Multilayer substrate

Abstract

This second radiation conductor layer is provided in a laminate so as to be in contact with a second insulator layer and is located in the positive direction of a Z-axis from the first radiation conductor layer. The second radiation conductor layer overlaps with a first radiation conductor layer when viewed in the Z-axis direction. The frequency of the electromagnetic wave radiated or received by the second radiation conductor layer is higher than the frequency of the electromagnetic wave radiated or received by the first radiation conductor layer, or the area of the second radiation conductor layer is smaller than the area of the first radiation conductor layer. A first planar ground conductor layer is located in the negative direction of the Z-axis from the first radiation conductor layer, and overlaps with the first radiation conductor layer and the second radiation conductor layer when viewed in the Z-axis direction.

Description

[Technical Field]

[0001] The present invention relates to a multilayer substrate comprising a plurality of radiating conductor layers. [Background technology]

[0002] A known example of a conventional invention relating to an antenna element is the patch antenna described in Patent Document 1. This patch antenna includes a dielectric block, a ground electrode, a parasitic electrode, a radiating electrode, and a connecting electrode. The dielectric block has a disk shape with upper and lower principal surfaces. The ground electrode is provided on the lower principal surface of the dielectric block. The radiating electrode is provided near the center of the upper principal surface of the dielectric block. The parasitic electrode is provided on the upper principal surface of the dielectric block. The parasitic electrode has a ring shape surrounding the radiating electrode when viewed in the vertical direction. The connecting electrode is provided on a side surface of the dielectric block. The connecting electrode electrically connects the ground electrode and the parasitic electrode. In the patch antenna described above, the radiating electrode transmits and receives high-frequency signals. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2007-97115 Summary of the Invention [Problem to be solved by the invention]

[0004] Incidentally, there are cases where it is desired to provide a plurality of radiation electrodes in the patch antenna described in Patent Document 1. In such cases, there is a demand for miniaturization of the patch antenna and improvement of the radiation characteristics of the patch antenna.

[0005] SUMMARY OF THE INVENTION It is therefore an object of the present invention to reduce the size of a multilayer substrate having a plurality of radiating conductor layers and to improve the radiation characteristics of the plurality of radiating conductor layers. [Means for solving the problem]

[0006] A multilayer substrate according to one embodiment of the present invention comprises: A laminate having a structure in which one or more first insulator layers and one or more second insulator layers are stacked in the Z-axis direction, wherein the dielectric constant of the one or more second insulator layers is lower than the dielectric constant of the one or more first insulator layers; a first radiating conductor layer provided on the laminate so as to be in contact with the first insulator layer; a second radiating conductor layer provided on the laminate so as to be in contact with the second insulator layer, located in a positive direction of the Z axis from the first radiating conductor layer, and overlapping with the first radiating conductor layer as viewed in the Z axis direction, wherein a frequency of an electromagnetic wave radiated or received by the second radiating conductor layer is higher than a frequency of an electromagnetic wave radiated or received by the first radiating conductor layer, or an area of ​​the second radiating conductor layer is smaller than an area of ​​the first radiating conductor layer; a first planar ground conductor layer located in the negative direction of the Z-axis from the first radiating conductor layer and overlapping the first radiating conductor layer and the second radiating conductor layer when viewed in the Z-axis direction; a first ground conductor layer that does not overlap the first radiation conductor layer and the second radiation conductor layer when viewed in the Z-axis direction and is located in a positive direction of the Z-axis relative to the first radiation conductor layer; It is equipped with: [Effects of the Invention]

[0007] According to the multilayer substrate of the present invention, it is possible to reduce the size of a multilayer substrate having a plurality of radiating conductor layers, and also to improve the radiation characteristics of the plurality of radiating conductor layers. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is an exploded perspective view of a multilayer substrate 10. As shown in FIG. [Figure 2] FIG. 2 is a cross-sectional view of the multilayer substrate 10 taken along line AA in FIG. [Figure 3] FIG. 3 is a perspective view of the multilayer substrate 10 from above. [Figure 4] FIG. 4 is a cross-sectional view of the multilayer substrate 10a. [Figure 5] FIG. 5 is a cross-sectional view of the multilayer substrate 10b. [Figure 6] FIG. 6 is an exploded perspective view of the multilayer substrate 10c. [Figure 7] FIG. 7 is an exploded perspective view of the multilayer substrate 10d. [Figure 8] FIG. 8 is a perspective view of the multilayer substrate 10e seen from above. DETAILED DESCRIPTION OF THE INVENTION

[0009] (Embodiment) [Structure of multilayer substrate 10] The structure of a multilayer substrate 10 according to one embodiment of the present invention will be described below with reference to the drawings. Fig. 1 is an exploded perspective view of the multilayer substrate 10. Fig. 2 is a cross-sectional view of the multilayer substrate 10 taken along line AA in Fig. 1. Fig. 3 is a perspective view of the multilayer substrate 10 seen from above.

[0010] Hereinafter, the stacking direction of the laminate 12 of the multilayer substrate 10 is defined as the up-down direction. The up-down direction coincides with the Z-axis direction. The up direction is the positive direction of the Z-axis. The down direction is the negative direction of the Z-axis. When viewing the multilayer substrate 10 in the up-down direction, the two directions in which the sides of the multilayer substrate 10 extend are defined as the left-right direction and the front-back direction. The left-right direction coincides with the X-axis direction. The front-back direction coincides with the Y-axis direction. The left-right direction is perpendicular to the up-down direction. The front-back direction is perpendicular to the up-down direction and the left-right direction. Note that the definitions of directions in this specification are merely examples. Therefore, the directions in the actual use of the multilayer substrate 10 do not necessarily coincide with the directions in this specification. Furthermore, the up-down direction may be reversed in each drawing. Similarly, the left-right direction may be reversed in each drawing. The front-back direction may be reversed in each drawing.

[0011] Hereinafter, X is a component or member of the multilayer substrate 10. In this specification, unless otherwise specified, each part of X is defined as follows: The front part of X means the front half of X. The rear part of X means the rear half of X. The left part of X means the left half of X. The right part of X means the right half of X. The upper part of X means the upper half of X. The lower part of X means the lower half of X. The front end of X means the front end of X. The rear end of X means the rear end of X. The left end of X means the left end of X. The right end of X means the right end of X. The upper end of X means the upper end of X. The lower end of X means the lower end of X. The front end of X means the front end of X and its vicinity. The rear end of X means the rear end of X and its vicinity. The left end of X means the left end of X and its vicinity. The right end of X means the right end of X and its vicinity. The upper end of X means the upper end of X and its vicinity. The lower end of X means the lower end of X and its vicinity.

[0012] The multilayer substrate 10 is used in, for example, electronic devices such as mobile phones. As shown in Fig. 1, the multilayer substrate 10 includes a laminate 12, a first ground conductor layer 16, a planar ground conductor layer 18, a first radiation conductor layer 20, a second radiation conductor layer 21, external electrodes 24a, 24b, 26a, 26b, and interlayer connection conductors v1 to v8.

[0013] The laminate 12 has a plate shape. As shown in FIGS. 1 and 2, the laminate 12 has a rectangular shape when viewed in the vertical direction. The laminate 12 has a structure in which insulator layers 14b to 14d (first insulator layers), insulator layer 14a (second insulator layer), and insulator layers 14e to 14g (third insulator layers) are stacked in the Z-axis direction. The insulator layers 14a to 14g are arranged in this order from top to bottom. The dielectric constant of the insulator layer 14a (second insulator layer) is lower than the dielectric constant of the insulator layers 14b to 14d (first insulator layers). The dielectric constant of the insulator layers 14e to 14g (third insulator layers) is lower than the dielectric constant of the insulator layers 14b to 14d (first insulator layers). In this embodiment, the dielectric constant of the insulator layer 14a is equal to the dielectric constant of the insulator layers 14e to 14g. The insulating layers 14a to 14g are made of a thermoplastic resin such as polyimide, liquid crystal polymer, etc. Therefore, the laminate 12 is flexible.

[0014] The first radiating conductor layer 20 radiates and / or receives a first high-frequency signal. The first radiating conductor layer 20 is provided on the laminate 12 so as to be in contact with the insulator layers 14b and 14c (first insulator layers). In this embodiment, the first radiating conductor layer 20 is located on the upper main surface of the insulator layer 14c. As shown in FIG. 3 , the first radiating conductor layer 20 has a diamond shape with diagonals extending in the left-right direction (X-axis direction) and the front-rear direction (Y-axis direction) when viewed in the up-down direction (Z-axis direction).

[0015] The second radiating conductor layer 21 radiates and / or receives a second high-frequency signal. The second radiating conductor layer 21 is provided on the laminate 12 so as to be in contact with the insulator layer 14a (second insulator layer). In this embodiment, the second radiating conductor layer 21 is located on the upper main surface of the insulator layer 14a. As a result, the second radiating conductor layer 21 is located above the first radiating conductor layer 20 (in the positive direction of the Z axis). The vertical distance between the second radiating conductor layer 21 and the first radiating conductor layer 20 is ¼ of the wavelength of the second high-frequency signal.

[0016] 3, the second radiating conductor layer 21 overlaps with the first radiating conductor layer 20 when viewed in the up-down direction (Z-axis direction). As shown in FIG. 3, the second radiating conductor layer 21 has a diamond shape with diagonals extending in the left-right direction (X-axis direction) and the front-rear direction (Y-axis direction) when viewed in the up-down direction (Z-axis direction). However, the area of ​​the second radiating conductor layer 21 is smaller than the area of ​​the first radiating conductor layer 20. Therefore, when viewed in the up-down direction, four sides of the first radiating conductor layer 20 do not overlap with the second radiating conductor layer 21. As a result, the frequency of the second high-frequency signal (electromagnetic wave) radiated or received by the second radiating conductor layer 21 is higher than the frequency of the first high-frequency signal (electromagnetic wave) radiated or received by the first radiating conductor layer 20.

[0017] As shown in FIGS. 1 and 2 , the planar ground conductor layer 18 is provided on the laminate 12. More specifically, the planar ground conductor layer 18 (first planar ground conductor layer) is located below the first radiation conductor layer 20 (in the negative direction of the Z axis). The planar ground conductor layer 18 is provided on the lower main surface of the insulator layer 14g. As shown in FIG. 1 , the planar ground conductor layer 18 has a rectangular shape when viewed in the up-down direction. The long sides of the planar ground conductor layer 18 extend in the left-right direction. The short sides of the planar ground conductor layer 18 extend in the front-to-rear direction. When viewed in the up-down direction (Z axis direction), the planar ground conductor layer 18 (first planar ground conductor layer) overlaps with the first radiation conductor layer 20 and the second radiation conductor layer 21. The planar ground conductor layer 18 is connected to a ground potential.

[0018] The first ground conductor layer 16 is provided on the laminate 12. More specifically, the first ground conductor layer 16 is located above the first radiation conductor layer 20 (in the positive direction of the Z axis). In this embodiment, the first ground conductor layer 16 is provided at the same position in the up-down direction (Z axis direction) as the second radiation conductor layer 21. Therefore, the first ground conductor layer 16 is located on the upper main surface of the insulator layer 14a.

[0019] Furthermore, the first ground conductor layer 16 does not overlap with the first radiation conductor layer 20 and the second radiation conductor layer 21 when viewed in the up-down direction (Z-axis direction). In this embodiment, the first ground conductor layer 16 is located to the left (positive direction of the X-axis), right (negative direction of the X-axis), front (positive direction of the Y-axis), and rear (negative direction of the Y-axis) of the first radiation conductor layer 20 and the second radiation conductor layer 21 when viewed in the up-down direction (Z-axis direction). Therefore, the first ground conductor layer 16 has a ring shape surrounding the peripheries of the first radiation conductor layer 20 and the second radiation conductor layer 21 when viewed in the up-down direction (Z-axis direction). In this embodiment, the first ground conductor layer 16 has outer and inner edges of a rectangle having two sides extending in the front-rear direction and two sides extending in the left-right direction.

[0020] The external electrodes 24a, 24b, 26a, and 26b are provided on the lower main surface of the insulator layer 14g. The external electrodes 24a, 24b, 26a, and 26b are not in contact with the planar ground conductor layer 18. Therefore, the external electrodes 24a, 24b, 26a, and 26b are located within openings provided in the planar ground conductor layer 18. The external electrodes 24a and 24b overlap the first radiating conductor layer 20 when viewed in the vertical direction. The external electrodes 26a and 26b overlap the second radiating conductor layer 21 when viewed in the vertical direction. A first high-frequency signal is input to and output from the external electrodes 24a and 24b. A second high-frequency signal is input to and output from the external electrodes 26a and 26b.

[0021] The interlayer connection conductor v1 electrically connects the first radiation conductor layer 20 and the external electrode 24a. The interlayer connection conductor v1 penetrates the insulating layers 14c to 14g in the vertical direction. The interlayer connection conductor v1 is located near the midpoint of the front left side of the first radiation conductor layer 20 when viewed in the vertical direction. The point at which the interlayer connection conductor v1 comes into contact with the first radiation conductor layer 20 is the first feeding point P1.

[0022] The interlayer connection conductor v2 electrically connects the first radiation conductor layer 20 and the external electrode 24b. The interlayer connection conductor v2 penetrates the insulating layers 14c to 14g in the vertical direction. The interlayer connection conductor v2 is located near the midpoint of the left rear side of the first radiation conductor layer 20 when viewed in the vertical direction. The point at which the interlayer connection conductor v2 comes into contact with the first radiation conductor layer 20 is the second feeding point P2.

[0023] The interlayer connection conductor v3 electrically connects the second radiation conductor layer 21 and the external electrode 26a. The interlayer connection conductor v3 penetrates the insulating layers 14a to 14g in the vertical direction. The interlayer connection conductor v3 is located near the midpoint of the right front side of the second radiation conductor layer 21 when viewed in the vertical direction. The point at which the interlayer connection conductor v3 comes into contact with the second radiation conductor layer 21 is the third feeding point P3.

[0024] The interlayer connection conductor v4 electrically connects the second radiation conductor layer 21 and the external electrode 26b. The interlayer connection conductor v4 penetrates the insulating layers 14a to 14g in the vertical direction. The interlayer connection conductor v4 is located near the midpoint of the right rear side of the second radiation conductor layer 21 when viewed in the vertical direction. The point at which the interlayer connection conductor v4 comes into contact with the second radiation conductor layer 21 is the fourth feeding point P4.

[0025] The interlayer connection conductors v5 to v8 electrically connect the first ground conductor layer 16 and the planar ground conductor layer 18. The interlayer connection conductors v5 to v8 each penetrate the insulating layers 14a to 14g.

[0026] The first ground conductor layer 16, the planar ground conductor layer 18, the first radiation conductor layer 20, the second radiation conductor layer 21, and the external electrodes 24a, 24b, 26a, 26b are formed, for example, by patterning copper foil attached to the upper or lower main surfaces of the insulator layers 14a to 14g. The interlayer connection conductors v1 to v8 are, for example, via-hole conductors. The via-hole conductors are formed by forming through-holes in the insulator layers 14a to 14g, filling the through-holes with conductive paste, and sintering the conductive paste.

[0027] In the multilayer substrate 10 described above, the first ground conductor layer 16, the planar ground conductor layer 18, and the first radiation conductor layer 20 function as a patch antenna that radiates or receives a first high-frequency signal, while the first ground conductor layer 16, the planar ground conductor layer 18, and the second radiation conductor layer 21 function as a patch antenna that radiates or receives a second high-frequency signal.

[0028] [effect] The multilayer substrate 10 can be made smaller in size by including the first radiation conductor layer 20 and the second radiation conductor layer 21. More specifically, the second radiation conductor layer 21 overlaps the first radiation conductor layer 20 when viewed in the top-bottom direction. As a result, the area of ​​the multilayer substrate 10 when viewed in the top-bottom direction is smaller than the area of ​​a multilayer substrate in which two radiation conductors are arranged side by side in the front-to-back or left-to-right direction. Therefore, the multilayer substrate 10 can be made smaller in size by including the first radiation conductor layer 20 and the second radiation conductor layer 21.

[0029] The multilayer substrate 10 can improve the radiation characteristics of the first radiation conductor layer 20. More specifically, the area of ​​the first radiation conductor layer 20 is larger than the area of ​​the second radiation conductor layer 21. Therefore, when viewed in the vertical direction, the first radiation conductor layer 20 is located closer to the first ground conductor layer 16. In this case, currents of opposite phases flow through the planar ground conductor layer 18. As a result, the radiation characteristics of the first radiation conductor layer 20 deteriorate.

[0030] Therefore, in the multilayer substrate 10, the first radiating conductor layer 20 is provided on the laminate 12 so as to be in contact with the insulator layers 14b and 14c. The dielectric constants of the insulator layers 14b and 14c are higher than that of the insulator layer 14a. This allows the wavelength shortening effect to make the first radiating conductor layer 20 smaller without changing the frequency of the first high-frequency signal radiated or received by the first radiating conductor layer 20. Therefore, when viewed in the vertical direction, the first radiating conductor layer 20 is spaced apart from the first ground conductor layer 16. This makes it difficult for reverse-phase currents to flow through the planar ground conductor layer 18. As described above, the multilayer substrate 10 can improve the radiation characteristics of the first radiating conductor layer 20.

[0031] The multilayer substrate 10 can improve the radiation characteristics of the second radiating conductor layer 21. More specifically, the frequency of the second high-frequency signal radiated or received by the second radiating conductor layer 21 is higher than the frequency of the first high-frequency signal radiated or received by the first radiating conductor layer 20. Therefore, the area of ​​the second radiating conductor layer 21 is smaller than the area of ​​the first radiating conductor layer 20. In this case, it is difficult to improve the radiation characteristics of the second radiating conductor layer 21.

[0032] Therefore, the second radiating conductor layer 21 is provided on the laminate 12 so as to be in contact with the insulator layer 14a. The dielectric constant of the insulator layer 14a is lower than the dielectric constants of the insulator layers 14b to 14d. Therefore, the wavelength shortening effect is less likely to occur in the second radiating conductor layer 21. Therefore, the area of ​​the second radiating conductor layer 21 can be increased without changing the frequency of the second high-frequency signal radiated or received by the second radiating conductor layer 21. As a result, the multilayer substrate 10 can improve the radiation characteristics of the second radiating conductor layer 21.

[0033] The multilayer substrate 10 can make the antenna gain of the first radiation conductor layer 20 in the first polarization and the antenna gain of the first radiation conductor layer 20 in the second polarization closer to each other. More specifically, the first radiation conductor layer 20 radiates and receives a first high-frequency signal in the first polarization at a first feed point P1. The first radiation conductor layer 20 radiates and receives a first high-frequency signal in the second polarization at a second feed point P2. To make the antenna gain of the first radiation conductor layer 20 in the first polarization and the antenna gain of the first radiation conductor layer 20 in the second polarization closer to each other, it is sufficient to make the distance from the first feed point P1 to the first ground conductor layer 16 closer to the distance from the second feed point P2 to the first ground conductor layer 16.

[0034] Therefore, in the multilayer substrate 10, the first radiation conductor layer 20 and the second radiation conductor layer 21 have a diamond shape with diagonals extending in the left-right and front-rear directions when viewed in the vertical direction, as shown in FIG. 3 . Furthermore, the first ground conductor layer 16 is located to the left, right, front, and rear of the first radiation conductor layer 20 and the second radiation conductor layer 21 when viewed in the vertical direction. This makes the distance from the first feed point P1 to the first ground conductor layer 16 equal to the distance from the second feed point P2 to the first ground conductor layer 16. As a result, the multilayer substrate 10 can make the antenna gain of the first radiation conductor layer 20 in the first polarization and the antenna gain of the first radiation conductor layer 20 in the second polarization close to each other. For the same reason, the multilayer substrate 10 can make the antenna gain of the second radiation conductor layer 21 in the first polarization close to each other.

[0035] The multilayer substrate 10 can improve the antenna gain of the second radiating conductor layer 21. More specifically, the second radiating conductor layer 21 radiates a second high-frequency signal in the upward and downward directions. The second high-frequency signal radiated downward is reflected by the first radiating conductor layer 20 and travels upward. The vertical distance between the second radiating conductor layer 21 and the first radiating conductor layer 20 is ¼ of the wavelength of the second high-frequency signal. This causes a phase shift of 180° between the second high-frequency signal and the first radiating conductor layer 20. Furthermore, the phase of the second high-frequency signal is shifted by 180° upon reflection. As a result, the phase of the second high-frequency signal radiated downward matches the phase of the second high-frequency signal radiated upward. Therefore, the multilayer substrate 10 can improve the antenna gain of the second radiating conductor layer 21.

[0036] (First Modification) The multilayer substrate 10a according to the first modification will be described below. Fig. 4 is a cross-sectional view of the multilayer substrate 10a.

[0037] The multilayer substrate 10a differs from the multilayer substrate 10 in that the laminate 12 further includes protective layers 15a and 15b. This difference will be described below. The insulator layer 14a (second insulator layer) is located above (in the positive direction of the Z axis) the insulator layers 14b to 14d (first insulator layers). The protective layer 15a is located above (in the positive direction of the Z axis) the insulator layer 14a (second insulator layer). In this embodiment, the protective layer 15a covers the upper main surface of the insulator layer 14a. Furthermore, the protective layer 15a covers the second radiation conductor layer 21. The protective layer 15b covers the lower main surface of the insulator layer 14g. Furthermore, the protective layer 15b covers the planar ground conductor layer 18. However, the external electrodes 24a, 24b, 26a, and 26b and portions of the planar ground conductor layer 18 are exposed from the protective layer 15b.

[0038] The dielectric constant of the protective layers 15a and 15b is lower than the dielectric constant of the insulator layer 14a (second insulator layer). The second radiating conductor layer 21 is buried in the protective layer 15a. As a result, the area of ​​the second radiating conductor layer 21 in contact with the protective layer 15a is larger than the area of ​​the second radiating conductor layer 21 in contact with the insulator layer 14a (second insulator layer). The other structures of the multilayer substrate 10a are the same as those of the multilayer substrate 10. The multilayer substrate 10a can achieve the same effects as the multilayer substrate 10.

[0039] The multilayer substrate 10a can improve the radiation characteristics of the second radiating conductor layer 21. More specifically, the dielectric constant of the protective layer 15a is lower than the dielectric constant of the insulator layer 14a (second insulator layer). The area where the second radiating conductor layer 21 is in contact with the protective layer 15a is larger than the area where the second radiating conductor layer 21 is in contact with the insulator layer 14a (second insulator layer). This makes it difficult for the wavelength shortening effect to occur in the second radiating conductor layer 21. Therefore, the area of ​​the second radiating conductor layer 21 can be increased without changing the frequency of the second high-frequency signal radiated or received by the second radiating conductor layer 21. As a result, the multilayer substrate 10a can improve the radiation characteristics of the second radiating conductor layer 21.

[0040] (Second Modification) The multilayer substrate 10b according to the second modification will be described below. Fig. 5 is a cross-sectional view of the multilayer substrate 10b.

[0041] The multilayer substrate 10b differs from the multilayer substrate 10a in that the dielectric constant of the protective layers 15a, 15b is higher than the dielectric constant of the insulator layer 14a (second insulator layer). The second radiating conductor layer 21 is buried in the insulator layer 14a. As a result, the area of ​​the second radiating conductor layer 21 in contact with the protective layer 15a is smaller than the area of ​​the second radiating conductor layer 21 in contact with the insulator layer 14a (second insulator layer). The rest of the structure of the multilayer substrate 10b is the same as that of the multilayer substrate 10a. The multilayer substrate 10b can achieve the same effects as the multilayer substrate 10a.

[0042] The multilayer substrate 10b can suppress degradation of the radiation characteristics of the second radiating conductor layer 21. More specifically, the dielectric constants of the protective layers 15a and 15b are higher than the dielectric constant of the insulator layer 14a (second insulator layer). However, the area where the second radiating conductor layer 21 is in contact with the protective layer 15a is smaller than the area where the second radiating conductor layer 21 is in contact with the insulator layer 14a (second insulator layer). This suppresses excessive wavelength shortening effect in the second radiating conductor layer 21. Therefore, it is possible to suppress reduction in the area of ​​the second radiating conductor layer 21 without changing the frequency of the second high-frequency signal radiated or received by the second radiating conductor layer 21. As a result, the multilayer substrate 10b can suppress degradation of the radiation characteristics of the second radiating conductor layer 21.

[0043] (Third Modification) A multilayer substrate 10c according to a third modified example will now be described. Fig. 6 is an exploded perspective view of the multilayer substrate 10c.

[0044] The multilayer substrate 10c differs from the multilayer substrate 10 in that it further includes a first matching circuit 50a and a second matching circuit 50b. More specifically, the laminate 12 has a structure in which an insulator layer 14a (second insulator layer), insulator layers 14b to 14d (first insulator layers), and insulator layers 14e, 14h, 14i, and 14g (third insulator layers) are arranged in this order downward (in the negative direction of the Z axis). The dielectric constant of the insulator layers 14e, 14h, 14i, and 14g (third insulator layer) is lower than the dielectric constant of the insulator layers 14b to 14d (first insulator layers).

[0045] The multilayer substrate 10c further includes a planar ground conductor layer 28, first signal conductor layers 30 and 32, second signal conductor layers 34 and 36, and interlayer connection conductors v11 to v14. The planar ground conductor layer 28 is located on the upper main surface of the insulator layer 14h.

[0046] The first signal conductor layers 30, 32 and the second signal conductor layers 34, 36 are located on the upper main surface of the insulator layer 14i. Therefore, the first signal conductor layers 30, 32 and the second signal conductor layers 34, 36 are located below the planar ground conductor layer 28 and above the planar ground conductor layer 18. When viewed in the up-down direction, the first signal conductor layers 30, 32 and the second signal conductor layers 34, 36 overlap with the planar ground conductor layers 18, 28. The first signal conductor layers 30, 32 and the second signal conductor layers 34, 36 extend in the left-right direction.

[0047] The interlayer connection conductor v1 electrically connects the first radiation conductor layer 20 and the right end of the first signal conductor layer 30. The interlayer connection conductor v11 electrically connects the left end of the first signal conductor layer 30 and the external electrode 24a.

[0048] The interlayer connection conductor v2 electrically connects the first radiation conductor layer 20 and the right end of the first signal conductor layer 32. The interlayer connection conductor v12 electrically connects the left end of the first signal conductor layer 32 and the external electrode 24b.

[0049] The interlayer connection conductor v3 electrically connects the second radiation conductor layer 21 and the left end of the second signal conductor layer 34. The interlayer connection conductor v13 electrically connects the right end of the second signal conductor layer 34 and the external electrode 26a.

[0050] The interlayer connection conductor v4 electrically connects the second radiation conductor layer 21 and the left end of the second signal conductor layer 36. The interlayer connection conductor v14 electrically connects the right end of the second signal conductor layer 36 and the external electrode 26b.

[0051] As described above, the first signal conductor layers 30, 32, the second signal conductor layers 34, 36, and the planar ground conductor layers 18, 28 have a stripline structure. As a result, the first signal conductor layers 30, 32 and the planar ground conductor layers 18, 28 form a first matching circuit 50a. The second signal conductor layers 34, 36 and the planar ground conductor layers 18, 28 form a second matching circuit 50b.

[0052] As described above, the first matching circuit 50a is electrically connected to the first radiation conductor layer 20 via the interlayer connection conductors v1 and v2. The second matching circuit 50b is electrically connected to the second radiation conductor layer 21 via the interlayer connection conductors v3 and v4. The first matching circuit 50a and the second matching circuit 50b are in contact with the insulator layers 14e to 14g (third insulator layers). The other structures of the multilayer substrate 10c are the same as those of the multilayer substrate 10, so a description thereof will be omitted. The multilayer substrate 10c can achieve the same effects as the multilayer substrate 10.

[0053] In the multilayer substrate 10c, the first matching circuit 50a and the second matching circuit 50b are in contact with the insulator layers 14e-14g (third insulator layers). The dielectric constant of the insulator layers 14e-14g (third insulator layers) is lower than the dielectric constant of the insulator layers 14b-14d (first insulator layers). This reduces the likelihood of capacitance being formed between the first signal conductor layers 30, 32 and the planar ground conductor layers 18, 28. This reduces the likelihood of capacitance being formed between the second signal conductor layers 34, 36 and the planar ground conductor layers 18, 28. Therefore, even if the line widths of the first signal conductor layers 30, 32 and the second signal conductor layers 34, 36 are increased, the capacitance does not become too large. This allows the resistance values ​​of the first signal conductor layers 30, 32 and the second signal conductor layers 34, 36 to be reduced while maintaining the characteristic impedances of the first matching circuit 50a and the second matching circuit 50b at desired values.

[0054] (Fourth Modification) A multilayer substrate 10d according to a fourth modified example will be described below. Fig. 7 is an exploded perspective view of the multilayer substrate 10d.

[0055] The multilayer substrate 10d differs from the multilayer substrate 10c in the structure of the laminate 12. The laminate 12 has a first region A1 and a second region A2. The first region A1 is formed by insulating layers 14a (the first 2 insulating layer), insulating layers 14b to 14d ( 1 Insulator layer) and insulator layers 14e, 14h, 14i, 14 g The second region A2 is a region where the insulating layer 14a (third insulating layer) exists when viewed in the vertical direction (Z-axis direction). 2 Insulator layer) and insulator layers 14b to 14d (the 1 Insulator layer) does not exist, and insulator layers 14e, 14h, 14i, 14 g This is the region where the third insulating layer (Third Insulator Layer) is present.

[0056] The first signal conductor layer 30 is electrically connected to the first radiation conductor layer 20 via an interlayer connection conductor v1. The first signal conductor layer 32 is electrically connected to the first radiation conductor layer 20 via an interlayer connection conductor v2. The second signal conductor layer 34 is electrically connected to the second radiation conductor layer 21 via an interlayer connection conductor v3. The second signal conductor layer 36 is electrically connected to the second radiation conductor layer 21 via an interlayer connection conductor v4. The first signal conductor layers 30, 32 and the second signal conductor layers 34, 36 are in contact with the insulator layers 14h, 14i (third insulator layers) and extend from the first region A1 to the second region A2. The other structure of the multilayer substrate 10d is the same as that of the multilayer substrate 10c, so a description thereof will be omitted. The multilayer substrate 10d can achieve the same effects as the multilayer substrate 10c.

[0057] For the same reason as in the multilayer substrate 10c, the multilayer substrate 10d can reduce the resistance values ​​of the first signal conductor layers 30, 32 and the second signal conductor layers 34, 36. As a result, even if the first signal conductor layers 30, 32 and the second signal conductor layers 34, 36 are long, insertion loss is unlikely to occur in the first signal conductor layers 30, 32 and the second signal conductor layers 34, 36.

[0058] In the multilayer substrate 10d, the vertical thickness of the second region A2 is smaller than the vertical thickness of the first region A1. Therefore, the second region A2 is more easily deformed than the first region A1. Therefore, the multilayer substrate 10d can be used with the second region A2 bent.

[0059] (Fifth Modification) A multilayer substrate 10e according to the fifth modified example will be described below. Fig. 8 is a perspective view of the multilayer substrate 10e seen from above.

[0060] The multilayer substrate 10e differs from the multilayer substrate 10 in that it further includes a third radiating conductor layer 120 and a fourth radiating conductor layer 121. The third radiating conductor layer 120 is provided on the laminate 12 so as to be in contact with the insulator layers 14b and 14c (first insulator layers). The fourth radiating conductor layer 121 is provided on the laminate 12 so as to be in contact with the insulator layer 14a (second insulator layer). The fourth radiating conductor layer 121 is located above the third radiating conductor layer 120 (positive direction of the Z-axis) and overlaps with the third radiating conductor layer 120 when viewed in the up-down direction (Z-axis direction).

[0061] The area of ​​the fourth radiating conductor layer 121 is smaller than the area of ​​the third radiating conductor layer 120. As a result, the frequency of the fourth high frequency signal (electromagnetic wave) radiated or received by the fourth radiating conductor layer 121 is higher than the frequency of the third high frequency signal (electromagnetic wave) radiated or received by the third radiating conductor layer 120.

[0062] The first ground conductor layer 16 has a ring shape surrounding the first radiation conductor layer 20, the second radiation conductor layer 21, the third radiation conductor layer 120, and the fourth radiation conductor layer 121 when viewed in the vertical direction (Z-axis direction). The other structures of the multilayer substrate 10e are the same as those of the multilayer substrate 10, and therefore description thereof will be omitted. The multilayer substrate 10e can achieve the same effects as the multilayer substrate 10.

[0063] (Other embodiments) The multilayer substrate according to the present invention is not limited to multilayer substrates 10, 10a to 10e, and can be modified within the scope of the invention. Furthermore, the structures of multilayer substrates 10, 10a to 10e may be combined arbitrarily.

[0064] No. The number of insulating layers may be one or more.

[0065] No. The number of insulating layers may be one or more.

[0066] No. 3 The number of insulating layers may be one or more.

[0067] In addition, either the frequency of the electromagnetic waves emitted or received by the second radiation conductor layer 21 may be higher than the frequency of the electromagnetic waves emitted or received by the first radiation conductor layer 20, or the area of ​​the second radiation conductor layer 21 may be smaller than the area of ​​the first radiation conductor layer 20.

[0068] In addition, either the frequency of the electromagnetic waves emitted or received by the fourth radiation conductor layer 121 may be higher than the frequency of the electromagnetic waves emitted or received by the third radiation conductor layer 120, or the area of ​​the fourth radiation conductor layer 121 may be smaller than the area of ​​the third radiation conductor layer 120.

[0069] Note that only one of the interlayer connection conductors v1 and v2 may be provided, or only one of the interlayer connection conductors v3 and v4 may be provided.

[0070] Alternatively, only the interlayer connection conductor v1 may be provided. In this case, the interlayer connection conductor v1 is connected to both the first radiation conductor layer 20 and the second radiation conductor layer 21, and is also connected to the external electrode 24a. Both the first high-frequency signal and the second high-frequency signal are input and output to the external electrode 24a. When the first radiation conductor layer 20 receives the first high-frequency signal and the second radiation conductor layer 21 receives the second high-frequency signal, for example, a duplexer is connected to the external electrode 24a. The duplexer then separates the first high-frequency signal from the second high-frequency signal.

[0071] The dielectric constant of the insulating layer 14a is e It does not have to be equal to the dielectric constant of ~14g.

[0072] The first ground conductor layer 16 does not have to have a ring shape.

[0073] The first radiating conductor layer 20 is sandwiched between the first insulator layers from above and below. However, the first radiating conductor layer 20 may be in contact with only the insulator layer 14b (first insulator layer) or only the insulator layer 14c (first insulator layer).

[0074] The second radiating conductor layer 21 may be sandwiched between second insulating layers from above and below.

[0075] It is only necessary that at least one of the first matching circuit 50a and the second matching circuit 50b be in contact with the insulating layers 14e to 14g (third insulating layers).

[0076] It is only necessary that at least one of the first signal conductor layers 30, 32 and the second signal conductor layers 34, 36 be in contact with the insulating layers 14h, 14i (third insulating layers).

[0077] The present invention has the following structure:

[0078] (1) A laminate having a structure in which one or more first insulator layers and one or more second insulator layers are stacked in the Z-axis direction, wherein the dielectric constant of the one or more second insulator layers is lower than the dielectric constant of the one or more first insulator layers; a first radiating conductor layer provided on the laminate so as to be in contact with the first insulator layer; a second radiating conductor layer provided on the laminate so as to be in contact with the second insulator layer, located in a positive direction of the Z axis from the first radiating conductor layer, and overlapping with the first radiating conductor layer as viewed in the Z axis direction, wherein a frequency of an electromagnetic wave radiated or received by the second radiating conductor layer is higher than a frequency of an electromagnetic wave radiated or received by the first radiating conductor layer, or an area of ​​the second radiating conductor layer is smaller than an area of ​​the first radiating conductor layer; a first planar ground conductor layer located in the negative direction of the Z-axis from the first radiating conductor layer and overlapping the first radiating conductor layer and the second radiating conductor layer when viewed in the Z-axis direction; a first ground conductor layer that does not overlap the first radiation conductor layer and the second radiation conductor layer when viewed in the Z-axis direction and is located in a positive direction of the Z-axis relative to the first radiation conductor layer; Equipped with Multilayer board.

[0079] (2) The direction perpendicular to the Z-axis direction is defined as the X-axis direction, A direction perpendicular to the X-axis direction and the Z-axis direction is defined as a Y-axis direction, When viewed in the Z-axis direction, the first ground conductor layer is aligned with the first radiation conductor layer and the second radiation conductor layer in the positive direction of the X-axis. and the negative direction of the X axis , located in the positive direction of the Y axis and in the negative direction of the Y axis, The first radiation conductor layer and the second radiation conductor layer have a diamond shape with diagonals extending in the X-axis direction and the Y-axis direction when viewed in the Z-axis direction. The multilayer substrate according to (1).

[0080] (3) the laminate has a structure in which the one or more second insulator layers, the one or more first insulator layers, and the one or more third insulator layers are arranged in this order in the negative direction of the Z axis, the one or more third insulator layers have a lower dielectric constant than the one or more first insulator layers; The multilayer substrate comprises: a first matching circuit electrically connected to the first radiation conductor layer; a second matching circuit electrically connected to the second radiation conductor layer; It further includes At least one of the first matching circuit and the second matching circuit is in contact with the one or more third insulator layers. A multilayer substrate according to either (1) or (2).

[0081] (4) the laminate has a structure in which the one or more second insulator layers, the one or more first insulator layers, and the one or more third insulator layers are arranged in this order in the negative direction of the Z axis, the one or more third insulator layers have a lower dielectric constant than the one or more first insulator layers; the laminate has, as viewed in the Z-axis direction, a first region in which the one or more first insulator layers, the one or more second insulator layers, and the one or more third insulator layers are present, and a second region in which the one or more first insulator layers and the one or more second insulator layers are absent and the one or more third insulator layers are present, The multilayer substrate comprises: a first signal conductor layer electrically connected to the first radiation conductor layer; a second signal conductor layer electrically connected to the second radiation conductor layer; It further includes At least one of the first signal conductor layer and the second signal conductor layer is in contact with the one or more third insulator layers and extends from the first region to the second region. A multilayer substrate according to either (1) or (2).

[0082] (5) The multilayer substrate comprises: a third radiating conductor layer provided on the laminate so as to be in contact with the first insulator layer; a fourth radiation conductor layer that is provided on the laminate so as to be in contact with the second insulator layer, that is located in the positive direction of the Z axis from the third radiation conductor layer, and that overlaps with the third radiation conductor layer when viewed in the Z axis direction, wherein a frequency of an electromagnetic wave radiated or received by the fourth radiation conductor layer is higher than a frequency of an electromagnetic wave radiated or received by the third radiation conductor layer, or an area of ​​the fourth radiation conductor layer is smaller than an area of ​​the third radiation conductor layer; It further comprises: the first ground conductor layer has a ring shape surrounding the first radiating conductor layer, the second radiating conductor layer, the third radiating conductor layer, and the fourth radiating conductor layer when viewed in the Z-axis direction; A multilayer substrate according to any one of (1) to (4).

[0083] (6) the one or more second insulating layers are located in the negative direction of the Z axis from the second radiating conductor layer, the laminate further includes a protective layer located in the positive direction of the Z-axis from the one or more second insulator layers and covering the second radiating conductor layer; the dielectric constant of the protective layer is lower than the dielectric constant of the one or more second insulator layers; an area where the second radiating conductor layer is in contact with the protective layer is larger than an area where the second radiating conductor layer is in contact with the one or more second insulator layers; A multilayer substrate according to any one of (1) to (5).

[0084] (7) the one or more second insulating layers are located in the negative direction of the Z axis from the second radiating conductor layer, the laminate further includes a protective layer located in the positive direction of the Z-axis from the one or more second insulator layers and covering the second radiating conductor layer; the dielectric constant of the protective layer is higher than the dielectric constant of the one or more second insulator layers; an area where the second radiating conductor layer is in contact with the protective layer is smaller than an area where the second radiating conductor layer is in contact with the one or more second insulator layers; A multilayer substrate according to any one of (1) to (5).

[0085] (8) the first ground conductor layer has a ring shape surrounding the first radiation conductor layer and the second radiation conductor layer when viewed in the Z-axis direction; A multilayer substrate according to any one of (1) to (7). [Explanation of symbols]

[0086] 10,10a~10e: Multilayer board 12: Laminate 14a to 14j: Insulator layers 15a, 15b: Protective layer 16: First ground conductor layer 18, 28: Planar ground conductor layers 20: First radiation conductor layer 21: Second radiation conductor layer 24a, 24b, 26a, 26b: External electrode 30, 32: First signal conductor layer 34, 36: Second signal conductor layer 50a: 1st matching circuit 50b: 2nd matching circuit 120: Third radiation conductor layer 121: Fourth radiation conductor layer A1:First area A2:Second area P1: First feeding point P2: Second feed point P3: Third power supply point P4: 4th feeding point v1 to v8, v11 to v14: Interlayer connection conductors

Claims

1. a laminate having a structure in which one or more first insulator layers and one or more second insulator layers are stacked in the Z-axis direction, wherein the dielectric constant of the one or more second insulator layers is lower than the dielectric constant of the one or more first insulator layers; a first radiating conductor layer provided on the laminate so as to be in contact with the first insulator layer; a second radiating conductor layer provided on the laminate so as to be in contact with the second insulator layer, located in a positive direction of the Z axis from the first radiating conductor layer, and overlapping with the first radiating conductor layer as viewed in the Z axis direction, wherein a frequency of an electromagnetic wave radiated or received by the second radiating conductor layer is higher than a frequency of an electromagnetic wave radiated or received by the first radiating conductor layer, or an area of ​​the second radiating conductor layer is smaller than an area of ​​the first radiating conductor layer; a first planar ground conductor layer located in the negative direction of the Z-axis from the first radiating conductor layer and overlapping the first radiating conductor layer and the second radiating conductor layer when viewed in the Z-axis direction; a first ground conductor layer that does not overlap the first radiating conductor layer and the second radiating conductor layer when viewed in the Z-axis direction and is located in a positive direction of the Z-axis relative to the first radiating conductor layer; Equipped with the first radiating conductor layer is in contact with the first insulator layer located in the positive direction of the Z axis from the first radiating conductor layer; Multilayer board.

2. The direction perpendicular to the Z-axis direction is defined as the X-axis direction, A direction perpendicular to the X-axis direction and the Z-axis direction is defined as a Y-axis direction, When viewed in the Z-axis direction, the first ground conductor layer is located in the positive direction of the X-axis, the negative direction of the X-axis, and the positive direction of the Y-axis and the negative direction of the Y-axis of the first radiation conductor layer and the second radiation conductor layer, the first radiating conductor layer and the second radiating conductor layer have a diamond shape with diagonals extending in the X-axis direction and the Y-axis direction when viewed in the Z-axis direction, portions of the first ground conductor layer that are located in the positive direction of the X-axis and the negative direction of the X-axis of the first radiating conductor layer and the second radiating conductor layer extend in the Y-axis direction; the first radiating conductor layer and the second radiating conductor layer have portions of the first ground conductor layer that are located in the positive direction of the Y axis and the negative direction of the Y axis, respectively, extending in the X axis direction; The multilayer substrate according to claim 1 .

3. the laminate has a structure in which the one or more second insulator layers, the one or more first insulator layers, and the one or more third insulator layers are arranged in this order in the negative direction of the Z axis, the dielectric constant of the one or more third insulator layers is lower than the dielectric constant of the one or more first insulator layers; The multilayer substrate comprises: a first matching circuit electrically connected to the first radiation conductor layer; a second matching circuit electrically connected to the second radiation conductor layer; It further includes at least one of the first matching circuit and the second matching circuit is in contact with the one or more third insulator layers; The multilayer substrate according to claim 1 or 2.

4. the laminate has a structure in which the one or more second insulator layers, the one or more first insulator layers, and the one or more third insulator layers are arranged in this order in the negative direction of the Z axis, the dielectric constant of the one or more third insulator layers is lower than the dielectric constant of the one or more first insulator layers; the laminate has, as viewed in the Z-axis direction, a first region in which the one or more first insulator layers, the one or more second insulator layers, and the one or more third insulator layers are present, and a second region in which the one or more first insulator layers and the one or more second insulator layers are not present and the one or more third insulator layers are present, The multilayer substrate comprises: a first signal conductor layer electrically connected to the first radiation conductor layer; a second signal conductor layer electrically connected to the second radiation conductor layer; It further includes At least one of the first signal conductor layer and the second signal conductor layer is in contact with the one or more third insulator layers and extends from the first region to the second region. The multilayer substrate according to claim 1 or 2.

5. The multilayer substrate comprises: a third radiating conductor layer provided on the laminate so as to be in contact with the first insulator layer; a fourth radiating conductor layer that is provided on the laminate so as to be in contact with the second insulator layer, that is located in the positive direction of the Z axis from the third radiating conductor layer, and that overlaps with the third radiating conductor layer when viewed in the Z axis direction, wherein a frequency of an electromagnetic wave radiated or received by the fourth radiating conductor layer is higher than a frequency of an electromagnetic wave radiated or received by the third radiating conductor layer, or an area of ​​the fourth radiating conductor layer is smaller than an area of ​​the third radiating conductor layer; It further comprises: the first ground conductor layer has a ring shape surrounding the first radiating conductor layer, the second radiating conductor layer, the third radiating conductor layer, and the fourth radiating conductor layer when viewed in the Z-axis direction; The multilayer substrate according to claim 1 or 2.

6. the one or more second insulating layers are located in a negative direction of the Z axis relative to the second radiating conductor layer, the laminate further includes a protective layer located in the positive direction of the Z-axis from the one or more second insulator layers and covering the second radiating conductor layer; the dielectric constant of the protective layer is lower than the dielectric constant of the one or more second insulator layers; an area where the second radiating conductor layer is in contact with the protective layer is larger than an area where the second radiating conductor layer is in contact with the one or more second insulator layers; The multilayer substrate according to claim 1 or 2.

7. the one or more second insulating layers are located in a negative direction of the Z axis relative to the second radiating conductor layer, the laminate further includes a protective layer located in the positive direction of the Z-axis from the one or more second insulator layers and covering the second radiating conductor layer; the dielectric constant of the protective layer is higher than the dielectric constant of the one or more second insulator layers; an area where the second radiating conductor layer is in contact with the protective layer is smaller than an area where the second radiating conductor layer is in contact with the one or more second insulator layers; The multilayer substrate according to claim 1 or 2.

8. the first ground conductor layer has a ring shape surrounding the first radiation conductor layer and the second radiation conductor layer when viewed in the Z-axis direction; The multilayer substrate according to claim 1 or 2.

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