Heat dissipation assembly and heat dissipation device

Abstract

A heat dissipation assembly and a heat dissipation device are disclosed. The heat dissipation assembly includes a substrate base (110), a substrate cover plate (120), a turbulence generating member, and a plurality of heat dissipation members (130), the substrate cover plate (120) is connected to the substrate base (110) to form a heat collection cavity (210) for concentrating heat, the turbulence generating member includes a turbulence generating piece (310) and a turbulence generating column, and is installed in the heat collection cavity (210), the turbulence generating piece (310) and the heat collection cavity (210) have the same height, the turbulence generating piece (310) is disposed at least partially in close contact with the substrate base (110), and the substrate is supported by a heat dissipation member (130). The turbulence generating piece (310) is disposed at least partially in close contact with the substrate cover plate (120), the side walls of the turbulence generating piece (310) are disposed between the substrate cover plate (120) and the substrate base (110), the side walls of the turbulence generating piece (310) support the substrate cover plate (120) and the substrate base (110), and an air space is provided between adjacent side walls of the turbulence generating piece (310), and a plurality of heat dissipation members (130) are connected to the substrate cover plate (120), and the heat dissipation members (130) are provided with heat dissipation pipes (230) arranged to communicate with the heat collection cavity (210).

Description

[Technical Field]

[0001] This application is filed based on a Chinese patent application bearing application number 202111134798.5 and filed on September 27, 2021, and claims priority to that Chinese patent application, the entire contents of which are incorporated herein by reference.

[0002] FIELD OF THE INVENTION This application relates to the field of electronics, and more particularly to heat dissipation assemblies and devices. [Background technology]

[0003] With the rapid development of power electronics technology, electronic devices are developing in the direction of increasing capacity, power output, integration, and weight. As a result, the heat dissipation density of equipment systems is becoming increasingly higher, and the demand for environmental adaptability is also increasing. As a result, the problem of reliable heat dissipation in electronic devices has become a bottleneck that inhibits the development of the industry.

[0004] Taking the heat dissipation device of an active antenna unit (AAU) as an example, the heat dissipation demand for its weight reduction is mainly limited by the internal power consumption bottleneck of the chip. Some technical solutions use 3D VC-shaped heat dissipation devices to cool localized high heat flux areas, but this technology has problems such as a high risk of leakage, low reliability, low pressure resistance, and easy deformation. At the same time, when placed vertically, the top of the heat collection cavity of the 3D VC heat dissipation module is prone to dry burning, which poses a risk of overheating and causing failure of the corresponding chip.

[0005] The heat dissipation capacity of a 3D VC heat dissipation module is closely related to the thermal design of its structure. To further improve the heat dissipation capacity of the 3D VC module itself and the entire device, it is urgent to improve and optimize the design of the internal cavity of the heat dissipation module and the assembly structure between the heat dissipation module and the housing. Summary of the Invention [Problem to be solved by the invention]

[0006] The present application provides a heat dissipation assembly and a heat dissipation device. [Means for solving the problem]

[0007] In a first aspect, embodiments of the present application provide a heat dissipation assembly, the heat dissipation assembly comprising: A substrate base; a substrate cover plate connected to the substrate base and forming a heat collection cavity for concentrating heat; a turbulation generating member disposed within the heat-collection cavity, the turbulation generating member comprising one or more turbulation generating pieces and turbulation columns, the height of the turbulation generating pieces being equal to the height of the heat-collection cavity, the turbulation generating pieces being disposed in close contact with at least a portion of the substrate base and at least a portion of the substrate cover plate, side walls of the turbulation generating pieces being disposed between the substrate cover plate and the substrate base, the side walls supporting the substrate cover plate and the substrate base, and an empty space being defined between adjacent side walls of the turbulation generating pieces; The heat dissipation members include a plurality of heat dissipation members connected to the substrate cover plate, each of which has one or more heat dissipation ducts, the heat dissipation ducts being arranged to communicate with the heat collection cavity. The substrate cover plate is provided with a through-groove, the heat dissipation member is positioned through a positioning part at the bottom and assembled with the through-groove, and the heat dissipation duct communicates with the heat collection cavity through the through-groove.

[0008] In a second aspect, embodiments of the present application provide a heat dissipation device including the heat dissipation assembly according to the first aspect.

[0009] Other features and advantages of the present application will be set forth in the following description, and in part will be obvious from the description, or may be learned by the practice of the present application. The objectives and other advantages of the present application may be achieved and obtained by the structures particularly pointed out in the description, claims and drawings.

[0010] The accompanying drawings are intended to provide a further understanding of the technical solution of the present application, constitute a part of the specification, and are used to interpret the technical solution of the present application together with the examples of the present application, and are not intended to constitute limitations on the technical solution of the present application.

[0011] The present application will be further described below in combination with figures and examples. [Brief explanation of the drawings]

[0012] [Figure 1] 1 is a structural schematic diagram of a heat dissipation assembly according to an embodiment of the present application; [Figure 2] 1 is a partial schematic diagram of a connection structure between a substrate and a heat dissipation member of a heat dissipation assembly according to an embodiment of the present application; [Figure 3] 1 is a partial schematic diagram of a heat dissipation assembly according to an embodiment of the present application, in which turbulence generating pieces are provided within a substrate; [Figure 4] 1 is a first structural schematic diagram of a turbulence generating piece in a heat dissipation assembly according to an embodiment of the present application; FIG. [Figure 5] FIG. 2 is a second structural schematic diagram of a turbulence generating piece in a heat dissipation assembly according to an embodiment of the present application. [Figure 6] FIG. 10 is a third structural schematic diagram of a turbulence generating piece in a heat dissipation assembly according to an embodiment of the present application. [Figure 7] 1 is a first structural schematic diagram of a turbulence generating member in a heat dissipation assembly according to an embodiment of the present application; [Figure 8] FIG. 2 is a second structural schematic diagram of a turbulence generating member in a heat dissipation assembly according to an embodiment of the present application. [Figure 9] FIG. 10 is a third structural schematic diagram of a turbulence generating member in a heat dissipation assembly according to an embodiment of the present application. [Figure 10] 1 is a structural schematic diagram of a heat dissipation assembly according to an embodiment of the present disclosure, in which a turbulence generating member and a heat dissipation pipe of a heat dissipation member are installed at offset positions; [Figure 11] 1 is a structural schematic diagram of a heat dissipation device according to an embodiment of the present application; [Figure 12] 1 is a structural schematic diagram of a heat dissipation member of a heat dissipation assembly according to an embodiment of the present application; [Figure 13]1 is a structural schematic diagram of the assembly of turbulence generating columns of a heat dissipation assembly according to an embodiment of the present application; [Figure 14] 1 is a structural schematic diagram of a heat dissipation assembly according to an embodiment of the present disclosure, which is connected to a housing by screwing; [Figure 15] 1 is a structural schematic diagram of a heat dissipation assembly according to an embodiment of the present application connected to a housing by stir friction welding; DETAILED DESCRIPTION OF THE INVENTION

[0013] This section describes in detail specific embodiments of the present application, and the accompanying drawings illustrate preferred embodiments of the present application. The role of the drawings is to graphically supplement the written description of the specification, allowing an intuitive and concrete understanding of each technical feature and the overall technical solution of the present application, but should not be construed as a limitation on the protection scope of the present application.

[0014] In the description of this application, "some" means one or more, "multiple" means two or more, "greater than", "less than", "more than", etc. should be understood to exclude the reference number, and "greater than", "less than", "within", etc. should be understood to include the reference number. References to "first", "second", etc. are only for the purpose of distinguishing technical features, and should not be understood to indicate or imply relative importance, or to imply the number of technical features presented, or to imply the context of technical features.

[0015] In the description of this application, unless otherwise clearly limited, the terms "installation," "mounting," "connection," etc. should be understood in a broad sense. Those skilled in the art can reasonably determine the specific meanings of the above terms in this application in combination with the specific content of the technical means.

[0016] An embodiment of the present application provides a heat dissipation assembly and a heat dissipation device. The heat dissipation assembly includes a substrate base, a substrate cover plate, a turbulence generating member, and a plurality of heat dissipation members. The substrate cover plate is connected to the substrate base to form a heat collection cavity for concentrating heat. The turbulence generating member includes a turbulence generating piece and is installed within the heat collection cavity. The turbulence generating member is flush with the heat collection cavity. The turbulence generating member is disposed in at least partial contact with the substrate base and at least partial contact with the substrate cover plate. Sidewalls of the turbulence generating member are disposed between the substrate cover plate and the substrate base. The sidewalls of the turbulence generating member support the substrate cover plate and the substrate base. An air space is defined between adjacent sidewalls of the turbulence generating member. The plurality of heat dissipation members are connected to the substrate cover plate. The heat dissipation member is provided with one or more heat dissipation ducts that are configured to communicate with the heat collection cavity. The top surface of the turbulence generator is tightly fitted to the cavity side of the substrate cover plate, and the bottom surface of the turbulence generator is tightly fitted to the cavity side of the substrate base. The side walls of the turbulence generator are sandwiched between the substrate cover plate and the substrate base to form a support, improving the pressure resistance, structural strength, and reliability of the heat dissipation device. The cavity between the adjacent side walls of the turbulence generator serves as a gas-liquid separation channel, allowing the liquid working medium to flow along the wall. The gas working medium rises through the center of the cavity and separates, improving the two-phase circulation efficiency of the cavity inside the substrate. Furthermore, when the high-temperature gas and liquid working medium passes through the turbulence generator, the high-temperature gas and liquid flow is obstructed by the turbulence generator, causing the high-temperature gas and liquid flow to bypass the turbulence generator, forming vortices on the side of the turbulence generator and breaking up the thermal boundary layer on the surface of the turbulence generator. This significantly reduces thermal resistance, increases the heat transfer coefficient, and enhances heat transfer.

[0017] The present embodiments are further described below in connection with the accompanying drawings.

[0018] 1 to 3 show a heat dissipation assembly 100 according to one embodiment of the present disclosure. The heat dissipation assembly 100 includes a substrate base 110, a substrate cover plate 120, a turbulence generating element, and a plurality of heat dissipation elements 130. The substrate cover plate 120 is connected to the substrate base 110 to form a heat-collecting cavity 210 for concentrating heat. The turbulence generating element is installed in the heat-collecting cavity and includes one or more turbulence generating pieces 310 and turbulence generating columns. The turbulence generating pieces 310 are disposed at least partially in close contact with the substrate base 110 and at least partially in close contact with the substrate cover plate 120. The plurality of heat dissipation elements 130 are connected to the substrate cover plate 120. The heat dissipation element 130 includes one or more heat dissipation conduits 230 that communicate with the heat-collecting cavity 210. The provision of the turbulence generating pieces 310 can address reliability and pressure resistance issues of the heat dissipation device. Furthermore, when high-temperature gas or liquid passes through the turbulence generating pieces 310, the flow of the high-temperature gas or liquid is obstructed by the turbulence generating pieces 310, causing the high-temperature gas or liquid to bypass the turbulence generating pieces 310, forming vortices on the sides of the turbulence generating pieces 310 and destroying the thermal boundary layer on the surface of the turbulence generating pieces 310. This significantly reduces thermal resistance, increases the heat transfer coefficient, and enhances heat transfer. That is, the installation of the turbulence generating pieces 310 not only solves the problems of reliability and pressure resistance of the heat dissipation device, but also reduces thermal resistance and increases the heat transfer coefficient.

[0019] As shown in FIG. 3 , in one embodiment, multiple sets of continuous turbulence generating pieces 310 are installed within the heat-collection cavity 210 at the same height. This enhances the welding strength between the substrate base 110 and the substrate cover plate 120. The top surfaces of the turbulence generating pieces 310 are closely attached to the cavity side of the substrate cover plate 120, and the bottom surfaces of the turbulence generating pieces 310 are closely attached to the cavity side of the substrate base 110. The side walls of the turbulence generating pieces 310 are sandwiched between the substrate cover plate 120 and the substrate base 110 to form support, thereby improving the pressure resistance, structural strength, and reliability of the heat dissipation device. The adjacent side walls of the turbulence generating pieces 310 form separate chambers as gas-liquid separation channels, allowing the liquid working medium to flow along the walls and the gas working medium to rise and separate through the center of the chamber, improving the two-phase circulation efficiency within the cavity within the substrate.

[0020] The turbulence generators 310 may have various structures. For example, the simple turbulence generators 310 structures shown in FIGS. 4 and 5 are shown. For example, the complex turbulence generators 310 structure shown in FIG. 6 is formed by combining multiple simple turbulence generators 310. In the complex turbulence generators 310 structure, two simple turbulence generators 310 are closely arranged and the side walls are offset to form a locally intertwined overlapping structure. This locally intertwined overlapping structure of the turbulence generators provides a stronger pressure resistance than the simple turbulence generators 310. This embodiment does not specifically limit the structure of the turbulence generators 310.

[0021] In addition, within the heat-collecting cavity 210, each of the sets of turbulence generators 310 may be individually positioned by spot welding, or large-area turbulence generators 310 may be positioned integrally. Adjacent turbulence generators 310 may be closely spaced or spaced apart. The side walls of the turbulence generators 310 may be aligned parallel to each other, or may be offset to form an overlapping structure with localized overlaps. In this embodiment, the method of installing the turbulence generators 310 is not specifically limited.

[0022] 4 to 6, the turbulence generating piece 310 includes a plurality of array elements 311. The cross-sectional shape of the array element 311 may be a square, trapezoid, rectangle, Z-shape, V-shape, or W-shape, and is not specifically limited in this embodiment.

[0023] The heat dissipation member 130 is a fin provided with a heat dissipation duct 230. The heat dissipation member 130 and the substrate cover plate 120 may be installed vertically or at an angle, and this embodiment is not specifically limited thereto.

[0024] Furthermore, it may be understood that the heat dissipation member 130 having the heat dissipation conduit 230 can be filled with the flow of gaseous or liquid refrigerant within the heat dissipation conduit 230. When the temperature of the gaseous or liquid refrigerant exceeds a threshold, the liquid gaseous or liquid refrigerant vaporizes, and the vaporized gaseous or liquid refrigerant flows upward, exchanging heat with the cool air in the external environment via the surface of the heat dissipation member 130. When the temperature of the vaporized gaseous or liquid refrigerant drops below the threshold, it liquefies, and the liquefied gaseous or liquid refrigerant flows downward under the action of gravity. This achieves a circulating flow.

[0025] 7, in one embodiment, when large-area turbulators 310 are used and mounted on the substrate base 110 for integral positioning, localized areas of the turbulators 310 may be hollowed out by laser engraving or other methods, thereby reducing the flow resistance within the heat-collection cavity 210. Furthermore, the large-area, integrated turbulators 310 structure utilizes the structural continuity between the turbulators 310 for integral positioning, thereby reducing the risk of the turbulators 310 being displaced unevenly during welding, which could block the heat-dissipation duct 230.

[0026] 8, in one embodiment, the cavity of the turbulence generating piece 310 is approximately perpendicular to the direction of gravity during use. The turbulence generating piece 310 and the heat dissipation member 130 are installed so as to be spaced apart and intersect with each other. The turbulence generating piece 310 is not installed in the substrate cover plate 120 at the position of the through groove 220 for gas-liquid exchange with the heat dissipation member 130. The edge distance between the turbulence generating piece 310 and the through groove 220 for gas-liquid exchange is 1 mm or more.

[0027] 9, in one embodiment, when the cavity of the turbulence generating piece 310 is substantially parallel to the direction of gravity, the turbulence generating piece 310 may be configured as a flat sheet at the location of the gas-liquid exchange through-hole 220, with the bottom surface of the flat sheet in close contact with the side of the cavity of the substrate base 110, and a gap space maintained between the top surface of the flat sheet and the gas-liquid exchange through-hole. That is, to prevent the turbulence generating piece 310 from blocking the through-hole 220, the portion of the turbulence generating piece 310 that comes into close contact with the substrate cover plate 120 is offset from the through-hole 220. Here, the distance between the edge of the flat sheet and the edge of the gas-liquid exchange through-hole 220 is 1 mm or more.

[0028] 10, in one embodiment, when the cavity of the turbulence generating pieces 310 is approximately parallel to the direction of gravity, the portion of each turbulence generating piece 310 that is in close contact with the substrate cover plate 120 is offset from the heat dissipation duct 230. This prevents the turbulence generating pieces 310 from blocking the heat dissipation duct 230 and hindering the gas-liquid exchange between the heat collection cavity 210 and the heat dissipation duct 230 of the heat dissipation member 130.

[0029] In one embodiment, as shown in FIG. 3 , a circumferential counterbore hole is provided inside the substrate base 110 to separate the heat collection cavity 210. The circumferential counterbore hole enhances the connection strength and airtightness between the substrate base 110 and the substrate cover plate 120. The circumferential counterbore hole may be integral with the substrate base 110 or the substrate cover plate 120, and this embodiment is not specifically limited thereto. The internal cavity of the substrate base 110 is provided with a circumferential counterbore hole. The bottom surface of the substrate cover plate 120 is tightly connected to the top surface of the circumferential counterbore hole. The side surface of the substrate cover plate 120 is tightly installed against the periphery of the internal cavity of the substrate base 110. The substrate cover plate 120 and the substrate base 110 separate the heat collection cavity 210 through the circumferential counterbore hole.

[0030] 11 and 12 , the heat dissipation assembly 100 is assembled with a housing 1110 to form a heat dissipation device 1100. The heat dissipation member 130 can reduce the discontinuity between the fins on the housing 1110 and the external extension structure 330, thereby increasing the heat dissipation area of the heat dissipation member 130. The external extension structure 330 of the heat dissipation member 130 may replace some or all of the fins on the housing 1110, and a heat dissipation conduit 230 communicating with the heat collection cavity 210 may be disposed within the external extension structure 330. The upper external extension structure 330 of the heat dissipation member 130 allows the heat dissipation member 130 to replace all of the upper fins of the housing 1110 in the height direction. In addition, the upper external extension structure 330 is provided with a heat dissipation pipe 230 communicating with the heat collection cavity 210, which increases the condensation area and heat dissipation area of the heat dissipation member 130, and further raises the liquid level in the heat collection cavity 210, thereby solving the problem of dry heating at the top of the heat collection cavity 210 and improving the two-phase circulation efficiency and heat dissipation efficiency of the heat dissipation assembly.

[0031] 2 and 12 , the substrate cover plate 120 is provided with a through-groove 220 for gas-liquid exchange corresponding to the heat dissipation member 130. The bottom of the heat dissipation member 130 can be inserted into the through-groove 220 to connect the heat dissipation conduit 230 of the heat dissipation member 130 to the heat collection cavity 210 of the substrate. To prevent the heat dissipation member 130 from being excessively inserted into the heat collection cavity 210 and blocking the gas-liquid exchange, a trapezoidal overlap-type positioning portion 430 is provided at the bottom of the heat dissipation member 130. The heat dissipation member 130 can be positioned and assembled with the through-groove 220 of the substrate cover plate 120 using the positioning portion 430.

[0032] In addition, the heat dissipation member 130 may extend downward and outward to form a downward external extension structure 330, or may extend upward and outward to form an upward external extension structure 330, and this embodiment does not specifically limit this.

[0033] In addition, the external extension structure 330 of the heat dissipation member 130 may not replace the tooth plate provided on the housing 1110, but may be positioned within the original fin flow path of the housing 1110 to form a densely packed tooth state.

[0034] The heat dissipation member 130 is provided with a heat dissipation duct 230 that communicates with the heat collection cavity. The heat dissipation duct 230 may be in a honeycomb pattern, a brachistochrone pattern, a diagonal pattern, or a combination of these patterns, but this embodiment is not limited to these. For example, as shown in FIG. 12, when the heat dissipation duct 230 is in the brachistochrone pattern or diagonal pattern, the anti-gravity high point of the heat dissipation duct 230 may be located on the crest side and the anti-gravity low point on the substrate side.

[0035] 1 and 12, an anchor 530 may be provided on the top of the heat dissipation member 130. The protective cover plate 140 of the heat dissipation device 1100 is assembled to the anchor 530 of the heat dissipation member 130 of the heat dissipation assembly 100 by a rivet method, thereby providing a protective function to the heat dissipation assembly 100. The heat dissipation member 130 may be assembled to the protective cover plate 140 by a welding method, but this embodiment is not specifically limited thereto.

[0036] During operation, the liquid refrigerant (two-phase working medium) in the heat-collection cavity 210 of the heat dissipation assembly 100 rapidly absorbs heat and vaporizes, so the substrate of the heat dissipation assembly 100 needs to be able to withstand sufficient pressure to prevent problems such as swelling and deformation that may occur due to excessive internal pressure. In this embodiment, turbulence generating pieces 310 or turbulence generating columns are installed in the heat-collection cavity 210 to increase the connection strength between the substrate base 110 and the substrate cover plate 120.

[0037] During use, the heat-generating chip is attached to the outer surface of the substrate base 110 to dissipate heat. To reduce the thermal contact resistance between the attachment surfaces, the PCB and the substrate of the heat dissipation assembly 100 are typically tightly assembled using screws, requiring the heat dissipation substrate to have screw holes for securely attaching to the PCB. As shown in FIG. 13 , concentric turbulence generating columns with screw holes are installed within the heat collection cavity 210 of the heat dissipation assembly 100. The turbulence generating columns include a first column 1320 and a second column 1310 arranged concentrically with the first column. The first column 1320 has a larger radius than the second column 1310, is installed within the heat collection cavity 210, and has a height equal to that of the heat collection cavity 210. The top and bottom surfaces of the first column 1320 are in close contact with the cavity side surfaces of the substrate base 110 and the substrate cover plate 120, respectively, thereby increasing the pressure resistance of the substrate when welded. Meanwhile, a screw hole is provided within the second pillar 1310, and the second pillar 1310 is higher than the first pillar 1320. If the position of the screw hole interferes with the heat dissipation member 130, the height of the second pillar 1310 does not exceed the upper surface of the substrate cover plate 120, and the depth of the screw hole does not penetrate the substrate cover plate 120. If the position of the screw hole does not interfere with the heat dissipation member 130, the height of the second pillar 1310 may protrude from the substrate cover plate 120. This allows fitting into a screw hole with a greater depth, improving the assembly capability between the PCB and the substrate and effectively reducing the contact thermal resistance between the chip and the substrate.

[0038] An embodiment of the present application further provides a heat dissipation device 1100 as shown in FIG. 11 . The heat dissipation device 1100 includes the heat dissipation assembly 100 and a housing 1110, as in the above-described embodiment. The technical means, problems to be solved, and technical effects achieved by the heat dissipation device 1100 are the same as those of the heat dissipation assembly 100 in the above-described embodiment, and therefore will not be described here. To further improve the function of the heat dissipation assembly 100, the heat dissipation assembly 100 needs to be tightly assembled with the housing 1110 of the heat dissipation device 1100. The heat dissipation assembly 100 and the housing 1110 may be assembled by a screw-fitting and sealing method or by a stir friction welding method, which is not specifically limited in this embodiment.

[0039] In one embodiment, the assembly of the heat dissipation assembly 100 and the housing 1110 by screwing and sealing is shown in FIG. The cooling area of the substrate base 110 defines the inner contour boundary, and an assembly flange 1410 extends outward along the inner contour boundary toward the heat dissipation member 130, higher than the upper surface of the substrate of the housing 1110. The contour edge of the assembly flange 1410 is provided with multiple protrusions 1420, with assembly screw holes 1430 formed in the centers of the protrusions 1420, and a seal groove 1440 formed along the centerline of the underside of the assembly flange 1410. An assembly through-groove is formed in the substrate of the housing 1110, based on the outer contour boundary of the substrate base 110 of the heat dissipation assembly. An assembly protrusion 1120 is provided on the upper surface of the substrate of the housing 1110, based on the boundary of the assembly through-groove and the outer contour boundary of the assembly flange 1410 of the heat dissipation assembly. The assembly protrusion 1120 fits tightly against the bottom surface of the assembly flange 1410. Screw holes of the same size are provided at positions corresponding to the assembly screw holes 1430 of the assembly flange 1410. The heat dissipation assembly 100 is positioned in close contact with the assembly protrusion 1120 on the upper surface of the substrate of the housing 1110 via the protruding assembly flange 1410 of the substrate base 110, and is fixedly assembled via the corresponding assembly screw holes 1430, with a seal strip installed in the flange seal groove 1440.

[0040] In one embodiment, the heat dissipation assembly 100 and the housing 1110 are assembled using a stir friction welding process, as shown in FIG. 15 . The cooling zone of the substrate base 110 is defined as the reference boundary, and the inner side of the reference boundary is the central bottom plate of the substrate base 110. The reference boundary extends outward beyond the heat-affected zone of the stir friction welding process, with the distance of the outward extension being 2 mm or greater. The substrate base 110 has a first circumferential thickened region 410 within the extension range of the reference boundary, the first circumferential thickened region 410 having a height equal to or greater than the depth of the weld joint in the stir friction welding process. An assembly through-groove is drilled in the substrate of the housing 1110, based on the circumferential outer edge boundary of the substrate base 110 of the heat dissipation assembly 100. The outward extension range from the assembly through-groove boundary is equal to or greater than the shoulder radius of the welding process. The substrate of the housing 1110 is locally thickened within the extension range in the form of a second circumferential thickened region 1510, with a height equal to or greater than the depth of the weld joint in the stir friction welding process. The first circumferential thickened region 410 of the substrate base 110 of the heat dissipation assembly and the second circumferential thickened region 1510 of the substrate of the housing 1110 are assembled in close contact with each other via their sides and fixedly connected by stir friction welding. Note that, in friction stir welding, the workpiece material is locally melted by using heat generated by friction between a rapidly rotating welding tool and the workpiece, and as the welding tool moves forward along the weld interface, the plasticized material flows from the front to the rear of the welding tool due to the rotational frictional force of the welding tool and is pushed out by the welding tool to form a dense solid-state weld seam.

[0041] An embodiment of the present application provides a heat dissipation assembly and a heat dissipation device. The heat dissipation assembly includes a substrate base, a substrate cover plate, a turbulence generating member, and a plurality of heat dissipation members. The substrate cover plate is connected to the substrate base to form a heat collection cavity for concentrating heat. The turbulence generating member includes a turbulence generating piece and a turbulence generating column, and is installed within the heat collection cavity. The turbulence generating piece is flush with the heat collection cavity. The turbulence generating piece is disposed in at least partial contact with the substrate base and at least partial contact with the substrate cover plate. Sidewalls of the turbulence generating piece are disposed between the substrate cover plate and the substrate base. The sidewalls of the turbulence generating piece support the substrate cover plate and the substrate base. An air space is provided between adjacent sidewalls of the turbulence generating piece. The plurality of heat dissipation members are connected to the substrate cover plate. The heat dissipation member is provided with one or more heat dissipation ducts that are configured to communicate with the heat collection cavity. The top surface of the turbulence generator is tightly fitted to the cavity side of the substrate cover plate, and the bottom surface of the turbulence generator is tightly fitted to the cavity side of the substrate base. The side walls of the turbulence generator are sandwiched between the substrate cover plate and the substrate base to form a support, improving the pressure resistance, structural strength, and reliability of the heat dissipation device. The cavity between the adjacent side walls of the turbulence generator serves as a gas-liquid separation channel, allowing the liquid working medium to flow along the wall. The gas working medium rises through the center of the cavity and separates, improving the two-phase circulation efficiency of the cavity inside the substrate. Furthermore, when the high-temperature gas and liquid working medium passes through the turbulence generator, the high-temperature gas and liquid flow is obstructed by the turbulence generator, causing the high-temperature gas and liquid flow to bypass the turbulence generator, forming vortices on the side of the turbulence generator and breaking up the thermal boundary layer on the surface of the turbulence generator. This significantly reduces thermal resistance, increases the heat transfer coefficient, and enhances heat transfer.

[0042] The above describes the embodiments of the present application in detail in combination with the accompanying drawings, but the present application is not limited to the above embodiments, and various modifications are possible within the scope of knowledge possessed by a person skilled in the art without departing from the gist of the present application.

Claims

1. A heat dissipation assembly, comprising: The heat dissipation assembly includes: A substrate base; a substrate cover plate connected to the substrate base and forming a heat collection cavity for concentrating heat; a turbulator disposed within the heat-collection cavity, the turbulator comprising one or more turbulator pieces, the turbulator pieces having the same height as the heat-collection cavity, the turbulator pieces being disposed in at least partial contact with the substrate base and at least partial contact with the substrate cover plate, side walls of the turbulator pieces being disposed between the substrate cover plate and the substrate base, the side walls supporting the substrate cover plate and the substrate base, and an empty space being defined between adjacent side walls of the turbulator pieces; a plurality of heat dissipation members connected to the substrate cover plate, each heat dissipation member having one or more heat dissipation conduits, the heat dissipation conduits being connected to the heat collection cavity; Including, The substrate cover plate is provided with a through-groove, the heat dissipation member is positioned and assembled with the through-groove through a positioning part at the bottom, and the heat dissipation duct communicates with the heat collection cavity through the through-groove. Heat dissipation assembly.

2. the turbulator includes a plurality of array elements; The cross-sectional shape of the array elements includes at least one of a triangle shape, a trapezoid shape, a rectangle shape, a Z shape, a V shape, and a W shape. The heat dissipation assembly of claim 1 .

3. The arrangement of adjacent turbulence generating pieces includes at least one of a spaced arrangement and a close contact arrangement. The heat dissipation assembly of claim 1 .

4. The sidewall structures of the two closely arranged turbulators may be parallel aligned structures or may be overlapping structures formed with offset positions and intersecting locally. The heat dissipation assembly of claim 3 .

5. Two or more closely arranged turbulence generating piece units constitute an integrated complex turbulence generating piece unit structure. The heat dissipation assembly of claim 4.

6. The turbulence generating piece has a portion thereof that is in close contact with the substrate cover plate and is offset from the through groove so that the turbulence generating piece does not block the through groove. The heat dissipation assembly of claim 1 .

7. The turbulence generating piece is arranged so that a portion of the turbulence generating piece that is in close contact with the substrate cover plate is offset from the heat dissipation pipe so as not to block the heat dissipation pipe. The heat dissipation assembly of claim 1 .

8. the substrate base is provided with turbulence generating columns; the turbulence generating columns include a first column and a second column provided concentrically with the first column, the first cylinder has a larger radius than the second cylinder, is disposed within the heat collection cavity, and has a height equal to the height of the heat collection cavity; The second pillar has a screw hole and is higher than the first pillar. The heat dissipation assembly of claim 1 .

9. The heat dissipation member includes external extension structures extending from both sides of the heat dissipation member in the gravity direction, and the external extension structures make the dimension of the heat dissipation member in the gravity direction larger than the longitudinal dimension of the substrate base. The heat dissipation assembly of claim 1 .

10. The shape structure of the heat dissipation pipe includes at least one of a honeycomb shape, a brachistochrone shape, and a diagonal shape. The heat dissipation assembly of claim 1 .

11. A heat dissipation assembly comprising the heat dissipation assembly of any one of claims 1 to 10. Heat dissipation device.

12. The heat sink assembly further includes a housing, the heat sink assembly being hermetically connected to the housing. The heat dissipation device of claim 11.

13. The heat dissipation assembly is connected to the housing by screwing, or the heat dissipation assembly is connected to the housing by stir friction welding. The heat dissipation device of claim 12.

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