Heat treatment method and heat treatment apparatus

Abstract

To provide a heat treatment method and a heat treatment device that can measure a temperature of a substrate at the time of flashlight irradiation with a simple configuration.SOLUTION: An upper radiation thermometer 25 is provided obliquely above a semiconductor wafer as a temperature measurement target. The upper radiation thermometer 25 comprises a photovoltaic element 28 for generating an electromotive force when receiving light. The photovoltaic element 28 has both a high-speed response and a good noise characteristic in a low frequency region. The photovoltaic element 28 can obtain a sufficient sensitivity even at a room temperature without cooling, and therefore, the upper radiation thermometer 25 does not need a mechanism for cooling. Since the upper radiation thermometer 25 does not need to provide an optical chopper and a differentiation circuit, the upper radiation thermometer 25 can measure a surface temperature of the semiconductor wafer with a simple configuration at the time of both preheating with a halogen lamp and flashlight irradiation.SELECTED DRAWING: Figure 8

Description

[Technical Field]

[0001] The present invention relates to a heat treatment method and a heat treatment apparatus for heating a thin precision electronic substrate (hereinafter simply referred to as "substrate") such as a semiconductor wafer by irradiating the substrate with flash light. [Background technology]

[0002] Flash lamp annealing (FLA), which heats semiconductor wafers in an extremely short time, is attracting attention in the semiconductor device manufacturing process.Flash lamp annealing is a heat treatment technology that uses a xenon flash lamp (hereinafter, simply referred to as "flash lamp" means a xenon flash lamp) to irradiate the surface of a semiconductor wafer with flash light, thereby raising the temperature of only the surface of the semiconductor wafer in an extremely short time (a few milliseconds or less).

[0003] The spectral distribution of radiation from a xenon flash lamp is in the ultraviolet to near-infrared range, with a shorter wavelength than conventional halogen lamps and a wavelength that roughly matches the fundamental absorption band of silicon semiconductor wafers. Therefore, when a semiconductor wafer is irradiated with flash light from a xenon flash lamp, little light is transmitted, making it possible to rapidly heat the semiconductor wafer. It has also been found that if the flash light is irradiated for an extremely short period of time, less than a few milliseconds, it is possible to selectively heat only the area near the surface of the semiconductor wafer.

[0004] Flash lamp annealing is used in processes that require heating for an extremely short period of time, such as activating impurities implanted in a semiconductor wafer. By irradiating the surface of a semiconductor wafer into which impurities have been implanted by ion implantation with a flash light from a flash lamp, the surface of the semiconductor wafer can be heated to the activation temperature in an extremely short period of time, allowing only the impurities to be activated without diffusing them deeply.

[0005] Wafer temperature control is important in any heat treatment of semiconductor wafers, not just flash lamp annealing, and for this reason, it is necessary to accurately measure the temperature of the semiconductor wafer during heat treatment. In particular, in flash lamp annealing, it is important to accurately measure the surface temperature of the semiconductor wafer, which changes rapidly when irradiated with flash light. Patent Document 1 discloses a technology for measuring the surface temperature of a semiconductor wafer during flash light irradiation using a radiation thermometer. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Patent Application Laid-Open No. 2012-238779 Summary of the Invention [Problem to be solved by the invention]

[0007] Because thermal detection elements such as thermopiles cannot keep up with the rapid temperature changes on the surface of semiconductor wafers that occur when exposed to flash light, radiation thermometers for measuring the surface temperature of semiconductor wafers exposed to flash light have traditionally used quantum-type detection elements, called photoconductive elements. However, photoconductive elements have poor signal-to-noise ratios in the low-frequency range and must be cooled below freezing (e.g., -25°C) to achieve high sensitivity. Even if the photoconductive element is cooled below freezing, the thermometer housing containing the element remains at room temperature, resulting in poor thermal balance for the radiation thermometer as a whole. This requires the installation of an optical chopper to separate the measurement light from the background light from the thermometer housing, but this increases the size and complexity of the temperature measurement system.

[0008] The present invention has been made in view of the above-mentioned problems, and has an object to provide a heat treatment method and a heat treatment apparatus that can measure the temperature of a substrate during irradiation with flash light with a simple configuration. [Means for solving the problem]

[0009] In order to solve the above-mentioned problems, the invention of claim 1 provides a heat treatment method for heating a substrate by irradiating the substrate with flash light, the method comprising: a housing step of housing the substrate in a chamber; a preheating step of preheating the substrate by irradiating it with light from a continuously lit lamp; and a flash heating step of irradiating a surface of the substrate with flash light from a flash lamp, wherein a temperature of the substrate is measured by a first radiation thermometer having a photovoltaic element that generates an electromotive force by photoelectric effect, based on an electromotive force signal generated in the photovoltaic element when infrared light radiated from the substrate is received by the first radiation thermometer, and the first radiation thermometer measures the temperature of the substrate by executing in parallel a first measurement mode in which data is acquired at a first sampling interval and a second measurement mode in which data is acquired at a second sampling interval shorter than the first sampling interval. The signal output from the photovoltaic element is processed using a digital filter, and an IIR filter is used as the digital filter in the preheating step, and an FIR filter is used in the flash heating step. It is characterized by:

[0010] The invention of claim 2 is characterized in that, in the heat treatment method of the invention of claim 1, during the preheating step, the temperature of the front surface of the substrate is measured by the first radiation thermometer and the temperature of the back surface of the substrate is measured by a second radiation thermometer whose emissivity has been calibrated, and the emissivity set in the first radiation thermometer is calibrated based on the temperature of the substrate measured by the second radiation thermometer.

[0012] Also, claims 3 The invention is 1 In the heat treatment method according to the present invention, among the data acquired in the second measurement mode, data acquired during a certain period of time extending before and after the point at which the data value reaches a predetermined threshold is converted into temperature.

[0013] Also, claims 4 The invention is 3 In the heat treatment method according to the present invention, all data acquired in the first measurement mode is converted into temperature.

[0014] Also, claims 5 The invention is 4In the heat treatment method according to the present invention, the temperature values ​​obtained by temperature conversion of the data acquired in the first measurement mode are interpolated with the temperature values ​​obtained by temperature conversion of the data acquired in the second measurement mode, and the interpolated values ​​are displayed on the display unit.

[0017] Also, claims 6 The invention relates to a thermal treatment apparatus for heating a substrate by irradiating the substrate with a flash of light, the apparatus comprising: a chamber for accommodating a substrate; a continuously lit lamp for preheating the substrate by irradiating the substrate with light; a flash lamp for flash-heating the substrate by irradiating the surface of the substrate with flash of light; and a first radiation thermometer for measuring the temperature of the substrate based on a signal of an electromotive force generated in the photovoltaic element when infrared light radiated from the substrate is received, the first radiation thermometer measuring the temperature of the substrate by parallelly executing a first measurement mode for acquiring data at a first sampling interval and a second measurement mode for acquiring data at a second sampling interval shorter than the first sampling interval. The signal output from the photovoltaic element is processed using a digital filter, and an IIR filter is used as the digital filter in the preheating, and an FIR filter is used in the flash heating. It is characterized by:

[0018] Also, claims 7 The invention is 6 The heat treatment apparatus according to the invention further comprises a second radiation thermometer for measuring the temperature of the substrate, wherein during the preheating, the first radiation thermometer measures the temperature of the front surface of the substrate and the second radiation thermometer, which has been calibrated for emissivity, measures the temperature of the back surface of the substrate, and the emissivity set in the first radiation thermometer is calibrated based on the temperature of the substrate measured by the second radiation thermometer.

[0020] Also, claims 8 The invention is 6 The heat treatment apparatus according to the present invention is characterized in that it further comprises a temperature conversion unit that converts the temperature of data acquired in the second measurement mode during a certain period of time before and after the point at which the data value reaches a predetermined threshold.

[0021] Also, claims9 The invention is 8 In the heat treatment apparatus according to the present invention, the temperature conversion unit converts all data acquired in the first measurement mode into temperatures.

[0022] Also, claims 10 The invention is 9 The heat treatment apparatus according to the present invention is characterized in that it further comprises a display unit that interpolates and displays a temperature value obtained by temperature-converting data acquired in the first measurement mode and a temperature value obtained by temperature-converting data acquired in the second measurement mode. [Effects of the Invention]

[0025] Claims 1 to 1 5 According to the present invention, since the temperature of the substrate is measured by the first radiation thermometer equipped with a photovoltaic element, there is no need to provide an optical chopper in the photovoltaic element, and the temperature of the substrate during flash light irradiation can be measured with a simple configuration. Furthermore, since the first radiation thermometer acquires data at the first sampling interval and the second sampling interval, data can be appropriately acquired in both the preheating step and the flash heating step. Furthermore, since the signal output from the photovoltaic element is processed using a digital filter, signal processing can be performed by common hardware in both the preheating step and the flash heating step.

[0027] In particular, claims 5 According to the invention, the temperature values ​​obtained by temperature conversion of the data obtained in the first measurement mode are interpolated with the temperature values ​​obtained by temperature conversion of the data obtained in the second measurement mode and displayed on the display unit, so that the temperature change of the substrate from the pre-heating process to the flash heating process can be depicted with high accuracy.

[0029] Claim 6 From the claim 10According to the invention, since the first radiation thermometer equipped with a photovoltaic element for measuring the temperature of the substrate is provided, there is no need to provide an optical chopper in the photovoltaic element, and the temperature of the substrate during flash light irradiation can be measured with a simple configuration. Furthermore, since the first radiation thermometer acquires data at the first sampling interval and the second sampling interval, data can be acquired appropriately during both pre-heating and flash heating. Furthermore, since the signal output from the photovoltaic element is processed using a digital filter, signal processing can be performed using common hardware for both preheating and flash heating.

[0031] In particular, claims 10 According to the invention, a display unit is provided that interpolates and displays the temperature value obtained by converting the data acquired in the first measurement mode into the temperature value obtained by converting the data acquired in the second measurement mode, thereby making it possible to accurately depict the temperature change of the substrate from pre-heating to flash heating. [Brief explanation of the drawings]

[0033] [Figure 1] 1 is a vertical cross-sectional view showing the configuration of a heat treatment apparatus according to the present invention. [Figure 2] FIG. 2 is a perspective view showing the overall appearance of the holding portion. [Figure 3] FIG. [Figure 4] FIG. 2 is a cross-sectional view of a susceptor. [Figure 5] FIG. [Figure 6] FIG. [Figure 7] FIG. 2 is a plan view showing the arrangement of a plurality of halogen lamps. [Figure 8] FIG. 2 is a functional block diagram of an upper radiation thermometer and a lower radiation thermometer. [Figure 9] 2 is a flowchart showing a procedure of a processing operation in the heat treatment apparatus of FIG. [Figure 10] FIG. 10 is a diagram for explaining partial extraction from data acquired in a short cycle mode. [Figure 11] FIG. 10 is a diagram showing a temperature profile displayed on a display unit. DETAILED DESCRIPTION OF THE INVENTION

[0034] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

[0035] FIG. 1 is a vertical cross-sectional view showing the configuration of a heat treatment apparatus 1 according to the present invention. The heat treatment apparatus 1 in FIG. 1 is a flash lamp annealing apparatus that heats a disk-shaped semiconductor wafer W as a substrate by irradiating the semiconductor wafer W with flash light. The size of the semiconductor wafer W to be treated is not particularly limited, but is, for example, φ300 mm or φ450 mm (φ300 mm in this embodiment). Note that in FIG. 1 and the subsequent figures, the dimensions and number of various parts are exaggerated or simplified as necessary for ease of understanding.

[0036] Heat treatment apparatus 1 includes a chamber 6 that accommodates a semiconductor wafer W, a flash heating unit 5 that incorporates multiple flash lamps FL, and a halogen heating unit 4 that incorporates multiple halogen lamps HL. The flash heating unit 5 is provided above chamber 6, and the halogen heating unit 4 is provided below. Heat treatment apparatus 1 also includes, inside chamber 6, a holder 7 that holds the semiconductor wafer W in a horizontal position, and a transfer mechanism 10 that transfers the semiconductor wafer W between the holder 7 and the outside of the apparatus. Heat treatment apparatus 1 also includes a control unit 3 that controls the operating mechanisms provided in the halogen heating unit 4, flash heating unit 5, and chamber 6 to perform heat treatment on the semiconductor wafer W.

[0037] The chamber 6 is constructed by attaching quartz chamber windows to the top and bottom of a cylindrical chamber side portion 61. The chamber side portion 61 has a roughly cylindrical shape with openings at the top and bottom, with an upper chamber window 63 attached to and closing the upper opening, and a lower chamber window 64 attached to and closing the lower opening. The upper chamber window 63, which forms the ceiling of the chamber 6, is a disc-shaped member made of quartz and functions as a quartz window that transmits the flash light emitted from the flash heating unit 5 into the chamber 6. The lower chamber window 64, which forms the floor of the chamber 6, is also a disc-shaped member made of quartz and functions as a quartz window that transmits the light from the halogen heating unit 4 into the chamber 6.

[0038] Furthermore, a reflective ring 68 is attached to the upper part of the inner wall surface of the chamber side 61, and a reflective ring 69 is attached to the lower part. Both reflective rings 68, 69 are formed in an annular shape. The upper reflective ring 68 is attached by fitting it from the upper side of the chamber side 61. On the other hand, the lower reflective ring 69 is attached by fitting it from the lower side of the chamber side 61 and fastening it with screws (not shown). In other words, both reflective rings 68, 69 are detachably attached to the chamber side 61. The internal space of the chamber 6, i.e., the space surrounded by the upper chamber window 63, the lower chamber window 64, the chamber side 61, and the reflective rings 68, 69, is defined as a heat treatment space 65.

[0039] By attaching the reflecting rings 68, 69 to the chamber side portion 61, a recess 62 is formed on the inner wall surface of the chamber 6. That is, the recess 62 is formed by a central portion of the inner wall surface of the chamber side portion 61 where the reflecting rings 68, 69 are not attached, the lower end surface of the reflecting ring 68, and the upper end surface of the reflecting ring 69. The recess 62 is formed in an annular shape along the horizontal direction on the inner wall surface of the chamber 6, and surrounds the holder 7 that holds the semiconductor wafer W. The chamber side portion 61 and the reflecting rings 68, 69 are made of a metal material (e.g., stainless steel) that has excellent strength and heat resistance.

[0040] Furthermore, a transfer opening (furnace port) 66 is formed in the chamber side portion 61, through which a semiconductor wafer W is loaded into and unloaded from the chamber 6. The transfer opening 66 can be opened and closed by a gate valve 185. The transfer opening 66 is connected to the outer peripheral surface of the recessed portion 62. Therefore, when the gate valve 185 opens the transfer opening 66, the semiconductor wafer W can be loaded into and unloaded from the heat treatment space 65 through the transfer opening 66 and the recessed portion 62. Furthermore, when the gate valve 185 closes the transfer opening 66, the heat treatment space 65 in the chamber 6 becomes an airtight space.

[0041] Furthermore, through holes 61a and 61b are formed in the chamber side portion 61. The through hole 61a is a cylindrical hole for guiding infrared light radiated from the upper surface of a semiconductor wafer W held on a susceptor 74 (described later) to the infrared sensor 29 of the upper radiation thermometer 25. On the other hand, the through hole 61b is a cylindrical hole for guiding infrared light radiated from the lower surface of the semiconductor wafer W to the infrared sensor 24 of the lower radiation thermometer 20. The through holes 61a and 61b are provided at an angle with respect to the horizontal direction so that their axes of penetration intersect with the main surface of the semiconductor wafer W held on the susceptor 74. A transparent window 26 made of calcium fluoride material that transmits infrared light in a wavelength range measurable by the upper radiation thermometer 25 is attached to the end of the through hole 61a facing the heat treatment space 65. Furthermore, a transparent window 21 made of barium fluoride material that transmits infrared light in the wavelength range that can be measured by the lower radiation thermometer 20 is attached to the end of the through hole 61b facing the heat treatment space 65.

[0042] Gas supply holes 81 are formed in the upper part of the inner wall of the chamber 6 to supply processing gas to the heat treatment space 65. The gas supply holes 81 are formed at a position above the recess 62 and may be provided in the reflecting ring 68. The gas supply holes 81 are connected to a gas supply pipe 83 via a buffer space 82 formed in an annular shape inside the side wall of the chamber 6. The gas supply pipe 83 is connected to a processing gas supply source 85. A valve 84 is inserted in the gas supply pipe 83. When the valve 84 is opened, processing gas is supplied from the processing gas supply source 85 to the buffer space 82. The processing gas that has flowed into the buffer space 82 spreads within the buffer space 82, which has lower fluid resistance than the gas supply holes 81, and is supplied from the gas supply holes 81 into the heat treatment space 65. The processing gas may be, for example, an inert gas such as nitrogen (N), a reactive gas such as hydrogen (H) or ammonia (NH), or a mixture thereof (nitrogen gas in this embodiment).

[0043] Meanwhile, a gas exhaust hole 86 is formed in the lower part of the inner wall of the chamber 6 to exhaust gas from the heat treatment space 65. The gas exhaust hole 86 is formed below the recess 62 and may be provided in the reflecting ring 69. The gas exhaust hole 86 is connected to a gas exhaust pipe 88 via a buffer space 87 formed in an annular shape inside the side wall of the chamber 6. The gas exhaust pipe 88 is connected to an exhaust unit 190. A valve 89 is inserted in the gas exhaust pipe 88. When the valve 89 is opened, the gas in the heat treatment space 65 is exhausted from the gas exhaust hole 86 through the buffer space 87 to the gas exhaust pipe 88. The gas supply hole 81 and the gas exhaust hole 86 may be provided in multiple numbers along the circumferential direction of the chamber 6, or may be slit-shaped. The process gas supply source 85 and the exhaust unit 190 may be mechanisms provided in the heat treatment apparatus 1 or may be utilities of a factory where the heat treatment apparatus 1 is installed.

[0044] A gas exhaust pipe 191 for discharging gas from the heat treatment space 65 is also connected to the tip of the transfer opening 66. The gas exhaust pipe 191 is connected to an exhaust unit 190 via a valve 192. By opening the valve 192, the gas in the chamber 6 is exhausted through the transfer opening 66.

[0045] 2 is a perspective view showing the overall appearance of the holder 7. The holder 7 is configured to include a base ring 71, a connecting portion 72, and a susceptor 74. The base ring 71, the connecting portion 72, and the susceptor 74 are all made of quartz. In other words, the entire holder 7 is made of quartz.

[0046] The base ring 71 is an arc-shaped quartz member with a portion missing from the annular shape. This missing portion is provided to prevent interference between the base ring 71 and a transfer arm 11 of the transfer mechanism 10, which will be described later. The base ring 71 is placed on the bottom surface of the recess 62, and is supported by the wall surface of the chamber 6 (see FIG. 1). A plurality of connecting portions 72 (four in this embodiment) are erected on the upper surface of the base ring 71 along the circumferential direction of the annular shape. The connecting portions 72 are also quartz members, and are fixed to the base ring 71 by welding.

[0047] The susceptor 74 is supported by four connecting portions 72 provided on the base ring 71. FIG. 3 is a plan view of the susceptor 74. FIG. 4 is a cross-sectional view of the susceptor 74. The susceptor 74 includes a holding plate 75, a guide ring 76, and a plurality of substrate support pins 77. The holding plate 75 is a substantially circular, flat member made of quartz. The diameter of the holding plate 75 is larger than the diameter of the semiconductor wafer W. That is, the holding plate 75 has a planar size larger than that of the semiconductor wafer W.

[0048] A guide ring 76 is installed on the periphery of the upper surface of the holding plate 75. The guide ring 76 is an annular member having an inner diameter larger than the diameter of the semiconductor wafer W. For example, if the diameter of the semiconductor wafer W is φ300 mm, the inner diameter of the guide ring 76 is φ320 mm. The inner periphery of the guide ring 76 has a tapered surface that widens upward from the holding plate 75. The guide ring 76 is made of quartz, the same as the holding plate 75. The guide ring 76 may be welded to the upper surface of the holding plate 75, or may be fixed to the holding plate 75 by a separately processed pin or the like. Alternatively, the holding plate 75 and the guide ring 76 may be processed as an integrated member.

[0049] The area of ​​the upper surface of the holding plate 75 that is inside the guide ring 76 is a flat holding surface 75a that holds the semiconductor wafer W. A plurality of substrate support pins 77 are provided on the holding surface 75a of the holding plate 75. In this embodiment, a total of 12 substrate support pins 77 are provided at 30° intervals along a circumference concentric with the outer circumferential circle of the holding surface 75a (the inner circumferential circle of the guide ring 76). The diameter of the circle on which the 12 substrate support pins 77 are arranged (the distance between opposing substrate support pins 77) is smaller than the diameter of the semiconductor wafer W. If the diameter of the semiconductor wafer W is 300 mm, the diameter is 270 mm to 280 mm (270 mm in this embodiment). Each substrate support pin 77 is made of quartz. The plurality of substrate support pins 77 may be provided on the upper surface of the holding plate 75 by welding, or may be machined integrally with the holding plate 75.

[0050] Returning to FIG. 2, four connecting portions 72 erected on the base ring 71 are fixed to the peripheral edge of the holding plate 75 of the susceptor 74 by welding. That is, the susceptor 74 and the base ring 71 are fixedly connected by the connecting portions 72. The base ring 71 of the holding portion 7 is supported on the wall surface of the chamber 6, and the holding portion 7 is thereby attached to the chamber 6. When the holding portion 7 is attached to the chamber 6, the holding plate 75 of the susceptor 74 is in a horizontal position (a position in which the normal line coincides with the vertical direction). That is, the holding surface 75a of the holding plate 75 is a horizontal plane.

[0051] The semiconductor wafer W carried into the chamber 6 is placed and held in a horizontal position on the susceptor 74 of the holder 7 attached to the chamber 6. At this time, the semiconductor wafer W is supported by twelve substrate support pins 77 erected on a holding plate 75 and held on the susceptor 74. More precisely, the upper ends of the twelve substrate support pins 77 contact the underside of the semiconductor wafer W to support the semiconductor wafer W. The heights of the twelve substrate support pins 77 (the distance from the upper ends of the substrate support pins 77 to the holding surface 75a of the holding plate 75) are uniform, so the twelve substrate support pins 77 can support the semiconductor wafer W in a horizontal position.

[0052] Furthermore, the semiconductor wafer W is supported by a plurality of substrate support pins 77 at a predetermined distance from the holding surface 75a of the holding plate 75. The thickness of the guide ring 76 is greater than the height of the substrate support pins 77. Therefore, the guide ring 76 prevents the semiconductor wafer W supported by the plurality of substrate support pins 77 from shifting in the horizontal direction.

[0053] 2 and 3, an opening 78 is formed in the holding plate 75 of the susceptor 74, penetrating vertically. The opening 78 is provided so that the lower radiation thermometer 20 can receive radiation (infrared light) emitted from the underside of the semiconductor wafer W. That is, the lower radiation thermometer 20 receives the light emitted from the underside of the semiconductor wafer W through the opening 78 and a transparent window 21 attached to the through-hole 61b of the chamber side 61, thereby measuring the temperature of the semiconductor wafer W. Furthermore, the holding plate 75 of the susceptor 74 is formed with four through-holes 79 through which lift pins 12 of the transfer mechanism 10, which will be described later, pass to transfer the semiconductor wafer W.

[0054] FIG. 5 is a plan view of the transfer mechanism 10. FIG. 6 is a side view of the transfer mechanism 10. The transfer mechanism 10 includes two transfer arms 11. The transfer arms 11 are arc-shaped so as to fit the generally annular recess 62. Two lift pins 12 are provided on each of the transfer arms 11. The transfer arms 11 and the lift pins 12 are made of quartz. Each transfer arm 11 is rotatable by a horizontal movement mechanism 13. The horizontal movement mechanism 13 horizontally moves the pair of transfer arms 11 between a transfer operation position (position indicated by a solid line in FIG. 5) where the transfer arms 11 transfer the semiconductor wafer W to the holder 7 and a retracted position (position indicated by a two-dot chain line in FIG. 5) where the transfer arms 11 do not overlap the semiconductor wafer W held by the holder 7 in a plan view. The horizontal movement mechanism 13 may be one that rotates each transfer arm 11 using an individual motor, or one that uses a link mechanism to rotate a pair of transfer arms 11 in conjunction with one another using a single motor.

[0055] Furthermore, the pair of transfer arms 11 are raised and lowered together with the horizontal movement mechanism 13 by the lifting mechanism 14. When the lifting mechanism 14 raises the pair of transfer arms 11 to the transfer operation position, a total of four lift pins 12 pass through through holes 79 (see FIGS. 2 and 3 ) formed in the susceptor 74, and the upper ends of the lift pins 12 protrude from the upper surface of the susceptor 74. On the other hand, when the lifting mechanism 14 lowers the pair of transfer arms 11 to the transfer operation position to remove the lift pins 12 from the through holes 79, and the horizontal movement mechanism 13 moves the pair of transfer arms 11 so as to open, each transfer arm 11 moves to a retracted position. The retracted position of the pair of transfer arms 11 is directly above the base ring 71 of the holder 7. Because the base ring 71 is placed on the bottom surface of the recess 62, the retracted position of the transfer arms 11 is inside the recess 62. In addition, an exhaust mechanism (not shown) is also provided near the location where the drive part of the transfer mechanism 10 (horizontal movement mechanism 13 and lifting mechanism 14) is located, and is configured to exhaust the atmosphere around the drive part of the transfer mechanism 10 to the outside of the chamber 6.

[0056] Returning to FIG. 1 , the flash heating unit 5, which is provided above the chamber 6, is configured with a light source made up of multiple (30 in this embodiment) xenon flash lamps FL inside a housing 51, and a reflector 52 provided to cover the light source from above. A lamp light emission window 53 is attached to the bottom of the housing 51 of the flash heating unit 5. The lamp light emission window 53, which forms the floor of the flash heating unit 5, is a plate-shaped quartz window made of quartz. By installing the flash heating unit 5 above the chamber 6, the lamp light emission window 53 faces the upper chamber window 63. The flash lamps FL irradiate a heat treatment space 65 with flash light from above the chamber 6 through the lamp light emission window 53 and the upper chamber window 63.

[0057] The multiple flash lamps FL are each a rod-shaped lamp having a long cylindrical shape, and are arranged in a plane so that their longitudinal directions are parallel to each other along the main surface of the semiconductor wafer W held by the holder 7 (i.e., along the horizontal direction). Therefore, the plane formed by the arrangement of the flash lamps FL is also a horizontal plane.

[0058] A xenon flash lamp FL comprises a rod-shaped glass tube (discharge tube) filled with xenon gas and fitted with an anode and cathode connected to a capacitor at both ends, and a trigger electrode attached to the outer surface of the glass tube. Because xenon gas is an electrical insulator, electricity does not flow through the glass tube under normal conditions, even if a charge is stored in the capacitor. However, when a high voltage is applied to the trigger electrode, causing the insulation to break down, the electricity stored in the capacitor flows instantaneously through the glass tube, exciting the xenon atoms or molecules and emitting light. In such a xenon flash lamp FL, electrostatic energy previously stored in the capacitor is converted into extremely short light pulses of 0.1 to 100 milliseconds, enabling it to emit extremely intense light compared to continuous light sources such as halogen lamps HL. In other words, a flash lamp FL is a pulsed lamp that emits light instantaneously for an extremely short period of time, less than one second. The light emission time of the flash lamp FL can be adjusted by adjusting the coil constant of the lamp power supply that supplies power to the flash lamp FL.

[0059] Furthermore, reflector 52 is provided above the multiple flash lamps FL so as to cover them entirely. The basic function of reflector 52 is to reflect the flash light emitted from the multiple flash lamps FL toward the heat treatment space 65. Reflector 52 is made of an aluminum alloy plate, and its surface (the surface facing the flash lamps FL) is roughened by blasting.

[0060] The halogen heating unit 4, which is provided below the chamber 6, has a plurality of halogen lamps HL (40 in this embodiment) built into the inside of the housing 41. The halogen heating unit 4 heats the semiconductor wafer W by irradiating light from the plurality of halogen lamps HL from below the chamber 6 through a lower chamber window 64 into a heat treatment space 65.

[0061] FIG. 7 is a plan view showing the arrangement of multiple halogen lamps HL. 40 halogen lamps HL are arranged in two rows, upper and lower. 20 halogen lamps HL are arranged in the upper row, which is closer to the holder 7, and 20 halogen lamps HL are also arranged in the lower row, which is farther from the holder 7 than the upper row. Each halogen lamp HL is a rod-shaped lamp having a long cylindrical shape. In both the upper and lower rows, the 20 halogen lamps HL are arranged so that their longitudinal directions are parallel to each other along the main surface of the semiconductor wafer W held by the holder 7 (i.e., along the horizontal direction). Therefore, the plane formed by the arrangement of the halogen lamps HL in both the upper and lower rows is a horizontal plane.

[0062] 7, the halogen lamps HL are arranged more densely in the region facing the periphery of the semiconductor wafer W held by the holder 7 on both the upper and lower tiers than in the region facing the center of the semiconductor wafer W. That is, on both the upper and lower tiers, the halogen lamps HL are arranged at a shorter pitch in the periphery of the lamp arrangement than in the center. This allows a greater amount of light to be irradiated onto the periphery of the semiconductor wafer W, which is prone to temperature drop during heating due to light irradiation from the halogen heating unit 4.

[0063] The lamp group consisting of the halogen lamps HL on the upper row and the lamp group consisting of the halogen lamps HL on the lower row are arranged so as to intersect in a grid pattern. That is, a total of 40 halogen lamps HL are arranged so that the longitudinal direction of the 20 halogen lamps HL arranged on the upper row and the longitudinal direction of the 20 halogen lamps HL arranged on the lower row are perpendicular to each other.

[0064] A halogen lamp HL is a filament-type light source that emits light by passing electricity through a filament placed inside a glass tube, causing it to incandescent. The glass tube is filled with an inert gas, such as nitrogen or argon, containing trace amounts of halogen elements (iodine, bromine, etc.). The introduction of halogen elements makes it possible to set the filament temperature at a high temperature while preventing filament breakage. Therefore, compared to standard incandescent light bulbs, halogen lamps HL have the characteristics of a longer lifespan and the ability to continuously emit strong light. In other words, halogen lamps HL are continuous lamps that emit light continuously for at least one second. Furthermore, because halogen lamps HL are rod-shaped, they have a long lifespan, and by arranging them horizontally, they achieve excellent radiation efficiency toward the semiconductor wafer W above.

[0065] Also, a reflector 43 is provided below the two-tiered halogen lamps HL inside the housing 41 of the halogen heating unit 4 (FIG. 1). The reflector 43 reflects the light emitted from the multiple halogen lamps HL toward the heat treatment space 65.

[0066] As shown in FIG. 1, the chamber 6 is provided with two radiation thermometers: an upper radiation thermometer (first radiation thermometer) 25 and a lower radiation thermometer (second radiation thermometer) 20. FIG. 8 is a functional block diagram of the upper radiation thermometer 25 and the lower radiation thermometer 20. The upper radiation thermometer 25 is installed diagonally above the semiconductor wafer W held on the susceptor 74 and measures the temperature of the top surface of the semiconductor wafer W. The upper radiation thermometer 25 includes an infrared sensor 29 and a temperature measurement unit 27. The infrared sensor 29 receives infrared light emitted from the top surface of the semiconductor wafer W held on the susceptor 74. The infrared sensor 29 of the upper radiation thermometer 25 incorporates a photovoltaic element 28 so as to be able to respond to a sudden change in temperature of the top surface of the semiconductor wafer W at the moment when flash light is irradiated. The photovoltaic element 28 is an element that generates an electromotive force by the photoelectric effect when it receives light, and is formed of, for example, InSb (indium antimonide). The photovoltaic element 28 generates a higher electromotive force as the temperature of the light emitter of the received infrared light increases.

[0067] While conventional photoconductive elements have poor signal-to-noise ratios, especially in the low-frequency range, photovoltaic elements 28 exhibit favorable noise characteristics even in the low-frequency range. In other words, the upper radiation thermometer 25 incorporating photovoltaic elements 28 combines fast response with favorable noise characteristics in the low-frequency range. Furthermore, photoconductive elements require cooling below freezing to achieve high sensitivity. However, because the infrared sensor 29 is located on the chamber side 61 (as shown in Figure 1), the temperature around the photoconductive element rises during heat treatment, sometimes resulting in insufficient cooling of the photoconductive element. Insufficient cooling of the photoconductive element can prevent the upper radiation thermometer 25 from measuring the temperature of the top surface of the semiconductor wafer W, potentially rendering the heat treatment apparatus 1 inoperable. In contrast, some photovoltaic elements 28 offer sufficient sensitivity even at room temperature (10–60°C) without cooling. Therefore, the upper radiation thermometer 25 equipped with the photovoltaic element 28 that operates even at room temperature maintains a good overall thermal balance at room temperature, minimizing zero-point drift compared to conventional photoconductive elements and eliminating the need for an optical chopper. Furthermore, the photovoltaic element 28 that operates at room temperature does not require a Peltier element for cooling or a mechanism to prevent condensation due to cooling, so it can be made into a chip and miniaturized. As a result, the upper radiation thermometer 25 that employs the photovoltaic element 28 can be prevented from becoming larger and more complex. This is advantageous for installing the upper radiation thermometer 25 in a flash lamp annealing apparatus, which has many limitations on installation space.

[0068] The temperature measurement unit 27 includes an amplifier circuit 101, an A / D converter 102, a temperature conversion section 103, a profile creation section 105, and a storage section 107. A signal representing an electromotive force generated in the photovoltaic element 28 when the infrared sensor 29 receives infrared light emitted from the semiconductor wafer W is output to the amplifier circuit 101. The amplifier circuit 101 amplifies the electromotive force signal output from the infrared sensor 29 and transmits it to the A / D converter 102. The A / D converter 102 converts the electromotive force signal amplified by the amplifier circuit 101 into a digital signal.

[0069] The temperature conversion unit 103 and the profile creation unit 105 are functional processing units that are realized when a CPU (not shown) mounted on the temperature measurement unit 27 executes a predetermined processing program. The temperature conversion unit 103 performs predetermined arithmetic processing on the signal output from the A / D converter 102, that is, the signal indicating the intensity of the infrared light received by the infrared sensor 29, to convert it into a temperature. The temperature determined by the temperature conversion unit 103 is the temperature of the top surface of the semiconductor wafer W.

[0070] Furthermore, the profile creation unit 105 creates a temperature profile 108 that indicates the change in temperature over time of the upper surface of the semiconductor wafer W by sequentially storing the temperature data acquired by the temperature conversion unit 103 in a storage unit 107. A known storage medium such as a magnetic disk or memory can be used as the storage unit 107. The creation of the temperature profile will be described in more detail later.

[0071] Meanwhile, the lower radiation thermometer 20 is disposed diagonally below the semiconductor wafer W held on the susceptor 74 and measures the temperature of the underside of the semiconductor wafer W. The lower radiation thermometer 20 includes an infrared sensor 24 and a temperature measurement unit 22. The infrared sensor 24 receives infrared light radiated from the underside of the semiconductor wafer W held on the susceptor 74 through an opening 78. The infrared sensor 24 of the lower radiation thermometer 20 does not need to support high-speed measurement like the upper radiation thermometer 25, and therefore includes a thermopile, for example, as a light-receiving element. The infrared sensor 24 outputs a signal generated in response to the received light to the temperature measurement unit 22. The temperature measurement unit 22 includes an A / D converter, a temperature conversion circuit, etc. (not shown), and converts the signal indicating the intensity of the infrared light output from the infrared sensor 24 into a temperature. The temperature measured by the temperature measurement unit 22 is the temperature of the underside of the semiconductor wafer W.

[0072] The lower radiation thermometer 20 and the upper radiation thermometer 25 are electrically connected to the control unit 3, which is the controller for the entire heat treatment apparatus 1. The temperatures of the lower and upper surfaces of the semiconductor wafer W measured by the lower radiation thermometer 20 and the upper radiation thermometer 25, respectively, are transmitted to the control unit 3. The control unit 3 controls various operating mechanisms provided in the heat treatment apparatus 1. The hardware configuration of the control unit 3 is similar to that of a general computer. That is, the control unit 3 includes a CPU, which is a circuit that performs various arithmetic processing, a ROM, which is a read-only memory that stores basic programs, a RAM, which is a read / write memory that stores various information, and a magnetic disk that stores control software, data, and the like. The CPU of the control unit 3 executes a predetermined processing program, thereby causing the heat treatment apparatus 1 to perform processing.

[0073] A display unit 34 and an input unit 33 are also connected to the control unit 3. The control unit 3 displays various information on the display unit 34. An operator of the heat treatment device 1 can input various commands and parameters from the input unit 33 while checking the information displayed on the display unit 34. The input unit 33 can be, for example, a keyboard or a mouse. The display unit 34 can be, for example, a liquid crystal display. In this embodiment, a liquid crystal touch panel provided on the outer wall of the heat treatment device 1 is used as the display unit 34 and the input unit 33, so that both functions are combined.

[0074] In addition to the above configuration, the heat treatment apparatus 1 is equipped with various cooling structures to prevent excessive temperature rise in the halogen heating unit 4, flash heating unit 5, and chamber 6 due to the thermal energy generated by the halogen lamps HL and flash lamps FL during heat treatment of the semiconductor wafer W. For example, a water-cooled pipe (not shown) is provided in the wall of the chamber 6. The halogen heating unit 4 and flash heating unit 5 also have an air-cooled structure that creates a gas flow inside to remove heat. Air is also supplied to the gap between the upper chamber window 63 and the lamp light emission window 53 to cool the flash heating unit 5 and upper chamber window 63.

[0075] Next, a description will be given of the processing operation in the heat treatment apparatus 1. Fig. 9 is a flowchart showing the procedure of the processing operation in the heat treatment apparatus 1. The processing procedure for the semiconductor wafer W described below progresses as the control unit 3 controls each operating mechanism of the heat treatment apparatus 1.

[0076] First, prior to processing of the semiconductor wafer W, the gas supply valve 84 is opened, and the exhaust valve 89 is also opened to start supplying and exhausting gas to and from the chamber 6. When the valve 84 is opened, nitrogen gas is supplied to the heat treatment space 65 through the gas supply hole 81. When the valve 89 is opened, the gas inside the chamber 6 is exhausted through the gas exhaust hole 86. As a result, the nitrogen gas supplied from the upper part of the heat treatment space 65 inside the chamber 6 flows downward and is exhausted from the lower part of the heat treatment space 65.

[0077] Furthermore, by opening the valve 192, the gas inside the chamber 6 is also exhausted from the transfer opening 66. Furthermore, the atmosphere around the drive unit of the transfer mechanism 10 is also exhausted by an exhaust mechanism (not shown). Note that during the heat treatment of the semiconductor wafer W in the heat treatment apparatus 1, nitrogen gas is continuously supplied to the heat treatment space 65, and the supply amount is changed as appropriate depending on the treatment process.

[0078] Next, gate valve 185 is opened to open transfer opening 66, and a semiconductor wafer W to be processed is loaded into heat treatment space 65 in chamber 6 through transfer opening 66 by a transfer robot outside the apparatus (step S1). At this time, there is a risk that the atmosphere outside the apparatus may be drawn in as the semiconductor wafer W is loaded, but since nitrogen gas is continuously supplied to chamber 6, the nitrogen gas flows out from transfer opening 66, making it possible to minimize the inclusion of such external atmosphere.

[0079] The semiconductor wafer W carried in by the transfer robot advances to a position directly above the holder 7 and stops there. Then, the pair of transfer arms 11 of the transfer mechanism 10 move horizontally from the retracted position to the transfer operation position and rise, causing the lift pins 12 to pass through the through holes 79 and protrude from the upper surface of the holding plate 75 of the susceptor 74 to receive the semiconductor wafer W. At this time, the lift pins 12 rise to a position higher than the upper ends of the substrate support pins 77.

[0080] After the semiconductor wafer W is placed on the lift pins 12, the transfer robot exits the heat treatment space 65, and the transfer opening 66 is closed by the gate valve 185. Then, the pair of transfer arms 11 descend, transferring the semiconductor wafer W from the transfer mechanism 10 to the susceptor 74 of the holder 7, where it is held horizontally from below. The semiconductor wafer W is supported by a plurality of substrate support pins 77 erected on the holding plate 75 and held on the susceptor 74. The semiconductor wafer W is held on the holder 7 with its front surface, which is the surface to be processed, facing upward. A predetermined gap is formed between the back surface (the main surface opposite to the front surface) of the semiconductor wafer W supported by the plurality of substrate support pins 77 and the holding surface 75a of the holding plate 75. The pair of transfer arms 11, which have descended to below the susceptor 74, are retracted to a retracted position, i.e., inside the recess 62, by the horizontal movement mechanism 13.

[0081] After the semiconductor wafer W is held from below in a horizontal position by the susceptor 74 of the holder 7, which is made of quartz, the 40 halogen lamps HL of the halogen heating unit 4 are simultaneously turned on to begin preheating (assisted heating) (step S2). The halogen light emitted from the halogen lamps HL passes through the lower chamber window 64 and the susceptor 74, both of which are made of quartz, and is irradiated onto the underside of the semiconductor wafer W. The semiconductor wafer W is preheated by being irradiated with light from the halogen lamps HL, and its temperature rises. Note that the transfer arm 11 of the transfer mechanism 10 is retracted inside the recess 62, so it does not interfere with heating by the halogen lamps HL.

[0082] The temperature of the semiconductor wafer W, which is heated by the light irradiation from the halogen lamps HL, is measured by the lower radiation thermometer 20. The measured temperature of the semiconductor wafer W is transmitted to the control unit 3. The control unit 3 controls the output of the halogen lamps HL while monitoring whether the temperature of the semiconductor wafer W, which is heated by the light irradiation from the halogen lamps HL, has reached a predetermined preheating temperature T1. In other words, the control unit 3 feedback-controls the output of the halogen lamps HL based on the measurement value by the lower radiation thermometer 20 so that the temperature of the semiconductor wafer W becomes the preheating temperature T1. The lower radiation thermometer 20 serves as a control temperature sensor for controlling the output of the halogen lamps HL during preheating of the semiconductor wafer W.

[0083] After the temperature of the semiconductor wafer W reaches the preheating temperature T1, the control unit 3 temporarily maintains the semiconductor wafer W at the preheating temperature T1. Specifically, when the temperature of the semiconductor wafer W measured by the lower radiation thermometer 20 reaches the preheating temperature T1, the control unit 3 adjusts the output of the halogen lamps HL to maintain the temperature of the semiconductor wafer W at approximately the preheating temperature T1.

[0084] By performing preheating using the halogen lamps HL in this manner, the temperature of the entire semiconductor wafer W is uniformly raised to the preheating temperature T1. During preheating using the halogen lamps HL, the temperature of the peripheral portion of the semiconductor wafer W, where heat dissipation is more likely, tends to be lower than that of the central portion, but the arrangement density of the halogen lamps HL in the halogen heating unit 4 is higher in the region facing the peripheral portion of the semiconductor wafer W than in the region facing the central portion. As a result, a greater amount of light is irradiated onto the peripheral portion of the semiconductor wafer W, where heat dissipation is more likely, and the in-plane temperature distribution of the semiconductor wafer W during the preheating stage can be made uniform.

[0085] While preheating is being performed and the temperature of the semiconductor wafer W is being maintained at the preheating temperature T1, the emissivity of the upper radiation thermometer 25 is calibrated (step S3). The emissivity of the upper radiation thermometer 25 is calibrated based on the temperature measurement value of the lower radiation thermometer 20. The emissivity of the lower radiation thermometer 20 is accurately calibrated in advance. The emissivity of the lower radiation thermometer 20 is calibrated, for example, using a wafer with a thermocouple. Specifically, while the wafer with the thermocouple is heated to a constant temperature by light irradiation from a halogen lamp HL, the front surface temperature of the wafer with the thermocouple is measured by the thermocouple, and the back surface temperature is measured by the lower radiation thermometer 20. The emissivity of the lower radiation thermometer 20 is then calibrated so that the temperature measured by the lower radiation thermometer 20 matches the temperature measured by the thermocouple. The accurately calibrated emissivity is set in the lower radiation thermometer 20 in this manner.

[0086] During preheating, while the temperature of the semiconductor wafer W is maintained at the preheating temperature T1, the temperature of the front surface of the semiconductor wafer W is measured by the upper radiation thermometer 25, and the temperature of the back surface of the semiconductor wafer W is measured by the lower radiation thermometer 20. During the preheating stage, no temperature difference occurs between the front and back surfaces of the semiconductor wafer W, and the front surface temperature and the back surface temperature are the same. Therefore, the emissivity of the upper radiation thermometer 25 is calibrated so that the front surface temperature of the semiconductor wafer W measured by the upper radiation thermometer 25 matches the back surface temperature measured by the lower radiation thermometer 20. The calibrated emissivity is then set in the upper radiation thermometer 25. As a result, the emissivity of the front surface of the semiconductor wafer W to be processed is set in the upper radiation thermometer 25, and the emissivity set in the upper radiation thermometer 25 can be accurately calibrated.

[0087] After the emissivity calibration of the upper radiation thermometer 25 is completed, temperature measurement by the upper radiation thermometer 25 is started (step S4). The upper radiation thermometer 25 receives infrared light emitted from the surface of the semiconductor wafer W and measures the temperature of the surface. In this embodiment, the upper radiation thermometer 25 acquires data in two sampling rate (sampling interval) modes: a long-cycle mode (first measurement mode) and a short-cycle mode (second measurement mode). Data acquisition refers to the infrared sensor 29 of the upper radiation thermometer 25 acquiring a signal of the electromotive force generated in the photovoltaic element 28. In the long-cycle mode, data acquisition is performed at a sampling rate of, for example, 50 milliseconds (20 Hz). On the other hand, in the short-cycle mode, data acquisition is performed at a sampling rate shorter than the sampling rate in the long-cycle mode, for example, a sampling rate of 0.04 milliseconds (25 kHz). The upper radiation thermometer 25 executes the long-cycle mode and the short-cycle mode in parallel. That is, the upper radiation thermometer 25 acquires data at a sampling rate of 0.04 milliseconds, and also acquires data at a sampling rate of 50 milliseconds.

[0088] Of the two modes, data (electromotive force signals) acquired in the long-cycle mode at a sampling rate of 50 milliseconds are all sequentially converted into temperature values ​​by the temperature conversion unit 103. On the other hand, data acquired in the short-cycle mode at a sampling rate of 0.04 milliseconds has an extremely short sampling rate, so the temperature conversion unit 103 cannot keep up with the processing time to sequentially convert all of the data into temperature values. For this reason, data acquired in the short-cycle mode is temporarily stored in the memory unit 107 of the temperature measurement unit 27, and some of the data is extracted and converted into temperature values ​​by the temperature conversion unit 103, which will be described further below.

[0089] When a predetermined time has elapsed since the temperature of the semiconductor wafer W reached the preheating temperature T1, the flash lamps FL of the flash heating unit 5 irradiate the surface of the semiconductor wafer W held on the susceptor 74 with flash light (step S5). At this time, part of the flash light emitted from the flash lamps FL heads directly into the chamber 6, and the other part is reflected by the reflector 52 before heading into the chamber 6, and the semiconductor wafer W is flash-heated by the irradiation of these flash lights.

[0090] Flash heating is performed by irradiating a flash of light (flash of light) from flash lamps FL, which can raise the surface temperature of the semiconductor wafer W in a short time. That is, the flash of light irradiated from the flash lamps FL is an extremely short, intense flash with an irradiation time of approximately 0.1 milliseconds to 100 milliseconds, in which electrostatic energy previously stored in a capacitor is converted into an extremely short light pulse. The surface temperature of the semiconductor wafer W flash-heated by the irradiation of the flash light from the flash lamps FL instantaneously rises to a processing temperature T2 of 1000°C or higher and then rapidly drops.

[0091] From preheating through flash heating, the surface temperature of the semiconductor wafer W is continuously measured by the upper radiation thermometer 25. During the preheating stage, the rate at which the temperature of the semiconductor wafer W is increased by the halogen lamps HL is significantly smaller than the rate at which the temperature is increased during flash heating, and the change in the surface temperature of the semiconductor wafer W is also gradual, so temperature measurement in the long cycle mode is preferred. In contrast, during flash heating, the surface temperature of the semiconductor wafer W rises suddenly and instantaneously, so the maximum surface temperature that can be reached may not be captured in the long cycle mode, and temperature measurement in the short cycle mode is therefore preferred.

[0092] As described above, upper radiation thermometer 25 executes the long-cycle mode and the short-cycle mode in parallel. Of these, all data acquired in the long-cycle mode is converted into temperature values ​​by temperature conversion unit 103. As a result, the surface temperature of semiconductor wafer W during preheating is measured by upper radiation thermometer 25.

[0093] On the other hand, not all of the data acquired in the short cycle mode is converted to temperature values; only a portion is converted to temperature values ​​by the temperature conversion unit 103. Because the short cycle mode is unnecessary except during flash heating, it is necessary to extract some data before and after flash heating from the data acquired in the short cycle mode. FIG. 10 is a diagram for explaining the extraction of a portion from the data acquired in the short cycle mode. FIG. 10 shows the electromotive force data acquired in the short cycle mode and stored in the memory unit 107, etc., in chronological order according to the time of acquisition. The electromotive force generated in the photovoltaic element 28 of the upper pyrometer 25 increases as the surface temperature of the semiconductor wafer W, which is the measurement target, increases. In other words, if the surface temperature of the semiconductor wafer W increases rapidly during flash heating, the electromotive force data value acquired by the upper pyrometer 25 also increases.

[0094] In this embodiment, a threshold value Vt is set for the electromotive force data to trigger extraction. The threshold value Vt may be, for example, a value obtained by adding a predetermined margin to the electromotive force value corresponding to the preheating temperature T1 during preheating before flash light irradiation. Since the preheating temperature T1 is known from the processing recipe, it is possible to convert the preheating temperature T1 into an electromotive force value. In the example of FIG. 10 , the electromotive force data acquired at time t1 reaches the threshold value Vt. Data acquired in the short cycle mode is extracted for a 120-millisecond period, from 20 milliseconds before to 100 milliseconds after time t1, at which the data value reaches the threshold value Vt. Since the sampling rate in the short cycle mode is 0.04 milliseconds, 3,000 data points are extracted. The temperature conversion unit 103 then converts the 3,000 data points extracted from the 120-millisecond period of data acquired in the short cycle mode into temperature values. In this way, by converting into temperature only the data acquired in the short cycle mode during a certain period of time extending from before to after the time t1 when the data value reaches the predetermined threshold value Vt, the change in the surface temperature of the semiconductor wafer W during flash heating can be accurately measured by the upper radiation thermometer 25.

[0095] Next, the profile creation unit 105 creates a temperature profile 108 that shows the time change in the surface temperature of the semiconductor wafer W from preheating to flash heating (step S6). The surface temperature of the semiconductor wafer W is measured by the upper radiation thermometer 25. The upper radiation thermometer 25 measures the surface temperature of the semiconductor wafer W in two modes: long-period mode and short-period mode. Because the sampling rate in the long-period mode is 50 milliseconds, the long-period mode is sufficient to track temperature changes during preheating of the semiconductor wafer W by light irradiation from the halogen lamp HL and is also suitable for capturing the overall temperature change of the semiconductor wafer W. However, the long-period mode alone cannot track instantaneous temperature changes during flash heating of the semiconductor wafer W by flash light irradiation with an irradiation time of 0.1 milliseconds or more and 100 milliseconds or less. In other words, creating a temperature profile using only temperature values ​​converted from data acquired in the long-period mode does not accurately depict the temperature change of the semiconductor wafer W, especially during flash heating. For this reason, the surface temperature of the semiconductor wafer W during flash heating is measured in a short-period mode with a sampling rate of 0.04 milliseconds.

[0096] Profile creation unit 105 uses the temperature values ​​obtained by temperature-converting data acquired in the long-cycle mode as a base, and interpolates (combines) the temperature values ​​obtained by temperature-converting data acquired in the short-cycle mode to create temperature profile 108. As a result, temperature profile 108 can accurately depict the temperature change in the surface temperature of semiconductor wafer W during flash heating, and can accurately depict the temperature change in semiconductor wafer W from pre-heating to flash heating.

[0097] Next, the control unit 3 displays the created temperature profile 108 on the display unit 34 (step S7). FIG. 11 is a diagram showing the temperature profile 108 displayed on the display unit 34. The temperature profile 108 was obtained by measuring the temperature change in the surface temperature of the semiconductor wafer W from preheating to flash heating using one upper radiation thermometer 25. The temperature profile 108 was also obtained by interpolating the temperature values ​​obtained by temperature-converting the data obtained in the long-cycle mode to the temperature values ​​obtained by temperature-converting the data obtained in the short-cycle mode, and thus appropriately depicts the rapid temperature change in the surface temperature of the semiconductor wafer W during flash heating.

[0098] After the flash heating process is completed, the halogen lamps HL are turned off after a predetermined time has elapsed. This causes the temperature of the semiconductor wafer W to rapidly decrease from the preheating temperature T1. The temperature of the semiconductor wafer W during this decrease is measured by the lower radiation thermometer 20, and the measurement result is transmitted to the control unit 3. The control unit 3 monitors, based on the measurement result of the lower radiation thermometer 20, whether the temperature of the semiconductor wafer W has decreased to a predetermined temperature. After the temperature of the semiconductor wafer W has decreased to or below the predetermined temperature, the pair of transfer arms 11 of the transfer mechanism 10 again move horizontally from the retracted position to the transfer operation position and rise, causing the lift pins 12 to protrude from the upper surface of the susceptor 74 and receive the heat-treated semiconductor wafer W from the susceptor 74. Next, the transfer opening 66, which had been closed by the gate valve 185, is opened, and the semiconductor wafer W placed on the lift pins 12 is removed from the chamber 6 by a transfer robot external to the apparatus, completing the heat treatment of the semiconductor wafer W (step S8).

[0099] In this embodiment, the surface temperature of the semiconductor wafer W is measured using an upper radiation thermometer 25 incorporating a photovoltaic element 28. As previously mentioned, the photoconductive element used in conventional radiation thermometers for measuring wafer surface temperature has a poor signal-to-noise ratio in the low-frequency range and requires cooling to below freezing, necessitating the use of an optical chopper. However, achieving high-speed chopping on the order of microseconds requires the rotation of a large blade at high speed, which is not only impractical but also significantly increases the size of the temperature measurement system. For this reason, in practice, instead of using an optical chopper, a differential circuit is used to detect the rapid temperature change caused by flash light irradiation. The use of a differential circuit makes it impossible to measure the temperature during preheating, which exhibits gradual temperature changes due to light irradiation from the halogen lamp HL.

[0100] The upper radiation thermometer 25 equipped with the photovoltaic element 28 can achieve a good signal-to-noise ratio even in the low-frequency range and can be used at room temperature. Therefore, the upper radiation thermometer 25 does not need to be equipped with an optical chopper or a differential circuit. The absence of a differential circuit also makes it possible to measure the temperature of the semiconductor wafer W during preheating, when the temperature changes gradually. Therefore, by using the upper radiation thermometer 25 equipped with the photovoltaic element 28, it is possible to measure the surface temperature of the semiconductor wafer W with a simple configuration both during preheating by light irradiation from the halogen lamp HL and during flash light irradiation from the flash lamp FL.

[0101] Furthermore, in this embodiment, the emissivity of the upper radiation thermometer 25 is calibrated using the lower radiation thermometer 20 during preheating before flash light irradiation. When flash light is irradiated, a rapid rise in temperature on the surface of the semiconductor wafer W may cause warping or vibration of the semiconductor wafer W, which may prevent accurate measurement. By calibrating the emissivity of the upper radiation thermometer 25 before flash light irradiation, it is possible to measure the temperature of the semiconductor wafer W using the lower radiation thermometer 20 and the upper radiation thermometer 25 and appropriately calibrate the emissivity of the upper radiation thermometer 25 without being affected by wafer warping or vibration.

[0102] In this embodiment, the upper pyrometer 25 acquires data at two sampling rates: a long-cycle mode and a short-cycle mode. The long-cycle mode is suitable for preheating the semiconductor wafer W using the halogen lamps HL, which have a gradual temperature change. On the other hand, the short-cycle mode is suitable for flash-heating the semiconductor wafer W using the flash lamps FL, which have a rapid temperature change. In other words, by acquiring data in the long-cycle mode and the short-cycle mode, the upper pyrometer 25 can measure the temperature of the semiconductor wafer W appropriately in response to both preheating and flash heating.

[0103] Furthermore, the upper pyrometer 25 measures the temperature of the semiconductor wafer W during both preheating and flash heating using common hardware. Because the frequency band and signal strength of the signal output from the infrared sensor 29 are completely different during preheating and flash heating, it is necessary to optimize the hardware for each to achieve a good S / N ratio. In this embodiment, a digital filter 104 is incorporated into the temperature conversion unit 103 to process the signal output from the infrared sensor 29 during both preheating and flash heating using common hardware (see FIG. 8 ). Specifically, the A / D converter 102 converts the electromotive force signal output from the infrared sensor 29, which incorporates the photovoltaic element 28, into a digital signal, which is then processed using the digital filter 104. While changing the filter characteristics of an analog filter requires changing the entire hardware, a digital filter can achieve different filter characteristics by changing the software incorporated into the same hardware. In this embodiment, by changing the software incorporated into the common hardware, a good S / N ratio can be achieved during preheating and flash heating by using a digital filter 104 with different characteristics. Specifically, for example, when preheating using a halogen lamp HL, an IIR (Infinite Impulse Response) filter is used as the digital filter 104, and when flash heating using a flash lamp FL, an FIR (Finite Impulse Response) filter is used as the digital filter 104.

[0104] Although the embodiments of the present invention have been described above, various modifications other than those described above can be made to the present invention without departing from the spirit of the present invention. For example, in the above embodiment, the upper radiation thermometer 25 is provided with the photovoltaic element 28, but the lower radiation thermometer 20 may be provided with the photovoltaic element 28. Since the photovoltaic element 28 is capable of measuring both during preheating and flash heating, the lower radiation thermometer 20 equipped with the photovoltaic element 28 may be used to measure the temperature of the backside of the semiconductor wafer W during preheating by the halogen lamps HL.

[0105] In the above embodiment, the sampling rate in the long-cycle mode is 50 milliseconds and the sampling rate in the short-cycle mode is 0.04 milliseconds, but this is not limited to this and each sampling rate can be set to an appropriate value. The sampling rates in the long-cycle mode and the short-cycle mode can be set appropriately depending on processing conditions such as the rate of temperature rise of the semiconductor wafer W due to light irradiation from the halogen lamps HL and the irradiation time of the flash light.

[0106] In the above embodiment, the threshold value Vt that triggers data extraction in the short cycle mode is a value obtained by adding a predetermined margin to the electromotive force value corresponding to the preheating temperature T1. However, this is not limited to this. For example, in the electromotive force data plotted in a time series as shown in FIG. 10 , the threshold value Vt may be a value obtained by adding a predetermined margin to the electromotive force value x seconds (x is an arbitrary value, for example, 50 milliseconds) before the current time (any point in time). This is equivalent to triggering data extraction when the slope of the electromotive force value exceeds a predetermined value. If the threshold value Vt is a value obtained by adding a predetermined margin to the electromotive force value corresponding to the preheating temperature T1, there is a risk of false detection of the trigger due to, for example, overshooting of the temperature control during preheating. However, such false detection can be prevented by setting the threshold value Vt to a value obtained by adding a predetermined margin to the electromotive force value x seconds before the current time. Alternatively, the control unit 3 issues a signal to execute flash light irradiation several seconds before the flash lamp FL emits light, and the threshold value Vt may be a value obtained by adding a predetermined margin to the electromotive force value at the time the signal is issued. Furthermore, data for a predetermined period from the time the signal to execute flash light irradiation is issued may be converted into temperature.

[0107] In addition, in the above embodiment, an IIR filter is used as the digital filter 104 during preheating and an FIR filter is used during flash heating, but this is not limited to this, and for example, a state space filter or the like may be used.

[0108] Alternatively, multiple upper radiation thermometers 25 may be provided above the semiconductor wafer W held on the susceptor 74. The measurement positions of the multiple upper radiation thermometers 25 are different from one another. Each of the multiple upper radiation thermometers 25 includes a photovoltaic element 28. In this case, emissivity calibration may be performed on one of the multiple upper radiation thermometers 25 based on the temperature measurement value of the lower radiation thermometer 20, as in the above embodiment, and the calibrated emissivity may be reflected in the other upper radiation thermometers 25. The temperature measurement position of the semiconductor wafer W by the upper radiation thermometer 25, which is the subject of emissivity calibration, and the temperature measurement position of the backside of the semiconductor wafer W by the lower radiation thermometer 20 are preferably symmetrical across the semiconductor wafer W. This minimizes errors in emissivity calibration due to the in-plane temperature distribution of the semiconductor wafer W. Furthermore, it is preferable that the measurement conditions, such as the field of view area and angle, be consistent for all upper radiation thermometers 25. By providing multiple upper radiation thermometers 25, temperatures at multiple points on the surface of the semiconductor wafer W can be measured, enabling multi-point control.

[0109] Furthermore, in the above embodiment, the photovoltaic element 28 is formed of InSb, but this is not limited thereto, and the photovoltaic element 28 may be formed using InAsSb (indium arsenic antimony) or InAs (indium arsenic).

[0110] Furthermore, in the above embodiment, the flash heating unit 5 is provided with 30 flash lamps FL, but this is not limited to this and the number of flash lamps FL can be any number. Furthermore, the flash lamps FL are not limited to xenon flash lamps and may be krypton flash lamps. Furthermore, the number of halogen lamps HL provided in the halogen heating unit 4 is not limited to 40 and can be any number.

[0111] In addition, in the above embodiment, a filament-type halogen lamp HL is used as a continuously lit lamp that emits light continuously for one second or more to perform the heat treatment to maintain the substrate at a predetermined temperature, but this is not limited to this, and the heat treatment may be performed using a discharge arc lamp (e.g., a xenon arc lamp) or an LED lamp as a continuously lit lamp instead of the halogen lamp HL. [Explanation of symbols]

[0112] 1. Heat treatment equipment 3. Control Unit 4 Halogen heating section 5 Flash heating section 6 chambers 7 Holding part 10 Transfer mechanism 20 Lower radiation thermometer 25 Upper radiation thermometer 27 Temperature measurement unit 28 Photovoltaic element 33 Input section 34 Display section 63 Upper chamber window 64 Lower chamber window 65 Heat Treatment Space 74 Susceptor 101 Amplifier circuit 102 A / D converter 103 Temperature conversion unit 104 Digital Filter 105 Profile Creation Department 107 Storage section 108 Temperature Profile FL flash lamp HL halogen lamp W Semiconductor wafer

Claims

1. A heat treatment method for heating a substrate by irradiating the substrate with flash light, comprising: a housing step of housing the substrate in the chamber; a preheating step of preheating the substrate by irradiating it with light from a continuously lit lamp; a flash heating step of irradiating a surface of the substrate with flash light from a flash lamp; Equipped with a first radiation thermometer including a photovoltaic element that generates an electromotive force by a photoelectric effect, measuring the temperature of the substrate based on a signal of an electromotive force generated in the photovoltaic element when infrared light radiated from the substrate is received by the photovoltaic element; The first radiation thermometer is a first measurement mode in which data is acquired at a first sampling interval; a second measurement mode in which data is acquired at a second sampling interval shorter than the first sampling interval; in parallel to measure the temperature of the substrate; processing a signal output from the photovoltaic element using a digital filter; A heat treatment method characterized in that an IIR filter is used as a digital filter in the preheating step, and an FIR filter is used in the flash heating step.

2. The heat treatment method according to claim 1, a heat treatment method comprising: measuring a temperature of the front surface of the substrate with the first radiation thermometer and measuring a temperature of the rear surface of the substrate with a second radiation thermometer whose emissivity has been calibrated during the preheating step; and calibrating the emissivity set in the first radiation thermometer based on the temperature of the substrate measured with the second radiation thermometer.

3. The heat treatment method according to claim 1, A heat treatment method characterized in that, of the data acquired in the second measurement mode, data acquired during a certain period of time spanning before and after the point at which the data value reaches a predetermined threshold is converted into temperature.

4. The heat treatment method according to claim 3, A heat treatment method comprising converting all data acquired in the first measurement mode into temperatures.

5. The heat treatment method according to claim 4, A heat treatment method characterized in that the temperature value obtained by converting the data acquired in the first measurement mode into a temperature value obtained by converting the data acquired in the second measurement mode is interpolated and displayed on a display unit.

6. A thermal treatment apparatus for heating a substrate by irradiating the substrate with flash light, a chamber for housing the substrate; a continuously lit lamp that irradiates light onto the substrate to preheat the substrate; a flash lamp for flash-heating the substrate by irradiating a surface of the substrate with flash light; a first radiation thermometer including a photovoltaic element that generates an electromotive force by a photoelectric effect, and that measures the temperature of the substrate based on a signal of an electromotive force generated in the photovoltaic element when infrared light emitted from the substrate is received; Equipped with The first radiation thermometer is a first measurement mode in which data is acquired at a first sampling interval; a second measurement mode in which data is acquired at a second sampling interval shorter than the first sampling interval; in parallel to measure the temperature of the substrate; processing a signal output from the photovoltaic element using a digital filter; The heat treatment apparatus is characterized in that an IIR filter is used as a digital filter in the preheating and an FIR filter is used in the flash heating.

7. 7. The heat treatment apparatus according to claim 6, a second radiation thermometer for measuring the temperature of the substrate; a heat treatment apparatus characterized in that, during the preheating, the first radiation thermometer measures the temperature of the front surface of the substrate and the second radiation thermometer, which has been calibrated for emissivity, measures the temperature of the back surface of the substrate, and the emissivity set in the first radiation thermometer is calibrated based on the temperature of the substrate measured by the second radiation thermometer.

8. 7. The heat treatment apparatus according to claim 6, A heat treatment apparatus characterized by further comprising a temperature conversion unit that converts, into temperature, data acquired in the second measurement mode over a certain period of time spanning before and after the point at which the data value reaches a predetermined threshold.

9. 9. The heat treatment apparatus according to claim 8, The heat treatment apparatus, wherein the temperature conversion unit converts all data acquired in the first measurement mode into temperatures.

10. 10. The heat treatment apparatus according to claim 9, a display unit that displays a temperature value obtained by temperature-converting data acquired in the second measurement mode interpolated with a temperature value obtained by temperature-converting data acquired in the first measurement mode.

Images