Ribbed cover for multi-station processing modules

Abstract

In some examples, a rib cover for a multi-station processing module having ribs disposed between adjacent processing chambers is provided. The exemplary rib cover includes a first portion for supporting the rib cover on the rib, a first side shield that covers a first wall of the rib when the rib cover is attached, and at least one spacer that holds an inner surface of the rib cover away from the covered rib.

Description

[Technical Field]

[0001] Priority claims This application claims the benefit of priority to U.S. Patent Application No. 63 / 078,302, filed September 14, 2020, which is incorporated herein by reference in its entirety.

[0002] FIELD OF THE DISCLOSURE The present disclosure relates generally to rib covers for multi-station substrate processing modules, and more particularly to rib covers for quad-station processing modules (QSMs). [Background technology]

[0003] During some substrate processing in the vacuum chamber of a QSM, high defect counts may be observed along the edge of the substrate closest to the chamber rib extending between adjacent processing chambers. Deposits on the surface of the chamber rib can be redistributed to the surface of the substrate, such as a wafer, by spalling or flaking of the deposited material. This fallout can be observed as defects or particle distribution on the wafer.

[0004] Currently, to remove such debris, in situ chamber cleaning is performed after processing a certain number of wafer batches. In some cases, the number of wafer batches between cleanings is too small, making it impossible to meet hourly wafer throughput targets. Wafer throughput can be improved by extending the time between chamber cleanings.

[0005] The background description provided herein is intended to present the contents of the present disclosure generally. Work by the presently named inventors within the scope of what is described in this Background section, as well as aspects of the description that may not otherwise be considered prior art at the time of filing, are not admitted, expressly or impliedly, as prior art against the present disclosure. Summary of the Invention

[0006] In some examples, a rib cover for a multi-station processing module is provided. The processing module has a rib disposed between adjacent processing chambers of the processing module. The exemplary rib cover includes a first portion configured to support the rib cover on the rib of the multi-station processing module, a first side shield configured to cover a first wall of the rib, and at least one spacer configured to hold a first surface of the rib cover away from the rib.

[0007] In some examples, the rib cover further comprises a second side shield that covers a second wall of the rib when the rib cover is attached.

[0008] In some examples, the upper portion of the rib cover and the first and second side shields define a channel for the rib cover.

[0009] In some examples, the channel includes a flared mouth.

[0010] In some instances, engagement of the flared opening and the rib prevents radial movement of the rib cover relative to the process module.

[0011] In some examples, the channel is configured to support or hold the rib cover on the rib by gravity alone.

[0012] In some examples, at least one spacer is positioned within the channel, and the channel is configured to support or retain the rib cover on the rib by a slip fit or frictional engagement between the at least one spacer and the rib.

[0013] In some examples, the at least one spacer is configured to minimize thermal contact between the rib cover and the rib.

[0014] In some examples, the separation distance between the rib cover and the rib ranges from 0.05 to 0.50 inches (approximately 1.27 to 12.7 mm).

[0015] In some examples, the cross-sectional thickness of the rib cover or channel ranges from 0.25 to 0.70 inches (approximately 6.35 to 17.78 mm).

[0016] In some examples, at least a second portion of the rib cover includes a ceramic material.

[0017] In some examples, a multi-station processing module has a rib disposed between adjacent processing chambers of the processing module. An exemplary processing module includes a rib cover. The exemplary rib cover includes a first portion configured to support the rib cover on the rib of the multi-station processing module, a first side shield configured to cover a first wall of the rib, and at least one spacer configured to hold a first surface of the rib cover away from the rib.

[0018] In some examples, the rib cover further comprises a second side shield that covers a second wall of the rib when the rib cover is attached.

[0019] In some examples, the first portion of the rib cover and the first and second side shields define a channel for the rib cover.

[0020] In some examples, the channel includes a flared mouth.

[0021] In some instances, engagement of the flared opening and the rib prevents radial movement of the rib cover relative to the process module.

[0022] In some examples, the channel is configured to support or hold the rib cover on the rib by gravity alone.

[0023] In some examples, at least one spacer is positioned within the channel, and the channel is configured to support or retain the rib cover on the rib by a slip fit or frictional engagement between the at least one spacer and the rib.

[0024] In some examples, the at least one spacer is configured to minimize thermal contact between the rib cover and the rib.

[0025] In some examples, the separation distance between the rib cover and the rib ranges from 0.05 to 0.50 inches (approximately 1.27 to 12.7 mm).

[0026] In some examples, the cross-sectional thickness of the rib cover or channel ranges from 0.25 to 0.70 inches (approximately 6.35 to 17.78 mm).

[0027] In some examples, at least a second portion of the rib cover includes a ceramic material.

[0028] In some examples, a method for operating a multi-station processing module is provided. The exemplary processing module has a rib disposed between adjacent processing chambers of the processing module. The exemplary method includes providing a rib cover for the rib, the rib cover having a first portion configured to support the rib cover on the rib of the multi-station processing module, the rib being disposed between adjacent processing chambers of the multi-station processing module, a first side shield covering a portion of a wall of a first processing chamber of the adjacent processing chamber of the multi-station processing module, and at least one spacer configured to hold a first surface of the first portion, or a surface of the first side shield, away from a surface of the wall of the first processing chamber of the processing module; and attaching the rib cover to the rib.

[0029] In some examples, the method further includes removing residual deposits from the rib cover between processing cycles of the processing module. [Brief explanation of the drawings]

[0030] Several embodiments are illustrated in the figures of the accompanying drawings, which are presented by way of example and not by way of limitation.

[0031] [Figure 1] FIG. 1 is a schematic diagram of a substrate processing tool, according to some example embodiments. [Figure 2] FIG. 2 is a schematic diagram of a substrate processing tool, according to some example embodiments. [Figure 3] FIG. 3 is a schematic diagram of a substrate processing tool, according to some example embodiments. [Figure 4] FIG. 4 is a schematic diagram of a substrate processing tool, according to some example embodiments. [Figure 5] FIG. 5 is a schematic diagram of a substrate processing tool, according to some example embodiments.

[0032] [Figure 6] FIG. 6 is a schematic diagram of an exemplary processing chamber in which examples of the present disclosure may be employed.

[0033] [Figure 7] FIG. 7 is a perspective view of an open QSM in accordance with an exemplary embodiment.

[0034] [Figure 8A] FIG. 8A is a perspective top view of a rib cover according to an exemplary embodiment. [Figure 8B] FIG. 8B is a perspective bottom view of a rib cover according to an exemplary embodiment.

[0035] [Figure 9] FIG. 9 is a schematic diagram of a QSM showing an example of particle distribution on a wafer, according to an example embodiment.

[0036] [Figure 10] FIG. 10 is a diagram illustrating operations in an exemplary method of operating a multi-station processing module, according to some examples. DETAILED DESCRIPTION OF THE INVENTION

[0037] The following description includes systems, methods, techniques, instruction sequences, and computing machine program products that embody exemplary embodiments of the present disclosure. In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the exemplary embodiments. However, it will be apparent to those skilled in the art that the present disclosure may be practiced without these specific details.

[0038] 1, a top view of an exemplary substrate processing tool 100 is shown. The substrate processing tool 100 includes multiple process modules 102. In some examples, each of the process modules 102 can be configured to perform one or more respective processes on a substrate. A substrate to be processed is loaded into the substrate processing tool 100 via a port in a loading station of an EFEM 104 (equipment front end module) and then transferred to one or more of the process modules 102. For example, the substrate may be loaded into each of the process modules 102 in succession.

[0039] Referring now to FIG. 2, an exemplary configuration 200 of a fabrication chamber 202 containing multiple substrate processing tools 204 is shown.

[0040] 3 illustrates a first exemplary configuration 300 including a first substrate processing tool 302 and a second substrate processing tool 304. The first substrate processing tool 302 and the second substrate processing tool 304 are arranged sequentially and connected by a transfer stage 306 under vacuum. As shown, the transfer stage 306 includes a pivoting transfer mechanism configured to transfer substrates between a VTM 308 (vacuum transfer module) of the first substrate processing tool 302 and a VTM 310 of the second substrate processing tool 304. However, in other examples, the transfer stage 306 may include other suitable transfer mechanisms, such as a linear transfer mechanism. In some examples, a first robot (not shown) of the VTM 308 can place a substrate on supports 312 positioned at a first location, the supports 312 are pivoted to a second location, and a second robot (not shown) of the VTM 310 retrieves the substrate from the supports 312 at the second location. In some examples, the second substrate processing tool 304 may include a storage buffer 314 configured to store one or more substrates between processing stages.

[0041] The transfer mechanism may also be stacked to provide two or more transfer systems between the first substrate processing tool 302 and the second substrate processing tool 304. The transfer stage 306 may also have multiple slots to carry or buffer multiple substrates at a time.

[0042] In the exemplary configuration 300, the first substrate processing tool 302 and the second substrate processing tool 304 are configured to share a single EFEM 316 (equipment front end module).

[0043] 4 shows a second exemplary configuration 400 including a first substrate processing tool 402 and a second substrate processing tool 404 arranged sequentially and connected by a transfer stage 406. The exemplary configuration 400 is similar to the exemplary configuration 300 of FIG. 3, except that the EFEM is eliminated in the exemplary configuration 400. Thus, a substrate may be loaded directly into the first substrate processing tool 402 via an airlock loading station 408 (e.g., using a storage or transport carrier such as a vacuum wafer carrier, a front-opening unified pod (FOUP), an atmospheric (ATM) robot, or other suitable mechanism).

[0044] The apparatus, systems, and methods of the present disclosure may be applied to multi-station processing modules, more particularly quad-station processing modules (QSMs). In some examples, as shown in FIG. 5 , a substrate processing tool 500 is shown. The substrate processing tool 500 includes four QSMs 506. Each of the QSMs 506 includes four stations 516 (thus a quad-station module). Each station 516 may include a processing chamber or a vacuum chamber. The substrate processing tool 500 includes a transfer robot 502 and a transfer robot 504, collectively referred to as transfer robots 502 / 504. The substrate processing tool 500 is shown without a mechanical indexer for illustrative purposes. In other examples, each QSM 506 of the substrate processing tool 500 may include a mechanical indexer that transfers substrates (e.g., wafers) from station to station within a given QSM 506. The indexer may include a carrier ring or a rejection ring.

[0045] The VTM 514 and the EFEM 508 can each include one of the transfer robots 502 / 504. The transfer robots 502 / 504 may have the same or different configurations. In some examples, the transfer robot 502 is shown having two arms, each with two vertically stacked end effectors. The transfer robot 504 of the VTM 514 selectively transfers substrates to and from the EFEM 508 and the QSM 506. The transfer robot 504 of the EFEM 508 transfers substrates to and from the EFEM 508. In some examples, the transfer robot 504 can have two arms, each with a single end effector or two vertically stacked end effectors. The system controller 1200 can control various operations of the illustrated substrate processing tool 500 and its components, including, but not limited to, the operation of the robots 502 / 504 and the rotation of the respective indexers of the QSM 506.

[0046] The VTM 514 is configured to interface with, for example, all four of the QSMs 506, each having a single load station accessible via a respective 510 slot. In this example, the sides 512 of the VTM 514 are not angled (i.e., the sides 512 are substantially straight or planar). In this manner, two of the QSMs 506, each having a single load station, can be coupled to each of the sides 512 of the VTM 514. Thus, the EFEM 508 can be positioned at least partially between two of the QSMs 506, reducing the footprint of the substrate processing tool 500.

[0047] Referring now to FIG. 6 , an exemplary simplified configuration 600 of a plasma-based processing chamber provided in each of the stations 516 is shown. While the present subject matter can be used in a variety of semiconductor manufacturing and wafer processing operations, in the illustrated example, the plasma-based processing chambers are described in the context of plasma-enhanced or radical-enhanced chemical vapor deposition (CVD) or atomic layer deposition (ALD) operations. Those skilled in the art will recognize that other types of ALD processing techniques are known (e.g., thermal-based ALD operations) and can incorporate non-plasma-based processing chambers. An ALD tool is a special type of CVD processing system in which an ALD reaction occurs between two or more chemical species. The two or more chemical species, called precursor gases, are used to form thin film deposits of materials on substrates, such as silicon wafers used in the semiconductor industry. The precursor gases are sequentially introduced into the ALD processing chamber and react with the surface of the substrate to form a deposition layer. Typically, the substrate repeatedly interacts with the precursors, slowly depositing increasingly thick layers of one or more material films on the substrate. In certain applications, multiple precursor gases can be used to form various types of films during a substrate manufacturing process.

[0048] FIG. 6 is shown to include a plasma-based processing chamber 102 in which a showerhead 604 (which may be a showerhead electrode) and a substrate support assembly 608 or pedestal are disposed. Typically, the substrate support assembly 608 provides a substantially isothermal surface and can function as both a heating element and a heat sink for the substrate 606. The substrate support assembly 608 may include an electrostatic chuck (ESC) that includes a heating element to assist in processing the substrate 606, as described above. The substrate 606 may include, for example, a wafer including an elemental semiconductor material (e.g., silicon (Si) or germanium (Ge)) or a compound semiconductor material (e.g., silicon germanium (SiGe) or gallium arsenide (GaAs)). In addition, other substrates include dielectric materials such as, for example, quartz, sapphire, semi-crystalline polymers, or other non-metallic and non-semiconductor materials.

[0049] During operation, a substrate 606 is loaded onto the substrate support assembly 608 through a load port 610. An exclusion ring can load the wafer onto the substrate support assembly 608. Other loading configurations are also possible. A gas line 614 can supply one or more process gases (e.g., precursor gases) to the showerhead 604. The showerhead 604 then delivers the one or more process gases to the plasma-based processing chamber 602. A gas source 612 (e.g., one or more precursor gas ampoules) that supplies one or more process gases is coupled to the gas line 614. In some examples, an RF (radio frequency) power source 616 is coupled to the showerhead 604. In other examples, a power source is coupled to the substrate support assembly 608 or the ESC.

[0050] Downstream of the gas lines 614, a point-of-use (POU) and manifold combination (not shown) controls the flow of one or more process gases into the plasma-based processing chamber 602 before entering the showerhead 604. For plasma-based processing chambers 602 used to deposit thin films in plasma-enhanced ALD operations, precursor gases can be mixed within the showerhead 604.

[0051] During operation, the plasma-based processing chamber 602 is evacuated by a vacuum pump 618. RF power is capacitively coupled between the showerhead 604 and a lower electrode 620 included in or on the substrate support assembly 608. The substrate support assembly 608 is typically supplied with two or more RF frequencies. For example, in various embodiments, the RF frequency can be selected from at least one of approximately 1 MHz, 2 MHz, 13.56 MHz, 27 MHz, 60 MHz, and other frequencies, as desired. Coils designed to block or partially block specific RF frequencies can be designed as needed. Therefore, the specific frequencies described herein are provided solely for ease of understanding. RF power is used to energize one or more process gases into a plasma in the space between the substrate 606 and the showerhead 604. The plasma can assist in depositing various layers (not shown) on the substrate 606. In other applications, the plasma can be used to etch device features into various layers on the substrate 606. RF power is coupled through at least the substrate support assembly 608. The substrate support assembly 608 may have a heater built into it (not shown in Figure 6). The detailed design of the plasma-based processing chamber 602 may vary.

[0052] 7 is a perspective view 700 of an open multi-station processing module, in this case a QSM 702. One processing station 703 is visible in each quadrant of the QSM 702. Other numbers of stations are also possible. Each station 703 includes a substrate processing chamber 704. For clarity, components such as a substrate transfer paddle and top plate for forming a vacuum seal within the processing chamber 704 are not shown. Each processing chamber 704 is shown to include a substrate support assembly 706 (substrate not shown) and a paddle spindle 710.

[0053] Aluminum chamber ribs 708 are positioned between each of the processing chambers 704. In this example, the QSM 702 includes four chamber ribs 708. Other numbers of ribs 708 are also possible. Each chamber rib 708 extends radially away from the paddle spindle 710 from its inner end 712 to its outer end 714. A rib cover 716, described more fully below, covers each rib 708.

[0054] As mentioned above, in some substrate processes performed in the processing chamber of the QSM702, high defect counts may be observed along the edge of the processed substrate closest to the respective chamber ribs 708. Material deposited on the surfaces of the chamber ribs 708 is prone to redistribution to the surface of the processed substrate due to peeling or flaking of the deposited material. In some examples, the provision of a rib cover 716 addresses this issue. A ceramic rib cover 716 mounted over the ribs 708 can prevent or reduce material deposition on the surface below the ribs 708. Alternatively, deposits that may form on the rib cover 716 during substrate processing can be removed after multiple cycles to prevent (or minimize) the deposited material from falling onto the substrate. In some examples, due to the nature of the ceramic surface, the deposition rate of material on the rib cover 716 is lower than the rate that occurs on the aluminum surface below the ribs 708, and the deposited material may be more adhesive when adhering to the ceramic surface of the rib cover 716 than to the aluminum surface below the ribs 708.

[0055] 8A-8B show top and bottom perspective views of an exemplary rib cover 716. The rib cover 716 can be installed in a multi-station processing module, such as a QSM 702, to cover a chamber rib 708 disposed between two adjacent processing chambers 704 of the QSM 702.

[0056] The rib cover 716 includes a first (or support) portion 802 (also referred to as an upper portion) for supporting the rib cover 716 on the rib 708. The rib cover 716 further includes two side shields: a first side shield 804 and a second side shield 812. When installed, each side shield 804 and 812 covers a portion of the rib 708 between adjacent processing chambers 704, e.g., wall 718 in FIG. 7. In most instances, the covered portion of wall 718 is not necessarily part of the rib 708. Other wall or rib covering configurations are also possible. A set of four rib covers 716 can each cover a respective rib 708 of the QSM 702 in the manner shown in FIG. 7.

[0057] 8B , the exemplary rib cover 716 includes at least one spacer, in this case four spacers 806. Each spacer 806 holds a surface 808 (e.g., an inner surface) of the first portion 802, or surfaces 810 and 814 (e.g., inner surfaces) of the respective first and second side shields 804 and 812, away from a wall surface of the first processing chamber 704 or a wall of the rib 708.

[0058] In some examples, the first portion 802 of the rib cover 716 and the first and second side shields 804 and 812 define an open channel 816 for the rib cover 716. The volume of the channel 816 defined by the first portion 802 and the side shields 804 and 812 is configured to accommodate the first portion (also referred to as the upper portion) of the rib 708 when attached to the rib 708, for example, as shown in FIG. 7 . In some examples, the channel 816 includes a flared, open mouth 818. The engagement of the flared mouth 818 with the bifurcated radially inner end of the rib 708 (for example, as shown in FIG. 7 ) prevents further radially inward movement of the rib cover 716 relative to the rib 708 and the processing chamber 704 of the QSM 702.

[0059] In some examples, one or more of the spacers 806 are located within the channel 816. In some examples, the channel 816 is sized and configured to support or retain the rib cover 716 on the rib 708 by gravity alone. In this example, one or more of the spacers 806 can engage with the rib 708 with a loose fit or a snug fit. In some examples, the channel 816 is configured to support or retain the rib cover 716 on the rib 708 by frictional engagement between one or more of the spacers 806 and the rib 708 or the wall of the processing chamber 704.

[0060] The occurrence of certain undesirable defect counts during substrate processing is further discussed above. In some instances, QSM 702 performing an ashable hard mask (AHM) process observes high defect counts along the edge of the wafer closest to the aluminum chamber rib 708 in the processing or vacuum chamber. Deposits on the surface of the rib 708 are believed to be redistributed onto the processed substrate (e.g., wafer) by peeling or flaking. To help prevent this problem, some exemplary spacers are provided as "minimum contact" spacers 806, or mini-pads. In such instances, the mini-pads / spacers 806 are configured to reduce or minimize physical and / or thermal contact between the rib cover 716 and the rib 708 or the processing chamber wall to which the rib cover 716 is attached. The rib cover 716 is held away from the heat sink of the aluminum processing chamber 704. This reduced physical and / or thermal contact allows the rib cover 716 to heat up under parasitic plasma exposure, thereby preventing or reducing condensation of the AHM film and eliminating or mitigating this phenomenon as a defect source.

[0061] In some examples, the mini-pads / spacers 806 hold the surface of the channel 816 away from the ribs 708 or the walls of the processing chamber 704 by a separation distance. The separation distance can be in the range of 0.05 to 0.50 inches (approximately 1.27 to 12.7 mm). The separation distance may be selected within this range to optimize sensitivity quality, for example, to minimize potential electrical arcing across the space between the rib cover 716 and the ribs 708. The separation distance may also be selected to minimize the accumulation of debris or processing artifacts under the rib cover 716.

[0062] In some examples, the rib cover 716 is configured to be robust enough to withstand rough handling and multiple repeated installations to the processing chamber 704. Some examples are further configured to withstand repeated exposure to harsh substrate processing conditions. To this end, the cross-sectional thickness of the rib cover 716 or a portion of the channel 816, e.g., the cross-sectional thickness of the side shields 804 or 812, may be provided in the range of 0.25 to 0.70 inches (approximately 6.35 to 17.78 mm). In some examples, at least a portion of the rib cover comprises a ceramic material such as alumina. Other ceramics may also be acceptable.

[0063] Typically, the aluminum chamber of QSM 702 is water-cooled, but the selection of an appropriate ceramic material (in conjunction with placing a minimal contact spacer (such as mini-pad / spacer 806) within channel 816) allows the ceramic material of rib cover 716 to absorb most of the heat generated from the parasitic plasma, since the trapped heat is not conducted into aluminum processing chamber 704. This prevents film condensation and a more sticky adhesion of the deposition material to rib cover 716 rather than to the substrate being processed within chamber 704.

[0064] With reference to Figure 9, testing was performed on a QSM702 containing four stations, labeled STN1-4 in the schematic diagram. As shown, rib covers 716 were installed on two of the four ribs 708 of the QSM702, namely, between STN1 and STN2 and between STN2 and STN3. After testing, particle distributions on the wafer were identified for each station. A heavy particle distribution 902 can be observed in the substrate area adjacent to the uncovered ribs 708. A much lighter particle distribution 904 can be observed in the substrate area adjacent to the covered ribs 708, which are protected by the rib covers 716. This significantly improves defectivity performance on the wafer.

[0065] The provision of rib cover 716 may in some instances be considered a passive solution and therefore inherently low cost. Rib cover 716 may be easily installed on new tools without requiring removal of existing hardware and may also be retrofitted to tools in the field. In some instances, the provision of rib cover 716 does not affect existing process recipes, in other words, it is recipe transparent.

[0066] Some examples of the present disclosure include method embodiments. Referring to FIG. 10 , exemplary operations for a method 1000 of operating a multi-station processing module having a rib disposed between adjacent chambers of the processing module are provided. Method 1000 includes, in operation 1002, providing a rib cover for the rib, the rib cover including a first portion (also referred to as an upper portion) for supporting the rib cover on the rib, a first side shield that covers a first wall of the rib when the rib cover is attached, and at least one spacer that holds a first surface of the rib cover away from the covered rib; and, in operation 1004, attaching the rib cover to the rib. Method 1000 can further include, in operation 1006, removing residual deposits from the rib cover between processing cycles of the processing module.

[0067] While examples have been described with reference to certain exemplary embodiments or methods, it will be apparent that various modifications and changes can be made to these embodiments without departing from the broader scope of the present embodiments. Accordingly, the specification and drawings are to be considered in an illustrative and not a restrictive sense. The accompanying drawings, which form a part of this specification, show, by way of example, and not by way of limitation, specific embodiments in which the subject matter may be practiced. The illustrated embodiments are described in sufficient detail to enable those skilled in the art to practice the teachings disclosed herein. Other embodiments may be utilized, and other embodiments may be derived from the teachings disclosed herein, such that structural and logical substitutions and changes can be made without departing from the scope of the present disclosure. Therefore, this detailed description is not to be construed in a limiting sense, and the scope of various embodiments is defined only by the appended claims, along with the full range of equivalents to which such claims are entitled.

[0068] Although such embodiments of the inventive subject matter may be individually and / or collectively referred to herein by the term "invention," this is merely a matter of convenience and is not intended to voluntarily limit the scope of this application to any single invention or inventive concept (if more than one is disclosed). Accordingly, although specific embodiments have been illustrated and described herein, it should be understood that any configuration calculated to achieve the same purpose may be substituted for the specific embodiment shown. The present disclosure is intended to cover any and all adaptations or modifications of the various embodiments. Combinations of the above embodiments with other embodiments not specifically described herein will be apparent to those of skill in the art upon reviewing the above description.

[0069] While examples have been described with reference to certain exemplary embodiments or methods, it will be apparent that various modifications and changes can be made to these embodiments without departing from the broader scope of the present embodiments. Accordingly, the specification and drawings are to be considered in an illustrative and not a restrictive sense. The accompanying drawings, which form a part of this specification, show, by way of example, and not by way of limitation, specific embodiments in which the subject matter may be practiced. The illustrated embodiments are described in sufficient detail to enable those skilled in the art to practice the teachings disclosed herein. Other embodiments may be utilized, and other embodiments may be derived from the teachings disclosed herein, such that structural and logical substitutions and changes can be made without departing from the scope of the present disclosure. Therefore, this detailed description is not to be construed in a limiting sense, and the scope of various embodiments is defined only by the appended claims, along with the full range of equivalents to which such claims are entitled.

[0070] Although such embodiments of the inventive subject matter may be individually and / or collectively referred to herein by the term "invention," this is merely a matter of convenience and is not intended to voluntarily limit the scope of this application to any single invention or inventive concept (if more than one is disclosed). Accordingly, although specific embodiments have been illustrated and described herein, it should be understood that any configuration calculated to achieve the same purpose may be substituted for the specific embodiment shown. The present disclosure is intended to cover any and all adaptations or modifications of the various embodiments. Combinations of the above embodiments with other embodiments not specifically described herein will be apparent to those of skill in the art upon reviewing the above description.

Claims

1. 1. A ribbed cover for a multi-station processing module, comprising: a first portion configured to support the rib cover on a rib of the multi-station processing module, the rib being positioned between adjacent processing chambers of the multi-station processing module; a first side shield configured to cover a first wall of the rib; at least one spacer configured to hold an inner surface of the first portion away from the rib; Ribbed cover.

2. 2. The rib cover according to claim 1, The rib cover further comprises a second side shield that covers a second wall of the rib when the rib cover is attached.

3. 3. The rib cover according to claim 2, The first portion of the rib cover and the first and second side shields define a channel for the rib cover.

4. 4. The rib cover according to claim 3, The channel includes a flared opening.

5. 5. The rib cover according to claim 4, A rib cover, wherein engagement of the flared opening and the rib prevents radial movement of the rib cover relative to the process module.

6. 4. The rib cover according to claim 3, The rib cover, wherein the channel is configured to support or hold the rib cover on the rib by gravity alone.

7. 4. The rib cover according to claim 3, The at least one spacer is positioned within the channel, and the channel is configured to support or retain the rib cover on the rib by a slip fit or frictional engagement between the at least one spacer and the rib.

8. 4. The rib cover according to claim 3, The at least one spacer is configured to minimize thermal contact between the rib cover and the rib.

9. 9. The rib cover according to claim 8, A rib cover, wherein the separation distance between the rib cover and the rib is in the range of 0.05 to 0.50 inches (approximately 1.27 to 12.7 mm).

10. 4. The rib cover according to claim 3, A rib cover, wherein the cross-sectional thickness of the rib cover or the channel ranges from 0.25 to 0.70 inches (approximately 6.35 to 17.78 mm).

11. 2. The rib cover according to claim 1, A rib cover, wherein at least a portion of the rib cover comprises a ceramic material.

12. 1. A multi-station processing module, comprising: A rib cover, a first portion configured to support the rib cover on a rib of the multi-station processing module, the rib being positioned between adjacent processing chambers of the multi-station processing module; a first side shield configured to cover a first wall of the rib; at least one spacer configured to hold an inner surface of the first portion away from the rib; Ribbed cover A multi-station processing module comprising:

13. 13. A multi-station processing module according to claim 12, comprising: The rib cover further comprises a second side shield covering a second wall of the rib when the rib cover is attached.

14. 14. A multi-station processing module according to claim 13, comprising: The first portion of the rib cover and the first and second side shields define a channel for the rib cover.

15. 15. The multi-station processing module of claim 14, The channel includes a flared outlet.

16. 16. A multi-station processing module according to claim 15, comprising: The multi-station processing module, wherein engagement of the flared mouth and the rib prevents radial movement of the rib cover relative to the processing module.

17. 15. The multi-station processing module of claim 14, A multi-station processing module, wherein the channel is configured to support or retain the rib cover on the rib solely by gravity.

18. 15. The multi-station processing module of claim 14, the at least one spacer is positioned within the channel, the channel configured to support or retain the rib cover on the rib by a slip fit or frictional engagement between the at least one spacer and the rib.

19. 15. The multi-station processing module of claim 14, The at least one spacer is configured to minimize thermal contact between the rib cover and the rib.

20. 20. The multi-station processing module of claim 19, A multi-station processing module, wherein the separation distance between the rib cover and the rib ranges from 0.05 to 0.50 inches (approximately 1.27 to 12.7 mm).

21. 15. The multi-station processing module of claim 14, A multi-station processing module, wherein the cross-sectional thickness of the rib cover or the channel ranges from 0.25 to 0.70 inches (approximately 6.35 to 17.78 mm).

22. 13. A multi-station processing module according to claim 12, comprising: At least a portion of the rib cover comprises a ceramic material.

23. 1. A method of operating a multi-station processing module, comprising: providing a rib cover for the rib, said rib cover comprising: a first portion configured to support the rib cover on a rib of the multi-station processing module, the rib being positioned between adjacent processing chambers of the multi-station processing module; a first side shield covering a portion of a wall of a first processing chamber of the adjacent processing chamber of the multi-station processing module; and at least one spacer configured to hold a first surface of the first portion or a surface of the first side shield away from a surface of the wall of the first processing chamber of the processing module; and attaching the rib cover to the rib; A method comprising:

24. 24. The method of claim 23, The method further includes removing residual deposits from the rib cover between processing cycles of the processing module.

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