Chip collection device

Abstract

To provide a chip collection device capable of automatically collecting chips of tape material.SOLUTION: The chip collection device is a device for collecting chips of a tape material discharged from a tape feeder that supplies components using the tape material. The chip collection device has a tubular collection path and a positive pressure supply unit. The collection path has an air inlet at a first end and an air outlet at a second end. In an area between the air inlet and the air outlet, a chip entrance opening is provided for chips discharged from the tape feeder to enter. The positive pressure supply unit supplies positive pressure to the air inlet of the collection path to form airflow from the air inlet to the air outlet in the collection path. With this, the positive pressure supply unit sends chips into the collection path via the chip entrance opening to the air outlet.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present disclosure relates to a chip collection device that collects chips of a tape member discharged from a tape feeder. [Background technology]

[0002] A conventional component placement device (component mounting device) that places (mounts) components on a circuit board uses a placement head to pick up components supplied from a component supply unit and place them on the circuit board. Tape feeders that supply components using a tape member are often used as the component supply unit. Tape feeders transport a tape member (carrier tape) that stores a large number of components lined up in a row and supply it to the component supply position. After supplying the components, the tape member is cut by a cutter device and then dropped down under its own weight through a chute and discharged.

[0003] Tape scraps discharged from a component mounting device are collected in a container installed below the component mounting device. Workers collect the scraps by pulling out the container from below the component mounting device. Therefore, in a production line where multiple component mounting devices are lined up, the amount of tape scraps generated becomes enormous, and the task of collecting them places a heavy burden on workers. For this reason, scrap collection devices that automatically collect scraps have been proposed. For example, Patent Document 1 discloses a technology in which scraps of a tape material that are cut and fall are guided into a tubular transport path, and then a positive pressure is applied to the side of the transport path where the scraps fall and a negative pressure is applied to the side where the scraps are discharged, thereby moving the scraps to the exit of the transport path. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] International Publication No. 2017 / 026030 Summary of the Invention

[0005] The present disclosure relates to a chip collection device that collects chips of a tape member discharged from a tape feeder that supplies components using the tape member, the device comprising: a tubular collection path having a first end and a second end, and a chip inlet opening through which the chips discharged from the tape feeder enter in a region between the first end and the second end; and a positive pressure supply unit that supplies positive pressure to the collection path and creates an air flow within the collection path toward the second end, thereby pressure-feeding the chips that have entered the collection path through the chip inlet opening to the second end, the collection path having an inclined portion extending diagonally upward, a horizontal portion that is located in the collection path closer to the second end than the inclined portion, and an opening provided in the horizontal portion. The chip inlet opening is provided in the vertical wall of the recovery path. , a chip collection device is provided.

[0006] According to the present disclosure, scraps of tape members can be automatically collected with an inexpensive configuration. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is a perspective view showing a chip collection device according to a first embodiment of the present disclosure together with a work line including a plurality of component mounting devices; [Figure 2] FIG. 2 is a side view of one of the component mounting apparatuses shown in FIG. [Figure 3] FIG. 3 is an enlarged cross-sectional side view of a portion of the component mounting device shown in FIG. [Figure 4] FIG. 2 is a perspective view of the chip collection device shown in FIG. [Figure 5] FIG. 5 is a partially exploded perspective view of the chip collection device shown in FIG. [Figure 6A] FIG. 5 is a cutaway perspective view of a portion of the chip collection device shown in FIG. [Figure 6B] FIG. 6B is a diagram showing a state in which the opening and closing plate in FIG. 6A is opened. [Figure 7A] FIG. 5 is a perspective view of a storage section of the chip collection device shown in FIG. [Figure 7B] 7B is a side view of the housing shown in FIG. 7A. [Figure 8A] FIG. 1 is an explanatory diagram of the operation of the chip collection device according to the first embodiment of the present disclosure. [Figure 8B] 8A, which is a diagram illustrating the operation of the chip collection device. [Figure 8C] An explanatory diagram of the operation of the chip collection device, following FIG. 8B. [Figure 9A] FIG. 1 is an explanatory diagram of the operation of the chip collection device according to the first embodiment of the present disclosure. [Figure 9B] 9A, which is a diagram illustrating the operation of the chip collection device. [Figure 9C] 9B , which is a diagram illustrating the operation of the chip collection device. [Figure 10A] FIG. 7B is a diagram illustrating the operation of the storage unit shown in FIG. [Figure 10B] 10A, which is a diagram illustrating the operation of the storage unit. [Figure 10C] 10B , which is a diagram illustrating the operation of the storage unit. [Figure 11A] FIG. 10 is a cutaway perspective view of a portion of a chip collection device according to a second embodiment of the present disclosure. [Figure 11B] 11B is a cross-sectional view of a portion of the chip collection device shown in FIG. [Figure 12A] FIG. 10 is a cutaway perspective view of a portion of a chip collection device according to a third embodiment of the present disclosure. [Figure 12B] FIG. 12B is a perspective view showing a state in which the bent opening / closing plate in FIG. 12A is opened. [Figure 13A] FIG. 10 is an explanatory diagram of the operation of the chip collection device according to the third embodiment of the present disclosure. [Figure 13B] 13A, which is a diagram illustrating the operation of the chip collecting device. [Figure 13C] 13B , which is a diagram illustrating the operation of the chip collection device. [Figure 14] FIG. 10 is a cutaway perspective view of a portion of a chip collection device according to a fourth embodiment of the present disclosure. [Figure 15A] FIG. 10 is an explanatory diagram of the operation of the chip collection device according to the fourth embodiment of the present disclosure. [Figure 15B] 15A, which is a diagram illustrating the operation of the chip collecting device. [Figure 16A] FIG. 10 is a cross-sectional view of a portion of a chip collection device according to a fourth embodiment of the present disclosure. [Figure 16B] FIG. 10 is a cross-sectional view of a portion of another chip collection device according to the fourth embodiment of the present disclosure. [Figure 17] FIG. 10 is a diagram illustrating a separation distance of a chip collection device according to a fourth embodiment of the present disclosure. [Figure 18] FIG. 13 is a perspective view of a chip collection device according to a fifth embodiment of the present disclosure. [Figure 19] FIG. 13 is a perspective view of a chip collection device according to a sixth embodiment of the present disclosure. [Figure 20] 20 is a cross-sectional view of a portion of the chip collection device shown in FIG. [Figure 21] FIG. 13 is a perspective view of a chip collection device according to a seventh embodiment of the present disclosure. [Figure 22] FIG. 19 is a perspective view of a chip collection device according to an eighth embodiment of the present disclosure. [Figure 23] 23 is a cross-sectional view of a portion of the chip collection device shown in FIG. [Figure 24] FIG. 13 is a side cross-sectional view of a portion of a chip collection device according to a ninth embodiment of the present disclosure. [Figure 25] 25 is a cutaway perspective view of a part of the collection path of the chip collection device shown in FIG. 24; [Figure 26A] 13 is an explanatory diagram of the operation of the chip collection device according to the ninth embodiment of the present disclosure. [Figure 26B] 26A, which is a diagram illustrating the operation of the chip collecting device. DETAILED DESCRIPTION OF THE INVENTION

[0008] Before describing the embodiments of the present disclosure, we will briefly explain how the idea for the present disclosure was conceived. The chip collection device described in Patent Document 1 requires both a positive pressure generator that generates positive pressure and a negative pressure generator that generates negative pressure. This requires large-scale equipment and increases manufacturing costs.

[0009] The present disclosure provides a chip collection device that can automatically collect chips of tape members with an inexpensive configuration.

[0010] Hereinafter, various embodiments of the present disclosure will be described with reference to the drawings. Note that the same reference numerals will be used to designate the same components as those in the preceding embodiments, and detailed descriptions thereof may be omitted.

[0011] (Embodiment 1) FIG. 1 shows a work line 2 to which a chip collection device 1 according to a first embodiment of the present disclosure is applied. On the work line 2, multiple (three in this example) component mounting devices 3 are lined up in series. Each component mounting device 3 delivers a board KB to an adjacent downstream component mounting device 3. Each component mounting device 3 mounts a component onto the board KB. In this embodiment, on the work line 2, the board KB is delivered along the X-axis. That is, the X-axis extends horizontally from left to right as seen by the operator OP, and the three component mounting devices 3 are lined up along the X-axis. The Y-axis is perpendicular to the X-axis in the horizontal plane. That is, the Y-axis extends from front to back as seen by the operator OP. The Z-axis extends from bottom to top. The X-axis, Y-axis, and Z-axis are defined in the same manner in the second and subsequent embodiments.

[0012] 2 is a side view of the component mounting device 3. The component mounting device 3 has a base 11 and a cover member 12 that covers the top of the base 11, and two board transport paths 14 are provided inside a work space 13 covered by the cover member 12. Each of the board transport paths 14 has a conveyor mechanism provided on the base 11, which transports the board KB along the X axis and positions it at a predetermined work position.

[0013] Feeder carriages 15 are attached to the front and rear ends of base 11. As shown in Fig. 1, a plurality of tape feeders 16 are attached to each feeder carriage 15 and aligned along the X axis. In Fig. 2, each tape feeder 16 takes in carrier tape 18 (tape member) unwound from tape reel 17 held by feeder carriage 15 and transports it along the Y axis toward board transport path 14. In this way, tape feeder 16 supplies components BH stored on carrier tape 18 to component supply position 16K.

[0014] Two mounting heads 21 are provided above the base 11 and are moved by a head movement mechanism 22. Each of the mounting heads 21 has a nozzle 21N extending downward. The head movement mechanism 22 includes, for example, a Cartesian coordinate robot, and moves the two mounting heads 21 independently within a horizontal plane. Each of the nozzles 21N of the mounting heads 21 picks up a component BH supplied to the component supply position 16K by the tape feeder 16 by suctioning it to its lower end.

[0015] The component mounting device 3 has a control device 23. The control device 23 controls the operations of the board transport path 14, the tape feeder 16, the mounting head 21, and the head moving mechanism 22.

[0016] When performing component mounting work, the control device 23 first operates the board transport path 14 to receive the board KB from an upstream device (upstream in the flow of boards KB) and positions the board KB. After positioning the board KB, the control device 23 operates the tape feeder 16 to supply components BH to the component supply position 16K, while operating the head moving mechanism 22 to cause the mounting head 21 to repeatedly perform component transfer operations. The component transfer operations include an operation in which the mounting head 21 picks up the components BH supplied by the tape feeder 16, and an operation in which the mounting head 21 mounts the picked-up components BH onto the board KB.

[0017] The control device 23 causes the mounting head 21 to repeatedly execute the component transfer operation, thereby mounting all of the components BH to be mounted on the board KB. Once this series of operations is complete, the control device 23 operates the board transport path 14 to transport the board KB downstream in the flow of boards KB. After the three component mounting devices 3 have mounted the components BH on the board KB in this manner, the component mounting device 3 located most downstream transports the board KB to a device downstream in the work line 2 (downstream in the flow of boards KB), completing the component mounting operation for one board KB.

[0018] Next, the chip collection device 1 will be described. First, cutting of the carrier tape 18 will be described. As shown in FIG. 2, each feeder cart 15 of the component mounting device 3 has a cutter device 31 and a chute 32. The cutter device 31 is provided below the tape feeder 16. The cutter device 31 cuts the carrier tape 18 after the tape feeder 16 has finished supplying components BH. The chute 32 is provided below the cutter device 31. The chute 32 guides chips KZ of the carrier tape 18 that are cut by the cutter device 31 and fall under their own weight. FIG. 3 is an enlarged cross-sectional view of region III in FIG. 2. As shown in FIG. 3, the chips KZ are discharged downward from a discharge opening 32K at the lower end of the chute 32, exit the feeder cart 15, and enter a receiving section 42, which will be described later.

[0019] In this way, chips KZ are generated from each of the component mounting devices 3 that make up the work line 2, and the amount of chips KZ of the carrier tape 18 generated throughout the work line 2 is enormous. The chip collection device 1 automatically collects the large amount of chips KZ generated from the work line 2 in one place without manual intervention, making it easy to dispose of them.

[0020] As shown in FIG. 4, the chip recovery device 1 has two recovery paths 41, six receiving sections 42, a positive pressure supply section 43, and a storage section 44. The recovery paths 41 are tubular members extending in the direction in which the component mounting devices 3 are arranged, and are installed on the floor surface FL. In other words, the recovery paths 41 extend along the X-axis. Two recovery paths 41 are installed side by side, one in front and one in back. The recovery path 41 installed on the front side corresponds to the three feeder carts 15 located on the front side, and the recovery path 41 installed on the rear side corresponds to the three feeder carts 15 located on the rear side.

[0021] Each recovery path 41 extends linearly in the area below the multiple component mounting devices 3 lined up in series along the X-axis. Each recovery path 41 has an opening at a first end located upstream of the flow of boards KB and a second end located downstream of the flow of boards KB (see also FIG. 5). Hereinafter, the opening at the first end of recovery path 41 will be referred to as air inlet 41A, and the opening at the second end of recovery path 41 will be referred to as air outlet 41B.

[0022] 6A and 6B, recovery path 41 has a hollow shape with a rectangular cross section, and includes an upper wall 41C, a lower wall 41D, and a first vertical wall 41E and a second vertical wall 41F that face each other along the Y axis. First vertical wall 41E is closer to feeder cart 15 than second vertical wall 41F.

[0023] As shown in Fig. 5, each recovery path 41 is provided with a plurality of chip entrance openings (hereinafter referred to as "openings") 41K in the area between the air inlet 41A and the air outlet 41B. Chips KZ from the tape feeder 16 discharged through the chute 32 of the feeder cart 15 enter each of the openings 41K. As shown in Fig. 6B, the openings 41K are provided in a first vertical wall 41E of the recovery path 41. As shown in Fig. 5, each recovery path 41 corresponds to three component mounting devices 3, and each recovery path 41 is provided with three openings 41K in the direction in which the component mounting devices 3 are lined up. In other words, the three openings 41K are aligned along the X-axis.

[0024] 4 and 5, the area of ​​recovery path 41 near air outlet 41B extends obliquely upward toward air outlet 41B. The end of recovery path 41's obliquely upward extension is a horizontal section, and air outlet 41B opens to the underside of this horizontal section.

[0025] As shown in FIG. 5, ventilation holes 41H are provided in the recovery path 41 near each air outlet 41B. Specifically, the ventilation holes 41H are provided in a portion between the air outlet 41B and the opening 41K located closest to the air outlet 41B. In other words, the ventilation holes 41H are provided in the recovery path 41 downstream of the opening 41K that is located furthest downstream in the direction of air flow in the recovery path 41 among the openings 41K. The ventilation holes 41H are openings that connect the inside and outside of the recovery path 41. A mesh member having a mesh size that does not allow the chips KZ to pass through is attached to the ventilation holes 41H. Alternatively, the ventilation holes 41H may be large enough to not allow the chips KZ to pass through.

[0026] As shown in FIGS. 6A and 6B, an opening / closing plate 60 serving as a shutter member for opening and closing the opening 41K is provided on the inner surface of the first vertical wall 41E. The opening / closing plate 60 is a flat, rectangular member, and a base end KT of the opening / closing plate 60 is rotatably attached to the inner surface of the recovery path 41. More specifically, the base end KT is attached to the inner surface of the recovery path 41 via a hinge 61. The axis of the hinge 61 extends vertically. Therefore, the opening / closing plate 60 is configured to swing around the axis of the hinge 61 (i.e., in the horizontal plane) to open and close the opening 41K. In other words, the opening / closing plate 60 is a door-like member, and the base end KT is rotatable around the axis of the hinge 61. In this way, the base end KT of the opening / closing plate 60 is attached to the inner surface of the recovery path 41, and the opening / closing plate 60 is provided to be rotatable around the base end KT.

[0027] Fig. 6A shows a state in which the opening / closing plate 60 is closed and the opening 41K is closed. On the other hand, Fig. 6B shows a state in which the opening / closing plate 60 is open and the opening 41K is open. As can be seen from Fig. 6B, the opening / closing plate 60 can be opened until the tip ST abuts against the second vertical wall 41F of the recovery path 41.

[0028] As shown in Fig. 2, the receiving unit 42 is installed on the floor surface FL below each of the feeder carts 15. The receiving unit 42 has an overall box shape, and as shown in Fig. 5, the surface facing the recovery path 41 is open.

[0029] As shown in Figures 5 to 6B, the receiving units 42 are attached to the outside of the first vertical wall 41E, and cover the openings 41K provided in the first vertical wall 41E from the outside of the recovery path 41. As shown in Figures 4 and 5, three receiving units 42 are connected to each of the front recovery path 41 and the rear recovery path 41.

[0030] As shown in Figures 4 to 6B, a chip receiving opening 42K that opens upward is provided on the top surface of the receiving unit 42. As shown in Figure 3, the chip receiving opening 42K is located directly below the chute 32 of the feeder cart 15. Therefore, chips KZ that fall through the chute 32 due to their own weight enter the receiving unit 42 through the chip receiving opening 42K. In other words, the receiving unit 42 receives the chips KZ discharged from the tape feeder 16 from the chip receiving opening 42K that is provided so as to open upward.

[0031] As shown in FIGS. 3 and 5 to 6B, an air blower 51 is provided inside the receiving section 42. As shown in FIGS. 4 and 5, the three air blowers 51 provided in the three front receiving sections 42 are connected in series by a duct 52. Similarly, the three air blowers 51 provided in the three rear receiving sections 42 are connected in series by a duct 52. The duct 52 is an air supply path that extends along the X-axis. In detail, in a plan view, multiple air blowers 51 are connected to the duct 52. The duct 52 is provided approximately parallel to the recovery path 41. The downstream end of the duct 52 in the air flow direction is closed, and the direction in which the air supplied to the duct 52 flows is the same as the direction in which the air supplied to the recovery path 41 flows.

[0032] 6A and 6B, the air blower 51 in the receiving section 42 is provided with a plurality of air outlets 51N aligned in the direction in which the duct 52 extends. That is, the air outlets 51N are provided along the X-axis. Each of the air outlets 51N opens toward the opening 41K of the recovery path 41.

[0033] 4, the positive pressure supply unit 43 is connected to a positive pressure source 72 via an external pipe 71. The positive pressure supply unit 43 has a built-in control valve 43V. Each air inlet 41A of the recovery line 41 and each upstream end of the pipe 52 are connected to the control valve 43V via internal pipes (not shown) provided inside the positive pressure supply unit 43. The external pipes 71 are connected to these internal pipes via the control valves 43V.

[0034] The positive pressure supply unit 43 controls the positive pressure supplied from the positive pressure source 72 through the external piping 71 with the control valve 43V, thereby supplying positive pressure to each air inlet 41A of the recovery path 41. When positive pressure is supplied to the air inlet 41A of the recovery path 41, an air flow is formed in the recovery path 41 from the air inlet 41A to the air outlet 41B.

[0035] The positive pressure supply unit 43 also supplies positive pressure to each of the pipes 52 by controlling the positive pressure supplied from the positive pressure source 72 with the control valve 43V. When positive pressure is supplied into the pipes 52, air is blown out from the air outlets 51N of the air blowers 51 in each of the receivers 42 connected to the pipes 52. When air is blown out from the air blowers 51, the opening and closing plate 60 is pushed open from the inside of the receivers 42 as shown in FIG. 6B .

[0036] The operation of the control valve 43V is controlled by a management device 73 shown in Fig. 4, which is provided separately from the work line 2. Alternatively, one of the control devices 23 of the component mounting devices 3 constituting the work line 2 may control the operation of the control valve 43V.

[0037] As shown in FIGS. 7A and 7B, the storage section 44 has a belt conveyor 82. The belt conveyor 82 has a pair of frames 81, a plurality of pulleys, and a belt 82B. The frames 81 are arranged opposite each other along the X axis. The plurality of pulleys includes a drive pulley 82K and a plurality of driven pulleys 82J, and are rotatably supported by the frames 81. The belt 82B is stretched around these plurality of pulleys. Partitions 82H extending along the width of the belt 82B are provided at regular intervals on the surface of the belt 82B.

[0038] A drive motor (hereinafter referred to as motor) 83 is attached to one side of the frame 81, and the motor 83 rotates a drive pulley 82K via a drive belt 84, causing a belt 82B to run. A pair of belt guides 85 are provided on the frame 81, and the belt guides 85 guide both ends of the belt 82B. Therefore, the belt 82B runs along a predetermined path. The operation of the motor 83 is controlled by the management device 73 or a control device 23 of one of the multiple component mounting devices 3.

[0039] As shown in Fig. 7B, the transport area of ​​the belt conveyor 82 has a discharge area R1 that extends substantially horizontally along the Y axis, an ascending area R2 that is connected to the discharge area R1 and extends diagonally upward, and a dumping area R3 that is connected to the ascending area R2 and extends substantially horizontally along the Y axis. Each section on the belt 82B moves through these three areas in this order as the drive pulley 82K is rotated by the motor 83. That is, for example, the section of the belt 82B sandwiched between two adjacent partition sections 82H moves in the order of discharge area R1 → ascending area R2 → dumping area R3.

[0040] As shown in Fig. 4, the belt conveyor 82 is installed so that the discharge area R1 of the belt 82B is located directly below the air outlets 41B of the two recovery paths 41. As shown in Figs. 4 and 7A and 7B, a chip passage 86 is provided below the dump area R3 of the belt 82B, and a storage box 87 is installed below the chip passage 86. The storage box 87 is a box-shaped member that opens upward.

[0041] Next, we will explain the operation of the chip collection device 1. As described above, chips KZ of the carrier tape 18 are discharged from the feeder cart 15. The receiver 42 installed below the chute 32 receives the chips KZ through the chip receiving opening 42K as shown in Figures 8A and 9A.

[0042] The management device 73 performs the operation of collecting the chips KZ at regular intervals while the work line 2 is performing the component mounting operation. When performing the operation of collecting the chips KZ, the management device 73 first activates the control valve 43V of the positive pressure supply unit 43 to supply positive pressure to each of the pipelines 52. Note that the management device 73 supplies positive pressure to the pipelines 52 in a state where positive pressure is not being supplied to each of the air inlets 41A of the collection paths 41.

[0043] When positive pressure is supplied to each of the pipes 52, air is blown out from the air blower 51 (air blowing outlet 51N), as shown by dashed lines FD in FIGS. 8B and 9B. When air is blown out from the air blower 51, the opening / closing plate 60 covering the opening 41K is pushed open by the air, and the opening 41K is opened. Furthermore, the chips KZ in the receiving section 42 are pushed out from the opening 41K by the blown air and enter the recovery path 41. As a result, the chips KZ in the receiving section 42 are transferred into the recovery path 41.

[0044] In this way, the air blower 51 provided in the receiving part 42 blows air from the receiving part 42 toward the recovery path 41, thereby transferring the chips KZ received by the receiving part 42 into the recovery path 41. In this way, the air blower 51 functions as a transfer part that transfers the chips KZ received by the receiving part 42 into the recovery path 41 when positive pressure is not being supplied to the air inlet 41A of the recovery path 41 by the positive pressure supply part 43.

[0045] After causing air to be blown out from the air blower 51 in the receiving section 42 through the conduit 52, the management device 73 controls the control valve 43V to stop the supply of positive pressure to the conduit 52. In other words, the management device 73 stops the air from being blown out from the air blower 51. Then, the management device 73 supplies positive pressure to each air inlet 41A of the recovery path 41, as shown by arrow P in Figure 8C. This forms an air flow inside each recovery path 41 from the air inlet 41A toward the air outlet 41B.

[0046] When an air flow from the air inlet 41A toward the air outlet 41B is formed in the recovery path 41, the chips KZ transferred from the receiver 42 into the recovery path 41 are pressure-fed toward the air outlet 41B by the air flow (air pressure), as shown in FIGS. 8C and 9C. In this way, the air blowing from the air blower 51 is stopped, and an air flow is formed in the recovery path 41. Therefore, the opening and closing plates 60 provided in the recovery path 41 close the corresponding openings 41K. Therefore, the chips KZ are not obstructed by the opening and closing plates 60, and are pressure-fed smoothly through the recovery path 41 toward the air outlet 41B.

[0047] In this way, the positive pressure supply unit 43 supplies positive pressure to the air inlet 41A of the recovery path 41, and forms an air flow from the air inlet 41A to the air outlet 41B within the recovery path 41. Due to this air flow, the chips KZ that have entered the recovery path 41 through the opening 41K are pressure-fed to the air outlet 41B.

[0048] The chips KZ that have been pressure-fed through the recovery path 41 toward the air outlet 41B fall downward from the air outlet 41B, as shown in FIG. 10A. The chips KZ are then discharged into the discharge area R1 of the belt 82B located below the air outlet 41B. The management device 73 continues to supply positive pressure to the air inlet 41A for a predetermined time (several seconds). Then, once the chips KZ in the recovery path 41 have been discharged from the air outlet 41B onto the belt 82B, the management device 73 stops supplying positive pressure to the air inlet 41A of the recovery path 41.

[0049] As described above, the recovery path 41 has vent holes 41H near each air outlet 41B. While positive pressure is supplied to the air inlet 41A, the air in the recovery path 41 is released to the outside of the recovery path 41 through the vent holes 41H. This prevents the pressure from becoming extremely high at the downstream end of the recovery path 41, causing the air flow rate to decrease. This prevents a situation in which some of the chips KZ in the recovery path 41 do not reach the air outlet 41B due to a decrease in the air flow rate, resulting in some of the chips KZ not being discharged. This is particularly effective in a configuration in which the area of ​​the recovery path 41 near the air outlet 41B is inclined upward, and the chips KZ climb the slope in the recovery path 41 in this area against their own weight.

[0050] When the chips KZ in the recovery path 41 are discharged onto the belt 82B as shown in FIG. 10A, the management device 73 operates the motor 83 to run the belt 82B. As a result, the chips KZ discharged into the discharge region R1 of the belt 82B are transported diagonally upward as shown by arrow H1 in the ascending region R2 in FIG. 10B, and then transported to the dumping region R3 as shown by arrow H2 in FIG. 10C. As mentioned above, the surface of the belt 82B is provided with a partition 82H extending along the width of the belt 82B. Therefore, the chips KZ are reliably transported to the dumping region R3 without falling off the belt 82B, even in the ascending region R2.

[0051] The chips KZ carried to the dumping area R3 are dumped downward from the end of the dumping area R3, as shown in Fig. 10C. The chips KZ dumped from the end of the dumping area R3 fall through the chip passage 86 located directly below and are collected in a collection box 87. Therefore, the chips KZ collected through the two collection paths 41 are ultimately collected in one collection box 87.

[0052] In this way, the belt conveyor 82 functions as a transport section that transports the chips KZ after receiving the chips KZ discharged from the air outlet 41B of the recovery path 41. More specifically, the belt conveyor 82 functions as an ascent and fall section that raises and drops the chips KZ after receiving the chips KZ discharged from the air outlet 41B of the recovery path 41. The storage box 87 also functions as a chip storage section that stores the chips KZ that have dropped from the belt conveyor 82, which is an ascent and fall section.

[0053] Once the chips KZ have been stored in the storage box 87, the operator OP removes the storage box 87 from the storage section 44, disposes of the chips KZ in a predetermined location, and returns the storage box 87 to its original position. This completes the series of chip collection operations.

[0054] In this way, in the chip collection device 1, the management device 73 performs a series of chip collection operations in which air is supplied to the air blower 51 through the duct 52, and then positive pressure is supplied to the air inlet 41A of the collection path 41. This series of operations allows chips KZ of the carrier tape 18 discharged from the multiple feeder carts 15 to be collected and stored in the storage section 44, even if the work line 2 has multiple component mounting devices 3, each of which has a feeder cart 15. In other words, the chip collection device 1 uses only positive pressure, without using negative pressure, to collect chips KZ of the carrier tape 18 generated by the component mounting devices 3 in one place (storage box 87).

[0055] The management device 73 repeats the above-described chip collection operation every time a fixed time has elapsed. The worker OP simply disposes of the chips KZ collected in the collection box 87 every time the chip collection operation is performed, or every time the chip collection operation is performed several times. Therefore, even if a huge amount of chips KZ of the carrier tape 18 is generated on the work line 2, the burden on the worker OP of collecting the chips KZ is small, and the labor required for the work of collecting the chips KZ is greatly reduced.

[0056] (Embodiment 2) Next, a chip collection device according to a second embodiment of the present disclosure will be described with reference to Figures 11A and 11B. The chip collection device according to the second embodiment has the same configuration as the first embodiment, except that the position of the hinge 61 that swings the opening and closing plate 60 is different. In the second embodiment, the hinge 61 that swings the opening and closing plate 60 is provided on the inner surface of the receiving portion 42, rather than on the inner surface of the first vertical wall 41E of the recovery path 41. Even in this case, the opening and closing plate 60 functions in the same way as in the first embodiment, and therefore the same effects as in the first embodiment can be obtained.

[0057] (Embodiment 3) Next, a chip collection device according to a third embodiment of the present disclosure will be described with reference to Figures 12A to 13C. The chip collection device according to the third embodiment has the same configuration as that of the first embodiment, except for the configuration of the shutter member. In the first embodiment, the opening / closing plate 60, which is the shutter member, is a single flat plate-like member. In contrast, in the actual third embodiment, a bent opening / closing plate (hereinafter, opening / closing plate) 160 as shown in Figures 12A and 12B functions as the shutter member.

[0058] The opening / closing plate 160 has a first plate-shaped portion 162, an intermediate hinge 161, and a second plate-shaped portion 163. The first plate-shaped portion 162 includes a base end portion KT attached to the inner surface of the first vertical wall 41E of the recovery path 41 via the hinge 161. The second plate-shaped portion 163 includes a tip portion ST on the opposite side of the entire opening / closing plate 160 from the base end portion KT. The intermediate hinge 161 connects the first plate-shaped portion 162 and the second plate-shaped portion 163. The intermediate hinge 161 is located in the middle between the base end portion KT and the tip portion ST, and has an axis parallel to the hinge 161. In other words, the portion from the base end portion KT to the intermediate hinge 161 is the first plate-shaped portion 162, and the portion from the intermediate hinge 161 to the tip portion ST is the second plate-shaped portion 163. For this reason, the opening and closing plate 160 of embodiment 3 is able to swing (bend) around an axis extending vertically parallel to the axis of the hinge 61 not only at the base end KT but also at the intermediate portion between the base end KT and the tip end ST.

[0059] 12A, when the opening 41K is closed, the first plate-shaped portion 162 and the second plate-shaped portion 163 extend in the same plane. On the other hand, as shown in Fig. 12B, when the opening 41K is open, the first plate-shaped portion 162 extends along the Y axis so as to substantially cross the recovery path 41. The second plate-shaped portion 163 is bent relative to the first plate-shaped portion 162, and the tip portion ST of the second plate-shaped portion 163 abuts against the second vertical wall 41F.

[0060] In the third embodiment, as in the first embodiment, after the chips KZ are received in the receiver 42 as shown in FIG. 13A, a positive pressure is supplied to the duct 52 by the management device 73 as shown by the dashed line FD in FIG. 13B, and air is blown out from the air blower 51 in the receiver 42. As a result, the opening / closing plate 160 is pushed by the air as shown in FIG. 13B and bends at the intermediate hinge 161 to open the opening 41K, and the opening 41K is set in an open state. In addition, the air blown out from the air blower 51 causes the chips KZ in the receiver 42 to enter the recovery path 41 from the opening 41K. That is, the chips KZ in the receiver 42 are transferred into the recovery path 41.

[0061] Once the chips KZ in the receiver 42 have been transferred into the recovery path 41, the management device 73 stops the supply of positive pressure to the pipe 52 and stops the air blowing from the air blower 51. Then, the management device 73 supplies positive pressure to the air inlet 41A of the recovery path 41, as shown by arrow P in FIG. 13C. As a result, an air flow from the air inlet 41A to the air outlet 41B is formed in the recovery path 41, and the chips KZ that have been transferred into the recovery path 41 are pressure-fed toward the air outlet 41B. At this time, the opening / closing plate 160 is pushed by the air flowing in the recovery path 41 to close the opening 41K, so the movement of the chips KZ in the recovery path 41 is not obstructed by the opening / closing plate 160.

[0062] In this way, the chip collection device of embodiment 3 can also achieve the same effects as the chip collection device 1 of embodiment 1. In embodiment 3, as can be seen from Fig. 13B, when the opening / closing plate 160 opens the opening 41K, the area over which the opening 41K is open is larger than in embodiment 1 (see Fig. 8B). Therefore, the transfer of the chips KZ from the receiver 42 into the collection path 41 can be performed more smoothly.

[0063] (Fourth embodiment) Next, a chip collection device according to the fourth embodiment will be described with reference to Figures 14 to 17. As shown in Figure 14, the chip collection device according to the fourth embodiment has the same configuration as that of the first embodiment, except that a plate-shaped member 260 is provided instead of the shutter member (opening / closing plate 60) of the first embodiment.

[0064] As shown in FIGS. 14, 15A, and 15B, the plate-shaped member 260 is supported in a cantilevered manner with its base end KT fixed to the inner surface of the first vertical wall 41E of the recovery path 41. The base end KT is fixed at a position upstream of the opening 41K in the air flow direction. The tip end ST is the end opposite the base end KT. The region from the base end KT to the tip end ST extends obliquely toward the second vertical wall 41F as it moves from upstream to downstream in the air flow direction within the recovery path 41. That is, the tip end ST, and therefore the plate-shaped member 260, reduces the air flow path cross-sectional area within the recovery path 41 as it moves from upstream to downstream. The tip end ST of the plate-shaped member 260 is spaced apart from the inner surface of the recovery path 41. Therefore, the tip end ST is spaced apart from both the inner surfaces of the first vertical wall 41E and the second vertical wall 41F.

[0065] In this way, the base end KT of the plate-shaped member 260 is attached to the inner surface of the recovery path 41 at a position upstream of the opening 41K in the air flow, and the tip end ST on the opposite side of the air flow from the base end KT is located downstream of the air flow from the base end KT and is spaced apart from the inner surface of the recovery path 41.

[0066] In the fourth embodiment, similarly to the first embodiment, the management device 73 first blows air from the air blower 51 as shown by the dashed line FD in Fig. 15A to transfer the chips KZ in the receiver 42 into the recovery path 41. At this time, the chips KZ in the receiver 42 enter the recovery path 41 from the region between the inner surface of the recovery path 41 (the inner surface of the first vertical wall 41E) and the plate-shaped member 260.

[0067] When the chips KZ in the receiver 42 have been transferred into the recovery path 41, the management device 73 stops the air blowing from the air blower 51, and then supplies positive pressure to the air inlet 41A of the recovery path 41, as shown by arrow P in Fig. 15B. This creates an air flow in the recovery path 41 that flows from the air inlet 41A to the air outlet 41B, and the chips KZ are pressure-fed toward the air outlet 41B of the recovery path 41.

[0068] In the air flow formed in the recovery path 41, the cross-sectional area of ​​the air flow path is locally reduced where the plate-shaped member 260 is provided, causing the flow velocity to slow down and the pressure to increase. In this way, the cross-sectional area of ​​the air flow path is locally reduced in the front-side region HG, which is the region between the second vertical wall 41F and the plate-shaped member 260 on the front side of the tip portion ST of the plate-shaped member 260. Therefore, a pressure loss occurs downstream of the plate-shaped member 260. As a result, the pressure in the back-side region RG, which is the region between the plate-shaped member 260 and the receiver 42 on the back side of the tip portion ST of the plate-shaped member 260, is relatively lower than that in the front-side region HG.

[0069] Thus, the pressure in the back-side region RG is relatively lower than the pressure in the front-side region HG. However, most of the air in the recovery path 41 does not flow from the front-side region HG of the plate-shaped member 260 to the back-side region RG. This is because the plate-shaped member 260 extends obliquely toward the second vertical wall 41F as it moves from upstream to downstream of the air flow in the recovery path 41. Even when air contacts the plate-shaped member 260, the overall air flow direction is generally maintained from upstream to downstream. Furthermore, because the pressure in the back-side region RG is relatively lower than the pressure in the front-side region HG, the pressure inside the receiving portion 42 is relatively higher than the pressure in the back-side region RG. As a result, the air inside the receiving portion 42 is drawn into the recovery path 41. Therefore, even though the back-side region RG is connected to the internal space of the receiving portion 42, the air in the recovery path 41 does not flow toward the receiving portion 42. Therefore, the chips KZ transferred into the recovery path 41 are sent downstream of the recovery path 41 without returning (flowing backward) from the receiving section 42 to the chute 32.

[0070] In this way, the chip collection device of embodiment 4 can also achieve the same effects as in embodiment 1. In addition, embodiment 4 does not have a movable member like the opening and closing plate 60 of embodiment 1, and the configuration is simplified. In embodiment 4, plate-like member 260 functions as a backflow prevention unit that prevents air in collection path 41 from flowing back toward receiving portion 42.

[0071] When positive pressure is supplied to the air inlet 41A, the pressure inside the recovery path 41 gradually decreases from the air inlet 41A toward the air outlet 41B. Therefore, as shown in FIGS. 16A and 16B, when multiple openings 41K are arranged side by side in the air flow direction of the recovery path 41, the separation distance RK between the tip ST of the plate-shaped member 260 and the inner surface of the first vertical wall 41E may be gradually decreased toward the downstream side of the air. In other words, the plate-shaped member 260 may be attached so that T1 > T2 > T3 is satisfied. This allows the pressure difference between the front and back sides of the tip ST of the plate-shaped member 260 to be approximately the same.

[0072] The separation distance RK can be adjusted by the length L of the plate-shaped member 260 shown in FIG. 17 and the opening angle Θ of the plate-shaped member 260 from the first vertical wall 41E. The length L is the length from the base end KT to the tip end ST. Therefore, to gradually decrease the separation distance RK along the air flow, the separation distance RK of the plate-shaped member 260 can be made smaller as it is positioned downstream of the air flow. In other words, when multiple openings 41K are arranged side by side in the air flow direction, if two plate-shaped members 260 are arbitrarily selected, the separation distance RK of the downstream plate-shaped member 260 will be smaller than the separation distance RK of the upstream plate-shaped member 260.

[0073] 16A, the length L of multiple plate-shaped members 260 may be the same, and the opening angle Θ from the inner surface of recovery path 41 may become smaller the further downstream they are located in the air flow. In other words, when two plate-shaped members 260 are arbitrarily selected, the opening angle from the inner surface of recovery path 41 of the downstream plate-shaped member 260 is smaller than the opening angle from the inner surface of recovery path 41 of the upstream plate-shaped member 260.

[0074] 16B, the opening angle Θ of the plurality of plate-shaped members 260 from the inner surface of the recovery path 41 may be the same, and the length L may be made smaller as the plate-shaped members are positioned further downstream in the air flow. In other words, when two plate-shaped members 260 are arbitrarily selected, the length L of the downstream plate-shaped member 260 is shorter than the length L of the upstream plate-shaped member 260.

[0075] (Embodiment 5) Next, a chip collection device in embodiment 5 will be described with reference to Fig. 18. The chip collection device in embodiment 5 has the same configuration as embodiment 1 except for the way in which the ducts 52 are provided. In embodiment 1, three air blowers 51 in three receivers 42 arranged side by side along the X axis at the front and rear are each connected in series by a single duct 52. In contrast, in embodiment 5, the three air blowers 51 are each directly connected to the positive pressure supply unit 43 by individual ducts 52, and positive pressure is directly supplied to each of the air blowers 51 from the positive pressure supply unit 43. The downstream end of each duct 52 in the air flow direction is closed.

[0076] The pressure in the pipe 52 to which positive pressure is applied from the positive pressure supply unit 43 increases the further downstream in the air flow, and therefore, the more downstream the receiving unit 42 is located, the higher the pressure of the air blown out from the air blowers 51. In contrast, in the fifth embodiment, the positive pressure supply unit 43 can cause each of the air blowers 51 to blow out air at approximately the same pressure. Therefore, the amount of air blown out when transferring the chips KZ from each of the receiving units 42 into the recovery path 41 can be made approximately the same. This configuration can be applied not only to the first embodiment but also to the second to fourth embodiments.

[0077] (Sixth embodiment) Next, a chip collection device according to a sixth embodiment will be described with reference to FIGS. 19 and 20. As shown in FIG. 19, the chip collection device according to the sixth embodiment has the same configuration as that according to the first embodiment, except for the way in which the duct 52 is provided. In the first embodiment, the direction of the air flowing through the duct 52 is the same as the direction of the air supplied into the recovery path 41. In contrast, in the sixth embodiment, the direction of the air flowing through the duct 52 is opposite to the direction of the air supplied into the recovery path 41. That is, in the sixth embodiment, in a plan view, three air blowers 51 are connected in series to one duct 52, and the duct 52 is provided substantially parallel to the recovery path 41. The downstream end of the air flow in the duct 52 is closed. The direction of the air supplied to the duct 52 is opposite to the direction of the air supplied into the recovery path 41. The duct 52 being provided substantially parallel to the recovery path 41 means that the angle between the duct 52 and the recovery path 41 is, for example, between 0 degrees and 45 degrees. The angle is more preferably 0 degrees or more and 10 degrees or less, and even more preferably 0 degrees or more and 5 degrees or less.

[0078] The pressure in the conduit 52 to which positive pressure is applied from the positive pressure supply unit 43 increases the further downstream in the air flow. Similarly, the pressure of the air blown out from the multiple air outlets 51N in one air blower 51 increases the further downstream the air outlet 51N is located in the conduit 52 in the air flow direction. Therefore, in the configuration shown in FIG. 20 , the air outlet 51N located more upstream in the air flow direction in the recovery path 41 blows out air with a higher pressure. This creates a gradient in the pressure of the air blown out from the air blower 51 in the receiving unit 42. That is, the pressure increases further upstream in the air flow in the recovery path 41. As shown in FIG. 20 , the direction of the air blown out from the receiving unit 42 into the recovery path 41 is an oblique direction that includes a component in the direction in which the air flows in the recovery path 41. The direction in which the air flows in the recovery path 41 is the direction from the air inlet 41A to the air outlet 41B, that is, from left to right in FIG. 20 . As described above, the flow direction of the air blown from the receiving portion 42 into the recovery path 41 has a component in the direction in which the air flows within the recovery path 41, so the chips KZ transferred from the receiving portion 42 into the recovery path 41 are unlikely to move upstream within the recovery path 41. In addition, because the strength of the air blown out from the multiple air outlets 51N varies, even if a clump of chips KZ has formed within the receiving portion 42, the clump is broken up. Therefore, the chips KZ within the receiving portion 42 are smoothly transferred into the recovery path 41. When air is subsequently supplied into the recovery path 41, the chips KZ are carried downstream without stagnating or clogging within the recovery path 41. This configuration can be applied not only to embodiment 1 but also to embodiments 2 to 4.

[0079] (Embodiment 7) Next, with reference to FIG. 21 , a chip collection device according to the seventh embodiment will be described. The chip collection device according to the seventh embodiment has the same configuration as that according to the first embodiment, except for the way in which the ducts 52 are provided. In the first embodiment, the three air blowers 51 in the three receivers 42 arranged in a line along the X-axis, one at the front and one at the rear, are connected in series by a single duct 52. In contrast, in the seventh embodiment, as in the fifth embodiment shown in FIG. 18 , the three air blowers 51 are each directly connected to the positive pressure supply unit 43 by a separate duct 52, and positive pressure is directly supplied from the positive pressure supply unit 43 to each of the three air blowers 51 arranged along the X-axis. As in the sixth embodiment shown in FIG. 19 , the direction of air flowing through the ducts 52 is opposite to the direction of air supplied into the recovery path 41. The downstream end of the air flow in each duct 52 is closed.

[0080] In the seventh embodiment, as in the sixth embodiment, the pressure in the conduit 52 to which positive pressure is applied from the positive pressure supply unit 43 increases the further downstream in the air flow. Similarly, the pressure of the air blown out from the multiple air outlets 51N of one air blower 51 increases the further downstream the air outlet 51N is located in the conduit 52 in the air flow. That is, the air outlet 51N is located more upstream in the air flow in the recovery path 41, the higher the pressure of the air blown out. For this reason, a gradient occurs in the pressure of the air blown out from the air blower 51 in the receiving unit 42. That is, the pressure increases further upstream in the air flow in the recovery path 41. The direction of the flow of air blown out from the receiving unit 42 into the recovery path 41 is an oblique direction that includes a component in the direction in which the air flows in the recovery path 41, as shown in FIG. 20 . Therefore, the seventh embodiment can achieve the same effects as the sixth embodiment.

[0081] Furthermore, in the seventh embodiment, similarly to the fifth embodiment, each of the air blowers 51 is directly connected to the positive pressure supply unit 43 by an individual pipe 52. Therefore, positive pressure is directly supplied to each of the three air blowers 51 lined up along the X axis from the positive pressure supply unit 43. Therefore, the amount of air blown out when transferring the chips KZ from each of the receivers 42 into the recovery path 41 can be made approximately the same, and the same effect as in the fifth embodiment can be obtained.

[0082] (Embodiment 8) Next, a chip collection device in embodiment 8 will be described with reference to FIGS. 22 and 23. As shown in FIG. 22, the chip collection device in embodiment 8 has the same configuration as embodiment 1 except for the way in which the duct 52 is provided. In embodiment 1, three air blowers 51 in three receivers 42 arranged side by side along the X axis are connected in series by a single duct 52. In contrast, in embodiment 7, as in embodiment 5 shown in FIG. 18 and embodiment 7 shown in FIG. 21, the three air blowers 51 are each directly connected to the positive pressure supply unit 43 by a separate duct 52. Therefore, positive pressure is directly supplied from the positive pressure supply unit 43 to each of the three air blowers 51 arranged side by side along the X axis. Then, as shown in FIG. 23, air is supplied from the outside of the air blower 51. That is, air is supplied from the outside in the Y axis as viewed from the air blower 51. Therefore, positive pressure is uniformly applied to multiple (here, three) air outlets 51N that the air blower 51 has. Therefore, the amount of air blown out when transferring the chips KZ from the receiver 42 into the recovery path 41 can be made substantially the same for the plurality of air outlets 51N.

[0083] (Embodiment 9) Next, a chip collection device according to the ninth embodiment will be described with reference to Figures 24 to 26B. In the chip collection device according to the ninth embodiment, an opening 41K is provided on the upper surface of the collection path 41, and a receiver 42 and an air blower 51 are not provided. The opening 41K functions as a chip receiving opening. The rest of the configuration is the same as that of the first embodiment.

[0084] In the ninth embodiment, a plate-shaped member 260 similar to that in the fourth embodiment is used. A base end KT of the plate-shaped member 260 is fixed to the inner surface of the upper wall 41C of the recovery path 41. In detail, as shown in FIGS. 25 to 26B, the base end KT of the plate-shaped member 260 is fixed at a position upstream of the opening 41K in the air flow direction. The plate-shaped member 260 extends diagonally downward so that the flow path cross-sectional area within the recovery path 41 becomes smaller from the upstream to the downstream of the air flow within the recovery path 41.

[0085] As described above with reference to FIGS. 2 and 3, the chips KZ fall from the chute 32 of the feeder carriage 15 of the component mounting device 3 under their own weight. As shown in FIGS. 24 and 26A, in the ninth embodiment, the chips KZ falling from the chute 32 under their own weight directly enter the recovery path 41 through the opening 41K. For this reason, the air blower 51 as in the first embodiment is not provided, and the positive pressure supply unit 43 can supply positive pressure to the air inlet 41A of the recovery path 41 at any timing. When positive pressure is supplied to the air inlet 41A of the recovery path 41, an air flow is formed in the recovery path 41 from the air inlet 41A to the air outlet 41B, as shown by the arrow P in FIG. 26B. The chips KZ in the recovery path 41 are pressure-fed toward the air outlet 41B.

[0086] In the flow of air from the air inlet 41A to the air outlet 41B in the recovery path 41, the cross-sectional area of ​​the flow path is locally reduced at the location where the plate-shaped member 260 is provided, resulting in a slower flow rate and higher pressure. In this manner, the cross-sectional area of ​​the air flow path is locally reduced in the front-side region HG, which is the region below the plate-shaped member 260 on the front side of the tip portion ST of the plate-shaped member 260. Therefore, pressure loss occurs downstream of the plate-shaped member 260. As a result, the pressure in the back-side region RG, which is the region above the plate-shaped member 260 on the back side of the tip portion ST of the plate-shaped member 260, is relatively lower than that in the front-side region HG. Therefore, for the same reason as in the fourth embodiment, most of the air in the recovery path 41 does not flow from the front-side region HG to the back-side region RG of the plate-shaped member 260. Therefore, even though the back-side region RG is connected to the internal space of the receiving portion 42, the air in the recovery path 41 does not flow toward the receiving portion 42. As a result, the chips KZ transferred into the recovery path 41 are sent downstream of the recovery path 41 without returning (flowing backward) from the receiving section 42 to the chute 32.

[0087] The chips KZ that have fallen into the recovery path 41 in this manner are pressure-fed to the air outlet 41B by the positive pressure supplied from the air inlet 41A of the recovery path 41. Therefore, in the ninth embodiment, the same effect as in the first embodiment can be obtained. Note that in the ninth embodiment as well, the plate-like member 260 functions as a backflow prevention part that prevents the air in the recovery path 41 from flowing back toward the receiver 42.

[0088] As described above, the chip collection device 1 in embodiments 1 to 9 has a tubular collection path 41 having an air inlet 41A at a first end and an air outlet 41B at a second end, and an opening 41K in a sidewall through which chips KZ discharged from the component mounting device 3 enter. By supplying positive pressure to the air inlet 41A to form an air flow from the air inlet 41A toward the air outlet 41B, the chips KZ that enter the inside of the collection path 41 through the opening 41K are pressure-fed toward the air outlet 41B. In the chip collection device 1 in embodiments 1 to 9, the chips KZ are pressure-fed using only positive pressure, so a negative pressure generator is not required, and the chips KZ of the carrier tape 18 can be automatically collected with an inexpensive configuration.

[0089] While the embodiments of the present disclosure have been described above, the present disclosure is not limited to the above and various modifications are possible. For example, the storage unit 44 may be configured such that a storage box 87 is installed below each air outlet 41B of the recovery path 41. In this case, the height of the storage box 87 is limited to be equal to or less than the height of the air outlet 41B. In this regard, according to the first to ninth embodiments, it is sufficient that the height of the discharge region R1 of the belt 82B constituting the storage unit 44 is equal to or less than the height of the air outlet 41B, and the height of the storage box 87 itself may be high, allowing the use of a storage box 87 with a large capacity.

[0090] In addition, in the first to eighth embodiments, the transfer unit is configured to blow air to transfer the chips KZ in the receiving unit 42 into the recovery path 41. Alternatively, a conveyor device or the like may be installed in the receiving unit 42. This conveyor device or the like functions as the transfer unit that transfers the chips KZ in the receiving unit 42 to the recovery path 41. Alternatively, air may be blown by a blower using an electric motor. In this case, this blower functions as the transfer unit. In addition, in the first to ninth embodiments, two recovery paths 41 are provided, one at the front and one at the back. However, in cases where the component mounting device 3 is configured only on one side from the center in FIG. 2, there may be only one recovery path 41. In the first to ninth embodiments, three component mounting devices 3, each including two tape feeders 16, are arranged in series, and the recovery path 41 extends linearly to the area below the component mounting devices 3. However, the number of component mounting devices 3 is not limited to three. It may be one, two, or four or more. [Industrial Applicability]

[0091] The present disclosure provides a scrap collection device that can automatically collect scraps of tape materials with an inexpensive configuration, and is therefore useful for component mounting devices that supply components with a tape feeder and mount the components on a circuit board or the like. [Explanation of symbols]

[0092] 1. Chip collection device 2 Work Line 3. Component placement device 11 Foundation 12 Cover member 13. Workspace 14. Substrate transport path 15 Feeder cart 16 Tape Feeder 16K Parts supply position 17 Tape reel 18 Carrier tape 21 Placement head 21N nozzle 22 Head movement mechanism 23 Control device 31 Cutter device 32 Shooter 32K discharge opening 41 Recovery Route 41A Air inlet 41B Air outlet 41C Upper wall 41D Lower wall 41E 1st vertical wall 41F 2nd vertical wall 41K Chip entry opening (opening) 41H ventilation hole 42 Receptor 42K Chip receiving opening 43 Positive pressure supply section 43V Control Valve 44 Storage section 51 Air blower 51N Air outlet 52 Pipeline 60 Opening and closing plate 61 Hinge 71 External piping 72 positive pressure source 73 Management device 81 frames 82 Conveyor Belt 82B Belt 82H Partition 82J driven pulley 82K drive pulley 83 Drive motor (motor) 84 Drive belt 85 Belt guide 86 Chip passage 87 Storage Box 160 Bent type opening and closing plate (opening and closing plate) 161 Intermediate hinge 162 First plate-shaped part 163 Second plate-shaped part 260 Plate-shaped members KT proximal end ST tip RK separation distance KZ chips BH parts

Claims

1. A chip collection device that collects chips of a tape member discharged from a tape feeder that supplies components using the tape member, a tubular recovery path having a first end and a second end, the recovery path having a chip inlet opening in a region between the first end and the second end through which the chips discharged from the tape feeder enter; a positive pressure supply unit that supplies positive pressure to the recovery path and creates an air flow in the recovery path toward the second end, thereby pressure-feeding the chips that have entered the recovery path through the chip inlet opening to the second end, The recovery path is an inclined portion extending obliquely upward; a horizontal portion located in the recovery path closer to the second end than the inclined portion; an opening provided in the horizontal portion, The chip entry opening is provided in a vertical wall of the recovery path. Chip collection device.

2. The nozzle further includes a storage section for storing the chips discharged from the second end. The chip collection device according to claim 1 .

3. The storage unit includes a transport unit that receives the chips discharged from the second end and then transports the chips, and a chip storage unit that receives the chips from the transport unit. The chip collection device according to claim 2.

4. The conveying section includes a rising region that conveys the chips obliquely upward. The chip collection device according to claim 3.

5. The conveying unit includes a belt conveyor. The chip collection device according to claim 3.

6. A plurality of component mounting devices each having the tape feeder are arranged in series, the recovery path extends linearly in an area below the plurality of component mounting devices; The chip collection device according to claim 1.

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