Temperature control system and temperature control method

Abstract

To control temperature of a probe to be within its specified operating temperature range by controlling the temperature of the probe.SOLUTION: A thermal management system 10 for a test-and-measurement probe includes a thermally insulated barrier wall 102 and a fluid inlet conduit 103. The barrier wall 102 is configured to permit a second portion 110 of the probe head 101 to extend from the barrier wall 102 to the outside while enclosing a first portion 109 of a probe head 101 of the probe within an interior cavity 107 of the barrier wall 102. The barrier wall 102 further includes a fluid outlet passageway 113 configured to permit heat-transfer fluid 114 to pass from a probe-head end 115 of the interior cavity 107, through the interior cavity 107 of the barrier wall 102, and to be discharged to the outside of the barrier wall 102 through an access portion 106 of the barrier wall 102. The fluid inlet conduit 103 is configured to enter the barrier wall 102 through the access portion 106 of the barrier wall 102, extends through the interior cavity 107, and is configured to introduce the heat-transfer fluid 114 to the probe-head end 115 of the interior cavity 107.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to test measurement probes, and more particularly to systems and methods for thermal management of test measurement probes. [Background technology]

[0002] Users of test and measurement equipment, such as oscilloscopes, often use probes to connect devices under test (DUTs), such as circuit boards, to the inputs of the test and measurement equipment in order to visualize and measure the electrical signals occurring at the DUT. These users are typically engineers who design circuit boards for a wide variety of electronic devices. Consumers of electronic devices generally desire these devices to be as physically small as possible. Therefore, engineers are often tasked with packing a large number of electrical components into a small area on the circuit board. Furthermore, the electrical components themselves are generally designed to become physically smaller with each generation. Due to the small size and high density of electrical components on the DUT, engineers may have difficulty contacting the probes to the test points on the DUT.

[0003] Therefore, test measurement probes must be able to make physical and electrical contact with hard-to-reach DUT test points while simultaneously providing high bandwidth and good signal fidelity. DUT test points vary greatly in their placement and accessibility. Test points can be oriented at any angle within the DUT, from horizontal to vertical. Test points can also be obscured by electrical components. Modern high-speed signal buses, such as DDR2, DDR4, and PCIe Gen4, often use differential signals, and probes used to measure these signals must make electrical contact with two test points simultaneously. This can be even more challenging if the two test points are on different planes.

[0004] In some cases, probes are semi-permanently connected to the DUT test points. For example, a "solder" style probe may have wires from the probe soldered to the test points or attached to the test points with conductive epoxy, tape, or other means. This type of semi-permanent probe connection can provide a reliable connection to the DUT.

[0005] However, solder-on probes also have many drawbacks. Because DUT test points are often inaccessible, the process of soldering the probe wires to the DUT is difficult for the probe user, requiring long setup times and excellent dexterity. Furthermore, the quality of the solder connections can vary widely, resulting in significant signal fidelity, especially at high frequencies. Furthermore, the thin wires used to attach the probes can easily damage the DUT when the user solders the wires into place. Probing different test points requires unsoldering and resoldering the wires, a time-consuming process that makes these types of probes unsuitable for rapid debug environments where several different DUT test points need to be quickly checked. Finally, these types of solder-on probes tend to wear out after only a few connections and can be costly to replace.

[0006] To overcome some of these issues, another style of probe, called a "browser probe," is designed for the user to hold by hand or with a holding tool and position it in contact with one or more test points within the DUT. This type of browser probe is more suitable for debug environments where maximum flexibility in probe placement and minimal measurement setup time are desired. Browser probes can be designed as single-ended probes, measuring one electrical signal relative to ground at one test point within the DUT, or as differential probes, measuring electrical signals at two test points within the DUT and generating an output signal based on the difference between the two measured signals.

[0007] Probes are typically designed for optimal operation in laboratory, workshop, bench, and office environments, i.e., temperatures around 18–22°C, or around room temperature. Probes can also be designed to operate at temperatures above and below room temperature to enable thermal margin or performance testing of the DUT. For example, some Tektronix probes, such as the P6247, are specified and designed to operate between 0°C and 50°C (see Non-Patent Document 1). The upper and lower operating temperature range of a probe is typically affected by the electrical components used in the probe. For example, in active probes, the amplifier circuitry in the probe tip conditions the signal received from the DUT, but this may have its own upper and lower operating temperature limits, which in turn affect the upper and lower operating temperature range of the entire probe. Operating a probe (and therefore the electrical components that make up the probe) at temperatures outside the probe's specified operating temperature range can cause drift in the performance of these components, which can result in inaccurate measurements or even damage the probe. [Prior art documents] [Patent documents]

[0008] [Patent Document 1] Japanese Patent Application Publication No. 2017-067762 [Patent Document 2] Japanese Patent Application Laid-Open No. 2015-083974 [Non-patent literature]

[0009] [Non-Patent Document 1] "P6248, P6247, and P6246 Differential Probes Data Sheet," Tektronix, [online], [Retrieved November 13, 2020], Internet<https: / / jp.tek.com / datasheet / differential-probes-2> [Non-patent document 2] "Vortex tube" article, Wikipedia, [Online], [Retrieved November 13, 2020], Internet < https: / / en.wikipedia.org / wiki / Vortex_tube> Summary of the Invention [Problem to be solved by the invention]

[0010] However, in some use cases, a user may want to connect a probe to a DUT and perform measurements on the DUT at environmental temperatures that exceed the probe's operating temperature specifications. For example, the DUT may be a circuit board or other electrical device or module designed for use in an automobile. In these cases, the required operating temperature range of the DUT may significantly exceed the temperature specifications of the probe. For example, the DUT may be required to operate down to at least -5 degrees Celsius, -10 degrees Celsius, or even -20 degrees Celsius, and up to at least 100 degrees Celsius, 125 degrees Celsius, 150 degrees Celsius, or even 175 degrees Celsius.

[0011] To verify that a DUT meets these specifications, a user might place the DUT in a controlled temperature chamber and operate it. To measure the DUT's performance, the user might also place a probe attached to the DUT in the temperature chamber, extend the probe cable out of the temperature chamber through an access port, and connect it to the input of test and measurement equipment. The probe is therefore exposed to the same environmental temperature as the DUT, which often exceeds the probe's specified operating temperature. In some situations, the probe temperature is also inconsistent. For example, a user might run multiple tests with a schedule that swings from 0 degrees Celsius to 175 degrees Celsius and back again. With existing technology, a user would either have to accept uncertainty with a single probe when it is out of range and replace it with one that meets the test needs when the temperature swings, or physically damage the probe (possibly beyond repair).

[0012] The disclosed technical arrangements address the shortcomings of the prior art. [Means for solving the problem]

[0013] As described herein, aspects of the present invention relate to a temperature management system for a test measurement probe. Some aspects of the present invention manage the temperature to which a probe is exposed to ensure that the probe is within or close to a specified operating temperature range so that the probe can properly measure a DUT. Furthermore, aspects of the present invention enable tight control of the probe's temperature, enabling the probe to obtain highly accurate measurements. To do so, aspects of the present invention provide a heat transfer fluid that cools a portion of the test measurement probe without affecting the temperature of the test environment (referring to a temperature-controlled chamber in which the DUT is located), thereby ensuring the accuracy of the measurement results.

[0014] Aspects, features and advantages of embodiments of the present invention will become apparent from the following description of the embodiments, taken in conjunction with the accompanying drawings. [Brief explanation of the drawings]

[0015] [Figure 1] FIG. 1 is a graphical illustration of a thermal management system for a test and measurement probe according to an exemplary embodiment. [Figure 2] FIG. 2 is a partial cutaway view of a portion of the thermal management system of FIG. [Figure 3] Figure 3 shows an example of a method for managing the temperature of the probe head of a test measurement probe. [Figure 4] FIG. 4 is a partial cutaway view of a portion of a temperature management system similar to that of FIG. 2, but showing an alternative configuration with an internal Peltier device. DETAILED DESCRIPTION OF THE INVENTION

[0016] Figure 1 is a graphical diagram illustrating a portion of a thermal management system 100 for a test measurement probe according to an exemplary embodiment. Figure 2 is a partial cutaway view of a portion of the thermal management system 100 of Figure 1. As shown in Figures 1-2, the thermal management system 100 for a probe head 101 of a test measurement probe may include a shroud 102 and a fluid inlet conduit 103.

[0017] In FIG. 1 , a portion of the thermal management system 100 is illustrated as being within a test environment 104. The test environment 104 may be, for example, an environment having a higher or lower temperature than the temperature of an area 105 outside the bulkhead 102. Thus, the test environment 104 may be, for example, a temperature-controlled room such as an oven, refrigerator, or freezer. Thus, the bulkhead 102 may be inserted, for example, through an access port in the temperature-controlled room. Note that the area 105 shown outside the bulkhead 102 is also external to the test environment 104 when the bulkhead 102 is installed in the test environment 104, as in the example shown in FIGS. 1-2 . The test environment 104 may also be somewhere other than a temperature-controlled room, such as the interior of an automobile engine.

[0018] The bulkhead 102 may be configured to be substantially airtight and insulated, except for the access portion 106 in the bulkhead 102. As used in this disclosure, "substantially airtight" means largely or essentially preventing air or other fluids from escaping through the material of the bulkhead 102 itself, without requiring a complete seal. In particular, the interior cavity 107 of the bulkhead 102 is understood to be connected to the region 105 outside the bulkhead 102 through the access portion 106 in the bulkhead 102, as described elsewhere in this disclosure. The connection from the interior cavity 107 of the bulkhead 102 to the region 105 outside the bulkhead 102 is through the access portion 106 in the bulkhead 102, and not through the material of the bulkhead 102 itself, because the access portion is an opening in the bulkhead 102. Thus, the bulkhead 102 is substantially airtight to air or another fluid passing through the bulkhead 102 and into the test environment 104.

[0019] As used in this disclosure, "thermally insulated," with respect to the bulkhead 102, means that the transfer of heat through the material of the bulkhead 102 itself is largely or essentially prevented, and does not require a complete barrier to all heat conduction. In some embodiments, the bulkhead 102 may include layers 108 of insulating material. For example, one or more layers 108 of insulating material may be or include polyester batting. In some alternative embodiments, the polyester batting may have a reflective backing configured to reflect infrared energy.

[0020] The septum 102 receives and substantially encloses a first portion 109 of the probe head 101 within an interior cavity 107 of the septum 102, while allowing a second portion 110 of the probe head 101 to extend outward from a probe head end 111 of the septum 102. As used herein with respect to the septum 102, "substantially enclose" means surrounding most or essentially all sides, without necessarily completely covering. For example, the second portion 110 of the probe head 101 is seen to extend outward from the probe head end 111 of the septum 102. Additionally, it is seen that one or more probe cables 112 and fluid inlet conduits 103 of the probe head 101 may extend outward from the access portion 106 of the septum 102. In some configurations, the second portion 110 of the probe head 101 may be referred to as a tip holder and may be configured to receive and hold various types of probe tips.

[0021] 1-2, the probe head end 111 of the septum 102 is opposite the access portion 106 of the septum 102 and does not occupy the same location as the access portion 106 of the septum 102. The probe head end 111 of the septum 102 includes a seal or sealant to allow the second portion 110 of the probe head 101 to extend outwardly from the probe head end 111 of the septum 102 while keeping the septum 102 substantially airtight and insulated. Additionally, the interior cavity 107 of the septum 102 is connected to the area 105 outside the septum 102 through the access portion 106 of the septum 102. The access 106 in the septum 102 may also have a seal or sealing material, or may be fastened or clamped down to allow one or more probe cables 112, fluid inlet conduits 103, etc. to extend out of the access 106 in the septum 102 while still allowing the septum 102 to remain substantially airtight and insulated.

[0022] The bulkhead 102 further includes a fluid outlet passage 113 that allows a heat transfer fluid 114 to pass from the probe head end 115 of the internal cavity 107, through the internal cavity 107 of the bulkhead 102, through the access portion 106 in the bulkhead 102, and out of the bulkhead 102. The probe head end 115 of the internal cavity 107 of the bulkhead 102 is on the opposite side from the access portion 106 in the bulkhead 102, and as the heat transfer fluid 114 passes through the internal cavity 107 of the bulkhead 102 and exits the bulkhead 102, the heat transfer fluid 114 comes into contact with the probe cable 112. Thus, the probe cable 112 can be cooled or heated depending on the relative temperature of the heat transfer fluid 114.

[0023] The heat transfer fluid 114 may be, for example, air, water, or other suitable fluid. In configurations where the heat transfer fluid 114 is air, the air may be supplied by a compressed air source 121. The compressed air source 121 may include a filter to reduce water and particulates in the air. The compressed air source 121 may provide compressed air at a pressure, for example, between about 80 PSIG (about 552 kilopascals above atmospheric pressure) and about 100 PSIG (about 689 kilopascals above atmospheric pressure).

[0024] In some alternative embodiments, the septum 102 is substantially flexible and configured to encase the first portion 109 of the probe head 101. As used in this disclosure, "substantially flexible" means, with respect to the septum 102, that it is mostly or primarily flexible, without requiring complete flexibility throughout the entire septum 102. The septum 102 may include a zipper, hook-and-loop, snap closure, or other fastener 131 that allows the septum 102 to remain substantially airtight and insulating while encasing around the first portion 109 of the probe head 101. By encasing the septum 102 around the first portion 109 of the probe head 101, a user can more easily attach the septum 102 to the probe without having to pack or pull the probe head 101 down the length of the septum 102 from the access portion 106 to the probe head end 111.

[0025] The fluid inlet conduit 103 enters the bulkhead 102 through an access 106 in the bulkhead 102, extends through an interior cavity 107 of the bulkhead 102, and is configured to introduce a heat transfer fluid 114 to a probe head end 115 of the interior cavity 107. In some alternative embodiments, the fluid inlet conduit 103 is constructed of low-friction tubing with a small-diameter transition section to reduce frictional losses. For example, the fluid inlet conduit 103 may be a smooth-walled, continuous tube having a continuous cross-section. The fluid inlet conduit 103 may be an extruded polymer tube, such as silicone tubing. In some embodiments, the fluid inlet conduit 103 is rigid or semi-rigid to prevent the fluid inlet conduit 103 from collapsing when covered by the bulkhead 102 during normal operation. Thus, a rigid or semi-rigid fluid inlet conduit 103 can reduce crimping or kinking of the fluid inlet conduit 103, thereby reducing frictional losses as the heat transfer fluid 114 passes through the fluid inlet conduit 103. Preferably, however, the fluid inlet conduit 103 is sufficiently flexible to allow flexible movement of one or more probe cables 112 and to allow optimal positioning of the probe head 101 to measure the DUT.

[0026] As shown in FIGS. 1-2 , the thermal management system 100 may further include a diverter 116 at the probe head end 115 of the interior cavity 107 of the bulkhead 102. The diverter 116 is configured to change the flow direction of the heat transfer fluid 114 from an inflow direction 117 to an outflow direction 118. In some alternative embodiments, the fluid inflow conduit 103 terminates within the diverter 116. Thus, the incoming heat transfer fluid 114 first contacts the diverter 116 after exiting the fluid inflow conduit 103 within the diverter 116. As shown in FIGS. 1-2 , the outflow direction 118 may be opposite the inflow direction 117, and the heat transfer fluid 114 makes a “U-turn” by flowing through the diverter 116.

[0027] 1-2, the thermal management system 100 may also include a fluid supply system configured to introduce a heat transfer fluid 114 into the fluid inlet conduit 103. Applicant intends that any currently existing or future developed structure that performs the same function as introducing a heat transfer fluid 114 into a fluid inlet be encompassed by the term "fluid supply system." In some alternative embodiments, a first portion of the fluid inlet conduit 103 may be integral with or embedded in the bulkhead 102, and a second portion of the fluid inlet conduit 103 may be connected to the fluid supply system, and the first and second portions may be removably connected using a quick-connect coupling mechanism or other coupling mechanism.

[0028] In some alternative embodiments, the fluid supply system may include a vortex tube 119. The vortex tube 119 is a known mechanical device that separates compressed gas into a hot stream and a cold stream, with the hot stream exiting the vortex tube 119 through a hot outlet 122 and the cold stream exiting the vortex tube 119 through a cold outlet 123. Compressed air (e.g., from a compressed air source 121) is supplied to an inlet port 120 of the vortex tube 119, which is also referred to in this document as the return side of the vortex tube 119. The reason for this terminology will become clear in the following description of the fluid outlet conduit 127.

[0029] Thus, the vortex tube 119 can provide either hot gas (from the hot outlet 122) or cold gas (from the cold outlet 123), where hot and cold are relative to each other and to the temperature of the compressed gas before entering the vortex tube 119. For example, in some configurations, the gas exiting the cold outlet 123 can reach a temperature of up to about −50°C (−60°F), while the gas exiting the hot outlet 122 can reach a temperature of about 200°C (390°F). The vortex tube 119 can have a flow capacity of about 4 cubic feet per minute (about 0.1137 cubic meters) when supplied with compressed gas at about 100 PSIG (about 689 kilopascals above atmospheric pressure). In such a configuration, the vortex tube 119 can provide, for example, about 200 BTU (about 58.6 watt-hours) of cooling capacity per hour.

[0030] Thus, in some embodiments, in a cooling mode of the vortex tube 119, the fluid inlet conduit 103 is coupled to the cold outlet 123 of the vortex tube 119 to introduce cold heat transfer fluid 114 to the probe head end 115 of the internal cavity 107. Alternatively, in some embodiments, in a heating mode of the vortex tube 119, the fluid inlet conduit 103 is coupled to the hot outlet 122 of the vortex tube 119 to introduce hot heat transfer fluid 114 to the probe head end 115 of the internal cavity 107.

[0031] In some variations, the fluid delivery system includes a thermoelectric cooler or heater 124. Thermoelectric coolers and thermoelectric heaters are known devices that use the Peltier effect to generate heat flux between two materials. As used in this disclosure, the term Peltier device 124 refers to a thermoelectric cooler or a thermoelectric heater. Because of the heat flux, a Peltier device has a hot side and a cold side and can therefore be used for either heating or cooling. In configurations where the Peltier device 124 is used to heat the heat transfer fluid 114, the hot side is the active side 125 of the Peltier device 124, and the cold side of the Peltier device 124 is referred to as the return side 126 of the Peltier device 124. Similarly, in configurations where a Peltier device 124 is used to cool the heat transfer fluid 114, the cold side is the active side 125 of the Peltier device 124, and the hot side of the Peltier device 124 is referred to as the return side 126 of the Peltier device 124. The reason for this terminology will become clear in the following discussion of the fluid outlet conduit 127. As shown in FIG. 1, the Peltier device 124 may be external to the bulkhead 102.

[0032] Alternatively, or in addition, the Peltier device 124 may be within the bulkhead 102, as shown in FIG. 4. In some such variations, in the cooling mode of the Peltier device 124, the cold side of the Peltier device 124 may be in contact with the first portion 109 of the probe head 101 and, in addition (or instead), with a portion of the probe cable 112 attached to the probe head 101. In the cooling mode, the heat transfer fluid 114 may pass through the hot side of the Peltier device 124 before contacting the first portion 109 of the probe head 101. Similarly, in the heating mode of the Peltier device 124, the hot side of the Peltier device 124 may be in contact with the first portion 109 of the probe head 101 and, in addition (or instead), with a portion of the probe cable 112 attached to the probe head 101. In the heating mode, the heat transfer fluid 114 may pass through the cold side of the Peltier device 124 before the heat transfer fluid 114 contacts the first portion 109 of the probe head 101 .

[0033] In some alternative embodiments, the fluid inlet conduit 103 may extend to the internal Peltier device 124, and similarly, the fluid outlet conduit 127 (described below) may extend to the internal Peltier device 124. Thus, in embodiments having an internal Peltier device 124, the heat transfer fluid 114 can provide a heat flux, for example, to carry excess heat away from the internal Peltier device 124. In some alternative embodiments, the Peltier device 124 may be in contact with the probe head 101 and in addition (or instead) with the probe cable 112, as described above, but may not be in contact with the bulkhead 102. Some configurations that contact the Peltier device 124 to the probe head 101 may have a faster response to the temperature control means, as described below with respect to the temperature controller 129, because, for example, the fluid inlet conduit 103 does not extend to the vortex tube 119 or Peltier device 124 outside the bulkhead 102, and there is less volume of heat transfer fluid 114. In some alternative configurations, the internal Peltier device 124 may be incorporated into or integrated into the probe head 101, and in particular the first portion 109 of the probe head 101.

[0034] 1 and 2, in some alternative embodiments, the thermal management system 100 includes a fluid outlet conduit 127 connecting the fluid outlet passage 113 to the return sides 120, 126 of the fluid supply system. as In such a configuration, the heat transfer fluid 114 exiting the bulkhead 102 may be returned to the fluid supply system (e.g., vortex tube 119 or Peltier device 124) for repeated cooling or heating. The fluid outlet conduit 127 may be low-friction tubing with a small diameter transition section to reduce frictional losses. In some alternative embodiments, a first portion of the fluid outlet conduit 127 may be integral with or embedded in the bulkhead 102, and a second portion of the fluid outlet conduit 127 may be connected to the return side 120, 126 of the fluid supply system, with the first and second portions being removably connected using a quick-connect coupling or other coupling mechanism.

[0035] 1-2, the temperature management system 100 may further include a temperature sensing device 128 configured to sense the temperature at the probe head end 115 of the interior cavity 107 of the bulkhead 102. The temperature sensing device 128 may be, for example, a thermocouple or a visual indicator such as a color-changing material. The temperature sensing device 128 may be, for example, a thermocouple or a color-changing material, as shown in FIG. 2 As another example, the temperature sensing device 128 may be located within the probe head 101.

[0036] In some variations, the temperature management system 100 may include a temperature controller 129 configured to receive an indication of the detected temperature from the temperature sensing device 128 and adjust one or both of the temperature of the heat transfer fluid 114 and the flow rate of the heat transfer fluid 114 in response to the indication of the detected temperature. For example, the temperature controller 129 may instruct a control valve 130 between the fluid supply system and the fluid inlet conduit 103. As another example, the temperature controller 129 may instruct the Peltier device 124 to, for example, increase or decrease the current to adjust the temperature of the hot and cold sides. Additionally or alternatively, in some variations, the temperature management system 100 may access a temperature sensing device integrated with the probe head 101 of the test measurement probe. The temperature controller 129 may be, for example, external to the bulkhead 102, internal to the bulkhead 102, part of the probe head 101, part of the test and measurement instrument, or in another suitable location.

[0037] To set up and operate the system 100, for example, using an embodiment with the vortex tube 119 in cooling mode, a user places a first portion of a probe head 101 of a test measurement probe within the interior cavity 107 of the bulkhead 102. For example, a user inserts the probe head 101 into the diverter 116 and then wraps the bulkhead 102 around the first portion 109 of the probe head 101, as well as a portion of the probe cable 112 attached to the probe head 101. A second portion 110 of the probe head 101 extends out the probe head end 111 of the bulkhead 102. If desired, and if not already within the test environment 104, the probe head 101 and bulkhead 102 can be inserted into the test environment 104 through a port in the temperature-controlled chamber that serves as the test environment 104.

[0038] A user may then attach a compressed air source 121 to the inlet port 120 of the vortex tube 119. The compressed air passes through the vortex tube 119. When the system 100 is configured in a cooling mode, the cooled air exits the cold outlet 123 of the vortex tube 119 and enters the fluid inlet conduit 103, where it flows into the bulkhead 102 through the access 106 in the bulkhead 102, then through the interior cavity 107 of the bulkhead 102 and into the probe head end 115 of the interior cavity 107.

[0039] In this position, the cooled air impinges on the diverter 116, which passes the cooled air around most of the first portion 109 of the probe head 101, thereby cooling the first portion 109 of the probe head 101. The first portion 109 of the probe head 101 is typically temperature-sensitive, but it contains the active components (such as amplifier circuitry) of the probe head 101 that generate heat. The cooled air thus serves to regulate the temperature of the components within the first portion 109 of the probe head 101. Some of the heat generated by these components is transferred to the passing electrically conductive fluid 114. The diverter 116 also redirects the still-cool, but now slightly warmer, air from an inflow direction 117 (the direction of flow from the fluid inlet conduit 103) to an outflow direction 118 (the direction of air flow back toward the access portion 106 in the bulkhead 102). After exiting the diverter 116, the cool air enters the fluid outlet passage 113, passes from the probe head end 115 of the internal cavity 107, through the internal cavity portion 107 of the bulkhead 102, and is exhausted out of the bulkhead 102 through the access portion 106 of the bulkhead 102. While passing through the internal cavity 107 of the bulkhead 102, the cool air may also cool the portion of the probe cable 112 that is within the bulkhead 102.

[0040] As the air exits the bulkhead 102 through the access 106 in the bulkhead 102, the air may be exhausted to an area 105 outside the bulkhead 102. Alternatively, the air exiting the bulkhead 102 may be directed into a fluid outlet conduit 127 for transport elsewhere, such as to the return side 120 of the vortex tube 119.

[0041] 3 illustrates an example method for managing the temperature of a probe head 101 of a test measurement probe. Referring to FIGS. 1-3, a method 300 for managing the temperature of a probe head 101 includes the following steps: In step 301, a first portion of the probe head 101 is substantially enclosed within an internal cavity 107 of the bulkhead 102 while allowing a second portion 110 of the probe head 101 to extend outside a probe head end 111 of the bulkhead 102. Note that the bulkhead 102 is substantially airtight and thermally insulating except for an access portion 106 in the bulkhead 102, which is on the opposite side of the internal cavity 107 of the bulkhead 102 from the probe head end 115. In step 305, a heat transfer fluid 114 is introduced into the partition 102 through the access 106 in the partition 102 and through a fluid inlet conduit 103 extending through the interior cavity 107 of the partition 102 to the probe head end 115 of the interior cavity 107. In step 306, the heat transfer fluid 114 is contacted with the first portion 109 of the probe head 101. In step 309, the heat transfer fluid 114 is passed through the fluid outlet passage 113 from the probe head end 115 of the interior cavity 107, through the interior cavity 107 of the partition 102, through the access 106 in the partition 102, and out of the partition 102.

[0042] In some alternative embodiments, the method may include, after step 306 of contacting the heat transfer fluid 114 with the first portion 109 of the probe head 101, step 308 of contacting the heat transfer fluid 114 with the probe cable 112 extending from the probe head 101.

[0043] In some variations, the method may include step 302 of supplying a heat transfer fluid 114 (wherein the heat transfer fluid 114 comprises compressed air) from a compressed air source 121 and step 303 of passing the compressed air through a vortex tube 119 before step 305 of introducing the heat transfer fluid 114 into the probe head end 115 of the internal cavity 107.

[0044] In some variations, the method may include passing 304 the heat transfer fluid 114 through a Peltier device 124 to change the temperature of the heat transfer fluid 114 before introducing 305 the heat transfer fluid 114 into the probe head end 115 of the internal cavity 107.

[0045] In some variations, the method may include step 307 of redirecting the flow of the heat transfer fluid 114 from an inflow direction 117 to an outflow direction 118 at the probe head end 115 of the interior cavity 107 of the bulkhead 102.

[0046] In some variations, the method may include detecting 310 the temperature of the heat transfer fluid 114 at the probe head end 115 of the interior cavity 107 of the bulkhead 102 .

[0047] Thus, configurations of the disclosed technology provide a heat transfer fluid that cools a portion of the test measurement probe without affecting the temperature of the test environment. Thus, some configurations of the disclosed technology manage the temperature to which the probe is exposed, keeping the probe within or close to a specified operating temperature range so that the probe properly measures the DUT.

[0048] [Example] The following examples are provided to aid in understanding the technology disclosed in this application. Embodiments of the technology may include one or more of the examples described below, and any combination thereof.

[0049] Example 1 includes a thermal management system for a test measurement probe, comprising an insulated partition configured to enclose a first portion of a probe head of the test measurement probe within an internal cavity of the partition while allowing a second portion of the probe head to extend outward from the partition, the internal cavity of the partition configured to communicate with an area outside the partition through an access portion of the partition, the partition further comprising a fluid outlet passage configured to pass a heat transfer fluid from a probe head end of the internal cavity through the internal cavity of the partition, through the access portion of the partition, and outward from the partition, and a fluid inlet conduit configured to enter the partition through the access portion of the partition and extend through the internal cavity of the partition to introduce the heat transfer fluid to the probe head end of the internal cavity.

[0050] Example 2 includes the temperature management system of example 1, further comprising a fluid supply system configured to introduce the heat transfer fluid into the fluid inlet conduit.

[0051] Example 3 includes the temperature management system of example 2, further comprising a fluid outlet conduit connecting the fluid outlet passage to a return side of the fluid supply system.

[0052] Example 4 includes the temperature control system of any one of Examples 2 and 3, in which the fluid supply system has a vortex tube.

[0053] Example 5 includes the temperature management system of example 4, wherein the fluid inlet conduit is coupled to the cold outlet of the vortex tube.

[0054] Example 6 includes the thermal management system of example 4, wherein the fluid inlet conduit is coupled to the hot outlet of the vortex tube.

[0055] Example 7 includes the temperature control system of any one of Examples 2 to 6, and the fluid supply system includes a thermoelectric cooler.

[0056] Example 8 includes the temperature control system of any one of Examples 2 to 6, and the fluid supply system has a thermoelectric heater.

[0057] Example 9 includes the temperature management system of any of Examples 1-8, further comprising a temperature sensing device configured to sense a temperature at a probe head end of the interior cavity of the septum.

[0058] Example 10 includes the temperature management system of example 9, further including a temperature controller configured to receive an indication of a detected temperature from the temperature detection device and to adjust one or both of a temperature of the heat transfer fluid or a flow rate of the heat transfer fluid in response to the indication of the detected temperature.

[0059] Example 11 includes the temperature management system of any of Examples 1 to 10, further comprising a diverter at the probe head end of the internal cavity of the partition, the diverter configured to change the direction of flow of the heat transfer fluid from an inflow direction to an outflow direction.

[0060] Example 12 includes the thermal management system of example 11, wherein the fluid inlet conduit terminates in a diverter.

[0061] Example 13 includes the temperature management system of any of Examples 1-12, wherein the bulkhead is substantially flexible and configured to encase the first portion of the probe head.

[0062] Example 14 is a method for controlling the temperature of a probe head of a test measurement probe, the method comprising: enclosing a first portion of the probe head of the test measurement probe within an interior cavity of an insulated bulkhead while allowing a second portion of the probe head to extend outside the bulkhead; and controlling the temperature of the probe head by contacting a heat transfer fluid within the bulkhead with the first portion of the probe head.

[0063] Example 15 includes the method of Example 14, wherein the step of controlling the temperature of the probe head by contacting a heat transfer fluid with a first portion of the probe head within the partition includes the steps of: introducing the heat transfer fluid into the partition through an access portion in the partition and through a fluid inlet conduit extending through the interior cavity of the partition to an end of the probe head in the interior cavity; and passing the heat transfer fluid from the probe head end of the interior cavity through the interior cavity of the partition and out of the partition through the access portion in the partition by a fluid outlet passage.

[0064] Example 16 includes the method of example 14 or example 15, further comprising, after the step of contacting the heat transfer fluid with the first portion of the probe head, contacting the heat transfer fluid with a probe cable extending from the probe head.

[0065] Example 17 includes the method of any of Examples 14-16, further comprising: providing a heat transfer fluid comprising compressed air from a compressed air source; and passing the compressed air through a vortex tube before introducing the heat transfer fluid into the probe head end of the internal cavity.

[0066] Example 18 includes the method of any of Examples 14-17, further comprising passing the heat transfer fluid through a Peltier device to change the temperature of the heat transfer fluid before introducing the heat transfer fluid into the probe head end of the internal cavity.

[0067] Example 19 includes the method of any of Examples 14-18, further comprising sensing the temperature of the heat transfer fluid at a probe head end in the interior cavity of the septum.

[0068] Example 20 includes the method of any of Examples 14-19, further comprising changing the direction of flow of the heat transfer fluid from an inflow direction to an outflow direction at the probe head end of the interior cavity of the bulkhead.

[0069] Aspects may operate on specially created hardware, firmware, digital signal processors, or specially programmed general-purpose computers, including processors that operate according to programmed instructions. The terms "controller" or "processor" herein contemplate microprocessors, microcomputers, ASICs, and dedicated hardware controllers, among others. One or more aspects may be embodied in computer-usable data and computer-executable instructions, such as one or more program modules, executed by one or more computers (including a monitoring module) or other devices. Generally, program modules include routines, programs, objects, components, data structures, and the like, which, when executed by a processor in a computer or other device, perform particular tasks or implement particular abstract data formats. Computer-executable instructions may be stored in computer-readable storage media, such as hard disks, optical disks, removable storage media, solid-state memory, RAM, and the like. Those skilled in the art will appreciate that the functionality of the program modules may be combined or distributed as desired in various embodiments. Furthermore, such functionality may be embodied in whole or in part in firmware or hardware equivalents, such as integrated circuits, field programmable gate arrays (FPGAs), etc. Certain data structures may be used to more effectively implement one or more aspects of the disclosed technology, and such data structures are considered within the scope of the computer-executable instructions and computer-usable data described herein.

[0070] The above-described aspects of the disclosed subject matter have many advantages that have been described or that will be apparent to those skilled in the art. Nevertheless, not all of these advantages or features are required in all aspects of the disclosed devices, systems, or methods.

[0071] Additionally, the description of this application refers to specific features. It should be understood that the disclosure herein includes all possible combinations of these specific features. When a specific feature is disclosed in the context of a particular aspect or embodiment, that feature can also be used in the context of other aspects and embodiments, to the extent possible.

[0072] Furthermore, when this application refers to a method having two or more defined steps or processes, these defined steps or processes may be performed in any order or simultaneously, unless the circumstances do not preclude this possibility.

[0073] Furthermore, the term "comprises" and its grammatical equivalents are used herein to indicate that other components, features, steps, processes, or operations are optionally present. For example, "comprising" components A, B, and C or "something which comprises" components A, B, and C may include only components A, B, and C, or may include components A, B, and C along with one or more other components.

[0074] For convenience of explanation, specific configurations of the invention have been shown and described, but it will be understood that various modifications can be made without departing from the spirit and scope of the invention. [Explanation of symbols]

[0075] 100 Temperature Control System 101 Probe Head 102 Bulkhead 103 Fluid inlet conduit 104 Testing Environment 105 Area outside the bulkhead 106 Bulkhead access 107 Internal cavity 108 Layer of insulation 109 First part of the probe head 110 Second part of the probe head 111 Probe head end of bulkhead 112 Probe Cable 113 Fluid outflow passage 114 Heat Transfer Fluid 115 Probe head end of inner cavity 116 Diverter 117 Inflow direction 118 Outflow direction 119 Vortex tube 120 Vortex tube inlet port 121 Compressed Air Source 122 High temperature outlet 123 Cold outlet 124 Peltier Devices (Thermoelectric Coolers or Heaters) 125 Active side of Peltier device 126 Return side of Peltier device 127 Fluid outflow conduit 128 Temperature Sensing Device 129 Temperature Controller 130 Control Valve 131 Fastener

Claims

1. A temperature control system for use of a test measurement probe having an internal electrical component and a specified operating temperature range in a test environment where the temperature exceeds the operating temperature range, a bulkhead insulated from the test environment, the bulkhead configured to enclose a first portion of a probe head of the test measurement probe, where the electrical components are present, within an internal cavity of the bulkhead while allowing a second portion of the probe head to extend from one end of the bulkhead into the test environment, the internal cavity of the bulkhead configured to communicate with an area outside the bulkhead and outside the test environment through an access portion of the bulkhead located at an end opposite the one end of the bulkhead, the bulkhead further having a fluid outlet passage configured to pass a heat transfer fluid from an end of the internal cavity closer to the one end through the internal cavity of the bulkhead, through the access portion of the bulkhead, and out of the bulkhead; a fluid inlet conduit configured to enter the partition through the access portion in the partition, extend through the internal cavity of the partition, and introduce the heat transfer fluid to the end of the internal cavity proximal to the one end; a fluid supply system configured to introduce the heat transfer fluid into the fluid inlet conduit; a temperature detection device configured to detect a temperature at the end of the partition wall proximate the one end of the internal cavity; a temperature controller configured to receive an indication of a detected temperature from the temperature detection device and to adjust one or both of a temperature of the heat transfer fluid or a flow rate of the heat transfer fluid in response to the indication of the detected temperature; A temperature control system comprising:

2. The temperature management system of claim 1 , wherein the fluid supply system comprises a vortex tube, a thermoelectric cooler, or a thermoelectric heater.

3. 1. A method for managing the temperature of a probe head of a test measurement probe having an electrical component built therein and having a specified operating temperature range, for use in a test environment having a temperature exceeding said operating temperature range, comprising: enclosing a first portion of the probe head of the test measurement probe, in which the electrical components reside, within an interior cavity of a bulkhead insulated from the test environment, while allowing a second portion of the probe head to extend from one end of the bulkhead into the test environment; introducing a heat transfer fluid into the partition through an access portion located at an end opposite the one end of the partition and through a fluid inlet conduit extending through the internal cavity of the partition to an end of the internal cavity proximal to the one end; passing the heat transfer fluid through a fluid outlet passage from the end of the internal cavity proximate the one end, through the internal cavity of the partition, through the access portion of the partition, and out of the partition; sensing the temperature of the heat transfer fluid at the end of the partition wall proximate the one end of the internal cavity; adjusting one or both of the temperature of the heat transfer fluid and the flow rate of the heat transfer fluid in response to the detected temperature; A temperature control method comprising:

4. providing said heat transfer fluid comprising compressed air from a source of compressed air; passing the compressed air through a vortex tube before introducing the heat transfer fluid into the end of the internal cavity proximate the one end; The temperature management method of claim 3 further comprising:

5. 5. The temperature management method of claim 3 or 4, further comprising the step of passing the heat transfer fluid through a Peltier device to change the temperature of the heat transfer fluid before introducing the heat transfer fluid into the end of the internal cavity closer to the one end.

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