Support device, inspection system, and control method for support device

Abstract

To provide an inspection system capable of flexibly controlling the temperature of a support portion that supports a substrate W to be inspected.SOLUTION: A support device includes: a support portion that supports an object to be inspected and has therein a channel through which a first temperature control medium flows from an inlet to an outlet; a mixing portion that discharges a third temperature control medium obtained by mixing the first temperature control medium flowing out from the outlet and a second temperature control medium supplied from the outside at a set ratio; a medium transfer portion that sends the third temperature control medium to the inlet as the first temperature control medium; and a heating portion that heats the first temperature control medium or the third temperature control medium.SELECTED DRAWING: Figure 7

Description

[Technical Field]

[0001] The present disclosure relates to a support device, an inspection system, and a method for controlling the support device. [Background technology]

[0002] For example, Patent Document 1 discloses an inspection system that includes a plurality of inspection chambers that house inspection units that perform electrical inspections of an object to be inspected on a stage. Patent Document 1 discloses that the inspection system includes a coolant supply unit that supplies a coolant to the stage, and a plurality of coolant pipes that extend from the coolant supply unit to the corresponding inspection chambers. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2019-029627 Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure provides an inspection system that is capable of flexibly controlling the temperature of a support that supports a substrate to be inspected. [Means for solving the problem]

[0005] According to one aspect of the present disclosure, a support device is provided that includes: a support section that supports an object to be inspected and has an internal flow path through which a first temperature-controlling medium flows from an inlet to an outlet; a mixing section that discharges a third temperature-controlling medium that is a mixture of the first temperature-controlling medium flowing out of the outlet and a second temperature-controlling medium supplied from the outside in a set ratio; a medium transport section that sends the third temperature-controlling medium to the inlet as the first temperature-controlling medium; and a heating section that heats the first temperature-controlling medium or the third temperature-controlling medium. [Effects of the Invention]

[0006] The present disclosure provides an inspection system that is capable of flexibly controlling the temperature of a support that supports a substrate to be inspected. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is a top cross-sectional view showing a schematic configuration of an inspection system according to this embodiment. [Figure 2] FIG. 2 is a front vertical cross-sectional view showing a schematic configuration of the inspection system according to this embodiment. [Figure 3] FIG. 3 is a front vertical cross-sectional view showing the configuration of the inspection area of the inspection system according to this embodiment. [Figure 4] FIG. 4 is a partially enlarged view showing details of the tester of the inspection system according to this embodiment. [Figure 5] FIG. 5 is a cross-sectional view showing details of the chuck top of the inspection system according to this embodiment. [Figure 6] FIG. 6 is a diagram showing an outline of a support device of the inspection system according to the first embodiment. [Figure 7] FIG. 7 is a diagram illustrating the flow of the temperature control medium in the inspection system according to the first embodiment. [Figure 8] FIG. 8 is a diagram illustrating the flow of the temperature control medium in the inspection system according to the first embodiment. [Figure 9] FIG. 9 is a diagram showing an outline of a support device of an inspection system according to the second embodiment. [Figure 10] FIG. 10 is a diagram showing an outline of an inspection system according to the third embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0008] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In this specification and the drawings, substantially identical components are designated by the same reference numerals, and redundant description will be omitted.

[0009] <Overall configuration of the inspection system> Fig. 1 is a top cross-sectional view showing a schematic configuration of an inspection system 100 according to this embodiment. Fig. 2 is a front vertical cross-sectional view showing a schematic configuration of the inspection system 100 according to this embodiment.

[0010] An inspection system 100, which is an apparatus for inspecting electrical characteristics based on a set temperature set for each substrate W, which is an example of a substrate, includes a housing 110. The interior of the housing 110 is divided into a loading / unloading area 111, a transport area 112, and an inspection area 113.

[0011] The carry-in / out area 111 is an area for carrying in a substrate W before inspection into the inspection system 100 and carrying out a substrate W after inspection from the inspection system 100. It is also an area for carrying in a probe card 180, which will be described later, into the inspection system 100 and carrying out the same from the inspection system 100. The carry-in / out area 111 is provided with a port 120 for receiving a cassette C containing a plurality of substrates W and a loader 121 for accommodating the probe card 180, which will be described later. The carry-in / out area 111 is also provided with a control unit 122 for controlling each component of the inspection system 100.

[0012] The transfer area 112 is an area for transferring the substrate W and the like between the carry-in / out area 111 and the inspection area 113. A transfer device 130 that can move freely while holding the substrate W and the like is disposed in the transfer area 112. The transfer device 130 transfers the substrate W between a cassette C in a port 120 in the carry-in / out area 111 and an alignment unit 150 (described later) in the inspection area 113. The transfer device 130 also transfers a probe card 180 that requires maintenance among probe cards 180 fixed to a pogo frame 170 (described later) in the inspection area 113 to a loader 121 in the carry-in / out area 111. The transfer device 130 also transfers a new or maintained probe card 180 from the loader 121 to the pogo frame 170 in the inspection area 113.

[0013] The inspection area 113 is an area where the electrical characteristics of electronic devices formed on the substrate W are inspected. The inspection area 113 is provided with a plurality of testers 140 as inspection units. Specifically, as shown in FIG. 2, the inspection area 113 is divided into three vertical areas, and each divided area 113a is provided with a tester row consisting of four testers 140 arranged in the horizontal direction in FIG. 2. Each divided area 113a is also provided with one alignment unit 150 and one camera 160. The number and arrangement of the testers 140, alignment units 150, and cameras 160 can be selected arbitrarily. The testers 140 transmit and receive electrical signals for electrical characteristic inspection to and from the substrate W.

[0014] The alignment unit 150 includes a chuck top 151 and an aligner 153. Details of the chuck top 151 and the aligner 153 will be described later. The alignment unit 150 places a substrate W thereon. The alignment unit 150 also aligns the placed substrate W with a probe card 180 disposed below the tester 140. The alignment unit 150 is provided so as to be movable within the area below the tester 140 to perform alignment.

[0015] The camera 160 captures an image of the positional relationship between the probe card 180 disposed below the tester 140 and the substrate W placed on the alignment unit 150. The camera 160 is arranged to move horizontally and be positioned in front of each tester 140 in the divided region 113a in which the camera 160 is provided.

[0016] In the inspection system 100 of this embodiment, while the transport device 130 transports a substrate W toward one of the multiple testers 140 in the divided area 113a, other testers 140 in the divided area 113a can inspect the electrical characteristics of electronic devices formed on other substrates W.

[0017] Next, the tester 140, the alignment unit 150, and their related configurations will be described in detail with reference to Figures 3 and 4. Figure 3 is a front vertical cross-sectional view showing the configuration of the inspection area 113 of the inspection system 100 according to this embodiment. Figure 4 is a partially enlarged view showing the details of the tester 140 of the inspection system 100 according to this embodiment.

[0018] 3 and 4, the tester 140 has a tester motherboard 141 that is horizontally disposed on the bottom of the tester 140. A plurality of test circuit boards (not shown) are mounted in an upright position on the tester motherboard 141. In addition, a plurality of electrodes are provided on the bottom surface of the tester motherboard 141.

[0019] Furthermore, below the tester 140, one pogo frame 170 and one probe card 180 are provided in this order from above.

[0020] A plurality of support walls 110b are provided around the tester 140, extending vertically downward from the upper wall 110a of each divided region 113a. Pogo frames 170 are attached to the lower parts of the support walls 110b that face each other. Each tester 140 is supported by the support walls 110b that face each other and the pogo frames 170 attached between the support walls 110b.

[0021] The pogo frame 170 supports the probe card 180 and electrically connects the probe card 180 to the tester 140. The pogo frame 170 is disposed so as to be located between the tester 140 and the probe card 180. The pogo frame 170 has pogo pins that electrically connect the tester 140 and the probe card 180. Specifically, the pogo frame 170 has a pogo block 172 that holds a large number of pogo pins, and a frame main body 173 that has mounting holes 173a into which the pogo block 172 is inserted to mount the pogo pins.

[0022] A probe card 180 is vacuum-attached to the underside of the pogo frame 170 while being aligned in a predetermined position.

[0023] Bellows 174 extending vertically downward are attached to the underside of the pogo frame 170 so as to surround the attachment position of the probe card 180. The bellows 174 form an airtight space that contains the probe card 180 and the substrate W. In the airtight space, the substrate W on the chuck top 151 (described later) is in contact with probes 182 (described later) of the probe card 180.

[0024] A vacuum mechanism (not shown) applies a vacuum suction force to the pogo frame 170 and the probe card 180. The vacuum suction force causes the lower end of each pogo pin of the pogo frame 170 to contact a corresponding electrode pad on the upper surface of a card body 181 (described later) of the probe card 180. The vacuum suction force also causes the upper end of each pogo pin of the pogo frame 170 to contact a corresponding electrode on the lower surface of the tester motherboard 141.

[0025] The probe card 180 has a disk-shaped card body 181, a plurality of electrode pads (not shown) provided on the upper surface of the card body 181, and probes 182, which are a plurality of needle-shaped terminals extending downward from the lower surface of the card body 181. The plurality of electrodes provided on the upper surface of the card body 181 are electrically connected to the corresponding probes 182. During testing, the probes 182 each come into contact with an electrode pad or a solder bump on an electronic device formed on the substrate W. Therefore, during electrical characteristic testing, electrical signals related to the test are transmitted and received between the tester motherboard 141 and the electronic device on the substrate W via the pogo pins, the electrodes provided on the upper surface of the card body 181, and the probes 182.

[0026] The alignment unit 150 includes a chuck top 151 and an aligner 153. The chuck top 151 is detachably mounted on the aligner 153. A substrate W is mounted on the chuck top 151. The chuck top 151 also adsorbs the mounted substrate W. The chuck top 151 is provided with a temperature adjustment mechanism 152. The temperature adjustment mechanism 152 adjusts the temperature of the chuck top 151 during an electrical characteristic test. By adjusting the temperature using the temperature adjustment mechanism 152, the temperature of the substrate W mounted on the chuck top 151 during an electrical characteristic test can be adjusted to, for example, −30° C. to +130° C.

[0027] The aligner 153 supports the chuck top 151 and moves the chuck top 151 in the up-down direction in FIGS. 3 and 4, the front-rear direction on the paper, and the left-right direction.

[0028] The alignment unit 150 aligns the substrate W on the chuck top 151 and the probes 182 of the probe card 180 so that they are in contact with each other. After this alignment, an airtight space is formed containing the probe card 180 and the substrate W, and the airtight space is evacuated by a vacuum mechanism (not shown). At this time, the aligner 153 is moved downward, so that the chuck top 151 is separated from the aligner 153 and is attracted to the pogo frame 170.

[0029] <Chuck top> Next, the chuck top 151 of the inspection system 100 according to this embodiment will be described. Fig. 5 is a cross-sectional view showing the details of the chuck top 151 of the inspection system 100 according to this embodiment. Fig. 5 is a view showing a state in which the substrate W is placed on the chuck top 151.

[0030] The chuck top 151 of the inspection system 100 according to this embodiment includes a top plate 155 and a cooling jacket 156 .

[0031] The top plate 155 is a member on which the substrate W is placed. The top plate 155 is provided with a mechanism for adsorbing the substrate W, such as an electrostatic chuck.

[0032] The cooling jacket 156 is a component for adjusting the temperature of the substrate W. A medium flow path 158 is formed inside the cooling jacket 156, through which a temperature control medium HM flows. The medium flow path 158 is formed, for example, in a spiral shape when viewed from above. The shape of the medium flow path 158 when viewed from above is not limited to a spiral shape and may be, for example, a zigzag shape. The temperature control medium HM introduced into the medium flow path 158 is connected to a coolant supply unit 2 (described later) through an inlet / outlet pipe 158a provided outside the cooling jacket 156. A separate heater may be provided as a component for adjusting the temperature. The temperature control medium HM is a medium for adjusting the temperature of the substrate W. The temperature control medium HM is, for example, water, brine, or the like. The temperature control medium HM may be used to cool the substrate W or to heat the substrate W.

[0033] First Embodiment <Inspection system S1> An inspection system S1, which is an example of an inspection system according to the first embodiment, will be described. The inspection system S1 according to the first embodiment will be described by extracting key points of the inspection system S1 according to the first embodiment from the configuration of the inspection system 100 described above. Fig. 6 is a diagram for explaining an outline of the inspection system S1, which is an example of an inspection system according to the first embodiment.

[0034] The inspection system S1 performs electrical inspection of the substrate W in a temperature-controlled state. The inspection system S1 includes an inspection device 1 and a coolant supply unit 2. In the inspection system S1, the number of cells to be inspected, i.e., the number of support units 10, and the number of coolant supply units 2 have a one-to-one relationship.

[0035] The inspection device 1 performs an electrical inspection of the substrate W. The coolant supply unit 2 supplies the inspection device 1 with a temperature-adjusted temperature-control medium.

[0036] [Inspection device 1] The inspection apparatus 1 includes a supporting device 3, an inspection unit 70, and a control unit 80. The supporting device 3 places and supports a substrate W to be inspected. The inspection unit 70 performs an electrical inspection of the substrate W supported by the supporting device 3.

[0037] A temperature control medium is supplied to and recovered from the inspection device 1 by the refrigerant supply unit 2. The refrigerant supply unit 2 connects pipe Pa1 to joint F1 and is connected to pipe P1. The refrigerant supply unit 2 supplies the temperature control medium to the inspection device 1 via pipe Pa1. Pipe P1 is connected to pipe P2 via stop valve SV1. The refrigerant supply unit 2 also connects pipe Pa2 to joint F2 and is connected to pipe P12. The refrigerant supply unit 2 recovers the temperature control medium from the inspection device 1 via pipe Pa2. Pipe P12 is connected to pipe P11 via stop valve SV2. The stop valves SV1 and SV2 are controlled by the control unit 80.

[0038] Each element will be explained.

[0039] (Support device 3) The supporting device 3 holds the substrate W to be inspected while adjusting the temperature of the substrate W to a desired temperature. The supporting device 3 includes a supporting unit 10, a mixing unit 20, a medium transporting unit 30, and a heating unit 40.

[0040] (Support part 10) The support part 10 places and holds the substrate W to be inspected. The support part 10 is, for example, a chuck top 151 in the inspection system 100. The support part 10 has a flow path 11 (medium flow path) therein. The support part 10 has an inlet 12a through which a temperature control medium flows in and an outlet 12b through which the temperature control medium flows out. The temperature control medium flows into the flow path 11 from the inlet 12a and flows out from the outlet 12b.

[0041] A temperature control medium flows inside the support 10 and exchanges heat with the substrate W, thereby controlling the temperature of the substrate W to a desired temperature.

[0042] The support part 10 also includes a temperature measuring element 15. The temperature measuring element 15 measures the temperature of the support part 10. The measurement result of the temperature measuring element 15 is input to the control part 80. The control part 80 controls the temperature measured by the temperature measuring element 15 so that it becomes a desired temperature.

[0043] (Mixing section 20) The mixing section 20 mixes the temperature-control medium supplied from outside the inspection device 1, specifically from the refrigerant supply section 2, with the temperature-control medium flowing out from the outlet 12b of the support section 10, and discharges the mixed temperature-control medium into the medium transfer section 30.

[0044] The mixing section 20 includes a three-way valve 21, and branch pipes B1, B2, and B3. Each of the branch pipes B1, B2, and B3 branches in three directions.

[0045] The three-way valve 21 has an inlet 21a through which the temperature-control medium supplied from the refrigerant supply unit 2 flows in, a first outlet 21b through which the temperature-control medium flows out into a path that is recovered in the refrigerant supply unit 2, and a second outlet 21c through which the temperature-control medium flows out into a path that is passed to the support unit 10.

[0046] A pipe P2, through which the temperature control medium supplied from the refrigerant supply unit 2 flows, is connected to an inlet 21a of the three-way valve 21. A pipe P10, which connects to a branch pipe B3, is connected to a first outlet 21b of the three-way valve 21. A pipe P3, which connects to a branch pipe B1, is connected to a second outlet 21c of the three-way valve 21. A check valve 22 is provided in the pipe P3 to prevent the temperature control medium from flowing from the three-way valve 21 to the branch pipe B1 and from flowing from the branch pipe B1 to the three-way valve 21.

[0047] As described above, branch pipe B1 is connected to pipe P3, pipe P4 which is a path for flowing the temperature control medium to support part 10, and pipe P8 which is connected to branch pipe B2. Pipe P8 is provided with check valve 23 to prevent the temperature control medium from flowing from branch pipe B2 to branch pipe B1 and from branch pipe B1 to branch pipe B2.

[0048] Branch pipe B2 is connected to pipe P7 through which the temperature control medium flows from support unit 10, pipe P8 as described above, and pipe P9 connected to branch pipe B3. Branch pipe B3 is connected to pipe P9, pipe P10, and pipe P11 through which the temperature control medium flows to refrigerant supply unit 2 as described above.

[0049] The three-way valve 21 can adjust its opening to control the distribution ratio between the amount of temperature control medium flowing from the inlet 21a to the first outlet 21b and the amount of temperature control medium flowing from the inlet 21a to the second outlet 21c. The three-way valve 21 is connected to a control unit 80. The control unit 80 controls the opening of the three-way valve 21 to a desired opening. By the control unit 80 controlling the opening of the three-way valve 21, the ratio between the amount of temperature control medium flowing from the inlet 21a to the first outlet 21b and the amount of temperature control medium flowing from the inlet 21a to the second outlet 21c can be controlled to a desired ratio.

[0050] (Media transfer section 30) The medium transfer unit 30 causes the temperature control medium flowing in from the pipe P5 to flow into the pipe P6. The medium transfer unit 30 is, for example, a pump. The medium transfer unit 30 causes the temperature control medium flowing out from the mixer 20 to flow into the inlet 12a of the support unit 10. The type of pump used in the medium transfer unit 30 is not particularly limited, and may be, for example, an axial flow pump.

[0051] The medium transfer unit 30 is connected to the control unit 80. The control unit 80 controls the flow rate of the temperature control medium flowed by the medium transfer unit 30. If the medium transfer unit 30 is a rotary pump, the control unit 80 controls the rotation speed of the pump. Note that the flow rate may be controlled by providing a separate valve.

[0052] (Heating section 40) The heating unit 40 heats the temperature control medium. The heating unit 40 is, for example, a hot wire heater. The heating unit 40 is connected to the control unit 80. The control unit 80 controls the amount of heat generated by the heating unit 40. For example, if the heating unit 40 is a hot wire heater, the control unit 80 controls the amount of heat generated by the hot wire heater by controlling the power supplied to the hot wire heater.

[0053] (Inspection Department 70) The inspection unit 70 electrically inspects the substrate W. The inspection unit 70 is, for example, the tester 140 and the probe card 180 in the inspection system 100. The inspection unit 70 includes, for example, inspection probes. The inspection unit 70 performs an electrical inspection of the substrate W by bringing the probes into contact with the substrate W.

[0054] (control unit 80) The control unit 80 controls the inspection device 1. The control unit 80 is configured by a computer including a calculation unit and a storage unit. The control unit 80 controls each unit of the inspection device 1. The calculation unit includes, for example, a CPU (Central Processing Unit). The storage unit includes, for example, a RAM (Random Access Memory), a ROM (Read Only Memory), an HDD (Hard Disk Drive), an SSD (Solid State Drive), or a combination thereof.

[0055] The storage unit stores a program that includes steps (instructions) for executing operations required for the inspection process. The program includes, for example, steps configured to control the operations of the three-way valve 21 of the mixing unit 20, the medium transfer unit 30, and the heating unit 40 so as to adjust the temperature of the substrate W, more specifically, the temperature of the temperature measuring element 15, to a desired temperature. The program is stored in a storage medium, such as a hard disk, a compact disk, a magneto-optical disk, or a memory card, and is installed into a computer from the storage medium.

[0056] For example, the control unit 80 controls the opening degree of the three-way valve 21 so that the temperature of the temperature measuring element 15 of the support unit 10 becomes a desired temperature. By controlling the opening degree of the three-way valve 21, the control unit 80 controls the mixing ratio of the temperature control medium discharged from the support unit 10 and the temperature control medium supplied from the refrigerant supply unit 2. As described above, the control unit 80 executes the control method according to this embodiment.

[0057] [Refrigerant supply section 2] The coolant supply unit 2 supplies a temperature control medium at a predetermined temperature to the inspection device 1. The coolant supply unit 2 is, for example, a chiller. The temperature of the temperature control medium supplied by the coolant supply unit 2 is lower than the temperature of the temperature control medium flowing through the support unit 10.

[0058] The coolant supply unit 2 supplies the temperature control medium to the inspection device 1 by connecting the pipe Pa1 to the joint F1. The coolant supply unit 2 also recovers the temperature control medium from the inspection device 1 by connecting the pipe Pa2 to the joint F2.

[0059] <Flow of temperature control medium in inspection system S1> The flow of the temperature control medium in the inspection system S1 will now be described. Figures 7 and 8 are diagrams illustrating the flow of the temperature control medium in the inspection system S1 according to the first embodiment.

[0060] The inspection system S1 has two modes: a heating mode and a cooling mode. Each mode will be explained below.

[0061] (heating mode) The heating mode is a mode used, for example, when the substrate W does not generate heat and cooling is not necessary. The flow of the temperature control medium in the heating mode is shown in Figure 7. In the heating mode, the temperature control medium (hereinafter referred to as the first temperature control medium L1) flowing through the support part 10 is circulated by the medium transfer part 30. Also, in the heating mode, the temperature control medium (hereinafter referred to as the second temperature control medium L2) supplied from the coolant supply part 2 is returned entirely to the coolant supply part 2.

[0062] Specifically, the three-way valve 21 of the mixing unit 20 prevents the second temperature control medium L2 from flowing toward the support unit 10. Then, the three-way valve 21 of the mixing unit 20 returns all of the second temperature control medium L2 to the refrigerant supply unit 2. That is, the ratio of the second temperature control medium L2 flowing into the branch pipe B1 in the three-way valve 21 is set to zero.

[0063] The heating unit 40 heats the first temperature control medium L1 discharged from the mixing unit 20. The heated first temperature control medium L1 is sent to the supporting unit 10 by the medium transferring unit 30.

[0064] (Cooling mode) The cooling mode is a mode used when, for example, the substrate W generates heat during inspection and needs to be cooled. The flow of the temperature control medium in the cooling mode is shown in Figure 8. In the cooling mode, the mixer 20 mixes a portion of the first temperature control medium L1 (first temperature control medium L1a) flowing out from the supporter 10 with a portion of the second temperature control medium L2 (second temperature control medium L2a) supplied from the refrigerant supply unit 2, and discharges the mixed third temperature control medium L3 into the medium transfer unit 30.

[0065] The heating unit 40 heats the third temperature control medium L3 discharged from the mixing unit 20. The heated third temperature control medium L3 is sent by the medium transfer unit 30 to the support unit 10 as the first temperature control medium L1.

[0066] Specifically, the three-way valve 21 of the mixing section 20 causes the second temperature control medium L2a, which is a part of the second temperature control medium L2, to flow toward the support section 10. Meanwhile, the remaining second temperature control medium L2b, which does not flow toward the support section 10, flows into the branch pipe B3. Furthermore, in the branch pipe B2, the first temperature control medium L1a, which is a part of the first temperature control medium L1, flows toward the branch pipe B1. Meanwhile, in the first temperature control medium L1, the first temperature control medium L1b, which does not flow from the branch pipe B2 to the branch pipe B1, flows toward the branch pipe B3. The amount of the first temperature control medium L1b is equal to the amount of the second temperature control medium L2a.

[0067] In the branch pipe B1, the first temperature control medium L1a and the second temperature control medium L2a are mixed. Then, the third temperature control medium L3, which is a mixture of the first temperature control medium L1a and the second temperature control medium L2a, flows toward the medium transfer unit 30. In the inspection device 1, the third temperature control medium L3 is heated in the heating unit 40 and sent from the medium transfer unit 30 to the support unit 10.

[0068] Meanwhile, in the branch pipe B3, the first temperature control medium L1b and the second temperature control medium L2b are mixed. Then, the temperature control medium L2r obtained by mixing the first temperature control medium L1b and the second temperature control medium L2b is recovered in the refrigerant supply unit 2.

[0069] Furthermore, when the temperature of the support part 10 is higher than the desired temperature (target temperature), the control part 80 controls the ratio so that the ratio of the second temperature adjustment medium L2a is higher.

[0070] In the above explanation, the heating mode and the cooling mode have been described separately, but the heating mode may be the case where, in the cooling mode, the third temperature control medium L3, in which the proportion of the second temperature control medium L2 flowing into the branch pipe B1 in the three-way valve 21 of the mixing section 20 is set to zero, is discharged from the mixing section 20. In that case, the third temperature control medium L3, in which the proportion of the second temperature control medium L2 flowing into the branch pipe B1 in the three-way valve 21 of the mixing section 20 is set to zero, is equal to the first temperature control medium L1.

[0071] <Actions and Effects> According to the inspection system S1 of the first embodiment, the temperature of the support part that supports the substrate to be inspected can be flexibly controlled.

[0072] According to the inspection system S1, by controlling the heating unit 40 and the three-way valve 21 to control the temperature of the substrate W, it is possible to control the temperature of the temperature control medium flowing through the support unit 10 when controlling the temperature of the support unit 10 that supports the substrate W to be inspected. In the coolant supply unit 2, which is a chiller, it is desirable to flow a constant flow rate to maintain the temperature of the temperature control medium constant. According to the inspection system S1, the flow rate of the temperature control medium supplied from the coolant supply unit 2 is constant regardless of the target temperature of the support unit 10, so it is possible to stabilize the temperature of the temperature control medium supplied from the coolant supply unit 2. Furthermore, according to the inspection system S1, the temperature control medium is heated by the heating unit 40, which is a heater, so the temperature of the temperature control medium can be controlled with a high response speed.

[0073] Furthermore, the inspection system S1 controls the medium transport unit 30 to control the temperature of the substrate W, thereby controlling the flow rate of the temperature control medium flowing through the support unit 10 when controlling the temperature of the support unit 10 that supports the substrate W to be inspected. The inspection system S1 controls the flow rate of the temperature control medium, thereby controlling the amount of heat transferred from the temperature control medium to the support unit 10 per unit time. Therefore, the inspection system S1 can control the temperature response speed of the support unit 10 per unit time.

[0074] For example, in general, the temperature of the support table that supports the substrate W to be inspected is controlled by maintaining a constant temperature of the temperature control medium supplied and controlling the flow rate of the temperature control medium. If the temperature of the temperature control medium is changed using a chiller, the response speed may be slow. Furthermore, if the flow rate of the chiller changes, the temperature of the temperature control medium may not be stable. According to the inspection system S1 of this embodiment, the temperature can be stably controlled while also taking the response speed into consideration.

[0075] Second Embodiment <Inspection system S2> In the inspection system S1 according to the first embodiment, the heating unit 40 is provided separately from the support unit 10, but the heating unit may be provided inside the support unit. The inspection system S2 according to the second embodiment includes an inspection device 1A equipped with a support device 3A instead of the inspection device 1.

[0076] The supporting device 3A includes a supporting section 10A instead of the supporting section 10 of the supporting device 3 according to the first embodiment. Moreover, the supporting device 3A includes a heating section 40A provided inside the supporting section 10A instead of the heating section 40 of the supporting device 3 according to the first embodiment.

[0077] An inspection system S2 will be described as an example of an inspection system according to the second embodiment. Fig. 9 is a diagram for explaining an outline of the inspection system S2 as an example of an inspection system according to the second embodiment.

[0078] (Support part 10A) The support part 10A supports and holds the substrate W to be inspected. The support part 10A has a flow path 11 therein. The support part 10A has an inlet 12a through which a temperature control medium flows in and an outlet 12b through which the temperature control medium flows out. The temperature control medium flows into the flow path 11 so that it flows in from the inlet 12a and flows out from the outlet 12b.

[0079] The support part 10A also has a heating part 40A therein. The heating part 40A heats the first temperature control medium L1. The heating part 40A heats the support part 10A and also heats the temperature control medium. The heating part 40A is, for example, a hot wire heater. The heating part 40A is connected to a control part 80. The control part 80 controls the amount of heat generated by the heating part 40A. The temperature control medium flows inside the support part 10A, and the temperature control medium is heated by the heating part 40A, and heat is exchanged between the substrate W and the temperature control medium, thereby controlling the temperature of the substrate W to a desired temperature.

[0080] <Actions and Effects> According to the inspection system S2 of the second embodiment, in addition to the effects and advantages of the inspection system S1 of the first embodiment, the scale of the system can be reduced by integrating the heating unit with the support unit.

[0081] In addition, in the inspection system S2 of the second embodiment, a heating unit is not provided outside the support unit 10, but a heating unit that heats the temperature-control medium may be provided outside the support unit 10 in addition to the heating unit 40A inside the support unit 10.

[0082] Third Embodiment <Inspection System S3> In the inspection system S1 according to the first embodiment, there is a one-to-one relationship between the support device 3 and the refrigerant supply unit 2, but it is also possible to provide multiple support devices 3 for one refrigerant supply unit 2. The inspection system S3 according to the third embodiment includes an inspection device 1B equipped with multiple support devices 3 instead of the inspection device 1. In other words, the inspection system S3 includes multiple support devices 3. The inspection system S3 is a so-called multi-cell test system. FIG. 10 is a diagram showing an outline of the inspection system S3 according to the third embodiment.

[0083] The inspection device 1B of the inspection system S3 according to the third embodiment includes a plurality of support devices 3 for one refrigerant supply unit 2. The temperature control medium supplied from the refrigerant supply unit 2 is branched by piping and supplied to each of the plurality of support devices 3. The temperature control medium discharged from each of the plurality of support devices 3 is joined through the branched piping and collected in the refrigerant supply unit 2.

[0084] In the inspection system S3, the support device 3 may be replaced with the support device 3A provided in the inspection system S2 according to the second embodiment.

[0085] <Actions and Effects> In addition to the effects and advantages of the inspection system S1 according to the first embodiment, the inspection system S3 according to the third embodiment can individually control the temperature of each of the multiple support devices 3. That is, the inspection system S3 allows inspection to be performed under different temperature conditions in each of the multiple inspection devices.

[0086] For example, in a multi-cell test system equipped with multiple testers, such as the inspection system 100, if a temperature-controlled medium is supplied from a single refrigerant supply unit to multiple inspection devices, all of the multiple inspection devices can only perform inspections under the same temperature conditions. According to the inspection system S3 of this embodiment, each of the multiple support devices 3 is equipped with a mixing unit 20, a medium transfer unit 30, and a heating unit 40, so that the temperature can be controlled individually for each of the multiple testers. Therefore, the inspection system S3 allows inspections to be performed under different temperature conditions for each of the multiple testers.

[0087] Furthermore, according to the inspection system S3, the total flow rate of the temperature-controlling medium supplied from the refrigerant supply unit 2 to each inspection device 1B is constant regardless of the target temperature of the support unit 10 in each support device 3, and therefore the temperature of the temperature-controlling medium supplied from the refrigerant supply unit 2 can be stabilized.

[0088] The support device, inspection system, and support device control method according to the present disclosure should be considered to be illustrative in all respects and not restrictive. The above-described embodiments can be modified and improved in various ways without departing from the scope and spirit of the appended claims. The matters described in the above-described embodiments can be configured in other ways as long as they are not inconsistent, and can be combined as long as they are not inconsistent. [Explanation of symbols]

[0089] 1, 1A, 1B Inspection equipment 2 Refrigerant supply section 3, 3A support device 10, 10A support part 11 Flow path 12a Inlet 12b Outlet 15 Temperature measurement element 20 Mixing section 21 Three-way valve 30 Media transfer section 40, 40A heating section 70 Inspection Department 80 Control Unit W substrate

Claims

1. a support part that supports the test object and has a flow path therein through which the first temperature control medium flows from an inlet to an outlet; a mixing section that discharges a third temperature control medium obtained by mixing the first temperature control medium flowing out of the outlet with a second temperature control medium supplied from the outside at a set ratio; a medium transfer unit that sends the third temperature control medium to the inlet as the first temperature control medium; a heating unit that heats the first temperature control medium or the third temperature control medium; Equipped with The mixing unit includes a three-way valve, The three-way valve distributes the temperature control medium supplied from the outside to a path for discharging the medium to the outside and a path for sending the medium to the medium transfer unit. Support device.

2. Further comprising a control unit, The control unit controls the ratio in accordance with the temperature of the support unit. The support device of claim 1 .

3. the temperature of the second temperature control medium is lower than the temperature of the first temperature control medium; the control unit controls the ratio so that the ratio of the second temperature control medium is increased when the temperature of the support unit is higher than a target temperature. The support device of claim 2 .

4. The control unit controls the proportion of the second temperature control medium to zero. The support device of claim 3 .

5. The control unit controls the heat generation amount of the heating unit and the flow rate of the medium transport unit. A supporting device according to any one of claims 2 to 4.

6. The control unit controls the opening degree of the three-way valve. A support device according to any one of claims 2 to 5.

7. The support part includes the heating part therein. A support device according to any one of claims 1 to 6.

8. a refrigerant supply unit; A plurality of the support devices according to any one of claims 1 to 7 are provided, the refrigerant supply unit supplies the second temperature control medium to each of the plurality of supporting devices. Inspection system.

9. a support part that supports the test object and has a flow path therein through which the first temperature control medium flows from an inlet to an outlet; a heating unit that heats the first temperature control medium; a mixing section that discharges a third temperature control medium obtained by mixing the first temperature control medium flowing out of the outlet with a second temperature control medium supplied from the outside at a set ratio; a medium transfer unit that sends the third temperature control medium to the inlet as the first temperature control medium; The mixing unit includes a three-way valve, and the three-way valve distributes a temperature control medium supplied from the outside to a path for discharging the medium to the outside and a path for sending the medium to the medium transfer unit. The ratio is controlled by controlling the opening degree of the three-way valve in accordance with the temperature of the support portion. Control method.

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