Apparatus for transporting a substrate, system for processing a substrate, and method for transporting a substrate

Abstract

To reduce a floor area of a substrate transfer chamber in transferring a substrate in the substrate transfer chamber.SOLUTION: An apparatus comprises: a substrate transfer chamber having a side wall part to which a substrate processing chamber is connected and on which an opening through which carrying-in / carrying-out of a substrate is performed with the substrate processing chamber is formed and a movement surface on which a first magnet is provided; a tabular substrate transfer module that is housed in the substrate transfer chamber, holds the substrate, comprises a second magnet, and is configured to be movable along the movement surface in a state of floating from the movement surface using magnetic force; an angle adjustment mechanism that is provided in the substrate transfer chamber and changes over the movement surface's angle between a first angle and a second angle closer to the vertical angle than the first angle; and a transfer passage that constitutes the substrate transfer chamber, is connected to the angle adjustment mechanism's movement surface changed over to the second angle, and has a movement surface at the second angle.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to an apparatus for transporting a substrate, a system for processing a substrate, and a method for processing a substrate. [Background technology]

[0002] For example, in an apparatus for processing semiconductor wafers (hereinafter also referred to as "wafers"), which are substrates, the wafers are transported between a carrier containing the wafers and a wafer processing chamber where the processing is carried out. Wafer transport mechanisms of various configurations are used to transport the wafers.

[0003] For example, Patent Document 1 describes a substrate carrier that uses magnetic levitation to transfer semiconductor substrates between processing chambers while floating above a plate. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Special Publication No. 2018-504784 Summary of the Invention [Problem to be solved by the invention]

[0005] The present disclosure provides a technique for reducing the floor area of ​​a substrate transfer chamber when transferring substrates using a magnetic levitation type substrate transfer module. [Means for solving the problem]

[0006] 1st The disclosed apparatus for transporting a substrate is an apparatus for transporting a substrate to a substrate processing chamber in which processing of the substrate is performed, a substrate transfer chamber having a sidewall portion formed with an opening to which the substrate processing chamber is connected and through which substrates are transferred between the substrate processing chamber and the sidewall portion, and a moving surface provided with a first magnet; a plate-shaped substrate transfer module that is accommodated in the substrate transfer chamber, holds the substrate, and includes a second magnet that is subjected to a magnetic force that is at least one of a repulsive force and an attractive force acting between the second magnet and the first magnet, and is configured to be movable along the moving surface while being suspended from the moving surface using the magnetic force; an angle adjustment mechanism provided in the substrate transfer chamber and configured to switch the angle of the moving surface between a first angle and a second angle closer to vertical than the first angle; a transfer passage that constitutes the substrate transfer chamber, is connected to the angle adjustment mechanism moving surface switched to the second angle, and has a moving surface at the second angle; 、 the substrate transfer chamber is configured to transfer a substrate into or out of a substrate processing chamber using a substrate transfer module that moves on a moving plane at the first angle; the angle adjustment mechanism is disposed in a region between the conveying passage and the opening . A substrate transport apparatus according to a second disclosure is an apparatus that transports a substrate to a substrate processing chamber in which processing of the substrate is performed, a substrate transfer chamber having a sidewall portion formed with an opening to which the substrate processing chamber is connected and through which substrates are transferred between the substrate processing chamber and the sidewall portion, and a moving surface provided with a first magnet; a plate-shaped substrate transfer module that is accommodated in the substrate transfer chamber, holds the substrate, and includes a second magnet that is subjected to a magnetic force that is at least one of a repulsive force and an attractive force acting between the second magnet and the first magnet, and is configured to be movable along the moving surface while being suspended from the moving surface using the magnetic force; an angle adjustment mechanism provided in the substrate transfer chamber and configured to switch the angle of the moving surface between a first angle and a second angle closer to vertical than the first angle; a transfer passage that constitutes the substrate transfer chamber, is connected to the angle adjustment mechanism moving surface that has been switched to the second angle, and has a moving surface at the second angle; two second angled moving surfaces are arranged in the conveying passage so as to face each other, the angle adjustment mechanism includes two moving surfaces connectable to the two moving surfaces of the conveying passage, respectively; Between the two movement surfaces, partition members are provided that partition spaces in which the substrate transfer modules move along each of the movement surfaces. [Effects of the Invention]

[0007] According to the present disclosure, when transporting substrates using a magnetic levitation type substrate transport module, the floor area of ​​the substrate transport chamber can be reduced. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a plan view of a wafer processing system according to a first embodiment. [Figure 2] 1 is a schematic diagram of a tile on which a moving surface is formed, and a transport module. [Figure 3] FIG. 2 is a vertical cross-sectional side view of the transfer module. [Figure 4] FIG. [Figure 5]1 is a vertical sectional front view showing a planar area where an angle adjustment mechanism according to a first embodiment is provided. FIG. [Figure 6] FIG. 2 is a vertical sectional front view showing a conveying passage according to the first embodiment. [Figure 7] 10A and 10B are first operational views showing an example of the operation of the transfer module. [Figure 8] 10 is a second operational view showing an example of the operation of the transfer module. FIG. [Figure 9] 10A and 10B are third operational views showing an example of the operation of the transfer module. [Figure 10] FIG. 10 is a fourth operational diagram showing an example of the operation of the transfer module. [Figure 11] FIG. 10 is a plan view of a wafer processing system according to a second embodiment. [Figure 12] 10A and 10B are first operational views showing an example of operation of the transfer module according to the second embodiment; [Figure 13] FIG. 10 is a second operational view showing an example of the operation of the transfer module according to the second embodiment. [Figure 14] FIG. 10 is a plan view of a wafer processing system according to a third embodiment. [Figure 15] FIG. 11 is a vertical sectional front view showing an area where the angle adjustment mechanism according to the third embodiment is provided. [Figure 16] FIG. 10 is a vertical sectional front view showing a conveying passage according to a third embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0009] [First embodiment] The overall configuration of a wafer processing system 100 equipped with a substrate transfer device according to the first embodiment will be described below with reference to FIG. 1 shows a multi-chamber type wafer processing system 100 equipped with a plurality of wafer processing chambers 110, which are substrate processing chambers in which wafers W are processed. As shown in Fig. 1, the wafer processing system 100 is equipped with a load port 141, an atmospheric transfer chamber 140, a load lock chamber 130, a vacuum transfer chamber 120, and a plurality of wafer processing chambers 110. In the following description, the side on which the load port 141 is provided is referred to as the front side.

[0010] In the wafer processing system 100, a load port 141, an atmospheric transfer chamber 140, and a load lock chamber 130 are arranged in this order horizontally from the front side. A vacuum transfer chamber 120 is connected to the rear side of the load lock chamber 130 for transferring a wafer W to the wafer processing chamber 110 under a vacuum atmosphere.

[0011] The load port 141 is configured as a mounting table on which carriers C, which accommodate wafers W to be processed, are placed, and three carriers are installed side by side in the left-right direction when viewed from the front side. As the carriers C, for example, a FOUP (Front Opening Unified Pod) or the like can be used.

[0012] The atmospheric transfer chamber 140 has an atmospheric pressure (normal pressure) atmosphere, and for example, a downflow of clean air is formed. A wafer transfer mechanism 142 for transferring wafers W is provided inside the atmospheric transfer chamber 140. The wafer transfer mechanism 142 in the atmospheric transfer chamber 140 transfers wafers W between the carrier C and the load lock chamber 130.

[0013] Two load lock chambers 130 are installed side by side between the vacuum transfer chamber 120 and the atmospheric transfer chamber 140. A wafer W to be loaded or unloaded is temporarily placed inside the load lock chamber 130. The load lock chamber 130 has lift pins 131 that push up the loaded wafer W from below and hold it in place. Three lift pins 131 are provided at equal intervals around the periphery and are configured to be able to move up and down freely. The load lock chamber 130 is configured to be able to switch between an atmospheric pressure atmosphere and a vacuum atmosphere. The load lock chambers 130 and the atmospheric transfer chamber 140 are connected via a gate valve 133.

[0014] A vacuum transfer chamber 120 is connected to the rear side of the load lock chamber 130 via a gate valve 132. A plurality of wafer processing chambers 110 are also connected to the vacuum transfer chamber 120. A wafer W to be processed is transferred between the load lock chamber 130 and the wafer processing chamber 110 via this vacuum transfer chamber 120. At this time, the wafer W is transferred while being placed on a transfer module (substrate transfer module) 20, which will be described later.

[0015] In this example, the vacuum transfer chamber 120 is provided so as to extend rearward from the load lock chamber 130. The wafer processing chambers 110 are connected to the left and right of the vacuum transfer chamber 120 so as to face each other with the vacuum transfer chamber 120 in between. In this example, two sets of wafer processing chambers 110 facing each other are provided, one at the front and one at the back, for a total of four. The vacuum transfer chambers 120 are depressurized to a vacuum atmosphere by a vacuum exhaust mechanism (not shown). The vacuum transfer chamber 120 corresponds to the substrate transfer chamber in this embodiment.

[0016] Before describing the vacuum transfer chamber 120, we will explain the transfer module 20 that transfers the wafer W within the vacuum transfer chamber 120. As shown in Figures 2 and 3, the transfer module 20 includes a stage 2 on which the wafer W is placed and held. For example, the stage 2 is formed in the shape of a flat disk, and its upper surface has a diameter larger than that of the wafer W, forming a mounting surface on which the wafer W to be transferred is placed.

[0017] As will be described in detail later, the transfer module 20 is configured to be able to hold and move the wafer W in an orientation in which the mounting surface is arranged along the vertical direction. For convenience of expression, the above orientation is also referred to as the "standing orientation." For this reason, two protrusions 22 are provided on the upper surface of the stage 2 to support the wafer W from below and prevent the wafer W from falling when the transfer module 20 is in the standing orientation. Note that instead of supporting the wafer W with the protrusions 22, an electrostatic chuck or a mechanical chuck may be provided on the stage 2 to support the wafer W. Furthermore, as shown in FIG. 1, the transfer module 20 has three slits 21 extending from the periphery of the stage 2 toward the inside of the stage 2 to avoid interference with the lift pins 131 provided in the load lock chamber 130.

[0018] As shown in FIG. 3, a vacuum transfer chamber 120 (described later) is provided with a plurality of tiles 10a, each having a moving surface 10 for moving a transfer module 20 by magnetic levitation. In this example, similar tiles 10a are also provided on the bottom surface of a load lock chamber 130. Each tile 10a has a plurality of moving surface side coils 15 arranged below the moving surface 10. The moving surface side coils 15 generate a magnetic field when power is supplied from a power supply unit (not shown). From this perspective, the moving surface side coils 15 correspond to the first magnet in this embodiment. In order to avoid complicating the drawings, the reference numerals are omitted in the drawings other than FIGS. 2 and 3, but the moving surface 10 shown in each drawing is formed by the tiles 10a described above.

[0019] Meanwhile, multiple permanent magnets 35 are arranged inside the transfer module 20. A repulsive force or an attractive force acts on each permanent magnet 35 relative to the magnetic field generated by the moving surface side coil 15, depending on the orientation of its magnetic poles. The action of the magnetic force, which is at least one of the repulsive force and the attractive force, can cause the transfer module 20 to be magnetically levitated relative to the moving surface 10. Furthermore, by adjusting the strength and position of the magnetic field generated by the moving surface side coil 15, it is possible to move the transfer module 20 in a desired direction on the moving surface 10, adjust the amount of levitation, and adjust the orientation of the transfer module 20.

[0020] The permanent magnet 35 provided in the transport module 20 corresponds to the second magnet in this embodiment. Note that instead of the permanent magnet in the transport module 20, the second magnet may be configured using a coil that is supplied with power from a battery and functions as an electromagnet. For convenience, the gap between the moving surface 10 and the transport module 20 formed by magnetic levitation is shown only in FIG. 3, and is omitted from the other drawings.

[0021] Next, the vacuum transfer chamber 120 will be described. The vacuum transfer chamber 120 comprises a flat area 121 and a transfer passage 122. The flat area 120 is provided on its bottom side with a horizontal movement surface 10 along which the transfer module 20 is moved in a flat position. The transfer passage 122 also comprises a vertical movement surface 10 along which the transfer module 20 is moved in an upright position.

[0022] In this example, in an area connected to two load lock chambers 130 provided on the front side of the vacuum transfer chamber 120, flat areas 121 are arranged so as to face these two load lock chambers 130. In addition, flat areas 121 are also arranged in two areas sandwiched between the left and right wafer processing chambers 110 when viewed from the front side. Therefore, as shown in Fig. 1, the flat areas 121 are arranged in three places lined up in the front-to-rear direction.

[0023] Furthermore, adjacent flat areas 121 in the front-rear direction are connected by a transport path 122. When viewed from the front, the transport path 122 is connected to the flat areas 121 at approximately the center in the left-right direction. The left and right side surfaces of the transport path 122 are vertical, and a moving surface 10 for moving the transport module 20 is formed on the left side of the left and right side surfaces. The transport path 122 has a smaller width in the left-right direction than the flat areas 121, and also has a smaller floor area.

[0024] The vacuum transfer chamber 120 is provided with an angle adjustment mechanism 3 that switches the angle of the moving surface 10 of the transfer module 20. The angle adjustment mechanism 3 switches the angle of the moving surface 10, thereby switching the posture of the transfer module 20 that moves along the moving surface 10 between flat placement and upright placement.

[0025] 1, 4, and 5, the angle adjustment mechanism 3 is provided in the area on the left hand side of the flat area 121 when viewed from the front. The angle adjustment mechanism 3 is equipped with a stage 30, one surface of which is a moving surface 10. The stage 30 is configured as a square plate that is slightly larger than the transfer module 20. In addition, a rotation axis 31 is provided at the center of the flat area 121 when viewed from the front, at the right end of the stage 30, and is arranged to extend in the front-to-rear direction.

[0026] The stage 30 is configured to rotate around the rotation axis 31. By rotating the stage 30, the angle of the moving surface 10 can be switched between a first angle where the moving surface 10 is horizontal and a second angle where the moving surface 10 is vertical. The position of the rotation axis 31 is set to be aligned with the position of the transport path 122, and when the stage 30 is turned vertical, the moving surface 10 of the stage 30 and the moving surface 10 of the transport path 122 are connected.

[0027] According to the angle adjustment mechanism 3 configured as described above, when the stage 30 is set at the first angle, the moving surface 10 of the stage 30 is connected to other moving surfaces 10 within the planar area 121. This allows the transfer module 20 to move freely over the entire surface within the planar area 121.

[0028] Furthermore, as described above, when the stage 30 is at the second angle, the moving surface 10 of the stage 30 is connected to the moving surface 10 of the transfer path 122 shown in Fig. 6. This allows the transfer module 20 to move freely between the stage 30 and the transfer path 122. In other words, it can be said that the transfer path 122 has a moving surface 10 at the second angle.

[0029] Each wafer processing chamber 110 is connected to the sidewall of the vacuum transfer chamber 120 (flat area 121) through an opening in which a gate valve 111 is provided. The gate valve 111 is configured to open by moving upward from a closed state, for example, and a lip seal provided on the underside of the gate seals the interior of the wafer processing chamber 110. By using gate valves 111 configured in this way, unevenness between the moving surfaces 10 can be reduced, and this can prevent impediments to the entry and exit of the transfer module 20 between the wafer processing chamber 110.

[0030] Each wafer processing chamber 110 is depressurized to a vacuum atmosphere by a vacuum exhaust mechanism (not shown), and a predetermined process is performed on a wafer W placed on a mounting table 112 provided therein. Examples of processes performed on the wafer W include etching, film formation, cleaning, and ashing. The mounting table 112 is provided with, for example, a heater (not shown) that heats the wafer W to a predetermined temperature. If the process performed on the wafer W uses a process gas, the wafer processing chamber 110 is provided with a process gas supply unit (not shown) configured, for example, by a shower head. The wafer processing chamber 110 corresponds to the substrate processing chamber of this embodiment.

[0031] The wafer processing chamber 110 is also provided with a wafer W transfer mechanism (not shown) that transfers the wafer W between it and the transfer module 20 in the vacuum transfer chamber 120. An example of the transfer mechanism is lift pins that protrude and retract through the above-mentioned slits 21 provided in the transfer module 20 and push up the wafer W placed on the transfer module 20 from below to lift and lower it. The lift pins can then be lowered to transfer the wafer W to a mounting table 112 provided in the wafer processing chamber 110.

[0032] 1, the wafer processing system 100 having the above-described configuration includes a control unit 9 that controls the moving surface side coils 15, the wafer processing chamber 110, etc. The control unit 9 is configured by a computer having a CPU and a storage unit, and controls the various units of the wafer processing system 100. The storage unit stores a program that includes a group of steps (commands) for controlling the operation of the transfer module 20 and the wafer processing chamber 110. This program is stored on a storage medium such as a hard disk, compact disc, magnetic optical disc, or memory card, and is installed from there into the computer.

[0033] Next, we will explain an example of the operation of the wafer processing system 100. First, a carrier C containing wafers W to be processed is placed on the load port 141, and the wafer W is then removed from the carrier C by the wafer transfer mechanism 142 in the atmospheric transfer chamber 140.

[0034] Next, the gate valve 133 is opened, and when the wafer transfer mechanism 142 enters the load lock chamber 130, the lift pins 131 push up and receive the wafer W. In this example, the first wafer W is loaded into the load lock chamber 130 on the right side as viewed from the front. Thereafter, when the wafer transfer mechanism 142 retreats from the load lock chamber 130, the gate valve 133 is closed. Furthermore, the atmosphere inside the load lock chamber 130 is switched from atmospheric pressure to a vacuum atmosphere. Next, using the same procedure, the second wafer W is transferred to the load lock chamber 130 on the left side as viewed from the front.

[0035] Once the load lock chamber 130 is in a vacuum atmosphere, the gate valve 132 is opened. At this time, the transfer module 20 is waiting in the vacuum transfer chamber 120, facing the load lock chamber 130. Then, using the magnetic field generated by the moving surface side coil 15 provided on the tile 10a, the transfer module 20 is raised by magnetic levitation using a repulsive force.

[0036] Next, we will explain the transfer of the wafer W from the load lock chamber 130 to each wafer processing chamber 110. Before starting the transfer of the wafer W, the stage 30 of each angle adjustment mechanism 3 sets the moving surface 10 to a horizontal state (first angle).

[0037] First, the transfer module 20 is advanced into the load lock chamber 130 and positioned below the wafer W supported by the lift pins 131. The lift pins 131 are then lowered to transfer the wafer W to the transfer module 20, whereby the wafer W is placed on the stage 2.

[0038] Next, as shown in Fig. 7, the transfer module 20 holding the wafer W is withdrawn from the load lock chamber 130 and moved to the left within the flat area 121 as viewed from the front. As described above, when the moving surface 10 of the stage 30 is made horizontal, the moving surface 10 of the stage 30 is connected to other moving surfaces 10 within the flat area 121. Therefore, as shown in Fig. 7, the transfer module 20 can move along the moving surface 10 of the stage 30. At this time, the transfer module 20 stops with the protrusion 22 facing the rotation axis 31 as shown in Fig. 4.

[0039] Next, the angle of the stage 30 is adjusted by the angle adjustment mechanism 3, and the moving plane 10 is switched to the vertical (second angle). At this time, as shown in FIG. 8, the angle of the stage 30 of the other angle adjustment mechanism 3 provided on the wafer processing chamber 110 side is also adjusted, and the moving plane 10 is switched to the vertical. As a result, the moving surface 10 of the stage 30 on the wafer processing chamber 110 side is also connected to the moving surface 10 of the transfer path 122 .

[0040] At this time, the transfer module 20 is in an upright position, and a protrusion 22 is provided on the side of the rotation axis 31 as viewed from the wafer W. This protrusion 22 is located below the wafer W in the upright position, preventing the wafer W from falling. In addition, the position of the wafer W is restricted by the protrusion 22, which also has the effect of alignment. Then, the transfer module 20 of the stage 30 passes through the moving surface 10 of the transfer passage 122 and moves to, for example, the moving surface 10 of the stage 30 of the angle adjustment mechanism 3 provided in the next flat area 121 (FIG. 9).

[0041] Next, the movement surface 10 of the stage 30 on which the transfer module 20 is located is switched to horizontal. As a result, the transfer module 20 assumes a horizontal position as shown in FIG. 10 , and the movement surface 10 of the stage 30 is connected to another movement surface 10 in the flat area 121. In other words, the angle adjustment mechanism 3 provided in the flat area 121 on the wafer processing chamber 110 side switches the movement surface 10 of the transfer module 20 that has moved through the transfer path 122 from the second angle to the first angle. Then, for example, the gate valve 111 of the wafer processing chamber 110, which is the transfer destination, is opened, and the wafer W held by the transfer module 20 is loaded into the wafer processing chamber.

[0042] Once the wafers W have been loaded into each wafer processing chamber 110 through the above-described operations, the transfer module 20 is withdrawn and the gate valve 111 is closed. Next, the wafers W are heated by the mounting tables 112 in sequence until they reach a preset temperature, and processing gas is supplied from the processing gas supply unit into the wafer processing chamber 110. In this manner, the desired processing is performed on the wafers W.

[0043] After the wafer W has been processed for the preset period, the heating of the wafer W is stopped and the supply of the processing gas is stopped. Thereafter, the wafer W is transferred in the reverse order to the procedure of loading, and is returned from the wafer processing chamber 110 to the load lock chamber 130. Furthermore, after the atmosphere in the load lock chamber 130 is switched to a normal pressure atmosphere, the wafer W in the load lock chamber 130 is removed by the wafer transfer mechanism 142 on the atmospheric transfer chamber 140 side and returned to a predetermined carrier C.

[0044] To summarize the above operations, when the transfer module 20 carrying the wafer W exits the load lock chamber 130, the angle adjustment mechanism 3 moves the moving surface 10 to change its orientation from flat to upright. The transfer module 20 then moves in the upright orientation through the transfer passage 122 to the flat area 121 on the wafer processing chamber 110 side. Thereafter, the angle adjustment mechanism 3 provided in the flat area 121 changes the orientation of the transfer module 20 to flat. The transfer module 20 then moves in the flat orientation on the moving surface 10 at the first angle, enters the wafer processing chamber 110, and hands over the wafer W.

[0045] In this way, by moving the transfer module 20 along the vertical moving surface 10, the wafer W can be transferred using the transfer passage 122 with a small floor area. This reduces the overall floor area of ​​the vacuum transfer chamber 120, and prevents the device from becoming larger.

[0046] Furthermore, the wafer processing system 100 is also provided with a pump for creating a vacuum inside the wafer processing chamber 110, a tank for a processing liquid used to process the wafer W, and the like. For example, if such a pump, tank, and the like were to be installed above the wafer processing chamber 110, the wafer processing system 100 may become tall. On the other hand, in the wafer processing system 100 according to the present disclosure, the pump, tank, and the like can be arranged in an area to the side of the transfer path 122, thereby preventing the wafer processing system 100 from becoming tall.

[0047] In some cases, the temperature of the wafer W placed on the mounting table 112 is controlled by a temperature control mechanism such as a chiller, but in terms of thermal efficiency, it is preferable to locate the temperature control mechanism as close as possible to the location where heat treatment is performed. The wafer processing system 100 according to the present disclosure provides more options for the layout of installation of ancillary equipment, such as using the side of the transfer path 122 to provide the temperature control mechanism near the location where heat treatment is performed, and a layout suitable for the process to be used can be selected.

[0048] Furthermore, the angle (second angle) of the moving surface 10 of the transfer path 122 is not limited to being vertical, but may be, for example, 45° or more and 90° or less. By making the side surface of the transfer path 122 into an inclined moving surface 10 in this way, it is possible to reduce the floor area of ​​the vacuum transfer chamber 120. Furthermore, the angle adjustment mechanism 3 may be provided inside the load lock chamber 130.

[0049] Furthermore, the number and layout of the wafer processing chambers 110 arranged in the vacuum transfer chamber 120 are not limited to the example shown in Fig. 1. The number of wafer processing chambers 110 arranged may be increased or decreased as needed. For example, the case where only one wafer processing chamber 110 is provided in the vacuum transfer chamber 120 is also within the technical scope of the present disclosure.

[0050] Furthermore, the arrangement of the vacuum transfer chamber 120 is not limited to the case where the long side of the vacuum transfer chamber 120 is oriented in the front-to-rear direction as shown in Fig. 1. For example, the vacuum transfer chamber 120 may be arranged so that the long side is oriented in the left-to-right direction when viewed from the load port 141 side. Furthermore, the planar shape of the vacuum transfer chamber 120 may be of various shapes depending on the shape of the area in which the wafer processing system 100 is disposed. For example, the transfer passage 122 may be arranged so as to form each side of an approximately square, a polygon with five or more sides, a circle, or an ellipse.

[0051] In addition, the substrate transfer chamber in which the wafer W is transferred to the wafer processing chamber 110 using the transfer module 20 is not limited to being configured as the vacuum transfer chamber 120 whose interior is a vacuum atmosphere. The apparatus of the present disclosure can also be applied to a wafer processing system configured such that the wafer processing chamber 110 is provided to the side of a substrate transfer chamber whose interior is an atmospheric pressure atmosphere. In this case, it is not essential to provide the load lock chamber 130 to the wafer processing system, and the wafer W removed from the carrier C to the atmospheric transfer chamber 140 may be directly loaded into the substrate transfer chamber.

[0052] [Second embodiment] The wafer processing system may be configured such that the transfer module 20 moves along the moving plane 10 while remaining in an upright position and enters the wafer processing chamber 113. For example, Figure 11 shows a wafer processing system 101 in which the transfer module 20 moves along the vertical moving plane 10 into the wafer processing chamber 113. 1 in that a flat area 121 is provided only on the front side of the wafer processing system 101, which is disposed so as to face the load lock chamber 130. The transfer module 20 is placed upright in this flat area 121, and is moved along the vertical transfer surface 10 via a transfer passage 122 to enter the wafer processing chamber 113.

[0053] In this example, a turntable 123 that switches the movement direction of the transport module 20 is provided at the rear side of the transport path 122. Another transport path 122 is provided at the rear side of this turntable 123, and another turntable 123 is provided at the end of the rear transport path 122. Each turntable 123 is configured to rotate around a vertical axis, and a vertical surface 124 is provided on the turntable 123, the vertical surface 124 having a movement surface 10 that is connected to the movement surface 10 of each transport path 122.

[0054] The wafer processing chamber 113 is connected to the left and right of each turntable 123 via passages 125 each having a moving surface 10 that connects with the moving surface 10 of the vertical surface 124 when the turntable 123 is rotated 90° counterclockwise as viewed from above. Note that reference numeral 111 in Fig. 11 denotes a gate valve.

[0055] The wafer processing chamber 113 has, for example, a vertical moving surface 10 connected to the moving surface 10 of the passage 125. The wafer processing chamber 113 in this example is provided with an ion implantation unit 114 that performs ion implantation by horizontally irradiating ions toward a wafer W supported by a transfer module 20 that has entered the wafer processing chamber 113. This wafer processing chamber 113 is configured to irradiate ions toward a wafer W supported by the transfer module 20.

[0056] A support part for supporting the transfer module 20 from below may be provided on the moving surface 10 of the wafer processing chamber 113 in order to align the transfer module 20. The wafer processing chamber 113 may also be provided with a transfer mechanism for transferring the wafer from the transfer module 20 that has moved along the vertical moving surface 10 to a wafer holder on the wafer processing chamber 113 side.

[0057] In the above-described wafer processing system 101, as in the first embodiment, the transfer module 20 holding the wafer W is entered from the load lock chamber 130 into the vacuum transfer chamber 120 and moved above the stage 30. Then, after the movement plane 10 is switched to vertical, the transfer module 20 is moved, for example, to the front turntable 123 (FIG. 12). Next, as shown in FIG. 13, the turntable 123 is rotated counterclockwise by 90°. Furthermore, the gate valve 111 of the destination wafer processing chamber 113 is opened, and the transfer module 20, which is in an upright position, is moved along the movement plane 10 at the second angle and entered the left wafer processing chamber 113. Next, the gate valve 111 is closed, and the wafer W is processed. In the above-described wafer processing system 101, the wafer W can be transferred via the transfer paths 122 and 125 which have small floor areas, and the floor area of ​​the vacuum transfer chamber 120 can be reduced, so that the same effect can be obtained.

[0058] [Third embodiment] Alternatively, both side surfaces of the transfer path 122 may be configured as movement surfaces 10 for the transfer modules 20, allowing two transfer modules 20 to pass through the transfer path 122. Figures 14 to 16 show an example of such a wafer processing system 102. In this example, both left and right side surfaces of the transfer path 122 are configured as vertical movement surfaces 10 (Figure 14).

[0059] In addition to the angle adjustment mechanisms 3 shown in the first embodiment, an angle adjustment mechanism 3 is also provided in the area on the right side of the flat area 121 when viewed from the front. These angle adjustment mechanisms 3 are configured symmetrically when viewed from the front (FIG. 15). There is a gap between the left and right angle adjustment mechanisms 3, but this gap is small enough not to interfere with the movement of the transport module 20 between the left and right angle adjustment mechanisms 3. Furthermore, a horizontal moving surface 10 may be provided to fill this gap.

[0060] According to the above-described configuration, when the moving surfaces 10 of the left and right stages 30 are horizontal, the moving surfaces 10 within the planar area 121 are connected to each other. Furthermore, when the moving surface 10 of the right stage 30 is vertical, the moving surface 10 is connected to the moving surface 10 on the right side of the transport path 122. On the other hand, when the moving surface 10 of the left stage 30 is vertical, the moving surface 10 is connected to the moving surface 10 on the left side of the transport path 122.

[0061] The transfer path 122 is formed to have a width that allows two transfer modules 20 holding wafers W to pass each other (FIG. 16). Therefore, the two opposing moving surfaces 10 are arranged with a gap therebetween that allows the transfer modules 20 to pass each other. In addition, a partition member 126 made of a dielectric material is provided at the center of the transfer path 122 in the left-right direction, dividing the space within the transfer path 122, through which the transfer modules 20 holding wafers W move, into left and right sections.

[0062] This configuration allows the transport modules 20 to pass each other on the transport path 122 while preventing the transport path 122 from becoming wider. Therefore, multiple transport modules 20 can pass through each transport path 122 at the same time, improving the throughput of the device. Furthermore, by installing a dielectric partition member 126 to divide the transport passage 122 into left and right halves, it is possible to prevent the magnetic forces of the transport modules 20 from interfering with each other when the two transport modules 20 pass each other.

[0063] Alternatively, unlike the example described using Figures 14 to 16, a wafer processing system may be configured in which a moving surface 10 is formed on each side of a common vertical wall, and two transport paths 122 are provided to move the transport modules 20 along each moving surface 10.

[0064] The embodiments disclosed herein should be considered to be illustrative in all respects and not restrictive, and the above-described embodiments may be omitted, substituted, or modified in various ways without departing from the scope and spirit of the appended claims. [Explanation of symbols]

[0065] 3 Angle adjustment mechanism 10 Moving Surface 15 Moving surface side coil 20 Transfer module 35 Permanent Magnets 110 Wafer processing chamber 120 Vacuum Transfer Chamber 122 Transport aisle W wafer

Claims

1. An apparatus for transporting a substrate to a substrate processing chamber in which processing of the substrate is performed, a substrate transfer chamber having a sidewall portion formed with an opening to which the substrate processing chamber is connected and through which substrates are transferred between the substrate processing chamber and the sidewall portion, and a moving surface provided with a first magnet; a plate-shaped substrate transport module that is accommodated in the substrate transport chamber, holds the substrate, and includes a second magnet that is subjected to a magnetic force that is at least one of a repulsive force and an attractive force acting between the second magnet and the first magnet, and is configured to be movable along the moving surface while being suspended from the moving surface using the magnetic force; an angle adjustment mechanism provided in the substrate transfer chamber and configured to switch the angle of the movement plane between a first angle and a second angle that is closer to vertical than the first angle; a transfer passage that constitutes the substrate transfer chamber, is connected to the angle adjustment mechanism movement surface that has been switched to the second angle, and has a movement surface at the second angle; the substrate transfer chamber is configured to transfer a substrate into or out of a substrate processing chamber using a substrate transfer module that moves along a movement plane at the first angle; An apparatus comprising the angle adjustment mechanism disposed in a region between the conveying passage and the opening.

2. An apparatus for transporting a substrate to a substrate processing chamber in which processing of the substrate is performed, a substrate transfer chamber having a sidewall portion formed with an opening to which the substrate processing chamber is connected and through which substrates are transferred between the substrate processing chamber and the sidewall portion, and a moving surface provided with a first magnet; a plate-shaped substrate transport module that is accommodated in the substrate transport chamber, holds the substrate, and includes a second magnet that is subjected to a magnetic force that is at least one of a repulsive force and an attractive force acting between the second magnet and the first magnet, and is configured to be movable along the moving surface while being suspended from the moving surface using the magnetic force; an angle adjustment mechanism provided in the substrate transfer chamber and configured to switch the angle of the movement plane between a first angle and a second angle that is closer to vertical than the first angle; a transfer passage that constitutes the substrate transfer chamber, is connected to the angle adjustment mechanism movement surface that has been switched to the second angle, and has a movement surface at the second angle; two moving surfaces of the second angle are arranged in the conveying passage so as to face each other, the angle adjustment mechanism includes two moving surfaces connectable to the two moving surfaces of the conveying passage, respectively; The apparatus further comprises a partition member provided between the two movement surfaces to partition a space in which the substrate transfer module moves along each of the movement surfaces.

3. 3. The apparatus according to claim 1, wherein the first angle is horizontal and the second angle is an angle inclined relative to the horizontal in the range of 45 to 90 degrees.

4. 3. The apparatus according to claim 2, wherein the substrate transfer chamber is configured to transfer substrates into and out of the substrate processing chamber using a substrate transfer module that moves along the second angled movement plane.

5. the substrate transfer chamber is configured to transfer the substrate under a vacuum atmosphere; a load lock chamber, the internal pressure of which can be switched between atmospheric pressure and vacuum, and in which substrates are temporarily placed for being transferred between the substrate transfer chamber and the load lock chamber, is connected to a position on the side wall of the substrate transfer chamber different from a position where an opening for connecting the substrate processing chamber is formed; 5. The apparatus according to claim 1, wherein the substrate transport chamber is configured to transfer the substrate between the load lock chamber and the substrate transport chamber using the substrate transport module that moves on the movement plane at the first angle, and the angle adjustment mechanism is disposed in a region between the load lock chamber and the transport passage.

6. two moving surfaces of the second angle are arranged in the conveying passage so as to face each other, 2. The apparatus of claim 1, wherein the angle adjustment mechanism comprises two moving surfaces respectively connectable to the two moving surfaces of the conveying path.

7. The apparatus according to claim 6 , wherein the two movement surfaces of the transfer passage are arranged with a gap therebetween that allows the substrate transfer modules moving along each of the movement surfaces to pass each other.

8. a substrate transport device according to any one of claims 1 to 7; a plurality of substrate processing chambers connected to the substrate transfer chamber via the opening;

9. 1. A method for transporting a substrate to a substrate processing chamber in which processing of the substrate is performed, comprising: a plate-like substrate transport module that is housed in a substrate transport chamber having a sidewall portion to which the substrate processing chamber is connected and which has an opening formed therein for loading and unloading substrates between the substrate processing chamber and the substrate processing chamber, and a moving surface on which a first magnet is provided, the plate-like substrate transport module having a second magnet that holds the substrate and is subjected to a magnetic force that is at least one of a repulsive force and an attractive force acting between the second magnet and the first magnet, and that is configured to be movable along the moving surface while being suspended from the moving surface by using the magnetic force; switching the angle of the plane of movement of the substrate transfer module holding the substrate between a first angle and a second angle closer to vertical than the first angle; and configuring the substrate transport chamber, connecting the moving surface switched to the second angle, and transporting the substrate by the substrate transport module through a transport passage having the moving surface at the second angle; A method in which, when the substrate transport chamber is configured to load and unload substrates relative to a substrate processing chamber using a substrate transport module that moves on a moving plane at the first angle, the switching process is performed in an area between the transport passage and the opening.

10. 1. A method for transporting a substrate to a substrate processing chamber in which processing of the substrate is performed, comprising: a plate-like substrate transport module that is housed in a substrate transport chamber having a sidewall portion to which the substrate processing chamber is connected and which has an opening formed therein for loading and unloading substrates between the substrate processing chamber and the substrate processing chamber, and a moving surface on which a first magnet is provided, the plate-like substrate transport module having a second magnet that holds the substrate and is subjected to a magnetic force that is at least one of a repulsive force and an attractive force acting between the second magnet and the first magnet, and that is configured to be movable along the moving surface while being suspended from the moving surface by using the magnetic force; switching the angle of the plane of movement of the substrate transfer module holding the substrate between a first angle and a second angle closer to vertical than the first angle; and transporting the substrate by the substrate transport module through the transport passage, which configures the substrate transport chamber and is connected to the movement surface switched to the second angle and has a movement surface at the second angle, two movement surfaces at the second angle arranged to face each other, and partition members are provided between the two movement surfaces to partition a space in which the substrate transport module moves along each of the movement surfaces, The method, wherein the step of switching the angle of the moving surface is performed for each of the two moving surfaces of the conveying path.

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