Display device manufacturing method, display device, and tiling display device

Abstract

The present invention relates to a manufacturing method of a display device, a display device, and a tiling display device. The display device of the present invention includes an LCD display panel, a plurality of solder pad units, a plurality of conductive units, and a plurality of Mini LEDs. According to the present invention, by manufacturing a plurality of Mini LEDs in the frame area of ​​the LCD display panel, the frame area of ​​the LCD display panel that is not originally emitting light can be displayed by the Mini LEDs, improving the screen occupancy ratio of the display device and improving the product competitiveness of the tiling display device.

Description

[Technical Field]

[0001] The present application relates to the field of display technology, and in particular to a method for manufacturing a display device, a display device, and a tiling display device. [Background technology]

[0002] As fossil fuels continue to decline, solar energy, as a new renewable energy source, has become an important part of human energy use. Over the past decade, solar energy application technology has rapidly developed in countries around the world. Currently, the market size of tiling display devices is increasing year by year. LED (light-emitting diode) tiling display devices occupy the high-end tiling display market due to the small tiling seams between adjacent LED display panels. LCD (liquid crystal display) tiling display devices occupy the mid- to low-end tiling display market due to the large tiling seams between adjacent LCD display panels. Therefore, it is necessary to reduce the tiling seams between the display areas of adjacent LCD display panels in the tiling display device of LCD display panels, or even to eliminate the tiling seams, so as to extend the tiling seams to the frameless area of large-sized LCD display panels and improve the product competitiveness of the tiling display device of LCD display panels. That is, with the advantages of price and small tiling seams, it is necessary to occupy the high-end market for tiling display devices of LED display panels, such as radio and television media and big data centers. Summary of the Invention

[0003] The working environment for solar panels is limited to outdoors. The problem is not wind, rain, or lightning, but dust that has accumulated over the years. Dust or other deposits on solar panels affect the panel's transmittance and hinder photoelectric efficiency, severely impacting the panel's ability to directly capture sunlight, reducing the panel's energy absorption and conversion efficiency, and lowering power generation efficiency. Currently, mixed tiling of large-size LCD display panels with Mini LEDs (submillimeter light-emitting diodes) is often used to eliminate the tiling seams between the display areas of adjacent LCD display panels.

[0004] Typically, solder paste is printed onto an LCD panel, Mini LEDs are then printed onto the solder paste, and then reflow soldering is performed to bond the LCD panel and Mini LED. Reflow soldering requires simultaneous reflow soldering with the LCD panel, since localized heating is not possible. While typical soldering temperatures exceed 180°C, the liquid crystal molecules in the LCD panel's liquid crystal layer will irreversibly decompose if exposed to temperatures above 120°C for more than two minutes, and the LCD panel's polarizer will fail if exposed to temperatures above 120°C for more than two minutes, ultimately affecting the display quality of the LCD panel. Furthermore, printing solder paste on large-sized LCD panels requires a larger metal mask. The larger the metal mask, the more it bends under its own weight, making it difficult to control the amount of solder paste. This can lead to misalignment of the printed solder paste and resulting in ghosting (NG) in the printed solder paste.

[0005] The object of the present invention is to provide a display device manufacturing method, a display device, and a tiling display device that can solve the problem that the high temperature of reflow soldering present in the existing process of bonding Mini LEDs to an LCD display panel causes damage to the liquid crystal layer and polarizer of the LCD display panel, affecting the display effect of the LCD display panel.

[0006] In order to solve the above problem, according to the present invention, there is provided a method for manufacturing a display device, comprising the steps of: providing an LCD display panel including a display area and a frame area; forming a plurality of solder pad units spaced apart from one another on the frame region of the LCD display panel; forming a plurality of conductive units at intervals on one side of the solder pad unit away from the LCD display panel, the conductive units being made of an anisotropic conductive film or a solder paste, and electrically connected to the solder pad unit in correspondence with the solder pad unit; and forming a plurality of Mini LEDs spaced apart from one another on one side of the conductive unit away from the LCD display panel so as to be electrically connected to the solder pad unit.

[0007] Furthermore, the step of forming a plurality of conductive units spaced apart from one another on one side of the solder pad unit away from the LCD display panel includes: The method includes adhering an anisotropic conductive adhesive film to one side of the solder pad unit that is spaced apart from the LCD display panel, the anisotropic conductive adhesive film also covering the LCD display panel between adjacent solder pad units.

[0008] Furthermore, the step of forming a plurality of conductive units spaced apart from one another on one side of the solder pad unit away from the LCD display panel includes: The method further includes melting the anisotropic conductive adhesive film corresponding to the solder pad units by a heat pressing process to form a plurality of the conductive units electrically connected to the solder pad units.

[0009] Furthermore, the step of forming a plurality of conductive units spaced apart from one another on one side of the solder pad unit away from the LCD display panel includes: The method further includes forming a plurality of insulating units in which the anisotropic conductive adhesive film not corresponding to the solder pad units crosses the conductive units.

[0010] Furthermore, the step of forming a plurality of conductive units spaced apart from one another on one side of the solder pad unit away from the LCD display panel includes: Printing a solder paste corresponding to the solder pad unit on one side of the solder pad unit that is spaced apart from the LCD display panel by an inkjet printing process.

[0011] Furthermore, the step of forming a plurality of conductive units spaced apart from one another on one side of the solder pad unit away from the LCD display panel includes: The method further includes melting the solder paste between the solder pad units and the Mini LEDs through a laser heating process to form a plurality of the conductive units electrically connected to the corresponding solder pad units.

[0012] In order to solve the above problem, according to the present invention, there is provided a display device, an LCD display panel including a display area and a frame area; a plurality of solder pad units provided at intervals in the frame region of the LCD display panel; a plurality of conductive units provided at intervals from one another on one side of the solder pad unit spaced apart from the LCD display panel so as to be electrically connected to the solder pad units in correspondence therewith; a plurality of Mini LEDs located in the frame region and spaced apart from one another on one side of the conductive unit away from the LCD display panel so as to be electrically connected to the solder pad unit; The conductive unit may be made of an anisotropic conductive film or a solder paste.

[0013] Furthermore, the material of the conductive unit is an anisotropic conductive film, The display device further includes a plurality of insulating units disposed across the conductive units.

[0014] Furthermore, the thickness of the conductive unit ranges from 30 μm to 60 μm.

[0015] To solve the above problem, according to the present invention, there is provided a tiling display device comprising a plurality of display devices according to the present invention tiled with one another. [Effects of the Invention]

[0016] According to the display device of the present invention, by manufacturing multiple Mini LEDs in the frame area of the LCD display panel, the frame area of the LCD display panel that is not normally used for light emission can be displayed using Mini LEDs, thereby improving the screen occupancy ratio of the display device and ultimately eliminating the tiling seam between the display areas of two adjacent LCD display panels in the tiling display device, thereby improving the product competitiveness of the tiling display device.

[0017] According to the present invention, an anisotropic conductive adhesive film is attached to a solder pad unit, and then a Mini LED is manufactured on the anisotropic conductive adhesive film. Then, the anisotropic conductive adhesive film corresponding to the solder pad unit is melted by a heat pressing process to form a plurality of conductive units spaced apart from each other. Since the heat pressing process can heat locally, there is no need to heat the entire LCD display panel, thus avoiding the occurrence of the solder paste ghost phenomenon caused by printing the solder paste in the prior art, and avoiding the phenomenon of affecting the display effect of the LCD display panel caused by the reflow soldering process in the prior art.

[0018] According to the present invention, solder paste is printed on a solder pad unit by an inkjet printing process, and then Mini LEDs are manufactured on the solder paste. Then, the solder paste between the solder pad unit and the Mini LED is melted by a laser heating process to form a plurality of conductive units spaced apart from each other. Since the laser heating process can heat locally, there is no need to heat the entire LCD display panel, thereby avoiding the occurrence of the solder paste ghost phenomenon caused by the printing of solder paste in the prior art and avoiding the phenomenon affecting the display effect of the LCD display panel caused by the reflow soldering process in the prior art. [Brief explanation of the drawings]

[0019] In order to more clearly describe the technical solutions in the embodiments of the present application, the following briefly describes the drawings that need to be used in the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application, and those skilled in the art can obtain other drawings based on these drawings without paying creative labor.

[0020] [Figure 1] 1 is a schematic plan view showing a tiling display device of the present invention. [Figure 2] 1 is a schematic diagram illustrating the structure of a display device according to a first embodiment. [Figure 3] 3A to 3C are diagrams illustrating manufacturing steps of the display device of Example 1. [Figure 4] 10 is a schematic diagram showing a structure for manufacturing a solder pad unit on an LCD display panel in a frame region. FIG. [Figure 5] 1 is a schematic diagram showing a structure in which an anisotropic conductive adhesive film is attached to the solder pad unit of Example 1. FIG. [Figure 6] FIG. 1 is a schematic diagram showing the structure for manufacturing a Mini LED on the anisotropic conductive adhesive film of Example 1. [Figure 7]FIG. 1 is a schematic diagram showing the structure of forming a conductive unit by melting the anisotropic conductive adhesive film between the solder pad unit and the Mini LED by the heat pressing process of Example 1. [Figure 8] FIG. 10 is a schematic diagram showing the structure of a display device according to a second embodiment. [Figure 9] 10A to 10C are diagrams illustrating manufacturing steps of a display device according to a second embodiment. [Figure 10] FIG. 10 is a schematic diagram showing a structure for inkjet printing solder paste onto the solder pad unit of Example 2. [Figure 11] FIG. 1 is a schematic diagram showing the structure of manufacturing a Mini LED using the solder paste of Example 2. [Figure 12] FIG. 10 is a schematic diagram showing the structure of forming a conductive unit by melting the solder paste between the solder pad unit and the Mini LED using a laser heating process in Example 2. DETAILED DESCRIPTION OF THE INVENTION

[0021] In order to fully introduce the technical contents of the present invention to those skilled in the art and illustrate how the present invention can be implemented, thereby making the technical contents disclosed in the present invention clearer and making it easier for those skilled in the art to understand how to implement the present invention, preferred embodiments of the present application will be described in detail below with reference to the drawings in this specification. However, the present invention can be embodied in many different forms of embodiments, and the scope of protection of the present invention is not limited to the embodiments mentioned in this specification, and the description of the following embodiments does not limit the scope of the present invention.

[0022] Directional terms used in the present invention, such as "upper", "lower", "front", "rear", "left", "right", "inner", "outer", "side", etc., are only directions in the drawings, and the directional terms used in this specification are used for interpreting and explaining the present invention, and do not limit the scope of protection of the present invention.

[0023] In the drawings, parts with the same structure are designated by the same numeral symbols, and components with similar structures or functions are designated by similar numeral symbols. Furthermore, for the sake of convenience of understanding and explanation, the dimensions and thicknesses of each component shown in the drawings are arbitrarily indicated, and the present invention does not limit the dimensions and thicknesses of each component.

[0024] As shown in Figure 1, the present invention provides a tiling display device 100. The tiling display device 100 includes a plurality of display devices 200 that are tiled with one another. Example 1

[0025] As shown in FIG. 2, the display device 200 of this embodiment includes an LCD display panel 1, a plurality of solder pad units 2, a plurality of conductive units 3, a plurality of Mini LEDs 4, and a plurality of insulating units 5.

[0026] According to the display device of this embodiment, by manufacturing multiple Mini LEDs 4 in the frame area 102 of the LCD display panel 1, the frame area 102 of the LCD display panel 1, which is not normally illuminated, can be displayed using the Mini LEDs 4, thereby improving the screen occupancy ratio of the display device 200 and ultimately eliminating the tiling seam between the display areas 101 of two adjacent LCD display panels 1 of the tiling display device 100, thereby improving the product competitiveness of the tiling display device 100.

[0027] As shown in FIG. 2, the LCD display panel 1 is divided into a display area 101 and a frame area 102.

[0028] Here, the LCD display panel 1 includes an array substrate 11 , a color film substrate 12 , a liquid crystal layer 13 , a first polarizer 14 , a second polarizer 15 and a frame adhesive 16 .

[0029] Here, the array substrate 11 is disposed in a display area 101 and a frame area 102. The array substrate 11 includes a film layer structure including a first substrate, a thin film transistor layer, a first electrode, and the like.

[0030] Here, the color film substrate 12 is disposed opposite the array substrate 11 and is disposed in the display area 101 and the frame area 102. The color film substrate 12 includes a film layer structure including a second substrate, a color filter, a black matrix, a second electrode, and the like.

[0031] Here, the liquid crystal layer 13 is provided between the array substrate 11 and the color film substrate 12 so as to be located in the display area 101 .

[0032] Here, the first polarizer 14 is provided on one side of the array substrate 11, spaced apart from the color film substrate 12, so as to be located in the display area 101 and the frame area 102. The first polarizer 14 has a structure including two layers of TAC (triacetate cellulose) and PVA (polyvinyl alcohol) located between the two TAC layers. Here, it is the PVA layer that performs the polarizing function, but PVA is very susceptible to hydrolysis. Therefore, in order to protect the physical properties of the polarizing film, it is necessary to compound a thin film of TAC, which has high light transmittance, good water resistance, and a certain mechanical strength, on both sides of the PVA for protection.

[0033] Here, the second polarizer 15 is provided on one side of the color film substrate 12, spaced apart from the array substrate 11, so as to be located in the display area 101. The second polarizer 15 has a structure including two layers of TAC (triacetate cellulose) and PVA (polyvinyl alcohol) located between the two TAC layers. Here, it is the PVA layer that performs the polarizing function, but PVA is extremely susceptible to hydrolysis. Therefore, to protect the physical properties of the polarizing film, it is necessary to compound a thin film of TAC, which has high light transmittance, good water resistance, and a certain mechanical strength, on both sides of the PVA for protection.

[0034] Here, a frame adhesive 16 is provided between the array substrate 11 and the color film substrate 12 so as to surround the liquid crystal layer 13 and to be located in the frame region 102 .

[0035] Here, the plurality of solder pad units 2 are provided at intervals from one another in the frame region 102 of the LCD display panel 1. In this embodiment, the solder pad units 2 are provided at intervals from one another on one side of the color film substrate 12 that is spaced apart from the array substrate 11.

[0036] Here, a plurality of conductive units 3 are provided at intervals from one another on one side of the solder pad unit 2, which is spaced apart from the LCD display panel 1. In this embodiment, the conductive units 3 are provided at intervals from one another on one side of the solder pad unit 2, which is spaced apart from the color film substrate 12. The conductive units 3 are electrically connected to the corresponding solder pad units 2. In this embodiment, the material of the conductive units 3 is an anisotropic conductive film (ACF). The thickness of the conductive units 3 ranges from 30 μm to 60 μm. This allows for good electrical connection between the solder pad units 2 and the Mini LEDs 4.

[0037] Here, the Mini LEDs 4 are spaced apart from one another on one side of the conductive unit 3 away from the LCD display panel 1. Each Mini LED 4 includes two connection terminals 41. The connection terminals 42 are electrically connected to the corresponding conductive unit 3.

[0038] Here, the insulating units 5 are provided so as to intersect with the conductive units 3. In this embodiment, the insulating units 5 are made of the same material as the conductive units 3.

[0039] As shown in Figures 3 and 4, according to this embodiment, there is further provided a method for manufacturing a display device of this embodiment, which includes step S1 of providing an LCD display panel 1 including a display area 101 and a frame area 102, and step S2 of forming a plurality of solder pad units 22 spaced apart from each other in the frame area 102 of the LCD display panel 1.

[0040] As shown in Figures 3 and 5, the manufacturing method of the display device of this embodiment further includes S3 of adhering an anisotropic conductive adhesive film 6 to one side of the solder pad unit 2 away from the LCD display panel 1, the anisotropic conductive adhesive film 6 also covering the LCD display panel 1 between adjacent solder pad units 2.

[0041] As shown in Figures 3 and 6, the manufacturing method of the display device of this embodiment further includes S4, which forms a plurality of Mini LEDs 4 spaced apart from each other on one side of the anisotropic conductive adhesive film 6 away from the LCD display panel 1, each of which corresponds to two adjacent solder pad units 2.

[0042] 3 and 7, the manufacturing method of the display device of this embodiment further includes S5, in which the anisotropic conductive adhesive film 6 corresponding to the solder pad units 2 is melted by a heat pressing process to form a plurality of conductive units 3 spaced apart from each other, and the anisotropic conductive adhesive film 6 not corresponding to the solder pad units 2 forms a plurality of insulating units 5 arranged crossing the conductive units 3. The conductive units 3 correspond to the solder pad units 2.

[0043] Specifically, the anisotropic conductive adhesive film 6 is heated by the mold 7 to melt the anisotropic conductive adhesive film 6, and the mold 7 presses the Mini LED 4 and the solder pad unit 2, thereby adhering the Mini LED 4 and the solder pad unit 2 together. After the anisotropic conductive adhesive film 6 corresponding to the solder pad unit 2 undergoes a heat pressing process, the insulating housing of the anisotropic conductive adhesive film 6 is crushed, the internal metal conductive particles are exposed, conductivity is achieved, and an electrical connection between the solder pad unit 2 and the Mini LED 4 is achieved. The anisotropic conductive adhesive film 6 that does not correspond to the solder pad unit 2 is not pressed, so the insulating housing of the anisotropic conductive adhesive film 6 is not crushed and cannot be conductive, and an insulating unit 5 is formed.

[0044] The heat pressing process can heat locally, and therefore does not require heating the entire LCD display panel 1, thereby avoiding the occurrence of solder paste ghosting caused by solder paste printing in the prior art, and avoiding damage to the liquid crystal layer 13, first polarizer 14 and second polarizer 15 of the LCD display panel 1 caused by the reflow soldering process in the prior art, and ultimately avoiding affecting the display effect of the LCD display panel 1. Example 2

[0045] As shown in FIG. 8, the display device 200 of this embodiment includes an LCD display panel 1, a plurality of solder pad units 2, a plurality of conductive units 3, and a plurality of Mini LEDs 4.

[0046] According to the display device of this embodiment, by manufacturing multiple Mini LEDs 4 in the frame area 102 of the LCD display panel 1, the frame area 102 of the LCD display panel 1, which is not normally illuminated, can be displayed using the Mini LEDs 4, thereby improving the screen occupancy ratio of the display device 200 and ultimately eliminating the tiling seam between the display areas 101 of two adjacent LCD display panels 1 of the tiling display device 100, thereby improving the product competitiveness of the tiling display device 100.

[0047] As shown in FIG. 8, the LCD display panel 1 is divided into a display area 101 and a frame area 102.

[0048] Here, the LCD display panel 1 includes an array substrate 11 , a color film substrate 12 , a liquid crystal layer 13 , a first polarizer 14 , a second polarizer 15 and a frame adhesive 16 .

[0049] Here, the array substrate 11 is disposed in a display area 101 and a frame area 102. The array substrate 11 includes a film layer structure including a first substrate, a thin film transistor layer, a first electrode, and the like.

[0050] Here, the color film substrate 12 is disposed opposite the array substrate 11 and is disposed in the display area 101 and the frame area 102. The color film substrate 12 includes a film layer structure including a second substrate, a color filter, a black matrix, a second electrode, and the like.

[0051] Here, the liquid crystal layer 13 is provided between the array substrate 11 and the color film substrate 12 so as to be located in the display area 101 .

[0052] Here, the first polarizer 14 is provided on one side of the array substrate 11, spaced apart from the color film substrate 12, so as to be located in the display area 101 and the frame area 102. The first polarizer 14 has a structure including two layers of TAC (triacetate cellulose) and PVA (polyvinyl alcohol) located between the two TAC layers. Here, it is the PVA layer that performs the polarizing function, but PVA is very susceptible to hydrolysis. Therefore, in order to protect the physical properties of the polarizing film, it is necessary to compound a thin film of TAC, which has high light transmittance, good water resistance, and a certain mechanical strength, on both sides of the PVA for protection.

[0053] Here, the second polarizer 15 is provided on one side of the color film substrate 12, spaced apart from the array substrate 11, so as to be located in the display area 101. The second polarizer 15 has a structure including two layers of TAC (triacetate cellulose) and PVA (polyvinyl alcohol) located between the two TAC layers. Here, it is the PVA layer that performs the polarizing function, but PVA is extremely susceptible to hydrolysis. Therefore, to protect the physical properties of the polarizing film, it is necessary to compound a thin film of TAC, which has high light transmittance, good water resistance, and a certain mechanical strength, on both sides of the PVA for protection.

[0054] Here, a frame adhesive 16 is provided between the array substrate 11 and the color film substrate 12 so as to surround the liquid crystal layer 13 and to be located in the frame region 102 .

[0055] Here, the plurality of solder pad units 2 are provided at intervals from one another in the frame region 102 of the LCD display panel 1. In this embodiment, the solder pad units 2 are provided at intervals from one another on one side of the color film substrate 12 that is spaced apart from the array substrate 11.

[0056] Here, a plurality of conductive units 3 are provided at intervals from one another on one side of the solder pad unit 2, which is spaced apart from the LCD display panel 1. In this embodiment, the conductive units 3 are provided at intervals from one another on one side of the solder pad unit 2, which is spaced apart from the color film substrate 12. The conductive units 3 are electrically connected to the corresponding solder pad units 2. In this embodiment, the material of the conductive units 3 is solder paste. The thickness range of the conductive units 3 is 30 μm to 60 μm. This allows for good electrical connection between the solder pad units 2 and the Mini LEDs 4.

[0057] Here, the Mini LEDs 4 are spaced apart from one another on one side of the conductive unit 3 away from the LCD display panel 1. Each Mini LED 4 includes two connection terminals 41. The connection terminals 42 are electrically connected to the corresponding conductive unit 3.

[0058] As shown in Figures 4 and 9, according to this embodiment, there is further provided a method for manufacturing a display device of this embodiment, which includes step S1 of providing an LCD display panel 1 including a display area 101 and a frame area 102, and step S2 of forming a plurality of solder pad units 22 spaced apart from each other in the frame area 102 of the LCD display panel 1.

[0059] As shown in Figures 9 and 10, the manufacturing method of the display device of this embodiment further includes S3, which prints solder paste 8 corresponding to the solder pad unit 2 on one side of the solder pad unit 2 away from the LCD display panel 1 by an inkjet printing process.

[0060] As shown in Figures 9 and 11, the manufacturing method for the display device of this embodiment further includes S4, which forms a plurality of Mini LEDs 4 spaced apart from each other on one side of the solder paste 8 away from the LCD display panel 1, each of which corresponds to two adjacent solder pad units 2.

[0061] As shown in Figures 9 and 12, the manufacturing method of the display device of this embodiment further includes S5, which uses a laser heating process to melt the solder paste 8 between the solder pad unit 2 and the Mini LED 4 to form multiple conductive units 3 spaced apart from each other.

[0062] The laser heating process can heat locally, thus eliminating the need to heat the entire LCD display panel, thereby avoiding the occurrence of solder paste ghosting caused by solder paste printing in the prior art, and avoiding damage to the liquid crystal layer 13, first polarizer 14 and second polarizer 15 of the LCD display panel 1 caused by the reflow soldering process in the prior art, ultimately avoiding any impact on the display effect of the LCD display panel 1.

[0063] The display device manufacturing method, the display device, and the tiling display device according to the present application have been described in detail above. Although the present application has described the principles and embodiments in detail using specific examples, the explanation of the above examples is only used to facilitate understanding of the present application. At the same time, those skilled in the art will recognize that there are changes in the specific embodiments and application scope based on the concept of the present application, and therefore the contents of this application should not be construed as limitations of the present application. [Explanation of symbols]

[0064] 100, tiling display device 200, display device 1, LCD display panel 2, solder pad unit 3, conductive unit 4, Mini LED 5, insulating unit 6, anisotropic conductive adhesive film 7, mold 8, solder paste 101, display area 102, frame area 11, array substrate 12, color film substrate 13, liquid crystal layer 14, first polarizer 15, second polarizer 16, frame adhesive.

Claims

1. A method for manufacturing a display device, comprising: providing an LCD display panel including a display area and a frame area; forming a plurality of solder pad units spaced apart from one another on the frame region of the LCD display panel; Affixing an anisotropic conductive adhesive film located in the frame region of the LCD display panel to one side of the solder pad unit that is spaced from the LCD display panel; forming a plurality of Mini LEDs spaced apart from one another on one side of the anisotropic conductive adhesive film away from the LCD display panel, the Mini LEDs being located in the frame region of the LCD display panel; and melting the anisotropic conductive adhesive film corresponding to the solder pad units by a heat pressing process that locally heats the frame region of the LCD display panel to form a plurality of conductive units that correspond to and are electrically connected with the solder pad units, and the Mini LEDs are electrically connected to the solder pad units through the conductive units. A method for manufacturing a display device.

2. In the step of adhering the anisotropic conductive adhesive film, the anisotropic conductive adhesive film also covers the LCD display panel between the adjacent solder pad units. The method for manufacturing the display device according to claim 1 .

3. The step of forming the conductive units further includes forming a plurality of insulating units in which the anisotropic conductive adhesive film not corresponding to the solder pad units crosses the conductive units. The method for manufacturing the display device according to claim 1 .

4. A method for manufacturing a display device, comprising: providing an LCD display panel including a display area and a frame area; forming a plurality of solder pad units spaced apart from one another on the frame region of the LCD display panel; printing solder paste on one side of the solder pad unit away from the LCD display panel by an inkjet printing process, the solder paste being located in the frame area of the LCD display panel corresponding to the solder pad unit; forming a plurality of mini LEDs spaced apart from one another on one side of the solder paste away from the LCD display panel, the mini LEDs being positioned in the frame region of the LCD display panel; melting the solder paste between the solder pad units and the Mini LEDs by a laser heating process that locally heats the frame region of the LCD display panel to form a plurality of conductive units that are electrically connected to the solder pad units, and the Mini LEDs are electrically connected to the solder pad units through the conductive units; A method for manufacturing a display device.

5. A display device, an LCD display panel including a display area and a frame area; a plurality of solder pad units provided at intervals in the frame region of the LCD display panel; a plurality of conductive units provided at intervals from one another on one side of the solder pad unit spaced apart from the LCD display panel so as to be electrically connected to the solder pad units in correspondence therewith, the conductive units being made of an anisotropic conductive film, and an insulating housing covering metal conductive particles therein is crushed to expose the metal conductive particles therein; a plurality of insulating units disposed so as to intersect with the conductive unit, the insulating units being made of an anisotropic conductive film, and the insulating housings covering the metal conductive particles inside the insulating units are not crushed; a plurality of mini LEDs located in the frame region and spaced apart from one another on one side of the conductive unit spaced apart from the LCD display panel so as to be electrically connected to the solder pad unit; Display device.

6. The thickness range of the conductive unit is 30 μm to 60 μm. The display device according to claim 5 .

7. A tiling display device comprising a plurality of display devices tiled with one another, The display device includes: an LCD display panel including a display area and a frame area; a plurality of solder pad units provided at intervals in the frame region of the LCD display panel; a plurality of conductive units provided at intervals from one another on one side of the solder pad unit spaced apart from the LCD display panel so as to be electrically connected to the solder pad units in correspondence therewith, the conductive units being made of an anisotropic conductive film, and an insulating housing covering metal conductive particles therein is crushed to expose the metal conductive particles therein; a plurality of insulating units disposed so as to intersect with the conductive unit, the insulating units being made of an anisotropic conductive film, and the insulating housings covering the metal conductive particles inside the insulating units are not crushed; a plurality of Mini LEDs located in the frame region and spaced apart from one another on one side of the conductive unit spaced apart from the LCD display panel so as to be electrically connected to the solder pad unit; the conductive unit is made of an anisotropic conductive film or a solder paste; Tiling display device.

8. The thickness range of the conductive unit is 30 μm to 60 μm. The tiling display device according to claim 7 .

Images