Plasma processing equipment

The plasma processing apparatus addresses the challenge of in-plane uniformity by using a gas supply system with multiple inlets and a controller to manage gas distribution, achieving improved uniformity and controllability in plasma processing.

JP7727528B2Active Publication Date: 2025-08-21TOKYO ELECTRON LTD
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Patent Information

Application Number
JP2021209634
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2021-12-23
Publication Date
2025-08-21
Estimated Expiration
2041-12-23

AI Technical Summary

Technical Problem

Existing plasma processing apparatuses face challenges in achieving uniformity of plasma processing across the substrate surface, particularly in controlling the in-plane uniformity of plasma processing.

Method used

A plasma processing apparatus with a gas supply system that includes a showerhead with multiple gas inlets and a controller to independently control the supply of different gases to these inlets, allowing for precise control of gas distribution and flow rates to achieve uniform plasma processing.

Benefits of technology

The apparatus enhances in-plane uniformity of plasma processing by allowing for fine adjustment of gas distribution, improving the controllability of substrate processing and expanding the process window.

✦ Generated by Eureka AI based on patent content.

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Abstract

To provide plasma processing equipment and a gas supply method that control in-plane uniformity of plasma processing.SOLUTION: Plasma processing equipment is provided, comprising: a plasma processing chamber which has a substrate support portion supporting a substrate; a shower head which has a plurality of gas introduction portions configured to respectively introduce gas into respective region within the plasma processing chamber; a gas supply portion which supplies the gas to the plurality of gas introduction portions; a plasma generation portion which generates plasma of the gas; and a control portion which controls at least the gas supply portion. The gas supply portion comprises: a gas unit which supplies common gas to the plurality of gas introduction portions; and an injection unit which supplies injection gas to the selected gas introduction portion, of the plurality of the gas introduction portions. The control portion controls the injection unit in such a way that two or more type of the injection gas is supplied to the two different gas introduction portions.SELECTED DRAWING: Figure 2
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Citation Information

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