Wiring parts

Abstract

To provide a wiring component in which a covering material is less likely to be damaged or misaligned even when a high capacity of electricity is passed.SOLUTION: A wiring component according to the present invention includes a conductive member having a total extending length of 300 mm or more and a covering member covering the conductive member, the average distance C (average clearance C) between the conductive member and the covering member is 5 mm or less, and the covering member is made of a resin composition containing a polypropylene-based resin, and the secondary shrinkage A (mm) in the extending length direction after heat aging at 150°C for 24 hours of the covering member satisfies the equation (1).SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a wiring component. [Background technology]

[0002] Metallic wiring components are sometimes used in wiring within electrical equipment, such as battery packs that connect multiple batteries used in emergency power supply equipment, for the purpose of connecting battery terminals, etc. These wiring components are often covered with insulating resin to prevent the risk of short circuits caused by contact with metallic tools during work (see Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2003-86167 Summary of the Invention [Problem to be solved by the invention]

[0004] In recent years, electrical equipment has become larger and larger in capacity, and the wiring components used inside such equipment have become longer. When a large amount of electricity flows through a long wiring component, it generates heat, causing the resin covering to thermally shrink, which can cause the resin covering to crack or become displaced. SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a wiring component in which the covering material is less likely to be damaged or displaced even when a high volume of electricity is passed through it. [Means for solving the problem]

[0005] That is, the present invention is as follows. [1] A wiring component including conductive members having a total extension length of 300 mm or more and a covering member that covers the conductive members, the conductive member penetrates the covering member from one end to the other end in the extending direction of the covering member, the extending direction is a direction along the surface of the conductive member from one end to the other end of the conductive member, the average distance C between the conductive member and the covering member (average clearance C) is 5 mm or less; the covering member is made of a resin composition containing a polypropylene-based resin and a polyphenylene ether-based resin, Secondary shrinkage A in the extended length direction of the coated member after heat aging at 150°C for 24 hours (%) is expressed by the following equation (1): A<9.6×e -0.93t ···(1) (In equation (1), e is the base of the natural logarithm, t is The covering member Thickness (mm) Fulfilling the covering member covers the conductive member such that the extending length direction during the secondary shrinkage A is the length direction along the surface of the conductive member from one end to the other end of the conductive member. A wiring component characterized by 。 [2] The covering member is Copper foil Sandwich It is a material that does not break after being embedded in a material and heat aged at 150°C for 1000 hours. ] Wiring components listed. [3] The conductive member is a bus bar. [1] or [2] The wiring component described in [4] [1] ~ The Vicat softening point of the resin composition is 130°C or higher. [3] 10. The wiring component according to claim 9, wherein [5] a step of manufacturing a covering member that covers the conductive member by injection molding; The mold temperature during the injection molding is 50 to 90°C. The method for manufacturing a wiring component according to any one of [1] to [4], [Effects of the Invention]

[0006] The wiring component of the present invention, having the above-described configuration, is less likely to be damaged or displaced even when a large amount of electricity is passed through it, and is less likely to suffer metal deterioration of the coating material due to contact with conductive members. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 2 is a perspective view showing a part of a wiring component according to an example of the present embodiment. [Figure 2] 1A and 1B are cross-sectional views of an example of a wiring component according to the present embodiment taken along a plane perpendicular to its extending direction (a plane along line BB shown in FIG. 1 ), and a cross-sectional view of an example of a wiring component according to the present embodiment taken along a plane along its extending direction (a plane along line AA shown in FIG. 1 ). [Figure 3] 1A and 1B are cross-sectional views of a wiring component according to another example of the present embodiment, taken along a plane perpendicular to the direction of extension thereof; [Figure 4] 1A is a perspective view showing a part of a wiring component according to a first modified example of the present embodiment, FIG. 1B is a perspective view showing a part of a wiring component according to a second modified example of the present embodiment, and FIG. 1C is a perspective view showing a part of a wiring component according to a third modified example of the present embodiment. [Figure 5] FIG. 13 is a schematic view of the wiring component of Example 8 after fitting and connection. DETAILED DESCRIPTION OF THE INVENTION

[0008] Hereinafter, a mode for carrying out the present invention (hereinafter referred to as "the present embodiment") will be described in detail. The present invention is not limited to the following embodiment, and various modifications can be made within the scope of the gist thereof.

[0009] [Wiring parts] The wiring component of this embodiment is a wiring component including conductive members having a total extension length of 300 mm or more and a covering member covering the conductive members, wherein the average distance C between the conductive members and the covering member (average clearance C) is 5 mm or less, the covering member is made of a resin composition containing a polypropylene-based resin, and the secondary shrinkage A (mm) of the covering member in the extension direction after heat aging at 150°C for 24 hours satisfies the following formula (1): A<9.6×e -0.93t ···(1) (In formula (1), e is the base of the natural logarithm, and t is the thickness (mm)) The extending direction may be a direction along the surface of the conductive member from one end to the other end of the conductive member.

[0010] 1 shows an example of a wiring component 1 according to this embodiment. A conductive member 2 is at least partially covered with a covering member 3. In the wiring component 1 of this embodiment, at least a portion of one conductive member 2 may be covered with a covering member 3, or at least a portion of multiple conductive members 2 may be covered with a covering member 3. In the wiring component 1 of this embodiment, the conductive member 2 may penetrate from one end of the covering member 3 to the other end in the extending direction. Furthermore, the input and output portions of the conductive member 2 may be exposed and not covered by the covering member 3 (FIGS. 1 and 4). For example, if the conductive member is structured to extend from the input portion to the output portion, the input portion side may be one end and the output portion side may be the other end. The covering member 3 may be provided so as not to contact the conductive member 2 (Figures 2A and 3A), so as to contact only a portion of the conductive member 2 (Figure 3B), or so as to contact the entire periphery of the conductive member. The wiring component 1 of this embodiment may be straight (FIGS. 1 to 3), or may have at least one bent portion (preferably two or more bent portions) (FIG. 4). The conductive member 2 and the covering member 3 may have the same thickness in the extension direction (FIGS. 1 and 4), or may have different thicknesses. Furthermore, the distance C between the conductive member 2 and the covering member may be constant or may vary. In the wiring component 1 of this embodiment, the conductive member 2 and the covering member 3 covering the conductive member 2 may be further covered with another covering material.

[0011] In the wiring component of this embodiment, the thickness of the covering member is preferably 0.4 to 2.5 mm, more preferably 0.6 to 2.0 mm, and even more preferably 0.8 to 1.5 mm, from the viewpoint of achieving both electrical conductivity and leakage prevention properties as well as space saving and weight reduction. The thickness of the covering member can be measured by the method described in the Examples below.

[0012] The secondary shrinkage A (mm) of the above-mentioned covering member in the elongated length direction after heat aging at 150°C for 24 hours is set to 9.6 x e from the viewpoint of making the covering member less susceptible to breakage or displacement when a high capacity current is passed through it. -0.93t It is preferable that the thickness is less than 9.0×e mm, and more preferably less than 9.0×e -1.1t It is less than mm. The secondary shrinkage A in the extending direction of the covering member can be measured by the method described in the examples below. The inventors have conducted extensive research into the causes of breakage and misalignment of the covering member in the wiring component and have found that the primary cause is secondary shrinkage in the extension direction of the covering member, rather than secondary shrinkage in the circumferential direction perpendicular to the extension direction, which occurs when a high capacity current is passed through the covering member. They have also found that suppressing secondary shrinkage in the extension direction of the covering member is particularly effective in solving the problems of breakage and misalignment. The secondary shrinkage A can be reduced, for example, by adjusting the composition of the resin composition constituting the covering member to increase the Vicat softening point. Specific methods for adjusting the composition to increase the Vicat softening point include increasing the content of polyphenylene ether in the resin composition, and using a resin with a high Tg and / or melting point as a resin component other than the polypropylene-based resin described below. Furthermore, the secondary shrinkage A can also be reduced by increasing the mold temperature during injection molding (for example, 60°C or higher, preferably 70°C or higher, and more preferably 80°C or higher), increasing the resin temperature (for example, 230°C or higher, preferably 240°C or higher, and more preferably 250°C or higher), increasing the dwell pressure (for example, 20% or higher), or lengthening the injection time (for example, 15 seconds or longer).

[0013] In the wiring component of this embodiment, the coverage rate of the conductive member by the covering member is preferably 50 to 100%, more preferably 55 to 95%, even more preferably 60 to 90%, and particularly preferably 70 to 90%, from the viewpoints of conductivity and leakage prevention. The coverage rate refers to the ratio of the area of ​​the inner surface of the covering member that constitutes the outer surface of the internal space of the covering member to the area of ​​the outer surface of the conductive member. Here, the internal space of the covering member refers to the area that can be accommodated by the covering member. More specifically, if the inner surface of the covering member forms a closed system, the internal space of the covering member refers to the area defined by the inner surface of the covering member. Furthermore, if the inner surface of the covering member forms at least a portion of an open system with respect to the periphery in the extension direction and / or the extension direction (see FIG. 1), the internal space of the covering member refers to the area defined by the inner surface of the covering member and the imaginary inner surfaces connecting the inner surfaces of the open system. The covering member may cover all or part of the periphery of the conductive member in the extension direction (around the extension direction).Furthermore, the covering member may cover all or part of the conductive member in the extension direction, excluding the input and output portions to the conductive member.

[0014] In the wiring component of this embodiment, the covering member is preferably a member that does not break after being subjected to thermal aging at 150° C. for 1000 hours with copper foil sandwiched between the covering members. The occurrence of the above-mentioned breakage can be determined by the method described in the Examples below.

[0015] In the wiring component of this embodiment, the average distance C between the conductive member and the covering member (average clearance C) is 5 mm or less, preferably 2 mm or less, more preferably 1 mm or less, even more preferably 0.5 mm or less, and particularly preferably 0 mm (the conductive member and the covering member are in contact over the entire covering area), from the viewpoint of both facilitating the release of heat from the conductive member to the outside and preventing displacement of the covering member. Alternatively, it may be more than 0 mm. The distance C between the conductive member and the covering member refers to the minimum distance between the two members in a cross section of the wiring component cut along a plane perpendicular to its extension direction (FIG. 2A). The average distance C between the conductive member and the covering member refers to the average of the minimum distances between the two members in the extension direction of the wiring component. The minimum distance may be constant or may vary across the extension direction, but is preferably constant. The difference (mm) between the maximum and minimum values ​​of the minimum distance across the extension direction is preferably 60% or less, and more preferably 50% or less, of the average value (mm) of the clearance C. If the conductive member is capable of swinging inside the covering member, the distance between the conductive member and the covering member may vary, but in this case, the minimum distance between the two members when they are placed at rest on a horizontal surface may be taken as the distance C between the conductive member and the covering member. The average clearance C can be measured by the method described in the examples below.

[0016] The surface hardness of the wiring component of this embodiment is preferably 60 or more, more preferably 80 or more, and even more preferably 90 or more, from the viewpoint of making the wiring component less susceptible to deformation. The surface hardness is a Rockwell hardness measured on the M scale in accordance with JIS K 7202-2. The surface hardness of the wiring component may be the surface hardness of the surface of a covering member that forms the surface of the wiring component.

[0017] The bending elastic modulus of the wiring component of this embodiment is preferably 1800 MPa or more, more preferably 2000 to 3000 MPa, and even more preferably 2200 to 3000 MPa, from the viewpoint of making the wiring component less susceptible to deformation. The flexural modulus is a value measured in accordance with ISO178. The flexural modulus of the wiring component may be the flexural modulus of a covering member that forms the surface of the wiring component.

[0018] In the wiring component of this embodiment, the occupancy rate of the conductive member in the internal space of the covering member is preferably 40 to 100 volume %, more preferably 40 to 90 volume %, even more preferably 50 to 90 volume %, and particularly preferably 60 to 90 volume %, from the viewpoint of both facilitating the release of heat from the conductive member to the outside and making it less likely for the covering member to become misaligned. The occupancy rate refers to the ratio of the volume of the conductive member present in the internal space of the covering member to the volume of the internal space of the covering member.

[0019] (Conductive material) The total extension length of the conductive member is preferably 300 mm or more, more preferably 400 to 1500 mm, even more preferably 500 to 1200 mm, and particularly preferably 600 to 700 mm. The extension length (length in the extension direction) may be the length along the surface of the conductive member in the direction from one end to the other end of the conductive member. When the wiring component of this embodiment includes multiple conductive members, the total extension length may be the total extension length of all conductive members. For example, when the wiring component of this embodiment includes multiple conductive members aligned in the same direction and spaced apart, the direction in which the conductive members are aligned may be defined as the extension direction, and the total extension length may be the sum of the extension direction lengths of each conductive member. When multiple conductive members are aligned in multiple rows in the same direction (FIG. 5), the total extension length may be calculated by measuring the total extension direction length of each conductive member in each row and adding up the total extension direction lengths of each row.

[0020] The shape of the conductive member may be appropriately selected depending on the purpose and application, and is not particularly limited. The cross-sectional shape (cross-section perpendicular to the extension direction) may be rectangular as shown in Fig. 1, but is not limited thereto and may be rectangular, circular, elliptical, or other shapes. The cross-sectional shape may be the same or different over the entire length in the extension direction. The overall shape may be a straight line as shown in FIG. 1, but may also be a curved or twisted shape as shown in FIGS. 4(A) to 4(C). Furthermore, when the wiring component of this embodiment includes a plurality of conductive members, the conductive members may have the same shape or different shapes.

[0021] The average area of ​​the cross-sectional shape of the conductive member is, for example, 10.0 to 150 mm 2 Usually 12.5 to 120 mm 2 , 15.0~100mm 2 The average area of ​​the cross-sectional shape refers to the average of the cross-sectional area of ​​the entire length in the extending direction of the conductive member. 2 This tends to make it easier to pass high-capacity electricity. 2 By satisfying the above condition, the electrical equipment tends to be space-saving. In addition to the above-mentioned space-saving viewpoint, from the viewpoint of facilitating the manufacture of wiring components, it is preferable that the conductive member is made of a single component. For example, it is preferable that the conductive member has a structure in which multiple components are not connected, interwoven, or stacked. When the wiring component of this embodiment includes a plurality of conductive members, the average area may be an arithmetic mean of the average areas of the cross-sectional shapes of the respective conductive members.

[0022] The conductive member may have a bent portion from the viewpoint of preventing misalignment between the conductive member and the covering member. The number of bent portions may be one or two or more (FIG. 4).

[0023] The material constituting the conductive member is not particularly limited as long as it has conductivity, and examples thereof include metals such as aluminum, aluminum alloys, copper, copper alloys, silver, and combinations thereof. The conductive member may be a conductor whose surface is plated.

[0024] The conductive member may be, for example, a bus bar, an electric wire, etc. Among these, a bus bar is preferable from the viewpoint of space saving.

[0025] (Covering material) The covering member may consist of a single member (FIG. 4), or may include multiple members that can fit together (FIGS. 1 to 3). Of these, it is preferable that the covering member include multiple members (e.g., two members) that can fit together, since this is easier to manufacture. The multiple members may be connected, for example, by a fitting portion 4 (FIG. 1). The manner of fitting is not limited to that shown in FIG. 1 etc., and for example, a plurality of members may be joined together in the extension direction.

[0026] The coating member is made of a resin composition. Preferably, the coating member contains only the resin composition. The resin composition contains a polypropylene-based resin and may further contain a resin component other than the polypropylene-based resin or other components. Among these, from the viewpoint of further reducing the likelihood of damage or displacement of the covering material when a high capacity of electricity is passed through it and preventing metal deterioration of the covering material due to contact with a conductive member, the resin composition preferably contains a polypropylene-based resin and a polyphenylene ether-based resin (preferably polyphenylene ether) as resin components, and preferably contains only a polypropylene-based resin and a polyphenylene ether-based resin (preferably polyphenylene ether). The coating member may be composed solely of the resin composition, or may be composed of a coating member composed of the resin composition and a coating member composed of another material, and is preferably composed solely of the resin composition.

[0027] -Polypropylene resin- Examples of the polypropylene resin include propylene homopolymers, copolymers of propylene with other monomers, and modified products thereof. The polypropylene-based resin is preferably crystalline, and more preferably a crystalline propylene homopolymer or a crystalline propylene-ethylene block copolymer. The polypropylene-based resin may also be a mixture of a crystalline propylene homopolymer and a crystalline propylene-ethylene block copolymer. The polypropylene resin may be used alone or in combination of two or more kinds. Examples of other monomers copolymerizable with propylene include α-olefins such as butene-1 and hexene-1. The polymerization form is not particularly limited, and may be a random copolymer, a block copolymer, or the like.

[0028] Examples of methods for producing the crystalline propylene-ethylene block copolymer include a method in which a crystalline propylene homopolymer portion is synthesized in the first polymerization step, and in the second or subsequent polymerization steps, propylene, ethylene, and, if necessary, other α-olefins are copolymerized with the crystalline propylene homopolymer portion. The method for producing the polypropylene resin is not particularly limited, and any known method can be used, such as a method of polymerizing propylene or other monomers in the presence of a catalyst.Specific examples include a method of polymerizing propylene or other monomers in the presence of the catalyst and an alkylaluminum compound at a polymerization temperature of 0 to 100°C and a polymerization pressure of 3 to 100 atmospheres. Examples of the catalyst used in the production of polypropylene-based resins include titanium trichloride catalysts, titanium halide catalysts supported on a carrier such as magnesium chloride, etc. In the production of polypropylene-based resins, a chain transfer agent such as hydrogen may be added to adjust the molecular weight of the polymer. The polymerization method for producing the polypropylene resin may be either a batch method or a continuous method, and may be selected from solution polymerization in a solvent such as butane, pentane, hexane, heptane, or octane, slurry polymerization, bulk polymerization in a monomer without a solvent, or gas phase polymerization in a gaseous monomer. In the production of polypropylene-based resins, in addition to the catalyst, an electron donor compound can be used as a third component, either as an internal donor or an external donor, to enhance the isotacticity and polymerization activity of polypropylene. Examples of the electron donor compound include known compounds, such as ester compounds such as ε-caprolactone, methyl methacrylate, ethyl benzoate, methyl toluate, aromatic monocarboxylic acid esters, and alkoxy esters; phosphites such as triphenyl phosphite and tributyl phosphite; phosphoric acid derivatives such as hexamethylphosphoric triamide; alkoxysilanes such as aromatic alkylalkoxysilanes and aliphatic hydrocarbon alkoxysilanes; various ethers; various alcohols; and various phenols.

[0029] The melt flow rate (MFR) of the polypropylene resin (230°C, load 2.16 kgf) is preferably 0.01 to 300 g / 10 min, more preferably 0.1 to 100 g / 10 min, and even more preferably 0.1 to 30 g / 10 min. By setting the MFR within the above range, it is possible to achieve a good balance between molding flowability, impact strength, and weld strength. In addition, polypropylene resins having an MFR within these ranges may be used alone or in combination of two or more kinds.

[0030] When the resin composition contains a polyphenylene ether resin, it preferably contains a compatibilizer from the viewpoint of improving the compatibility between the polypropylene resin and the polyphenylene ether resin. As the compatibilizer for the polyphenylene ether resin and the polypropylene resin, a known compatibilizer can be used, and for example, a hydrogenated block copolymer described below can be preferably used.

[0031] The mass proportion of the polypropylene resin in 100% by mass of the resin composition is preferably 5 to 90% by mass, more preferably 8 to 80% by mass, and even more preferably 10 to 70% by mass, from the viewpoint of making the covering material less susceptible to damage or displacement when a high capacity of electricity is passed through it, preventing metal deterioration of the covering material due to contact with conductive members, and further from the viewpoint of electrical properties (particularly tracking resistance).

[0032] -Resin components other than polypropylene-based resins- Examples of resin components other than the polypropylene resin include polyphenylene ether resins, block copolymers containing two or more polymer blocks A mainly made of a vinyl aromatic compound and one or more polymer blocks B mainly made of a conjugated diene compound, and / or hydrogenated block copolymers obtained by hydrogenating a block copolymer containing two or more polymer blocks A mainly made of a vinyl aromatic compound and one or more polymer blocks B mainly made of a conjugated diene compound, polyamide resins, polyphenylene sulfide, thermoplastic elastomers (such as polyolefin elastomers), etc. Among these, polyphenylene ether resins are preferred, and polyphenylene ether resins and hydrogenated block copolymers are more preferred.

[0033] -Polyphenylene ether resin- The resin composition may contain a polyphenylene ether resin. By containing a polyphenylene ether resin, the covering material is more resistant to breakage and displacement even when a high capacity current is passed through it. Furthermore, metal deterioration of the covering material due to contact with a conductive member can be prevented. The polyphenylene ether resin contains polyphenylene ether (sometimes referred to as "PPE" in this specification) and may further contain a polystyrene resin. That is, the PPE resin may be a mixed resin made of PPE and a polystyrene resin, or may be a resin made of only PPE.

[0034] Examples of the PPE include a homopolymer having a repeating unit structure represented by the following chemical formula (1) and a copolymer having a repeating unit structure represented by the following chemical formula (1). The above PPE may be used alone or in combination of two or more. [ka] In the above chemical formula (1), R 1 , R 2 , R 3 , and R 4 are each independently a monovalent group selected from the group consisting of a hydrogen atom, a halogen atom, a primary alkyl group having 1 to 7 carbon atoms, a secondary alkyl group having 1 to 7 carbon atoms, a phenyl group, a haloalkyl group, an aminoalkyl group, a hydrocarbonoxy group, and a halohydrocarbonoxy group in which at least two carbon atoms separate the halogen atom from the oxygen atom.

[0035] From the viewpoints of fluidity during processing, toughness, and heat aging resistance, the PPE preferably has a reduced viscosity of 0.15 to 2.0 dL / g, more preferably 0.20 to 1.0 dL / g, and even more preferably 0.30 to 0.70 dL / g, as measured using a 0.5 g / dL chloroform solution at 30°C with an Ubbelohde viscometer.

[0036] Examples of the PPE include, but are not limited to, homopolymers such as poly(2,6-dimethyl-1,4-phenylene ether), poly(2-methyl-6-ethyl-1,4-phenylene ether), poly(2-methyl-6-phenyl-1,4-phenylene ether), and poly(2,6-dichloro-1,4-phenylene ether); and copolymers such as copolymers of 2,6-dimethylphenol and other phenols (e.g., 2,3,6-trimethylphenol and 2-methyl-6-butylphenol). Among these, from the viewpoints of the balance between toughness and rigidity when formed into a resin composition and ease of raw material availability, poly(2,6-dimethyl-1,4-phenylene ether) and copolymers of 2,6-dimethylphenol and 2,3,6-trimethylphenol are preferred, and poly(2,6-dimethyl-1,4-phenylene ether) is more preferred.

[0037] The PPE can be produced by known methods, including, but not limited to, the oxidative polymerization of 2,6-xylenol by Hay using a complex of cuprous salt and amine as a catalyst, as described in U.S. Pat. No. 3,306,874, and the methods described in U.S. Pat. Nos. 3,306,875, 3,257,357, 3,257,358, JP-B-52-17880, JP-A-50-51197, and JP-A-63-152628.

[0038] The PPE may be a modified PPE obtained by reacting the homopolymer and / or copolymer with a styrene monomer or a derivative thereof, and / or an α,β-unsaturated carboxylic acid or a derivative thereof, wherein the graft or addition amount of the styrene monomer or a derivative thereof, and / or the α,β-unsaturated carboxylic acid or a derivative thereof is preferably 0.01 to 10% by mass relative to 100% by mass of the polyphenylene ether resin.

[0039] Examples of methods for producing the modified PPE include a method in which the PPE is reacted in the presence or absence of a radical generator in a molten state, solution state, or slurry state at a temperature of 80 to 350°C. The PPE may be a mixture of the homopolymer and / or copolymer and the modified PPE in any ratio.

[0040] Examples of the polystyrene resin include atactic polystyrene, rubber-reinforced polystyrene (high impact polystyrene, HIPS), styrene-acrylonitrile copolymer (AS) having a styrene content of 50% by mass or more, and AS resin in which the styrene-acrylonitrile copolymer is rubber-reinforced, and atactic polystyrene and / or high impact polystyrene are preferred. The polystyrene resins may be used singly or in combination of two or more.

[0041] The polyphenylene ether resin may be a polyphenylene ether resin composed of PPE and a polystyrene resin, with the mass ratio of the PPE to the polystyrene resin (PPE / polystyrene resin) being 97 / 3 to 5 / 95. Using such a resin for a covering member tends to prevent warping of the covering member and to better prevent breakage or displacement of the covering member when a high capacity current is passed through it. From the viewpoint of obtaining a composition with high fluidity and a high Vicat softening point, the mass ratio of the PPE to the polystyrene resin (PPE / polystyrene resin) is more preferably 90 / 10 to 40 / 60, even more preferably 90 / 10 to 50 / 50, and particularly preferably 90 / 10 to 60 / 40.

[0042] The mass proportion of the polyphenylene ether resin in 100 mass% of the resin composition is preferably 3 to 90 mass%, more preferably 5 to 80 mass%, and even more preferably 8 to 70 mass%, from the viewpoint of making the covering material less susceptible to damage or displacement when a high capacity of electricity is passed through it and from the viewpoint of preventing metal deterioration of the covering material due to contact with a conductive member.

[0043] The mass proportion of the polypropylene resin in the resin composition relative to 100 parts by mass of the total mass of the polypropylene resin and the polyphenylene ether resin is preferably 30 to 100 parts by mass, more preferably 40 to 90 parts by mass, and even more preferably 50 to 80 parts by mass, from the viewpoint of making the covering material less susceptible to damage or displacement when a high capacity of electricity is passed through it, and from the viewpoint of preventing metal deterioration of the covering material due to contact with a conductive member. The resin composition may be a mixture in which the resin components are composed only of a polypropylene-based resin and a polyphenylene ether-based resin.

[0044] -Hydrogenated block copolymer- The hydrogenated block copolymer used in this embodiment is not particularly limited, and examples thereof include unmodified hydrogenated block copolymers, modified hydrogenated block copolymers, and mixtures of both. The hydrogenated block copolymers may be used alone or in combination of two or more.

[0045] The hydrogenated block copolymer acts as a compatibilizer or an impact resistance imparting agent for the polyphenylene ether resin and the polypropylene resin. The hydrogenated block copolymer is a block copolymer obtained by hydrogenating at least a portion of a block copolymer comprising a polymer block A mainly composed of a vinyl aromatic compound and a polymer block B mainly composed of a conjugated diene compound, wherein the total amount of 1,2-vinyl bonds and 3,4-vinyl bonds of the conjugated diene compound in polymer block B (hereinafter also referred to as "total vinyl bond amount", described later) is 30 to 90%. Matters relating to the unmodified and modified hydrogenated block copolymers will be described below.

[0046] ---Polymer block A mainly composed of vinyl aromatic compounds--- The polymer block A mainly composed of a vinyl aromatic compound is not particularly limited, and examples thereof include a homopolymer block of a vinyl aromatic compound, and a copolymer block of a vinyl aromatic compound and a conjugated diene compound. In addition, the phrase "mainly composed of a vinyl aromatic compound" in the polymer block A means that the content of the vinyl aromatic compound moiety in the polymer block A before hydrogenation is more than 50% by mass, and the content is preferably 70% by mass or more, more preferably 80% by mass or more, and may be 100% by mass or less.

[0047] The vinyl aromatic compound constituting the polymer block A is not particularly limited and examples thereof include styrene, α-methylstyrene, vinyltoluene, p-tert-butylstyrene, diphenylethylene, etc., with styrene being preferred. The above vinyl aromatic compounds may be used alone or in combination of two or more.

[0048] From the viewpoint of improving the heat creep resistance of the resin composition, the number average molecular weight (Mn) of the polymer block A is preferably 15,000 or more, more preferably 20,000 or more, particularly preferably 25,000 or more, and is preferably 100,000 or less. The number average molecular weight (Mn) can be determined by a conventionally known method using GPC (mobile phase: chloroform, standard substance: polystyrene). Specifically, the number average molecular weight (Mn) can be measured by the method described in the examples below.

[0049] ---Polymer block B mainly composed of conjugated diene compounds--- The polymer block B mainly composed of a conjugated diene compound is not particularly limited, and examples thereof include a homopolymer block of a conjugated diene compound, and a copolymer block of a conjugated diene compound and a vinyl aromatic compound. In addition, the phrase "mainly composed of a conjugated diene compound" in the polymer block B means that the content of the conjugated diene compound portion in the polymer block B before hydrogenation exceeds 50% by mass. From the viewpoint of improving the fluidity of the resin composition, the content is preferably 70% by mass or more, more preferably 80% by mass or more, and may be 100% by mass or less.

[0050] The conjugated diene compound constituting the polymer block B is not particularly limited and examples thereof include butadiene, isoprene, 1,3-pentadiene, 2,3-dimethyl-1,3-butadiene, etc., butadiene, isoprene, and combinations thereof are preferred, and butadiene is more preferred. The above conjugated diene compounds may be used alone or in combination of two or more.

[0051] In the microstructure of polymer block B (bonding form of the conjugated diene compound), the sum of the 1,2-vinyl bond content and the 3,4-vinyl bond content (total vinyl bond content) is 30% or more, preferably 45% or more, and more preferably 65% ​​or more, and 90% or less, from the viewpoint of improving the compatibility of polymer block B with the polypropylene-based resin. The sum of the 1,2-vinyl bond content and the 3,4-vinyl bond content (total vinyl bond content) refers to the ratio of the sum of the 1,2-vinyl bond content and the 3,4-vinyl bond content to the sum of the 1,2-vinyl bond content, the 3,4-vinyl bond content, and the 1,4-conjugated bond content in the polymer block B before hydrogenation. The total vinyl bond content can be measured using an infrared spectrophotometer and calculated in accordance with the method described in Analytical Chemistry, Volume 21, No. 8, August 1949.

[0052] The method for synthesizing the block copolymer containing the polymer block A and the polymer block B is not particularly limited, and examples thereof include known methods such as anionic polymerization. The block structure of the unmodified and modified hydrogenated block copolymers is not particularly limited, and examples of the hydrogenated block copolymers include structures such as AB, ABA, BABA, (AB-)M, and ABABA, where polymer block A is represented by "A" and polymer block B is represented by "B." Here, (AB-)M is a reaction residue of a polyfunctional coupling agent such as silicon tetrachloride (M=Si) or tin tetrachloride (M=Sn), or a residue of an initiator such as a polyfunctional organolithium compound.

[0053] The molecular structure of the unmodified and modified hydrogenated block copolymers is not particularly limited, and examples thereof include linear, branched, radial, and combinations thereof.

[0054] The distribution of the vinyl aromatic compound in the molecular chain of polymer block A and the distribution of the conjugated diene compound in the molecular chain of polymer block B contained in the block copolymer are not particularly limited, and examples thereof include random, tapered (where the monomer portion increases or decreases along the molecular chain), partial block, and combinations thereof.

[0055] When a block copolymer contains a plurality of polymer blocks A or a plurality of polymer blocks B, the plurality of polymer blocks A or the plurality of polymer blocks B may have the same structure or different structures.

[0056] With respect to the entire block copolymer including polymer block A and polymer block B, from the viewpoints of improving the fluidity, impact resistance, and appearance of the hydrogenated block copolymer and reducing the occurrence of welds, the content of the vinyl aromatic compound in the block copolymer before hydrogenation is preferably 20% by mass or more, more preferably 30% by mass or more, and is preferably 95% by mass or less, more preferably 80% by mass or less. The content of the vinyl aromatic compound can be measured using an ultraviolet spectrophotometer.

[0057] The number average molecular weight (Mn) of the block copolymer before hydrogenation is preferably 5,000 or more, more preferably 10,000 or more, and particularly preferably 30,000 or more, and is preferably 1,000,000 or less, more preferably 800,000 or less, and particularly preferably 500,000 or less. The number average molecular weight can be determined by a conventionally known method using GPC (mobile phase: chloroform, standard substance: polystyrene).

[0058] The molecular weight distribution (Mw / Mn) of the block copolymer before hydrogenation is preferably 10 or less, more preferably 8 or less, and particularly preferably 5 or less. The molecular weight distribution (Mw / Mn) can be calculated by dividing the weight average molecular weight (Mw) determined by a conventionally known method using GPC (mobile phase: chloroform, standard substance: polystyrene) by the number average molecular weight (Mn) described above. The method for hydrogenating the block copolymer is not particularly limited, and examples thereof include methods of hydrogenating the block copolymer using (1) supported heterogeneous hydrogenation catalysts in which a metal such as Ni, Pt, Pd, or Ru is supported on carbon, silica, alumina, diatomaceous earth, or the like; (2) so-called Ziegler-type hydrogenation catalysts in which a transition metal salt such as an organic acid salt of Ni, Co, Fe, or Cr or the like or an acetylacetonate salt is used with a reducing agent such as an organoaluminum; or (3) homogeneous hydrogenation catalysts such as so-called organometallic complexes of organometallic compounds such as Ti, Ru, Rh, or Zr, for example, under conditions of a reaction temperature of 0 to 200°C and a hydrogen pressure of 0.1 to 15 MPa.

[0059] The hydrogenation rate of the conjugated diene compound moiety constituting the polymer block B in the unmodified and modified hydrogenated block copolymers is not particularly limited, and from the viewpoint of improving the heat resistance of the resin composition, it is preferably 50% or more, more preferably 80% or more, and particularly preferably 90% or more, based on the total amount of double bonds derived from the conjugated diene compound. The hydrogenation rate can be measured using a nuclear magnetic resonance (NMR) spectrometer. The method for producing the unmodified and modified hydrogenated block copolymers is not particularly limited, and known production methods can be used. Specific examples of known production methods include those described in JP-A-47-11486, JP-A-49-66743, JP-A-50-75651, JP-A-54-126255, JP-A-56-10542, JP-A-56-62847, JP-A-56-100840, JP-A-2-300218, British Patent No. 1,130,770, U.S. Pat. No. 3,281,383, U.S. Pat. No. 3,639,517, British Patent No. 1,020,720, U.S. Pat. No. 3,333,024, and U.S. Pat. No. 4,501,857.

[0060] From the viewpoints of fluidity, heat resistance, and impact resistance, the content of the hydrogenated block copolymer in the resin composition is preferably 1 to 40% by mass, more preferably 2 to 30% by mass, and even more preferably 3 to 20% by mass, relative to 100% by mass of the resin composition.

[0061] --Polyamide resin-- The resin composition may contain a polyamide resin. Any polyamide resin having an amide bond (—NH—C(═O)—) in the repeating unit of the polymer main chain can be used. The polyamide resin is a polymer or copolymer whose main raw materials are, for example, amino acids, lactams, or diamines and dicarboxylic acids.

[0062] Representative examples of raw materials for polyamide resins include amino acids such as 6-aminocaproic acid, 11-aminoundecanoic acid, 12-aminododecanoic acid, and para-aminomethylbenzoic acid; lactams such as ε-caprolactam and ω-laurolactam; aliphatic diamines such as tetramethylenediamine, pentamethylenediamine, hexamethylenediamine, 2-methylpentamethylenediamine, nonamethylenediamine, decamethylenediamine, undecamethylenediamine, dodecamethylenediamine, 2,2,4- / 2,4,4-trimethylhexamethylenediamine, and 5-methylnonamethylenediamine; aromatic diamines such as metaxylylenediamine and paraxylylenediamine; 1,3-bis(aminomethyl)cyclohexane, 1,4-bis(aminomethyl)cyclohexane, and 1-amino-3-aminomethyl-3,5,5-trimethylcyclohexane. Aliphatic diamines such as methyl acrylate, bis(4-aminocyclohexyl)methane, bis(3-methyl-4-aminocyclohexyl)methane, 2,2-bis(4-aminocyclohexyl)propane, bis(aminopropyl)piperazine, and aminoethylpiperazine; aliphatic dicarboxylic acids such as adipic acid, suberic acid, azelaic acid, sebacic acid, and dodecanedioic acid; aromatic dicarboxylic acids such as terephthalic acid, isophthalic acid, 2-chloroterephthalic acid, 2-methylterephthalic acid, 5-methylisophthalic acid, 5-sodiumsulfoisophthalic acid, 2,6-naphthalenedicarboxylic acid, hexahydroterephthalic acid, and hexahydroisophthalic acid; and alicyclic dicarboxylic acids such as 1,4-cyclohexanedicarboxylic acid, 1,3-cyclohexanedicarboxylic acid, 1,2-cyclohexanedicarboxylic acid, and 1,3-cyclopentanedicarboxylic acid. In this embodiment, two or more types of polyamide homopolymers or copolymers derived from these raw materials may be blended.

[0063] Specific examples of polyamide-based resins include polyamide 6, polyamide 66, polyamide 46, polyamide 410, polyamide 56, polyamide 510, polyamide 610, polyamide 612, polyamide 106, polyamide 1010, polyamide 1012, polyamide 11, polyamide 12, polyamide 4T, polyamide 5T, polyamide 6I, polyamide 6T, polyamide 9T, polyamide 10I, polyamide 10T, MXD6, MXD10, PXD6, PXD10, and polyamide copolymers containing at least two different polyamide components from these, or mixtures of these.

[0064] When the resin composition contains a polyamide resin, it preferably contains a compatibilizer from the viewpoint of improving the compatibility between the polypropylene resin and the polyamide resin. Examples of compatibilizers that can be used in this embodiment are described in detail in JP-A-8-48869 and JP-A-9-124926, and all of these known compatibilizers can be used, and they can also be used in combination. Among these various compatibilizers, particularly suitable examples include one or more selected from citric acid, maleic acid, itaconic acid, and anhydrides thereof, with maleic anhydride and citric acid being more preferred.

[0065] --Polyphenylene sulfide-- The resin composition may contain polyphenylene sulfide, which is divided into linear polyphenylene sulfide resins (hereinafter sometimes abbreviated as "linear PPS") and crosslinked polyphenylene sulfide resins (hereinafter sometimes abbreviated as "crosslinked PPS") depending on the production method.

[0066] The former linear PPS is a polymer containing arylene sulfide repeating units represented by the following formula (3) in an amount of usually 50 mol % or more, preferably 70 mol % or more, and more preferably 90 mol % or more. [-Ar-S-] (3) (Here, Ar represents an arylene group, and examples of the arylene group include a p-phenylene group, an m-phenylene group, a substituted phenylene group (the substituent is preferably an alkyl group having 1 to 10 carbon atoms or a phenyl group), a p,p'-diphenylenesulfone group, a p,p'-biphenylene group, a p,p'-diphenylenecarbonyl group, and a naphthylene group.)

[0067] Linear PPS may be a homopolymer containing one type of arylene group as a structural unit, or a copolymer obtained by mixing two or more different arylene groups from the viewpoints of processability and heat resistance. Among these, linear polyphenylene sulfide resins having p-phenylene sulfide repeating units as the main structural unit are preferred because of their excellent processability and heat resistance and ease of industrial availability.

[0068] The latter crosslinked (including semi-crosslinked) polyphenylene sulfide resin is produced by polymerizing the linear polyphenylene sulfide resin described above, followed by heat treatment in the presence of oxygen at a temperature equal to or lower than the melting point of the polyphenylene sulfide resin, thereby promoting oxidative crosslinking and appropriately increasing the polymer molecular weight and viscosity.

[0069] Furthermore, these PPSs (linear PPS, crosslinked PPS) may be acid-modified PPSs. Acid-modified PPSs are those obtained by modifying the above-mentioned PPSs with an acid compound. Examples of such acid compounds include unsaturated carboxylic acids or their anhydrides, such as acrylic acid, methacrylic acid, maleic acid, fumaric acid, and maleic anhydride, as well as saturated aliphatic carboxylic acids and aromatic-substituted carboxylic acids. Furthermore, inorganic acid compounds, such as acetic acid, hydrochloric acid, sulfuric acid, phosphoric acid, silicic acid, and carbonic acid, may also be used.

[0070] -Other ingredients- Examples of the other components include higher fatty acid bisamides; flame retardants; inorganic or organic fillers and reinforcing materials; heat stabilizers; antioxidants; metal deactivators; nucleating agents; plasticizers (low molecular weight polyethylene, epoxidized soybean oil, polyethylene glycol, fatty acid esters, etc.); weather (light) resistance improvers; slip agents; various colorants; release agents; compatibilizers; and admixtures.

[0071] --Higher fatty acid bisamide-- The resin composition may contain a higher fatty acid bisamide from the viewpoints of impact resistance, flowability, mold contamination prevention, and mold releasability. The resin composition, by using a higher fatty acid bisamide, is superior in terms of the balance of impact resistance, fluidity, mold contamination resistance, and mold releasability compared to resin compositions using other resin additives (for example, metal salts of higher fatty acids such as stearic acid, behenic acid, montanic acid, etc. with magnesium, zinc, calcium, etc.; compounds of higher fatty acids with monoamines; ester compounds of higher fatty acids with alcohols; etc.).

[0072] The higher fatty acid bisamide is a bisamide of a higher fatty acid, and is preferably a compound obtained by a dehydration reaction between a higher fatty acid and a diamine. As the higher fatty acid bisamide, a bisamide compound of a higher fatty acid and a linear aliphatic diamine having 2 to 6 carbon atoms is preferred from the viewpoint of impact resistance.

[0073] As the aliphatic diamine, methylenediamine, ethylenediamine, and hexamethylenediamine are preferred. From the viewpoint of impact resistance, the higher fatty acid is preferably a fatty acid having 10 to 25 carbon atoms, more preferably a fatty acid having 12 to 22 carbon atoms, and even more preferably a fatty acid having 14 to 22 carbon atoms. Furthermore, the higher fatty acid may be either a saturated fatty acid or an unsaturated fatty acid, but is preferably a saturated fatty acid.

[0074] Examples of the higher fatty acid bisamide include bisamide compounds obtained by reacting a higher fatty acid such as capric acid, lauric acid, stearic acid, behenic acid, or montanic acid with a diamine such as methylenebisamine, ethylenebisamine, or hexamethylenebisamine.

[0075] From the viewpoints of impact resistance, flowability, mold contamination resistance, and mold releasability, the content of the higher fatty acid bisamide in the resin composition is preferably 0.5 to 10 mass%, more preferably 0.5 to 5 mass%, and even more preferably 0.5 to 3 mass%, relative to 100 mass% of the resin composition.

[0076] --Flame retardant-- The resin composition may contain a flame retardant from the viewpoint of imparting flame retardancy. The flame retardants may be used alone or in combination of two or more.

[0077] Examples of the flame retardant include phosphorus-containing flame retardants and silicone-based flame retardants. Phosphorus-containing flame retardants known in the art, such as organic phosphorus compounds, red phosphorus, and inorganic phosphates, are preferred, and among these, phosphate ester compounds are more preferred. Examples of the flame retardant include, but are not limited to, phosphate ester compounds such as trimethyl phosphate, triethyl phosphate, tripropyl phosphate, tributyl phosphate, tripentyl phosphate, trihexyl phosphate, tricyclohexyl phosphate, triphenyl phosphate, tricresyl phosphate, trixylenyl phosphate, cresyl diphenyl phosphate, dicresyl phenyl phosphate, dimethyl ethyl phosphate, methyl dibutyl phosphate, ethyl dipropyl phosphate, and hydroxyphenyl diphenyl phosphate; modified phosphate ester compounds obtained by modifying these with various substituents; and various condensed phosphate ester compounds. Among these, condensed phosphate ester compounds are preferred.

[0078] --Inorganic or organic fillers and reinforcing materials-- The resin composition may contain an inorganic or organic filler or reinforcing material from the viewpoint of improving mechanical strength.

[0079] Examples of the inorganic or organic filler or reinforcing material include, but are not limited to, fibrous, granular, plate-like, and needle-like reinforcing materials such as glass fiber, potassium titanate fiber, gypsum fiber, brass fiber, stainless steel fiber, steel fiber, ceramic fiber, boron whisker fiber, mica, talc, silica, calcium carbonate, kaolin, calcined kaolin, wollastonite, xonotlite, apatite, glass beads, glass flakes, titanium oxide, carbon fiber, carbon black, polyacrylonitrile fiber, and aramid fiber. Among these, preferred are glass fiber, talc, and wollastonite, and more preferred is glass fiber. These inorganic or organic fillers and reinforcing materials may be used alone or in combination of two or more. The inorganic or organic filler or reinforcing material may be surface-treated by a known method using a surface treatment agent such as a silane coupling agent.

[0080] From the viewpoint of suitably producing a coating member having a long extension length, the content of the inorganic or organic filler or reinforcing material is preferably 20% by mass or less, more preferably 10% by mass or less, and even more preferably 5% by mass or less, relative to 100% by mass of the resin composition.

[0081] The compatibilizer may be one or more selected from citric acid, maleic acid, itaconic acid, and anhydrides thereof, with maleic anhydride and citric acid being more preferred.

[0082] -Method of manufacturing resin composition- The resin composition can be produced, for example, by melt-kneading the polypropylene resin, and, if necessary, resin components other than the polypropylene resin, and the other components.

[0083] The melt kneader used for melt kneading is not limited to, but includes, for example, a single-screw extruder, a multi-screw extruder including a twin-screw extruder, a roll, a kneader, a Brabender Plastograph, a Banbury mixer, etc., and from the viewpoint of kneading properties, a twin-screw extruder is particularly preferred. Specific examples include the ZSK series manufactured by Werner & Pfleiderer, the TEM series manufactured by Toshiba Machine Co., Ltd., and the TEX series manufactured by The Japan Steel Works, Ltd.

[0084] The production method using an extruder will be described below.

[0085] The L / D (effective barrel length / inner barrel diameter) of the extruder is preferably 20 or more and 60 or less, and more preferably 30 or more and 50 or less.

[0086] The configuration of the extruder is not particularly limited, but for example, it is preferable to have a first raw material supply port on the upstream side with respect to the flow direction of the raw materials, a first vacuum vent downstream from the first raw material supply port, a second raw material supply port downstream from the first vacuum vent (if necessary, a third and a fourth raw material supply port may be further provided downstream of the second raw material supply port), and a second vacuum vent downstream from the second raw material supply port. In particular, it is more preferable to have a kneading section provided upstream of the first vacuum vent, a kneading section provided between the first vacuum vent and the second raw material supply port, and a kneading section provided between the second to fourth raw material supply ports and the second vacuum vent.

[0087] The method of supplying raw materials to the second to fourth raw material supply ports is not particularly limited, but a method of supplying raw materials from the side open port of the extruder using a forced side feeder is preferred because it tends to provide more stable supply than a method of simply adding raw materials through the open ports of the second to fourth raw material supply ports of the extruder.

[0088] In particular, when the raw materials contain powder and it is desired to reduce the generation of crosslinked products or carbonized products due to the thermal history of the resin, a method using a forced side feeder that supplies the raw materials from the side of the extruder is more preferable, and a method in which forced side feeders are provided at the second to fourth raw material supply ports and the raw material powders are supplied in portions is even more preferable.

[0089] When adding a liquid raw material, it is preferable to add it into the extruder using a plunger pump, gear pump or the like.

[0090] The upper openings of the second to fourth raw material supply ports of the extruder can also be used as openings for venting the air being transported.

[0091] The melt-kneading temperature and screw rotation speed in the melt-kneading step of the resin composition are not particularly limited, but can be selected so that the resin can be heated and melted without difficulty and processed at a temperature equal to or higher than the melting point of the crystalline resin for the crystalline resin, or at a temperature equal to or higher than the glass transition temperature of the amorphous resin for the amorphous resin. Typically, the temperature is selected arbitrarily from 200 to 370°C, and the screw rotation speed is 100 to 1200 rpm.

[0092] To reduce the generation of crosslinked or charred resins due to thermal history in the presence of oxygen, it is preferable to maintain the oxygen concentration of each raw material in the process line of the extruder at less than 1.0% by volume. The above-mentioned addition route is not particularly limited, but a specific example may include, in order from a stock tank, piping, a gravimetric feeder with a refill tank, piping, a supply hopper, and a twin-screw extruder. A method for maintaining such a low oxygen concentration is not particularly limited, but an effective method is to introduce an inert gas into each process line with increased airtightness. Usually, it is preferable to introduce nitrogen gas to maintain the oxygen concentration at less than 1.0% by volume.

[0093] The method for producing a resin composition containing the polyphenylene ether-based resin, when the polyphenylene ether-based resin contains a powdery component (having a volume average particle size of less than 10 μm), has the effect of further reducing residues in the screws of a twin-screw extruder when the resin composition is produced using a twin-screw extruder, and further has the effect of reducing the generation of black spots, carbonized matter, and the like in the resin composition obtained by the above-mentioned production method.

[0094] -Characteristics of resin composition- The Vicat softening point of the resin composition is preferably 130°C or higher, more preferably 140°C or higher, even more preferably 150 to 200°C, and particularly preferably 160 to 200°C, from the viewpoint of further reducing the thermal shrinkage of the covering member (for example, secondary shrinkage A after thermal aging at 150°C for 24 hours). The Vicat softening point is a value measured in accordance with JIS K 7206 A50, and specifically, can be measured by the method described in the examples below.

[0095] The surface hardness of the resin composition is preferably 60 or more, more preferably 80 or more, and even more preferably 90 or more, from the viewpoint of making the wiring component less likely to deform. The surface hardness may be determined as Rockwell hardness measured on the M scale in accordance with JIS K 7202-2 using a type A test piece molded in accordance with ISO 10724-1, by feeding pellets of the resin composition into a screw inline injection molding machine set at a cylinder temperature of 270 to 320°C and a mold temperature of 60 to 120°C.

[0096] The flexural modulus of the resin composition is preferably 1800 MPa or more, more preferably 2000 to 3000 MPa, and even more preferably 2200 to 3000 MPa, from the viewpoint of making the wiring component less susceptible to deformation. The flexural modulus may be defined as the flexural modulus (MPa) measured in accordance with ISO178 using a type A test piece molded in accordance with ISO10724-1, by feeding pellets of the resin composition into a screw in-line injection molding machine set at a cylinder temperature of 270 to 320°C and a mold temperature of 60 to 120°C, and using this test piece.

[0097] -Method of manufacturing coated components- The covering member can be produced, for example, by injection molding the resin composition. For example, the resin composition, optionally obtained in the form of pellets, is introduced into a mold cavity of an injection molding machine and injection molded.

[0098] The mold temperature during injection molding is preferably 50 to 90°C, more preferably 60 to 90°C, and even more preferably 70 to 90°C, from the viewpoint of further reducing the thermal shrinkage of the covering member (for example, secondary shrinkage A after thermal aging at 150°C for 24 hours).

[0099] The resin temperature during injection molding is preferably 240 to 290°C, more preferably 250 to 290°C, and even more preferably 260 to 290°C, from the viewpoint of further reducing the thermal shrinkage of the covering member (for example, secondary shrinkage A after thermal aging at 150°C for 24 hours).

[0100] The holding pressure during injection molding (holding pressure relative to the maximum injection pressure) is preferably 20 to 90%, more preferably 50 to 90%, and even more preferably 70 to 90%, from the viewpoint of further reducing the thermal shrinkage of the covering member (for example, secondary shrinkage A after thermal aging at 150°C for 24 hours).

[0101] The injection time during injection molding is preferably 15 seconds or longer, more preferably 20 seconds or longer, from the viewpoint of further reducing the thermal shrinkage of the covering member (for example, secondary shrinkage A after heat aging at 150°C for 24 hours).

[0102] The covering member may cover the conductive member so that the extending direction when measuring the secondary shrinkage A is the direction along the surface of the conductive member from one end to the other end.

[0103] The applications of the wiring component of this embodiment are not particularly limited, and examples thereof include electrical equipment such as assembled batteries, secondary batteries, and distribution boards; electrical wiring within buildings; components within home appliances; and electrical circuits within objects that are driven by multiple wheels on roads or tracks. [Example]

[0104] The present invention will be described in more detail below based on examples, but the present invention is not limited to these examples.

[0105] The raw materials used in the examples and comparative examples are shown below. -(a) Polypropylene resin- Polypropylene homopolymer with MFR of 20 g / 10 min The MFR was measured in accordance with ISO1133 under conditions of a temperature of 230°C and a load of 2.16 kg.

[0106] -(b) Polyphenylene ether resin- Polyphenylene ether obtained by oxidative polymerization of 2,6-xylenol, with a reduced viscosity (ηsp / c: 0.5 g / dL chloroform solution) of 0.42 The reduced viscosity was measured at 30°C using a chloroform solution with ηsp / c of ​​0.5 g / dL.

[0107] -(c) Hydrogenated block copolymer- The polymer synthesized is as follows: A block copolymer having a block structure was synthesized by a known method, with polymer block A consisting of polystyrene and polymer block B consisting of polybutadiene. The synthesized block copolymer was hydrogenated by a known method. The polymer was not modified. The physical properties of the obtained unmodified hydrogenated block copolymer are shown below. (ci) BABA type Polystyrene content in block copolymer before hydrogenation: 44%, number average molecular weight (Mn) of block copolymer before hydrogenation: 95,000, number average molecular weight (Mn) of polystyrene block: 41,800, number average molecular weight (Mn) of polybutadiene block: 53,200, molecular weight distribution (Mw / Mn) of block copolymer before hydrogenation: 1.06, total vinyl bond content (1,2-vinyl bond content) in polybutadiene block before hydrogenation: 75%, hydrogenation rate of polybutadiene portion constituting polybutadiene block: 99.9% The content of vinyl aromatic compounds was measured using an ultraviolet spectrophotometer. The number average molecular weight (Mn) was determined by a conventional method using GPC (mobile phase: chloroform, standard: polystyrene). The molecular weight distribution (Mw / Mn) was calculated by dividing the weight average molecular weight (Mw) determined by a conventional method using GPC (mobile phase: chloroform, standard: polystyrene) by the number average molecular weight (Mn) described above. The total vinyl bond content was measured using an infrared spectrophotometer and calculated according to the method described in Analytical Chemistry, Volume 21, No. 8, August 1949. The hydrogenation rate was measured using a nuclear magnetic resonance (NMR) spectrometer.

[0108] -(d) Phosphinates- Clariant Japan "Exolit OP1230"

[0109] -(e) Melamine polyphosphate- BASF "Melapur 200 70"

[0110] -(f) Phosphate ester compounds- Daihachi Chemical Co., Ltd. "E890" (condensed phosphate ester compound)

[0111] -(g) Talc- Talc MS manufactured by Nippon Talc Co., Ltd. (average particle size (D50) measured by laser diffraction method = 14 μm)

[0112] -Conductive materials- In Examples 1 to 7 and Comparative Examples 1 and 2, the conductive members were made of JIS-H-3100 copper as the copper plate and JIS-H-4000 aluminum alloy as the aluminum plate, and had the shape shown in FIG. 4(A). Plate thickness: 2.0 mm, width: 20 mm, extension length: 480 mm, or Plate thickness: 3.0 mm, width: 30 mm, extension length: 620 mm A plate material was prepared. The two types of conductive members described above were made of a single component. In Example 8, the following conductive members were used. The copper plates were made of JIS-H-3100 copper, and 13 members each consisting of a single plate material component with the shape shown in Figure 1, thickness: 2.0 mm, width: 10 mm, and extension length: 30 mm were used. In Example 9, the following conductive members were used. The copper plates used were JIS-H-3100 copper, and three members each consisting of a single plate material component with the shape shown in Figure 1, thickness: 3.0 mm, width: 30 mm, and extension length: 110 mm were used.

[0113] (Examples 1 to 9, Comparative Examples 1 and 2) -Resin composition- The melt kneader used to produce the resin composition was a twin-screw extruder (ZSK-25, manufactured by Coperion). The L / D of the extruder was set to 35. The twin-screw extruder was configured to have a first raw material supply port on the upstream side in the direction in which the raw materials flow, a vacuum vent downstream of the first raw material supply port, a liquid addition pump downstream of the vacuum vent, a second raw material supply port downstream of the liquid addition pump, and a vacuum vent downstream of the second raw material supply port. The raw material was supplied to the second raw material supply port by adding it from the side opening using a forced side feeder. Components (a) to (g) were fed into the twin-screw extruder set up as described above in the compositions shown in Table 1, with components (a) to (e) fed through the first raw material feed port, component (f) fed through the first raw material feed port, and component (g) fed through the second raw material feed port, and melt-kneaded to produce a pelletized resin composition. The kneading conditions were as follows: extruder barrel temperature (from the first raw material feed port to the second raw material feed port): 270 to 320°C; extruder barrel temperature (from the second raw material feed port to the die head): 270 to 320°C; screw rotation speed: 300 rpm; and extrusion rate: 15 kg / hour. In Table 1, "PPE / PP ratio" refers to the mass ratio relative to 100% by mass of the total mass of PPE and PP. Furthermore, "mass ratio of (ci)," "mass ratio of (d) / (e) / (f)," and "mass ratio of (g)" refer to the mass ratio relative to 100% by mass of the resin composition. In the resin compositions of the examples and comparative examples, all components other than (ci), (d), (e), (f), and (g) are PPE or PP.

[0114] -Coating conductive components with coating materials- The obtained pellets of the resin composition were fed into an injection molding machine (product name: SE-180-HP, manufactured by Sumitomo Heavy Industries, Ltd.), and a coated member having the average thickness, coverage, and clearance shown in Table 1 was molded under the molding conditions of resin temperature, mold temperature, pressure dwell relative to maximum injection pressure, injection time, and cooling time shown in Table 1. The materials listed in Table 1 were used as the conductive materials. In the case of the one-piece type, the conductive material was coated by insert molding, and in the case of the interlocking type, multiple molded products obtained by injection molding were attached to the conductive material and interlocked to coat it. In Examples 8 and 9, one conductive member was fitted and covered with one covering member having a hinge portion. In Example 8, six or seven conductive members were aligned in the extension direction and connected in a U-shape (FIG. 5). Note that FIG. 5 is a view after fitting and connection. The surfaces of conductive members 2 (in FIG. 5, the upper row is seven rectangular conductive members with two holes (only half of the conductive members at the left and right ends are exposed, and the middle portion of the middle conductive member is covered with a covering member), and the lower row is six rectangular conductive members with two holes (the middle portion of the conductive member is covered with a covering member)) are exposed, but the other surfaces are covered with covering member 3. In Example 8, two conductive members aligned in a line in the extension direction are prepared in opposing positions (FIG. 5), and connected in a U-shape, resulting in a wiring component with 13 conductive members. In Example 9, three conductive members were aligned in the extension direction and connected in the extension direction of the conductive members. The surface of the conductive member 2 (three rectangular conductive members with two holes each (the middle part of the conductive member is covered with a covering member)) is exposed, but the other surfaces are covered with a covering member 3. In Examples 8 and 9, the extension direction is the direction in which the conductive members are aligned (the left-right direction in FIG. 5).

[0115] [evaluation] The wiring components obtained in the examples and comparative examples were subjected to the following measurements.

[0116] -Average clearance C- The conductive member coated with the coating member of each Example and Comparative Example was divided into four equal parts in the extension direction, and measurements were performed at three locations in the cross-sectional direction using X-ray CT (apparatus: inspeXio SMX-255CT (manufactured by Shimadzu Corporation), X-ray conditions (X-ray target: W, X-ray tube voltage / tube current: 210)). When the measurement location after dividing into four equal parts was a bent part of the coating member or a location where no conductive member was present, measurements were performed on the nearest straight part from the measurement location or on a cross-section where a conductive member was present. The average value (mm) of the clearance C at the three locations was taken as the average clearance C (mm).

[0117] -Thickness, secondary shrinkage- The coated members of each Example and Comparative Example were left standing in an environment of 23°C and 50% RH for 7 days. After standing, they were divided into four equal parts in the extension direction, and flat plates were cut out from three central locations in the width direction so that each square had 10 mm sides in both the extension direction and the width direction. If the cut-out locations after dividing into four equal parts are bent parts of the coated member or locations where no conductive member is present, the flat plate may be cut out from the nearest straight part from the above locations or from a cross section where a conductive member is present. If the width length is less than 10 mm, the flat plate may be cut out to the maximum possible width. The thickness (mm) of the central portion of the cut-out flat plate was measured using a micrometer. Then, the length corresponding to the extension direction of the covering member was measured in advance using a macroscope (3D shape measuring machine VR-3000 (manufactured by Keyence)) (referred to as dimension L). Then, the flat plate was placed in an oven, 150 After the thermal aging, the flat plate was removed and left to stand for one day in an environment of 23°C and 50% RH. After the standing, the length of the covering member in the extension direction was measured with a macroscope in the same manner as before the thermal aging (referred to as dimension L'). The thermal shrinkage of each sample was calculated using the following formula (3), and the average value was taken as the secondary shrinkage A (%). Heat shrinkage rate (%) = (L - L') / L × 100 (3)

[0118] -Evaluation of metal deterioration resistance- The evaluation test method for metal deterioration resistance (crack occurrence) at high temperatures is as follows. A 10mm square plate was cut from the adjacent area of ​​a 10mm square plate cut using the method described in "Thickness, Secondary Shrinkage." The plate was sandwiched between two 10mm x 10mm x 0.127mm thick copper foil sheets, and the center of the plate was fastened with a binder clip to secure the copper foil to the plate. This copper foil-attached plate was placed in a hot air oven and subjected to a heating test at 150°C for 1000 hours. After the heating test began, the plate with the copper foil was checked for fracture.

[0119] -Vicat softening point- Pellets of the resin composition of each example and comparative example were fed into a screw in-line injection molding machine with the cylinder set to 270 to 320°C and the mold set to 60 to 120°C, and test pieces of type A were molded in accordance with ISO 10724-1. Using these test pieces, the Vicat softening point (°C) was measured in accordance with JIS K 7206 A50.

[0120] -Heat cycle test- The wiring components of each example and comparative example were left in an environment of 23°C and 50% RH for at least 7 days. After leaving the components, a heat shock resistance test was performed using a thermal shock tester (a condensation cycle tester DC2010S (manufactured by Kusumoto Chemicals)) for 500 cycles, each cycle consisting of heating at 120°C for 30 minutes, cooling to -10°C for 30 minutes, and then heating back to 120°C. The coating was visually inspected for cracks and misalignment. Cases without cracks or misalignment were evaluated as ○ (good), and cases with cracks and / or misalignment were evaluated as × (poor).

[0121] [Table 1] [Industrial Applicability]

[0122] The wiring components of the present invention can be used, for example, as wiring components in electrical equipment such as assembled batteries, secondary batteries, and distribution boards; electrical wiring components in buildings; wiring components in home appliances; and wiring components for electrical circuits in objects that are driven by multiple wheels on roads or tracks. [Explanation of symbols]

[0123] 1 Wiring parts 2. Conductive materials 3 Covering materials 4. Fitting

Claims

1. A wiring component including conductive members having a total extension length of 300 mm or more and a covering member covering the conductive members, the conductive member penetrates the covering member from one end to the other end in the extending direction of the covering member, the extending direction is a direction along the surface of the conductive member from one end to the other end of the conductive member, the average distance C between the conductive member and the covering member (average clearance C) is 5 mm or less; the covering member is made of a resin composition containing a polypropylene-based resin and a polyphenylene ether-based resin, The secondary shrinkage A (%) in the extending longitudinal direction of the coated member after heat aging at 150°C for 24 hours is calculated by the following formula (1): A<9.6×e －０．９３ｔ ・・・(1) (In formula (1), e is the base of the natural logarithm, and t is the thickness (mm) of the covering member.) Fulfilling the covering member covers the conductive member such that the extending length direction during the secondary shrinkage A is the length direction along the surface of the conductive member from one end to the other end of the conductive member. A wiring component characterized by:

2. 2. The wiring component according to claim 1, wherein the covering member is a member that does not break after being sandwiched between copper foils and subjected to thermal aging at 150[deg.] C. for 1000 hours.

3. The wiring component according to claim 1 or 2, wherein the conductive member is a bus bar.

4. The wiring component according to any one of claims 1 to 3, wherein the resin composition has a Vicat softening point of 130°C or higher.

5. A method for manufacturing a coating member that covers a conductive member by injection molding, The mold temperature during the injection molding is 50 to 90°C.

5. The method for manufacturing a wiring component according to claim 1.

Images