Conductivity enhancer

Abstract

The present invention provides a composition that includes an organic phosphorous compound and is for improving the conductivity of a conductive polymer including a metal component. The present invention also provides: a conductive material that includes a polymer matrix, metal, and an organic phosphorous compound; and a production method therefor. The present invention also provides a sintering promoter for metal components, that includes an organic phosphorous compound.

Description

[Technical Field]

[0001] The present disclosure relates to compositions for enhancing the electrical conductivity of conductive polymers, and more particularly to conductivity enhancers comprising organophosphorus compounds. [Background technology]

[0002] Various improvements have been made to conductive materials and conductors, but currently available conductive materials are limited to those containing specific combinations of conductive components and substrates. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2019-102719 [Patent Document 2] International Publication No. 2015 / 099049 [Patent Document 3] International Publication No. 2019 / 039511 [Patent Document 4] International Publication No. 2017 / 163615 [Patent Document 5] Japanese Patent Application Publication No. 2017-183207 Summary of the Invention [Means for solving the problem]

[0004] The present disclosure provides a conductive material that includes a desired combination of a conductive component and a substrate.

[0005] The present disclosure provides, for example:

[0006] (Item 1) A composition for improving the conductivity of a conductive polymer containing a metal-based component, comprising an organophosphorus compound. (Item 2) The composition according to the above item, wherein the organophosphorus compound contains trivalent phosphorus. (Item 3) The composition according to any one of the above items, wherein the organophosphorus compound is a phosphine substituted with an alkyl, cycloalkyl, or aryl. (Item 4) The composition according to any one of the above items, wherein the organophosphorus compound is one or a combination of two or more phosphines selected from the group consisting of tributylphosphine, trioctylphosphine, triphenylphosphine, tri(o-tolyl)phosphine, cyclohexyldiphenylphosphine, 1,2-bis(diphenylphosphino)ethane, and tricyclohexylphosphine. (Item 4a) The composition according to any one of the preceding items, wherein the organophosphorus compound is triphenylphosphine. (Item 5) The composition according to any one of the above items, wherein the metal-based component is a metal, a metal oxide, a metal carbide, a metal sulfide, or a combination thereof. (Item 6) The composition according to any one of the above items, wherein the metal comprises silver, copper, gold, aluminum, zinc, nickel, tin, and / or iron. (Item 6a) The composition according to any one of the above items, wherein the metal is silver. (Item 7) The composition according to any one of the above items, wherein the metal oxide is one or a combination of two or more oxides selected from the group consisting of alumina, tin oxide, indium oxide, zinc oxide, indium-tin oxide, and antimony-tin oxide. (Item 8) The composition according to any one of the above items, wherein the metal carbide is one or a combination of two or more carbides selected from the group consisting of tungsten carbide, titanium carbide, molybdenum carbide, tantalum carbide, niobium carbide, vanadium carbide, and zirconium carbide. (Item 9) The composition according to any one of the above items, wherein the metal-based component is a particle having a particle diameter of 1 μm to 100 μm. (Item 10) The composition according to any one of the above items, wherein the polymer matrix in the conductive polymer is a (meth)acrylic polymer, a urethane polymer, an olefin polymer, or an epoxy polymer. (Item 10a) The composition according to any one of the above items, wherein the polymer matrix in the conductive polymer is a (meth)acrylic polymer. (Item 11) The composition according to any one of the above items, wherein the polymer matrix in the conductive polymer is a homopolymer containing one type of monomer component or a copolymer containing two to three types of monomer components. (Item 11a) The composition according to any one of the above items, wherein the polymer matrix in the conductive polymer is a homopolymer. (Item 12) The monomer component of the polymer matrix is represented by the formula (1) [ka] wherein: R 1 is a hydrogen atom or a methyl group, R 2 is a hydrogen atom, a substituted or unsubstituted alkyl group, a substituted or unsubstituted cycloalkyl group, a substituted or unsubstituted non-aryl heterocycloalkyl group, a substituted or unsubstituted aryl group, or a substituted or unsubstituted heteroaryl group; The composition according to any one of the preceding paragraphs. (Section 12a)R 1 is a hydrogen atom. (Section 12b)R 2 is a hydrogen atom or a substituted or unsubstituted alkyl group. (Section 12c)R 2 is a hydrogen atom or a substituted or unsubstituted C 1~6 The composition according to any one of the preceding claims, wherein the group is an alkyl group. (Section 12d)R 2 The composition of any one of the preceding claims, wherein is ethyl. (Item 13) Sintering accelerators for metal-based components, including organophosphorus compounds. (Item 14) A sintering accelerator according to any one of the preceding items, comprising one or more of the features described in the preceding items. (Item 15) A conductive material comprising a polymer matrix, a metal, and an organic phosphorus compound. (Item 16) The conductive material according to any one of the above items, wherein the organic phosphorus compound contains trivalent phosphorus. (Item 17) The conductive material according to any one of the above items, wherein the organic phosphorus compound is a phosphine substituted with an alkyl, cycloalkyl, or aryl. (Item 17a) The conductive material according to any one of the above items, wherein the organic phosphorus compound is one phosphine selected from the group consisting of tributylphosphine, trioctylphosphine, triphenylphosphine, tri(o-tolyl)phosphine, cyclohexyldiphenylphosphine, 1,2-bis(diphenylphosphino)ethane, and tricyclohexylphosphine, or a combination of two or more phosphines. (Item 17b) The conductive material according to any one of the above items, wherein the organic phosphorus compound is triphenylphosphine. (Item 18) The conductive material according to any one of the above items, wherein the metal comprises silver, copper, gold, aluminum, zinc, nickel, tin, and / or iron. (Item 18a) The conductive material according to any one of the above items, wherein the metal is silver. (Item 19) The conductive material according to any one of the above items, wherein the metal is in the form of particles having a particle diameter of 1 μm to 100 μm. (Item 20) The conductive material according to any one of the above items, wherein the polymer matrix is an acrylic polymer, a urethane polymer, an olefin polymer, or an epoxy polymer. (Item 20a) The conductive material according to any one of the above items, wherein the polymer matrix is a (meth)acrylic polymer. (Item 21) The conductive material according to any one of the above items, wherein the polymer matrix is a homopolymer containing one type of monomer component or a copolymer containing two or three types of monomer components. (Item 21a) The conductive material according to any one of the above items, wherein the polymer matrix is a homopolymer. (Item 22) The monomer component of the polymer matrix is represented by the formula (1) [ka] wherein: R 1 is a hydrogen atom or a methyl group, R 2 is a hydrogen atom, a substituted or unsubstituted alkyl group, a substituted or unsubstituted cycloalkyl group, a substituted or unsubstituted non-aryl heterocycloalkyl group, a substituted or unsubstituted aryl group, or a substituted or unsubstituted heteroaryl group; The conductive material according to any one of the above items. (Section 22a)R 1 is a hydrogen atom. (Section 22b)R 2 is a hydrogen atom or a substituted or unsubstituted alkyl group. (Section 22c)R 2 is a hydrogen atom or a substituted or unsubstituted C 1~6 Item 10. The conductive material according to any one of the preceding items, wherein the conductive material is an alkyl group. (Section 22d)R 2 The conductive material according to any one of the preceding items, wherein is ethyl. (Item 23) The conductive material according to any one of the above items, wherein the conductive material further contains a dispersant. (Item 24) The conductive material according to any one of the above items, wherein the dispersant is 2-(2-butoxyethoxy)ethanol. (Item 25) A conductive material according to any one of the preceding items, including one or more of the features described in the preceding items. (Item 26) A method for producing a conductive material, the method comprising: heating a mixture comprising a polymer matrix, a metal, and an organophosphorus compound to form a conductive material; method. (Item 26a) A method for improving the conductivity of a conductive polymer containing a metal, the method comprising heating a mixture containing a polymer matrix, the metal, and an organophosphorus compound to produce a conductive polymer containing the metal; method. (Item 27) The method according to any one of the above items, wherein the heating temperature is 80°C to 150°C. (Item 28) The method according to any one of the above items, wherein the heating temperature is 100°C to 140°C. (Item 29) The method according to any one of the above items, wherein the heating time is 10 to 50 minutes. (Item 30) The method of any one of the preceding items, further comprising adding a dispersant to the mixture before heating. (Item 31) A method according to any one of the preceding items, comprising one or more of the features described in the preceding items.

[0007] The present disclosure also provides, for example:

[0008] (Item A1) A composition for improving the conductivity of a conductive polymer containing a metal-based component, comprising an organic phosphorus compound. (Item A2) The composition according to the preceding item, wherein the organophosphorus compound contains trivalent phosphorus. (Item A3) The composition of any one of the preceding items, wherein the organophosphorus compound is an alkyl-, cycloalkyl-, or aryl-substituted phosphine. (Item A4a) The composition of any one of the preceding items, wherein the organophosphorus compound is one or a combination of two or more phosphines selected from the group consisting of tributylphosphine, trioctylphosphine, triphenylphosphine, tri(o-tolyl)phosphine, cyclohexyldiphenylphosphine, 1,2-bis(diphenylphosphino)ethane, and tricyclohexylphosphine. (Item A4b) The composition according to any one of the preceding items, wherein the organophosphorus compound is triphenylphosphine. (Item A5) The composition of any one of the preceding items, wherein the metal-based component is a metal, a metal oxide, a metal carbide, a metal sulfide, or a combination thereof. (Item A6a) The composition of any one of the preceding items, wherein the metal comprises silver, copper, gold, aluminum, zinc, nickel, tin, and / or iron. (Item A6b) The composition according to any one of the preceding items, wherein the metal is silver. (Item A7) The composition according to any one of the preceding items, wherein the metal oxide is one or a combination of two or more oxides selected from the group consisting of alumina, tin oxide, indium oxide, zinc oxide, indium tin oxide, and antimony tin oxide. (Item A8) The composition of any one of the preceding items, wherein the metal carbide is one or a combination of two or more carbides selected from the group consisting of tungsten carbide, titanium carbide, molybdenum carbide, tantalum carbide, niobium carbide, vanadium carbide, and zirconium carbide. (Item A9) The composition according to any one of the preceding items, wherein the metal-based component is a particle having a particle size of 1 μm to 100 μm. (Item A10a) The composition of any one of the preceding items, wherein the polymer matrix in the conductive polymer is a (meth)acrylic polymer, a urethane polymer, an olefin polymer, an epoxy polymer, or a styrene-butadiene polymer. (Item A10b) The composition according to any one of the above items, wherein the polymer matrix in the conductive polymer is a (meth)acrylic polymer. (Item A11a) The composition according to any one of the preceding items, wherein the polymer matrix in the conductive polymer is a homopolymer containing one type of monomer component or a copolymer containing two to three types of monomer components. (Item A11b) The composition according to any one of the preceding items, wherein the polymer matrix in the conductive polymer is a homopolymer. (Item A12a) The monomer component of the polymer matrix is represented by the formula (1) [ka] wherein: R 1 is a hydrogen atom or a methyl group, R 2is a hydrogen atom, a substituted or unsubstituted alkyl group, a substituted or unsubstituted cycloalkyl group, a substituted or unsubstituted non-aryl heterocycloalkyl group, a substituted or unsubstituted aryl group, or a substituted or unsubstituted heteroaryl group; Item 10. The composition of any one of the preceding items. (Section A12b)R 1 is a hydrogen atom. (Section A12c)R 2 is a hydrogen atom or a substituted or unsubstituted alkyl group. (Section A12d)R 2 is a hydrogen atom or a substituted or unsubstituted C 1~6 The composition according to any one of the preceding claims, wherein the group is an alkyl group. (Section A12e)R 2 The composition of any one of the preceding claims, wherein is ethyl. (Item A13) Sintering accelerators for metallic components, including organophosphorus compounds. (Item A14) A sintering accelerator according to any one of the preceding items, including one or more features of the preceding items. (Item A15) A conductive material comprising a polymer matrix, a metal, and an organic phosphorus compound. (Item A16) The conductive material according to any one of the preceding items, wherein the organic phosphorus compound contains trivalent phosphorus. (Item A17a) The conductive material according to any one of the preceding items, wherein the organophosphorus compound is a phosphine substituted with an alkyl, cycloalkyl, or aryl. (Item A17b) The conductive material according to any one of the above items, wherein the organic phosphorus compound is one phosphine selected from the group consisting of tributylphosphine, trioctylphosphine, triphenylphosphine, tri(o-tolyl)phosphine, cyclohexyldiphenylphosphine, 1,2-bis(diphenylphosphino)ethane, and tricyclohexylphosphine, or a combination of two or more phosphines. (Item A17c) The conductive material according to any one of the above items, wherein the organic phosphorus compound is triphenylphosphine. (Item A18) The conductive material according to any one of the preceding items, wherein the metal comprises silver, copper, gold, aluminum, zinc, nickel, tin, and / or iron. (Item A18a) The conductive material according to any one of the above items, wherein the metal is silver. (Item A19) The conductive material according to any one of the preceding items, wherein the metal is in the form of particles having a particle diameter of 1 μm to 100 μm. (Item A20a) The conductive material according to any one of the preceding items, wherein the polymer matrix is an acrylic polymer, a urethane polymer, an olefin polymer, an epoxy polymer, or a styrene-butadiene polymer. (Item A20b) The conductive material according to any one of the above items, wherein the polymer matrix is a (meth)acrylic polymer. (Item A21a) The conductive material according to any one of the preceding items, wherein the polymer matrix is a homopolymer containing one type of monomer component or a copolymer containing two or three types of monomer components. (Item A21b) The conductive material according to any one of the above items, wherein the polymer matrix is a homopolymer. (Item A22a) The monomer component of the polymer matrix is represented by the formula (1) [ka] wherein: R 1 is a hydrogen atom or a methyl group, R 2 is a hydrogen atom, a substituted or unsubstituted alkyl group, a substituted or unsubstituted cycloalkyl group, a substituted or unsubstituted non-aryl heterocycloalkyl group, a substituted or unsubstituted aryl group, or a substituted or unsubstituted heteroaryl group; Item 10. The conductive material according to any one of the preceding items. (Section A22b)R 1 is a hydrogen atom. (Section A22c)R 2is a hydrogen atom or a substituted or unsubstituted alkyl group. (Section A22d)R 2 is a hydrogen atom or a substituted or unsubstituted C 1~6 Item 10. The conductive material according to any one of the preceding items, wherein the conductive material is an alkyl group. (Section A22e)R 2 The conductive material according to any one of the preceding items, wherein is ethyl. (Item A23) The conductive material according to any one of the preceding items, wherein the conductive material further comprises a dispersant. (Item A24) The conductive material according to any one of the preceding items, wherein the dispersant is 2-(2-butoxyethoxy)ethanol. (Item A25) A conductive material according to any one of the preceding items, including one or more features according to the preceding items. (Item A26a) A method for producing a conductive material, the method comprising: heating a mixture comprising a polymer matrix, a metal, and an organophosphorus compound to form a conductive material; method. (Item A26b) A method for improving the conductivity of a conductive polymer containing a metal, the method comprising heating a mixture containing a polymer matrix, the metal, and an organophosphorus compound to produce a conductive polymer containing the metal. method. (Item A27) The method according to any one of the preceding items, wherein the heating temperature is 80°C to 150°C. (Item A28) The method according to any one of the preceding items, wherein the heating temperature is 100°C to 140°C. (Item A29) The method according to any one of the preceding items, wherein the heating time is 10 to 50 minutes. (Item A30) The method of any one of the preceding items, including adding a dispersing agent to the mixture before heating. (Item A31) A method according to any one of the preceding items, including one or more features of the preceding items.

[0009] It is contemplated that the present disclosure may provide one or more of the above-described features in combinations other than those explicitly stated. Still further embodiments and advantages of the present disclosure will be recognized by those skilled in the art upon reading and understanding the following detailed description, if necessary. [Effects of the Invention]

[0010] The present disclosure provides a conductivity improver, and by using the conductivity improver, a technique can be provided that can improve conductivity. DETAILED DESCRIPTION OF THE INVENTION

[0011] The present disclosure will now be described, illustrating the best mode thereof. Throughout this specification, singular expressions should be understood to include the plural concept unless otherwise specified. Thus, singular articles (e.g., "a," "an," "the," etc. in English) should be understood to include the plural concept unless otherwise specified. Furthermore, terms used in this specification should be understood to have the meaning commonly used in the art unless otherwise specified. Therefore, unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. In the event of conflict, the present specification (including definitions) will prevail.

[0012] The following provides definitions of terms particularly used in this specification and / or explains basic technical content as appropriate.

[0013] (Definition of terms) In this specification, the term "electrical conductivity" is used in the usual sense in the relevant field to refer to the property of conducting electricity, and this physical property is called "conductivity," which is defined as the reciprocal of the resistivity (specific resistance, also called volume resistivity in the resin field) of a certain object (also called a conductor). In this specification, conductivity (or resistivity) is measured as follows. Specifically, unless otherwise specified, the value measured is taken by cutting the object to be measured (for example, a film, etc.) into a piece 0.5 cm long x 2.00 cm wide x 0.2 cm thick and measuring it using a four-terminal measurement method (for example, but not limited to, a Loresta GP (manufactured by Mitsubishi Chemical Analytech Co., Ltd.)).

[0014] As used herein, the term "conductive material" refers to any material that is electrically conductive. As used herein, a conductive material is defined as a material having a conductivity of 1.0×10 -1 Ω cm or less, usually 1.0×10 -2 Ω·cm or less, preferably 1.0×10 -3 The conductive material includes, but is not limited to, a material having a resistivity of Ω·cm or less. The conductive material contains a conductive component that provides conductivity. Typically, the conductive material is generally composed of a base material and a conductive component.

[0015] As used herein, a "phosphine" is a trivalent phosphorus compound represented by R3P, where each R is independently hydrogen or any optionally substituted alkyl, cycloalkyl, aryl, non-aryl heterocycloalkyl, or heteroaryl, etc.

[0016] As used herein, the term "organophosphorus compound" is used in the usual sense in the art as a general term for organic compounds containing phosphorus, and includes those in which the phosphorus atom is directly bonded to a carbon atom and those in which it is bonded as a phosphate ester. Organic compounds containing a carbon-phosphorus bond are generally used. Representative examples of the organophosphorus compound include those containing trivalent phosphorus, such as phosphines substituted with alkyl, cycloalkyl, or aryl, but are not limited to these. For example, one or a combination of two or more phosphines selected from the group consisting of tributylphosphine, trioctylphosphine, triphenylphosphine, tri(o-tolyl)phosphine, cyclohexyldiphenylphosphine, 1,2-bis(diphenylphosphino)ethane, and tricyclohexylphosphine can be used, particularly triphosphine.

[0017] As used herein, the term "improving conductivity" refers to a significant increase in conductivity when a component of the present disclosure is added to a conductive component or material compared to before the addition, and refers to an improvement in conductivity of at least about 1%, about 2%, about 3%, about 4%, about 5%, about 6%, about 7%, about 8%, about 9%, about 10%, about 15%, about 20%, about 25%, about 30%, about 35%, about 40%, about 45%, about 50%, about 55%, about 60%, about 65%, about 70%, about 75%, about 80%, about 85%, about 90%, about 95%, or about 99%, which can also be expressed in terms of a decrease in volume resistivity. For example, this means that the volume resistivity is reduced by about 1%, about 2%, about 3%, about 4%, about 5%, about 6%, about 7%, about 8%, about 9%, about 10%, about 15%, about 20%, about 25%, about 30%, about 35%, about 40%, about 45%, about 50%, about 55%, about 60%, about 65%, about 70%, about 75%, about 80%, about 85%, about 90%, about 95%, or about 99% compared to a comparison object.

[0018] As used herein, the term "reducing the sintering temperature" means that when a component of the present disclosure is added to a conductive component or material, the same or lower volume resistivity can be achieved even when heated at a lower temperature than when the component is not added. For example, the term "reducing the sintering temperature" means reducing the sintering temperature by at least about 1%, about 2%, about 3%, about 4%, about 5%, about 6%, about 7%, about 8%, about 9%, about 10%, about 15%, about 20%, about 25%, about 30%, about 35%, about 40%, about 45%, about 50%, about 55%, about 60%, about 65%, about 70%, about 75%, about 80%, about 85%, about 90%, about 95%, or about 99%.

[0019] In this specification, the term "substrate" is also referred to as "matrix" and refers to the fundamental part of the structure of a conductive material. Various polymers can be used as the substrate. When the substrate is a polymer, the substrate may be called a "polymer matrix." The polymer matrix may be a homopolymer containing one type of monomer component or a copolymer containing two or three types of monomer components, and a (meth)acrylic polymer or the like can be used.

[0020] For example, the monomer component of the polymer matrix may be represented by the formula (1) [ka] wherein R 1 is a hydrogen atom or a methyl group, and R 2 may be a compound in which is a hydrogen atom, a substituted or unsubstituted alkyl group, a substituted or unsubstituted cycloalkyl group, a substituted or unsubstituted non-aryl heterocycloalkyl group, a substituted or unsubstituted aryl group, or a substituted or unsubstituted heteroaryl group.

[0021] In this specification, the term "metal-based component" refers to a component that contains metal atoms as its constituent elements in some form, and is a concept that encompasses metal components such as metals, as well as components derived from metals (e.g., metal oxides, metal carbides, metal sulfides, etc.), and combinations of these.

[0022] As used herein, the term "metallic component" includes metals or alloys, such as silver, copper, gold, aluminum, zinc, nickel, tin, and / or iron.

[0023] Examples of metal oxides include alumina, tin oxide, indium oxide, zinc oxide, indium-tin oxide, and antimony-tin oxide.

[0024] Examples of metal carbides include tungsten carbide, titanium carbide, molybdenum carbide, tantalum carbide, niobium carbide, vanadium carbide, and zirconium carbide.

[0025] In this specification, the terms "particle size" and "particle diameter" of a metal-based component are used interchangeably and refer to the average particle diameter d50, which can be measured using a commercially available laser diffraction particle size distribution analyzer or the like. The particle diameter also applies to non-spherical shapes, and in the case of non-spherical shapes, it refers to the particle diameter when converted into a spherical shape. Shapes other than spherical may include any shape such as scales or needles.

[0026] In this specification, the term "conductive polymer" refers to a polymer that is conductive, as well as a polymer that is conductive as a whole when mixed with other components, and preferably has a resistivity of 1.0×10 -3 A conductive polymer is a material with a resistivity of Ω·cm or less. A typical example of a conductive polymer is a mixture of a polymer matrix and a metal-based component. Conductive polymers are sometimes called conductive polymer compositions.

[0027] In this specification, the term "(meth)acrylic monomer" refers to a monomer containing an acrylic group and / or a methacrylic group, and examples thereof include acrylic acid, methacrylic acid, acrylic acid esters, methacrylic acid esters, acrylic acid amides, and methacrylic acid amides.

[0028] As used herein, "(meth)acrylic" means "acrylic" or "methacrylic", and "(meth)acrylate" means "acrylate" or "methacrylate".

[0029] In this specification, "urethane-based polymer" refers to a polymer having a urethane bond (-OC(=O)NH-). A typical example is one obtained by reacting a polyol with a diisocyanate. In this specification, urethane-based polymers may also be referred to as "urethane-based resins" or "urethane resins."

[0030] In this specification, an "olefin-based polymer" is a polymer produced by polymerization of a hydrocarbon monomer (typically, an alkene) having one or more double bonds. Specific examples include polyethylene, polypropylene, and polystyrene. In this specification, an olefin-based polymer may also be referred to as an "olefin-based resin" or "olefin resin."

[0031] In this specification, "epoxy-based polymer" refers to a thermosetting resin that can be cured by forming a crosslinked network using epoxy groups remaining in the polymer. Epoxy-based polymers include prepolymers before crosslinking and resins obtained by mixing a prepolymer with a curing agent and subjecting it to a thermal curing treatment. Epoxy-based polymers may also be referred to as "epoxy-based resins" or "epoxy resins" in this specification.

[0032] As used herein, "styrene-butadiene polymer" refers to a copolymer formed by copolymerization of styrene and butadiene monomers. Styrene-butadiene polymers may also be referred to as "styrene-butadiene resins" or "styrene-butadiene resins."

[0033] In this specification, the term "substitutable number" refers to the maximum number of hydrogen atoms that can be substituted when hydrogen atoms of a group are substituted with a substituent, provided that the resulting group is chemically stable.

[0034] In this specification, the term "alkyl group" refers to a monovalent group formed by removing one hydrogen atom from an aliphatic hydrocarbon (alkane) such as methane, ethane, or propane, and is generally C n H 2n+1 - (where n is a positive integer). The alkyl group may be a straight chain or a branched chain. 1~4 Examples of alkyl groups include methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, tert-butyl, and sec-butyl groups, but the present disclosure is not limited to these examples. 1~6 As the alkyl group, for example, C 1~4 Examples of the alkyl group include an alkyl group, an n-pentyl group, an isoamyl group, an n-hexyl group, and an isohexyl group, but the present disclosure is not limited to these examples. 1~10 As the alkyl group, for example, C 1~6 Examples of the alkyl group include an alkyl group having 1 to 18 carbon atoms, an n-octyl group, an n-nonyl group, an isononyl group, a branched nonyl group, an n-decanyl group, and an isodecyl group, but the present disclosure is not limited to these examples. 1~18 As the alkyl group, for example, C 1~10 Examples of such groups include alkyl groups, undecyl groups, lauryl groups, tridecyl groups, myristyl groups, pentadecyl groups, palmityl groups, heptadecyl groups, stearyl groups, and isostearyl groups, but the present disclosure is not limited to these examples.

[0035] In this specification, the term "alkenyl group" refers to a monovalent group generated by removing one hydrogen atom from an aliphatic hydrocarbon (alkene) containing at least one double bond, such as ethene, propene, or butene, and is generally C m H 2m-1(where m is an integer of 2 or greater). The alkenyl group may be linear or branched. Examples of alkenyl groups having 2 to 6 carbon atoms include ethenyl, 1-propenyl, 2-propenyl, butenyl, pentenyl, and hexenyl groups, but the present disclosure is not limited to these examples. Examples of alkenyl groups having 2 to 10 carbon atoms include alkenyl groups having 2 to 6 carbon atoms, heptenyl, octenyl, nonenyl, and decenyl groups, but the present disclosure is not limited to these examples.

[0036] In this specification, the term "alkoxy group" refers to a monovalent group generated by the loss of a hydrogen atom from the hydroxy group of an alcohol, and generally refers to a C n H 2n+1 O- (where n is an integer of 1 or more). Examples of the alkoxy group having 1 to 6 carbon atoms include a methoxy group, an ethoxy group, an n-propyloxy group, an isopropyloxy group, an n-butyloxy group, an isobutyloxy group, a tert-butyloxy group, a sec-butyloxy group, an n-pentyloxy group, an isoamyloxy group, an n-hexyloxy group, and an isohexyloxy group, but the present disclosure is not limited to these examples.

[0037] As used herein, the term "haloalkyl group" refers to an alkyl group in which one or more hydrogen atoms on the alkyl group are substituted with halogen atoms. The term "perhaloalkyl" refers to an alkyl group in which all hydrogen atoms on the alkyl group are substituted with halogen atoms. A haloalkyl group (C 1-6Examples of haloalkyl groups include trifluoromethyl, trifluoroethyl (e.g., 2,2,2-trifluoroethyl), perfluoroethyl, trifluoro-n-propyl, tetrafluoropropyl (e.g., 2,2,3,3-tetrafluoropropyl), perfluoro-n-propyl, trifluoroisopropyl, perfluoroisopropyl, trifluoro-n-butyl, perfluoro-n-butyl, trifluoroisobutyl, perfluoroisobutyl, trifluoro-tert-butyl, perfluoro-tert-butyl, trifluoro-n-pentyl, octafluoropentyl (e.g., 2,2,3,3,4,4,5,5-octafluoropentyl), perfluoro-n-pentyl, trifluoro-n-hexyl, and perfluoro-n-hexyl groups, but the present disclosure is not limited to these examples. 1-8 haloalkyl group) is C 1-6 Examples include haloalkyl groups, undecafluoro-n-heptyl groups, perfluoro-n-heptyl groups, tridecafluorooctyl groups (such as 3,3,4,4,5,5,6,6,7,7,8,8,8-tridecafluorooctyl groups), and perfluoro-n-octyl groups, but the present disclosure is not limited to these examples.

[0038] As used herein, the term "cycloalkyl group" refers to a monocyclic or polycyclic saturated hydrocarbon group, including those with a bridged structure. For example, "C 3-12 "Cycloalkyl group" means a cyclic alkyl group having 3 to 12 carbon atoms. 6-12 Specific examples of the cycloalkyl group include a cyclohexyl group, a cycloheptyl group, a cyclooctyl group, an adamantyl group, an isobornyl group, a 2-methyl-2-adamantyl group, and a 2-ethyl-2-adamantyl group, but the present disclosure is not limited to these examples. 5-12 Specific examples of the cycloalkyl group include a cyclopentyl group, C 6-12 Examples include cycloalkyl groups, but the present disclosure is not limited to these examples. 3-12Specific examples of the cycloalkyl group include a cyclopropyl group, a cyclobutyl group, and C 5-12 A cycloalkyl group is preferably used. 6-12 Examples of such a group include, but are not limited to, the present disclosure.

[0039] As used herein, the term "cycloalkenyl group" refers to a monocyclic or polycyclic unsaturated hydrocarbon group containing a double bond, and includes those with a bridged structure. Examples include those in which one or more carbon-carbon bonds of the above-mentioned "cycloalkyl group" are double bonds. For example, "C 3-12 The term "cycloalkenyl group" refers to a cyclic alkenyl group having 3 to 12 carbon atoms. 6-12 Examples of the "cycloalkenyl group" include a 1-cyclohexenyl group, a 2-cyclohexenyl group, a 3-cyclohexenyl group, a cycloheptenyl group, a cyclooctenyl group, and a cyclononenyl group. 3-12 In the case of "cycloalkyl group", cyclopropenyl group, cyclobutenyl group, cyclopentenyl group, C 6-12 A cycloalkenyl group and the like are preferred. 6-12 Examples include "cycloalkenyl groups", but the present disclosure is not limited to these examples.

[0040] As used herein, "non-aryl heterocycloalkyl" and "non-aryl heterocycle" refer to a cyclic group having 1 to 3 atoms of the same or different types selected from nitrogen, oxygen, and sulfur atoms within the ring. The group may contain one or more unsaturated bonds, but does not contain an aromatic group. For example, a "3- to 8-membered non-aryl heterocycloalkyl" refers to a non-aryl heterocycloalkyl having 3 to 8 ring atoms. Specific examples of "non-aryl heterocycloalkyl" include oxiranyl, oxetanyl, pyranyl, pyrrolidinyl, imidazolidinyl, piperidinyl, morpholinyl, thiomorpholinyl, hexamethyleneiminyl, thiazolidinyl, tetrahydrofuranyl, tetrahydropyridinyl, tetrahydropyranyl, 1,3-dioxolanyl, 1,3-dioxanyl, and 1,4-dioxanyl, but the present disclosure is not limited to these examples. The group also includes a heterocyclic group having a crosslinked structure.

[0041] As used herein, the term "aryl group" refers to a group formed by removing one hydrogen atom from the ring of an aromatic hydrocarbon. For example, a phenyl group (C6H5-) is formed from benzene, a tolyl group (CH3C6H4-) is formed from toluene, a xylyl group ((CH3)2C6H3-) is formed from xylene, and a naphthyl group (C 10 H8-) is induced. 6~14 The term "aryl group" means an aromatic hydrocarbon group having 6 to 14 carbon atoms. 6~14 Specific examples of the "aryl group" include a phenyl group, a 1-naphthyl group, a 2-naphthyl group, an azulenyl group, an acenaphthenyl group, an anthryl group, a fluorenyl group, a phenalenyl group, and a phenanthryl group. 6~18 Specific examples of the "aryl group" include C 6~14Examples of the aryl group include an aryl group, a benzo[a]anthryl group, a benzo[a]fluorenyl group, a benzo[c]phenanthryl group, a chrysenyl group, a fluoranthenyl group, a pyrenyl group, a tetracenyl group, and a triphenylenyl group. The arylthio group refers to an aryl-S- group. For example, a phenyl-S- group (phenylthio group) is included, but the present disclosure is not limited to these examples.

[0042] As used herein, the term "heteroaryl group" refers to a monocyclic or polycyclic heteroatom-containing aromatic group containing one or more (e.g., 1 to 4) heteroatoms, the same or different, selected from nitrogen, sulfur, and oxygen atoms. For example, a "5- to 18-membered heteroaryl group" refers to a heteroaryl group having 5 to 18 ring atoms. A "haloheteroaryl group" refers to a group in which one or more hydrogen atoms on the ring atoms are substituted with halogen. Specific examples of "heteroaryl groups" include pyrrolyl, thienyl, benzothienyl, benzofuranyl, benzoxazolyl, benzothiazolyl, furyl, oxazolyl, thiazolyl, isoxazolyl, isothiazolyl, benzoisoxazolyl, benzoisothiazolyl, imidazolyl, pyrazolyl, pyridyl, pyrazyl, pyrimidyl, pyridazyl, quinolyl, and isoquinolyl. Examples of such groups include a triazolyl group, a triazinyl group, a tetrazolyl group, an indolyl group, an imidazo[1,2-a]pyridyl group, a pyrazolo[1,5-a]pyridyl group, a [1,2,4]triazolo[1,5-a]pyridyl group, a benzimidazolyl group, a quinoxalyl group, a cinnolyl group, a quinazolyl group, an indazolyl group, a naphthyridyl group, a quinolinolyl group, and an isoquinolinolyl group, but the present disclosure is not limited to these examples.

[0043] Generally, the term "substituted" refers to the replacement of one or more hydrogen radicals in a given structure with the radical of a particular substituent. It is recognized that the phrase "optionally substituted" is used interchangeably with the phrase "unsubstituted or substituted." For example, "C 1~10 C optionally substituted with alkyl group 6~18"Aryl group" means "unsubstituted C 6~18 Aryl group, or C 1~10 C substituted with alkyl group 6~18 In this specification, the number of substituents in a group defined using "substituted" or "optionally substituted" is not particularly limited, and may be one or more, as long as substitution is possible. Unless otherwise specified, the description of each group also applies to the case where the group is a part or substituent of another group. The number of carbon atoms in the definition of "substituent" can be expressed by, for example, "C 1-6 " etc. Specifically, "C 1-6 The term "alkyl" has the same meaning as an alkyl group having 1 to 6 carbon atoms. In this specification, when a substituent is not specifically designated with the term "substituted" or "optionally substituted," it means an "unsubstituted" substituent.

[0044] As used herein, the term "polymer" refers to a compound formed by the polymerization of multiple monomers. In this case, the monomers are the "starting materials" and the polymer is the product (final product).

[0045] As used herein, a "homopolymer" is a compound formed by the polymerization of only one type of monomer, and a "copolymer" is a compound formed by the polymerization of two or more types of monomer.

[0046] In this specification, a copolymer of monomer A means a copolymer in which one of the monomers contained therein is monomer A.

[0047] In this specification, "(meth)acrylate" means acrylate or methacrylate, and acrylate and methacrylate may be used alone or in combination. "(meth)acryloyloxy" means acryloyloxy or methacryloyloxy, and acryloyloxy and methacryloyloxy may be used alone or in combination. "(meth)acrylic acid" means acrylic acid or methacrylic acid, and acrylic acid and methacrylic acid may be used alone or in combination.

[0048] As used herein, the terms "(meth)acrylic polymer" and "(meth)acrylic-based polymer" refer to a homopolymer or copolymer of (meth)acrylic acid or (meth)acrylate, or a salt or derivative thereof.

[0049] As used herein, the term "monomer" refers to a compound that polymerizes two or more units to form a polymer. Examples of the monomers of the present disclosure include (meth)acrylic monomers, ethylene monomers, styrene monomers, butadiene monomers, urethane monomers, amide monomers, ester monomers, ether monomers, imide monomers, amide-imide monomers, carbonate monomers, acetal monomers, sulfone monomers, phenylene sulfide monomers, ether ether ketone monomers, silicone monomers, and monomers that polymerize to form AES resins, diallyl phthalate resins, ABS resins, silicone resins, or the like.

[0050] In this specification, "firing" refers to the process of forming raw material powder, heating it to shrink and densify it, and obtaining a sintered body with a certain shape and strength.

[0051] In this specification, "sintering" refers to the phenomenon in which raw material powder is baked and solidified at high temperatures. Gaps are observed between the particles of the raw material powder, but when sintering occurs in a high-temperature environment (a temperature lower than the melting point), the contact area between the particles increases, reducing the gaps and causing the powder to harden. The remaining gaps are called "voids" or "pores."

[0052] As used herein, the term "sintering accelerator" refers to a substance that interacts with a metal-based component to reduce the temperature required to achieve sintering compared to the temperature before its addition.

[0053] As used herein, the term "kit" refers to a unit in which the components to be provided (e.g., coating component, conductive component, solvent, instructions, etc.) are provided, typically separated into two or more compartments. This kit form is preferred when the purpose is to provide a composition that, for reasons of stability, should not be provided in a mixed state, but is preferably mixed immediately before use. Such a kit advantageously includes instructions or instructions describing how to use the components provided (e.g., conductive component, coating component) or how to dispose of reagents or waste liquids after use. When the term "kit" is used herein, the kit may typically include instructions describing how to use a solvent, etc.

[0054] (Basic explanation of conductive materials) The conductive material provided in the present disclosure includes any conductive component available in the art, and is characterized in that the conductive material has improved conductivity due to the inclusion of a composition for improving conductivity (also referred to as a conductivity improver) provided in the present disclosure.

[0055] The conductive material of the present disclosure may typically contain a base material other than the conductive component.

[0056] (Basic explanation of conductivity improvers) The composition for improving the conductivity of a conductive polymer (conductivity enhancer) provided in the present disclosure comprises an organophosphorus compound.

[0057] (Conductive components targeted by conductivity improvers) The conductive component that can be targeted by the conductivity improver of the present disclosure may be any substance that promotes adsorption and diffusion, and a representative component may be any metal-based component. Without wishing to be bound by theory, the components of the present disclosure have the effect of adsorption and diffusion, and it is thought that if the component is a metal-based component, the adsorption and diffusion increases the contact points of the conductive component, thereby improving the conductivity.

[0058] The conductive component that can be targeted by the conductivity improver of the present disclosure is preferably a metal component. Without wishing to be bound by theory, in the case of a metal component, when molecules that interact with the metal component are present in the system, the molecules are adsorbed to the metal surface, and metal fine particles that can interact with the adsorbed portions are dissociated, increasing the amount of metal fine particles present in the system and increasing the number of contact points, which is thought to improve conductivity.

[0059] More preferred are silver, copper, gold, aluminum, zinc, nickel, tin, and iron, and even more preferred is silver.

[0060] (General manufacturing method for conductive materials) (1) Method for manufacturing polymer matrix In a representative embodiment, the polymer matrix of the present disclosure can be prepared by polymerizing a monomer by heating it and / or by irradiating it with ultraviolet light at a specific irradiance. Such ultraviolet light irradiation can be arbitrarily determined and carried out by a person skilled in the art. When preparing a polymer matrix by polymerization using ultraviolet light, the complicated drying procedure for removing the solvent is not required, and the process is easy to use.

[0061] Here, ultraviolet light refers to electromagnetic waves with wavelengths shorter than visible light but longer than X-rays. The upper limit of the short wavelength end of visible light is 400 nm, and ultraviolet light can be defined as electromagnetic waves with wavelengths shorter than this. The lower limit of ultraviolet light wavelength is about 10 nm, and any electromagnetic wave with a wavelength longer than this is understood to fall into the category of ultraviolet light. The wavelength of ultraviolet light used in the present disclosure may be any wavelength, and an appropriate wavelength can be selected depending on the purpose. For example, in the present disclosure, any wavelength may be used as long as it can produce an initial effect on the monomer. Typically, it is a wavelength that can be irradiated by the light source used in the examples or test examples. Specifically, a light source with a wavelength of about 150 nm to 400 nm is used, and preferably 300 nm to 400 nm.

[0062] The preferred irradiance of the ultraviolet light used in the present disclosure varies depending on the starting material. The ultraviolet light irradiation device is not particularly limited, and examples thereof include a low-pressure mercury lamp, a medium-pressure mercury lamp, a high-pressure mercury lamp, an ultra-high-pressure mercury lamp, a metal halide lamp, a black light lamp, a UV electrodeless lamp, a short arc lamp, and an LED.

[0063] When polymerizing a monomer, it is preferable to use a polymerization initiator. Examples of the polymerization initiator include a thermal polymerization initiator, a photopolymerization initiator, a redox polymerization initiator, an ATRP (atom transfer radical polymerization) initiator, an ICAR ATRP initiator, an ARGET ATRP initiator, a RAFT (reversible addition-fragmentation chain transfer polymerization) agent, an NMP (nitroxide-mediated polymerization) agent, and a polymer polymerization initiator. These polymerization initiators may be used alone or in combination of two or more. Among these polymerization initiators, a photopolymerization initiator is preferable from the viewpoint of not leaving a thermal history in the polymer matrix.

[0064] Examples of the photopolymerization initiator include 2,4,6-trimethylbenzoyldiphenylphosphine oxide, 2,2'-bis(o-chlorophenyl)-4,4',5,5'-tetraphenyl-1,1'-biimidazole, 2,4,6-tris(trichloromethyl)-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-(p-methoxyphenylvinyl)-1,3,5-triazine, diphenyliodonium tetrafluoroborate, diphenyliodonium hexafluorophosphate, 4,4'-ditert-butyldiphenylphosphine oxide ... Phenyliodonium tetrafluoroborate, 4-diethylaminophenylbenzenediazonium hexafluorophosphate, benzoin, 2-hydroxy-2-methyl-1-phenylpropan-2-one, benzophenone, thioxanthone, 2,4,6-trimethylbenzoyldiphenylacylphosphine oxide, triphenylbutylborate tetraethylammonium, diphenyl-4-phenylthiophenylsulfonium hexafluorophosphate, 2,2-dimethoxy-1,2-diphenylethan-1-one, phenyl Photoradical polymerization initiators such as glyoxylic acid methyl ester, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one, bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide, 1,2-octanedione, 1-[4-(phenylthio)-2-(o-benzoyloxime)], bis(η5-2,4-cyclopentadien-1-yl)bis[2,6-difluoro-3-(1H-pyrrol-1-yl)phenyltitanium], 2,4,6-tris(trichloromethyl)-1,3 Examples of photo-polymerization initiators include cationic ring-opening photo-polymerization initiators such as 1,5-triazine, 2,4-bis(trichloromethyl)-6-(p-methoxyphenylvinyl)-1,3,5-triazine, diphenyliodonium tetrafluoroborate, 4,4'-ditert-butyldiphenyliodonium tetrafluoroborate, 4-diethylaminophenylbenzenediazonium hexafluorophosphate, and diphenyl-4-phenylthiophenylsulfonium hexafluorophosphate, but the present disclosure is not limited to these examples. These photo-polymerization initiators may be used alone or in combination of two or more.

[0065] When a photopolymerization initiator is used as the polymerization initiator, the amount of the photopolymerization initiator is preferably about 0.01 to about 20 parts by weight per 100 parts by weight of all the monomers.

[0066] Examples of thermal polymerization initiators include azo-based polymerization initiators such as azobisisobutyronitrile (AIBN), 2,2'-azobis(methyl isobutyrate), 2,2'-azobis(2,4-dimethylvaleronitrile), 2,2'-azobis(2-methylbutyronitrile), and 1,1'-azobis(cyclohexane-1-carbonitrile), and peroxide-based polymerization initiators such as benzoyl peroxide, potassium persulfate, and ammonium persulfate, but the present disclosure is not limited to these examples. These polymerization initiators may be used alone or in combination of two or more.

[0067] When a thermal polymerization initiator is used as the polymerization initiator, the amount of the thermal polymerization initiator is preferably about 0.01 to about 20 parts by weight per 100 parts by weight of all the monomers.

[0068] When using a polymerization initiator that generates nitrogen (N) during the polymerization reaction, such as AIBN, the resulting composite may contain bubbles. These bubbles can be the starting point for fracture, potentially reducing the composite's properties, such as its elongation, but potentially improving its impact absorption. The bubbles contained in the composite are not limited to those derived from the polymerization initiator; they may be obtained by adding a blowing agent, removing a solvent, or by any other known method for incorporating bubbles into resins.

[0069] Other polymerization initiators that can be used in the present disclosure include, for example, redox polymerization initiators such as hydrogen peroxide and iron(II) salts, persulfates and sodium hydrogen sulfite, ATRP (atom transfer radical polymerization) initiators using alkyl halides in the presence of a metal catalyst, ICAR ATRP initiators and ARGET ATRP initiators using metals and nitrogen-containing ligands, RAFT (reversible addition-fragmentation chain transfer polymerization) agents, NMP (nitroxide-mediated polymerization) agents, polymeric polymerization initiators such as polydimethylsiloxane unit-containing polymeric azo polymerization initiators, and polyethylene glycol unit-containing polymeric azo polymerization initiators, but the present disclosure is not limited to these examples. These polymerization initiators may be used alone or in combination of two or more types.

[0070] When polymerizing a monomer, a chain transfer agent may be used to adjust the molecular weight. The chain transfer agent can usually be used by mixing it with the monomer. Examples of chain transfer agents include 2-(dodecylthiocarbonothioylthio)-2-methylpropionic acid, 2-(dodecylthiocarbonothioylthio)propionic acid, methyl 2-(dodecylthiocarbonothioylthio)-2-methylpropionate, 2-(dodecylthiocarbonothioylthio)-2-methylpropionic acid 3-azido-1-propanol ester, 2-(dodecylthiocarbonothioylthio)-2-methylpropionic acid pentafluorophenyl ester, mercaptan group-containing compounds such as lauryl mercaptan, dodecyl mercaptan, and thioglycerol, and inorganic salts such as sodium hypophosphite and sodium hydrogen sulfite. However, the present disclosure is not limited to these examples. These chain transfer agents may be used alone or in combination of two or more. The amount of the chain transfer agent is not particularly limited, but is usually about 0.01 to about 10 parts by weight per 100 parts by weight of all monomers.

[0071] The atmosphere in which the monomers are polymerized is not particularly limited, and may be air or an inert gas such as nitrogen gas or argon gas.

[0072] The temperature at which the monomers are polymerized is not particularly limited, and is usually preferably about 5 to 100° C. The time required to polymerize the monomers varies depending on the polymerization conditions and cannot be generally determined, so is arbitrary, but is usually about 1 to 20 hours.

[0073] The polymerization reaction can be terminated at any time when the amount of remaining monomer is 20% by mass or less, which can be measured, for example, by gel permeation chromatography (GPC).

[0074] By bulk polymerizing the monomers in the manner described above, a polymer matrix can be obtained.

[0075] In one embodiment, the monomers are polymerized in the absence of a crosslinking agent, hi another embodiment, the monomers are polymerized in the presence of a crosslinking agent.

[0076] In one embodiment, the polymer matrix is thermally or photopolymerized. In another embodiment, the polymer matrix is thermally polymerized. In another embodiment, the polymer matrix is photopolymerized.

[0077] Examples of methods for polymerizing the monomer include bulk polymerization, solution polymerization, emulsion polymerization, and suspension polymerization, but the present disclosure is not limited to these examples. Among these polymerization methods, bulk polymerization and solution polymerization are preferred.

[0078] The polymerization of the monomer can be carried out by, for example, radical polymerization, living radical polymerization, anionic polymerization, cationic polymerization, addition polymerization, polycondensation, catalytic polymerization, or the like.

[0079] When polymerizing a monomer by solution polymerization, for example, the monomer can be polymerized by dissolving the monomer in a solvent and adding a polymerization initiator to the resulting solution while stirring the solution, or the monomer can be polymerized by dissolving a polymerization initiator in a solvent and adding the monomer to the resulting solution while stirring the solution. The solvent is preferably an organic solvent that is compatible with the monomer.

[0080] The homopolymers or copolymers included in the conductive material of the present disclosure may be polymerized by using a peroxide-based initiator (e.g., benzoyl peroxide, and azobisisobutyronitrile, and analogs thereof) as a polymerization initiator.

[0081] When the above-mentioned usable polymerization initiators are used as the polymerization initiator, the amount of the polymerization initiator is preferably usually about 0.01 to about 20 parts by weight per 100 parts by weight of all the monomers.

[0082] In one embodiment, electron beam polymerization is performed by irradiating the monomer with an electron beam. In one embodiment, the monomer can be polymerized by irradiation with an electron beam alone. In electron beam polymerization, the electron beam is irradiated in the presence of a photopolymerization initiator in one embodiment, or in the absence of a photopolymerization initiator in another embodiment. Both embodiments are within the scope of the present disclosure.

[0083] There are no particular limitations on the polymerization reaction temperature and atmosphere when polymerizing the monomer. Typically, the polymerization reaction temperature is about 50°C to about 120°C. The polymerization reaction atmosphere is preferably an inert gas atmosphere such as nitrogen gas. The polymerization reaction time of the monomer varies depending on the polymerization reaction temperature and other factors and cannot be determined in general, but is usually about 3 to 20 hours.

[0084] (2) Manufacturing method of polymer matrix contained in conductive material The polymer (or polymer matrix) contained in the conductive material of the present disclosure can be produced by mixing two or more specific monomers and polymerizing them under appropriate polymerization conditions, using appropriate additives such as a polymerization initiator as needed. The conductive material of the present disclosure can then be produced by mixing the conductive component and any other components into this polymer matrix and heating the mixture. The individual components and specific production conditions for the polymer are described in detail below.

[0085] In one aspect, the present disclosure relates to a method for producing a homopolymer containing one monomer component or a copolymer containing two or three monomer components as a polymer matrix. In an exemplary embodiment, the monomer component of the polymer matrix is a monomer represented by formula (1): [ka] wherein R 1 is a hydrogen atom or a methyl group, R 2 is a hydrogen atom, a substituted or unsubstituted alkyl group, a substituted or unsubstituted cycloalkyl group, a substituted or unsubstituted non-aryl heterocycloalkyl group, a substituted or unsubstituted aryl group, or a substituted or unsubstituted heteroaryl group.

[0086] In one embodiment of the present disclosure, the polymerization of the monomers is carried out according to a polymerization method selected from the group consisting of bulk polymerization, solution polymerization, emulsion polymerization, and suspension polymerization. Without wishing to be bound by theory, the monomers of the present disclosure may be polymerized by chain polymerization, step-growth polymerization, or living polymerization.

[0087] (3-1) Monomer Preparation Method The monomer components used in the present disclosure may be commercially available from manufacturers such as those exemplified in the Examples or Test Examples, or may be prepared according to methods well known to those skilled in the art.

[0088] (3-2) Photopolymerization manufacturing method In one embodiment, the polymer matrix of the present disclosure is obtained in one step by photopolymerizing a monomer (including one or more monomers) in the presence of a polymerization initiator.

[0089] In one embodiment, the polymer matrix of the present disclosure can be produced by irradiating one (meth)acrylic monomer with ultraviolet light in the presence of a polymerization initiator, such as 2,4,6-trimethylbenzoyldiphenylphosphine oxide.

[0090] This step is usually carried out at room temperature for about 2 hours, but is not limited to this and may be carried out for 0.5 to 3 hours, or 0.5 to 24 hours or longer.

[0091] (3-3) Preparation of resin solution In one embodiment, the polymer matrix of the present disclosure obtained by polymerizing the monomers is dissolved in a solvent to form a resin solution, examples of suitable solvents include heptane, octane, undecane, limonene, 3-methoxy-3-methyl-1-butanol, octanol, and 2-ethyl-1-hexanol.

[0092] (3-4) Preparation method of conductive material In one embodiment, the conductive material is obtained by mixing the resin solution obtained in (3-3) with a conductive component and, if necessary, a dispersant, and heating the resulting mixture. Those skilled in the art can also produce the conductive material by other methods using the description herein and any method known in the art.

[0093] The conductive material of the present disclosure can be produced by mixing one or more specific monomers and polymerizing them under appropriate polymerization conditions, using appropriate additives such as a polymerization initiator as needed. The individual components and specific production conditions are described in detail below.

[0094] (Explanation of conductive components) The essential conductive component in the present disclosure is a metal-based component (including conductive whiskers such as zinc oxide and potassium titanate, and conductive metal oxides such as titanium oxide), preferably a metal component, more preferably metal particles such as copper, gold, nickel, tin, aluminum, zinc, iron, and silver. The conductive component in the present disclosure may be, in addition to the metal-based component, natural graphite such as flake graphite, graphite such as artificial graphite, carbon black such as acetylene black, ketjen black, channel black, furnace black, lamp black, and thermal black, carbon-based materials such as graphene, carbon nanotubes, and fullerenes, conductive fibers such as carbon fibers and metal fibers, carbon fluorides, and organic conductive materials such as polyphenylene derivatives. In the present disclosure, each essential conductive component may be used alone, or two or more of these conductive components may be used in combination, including at least one essential conductive component.

[0095] The solid content of the conductive component in the total solid content of the polymer matrix and the conductive component cannot be determined in general because it varies depending on the type of the conductive component, etc., but from the viewpoint of obtaining a conductive film that is excellent in workability and formability as well as flexibility and elongation, it is preferably 1 mass % or more, and from the viewpoint of obtaining a conductive film that is excellent in workability and formability as well as flexibility and elongation, it is preferably 100 mass % or less.

[0096] Examples of carbon nanotubes include single-walled carbon nanotubes, which have a hollow cylindrical structure formed by rolling a single sheet of graphite (graphene sheet) into a cylindrical shape; multi-walled carbon nanotubes, which have a structure formed by concentrically stacking multiple single-walled carbon nanotubes of different diameters; single-walled carbon nanotubes produced by the super-growth method; carbon nanocones, which are single-walled carbon nanotubes with closed conical ends; and carbon nanotubes encapsulating fullerenes therein. However, the present disclosure is not limited to these examples. These carbon nanotubes may be used alone or in combination of two or more types. Among these carbon nanotubes, multi-walled carbon nanotubes are preferred.

[0097] The length of the carbon nanotubes is preferably 0.1 to 1000 μm, more preferably 1 to 500 μm, and even more preferably 1 to 90 μm, from the viewpoint of obtaining a conductive film that is excellent in workability and formability as well as flexibility and elongation.

[0098] The diameter of the carbon nanotubes is preferably 10 to 50 nm, more preferably 10 to 20 nm, from the viewpoint of obtaining a conductive film that is excellent in workability and formability, as well as flexibility and elongation.

[0099] The solid content of carbon nanotubes in the total solid content of the polymer matrix and the carbon nanotubes is preferably 1 mass% or more, more preferably 1.5 mass% or more, and even more preferably 2 mass% or more, from the viewpoint of obtaining a conductive film that is excellent in workability and formability as well as flexibility and elongation; and from the viewpoint of obtaining a conductive film that is excellent in workability and formability as well as flexibility and elongation, it is preferably 25 mass% or less, more preferably 20 mass% or less, even more preferably 15 mass% or less, and even more preferably 3.5 to 10 mass%.

[0100] (Conductive material applications) The conductive polymer of the present disclosure can be suitably used for conductive films that can be suitably used in, for example, sensors used in actuators, industrial robots, etc., wiring, electrodes, substrates, power generation elements, speakers, microphones, noise cancellers, transducers, artificial muscles, small pumps, medical instruments, etc., and can also be suitably used as a raw material for such conductive films.

[0101] (Preferred embodiment) Preferred embodiments of the present disclosure will be described below. The embodiments provided below are provided for a better understanding of the present disclosure, and it is understood that the scope of the present disclosure should not be limited to the following description. Therefore, it is clear that those skilled in the art can make appropriate modifications within the scope of the present disclosure in light of the description herein. It is also understood that the following embodiments of the present disclosure can be used alone or in combination.

[0102] (Applications for improving conductivity) In one aspect, the present disclosure relates to electrical conductivity enhancement applications.

[0103] More particularly, the present disclosure provides compositions for enhancing the electrical conductivity of conductive polymers that include metal-based components, comprising organophosphorus compounds.

[0104] In one specific embodiment, it was confirmed that the addition of phosphine caused sintering at a low temperature (120°C) that had not previously occurred. Without wishing to be bound by theory, in this embodiment, the greater the amount of phosphine added, the greater the decrease in resistance change, which is believed to have promoted sintering of the internal metal particles. Furthermore, although it is believed that the greater the amount of phosphine added, the fewer filler contacts there are, the present disclosure has found that there is no significant change in conductivity. Energy calculations of the system during heating showed that it was most stable when the distance between the phosphine molecules and silver atoms was close enough for them to interact, which is believed to be why a large number of fine particles were generated through the adsorption-diffusion effect, creating contacts.

[0105] In one embodiment, the organophosphorus compound comprises trivalent phosphorus.

[0106] In one embodiment, the organophosphorus compound is an alkyl-, cycloalkyl-, or aryl-substituted phosphine.

[0107] In one embodiment, the organophosphorus compound is one or a combination of two or more phosphines selected from the group consisting of tributylphosphine, trioctylphosphine, triphenylphosphine, tri(o-tolyl)phosphine, cyclohexyldiphenylphosphine, 1,2-bis(diphenylphosphino)ethane, and tricyclohexylphosphine.

[0108] In one embodiment, the organophosphorus compound is triphenylphosphine.

[0109] In one embodiment, the metal-based component is a metal, a metal oxide, a metal carbide, a metal sulfide, or a combination thereof.

[0110] In one embodiment, the metal comprises silver, copper, gold, aluminum, zinc, tin, nickel, and / or iron.

[0111] In one embodiment, the metal is silver.

[0112] In one embodiment, the metal oxide is one or a combination of two or more oxides selected from the group consisting of alumina, tin oxide, indium oxide, zinc oxide, indium-tin oxide, and antimony-tin oxide.

[0113] In one embodiment, the metal carbide is one or a combination of two or more carbides selected from the group consisting of tungsten carbide, titanium carbide, molybdenum carbide, tantalum carbide, niobium carbide, vanadium carbide, and zirconium carbide.

[0114] In another embodiment, the metal-based component is a particle having a particle size of 1 μm to 100 μm. The metal-based component is preferably a particle having a particle size of 90 μm or less, 80 μm or less, 70 μm or less, 60 μm or less, 50 μm or less, 40 μm or less, 30 μm or less, 20 μm or less, 10 μm or less, 5 μm or less, etc., and may be 0.01 μm or more, 0.05 μm or more, 0.1 μm or more, 0.2 μm or more, 0.3 μm or more, 0.4 μm or more, 0.5 μm or more, 0.6 μm or more, 0.7 μm or more, 0.8 μm or more, 0.9 μm or more, 1 μm or more, 1.5 μm or more, 2 μm or more, 2.5 μm or more, 3 μm or more, etc. The metal-based component is preferably a particle having a particle diameter of 1 μm to 50 μm, more preferably 1 μm to 10 μm, and even more preferably 1 μm to 10 μm. The shape of the particle is not particularly limited, and examples include a spherical, scaly, or needle-like shape.

[0115] In one embodiment, the polymer matrix in the conductive polymer is a (meth)acrylic polymer, a urethane polymer, an olefin polymer, or an epoxy polymer.

[0116] In one embodiment, the polymer matrix in the conductive polymer is a (meth)acrylic polymer, a urethane polymer, an olefin polymer, an epoxy polymer, or a styrene-butadiene polymer.

[0117] In one embodiment, the polymer matrix in the conductive polymer is a (meth)acrylic polymer.

[0118] In one embodiment, the polymer matrix in the conductive polymer is a homopolymer containing one type of monomer component or a copolymer containing two to three types of monomer components.

[0119] In one embodiment, the polymer matrix in the conductive polymer is a homopolymer.

[0120] In one embodiment, the monomer component of the polymer matrix is represented by formula (1): [ka] wherein R 1 is a hydrogen atom or a methyl group, and R 2 is a hydrogen atom, a substituted or unsubstituted alkyl group, a substituted or unsubstituted cycloalkyl group, a substituted or unsubstituted non-aryl heterocycloalkyl group, a substituted or unsubstituted aryl group, or a substituted or unsubstituted heteroaryl group.

[0121] In one embodiment, R 1 is a hydrogen atom. 1 is a methyl group.

[0122] In one embodiment, R 2 is a hydrogen atom or a substituted or unsubstituted alkyl group.

[0123] In one embodiment, R 2 is a hydrogen atom or a substituted or unsubstituted C 1~6 It is an alkyl group.

[0124] In one embodiment, R 2 is ethyl.

[0125] (sintering accelerator) In one aspect, the present disclosure provides a sintering promoter for a metal-based component, the sintering promoter comprising an organophosphorus compound.

[0126] In one specific aspect, the present disclosure provides a sintering promoter for metal-based components, comprising a triarylphosphine. Preferred embodiments of the sintering promoter may utilize any of the embodiments described herein or a combination thereof, and may be applied in combination with one or more of the embodiments described in the section (Applications for Improving Electrical Conductivity) herein.

[0127] Although not wishing to be bound by theory, it is believed that the interaction between the metal-based component (e.g., silver particles) and the organic molecule (e.g., triphenylphosphine) reduces the surface energy of the metal-based component, making it more susceptible to external energy (thermal energy due to sintering), thereby promoting sintering.

[0128] The sintering accelerator of the present disclosure may be used in the above-mentioned sintering, such as when producing a compact by powder metallurgy or when producing a sintered alloy.

[0129] (Conductive material) In one aspect, the present disclosure provides a conductive material comprising the polymer matrix of the present disclosure, a metal, and an organophosphorus compound.

[0130] Since the conductive material of the present disclosure is intended to be coated onto elastomers or substrates, a lower heating temperature is preferable. While a mixture of silver microparticles and an acrylic copolymer required heat treatment at 180°C, adding a triphenylphosphine solution to a mixture of a polymer matrix and metal enabled heat treatment at a lower temperature than conventional methods without changing the resin composition or silver particles.

[0131] Preferred embodiments of the conductive material may utilize any of the embodiments described herein or a combination thereof, and may be applied in combination with one or more of the embodiments described in the section (Applications for improving electrical conductivity) of this specification.

[0132] In one embodiment, the organophosphorus compound comprises trivalent phosphorus.

[0133] In one embodiment, the organophosphorus compound is an alkyl-, cycloalkyl-, or aryl-substituted phosphine.

[0134] In one embodiment, the organophosphorus compound is one phosphine or a combination of two or more phosphines selected from the group consisting of tributylphosphine, trioctylphosphine, triphenylphosphine, tri(o-tolyl)phosphine, cyclohexyldiphenylphosphine, 1,2-bis(diphenylphosphino)ethane, and tricyclohexylphosphine.

[0135] In one embodiment, the organophosphorus compound is triphenylphosphine.

[0136] In one embodiment, the metal comprises silver, copper, gold, aluminum, zinc, tin, nickel, and / or iron. In a preferred embodiment, the metal is silver. Without wishing to be bound by theory, silver has good electrical conductivity and is durable.

[0137] In one embodiment, the metal is in the form of particles having a particle size of 1 μm to 100 μm.

[0138] In one embodiment, the polymer matrix is an acrylic-based polymer, a urethane-based polymer, an olefin-based polymer, or an epoxy-based polymer.

[0139] In one embodiment, the polymer matrix is an acrylic polymer, a urethane polymer, an olefin polymer, an epoxy polymer, or a styrene-butadiene polymer.

[0140] In one embodiment, the polymer matrix is a (meth)acrylic polymer or a styrene-butadiene-based polymer. In one embodiment, the polymer matrix is a (meth)acrylic polymer. In one embodiment, the polymer matrix is a styrene-butadiene-based polymer.

[0141] In one embodiment, the polymer matrix is a homopolymer containing one type of monomer component or a copolymer containing two to three types of monomer components.

[0142] In one embodiment, the polymer matrix is a homopolymer.

[0143] In one embodiment, the monomer component of the polymer matrix is represented by formula (1): [ka] wherein R 1 is a hydrogen atom or a methyl group, and R 2 is a hydrogen atom, a substituted or unsubstituted alkyl group, a substituted or unsubstituted cycloalkyl group, a substituted or unsubstituted non-aryl heterocycloalkyl group, a substituted or unsubstituted aryl group, or a substituted or unsubstituted heteroaryl group.

[0144] In one embodiment, R 1 is a hydrogen atom. 1 is a methyl group.

[0145] In one embodiment, R 2 is a hydrogen atom or a substituted or unsubstituted alkyl group.

[0146] In one embodiment, R 2 is a hydrogen atom or a substituted or unsubstituted C 1~6 It is an alkyl group.

[0147] In one embodiment, R 2 is ethyl.

[0148] In one embodiment, the conductive material further comprises a dispersant.

[0149] In one embodiment, the dispersant is 2-(2-butoxyethoxy)ethanol.

[0150] (Conductive material manufacturing) In one aspect, the present disclosure provides methods for producing the conductive materials and sintering promoters of the present disclosure.

[0151] In a particular aspect, the present disclosure provides a method of making a conductive material, comprising heating a mixture including a polymer matrix, a metal, and an organophosphorus compound to produce the conductive material. The method includes heating a mixture containing the polymer matrix, the metal, and an organophosphorus compound to produce a conductive polymer containing the metal. A preferred embodiment of the manufacturing method can utilize any embodiment or combination thereof described herein, and can apply one or more combinations of any embodiment described in the section (Applications for improving electrical conductivity) of this specification.

[0152] In one embodiment, the heating temperature is 80°C to 150°C, preferably 100°C to 140°C.

[0153] In one embodiment, the heating time is 10 to 50 minutes.

[0154] In another embodiment, the method includes adding a dispersant to the mixture before heating.

[0155] (Note) In this specification, "or" is used when "at least one or more" of the items listed in the sentence can be employed. The same applies to "alternative." In this specification, when it is stated that "within a range of two values," the range includes the two values themselves.

[0156] All references cited herein, including scientific literature, patents, patent applications, and the like, are incorporated by reference in their entirety to the same extent as if each were specifically set forth.

[0157] The present disclosure has been described above by showing preferred embodiments for ease of understanding. The present disclosure will be described below based on test examples. However, the above description and the following test examples are provided for illustrative purposes only and are not intended to limit the present disclosure. Therefore, the scope of the present disclosure is not limited to the embodiments, examples, or test examples specifically described herein, but is limited only by the scope of the claims. [Example]

[0158] [Test example] Test examples are described below. The handling of organisms used in the following test examples complied with the standards stipulated by regulatory agencies, where necessary. The reagents used were specifically products described in the examples or test examples, but equivalent products from other manufacturers (Sigma-Aldrich, etc.) can also be used.

[0159] (Preparation of polymer matrix) <Test Example 1> Ethyl acrylate (EA, 10.00 g) was mixed with 2,4,6-trimethylbenzoyldiphenylphosphine oxide (0.0123 g, manufactured by BASF, trade name Irgacure TPO) as a polymerization initiator to obtain a monomer component containing the polymerization initiator. The obtained monomer component was poured into a transparent glass mold (length: 100 mm, width: 100 mm, depth: 2 mm), and then the monomer component was irradiated with a dose of 0.36 mW / cm. 2 The monomer components were irradiated with ultraviolet light so that the temperature reached 100°C, and the monomer components were bulk polymerized for 2 hours to obtain a polymer.

[0160] The obtained polymer (10.00 g) was dissolved in toluene (90.00 g) to obtain an acrylic resin solution.

[0161] (Preparation of phosphine solution) Triphenylphosphine (5.00 g) was dissolved in tetrahydrofuran (5.00 g) to obtain a phosphine solution.

[0162] (Method for producing conductive film) To the acrylic resin solution (60.00 g) obtained in Test Example 1, silver filler (24.00 g, manufactured by Fukuda Metal Foil & Powder Co., Ltd., product name AgC-A), 2-(2-butoxyethoxy)ethanol (0.5 g) as a dispersant, and the prepared triphenylphosphine solution (0.12 g) were added, and mixed in a Mazerustar manufactured by Kurabo Industries, Ltd. to obtain a conductive material precursor.

[0163] The obtained conductive material precursor was applied to a release polyethylene terephthalate film (manufactured by Mitsui Chemicals Tocello Inc., trade name Separator SP-PET PET-01-Bu) as a release film to form a coating film.

[0164] The coating was heated in an oven at 120° C. for 30 minutes to obtain a conductive film with a thickness of about 30 μm.

[0165] (Volume resistivity measurement) The obtained conductive film was cut into a piece of 0.5 cm length and 2.00 cm width, and measured by a four-terminal method using Loresta GP (manufactured by Mitsubishi Chemical Analytech Corporation).

[0166] (How to check resistance change) (Measurement of resistance value) The conductive film obtained above was cut into a piece 0.5 cm long and 2.00 cm wide, and the resistance value (ΩA) before stretching was measured using a digital multimeter (trade name PC773, manufactured by Sanwa Denki Keiki Co., Ltd.) with the inter-electrode distance fixed at 1.00 cm.

[0167] (Resistance change) Next, with the conductive film still fixed on the multimeter electrodes, the distance between the electrodes was set to 2.00 cm, and the resistance value (ΩB) at this time was measured. The change in resistance value was calculated as follows. Resistance change = ΩB / ΩA

[0168] <Test Examples 2 and 3> Conductive films were prepared in the same manner as in Test Example 1, except that the amount of triphenylphosphine solution added was changed as shown in Table 1, and the change in resistance value was measured in the same manner as in Test Example 1.

[0169] <Test Example 4> Except for using cyclohexyldiphenylphosphine instead of triphenylphosphine, a cyclohexyldiphenylphosphine solution was prepared in the same manner as in Test Example 1. Except for using this cyclohexyldiphenylphosphine solution instead of the triphenylphosphine solution, a conductive film was prepared in the same manner as in Test Example 1, and the change in resistance value was measured in the same manner as in Test Example 1.

[0170] <Test Examples 5-7> Conductive films were prepared in the same manner as in Test Example 1, except that the amount of silver filler added was changed as shown in Table 2, and the change in resistance value was measured in the same manner as in Test Example 1.

[0171] <Test Example 8> A conductive film was prepared in the same manner as in Test Example 1, except that the temperature for the heat treatment was changed to 150°C, and the change in resistance value was measured in the same manner as in Test Example 1.

[0172] <Test Examples 9 and 10> A resin solution was obtained by dissolving polycycloolefin (40.00 g, manufactured by Zeon Corporation, trade name: Zeonor) in toluene (60.00 g). Using this resin solution, conductive films having the compositions shown in Table 2 were produced in the same manner as in each of the above test examples, and the change in resistance value was measured in the same manner as in test example 1.

[0173] <Test Example 11> A styrene-butadiene resin solution was obtained by dissolving 4.00 g of styrene-butadiene block copolymer (JSR Corporation, product name: TR2601C) in 6.00 g of toluene. To this styrene-butadiene resin solution (10.00 g), silver filler (16.00 g), 2-(2-butoxyethoxy)ethanol (0.32 g) as a dispersant, and the above triphenylphosphine solution (0.8 g) were added and mixed in a Kurabo Mazerustar to obtain a conductive material precursor. Using the obtained conductive material precursor, a conductive film was fabricated in the same manner as in each of the above test examples, and the change in resistance was measured in the same manner as in Test Example 1.

[0174] <Test Example 12> Conductive films were prepared in the same manner as in Test Example 11, except that the amount of triphenylphosphine solution added was changed as shown in Table 2, and the change in resistance value was measured in the same manner as in Test Example 1.

[0175] (result) The results of the above test examples are shown in Tables 1 and 2. [Table 1] [Table 2]

[0176] When comparing the particle size distribution after sintering between systems with and without triphenylphosphine added, it was observed that the added system had a high frequency of particles in the ranges of 5 μm to 10 μm and ≦1 μm, while the non-additive system had a high frequency of particles in the range of approximately 3 to 5 μm (data not shown).

[0177] (Note) As described above, the present disclosure has been illustrated using preferred embodiments thereof, but it is understood that the scope of the present disclosure should be interpreted solely by the claims. This application claims priority to Japanese Patent Application No. 2019-148111 (filed August 9, 2019), the contents of which are incorporated herein by reference in their entirety. It is understood that the patents, patent applications, and other documents cited herein are incorporated herein by reference in their entirety as if the contents themselves were specifically set forth herein. [Industrial Applicability]

[0178] The conductivity improver of the present disclosure can be used to provide an efficient conductive material, and can be used in industries that require conductive materials.

[0179] The sintering accelerator of the present disclosure can be used to lower the sintering temperature of metal-based components and can be used in industries that require sintering of metal-based components.

Claims

1. A composition for improving the conductivity of a conductive polymer containing a metal-based component, the composition comprising an organophosphorus compound, wherein a polymer matrix in the conductive polymer is a homopolymer containing one type of monomer component or a copolymer containing two or three types of monomer components; The monomer component of the polymer matrix is represented by the formula (1) 【Chemistry 9】 wherein: R １ is a hydrogen atom or a methyl group, R ２ is a hydrogen atom, a substituted or unsubstituted alkyl group, a substituted or unsubstituted cycloalkyl group, a substituted or unsubstituted non-aryl heterocycloalkyl group, a substituted or unsubstituted aryl group, or a substituted or unsubstituted heteroaryl group; The composition, wherein the organophosphorus compound is one or a combination of two or more phosphines selected from the group consisting of tributylphosphine, trioctylphosphine, triphenylphosphine, tri(o-tolyl)phosphine, cyclohexyldiphenylphosphine, 1,2-bis(diphenylphosphino)ethane, and tricyclohexylphosphine.

2. 2. The composition according to claim 1, wherein the metal-based component is a particle having a particle size of 1 μm to 100 μm.

3. The composition according to claim 1 or 2, wherein the polymer matrix in the conductive polymer is a homopolymer containing one type of monomer component.

4. R ２ represents a hydrogen atom, a substituted or unsubstituted C １～６ The composition according to any one of claims 1 to 3, wherein the group is an alkyl group.

5. A sintering accelerator for a metal-based component, comprising an organophosphorus compound and a polymer matrix, wherein the polymer matrix is a homopolymer containing one type of monomer component or a copolymer containing two or three types of monomer components; The monomer component of the polymer matrix is represented by the formula (1) 【Chemistry 9】 wherein: R 1 is a hydrogen atom or a methyl group; R 2 is a hydrogen atom, a substituted or unsubstituted alkyl group, a substituted or unsubstituted cycloalkyl group, a substituted or unsubstituted non-aryl heterocycloalkyl group, a substituted or unsubstituted aryl group, or a substituted or unsubstituted heteroaryl group; The sintering accelerator for a metal-based component, wherein the organic phosphorus compound is one or a combination of two or more phosphines selected from the group consisting of tributylphosphine, trioctylphosphine, triphenylphosphine, tri(o-tolyl)phosphine, cyclohexyldiphenylphosphine, 1,2-bis(diphenylphosphino)ethane, and tricyclohexylphosphine.

6. A conductive material comprising a polymer matrix, a metal, and an organophosphorus compound, the polymer matrix is a homopolymer containing one type of monomer component or a copolymer containing two or three types of monomer components; The monomer component of the polymer matrix is represented by the formula (1) 【Chemistry 9】 wherein: R １ is a hydrogen atom or a methyl group, R ２ is a hydrogen atom, a substituted or unsubstituted alkyl group, a substituted or unsubstituted cycloalkyl group, a substituted or unsubstituted non-aryl heterocycloalkyl group, a substituted or unsubstituted aryl group, or a substituted or unsubstituted heteroaryl group; The conductive material, wherein the organophosphorus compound is one or a combination of two or more phosphines selected from the group consisting of tributylphosphine, trioctylphosphine, triphenylphosphine, tri(o-tolyl)phosphine, cyclohexyldiphenylphosphine, 1,2-bis(diphenylphosphino)ethane, and tricyclohexylphosphine.

7. The conductive material according to claim 6 , wherein the polymer matrix is a homopolymer containing one type of monomer component.

8. R ２ represents a hydrogen atom, a substituted or unsubstituted C １～６ The conductive material according to claim 6 or 7, which is an alkyl group.

9. The conductive material according to claim 6, wherein the metal is a particle having a particle diameter of 1 μm to 100 μm.

10. 1. A method of manufacturing a conductive material, the method comprising: heating a mixture comprising a polymer matrix, a metal, and an organophosphorus compound to form a conductive material; the polymer matrix is a homopolymer containing one type of monomer component or a copolymer containing two or three types of monomer components; The monomer component of the polymer matrix is represented by the formula (1) 【Chemistry 9】 is a compound represented by During the ceremony, R １ is a hydrogen atom or a methyl group, R ２ is a hydrogen atom, a substituted or unsubstituted alkyl group, a substituted or unsubstituted cycloalkyl group, a substituted or unsubstituted non-aryl heterocycloalkyl group, a substituted or unsubstituted aryl group, or a substituted or unsubstituted heteroaryl group; The method, wherein the organophosphorus compound is one or a combination of two or more phosphines selected from the group consisting of tributylphosphine, trioctylphosphine, triphenylphosphine, tri(o-tolyl)phosphine, cyclohexyldiphenylphosphine, 1,2-bis(diphenylphosphino)ethane, and tricyclohexylphosphine.

11. The method of claim 10 , wherein the polymer matrix is a homopolymer comprising one monomer component.

12. R ２ represents a hydrogen atom, a substituted or unsubstituted C １～６ The method according to claim 10 or 11, wherein the alkyl group is an alkyl group.

13. The method according to any one of claims 10 to 12, wherein the heating temperature is from 80°C to 150°C.

14. The method according to any one of claims 10 to 13, wherein the heating time is from 10 minutes to 50 minutes.

15. The method of claim 10, wherein the metal is a particle having a particle size of 1 μm to 100 μm.

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