Semiconductor drying chamber exhaust pipe assembly

Abstract

The exhaust pipe assembly maintains a constant temperature, prevents clogging of the crystals due to cooling, and has room for expansion and contraction to accommodate thermal expansion of the horizontal and vertical exhaust pipes due to the waste heat extracted from the semiconductor drying chamber, preventing structural damage and improving overall practicality. [Solution] The present invention provides an exhaust pipe assembly for a semiconductor drying chamber, the exhaust equipment being installed outside the semiconductor drying chamber and mainly comprising a combination of one vertical exhaust pipe and several horizontal exhaust pipes, with several air guide pipe structures installed on the horizontal exhaust pipes, connecting to one side of the exterior of the semiconductor drying chamber and communicating with the interior of the semiconductor drying chamber, the ends of the vertical exhaust pipes being connected to an air extraction equipment, the exterior of each air guide pipe structure being wrapped in a heating cloth, the interior of each pipe body being an aluminum alloy pipe body with a built-in thin film heating plate, the exterior being covered with an insulating plate, a set of pipe expansion kits being connected to the tail end of the horizontal exhaust pipe, and a buffer connection seat being combined with the bottom of the vertical exhaust pipe.

Description

[Technical Field]

[0001] The present invention is an improved technology relating to the exhaust pipe structure of a drying chamber required when a semiconductor undergoes a drying process after being coated with epoxy resin (photosensitive agent). [Background technology]

[0002] The semiconductor manufacturing process includes a surface treatment step in which a specific paint is applied. After application, a drying step is required, in which the semiconductors are sent to a semiconductor drying chamber equipped with heating equipment for hot air drying. A set of exhaust pipe structures is installed on the outside of the semiconductor drying chamber to extract air. As shown in Figure 1, a set of exhaust pipe structures 10 is installed on the side of semiconductor drying chamber 1. This exhaust pipe structure 10 has a straight exhaust pipe 14 with two upper and lower connectors 15 connected to an upper horizontal exhaust pipe 12 and a lower horizontal exhaust pipe 13, respectively. The upper horizontal exhaust pipe 12 and the lower horizontal exhaust pipe 13 each have multiple bent pipes 11, which are connected to the exterior side of semiconductor drying chamber 1 and communicate with the interior through the bent pipes 11. The end of straight exhaust pipe 14 is connected to air extraction equipment 2.

[0003] However, because the exhaust air extracted by the exhaust pipe structure 10 is hot air at a certain temperature, generally, when the exhaust air passes through the curved pipe 11 and enters the horizontal exhaust pipes 12 and 13, the temperature gradually drops, which can cause crystallization. If these crystals accumulate inside the pipe, they can cause blockages and poor exhaust performance over time. Furthermore, the exhaust pipe structure 10 is usually made of metal, which undergoes thermal expansion and cooling contraction when exposed to heat. This can lead to metal fatigue during long-term operation, and excessive heating can damage the structure, causing air leaks and other undesirable results. Therefore, improvements are needed.

[0004] Furthermore, semiconductor manufacturing requires a drying process after coating. The exhaust pipe structure of the drying chamber is primarily designed to ensure the cleanliness and safety of the manufacturing process, for example, by removing harmful gases. Various chemical gases and materials are used in semiconductor manufacturing, and these gases can be corrosive or toxic. The exhaust pipe structure of the drying chamber effectively removes these harmful gases and prevents damage to the equipment and the environment. Furthermore, the semiconductor manufacturing process is very sensitive, and even minute contaminants can affect product quality. The exhaust structure effectively controls particles and contaminants during the manufacturing process, maintaining a clean manufacturing environment. The exhaust pipe structure of the drying chamber stabilizes the vacuum environment and helps the manufacturing process proceed smoothly.

[0005] The main object of the present invention is to solve the problems of the exhaust pipe structure of the conventional semiconductor drying chamber, which causes crystals to accumulate and clog due to cooling, and the problem that the exhaust pipe structure of the drying chamber may be damaged due to repeated thermal expansion and cooling contraction due to its rigid structure.

[0006] The present invention provides an exhaust pipe structure for a semiconductor drying chamber. This exhaust equipment is installed outside the semiconductor drying chamber and mainly consists of a vertical exhaust pipe and a number of horizontal exhaust pipes. The horizontal exhaust pipes are equipped with a number of air guide pipe structures, which are connected to the exterior sides of the semiconductor drying chamber and communicate with the interior. The ends of the vertical exhaust pipes are connected to an air extraction system, in which the exterior of each air guide pipe structure is wrapped in a heating cloth, and the interior of each pipe body is an aluminum alloy pipe body with a built-in thin-film heater. The exterior is covered with an insulating plate, and a set of pipe expansion kits is connected to the tail end of the horizontal exhaust pipe, and a buffer connection seat is combined with the bottom of the vertical exhaust pipe. This structural design allows the exhaust pipe structure to maintain a constant temperature and prevent crystal clogging due to cooling. Furthermore, the horizontal exhaust pipes and vertical exhaust pipes are subjected to thermal expansion in response to the hot waste air extracted from the semiconductor drying chamber. Therefore, when designing an exhaust pipe structure for a semiconductor drying chamber, how to design a safe and effective exhaust structure is an important issue for manufacturers, and has been a long-standing issue that manufacturers have been hoping to address. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] Japanese Patent Application Publication No. 2023-134512 Summary of the Invention [Problem to be solved by the invention]

[0008] The inventors have collected relevant information, received evaluations and reviews from many stakeholders, and, based on their many years of experience in this industry, have developed an exhaust pipe structure for a drying chamber used in the drying process after coating in the conductor manufacturing process, aiming to ensure the cleanliness and safety of the manufacturing process. Furthermore, they have attempted to improve the exhaust structure and design a new exhaust pipe structure, eliminating the corrosive and toxic nature of harmful gases and avoiding damage to the equipment and the environment. [Means for solving the problem]

[0009] This invention relates to an exhaust pipe structure used in semiconductor manufacturing processes, in which a multi-layer filter device is always installed. These filters effectively remove airborne particles and volatile organic compounds, preventing the chemicals in photosensitizers from volatilizing and entering the work environment or the outside air. The exhaust pipe structure is also equipped with an airflow monitoring device to ensure that the exhaust volume remains within a stable range during the drying process. This not only maintains a stable environment within the drying chamber, but also ensures timely discharge of harmful gases and reduces the accumulation of pollutants. Furthermore, because photosensitizers and other chemicals can emit corrosive gases during the drying process, exhaust pipes are typically made of corrosion-resistant materials (e.g., stainless steel or specialty plastics). Some advanced exhaust systems also have an automatic cleaning function that periodically removes sediments and pollutants from the exhaust pipe during operation, ensuring the long-term stability of the exhaust system. [Effects of the Invention]

[0010] As mentioned above, in a semiconductor drying chamber, the horizontal and vertical exhaust pipes have a certain degree of expansion and contraction margin when subjected to thermal expansion in response to toxic gases and thermal waste air extracted as exhaust. This is to prevent structural damage, improve overall safety, durability, and service life, and increase practicality by reducing the frequency of exhaust pipe maintenance. This maintains environmental cleanliness and the stability of the manufacturing process during the coating and drying processes, extends service life, and reduces the frequency of maintenance. [Brief explanation of the drawings]

[0011] [Figure 1] Schematic diagram of the exhaust pipe structure arrangement of the conductor drying chamber of the present invention. [Figure 2] 1 is a schematic diagram of the exhaust pipe structure arrangement of a semiconductor drying chamber according to the present invention; [Figure 3] 1 is a cross-sectional view of an air guide tube structure according to the present invention. [Figure 4] FIG. 2 is a cross-sectional view of the horizontal exhaust pipe of the present invention. [Figure 5] Schematic diagram of the structure of the exhaust horizontal pipe tail end extension kit of the present invention. [Figure 6] Schematic diagram of the structure of the exhaust horizontal pipe tail end extension kit of the present invention. [Figure 7] Schematic diagram of the exhaust vertical pipe bottom buffer connection seat of the present invention. [Figure 8] Schematic diagram of the exhaust vertical pipe bottom buffer connection seat of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0012] 2 to 4, the exhaust pipe structure for a semiconductor drying chamber of the present invention has several air guide pipe structures 40 arranged on the side of the semiconductor drying chamber, the exterior of each air guide pipe structure 40 covered with a heating cloth bag 41 and connected to a horizontal exhaust pipe 20 to form an internal connection. Each horizontal exhaust pipe 20 is mainly made of aluminum alloy, has a thin-film heating plate 21 built in, and is covered on the exterior with a heat insulating plate 22. An expansion kit 30 is connected to the tail end of each horizontal exhaust pipe 20, and a buffer connection seat is combined with the bottom of the vertical exhaust pipe 50.

[0013] 5 and 6, the expansion kit 30 is connected to the tail end of the horizontal exhaust pipe 20 and has a fixed seat 31 and a bearing 33. A convex shaft 32 extends from one side of the fixed seat 31, and the open end of the bearing 33 is attached to the outside of the shaft 32, forming a slidable combination. The other side of the bearing 33 is connected to the horizontal exhaust pipe 20. Therefore, when the horizontal exhaust pipe 20 is subjected to thermal expansion, it expands slightly, causing the bearing 33 to move toward the fixed seat 31 (as shown in FIG. 5). When the temperature drops, it moves in the opposite direction (as shown in FIG. 6). Therefore, the horizontal exhaust pipe 20 of the present invention can avoid structural damage caused by repeated thermal expansion and cooling contraction.

[0014] 7 and 8, in the present invention, a buffer connection seat 60 is combined with the bottom of the exhaust vertical pipe 50, the buffer connection seat 60 including a base seat 61, the upper end of which is provided with a directional pillar 62. A slidable sleeve 63 is installed on the outside of the directional pillar 62, and the upper part of the sleeve 63 is connected to the lower end of the exhaust vertical pipe 50. Therefore, when the length of the exhaust vertical pipe 50 increases due to thermal expansion, the sleeve 63 is pushed up along the directional pillar 62 toward the base seat 61, so that the pipe body is not compressed. Furthermore, when the temperature decreases, the exhaust vertical pipe 50 cools and shortens, returning to its original position (as shown in FIG. 8).

[0015] As described above, the present invention achieves temperature-maintaining structural design that prevents crystallization due to cooling as the extracted exhaust gas passes through the air guide pipe structure 40, the horizontal exhaust pipe 20, and the vertical exhaust pipe 50, thereby overcoming the adverse effects of blockage within the pipes. Furthermore, the buffer structure design reduces structural damage to the exhaust pipe structure during repeated thermal expansion and cooling contraction, thus representing a significant advance in the field. The above description specifically illustrates preferred embodiments of the present invention, and the present invention is not limited to these embodiments. Those skilled in the art may make various equivalent modifications or substitutions within the spirit of the present invention, and all such equivalent modifications and substitutions are within the scope of the claims of this application. [Explanation of symbols]

[0016] 1: Semiconductor drying chamber 2: Ventilation equipment 10: Exhaust pipe set 11: Bent pipe connector 12: Upper exhaust horizontal pipe 13: Lower exhaust horizontal pipe 14: Straight exhaust pipe 15: Connection parts 20: Horizontal exhaust pipe 21: Thin film heating plate 22: Heat insulating board 30: Telescopic parts 31:Fixed seat 32: Axis pillar 33: Bearing 40: Air guide pipe set 41: Heated cloth wrapping 50: Vertical exhaust pipe 60: Buffer connection seat 61: Bottom seat 62: Oriented pillar 63: Tube

Claims

1. This is an exhaust system installed outside the semiconductor drying chamber, and includes a structure that combines a vertical exhaust pipe and multiple horizontal exhaust pipes. It has a plurality of air guide pipes, which are connected to one side of the exterior of the semiconductor drying chamber; The outside of each air guide pipe is wrapped with heating cloth, and the inside of the semiconductor drying chamber is connected to the outside. Each of the horizontal exhaust pipes is connected to the air guide pipe set, and the inside of the pipes are connected. The exhaust pipe assembly for a semiconductor drying chamber is characterized in that each exhaust horizontal pipe is mainly made of an aluminum alloy pipe body, has a thin film heating plate built in, and is covered with a heat insulating plate on the outside.

2. 2. The exhaust pipe assembly of claim 1, further comprising a plurality of expandable pipe sleeves, each of which is connected to the tail end of one of the horizontal exhaust pipes, each of which has a fixed seat and a bearing, a convex shaft extending from one side of the fixed seat, an open end of the bearing being mounted on the outside of the shaft to form a slidable combination, and the other end of the bearing being connected to the horizontal exhaust pipe.

3. This is a semiconductor drying chamber exhaust pipe assembly, and a buffer joint is combined with the bottom of the exhaust vertical pipe.

2. The exhaust pipe assembly of claim 1, wherein the buffer connection seat comprises a base seat, a fixed pole is installed at the upper end of the base seat, a sliding sleeve is installed on the outside of the fixed pole, and an upper part of the sleeve is connected to the lower end of the exhaust vertical pipe.

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