Termination circuit boards, electronic component mounting packages, and electronic modules

Abstract

This termination circuit substrate comprises a dielectric substrate, a ground conductor portion, a signal conductor portion, a first resistor portion, and a second resistor portion. The ground conductor portion includes, positioned in order, a first ground conductor line, a second ground conductor line, a third ground conductor line, and a fourth ground conductor line. The signal conductor portion includes a first signal line positioned between the first ground conductor line and the second ground conductor line, and a second signal line positioned between the third ground conductor line and the fourth ground conductor line. The first resistor portion includes a first resistor connecting the first ground conductor line and the first signal line, a second resistor connecting the second ground conductor line and the first signal line, a third resistor connecting the third ground conductor line and the second signal line, and a fourth resistor connecting the fourth ground conductor line and the second signal line. The second resistor portion connects the second ground conductor line and the third ground conductor line.

Description

[Technical Field]

[0001] The present disclosure relates to a termination circuit board, an electronic component mounting package, and an electronic module. [Background technology]

[0002] Conventionally, a wiring board connected to a semiconductor element has been used in a package for housing a semiconductor element that processes an electric signal (e.g., a high-frequency signal). One known example of such a wiring board is the wiring board described in Patent Document 1. The wiring board described in Patent Document 1 has a resistor to convert a signal containing a high-frequency signal component from electric energy to thermal energy and reduce noise due to signal reflection. More specifically, the wiring board described in Patent Document 1 includes a signal line conductor on a dielectric substrate, first ground conductors spaced apart on both sides of the signal line conductor, and a resistor connecting one end of the signal line conductor to the first ground conductor. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2010-135712 Summary of the Invention

[0004] In one embodiment of the present disclosure, (1) a termination circuit board includes a dielectric substrate, a ground conductor, a signal conductor, a first resistor, and a second resistor. The dielectric substrate has a first surface including a first side. Furthermore, when a direction along the first side is defined as a first direction and a direction intersecting the first direction is defined as a second direction, the ground conductor is located on the first surface, and a distance from the first side in the second direction is a first distance. The signal conductor is located on the first surface, and a distance from the first side in the second direction is a second distance. The first resistor is located on the first surface and connects the ground conductor and the signal conductor. The second resistor is located on the first surface, and a distance from the first side in the second direction is a third distance. The ground conductor includes a first ground conductor line, a second ground conductor line, a third ground conductor line, and a fourth ground conductor line, which are arranged in order in the first direction. The signal conductor section has a first signal line located between the first ground conductor line and the second ground conductor line in the first direction, and a second signal line located between the third ground conductor line and the fourth ground conductor line. The first resistor section has a first resistor connecting the first ground conductor line and the first signal line in the first direction, a second resistor connecting the second ground conductor line and the first signal line, a third resistor connecting the third ground conductor line and the second signal line, and a fourth resistor connecting the fourth ground conductor line and the second signal line. The second resistor section connects the second ground conductor line and the third ground conductor line in the first direction.

[0005] (2) The termination circuit board includes a dielectric substrate, a ground conductor, a signal conductor, and a first resistor. The dielectric substrate has a first surface including a first side. Furthermore, when a direction along the first side is defined as a first direction and a direction intersecting the first direction is defined as a second direction, the ground conductor is located on the first surface, and a distance from the first side in the second direction is a first distance. The signal conductor is located on the first surface, and a distance from the first side in the second direction is a second distance. The first resistor is located on the first surface and connects the ground conductor and the signal conductor. The ground conductor has a first ground conductor line, a second ground conductor line, a third ground conductor line, and a fourth ground conductor line positioned in order in the first direction. The signal conductor section has a first signal line located between the first ground conductor line and the second ground conductor line in the first direction, and a second signal line located between the third ground conductor line and the fourth ground conductor line. The first resistor section has, in the first direction, a first resistor connecting the first ground conductor line and the first signal line, a second resistor connecting the second ground conductor line and the first signal line, a third resistor connecting the third ground conductor line and the second signal line, and a fourth resistor connecting the fourth ground conductor line and the second signal line. The second ground conductor line and the third ground conductor line are located apart from each other in the first direction.

[0006] (3) In the termination circuit board of (1) or (2), the first surface has a first region and a second region. The first region is located apart from the first side and extends in a first direction. The second region is located between the first side and the first region and extends in the first direction. The first signal line, the second signal line, the first ground conductor line, the second ground conductor line, the third ground conductor line, and the fourth ground conductor line are located extending from the second region to the first region in a second direction intersecting the first direction. The first resistor, the second resistor, the third resistor, and the fourth resistor are located only in the first region. In the first direction, the distance between the first signal line and the first and second ground conductor lines in the second region is shorter than the distance between the first signal line and the first and second ground conductor lines in the first region.

[0007] (4) In the termination circuit boards of (1) to (3) above, in a second direction intersecting the first direction, the dimensions of the first signal line and the second signal line are equal to or greater than the dimensions of the first ground conductor line, the second ground conductor line, the third ground conductor line, and the fourth ground conductor line.

[0008] (5) In the termination circuit board of (1), (3), and (4) above, the first surface has a first region and a second region. The first region is located away from the first side and extends in a first direction. The second region is located between the first side and the first region and extends in the first direction. In the second region, the first ground conductor line has a first end, the second ground conductor line has a second end, the third ground conductor line has a third end, the fourth ground conductor line has a fourth end, the first signal line has a fifth end, the second signal line has a sixth end, and the second resistor section has a seventh end. The first end, second end, third end, fourth end, fifth end, sixth end, and seventh end are located on a straight line in the first direction.

[0009] (6) In the termination circuit board of any one of (2) to (4), the first surface has a first region and a second region. The first region is located away from the first side and extends in a first direction. The second region is located between the first side and the first region and extends in the first direction. In the second region, the first ground conductor line has a first end, the second ground conductor line has a second end, the third ground conductor line has a third end, the fourth ground conductor line has a fourth end, the first signal line has a fifth end, and the second signal line has a sixth end. The first end, second end, third end, fourth end, fifth end, and sixth end are located on a straight line in the first direction.

[0010] (7) The termination circuit board of any one of (1) to (6) above further includes a third resistor portion and a fourth resistor portion located on the first surface. The ground conductor portion further includes a fifth ground conductor line and a sixth ground conductor line. The third resistor portion connects the first ground conductor line and the fifth ground conductor line, and the fourth resistor portion connects the fourth ground conductor line and the sixth ground conductor line.

[0011] (8) The termination circuit board of any one of (1) to (7) above further includes a fifth resistor portion spaced apart from the first signal line and the second signal line. The ground conductor portion has a seventh ground conductor line spaced apart from the first region and extending in the first direction. The first surface has a first region and a second region. The first region is spaced apart from the first side and extends in the first direction. The second region is located between the first side and the first region and extends in the first direction. The fifth resistor portion is connected to the first ground conductor line, the second ground conductor line, the third ground conductor line, and the fourth ground conductor line, as well as to the seventh ground conductor line.

[0012] (9) The termination circuit board of any one of (1) to (8) above further includes a fifth resistor portion spaced apart from the first signal line and the second signal line. The ground conductor portion includes a seventh ground conductor line spaced apart from the first region and extending in the first direction, and an eighth ground conductor line located between the seventh ground conductor line and the first region and extending in the first direction. The eighth ground conductor line is connected to the first ground conductor line, the second ground conductor line, the third ground conductor line, and the fourth ground conductor line. The fifth resistor portion is connected to the seventh ground conductor line and the eighth ground conductor line.

[0013] (10) The termination circuit board of any one of (1) to (9) further includes a first wire, a second wire, a third wire, and a fourth wire. The first wire and the second wire electrically connect the first signal line and the electronic component. The third wire and the fourth wire electrically connect the second signal line and the electronic component. In a plan view, the distance between the first wire and the second wire in the first direction decreases as the wire moves outward in the second direction, and the distance between the third wire and the fourth wire in the first direction decreases as the wire moves outward in the second direction.

[0014] (11) In the termination circuit boards of (1) to (10) above, the first resistive section and the second resistive section are thin-film resistors.

[0015] (12) In the termination circuit boards of (1) to (11) above, the first resistor portion and the second resistor portion are made of a material containing TaN or Ta2N as a main component.

[0016] (13) In the termination circuit board of any one of (1) to (12), the first signal line includes a third signal line and a fourth signal line spaced apart from the third signal line. The second signal line includes a fifth signal line and a sixth signal line spaced apart from the fifth signal line. The first resistor section further includes a fifth resistor, a sixth resistor, a seventh resistor, and an eighth resistor. In a side view from the second direction, the fifth resistor overlaps the third signal line, the sixth resistor overlaps the fourth signal line, the seventh resistor overlaps the fifth signal line, and the eighth resistor overlaps the sixth signal line. The first resistor and the fifth resistor connect the third signal line and the first ground conductor line. The second resistor and the sixth resistor connect the fourth signal line and the second ground conductor line. The third and seventh resistors connect the fifth signal line and the third ground conductor line, and the fourth and eighth resistors connect the sixth signal line and the fourth ground conductor line.

[0017] (14) An electronic component mounting package according to one embodiment of the present disclosure includes a base, a frame body joined to the top surface of the base, and a termination circuit board described in (1) to (13) above mounted on the top surface.

[0018] (15) An electronic module according to one embodiment of the present disclosure includes the electronic component mounting package described in (14) above, an electronic component located on the upper surface of the base and electrically connected to a termination circuit board of the electronic component mounting package, and a lid located on the frame and covering the interior of the electronic component mounting package. [Brief explanation of the drawings]

[0019] [Figure 1] FIG. 2 is a plan view of a termination circuit board according to the first embodiment of the present disclosure. [Figure 2] FIG. 10 is a plan view of a modified example of the termination circuit board according to the first embodiment of the present disclosure. [Figure 3] FIG. 10 is a plan view of a termination circuit board according to a second embodiment of the present disclosure. [Figure 4] FIG. 10 is a plan view of a termination circuit board according to a third embodiment of the present disclosure. [Figure 5] FIG. 11 is a plan view of a modified example of a termination circuit board according to the third embodiment of the present disclosure. [Figure 6] FIG. 10 is a plan view of a termination circuit board according to a fourth embodiment of the present disclosure. [Figure 7] FIG. 2 is a perspective view of a termination circuit board according to the first embodiment of the present disclosure. [Figure 8] FIG. 8 is an enlarged plan view of a main part A shown in FIG. [Figure 9] 1 is a cross-sectional view of a termination circuit board, an electronic component mounting package, and an electronic module according to a first embodiment of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0020] <Configuration of the termination circuit board> Hereinafter, several exemplary embodiments of the present disclosure will be described with reference to the drawings. Note that although either direction of a termination circuit board may be considered to be up or down, for convenience, a Cartesian coordinate system xyz is defined, with the positive side of the z direction being considered to be up. Hereinafter, the term "first direction" refers to, for example, the x direction in the drawings. The term "second direction intersecting the first direction" refers to, for example, the y direction in the drawings. In addition, in this disclosure, the concept of "planar view" includes planar perspective view.

[0021] (First embodiment) Termination circuit boards 101a-d according to a first embodiment of the present disclosure will be described with reference to Figures 1, 2, 7, and 8. As shown in Figure 1, the termination circuit board 101a includes at least a dielectric substrate 1, a ground conductor portion 2G, a signal conductor portion 3S, a first resistor portion 4R, and a second resistor portion 5R.

[0022] The dielectric substrate 1 has a first surface 11 including a first side 11a. Examples of materials that can be used for the dielectric substrate 1 include ceramic materials such as aluminum oxide sintered body, mullite sintered body, silicon carbide sintered body, aluminum nitride sintered body, and silicon nitride sintered body, and dielectric materials such as glass ceramic materials. The dielectric substrate 1 may have a configuration in which a plurality of dielectrics are laminated. The dielectric substrate 1 is, for example, rectangular in plan view, with dimensions of 4 mm×4 mm to 50 mm×50 mm and a thickness of 0.5 mm to 10 mm.

[0023] Furthermore, if the direction along the first side 11a is defined as a first direction (the x-direction in one embodiment) and the direction intersecting the first direction is defined as a second direction (the y-direction in one embodiment), as shown in FIG. 1 , the ground conductor 2G is located on the first surface 11, and the distance between the ground conductor 2G and the first side 11a in the second direction is a first distance L1. Note that in one embodiment, the first side 11a and the ground conductor 2G are located apart as shown in FIG. 1 , but the first side 11a and the ground conductor 2G do not necessarily have to be located apart. In other words, the value of the first distance L1 may be zero. The same applies to the second distance L2 and the third distance L3 described below. If the first side 11a and the ground conductor 2G are located apart, the possibility of damage to the ground conductor 2G, the signal conductor 3S, the first resistor 4R, and the second resistor 5R can be reduced when manufacturing the dielectric substrate 1 that becomes the termination circuit board 101a by dicing.

[0024] The ground conductor section 2G includes a first ground conductor line 2G1, a second ground conductor line 2G2, a third ground conductor line 2G3, and a fourth ground conductor line 2G4, which are arranged in order in the x direction. More specifically, as shown in FIG. 1 , the first ground conductor line 2G1, the second ground conductor line 2G2, the third ground conductor line 2G3, and the fourth ground conductor line 2G4 are arranged in order from the positive side in the x direction. The first ground conductor line 2G1 and the second ground conductor line 2G2 extend in the y direction and are spaced apart. Similarly, the third ground conductor line 2G3 and the fourth ground conductor line 2G4 extend in the y direction and are spaced apart. Furthermore, the second ground conductor line 2G2 and the third ground conductor line 2G3 extend in the y direction and are spaced apart (a fourth distance L4).

[0025] Examples of materials for the ground conductor 2G (first ground conductor line 2G1, second ground conductor line 2G2, third ground conductor line 2G3, and fourth ground conductor line 2G4) include metal materials such as gold, silver, copper, nickel, tungsten, molybdenum, and manganese. The ground conductor 2G may be formed by sintering a metal paste on the first surface 11, or by using a thin-film formation technique such as vapor deposition or sputtering. An insulating film made of ceramic (e.g., an alumina coating) or resin may be located on a portion of the ground conductor 2G. The insulating film may be provided on the ground conductor 2G by screen printing. The insulating film may be located only on a portion of each signal line. This configuration reduces the possibility of short-circuiting of the signal lines.

[0026] As described above, in one embodiment, the first ground conductor line 2G1, the second ground conductor line 2G2, the third ground conductor line 2G3, and the fourth ground conductor line 2G4 are located separately from each other. This reduces the possibility that high-frequency signals from the ground conductor portion 2G will cause degradation of crosstalk characteristics in the signal conductor portion 3S. Note that the first ground conductor line 2G1, the second ground conductor line 2G2, the third ground conductor line 2G3, and the fourth ground conductor line 2G4 do not necessarily have to be located separately from each other and may be connected by the eighth ground conductor line 2G8, as shown in a fourth embodiment described later.

[0027] The signal conductor portion 3S is located on the first surface 11, and the distance from the first side 11a in the y direction is a second distance L2. The signal conductor portion 3S has a first signal line 3S1 located between the first ground conductor line 2G1 and the second ground conductor line 2G2 in the x direction, and a second signal line 3S2 located between the third ground conductor line 2G3 and the fourth ground conductor line 2G4.

[0028] The material of the signal conductor portion 3S (first signal line 3S1, second signal line 3S2) may be the same as or different from the material of the ground conductor portion 2G, and may be, for example, the same material as the material of the ground conductor portion 2G described above. The signal conductor portion 3S may also be formed by the same method as the ground conductor portion 2G. Positioning the first signal line 3S1 between the first ground conductor line 2G1 and the second ground conductor line 2G2 strengthens the ground potential and increases the electric field coupling. This reduces the possibility of resonance occurring when the electric field distribution expands beyond a desired range when the first signal line 3S1 transmits a high-frequency signal. Positioning the second signal line 3S2 between the third ground conductor line 2G3 and the fourth ground conductor line 2G4 provides the same effects as those described above.

[0029] Alternatively, the first signal line 3S1 and the second signal line 3S2 may be a pair of differential signal lines that transmit differential signals. In this case, currents flowing in opposite directions in the pair of signal lines cancel out external noise, thereby reducing the effects of EMI noise and enabling smoother transmission of high-frequency signals.

[0030] The first resistor portion 4R is located on the first surface 11 and connects the ground conductor portion 2G and the signal conductor portion 3S. The first resistor portion 4R has a first resistor 4R1, a second resistor 4R2, a third resistor 4R3, and a fourth resistor 4R4. The first resistor 4R1 connects the first ground conductor line 2G1 and the first signal line 3S1 in the x-direction. The second resistor 4R2 connects the second ground conductor line 2G2 and the first signal line 3S1. The third resistor 4R3 connects the third ground conductor line 2G3 and the second signal line 3S2. The fourth resistor 4R4 connects the fourth ground conductor line 2G4 and the second signal line 3S2.

[0031] Note that the above-mentioned "connected" means physically connected. For example, "the first resistor 4R connects the ground conductor 2G and the signal conductor 3S" includes cases where the first resistor 4R is in contact with the ground conductor 2G and the signal conductor 3S, and cases where part of the first resistor 4R overlaps with the ground conductor 2G and the signal conductor 3S.

[0032] The first resistor portion 4R (first resistor 4R1, second resistor 4R2, third resistor 4R3, and fourth resistor 4R4) is formed of a material having a higher resistivity than the signal conductor portion 3S. Examples of the material for the first resistor portion 4R include resistive materials such as tantalum nitride (TaN or TaN), ruthenium oxide (RuO), nickel-chromium alloy (Ni-Cr), copper-nickel alloy (Cu-Ni), and copper-manganese alloy (Cu-Mn). If the resistive material is TaN, for example, the first resistor portion 4R can be formed on the dielectric substrate 1 (on the first surface 11 in one embodiment) by a thin-film formation technique. Alternatively, the first resistor portion 4R may be formed by a thick-film method in which a paste containing a powder of a resistive material as a main component is printed and applied to the dielectric substrate 1, followed by sintering.

[0033] The second resistor portion 5R is located on the first surface 11, and the distance from the first side 11a in the y direction is a third distance L3. The second resistor portion 5R connects the second ground conductor line 2G2 and the third ground conductor line 2G3 in the x direction. The material of the second resistor portion 5R may be the same as or different from the material of the first resistor portion 4R, and may be, for example, the same material as the material of the first resistor portion 4R described above. The second resistor portion 5R may also be formed on the dielectric substrate 1 by the same method as the first resistor portion 4R.

[0034] As described above, the termination circuit board 101a according to the first embodiment includes the second resistor portion 5R connecting the second ground conductor line 2G2 and the third ground conductor line 2G3, and thereby can convert unwanted electrical signals generated between the first signal line 3S1 and the second signal line 3S2 into thermal energy. This reduces the possibility that unwanted electrical signals will be reflected by the first signal line 3S1 and the second signal line 3S2. This improves transmission characteristics even when transmitting high-frequency signals, and enables the termination circuit board 101a to achieve favorable reflection characteristics.

[0035] In one embodiment, the first resistor portion 4R and the second resistor portion 5R are thin-film resistors. Using thin-film resistors for the first resistor portion 4R and the second resistor portion 5R allows the termination circuit board 101a to be smaller and thinner. When the first resistor portion 4R and the second resistor portion 5R are thin-film resistors, they can be formed on the dielectric substrate 1 (on the first surface 11 in one embodiment) using the thin-film formation technology described above. Here, a thin-film resistor refers to a resistor having a thickness of, for example, 100 μm or less. Furthermore, forming the first resistor portion 4R and the second resistor portion 5R using thin films provides excellent dimensional accuracy, thereby enabling the precision of the resistance value to be increased. Furthermore, compared to when the first resistor portion 4R and the second resistor portion 5R are chip resistors, the implementation of chip resistors is unnecessary, which reduces the number of components in the termination circuit board 101a and reduces the possibility of degradation of the reflection characteristics due to the chip resistor mounting portions.

[0036] In one embodiment, the first resistor portion 4R and the second resistor portion 5R are mainly made of tantalum nitride (TaN or TaN). The first resistor portion 4R and the second resistor portion 5R are not limited to being made of conductive layers as described above, but may be independent components (such as chip resistors) or may be formed by combining a plurality of such components. Here, the term "main component" in this disclosure refers to at least the component with the highest content, e.g., a component with a content of 90% or more.

[0037] In one embodiment, as shown in FIGS. 1 and 8 , the first surface 11 of the termination circuit board 101a may have a first region 111 and a second region 112. In this case, the first region 111 is spaced apart from the first side 11a and extends in the x-direction. The second region 112 is located between the first side 11a and the first region 111 and extends in the x-direction. The first signal line 3S1, the second signal line 3S2, the first ground conductor line 2G1, the second ground conductor line 2G2, the third ground conductor line 2G3, and the fourth ground conductor line 2G4 are located extending from the second region 112 to the first region 111 in the y-direction intersecting the x-direction. Furthermore, the first resistor 4R1, the second resistor 4R2, the third resistor 4R3, and the fourth resistor 4R4 are located only in the first region 111. In the x-direction, the fifth distance L5 between the first signal line 3S1 and the first and second ground conductor lines 2G1 and 2G2 in the second region 112 is shorter than the sixth distance L6 between the first signal line 3S1 and the first and second ground conductor lines 2G1 and 2G2 in the first region 111. The above-described configuration facilitates adjusting the impedance of the first signal line 3S1 and the second signal line 3S2 to a desired value. Furthermore, when a first wire 71, a second wire 72, etc. (described later) are connected to the first signal line 3S1 in the second region 112, the proximity of the first signal line 3S1 to the first and second ground conductor lines 2G1 and 2G2 increases the capacitance, facilitating impedance matching of the first signal line 3S1. The same applies to the second signal line 3S2. Such a termination circuit board 101a has excellent transmission characteristics for high-frequency signals.

[0038] More specifically, in one embodiment, the first signal line 3S1 may have a first wide portion 3S1b in the second region 112 that is larger in the y direction than a portion (first narrow portion 3S1c) located in the first region 111. Similarly, the second signal line 3S2, the first ground conductor line 2G1, the second ground conductor line 2G2, the third ground conductor line 2G3, and the fourth ground conductor line 2G4 may each have a narrow portion in the first region 111 and a wide portion in the second region 112. That is, the wide portions located in the second region 112 are closer to each other in the y direction than the narrow portions located in the first region 111. In addition to the above-mentioned effect, this configuration can ensure an area for connecting first wires 71 and the like for connection to the electronic component 104 (described later) to the signal conductor portion 3S and the ground conductor portion 2G, thereby facilitating electrical connection between the electronic component 104 and the termination circuit board 101a.

[0039] In addition, in the y direction intersecting the x direction, the first dimension D1 of the first signal line 3S1 and the second signal line 3S2 may be equal to or greater than the second dimension D2 of the first ground conductor line 2G1, the second ground conductor line 2G2, the third ground conductor line 2G3, and the fourth ground conductor line 2G4. This configuration facilitates adjusting the impedance of the first signal line 3S1 and the second signal line 3S2 to a desired value. This termination circuit board 101a has excellent high-frequency signal transmission characteristics. In one embodiment, the first dimension D1 of the first signal line 3S1 and the second signal line 3S2 is the same as the second dimension D2 of the first ground conductor line 2G1, the second ground conductor line 2G2, the third ground conductor line 2G3, and the fourth ground conductor line 2G4.

[0040] In the second region 112, the first ground conductor line 2G1 has a first end 2G1a, the second ground conductor line 2G2 has a second end 2G2a, the third ground conductor line 2G3 has a third end 2G3a, the fourth ground conductor line 2G4 has a fourth end 2G4a, the first signal line 3S1 has a fifth end 3S1a, the second signal line 3S2 has a sixth end 3S2a, and the second resistor unit 5R has a seventh end 5R1a. The first end 2G1a, the second end 2G2a, the third end 2G3a, the fourth end 2G4a, the fifth end 3S1a, the sixth end 3S2a, and the seventh end 5R1a are located on a straight line (imaginary line C1) in the x direction. With this configuration, the transmission characteristics of high-frequency signals in the first signal line 3S1 and the second signal line 3S2 can be made closer to uniform.

[0041] More specifically, it is sufficient that the above-mentioned ground conductor 2G, signal conductor 3S, and second resistor 5R are positioned with a gap from the first side 11a in the y direction, and that L1 = L2 = L3 holds. In this case, in addition to the above-mentioned effect, it is possible to reduce the possibility of damage to the ground conductor 2G, signal conductor 3S, first resistor 4R, and second resistor 5R when manufacturing the dielectric substrate 1 that becomes the termination circuit board 101a by dicing.

[0042] As shown in FIG. 1, the termination circuit board 101a may further include a third resistor 6R and a fourth resistor 7R located on the first surface 11. In this case, the ground conductor 2G may further include a fifth ground conductor line 2G5 and a sixth ground conductor line 2G6. The third resistor 6R connects the first ground conductor line 2G1 and the fifth ground conductor line 2G5, and the fourth resistor 7R connects the fourth ground conductor line 2G4 and the sixth ground conductor line 2G6. This configuration more efficiently converts unwanted electrical signals generated between the first signal line 3S1 and the second signal line 3S2 into thermal energy. This reduces the possibility of resonance in the termination circuit board 101a and achieves favorable reflection characteristics.

[0043] 2, the termination circuit board 101a may also include a fifth resistor 8R spaced apart from the first signal line 3S1 and the second signal line 3S2. The ground conductor 2G has a seventh ground conductor line 2G7 spaced apart from the first region 111 and extending in the x-direction. As described above, the first surface 11 has the first region 111 and the second region 112. That is, the first region 111 is spaced apart from the first side 11a and extends in the x-direction. The second region 112 is located between the first side 11a and the first region 111 and extends in the x-direction. The fifth resistor 8R is connected to the first ground conductor line 2G1, the second ground conductor line 2G2, the third ground conductor line 2G3, and the fourth ground conductor line 2G4, as well as to the seventh ground conductor line 2G7. With this configuration, compared to the case where the fifth resistor 8R is not provided, unwanted electrical signals generated between the first signal line 3S1 and the second signal line 3S2 can be converted into thermal energy more efficiently, thereby reducing the possibility that unwanted electrical signals will be reflected by the first signal line 3S1 and the second signal line 3S2.

[0044] In one embodiment, the fifth resistor portion 8R is located separately from the second resistor portion 5R, the third resistor portion 6R, and the fourth resistor portion 7R, but the fifth resistor portion 8R does not necessarily have to be located separately from the second resistor portion 5R, the third resistor portion 6R, and the fourth resistor portion 7R. In other words, the fifth resistor portion 8R may be connected to each of the second resistor portion 5R, the third resistor portion 6R, and the fourth resistor portion 7R, or may be connected to any one of them.

[0045] 7 and 8, the termination circuit board 101a may further include a first wire 71, a second wire 72, a third wire 73, and a fourth wire 74. The first wire 71 and the second wire 72 electrically connect the first signal line 3S1 and the electronic component 104. The third wire 73 and the fourth wire 74 electrically connect the second signal line 3S2 and the electronic component 104. In a plan view, a distance L712 between the first wire 71 and the second wire 72 in the x direction decreases as the wire moves outward along the y direction (in one embodiment, in the negative direction of the y axis). A distance L734 between the third wire 73 and the fourth wire 74 in the x direction decreases as the wire moves outward along the y direction (in the negative direction of the y axis). This configuration reduces the possibility of sudden impedance fluctuations when signals are transmitted between electronic component 104 and first signal line 3S1 and second signal line 3S2 of termination circuit board 101a, and reduces the possibility of unwanted electrical signals being reflected by first signal line 3S1 and second signal line 3S2.

[0046] 8, if the distance in the x direction between the first wire 71 and the second wire 72 at the point connected to the first signal line 3S1 is L712a and the distance in the x direction between the first wire 71 and the second wire 72 at the point connected to the electronic component 104 is L712b, then L712a > L712b. Also, although not shown, if the distance in the x direction between the third wire 73 and the fourth wire 74 at the point connected to the second signal line 3S2 is L734a and the distance in the x direction between the third wire 73 and the fourth wire 74 at the point connected to the electronic component 104 is L734b, then L734a > L734b.

[0047] 8 , in one embodiment, the first wire 71 and the second wire 72 electrically connect the first signal line 3S1 and the seventh signal line 104S7 of the electronic component 104. Although not shown, similar to the first wire 71 and the second wire 72, the third wire 73 and the fourth wire 74 electrically connect the second signal line 3S2 and the eighth signal line 104S8 of the electronic component 104.

[0048] 8 , in a plan view, the absolute value of the tilt of the first wire 71 with respect to the x direction may be the same as the absolute value of the tilt of the second wire 72 with respect to the x direction. In other words, the tilt of the first wire 71 with respect to the x direction is symmetrical with the tilt of the second wire 72 with respect to the x direction across the first signal line 3S1. In one embodiment, the third wire 73 and the fourth wire 74 also have the same configuration as the first wire 71 and the second wire 72 described above.

[0049] The termination circuit board 101a may also include one or more fifth wires 75 and one or more sixth wires 76. The fifth wire 75 is located farther from the second wire 72 than the first wire 71 and connects the first ground conductor line 2G1 to the tenth ground conductor line 104G of the electronic component 104. The sixth wire 76 is located farther from the first wire 72 than the second wire 71 and connects the second ground conductor line 2G2 to the tenth ground conductor line 104G. In one embodiment, the inclination of the fifth wire 75 with respect to the x-direction is the same as the inclination of the first wire 71 with respect to the x-direction. The inclination of the sixth wire 76 with respect to the x-direction is the same as the inclination of the second wire 72 with respect to the x-direction. Note that the positional relationships among the first wire 71, the second wire 72, the third wire 73, the fourth wire 74, the fifth wire 75, and the sixth wire 76 are not limited to those in the above embodiment.

[0050] An example of the material for the first wire 71 is a conductive metal material such as platinum. The second wire 72, the third wire 73, the fourth wire 74, the fifth wire 75, and the sixth wire 76 may be made of the same material as the first wire 71, or may be made of a different material.

[0051] (Second embodiment) Next, a termination circuit board 101b according to a second embodiment of the present disclosure will be described with reference to Fig. 3. Note that, in the following, only the configuration of the second embodiment that differs from the configuration of the first embodiment will be described, and the other configurations will be assigned the same reference numerals as in the first embodiment and will not be described again.

[0052] The termination circuit board 101b according to the second embodiment differs from the first embodiment in that the second ground conductor line 2G2 and the third ground conductor line 2G3 are positioned apart. Here, the second ground conductor line 2G2 and the third ground conductor line 2G3 being positioned apart means that the second ground conductor line 2G2 and the third ground conductor line 2G3 are positioned separately from each other and are not electrically connected to each other on the termination circuit board 101b. In other words, in this embodiment, the second resistor 5R of the first embodiment is not provided between the second ground conductor line 2G2 and the third ground conductor line 2G3. This eliminates the need to provide the second resistor 5R, thereby reducing the number of steps required to manufacture the termination circuit board 101b.

[0053] (Third embodiment) Next, a termination circuit board 101c according to a third embodiment of the present disclosure will be described with reference to Figures 4 and 5. Note that, in the following, only the configuration of the third embodiment that differs from the configuration of the first embodiment will be described, and the other configurations will be assigned the same reference numerals as in the first embodiment and will not be described.

[0054] The termination circuit board 101c according to the third embodiment differs from the first embodiment in that it further includes a fifth resistor portion 8R, a seventh ground conductor line 2G7, and an eighth ground conductor line 2G8. That is, as shown in FIG. 4, the termination circuit board 101c may further include a fifth resistor 8R spaced apart from the first signal line 3S1 and the second signal line 3S2. In this case, the ground conductor portion 2G includes a seventh ground conductor line 2G7 and an eighth ground conductor line 2G8. The seventh ground conductor line 2G7 is spaced apart from the first region 111 and extends in the x-direction. The eighth ground conductor line 2G8 is located between the seventh ground conductor line 2G7 and the first region 111 and extends in the x-direction. The eighth ground conductor line 2G8 is connected to the first ground conductor line 2G1, the second ground conductor line 2G2, the third ground conductor line 2G3, and the fourth ground conductor line 2G4. The fifth resistor 8R is connected to the seventh ground conductor line 2G7 and the eighth ground conductor line 2G8. In other words, the first signal line 3S1 is surrounded by the first ground conductor line 2G1, the second ground conductor line 2G2, and the eighth ground conductor line 2G8, and the second signal line 3S2 is surrounded by the third ground conductor line 2G3, the fourth ground conductor line 2G4, and the eighth ground conductor line 2G8.

[0055] With this configuration, unwanted electrical signals generated between the first signal line 3S1 and the second signal line 3S2 can be converted into thermal energy more efficiently than in a case where the fifth resistor 8R is not provided, thereby reducing the possibility that unwanted electrical signals will be reflected by the first signal line 3S1 and the second signal line 3S2.

[0056] Furthermore, multiple fifth resistor portions 8R may be located between the seventh ground conductor line 2G7 and the eighth ground conductor line 2G8. More specifically, as shown in FIG. 5, the fifth resistor portion 8R may include a sixth resistor portion 8R6, a seventh resistor portion 8R7, and an eighth resistor portion 8R8. In one embodiment, the sixth resistor portion 8R6 overlaps the third resistor portion 6R, the seventh resistor portion 8R7 overlaps the second resistor portion 5R, and the eighth resistor portion 8R8 overlaps the fourth resistor portion 7R in a side view from the y direction. This configuration effectively reduces the possibility of unwanted electrical signals being reflected back to the first signal line 3S1 and the second signal line 3S2 while adjusting the resistance value of the fifth resistor portion 8R. The positions of the sixth resistor portion 8R6, the seventh resistor portion 8R7, and the eighth resistor portion 8R8 are not limited to those in the above embodiment.

[0057] (Fourth embodiment) Next, a termination circuit board 101d according to a fourth embodiment of the present disclosure will be described with reference to Fig. 6. Note that, in the following, only the configuration of the fourth embodiment that differs from the configuration of the first embodiment will be described, and the other configurations will be assigned the same reference numerals as in the first embodiment and will not be described.

[0058] In the termination circuit board 101d according to the fourth embodiment, the first signal line 3S1 includes a third signal line 3S13 and a fourth signal line 3S14 spaced apart from the third signal line 3S13. The second signal line 3S2 includes a fifth signal line 3S25 and a sixth signal line 3S26 spaced apart from the fifth signal line 3S25. The first resistor section 4R further includes a fifth resistor 4R5, a sixth resistor 4R6, a seventh resistor 4R7, and an eighth resistor 4R8. In a side view from the y direction, the fifth resistor 4R5 is positioned to overlap the third signal line 3S13, the sixth resistor 4R6 is positioned to overlap the fourth signal line 3S14, the seventh resistor 4R7 is positioned to overlap the fifth signal line 3S25, and the eighth resistor 4R8 is positioned to overlap the sixth signal line 3S26.

[0059] The first resistor 4R1 and the fifth resistor 4R5 connect the third signal line 3S13 and the first ground conductor line 2G1. The second resistor 4R2 and the sixth resistor 4R6 connect the fourth signal line 3S14 and the second ground conductor line 2G2. The third resistor 4R3 and the seventh resistor 4R7 connect the fifth signal line 3S25 and the third ground conductor line 2G3. The fourth resistor 4R4 and the eighth resistor 4R8 connect the sixth signal line 3S26 and the fourth ground conductor line 2G4. In this case, the third signal line 3S13 and the fourth signal line 3S14 are a pair of signal lines that transmit differential signals. Furthermore, the fifth signal line 3S25 and the sixth signal line 3S26 are a pair of signal lines that transmit differential signals of a channel different from that of the first signal line 3S1 (the third signal line 3S13 and the fourth signal line 3S14). With the above-described configuration, unwanted electrical signals generated between the first signal line 3S1 and the second signal line 3S2 and between the fifth signal line 3S25 and the sixth signal line 3S26 can be converted into thermal energy more efficiently, thereby reducing the possibility that the unwanted electrical signals will be reflected by the first signal line 3S1 and the second signal line 3S2.

[0060] <Configuration of electronic component mounting package> Next, an electronic component mounting package 100 according to an embodiment of the present disclosure will be described with reference to FIG. 9. FIG. 9 is a cross-sectional view of an electronic module 10 including the electronic component mounting package 100 equipped with a termination circuit board 101a according to the first embodiment. The electronic component mounting package 100 includes the termination circuit board 101a, a base 102, and a frame 103. The frame 103 is bonded to the upper surface of the base 102, and the termination circuit board 101a is fixed to the frame 103. Alternatively, the termination circuit board 101a may be bonded to the upper surface of the base 102.

[0061] The base 102 has an upper surface. For example, the base 102 has a rectangular shape in a plan view, with dimensions of 10 mm × 10 mm to 50 mm × 50 mm and a thickness of 0.5 mm to 20 mm. Examples of materials for the base 102 include metal materials such as copper, iron, tungsten, molybdenum, nickel, and cobalt, as well as alloys containing these metal materials. In this case, the base 102 may be a single metal plate or a laminate of multiple metal plates. When the base 102 is made of any of the above metal materials, a plating layer of nickel, gold, or the like may be formed on the surface of the base 102 by electroplating or electroless plating to reduce oxidation corrosion. The base 102 may also be made of an insulating material, such as an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, a silicon nitride sintered body, or a ceramic material such as glass ceramics.

[0062] 9, the base 102 may have a first seat 102a and a second seat 102b for mounting the electronic component 104. In this case, the termination circuit board 101a may be mounted on the second seat 102b.

[0063] The frame 103 is located on the upper surface of the base 102 and protects the electronic components 104 located inside in a plan view. That is, in a plan view, the frame 103 is located so as to surround the electronic components 104. As shown in FIG. 9 , in one embodiment, the frame 103 may have a wiring base 103a for communicating signals with the outside and a frame 103b. That is, the wiring base 103a and the frame 103b surround the outer edge of the upper surface of the base 102. That is, the wiring base 103a and the frame 103b are located so as to surround the electronic components 104. Furthermore, in one embodiment, the frame 103 is located along the outer edge of the upper surface of the base 102, but the frame 103 may be located inside the outer edge of the upper surface of the base 102.

[0064] The frame 103 may be made of a metal material such as copper, iron, tungsten, molybdenum, nickel, or cobalt, or an alloy containing these metal materials. The frame 103 may also be made of an insulating material, such as a ceramic material such as an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, or a glass ceramic. If the frame 103 has a wiring base 103a, the wiring base 103a may be made of a ceramic material such as an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, or a silicon nitride sintered body, or a dielectric material such as a glass ceramic material. The wiring base 103a may also be made of a laminate of multiple insulating layers. The wiring base 103a and the frame 103b may be made of the same or different materials.

[0065] When the frame 103 has a wiring base 103a, wiring may be formed on a green sheet that forms the outline of the wiring base 103a using a metal material such as gold, silver, copper, nickel, tungsten, molybdenum, or manganese. The wiring may be formed by sintering a metal paste, or by using a thin-film formation technique such as vapor deposition or sputtering. An insulating film such as ceramic (e.g., an alumina coating) or resin may be positioned on a portion of the wiring.

[0066] The frame 103 can be joined to the base 102 via a brazing material or the like. The brazing material may be, for example, silver, copper, gold, aluminum, or magnesium, and may contain additives such as nickel, cadmium, or phosphorus.

[0067] <Electronic module configuration> Next, an electronic module 10 according to an embodiment of the present disclosure will be described. As shown in Fig. 9, the electronic module 10 includes an electronic component mounting package 100, an electronic component 104, and a lid 106. The electronic module 10 may also include a seal ring 105.

[0068] The electronic component 104 may be a component that processes signals, such as converting an optical signal to an electrical signal or an electrical signal to an optical signal. The electronic component 104 is located on the upper surface of the base 102 and is housed in the electronic component mounting package 100.

[0069] Examples of the electronic component 104 include optical semiconductor elements such as semiconductor lasers (LDs) or photodiodes (PDs), semiconductor integrated circuit elements, and sensor elements such as optical sensors. The electronic component 104 can be formed from a semiconductor material such as gallium arsenide or gallium nitride.

[0070] The electronic component 104 may have a thin-film resistor. The thin-film resistor may be provided in the same configuration as the termination circuit board 101a. This allows the electronic component side to convert unwanted electrical signals generated between the first signal line 3S1 and the second signal line 3S2 and / or between the seventh signal line 104S7 and the eighth signal line 104S8 into thermal energy, thereby reducing the possibility that the unwanted electrical signals will be reflected by the first signal line 3S1 and the second signal line 3S2 and / or the seventh signal line 104S7 and the eighth signal line 104S8.

[0071] The electronic component 104 may be mounted directly on the base 102, or may be mounted via the first seat 102a as described above.

[0072] Lid 106 is positioned on frame 103 to cover the interior of electronic component mounting package 100 and, together with frame 103, protects electronic component 104. Lid 106 is, for example, rectangular in plan view, with dimensions of 10 mm × 10 mm to 50 mm × 50 mm and a thickness of 0.5 mm to 2 mm. Examples of materials for lid 106 include metal materials such as iron, copper, nickel, chromium, cobalt, molybdenum, and tungsten, as well as alloys made up of a combination of these metal materials. The metal member that constitutes lid 106 can be produced by subjecting an ingot of such a metal material to metalworking methods such as rolling and punching.

[0073] The seal ring 105 functions to join the lid body 106 and the frame body 103. The seal ring 105 is located on the frame body 103 and surrounds the electronic component 104 in a plan view. Examples of materials for the seal ring 105 include metal materials such as iron, copper, silver, nickel, chromium, cobalt, molybdenum, and tungsten, and alloys combining a plurality of these metal materials. Note that if the seal ring 105 is not provided on the frame body 103, the lid body 106 may be joined via a joining material such as solder, brazing material, glass, or resin adhesive.

[0074] It should be noted that various combinations of the features in one embodiment are not limited to the examples of the above-described embodiment, and combinations of the respective embodiments are also possible. [Industrial Applicability]

[0075] The present disclosure can be used as a termination circuit board, an electronic component mounting package, and an electronic module. [Explanation of symbols]

[0076] 1. Dielectric substrate 11 Page 1 11a Side 1 111 First area 112 Second area 2G Ground conductor 2G1 First ground conductor line 2G1a 1st end 2G2 Second ground conductor line 2G2a 2nd end 2G3 Third ground conductor line 2G3a 2nd end 2G4 Fourth ground conductor line 2G4a 2nd end 2G5 5th ground conductor line 2G6 6th ground conductor line 2G7 Seventh ground conductor line 2G8 8th ground conductor line 3S signal conductor 3S1 First signal line 3S1a 5th end 3S1b First wide section 3S1c 1st narrow part 3S13 3rd signal line 3S14 4th signal line 3S2 Second signal line 3S2a 6th end 3S25 5th signal line 3S26 6th signal line 4R 1st resistance section 4R1 1st resistor 4R2 2nd resistor 4R3 Third Resistance 4R4 4th Resistance 4R5 5th resistor 4R6 6th resistor 4R7 7th resistor 4R8 8th resistor 5R 2nd resistance section 5R1a 7th end 6R 3rd resistance section 7R 4th resistance section 8R 5th resistance section 8R6 6th resistance section 8R7 7th resistance section 8R8 8th resistance section 71 First Wire 72 Second Wire 73 Third Wire 74 4th Wire 75 5th Wire 76 6th Wire L1 1st distance L2 2nd distance L3 Third distance L712a~b Distance between the first and second wires L734a~b Distance between the third and fourth wires L4 4th distance L5 5th distance L6 6th distance D1 First dimension D2 Second dimension C1 Virtual line 10 Electronic Module 100 Electronic component mounting package 101a~d Termination circuit board 102 Base 102a First pedestal 102b Second pedestal 103 Frame 103a Wiring board 103b Frame 104 Electronic Components 104S7 7th signal line 104S8 8th signal line 104G 10th ground conductor line 105 Seal ring 106 Lid

Claims

1. a dielectric substrate having a first surface including a first side; When a direction along the first side is defined as a first direction and a direction intersecting the first direction is defined as a second direction, a ground conductor portion located on the first surface and spaced a first distance from the first side in the second direction; a signal conductor portion located on the first surface and spaced a second distance from the first side in the second direction; a first resistor portion located on the first surface and connecting the ground conductor portion and the signal conductor portion; a second resistor portion located on the first surface and spaced a third distance from the first side in the second direction; the ground conductor section includes a first ground conductor line, a second ground conductor line, a third ground conductor line, and a fourth ground conductor line, which are arranged in order in the first direction; the signal conductor portion includes a first signal line located between the first ground conductor line and the second ground conductor line, and a second signal line located between the third ground conductor line and the fourth ground conductor line in the first direction; the first resistor section includes, in the first direction, a first resistor connecting the first ground conductor line and the first signal line, a second resistor connecting the second ground conductor line and the first signal line, a third resistor connecting the third ground conductor line and the second signal line, and a fourth resistor connecting the fourth ground conductor line and the second signal line; The second resistor portion connects the second ground conductor line and the third ground conductor line in the first direction.

2. a dielectric substrate having a first surface including a first side; When a direction along the first side is defined as a first direction and a direction intersecting the first direction is defined as a second direction, a ground conductor portion located on the first surface and spaced a first distance from the first side in the second direction; a signal conductor portion located on the first surface and spaced a second distance from the first side in the second direction; a first resistor portion located on the first surface and connecting the ground conductor portion and the signal conductor portion; the ground conductor section includes a first ground conductor line, a second ground conductor line, a third ground conductor line, and a fourth ground conductor line, which are arranged in order in the first direction; the signal conductor portion includes a first signal line located between the first ground conductor line and the second ground conductor line, and a second signal line located between the third ground conductor line and the fourth ground conductor line in the first direction; the first resistor section includes, in the first direction, a first resistor connecting the first ground conductor line and the first signal line, a second resistor connecting the second ground conductor line and the first signal line, a third resistor connecting the third ground conductor line and the second signal line, and a fourth resistor connecting the fourth ground conductor line and the second signal line; a termination circuit board, wherein the second ground conductor line and the third ground conductor line are positioned apart in the first direction;

3. the first surface has a first region located apart from the first side and extending in the first direction, and a second region located between the first side and the first region and extending in the first direction, the first signal line, the second signal line, the first ground conductor line, the second ground conductor line, the third ground conductor line, and the fourth ground conductor line are positioned to extend from the second region to the first region in a second direction intersecting the first direction, the first resistor, the second resistor, the third resistor, and the fourth resistor are located only in the first region; 3. The termination circuit board according to claim 1, wherein a distance between the first signal line and the first and second ground conductor lines in the second region in the first direction is shorter than a distance between the first signal line and the first and second ground conductor lines in the first region.

4. In a second direction intersecting the first direction, 3. The termination circuit board according to claim 1, wherein dimensions of the first signal line and the second signal line are equal to or greater than dimensions of the first ground conductor line, the second ground conductor line, the third ground conductor line, and the fourth ground conductor line.

5. the first surface has a first region spaced from the first side and extending in the first direction, and a second region located between the first side and the first region and extending in the first direction, In the second region, the first ground conductor line has a first end; the second ground conductor line has a second end; the third ground conductor line has a third end, the fourth ground conductor line has a fourth end, the first signal line has a fifth end; the second signal line has a sixth end; the second resistor portion has a seventh end, 2. The termination circuit board of claim 1, wherein the first end, the second end, the third end, the fourth end, the fifth end, the sixth end, and the seventh end are positioned on a straight line in the first direction.

6. the first surface has a first region spaced from the first side and extending in the first direction, and a second region located between the first side and the first region and extending in the first direction, In the second region, the first ground conductor line has a first end; the second ground conductor line has a second end; the third ground conductor line has a third end, the fourth ground conductor line has a fourth end, the first signal line has a fifth end; the second signal line has a sixth end; 3. The termination circuit board according to claim 1, wherein the first end, the second end, the third end, the fourth end, the fifth end, and the sixth end are positioned on a straight line in the first direction.

7. a third resistor portion and a fourth resistor portion located on the first surface; the ground conductor section includes a fifth ground conductor line and a sixth ground conductor line, the third resistor section connects the first ground conductor line and the fifth ground conductor line; 3. The termination circuit board according to claim 1, wherein the fourth resistor portion connects the fourth ground conductor line and the sixth ground conductor line.

8. a fifth resistor portion located with a space between the first signal line and the second signal line; the first surface has a first region located apart from the first side and extending in the first direction, and a second region located between the first side and the first region and extending in the first direction, the ground conductor portion has a seventh ground conductor line positioned with a gap between it and the first region and extending in the first direction, 3. The termination circuit board according to claim 1, wherein the fifth resistor section is connected to the first ground conductor line, the second ground conductor line, the third ground conductor line, the fourth ground conductor line, and also to the seventh ground conductor line.

9. a fifth resistor portion located at a distance from the first signal line and the second signal line; the first surface has a first region located apart from the first side and extending in the first direction, and a second region located between the first side and the first region and extending in the first direction, the ground conductor section includes a seventh ground conductor line that is spaced from the first region and extends in the first direction, and an eighth ground conductor line that is located between the seventh ground conductor line and the first region and extends in the first direction, the eighth ground conductor line is connected to the first ground conductor line, the second ground conductor line, the third ground conductor line, and the fourth ground conductor line; 3. The termination circuit board according to claim 1, wherein the fifth resistor portion is connected to the seventh ground conductor line and the eighth ground conductor line.

10. the signal line further includes a first wire and a second wire that electrically connect the first signal line and an electronic component, and a third wire and a fourth wire that electrically connect the second signal line and an electronic component; In plan view, a distance between the first wire and the second wire in the second direction decreases outward along the second direction; 3 . The termination circuit board according to claim 1 , wherein the distance between the third wire and the fourth wire in the second direction decreases outward along the second direction.

11. 6. The termination circuit board according to claim 1, wherein the first resistor portion and the second resistor portion are thin-film resistors.

12. 6. The termination circuit board according to claim 1, wherein the first resistor portion and the second resistor portion are made of a material containing TaN or Ta2N as a main component.

13. the first signal line includes a third signal line and a fourth signal line spaced apart from the third signal line; the second signal line includes a fifth signal line and a sixth signal line spaced apart from the fifth signal line; when viewed from the side in the second direction, the first resistor section includes a fifth resistor positioned to overlap the third signal line, a sixth resistor positioned to overlap the fourth signal line, a seventh resistor positioned to overlap the fifth signal line, and an eighth resistor positioned to overlap the sixth signal line; the first resistor and the fifth resistor connect the third signal line and the first ground conductor line; the second resistor and the sixth resistor connect the fourth signal line and the second ground conductor line; the third resistor and the seventh resistor connect the fifth signal line and the third ground conductor line; 3. The termination circuit board according to claim 1, wherein the fourth resistor and the eighth resistor connect the sixth signal line and the fourth ground conductor line.

14. A base and a frame body joined to an upper surface of the base; 3. An electronic component mounting package comprising: a termination circuit board according to claim 1 or 2 mounted on the top surface.

15. The electronic component mounting package according to claim 14; an electronic component located on the upper surface of the base and electrically connected to the termination circuit board of the electronic component mounting package; and a lid positioned on the frame and covering the inside of the electronic component mounting package.

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