Substrate Mounting System

Abstract

To provide a substrate mounting system capable of effectively reducing the risk of damage of a substrate due to a change of a temperature.SOLUTION: A substrate mounting system includes a mounting frame and a first positioning device. Regarding the mounting frame, a linear expansion coefficient is 30×10-6 / °C or less (namely, linear expansion coefficient≤30×10-6 / °C). The first positioning device is installed on the mounting frame. In a case where a substrate is installed on the frame, the first positioning device positions the substrate on the mounting frame while being in contact with the substrate. Therefore, in a case where a temperature is considerably changing, the substrate is prevented from receiving a considerable tension from the mounting frame or also prevented from being destroyed or deformed by pushing. Thus, cost for production can be reduced and yield can be improved.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a substrate support system, and more particularly to a substrate support system adapted for use at different temperatures. [Background technology]

[0002] It is well known that, to meet the needs of electronic products evolving toward higher performance and smaller size, the thickness of substrates employed in advanced manufacturing processes is becoming increasingly thinner. For example, printed circuit boards (PCBs) are used as substrates. However, if the substrate size is too thin, the substrate is prone to breakage or deformation when being moved and placed on a substrate. Furthermore, even when substrates are required to be processed at high temperatures or with drastic temperature changes, contact with other substrate-mounting equipment can easily cause breakage or deformation, resulting in reduced yields and increased costs. Summary of the Invention [Problem to be solved by the invention]

[0003] Therefore, how to provide a substrate mounting system that can be adapted to different temperatures for moving and mounting thin flexible substrates becomes an urgent problem to be solved. [Means for solving the problem]

[0004] In view of this, an object of the present invention is to provide a substrate mounting system that can effectively reduce damage to a substrate caused by temperature changes.

[0005] In order to achieve the above object, the present invention provides a substrate mounting system, which includes a mounting frame and a first positioning device, and the mounting frame has a coefficient of linear expansion (CTE) of 30×10 -6 / ℃ or less (i.e., coefficient of linear expansion (CTE)≦30×10 -6 / °C), and the first positioning device is installed on the mounting frame, and when the substrate is installed on the mounting frame, the first positioning device positions the substrate on the mounting frame while contacting the substrate. [Effects of the Invention]

[0006] The effects of the present invention are as follows: The linear expansion coefficient of the mounting frame is 30×10 -6 / ℃ or less (i.e., linear expansion coefficient ≦30×10 -6 By using the technical means of a temperature (°C) of 100°C, when the substrate is placed on the mounting frame, the first positioning device can position the substrate on the mounting frame. When the temperature rises and falls during the manufacturing process, the mounting frame is only slightly deformed. Furthermore, the substrate is not subjected to significant tension from the mounting frame, and is not damaged or deformed by pressure, which ultimately reduces production costs and improves yield. [Brief explanation of the drawings]

[0007] [Figure 1] 1 is a perspective view showing a substrate mounting system according to a preferred embodiment of the present invention; [Figure 2] FIG. 2 is an enlarged view showing a part of the configuration according to the preferred embodiment of the present invention. [Figure 3] FIG. 2 is an enlarged view showing a part of the configuration according to the preferred embodiment of the present invention. [Figure 4] FIG. 2 is an enlarged view showing a part of the configuration according to the preferred embodiment of the present invention. [Figure 5] FIG. 2 is a top view showing a part of the configuration according to the preferred embodiment of the present invention. [Figure 6] FIG. 6 is a schematic diagram showing a cross section taken along the line 6-6 in FIG. 5. [Figure 7] FIG. 2 is a perspective view showing a substrate mounting system according to the comparative example of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0008] In order to more clearly explain the present invention, a preferred embodiment will be described below with reference to the drawings. As shown in Figures 1 to 7, a substrate mounting system 1 according to a preferred embodiment of the present invention is for mounting a substrate 2. The substrate mounting system 1 includes a mounting frame 10 and a first positioning device 20. The mounting frame 10 has a linear expansion coefficient of 30x10 -6 / ℃ or less (i.e., linear expansion coefficient ≦30×10 -6 / °C). When the first positioning device 20 is installed on the mounting frame 10 and the substrate 2 is installed on the mounting frame 10, the first positioning device 20 positions the substrate 2 on the mounting frame 10 while contacting the substrate 2. When the substrate 2 is installed on the mounting frame 10, the first positioning device 20 can position the substrate 2 on the mounting frame 10. When the temperature rises and falls at each stage of manufacturing, even if the temperature changes drastically, by designing the mounting frame 10 to have a low linear expansion coefficient, the amount of deformation of the mounting frame 10 due to temperature is also low. Therefore, the substrate 2 is not subjected to excessive pulling or pushing from the mounting frame 10, and damage or deformation of the substrate 2 can be reduced, which in turn reduces production costs and improves yield.

[0009] In this embodiment, the linear expansion coefficient of the mounting frame 10 is set to 4.0×10 -6 In one embodiment, the linear expansion coefficient of the mounting frame 10 is set to 0.1×10 / °C. -6 and 30 x 10 -6 / °C may vary between 3.0 x 10 -6 and 10 x 10 -6 / °C.

[0010] In one embodiment, the material of the mounting frame 10 is such that the difference in the linear expansion coefficient between the mounting frame 10 and the substrate 2 is 10×10 -6 / ℃ or less (i.e., the difference in linear expansion coefficient is ≦10×10 -6 / ℃), the difference between the above values ​​is 0 to 5.0 × 10 -6 / °C. In this embodiment, the substrate 2 to be processed is a flexible printed circuit board made of glass material, and the mounting frame 10 is made of glass material. The difference in linear expansion coefficient between the substrate 2 and the mounting frame 10 is preferably 0 to 5.0 × 10 -6 / °C. The glass is Pyrex® glass. In other embodiments, the glass may be selected from, but is not limited to, soda-lime glass, potassium-lime glass, lead glass, barium glass, silicate glass, other silicate glasses, alumina glass, borosilicate glass, or phosphate glass. The mounting frame 10 may also be made of a material different from that of the substrate 2. The material may be selected from, for example, glass, metal, or alloy, but is not limited to these.

[0011] 2 and 3, the first positioning device 20 includes a base 22, an elastic means 24, and a positioning part 26. The base 22 is connected to the mounting frame 10, the positioning part 26 is rotatably connected to the base 22, and the elastic means 24 is connected to the base 22 and the positioning part 26, respectively. The elastic means 24 provides elastic force to the positioning part 26. When the substrate 2 is placed on the mounting frame 10, as shown in FIG. 7, the positioning part 26 can interpose the substrate 2 between the mounting frame 10 and the positioning part 26 through the elastic force applied by the elastic means 24. In this embodiment, the elastic means 24 is described as a torsion spring.

[0012] 2, the base 22 includes a base body 221 and a pin 222, the base body 221 is connected to the mounting frame 10, the pin 222 is connected to the base body 221, and the elastic means 24 is seated on the pin 222. The positioning part 26 includes a body 261 and two rolling parts 262, and has a connecting part 261a and an abutting part 261b at opposite ends of the body 261, the connecting part 261a is connected to the pin 222 rotatably with respect to the pin 222, and the two rolling parts 262 are connected to both left and right sides of the abutting part 261b of the body 261 rotatably with respect to the body 261, and the two rolling parts 262 are for abutting against the board 2. When the substrate 2 is interposed between the mounting frame 10 and the positioning portion 26, the two rolling portions 262 can roll in response to the movement of the mounting frame 10 when the substrate 2 moves relative to the mounting frame 10, thereby preventing the substrate 2 from being damaged or deformed by pulling or pushing. In this embodiment, the number of the rolling portions 262 is described as two. However, in other embodiments, the number of the rolling portions 262 may be one or more, and the same technical effect of being able to roll in response to the movement of the mounting frame 10 can be achieved.

[0013] 2, the base body 221 is connected to the frame 10 on one side and has a first mounting hole 221a on the other side. The connecting portion 261a of the positioning portion 26 has a second mounting hole. The pin can pass through the first mounting hole 221a, the second mounting hole, and the elastic means 24. One end of the elastic means 24 abuts against the base body 221, and the other end abuts against the body 261 of the positioning portion 26. When a user attempts to attach the substrate 2 to the mounting frame 10, as shown in FIG. 3, the push rod 3 passes through the through hole 10a in the mounting frame 10 and abuts the main body 261 of the positioning portion 26, and the main body 261 is rotated outward around the pin 222 as its axis, compressing the elastic means 24, and then the substrate 2 is placed in the space between the positioning portion 26 and the substrate 2. Next, the push rod 3 is withdrawn from the through hole 10a, and the positioning portion 26 is rotated inward around the pin 222 as its axis by the elastic force applied by the elastic means 24, and abuts against the surface of the substrate 2, so that the substrate 2 is securely interposed between the mounting frame 10 and the positioning portion 26.

[0014] In one embodiment, the elastic means 24 has a linear expansion coefficient of 20×10 -6 / ℃ or less (i.e., linear expansion coefficient ≦20×10 -6 / °C), and can still provide good elasticity even when applied in a high-temperature environment. For example, it may be made of Waspaloy® UNS N07001 nickel-based high-temperature alloy. In other embodiments, the elastic means 24 may have a different linear expansion coefficient depending on the manufacturing process. For example, the linear expansion coefficient of the elastic means 24 may be 5 to 20×10. -6 / °C interval, 15.9 x 10 -6 ~17.3×10 -6 / °C interval, 15.3 x 10 -6 ~19.7×10 -6 / °C interval, 13 x 10 -6 ~16.5×10-6 / ℃ or 10.5×10 -6 ~16×10 -6 / °C. Based on the linear expansion coefficient requirement, the material of the elastic means 24 may be, but is not limited to, spring steel, stainless steel, or alloy. Depending on the elements of the substrate, the alloy may be, but is not limited to, iron-based alloy, nickel-based alloy, cobalt-based alloy, powder metallurgy high-temperature alloy, or high-entropy alloy (HEA). Alternatively, an aluminum-copper-lithium heat-resistant alloy may be selected. For example, the elastic means 24 may preferably be selected from alloy materials such as, but not limited to, Inconel® 718, Inconel X-750, Nimonic® 263, Nimonic® 80A, Nimonic® 90, Rene 41, Elgiloy, Haynes® 25, Incoloy® 909, GH2132, A-286, GH2135, GH4145, GH4169, GH4090, GH4099, GH5605, etc.

[0015] 1 and 4, in this embodiment, the substrate mounting system 1 further includes a second positioning device 30 installed on the mounting frame 10, and the second positioning device 30 has a mounting portion 30a for mounting the side edge of the substrate 2. When the substrate mounting system 1 is operated in an upright position, as shown in FIG. 7, the second positioning device 30 corresponds to the position of the first positioning device 20 and is located at the bottom of the first positioning device 20, thereby supporting the lower edge of the substrate 2. Again, in this embodiment, six first positioning devices 20 are used as an example. Two first positioning devices 20 are installed in pairs at the top and both sides of the mounting frame 10, respectively. Two second positioning devices 30 are used as an example and are installed at the bottom of the mounting frame 10. In other embodiments, the number of first positioning devices 20 may be one or more, and the number of second positioning devices 30 may be one or more, or no second positioning device may be installed.

[0016] 5 and 6, in this embodiment, the base 22 includes a fixing part 223, and the base body 221 is connected to the mounting frame 10 via the fixing part 223. As shown in FIG. 6, the fixing part 223 includes a rear base body 2231, a tension spring 2232, a front base body 2233, and a bolt 2234, and the mounting frame 10 and the base body 221 are overlapped. The mounting frame 10 has a first through hole 10b communicating with the second through hole 221b in the base body 221. The front base body 2233 has a first through hole 2233a therein. The rear base body 2231 has a second through hole 2231a communicating with the first through hole 2233a therein. The rear base body 2231 has the first through hole 10b drilled at one end. The rear base body 2231 is engaged with the surface of the mounting frame 10 at its other end. The front base body 2233 has one end formed with the second through hole 221b and the first through hole 10b. The front base body 2233 is engaged with the surface of the base body 221 at its other end. The tension spring 2232 is formed with the first through hole 2233a and the second through hole 2231a. The outer diameter of the portion of the tension spring 2232 placed in the second through hole 2231a is larger than the diameter of one side of the second through hole 2231a that communicates with the first through hole 2233a. The rod portion 2234b of the bolt 2234 is formed with the first through hole 2233a. The outer diameter of the head portion 2234a of the bolt 2234 is larger than the diameter of the first through hole 2233a. By screwing the portion of the tension spring 2232 that forms the first through hole 2233a into the rod portion 2234b of the bolt 2234 with a screw, the front base body 2233 and the rear base body 2231 can be inserted into each other by the elastic force of the tension spring 2232, and the mounting frame 10 and the base body 221 are interposed between the front base body 2233 and the rear base body 2231.

[0017] 7, the mounting frame 10 has two opposing side edges each having a recess 10c recessed inward from the surface, each recess 10c being for inserting a movable mounting rod 4, and the movable mounting rod 4 has a plurality of grooves 4a arranged along its longitudinal axis. Therefore, the mounting frame 10 is engaged with one of the plurality of grooves 4a across the two movable mounting rods 4, and the design of each movable mounting rod 4 having a plurality of grooves 4a allows the two movable mounting rods 4 to mount a plurality of mounting frames 10 simultaneously.

[0018] In order to reduce the influence of the substrate mounting system on the substrate to be mounted, in one embodiment, the difference in linear expansion coefficient between the base 22 and the mounting frame 10 is 20×10 -6 / ℃ or less (i.e., difference in linear expansion coefficient ≦20×10 -6 / °C), the difference in deformation between the base 22 and the mounting frame 10 due to thermal expansion can be effectively reduced.

[0019] In one embodiment, the difference in linear expansion coefficient between the positioning portion 26 and the mounting frame 10 is 20×10 -6 / ℃ or less (i.e., difference in linear expansion coefficient ≦20×10 -6 / °C), thereby effectively reducing the difference in deformation between the positioning portion 26 and the mounting frame 10 due to thermal expansion.

[0020] In one embodiment, the difference in linear expansion coefficient between the pin 222 and the mounting frame 10 is 20×10 -6 / ℃ or less (i.e., difference in linear expansion coefficient ≦20×10 -6 / °C), thereby reducing the difference in thermal deformation between the pin 222 and the mounting frame 10.

[0021] In one embodiment, the difference in linear expansion coefficient between each of the rolling parts 262 and the mounting frame 10 is 20×10 -6 / ℃ or less (i.e., difference in linear expansion coefficient ≦20×10 -6 / °C). This reduces the difference in thermal deformation between the rolling portion 262 and the mounting frame 10. In one embodiment, the difference in linear expansion coefficient between the second positioning device 30 and the mounting frame 10 is 20×10 -6 / ℃ or less (i.e., difference in linear expansion coefficient ≦20×10 -6 / °C), thereby reducing the difference in thermal deformation between the second positioning device 30 and the mounting frame 10.

[0022] Among these, by designing the coefficient of linear expansion between each of the elements and the mounting frame 10, when the temperature changes drastically during manufacturing, the degree of deformation of the first positioning device 20 and the second positioning device 30 due to temperature changes can be effectively reduced. Therefore, the substrate 2 is not subjected to tension from the first positioning device 20 or the second positioning device 30, and is not broken or deformed by pressure, thereby reducing production costs and improving yield. Preferably, the difference between the coefficient of linear expansion of each of the elements and the coefficient of linear expansion of the mounting frame 10 is 10×10 -6 / ℃ or slightly less than 10×10 -6 / ° C. This effectively reduces the influence of thermal deformation on each element due to temperature changes during manufacturing.

[0023] Therefore, the effects of the present invention are as follows: When the substrate 2 is placed on the mounting frame 10, the first positioning device 20 can position the substrate 2 on the mounting frame 10. When the temperature is increased or high during manufacturing, the mounting frame 10 is made of a material with a low linear expansion coefficient, so that the amount of deformation of the mounting frame 10 caused by the influence of the environmental temperature is low, and the mounted substrate 2 is less likely to be pulled by the mounting frame 10. Furthermore, the substrate 2 is less likely to be broken or deformed by pressure, which would cause defects, and production costs can be reduced and yields can be improved.

[0024] The above description is merely a preferred embodiment of the present invention, and any equivalent replacements that apply to the specification and scope of the present invention should be included in the patent scope of the present invention. [Explanation of symbols]

[0025] 1. Substrate placement system 10 Mounting frame 10a through hole 10b First through hole 10c recess 2 boards 20 First positioning device 22 base 221 Base body 221a First mounting hole 221b Second through hole 222 pins 223 Fixed part 2231 Rear base body 2231a Second Piercing Hole 2232 Tension spring 2233 Front base body 2233a First Piercing Hole 2234 volts 2234a Head 2234b Rod section 24 Elastic means 26 Positioning part 261 Main Unit 261a Joint 261b Contact part 262 Rolling part 3 push rods 30 Second positioning device 30a Placement section 4 Moving and placing rod 4a Concave groove

Claims

1. A substrate mounting system for mounting a substrate, comprising: Linear expansion coefficient is 30 x 10 -6 / °C or less (i.e., linear expansion coefficient ≦30×10 -6 / °C), and a mounting frame; a first positioning device that is installed on the mounting frame and that positions the substrate on the mounting frame while contacting the substrate when the substrate is installed on the mounting frame; the first positioning device includes a positioning portion, When the substrate is placed on the mounting frame, the substrate is interposed between the mounting frame and the positioning portion, The difference in linear expansion coefficient between the substrate and the mounting frame is 20×10 -6 / °C or less (i.e., difference in linear expansion coefficient ≦20×10 -6 / °C).

2. The mounting frame has a linear expansion coefficient of 0.1×10 -6 and 30 x 10 -6 2. The substrate mounting system according to claim 1, wherein the temperature is between 100°C and 100°C.

3. the first positioning device further includes a base and a resilient means; the base is coupled to the mounting frame; the positioning portion is rotatably coupled to the base, the elastic means is connected to the base and the positioning portion, 2. The substrate mounting system according to claim 1, wherein the elastic means is for providing an elastic force to the positioning portion.

4. The elastic means has a linear expansion coefficient of 20×10 -6 / °C or less (i.e., linear expansion coefficient ≦20×10 -6 4. The substrate mounting system according to claim 3, wherein the temperature is 100° C. / ° C.

5. 4. The substrate supporting system of claim 3, wherein the elastic means is made of a material selected from the group consisting of spring steel, stainless steel, iron-based alloy, nickel-based alloy, cobalt-based alloy, powder metallurgy high-temperature alloy, and high-entropy alloy.

6. The difference in linear expansion coefficient between the base and the mounting frame is 20×10 -6 / °C or less (i.e., difference in linear expansion coefficient ≦20×10 -6 / °C), The difference in linear expansion coefficient between the positioning portion and the mounting frame is 20×10 -6 / °C or less (i.e., difference in linear expansion coefficient ≦20×10 -6 4. The substrate mounting system according to claim 3, wherein the temperature is 100° C. / ° C.

7. the base includes a base body and a pin, the base body is connected to the mounting frame, the pin is connected to the base body, and the elastic means is fitted to the pin; 4. The substrate mounting system of claim 3, wherein the positioning portion includes a main body and at least one rolling portion, and has a connecting portion and an abutment portion at opposite ends of the main body, the connecting portion being rotatably connected to the pin, the at least one rolling portion being rollably connected to the abutment portion on the main body, and the at least one rolling portion being adapted to abut against the substrate.

8. The difference in linear expansion coefficient between the pin and the mounting frame is 20×10 -6 / °C or less (i.e., difference in linear expansion coefficient ≦20×10 -6 / °C), The difference in linear expansion coefficient between the at least one rolling portion and the mounting frame is 20×10 -6 / °C or less (i.e., difference in linear expansion coefficient ≦20×10 -6 8. The substrate mounting system according to claim 7, wherein the temperature is 100°C / °F.

9. a second positioning device installed on the mounting frame, the second positioning device having a mounting portion for mounting a side edge of the substrate, wherein the difference in linear expansion coefficient between the second positioning device and the mounting frame is 20×10 -6 / °C or less (i.e., difference in linear expansion coefficient ≦20×10 -6 4. The substrate mounting system according to claim 3, wherein the temperature is 100° C. / ° C.

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