Top ring of polishing device and polishing device

Abstract

To provide a technique capable of suppressing falling-off of a fitting part of a band from a groove during use of a top ring.SOLUTION: In a top ring 10 of a polishing device 100, a groove 15 in which a fitting part 71a, 71b of a band 70 fits is provided in at least one of an outer peripheral wall 11 of a retainer member 30 and an outer peripheral wall 11 of a pressing mechanism 40. The groove has, in a sectional view, a groove opening, a groove bottom facing the groove opening, a first groove side wall connecting the groove opening and the groove bottom, and a second groove side wall connecting the groove opening and the groove bottom and facing the first groove side wall, and is a dovetail groove configured to be wider as a gap between the first and second groove side walls is closer to the groove bottom. The fitting part is configured to touch the first and second groove side walls in a state where the fitting part of the band fits in the dovetail groove.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a top ring of a polishing apparatus and a polishing apparatus. [Background technology]

[0002] Conventionally, a known polishing apparatus for polishing a substrate includes a top ring that holds a substrate and a polishing table that holds a polishing pad for polishing the substrate (see, for example, Patent Document 1). The top ring of this polishing apparatus includes a top ring body having a substrate support surface that supports the upper surface of the substrate, a retainer member that is disposed around the periphery of the substrate support surface and holds the outer edge of the substrate, a pressing mechanism that is disposed above the retainer member and configured to press the retainer member downward, and a band that extends from the outer peripheral wall of the retainer member to the outer peripheral wall of the pressing mechanism. Grooves are formed in the outer peripheral walls of the retainer member and the pressing mechanism, and fitting portions of the band (fitting portions provided at both ends of the band in Patent Document 1) fit into these grooves. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2020-19115 Summary of the Invention [Problem to be solved by the invention]

[0004] In the top ring of the conventional polishing apparatus described above, there is a risk that the band may come off the retainer member or the pressing mechanism when the top ring is in use.

[0005] The present invention has been made in consideration of the above, and one of its objects is to provide a technology that can prevent the band from coming off the retainer member or pressing mechanism when the top ring is in use. [Means for solving the problem]

[0006] (Aspect 1) In order to achieve the above object, a top ring of a polishing apparatus according to one aspect of the present invention comprises: a top ring body having a substrate support surface that supports an upper surface of a substrate; a retainer member disposed so as to surround the outer periphery of the substrate support surface and holding the outer edge of the substrate; a pressing mechanism disposed above the retainer member and configured to press the retainer member downward; and a band disposed from the outer periphery wall of the retainer member to the outer periphery wall of the pressing mechanism and having at least one fitting portion. At least one of the peripheral walls is provided with a groove into which the fitting portion of the band fits, and the groove is a dovetail groove that, in a cross-sectional view, has a groove opening, a groove bottom facing the groove opening, a first groove side wall connecting the groove opening and the groove bottom, and a second groove side wall connecting the groove opening and the groove bottom and facing the first groove side wall, and is configured so that the distance between the first groove side wall and the second groove side wall becomes wider as it approaches the groove bottom, and when the fitting portion of the band is fitted into the dovetail groove, the fitting portion is configured to contact the first groove side wall and the second groove side wall.

[0007] According to this aspect, the groove into which the fitting portion of the band fits is a dovetail groove as described above, so the degree of fit between the fitting portion of the band and the groove can be made stronger than when the groove into which the fitting portion of the band fits is not a dovetail groove (for example, when the groove is a rectangular groove with a constant distance between a pair of groove side walls). This prevents the fitting portion of the band from coming off the groove when the top ring is in use. As a result, the band can be prevented from coming off the retainer member or the pressing mechanism when the top ring is in use.

[0008] (Aspect 2) In the above-mentioned aspect 1, the fitting portion of the band may have a first convex portion that contacts the side wall of the first groove and a second convex portion that contacts the side wall of the second groove, and a V-shaped groove having a V-shaped cross section may be provided between the first convex portion and the second convex portion.

[0009] (Aspect 3) In the above-mentioned first or second aspect, a stretchable portion that can stretch in the vertical direction may be provided in a part of the band.

[0010] According to this aspect, when the retainer member is displaced in the vertical direction, the stretchable portion of the band can stretch in the vertical direction, thereby effectively preventing the fitting portion of the band from coming out of the groove.

[0011] (Aspect 4) In any one of the above-mentioned aspects 1 to 3, the groove may be provided in only one of the outer peripheral wall of the retainer member and the outer peripheral wall of the pressing mechanism.

[0012] (Aspect 5) In any one of the above-mentioned aspects 1 to 3, the groove may be provided in both the outer peripheral wall of the retainer member and the outer peripheral wall of the pressing mechanism.

[0013] (Aspect 6) In any one of the above aspects 1 to 3, the groove may be provided only in the outer peripheral wall of the retainer member out of the outer peripheral wall of the retainer member and the outer peripheral wall of the pressing mechanism, the top ring body may have an upper member provided to cover an upper part of the pressing mechanism, one end of the band may be sandwiched between the upper member and the pressing mechanism, and the fitting portion of the band may be provided at the other end of the band.

[0014] According to this aspect, the fitting portion provided on the other end of the band fits into the groove (dovetail groove), which prevents the fitting portion from coming out of the groove. Furthermore, because one end of the band is clamped between the upper member and the pressing mechanism, the one end of the band can also be prevented from coming out. Furthermore, according to this aspect, for example, during maintenance of the top ring, the fitting portion of the band can be removed from the groove, which makes it easy to separate, for example, the retainer member from the top ring. This improves the ease of maintenance of the top ring.

[0015] (Aspect 7) In any one of the above-mentioned aspects 1 to 6, the groove opening may be provided with a recess through which a processing tool for processing the groove passes when inserted into the groove from the groove opening.

[0016] According to this aspect, the machining tool can be easily inserted into the inside of the groove through the groove opening where the recess is provided, so that machining of the groove can be easily carried out.

[0017] (Aspect 8) In any one of the above-mentioned embodiments 1 to 7, the substrate may be a rectangular substrate.

[0018] (Aspect 9) In order to achieve the above-mentioned object, a top ring of a polishing apparatus according to one aspect of the present invention comprises a top ring body having a substrate support surface that supports an upper surface of a substrate, a retainer member arranged to surround the outer periphery of the substrate support surface and hold the outer edge of the substrate, a pressing mechanism arranged above the retainer member and configured to press the retainer member downward, and a band arranged from the outer peripheral wall of the retainer member to the outer peripheral wall of the pressing mechanism and having a fitting portion, wherein the outer peripheral wall of the retainer member has a groove into which the fitting portion of the band fits, the top ring body has an upper member arranged to cover the upper part of the pressing mechanism, and one end of the band is clamped between the upper member and the pressing mechanism, and the fitting portion of the band is provided at the other end of the band.

[0019] According to this aspect, one end of the band is clamped between the upper member and the pressing mechanism, which prevents the one end of the band from coming off the pressing mechanism when the top ring is in use. That is, it is possible to prevent the band from coming off the pressing mechanism when the top ring is in use.

[0020] (Aspect 10) To achieve the above object, a polishing apparatus according to one aspect of the present invention includes a top ring according to any one of aspects 1 to 9 above, and a polishing table that holds a polishing pad for polishing the substrate held by the top ring.

[0021] According to this aspect, it is possible to prevent the band from coming off the retainer member or the pressing mechanism when the top ring is in use. [Brief explanation of the drawings]

[0022] [Figure 1] Fig. 1(A) is a schematic diagram showing the main configuration of a polishing apparatus according to an embodiment, and Fig. 1(B) is a schematic plan view (top view) of the polishing apparatus main body. [Figure 2] FIG. 2 is a schematic perspective view of a top ring according to the embodiment. [Figure 3] FIG. 2 is a schematic cross-sectional view of a top ring according to an embodiment. [Figure 4] FIG. 4 is a schematic enlarged cross-sectional view of a portion B1 of FIG. 3. [Figure 5] Fig. 5(A) is a schematic enlarged cross-sectional view of portions B2 and B3 in Fig. 4. Fig. 5(B) is a schematic exploded view of the configuration of portion B2 in Fig. 4. [Figure 6] 10 is an enlarged cross-sectional view schematically showing a portion of a top ring of a polishing apparatus according to a first modified example of the embodiment. FIG. [Figure 7] Fig. 7(A) is a schematic diagram showing a peripheral configuration of a groove of a pressing mechanism of a top ring according to Modification 2 of the embodiment, as viewed from the front, and Fig. 7(B) is a schematic front view of a processing tool. [Figure 8] FIG. 11 is a schematic view showing a part of the outer peripheral wall of the top ring according to Modification 2 of the embodiment, viewed from the −X direction. DETAILED DESCRIPTION OF THE INVENTION

[0023] (Embodiment) Hereinafter, embodiments of the present invention will be described with reference to the drawings. The drawings are diagrammatically illustrated to facilitate understanding of the features, and the dimensional ratios of the components may not be the same as those in reality. The drawings also show XYZ Cartesian coordinates as necessary. In these Cartesian coordinates, the Z direction corresponds to the upward direction, and the -Z direction corresponds to the downward direction (the direction in which gravity acts).

[0024] FIG. 1(A) is a schematic diagram showing the main components of a polishing apparatus 100 according to this embodiment. 1(B) is a schematic plan view (top view) of the polishing apparatus main body 101. The polishing apparatus 100 according to this embodiment is a polishing apparatus capable of performing chemical mechanical polishing (CMP). Specifically, the polishing apparatus 100 illustrated in FIG. 1(A) includes the polishing apparatus main body 101 and a control device 120.

[0025] The polishing apparatus main body 101 mainly includes a polishing table 102, a top ring 10, and a dresser 104. The polishing table 102 is configured to hold a polishing pad Pd and rotate. Specifically, the polishing table 102 according to this embodiment is configured as a disk-shaped member, and the polishing pad Pd is attached to its upper surface. The upper surface (front surface) of the polishing pad Pd corresponds to the polishing surface. The polishing table 102 is connected to a table rotation shaft 103. The table rotation shaft 103 is rotated by a drive mechanism (e.g., a rotary motor), thereby rotating the polishing table 102. During polishing, a substrate Wf (described later) is pressed against the polishing pad Pd. This polishes the substrate Wf. The rotation of the polishing table 102 is controlled by a control device 120. Note that "R1" shown in FIG. 1B is an example of the rotation direction of the polishing table 102.

[0026] The specific type of polishing pad Pd is not particularly limited, and various polishing pads can be used, such as a hard foam type polishing pad, a nonwoven fabric type polishing pad, and a suede type polishing pad.

[0027] In this embodiment, a rectangular substrate having corners is used as an example of the substrate Wf. The number of corners of this rectangular substrate is not particularly limited as long as it is three or more, but in this embodiment, it is four as an example. That is, the substrate Wf according to this embodiment is a rectangular substrate. However, the shape of the substrate Wf is not limited to such a rectangular shape, and may be, for example, a circle (including an ellipse) without corners.

[0028] The top ring 10 is a member for holding the substrate Wf. The top ring 10 is configured to rotate while pressing the lower surface of the substrate Wf (i.e., the surface to be polished) against the polishing pad Pd. Specifically, the top ring 10 is connected to a ring rotation shaft 105. The top ring 10 rotates when the ring rotation shaft 105 is rotated by a drive mechanism (e.g., a rotation motor). Note that "R2" shown in FIG. 1(B) is an example of the rotation direction of the top ring 10.

[0029] The top ring 10 according to this embodiment is configured to oscillate relative to the polishing pad Pd. Specifically, a ring rotation shaft 105 of the top ring 10 is connected to a substrate oscillation shaft 107 via a substrate oscillation arm 106. When the substrate oscillation shaft 107 is driven to oscillate by a drive mechanism, the substrate oscillation arm 106 oscillates in an arc around the substrate oscillation shaft 107 (i.e., rotates clockwise and counterclockwise), causing the top ring 10 to oscillate in the same manner. The rotation and oscillation of the top ring 10 are controlled by a control device 120. Note that "SW1" shown in FIG. 1(B) is an example of the oscillation direction of the top ring 10.

[0030] The dresser 104 is a member for dressing the polishing surface of the polishing pad Pd. Abrasive grains (e.g., diamonds) are arranged on the underside of the dresser 104. The dresser 104 is connected to a dresser rotation shaft 108. The dresser 104 rotates when the dresser rotation shaft 108 is rotated by a drive mechanism (e.g., a rotary motor). Note that "R3" shown in FIG. 1(B) is an example of the rotation direction of the dresser 104.

[0031] The dresser 104 according to this embodiment is configured to swing relative to the polishing pad Pd. Specifically, a dresser rotation shaft 108 of the dresser 104 is connected to a dresser swing shaft 110 via a dresser swing arm 109. When the dresser swing shaft 110 is driven to swing by a drive mechanism (e.g., a swing motor), the dresser swing arm 109 swings around the dresser swing shaft 110, and as a result, the dresser 104 also swings. The rotation and swing operations of the dresser 104 are controlled by a control device 120. Note that "SW2" shown in FIG. 1B is an example of the swing direction of the dresser 104.

[0032] The polishing apparatus 100 includes a slurry supply mechanism (not shown) for supplying a slurry (polishing slurry) to the polishing surface of the polishing pad Pd. The slurry may be a solution containing abrasive grains such as silicon oxide, aluminum oxide, or cerium oxide. The specific type of slurry may be appropriately determined depending on the type of substrate Wf. The slurry may be supplied from above or below the polishing pad Pd, or from both above and below. The polishing apparatus 100 polishes the substrate Wf by rotating the polishing table 102 and the top ring 10 in the presence of the slurry.

[0033] The control device 120 comprehensively controls the operation of the polishing apparatus 100. Specifically, the control device 120 according to this embodiment includes a microcomputer. This microcomputer includes a CPU (Central Processing Unit) 121 as a processor, a storage device 122 as a non-transitory storage medium, and the like. In the control device 120, the CPU 121 as a processor operates based on commands from a program stored in the storage device 122, thereby controlling the operation of the polishing apparatus 100.

[0034] FIG. 2 is a schematic perspective view of the top ring 10. The top ring 10 according to this embodiment has, for example, a rectangular parallelepiped shape. The outer peripheral wall 11 of the top ring 10 has a plurality of corner portions 12 and connecting walls 13 connecting adjacent corner portions 12. In this embodiment, the number of corner portions 12 is four. However, the number of corner portions 12 is not limited to four and may be three, five, or more. Alternatively, the top ring 10 may have an outer shape (e.g., circular) without corner portions 12. The corner portions 12 may be rounded (in this case, the corner portions 12 are rounded). For example, the connecting wall 13 according to this embodiment has a flat surface. The outer peripheral wall 11 of the top ring 10 includes the outer peripheral wall of a retainer member 30 and the outer peripheral wall of a pressing mechanism 40, which will be described later.

[0035] Fig. 3 is a schematic cross-sectional view of the top ring 10, specifically, a cross-section taken along line A1-A1 in Fig. 2. Fig. 4 is a schematic enlarged cross-sectional view of portion B1 in Fig. 3. Referring to Figs. 3 and 4, the top ring 10 according to this embodiment includes a top ring body 20, a retainer member 30, a pressing mechanism 40, a guide mechanism 50, seal members 60a and 60b, and a band 70.

[0036] 3 and 4, the top ring body 20 according to this embodiment includes a lower member 21, an intermediate member 22 disposed above the lower member 21, an upper member 23 disposed above the intermediate member 22, and an elastic membrane 24 disposed below the lower member 21. The lower surface of the elastic membrane 24 corresponds to a "substrate support surface 24a" that supports the upper surface of the substrate Wf. The upper member 23, the intermediate member 22, and the lower member 21 are fastened together with bolts (not shown).

[0037] The elastic membrane 24 according to this embodiment is inflated by introducing gas, like an airbag. The top ring body 20 is configured so that the elastic membrane 24 is uniformly pressed against the polishing pad Pd during polishing of the substrate Wf. The top ring body 20 has the same configuration as the top ring body of a known polishing apparatus such as that described in Patent Document 1, and therefore will not be described in further detail.

[0038] 4, the retainer member 30 is disposed so as to surround the outer periphery of the substrate support surface 24a. The retainer member 30 is configured to hold the outer edge of the substrate Wf. Specifically, the retainer member 30 according to this embodiment includes, as an example, a first member 31, a second member 32 disposed above the first member 31, and a third member 33 disposed above the second member 32. The outer edge of the substrate Wf is held by the inner peripheral wall of the first member 31.

[0039] The pressing mechanism 40 is disposed above the retainer member 30. The pressing mechanism 40 is a mechanism for pressing the retainer member 30 downward. There are no particular limitations on the specific configuration of the pressing mechanism 40 as long as it has this function, but the pressing mechanism 40 according to this embodiment includes, as an example, a cylinder 41 and a piston 42.

[0040] The cylinder 41 is disposed so as to surround the outer periphery of the intermediate member 22 of the top ring body 20. The piston 42 protrudes downward from the cylinder 41. The piston 42 is displaced in the up and down direction relative to the cylinder 41. The lower end of the piston 42 abuts against the upper surface of the third member 33 of the retainer member 30. The downward displacement of the piston 42 can press the retainer member 30 downward. Note that the lower end of the piston 42 may be connected to the third member 33 of the retainer member 30, so that the retainer member 30 can be driven in the up and down direction in accordance with the up and down displacement of the piston 42.

[0041] The guide mechanism 50 is a mechanism for guiding the vertical displacement of the retainer member 30. There are no particular limitations on the specific configuration of the guide mechanism 50 as long as it has this function. However, the guide mechanism 50 according to the present embodiment includes, as an example, a guide roller 51, a guide pad 52, and a roller support member 53.

[0042] Guide roller 51 is rotatably supported by roller support member 53. Roller support member 53 is connected to lower member 21 via bolt 14. Guide pad 52 is disposed on the inner circumferential surface of third member 33 of retainer member 30. When retainer member 30 is displaced, guide pad 52 is guided in the vertical direction by guide roller 51. This guides the displacement of retainer member 30. Note that the configuration of guide mechanism 50 is similar to that of a known guide mechanism for a polishing machine such as that described in Patent Document 1, and therefore further detailed description will be omitted.

[0043] 4, the seal member 60a is sandwiched between the second member 32 and the third member 33 of the retainer member 30, and is also sandwiched between the roller support member 53 and the lower member 21 of the top ring body 20. The seal member 60a may be further fixed to the second member 32 and / or the third member 33 by bolts (not shown). The seal member 60a is provided to prevent slurry from entering the guide rollers 51 when the substrate Wf is polished.

[0044] In this embodiment, a space 25 is provided inside the top ring body 20. The upper member 23 of the top ring body 20 is provided to cover the upper part of the cylinder 41 of the pressing mechanism 40. The seal member 60b is sandwiched between the upper member 23 and the cylinder 41. The sealing member 60b may be further fixed to the cylinder 41 and / or the upper member 23 by bolts (not shown). The sealing member 60b is provided to prevent slurry from entering the space 25 inside the top ring body 20 through a gap between the upper member 23 and the cylinder 41. The configurations of the sealing members 60a and 60b are similar to those of sealing members of known polishing apparatuses such as those described in Patent Document 1, and therefore further detailed description thereof will be omitted.

[0045] Next, the peripheral configuration of the band 70 will be described. Fig. 5(A) is a schematic enlarged cross-sectional view of portions B2 and B3 in Fig. 4. Fig. 5(B) is an exploded view showing a schematic exploded state of the configuration of portion B2 in Fig. 4.

[0046] 4, 5(A), and 5(B), the band 70 is disposed across the outer peripheral wall 11 of the retainer member 30 and the outer peripheral wall 11 of the pressing mechanism 40. Specifically, the band 70 according to this embodiment is disposed across the outer peripheral wall 11 of the third member 33 of the retainer member 30 and the outer peripheral wall 11 of the cylinder 41 of the pressing mechanism 40. As shown in FIGS. 2 and 3, the band 70 is disposed across the entire circumferential direction of the outer peripheral wall 11. As shown in FIG. 4, the band 70 is disposed so as to cover the gap 26 between the retainer member 30 and the pressing mechanism 40. The band 70 is provided primarily to prevent slurry from entering the space 25 from the gap 26 during polishing of the substrate Wf. The band 70 according to this embodiment has an overall rectangular ring-like appearance.

[0047] The band 70 has at least one "fitting portion" for fitting into a groove 15, which will be described later. Specifically, as shown in FIGS. 5(A) and 5(B), the band 70 according to this embodiment has a fitting portion 71a and a fitting portion 71b located above the fitting portion 71a. The fitting portion 71b according to this embodiment is provided at one end (specifically, the upper end) of both ends of the band 70. The fitting portion 71a according to this embodiment is provided at the other end (specifically, the lower end) of both ends of the band 70.

[0048] Furthermore, at least the fitting portion of the band 70 according to this embodiment is made of an elastic material such as rubber. Specifically, not only the fitting portion of the band 70 according to this embodiment, but also the portions other than the fitting portion are made of an elastic material. In other words, the entire band 70 according to this embodiment is made of an elastic material.

[0049] 5(A) and 5(B), at least one of the outer peripheral wall 11 of the retainer member 30 and the outer peripheral wall 11 of the pressing mechanism 40 has a groove 15 formed therein for fitting with the fitting portion of the band 70. That is, the groove 15 may be formed only in the outer peripheral wall 11 of the retainer member 30, only in the outer peripheral wall 11 of the pressing mechanism 40, or both in the outer peripheral wall 11 of the retainer member 30 and the outer peripheral wall 11 of the pressing mechanism 40.

[0050] In this embodiment, the number of fitting portions of the band 70 is the same as the number of grooves 15. Since the number of fitting portions of the band 70 according to this embodiment is two, the grooves 15 are also provided in two locations. Specifically, the grooves 15 according to this embodiment are provided on both the outer peripheral wall 11 of the retainer member 30 and the outer peripheral wall 11 of the pressing mechanism 40. The fitting portion 71b of the band 70 fits into the groove 15 provided on the outer peripheral wall 11 of the pressing mechanism 40 (specifically, the cylinder 41), and the fitting portion 71a of the band 70 fits into the groove 15 provided on the outer peripheral wall 11 of the retainer member 30 (specifically, the third member 33).

[0051] In this embodiment, the configuration of the groove 15 provided in the outer peripheral wall 11 of the retainer member 30 is the same as the configuration of the groove 15 provided in the outer peripheral wall 11 of the pressing mechanism 40. Therefore, the groove 15 provided in the outer peripheral wall 11 of the pressing mechanism 40 will be taken as a specific example to explain the details of the groove 15. I will explain.

[0052] 5(B), in a cross-sectional view, the groove 15 has a groove opening 15a, a groove bottom 15b facing the groove opening 15a, and a pair of groove sidewalls (a first groove sidewall 15c and a second groove sidewall 15d) connecting the groove opening 15a and the groove bottom 15b. The first groove sidewall 15c and the second groove sidewall 15d face each other.

[0053] The first groove sidewall 15c and the second groove sidewall 15d are configured so that the distance d1 between the first groove sidewall 15c and the second groove sidewall 15d (i.e., the "groove width") becomes wider as the groove approaches the groove bottom 15b. In other words, the groove 15 according to this embodiment is a "dovetail groove."

[0054] When the fitting portions (fitting portions 71b and 71a) of the band 70 are fitted into the groove 15, the fitting portions are configured to come into contact with the first groove side wall 15c and the second groove side wall 15d.

[0055] As described above, according to this embodiment, the groove 15 into which the fitting portion of the band 70 fits is a dovetail groove. This allows for a stronger fit between the fitting portion of the band 70 and the groove 15 than when the groove into which the fitting portion of the band fits is not a dovetail groove (for example, when the groove is a rectangular groove with a constant distance between a pair of groove sidewalls). This prevents the fitting portion of the band 70 from coming off the groove 15 when the top ring 10 is in use. As a result, the band 70 is prevented from coming off the retainer member 30 or the pressing mechanism 40 when the top ring 10 is in use. Specifically, when the dovetail grooves are provided on both the retainer member 30 and the pressing mechanism 40 as in this embodiment, the band 70 is prevented from coming off the retainer member 30 and the pressing mechanism 40 when the top ring 10 is in use.

[0056] 5(B), the fitting portions 71b and 71a according to this embodiment each have a first protrusion 72 (i.e., a first "hump") that contacts the first groove sidewall 15c and a second protrusion 73 (i.e., a second "hump") that contacts the second groove sidewall 15d. A V-shaped groove 74 having a V-shaped cross section is provided between the first protrusion 72 and the second protrusion 73. Specifically, the V-shaped groove 74 is configured such that the spacing d2 (i.e., the "groove width") of the V-shaped groove 74 increases toward the tips of the first protrusion 72 and the second protrusion 73 in a cross-sectional view.

[0057] The width d3 of the first convex portion 72 and the second convex portion 73 according to this embodiment is set in advance so that the first convex portion 72 contacts the first groove sidewall 15c and the second convex portion 73 contacts the second groove sidewall 15d. Furthermore, the maximum value of the width d3 of the first convex portion 72 and the second convex portion 73 according to this embodiment is larger than the minimum value of the distance d1 between the first groove sidewall 15c and the second groove sidewall 15d (i.e., the size of the groove opening 15a).

[0058] Furthermore, referring to the enlarged view of part B4 in FIG. 4, a stretchable portion 75 that can stretch in the vertical direction is provided in a part of the band 70 according to this embodiment.

[0059] According to this configuration, when the retainer member 30 is displaced in the vertical direction, the expansion / contraction portion 75 can expand and contract in the vertical direction, thereby effectively preventing the fitting portion of the band 70 from coming out of the groove 15.

[0060] In this embodiment, the dovetail grooves are provided around the entire circumferential direction of the outer peripheral wall 11 (i.e., provided on the connecting wall 13 and the corner portions 12), but the present invention is not limited to this configuration. For example, the dovetail grooves may not be provided on the corner portions 12 of the outer peripheral wall 11, but may be provided only on the connecting wall 13. In this case, instead of the dovetail grooves, grooves with a rectangular cross section (where the distance between the first groove side wall 15c and the second groove side wall 15d is equal to the groove opening) may be provided on the corner portions 12. A constant groove may be provided from the opening 15a to the groove bottom 15b.

[0061] Furthermore, when comparing the pressing mechanism 40 and the retainer member 30, the pressing mechanism 40 is more susceptible to the penetration of liquids such as cleaning liquid (e.g., cleaning liquid for cleaning the top ring 10) and polishing slurry through the dovetail grooves. Therefore, when only one of the dovetail grooves of the pressing mechanism 40 and the dovetail grooves of the retainer member 30 is provided around the entire circumference of the outer peripheral wall 11, for example, the dovetail grooves of the pressing mechanism 40 may be provided around the entire circumference of the outer peripheral wall 11, while the dovetail grooves of the retainer member 30 may not be provided around the entire circumference of the outer peripheral wall 11. In this case, the retainer member 30 may be provided with a groove having a rectangular cross section.

[0062] Next, a modified example of the above-described embodiment will be described. In the following description, the same reference numerals will be used to designate the same or corresponding components as those in the above-described embodiment, and the description thereof will be omitted as appropriate.

[0063] (Variation 1) 6 is an enlarged cross-sectional view of a portion of the top ring 10A of the polishing apparatus 100 according to the first modification of the embodiment. Specifically, FIG. 6 is an enlarged schematic view of the same portion (portion B1) as in FIG. 4. The top ring 10A according to this modification differs from the top ring 10 shown in FIG. 4 in that it includes a pressing mechanism 40A instead of the pressing mechanism 40 and a band 70A instead of the band 70.

[0064] The pressing mechanism 40A according to this modification differs from the pressing mechanism 40 illustrated in FIG. 4 in that it does not have the groove 15.

[0065] 4 in that one end 76 of the band 70A is sandwiched between the upper member 23 and the pressing mechanism 40A. Specifically, a region of the band 70A extending a predetermined distance from the one end 76 toward the other end of the band 70A is sandwiched between the upper member 23 and the upper surface of the cylinder 41 of the pressing mechanism 40A. In other words, the one end 76 of the band 70A of the band 70A of this modification is fixed to the upper surface of the cylinder 41. The band 70A may also be fixed to the upper surface of the cylinder 41 with a bolt.

[0066] The other end of the band 70A according to this modification is configured by the fitting portion 71a described above, and this fitting portion 71a fits into the groove 15 (dovetail groove) of the retainer member 30.

[0067] In this modification, the fitting portion 71a of the band 70A is fitted into the groove 15 (dovetail groove), which prevents the fitting portion 71a from coming off the groove 15. As a result, the band 70A is prevented from coming off the retainer member 30 when the top ring 10 is in use. Furthermore, because one end 76 of the band 70A is sandwiched between the upper member 23 and the pressing mechanism 40A, the one end 76 is also prevented from coming off. As a result, the band 70A is prevented from coming off the pressing mechanism 40A when the top ring 10 is in use.

[0068] Furthermore, according to this modification, for example, during maintenance of the top ring 10A, the retainer member 30 can be easily separated from the top ring 10A by removing the fitting portion 71a of the band 70A from the groove 15. Specifically, the retainer member 30 and the members disposed beside the retainer member 30 (more specifically, the lower member 21 and the guide mechanism 50) (hereinafter, these members will be referred to as the "retainer member 30, etc.") can be easily disassembled from the top ring body 20.

[0069] Specifically, in this case, the fitting portion 71a of the band 70A can be easily removed from the groove 15 and turned over so that the fitting portion 71a rests on, for example, the upper surface of the upper member 23. This allows the retainer member 30 and other components to be easily disassembled because the band 70A does not get in the way. In other words, this modification improves the maintainability of the top ring 10A.

[0070] In this modification, the groove 15 may not be a dovetail groove. Specifically, in this case, the groove 15 may be a groove having a rectangular cross section. Even in this case, the one end 76 of the band 70A is sandwiched between the upper member 23 and the pressing mechanism 40A, which prevents the one end 76 from coming off. As a result, the band 70A can be prevented from coming off the pressing mechanism 40A when the top ring 10 is in use.

[0071] (Variation 2) FIG. 7(A) is a schematic diagram showing the peripheral configuration of the groove 15 of the pressing mechanism 40 of the top ring 10B according to the second modification of the embodiment, as viewed from the front. FIG. 7(B) is a schematic front view of a machining tool 200 for machining a dovetail groove. The machining tool 200 shown in FIG. 7(B) includes a rotating shaft 201 and a machining portion 202 (a portion for machining the dovetail groove) connected to the end of the rotating shaft 201. During machining using the machining tool 200, the rotation of the rotating shaft 201 causes the machining portion 202 to rotate. The machining tool 200 according to this modification is, for example, a cutting tool. Therefore, the machining portion 202 is formed by a cutting blade. The machining portion 202 has a shape similar to that of the sidewall of the dovetail groove. Specifically, the diameter of the machining portion 202 increases toward the tip of the machining portion 202.

[0072] As shown in FIG. 7A , the top ring 10B according to this modification has a recess 16 formed in the groove opening 15a of the groove 15 (dovetail groove) of the pressing mechanism 40. The recess 16 is a recess through which the machining part 202 of the machining tool 200 passes when inserted through the groove opening 15a. Specifically, the recess 16 according to this modification is provided to increase the opening area of ​​a portion of the groove opening 15a so that the machining part 202 can be inserted into the groove 15 through the groove opening 15a. In the machining tool 200 according to this modification, the maximum diameter of the machining part 202 is larger than the size of the groove opening 15a (the size of the portion of the groove opening 15a other than the recess 16). Therefore, by providing at least one such recess 16 in the groove opening 15a, the size of the groove opening 15a is partially increased, allowing the machining part 202 of the machining tool 200 to be easily inserted into the groove 15.

[0073] Although the specific shape of the recess 16 is not particularly limited, the recess 16 according to this modification has an arc shape, for example. As shown in Fig. 7(A) , the recess 16 according to this modification is provided in a part of the groove opening 15a so as to be recessed downward when viewed from the front of the groove opening 15a.

[0074] Furthermore, in the top ring 10B according to this modification, the groove 15 of the retainer member 30 is also provided with a recess 16 similar to that shown in FIG. 7(A) (see FIG. 8, which will be described later).

[0075] FIG. 8 is a schematic diagram showing a part of the outer peripheral wall 11 of a top ring 10B according to this modification, viewed from the -X direction. Note that the band 70 is not shown in FIG. 8. In the top ring 10B according to this modification, alignment marks 17 are provided on the outer peripheral wall 11 of the top ring body 20 and the outer peripheral wall 11 of the retainer member 30. Specifically, the alignment mark 17 is provided on the outer peripheral wall 11 of the upper member 23 of the top ring body 20. Furthermore, alignment marks 17 are also provided on the first member 31 and the second member 32 of the retainer member 30. These alignment marks 17 are provided on the top ring 10B. This mark serves as a guide for aligning the components when assembling them.

[0076] The alignment marks 17 and the recesses 16 of the groove openings 15a are arranged so that their positions in the vertical direction are aligned, so that the recesses 16 according to this modification also function as alignment marks.

[0077] According to this modification as described above, the recess 16 is provided in the groove opening 15a, so that the machining tool 200 can be easily inserted into the inside of the groove 15 from the groove opening 15a provided with the recess 16. This makes it easy to machine the groove 15.

[0078] Although the embodiments and modifications of the present invention have been described in detail above, the present invention is not limited to such specific embodiments and modifications, and various modifications and alterations are possible within the scope of the present invention as defined in the claims. [Explanation of symbols]

[0079] 10 Top Ring 11 Peripheral wall 15 Groove (Dovetail) 15a Groove opening 15b Groove bottom 15c 1st groove side wall 15d 2nd groove side wall 20 Top ring body 23 Upper member 24a Board support surface 30 Retainer member 40 Pressing mechanism 70 bands 71a,71b Fitting part 72 First convex part 73 Second convex part 74 V-shaped groove 75 Telescopic part 76 One end 100 Polishing equipment 102 Polishing table 200 Processing tools Wf substrate Pd polishing pad

Claims

1. a top ring body having a substrate support surface for supporting an upper surface of a substrate; a retainer member disposed around the outer periphery of the substrate support surface to hold an outer edge of the substrate; a pressing mechanism disposed above the retaining member and configured to press the retaining member downward; a band disposed across an outer peripheral wall of the retainer member and an outer peripheral wall of the pressing mechanism, the band having a fitting portion; a groove into which the fitting portion of the band fits is provided on an outer peripheral wall of the retainer member; the groove is a dovetail groove having, in a cross-sectional view, a groove opening, a groove bottom opposite the groove opening, a first groove sidewall connecting the groove opening and the groove bottom, and a second groove sidewall connecting the groove opening and the groove bottom and opposite the first groove sidewall, and configured such that a distance between the first groove sidewall and the second groove sidewall becomes wider as the groove approaches the groove bottom, the fitting portion of the band is configured to contact the first groove side wall and the second groove side wall when the fitting portion is fitted into the dovetail groove, the top ring body has an upper member provided to cover an upper portion of the pressing mechanism, One end of the band is clamped between the upper member and the pressing mechanism, A top ring of a polishing apparatus, wherein the fitting portion of the band is provided at the other end of the band.

2. the fitting portion of the band has a first convex portion that contacts the first groove side wall and a second convex portion that contacts the second groove side wall, 2. The top ring of the polishing apparatus according to claim 1, wherein a V-groove having a V-shaped cross section is provided between said first convex portion and said second convex portion.

3. 3. The top ring of a polishing apparatus according to claim 1, wherein a part of the band is provided with an expandable portion that is expandable in the vertical direction.

4. A top ring of a polishing apparatus described in any one of claims 1 to 3, wherein the groove opening is provided with a recess through which a machining tool for machining the groove passes when inserted from the groove opening into the groove.

5. A top ring of a polishing apparatus described in any one of claims 1 to 4, wherein the substrate is a rectangular substrate.

6. A top ring body having a substrate support surface for supporting an upper surface of a substrate; a retainer member disposed around the outer periphery of the substrate support surface to hold an outer edge of the substrate; a pressing mechanism disposed above the retaining member and configured to press the retaining member downward; a band disposed across an outer peripheral wall of the retainer member and an outer peripheral wall of the pressing mechanism, the band having a fitting portion; a groove into which the fitting portion of the band fits is provided on an outer peripheral wall of the retainer member; the top ring body has an upper member provided to cover an upper portion of the pressing mechanism, One end of the band is clamped between the upper member and the pressing mechanism, A top ring of a polishing apparatus, wherein the fitting portion of the band is provided at the other end of the band.

7. A top ring according to any one of claims 1 to 6, a polishing table that holds a polishing pad for polishing the substrate held by the top ring.

8. A top ring of a polishing apparatus as described in claim 2, wherein when the fitting portion of the band is fitted into the dovetail groove, a gap is provided between the bottom of the groove and the fitting portion.

9. A top ring of a polishing apparatus as described in claim 1 or 6, wherein the one end clamped between the upper member and the pressing mechanism is configured to entirely cover the upper surface of the pressing mechanism.

10. A first alignment mark is provided on the outer peripheral wall of the top ring body, a second alignment mark is provided on an outer peripheral wall of the retainer member; 5. The top ring of a polishing apparatus according to claim 4, wherein the recess provided in the groove opening, the first alignment mark, and the second alignment mark are arranged so as to be aligned in the up-down direction.

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