Substrate Processing Equipment

Abstract

To provide a substrate processing apparatus capable of suppressing reduction in throughput and enlargement of the apparatus.SOLUTION: A substrate processing apparatus includes: a grinding unit for grinding a back surface of a substrate having a protective tape attached to a front surface of the substrate; a frame mount unit for attaching a frame via a tape to the back surface of the substrate ground by the grinding unit; a transfer unit including a mount-side transfer unit for holding the back surface side of the grounded substrate and transferring the substrate from the grinding unit to the frame mount unit; and a control unit for controlling each component. The substrate processing apparatus has an ultraviolet irradiation unit 30 provided on a transfer path along which the substrate is transferred from the grinding unit to the frame mount unit, the ultraviolet irradiation unit including a UVLED light source 35 which is arranged so that the entire surface of the protective tape attached to the front surface side of the substrate held by the mount-side transfer unit is uniformly irradiated with ultraviolet rays.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a substrate processing apparatus. [Background technology]

[0002] In the process of manufacturing chips from semiconductor wafers, a processing apparatus may be used that combines in-line a grinding apparatus that grinds the back side of the wafer while a protective tape for protecting the device is attached to the front side of the wafer, and a device called a mounter that attaches a frame via dicing tape to the back side of the wafer after grinding and peels off the protective tape attached to the front side of the wafer.

[0003] In such processing equipment, the adhesiveness of the protective tape needs to be reduced in order for the mounter to peel it off, and for this reason, a mechanism is provided to irradiate the protective tape with ultraviolet light before it is transported to the mounter (see, for example, Patent Document 1).

[0004] Also, an apparatus is used in which ultraviolet light is irradiated onto the entire surface of the protective tape by moving a mercury lamp and the wafer arranged in a straight line relatively (see, for example, Patent Document 2). [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2002-343756 [Patent Document 2] Japanese Patent Application Laid-Open No. 2009-283662 Summary of the Invention [Problem to be solved by the invention]

[0006] However, in the method described in Patent Document 1, in which ultraviolet rays are irradiated onto the entire surface of the protective tape, it is necessary to place the wafer on the ultraviolet irradiation unit and perform operations such as closing the cover to prevent light from leaking to the surrounding area, which increases the irradiation time and reduces throughput.

[0007] Furthermore, the method described in Patent Document 2 in which ultraviolet light is irradiated onto the entire surface of the protective tape by moving a mercury lamp and a wafer arranged in a straight line relative to each other requires space for the relative movement, which poses a problem of increasing the size of the device.

[0008] The present invention has been made in view of the above problems, and an object of the present invention is to provide a substrate processing apparatus that can suppress a decrease in throughput and an increase in the size of the apparatus. [Means for solving the problem]

[0009] In order to solve the above-mentioned problems and achieve the object, the substrate processing apparatus of the present invention is a substrate processing apparatus that includes: a grinding unit that grinds one surface of a substrate having a protective tape attached to the other surface thereof; a frame mount unit that attaches a frame via tape to the other surface of the substrate ground by the grinding unit; a transport unit that includes a transport arm that holds the other surface of the substrate after grinding and transports it from the grinding unit to the frame mount unit; and a control unit that controls each component, and has an ultraviolet irradiation unit that includes a UV LED light source that is arranged on a transport path along which the substrate is transported from the grinding unit to the frame mount unit so that ultraviolet rays are evenly irradiated onto the entire surface of the protective tape attached to the one surface of the substrate held by the transport arm. The ultraviolet irradiation unit comprises an irradiation tube with an opening at the top, and a shutter having a pair of shutter members that are movable in directions approaching or separating from each other, closing the opening when they approach each other, and opening the opening when they separate from each other; the transport arm is formed in a circular shape, holds the substrate, and has an absorption pad whose outer diameter is smaller than the distance between the pair of separated shutter members and the inner diameter of the opening, and a large-diameter portion that is connected to the upper end of the absorption pad and is larger than the inner diameter of the opening; and when the ultraviolet irradiation unit irradiates ultraviolet rays onto the protective tape attached to one side of the substrate held by the transport arm, the absorption pad is inserted into the irradiation tube through the opening. It is characterized by: In the substrate processing apparatus, the large diameter portion may be formed in a circular shape, and the outer diameter may be larger than the distance between a pair of spaced apart shutter members.

[0010] In the substrate processing apparatus, the ultraviolet irradiation unit may be capable of irradiating ultraviolet rays of at least two different wavelengths.

[0011] In the substrate processing apparatus, the control unit may have a memory section that stores the type of protective tape and the ultraviolet wavelength suitable for hardening the protective tape, and may be able to change the wavelength of the ultraviolet light irradiated onto the protective tape depending on the type of protective tape attached to the substrate. [Effects of the Invention]

[0012] The present invention has the effect of suppressing a decrease in throughput and an increase in the size of the device. [Brief explanation of the drawings]

[0013] [Figure 1] FIG. 1 is a plan view schematically showing an example of the configuration of a substrate processing apparatus according to a first embodiment. [Figure 2] FIG. 2 is a perspective view showing an example of a substrate to be processed by the substrate processing apparatus shown in FIG. [Figure 3] FIG. 3 is a vertical cross-sectional view schematically showing the configuration of an ultraviolet irradiation unit of the substrate processing apparatus shown in FIG. [Figure 4] FIG. 4 is a plan view schematically showing an ultraviolet irradiation section of the ultraviolet irradiation unit shown in FIG. [Figure 5] FIG. 5 is a diagram showing data stored in a storage unit of the control unit of the substrate processing apparatus shown in FIG. [Figure 6] 6 is a perspective view showing a state in which the mount-side transport unit of the substrate processing apparatus shown in FIG. 1 has positioned the substrate above the ultraviolet irradiation unit. [Figure 7] FIG. 7 is a vertical cross-sectional view schematically showing the mount-side transport unit and the ultraviolet irradiation unit shown in FIG. [Figure 8] 8 is a perspective view showing a state in which the shutter of the ultraviolet irradiation unit of the substrate processing apparatus shown in FIG. 6 opens its opening. [Figure 9] FIG. 9 is a vertical cross-sectional view schematically showing the mount-side transport unit and the ultraviolet irradiation unit shown in FIG. [Figure 10]10 is a perspective view showing a state in which the mount-side transport unit of the substrate processing apparatus shown in FIG. 8 has lowered the substrate. [Figure 11] FIG. 11 is a vertical cross-sectional view schematically showing the mount-side transport unit and the ultraviolet irradiation unit shown in FIG. [Figure 12] FIG. 12 is a plan view schematically showing an ultraviolet irradiation section of an ultraviolet irradiation unit of a substrate processing apparatus according to a modified example of the first embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0014] Modes (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. Furthermore, the components described below include those that can be easily imagined by a person skilled in the art and those that are substantially the same. Furthermore, the configurations described below can be combined as appropriate. Furthermore, various omissions, substitutions, or modifications of the configuration can be made within the scope of the gist of the present invention.

[0015] [Embodiment 1] A substrate processing apparatus according to a first embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a plan view schematically showing an example of the configuration of the substrate processing apparatus according to the first embodiment. The substrate processing apparatus 1 shown in Fig. 1 according to the first embodiment is an apparatus for grinding a substrate 200 shown in Fig. 2.

[0016] (substrate) First, the substrate 200 will be described. Fig. 2 is a perspective view showing an example of a substrate to be processed by the substrate processing apparatus shown in Fig. 1. The substrate 200 to be processed by the substrate processing apparatus 1 is a wafer such as a disk-shaped semiconductor wafer or an optical device wafer, with silicon, sapphire, gallium arsenide, or the like as a base material 201. In the first embodiment, the substrate 200 has devices 204 formed in each region defined by lattice-shaped planned dividing lines 203 on a surface 202, as shown in Fig. 2.

[0017] The device 204 is, for example, an integrated circuit such as an IC (Integrated Circuit) or an LSI (Large Scale Integration), or an image sensor such as a CCD (Charge Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor).

[0018] In the substrate 200 according to embodiment 1, a protective tape 210 having the same diameter as the substrate 200 is attached to one surface, the front surface 202, and the other surface, the back surface 206, behind the front surface 202, is ground. The protective tape 210 includes a non-adhesive base layer made of synthetic resin and an adhesive layer made of synthetic resin and laminated on the base layer. When irradiated with ultraviolet light, the adhesive layer of the protective tape 210 hardens and loses its adhesive strength. There are multiple types of protective tape 210, each with different wavelengths of ultraviolet light that harden the adhesive layer. That is, different types of protective tape 210 may be irradiated with different wavelengths of ultraviolet light that harden the adhesive layer.

[0019] (Substrate processing equipment) Next, the substrate processing apparatus 1 will be described. The substrate processing apparatus 1 includes a grinding unit 2, a frame mount unit 20, a transport unit 41, and a control unit 100, as shown in FIG.

[0020] The grinding unit 2 is a processing device that rough-grinds, finish-grinds, and polishes the back surface 206 of a substrate 200 having a protective tape 210 attached to its front surface 202. As shown in Fig. 1, the grinding unit 2 mainly includes a unit main body 3, a rough-grinding unit 4, a finish-grinding unit 5, a polishing unit 6, a turntable supported by the unit main body 3 so as to be rotatable about its axis, four chuck tables 8, for example, installed on the turntable 7, a pair of cassettes 9, an alignment unit 10, an internal unit load / unload unit (not shown), and a cleaning unit 11.

[0021] The rough grinding unit 4 is configured to roughly grind the back surface 206 of the substrate 200 by rotating a grinding wheel having a grinding stone attached to the lower end of a spindle and pressing the wheel along the Z-axis direction, which is parallel to the vertical direction, against the back surface 206 of the substrate 200 held on the chuck table 8 at the rough grinding position 302. Similarly, the finish grinding unit 5 is configured to finish grind the back surface 206 of the substrate 200 by rotating a grinding wheel having a grinding stone attached to the lower end of a spindle and pressing the wheel along the Z-axis direction against the back surface 206 of the substrate 200 that has been roughly ground and is held on the chuck table 8 at the finish grinding position 303.

[0022] The polishing unit 6 is configured to polish the back surface 206 of the substrate 200 by rotating a polishing tool having a polishing pad attached to the lower end of a spindle and pressing the polishing tool along the Z-axis direction parallel to the vertical direction against the back surface 206 of the substrate 200 held on the chuck table 8 at the polishing position 304. In the first embodiment, the axes of the grinding wheels of the rough grinding unit 4 and the finish grinding unit 5, the axes of the polishing tool of the polishing unit 6, and the axis of the chuck table 8 are substantially parallel to each other and are spaced apart in the horizontal direction.

[0023] In the first embodiment, the polishing unit 6 performs dry polishing, or so-called dry polishing, on the rear surface 206 of the substrate 200 without supplying a processing liquid such as a polishing liquid.

[0024] The turntable 7 is a disk-shaped table mounted on the upper surface of the unit body 3, rotatable in a horizontal plane, and driven to rotate at a predetermined timing. On the turntable 7, for example, four chuck tables 8 are arranged at equal intervals, for example, at a phase angle of 90 degrees. These four chuck tables 8 have a chuck table structure with a vacuum chuck on the holding surface, and hold the substrate 200, with the front surface 202 side placed on the holding surface via protective tape 210, by vacuum suction. During grinding and polishing, these chuck tables 8 are driven to rotate in a horizontal plane by a rotary drive mechanism around an axis parallel to the vertical direction. As the turntable 7 rotates, the chuck tables 8 are sequentially moved to a loading / unloading position 301, a rough grinding position 302, a finish grinding position 303, a polishing position 304, and the loading / unloading position 301.

[0025] The cassette 9 is a container having a plurality of slots for accommodating the substrates 200. The cassette 9 accommodates the substrates 200 with protective tape 210 attached to the surface 202 before grinding and polishing. The alignment unit 10 is a table on which the substrates 200 removed from the cassette 9 are temporarily placed and on which the center alignment is performed.

[0026] The intra-unit carry-in / out unit has a suction pad and holds by suction the substrate 200 before grinding and polishing that has been aligned by the alignment unit 10, and carries it onto the chuck table 8 located at the carry-in / out position 301. The intra-unit carry-in / out unit holds by suction the substrate 200 after grinding and polishing that is held on the chuck table 8 located at the carry-in / out position 301, and carries it out to the cleaning unit 11.

[0027] The cleaning unit 11 cleans the substrate 200 after grinding and polishing, and removes contamination such as grinding dust and polishing dust adhering to the ground and polished processed surface.

[0028] The frame mount unit 20 is a processing device that attaches, via tape 211, an annular frame 212 whose inner diameter is larger than the outer diameter of the substrate 200 to the back surface 206 of the substrate 200 that has been ground and polished by the grinding unit 2. As shown in FIG. 1 , the frame mount unit 20 mainly includes a unit main body 21, an ultraviolet irradiation unit 30, a mounting unit 22, a peeling unit 23, a cleaning unit 24, an intra-unit transport unit (not shown), and a cassette 25. The unit main body 21 is provided alongside the unit main body 3 of the grinding unit 2.

[0029] (Ultraviolet irradiation unit) Next, the ultraviolet irradiation unit 30 will be described. Fig. 3 is a vertical cross-sectional view schematically showing the configuration of the ultraviolet irradiation unit of the substrate processing apparatus shown in Fig. 1. Fig. 4 is a plan view schematically showing the ultraviolet irradiation section of the ultraviolet irradiation unit shown in Fig. 3. The ultraviolet irradiation unit 30 irradiates ultraviolet rays onto the protective tape 210 attached to the front surface 202 of the substrate 200, the back surface 206 of which has been ground and polished, while the substrate 200 is held by the mount-side transport unit 26. The ultraviolet irradiation unit 30 is provided on the transport path of the substrate 200 of the transport unit 41.

[0030] 3, the ultraviolet irradiation unit 30 is provided on the transport path of the substrate 200 of the transport unit 41 and includes an irradiation tube 32 having an opening 31 at the top, an ultraviolet irradiation section 33, and a shutter 34. The irradiation tube 32 is provided on the transport path of the substrate 200 of the transport unit 41 and is a space provided within the cylindrical unit body 21 having an opening 31 at the top. The bottom of the irradiation tube 32 is closed.

[0031] The ultraviolet irradiation unit 33 includes a plurality of UV LED light sources 35 arranged on the bottom surface of the irradiation tube 32. LED stands for "light emitting diode," and UV stands for "ultraviolet." The UV LED light sources 35 are LEDs that irradiate ultraviolet light upward. In the first embodiment, the ultraviolet irradiation unit 33 includes, as the UV LED light sources 35, an LED that irradiates ultraviolet light with a wavelength of 365 nm and an LED that irradiates ultraviolet light with a wavelength of 385 nm. Thus, in the first embodiment, the ultraviolet irradiation unit 30 irradiates ultraviolet light with two different wavelengths. However, in the present invention, in addition to the LED that irradiates ultraviolet light with a wavelength of 365 nm and the LED that irradiates ultraviolet light with a wavelength of 385 nm, at least two LEDs that irradiate ultraviolet light with wavelengths different from these may also be included. In short, in the present invention, it is desirable for the ultraviolet irradiation unit 30 to irradiate ultraviolet light with at least two different wavelengths.

[0032] The multiple UV LED light sources 35 are arranged at positions where the difference in distance between adjacent ones is equal to or less than a predetermined value so that ultraviolet rays are uniformly irradiated onto the entire surface of the protective tape 210 attached to the surface 202 of the substrate 200 while it is held by the mount-side transport unit 26. In the first embodiment, the UV LED light sources 35 are arranged at positions where the difference in distance between adjacent LEDs that irradiate ultraviolet rays of each wavelength is equal to or less than a predetermined value so that ultraviolet rays of each wavelength are uniformly irradiated onto the entire surface of the protective tape 210 attached to the surface 202 of the substrate 200 while it is held by the mount-side transport unit 26.

[0033] The shutter 34 includes a pair of shutter members 36 that are movable toward or away from each other and are arranged above the opening 31. When the pair of shutter members 36 approach each other and their edges come into contact, the shutter 34 closes the opening 31. When the pair of shutter members 36 move away from each other, the shutter 34 opens the opening 31.

[0034] The mounting unit 22 positions the substrate 200, on which the tape 211 has been irradiated with ultraviolet rays by the ultraviolet irradiation unit 30, and the frame 212 in coaxial positions, adheres the rolled tape 211 to the back surface 206 of the substrate 200 and the frame 212, and cuts the tape 211 between the inner edge and the outer edge of the frame 212. The mounting unit 22 adheres the frame 212 to the back surface 206 of the substrate 200 via the tape 211.

[0035] The peeling unit 23 peels off the protective tape 210 from the front surface 202 of the substrate 200, which has a frame 212 attached to its back surface 206 via tape 211 by the mounting unit 22. The cleaning unit 11 cleans the front surface 202 of the substrate 200 from which the protective tape 210 has been peeled off by the peeling unit 23.

[0036] The cassette 25 is a container having a plurality of slots for accommodating the substrates 200. The cassette 25 accommodates the substrates 200 after grinding and polishing, from which the frames 212 have been attached and the protective tape 210 has been peeled off.

[0037] The intra-unit loading / unloading unit has an adsorption pad and adsorbs and holds the substrate 200 that has been ground by the grinding unit 2, and transports the substrate 200 between the mount side transport unit 26, the mount unit 22, the peeling unit 23 and the cleaning unit 24.

[0038] The transport unit 41 transports the substrate 200 from the grinding unit 2 to the frame mount unit 20, and includes a grinding side transport unit 12, an intra-unit transport unit of the grinding unit 2, a mount side transport unit 26 (corresponding to a transport arm), an intra-unit transport unit of the frame mount unit 20, and a transport unit moving mechanism 40.

[0039] The grinding-side transport unit 12 is, for example, a robot pick equipped with a U-shaped hand 13, and transports the substrate 200 by suction-holding it with the U-shaped hand 13. Specifically, the grinding-side transport unit 12 transports the substrate 200 before grinding and polishing from the cassette 9 to the alignment unit 10.

[0040] The mount-side transport unit 26 suction-holds the back surface 206 of the substrate 200 cleaned by the cleaning unit 24 of the grinding unit 2, and transports the substrate 200 from the grinding unit 2 to the frame mount unit 20. The mount-side transport unit 26 is a robot pick having a circular suction pad 27, and transports the substrate 200 by suction-holding it with the suction pad 27.

[0041] Specifically, the mount-side transport unit 26 transports the substrate 200 cleaned by the cleaning unit 24 of the grinding unit 2 to the ultraviolet irradiation unit 30 and the intra-unit transport unit, and also transports the substrate 200, to which the frame 212 has been attached and from which the protective tape 210 has been peeled off and cleaned, from the cleaning unit 24 into the cassette 25. The mount-side transport unit 26 can also raise and lower the suction pad 27.

[0042] The transport unit moving mechanism 40 moves the grinding-side transport unit 12 and the mount-side transport unit 26 along the width direction of the unit bodies 3, 21, across the grinding unit 2 and the frame mount unit 20. Furthermore, since the mount-side transport unit 26 transports the substrate 200 to the ultraviolet irradiation unit 30, the ultraviolet irradiation unit 30 is provided on a transport path along which the transport unit 41 transports the substrate 200 from the grinding unit 2 to the frame mount unit 20.

[0043] (control unit) Next, the control unit 100 will be described. FIG. 5 is a diagram showing data stored in the memory unit of the control unit of the substrate processing apparatus shown in FIG. 1. The control unit controls each of the above-mentioned components constituting the substrate processing apparatus 1. That is, the control unit causes the substrate processing apparatus 1 to perform processing operations on the substrate 200. The control unit is a computer capable of executing computer programs. The control unit includes an arithmetic processing device having a microprocessor such as a central processing unit (CPU), a storage device having memory such as a read only memory (ROM) or a random access memory (RAM), and an input / output interface device. The arithmetic processing device of the control unit executes the computer program stored in the storage device to generate control signals for controlling the substrate processing apparatus 1. The arithmetic processing device of the control unit outputs the generated control signals to each component of the substrate processing apparatus 1 via the input / output interface device.

[0044] In the first embodiment, the control unit 100 has a memory unit 101. The memory unit 101 stores data 102 shown in FIG. 5, which stores a one-to-one correspondence between the type of protective tape 210 and the wavelength of ultraviolet light suitable for curing the adhesive layer of the protective tape 210. The function of the memory unit 101 is realized by the storage device described above. FIG. 5 shows an example in which wavelength 1 suitable for curing the adhesive layer associated with type 1 protective tape 210 is 365 nm, and wavelength 2 suitable for curing the adhesive layer associated with type 2 protective tape 210 is 385 nm.

[0045] (Machining operation) Next, the processing operation of the substrate processing apparatus 1 will be described. Fig. 6 is a perspective view showing a state in which the mount-side transport unit of the substrate processing apparatus shown in Fig. 1 positions a substrate above the ultraviolet irradiation unit. Fig. 7 is a vertical cross-sectional view schematically showing the mount-side transport unit and the ultraviolet irradiation unit shown in Fig. 6. Fig. 8 is a perspective view showing a state in which the shutter of the ultraviolet irradiation unit of the substrate processing apparatus shown in Fig. 6 opens its opening. Fig. 9 is a vertical cross-sectional view schematically showing the mount-side transport unit and the ultraviolet irradiation unit shown in Fig. 8. Fig. 10 is a perspective view showing a state in which the mount-side transport unit of the substrate processing apparatus shown in Fig. 8 has lowered the substrate. Fig. 11 is a vertical cross-sectional view schematically showing the mount-side transport unit and the ultraviolet irradiation unit shown in Fig. 10.

[0046] In the substrate processing apparatus 1, a cassette 9 containing a substrate 200 is installed, an empty cassette 25 is installed, and processing conditions input by an operator are received by a control unit 100. The processing conditions include the type of protective tape 210 attached to a surface 202 of the substrate 200. When the control unit 100 receives an instruction to start the processing operation from the operator, the substrate processing apparatus 1 starts the processing operation.

[0047] In the processing operation, the control unit 100 of the substrate processing apparatus 1 causes the grinding-side transport unit 12 to take out the substrate 200 from the cassette 9 and transport it to the alignment unit 10, and causes the alignment unit 10 to align the center of the substrate 200. In the processing operation, the control unit of the substrate processing apparatus 1 causes the intra-unit transport unit to load the center-aligned substrate 200 onto the chuck table 8 located at the load / unload position 301.

[0048] In the processing operation, the substrate processing apparatus 1 suction-holds the front surface 202 of the substrate 200 to the chuck table 8 via the protective tape 210, exposes the back surface 206, and transports the substrate 200 sequentially to the rough grinding position 302, the finish grinding position 303, and the polishing position 304 using the turntable 7. In the processing operation, the substrate processing apparatus 1 rotates the grinding wheel using the spindle and rotates the chuck table 8 about its axis at the rough grinding position 302 and the finish grinding position 303, bringing the grinding wheel into contact with the back surface 206 of the substrate 200 and moving it closer to the chuck table 8 at a predetermined feed rate, thereby performing rough grinding and finish grinding on the back surface 206 of the substrate 200 using the grinding wheel in that order. In the processing operation, the substrate 200 is ground until it reaches a predetermined thickness.

[0049] In the processing operation, the substrate processing apparatus 1 rotates the turntable 7 to move the chuck table 8 holding the finish-ground substrate 200 to the polishing position 304, and at the polishing position 304, the spindle rotates the polishing tool and the chuck table 8 rotates about its axis, while the polishing pad is brought into contact with the back surface 206 of the substrate 200 and moved toward the chuck table 8 at a predetermined feed rate, thereby dry-polishing the back surface 206 of the substrate 200 with the polishing pad. In the processing operation, after dry-polishing for a predetermined time, the substrate processing apparatus 1 ends polishing by the polishing unit 6, positions the substrate 200 polished by the polishing unit 6 at the carry-in / out position 301, carries it into the cleaning unit 11 by the intra-unit transport unit, and cleans it in the cleaning unit 11.

[0050] In the processing operation, the control unit 100 of the substrate processing apparatus 1 causes the back surface 206 of the cleaned substrate 200 to be adsorbed and held by the suction pad 27 of the mount-side transport unit 26, and causes the transport unit moving mechanism 40 and the mount-side transport unit 26 to position the substrate 200 adsorbed and held by the suction pad 27 above the shutter 34 of the ultraviolet irradiation unit 30, as shown in Figures 6 and 7. In the processing operation, the control unit 100 of the substrate processing apparatus 1 causes the shutter members 36 of the shutter 34 of the ultraviolet irradiation unit 30 to move away from each other, thereby opening the opening 31, as shown in Figures 8 and 9.

[0051] 10 and 11, in the substrate processing apparatus 1, the control unit 100 lowers the suction pad 27, i.e., the substrate 200, on the mount-side transport unit 26. In the processing operation, the control unit 100 reads out the ultraviolet wavelength corresponding to the type of protective tape 210 determined by the processing conditions from the data 102 shown in FIG. 5, and turns on the UV LED light source 35, which irradiates ultraviolet light of the read wavelength, for a predetermined period of time. This hardens the adhesive layer of the protective tape 210 attached to the surface 202 of the substrate 200, reducing the adhesive strength of the adhesive layer.

[0052] In the processing operation, the control unit 100 of the substrate processing apparatus 1 turns on the UV LED light source 35 of the ultraviolet irradiation unit 30 for a predetermined time, then turns it off, and causes the mount-side transport unit 26 to lift the suction pad 27, i.e., the substrate 200. In the processing operation, the control unit 100 of the substrate processing apparatus 1 moves the shutter members 36 of the shutters 34 of the ultraviolet irradiation unit 30 in directions approaching each other, thereby closing the opening 31.

[0053] In the processing operation, the control unit 100 of the substrate processing apparatus 1 causes the mount-side transport unit 26 to transfer the substrate 200 to the intra-unit transport unit of the frame mount unit 20, and causes the intra-unit transport unit to transport the substrate 200 to the mount unit 22. In the processing operation, the control unit 100 of the substrate processing apparatus 1 causes the mount unit 22 to attach a frame 212 to the back surface 206 of the substrate 200 via tape 211, and causes the intra-unit transport unit to transport the substrate 200 with the frame 212 and the like attached to it to the peeling unit 23.

[0054] In the processing operation, the control unit 100 of the substrate processing apparatus 1 causes the peeling unit 23 to peel the protective tape 210 from the surface 202 of the substrate 200, and causes the intra-unit transport unit to transport the substrate 200 from which the protective tape 210 has been peeled to the cleaning unit 24. In the processing operation, the control unit 100 of the substrate processing apparatus 1 causes the cleaning unit 24 to clean the substrate 200, and causes the mount-side transport unit 26 to load the cleaned substrate 200 into the cassette 25. When the substrate processing apparatus 1 has performed grinding, polishing, etc. on all of the substrates 200 in the cassette 9, the processing operation ends.

[0055] The substrate processing apparatus 1 according to the first embodiment described above is configured to irradiate the entire surface of the protective tape 210 attached to the substrate 200 with ultraviolet light while the substrate 200 is held by the mount-side transport unit 26, thereby making it possible to suppress a decrease in throughput and an increase in the size of the apparatus. As a result, the substrate processing apparatus 1 according to the first embodiment has the effect of suppressing a decrease in throughput and an increase in the size of the apparatus.

[0056] Furthermore, the substrate processing apparatus 1 according to embodiment 1 not only achieves shorter irradiation time and longer life compared to when a mercury lamp is used by using the UV LED light source 35, but also has the advantage of overcoming the disadvantage of LEDs, which have a narrow wavelength band compared to mercury lamps, by using the UV LED light source 35 with multiple wavelengths.

[0057] [Modification] A substrate processing apparatus according to a modified example of embodiment 1 of the present invention will be described with reference to the drawings. Fig. 12 is a plan view schematically showing an ultraviolet irradiation section of an ultraviolet irradiation unit of the substrate processing apparatus according to a modified example of embodiment 1. In Fig. 12, the same parts as those in embodiment 1 are denoted by the same reference numerals, and their description will be omitted.

[0058] The substrate processing apparatus 1 according to the modified example is the same as that according to the first embodiment, except for the ultraviolet irradiation section 33 of the ultraviolet irradiation unit 30. The ultraviolet irradiation section 33 of the ultraviolet irradiation unit 30 of the substrate processing apparatus 1 according to the modified example includes a plurality of UVLED light sources 35 and a base 37, as shown in FIG.

[0059] The base 37 has a plate shape in a substantially horizontal position and is supported by a rotation shaft 38 that stands upright from the center of the bottom surface of the irradiation tube 32. The base 37 is formed in a fan shape that gradually widens radially outward from the center of the bottom surface of the irradiation tube 32. In the modified example, the base 37 has a fan shape with an angle 39 of approximately 90° in a plan view. In a plan view, the angle 39 of the base 37 is located at the center of the bottom surface of the irradiation tube 32, and the arc portion 42 is located on the outer edge of the bottom surface of the irradiation tube 32, and the angle 39 is supported by the rotation shaft 38.

[0060] The multiple UV LED light sources 35 are disposed on a base 37. More specifically, the multiple UV LED light sources 35 are disposed on the base 37, which rotates about a rotation shaft 38, so that the integrated amount of ultraviolet light irradiated onto the substrate 200 held by the suction pad 27 of the mount-side transport unit 26 is constant. The multiple UV LED light sources 35 are disposed on the base 37 in a plan view so that the intervals between adjacent UV LED light sources 35 along the spiral described above gradually narrow from the corner 39 toward the arc portion 42, so that the integrated amount of ultraviolet light irradiated onto the substrate 200 held by the suction pad 27 of the mount-side transport unit 26 is constant.

[0061] In the substrate processing apparatus 1 according to the modified example, the ultraviolet irradiation unit 30 turns on the UV LED light source 35 while rotating the base 37 about the rotation shaft 38, and irradiates the substrate 200 with ultraviolet light.

[0062] The substrate processing apparatus 1 according to the modified example is configured to irradiate the entire surface of the protective tape 210 attached to the substrate 200 with ultraviolet light while the substrate 200 is held by the mount-side transport unit 26, and therefore, similar to embodiment 1, it has the effect of suppressing a decrease in throughput and an increase in the size of the apparatus.

[0063] The present invention is not limited to the above-described embodiment, and can be implemented in various modifications without departing from the gist of the present invention. [Explanation of symbols]

[0064] 1. Substrate processing equipment 2 Grinding Unit 20 Frame Mount Unit 26 Mount side transfer unit (transfer arm) 30 UV irradiation unit 35 UVLED light source 41 Transport unit 100 control unit 101 Storage section 200 boards 202 Surface (one side) 206 Back side (other side) 210 Protective Tape 211 Tape 212 frames

Claims

1. A substrate processing apparatus, a grinding unit for grinding one surface of a substrate having a protective tape attached to the other surface; a frame mount unit that attaches a frame via tape to the other surface of the substrate ground by the grinding unit; a transfer unit including a transfer arm that holds the other surface side of the substrate after grinding and transfers it from the grinding unit to the frame mount unit; a control unit for controlling each component; a transfer path along which the substrate is transferred from the grinding unit to the frame mount unit; an ultraviolet irradiation unit including a UVLED light source arranged so that ultraviolet light is evenly irradiated onto the entire surface of the protective tape attached to one side of the substrate held by the transport arm; The ultraviolet irradiation unit comprises: an irradiation tube having an opening at the top; a shutter having a pair of shutter members that are movable in a direction to approach or move away from each other, close the opening when they approach each other, and open the opening when they move away from each other; The transfer arm includes: a circular suction pad for holding the substrate and having an outer diameter smaller than the distance between the pair of spaced-apart shutter members and the inner diameter of the opening; a large-diameter portion that is connected to an upper end of the suction pad and has a diameter larger than an inner diameter of the opening, When the ultraviolet irradiation unit irradiates the protective tape attached to one surface of the substrate held by the transport arm with ultraviolet rays, the suction pad is inserted into the irradiation tube through the opening. A substrate processing apparatus characterized by:

2. A substrate processing apparatus as described in claim 1, wherein the large diameter portion is formed in a circular shape and has an outer diameter larger than the distance between a pair of shutter members that are spaced apart from each other.

3. The ultraviolet irradiation unit comprises:

3. The substrate processing apparatus according to claim 1, wherein the substrate processing apparatus is capable of irradiating ultraviolet rays having at least two different wavelengths.

4. the control unit has a storage unit that stores the type of protective tape and the ultraviolet wavelength suitable for curing the protective tape, 4. The substrate processing apparatus according to claim 1, wherein the wavelength of the ultraviolet light irradiated onto the protective tape can be changed depending on the type of protective tape attached to the substrate.

Images