Holding member

Abstract

To provide a technique to suppress arcing relating to a connection terminal built in a holding member.SOLUTION: A holding member comprises: a plate-like member having a first principal surface on which an object is placed and a second principal surface which is a rear face of the first principal surface; a base member which has a third principal surface bonded to the second principal surface of the plate-like member, and which has a hole part opened on the third principal surface; and an insulation terminal part which is bonded to the second principal surface of the plate-like member, and at least part of which is disposed inside the hole part of the base member. The insulation terminal part has: a terminal whose central axis is bonded substantially perpendicular to the second principal surface of the plate-like member; a first insulation member in a hollow tubular shape which is disposed on the outer periphery of the terminal; and a second insulation member which covers at least part of the outer peripheral edge of a bonding surface between the first insulation member and the plate-like member.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a holding member for holding an object. [Background technology]

[0002] Electrostatic chucks, for example, are used as holding members for holding objects such as wafers during semiconductor manufacturing. Known electrostatic chuck devices include a metal base member and a ceramic substrate (also referred to as a "mounting substrate" on which the object is placed) provided on the base member. Conventionally, some such electrostatic chucks have connection terminals disposed inside the metal base member for electrical connection with external devices (see, for example, Patent Documents 1 and 2). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2010-103321 [Patent Document 2] Japanese Patent Application Laid-Open No. 2015-207765 Summary of the Invention [Problem to be solved by the invention]

[0004] When connection terminals are disposed inside a metal base member, arcing may occur between the metal base member and the connection terminals. Even when the base member is not made of metal, for example, when the joint between the mounting substrate and the base member is made of metal, arcing may occur between the joint and the connection terminals.

[0005] The present invention has been made to solve the above-mentioned problems, and has an object to provide a technique for suppressing arcing relating to a connection terminal built into a holding member. [Means for solving the problem]

[0006] The present invention has been made to solve the above-mentioned problems, and can be realized in the following forms.

[0007] (1) According to one aspect of the present invention, there is provided a holding member, the holding member comprising: a plate-shaped member having a first main surface on which the object is placed and a second main surface opposite to the first main surface; a base member having a third main surface joined to the second main surface of the plate-shaped member and having a hole opening to the third main surface; and an insulating terminal unit joined to the second main surface of the plate-shaped member and at least a portion of the insulating terminal unit disposed within the hole of the base member, the insulating terminal unit comprising a terminal whose central axis is joined to the second main surface of the plate-shaped member substantially perpendicularly; a hollow tubular first insulating member disposed on the outer periphery of the terminal; and a first insulating member having a tubular shape and a third insulating member. and a second insulating member formed over a portion of the outer peripheral surface and a portion of the second main surface of the plate-shaped member and covering at least a portion of the outer peripheral edge of the joint surface between the first insulating member and the plate-shaped member, wherein in a cross section including the central axis of the terminal of the holding member, a first line indicating the surface of the second insulating member is a curve recessed toward the second line and the third line from an imaginary straight line connecting a first point where a second line indicating the outer peripheral surface of the first insulating member and the first line intersect, and a second point where a third line indicating the second main surface of the plate-shaped member and the first line intersect.

[0008] According to this configuration, the second insulating member covers the joint between the first insulating member and the plate-shaped member, thereby enhancing insulation. Therefore, arcing related to the terminals, such as arcing between the base member and the terminals, or arcing between the terminals and a joint member connecting the plate-shaped member and the base member, can be suppressed. As a result, the second insulating member maintains the joint strength between the first insulating member and the plate-shaped member while suppressing arcing.

[0009] In addition, in a cross section of the holding member including the central axis of the terminal, a first line representing the surface of the second insulating member is a curve recessed toward the second and third lines from an imaginary line connecting a first point where a second line representing the outer peripheral surface of the first insulating member intersects with the first line and a second point where a third line representing the second main surface of the plate-like member intersects with the first line. In other words, because the first line representing the surface of the second insulating member is recessed from the imaginary line, interference with the base member can be reduced compared to when the first line representing the surface of the second insulating member coincides with the imaginary line. Furthermore, because the second insulating member is thinner than when the first line representing the surface of the second insulating member coincides with the imaginary line, a reduction in heat transfer between the plate-like member and the base member can be reduced even when the second insulating member is made of a material with relatively low thermal conductivity.

[0010] (2) In the holding member of the above embodiment, the second insulating member may cover the entire outer periphery of the joint surface between the first insulating member and the plate-like member. This can further strengthen the insulation and suppress arcing. Also, the joint strength between the first insulating member and the plate-like member by the second member can be further improved.

[0011] (3) The holding member of the above aspect may further include an insulating joint portion disposed between the second main surface of the plate-shaped member and the first insulating member, joining the plate-shaped member and the first insulating member, and the second insulating member may be integrally formed and connected to the joint portion. This is preferable because it improves strength compared to when there is a boundary between the joint portion and the second insulating member. Furthermore, it is possible to reduce the number of steps required to manufacture the holding member compared to when the joint portion and the second insulating member are formed separately.

[0012] (4) In the holding member of the above aspect, the material forming the plate-like member may have a different thermal expansion coefficient from the material forming the base member, and the base member may be disposed with a gap between them. In this way, when the plate-like member and the base member expand and contract with a change in temperature of the holding member, it is possible to prevent the second insulating member and the base member from coming into contact with each other and exerting force on each other.

[0013] The present invention can be realized in various forms, for example, in the form of a semiconductor manufacturing apparatus including a holding member, a manufacturing method of a holding member, and the like. [Brief explanation of the drawings]

[0014] [Figure 1] 1 is a perspective view schematically illustrating an external configuration of an electrostatic chuck according to an embodiment. [Figure 2] FIG. 2 is an explanatory view schematically showing an XZ cross-sectional configuration of the electrostatic chuck. [Figure 3] 3 is an explanatory view schematically showing the XZ cross-sectional configuration of an insulating terminal portion. FIG. [Figure 4] FIG. 4 is an explanatory diagram schematically showing a cross section taken along the line AA shown in FIG. [Figure 5] 4 is an explanatory diagram showing an enlarged view of a portion P shown in FIG. 3. FIG. [Figure 6] 5A to 5C are explanatory diagrams of a method for forming an insulating terminal portion. [Figure 7] FIG. 10 is an explanatory view schematically illustrating a cross-sectional configuration of a portion of an electrostatic chuck of a comparative example. DETAILED DESCRIPTION OF THE INVENTION

[0015] FIG. 1 is a perspective view schematically illustrating the external configuration of an electrostatic chuck 10 according to one embodiment of the present invention. FIG. 2 is an explanatory diagram schematically illustrating the XZ cross-sectional configuration of the electrostatic chuck 10. In FIG. 2, the positive Y-axis direction is the direction toward the back of the page. In the figure, mutually orthogonal X, Y, and Z axes are shown to identify directions. For convenience, in this specification, the positive Z-axis direction is referred to as the upward direction, and the negative Z-axis direction is referred to as the downward direction; however, the electrostatic chuck 10 may actually be installed in an orientation different from these orientations.

[0016] The electrostatic chuck 10 is a device that attracts and holds an object (e.g., a wafer W) by electrostatic attraction, and is used, for example, to fix the wafer W in a vacuum chamber of a semiconductor manufacturing device. The electrostatic chuck 10 includes a plate-like member 100 and a base member 200 that are arranged side by side in the vertical direction (Z-axis direction), and the plate-like member 100 and the base member 200 are joined by a joining member 500. The electrostatic chuck 10 in this embodiment is also referred to as a "holding member."

[0017] The plate-shaped member 100 is a plate-shaped member having a first main surface S1, which is a substantially circular, flat mounting surface, and a second main surface S2, which is the back surface of the first main surface S1, and is made of ceramic (for example, ceramic containing alumina, aluminum nitride, or the like as its main component). In addition, a recess 102 is formed on the second main surface S2 of the plate-shaped member 100, to which an insulating terminal portion 300, which will be described later, is bonded (FIG. 2).

[0018] An attraction electrode 120 (FIG. 2) made of a conductive material (e.g., a material containing tungsten, molybdenum, or the like as a main component) is disposed inside the plate-shaped member 100. The shape of the attraction electrode 120 as viewed in the Z-axis direction is, for example, substantially circular. When a voltage is applied to the attraction electrode 120 from a power source (not shown), an electrostatic attraction force is generated, and the wafer W is attracted and fixed to the first main surface S1 of the plate-shaped member 100 by this electrostatic attraction force.

[0019] The base member 200 is a plate-shaped member having a third main surface S3 that is substantially circular and flat and has a larger diameter than the plate-shaped member 100. As shown in FIG. 2, the third main surface S3 of the base member 200 is joined to the second main surface S2 of the plate-shaped member 100 via a joining member 500, thereby joining the plate-shaped member 100 and the base member 200. The base member 200 is formed of a metal material such as aluminum or an aluminum alloy. The joining member 500 is formed of an adhesive material such as a silicone-based resin, an acrylic-based resin, or an epoxy-based resin, with a silicone-based adhesive being more preferred because of its excellent flexibility and heat resistance. In this embodiment, the material constituting the plate-shaped member 100 and the material constituting the base member 200 have different thermal expansion coefficients.

[0020] A coolant flow path (not shown) is formed inside the base member 200, and when a coolant (for example, a fluorine-based inert liquid or water) flows through the coolant flow path, the base member 200 is cooled, and the plate-shaped member 100 is cooled by heat transfer between the base member 200 and the plate-shaped member 100 via the bonding member 500, and the wafer W held on the first main surface S1 of the plate-shaped member 100 is cooled. In this way, temperature control of the wafer W is achieved.

[0021] 2, the base member 200 has a hole 210, which is a through-hole that opens to the third main surface S3. Inside the hole 210, an insulating terminal portion 300 is arranged.

[0022] Fig. 3 is an explanatory diagram schematically showing the XZ cross-sectional configuration of the insulating terminal portion 300. Fig. 4 is an explanatory diagram schematically showing the AA cross-section shown in Fig. 3. Fig. 5 is an explanatory diagram showing an enlarged view of part P shown in Fig. 3.

[0023] 3, the insulating terminal portion 300 includes a terminal 310, a hollow cylindrical first insulating member 320 disposed on the outer periphery of the terminal 310, and a second insulating member 330. In this embodiment, the terminal 310 is a female terminal. The terminal 310 is joined to the recess 102 in the second main surface S2 of the plate-shaped member 100, with its central axis line LO extending substantially perpendicularly thereto. The terminal 310 is joined to the plate-shaped member 100 by, for example, brazing. The terminal 310 is electrically connected to the chucking electrode 120 by an electrode terminal (not shown). When a male terminal electrically connected to an external device is inserted into the hole 312 of the terminal 310 and electrically connected to the terminal 310, the electrostatic chuck 10 and the external device are electrically connected to each other.

[0024] The first insulating member 320 is joined to the second main surface S2 of the plate-shaped member 100 via a joining portion 400, with one end of the first insulating member 320 inserted in the recess 102 in the second main surface S2 of the plate-shaped member 100. As shown in the figure, a terminal 310 is disposed inside the first insulating member 320. In this embodiment, the first insulating member 320 is primarily composed of polyimide (PI). In other embodiments, the first insulating member 320 may be primarily composed of a thermosetting resin with high heat resistance, such as phenolic resin, melamine resin, epoxy resin, or silicone resin. In this embodiment, the joining portion 400 is primarily composed of silicone resin. In other embodiments, the first insulating member 320 may be primarily composed of a thermosetting insulating resin with high heat resistance, such as epoxy resin or polyurethane.

[0025] The second insulating member 330 is formed over a portion of the outer peripheral surface 322 of the first insulating member 320 and a portion of the second main surface S2 of the plate-shaped member 100 (FIG. 3), and covers the entire outer peripheral edge 326 (FIG. 4) of the joint surface 324 between the first insulating member 320 and the plate-shaped member 100. In other words, the second insulating member 330 covers the entire outer peripheral edge of the joint 400. As shown in FIG. 4, the XY cross-sectional shape of the second insulating member 330 is substantially annular. In this embodiment, the second insulating member 330 is primarily composed of silicone resin. In other embodiments, the second insulating member 330 may be primarily composed of a thermosetting insulating resin with high heat resistance, such as epoxy resin or polyurethane.

[0026] In this embodiment, the second insulating member 330 is made of the same material as the joint portion 400, and is connected to and integrally formed with the joint portion 400.

[0027] 5 , in a cross section including the central axis LO of the terminal 310 of the electrostatic chuck 10, a first line L1 indicating the surface of the second insulating member 330 is a curved line recessed toward the second line L2 and the third line L3 from an imaginary line VL connecting a first point P1, where the second line L2 indicating the outer peripheral surface 322 of the first insulating member 320 and the first line L1 intersect, and a second point P2, where the third line L3 indicating the second main surface S2 of the plate-shaped member 100 and the first line L1 intersect. In other words, the area of the cross section of the second insulating member 330 including the central axis LO of the terminal 310 is smaller than the area of the triangle formed by the first line L1, the second line L2, and the imaginary line VL. That is, the second insulating member 330 is thinner and has a smaller volume than when the first line L1 indicating its surface coincides with the imaginary line VL. In this embodiment, the second insulating member 330 is mainly made of silicone resin, which has low thermal conductivity, so reducing the volume can prevent a decrease in heat transfer. Also, by configuring the cross-sectional shape of the second insulating member 330 in this way, interference with the base member 200 can be prevented.

[0028] FIG. 6 is an explanatory diagram of a method for forming the insulated terminal portion 300. FIG. 6 illustrates a cross section corresponding to FIG. 3. First, as shown in FIG. 6(A), a plate-shaped member 100 is prepared, with a terminal 310 brazed to a recess 102 on the second main surface S2. Next, as shown in FIG. 6(B), adhesive G, primarily composed of silicone resin, is injected into the gap between the recess 102 on the second main surface S2 of the plate-shaped member 100 and the terminal 310. A similar adhesive G, primarily composed of silicone resin, is also applied to the outer peripheral surface 314 of the terminal 310. Then, the first insulating member 320 is placed over the terminal 310 so that the terminal 310 fits within the cavity of the first insulating member 320. As shown in FIG. 6(C), when one end of the first insulating member 320 is pressed into the recess 102 on the second main surface S2 of the plate-shaped member 100, the adhesive G injected into the recess 102 is extruded and hardened, thereby forming the second insulating member 330.

[0029] Fig. 7 is an explanatory diagram schematically illustrating a cross-sectional configuration of a portion of an electrostatic chuck 10P of a comparative example. Fig. 7 is a diagram corresponding to Fig. 3. The electrostatic chuck 10P of the comparative example differs from the electrostatic chuck 10 of the above-described embodiment in the configuration of an insulating terminal portion 300P and the surface SC of a hole portion 210P of a base member 200P. The same components as those of the electrostatic chuck 10 of the embodiment are denoted by the same reference numerals, and the preceding description is to be referred to.

[0030] In the electrostatic chuck 10P of the comparative example, the insulating terminal portion 300P includes a terminal 310 and a first insulating member 320, but does not include the second insulating member 330 of the above embodiment. That is, in the electrostatic chuck 10P of the comparative example, the outer peripheral edge 326 of the bonding surface 324 of the first insulating member 320 with the plate-shaped member 100 is not covered with an insulating member. Also, in the base member 200P, the C-chamfered surface SCP of the opening of the hole 210P on the third main surface S3 side is smaller than the surface SC of the above embodiment. That is, the depth of the C-chamfer in the base member 200P of the comparative example is shallower than that in the base member 200 of the above embodiment. Therefore, the distance between the terminal 310 and the base member 200P is shorter than in the electrostatic chuck 10 of the above embodiment, and the insulation of the bonding portion between the plate-shaped member 100 and the first insulating member 320 is also lower than in the electrostatic chuck 10 of the above embodiment. Therefore, arcing is likely to occur between the terminal 310 and the base member 200P.

[0031] In contrast, according to the electrostatic chuck 10 of this embodiment, the second insulating member 330 covers the entire outer circumferential edge 326 (FIG. 4) of the joint surface 324 between the first insulating member 320 and the plate-shaped member 100, thereby enhancing the insulating properties. Therefore, arcing between the terminal 310 and the base member 200 can be suppressed more effectively than in the electrostatic chuck 10P of the comparative example.

[0032] In the plate-shaped member 100 of this embodiment, the corner of the opening of the hole 210 in the base member 200 on the third main surface S3 side is C-chamfered (45° chamfered), and the chamfered surface SC is formed large enough to prevent interference between the base member 200 and the second insulating member 330. Therefore, the base member 200 and the second insulating member 330 are arranged with a gap between them. This also makes it possible to suppress arcing between the terminal 310 and the base member 200.

[0033] 5, the XZ cross-sectional shape of the second insulating member 330 is a recessed shape, which can suppress interference with the base member 200. In other words, it is possible to suppress the base member 200 from being supported by the second insulating member 330. Furthermore, because the second insulating member 330 is thin and has a small volume, it is possible to suppress a decrease in heat transfer between the plate-shaped member 100 and the base member 200.

[0034] In this embodiment, the plate-shaped member 100 is made of ceramic, and the base member 200 is made of metal, and they have different thermal expansion coefficients. When the plate-shaped member 100 and the base member 200 expand and contract with temperature changes during use of the electrostatic chuck 10, if there is no gap between the base member 200 and the second insulating member 330, the difference in thermal expansion coefficients between the plate-shaped member 100 and the base member 200 could cause the second insulating member 330 to come into contact with the base member 200 and be damaged. In contrast, according to the plate-shaped member 100 of this embodiment, the base member 200 and the second insulating member 330 are arranged with a gap between them, which can suppress interference between the base member 200 and the second insulating member 330 due to temperature changes during use of the electrostatic chuck 10, and can suppress damage to the second insulating member 330.

[0035] Furthermore, in this embodiment, since the second insulating member 330 is integrally formed and connected to the bonding portion 400, the number of steps required to manufacture the electrostatic chuck 10 can be reduced compared to when the bonding member 500 and the second insulating member 330 are formed separately.

[0036] <Modification of this embodiment> The present invention is not limited to the above-described embodiment, and can be embodied in various forms without departing from the spirit of the invention. For example, the following modifications are also possible.

[0037] In the above embodiment, the second insulating member 330 covers the entire outer periphery 326 of the joint surface 324 between the first insulating member 320 and the plate-shaped member 100, but the second insulating member 330 may cover only a portion of the outer periphery 326 of the joint surface 324 between the first insulating member 320 and the plate-shaped member 100. Even in this case, arcing can be suppressed more effectively than in a configuration that does not include the second insulating member 330 (for example, the electrostatic chuck 10P of the comparative example).

[0038] In the above embodiment, the second insulating member 330 is integrally formed with the joint 400. However, the second insulating member 330 and the joint 400 may be formed separately. For example, the second insulating member 330 may be bonded to the plate-shaped member 100 via the joint 400, and then an adhesive primarily composed of a thermosetting insulating resin may be applied and cured to cover the outer periphery 326 of the joint surface 324 of the first insulating member 320 where the first insulating member 320 is bonded to the plate-shaped member 100. Alternatively, a pre-formed second insulating member 330 may be bonded to the plate-shaped member 100 via the joint 400. When the second insulating member 330 and the joint 400 are formed separately, the second insulating member 330 and the joint 400 may be formed from different materials.

[0039] The method for forming the insulating terminal portion 300 is not limited to the above embodiment.

[0040] The above embodiment may be configured without the joining portion 400. For example, the first insulating member 320 may be joined to the plate-shaped member 100 by fitting, and the joining between the first insulating member 320 and the plate-shaped member 100 may be further strengthened by the second insulating member 330.

[0041] The thermal expansion coefficient of the material constituting the plate-shaped member 100 may be the same as that of the material constituting the base member 200. Alternatively, the thermal expansion coefficient of the material constituting the plate-shaped member 100 may be greater than that of the material constituting the base member 200.

[0042] In the above embodiment, an example was shown in which the base member 200 was disposed with a gap between it and the second insulating member 330, but the base member may be disposed without a gap between it and the second insulating member.

[0043] In the above embodiment, a female terminal is exemplified as the terminal 310, but a male terminal may also be used. When a male terminal is used as the terminal of the insulating terminal portion, the first insulating member is disposed on the outer periphery of the male terminal so that the first insulating member is disposed on the outer periphery of the female terminal when the male terminal is connected to the female terminal of the external device.

[0044] The materials for forming the components of the electrostatic chuck 10 are not limited to those described in the above embodiment. For example, the base member may be formed from a material other than metal, such as ceramic (AlSi, Si, etc.). When both the plate-shaped member and the base member are ceramic members, the plate-shaped member and the base member may be joined together by a metal joining member, for example. Even in such a configuration, if the insulating terminal portion is configured as in the above embodiment, arcing between the terminal and the metal joining member can be suppressed.

[0045] The electrostatic chuck 10 of the above embodiment may further include a plurality of heater electrodes formed of resistance heating elements made of a conductive material (e.g., a material containing tungsten, molybdenum, or the like) inside the plate-shaped member 100. In this configuration, the plate-shaped member 100 is heated by the heat generated by the heater electrodes, and the wafer W held on the first main surface S1 of the plate-shaped member 100 can be heated. This allows for more accurate temperature control of the wafer W.

[0046] In the above embodiment, an electrostatic chuck is used as an example of a holding member, but the holding member is not limited to an electrostatic chuck and can be configured as various holding members that hold an object on the surface of a plate-like member. For example, the holding member can be configured as a heater device, susceptor, or mounting table for a vacuum device for CVD, PVD, PLD, etching, etc.

[0047] In the above embodiment, the plate-shaped member 100 is a plate-shaped member having a substantially circular plane, but the planar shape of the plate-shaped member 100 is not limited to the above embodiment. For example, the plate-shaped member may have a rectangular plane, a polygonal plane, or the like.

[0048] The present invention has been described above based on embodiments and modifications, but the above-described embodiments are intended to facilitate understanding of the present invention and are not intended to limit the present invention. The present invention may be modified or improved without departing from the spirit and scope of the claims, and the present invention includes equivalents thereof. Furthermore, if a technical feature is not described as essential in this specification, it may be deleted as appropriate. [Explanation of symbols]

[0049] 10, 10P...Electrostatic chuck 100...Plate-shaped member 102...recess 120…Adsorption electrode 200, 200P...Base material 210, 210P, 312...hole 300, 300P...insulated terminal part 310...Terminal 314...Outer surface 320...First insulating member 322…Outer surface 324...joint surface 326...Outer edge 330...Second insulating member 400…Joint part 500... Joint material G...adhesive L1...first line L2...second line L3...Third line LO…Center axis line P1...first point P2: Second point S1...First principal surface S2…Second principal surface S3: Third principal surface SC, SCP…plane VL...imaginary line W...wafer

Claims

1. A holding member for holding an object, a plate-like member having a first main surface on which the object is placed and a second main surface that is the back side of the first main surface; a base member having a third main surface joined to the second main surface of the plate-like member, the base member having a hole formed in the third main surface; an insulating terminal portion joined to the second main surface of the plate-like member and at least a portion of which is disposed within the hole portion of the base member, The insulating terminal portion is a terminal joined to the second main surface of the plate-like member with its central axis line substantially perpendicular thereto; a hollow tubular first insulating member disposed on the outer periphery of the terminal; a second insulating member formed across a portion of the outer peripheral surface of the first insulating member and a portion of the second main surface of the plate-shaped member, and covering at least a portion of the outer peripheral edge of the joining surface between the first insulating member and the plate-shaped member; Equipped with In a cross section including the central axis of the terminal of the holding member, a first line indicating the surface of the second insulating member is a curved line recessed toward the second line and the third line from an imaginary straight line connecting a first point where a second line indicating the outer peripheral surface of the first insulating member and the first line intersect, and a second point where a third line indicating the second main surface of the plate-like member and the first line intersect, a thermal expansion coefficient of a material forming the plate-like member is different from a thermal expansion coefficient of a material forming the base member; The base member is disposed with a gap between it and the second insulating member. Holding member.

2. A holding member for holding an object, a plate-like member having a first main surface on which the object is placed and a second main surface that is the back side of the first main surface; a base member having a third main surface joined to the second main surface of the plate-like member, the base member having a hole formed in the third main surface; an insulating terminal portion joined to the second main surface of the plate-like member and at least a portion of which is disposed within the hole portion of the base member, The insulating terminal portion is a terminal joined to the second main surface of the plate-like member with its central axis line substantially perpendicular thereto; a hollow tubular first insulating member disposed on the outer periphery of the terminal; a second insulating member formed across a portion of the outer peripheral surface of the first insulating member and a portion of the second main surface of the plate-shaped member, and covering at least a portion of the outer peripheral edge of the joining surface between the first insulating member and the plate-shaped member; Equipped with In a cross section including the central axis of the terminal of the holding member, a first line indicating the surface of the second insulating member is a curved line recessed toward the second line and the third line from an imaginary straight line connecting a first point where a second line indicating the outer peripheral surface of the first insulating member and the first line intersect, and a second point where a third line indicating the second main surface of the plate-like member and the first line intersect, The second insulating member is mainly composed of resin. Holding member.

3. The holding member according to claim 1 or 2, The second insulating member covers the entire outer periphery of the joint surface between the first insulating member and the plate-like member. Holding member.

4. The holding member according to any one of claims 1 to 3, an insulating joint portion disposed between the second main surface of the plate-shaped member and the first insulating member, and joining the plate-shaped member and the first insulating member; The second insulating member is integrally formed and connected to the joint portion. Holding member.

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