Light-emitting module manufacturing method

Abstract

To provide a method for manufacturing a light-emitting module having a wire connecting between terminals, and a coating member coating the wire, which facilitates arrangement of the coating member in a desired region of a light-emitting module.SOLUTION: A method for manufacturing a light-emitting module that includes a first substrate having light-emitting elements mounted on an element mounting region and a first terminal arranged outside the element mounting region on its upper surface, and a second substrate including a second terminal arranged outside the substrate mounting region where the first substrate is mounted on its upper surface, includes the steps of: preparing an intermediate body where the first substrate is mounted in the substrate mounting region; connecting the first terminal and the second terminal with a wire; arranging a first frame part inside the first terminal; arranging a second frame part outside the second terminal; arranging a first resin coating a part of the wire on the upper surface of the second substrate positioned between the first frame part and the second frame part; and arranging a second resin on the wire exposed from the first resin.SELECTED DRAWING: Figure 15

Description

[Technical Field]

[0001] The present disclosure relates to a method for manufacturing a light emitting module. [Background technology]

[0002] Light-emitting devices and light-emitting modules having light-emitting elements such as light-emitting diodes are known. One example is a light-emitting device having a submount substrate, one or more light-emitting elements mounted on the submount substrate, bonding wires connecting a circuit pattern on the submount substrate to electrodes of the light-emitting elements, and a protective resin arranged around the bonding wires to enclose the bonding wires. A method for manufacturing this light-emitting device includes the steps of mounting one or more light-emitting elements on the submount substrate, connecting the circuit pattern on the submount substrate to the electrodes of the light-emitting elements with bonding wires, dripping uncured protective resin around the bonding wires to enclose the bonding wires, and then curing the resin (see Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2017-212301 Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure aims to facilitate the placement of a covering member in a desired region of a light-emitting module in a manufacturing method for the light-emitting module having wires that connect terminals and a covering member that covers the wires. [Means for solving the problem]

[0005] A method for manufacturing a light-emitting module according to an embodiment of the present disclosure includes a first substrate having, on its upper surface, an element mounting area, a light-emitting element to be mounted in the element mounting area, and a first terminal disposed outside the element mounting area, and a second substrate having, on its upper surface, a substrate mounting area on which the first substrate is to be mounted, and a second terminal disposed outside the substrate mounting area, the method including the steps of: preparing an intermediate body in which the first substrate is mounted in the substrate mounting area; connecting the first terminal and the second terminal with a wire; and arranging a first frame portion surrounding the element mounting region on the upper surface of the second substrate, the first frame portion being located inside the first terminals; arranging a second frame portion surrounding the first substrate on the upper surface of the second substrate, the second frame portion being located outside the second terminals; and arranging a covering member covering the wires, the covering member arranging including: arranging a first resin covering a part of the wires on the upper surface of the second substrate located between the first frame portion and the second frame portion; and arranging a second resin on the wires exposed from the first resin. the step of arranging the first resin includes the steps of: supplying the first resin onto an upper surface of the second substrate located between the second terminal and the second frame portion; and moving the supplied first resin below the wire. nothing. [Effects of the Invention]

[0006] According to one embodiment of the present disclosure, in a method for manufacturing a light-emitting module having a wire connecting terminals and a covering member covering the wire, it is possible to easily position the covering member in a desired area of the light-emitting module. [Brief explanation of the drawings]

[0007] [Figure 1] 1 is a perspective view schematically showing a light-emitting module according to an embodiment of the present invention; [Figure 2] 1 is a perspective view schematically illustrating a light-emitting module according to an embodiment of the present invention, with part of the configuration thereof omitted. [Figure 3] 1 is a plan view schematically showing a light-emitting module according to an embodiment of the present invention; [Figure 4] FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. [Figure 5] FIG. 2 is a cross-sectional view taken along line VV in FIG. [Figure 6]1A to 1C are plan views schematically illustrating an example of a manufacturing process of a method for manufacturing a light-emitting module according to the present embodiment. [Figure 7] 1A to 1C are plan views schematically illustrating an example of a manufacturing process of a method for manufacturing a light-emitting module according to the present embodiment. [Figure 8] 5A to 5C are cross-sectional views schematically illustrating an example of a manufacturing process of a method for manufacturing a light-emitting module according to the present embodiment. [Figure 9] 1A to 1C are plan views schematically illustrating an example of a manufacturing process of a method for manufacturing a light-emitting module according to the present embodiment. [Figure 10] 1A to 1C are plan views schematically illustrating an example of a manufacturing process of a method for manufacturing a light-emitting module according to the present embodiment. [Figure 11] 1A to 1C are plan views schematically illustrating an example of a manufacturing process of a method for manufacturing a light-emitting module according to the present embodiment. [Figure 12] 5A to 5C are cross-sectional views schematically illustrating an example of a manufacturing process of a method for manufacturing a light-emitting module according to the present embodiment. [Figure 13] 1A to 1C are plan views schematically illustrating an example of a manufacturing process of a method for manufacturing a light-emitting module according to the present embodiment. [Figure 14] 1A to 1C are plan views schematically illustrating an example of a manufacturing process of a method for manufacturing a light-emitting module according to the present embodiment. [Figure 15] 5A to 5C are cross-sectional views schematically illustrating an example of a manufacturing process of a method for manufacturing a light-emitting module according to the present embodiment. [Figure 16] 1A to 1C are plan views schematically illustrating an example of a manufacturing process of a method for manufacturing a light-emitting module according to the present embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0008] Hereinafter, a manufacturing method according to an embodiment of the present invention and a light-emitting module obtained by the manufacturing method (hereinafter, sometimes referred to as a "light-emitting module according to an embodiment") will be described with reference to the drawings. In the following description, terms indicating specific directions or positions (e.g., "upper," "lower," and other terms including these terms) will be used as necessary. However, the use of these terms is intended to facilitate understanding of the invention with reference to the drawings, and the meaning of these terms does not limit the technical scope of the present invention. Furthermore, parts that appear with the same reference numerals in multiple drawings indicate the same or equivalent parts or components.

[0009] Furthermore, the embodiments described below are intended to exemplify light-emitting modules and the like embodying the technical concepts of the present invention, and are not intended to limit the scope of the present invention. Furthermore, unless otherwise specified, the dimensions, materials, shapes, relative arrangements, and the like of the components described below are intended for illustrative purposes only and are not intended to limit the scope of the present invention. Furthermore, the content described in one embodiment may also be applied to other embodiments and modified examples. Furthermore, the size and positional relationships of components shown in the drawings may be exaggerated for clarity. Furthermore, to avoid overly complex drawings, schematic diagrams may be used in which some elements are omitted, or end views may be used as cross-sectional views showing only the cut surface.

[0010] <Light-emitting module according to the embodiment> FIG. 1 is a perspective view schematically showing a light emitting module according to this embodiment. FIG. 2 is a perspective view schematically showing the light emitting module according to this embodiment with part of its configuration omitted. FIG. 3 is a plan view schematically showing the light emitting module according to this embodiment. FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. 1. FIG. 5 is a cross-sectional view taken along line VV in FIG. 1.

[0011] As shown in Figures 1 to 5, the light-emitting module 1 of this embodiment has a first substrate 10, a second substrate 20, a light-emitting element 30, a wire 40, a first frame portion 50, a second frame portion 60, and a covering member 70.

[0012] The light-emitting module 1 may include a light-transmitting member 80 that covers the upper surfaces of the plurality of light-emitting elements 30. The light-emitting module 1 may also include a reflective member 90 that exposes the upper surfaces of the plurality of light-emitting elements 30 and covers the side surfaces in the element mounting region 10r on the upper surface 10a of the first substrate 10. Hereinafter, a case where the light-emitting module 1 includes the light-transmitting member 80 and the reflective member 90 will be described.

[0013] 2, for convenience of illustration, portions of the covering member 70, the first frame portion 50, the second frame portion 60, and the light-transmitting member 80 are omitted, and portions of the wire 40 and the light-emitting element 30 are visualized. Also, in FIG. 3, for convenience of illustration, the covering member 70 is omitted, and portions of the wire 40, the first frame portion 50, the second frame portion 60, and the like are visualized.

[0014] The first substrate 10 has, on its upper surface 10a, an element mounting region 10r and a first terminal 11 arranged outside the element mounting region 10r. A light-emitting element 30 is arranged in the element mounting region 10r of the first substrate 10. The second substrate 20 has, on its upper surface 20a, a substrate mounting region 20r on which the first substrate 10 is mounted and a second terminal 22 arranged outside the substrate mounting region 20r.

[0015] The first substrate 10 is placed on the substrate placement region 20r of the second substrate 20. A first frame 50 surrounding the element placement region 10r is arranged inside the first terminals 11 on the upper surface 10a of the first substrate 10. A second frame 60 surrounding the first substrate 10 is arranged outside the second terminals 22 on the upper surface 20a of the second substrate 20.

[0016] The first terminal 11 of the first substrate 10 is electrically connected to the second terminal 22 of the second substrate 20 by the wire 40. The first terminal 11, the second terminal 22, and the wire 40 are located between the first frame portion 50 and the second frame portion 60 in a plan view. The first terminal 11, the second terminal 22, and the wire 40 are covered by a covering member 70.

[0017] Each component of the light-emitting module 1 will be described below.

[0018] (First substrate 10) The first substrate 10 includes a flat support member and wiring arranged on the upper surface of the support member. The first substrate 10 has an element mounting region 10r on its upper surface 10a where a plurality of light-emitting elements 30 are mounted, and wiring is arranged in the element mounting region 10r. The first substrate 10 has a plurality of first terminals 11 arranged on the upper surface 10a outside the element mounting region 10r, and the first terminals 11 are electrically connected to the wiring arranged in the element mounting region 10r.

[0019] In a plan view, the first substrate 10 and the element mounting region 10r may be, for example, a rectangular region having long and short sides. For example, a plurality of light-emitting elements 30 are mounted in a matrix in the element mounting region 10r. The light-emitting elements 30 are electrically connected to one of the first terminals 11. The light-emitting elements 30 may be connected in series or parallel to the first terminals 11 in groups of a predetermined number. For example, the element mounting region 10r may have a long side length of 8 mm or more and 18 mm or less, and a short side length of 2 mm or more and 6 mm or less.

[0020] Each of the first terminals 11 has, for example, a substantially circular, elliptical, or rectangular shape. The first terminals 11 are spaced apart from one another and arranged in a row along opposing long sides of the rectangular element mounting region 10r on the upper surface 10a of the first substrate 10, sandwiching the element mounting region 10r. The interval between adjacent first terminals 11 may or may not be constant. The interval between adjacent first terminals 11 may be, for example, 20 μm or more and 100 μm or less. One end of a wire 40 is connected to the first terminal 11.

[0021] The first substrate 10 is, for example, a semiconductor substrate such as silicon. On the upper surface 10a of the first substrate 10, areas where no wiring is arranged are covered with, for example, an insulating film. Wiring may also be arranged inside or on the lower surface of the support member. For example, the first substrate 10 can be an integrated circuit substrate on which circuits for driving and controlling the multiple light-emitting elements 30 are integrated.

[0022] The first terminal 11 and the wiring may be made of, for example, metals such as Cu, Ag, Au, Al, Pt, Ti, W, Pd, Fe, and Ni, and / or alloys containing at least these metals.

[0023] (Second board) The second substrate 20 includes a flat substrate and wiring arranged on at least the upper surface of the substrate. The second substrate 20 has a substrate mounting area 20r on its upper surface 20a for mounting the first substrate 10, and further includes second terminals 22 on its upper surface outside the substrate mounting area 20r. The substrate mounting area 20r is an area on which the first substrate 10 is mounted. The substrate mounting area 20r is set as an area having approximately the same area as the shape of the first substrate 10 in a planar view. If the first substrate 10 is rectangular in a planar view, the substrate mounting area 20r can also be rectangular. Here, "approximately the same" is intended to include within an allowable range errors caused by material tolerances and mounting tolerances.

[0024] Each second terminal 22 has, for example, a substantially circular, oval, or rectangular shape. The second terminals 22 are spaced apart from one another on the upper surface 20a of the second substrate 20 and arranged in a row along opposing long sides of the rectangle, sandwiching the substrate mounting region 20r. The interval between adjacent second terminals 22 may or may not be constant. The interval between adjacent second terminals 22 may be, for example, 20 μm or more and 100 μm or less. The other end of the wire 40 is connected to the second terminal 22.

[0025] The base material constituting the second substrate 20 is preferably a material with high heat dissipation properties, and more preferably a material with high light-shielding properties and base material strength. Specific examples include metals such as Al and Cu; ceramics such as aluminum oxide, aluminum nitride, silicon nitride, and mullite; resins such as phenolic resin, epoxy resin, polyimide resin, BT resin (bismaleimide triazine resin), and polyphthalamide (PPA); and composites composed of resin and metal or ceramic (e.g., an inlay substrate in which a metal member is embedded in a resin). The base material may be flat, or may have a recess on its upper surface. In this case, the bottom of the recess of the second substrate 20 serves as a substrate mounting area 20r, and the first substrate 10 can be mounted in the recess.

[0026] The second substrate 20 may have wiring for placing the first substrate 10 on the surface of the substrate placement area 20r.

[0027] (wire) The wires 40 can be made of metals such as Au, Ag, Cu, Pt, and Al and / or alloys containing at least these metals. Au, which has excellent thermal resistance, is particularly preferred. The diameter of the wires 40 can be, for example, 15 μm to 50 μm. The wires 40 can be arranged across the long sides of the first substrate 10, which is substantially rectangular in plan view, so as to be, for example, substantially perpendicular to the long sides. Furthermore, among the multiple wires 40 arranged in a row along the long sides of the first substrate 10, the wires 40 located in the center of the row can be arranged substantially perpendicular to the long sides of the first substrate 10 in plan view, as described above, while the wires 40 located at the ends of the row can be arranged diagonally relative to the long sides of the first substrate 10 in plan view. The interval at which the wires 40 are aligned can be 20 μm to 100 μm.

[0028] (light-emitting element) The light-emitting element 30 has, for example, a substantially rectangular shape in a planar view. The light-emitting element 30 can have, for example, a square shape with sides of 40 μm to 100 μm in a planar view. The light-emitting element 30 includes a semiconductor laminate and positive and negative electrodes disposed on the surface of the semiconductor laminate. The light-emitting element 30 has positive and negative electrodes on the same side and is flip-chip mounted on the first substrate 10 with the electrode-equipped side facing downward. In this case, the upper surface opposite the electrode-equipped side serves as the main light extraction surface of the light-emitting element 30. In the light-emitting module 1, the light-emitting elements 30 are mounted on the first substrate 10 in a row and column direction, aligned with a predetermined spacing. The size and number of the light-emitting elements 30 can be appropriately selected depending on the desired configuration of the light-emitting module. Mounting a larger number of smaller light-emitting elements 30 at a higher density is particularly preferable. This allows the illumination range of the light emitted from the light-emitting module 1 to be controlled with a larger number of divisions. Such a light-emitting module 1 can be used as a light source for a high-resolution lighting system. For example, the number of light emitting elements 30 included in the light emitting module 1 can be set to 1,000 or more and 20,000 or less.

[0029] The light emitting element 30 can be selected from those with any wavelength. For example, a light emitting element 30 that emits blue light or green light can be selected from nitride semiconductors (In X Al Y Ga 1-X-Y N, 0≦X, 0≦Y, X+Y≦1) can be selected. Furthermore, semiconductors represented by GaAlAs and AlInGaP can be used as the light-emitting element 30 that emits red light. Furthermore, semiconductor light-emitting elements made of materials other than these can also be used. The composition and emitted color of the light-emitting element 30 can be selected appropriately depending on the purpose.

[0030] The light-emitting element 30 is bonded to wiring arranged in the element mounting region 10r of the first substrate 10 by a conductive bonding member. When flip-chip mounting the light-emitting element 30 on the first substrate 10, bumps made of a metal material such as Au, Ag, Cu, or Al can be used as the bonding member. Alternatively, solder such as an AuSn-based alloy or Sn-based lead-free solder can be used as the bonding member. Alternatively, a conductive adhesive made of resin containing conductive particles such as metal can be used as the bonding member. A plating method can be used to bond the light-emitting element 30 to the first substrate 10. An example of a plating material is Cu. Alternatively, the electrodes of the light-emitting element 30 and the wiring of the first substrate 10 may be in direct contact with each other without a bonding member.

[0031] (Covering material) The covering member 70 is a light-shielding member that covers the wires 40 outside the element mounting region 10r. As an example, the covering member 70 is arranged in a frame shape in a plan view so as to cover the wires 40 and surround the element mounting region 10r. The covering member 70 is arranged so as to be in contact with a first frame portion 50 and a second frame portion 60, which will be described later.

[0032] The covering member 70 is disposed at a distance from the light emitting element 30 in a planar view. The distance between the light emitting element 30 and the covering member 70 is, for example, 100 μm or more and 500 μm or less. Furthermore, in a planar view, the width of the covering member 70 located on the long side of the first substrate 10 is wider than the width of the covering member 70 located on the short side of the first substrate 10. The covering member 70 is preferably disposed so that its height (i.e., the distance from the upper surface 20a of the second substrate 20 to the upper surface of the covering member 70) is highest directly above the tops 40t of the wires 40. In other words, the covering member 70 is preferably disposed so that the tops 70t of the covering member 70 overlap the tops 40t of the wires 40. Furthermore, the tops 70t of the covering member 70 are preferably disposed so as to be higher than the tops of the first frame portion 50. In this specification, the width of the covering member 70 located on the long and short side sides of the first substrate 10 refers to the width in a direction perpendicular to the long and short sides of the first substrate 10 in a plan view. Also, the height of the covering member 70 refers to the distance from the top surface of the second substrate 20 to the top surface of the covering member 70.

[0033] Examples of the covering member 70 include resins containing a light-blocking filler. Examples of the base resin include silicone resin, modified silicone resin, epoxy resin, modified epoxy resin, and acrylic resin. Examples of light-blocking fillers include light-absorbing materials such as pigments, carbon black, titanium black, and graphite, and light-reflecting materials such as titanium oxide, aluminum oxide, zinc oxide, barium carbonate, barium sulfate, boron nitride, aluminum nitride, and glass fillers. Specifically, the exterior color of the covering member 70 may be white, which has excellent light reflectivity; black, which has excellent light absorption; or gray, which has both light reflectivity and light absorption properties. The covering member 70 may also be formed by stacking multiple resin layers. In particular, considering the deterioration of the resin due to light absorption, it is preferable to use a light-reflective white resin on at least the outermost surface of the covering member 70.

[0034] (First frame, second frame) The light-emitting module 1 has a first frame portion 50 that is disposed along the outer periphery of the element mounting region 10r on the upper surface 10a of the first substrate 10 between the element mounting region 10r and the first terminal 11 and that contacts the covering member 70. Furthermore, the light-emitting module 1 has a second frame portion 60 that is disposed on the upper surface 20a of the second substrate 20 outside the second terminal 22 and that contacts the covering member 70. In other words, the covering member 70 is disposed between the first frame portion 50 and the second frame portion 60, spanning from the upper surface 10a of the first substrate 10 to the upper surface 20a of the second substrate 20.

[0035] The covering member 70 is arranged between a first frame portion 50 arranged to surround the element mounting area 10r on the first substrate 10 and a second frame portion 60 arranged to surround the substrate mounting area 20r on the second substrate 20.

[0036] In the light-emitting module 1, the first frame 50 is disposed on the first substrate 10 such that its top is located higher than the light-emitting elements 30 and the light-transmissive member 80. The height of the first frame 50 from the upper surface 10a of the first substrate 10 may be the same as or different from the height of the second frame 60 from the upper surface 20a of the second substrate 20. If they are different, it is preferable that the second frame 60 be higher than the first frame 50. In this case, the difference between the height from the upper surface 20a of the second substrate 20 to the top of the first frame 50 and the height from the upper surface 20a of the second substrate 20 to the top of the second frame 60 can be made smaller than the thickness of the first substrate 10 (i.e., the distance from the upper surface 10a to the lower surface of the first substrate 10).

[0037] Examples of resins that can be used for the first frame 50 and the second frame 60 include the resins exemplified as the base material for the covering member 70 described above. The resin that constitutes the first frame 50 and the second frame 60 can preferably have a higher viscosity than the resin that constitutes the covering member 70. The viscosity of the resin can be adjusted, for example, by the amount of viscosity-adjusting filler contained in the resin. This allows the first frame 50 and the second frame 60 to be used as support members for supporting the covering member 70.

[0038] The first frame 50 is preferably translucent to light emitted from the light-emitting element 30 and the light-transmissive member 80. The first frame 50 is arranged on the first substrate 10 along the outer periphery of the element mounting region 10r in the shape of a substantially rectangular frame in a plan view. At a position along the longitudinal direction of the element mounting region 10r, the first frame 50 is arranged between the longitudinal sides of the element mounting region 10r and the plurality of first terminals 11. Furthermore, at a position along the lateral direction of the element mounting region 10r, the first frame 50 is arranged on the first substrate 10 between the element mounting region 10r and the outer edge of the first substrate 10.

[0039] The first frame 50 preferably has an inclined surface that slopes from the first substrate 10 side toward the top of the first frame 50. The inclined surface is preferably a curved surface that is convex outward, and specifically, the first frame 50 preferably has a portion that has an arc-shaped or elliptical arc-shaped cross section. This allows the surface of the covering member 70 that contacts the first frame 50 to be a curved surface that is concave toward the first frame 50. By having the covering member 70 have such a surface shape, light that is emitted from the light-transmitting member 80, passes through the first frame 50, and heads toward the covering member 70 can be reflected toward the first substrate 10. This reduces the amount of reflected light that becomes stray light and heads upward (toward the light extraction side), resulting in a light-emitting module with reduced unintended light scattering.

[0040] In the light-emitting module 1, the second frame portion 60 is disposed below the light-emitting element 30 and the light-transmitting member 80 with respect to the upper surface 20a of the second substrate 20. Therefore, the second frame portion 60 may or may not be translucent to the light emitted from the light-emitting element 30.

[0041] Even when the first substrate 10 is rectangular in plan view and the wires 40 are arranged only on the long sides of the rectangle, it is preferable that the tops 70t of the covering member 70 provided on the short sides of the first substrate 10 are at approximately the same height as the tops 70t of the covering member 70 provided on the long sides of the first substrate 10. In the light-emitting module 1, the first frame 50 is translucent, so that light emitted from the translucent member 80 can pass through the first frame 50. Furthermore, in the light-emitting module 1, the light that has passed through the first frame 50 can be reflected toward the first substrate 10 at the interface with the covering member 70, thereby reducing unintended scattering of light.

[0042] (Translucent member) The light-transmitting member 80 covers the upper surfaces of the plurality of light-emitting elements 30. The light-transmitting member 80 collectively covers the upper surfaces of the plurality of light-emitting elements 30 and the upper surface of the reflective member 90. The upper surface of the light-transmitting member 80 forms the light-emitting surface of the light-emitting module 1. The light-transmitting member 80 has a substantially rectangular shape in a plan view, and is arranged so as to enclose the plurality of light-emitting elements 30 in a plan view.

[0043] The light-transmitting member 80 may be a wavelength conversion member. In this case, the light-transmitting member 80 can convert the wavelength of at least a portion of the light emitted from the light-emitting element 30 and extract the converted light to the outside. Examples of wavelength conversion members include a sintered body of a phosphor, and a base material such as resin, glass, or other inorganic material containing phosphor powder. Examples of base materials that can be used include epoxy resin, silicone resin, a resin mixture thereof, and glass. The thickness of the light-transmitting member 80 can be, for example, approximately 20 μm to 100 μm. The light-transmitting member 80 is formed to a size that covers the entire upper surfaces of the multiple light-emitting elements 30. The light-transmitting member 80 may also be provided so as to extend to a position where it abuts against the first frame 50. In this case, the outer edge of the light-transmitting member 80 is preferably located between the first frame 50 and the first substrate 10 or between the covering member 70 and the first substrate 10. This improves the adhesion between the light-transmitting member 80 and the first substrate 10.

[0044] The phosphor is a yttrium aluminum garnet-based phosphor (e.g., (Y,Gd)3(Al,Ga)5O 12 :Ce), a lutetium aluminum garnet-based phosphor (e.g., Lu3(Al,Ga)5O 12 :Ce), a terbium aluminum garnet-based phosphor (e.g., Tb3(Al,Ga)5O 12 :Ce), a CCA-based phosphor (e.g., Ca 10 (PO4)6Cl2:Eu), a SAE-based phosphor (e.g., Sr4Al 14 O 25 :Eu), a chlorosilicate-based phosphor (e.g., Ca8MgSi4O 16 Cl2:Eu), a silicate-based phosphor (e.g., (Ba,Sr,Ca,Mg)2SiO4:Eu), a β-sialon-based phosphor (e.g., (Si,Al)3(O,N)4:Eu) or an α-sialon-based phosphor (e.g., Ca(Si,Al) 12 (O,N) 16 :Eu) and other oxynitride-based phosphors, an LSN-based phosphor (e.g., (La,Y)3Si6N 11 :Ce), a BSESN-based phosphor (e.g., (Ba,Sr)2Si5N8:Eu), an SLA-based phosphor (e.g., SrLiAl3N4:Eu), a CASN-based phosphor (e.g., CaAlSiN3:Eu) or an SCASN-based phosphor (e.g., (Sr,Ca)AlSiN3:Eu) and other nitride-based phosphors, a KSF-based phosphor (e.g., K2SiF6:Mn), a KSAF-based phosphor (e.g., K2(Si 1-x Al x )F 6-x :Mn where 0 < x < 1. ) or an MGF-based phosphor (e.g., 3.5MgO·0.5MgF2·GeO2:Mn) and other fluoride-based phosphors, quantum dots having a perovskite structure (e.g., (Cs,FA,MA)(Pb,Sn)(F,Cl,Br,I)3 where FA and MA represent formamidinium and methylammonium, respectively.), II-VI group quantum dots (e.g., CdSe), III-V group quantum dots (e.g., InP), or quantum dots having a chalcopyrite structure (e.g., (Ag,Cu)(In,Ga)(S,Se)2) etc. can be used.

[0045] (reflective material) The reflective member 90 is a member that covers the upper surface 10a of the first substrate 10 and the side surfaces of the light-emitting elements 30. The upper surface of the light-emitting elements 30 is exposed from the reflective member 90. The reflective member 90 may cover the area between the lower surface of the light-emitting elements 30 and the first substrate 10. The reflective member 90 reflects light that is emitted from the side surfaces of the light-emitting elements 30, allowing the light to be emitted from the upper surface of the light-transmitting member 80, which is the light-emitting surface of the light-emitting module 1. This can improve the light extraction efficiency of the light-emitting module 1. Furthermore, when the light-emitting elements 30 are individually lit, the boundary between the light-emitting area and the non-light-emitting area can be made clear. This improves the contrast ratio between the light-emitting area and the non-light-emitting area.

[0046] The reflective member 90 is preferably made of a soft resin with relatively low elasticity and excellent shape conformability. The reflective member 90 can be made of a resin material with good transparency and insulating properties, such as a thermosetting resin such as an epoxy resin or a silicone resin. The reflective member 90 is preferably made of a white resin containing particles of a light-reflecting material in a base resin. Examples of the light-reflecting material include light-reflecting materials similar to the light-reflecting materials contained in the covering member described above. The reflective member 90 may also contain a light-absorbing material such as carbon black, titanium black, or graphite.

[0047] The light-emitting module 1 having the above configuration can be used, for example, as a light source for a vehicle headlight. In this case, for example, a configuration is adopted in which light is emitted from the light source to the outside through a lens. In the light-emitting module 1, the light-emitting elements 30 are turned on by an external power switch. Note that the light-emitting module 1 is configured so that some or all of the preset light-emitting elements 30 can be individually driven.

[0048] In the light-emitting module 1, the covering member 70 has light-blocking properties and is disposed in contact with the first frame 50. This allows light transmitted through the first frame 50 to be absorbed or reflected toward the substrate by the covering member 70. This reduces unintended light scattering in the light-emitting module 1. The light-emitting module 1 reduces stray light, improving the performance of the optical device when used in combination with an optical system such as a lens. Furthermore, the covering member 70 contains a light-reflecting substance and / or a light-absorbing substance as a filler for providing light-blocking properties. This allows for a smaller amount of resin in the covering member 70 than when a translucent resin not containing these fillers is used. This reduces the load on the wire 40 due to thermal expansion of the resin. This improves the connectivity of the wire 40, resulting in a light-emitting module with excellent reliability.

[0049] <Method of manufacturing the light emitting module according to the embodiment> A method for manufacturing a light-emitting module according to an embodiment includes the steps of: preparing an intermediate body having, on its upper surface, a first substrate with an element mounting area, a light-emitting element to be mounted in the element mounting area, and a first terminal located outside the element mounting area; and a second substrate with, on its upper surface, a substrate mounting area for mounting the first substrate and a second terminal located outside the substrate mounting area, the intermediate body having the first substrate mounted in the substrate mounting area; connecting the first terminal and the second terminal with a wire; arranging a first frame on the upper surface of the first substrate inside the first terminal and surrounding the element mounting area; arranging a second frame on the upper surface of the second substrate outside the second terminal and surrounding the first substrate; and arranging a covering member to cover the wire. The covering member arranging step includes the steps of arranging a first resin on the upper surface of the second substrate between the first frame and the second frame to cover a portion of the wire, and arranging a second resin on the wire exposed from the first resin.

[0050] Furthermore, the manufacturing method of the light-emitting module according to the embodiment may include, before the step of arranging the first frame portion, a step of arranging a translucent member on the upper surface of the first substrate, the translucent member covering the light-emitting element and exposing the first terminal.

[0051] Hereinafter, each manufacturing step of the method for manufacturing a light emitting module according to the embodiment will be described with reference to the drawings.

[0052] 6 to 16 are diagrams schematically showing an example of manufacturing steps in the manufacturing method for the light-emitting module according to this embodiment. Specifically, FIGS. 6, 7, 9 to 11, 13, 14, and 16 are plan views illustrating the manufacturing steps for the light-emitting module. Also, FIGS. 8, 12, and 15 are cross-sectional views illustrating the manufacturing steps for the light-emitting module. In the description of the manufacturing method, "preparing" components does not necessarily mean manufacturing the components, but also includes acquiring the components, such as purchasing or receiving the components.

[0053] (Step of preparing an intermediate) 6, an intermediate body 200 is prepared. To prepare the intermediate body 200, a first substrate 10 is prepared, which has an element mounting region 10r and first terminals 11 disposed outside the element mounting region 10r on its upper surface 10a. The first substrate 10 can be prepared, for example, by preparing a flat support member made of silicon or the like, and forming wiring and the first terminals 11 by plating, sputtering, vapor deposition, or the like.

[0054] Next, the light emitting element 30 is mounted on the element mounting region 10r of the first substrate 10. The light emitting element 30 can be mounted by flip-chip mounting on the element mounting region 10r on the upper surface 10a of the first substrate 10. The light emitting element 30 can be prepared through some or all of multiple steps, such as a step of forming a semiconductor laminate and a step of forming element electrodes.

[0055] Next, a second substrate 20 is prepared, which has, on its upper surface 20a, a substrate mounting area 20r on which the first substrate 10 is mounted, and second terminals 22 arranged outside the substrate mounting area 20r. The second substrate 20 can be prepared, for example, by forming wiring such as Cu and the second terminals 22 on a flat support member made of metal, ceramic, or the like by plating, sputtering, vapor deposition, or the like. Next, the first substrate 10 on which the light-emitting element 30 is mounted is placed on the substrate mounting area 20r of the second substrate 20, to produce an intermediate body 200. The first substrate 10 and the second substrate 20 can be bonded together via a bonding material such as a sintered body containing Ag.

[0056] The step of preparing the intermediate may include a step of mounting the light-emitting element 30 on the element mounting region 10r of the first substrate 10 and then covering the side surfaces of the light-emitting element 30 with a reflective member 90. For example, after mounting the light-emitting element 30 on the first substrate 10, a mask is placed to cover the first terminals 11 and expose the element mounting region 10r. Then, a reflective member 90 such as an uncured white resin is placed in an area separated from the light-emitting element 30, and the white resin is allowed to flow and be disposed between the opposing side surfaces of adjacent light-emitting elements 30 and cured. After the reflective member 90 is placed, the mask is removed to expose the first terminals 11 from the reflective member 90. The reflective member 90 may also be placed between the lower surface of the light-emitting element 30 and the first substrate 10.

[0057] (Wire connection process) Next, as shown in FIG. 7 , the first terminal 11 of the first substrate 10 and the second terminal 22 of the second substrate 20 are connected by the wire 40. For example, the wire 40 is first connected to the first terminal 11 of the first substrate 10, and then connected to the second terminal 22 of the second substrate 20. By connecting the wire 40 in this order, the top of the wire 40 can be positioned closer to the first terminal 11. This allows the wire 40 to be positioned along the step between the first substrate 10 and the second substrate 20. Therefore, in the step of arranging the covering member 70 described below, the amount of resin positioned below the wire 40 is reduced, and the risk of the wire 40 being broken due to thermal expansion of the covering member 70 can be reduced.

[0058] (Step of placing a light-transmitting member) Next, as shown in FIG. 8 , a light-transmitting member 80 that covers the light-emitting element 30 and exposes the first terminals 11 is disposed on the upper surface 10a of the first substrate 10. For example, a member processed into a sheet shape of a predetermined size is prepared as the light-transmitting member 80 and disposed on the light-emitting element 30. The light-transmitting member 80 may be fixed to the light-emitting element 30 via a light-transmitting bonding member such as resin, or may be fixed by utilizing the tackiness of the light-transmitting member 80 without a bonding member. The light-transmitting member 80 may be processed into a sheet or plate shape and disposed on the light-emitting element 30, or may be applied to the light-emitting element 30 by spraying or the like. Alternatively, the light-transmitting member 80 may be formed by injection molding using a mold or the like, transfer molding, compression molding, or the like.

[0059] The light-transmitting member 80 preferably has a size that can encompass the element mounting region 10r in a plan view. This allows the outer periphery of the light-transmitting member 80 to be fixed to the upper surface 10a of the first substrate 10. In this way, by covering much of the upper surface 10a of the first substrate 10 with the light-transmitting member 80, the surface of the first substrate 10 can be protected. Note that the step of arranging the light-transmitting member 80 may be performed, if necessary, before the step of arranging the first frame portion 50.

[0060] (Step of placing the first frame portion) 9, a first frame 50 that surrounds the element mounting region 10r is disposed inside the first terminals 11 on the upper surface 10a of the first substrate 10. The first frame 50 can be disposed between the element mounting region 10r and the first terminals 11 and along the element mounting region 10r. For example, the first frame 50 can be disposed by dispensing uncured resin that forms the first frame 50 from a nozzle of a dispenser and moving the nozzle along the element mounting region 10r.

[0061] The first frame 50 can be formed to a predetermined height by providing multiple layers of uncured resin in the height direction. For example, the first frame 50 is formed by dispensing resin adjusted to a predetermined viscosity from a nozzle onto the first substrate 10 while moving the nozzle once around the element mounting region 10r to deposit one layer. Repeating this process can achieve the predetermined height. The height of one layer of resin can be, for example, approximately 150 μm. The first frame 50 can be formed, for example, by moving the nozzle twice around (i.e., stacking two layers of resin). It is preferable that the height of the highest point of the first frame 50, relative to the top surface 10a of the first substrate 10, is approximately the same as the height of the highest point of the wire 40. This allows the height of the covering member 70 covering the wire 40 to be lower in the region of the covering member 70 that is in contact with the first frame 50 and closer to the light emitting element 30, thereby reducing the occurrence of stray light due to light from the light emitting element 30 being reflected by the covering member 70.

[0062] If the manufacturing process of the light-emitting module 1 includes a step of arranging the light-transmitting member 80, the first frame 50 is preferably arranged to cover the outer periphery of the upper surface of the light-transmitting member 80. This improves adhesion between the light-transmitting member 80 and the first substrate. If the manufacturing process of the light-emitting module 1 does not include a step of arranging the light-transmitting member 80, the first frame 50 can be arranged to cover the outer periphery of the upper surface 10a of the first substrate 10.

[0063] (Step of placing the second frame portion) 10 , the second frame portion 60 surrounding the first substrate 10 is disposed outside the second terminals 22 on the upper surface 20a of the second substrate 20. For example, the second frame portion 60 can be disposed by dispensing uncured resin that forms the second frame portion 60 from the nozzle of a dispenser and moving the nozzle along the outside of the second terminals 22.

[0064] Similar to the first frame 50, the second frame 60 can be formed to a predetermined height by stacking multiple layers of uncured resin in the height direction. The height of one resin layer can be, for example, approximately 150 μm. The second frame 60 can be formed, for example, by moving the nozzle three times (stacking three layers of resin). The height of the highest point of the second frame 60, based on the upper surface 20a of the second substrate 20, is preferably equal to or less than the height of the upper surface 10a of the first substrate 10. Increasing the height of the second frame 60 requires stacking resin on the second substrate 20. However, the more layers are stacked, the more likely the stacked resin layers are to collapse. To stably stack multiple resin layers, the width of the second frame 60 must be increased. Increasing the width of the second frame 60 requires increasing the area of the upper surface 20a of the second substrate 20, which leads to an increase in the size of the light-emitting module 1. By making the height of the highest point of the second frame portion 60 equal to or less than the height of the upper surface 10a of the first substrate 10, the risk of the width of the second frame portion 60 becoming larger than necessary and the resulting increase in size of the light-emitting module 1 can be reduced.

[0065] In plan view, the second frame portion 60 can be arranged to include portions that are parallel to each side of the outer edge of the first substrate 10. In plan view, the second frame portion 60 may be arranged to include portions that are inclined with respect to each side of the first substrate 10 near the corners of the first substrate 10. The second frame portion 60 may be arranged using a different material from that of the first frame portion 50, or may be arranged using the same material as that of the first frame portion 50. If the same material is used, the second frame portion 60 and the first frame portion 50 can be arranged in the same process. Note that the process of arranging the first frame portion 50 and the process of arranging the second frame portion 60 may be performed in either order, or may be performed approximately simultaneously.

[0066] (Step of placing covering member) 11 to 16, a covering member 70 that covers the wire 40 is then placed. The covering member 70 can be placed by supplying uncured resin that constitutes the covering member 70 into a frame surrounded by the first frame portion 50 and the second frame portion 60. In this case, the first frame portion 50 and the second frame portion 60 can be used as a dam that blocks the flow of uncured resin that supports the covering member 70.

[0067] First, as shown in Fig. 11 , a first resin 70a that covers a portion of the wires 40 is placed on the upper surface 20a of the second substrate 20 that is located between the first frame 50 and the second frame 60. Specifically, for example, as shown in the upper and middle sections of Fig. 12 , the first resin 70a is supplied to the upper surface 20a of the second substrate 20 that is located between the second terminals 22 and the second frame 60. For example, the first resin 70a can be placed by supplying uncured resin that forms the first resin 70a from a nozzle 300 of a dispenser and moving the nozzle 300 along the second terminals 22.

[0068] The placement of the first resin 70a is preferably performed by stopping the supply of resin from the nozzle 300 onto the second substrate 20 and then waiting a predetermined time until the flow of the resin stabilizes. This allows the first resin 70a to move below the wires 40, as shown in the lower part of FIG. 12. The waiting time is preferably 10 seconds or more. This allows the first resin 70a to move below the wires 40 while wetting and spreading over the second substrate 20. In the lower part of FIG. 12, the first resin 70a preferably covers at least a portion of the side surface of the first substrate 10. The first resin 70a may also cover the entire height of the side surface of the first substrate 10. This makes the height of the first resin 70a covering the second substrate 20 approximately uniform, making it easier to shape the second resin 70b into a predetermined shape in a subsequent process.

[0069] 13 , for example, the upper surface 10a of the first substrate 10 is a rectangle having a first side 101 and a third side 103 as opposing short sides and a second side 102 and a fourth side 104 as opposing long sides. A plurality of wires 40 are arranged along each of the second side 102 and the fourth side 104. In this case, as shown by the arrows in FIG. 13 , it is preferable that the first resin 70a be supplied, for example, starting from a point P1 on the second substrate 20 located between the first side 101 and the second frame 60, and then be supplied sequentially along the first side 101, the second side 102, the third side 103, and the fourth side 104, and then be supplied again along the first side 101, and end at a point P2 on the second substrate 20 located between the first side 101 and the second frame 60. Immediately after the start of resin supply, the amount of resin coming out of the nozzle is unstable, so the amount of resin supplied along the first side 101 is small, and the height of the first resin 70a is likely to be low. Therefore, by supplying the first resin 70a along the fourth side 104 and then again along the first side 101, the amount of resin on the first side 101 can be made approximately the same as the amount of resin on the other sides, and the height of the first resin 70a on all sides can be made substantially uniform. The first resin 70a may be supplied in a direction inclined with respect to each side of the first substrate 10 near the corners of the first substrate 10. Note that in the region along the first side 101, the end point P2 at which the resin supply ends does not necessarily have to reach the start point P1 at which the resin supply begins, but may reach it. It is particularly preferable that the end point P2 at which the resin supply ends coincides with or passes through the start point P1 at which the resin supply begins.

[0070] Next, as shown in FIGS. 14 and 15 , a second resin 70b is disposed to cover the upper surface of the first substrate 10 located between the first frame 50 and the second frame 60 and the wires 40 exposed from the first resin 70a, thereby forming the covering member 70. Specifically, as shown in the upper and middle sections of FIG. 15 , the second resin 70b is supplied from above the wires 40, and the second resin 70b is disposed on the wires 40 exposed from the first resin 70a. For example, the second resin 70b can be disposed by dispensing uncured resin forming the second resin 70b from a nozzle 300 of a dispenser and moving the nozzle 300 above each wire 40 along the outer edge of the first substrate 10. The second resin 70b is preferably the same resin as the first resin 70a. By supplying the second resin 70b from above the wires 40, the entire wires 40 can be covered with the second resin 70b.

[0071] The second resin 70b covers at least a portion of the upper surface 10a of the first substrate 10. It is preferable that the second resin 70b covers the entire upper surface 10a of the first substrate 10 located between the first frame portion 50 and the second frame portion 60.

[0072] After supplying an amount of second resin 70b sufficient to cover the entire wire 40, the first resin 70a and the second resin 70b are cured, and as shown in the lower part of Fig. 15, a covering member 70 formed by integrating the first resin 70a and the second resin 70b is arranged to cover the wire 40. By curing the first resin 70a and the second resin 70b in the same process in this way, no interface is generated between the first resin 70a and the second resin 70b that cover the wire 40, and therefore the mechanical strength of the wire 40 and the covering member 70 can be improved.

[0073] Note that a waiting time may or may not be provided between the supply of the second resin 70b and the hardening of the first resin 70a and the second resin 70b. This is because the second resin 70b is supplied on top of the first resin 70a and therefore stops flowing earlier than the first resin 70a.

[0074] 16 , the supply of the second resin 70b preferably begins at point P3 on the first substrate 10, which is located between the third side 103 and the first frame 50, and is sequentially supplied along the third side 103, the fourth side 104, the first side 101, and the second side 102. The supply of the second resin 70b then preferably ends at point P4 on the first substrate 10, which is located between the third side 103 and the first frame 50. Because the amount of resin dispensed from the nozzle is unstable immediately after the start of resin supply, the amount of resin dispensed along the third side 103 tends to be small, resulting in a low height of the second resin 70b. Therefore, by first dispensing the second resin 70b along the second side 102 and then dispensing it again along the third side 103, the amount of resin dispensed along the third side 103 can be made approximately the same as the amount of resin dispensed along the other sides, thereby achieving a substantially uniform height of the second resin 70b along all sides. Furthermore, by differentiating the position where the supply of the first resin 70a and the position where the supply of the second resin 70b is started, the sides where the amount of resin is smaller do not overlap, and the height of the covering member 70 can be made approximately the same as the height of the areas along the other sides. Note that in the area along the third side 103, the end point P4 where the supply of resin ends does not have to reach the start point P3 where the supply of resin starts, but it may reach it. In particular, it is more preferable that the end point P4 where the supply of resin ends overlaps with or passes through the start point P3 where the supply of resin starts.

[0075] As described above, in the manufacturing method of the light-emitting module 1, the step of disposing the covering member 70 includes the step of disposing the first resin 70a and the step of disposing the second resin 70b. This makes it easier to dispose the covering member 70 in a desired region of the light-emitting module 1. For example, in the step of disposing the first resin 70a, the first resin 70a can be easily disposed below the wires 40. This reduces the risk of the resin not being filled below the wires 40. Furthermore, by supplying the first resin 70a to the upper surface 20a of the second substrate 20 located between the second terminals 22 and the second frame portion 60, waiting a predetermined time, and then moving the supplied first resin 70a over the second substrate 20 to be disposed below the wires 40, it is possible to further reduce the risk of the resin not being filled below the wires 40 and / or the voids being formed below the wires 40. Furthermore, in the process of placing the first resin 70a, by supplying the first resin 70a to the extent that it covers the side surface of the first substrate 10, the surface of the first resin 70a is more likely to become flat, and the risk of voids occurring below the wire 40 when the second resin 70b is placed can be reduced.

[0076] In the intermediate body 200, there is a difference in height between the upper surface 10a of the first substrate 10 and the upper surface 20a of the second substrate 20. Therefore, if the covering member 70 is supplied all at once between the first frame portion 50 and the second frame portion 60, there is a risk that the resin will overflow from the side of the second frame portion 60, which is lower than the first frame portion 50. However, in the manufacturing method of the light-emitting module 1, the step of arranging the covering member 70 includes a step of arranging the first resin 70a and a step of arranging the second resin 70b. In other words, because a large amount of resin is not supplied all at once from above the wires 40, the risk of the resin leaking from the side of the second frame portion 60 can be reduced.

[0077] Note that by making the second frame portion 60 taller, it is possible to make it less likely for the resin to leak from the side of the second frame portion 60. However, in order to make the second frame portion 60 taller, it is necessary to stack resin in multiple layers on the second substrate 20, which increases the width of the second frame portion 60 accordingly, leading to an increase in the size of the light-emitting module 1, as described above. By dividing the step of arranging the covering member 70 into a step of arranging the first resin 70a and a step of arranging the second resin 70b, it is possible to reduce the width of the second frame portion 60, thereby enabling the light-emitting module 1 to be made more compact.

[0078] Although the preferred embodiments have been described in detail above, the present invention is not limited to the above-described embodiments, and various modifications and substitutions can be made to the above-described embodiments without departing from the scope of the claims.

[0079] In addition to the above-described embodiments, the following supplementary notes are also disclosed. (Appendix 1) a step of preparing an intermediate body including a first substrate having, on its upper surface, an element mounting area, a light emitting element to be mounted in the element mounting area, and a first terminal disposed outside the element mounting area; and a second substrate having, on its upper surface, a substrate mounting area on which the first substrate is to be mounted, and a second terminal disposed outside the substrate mounting area, the first substrate being mounted in the substrate mounting area; connecting the first terminal and the second terminal with a wire; disposing a first frame portion surrounding the element mounting region on the upper surface of the first substrate, the first frame portion being located inside the first terminal; disposing a second frame portion surrounding the first substrate on the upper surface of the second substrate outside the second terminal; and placing a covering member covering the wire, The step of placing the covering member includes: a step of disposing a first resin on an upper surface of the second substrate located between the first frame portion and the second frame portion, the first resin covering a portion of the wire; and placing a second resin on the wire exposed from the first resin. (Appendix 2) A method for manufacturing an optical emitting module as described in Appendix 1, wherein the step of placing the first resin includes the steps of supplying the first resin to the upper surface of the second substrate located between the second terminal and the second frame portion, and moving the supplied first resin below the wire. (Appendix 3) In the step of disposing the second resin, 3. The method for manufacturing a light-emitting module according to claim 1, wherein the second resin is supplied from above the wire. (Appendix 4) In the step of disposing the first resin, 4. The method for manufacturing a light-emitting module according to claim 1, wherein the first resin covers at least a part of a side surface of the first substrate. (Appendix 5) In the step of disposing the second resin, 5. The method for manufacturing a light-emitting module according to claim 1, wherein the second resin covers at least a portion of an upper surface of the first substrate. (Appendix 6) The step of placing the covering member includes: 6. A method for manufacturing a light-emitting module according to any one of claims 1 to 5, comprising the step of curing the first resin and the second resin. (Appendix 7) the top surface of the first substrate is a rectangle having a first side and a third side opposite to each other and a second side and a fourth side opposite to each other; a plurality of the wires are arranged along each of the second side and the fourth side; A method for manufacturing a light-emitting module described in any one of Appendixes 1 to 6, wherein in the step of placing the first resin, the first resin is supplied sequentially along the first side, the second side, the third side, and the fourth side, and then supplied again along the first side. (Appendix 8) A method for manufacturing a light-emitting module as described in Appendix 7, wherein in the step of placing the second resin, the second resin is supplied sequentially along the third side, the fourth side, the first side, and the second side, and then supplied again along the third side. (Appendix 9) A method for manufacturing a light-emitting module described in any one of Appendixes 1 to 8, wherein the height of the highest point of the first frame portion is equal to or less than the height of the highest point of the covering member, based on the top surface of the second substrate. (Appendix 10) A method for manufacturing a light-emitting module described in any one of Appendixes 1 to 9, wherein the height of the highest point of the second frame portion is equal to or less than the height of the top surface of the first substrate, based on the top surface of the second substrate. (Appendix 11) Before the step of arranging the first frame portion, A method for manufacturing a light-emitting module described in any one of Appendixes 1 to 10, including a step of placing a translucent member on the upper surface of the first substrate, covering the light-emitting element and exposing the first terminal. (Appendix 12) In the step of arranging the first frame portion, 12. The method for manufacturing a light-emitting module according to claim 11, wherein the first frame portion covers an upper surface of the light-transmitting member. [Explanation of symbols]

[0080] 1 Light-emitting module 10 First board 101 Side 1 102 Side 2 103 Third Side 104 Side 4 10a top surface 10r Element mounting area 11 1st terminal 20 Second board 20a top surface 20r Substrate placement area 22 2nd terminal 30 Light-emitting element 40 wire 40t top 50 First frame portion 50 60 Second frame portion 60 70 Covering material 70a First Resin 70b 2nd resin 70t top 80 Translucent material 90 Reflective material 200 Intermediates 300 nozzles

Claims

1. a step of preparing an intermediate body including a first substrate having, on its upper surface, an element mounting area, a light emitting element to be mounted in the element mounting area, and a first terminal disposed outside the element mounting area; and a second substrate having, on its upper surface, a substrate mounting area on which the first substrate is mounted, and a second terminal disposed outside the substrate mounting area, the first substrate being mounted in the substrate mounting area; connecting the first terminal and the second terminal with a wire; disposing a first frame portion surrounding the element mounting region on the upper surface of the first substrate, the first frame portion being located inside the first terminal; disposing a second frame portion surrounding the first substrate on the upper surface of the second substrate outside the second terminal; and placing a covering member covering the wire, The step of placing the covering member includes: a step of disposing a first resin on an upper surface of the second substrate located between the first frame portion and the second frame portion, the first resin covering a portion of the wire; and disposing a second resin on the wire exposed from the first resin; A method for manufacturing a light-emitting module, wherein the step of placing the first resin includes the steps of supplying the first resin to an upper surface of the second substrate located between the second terminal and the second frame portion, and moving the supplied first resin below the wire.

2. In the step of disposing the second resin, The method for manufacturing a light-emitting module according to claim 1 , wherein the second resin is supplied from above the wire.

3. In the step of disposing the first resin, The method for manufacturing a light emitting module according to claim 1 , wherein the first resin covers at least a part of a side surface of the first substrate.

4. In the step of disposing the second resin, The method for manufacturing a light-emitting module according to claim 1 , wherein the second resin covers at least a part of an upper surface of the first substrate.

5. The step of placing the covering member includes: The method for manufacturing a light emitting module according to claim 1 , further comprising the step of curing the first resin and the second resin.

6. the top surface of the first substrate is a rectangle having a first side and a third side opposite to each other and a second side and a fourth side opposite to each other; a plurality of the wires are arranged along each of the second side and the fourth side; 6. The method for manufacturing a light-emitting module according to claim 1, wherein in the step of arranging the first resin, the first resin is supplied sequentially along the first side, the second side, the third side, and the fourth side, and then supplied again along the first side.

7. 7. The method for manufacturing a light-emitting module according to claim 6, wherein in the step of placing the second resin, the second resin is supplied sequentially along the third side, the fourth side, the first side, and the second side, and then supplied again along the third side.

8. The method for manufacturing a light-emitting module according to claim 1 , wherein the height of the highest point of the first frame portion is equal to or less than the height of the highest point of the covering member, based on the top surface of the second substrate.

9. The method for manufacturing a light-emitting module according to claim 1 , wherein the height of the highest position of the second frame portion is equal to or lower than the height of the upper surface of the first substrate, based on the upper surface of the second substrate.

10. Before the step of disposing the first frame portion, The method for manufacturing a light-emitting module according to claim 1 , further comprising the step of: arranging a light-transmitting member on an upper surface of the first substrate, the light-emitting element being covered and exposing the first terminal.

11. In the step of disposing the first frame portion, The method for manufacturing a light-emitting module according to claim 10 , wherein the first frame portion covers an upper surface of the light-transmitting member.

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