacturing an organic device according to claim 15, wherein an etching rate of the first insulating layer in the second etching step is smaller than an etching rate of the second insulating layer.

20. 20. The method for manufacturing an organic device according to claim 15, wherein the second insulating layer is formed on the first insulating layer by applying an organic material.

21. 21. The method for manufacturing an organic device according to claim 15, wherein the organic layer is provided by a vapor deposition process.

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