Sample processing system, image generating device, and image generating method

Abstract

To provide a sample processing system that can easily determine an appropriate processing condition.SOLUTION: A sample processing system includes a sample processing device that radiates an ion beam onto a sample to process the sample, and an image generating device that generates a predicted image of the sample when processed under a set processing condition using the sample processing device, and the predicted image includes information on the distribution of the irradiation direction of the ion beam.SELECTED DRAWING: Figure 16

Description

[Technical Field]

[0001] The present invention relates to a sample processing system, an image generating device, and an image generating method. [Background technology]

[0002] A known sample processing device that processes samples using an ion beam is the Cross Section Polisher (registered trademark). One processing method using such a sample processing device is the plane milling method, which uses the sputtering phenomenon that occurs when an ion beam is irradiated at a very shallow angle onto the sample surface to create a smooth plane.

[0003] For example, Patent Document 1 discloses an ion milling apparatus comprising an ion gun that irradiates a rotating sample with an ion beam and a sample rotation device that positions and rotates the sample so that its center of rotation is within the ion beam irradiation surface, characterized in that the center of rotation of the sample is offset by a predetermined distance from the center of the ion beam on the sample surface. By offsetting the center of the ion beam from the center of rotation of the sample in this way, it is possible to irradiate a wider area of the sample with the ion beam from various irradiation directions, compared to when the center of the ion beam and the center of rotation of the sample are coincident. This allows for smooth etching of a wider area of the sample. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 3-36285 Summary of the Invention [Problem to be solved by the invention]

[0005] However, the irradiation direction of the ion beam during processing changes in a complex manner depending on processing conditions such as the rotation speed of the sample and the distance between the center of the ion beam and the center of rotation of the sample, making it difficult to determine appropriate processing conditions. [Means for solving the problem]

[0006] One aspect of the sample processing system according to the present invention is a sample processing device that processes a sample by irradiating the sample with an ion beam; an image generating device that generates a predicted image when the sample is processed under set processing conditions using the sample processing device; Including, the sample processing device includes a sample stage having a tilting mechanism for tilting the sample and a rotation mechanism for rotating the sample; The image generating device generating a radial component image showing an intensity distribution of a radial component of the ion beam centered on the rotation center of the sample based on the processing conditions; generating a rotational component image showing an intensity distribution of a rotational component of the ion beam around the rotation center of the sample based on the processing conditions; generating the predicted image by adding together the luminance values of the radial component image and the luminance values of the rotational component image, with the luminance values having different signs for each corresponding pixel of the radial component image and the rotational component image; Do . One aspect of the sample processing system according to the present invention is a sample processing device that processes a sample by irradiating the sample with an ion beam; an image generating device that generates a predicted image when the sample is processed under set processing conditions using the sample processing device; Including, the sample processing device includes a sample stage having a tilting mechanism for tilting the sample, a rotation mechanism for rotating the sample, and a swing mechanism for swinging the sample; the processing conditions include a tilt angle of the sample, a rotation speed of the sample, and a distance between a rotation center of the sample and a swing center of the sample; The image generating device generating an irradiation direction distribution image representing the irradiation direction of the ion beam at each time based on the processing conditions; a process of adding the irradiation direction distribution images at each time to generate the predicted image; Do the following.

[0007] Such a sample processing device can obtain a predicted image of the sample when processed under set processing conditions, making it easy to determine appropriate processing conditions.

[0008] One aspect of the image generating device according to the present invention is an image generating unit that generates a predicted image of a sample when the sample is processed under set processing conditions using a sample processing device that processes the sample by irradiating the sample with an ion beam; a display control unit that displays the predicted image; Including, the sample processing device includes a sample stage having a tilting mechanism for tilting the sample and a rotation mechanism for rotating the sample; The image generation unit generating a radial component image showing an intensity distribution of a radial component of the ion beam centered on the rotation center of the sample based on the processing conditions; generating a rotational component image showing an intensity distribution of a rotational component of the ion beam around the rotation center of the sample based on the processing conditions; generating the predicted image by adding together the luminance values of the radial component image and the luminance values of the rotational component image, with the luminance values having different signs for each corresponding pixel of the radial component image and the rotational component image; Do . One aspect of the image generating device according to the present invention is an image generating unit that generates a predicted image of a sample when the sample is processed under set processing conditions using a sample processing device that processes the sample by irradiating the sample with an ion beam; a display control unit that displays the predicted image; Including, the sample processing device includes a sample stage having a tilting mechanism for tilting the sample, a rotation mechanism for rotating the sample, and a swing mechanism for swinging the sample; the processing conditions include a tilt angle of the sample, a rotation speed of the sample, and a distance between a rotation center of the sample and a swing center of the sample; The image generation unit generating an irradiation direction distribution image representing the irradiation direction of the ion beam at each time based on the processing conditions; a process of adding the irradiation direction distribution images at each time to generate the predicted image; Do the following.

[0009] Such an image generating device can generate a predicted image of the sample when it is processed under the set processing conditions, so that appropriate processing conditions can be easily determined.

[0010] One aspect of the image generation method according to the present invention is to generating a predicted image of the sample when the sample is processed under set processing conditions using a sample processing device that processes the sample by irradiating the sample with an ion beam; displaying the predicted image; Including, the sample processing device includes a sample stage having a tilting mechanism for tilting the sample and a rotation mechanism for rotating the sample; The step of generating a predicted image includes: generating a radial component image showing an intensity distribution of a radial component of the ion beam centered on the rotation center of the sample based on the processing conditions; generating a rotational component image showing an intensity distribution of a rotational component of the ion beam around a rotation center of the sample based on the processing conditions; generating the predicted image by adding together the luminance values of the radial component image and the luminance values of the rotational component image, with the luminance values having different signs for each corresponding pixel of the radial component image and the rotational component image; Contains . One aspect of the image generation method according to the present invention is to generating a predicted image of the sample when the sample is processed under set processing conditions using a sample processing device that processes the sample by irradiating the sample with an ion beam; displaying the predicted image; Including, the sample processing device includes a sample stage having a tilting mechanism for tilting the sample, a rotation mechanism for rotating the sample, and a swing mechanism for swinging the sample; the processing conditions include a tilt angle of the sample, a rotation speed of the sample, and a distance between a rotation center of the sample and a swing center of the sample; The step of generating a predicted image includes: generating an irradiation direction distribution image representing the irradiation direction of the ion beam at each time based on the processing conditions; adding the illumination direction distribution images at each time to generate the predicted image; Includes.

[0011] Such an image generation method can generate a predicted image when a sample is processed under set processing conditions, making it easy to determine appropriate processing conditions. [Brief explanation of the drawings]

[0012] [Figure 1] FIG. 1 is a diagram showing the configuration of a sample processing system according to a first embodiment. [Figure 2] FIG. 1 is a diagram showing the configuration of a sample processing system according to a first embodiment. [Figure 3] FIG. 2 is a diagram schematically showing a sample supported on a sample stage. [Figure 4] FIG. 1 is a diagram showing the configuration of an image generating apparatus. [Figure 5] 10 is a flowchart showing an example of an image generation method for generating a predicted image. [Figure 6] FIG. 2 is a diagram schematically illustrating an example of a GUI of the image generating device. [Figure 7] Ion beam image before and after correction. [Figure 8] FIG. 4 is a diagram illustrating a process for generating a predicted image at a first time point. [Figure 9] FIG. 4 is a diagram illustrating a process for generating a predicted image at a first time point. [Figure 10] FIG. 10 is a diagram for explaining a method for calculating the irradiation position of the ion beam at a second time. [Figure 11] FIG. 10 is a diagram for explaining a method for calculating the irradiation position of the ion beam at a second time. [Figure 12] FIG. 10 is a diagram for explaining component decomposition of a vector. [Figure 13] FIG. 10 is a diagram showing irradiation intensity distribution images superimposed every second. [Figure 14] FIG. 10 is a diagram showing an image of the irradiation intensity distribution of an ion beam. [Figure 15] Graphs showing the brightness profiles of the respective illumination intensity distribution images. [Figure 16] FIG. 10 is a diagram showing a vector component distribution image. [Figure 17] 6 is a graph showing the brightness profile of each vector component distribution image. [Figure 18] FIG. 10 is a diagram illustrating an example of a method for displaying a predicted image. [Figure 19] FIG. 10 is a diagram illustrating an example of a method for displaying a predicted image. [Figure 20] FIG. 10 is a diagram illustrating an example of a method for displaying a predicted image. [Figure 21] FIG. 10 is a diagram illustrating an example of a method for displaying a predicted image. [Figure 22] FIG. 10 is a diagram illustrating an example of a method for displaying a predicted image. [Figure 23] 10 is a flowchart showing an example of image generation processing of the image generation device. [Figure 24] FIG. 10 is a diagram showing the configuration of an ion source of a sample processing system according to a second embodiment. [Figure 25] FIG. 10 is a diagram showing an example of a predicted image. [Figure 26] FIG. 10 is a diagram schematically showing a state in which a sample having a laminated structure is subjected to plane milling. [Figure 27] FIG. 10 is a diagram showing an example of a predicted image. [Figure 28] FIG. 10 is a diagram showing the configuration of a sample processing system according to a third embodiment. [Figure 29] FIG. 10 is a diagram showing the configuration of a sample processing system according to a third embodiment. [Figure 30] 10A and 10B are diagrams for explaining the relationship between the distance between the rotation center and swing center of a sample and the irradiation range of an ion beam. [Figure 31] FIG. 10 is a diagram showing the configuration of a sample processing system according to a fourth embodiment. [Figure 32] FIG. 10 is a diagram showing the configuration of a sample processing system according to a fourth embodiment. [Figure 33] FIG. 10 is a diagram showing the configuration of a sample processing system according to a fifth embodiment. [Figure 34] FIG. 10 is a diagram showing the configuration of a sample processing system according to a fifth embodiment. [Figure 35] FIG. 10 is a diagram showing an example of an irradiation direction distribution image. [Figure 36] FIG. 10 is a diagram showing an example of an irradiation direction distribution image. [Figure 37] FIG. 10 is a diagram showing an example of an irradiation direction distribution image. [Figure 38] FIG. 4 is a diagram schematically showing a predicted image at a first time point. [Figure 39] FIG. 10 is a diagram schematically showing a predicted image at a second time point. DETAILED DESCRIPTION OF THE INVENTION

[0013] Preferred embodiments of the present invention will be described in detail below with reference to the drawings. Note that the embodiments described below do not unduly limit the content of the present invention as defined in the claims. Furthermore, not all of the configurations described below are necessarily essential components of the present invention.

[0014] 1. First embodiment 1.1. Sample processing system First, a sample processing system according to the first embodiment will be described with reference to the drawings. Figures 1 and 2 are diagrams showing the configuration of a sample processing system 2 according to the first embodiment.

[0015] 1 and 2 illustrate three mutually orthogonal axes: the X-axis, the Y-axis, and the Z-axis. The X-direction includes a +X direction that is one direction along the X-axis, and a -X direction that is the other direction along the X-axis. The Y-direction includes a +Y direction that is one direction along the Y-axis, and a -Y direction that is the other direction along the Y-axis. The Z-direction includes a +Z direction that is one direction along the Z-axis, and a -Z direction that is the other direction along the Z-axis.

[0016] 1 and 2, the sample processing system 2 includes a sample processing device 100 and an image generating device 200. For convenience, the image generating device 200 is not shown in FIG.

[0017] (1) Sample processing equipment The sample processing apparatus 100 processes the sample S by irradiating the sample S with an ion beam IB. The sample processing apparatus 100 is used to prepare samples for electron microscopes such as a scanning electron microscope (SEM), a transmission electron microscope (TEM), and a scanning transmission electron microscope (STEM). The sample processing apparatus 100 is also used to prepare samples for analytical instruments other than electron microscopes, such as an electron probe microanalyzer (EPMA) and an Auger microprobe.

[0018] The sample processing apparatus 100 is capable of processing by a plane milling method that produces a smooth plane by utilizing the sputtering phenomenon that occurs when an ion beam IB is irradiated at a very shallow angle onto the surface of the sample S. The following describes the case where the sample S is processed by the plane milling method using the sample processing apparatus 100.

[0019] 1 and 2, the sample processing device 100 includes an ion source 110, a sample stage 120, an alignment camera 130, a processing and observation camera 140, a chamber 150, a chamber door 160, and a control unit 170. Note that Fig. 1 illustrates a state in which the chamber door 160 is closed and the sample stage 120 is pushed into the chamber 150, while Fig. 2 illustrates a state in which the chamber door 160 is open and the sample stage 120 is pulled out of the chamber 150.

[0020] The ion source 110 generates an ion beam IB and irradiates the generated ion beam IB onto a sample S. The ion source 110 is attached to the top of the chamber 150.

[0021] The sample stage 120 supports the sample S. The sample stage 120 includes a tilt mechanism 20, a rotation mechanism 22, a swing mechanism 24, a Z stage 26, and an XY stage 28. In the example shown in FIGS. 1 and 2, an XY stage 28 is disposed on a swing table 24a of a swing mechanism 24. A Z stage 26 is disposed on the XY stage 28. A tilt mechanism 20 is attached to the Z stage 26, and a rotation mechanism 22 is tiltably supported by the tilt mechanism 20. A sample S is attached to the rotation mechanism 22.

[0022] Fig. 3 is a diagram showing a sample S supported by the sample stage 120. Fig. 3 shows a plan view of the surface Sa of the sample S and a cross-sectional view including the center of the sample S.

[0023] The tilting mechanism 20 tilts the sample S. By tilting the sample S with the tilting mechanism 20, it is possible to adjust the irradiation angle α (incident angle) of the ion beam IB with respect to the surface Sa of the sample S. The tilting mechanism 20 tilts the sample S by tilting the rotation mechanism 22. The tilting mechanism 20 includes a shaft member that supports the rotation mechanism 22 so that it can be tilted, and a support part that supports the shaft member. The tilting mechanism 20 may tilt the sample S using a driving device such as a motor.

[0024] The rotation mechanism 22 rotates the sample S around axis A. Axis A is perpendicular to the surface Sa of the sample S. When the tilt mechanism 20 tilts the rotation mechanism 22, axis A also tilts. Therefore, even when the tilt mechanism 20 tilts the sample S, axis A is always perpendicular to the surface Sa of the sample S. When the rotation mechanism 22 rotates the sample S, the center of rotation RC of the sample S is the position of the intersection of the surface Sa of the sample S and axis A. The rotation mechanism 22 includes a sample stage to which the sample S is fixed, and a drive device such as a motor that rotates the sample stage.

[0025] The swing mechanism 24 swings the sample S. That is, the swing mechanism 24 moves the sample S back and forth around the circumference (reciprocating circular motion). The swing mechanism 24 swings the tilt mechanism 20, rotation mechanism 22, Z stage 26, and XY stage 28 as a unit. Axis B, which serves as the swing axis, is parallel to the Y axis. The swing center SC of the sample S is the position of the intersection of the surface Sa of the sample S and axis B. The swing center SC can be set to any position on the surface Sa of the sample S. The position of the swing center SC can be moved by moving the sample S using the Z stage 26 or the XY stage 28. The swing mechanism 24 includes a swing table 24a and a drive device 24b, such as a motor, that swings the swing table 24a.

[0026] The Z stage 26 moves the sample S in the Z direction. The Z stage 26 can adjust the position of the sample S in the Z direction, i.e., the height of the sample S. The Z stage 26 moves the tilt mechanism 20 in the Z direction to move the sample S in the Z direction. The Z stage 26 moves the tilt mechanism 20 and the rotation mechanism 22 in the Z direction as a unit. By moving the sample S in the Z direction with the Z stage 26, the distance D between the rotation center RC and the swing center SC can be adjusted. In other words, in the sample processing device 100, the distance D is variable. The Z stage 26 moves the sample S in the Z direction using a driving device such as a motor. Note that the Z stage 26 may also be manually operated to move the sample S in the Z direction.

[0027] The XY stage 28 moves the sample S in the X and Y directions. The XY stage 28 can adjust the position of the sample S in the X and Y directions. The XY stage 28 moves the Z stage 26 in the X and Y directions, thereby moving the sample S in the X and Y directions. The XY stage 28 moves the tilt mechanism 20, the rotation mechanism 22, and the Z stage 26 as a unit. The XY stage 28 can adjust the distance B between the center BC of the ion beam IB and the center of rotation RC. In other words, the distance B is variable in the sample processing apparatus 100. The XY stage 28 moves the sample S in the X and Y directions using a driving device such as a motor. The XY stage 28 may also be manually operated to move the sample S in the X and Y directions.

[0028] The alignment camera 130 is a camera for determining the position of the optical axis of the ion beam IB. For example, when the chamber door 160 is open and the sample stage 120 is pulled out from the chamber 150, the center of the field of view of the alignment camera 130 becomes the position of the optical axis of the ion beam IB when the chamber door 160 is closed and the sample stage 120 is pushed into the chamber 150. When the chamber door 160 is closed, the alignment camera 130 is placed at a retracted position away from the ion source 110.

[0029] The processing and observation camera 140 is a camera for observing the sample S during processing. The optical axis of the processing and observation camera 140 is parallel to the Y axis. The processing and observation camera 140 is disposed outside the chamber 150. The processing and observation camera 140 can observe the sample S in the chamber 150 through an observation window 162 provided in the chamber 150.

[0030] The sample stage 120 is housed in the chamber 150. In the sample processing device 100, the sample S is irradiated with an ion beam IB in the chamber 150. The inside of the chamber 150 can be maintained at a reduced pressure by a vacuum pump (not shown).

[0031] The chamber door 160 airtightly seals the chamber 150. The sample stage 120 is attached to the chamber door 160. The chamber door 160 is slidable relative to the chamber 150, and the chamber door 160 can be opened and closed by sliding the chamber door 160. Therefore, the sample stage 120 can be pushed into the chamber 150 by closing the chamber door 160, or the sample stage 120 can be pulled out of the chamber 150 by opening the chamber door 160.

[0032] The control unit 170 controls each unit of the sample processing apparatus 100. The control unit 170 controls the ion source 110, for example, via the ion source control circuit 112. The ion source control circuit 112 converts a control signal from the control unit 170 into a drive signal for driving the ion source 110 and outputs the drive signal to the ion source 110. The control unit 170 also controls, for example, the sample stage 120. When processing conditions are set by the user, the control unit 170 operates the ion source 110 and the sample stage 120 in accordance with the processing conditions.

[0033] When processing a sample S by the plane milling method using the sample processing device 100, the processing conditions set include the energy of the ion beam IB (acceleration voltage of the ion beam), the irradiation angle α of the ion beam IB, the rotation speed of the sample S, the swing angle range of the sample S, the swing speed of the sample S, the distance B between the rotation center RC of the sample S and the center BC of the ion beam IB, the distance D between the rotation center RC of the sample S and the swing center SC, and the processing time.

[0034] In the sample processing apparatus 100, once processing conditions are set, the control unit 170 controls the ion source 110 and the sample stage 120 in accordance with the processing conditions. Specifically, the control unit 170 controls the acceleration voltage of the ion source 110 in accordance with the set energy of the ion beam IB. The control unit 170 also controls the tilt mechanism 20 in accordance with the set irradiation angle α of the ion beam IB. The control unit 170 also controls the rotation mechanism 22 in accordance with the set rotation speed. The control unit 170 also controls the swing mechanism 24 in accordance with the set swing angle range and swing speed. The control unit 170 also controls the XY stage 28 in accordance with the set distance B between the rotation center RC of the sample S and the center BC of the ion beam IB. The control unit 170 also controls the Z stage 26 in accordance with the set distance D between the rotation center RC of the sample S and the swing center SC.

[0035] As a result, in the sample processing device 100, the distance B between the rotation center RC of the sample S and the center BC of the ion beam IB becomes the set distance, and the distance D between the rotation center RC of the sample S and the swing center SC becomes the set distance. The irradiation angle α is the angle at which the ion beam IB is incident on the surface Sa of the sample S. Then, the ion beam IB is irradiated from the ion source 110 onto the sample S with a set energy (acceleration voltage). The ion beam IB is incident on the surface Sa of the sample S at a set irradiation angle α. At this time, the sample S rotates at a set rotation speed around a rotation center RC, and swings at a set swing speed within a set swing angle range around a swing center SC. The control unit 170 causes the ion source 110 to irradiate the ion beam IB for a set processing time. This allows the sample S to be processed under the set processing conditions.

[0036] In addition, the user may adjust the tilt angle of the sample S, the distance B between the rotation center RC of the sample S and the center BC of the ion beam IB, and the distance D between the rotation center RC of the sample S and the swing center SC by manually operating the sample stage 120.

[0037] (2) Image generation device 4 is a diagram showing the configuration of the image generating device 200. The image generating device 200 includes a processing unit 210, an input unit 220, a display unit 230, and a storage unit 240, as shown in FIG.

[0038] The input unit 220 is used by the user to input operation information, and outputs the input operation information to the processing unit 210. The functions of the input unit 220 can be realized by input devices such as a keyboard, a mouse, buttons, and a touch panel.

[0039] The display unit 230 displays the image generated by the processing unit 210. The function of the display unit 230 can be realized by a liquid crystal display (LCD), a touch panel that also functions as the input unit 220, or the like.

[0040] The storage unit 240 stores programs and various data for causing the computer to function as each unit of the processing unit 210. The storage unit 240 also functions as a work area for the processing unit 210. The functions of the storage unit 240 can be realized by a hard disk, a RAM (Random Access Memory), etc.

[0041] The functions of the processing unit 210 can be realized by executing a program using hardware such as various processors (CPU, DSP, etc.). The processing unit 210 includes an image generation unit 212 and a display control unit 214.

[0042] The image generation unit 212 generates a predicted image of the sample S when it is processed under the set processing conditions using the sample processing device 100. The predicted image includes information on the irradiation intensity of the ion beam IB and information on the irradiation direction of the ion beam IB when the sample S is processed under the set processing conditions. In other words, it is possible to know from the predicted image which position on the sample S is irradiated with the ion beam IB, at what irradiation intensity, and from which irradiation direction. The image generation unit 212 performs a simulation based on the set processing conditions and generates the predicted image.

[0043] The display control unit 214 causes the display unit 230 to display the predicted image generated by the image generation unit 212.

[0044] 1.2. Image generation method Next, a method for generating a predicted image will be described with reference to a flowchart shown in Fig. 5.

[0045] 1.2.1. Processing condition acquisition step S10 First, the image generation unit 212 acquires information on processing conditions. The information on the processing conditions input by the user via the input unit 220 is received, and the information on the processing conditions is acquired.

[0046] FIG. 6 is a diagram schematically showing an example of a GUI (Graphical User Interface) screen 4 of the image generating device 200. As shown in FIG.

[0047] As shown in FIG. 6, the GUI screen 4 includes a processing condition setting section G2 for setting processing conditions, a sample image display section G4 for visualizing the processing conditions and displaying the positional relationship between the sample S and the ion beam IB, and a predicted image display section G6 for displaying the generated predicted image.

[0048] The processing condition setting section G2 has sliders for setting various parameters of the processing conditions. Specifically, the processing condition setting section G2 has a slider for setting the energy of the ion beam IB, a slider for setting the irradiation angle α (Angle) of the ion beam IB, a slider for setting the swing angle range (Swing) of the sample S, a slider for setting the distance B (Eccent) between the rotation center RC of the sample S and the center BC of the ion beam IB, a slider for setting the distance D (Distance) between the rotation center RC of the sample S and the swing center SC, and a slider for setting the processing time (Time). Although not shown, the processing condition setting section G2 may also have a slider for setting the swing speed of the sample S.

[0049] The GUI elements for setting parameters are not limited to sliders, and the processing condition setting section G2 may include, for example, input fields for directly inputting parameters as numerical values.

[0050] The display of the processing condition setting section G2 is the same as, for example, the GUI for setting processing conditions in the sample processing device 100. Therefore, after checking the predicted image generated by the image generating device 200 and determining the processing conditions, the work of inputting various parameters into the GUI of the sample processing device 100 is easy.

[0051] The sample image display section G4 displays an image of the sample S according to the set processing conditions. Specifically, the image of the sample S reflecting the tilt angle of the sample S (the irradiation angle of the ion beam IB), the distance B between the rotation center RC of the sample S and the center BC of the ion beam IB, and the distance D between the rotation center RC of the sample S and the swing center SC is displayed.

[0052] Here, in the sample processing device 100, the distance B is adjusted while observing the alignment camera 130. Therefore, the sample image display section G4 displays the distance between the center of rotation RC of the sample S as seen from the alignment camera 130 and the center BC of the ion beam IB, which is calculated from the tilt angle of the sample S and the distance B.

[0053] The generated predicted image is displayed in the predicted image display section G6. In the predicted image display section G6, the image of the sample before processing and the predicted image are displayed superimposed on each other. In the predicted image display section G6, a slider 6 is provided for setting the transparency when the predicted image is superimposed on the image of the sample before processing. Also, a check box 8 is provided for displaying only half of the predicted image superimposed on the image of the sample before processing. Details of the method for displaying the predicted image in the predicted image display section G6 will be described later.

[0054] 1.2.2. Ion beam information acquisition step S20 Next, the image generating unit 212 acquires information about the ion beam IB. The information about the ion beam IB may be, for example, information about the ion beam IB of a set energy at a set irradiation angle α. This is information about the brightness distribution of the ion beam IB when it is irradiated onto the sample S. The information about the brightness distribution of the ion beam IB can be acquired, for example, from an ion beam image obtained by photographing a test sample that emits light when irradiated with the ion beam. A method for acquiring an ion beam image will be described below.

[0055] First, a glass sample is prepared as a sample that will emit light when irradiated with an ion beam. Next, as shown in FIG. 2, the chamber door 160 is opened, the sample stage 120 is pulled out of the chamber 150, and the glass sample is attached to the sample stage 120. Next, the tilt angle of the glass sample is adjusted using the tilt mechanism 20, and the irradiation angle α of the ion beam IB is set to the irradiation angle set as a processing condition. Next, the glass sample is aligned by operating the XY stage 28 while observing the glass sample with the alignment camera 130 so that the glass sample is positioned at the irradiation position of the ion beam IB.

[0056] Next, as shown in Figure 1, the chamber door 160 is closed and the sample stage 120 is pushed into the chamber 150. Next, the chamber 150 is evacuated. Next, the energy (acceleration voltage) of the ion beam IB is set, and the glass sample is irradiated with the ion beam IB. At this time, the rotation mechanism 22 and swing mechanism 24 are not operated, and the glass sample is kept stationary.

[0057] Next, the glass sample irradiated with the ion beam IB is photographed by the processing and observation camera 140. This makes it possible to acquire an ion beam image. At this time, the current of the ion beam IB is measured.

[0058] The captured ion beam image is an image captured from an oblique direction corresponding to the tilt angle of the glass sample relative to the surface of the glass sample. Therefore, the captured ion beam image is enlarged at a magnification rate according to the tilt angle so that it becomes an image captured from a direction perpendicular to the surface of the glass sample. As a result, the ion beam image becomes an image captured from a direction perpendicular to the surface of the glass sample. The ion beam image is, for example, a grayscale image in which the brightness of each pixel corresponds to the irradiation intensity of the ion beam IB.

[0059] Figure 7 shows ion beam image Ia before correction and ion beam image Ib after correction. Ion beam image Ia was captured by tilting the glass sample by 80°. Here, since 1 / sin(80°) = 1.0154, ion beam image Ia is stretched by 1.0154 times in the vertical direction, which corresponds to the tilt direction of the glass sample. This allows ion beam image Ib to be obtained.

[0060] 1.2.3. Step S30 for generating predicted images at each time (1) First time Next, a predicted image at a first time point is generated. The first time point is the time point when processing starts. Figures 8 and 9 are diagrams for explaining the process of generating a predicted image at the first time point.

[0061] First, as shown in Fig. 8, an ion beam image Ib is placed at a position a distance B between the set rotation center RC and the center BC of the ion beam IB, and an irradiation intensity distribution image Ib-1 at a first time is generated. The irradiation intensity distribution image Ib-1 at the first time is an image showing the distribution of the irradiation intensity of the ion beam IB at the first time. In the irradiation intensity distribution image Ib-1 shown in Fig. 8, the irradiation intensity of the ion beam IB is represented by brightness.

[0062] Next, for each pixel of the irradiation intensity distribution image Ib-1 at the first time, vector component decomposition is performed, and a radial component image Ir-1 showing the intensity distribution of the radial component of the ion beam IB is obtained. A rotational component image In-1 is generated, which shows the intensity distribution of the component in the rotational direction of the on-beam IB.

[0063] Specifically, first, at each pixel of the irradiation intensity distribution image Ib-1, the luminance S el The vector whose length is the size of the ion beam IB and whose direction is the irradiation direction of the ion beam IB is the center of rotation RC, and the radial component S el cosξ and the rotational component S el sinξ. Here, angle ξ is the angle between the radial direction and the irradiation direction of the ion beam at each pixel. In Figure 9, the irradiation direction of the ion beam IB is indicated by arrow C. From the radial direction component of each pixel obtained in this way, a radial component image Ir-1 is generated, in which the magnitude of the radial direction component is expressed as brightness. Also, from the rotational direction component of each pixel, a rotational component image In-1 is generated, in which the magnitude of the rotational direction component is expressed as brightness.

[0064] Next, the radial component image Ir-1 and the rotational component image In-1 are superimposed to generate a vector component distribution image Irn-1 that indicates the distribution of the irradiation intensity in the radial direction and the rotational direction of the ion beam at time 1. Specifically, for each corresponding pixel in the radial component image Ir-1 and the rotational component image In-1, the brightness values are added together, with the radial direction being positive and the rotational direction being negative.

[0065] For example, if the radial component image Ir-1 and the rotational component image In-1 are both 256-level images, and these are added with the radial direction as plus and the rotational direction as minus, a 512-level image is generated. When this 512-level image is output as a 256-level image, the brightness equivalent to zero is set to the intermediate 128th level, and then normalized to the larger absolute value of the maximum and minimum values.

[0066] As a result, in the vector component distribution image Irn-1, areas brighter than intermediate colors indicate high ion beam intensity in the radial direction, and areas darker than intermediate colors indicate high ion beam intensity in the rotational direction. In this way, the irradiation intensity of the ion beam IB in the radial direction and the rotational direction can be visualized. In the vector component distribution image Irn-1, areas brighter than intermediate colors are likely to produce radial processing streaks, and areas darker than intermediate colors are likely to produce rotational processing streaks.

[0067] In this way, an illumination intensity distribution image Ib-1 and a vector component distribution image Irn-1 can be generated as predicted images at the first time point.

[0068] (2)Second time (2-1) Ion beam irradiation position (swing) Next, at a second time, the irradiation position of the ion beam IB moved by the swing of the sample S, i.e., the position of the center BC, is determined. The second time is a time after the first time. The second time is, for example, one second after the first time.

[0069] FIG. 10 is a diagram for explaining a method for calculating the irradiation position of the ion beam IB that has moved due to the swing of the sample at the second time.

[0070] First, the rotation angle β of the ion beam IB rotated by swinging the sample S between the first time and the second time is calculated. The rotation angle β can be calculated from the swing speed, the swing angle, and the elapsed time.

[0071] Next, the coordinates (x1, y1) of the center BC of the ion beam IB at the second time are calculated using the rotation angle β of the ion beam due to the swing, the distance D between the swing center SC and the rotation center RC, and the distance B between the rotation center RC and the center BC, and the calculation result is converted into a polar coordinate system to obtain the coordinates (r, θ1). The coordinates (r, θ1) of the center BC can be calculated using the following formula: can be done.

[0072] x1=(D+B)sinβ y1=D-(D+B)cosβ r=(x1 2 +y1 2 ) 1 / 2 θ1=tan -1 (y1 / x1) Using these calculation formulas, the coordinates (r, θ1) of the center BC of the ion beam IB moved by the swing at the second time are calculated.

[0073] (2-2) Ion beam irradiation position (rotation) at the second time Next, the irradiation position of the ion beam IB moved by the rotation at the second time is calculated. Fig. 11 is a diagram for explaining a method for calculating the irradiation position of the ion beam IB moved by the rotation of the sample at the second time.

[0074] First, the rotation angle γ of the ion beam IB rotated by rotating the sample S between the first time and the second time is determined. The rotation angle γ can be determined from the rotation speed and the elapsed time.

[0075] Next, the coordinates (x2, y2) of the center BC of the ion beam IB at the second time are calculated. First, the rotation angle γ is added to the angle θ1 to obtain the coordinates of the center BC (r, θ2), and then the coordinates (r, θ2) are converted to Cartesian coordinates (x2, y2). The rotation angle φ of the ion beam IB at the second time can be calculated by adding the rotation angles β and γ. The coordinates (x2, y2) of the center BC can be calculated using the following formula.

[0076] r=(x2 2 +y2 2 ) 1 / 2 θ2=θ1+γ φ=β+γ Using these calculation formulas, the coordinates (x2, y2) of the center BC of the ion beam IB at the second time are obtained.

[0077] (2-3) Decomposition of vector components Next, an ion beam image Ib is placed at the coordinates (x2, y2) of the center BC of the ion beam IB to generate an irradiation intensity distribution image Ib-2 at the second time. Next, vector component decomposition is performed for each pixel of the irradiation intensity distribution image Ib-2 at the second time to generate a radial component image Ir-2 and a rotational component image In-2 at the second time.

[0078] FIG. 12 is a diagram for explaining the component decomposition of a vector.

[0079] At the pixel at coordinates (x3, y3), the luminance S el A vector whose length is the size of the vector and whose direction is the direction of irradiation of the ion beam IB is separated into a radial component Sr and a rotational component Sn centered on the rotation center RC. At the second time, the radial component Sr and the rotational component Sn at the pixel with coordinates (x3, y3) can be calculated using the following formulas.

[0080] Ψ=tan -1 (y3 / x3) ξ=Ψ+(π / 2-φ) Sr=|S el cosξ| Sn=|S el sinξ| Using the above formula, the radial component Sr and rotational component Sn can be calculated at the coordinates (x3, y3). Similarly, for other pixels in the irradiation intensity distribution image Ib-2, the radial component Sr and rotational component Sn can be calculated using the above formula. This allows the generation of a radial component image Ir-2 and a rotational component image In-2.

[0081] Next, the radial component image Ir-2 and the rotational component image In-2 are superimposed to generate a vector component distribution image Irn-2 that indicates the distribution of the radial and rotational irradiation intensities of the ion beam at time instant 2. In this way, an irradiation intensity distribution image Ib-2 and a vector component distribution image Irn-2 can be generated as predicted images at time instant 2.

[0082] For each time from the second time onwards until the end of the processing time, an irradiation intensity distribution image and a vector component distribution image are generated in the same manner as for the second time.

[0083] 1.2.4. Addition process S40 of predicted images at each time The irradiation intensity distribution images at each time from the first time to the nth time after the processing time has elapsed are added together to generate an irradiation intensity distribution image showing the distribution of the irradiation intensity of the ion beam IB after the set processing time has elapsed. Specifically, the brightness values of each corresponding pixel in the irradiation intensity distribution images from the first time to the nth time are added together to generate the irradiation intensity distribution image after the set processing time has elapsed. Figure 13 shows an image showing the irradiation intensity distribution images from the first time to the ninth time superimposed. The interval between each time is 1 second.

[0084] Similarly, the vector component distribution images at each time from the first time to the nth time are added together to generate a vector component distribution image showing the distribution of the irradiation intensity in the radial direction and the distribution of the irradiation intensity in the rotational direction of the ion beam IB after the set processing time has elapsed.

[0085] Through the above steps, an irradiation intensity distribution image and a vector component distribution image can be generated as predicted images when the sample S is processed under the set processing conditions.

[0086] 1.3. Predicted Image 1.3.1. Irradiation intensity distribution image Fig. 14 is a diagram showing an irradiation intensity distribution image showing the distribution of the irradiation intensity of the ion beam IB on the sample S when the sample S is processed under the set processing conditions. Fig. 14 shows four irradiation intensity distribution images generated by changing the processing conditions.

[0087] Specifically, Fig. 14 shows an irradiation intensity distribution image obtained under processing conditions in which the irradiation angle α of the ion beam IB is 80° and there is no swing, an irradiation intensity distribution image obtained under processing conditions in which the irradiation angle α is 80° and the swing angle is -30° to +30°, an irradiation intensity distribution image obtained under processing conditions in which the irradiation angle α is 85° and there is no swing, and an irradiation intensity distribution image obtained under processing conditions in which the irradiation angle α is 85° and the swing angle is -30° to +30°. The other processing conditions are the same for each irradiation intensity distribution image. Note that the brightness in each irradiation intensity distribution image shown in Fig. 14 is normalized by the maximum brightness.

[0088] Fig. 15 is a graph showing the brightness profile of each irradiation intensity distribution image. The four brightness profiles shown in Fig. 15 are brightness profiles on the center line of each irradiation intensity distribution image shown in Fig. 14. In each brightness profile shown in Fig. 15, the current value of the ion beam is normalized by the total brightness of the irradiation intensity distribution image to convert it into a current density, and then multiplied by a coefficient representing the component of the ion beam irradiated at an irradiation angle α in the depth direction of the sample. In other words, the vertical axis of the graph shown in Fig. 15 corresponds to the processing depth.

[0089] The four irradiation intensity distribution images shown in Figure 14 and the four brightness profiles shown in Figure 15 show that by swinging the sample S, a wider, smooth area can be formed near the center of the sample S compared to when it is not swung.

[0090] 1.3.2. Vector component distribution image Fig. 16 is a diagram showing vector component distribution images showing the distribution of the irradiation intensity in the radial direction and the irradiation intensity in the rotational direction of the ion beam IB on the sample S when the sample S is processed under set processing conditions. Fig. 16 shows four vector component distribution images generated by changing the processing conditions.

[0091] In each vector component distribution image shown in Fig. 16, brightness is normalized by the maximum brightness. In each vector component distribution image shown in Fig. 16, areas brighter than the intermediate color indicate high ion beam irradiation intensity in the radial direction, and areas darker than the intermediate color indicate high ion beam irradiation intensity in the rotational direction. In other words, areas brighter than the intermediate color are more likely to develop radial processing streaks, and areas darker than the intermediate color are more likely to develop rotational processing streaks.

[0092] Fig. 17 is a graph showing the brightness profile of each vector component distribution image. The four brightness profiles shown in Fig. 17 are brightness profiles on the center line of each vector component distribution image shown in Fig. 16. In each brightness profile shown in Fig. 17, a positive intensity on the vertical axis indicates a high ion beam irradiation intensity in the radial direction, and a negative intensity on the vertical axis indicates a high ion beam irradiation intensity in the rotational direction. In other words, a positive intensity indicates a high likelihood of radial processing streaks, and a negative intensity indicates a high likelihood of rotational processing streaks.

[0093] From the four vector component distribution images shown in Fig. 16 and the four brightness profiles shown in Fig. 17, when the sample S is not swung, the area formed near the center of the sample S where the ion beam is irradiated from both the rotational and radial directions is narrow, and the irradiation intensity of the ion beam in the radial direction is high in areas other than near the center. In other words, when the sample S is not swung, the area near the center of the sample S where processing streaks are unlikely to occur is narrow, and processing streaks in the radial direction are likely to occur in areas other than near the center.

[0094] In contrast, when the sample S is swung, a wider area is formed near the center of the sample S and is irradiated with the ion beam from both the rotational and radial directions, compared to when the sample S is not swung, and the ion beam intensity is weaker in both the radial and rotational directions in areas other than near the center. In other words, when the sample S is swung, a wider, smooth area with less influence of processing streaks can be formed near the center of the sample S, compared to when the sample S is not swung.

[0095] 1.3.3. Display method 16, the distribution of the irradiation direction of the ion beam IB is expressed by making the irradiation intensity of the ion beam IB in the radial direction brighter than the neutral color and making the irradiation intensity of the ion beam IB in the rotational direction darker than the neutral color. Note that the way of expressing the distribution of the irradiation direction of the ion beam IB is not limited to this.

[0096] For example, the distribution of the irradiation direction of the ion beam IB may be represented by color. Specifically, the irradiation intensity in the radial direction may be represented by cyan (green + blue), and the irradiation intensity in the rotational direction may be represented by red. In this display method, when the irradiation intensity in the radial direction and the irradiation intensity in the rotational direction are the same, the saturation disappears and the image becomes grayscale, so that the same information as the irradiation intensity distribution image can be displayed in the vector component distribution image. In other words, in this display method, the intensity distribution and the distribution of the irradiation direction of the ion beam IB can be displayed in a single image. Note that the color combination is not limited to cyan and red, but may be a combination of magenta (red + blue) and green, or a combination of yellow (red + green) and blue.

[0097] 1.3.4. Correction of predicted images 15, the brightness of the irradiation intensity distribution image is corrected by coefficients corresponding to the current density and irradiation angle, but the brightness of the irradiation intensity distribution image may also be corrected by the processing depth of a sample actually processed under the same processing conditions to create a brightness profile. This allows the vertical axis of the brightness profile to be represented by the processing depth.

[0098] Furthermore, since the milling rate differs depending on the energy of the ion beam and the material constituting the sample, the brightness of the irradiation intensity distribution image may be corrected according to the processing conditions and sample set by the user.

[0099] 1.4. Display In the image generating device 200, the display control unit 214 displays the predicted image on the display unit 230. The display control unit 214 displays the predicted image in the predicted image display section G6 of the GUI screen 4 shown in FIG.

[0100] Fig. 18 is a diagram for explaining an example of a method for displaying a predicted image. As shown in Fig. 18, an image of the sample S before processing and a vector component distribution image are displayed superimposed on each other. Furthermore, the position indicated by the horizontal axis of the brightness profile is displayed in accordance with the position of the image of the sample S. The image of the sample S before processing is an image captured by, for example, the alignment camera 130 or the processing and observation camera 140.

[0101] In the example shown in Fig. 18, the vertical axis of the brightness profile is converted into processing depth. In addition, the brightness profile shown in Fig. 18 displays the processing depth profile and the profile of the radial component.

[0102] Fig. 19 is a diagram for explaining an example of a method for displaying a predicted image. In the example shown in Fig. 19, an image of the sample S before processing and the left half of the vector component distribution image are displayed superimposed on each other.

[0103] Fig. 20 is a diagram for explaining an example of a method for displaying a predicted image. In the example shown in Fig. 20, an image of the processed sample S and a vector component distribution image are displayed superimposed on each other. In the example shown in Fig. 20, the image of the processed sample S and the left half of the vector component distribution image are displayed superimposed on each other. Furthermore, a brightness profile is displayed with the position indicated by the horizontal axis of the brightness profile aligned with the position of the image of the sample S.

[0104] Fig. 21 is a diagram for explaining an example of a method for displaying a predicted image. In the example shown in Fig. 21, the brightness of the irradiation intensity distribution image is corrected to the processing depth, and is displayed as a three-dimensional graph showing the position on the sample S and the processing depth at that position.

[0105] Fig. 22 is a diagram for explaining an example of a method for displaying a predicted image. In the example shown in Fig. 22, both an image of the sample S before processing and a vector component distribution image are displayed superimposed on each other, and a three-dimensional graph showing positions on the sample S and the processing depth at those positions are displayed.

[0106] 1.5. Image generation process FIG. 23 is a flowchart showing an example of the image generation process of the image generation device 200.

[0107] First, the image generation unit 212 acquires information on the set processing conditions (S100). The processing conditions are set, for example, by inputting the processing conditions into the GUI screen 4. The image generation unit 212 acquires information on the processing conditions input by the user into the GUI screen 4 via the input unit 220. Note that the image generation unit 212 may acquire information on the processing conditions from the control unit 170.

[0108] The processing conditions are the energy of the ion beam IB (acceleration voltage of the ion beam), The processing conditions include the irradiation angle α of the ion beam IB, the rotation speed of the sample S, the swing angle range of the sample S, the swing speed of the sample S, the distance B between the rotation center RC of the sample S and the center BC of the ion beam IB, the distance D between the rotation center RC of the sample S and the swing center SC, and the processing time. The processing condition information is stored in the memory unit 240.

[0109] Next, the image generation unit 212 acquires information about the ion beam IB (S102). The image generation unit 212 acquires, for example, an ion beam image Ib shown in Fig. 6 as information about the ion beam IB. The ion beam image Ib is stored in the storage unit 240, for example.

[0110] Next, the image generation unit 212 generates a predicted image at the first time based on the processing conditions and information on the ion beam IB (S104). The image generation unit 212 generates an irradiation intensity distribution image Ib-1 and a vector component distribution image Irn-1 as predicted images at the first time by the method described in step S30 above.

[0111] Next, the image generation unit 212 generates a predicted image at the mth time point based on the processing conditions (S106). Here, m=2, and the image generation unit 212 generates a predicted image at the second time point. The image generation unit 212 generates an illumination intensity distribution image Ib-2 and a vector component distribution image Irn-2 as predicted images at the second time point using the method described in step S30 above.

[0112] Next, the image generation unit 212 adds together the predicted image at the first time and the predicted image at the second time (S108). Specifically, the image generation unit 212 adds together the irradiation intensity distribution image Ib-1 and the irradiation intensity distribution image Ib-2, and adds together the vector component distribution image Irn-1 and the vector component distribution image Irn-2. This allows the generation of a predicted image when processed from the first time to the second time.

[0113] Next, the image generating unit 212 determines whether or not a predicted image at the nth time has been generated (S110).

[0114] If the image generation unit 212 determines that a predicted image at the nth time has not been generated (No in S110), it sets m=2+1=3, returns to process S106, and generates a predicted image at the third time (S106). Then, the image generation unit 212 adds the predicted image at the third time to the predicted image obtained when processing from the first time to the second time (S108). This allows the generation of a predicted image obtained when processing from the first time to the third time.

[0115] The image generation unit 212 repeats the process of generating a predicted image at the mth time (S106), the process of adding the predicted image at the mth time and the predicted image processed from the 1st time to the m-1th time (S108), and the process of determining whether or not the predicted image at the nth time has been generated (S110), until it generates a predicted image at the nth time.

[0116] When it is determined that the image generation unit 212 has generated a predicted image at the nth time (Yes in S110), the display control unit 214 causes the display unit 230 to display the generated predicted image. The display control unit 214 causes the predicted image display section G6 of the GUI screen 4 to display the predicted image in one of the display methods shown in FIGS. 14 to 22 described above. Note that the display control unit 214 may cause the display unit 230 to display the predicted image in a display method selected by the user from the display methods shown in FIGS. 14 to 22.

[0117] By the above processing, it is possible to display a predicted image of the sample when it is processed under the set processing conditions.

[0118] Effects The sample processing system 2 includes a sample processing device 100 that processes the sample S by irradiating the sample S with an ion beam IB, and an image generating device 200 that generates a predicted image when the sample S is processed under set processing conditions using the sample processing device 100. Therefore, the sample processing system 2 can obtain a predicted image when the sample S is processed under the set processing conditions, making it easy to determine appropriate processing conditions.

[0119] Furthermore, in the sample processing system 2, the generated predicted image includes information on the distribution of the irradiation direction of the ion beam IB. Therefore, it is possible to predict in which region and in which direction processing streaks will be formed in the sample S by processing. For example, in a region of the sample S that is irradiated with the ion beam IB from only one direction, processing streaks may be formed along the irradiation direction of the ion beam IB.

[0120] In the sample processing system 2, the sample processing device 100 includes an ion source 110 that irradiates the sample S with an ion beam IB, and a sample stage 120 that has a tilt mechanism 20 that tilts the sample S and a rotation mechanism 22 that rotates the sample S, and the processing conditions include the tilt angle and rotation speed of the sample S. Therefore, the sample processing system 2 can generate a predicted image that takes the tilt angle and rotation speed into consideration, so that the tilt angle conditions of the sample S and the rotation speed conditions of the sample S can be easily determined.

[0121] In the sample processing system 2, the sample stage 120 has a swing mechanism 24 that swings the sample S, and the swing center SC of the sample S and the rotation center RC of the sample S are located at different positions, and the processing conditions include the distance D between the rotation center RC and the swing center SC. Therefore, in the sample processing system 2, the sample S can be swung while being rotated, so that the area on the surface Sa of the sample S that is irradiated with the ion beam IB can be expanded. Furthermore, the area on the surface Sa of the sample S that is irradiated with the ion beam IB from multiple directions can be expanded. Furthermore, in the sample processing system 2, a predicted image that takes the distance D into consideration can be generated, so the conditions for the distance D can be easily determined.

[0122] Furthermore, in the sample processing system 2, the distance D between the rotation center RC of the sample S and the swing center SC of the sample S is variable. Since the sample processing system 2 can generate a predicted image that takes the distance D into consideration, the conditions for the distance D can be easily determined.

[0123] In the sample processing system 2, the distance between the center BC of the ion beam IB on the sample S and the center of rotation RC of the sample S is variable, and the processing conditions include the distance B between the center BC and the center of rotation RC. Therefore, in the sample processing system 2, it is possible to widen the area on the surface Sa of the sample S that is irradiated with the ion beam IB. Furthermore, since the sample processing system 2 can generate a predicted image that takes the distance B into consideration, the conditions for the distance B can be easily determined.

[0124] In the sample processing system 2, the image generating device 200 calculates the irradiation direction of the ion beam IB at each time during processing based on the processing conditions, and generates a predicted image based on the irradiation direction of the ion beam IB at each time. Therefore, the sample processing system 2 can generate a predicted image including information on the distribution of the irradiation direction of the ion beam IB.

[0125] In the sample processing system 2, the image generating device 200 separates a vector representing the irradiation direction and irradiation intensity of the ion beam IB into a radial component and a rotational component centered on the rotation center RC of the sample S at each time. Furthermore, the image generating device 200 generates a predicted image including information on the distribution of the intensity of the ion beam IB in the radial direction and information on the distribution of the intensity of the ion beam IB in the rotational direction based on the radial component at each time and the rotational component at each time. Therefore, in the sample processing system 2, it is possible to distinguish from the predicted image the areas on the surface Sa of the sample S where radial processing streaks are likely to occur and the areas in the rotational direction where radial processing streaks are likely to occur. It is possible to know the areas where processing streaks are likely to occur.

[0126] In the sample processing system 2, the image generating device 200 displays the predicted image superimposed on the image of the sample S before processing. Therefore, the sample processing system 2 can clearly display which area of the sample S will be processed and how.

[0127] In the sample processing system 2, the image generating device 200 represents the irradiation direction of the ion beam in a color in the predicted image. Therefore, the image generating device 200 can easily display the distribution of the irradiation direction of the ion beam in the predicted image.

[0128] In the sample processing system 2, the predicted image includes information on the distribution of the irradiation intensity of the ion beam. Therefore, the sample processing system 2 can know which region of the sample S will be processed and to what depth when the sample S is processed under the set processing conditions.

[0129] In the sample processing system 2, the predicted image includes information on the distribution of irradiation intensity of the ion beam IB in the radial direction around the rotation center RC of the sample S, and information on the distribution of irradiation intensity of the ion beam IB in the rotation direction around the rotation center RC of the sample S. Therefore, in the sample processing system 2, when the sample S is processed under the set processing conditions, it is possible to know the areas on the surface Sa of the sample S where radial processing streaks are likely to occur and the areas where rotational processing streaks are likely to occur.

[0130] The image generating device 200 includes an image generating unit 212 that generates a predicted image of the sample S when it is processed under set processing conditions using the sample processing device 100 that processes the sample S by irradiating the sample S with an ion beam, and a display control unit 214 that displays the predicted image. The predicted image also includes information on the distribution of the irradiation direction of the ion beam IB. Therefore, the image generating device 200 can generate a predicted image of the sample S when it is processed under the set processing conditions, making it easy to determine the processing conditions.

[0131] The image generation method in the sample processing system 2 includes the steps of generating a predicted image of the sample S when it is processed under set processing conditions using a sample processing device 100 that processes the sample S by irradiating the sample S with an ion beam IB, and displaying the predicted image. The predicted image also includes information on the distribution of the irradiation direction of the ion beam IB. Therefore, the image generation method in the sample processing system 2 can obtain a predicted image of the sample S when it is processed under the set processing conditions, making it easy to determine appropriate processing conditions.

[0132] 2. Second embodiment Next, a sample processing system according to a second embodiment will be described with reference to the drawings. Figure 24 is a diagram showing the configuration of an ion source 110 of the sample processing system according to the second embodiment. In the sample processing system according to the second embodiment, components having the same functions as those of the sample processing system 2 according to the first embodiment will be given the same reference numerals, and detailed description thereof will be omitted.

[0133] The ion source 110 is a Penning type ion source, and includes an anode 11, a cathode 12, an extraction electrode 13, and a focus electrode 14, as shown in FIG.

[0134] The anode 11 is cylindrical. The space inside the anode 11 serves as an ionization chamber for generating ions. Although not shown, gas is introduced into the ionization chamber from a gas supply unit. The gas introduced into the ionization chamber is, for example, argon gas.

[0135] The cathode 12 emits electrons. The cathode 12 also constitutes a pole piece that generates a magnetic field in the ionization chamber. The electrons emitted from the cathode 12 undergo a circular motion due to the magnetic field generated by the pole piece. A discharge voltage is applied between the anode 11 and the cathode 12 to cause a discharge.

[0136] The extraction electrode 13 extracts the ions generated in the ionization chamber. The ions are accelerated by the electric field created by the extraction electrode 13 and are emitted as an ion beam IB from the ion source 110. An acceleration voltage for accelerating the ions is applied between the anode 11 and the extraction electrode 13.

[0137] The focus electrode 14 is disposed between the cathode 12 and the extraction electrode 13. The focus electrode 14 is an electrode for controlling the spatial profile of the ion beam IB. Here, the spatial profile of the ion beam IB refers to the spatial intensity distribution of the ion beam IB.

[0138] In the ion source 110, an ion beam IB with uniform intensity can be obtained by controlling the focus voltage applied to the focus electrode 14. That is, the ion source 110 can emit an ion beam IB with a spatial profile close to that of a parallel beam.

[0139] In the sample processing system 2, the processing conditions include a discharge voltage, a focus voltage, and a flow rate of the gas introduced into the ionization chamber.

[0140] FIG. 25 is an example of a predicted image generated by the sample processing system 2 according to the second embodiment.

[0141] The ion source 110 can obtain an ion beam IB with uniform intensity, so that as shown in FIG. 25, a wide area in the center of the sample S can be flattened and a wide range can be milled.

[0142] FIG. 26 is a diagram showing a schematic diagram of a sample S having a layered structure after plane milling. When the sample S is plane milled, flat milled regions and tapered milled regions are formed in the sample S. Regions A and A' shown in FIG. 26 are milled flat. In contrast, regions B and B' are milled tapered. Regions B and B' have different taper angles, and therefore obtain different amounts of information. Specifically, the taper angle of region B' is smaller than that of region B, so the state of each layer can be confirmed.

[0143] FIG. 27 is an example of a predicted image generated by the sample processing system 2 according to the second embodiment.

[0144] FIG. 27 shows luminance profiles P1, P2, P3, and P4. The luminance profile P1 is a luminance profile obtained under the processing conditions of using the focus electrode 14 to make the intensity of the ion beam IB uniform, setting the irradiation angle α of the ion beam IB to 80°, and not swinging. The luminance profile P2 is a luminance profile obtained under the processing conditions of using the focus electrode 14 to make the intensity of the ion beam IB uniform, setting the irradiation angle α of the ion beam IB to 80°, and setting the swing angle to −30° to +30°. The luminance profile P3 is a comparative example obtained under the processing conditions of using no focus electrode, setting the irradiation angle α of the ion beam IB to 80°, and not swinging. The luminance profile P4 is a comparative example obtained under the processing conditions of using no focus electrode, setting the irradiation angle α of the ion beam IB to 80°, and setting the swing angle to −30° to +30°.

[0145] The difference in the tapered regions can be seen from the luminance profile shown in Fig. 27. Specifically, it can be seen that under the processing conditions of luminance profile P2, the taper angle becomes smaller as in region B'.

[0146] 3. Third embodiment Next, a sample processing system according to a third embodiment will be described with reference to the drawings. Figures 28 and 29 are diagrams showing the configuration of a sample processing system 2 according to the third embodiment. In the sample processing system according to the third embodiment, components having the same functions as those of the sample processing system 2 according to the first embodiment will be given the same reference numerals, and detailed description thereof will be omitted.

[0147] As shown in FIGS. 28 and 29, the sample processing device 100 includes an ion source moving mechanism 180 that moves the ion source 110 in the Z direction.

[0148] The ion source movement mechanism 180 moves the ion source 110 in the Z direction. By moving the ion source 110 in the Z direction with the ion source movement mechanism 180, the distance between the ion source 110 and the sample S can be adjusted. In FIG. 28, the ion source 110 is moved in the +Z direction, and in FIG. 29, the ion source 110 is moved in the -Z direction.

[0149] 30 is a diagram for explaining the relationship between the distance D between the rotation center RC and swing center SC of the sample S and the irradiation range of the ion beam IB. As shown in FIG. 30, the irradiation range W of the ion beam IB can be increased as the distance D increases.

[0150] However, if the sample S is moved in the −Z direction using the Z stage 26 while the ion source 110 is fixed to increase the distance D, the distance between the ion source 110 and the sample S increases. This reduces the irradiation intensity of the ion beam IB, and the processing rate decreases.

[0151] In the sample processing system 2, when the sample S is moved in the −Z direction by the Z stage 26 to increase the distance D, the ion source 110 can be moved in the −Z direction by the same distance by the ion source moving mechanism 180. This allows the distance D to be increased without changing the distance between the sample S and the ion source 110.

[0152] As described above, in the sample processing system 2, the sample processing device 100 includes the ion source moving mechanism 180 that moves the ion source 110, so that the distance D can be changed without changing the distance between the sample S and the ion source 110.

[0153] 4. Fourth embodiment Next, a sample processing system according to a fourth embodiment will be described with reference to the drawings. Figures 31 and 32 are diagrams showing the configuration of a sample processing system 2 according to the fourth embodiment. Hereinafter, in the sample processing system according to the fourth embodiment, components having the same functions as those of the sample processing system 2 according to the first embodiment will be given the same reference numerals, and detailed description thereof will be omitted.

[0154] In the sample processing system 2 according to the third embodiment described above, as shown in Figures 29 and 30, the sample processing apparatus 100 includes an ion source moving mechanism 180, so that the distance D can be changed without changing the distance between the sample S and the ion source 110.

[0155] In contrast, in the sample processing system 2 according to the fourth embodiment, as shown in FIGS. 31 and 32, the sample processing device 100 includes a swing movement mechanism 190 for moving the swing mechanism 24. Therefore, the distance D can be changed without changing the distance between the sample S and the ion source 110.

[0156] The swing movement mechanism 190 includes the chamber door 160 to which the swing mechanism 24 is attached, and a flange 192 that movably supports the chamber door 160. The flange 192 is fixed to the chamber 150.

[0157] As shown in Figures 31 and 32, the chamber door 160 is movable in the Z direction. For example, by moving the chamber door 160 in the +Z direction, the swing mechanism 24 moves in the +Z direction. This increases the distance D between the rotation center RC and swing center SC of the sample S. At this time, the Z stage 26 is used to move the sample S in the -Z direction by the same distance as the swing mechanism 24. This increases the distance D without changing the distance between the sample S and the ion source 110.

[0158] In this way, since the sample processing system 2 includes the swing movement mechanism 190 that moves the swing mechanism 24, the distance D can be changed without changing the distance between the sample S and the ion source 110.

[0159] 5. Fifth embodiment Next, a sample processing system according to a fifth embodiment will be described with reference to the drawings. Figures 33 and 34 are diagrams showing the configuration of a sample processing system 2 according to the fifth embodiment. Hereinafter, in the sample processing system according to the fifth embodiment, components having the same functions as those of the sample processing system 2 according to the first embodiment will be given the same reference numerals, and detailed description thereof will be omitted.

[0160] 33 and 34, in the sample processing system 2, the swing mechanism 24 includes a swing table 24a and a drive device 24b that swings the swing table 24a. The swing mechanism 24 is disposed in a chamber 150. The swing mechanism 24 is disposed on an XY stage 28.

[0161] The driving device 24b is movable on the XY stage 28, and by moving the driving device 24b, it is possible to move the axis B, which serves as the swing axis. This makes it possible to adjust the distance between the ion source 110 and the axis B. The driving device 24b includes, for example, a vacuum-compatible motor.

[0162] A tilting mechanism 20 is disposed on the swing table 24a, and a rotation mechanism 22 to which a sample S is fixed is disposed on the tilting mechanism 20. The tilting mechanism 20 is configured to be movable in the Y direction on the swing table 24a. By moving the tilting mechanism 20 in the Y direction, the distance between the ion source 110 and the sample S can be adjusted. In the sample processing system 2, the ion source 110 is attached to the side wall on the -Y side within the chamber 150.

[0163] For example, by moving the drive device 24b of the swing mechanism 24 in the -Y direction, the axis B serving as the swing axis is moved in the -Y direction, thereby increasing the distance D between the swing center SC and the rotation center RC. At this time, the XY stage 28 is used to move the sample S in the +Y direction by the same distance as the axis B. This allows the distance D to be increased without changing the distance between the sample S and the ion source 110.

[0164] In this way, in the sample processing system 2, the swing mechanism 24 is movable in the Y direction, so that the distance D can be changed without changing the distance between the sample S and the ion source 110.

[0165] 6. Sixth embodiment 6.1. Sample processing system Next, a sample processing system according to a sixth embodiment will be described with reference to the drawings. The configuration of the sample processing system according to the sixth embodiment is the same as that of the sample processing system 2 according to the first embodiment shown in Figures 1 and 2, and therefore a description thereof will be omitted.

[0166] 6.2. Image Generation Method In the sample processing system 2 according to the first embodiment described above, the image generating device 200 generated, as predicted images, the irradiation intensity distribution images shown in Figures 14 and 15 and the vector component distribution images of the ion beam IB shown in Figures 16 and 17.

[0167] In contrast to this, the image generating device 200 may generate, as a predicted image, an irradiation direction distribution image that shows only the distribution of the irradiation directions of the ion beam IB.

[0168] 35 to 37 are diagrams showing examples of irradiation direction distribution images, each of which shows a diagram for explaining processing conditions and an irradiation direction distribution image.

[0169] Fig. 35 is an irradiation direction distribution image when processing is performed under processing conditions where the center of rotation RC and the center BC of the ion beam IB coincide. Fig. 36 is an irradiation direction distribution image when processing is performed under processing conditions where the center of rotation RC and the center BC of the ion beam IB coincide, but the center of rotation RC and the swing center SC are misaligned. Fig. 37 is an irradiation direction distribution image when processing is performed under processing conditions where the center of rotation RC and the center BC of the ion beam IB are misaligned, and the center of rotation RC and the swing center SC are misaligned.

[0170] From the irradiation direction distribution images shown in Figures 35 to 37, it can be seen that by shifting the rotation center RC and the center BC of the ion beam IB and also by shifting the rotation center RC and the swing center SC, the area irradiated with the ion beam IB from multiple directions can be expanded.

[0171] 6.3. Image generation process The image generation process of the image generation device 200 will be described with reference to the flowchart shown in Fig. 23. The process of generating an irradiation direction distribution image will be described below. Note that the description of the same points as those in the image generation process described above will be omitted.

[0172] First, the image generating unit 212 acquires information on processing conditions (S100).

[0173] Next, the image generation unit 212 acquires information about the ion beam IB (S102). The image generation unit 212 acquires an ion beam image Ib shown in FIG. 7 as information about the ion beam IB. Here, it is sufficient if information about the diameter of the beam can be acquired from the ion beam image Ib. Therefore, if information about the diameter of the ion beam IB can be acquired as a processing condition, it is not necessary to acquire the ion beam image Ib.

[0174] Next, the image generating unit 212 generates an irradiation direction distribution image at the first time as a predicted image at the first time based on the processing conditions and information on the ion beam IB (S104).

[0175] Fig. 38 is a diagram schematically showing an irradiation direction distribution image I-1 at a first time. As shown in Fig. 38, in the irradiation direction distribution image I-1, an arrow indicating the irradiation direction of the ion beam IB at the first time is drawn inside the outline of the ion beam IB. In this way, the irradiation direction distribution image I-1 includes information on the irradiation direction of the ion beam IB but does not include information on the irradiation intensity of the ion beam IB.

[0176] Next, the image generating unit 212 generates an irradiation direction distribution image at the m-th time based on the processing conditions (S106).

[0177] 39 is a diagram schematically illustrating an example of an irradiation direction distribution image I-2 at time 2. The irradiation position and irradiation direction of the ion beam IB at time 2 can be calculated in the same manner as in step S106 in the first embodiment described above.

[0178] Next, the image generation unit 212 adds the irradiation direction distribution image I-1 and the irradiation direction distribution image I-2 together (S108). For example, the irradiation direction distribution image I-1 and the irradiation direction distribution image I-2 are superimposed on each other. Next, the image generation unit 212 determines whether or not a predicted image at the nth time has been generated (S110).

[0179] The image generating unit 212 repeats the process S106 of generating an irradiation direction distribution image at the mth time, the process S108 of adding the irradiation direction distribution image at the mth time and the irradiation direction distribution image processed from the 1st time to the (m-1)th time, and the process S110 of determining whether or not the irradiation direction distribution image at the nth time has been generated, until generating an irradiation direction distribution image at the nth time.

[0180] When it is determined that the image generating unit 212 has generated an irradiation direction distribution image at the nth time (Yes in S110), the display control unit 214 causes the generated irradiation direction distribution image to be displayed on the display unit 230. The display control unit 214 causes the display unit 230 to display an irradiation direction distribution image in which the irradiation directions are represented by arrows, as shown in, for example, Figs. 35 to 37. Note that the method of displaying the irradiation directions is not particularly limited, and for example, the irradiation directions may be represented by colors.

[0181] By the above processing, it is possible to display an irradiation direction distribution image when the sample is processed under the set processing conditions.

[0182] Effects In the sample processing system 2 of the sixth embodiment, the predicted image includes information on the distribution of the irradiation direction of the ion beam IB irradiated during processing, so as with the sample processing system 2 of the first embodiment, it is possible to predict in which area of the sample S and in which direction the processing lines formed in the sample S by processing will occur.

[0183] 7. Other The present invention is not limited to the above-described embodiment, and various modifications can be made within the scope of the present invention.

[0184] In the above-described first to sixth embodiments, the sample processing apparatus 100 has been described as rotating and swinging the sample S, but the operation of the sample processing apparatus 100 is not limited to this. For example, the sample processing apparatus 100 may slide the sample S along one axis perpendicular to the optical axis of the ion beam IB while rotating the sample S. Alternatively, for example, the sample processing apparatus 100 may move the sample S along the X-axis and Y-axis perpendicular to the optical axis of the ion beam IB to scan the surface Sa of the sample S with the ion beam IB.

[0185] The above-described embodiment and modifications are merely examples, and the present invention is not limited to these. For example, the embodiments and modifications can be combined as appropriate.

[0186] The present invention is not limited to the above-described embodiments, and various modifications are possible. For example, the present invention includes a configuration that is substantially the same as the configuration described in the embodiment. A substantially identical configuration means, for example, a configuration that has the same function, method, and result, or a configuration that has the same purpose and effect. The present invention also includes configurations in which non-essential parts of the configurations described in the embodiments are replaced. The present invention also includes configurations that achieve the same effects or purposes as the configurations described in the embodiments. The present invention also includes configurations in which publicly known technology is added to the configurations described in the embodiments. [Explanation of symbols]

[0187] 2...Sample processing system, 4...GUI screen, 6...slider, 8...check box, 11...anode, 12...cathode, 13...extraction electrode, 14...focus electrode, 20...tilt mechanism, 22...rotation mechanism, 24...swing mechanism, 24a...swing table, 24b...driver, 26...Z stage, 28...XY stage, 100...sample processing device, 110...ion source, 112...ion source control circuit, 120...sample stage, 130...alignment camera, 140...processing observation camera, 150...chamber, 160...chamber door, 162...observation window, 170...control unit, 180...ion source movement mechanism, 190...swing movement mechanism, 192...flange, 200...image generation device, 210...processing unit, 212...image generation unit, 214...display control unit, 220...input unit, 230...display unit, 240...storage unit

Claims

1. a sample processing device that processes a sample by irradiating the sample with an ion beam; an image generating device that generates a predicted image when the sample is processed under set processing conditions using the sample processing device; Including, the sample processing device includes a sample stage having a tilting mechanism for tilting the sample and a rotation mechanism for rotating the sample; The image generating device generating a radial component image showing an intensity distribution of a radial component of the ion beam centered on the rotation center of the sample based on the processing conditions; generating a rotational component image showing an intensity distribution of a rotational component of the ion beam around the rotation center of the sample based on the processing conditions; generating the predicted image by adding together the luminance values of the radial component image and the luminance values of the rotational component image, with the luminance values having different signs for each corresponding pixel of the radial component image and the rotational component image; A sample processing system that performs

2. In claim 1, the sample processing device includes an ion source that irradiates the sample with the ion beam; A sample processing system, wherein the processing conditions include a tilt angle of the sample and a rotation speed of the sample.

3. In claim 1, the sample stage has a swing mechanism for swinging the sample, the swing center of the sample and the rotation center of the sample are at different positions; A sample processing system, wherein the processing conditions include a distance between a rotation center of the sample and a swing center of the sample.

4. a sample processing device that processes a sample by irradiating the sample with an ion beam; an image generating device that generates a predicted image when the sample is processed under set processing conditions using the sample processing device; Including, the sample processing device includes a sample stage having a tilting mechanism for tilting the sample, a rotation mechanism for rotating the sample, and a swing mechanism for swinging the sample; the processing conditions include a tilt angle of the sample, a rotation speed of the sample, and a distance between a rotation center of the sample and a swing center of the sample; The image generating device generating an irradiation direction distribution image representing the irradiation direction of the ion beam at each time based on the processing conditions; a process of adding the irradiation direction distribution images at each time to generate the predicted image; A sample processing system that performs

5. In claim 3 or 4, A sample processing system, wherein the distance between the center of rotation of the sample and the center of swing of the sample is variable.

6. In any one of claims 1 to 4, a distance between a center of the ion beam on the sample and a center of rotation of the sample is variable; A sample processing system, wherein the processing conditions include a distance between a center of the ion beam and a center of rotation of the sample.

7. In any one of claims 1 to 3, The image generating device generating the radial component image and the rotational component image at each time during machining based on the machining conditions; a sample processing system that generates the predicted image based on the radial component image and the rotational component image at each of the times;

8. In claim 7, The image generating device At each time, a vector representing the irradiation direction of the ion beam and the irradiation intensity of the ion beam is separated into a component in the radial direction and a component in the rotational direction; A sample processing system that generates the predicted image including information on the distribution of the intensity of the ion beam in the radial direction and information on the distribution of the intensity of the ion beam in the rotational direction based on the radial component at each time and the rotational component at each time.

9. In any one of claims 1 to 4, The image generating device displays the predicted image superimposed on an image of the sample before processing.

10. In any one of claims 1 to 3, A sample processing system, wherein the image generating device represents the irradiation direction of the ion beam in color in the predicted image.

11. an image generating unit that generates a predicted image of a sample when the sample is processed under set processing conditions using a sample processing device that processes the sample by irradiating the sample with an ion beam; a display control unit that displays the predicted image; Including, the sample processing device includes a sample stage having a tilting mechanism for tilting the sample and a rotation mechanism for rotating the sample; The image generation unit generating a radial component image showing an intensity distribution of a radial component of the ion beam centered on the rotation center of the sample based on the processing conditions; generating a rotational component image showing an intensity distribution of a rotational component of the ion beam around the rotation center of the sample based on the processing conditions; generating the predicted image by adding together the luminance values of the radial component image and the luminance values of the rotational component image, with the luminance values having different signs for each corresponding pixel of the radial component image and the rotational component image; An image generating device that performs the above.

12. generating a predicted image of the sample when the sample is processed under set processing conditions using a sample processing device that processes the sample by irradiating the sample with an ion beam; displaying the predicted image; Including, the sample processing device includes a sample stage having a tilting mechanism for tilting the sample and a rotation mechanism for rotating the sample; The step of generating a predicted image includes: generating a radial component image showing an intensity distribution of a radial component of the ion beam centered on the rotation center of the sample based on the processing conditions; generating a rotational component image showing an intensity distribution of a rotational component of the ion beam around a rotation center of the sample based on the processing conditions; generating the predicted image by adding together the luminance values of the radial component image and the luminance values of the rotational component image, with the luminance values having different signs for each corresponding pixel of the radial component image and the rotational component image; An image generation method comprising:

13. an image generating unit that generates a predicted image of a sample when the sample is processed under set processing conditions using a sample processing device that processes the sample by irradiating the sample with an ion beam; a display control unit that displays the predicted image; Including, the sample processing device includes a sample stage having a tilting mechanism for tilting the sample, a rotation mechanism for rotating the sample, and a swing mechanism for swinging the sample; the processing conditions include a tilt angle of the sample, a rotation speed of the sample, and a distance between a rotation center of the sample and a swing center of the sample; The image generation unit generating an irradiation direction distribution image representing the irradiation direction of the ion beam at each time based on the processing conditions; a process of adding the irradiation direction distribution images at each time to generate the predicted image; An image generating device that performs the above.

14. generating a predicted image of the sample when the sample is processed under set processing conditions using a sample processing device that processes the sample by irradiating the sample with an ion beam; displaying the predicted image; Including, the sample processing device includes a sample stage having a tilting mechanism for tilting the sample, a rotation mechanism for rotating the sample, and a swing mechanism for swinging the sample; the processing conditions include a tilt angle of the sample, a rotation speed of the sample, and a distance between a rotation center of the sample and a swing center of the sample; The step of generating a predicted image includes: generating an irradiation direction distribution image representing the irradiation direction of the ion beam at each time based on the processing conditions; adding the illumination direction distribution images at each time to generate the predicted image; An image generation method comprising:

Images