Vacuum equipment, electronic device manufacturing equipment

Abstract

To provide a vacuum apparatus that comprises a plurality of chambers configured to be reduced in pressure inside, and that reduces trouble in assembling by enabling the plurality of chambers to be transported integrally in a small space.SOLUTION: A vacuum apparatus comprises a first chamber 21, a second chamber 22 connected to the first chamber 21, and a support unit 25 supporting the first chamber 21 and second chamber 22. The support unit 25 comprises: a first pedestal 251 which has a first fixation surface 251a where a bottom surface of the first chamber 21 is fixed; a second pedestal 252 which has a second fixation surface 252a where a bottom surface of the second chamber 22 is fixed; and a connection part 253 which connects the first pedestal 251 and second pedestal 252. The support unit 25 bends by the connection part 253 to vary in an angle of a corner formed between a surface along the first fixation surface 251a and a surface along the second fixation surface 252a.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a vacuum apparatus and an apparatus for manufacturing electronic devices. [Background technology]

[0002] Among vacuum devices, there are known devices equipped with multiple chambers configured so that the internal pressure can be reduced. For example, manufacturing equipment for electronic devices such as organic electroluminescence (EL) display devices generally has multiple cluster devices and relay devices arranged alternately. The cluster device has chambers such as a transfer chamber and a film-forming chamber, and performs processes such as film formation on substrates. The relay device has chambers such as a swirl chamber and a pass chamber, and is arranged between the cluster devices to transport substrates. The chambers of these devices are each mounted on an independent stand, and are transported to a factory or the like in a separated state. Therefore, when assembling the manufacturing equipment, it is necessary to adjust the vertical and horizontal positions of the chambers in order to connect them to each other.

[0003] On the other hand, Patent Document 1 discloses a configuration in which multiple chambers are supported by a single pedestal. One chamber is supported by the pedestal, and another chamber is connected to both ends of the other chamber, and the multiple chambers are supported in a so-called cantilever state, thereby supporting the multiple chambers with a single pedestal. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 10-247675 Summary of the Invention [Problem to be solved by the invention]

[0005] The configuration described above, in which multiple chambers are supported by a single stand, eliminates the need for position adjustments when assembling the device after transport. However, if the device is large, a similar configuration cannot be adopted because of potential problems such as tilting of the chambers and damage to the connections in a cantilevered state, as well as size restrictions for transportation.

[0006] The present invention aims to provide a vacuum device having a plurality of chambers configured so that the interior can be depressurized, which can transport the plurality of chambers as a single unit in a small space, thereby reducing the labor required for assembly. [Means for solving the problem]

[0007] The vacuum device of the present invention comprises: The inside is configured to be decompressible A first chamber; It is configured so that the inside can be decompressed. a second chamber connected to the first chamber; a support unit supporting the first chamber and the second chamber; A vacuum device comprising: the support unit comprises: a first pedestal having a first fixing surface to which a bottom surface of the first chamber is fixed; a second pedestal having a second fixing surface to which a bottom surface of the second chamber is fixed; and a connection portion connecting the first pedestal and the second pedestal; The support unit includes: It can be switched between two states: installation state and transportation state. The angle formed by the plane along the first fixing surface and the plane along the second fixing surface changes due to the connecting portion. The total length in the longitudinal direction in the transport state is made shorter than the total length in the longitudinal direction in the installed state. It is characterized by bending in such a way that [Effects of the Invention]

[0008] According to the present invention, in a vacuum apparatus having a plurality of chambers configured so that the inside can be depressurized, This allows multiple chambers to be transported as a single unit in a small space, reducing the labor required for assembly. [Brief explanation of the drawings]

[0009] [Figure 1]FIG. 1 is a schematic diagram showing a part of an electronic device manufacturing apparatus. [Figure 2] FIG. 2 is a schematic diagram of a relay device in an installed state. [Figure 3] FIG. 2 is a schematic perspective view of a relay device in an installed state. [Figure 4] FIG. 2 is a schematic diagram of a relay device in a transport state. [Figure 5] FIG. 2 is a schematic perspective view of a relay device in a transport state. [Figure 6] FIG. 10 is a schematic diagram of a connection portion in a transport state. [Figure 7] FIG. 2 is a schematic front view of the connection portion in an installed state. [Figure 8] FIG. 10 is a schematic bottom view of the connection portion in an installed state. [Figure 9] FIG. [Figure 10] FIG. 10 is a schematic diagram showing the driving of the leg members. [Figure 11] FIG. 10 is a schematic front view of a connection portion according to a modified example in a transport state. [Figure 12] FIG. 1 is an explanatory diagram of an organic EL display device according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0010] The following describes in detail exemplary embodiments of the present invention with reference to the drawings. However, the dimensions, materials, shapes, and relative positions of the components described in the embodiments may be changed as appropriate depending on the configuration of the device to which the invention is applied and various conditions. In other words, the scope of the present invention is not limited to the following embodiments.

[0011] The present invention relates to a vacuum apparatus having multiple chambers configured to enable pressure reduction inside. The present invention can be applied, for example, to an apparatus for depositing various materials on the surface of a substrate to form a film, and is preferably applied to an apparatus for forming a thin film (material film) of a desired pattern by vacuum deposition. The substrate material can be any material, such as glass, a polymeric film, a silicon wafer, or a metal. The substrate may be, for example, a glass substrate on which a film such as polyimide is deposited. The deposition material may also be any material, such as an organic material or a metallic material (metal, metal oxide, etc.). In addition to the vacuum deposition apparatus described below, the present invention can also be applied to film formation apparatuses including sputtering apparatuses and CVD (Chemical Vapor Deposition) apparatuses. Specifically, the technology of the present invention can be applied to apparatuses for manufacturing organic electronic devices (e.g., organic light-emitting elements, thin-film solar cells), optical components, etc. Among these, an apparatus for manufacturing organic light-emitting elements, which forms an organic light-emitting element by evaporating a deposition material and depositing it on a substrate through a mask, is one preferred application example of the present invention. The following describes the application of the present invention to an electronic device manufacturing apparatus, but the vacuum apparatus of the present invention is not limited to this and can be applied to various vacuum apparatuses equipped with multiple chambers.

[0012] <Electronic device manufacturing equipment> FIG. 1 is a plan view schematically showing the configuration of a portion of an electronic device manufacturing apparatus. The manufacturing apparatus in FIG. 1 is used, for example, to manufacture display panels for organic EL display devices for smartphones or organic EL display devices for VRHMDs. In the case of display panels for smartphones, for example, a 4.5th generation substrate (approximately 700 mm x approximately 900 mm), a 6th generation full size (approximately 1500 mm x approximately 1850 mm), or a half-cut size (approximately 1500 mm x approximately 925 mm) substrate is used. After films are formed on the substrate to form organic EL elements, the substrate is cut out to produce a plurality of smaller size panels. In the case of display panels for VRHMDs, for example, a silicon wafer of a predetermined size (for example, 300 mm) is used. After films are formed on the silicon wafer to form organic EL elements, the regions between the element formation regions (scrape) are cut out. The silicon wafer is cut along the ridge area to create multiple small panels.

[0013] An electronic device manufacturing apparatus generally includes a plurality of cluster apparatuses 1 and a relay apparatus 2 connecting the cluster apparatuses. The cluster apparatus 1 includes a plurality of film formation apparatuses 11 that perform processing (e.g., film formation) on substrates, a plurality of mask stock apparatuses 12 that store masks before and after use, and a transfer chamber 13 located in the center thereof. As shown in FIG. 1, the transfer chamber 13 is connected to each of the plurality of film formation apparatuses 11 and the mask stock apparatus 12.

[0014] A transfer robot 14 for transferring substrates and masks is disposed within the transfer chamber 13. The transfer robot 14 transfers substrates from the pass chamber 22 of the relay device 2 disposed upstream to the film formation device 11. The transfer robot 14 also transfers masks between the film formation device 11 and the mask stock device 12. The transfer robot 14 is, for example, a robot having a structure in which a robot hand for holding a substrate or a mask is attached to an articulated arm.

[0015] In the film formation apparatus 11 (also called a film formation chamber or a vapor deposition apparatus), a vapor deposition material stored in an evaporation source is heated by a heater to evaporate and then deposited on a substrate through a mask. A series of film formation processes, such as transferring the substrate to and from a transfer robot 14, adjusting the relative positions of the substrate and the mask (alignment), fixing the substrate on the mask, and film formation (vapor deposition), are performed by the film formation apparatus 11.

[0016] In the mask stock device 12, new masks to be used in the film formation process in the film formation device 11 and used masks are stored in two separate cassettes. A transfer robot 14 transfers used masks from the film formation device 11 to a cassette in the mask stock device 12, and transfers new masks stored in another cassette in the mask stock device 12 to the film formation device 11.

[0017] Connected to the cluster apparatus 1 are a pass chamber 22 that supplies substrates from the upstream side in the substrate flow direction to the cluster apparatus 1, and a pass chamber 22 that supplies substrates for which film formation processing has been completed in the cluster apparatus 1 to another cluster apparatus on the downstream side. A transfer robot 14 in the transfer chamber 13 receives substrates from the upstream pass chamber 22 and transfers them to one of the film formation apparatuses 11 in the cluster apparatus 1. The transfer robot 14 also receives substrates for which film formation processing has been completed in the cluster apparatus 1 from one of the multiple film formation apparatuses 11 and transfers them to the pass chamber 22 of the relay apparatus 2 connected downstream.

[0018] The relay device 2 is provided with a swirl chamber 21 that changes the orientation of the substrate, and pass chambers 22 on both the upstream and downstream sides of the swirl chamber 21, and transports the substrate transported from the upstream cluster device 1 to the downstream cluster device 1. The swirl chamber 21 is provided with a transport robot 24 that receives the substrate from the upstream pass chamber 22, rotates the substrate by 180°, and transports it to the downstream pass chamber 22. This ensures that the orientation of the substrate transported into the upstream cluster device 1 and the downstream cluster device 1 is the same, facilitating substrate processing.

[0019] In this embodiment, the pass chamber 22 is equipped with a stage for placing a substrate. The pass chamber 22 installed upstream of the swirl chamber 21 in the relay device 2 is equipped with a fixed stage that does not move or rotate. On the other hand, the pass chamber 22 installed downstream of the swirl chamber 21 is equipped with an alignment mechanism, and the stage can be driven to move in a first direction parallel to the placement surface, move in a second direction parallel to the placement surface and perpendicular to the first direction, and rotate around a third direction perpendicular to the first and second directions. The alignment process can be made more efficient by aligning the substrate in the relay device 2 in advance before the substrate is transferred into the transfer chamber 13 of the cluster device 1.

[0020] A buffer chamber 23 may be provided downstream of the cluster device 1 instead of the pass chamber 22. The relay device 2 installed upstream and / or downstream of the cluster device 1 may include a swirl chamber. 21, and at least one of a pass chamber 22 and a buffer chamber 23.

[0021] The cluster apparatus 1 and the relay apparatus 2 are vacuum apparatuses configured so that the interiors of the multiple chambers that make up each apparatus can be depressurized. The film forming apparatus 11, the mask stock apparatus 12, the transfer chamber 13, the buffer chamber 23, the swirl chamber 21, and the like are maintained in a high vacuum state during the manufacturing process of the organic light-emitting device. The pass chamber 22 is usually maintained in a low vacuum state, but may be maintained in a high vacuum state as necessary.

[0022] In this example, the configuration of the electronic device manufacturing apparatus has been described with reference to FIG. 1 , but the present invention is not limited thereto. Other types of apparatus and chambers may be included, and the arrangement of these apparatus and chambers may be changed. For example, the electronic device manufacturing apparatus according to one embodiment of the present invention may be an in-line type instead of the cluster type shown in FIG. 1 . That is, the apparatus may have a configuration in which a substrate and a mask are mounted on a carrier and transported through a plurality of film formation apparatuses arranged in a line to form a film. Furthermore, the apparatus may have a structure that combines the cluster type and in-line types. For example, the processes up to the formation of the base layer may be performed using a cluster type manufacturing apparatus, and the processes from the film formation of the electrode layer (cathode layer) to the sealing process and cutting process may be performed using an in-line type manufacturing apparatus.

[0023] <Relay device> 2 to 5, a relay device 2 according to an embodiment of the present invention will be described. In this embodiment, the longitudinal direction in which a substrate is transported from an upstream chamber to a downstream chamber in the substrate transport direction is defined as the X direction, the width direction perpendicular to the longitudinal direction is defined as the Y direction, and the height direction perpendicular to the longitudinal and width directions is defined as the Z direction. The longitudinal direction (X direction) is also the direction in which the substrate moves between the chambers.

[0024] The relay device 2 of this embodiment has a unique configuration that can be switched between two states: an installation state in which substrates are transported between cluster devices, and a transport state in which the device is transported to a factory or the like. FIG. 2(a) is a schematic plan view showing the configuration of the relay device 2 in an installation state in which the swirl chamber 21 and the pass chamber 22 are connected and substrates can be transported between the swirl chamber 21 and the pass chamber 22, and FIG. 2(b) is a schematic front view of the same. FIG. 3 is a schematic perspective view showing the relay device 2 in an installation state. The relay device 2 of this embodiment has pass chambers 22 (second chamber and third chamber) adjacent to each other on the upstream and downstream sides of the swirl chamber 21 (first chamber), and includes a support unit 25 that supports the swirl chamber 21 and the pass chamber 22. Furthermore, the relay device 2 has a gate valve 26 between the swirl chamber 21 and the pass chamber 22, and the gate valve 26 and the pass chamber 22 are connected via an adapter plate 27.

[0025] The support unit 25 includes a pedestal 251 (first pedestal) that supports the swirl chamber 21, a movable pedestal 252 (second pedestal, third pedestal) that supports the pass chamber 22, and a connection portion 253 that connects the pedestal 251 and the movable pedestal 252. The bottom surface of the swirl chamber 21 is fixed to a fixed surface 251a (first fixed surface) of the pedestal 251. Similarly, the bottom surface of the pass chamber 22 is fixed to a fixed surface 252a (second fixed surface, third fixed surface) of the movable pedestal 252. Furthermore, the support unit 25 includes a support structure 254 that supports the pedestal 251 from below, a leg member 255 that supports the movable pedestal 252 from below, and a shaft clamp member 256 as a leg connecting member that connects the leg member 255 and the movable pedestal 252.

[0026] In this embodiment, swirl chamber 21 has a hexagonal shape when viewed from above, and support structure 254, which supports swirl chamber 21 from below via pedestal 251, is made up of multiple support columns, including support columns supporting each vertex of the hexagon. Furthermore, support structure 254 is provided with level adjuster 2541, which allows for adjustment of the position in the height direction when assembling the device.

[0027] The pass chamber 22 in this embodiment has a rectangular shape when viewed from above, and is fixed to a movable pedestal 252. In the relay device 2 in an installed state, a fixing surface 251a of the pedestal 251 to which the swirl chamber 21 is fixed and a fixing surface 252a of the movable pedestal 252 to which the pass chamber 22 is fixed are arranged to be parallel. The movable pedestal 252 is supported by leg members 255 via shaft clamp members 256. Furthermore, the movable pedestal 252 is connected to the pedestal 251 via a connecting portion 253 composed of a plurality of members. That is, in the installed state, the movable pedestal 252 is supported by the leg members 255 and the connecting portion 253. Furthermore, the leg members 255 are provided with level adjusters 2551, and like the support structure 254, the position in the height direction can be adjusted.

[0028] Furthermore, the movable base 252 of this embodiment is supported by the connection portion 253 so as to be rotatable around the width direction (Y direction) as a rotation axis. When the connection between the pass chamber 22 and the swirl chamber 21 is released and the movable base 252 is rotated, the pass chamber 22 rotates together with the movable base 252. In addition, the leg members 255 are also supported by the shaft clamp members 256 so as to be rotatable around the width direction as a rotation axis. The relay device 2 in the installed state can be switched to a transport state, which will be described later, by rotating the movable base 252 and the leg members 255, respectively. The configuration that enables the movable base 252 and the leg members 255 to rotate will be described in detail below.

[0029] FIG. 4(a) is a schematic plan view showing the configuration of the relay device 2 in a transport state, and FIG. 4(b) is a schematic front view thereof. FIG. 5 is a schematic perspective view showing the relay device 2 in a transport state. In the relay device 2 in a transport state, the support unit 25 is bent so that the fixed surface 251a of the base 251 and the fixed surface 252a of the movable base 252 form an approximately right angle. Furthermore, the leg member 255 is folded relative to the movable base 252 so as to extend in a direction parallel to the fixed surface 252a of the movable base 252. The relay device 2 of this embodiment is configured so that a distance M1 from a rotation shaft portion 252b, which is the rotation center of the movable base 252, to the lower end of the support structure 254 is greater than a distance M2 from the rotation shaft portion 252b to the end of the movable base 252 farther from the connection portion 253. With this configuration, when the movable base 252 rotates relative to the base 251, the support unit 25 bends at a substantially right angle without the movable base 252 interfering with the ground, and the size of the relay device 2 during transportation can be reduced.

[0030] Furthermore, in order to prevent the leg members 255 from interfering with the support structure 254 and the like, the leg members 255 are rotatably supported by shaft clamp members 256 connected to the movable base 252, and are foldable relative to the movable base 252. That is, in the transport state, the movable base 252 is supported only by the connection parts 253. Note that, if the weight of the movable base 252 including the pass chamber 22 is so great that support by the connection parts 253 alone is insufficient, a modified example can be considered in which the movable base 252 and the support structure 254 are connected by a separate member to provide stronger support during transport.

[0031] As described above, by configuring the support unit 25 to be bendable so that the angle of the fixing surface 252a relative to the fixing surface 251a can be changed, the overall length L2 of the relay device 2 in the longitudinal direction in the transported state can be made smaller than the overall length L1 of the relay device 2 in the longitudinal direction in the installed state. Deforming the device so that the overall length of the longest side of the device is reduced provides significant advantages during transportation, such as reducing the transportation space and avoiding conflicts with size restrictions during transportation. That is, the relay device 2 of the present invention can transport multiple chambers as a single unit, making it easy to adjust the position when installing the device. Furthermore, compared to when each chamber or platform is simply connected, the device can be transported in a smaller size, contributing to space savings and avoiding conflicts with size restrictions during transportation.

[0032] The gate valve 26 has a disk 261 (valve element) and a body 262 (valve body), and opens and closes a passage for the substrate to pass from the inside of the swirl chamber 21 to the inside of the pass chamber 22 by movement of the disk 261. On the surface of the gate valve 26 opposite to the surface connected to the swirl chamber 21, An adapter plate 27 is provided for connection to the pass chamber 22. The adapter plate 27 and the pass chamber 22 are connected with threaded fasteners (not shown), and fastening with the threaded fasteners can be performed by removing a lid provided on the top surface of the pass chamber 22. The adapter plate 27 also has seal grooves 27a in which seal rings 28 are provided on both the connecting surface with the gate valve 26 and the connecting surface with the pass chamber 22. Connecting the gate valve 26 and the pass chamber 22 via the adapter plate 27 provided with the seal grooves 27a prevents air from leaking from the connection between the gate valve 26 and the pass chamber 22. The disk 261 is raised to block the path through which the substrate passes, closing the gate valve 26, sealing each chamber, and then evacuating each chamber with a pump, thereby maintaining each chamber in a low vacuum state or a high vacuum state.

[0033] In the relay device 2 in the transport state, each chamber may be sealed to prevent moisture and the like from entering the chambers during transport by sea, etc. Therefore, in the transport state, the gate valves 26 provided at both ends of the swirl chamber 21 are closed, thereby sealing the swirl chamber 21. Furthermore, the pass chamber 22 is sealed by attaching blank members 41 to both ends. The blank members 41 are made of SUS metal plates or the like with a thickness of about 5 to 20 mm. After sealing, the interiors of the swirl chamber 21 and the pass chamber 22 are each depressurized to create a vacuum state inside, and then transported.

[0034] <Connection 253> 6 to 9, the connection part 253 that connects the pedestal 251 and the movable pedestal 252 will be described. The movable pedestal 252 (second pedestal) and connection part 253 that connect to the pass chamber 22 provided on the downstream side of the swirl chamber 21 will be described below with reference to the drawings. Note that the movable pedestal 252 (third pedestal) and connection part 253 (connection part for the third pedestal) that connect to the pass chamber 22 provided on the upstream side of the swirl chamber 21 have the same configuration as those on the downstream side, and therefore description thereof will be omitted.

[0035] FIG. 6(a) is a schematic plan view showing the configuration of the connection portion 253 in a transport state, and FIG. 6(b) is a schematic front view thereof. The connection portion 253 in this embodiment is composed of three types of members: a base connection member 2531 that connects to the base 251; an intermediate member 2532 that engages with a pin component 38 connected to the underside of the path chamber 22; and a shaft clamp member 2533 through which the rotating shaft portion 252b of the movable base 252 is inserted. The base connection member 2531 is connected to the base 251 with screws 35 and is a member that extends in the longitudinal direction (X direction) so as to pass beside the space through which the disk 261 of the gate valve 26 moves, and is provided on both sides in the width direction of the relay device 2. The intermediate member 2532 is a member that is long in the width direction (Y direction) of the relay device 2 and is connected to the base connection member 2531 at both ends in the width direction with screws 33 and 34. That is, the connection portion 253 is provided so that the base 251, base connection member 2531, and intermediate member 2532 surround the body 262 of the gate valve 26 and the space in which the disk 261 moves. Furthermore, the intermediate member 2532 is provided with pin holes 2532a that engage with pin parts 38 connected to the path chamber 22. The pair of shaft clamp members 2533 are connected to both ends of the intermediate member 2532 in the width direction with screws 32. Furthermore, the shaft clamp members 2533 support the movable base 252 by engaging with the rotating shaft portion 252b of the movable base 252 at the rotating shaft support holes 2533a.

[0036] FIG. 7(a) is a schematic front view showing the detailed configuration of the connection portion 253 in an installed state, and FIG. 7(b) is a schematic front view of FIG. 7(a) with the screw parts and the like hidden. The shaft clamp member 2533 has a rotating shaft support hole 2533a, a notch 2533b, a clamp screw hole 2533c, a through hole 2533d (non-threaded hole), and a long through hole 2533e. The rotating shaft portion 252b of the movable base 252 is inserted into the rotating shaft support hole 2533a. The notch 2533b extends from the rotating shaft support hole 2533a to the end of the shaft clamp member 2533. The clamp screw hole 2533c and the through hole 2533d have the same central axis and extend perpendicular to the plane of the notch 2533b, and a clamp screw 31 is inserted through them. By attaching and fastening the clamp screw 31 to the clamp screw hole 2533c, the shaft clamp member 2533 is elastically deformed and the rotary shaft portion 252b of the movable base 252 is fastened by the rotary shaft support hole 2533a. By doing so, the movable base 252 can be rotated relative to the base 251, and by tightening the clamp screw 31, the movable base 252 can be fixed at a predetermined rotation position relative to the base 251.

[0037] The long through holes 2533e are holes through which screws 32 for connecting to the intermediate member 2532 are inserted, and two are provided in each shaft clamp member 2533. The long through holes 2533e are elongated in the longitudinal direction (X direction) for adjusting the longitudinal position of the pass chamber 22 with respect to the swirl chamber 21 when connecting the movable base 252 to the adapter plate 27. Providing two long through holes 2533e firmly supports the movable base 252 and prevents the shaft clamp member 2533 from rotating with respect to the intermediate member 2532 when the screws 32 are loosened, improving the workability of the installation work of the device. Details of the work of connecting the movable base 252 to the adapter plate 27 while adjusting the position of the movable base 252 and setting the relay device 2 in an installed state will be described later.

[0038] The base connecting member 2531 and the intermediate member 2532 are connected by a screw 33 attached to the side surface and a screw 34 attached to the underside. The base connecting member 2531 has a vertical wall portion 2531a, and the screw 33 is inserted into a through hole 2531b provided in the vertical wall portion 2531a. The screw 34 attached to the underside of the base connecting member 2531 is inserted into a screw hole provided in the lower part of the intermediate member 2532. In addition, a pin part 38 connected to the path chamber 22 engages with a pin hole 2532a of the intermediate member 2532.

[0039] FIG. 8(a) is a schematic bottom view showing the detailed configuration of the connection portion 253, and FIG. 8(b) is a schematic bottom view showing the detailed configuration of FIG. 8(a) without showing the screw parts and the like. FIG. 9 is a detailed view showing the detailed configuration of the connection portion 253. The base connection member 2531 is connected to the intermediate member 2532 with a screw 33 inserted into a through hole 2531b formed in a vertical wall portion 2531a on the side surface and a screw 34 inserted into a long through hole 2531c formed on the underside. The long through hole 2531c has an elongated hole shape that is long in the width direction (Y direction) for adjusting the widthwise position of the pass chamber 22 with respect to the swirl chamber 21 when connecting the movable base 252 to the adapter plate 27. That is, the long through hole 2533e of the shaft clamp member 2533 and the long through hole 2531c of the base connection member 2531 are long in directions perpendicular to each other. In addition, a gap of approximately 5 to 20 mm is provided between the vertical wall portion 2531a of the base connecting member 2531 and the end portion of the intermediate member 2532 facing the vertical wall portion 2531a, allowing the intermediate member 2532 to move widthwise relative to the base connecting member 2531 together with the path chamber 22.

[0040] Although the connection part 253 in this embodiment is made up of three types of members, it may be made up of more multiple members. Also, the connection part 253 is configured to have a space in which the disk 261 of the gate valve 26 moves, but a modified example is also conceivable in which a gate valve 26 whose disk 261 moves upward is used and the connection part 253 is configured without having a space in which the disk 261 moves.

[0041] Furthermore, the elongated holes provided in the connection portion are not limited to the configuration described above. For example, holes through which screws are inserted to connect the connection portion 253 and the base 251 may be elongated holes.

[0042] <Legs> 10(a) is a schematic diagram showing a state in which the leg member 255 is folded relative to the movable base 252, and FIG. 10(b) is a schematic diagram showing a state in which the leg member 255 supports the movable base 252. When the relay device 2 is in an installed state, the leg member 255 that supports the movable base 252 is connected to the movable base 252 via an axis clamp member 256. In addition, in order to prevent a situation in which the leg member 255 interferes with the ground and is unable to rotate when the movable base 252 rotates relative to the base 251, Additionally, the leg member 255 is also supported by the shaft clamp member 256 so as to be rotatable relative to the movable base 252 .

[0043] The shaft clamp member 256 has a rotation shaft support hole, a notch, a clamp screw hole, and a through-hole (non-threaded hole), and is connected to the movable base 252 with a screw 36. The rotation shaft support hole engages with the rotation shaft portion 255a of the leg member 255. The notch extends from the rotation shaft support hole to the end of the shaft clamp member 256. The clamp screw hole and the through-hole have the same central axis and extend perpendicular to the plane of the notch, and a clamp screw is inserted through them. By attaching and fastening a clamp screw 37 to the clamp screw hole, the shaft clamp member 256 elastically deforms, and the rotation shaft portion 255a of the leg member 255 is fastened by the rotation shaft support hole. In other words, by loosening the clamp screw 37, the leg member 255 can be rotated relative to the movable base 252, and by tightening the clamp screw 37, the position of the leg member 255 is fixed relative to the movable base 252. With the above-described configuration, the leg members 255 are fixed in a folded state relative to the movable base 252 during transportation, and the leg members 255 do not interfere with the support structure 254.

[0044] In the relay device 2 of this embodiment, the leg members 255 are connected to the movable base 252 even in the transport state, but the relay device 2 may be configured without a rotation function, assuming that the leg members 255 will be detached for transport. Also, the leg members 255 may be configured to be extendable in length so that they do not interfere with the support structure 254 when the relay device 2 is bent. Furthermore, a configuration in which the number of leg members is increased to provide stronger support can naturally be envisioned as a modified example.

[0045] <Installation of relay device 2> A method for assembling the relay device 2, which has been transported to a factory or the like, into an installation state will be described. First, to connect the relay device 2 at the same pass line height as the cluster device 1, the height position is adjusted using the level adjuster 2541 provided on the support structure 254. Next, the shaft clamp member 2533 is loosened and the movable base 252 is rotated so that the fixed surface 252a of the movable base 252 is approximately parallel to the fixed surface 251a of the base 251. At this time, the shaft clamp member 256 is also loosened, and the leg member 255 is rotated so that the movable base 252 and the pass chamber 22 can be supported. Then, the posture of the movable base 252 is fixed, and the level adjuster 2551 of the leg member 255 is used to adjust so that the pass chamber 22 can be supported from below. In this way, the pass chamber 22 is supported by the connection portion 253 and the leg member 255 via the movable base 252.

[0046] Next, to connect the pass chamber 22 and the swirl chamber 21, the position of the pass chamber 22 relative to the swirl chamber 21 is finely adjusted. Because the pass chamber 22 is connected to the adapter plate 27 with screw parts, position adjustments in various directions are required so that the screw fastening hole positions of the respective parts match. The pass chamber 22 is fixed to the movable base 252 with screw parts inserted from the bottom of the movable base 252, and the height position of the pass chamber 22 relative to the swirl chamber 21 can be finely adjusted by inserting a shim tape between the pass chamber 22 and the movable base 252. Furthermore, the horizontal position of the pass chamber 22 relative to the swirl chamber 21 can be finely adjusted by the through-hole 2533e that is long in the longitudinal direction (X direction) and the through-hole 2531c that is long in the width direction (Y direction). With the above configuration, an apparatus equipped with multiple chambers can be transported as a single unit in a small space, and after transportation, the position of the pass chamber 22 relative to the swirl chamber 21 can be finely adjusted and easily connected to assemble the apparatus.

[0047] The configuration of the present invention is not limited to the above-described configuration, and various modifications are possible. For example, a configuration in which a buffer chamber 23 is provided in the relay device 2 instead of the pass chamber 22, or a configuration in which pass chambers 22 are provided at both ends of the transfer chamber 13 of the cluster device 1 using connection parts 253 instead of the swirl chamber 21, etc. are possible.

[0048] As another modified example, a configuration in which a screw or the like is used instead of the pin component 38 to connect the path chamber 22 and the connecting portion 253 is also possible. FIG. 11 is a schematic front view showing the detailed configuration of the connecting portion 253 in an installed state of a modified example using a screw 39. In this modified example, the screw 39 is inserted through a through-hole provided in the base connecting member 2531 and the intermediate member 2532 and then into a threaded hole provided in the underside of the path chamber 22, thereby connecting the path chamber 22 and the connecting portion 253. With this configuration, a fastening force acts in a direction in which the path chamber 22 and the connecting portion 253 approach each other, thereby achieving a stronger connection than when a pin is simply engaged with a hole. Furthermore, during transportation, the screw 39 is attached to the underside of the path chamber 22, and the base connecting member 2531 and the intermediate member 2532 are connected with separate members such as a bolt and nut, thereby preventing foreign matter from entering the screw hole or the through-hole. It is also possible to configure the connection by providing separate screws and holes for connecting the path chamber 22 and the intermediate member 2532, and for connecting the intermediate member 2532 and the base connecting member 2531.

[0049] <Electronic device manufacturing method> Next, an example of a method for manufacturing an electronic device using the vacuum apparatus according to this embodiment will be described. Below, the configuration of an organic EL display device will be shown as an example of an electronic device, and a method for manufacturing the organic EL display device will be illustrated.

[0050] First, the organic EL display device to be manufactured will be described. Fig. 12(a) is an overall view of an organic EL display device 50, and Fig. 12(b) shows the cross-sectional structure of one pixel.

[0051] As shown in FIG. 12(a), a plurality of pixels 502, each including a plurality of light-emitting elements, are arranged in a matrix in a display region 501 of an organic EL display device 50. As will be described in detail later, each light-emitting element has a structure including an organic layer sandwiched between a pair of electrodes. Note that the term "pixel" here refers to the smallest unit that enables a desired color to be displayed in the display region 501. In the organic EL display device according to this embodiment, each pixel 502 is configured by a combination of a first light-emitting element 502R, a second light-emitting element 502G, and a third light-emitting element 502B, which emit light different from one another. The pixel 502 is often configured by a combination of red, green, and blue light-emitting elements, but may also be a combination of yellow, cyan, and white light-emitting elements, and is not particularly limited as long as it emits at least one color.

[0052] 12(b) is a partial cross-sectional schematic diagram taken along line SS in FIG. 12(a). A pixel 502 includes a plurality of light-emitting elements, each of which includes a first electrode (anode) 504, a hole transport layer 505, one of light-emitting layers 506R, 506G, or 506B, an electron transport layer 507, and a second electrode (cathode) 508 on a substrate 503. Among these, the hole transport layer 505, the light-emitting layers 506R, 506G, or 506B, and the electron transport layer 507 correspond to organic layers. In this embodiment, the light-emitting layer 506R is an organic EL layer that emits red light, the light-emitting layer 506G is an organic EL layer that emits green light, and the light-emitting layer 506B is an organic EL layer that emits blue light. The light-emitting layers 506R, 506G, and 506B are formed in patterns corresponding to the light-emitting elements (sometimes referred to as organic EL elements) that emit red, green, and blue light, respectively.

[0053] Furthermore, the first electrode 504 is formed separately for each light-emitting element. The hole transport layer 505, the electron transport layer 507, and the second electrode 508 may be formed in common for the plurality of light-emitting elements 502R, 502G, and 502B, or may be formed for each light-emitting element. Note that an insulating layer 509 is provided between the first electrodes 504 to prevent short-circuiting between the first electrode 504 and the second electrode 508 due to foreign matter. Furthermore, since the organic EL layer deteriorates due to moisture and oxygen, a protective layer 510 is provided to protect the organic EL element from moisture and oxygen.

[0054] In FIG. 12(b), the hole transport layer 505 and the electron transport layer 507 are shown as a single layer. Depending on the structure of the organic EL display element, the organic EL display element may be formed of multiple layers including a hole blocking layer and an electron blocking layer. In addition, a hole injection layer having an energy band structure that can smoothly inject holes from the first electrode 504 to the hole transport layer 505 can be formed between the first electrode 504 and the hole transport layer 505. Similarly, an electron injection layer can be formed between the second electrode 508 and the electron transport layer 507.

[0055] Next, an example of a method for manufacturing an organic EL display device will be specifically described.

[0056] First, a circuit (not shown) for driving the organic EL display device and a substrate (mother glass) 503 on which a first electrode 504 is formed are prepared.

[0057] An acrylic resin is formed by spin coating on the substrate 503 on which the first electrode 504 is formed, and the acrylic resin is patterned by lithography so as to form an opening in the area where the first electrode 504 is formed, thereby forming an insulating layer 509. This opening corresponds to the light-emitting region where the light-emitting element actually emits light.

[0058] The substrate 503 with the patterned insulating layer 509 is placed on a substrate carrier with an adhesive member attached. The adhesive member holds the substrate 503 in place. The substrate is then carried into a first organic material deposition apparatus, and after being inverted, a hole transport layer 505 is deposited as a common layer on the first electrode 504 in the display area. The hole transport layer 505 is deposited by vacuum deposition. In practice, the hole transport layer 505 is formed to be larger than the display area 501, so a high-resolution mask is not required.

[0059] Next, the substrate 503 on which up to the hole transport layer 505 has been formed is carried into a second organic material film formation apparatus. The substrate and a mask are aligned, and the substrate is placed on the mask. A red-emitting light-emitting layer 506R is formed on the portion of the substrate 503 where the red-emitting element is to be disposed.

[0060] Similar to the formation of the light-emitting layer 506R, a green-emitting light-emitting layer 506G is formed by a third organic material film formation apparatus, and then a blue-emitting light-emitting layer 506B is formed by a fourth organic material film formation apparatus. After the formation of the light-emitting layers 506R, 506G, and 506B is completed, an electron transport layer 507 is formed over the entire display area 501 by a fifth film formation apparatus. The electron transport layer 507 is formed as a layer common to the three light-emitting layers 506R, 506G, and 506B.

[0061] The substrate on which the electron transport layer 507 has been formed is moved in a metallic evaporation material deposition device, and a second electrode 508 is deposited.

[0062] Thereafter, the substrate is transferred to a plasma CVD apparatus, where a protective layer 510 is formed, thereby completing the film formation process on the substrate 503. After inversion, the adhesive member is peeled off from the substrate 503 as described in the above embodiment or example, thereby separating the substrate 503 from the substrate carrier. Thereafter, the organic EL display device 50 is completed after cutting.

[0063] If the substrate 503 on which the insulating layer 509 is patterned is exposed to an atmosphere containing moisture or oxygen from the time it is carried into the film-forming apparatus until the completion of the formation of the protective layer 510, the light-emitting layer made of an organic EL material may be deteriorated by the moisture or oxygen. Therefore, in this embodiment, the substrate is carried in and out of the film-forming apparatus in a vacuum atmosphere or an inert gas atmosphere. [Explanation of symbols]

[0064] Swirling chamber (first chamber) 21, path chamber (second chamber) 22, support unit 25, base (first base) 251, fixed surface (first fixed surface) 251a, movable base (second base) 252, fixed surface (second fixed surface) 251b, connection portion 253

Claims

1. A first chamber configured to be able to reduce the pressure inside; a second chamber configured so that the inside thereof can be decompressed and connected to the first chamber; a support unit supporting the first chamber and the second chamber; A vacuum device comprising: the support unit includes a first base having a first fixing surface to which a bottom surface of the first chamber is fixed, a second base having a second fixing surface to which a bottom surface of the second chamber is fixed, and a connection portion connecting the first base and the second base, The support unit is capable of being switched between two states: an installation state and a transport state, and the connection portion changes the angle between the surface along the first fixing surface and the surface along the second fixing surface, thereby bending the support unit so that the total length in the longitudinal direction of the transport state is smaller than the total length in the longitudinal direction of the installation state.

2. 2. The vacuum apparatus according to claim 1, further comprising a gate valve provided between the first chamber and the second chamber for opening and closing a passage through which the substrate passes from the inside of the first chamber to the inside of the second chamber.

3. 3. The vacuum apparatus according to claim 2, wherein a space for allowing a valve element of the gate valve to move is provided in the connection portion of the support unit.

4. the connecting portion is composed of a plurality of members that are connected to each other by fastening threaded fasteners, the first base is connected to the connection portion by fastening a screw fastener; The vacuum device according to any one of claims 1 to 3, characterized in that at least one of the through holes through which the shanks of the screw fasteners for connecting the plurality of components to each other are inserted and the through holes through which the shanks of the screw fasteners for connecting the connection portion and the first base are inserted is an elongated hole that is long in the direction of movement of a substrate between the first chamber and the second chamber.

5. a through hole through which a shank of the screw fastener for connecting the plurality of members to each other is inserted, and a through hole through which a shank of the screw fastener for connecting the connection portion and the first seat is inserted, 5. The vacuum device according to claim 4, wherein at least one of the holes is an elongated hole that is long in a direction perpendicular to the moving direction.

6. 6. The vacuum apparatus according to claim 1, wherein the support unit further comprises a support pillar connected to the first base and supporting the first base from below.

7. the second base includes a rotation shaft portion extending in a direction parallel to the first fixing surface, and is rotatably supported by the connection portion; 7. The vacuum device according to claim 6, wherein the connecting portion includes a shaft clamp member that can clamp the rotary shaft portion at a predetermined rotational position to fix the position of the second seat relative to the first seat.

8. the support unit is bendable so that an angle of the second fixing surface with respect to the first fixing surface is approximately a right angle; 8. The vacuum device according to claim 7, wherein a distance from the rotating shaft portion to a lower end of the support column in a direction perpendicular to the first fixed surface is greater than a distance from the rotating shaft portion to an end of the second base farther from the connection portion.

9. the support unit further includes a leg member that supports the second base from below, and a leg connecting member that connects the second base and the leg member, 9. The vacuum device according to claim 1, wherein the leg member is rotatably supported by the leg connecting member.

10. When the first fixing surface and the second fixing surface are parallel to each other, the leg member is perpendicular to a plane along the second fixing surface, 10. The vacuum device according to claim 9, wherein when the first fixing surface and the second fixing surface are not parallel, the leg members are positioned in a direction along the second fixing surface.

11. 11. The vacuum apparatus according to claim 1, wherein the first chamber is a turning chamber equipped with a robot hand for transporting a substrate.

12. the second chamber is a path chamber located downstream of the first chamber in a substrate transport direction and including a stage on which the substrate is placed, 12. The vacuum apparatus according to claim 11, wherein the stage is capable of at least one of movement in a first direction parallel to a surface on which the substrate is placed, movement in a second direction parallel to the surface on which the substrate is placed and perpendicular to the first direction, and rotation about a rotation axis in a third direction perpendicular to the first direction and the second direction.

13. a third chamber connected to the upstream side of the first chamber in the substrate transport direction, the support unit includes a third pedestal having a third fixing surface to which the third chamber is fixed, and a third pedestal connection portion that connects the first pedestal and the third pedestal, The vacuum device according to claim 12, wherein the support unit is bent by the third pedestal connection portion so that an angle formed between a plane along the first fixing surface and a plane along the third fixing surface changes.

14. 14. The vacuum apparatus according to claim 13, wherein the third chamber is a path chamber equipped with a fixed stage on which the substrate is placed.

15. a plurality of cluster apparatuses each having a film formation chamber for forming a film on a substrate; a relay device provided between adjacent cluster devices and configured to transport the substrate from an upstream side to a downstream side of the cluster device in a substrate transport direction; An electronic device manufacturing apparatus comprising:

15. An electronic device manufacturing apparatus, wherein the relay device includes the vacuum device according to claim 1.

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