Frame assemblies, power modules and equipment

Abstract

The frame assembly includes a frame, a plurality of pins located within the frame, at least one substrate, at least one first connecting rod, and at least one second connecting rod. The frame includes a first frame edge, a second frame edge, and a third frame edge. The first frame edge is provided opposite the third frame edge, and the second frame edge is connected between the first frame edge and the third frame edge. One end of a portion of the plurality of pins is connected to the first frame edge, and one end of the other portion is connected to the third frame edge. The other end of at least one pin of the plurality of pins connected to the same frame edge is connected to the substrate. A first connecting rod is connected between two adjacent pins connected to the same frame edge, and a second connecting rod is connected between the plurality of pins connected to the same frame edge and the second frame edge. The first connecting rod and the second connecting rod corresponding to the plurality of pins connected to the same frame edge are provided to be offset along the extension direction of the second frame edge, and the second connecting rod is closer to the substrate corresponding to the plurality of pins connected to the same frame edge than the first connecting rod.

Description

[Technical Field]

[0001] (CROSS-REFERENCE TO RELATED APPLICATIONS) This application claims priority from Chinese patent application No. 202211442179.7 filed on November 17, 2022, Chinese patent application No. 202211442178.2 filed on November 17, 2022, and Chinese patent application No. 202211442180.X filed on November 17, 2022, the entire disclosures of which are incorporated herein by reference.

[0002] The present disclosure relates to the field of electronic devices, and in particular to frame assemblies, power modules and equipment. [Background technology]

[0003] Power modules (PMs) have features such as high current density, low saturation voltage, low drive power, high switching frequency, high functionality integration, ease of use, and excellent reliability, and are widely applicable to many fields, including electronic devices, home appliances, automobiles, railway transportation, industrial equipment, new energy sources, and smart grids.

[0004] Typically, in the power module manufacturing process, each chip is packaged in resin to achieve high integration. During this process, the power module product is also connected to the frame via connecting rods, and then a trim / form process is required. The blanking position of the cutting tool is determined through the frame positioning holes, and the product is trimmed and formed. Finally, the product is separated from the frame. Summary of the Invention [Means for solving the problem]

[0005] In one aspect, a frame assembly is provided, the frame assembly comprising: a frame; a plurality of pins positioned within the frame; at least one substrate; at least one first connecting rod; and at least one second connecting rod. The frame comprises a first frame edge, a second frame edge, and a third frame edge. The first frame edge is disposed opposite the third frame edge, and the second frame edge is connected between the first and third frame edges. One end of a portion of the plurality of pins is connected to the first frame edge, and one end of another portion of the plurality of pins is connected to the third frame edge. The other end of at least one pin of the plurality of pins connected to the same frame edge is connected to the substrate. A first connecting rod is connected between two adjacent pins of the plurality of pins connected to the same frame edge, and a second connecting rod is connected between the plurality of pins connected to the same frame edge and the second frame edge. The first connecting rod and the second connecting rod corresponding to the multiple pins connected to the same frame edge are arranged offset along the extension direction of the second frame edge, and along the extension direction of the second frame edge, the second connecting rod is closer to the substrate corresponding to the multiple pins connected to the same frame edge than the first connecting rod.

[0006] In another aspect, a power module is provided, the power module comprising: a packaging body; a plurality of chips located within the packaging body; a plurality of pins; and at least one first insulating member located outside the packaging body. The plurality of chips comprises at least one driver chip and at least one power chip. The at least one driver chip and the at least one power chip are spaced apart along the width direction of the packaging body. The plurality of pins include a plurality of control pins and a plurality of power pins extending from a first side surface and a second side surface of the packaging body, respectively, the first side surface and the second side surface both extending along the length direction of the packaging body and being disposed opposite each other. The plurality of control pins are spaced apart along the length direction of the packaging body and electrically connected to the at least one driver chip, and the plurality of power pins are spaced apart along the length direction of the packaging body and electrically connected to the at least one power chip. A first insulating member is connected between two adjacent control pins.

[0007] In another aspect, there is provided an installation comprising a controller and the power module provided by the above embodiment, wherein the power module is connected to the controller. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a cross-sectional view of a frame assembly according to the related art. [Figure 2] 1 is a top view of a frame assembly in the related art after the bent leg forming process is completed. FIG. [Figure 3] FIG. 10 is a side view of a frame assembly in the related art during a cutting process. [Figure 4] FIG. 1 is a cross-sectional view of a frame assembly according to some embodiments. [Figure 5] FIG. 10 is a top view of a frame assembly after completing a bent leg forming process according to some embodiments. [Figure 6] FIG. 6 illustrates a portion of the frame assembly shown in FIG. 5. [Figure 7] FIG. 5 illustrates a portion of the frame assembly shown in FIG. 4. [Figure 8] FIG. 1 is a top view of a power module according to some embodiments. [Figure 9] FIG. 9 is an enlarged view of a portion A of the power module shown in FIG. [Figure 10] FIG. 1 illustrates a frame assembly according to some embodiments. [Figure 11] 11 is an enlarged view of a portion B of the frame assembly shown in FIG. 10. FIG. [Figure 12] 1A and 1B are diagrams showing cross sections along the width direction of a power module according to some embodiments. [Figure 13] 1A and 1B are diagrams showing cross sections along the width direction of a power module according to some embodiments. [Figure 14] 1A and 1B are diagrams showing cross sections along the width direction of a power module according to some embodiments. [Figure 15] 1A and 1B are diagrams showing cross sections along the width direction of a power module according to some embodiments. [Figure 16] FIG. 2 is a partial enlarged view of a power module according to some embodiments. [Figure 17] 1 is a cross-sectional view of a power module according to some embodiments. [Figure 18] 18 is an enlarged view of a portion C of the power module shown in FIG. 17. FIG. [Figure 19] 18 is an enlarged view of a portion C of the power module shown in FIG. 17. FIG. [Figure 20] FIG. 1 illustrates the structure of an installation according to some embodiments. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, several embodiments of the present disclosure will be clearly and completely described with reference to the drawings. Of course, the embodiments described herein are only a part of the embodiments of the present disclosure, and are not all of the embodiments. All other embodiments that can be easily conceived by a person skilled in the art based on the embodiments in the present disclosure are considered to be within the scope of the present disclosure.

[0010] Unless the context indicates otherwise, in this specification and claims, the term "comprise" and other forms thereof, such as the third-person singular "comprises" and the present participle form "comprising," should be interpreted in an open, inclusive sense, i.e., "including, but not limited to." In the description, the terms "one embodiment," "some embodiments," "exemplary embodiments," "example," "specific example," "some examples," and the like, are intended to indicate that a particular feature, structure, material, or characteristic associated with this embodiment or examples is included in at least one embodiment or example of the present disclosure. General references to the above terms do not necessarily refer to the same embodiment or example. Furthermore, a described particular feature, structure, material, or characteristic may be included in any one or more embodiments or examples in any appropriate manner.

[0011] Hereinafter, the terms "first" and "second" are for descriptive purposes only and should not be understood as indicating or implying the relative importance or quantity of the indicated technical features. Accordingly, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. As used in this specification and the appended claims, the singular forms "a," "an," and "the" also include plural references unless expressly stated otherwise. In describing the embodiments of the present disclosure, "plurality" means two or more unless expressly stated otherwise.

[0012] In describing some embodiments, the term "connected" and its derivatives may be used. For example, in describing some embodiments, the term "connected" may be used to indicate that two or more elements are in direct physical or electrical contact with each other.

[0013] "At least one of A, B, and C" has the same meaning as "at least one of A, B, or C," and all include the following combinations of A, B, and C: A only, B only, C only, a combination of A and B, a combination of A and C, a combination of B and C, and a combination of A, B, and C.

[0014] "A and / or B" includes the three combinations of A only, B only, and A and B together.

[0015] As used herein, "about," "approximately," or "approximate" includes the stated value and the mean within an acceptable range of deviation from the specified value, where the acceptable range of deviation is determined by one of ordinary skill in the art considering the measurement and the error associated with measuring the specified quantity (i.e., limitations of the measurement system).

[0016] Exemplary embodiments are described herein with reference to cross-sectional and / or plan views that are idealized illustrative drawings. In the drawings, thicknesses of layers and regions are exaggerated for clarity. The exemplary embodiments of the present disclosure are not limited to the shapes of regions illustrated herein and should be construed to include deviations in shape due to manufacturing or otherwise. For example, an etching region shown as a rectangle typically has curved features. Thus, the regions shown in the drawings are exemplary in nature, and their shapes are not intended to represent the actual shape of the regions of the equipment and are not intended to limit the scope of the exemplary embodiments.

[0017] In the trimming and forming process for manufacturing power modules, the power module is attached to the frame, and the blanking position of the cutting tool is determined through the frame positioning holes on the frame, and finally the trimming and forming of the product is completed. After the links between the pins are cut and each pin is separated and formed, the product and the frame are connected by only a single link, and when the product is separated, the link here is blanked, completing the separation of the product and the frame edge.

[0018] 1 to 3, in a frame assembly 1000' of the related art, a first link 30' is connected between a power module 10' and an outer frame edge 20', and the first link 30' extends to the inside of the power module 10' but is not connected to any pin inside the power module 10'. In other words, the first link 30' can be considered a dead pin, and the dead pin only serves to connect the power module 10' and the outer frame edge 20'.

[0019] In the process of separating the power module 10' from the outer frame edge 20', the first link 30' is generally cut off to the maximum extent from the power module 10' to ensure the performance and process requirements of the power module 10'. In the process of cutting off the first link 30', it is necessary to blank off the first link 30' using a blanking knife 40'. During blanking, the blanking knife 40' may damage or crack the resin colloid around the first link 30' due to the blanking force.

[0020] In addition, in the frame assembly 1000' of the related art, the pins 70' are connected between the substrate 80' and the outer frame edge 20', and a second link 50' is provided between two adjacent pins 70'. A third link 60' is also provided between the outer frame edge 20' and the pins 70', and the second link 50' and the third link 60' are located on the same straight line. Typically, when separating the power module 10' from the outer frame edge 20', a bending leg forming process must also be performed. Because the second link 50' and the third link 60' are located on the same straight line, the third link 60' interferes with and affects the bending leg forming process of the pins, which affects product production.

[0021] Based on this, an embodiment of the present disclosure provides a frame assembly. As shown in Figures 4 and 5, the frame assembly 1000 includes a frame 10 and a power module 100. The power module 100 is located within the frame 10 and connected to the frame 10. The power module 100 includes a plurality of pins 20 and at least one substrate 30.

[0022] The frame 10 includes a first frame edge 101, a second frame edge 102, and a third frame edge 103. The second frame edge 102 is connected between the first frame edge 101 and the third frame edge 103. For example, the first frame edge 101 and the third frame edge 103 are disposed opposite each other, and the second frame edge 102 is connected to the ends of the first frame edge 101 and the third frame edge 103 that are located on the same side.

[0023] 4, among the multiple pins 20, one end of some of the pins 20 is connected to a first frame edge 101, and one end of the remaining pins 20 is connected to a third frame edge 103. The other end of at least one of the multiple pins 20 connected to the same frame edge is connected to one board 30. This allows the board 30 to be electrically connected to an external device via the pins 20 connected to it, ensuring the structural reliability of the board 30.

[0024] 4, the frame assembly 1000 further includes a first connecting rod 60 located within the frame 10. The first connecting rod 60 is connected between two adjacent pins 20 among the multiple pins 20 connected to the same frame edge.

[0025] For example, the first connecting rod 60 may be connected between two adjacent pins 20 among the multiple pins 20 connected to the first frame edge 101. Also, for example, the first connecting rod 60 may be connected between two adjacent pins 20 among the multiple pins 20 connected to the third frame edge 103.

[0026] For example, among multiple pins 20 connected to the same frame edge, one first connecting rod 60 may be connected between each two adjacent pins 20, and the multiple first connecting rods 60 may be positioned on the same straight line.

[0027] 4, the frame assembly 1000 further includes a second connecting rod 40 located within the frame 10. The second connecting rod 40 is connected between the pins 20 connected to the same frame edge and the second frame edge 102 of the frame 10. The second connecting rod 40 is used to fix the power module 100 to the frame 10 so that the power module 100 is stably connected to the frame assembly 1000.

[0028] For example, one second connecting rod 40 may be connected between the multiple pins 20 connected to the first frame edge 101 and the second frame edge 102 of the frame 10. Also, for example, one second connecting rod 40 may be connected between the multiple pins 20 connected to the third frame edge 103 and the second frame edge 102 of the frame 10.

[0029] This not only improves the stability and reliability of the power module 100 installed on the frame assembly 1000, but also prevents jamming and deformation problems during the trim and form transport process. Furthermore, there is no need to install an additional link to connect the frame 10 and the frame assembly 1000. In the process of separating the subsequent power module 100 from the frame assembly 1000, the purpose of separating the power module 100 and the frame assembly 1000 can be achieved simply by blanking the second connecting rod 40. Furthermore, since there is no connection between the second connecting rod 40 and the packaging body 50 (as shown in FIGS. 4 and 5 ) used to package the main structure of the power module 100 and the packaging body 50 does not extend into the power module 100, it is possible to avoid damage or cracks to the packaging body on the power module 100 when blanking the second connecting rod 40, thereby ensuring the structural stability of the power module 100.

[0030] 4 , in the frame assembly 1000 provided by the embodiment of the present disclosure, the first connecting rod 60 and the second connecting rod 40 corresponding to the multiple pins 20 connected to the same frame edge are offset along the extension direction of the second frame edge 102. Also, along the extension direction of the second frame edge 102, the second connecting rod 40 is closer to the substrate 30 corresponding to the multiple pins 20 connected to the same frame edge than the first connecting rod 60.

[0031] Here, "first connecting rods 60 corresponding to multiple pins 20 connected to the same frame edge" refers to the first connecting rods 60 connected between the multiple pins 20 connected to the same frame edge. "second connecting rods 40 corresponding to multiple pins 20 connected to the same frame edge" refers to the second connecting rods 40 connected between the second frame edge 102 of the frame 10 and the multiple pins 20 connected to the same frame edge. "substrates 30 corresponding to multiple pins 20 connected to the same frame edge" refers to the substrates 30 connected to at least one pin 20 of the multiple pins 20 connected to the same frame edge.

[0032] 4, for example, for a plurality of pins 20 connected to a first frame edge 101 of a frame 10, at least one pin 20 is connected to a base plate 31, a first connecting rod 60 is connected between two adjacent pins 20, and a second connecting rod 40 is connected between the pin 20 closest to a second frame edge 102 of the frame 10 and the second frame edge 102 of the frame 10 along the extension direction Y1 of the first frame edge. In this case, the first connecting rod 60 and the second connecting rod 40 are offset from each other along the extension direction X1 of the second frame edge, and the second connecting rod 40 is closer to the base plate 31 than the first connecting rod 60.

[0033] As shown in FIG. 4, before being separately molded, each pin 20 extends as a whole substantially along the extending direction X1 of the second frame edge.

[0034] After the first connecting rod 60 is cut away and each pin 20 is separated and formed, each pin 20 is bent, i.e., bent along the thickness direction Z1 of the frame 10. The pins 20 after bent are as shown in Figure 5. Typically, each pin 20 is bent near the position of the first connecting rod 60 that is away from the substrate 30.

[0035] In the frame assembly 1000 provided by the embodiment of the present disclosure, the first connecting rod 60 and the second connecting rod 40 are offset along the extension direction X1 of the second frame edge, and the second connecting rod 40 is closer to the base plate 30 than the first connecting rod 60. As a result, during the bending leg forming process, the second connecting rod 40 is away from the bending position of the pin 20, which effectively prevents the second connecting rod 40 from interfering with and affecting the bending leg forming.

[0036] Here, the thickness direction Z1 of the frame refers to a direction perpendicular to the plane on which the frame 10 is located. The plane on which the frame 10 is located is a plane formed by the first frame edge 101, the second frame edge 102, and the third frame edge 103 of the frame 10.

[0037] In some embodiments, multiple pins 20 connected to the same frame edge are spaced apart along the extension direction of the frame edge, and the second connecting rod 40 is connected between one pin 20 of the multiple pins that is closest to the second frame edge 102 and the second frame edge 102.

[0038] For example, as shown in FIG. 4, a plurality of pins 20 connected to a first frame edge 101 are spaced apart along the extension direction Y1 of the first frame edge 101, and the second connecting rod 40 is connected between one pin 20 of the plurality of pins that is closest to the second frame edge 102 and the second frame edge 102.

[0039] This not only ensures the stability and reliability of the installation of the pins 20, but also prevents the pins 20 from coming into contact with each other and causing a malfunction. Furthermore, without affecting the spacing arrangement of the pins 20, the connection between the second connecting rod 40, the pins 20, and the frame 10 can be made stable and strong, so the connection between the power module 100 and the frame 10 can be made stable and strong, and jamming problems can be prevented when the frame assembly 1000 is transporting trim and form.

[0040] In some examples, as shown in FIG. 4 , the frame assembly 1000 includes multiple boards 30, such as a drive board 31 and a power board 32. The drive board 31 and the power board 32 are spaced apart along the extension direction X1 of the second frame edge 102 of the frame 10. At least one pin 20 of the multiple pins 20 connected to the first frame edge 101 may be connected to the drive board 31. In this case, the multiple pins 20 may also be referred to as drive pins. The drive board 31 is electrically connected to an external device via the drive pin connected thereto to realize the function of the drive board 31. At least one pin 20 of the multiple pins 20 connected to the third frame edge 103 may be connected to a power board 32. In this case, the multiple pins 20 may also be referred to as power pins. The power board 32 is electrically connected to an external device via the power pin connected thereto to realize the function of the power board 32.

[0041] Based on this, the frame assembly 1000 includes a plurality of second connecting rods 40. Of the plurality of pins 20 connected to the first frame edge 101 and spaced apart along the extension direction of the first frame edge 101, one second connecting rod 40 is connected between the second frame edge 102 and one pin closest to the second frame edge 102. Of the plurality of pins 20 connected to the third frame edge 103 and spaced apart along the extension direction of the third frame edge 103, another second connecting rod 40 may be connected between the second frame edge 102 and one pin closest to the second frame edge 102.

[0042] In the frame assembly 1000 provided by some embodiments of the present disclosure, the first frame edge 101 and the third frame edge 103 of the frame 10 are arranged opposite each other and can extend in the same direction. For example, in FIG. 4, the extension directions of the first frame edge 101 and the third frame edge 103 are both indicated by Y1.

[0043] As a result, the power module 100 is connected to the frame 10 on both sides along its length (which coincides with the extension direction X1 of the second frame edge 102 of the frame), so that the power module 100 can receive uniform force on both sides along its length, which further improves the stability and robustness of the connection of the power module 100 on the frame assembly 1000, thereby preventing jamming and deformation of the power module 100 during the trim / form transport process.

[0044] 4 and 5, the frame 10 further includes a fourth frame edge 104. The fourth frame edge 104 faces the second frame edge 102 and is connected between the first frame edge 101 and the third frame edge 103. In this case, multiple pins 20 connected to the same frame edge are spaced apart along the extension direction of the frame edge. Furthermore, one second connecting rod 40 is connected between the second frame edge 102 and the pin 20 closest to the second frame edge 102, and another second connecting rod 40 is connected between the fourth frame edge 104 and the pin 20 closest to the fourth frame edge 104.

[0045] For example, the multiple pins 20 connected to the first frame edge 101 are spaced apart along the extension direction of the first frame edge 101, and one second connecting rod 40 is connected between the pin 20 closest to the second frame edge 102 and the second frame edge 102, and another second connecting rod 40 is connected between the pin 20 closest to the fourth frame edge 104 and the fourth frame edge 104.

[0046] Also, by way of example, the multiple pins 20 connected to the third frame edge portion 103 are arranged at intervals along the extension direction of the third frame edge portion 103, and one second connecting rod 40 is connected between the pin 20 of the multiple pins 20 closest to the second frame edge 102 and the second frame edge 102, and another second connecting rod 40 is connected between the pin 20 closest to the fourth frame edge 104 and the fourth frame edge 104.

[0047] This not only makes it possible to make the force applied to the power module 100 in the frame assembly 1000 more uniform, but also further improves the stability and reliability of the attachment of the power module 100 in the frame assembly 1000.

[0048] In the frame assembly 1000 provided by some embodiments of the present disclosure, as shown in Figures 4 and 5, the power module 100 connected to the frame 10 further includes a packaging body 50. The packaging body 50 is used to package the main structure of the power module 100, such as the power board and the power chips connected to the power board, and the drive board and the drive chips connected to the drive board, thereby realizing the high integration characteristics of the power module 100 and ensuring the insulation and electrical safety of the power module 100.

[0049] 4, the pin 20 includes a first portion 201 located within the packaging body 50 and a second portion 202 extending from the packaging body 50. The first portion 201 of the pin 20 located within the packaging body 50 is connected to the substrate 30 (e.g., the drive substrate 31 or the power substrate 32), thereby ensuring the stability and reliability of the electrical connection between the first portion 201 and the substrate 30.

[0050] For the pin 20 connected to the second connecting rod 40, the second connecting rod 40 is connected to the second portion 202 of the pin 20. Because the second portion 202 is located outside the packaging body 50, the second connecting rod 40 is not affected by the packaging of the packaging body 50, ensuring the stability and independence of the installation of the second connecting rod 40. During the subsequent blanking process of the second connecting rod 40, the blanking force does not affect the packaging body 50 of the power module 100, and the packaging body 50 is not damaged or cracked. This ensures the stability and reliability of the power module 100 in the frame assembly 1000 and the structural stability of the power module 1000 after it is separated from the frame assembly 1000.

[0051] In some embodiments, the second portion 202 of the pin 20 may include a first sub-segment 2021 and a second sub-segment 2022. The first sub-segment 2021 is connected between the first portion 201 and the second sub-segment 2022 of the pin 20. When performing the pin bending leg forming process, the second sub-segment 2022 can be bent relative to the first sub-segment 2021 along the thickness direction Z1 of the frame. In this case, the second connecting rod 40 is connected to the first sub-segment 2021 of the second portion 202 of the pin 20. This prevents the second connecting rod 40 from interfering with and affecting the bending leg forming process.

[0052] In some embodiments of the present disclosure, the second connecting rod 40 is connected to the first sub-segment 2021 of the second portion 202 of the pin 20, so that the second sub-segment 2022 of the pin can be bent relative to the first sub-segment 2021 along the thickness direction Z1 of the frame during the leg bending process. Therefore, the distance from the connection point between the second connecting rod 40 and the first sub-segment 2021 of the second portion 202 of the pin 20 to the packaging body 50, and the distance from the connection point between the second connecting rod 40 and the first sub-segment 2021 of the second portion 202 of the pin 20 to the second sub-segment 2022 of the second portion 202 of the pin both affect the bending of the pin 20.

[0053] 6, the minimum distance d1 from the connection point A between the second connecting rod 40 and the first sub-segment 2021 of the second portion 202 of the pin 20 to the packaging body 50 is greater than the thickness of the frame 10. This allows the minimum distance from the connection point A between the first sub-segment 2021 and the second connecting rod 40 to the packaging body 50 to be set more reasonably, which further prevents the second connecting rod 40 from interfering with and affecting the bending leg forming process.

[0054] Here, the thickness of the frame 10 refers to the dimension of the frame 10 along its thickness direction Z1.

[0055] 6, the minimum distance d3 from the connection point A between the second connecting rod 40 and the first sub-segment of the second part of the pin to the second sub-segment 2022 of the second part 202 of the pin is greater than the thickness of the frame 10. This allows the minimum distance from the connection point A between the second connecting rod 40 and the first sub-segment 2021 to the second sub-segment 2022 of the pin to be set more reasonably, which further prevents the second connecting rod 40 from interfering with and affecting the bending leg forming process.

[0056] 7, the length d4 of the first sub-segment 2021 is greater than the width d5 ​​of the second connecting rod 40. The length of the first sub-segment 2021 refers to the dimension along the extension direction of the pin of the first sub-segment 2021 (i.e., the extension direction X1 of the second frame edge). The width of the second connecting rod 40 refers to the dimension along the extension direction X1 of the second frame edge of the second connecting rod 40.

[0057] Because the first sub-segment 2021 extends in the same direction as the pin itself, the extension direction of the pin itself is substantially the same as the extension direction of the second frame edge 102, and the second connecting rod 40 is connected between the pin and the second frame edge 102. Therefore, it is understood that there is an included angle between the extension direction of the first sub-segment 2021 and the extension direction of the second connecting rod 40. By making the length d4 of the first sub-segment 2021 greater than the width d5 ​​of the second connecting rod 40, it is possible to facilitate the connection between the second connecting rod 40 and the first sub-segment 2021 and further prevent the second connecting rod 40 from interfering with and affecting the bending leg forming process.

[0058] In some embodiments, the second connecting rod 40 may be connected to the first sub-segment 2021 perpendicularly, i.e., the extension direction of the second connecting rod 40 may be perpendicular to the extension direction of the first sub-segment 2021.

[0059] In the frame assembly 1000 provided by some embodiments of the present disclosure, as shown in FIGS. 4 to 7 , the second connecting rod 40 may extend along the extension direction of the first frame edge 101 or the third frame edge 103 of the frame 10. The extension direction of the first sub-segment 2021 may coincide with the extension direction of the second frame edge 102 of the frame 10. Illustratively, the extension direction of the first frame edge 101 or the third frame edge 103 may be perpendicular to the extension direction of the second frame edge 102.

[0060] This makes it possible to make the connection between the second connecting rod 40 and the first sub-segment 2021 more stable and robust, thereby improving the connection stability between the second connecting rod 40 and the power module 100.

[0061] Some embodiments of the present disclosure provide a power module 100. As shown in FIGS. 12 to 15, the main structure of the power module 100 includes a plurality of chips 300 and a plurality of pins 20. The plurality of chips 300 includes at least one driver chip 301 and at least one power chip 302. The plurality of pins 20 includes a plurality of control pins 21 electrically connected to the driver chip 301 and a plurality of power pins 22 electrically connected to the power chip 302. The power pins 22 are used to connect the power chip 302 to an external driver, and the control pins 21 are used to connect the driver chip 301 to an external controller. The power chip 302 is further electrically connected to the driver chip 301, and the driver chip 301 is used to drive the power chip 302.

[0062] As shown in Figures 4, 5, 8, 10, and 12 to 15, the power module 100 further includes a packaging body 50 used to package the main structure. A first side surface 50A and a second side surface 50B are provided opposite each other and extend along the longitudinal direction Y2 of the packaging body. For example, the extension direction of the first side surface 50A may coincide with the extension direction of the second side surface 50B.

[0063] The control pins 21 extend from the second side surface 50B of the packaging body 50 and are spaced apart along the extension direction of the second side surface 50B. The power pins 22 extend from the first side surface 50A of the packaging body 50 and are spaced apart along the extension direction of the first side surface 50A. The packaging body 50 packages the chips 300 together, achieving high integration of the power module 100 and ensuring the insulation and electrical safety of the power module 100.

[0064] The driver chip 301 and the power chip 302 are spaced apart along the width direction of the packaging body 50. Here, the direction in which the first side surface 50A of the packaging body points toward the second side surface 50B is called the width direction X2 of the packaging body, and the direction in which the multiple control pins 21 or multiple power pins 22 are arranged is called the length direction Y2 of the packaging body.

[0065] It should be noted that in the embodiment of the present disclosure, when the power module 100 is still located within the frame assembly 1000, i.e., when the power module has not yet been separated from the frame 10 of the frame assembly 1000, the control pins 21 included in the power module 100 are connected to the first frame edge 101 of the frame 10, and the power pins 22 are connected to the third frame edge 103 of the frame 10, as shown in Figures 4 and 10. Exemplarily, the extension direction Y1 of the first frame edge 101 or the third frame edge 103 may coincide with the length direction Y2 of the packaging body, and the extension direction X1 of the second frame edge may coincide with the width direction X2 of the packaging body.

[0066] Currently, with the trend toward higher density, higher integration, and smaller size of semiconductor devices (e.g., power modules), the number of pins on semiconductor devices (e.g., power modules) is gradually increasing, and both the pin width and the spacing between pins tend to become narrower. Both the pin width and the spacing between pins affect the structural strength of the pins and the insulation between the pins.

[0067] Based on this, as shown in FIGS. 8 to 11 , a power module 100 provided according to some embodiments of the present disclosure further includes at least one first insulating member 4 located outside the packaging body 50. Among the plurality of control pins 21, two adjacent control pins 21 are a first control pin 211 and a second control pin 212, respectively. One first insulating member 4 is connected between the first control pin 211 and the second control pin 212. The first insulating member 4 supports the two adjacent control pins 21 (i.e., the first control pin 211 and the second control pin 212) and is used to prevent the first control pin 211 and the second control pin 212 from being deformed and shortening the distance between them, thereby ensuring insulation between the two adjacent control pins 21.

[0068] 8, in some embodiments, the power module 100 includes 19 control pins 21, of which 10 are first control pins 211 and 9 are second control pins 212. The 10 first control pins 211 and the 9 second control pins 212 are alternately arranged along the longitudinal direction Y2 of the packaging body 50. The first insulating member 4 is connected between any two adjacent first control pins 211 and second control pins 212 that are relatively close to each other.

[0069] 10 , before the packaging body 50 packages multiple chips and the multiple pins have not yet been separated and molded (i.e., each pin 20 is still connected to the frame 10 of the frame assembly 1000), the multiple pins are connected to each other via a first connecting rod 60, and a first insulating member 4 is connected between two adjacent control pins 21 (i.e., the first control pin and the second control pin) and is located on the side of the first connecting rod 60 closer to the packaging body 50. Then, during the trim-and-form process, a blade 200 is typically used to cut the first connecting rod 60 between the two adjacent control pins 21, severing the connection between the two adjacent control pins and separating and molding each control pin 21, thereby realizing the electrical performance of each control pin 21. At this time, the first insulating member 4 is filled into the gap between the first control pin 211 and the second control pin 212, thereby effectively separating the first control pin 211 and the second control pin 212, effectively supporting the first control pin 211 and the second control pin 212, preventing the first control pin 211 and the second control pin 212 from deforming and shortening the distance between them, ensuring the insulation distance between the first control pin 211 and the second control pin 212, and further ensuring the insulation between the two control pins 211.

[0070] 9 and 11, in some embodiments, the first insulating member 4 is connected to a portion of the packaging body 50 that is located between two adjacent control pins 21. That is, one end of the first insulating member 4 along the length of the pin is connected to the packaging body 50, which ensures connection reliability of the first insulating member 4 and prevents the first insulating member 4 from falling off after the power module 100 has been used for a long period of time.

[0071] Here, the length direction of the pin can be approximately the same as the width direction of the packaging body.

[0072] In some embodiments, as shown in Figures 8 and 9, along the width direction X2 of the packaging body 50, the length of the first insulating member 4 is smaller than the length of at least one of the two adjacent control pins 21 connected to it.

[0073] Here, the length of the first insulating member 4 refers to the dimension of the first insulating member 4 along the width direction X2 of the packaging body 50. The length of the control pin 21 refers to the dimension of the control pin 21 along the width direction X2 of the packaging body 50.

[0074] For example, the length of the first insulating member 4 along the width direction X2 of the packaging body 50 is shorter than the length of the first control pin 211. Furthermore, for example, the length of the first insulating member 4 along the width direction X2 of the packaging body 50 is shorter than the length of the second control pin 212.

[0075] In some embodiments of the present disclosure, after the first connecting rod 60 is cut to separate and form each pin 20 (including the control pin 21 and the power pin 22), each pin 20 is bent, i.e., bent along the thickness direction Z1 of the frame 10. The pin 20 after the bent leg formation is shown in FIGS. 5 and 8. After the bent leg formation process, as shown in FIG. 9, the first control pin 211 includes a first portion 2111 and a second portion (not shown) that are connected to each other. The first portion 2111 extends along the width direction X2 of the packaging body 50, and the second portion extends along the thickness direction Z2 of the packaging body 50. As can be seen from the above, the width direction X2 of the packaging body 50 is approximately perpendicular to the thickness direction Z2 of the packaging body 50. In this case, the first portion 2111 of the first control pin 211 is approximately perpendicular to the second portion, i.e., the first control pin 211 has an approximately L-shape. Similarly, the second control pin 212 has a first portion 2121 and a second portion (not shown) that are connected to each other. The first portion 2121 extends along the width direction X2 of the packaging body 50, and the second portion extends along the thickness direction Z2 of the packaging body 50. That is, in this case, the shape of the second control pin 212 is substantially L-shaped.

[0076] As shown in FIGS. 12 to 15, the packaging body 50 further includes a bottom surface 50E and a top surface 50F. The bottom surface 50E and the top surface 50F connect the first side surface 50A, the second side surface 50B, the third side surface 50C, and the fourth side surface 50D. In the embodiment of the present disclosure, the direction from the bottom surface 50E to the top surface 50F is referred to as the thickness direction Z2. As shown in FIGS. 4, 5, and 10, the power module 100 is connected within the frame 10, and therefore the thickness direction Z2 of the packaging body here can be understood to coincide with the thickness direction Z1 of the frame.

[0077] In this case, the length of the first insulating member 4 along the width direction X2 of the packaging body 50 is shorter than the length of the first portion 2111 of the first control pin 211 and / or the first portion 2121 of the second control pin 212. This allows the first insulating member 4 to be effectively supported between the first portion 2111 of the first control pin 211 and the first portion 2121 of the second control pin 212, and the free end of the first insulating member 4 (i.e., the end away from the packaging body 50) protrudes from the first control pin 211 and the second control pin 212 along the width direction X2 of the packaging body 50, making it possible to prevent the first insulating member 4 from interfering with components other than the power module 100 when the power module 100 is attached.

[0078] In the power module 100 provided according to some embodiments of the present disclosure, as shown in FIG. 8 , the minimum distance d6 between the first control pin 211 and the second control pin 212 may be 0.5 mm or less. This allows more first control pins 211 and second control pins 212 to be installed within a limited range, or, if the number of first control pins 211 and second control pins 212 is constant, allows the dimension of the power module 100 along its width direction to be reduced, further improving the miniaturization of the power module 100. The minimum distance between the first control pin 211 and the second control pin 212 is the minimum distance required to ensure insulation between the first control pin 211 and the second control pin 212. In other words, the minimum distance d6 is the creepage distance between the first control pin 211 and the second control pin 212.

[0079] 8 and 9, in some embodiments, the first insulating member 4 is connected between the opposing side surfaces of two adjacent control pins 21 (i.e., the side surface 211A of the first control pin 211 and the side surface 212A of the second control pin 212 shown in FIG. 8). That is, along the longitudinal direction Y2 of the packaging body, opposing surfaces of the first insulating member 4 are connected to the side surface 211A of the first control pin 211 and the side surface 212A of the second control pin 212, respectively. This can strengthen the bonding force between the first insulating member 4 and the first control pin 211 and the second control pin 212, and can prevent the first control pin 211 and the second control pin 212 from deforming along the thickness direction Z2 of the packaging body 50.

[0080] In some embodiments, the first insulating member 4 is connected between the opposing surfaces of two adjacent control pins 21 (i.e., the first control pin 211 and the second control pin 212). The two opposing surfaces of the first insulating member 4 are flush with the two opposing surfaces of the first control pin 211 and the second control pin 212 along the thickness direction Z2 of the packaging body 50. This allows one surface of the first control pin 211 along the thickness direction Z2 of the packaging body 50 and one surface of the second control pin 212 along the thickness direction Z2 of the packaging body 50 to be positioned in the same plane, and also allows the other surface of the first control pin 212 along the thickness direction Z2 of the packaging body 50 and the other surface of the second control pin 212 along the thickness direction Z2 of the packaging body 50 to be positioned in the same plane, thereby ensuring the coplanarity of the first control pin 211 and the second control pin 212. Coplanarity is also called flatness and can reflect the coplanar state of multiple pins. When processing multiple pins, the surfaces of the multiple pins are not absolutely flat, but coplanarity is a numerical value that is the difference between the surface irregularities and the absolute level, and the smaller the numerical value, the better.

[0081] In some embodiments, a cut portion 41 is provided at one end of the first insulating member 4 that is distant from the packaging body 50. For example, the cut portion 41 is provided at one end of the first insulating member 4 that is not connected to the packaging body 50 (i.e., the above-mentioned free end) along the length direction of the pin.

[0082] 10 , in the process of cutting off the first connecting rod 60 between adjacent pins, the blade 200 covers the entire first connecting rod 60 along the width direction X2 of the packaging body 50, and, taking tolerances into consideration, can also cover a portion of one end of the first insulating member 4 that is remote from the packaging body 50, thereby ensuring that the first connecting rod 60 can be completely cut off. In this case, after the portion of the end of the first insulating member 4 that is covered by the blade 200 and that is remote from the packaging body 50 is cut off, a cut portion 41 is formed.

[0083] 9, the cut portion 41 may be a through groove. That is, the cut portion 41 penetrates two surfaces of the first insulating member 4 along the thickness direction Z2 of the packaging body. This further ensures that the first connecting rod 60 between adjacent pins is completely removed, and ensures the insulation between the two adjacent pins.

[0084] 9, the distance t between the bottom wall of the cutting portion 41 and the surface of one end of the first insulating member 4 that is away from the packaging body 50 may be 0.1 mm or more, which can further ensure that the blade 200 completely cuts off the first connecting rod 60 and ensure that the first control pin 211 and the second control pin 212 are insulated from each other.

[0085] In some embodiments, as shown in FIGS. 8 and 9 , the plurality of pins 20 further includes two support pins 25. The two support pins 25 extend from a third side surface 50C of the packaging body 50 and are spaced apart. The third side surface 50C is adjacent to the second side surface 50B and extends along the width direction X2 of the packaging body 50. The support pins 25 cooperate with the control pins 21 to support the power module 100 from different directions, improving the stability of the power module 100 and preventing deformation of the power module 100. In this case, the power module 100 further includes a second insulating member 5. The second insulating member 5 is connected between the two support pins 25. The second insulating member 5 is located outside the packaging body 50 and is used to support the two support pins 25, preventing deformation of the two support pins 25, and ensuring insulation between the two support pins 25.

[0086] In some embodiments, the second insulating member 5 is connected to a portion of the packaging body 50 located between the two support pins 25. That is, one end of the second insulating member 5 along the length of the support pin 25 is connected to the packaging body 50, thereby improving the connection reliability of the second insulating member 5 and preventing the second insulating member 5 from falling off after the power module 100 has been used for a long period of time.

[0087] Here, the length direction of the support pin 25 refers to the length direction of the portion of the support pin 25 that is pulled out from the outside of the packaging body 50. Because the support pin 25 is pulled out from the third side surface 50C of the packaging body, the length direction of the portion of the support pin 25 that is pulled out from the outside of the packaging body 50 can approximately coincide with the length direction of the packaging body.

[0088] In some examples, the end face of the other end of the second insulating member 5 along the length of the support pin 25 may be flush with the end face of the free end of the support pin 25 (i.e., the end of the portion of the support pin that is pulled out from the outside of the packaging body 50), thereby ensuring the regularity of the appearance of the power module 100 and preventing the second insulating member 5 from interfering with other components other than the power module 100.

[0089] 8 and 9, in some examples, opposing side surfaces of the second insulating member 5 are connected to opposing side surfaces of two support pins 25 along the width direction X2 of the packaging body. This makes it possible to strengthen the bonding force between the second insulating member 5 and the two support pins 25 and prevent the two support pins 25 from deforming along the thickness direction of the packaging body 50.

[0090] In some examples, along the thickness direction Z2 of the packaging body 50, two opposing surfaces of the second insulating member 5 are flush with two opposing surfaces of the two support pins 25, respectively. This ensures the coplanarity of the two support pins 25.

[0091] In the power module 100 provided by some embodiments of the present disclosure, the first insulating member 4 and the second insulating member 5 are both made of resin. For example, the material of the first insulating member 4 and / or the second insulating member 5 can include epoxy resin and silicon dioxide, which has relatively high strength and rigidity after curing and is low in cost. For example, the material of the first insulating member 4 and / or the second insulating member 5 can be the same as the material of the packaging body 50.

[0092] It is understood that when packaging the main structure of the power module 100, the mold used can have a structure corresponding to the first insulating member 4 and / or the second insulating member 5, so that when resin is injected into the mold, the packaging body 50 and the first insulating member 4 and / or the second insulating member 5 are formed simultaneously.

[0093] 8 , the plurality of control pins 21 include at least one first potential control pin group 23 and at least one second potential control pin group 24. The first potential control pin group 23 and the second potential control pin group 24 are arranged at intervals along the longitudinal direction Y2 of the packaging body 50. The first potential control pin group 23 includes a plurality of first potential control pins 231, and the second potential control pin group 24 includes a plurality of second potential control pins 241.

[0094] For example, the potential of the first potential control pin 231 is lower than the potential of the second potential control pin 241. That is, the first potential control pin 231 can be referred to as a low potential control pin, and a low voltage can be provided to the power module 100 via this pin. The second potential control pin 241 can be referred to as a high potential control pin, and a high voltage can be provided to the power module 100 via this pin.

[0095] A first insulating member 4 is connected between two adjacent first potential control pins 231 in the same first potential control pin group 23, and / or a first insulating member 4 is connected between two adjacent second potential control pins 241 in the same second potential control pin group 24.

[0096] For example, in the power module 100 shown in FIG. 8, the multiple control pins 21 include one low potential control pin group 23 and three high potential control pin groups 24, and the low potential control pin group 23 is located on one side of the second side surface 50B of the packaging body 50 along the longitudinal direction Y2 of the packaging body 50, and the three high potential control pin groups 24 are located on the other side of the second side surface 50B of the packaging body 50 along the longitudinal direction Y2 of the packaging body 50.

[0097] The low potential control pin group 23 may include thirteen low potential control pins 231. Of the thirteen low potential control pins 231, seven are first control pins 211 and the remaining six are second control pins. The seven first control pins 211 and six second control pins 212 are uniformly and alternately arranged along the longitudinal direction Y2 of the packaging body 50, and a first insulating member 4 is connected between any two adjacent first control pins 211 and second control pins 212.

[0098] Each high potential control pin group 24 includes two high potential control pins 241, which are the first control pin 211 and the second control pin 212. In this case, a first insulating member 4 is connected between the two high potential control pins 241 of the high potential control pin group 24.

[0099] As a result, the first insulating member 4 may be connected between two adjacent low potential control pins 231 that are relatively close to each other, and between two adjacent high potential control pins 241. The first insulating member 4 effectively supports the two adjacent control pins 21, and can prevent the control pins 21 from being deformed.

[0100] 8 , the minimum distance between the low potential control pin group 23 and the high potential control pin group 24 may be greater than the distance between two adjacent low potential control pins 231 in the same low potential control pin group 23, and / or the minimum distance between the low potential control pin group 23 and the high potential control pin group 24 may be greater than the minimum distance between two adjacent high potential control pins 241 in the same high potential control pin group 24. In this case, a first insulating member 4 may be connected between the low potential control pin group 23 and the high potential control pin group 24. That is, the insulating distance between the low potential control pin group 23 and the high potential control pin group 24 is relatively large, and even if the low potential control pin 231 or the high potential control pin 241 is deformed, the two do not form an electrical connection. In this case, there is no need to provide the first insulating member 4 between the low potential control pin group 23 and the high potential control pin group 24.

[0101] In some examples, there are multiple high potential control pin groups 24, and the minimum distance between two adjacent high potential control pin groups 24 is greater than the minimum distance between two adjacent high potential control pins 241 in the same high potential control pin group 24. In other words, the insulation distance between two adjacent high potential control pins 241 is relatively large, and in this case, there is no need to provide a first insulating member 4 between the two adjacent high potential control pins 241.

[0102] 8, at least one isolation portion 51 may be provided on the second side surface 50B of the packaging body 50. For example, one isolation portion 51 may be provided between adjacent first potential control pin group 23 and second potential control pin group 24, thereby increasing the insulation distance between the first potential control pin group 23 and the second potential control pin group 24. Furthermore, for example, one isolation portion 51 may also be provided between two adjacent second potential control pin groups 24, thereby increasing the insulation distance between the two adjacent second potential control pin groups 24.

[0103] For example, the separating portion 51 may be a protrusion. The protrusion is formed by protruding from the second side surface 50B of the packaging body 50 in a direction away from the center of the packaging body 50. Alternatively, the separating portion 51 may be a recess. The recess is formed by recessing the second side surface 50B of the packaging body 50 toward the center of the packaging body 50.

[0104] In a power module 100 provided by some embodiments of the present disclosure, when the plurality of pins 20 further includes two support pins 25 (e.g., a first support pin 251 and a second support pin 252) that are drawn out from a third side surface 50C of the packaging body and are spaced apart as shown in Fig. 16, the plurality of control pins 21 include a first functional pin 26 and a second functional pin 27 as shown in Fig. 17. Along the longitudinal direction Y2 of the packaging body 50, the second functional pin 27 is close to the center of the second side surface 50B of the packaging body 50, and the first functional pin 26 is located on the side of the second functional pin 27 that is away from the two support pins 25.

[0105] That is, the first functional pins 26, the second functional pins 27, and the support pins 25 are each arranged approximately uniformly along the longitudinal direction Y2 of the packaging body 50, and are drawn out from different side surfaces of the packaging body 50. This allows the power module 100 to be supported as a whole from different side surfaces of the power module 100, thereby avoiding the shaking problem that occurs when the power module 100 is supported from one side of the power module 100, improving the stability of the power module 100, and preventing deformation of the power module 100.

[0106] Furthermore, since the support pins 25 are pulled out from the third side surface 50C of the packaging body 50, it is possible to avoid an increase in the space occupied along the longitudinal direction Y2 of the power module 100 and a waste of material, and the installation of each pin used to support the power module 100 can be made more rational and compact, thereby reducing the volume of the power module 100 and improving the degree of miniaturization of the power module 100.

[0107] Furthermore, the first functional pin 26 and the second functional pin 27 are drawn out from the second side surface 50B of the packaging body 50, and the support pin 25 is drawn out from the third side surface 50C of the packaging body 50. This allows the insulation distance between these pins to be increased, thereby further improving the safety performance of the power module 100.

[0108] 17 , the first functional pins 26, the second functional pins 27, and the first support pins 251 are connected to the drive substrate 31, for example, as an integrated structure. The first functional pins 26 and the second functional pins 27 are drawn out from the second side surface 50B of the packaging body 50 and are all electrically connected to peripheral circuits, and the first support pins 251 are drawn out from the third side surface 50C of the packaging body 50. This allows the power module 100 to be supported from a side different from the side from which the control pins 21 are drawn out, ensuring the reliability of the installation of the power module 100.

[0109] 17, the power module 100 includes multiple driver chips 301, such as a first driver chip 3011 and a second driver chip 3012. According to different applications of the power module 100, the first driver chip 3011 may be a low-voltage driver chip, and the second driver chip 3012 may be a high-voltage driver chip, which can improve the operating performance of the power module 100.

[0110] In this case, the drive substrate 31 includes a first drive substrate 3101 and a second drive substrate 3102 that can be integrally molded. The first drive substrate 3101 and the second drive substrate 3102 are connected in sequence along the longitudinal direction Y2 of the packaging body 50. The first drive chip 3011 is mounted on the first drive substrate 3101, and the second drive chip 3012 is mounted on the second drive substrate 3102, thereby improving the compactness of the power module 100 structure.

[0111] In some examples, the first functional pins 26 may be electrically connected to the first driving chip 3011 and used to provide a ground voltage to the first driving chip 3011. The first functional pins 26 may be provided on one side of the first driving substrate 3101 along the length of the power module, the first support pins 251 may be provided on the side of the second driving substrate 3102 away from the first driving substrate 3101 along the length of the power module, and the second functional pins 27 may be provided, for example, close to a midpoint between the first driving substrate 3101 and the second driving substrate 3102. This allows the distribution of the first functional pins 26, the second functional pins 27, and the first support pins 251 within the packaging body 50 to be more uniform, thereby making the supporting force of the first functional pins 26, the second functional pins 27, and the first support pins 251 with respect to the power module 100 more uniform and improving the reliability and stability of the power module 100.

[0112] According to these embodiments, it is understood that the first potential control pin 231 of the first potential control pin group 23 in some of the above embodiments can be the first functional pin 26 and the second functional pin 27 here.

[0113] 17 , the plurality of control pins 21 further includes a third functional pin 28. The third functional pin 28 is electrically connected to the second drive chip 3012. The third functional pin 28 is connected to the second support pin 252, for example, as an integral structure. In addition, along the longitudinal direction Y2 of the packaging body, the third functional pin 28 is located on the side of the second functional pins 27 that is away from the first functional pin 26 and is close to the center of the second side surface 50B of the packaging body 50. For example, the third functional pin 28 is provided close to the middle position between the first drive substrate 3101 and the second drive substrate 3102.

[0114] As a result, the third functional pin 28 and the second support pin 252 can also support the power module 100 from two directions, thereby assisting the first functional pin 26, the second functional pin 27 and the first support pin 251 in supporting the power module 100, thereby further improving the stability of the power module 100.

[0115] In the power module 100 provided according to some embodiments of the present disclosure, the packaging body 50 further includes a flow guide portion 52. The flow guide portion 52 is located at a corner at the end of the second side surface 50B of the packaging body 50 along the longitudinal direction Y2. The flow guide portion 52 serves to guide the flow of resin when packaging the main body structure of the power module 100, and is configured to prevent voids from occurring at the corner of the packaging body 50.

[0116] In some examples, the flow guide portion 52 includes two consecutive recesses, namely, a first recess 521 and a second recess 522. The first recess 521 extends entirely along the length direction Y2 of the packaging body 50, and the second recess 522 extends entirely along the width direction X2 of the packaging body 50, thereby simplifying the manufacturing process of the packaging body 50 and reducing the manufacturing difficulty of the packaging body 50.

[0117] As can be seen from the above, the second recess 522 is farther from the control pin 21 than the first recess 521. Therefore, by drawing out the two support pins 25 from the side surface of the second recess 522 extending along the width direction X2 of the packaging body 50, not only can the miniaturization of the power module be improved, but also the insulation length between these pins can be extended.

[0118] 16 , the length of the two support pins 25 extending from the packaging body 50 does not exceed the depth of the second recess 522, i.e., the ends of the support pins 25 extending outward from the packaging body 50 along the longitudinal direction Y2 of the packaging body 50 do not exceed the third side surface 50C of the packaging body 50. This not only increases the creepage distance between the support pins 25 and the corresponding functional pins, but also prevents the exposed support pins 25 from coming into contact with devices located outside the packaging body 50, thereby preventing electric shock or damage.

[0119] 18 , both the first recess 521 and the second recess 522 are elongated, and the length d521 of the first recess 521 is equal to or greater than the length d522 of the second recess 522. This simplifies the design of the shapes of the first recess 521 and the second recess 522, makes it easier to mold the first recess 521 and the second recess 522, and further reduces the difficulty of manufacturing the packaging body 50.

[0120] Furthermore, the lengths of the first recess 521 and the second recess 522 can be matched with the lengths of the corresponding second side surface 50B and third side surface 50C, which saves the resin material required for packaging and improves the compactness of the structure, making the structure of the packaging body 50 more stable and reliable.

[0121] 16 and 19, in the power module 100 provided according to some embodiments of the present disclosure, the first recess 521 includes a first sub-side surface 5211 and a second sub-side surface 5212. The first sub-side surface 5211 extends along the width direction X2 of the packaging body 50, and the second sub-side surface 5212 extends along the length direction Y2 of the packaging body 50. The first sub-side surface 5211 is connected between (e.g., can be connected vertically to) the second sub-side surface 5212 and the second side surface 50B of the packaging body.

[0122] The second recess 522 has a third sub-side surface 5221 and a fourth sub-side surface 5222. The third sub-side surface 5221 extends along the length direction Y2 of the packaging body 50, and the fourth sub-side surface 5222 extends along the width direction X2 of the packaging body 50. The third sub-side surface 5221 is connected between (e.g., can be connected vertically to) the fourth sub-side surface 5222 and the third side surface 50C of the packaging body.

[0123] This simplifies the structure of the first recess 521 and the second recess 522, making it possible to realize an elongated structure for the first recess 521 and the second recess 522, and also reducing the difficulty of manufacturing the flow guide portion 52.

[0124] 16 and 19, the first recess 521 further includes a first transition arc surface 5213 between the first sub-side surface 5211 and the second sub-side surface 5212. This makes it possible to more uniformly distribute stress at the connection portion between the first sub-side surface 5211 and the second sub-side surface 5212 of the first recess 521, thereby preventing breakage due to stress concentration and improving the fatigue safety factor of the packaging body 50 in the first recess 521.

[0125] Similar to the first recess 521, the second recess 522 may also have a second transition arc surface 5223 between the third sub-side surface 5221 and the fourth sub-side surface 5222.

[0126] In some embodiments, the first support pin 251 and the second support pin 252 may each comprise a first pin segment, a second pin segment, and a third pin segment connected in sequence.

[0127] 17, the first support pin 251 may include a first pin segment 71, a second pin segment 72, and a third pin segment 73 connected in order. The first pin segment 71 and the third pin segment 73 extend along the length direction Y2 of the packaging body 50. The second pin segment 72 extends along the width direction X2 of the packaging body 50. An end of the third pin segment 73 away from the second pin segment 72 is drawn outward from the third side surface 50C of the packaging body 50 (e.g., the fourth sub-side surface 5222 of the second recess 522).

[0128] Similar to the first support pin 251, the second support pin 252 may also include a first pin segment 81, a second pin segment 82, and a third pin segment 83 connected in sequence.

[0129] For example, the width of the second pin segment 82 of the second support pin 252 is greater than the width of the second pin segment 72 of the first support pin 251 (ie, the dimension along the longitudinal direction Y2 of the packaging body 50).

[0130] This allows the available space on the drive substrate 31 to be fully utilized to improve the structural stability of the first support pin 251 and the second support pin 252, thereby improving the stability of support provided by both pins to the power module 100.

[0131] In the power module 100 provided by the embodiment of the present disclosure, the main structure of the power module can adopt various layouts and is not particularly limited here.

[0132] 12 and 13, the control pin 21 may have a first portion and a second portion connected to each other, the first portion being located within the packaging body 50, and the second portion being extended to the outside of the packaging body 50, and the driver chip 301 may be welded onto the first portion of the control pin 21 located within the packaging body 50. The power pin 22 may also have a first portion and a second portion connected to each other, the first portion being located within the packaging body 50, and the second portion being extended to the outside of the packaging body 50, and the power chip 302 may be welded onto the first portion of the power pin 22 located within the packaging body 50. The power chip 302 may also be electrically connected to the driver chip 301 via a wire.

[0133] 13, the connection methods of the control pins 21, the driver chip 301, the power pins 22, and the power chip 302 are all the same as those of the power module 100 shown in FIG. 12, and will not be described again here. Based on this, as shown in FIG. 13, the side of the first portion of the power pins 22 located within the packaging body 50, which is away from the power chip 302, can be connected to the heat sink 64 via an insulating layer 65 (e.g., an insulating resin sheet), and the surface of the heat sink 64, which is away from the first portion of the power pins 22 located within the packaging body 50, is flush with the bottom surface 50E of the packaging body 50 and is exposed to the outside of the packaging body 50. By providing the insulating layer 65 between the first portion of the power pins 22 located within the packaging body 50 and the heat sink 64, the first portion of the power pins 22 located within the packaging body 50 is separated from the heat sink 64, and electrical connection between the first portion of the power pins 22 located within the packaging body 50 and the heat sink 64 is avoided. When the power chip 302 operates and generates heat, the heat can be transferred to the heat sink 64 through the first portion of the power pin 22 located in the packaging body 50 and the insulating layer 65, and the heat sink 64 exchanges heat with the outside world to realize heat dissipation of the power module 100. For example, the heat sink 64 may be, but is not limited to, a copper sheet.

[0134] 14, the power module 100 further includes a direct bond copper (DBC) ceramic plate 90. The DBC ceramic plate 90 is disposed within the packaging body 50, and the power chip 302 and first portions of the power pins 22 located within the packaging body 50 are both disposed on the DBC ceramic plate 90 and electrically connected to the power pins 22 via wires. The driver chip 301 is disposed on first portions of the control pins 21 located within the packaging body 50, and the driver chip 301 is electrically connected to the power chip 302 via wires. The DBC ceramic plate 90 includes a ceramic layer 61 and first and second copper layers 62 and 63 located on either side of the ceramic layer 61. The power chip 302 and first portions of the power pins 22 located within the packaging body 50 are both disposed on the first copper layer 62. The surface of the second copper layer 63 away from the power chip 302 is flush with the bottom surface 50E of the packaging body 50 and is exposed to the outside of the packaging body 50. When the power chip 302 operates and generates heat, the heat can be transferred to the second copper layer 63 via the first copper layer 62 and the ceramic layer 61, and the second copper layer 63 exchanges heat with the outside, thereby realizing heat dissipation of the power module 100. The control pin 21 has a first part and a second part that are connected to each other, the first part is located within the packaging body 50, and the second part is extended to the outside of the packaging body 50, and the driver chip 301 may be provided on the first part of the control pin 21 located within the packaging body 50, for example by welding.

[0135] 15, similar to the power module 100 shown in FIG. 14, the power module 100 also includes a DBC ceramic plate 90. The installation manner of the DBC ceramic plate 90, the power chip 302, and the power pins 22 can be referred to the description of the above example, and will not be described again here. Based on this, the power module 100 further includes a printed circuit board (PCB) provided in the packaging body 50, a first portion of the control pin 21 located in the packaging body is electrically connected to the printed circuit board PCB, and the driver chip 301 is provided on the printed circuit board PCB.

[0136] Some embodiments of the present disclosure further provide equipment, and the power module 100 provided by the above embodiments can be applied to the equipment.

[0137] As shown in FIG. 20, the facility 1 includes a controller 2 and a power module 100 provided by any of the above embodiments, and the power module 100 is connected to the controller 2.

[0138] The equipment 1 provided by the embodiments of the present disclosure may include, but is not limited to, an inverter equipment or a rectifier equipment, and may be, for example, a motor drive controller.

[0139] For example, the controller 2 can generate a control signal according to a user's command and transmit the control signal to the power module 100. The power module 100 generates a drive signal according to the control signal and outputs it to a corresponding drive member to achieve drive control, inverter conversion, rectification conversion, etc.

[0140] By using the power module 100 of the above embodiment, the insulation withstand voltage and insulation reliability of the equipment 1 provided by the embodiment of the present disclosure are improved, and the electrical safety of the equipment is improved.

[0141] Those skilled in the art will appreciate that the scope of the present disclosure is not limited to the particular embodiments described above, and that modifications and substitutions can be made to specific elements of the embodiments without departing from the spirit of the present application. The scope of the present disclosure is limited by the claims.

Claims

1. A frame including a first frame edge, a second frame edge, and a third frame edge, wherein the first frame edge is provided opposite the third frame edge, and the second frame edge is connected between the first frame edge and the third frame edge; a plurality of pins located within the frame, wherein one end of a portion of the plurality of pins is connected to the first frame edge and one end of another portion of the plurality of pins is connected to the third frame edge; At least one substrate located within the frame, wherein the other end of at least one pin among a plurality of pins connected to the same frame edge is connected to the substrate; a plurality of first connecting rods located within the frame, each first connecting rod being connected between two adjacent pins among a plurality of pins connected to the same frame edge, the plurality of first connecting rods being located on the same straight line, and the number of the plurality of first connecting rods being greater than two; At least one second connecting rod located within the frame, the second connecting rod being connected between the second frame edge and a plurality of pins connected to the same frame edge; Equipped with the first connecting rod and the second connecting rod corresponding to the plurality of pins connected to the same frame edge are arranged to be offset along the extending direction of the second frame edge, and the second connecting rod is closer to the substrate corresponding to the plurality of pins connected to the same frame edge than the first connecting rod along the extending direction of the second frame edge; Frame assembly.

2. The plurality of pins connected to the same frame edge are spaced apart along the extension direction of the frame edge, and the second connecting rod is connected between the pin closest to the second frame edge and the second frame edge. The frame assembly of claim 1 .

3. the frame assembly includes a plurality of substrates and a plurality of second connecting rods, the plurality of substrates including a drive substrate and a power substrate, the drive substrate and the power substrate being spaced apart along an extension direction of the second frame edge; At least one pin of the plurality of pins connected to the first frame edge is connected to the drive substrate, and a second connecting rod is connected between one pin of the plurality of pins connected to the first frame edge that is closest to the second frame edge and the second frame edge; At least one pin of the plurality of pins connected to the third frame edge is connected to the power board, and another second connecting rod is connected between one pin of the plurality of pins connected to the third frame edge that is closest to the second frame edge and the second frame edge. The frame assembly of claim 2 .

4. The frame assembly includes a plurality of second connecting rods, and the frame further includes a fourth frame edge, the fourth frame edge being opposite the second frame edge and connected between the first frame edge and the third frame edge; The multiple pins connected to the same frame edge are arranged at intervals along the extension direction of the frame edge, and one second connecting rod is connected between the pin closest to the second frame edge and the second frame edge among the multiple pins, and another second connecting rod is connected between the pin closest to the fourth frame edge and the fourth frame edge among the multiple pins. The frame assembly of claim 1 .

5. Further comprising a packaging body used to package the at least one substrate; the pin has a first portion located within the packaging body and a second portion extending from the packaging body; for a pin connected to a second connecting rod, said second connecting rod being connected to a second portion of said pin; The frame assembly of claim 1 .

6. the second portion comprises a first sub-segment and a second sub-segment, the first sub-segment connected between the first portion and the second sub-segment, the second sub-segment bendable relative to the first sub-segment, and the second connecting rod connected to the first sub-segment; The frame assembly of claim 5 .

7. The minimum distance from the connection point between the second connecting rod and the first sub-segment to the packaging body along the extension direction of the second frame edge is greater than the thickness of the frame edge; and / or a minimum distance from a connection point between the second connecting rod and the first sub-segment to the second sub-segment is greater than a thickness of the frame edge; The frame assembly of claim 6.

8. Along the extension direction of the second frame edge, the length of the first sub-segment is greater than the width of the second connecting rod; The frame assembly of claim 6.

9. The frame assembly according to claim 6 , wherein the extension direction of the second connecting rod is perpendicular to the extension direction of the first sub-segment.

10. A packaging body; a plurality of chips located within the packaging body, each chip including at least one driving chip and at least one power chip, the at least one driving chip and the at least one power chip being spaced apart along a width direction of the packaging body; a plurality of pins including a plurality of control pins and a plurality of power pins drawn out from a first side surface and a second side surface of the packaging body, respectively, the first side surface and the second side surface both extending along the length direction of the packaging body and being arranged opposite to each other, the plurality of control pins being arranged at intervals along the length direction of the packaging body and being electrically connected to the at least one driving chip, and the plurality of power pins being arranged at intervals along the length direction of the packaging body and being electrically connected to the at least one power chip; at least one substrate, wherein one end of at least one pin among the plurality of pins drawn out from the same side surface of the packaging body is connected to the substrate; at least one first insulating member located outside the packaging body, wherein one first insulating member is connected between two adjacent control pins; a cut portion is provided at one end of the first insulating member that is away from the packaging body, and the width of the cut portion is smaller than the width of the first insulating member along the length direction of the packaging body; Among the plurality of pins drawn out from the same side of the packaging body, each two adjacent pins are connected via a first connecting rod, the plurality of first connecting rods are positioned on the same straight line, and the number of the plurality of first connecting rods is greater than two; One pin of the plurality of pins extending from the same side of the packaging body is connected to a second connecting rod; a first connecting rod and a second connecting rod corresponding to a plurality of pins drawn out from the same side surface of the packaging body are offset along a direction perpendicular to the first side surface or the second side surface, and the second connecting rod is closer to a substrate corresponding to a plurality of pins drawn out from the same side surface of the packaging body than the first connecting rod along the direction perpendicular to the first side surface or the second side surface; Power module.

11. the first insulating member is connected to a portion of the packaging body located between the two adjacent control pins; The power module according to claim 10.

12. a length of the first insulating member along a width direction of the packaging body is shorter than a length of at least one of the two adjacent control pins; The power module according to claim 10.

13. the first insulating member is connected between opposite sides of the two adjacent control pins; or the first insulating member is connected between opposing side surfaces of the two adjacent control pins, and the first insulating member and the two adjacent control pins are flush with each other along a thickness direction of the packaging body. The power module according to claim 10.

14. the cut portion is a through groove and penetrates two surfaces of the first insulating member along the thickness direction of the packaging body; The power module according to claim 10.

15. The plurality of pins further include two support pins, the two support pins being extended from a third side surface of the packaging body and spaced apart from each other; The power module further includes a second insulating member, the second insulating member being located outside the packaging body and connected between the two support pins. The power module according to claim 10.

16. the second insulating member is connected to a portion of the packaging body located between the two support pins.

16. The power module according to claim 15.

17. An equipment comprising a controller and a power module according to any one of claims 10 to 16, wherein the power module is connected to the controller. Equipment.

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