Display module and display device

Abstract

The disclosure provides a display module and a display device. The display module includes a display panel having a substrate, a driving circuit, and a first pad, and a flexible circuit board. The flexible circuit board includes a flexible substrate, a first wiring layer, and a first reinforcing plate. The first wiring layer is disposed on the flexible substrate, and the first wiring layer has a main wiring portion and a second pad. The first reinforcing plate is disposed on a side of the first wiring layer away from the flexible substrate, and an orthogonal projection of the main wiring portion onto the flexible substrate is located within an orthogonal projection of the first reinforcing plate onto the flexible substrate. The second pad is connected to the main wiring portion, and at least a portion of the second pad is electrically connected to the first pad by a conductive paste having conductive particles. The first reinforcing plate is disposed outside the display panel in a first direction. The first reinforcing plate has a first edge facing the display panel, and the first edge has protrusions and recesses, which are alternately arranged in a second direction to form a wavy shape.

Description

[Technical Field]

[0001] The present application relates to the field of display technology, and in particular to display modules and display devices. [Background technology]

[0002] As virtual reality (VR) and augmented reality (AR) technologies continue to advance, display devices used in the VR / AR field are also moving toward smaller size, higher pixel density (PPI), faster response times, and wider color gamuts. Silicon-based microdisplay OLED (Organic Light-Emitting Diode) panels are one prominent example of this trend.

[0003] To facilitate module assembly, flexible printed circuits (FPCs) have become the main method for connecting silicon-based OLEDs with driving terminals, placing higher requirements on the design of flexible printed circuits and the binding process between the flexible printed circuits and silicon-based OLEDs. Summary of the Invention [Problem to be solved by the invention]

[0004] SUMMARY OF THE INVENTION The present invention has been made to solve at least one of the technical problems in the prior art, and provides a display module and a display device. [Means for solving the problem]

[0005] In order to achieve the above object, the present application a display panel including a display area and a bind area located on at least one side of the display area, the display panel comprising a substrate, a drive circuit, and a first pad, the drive circuit and the first pad are both provided on the substrate, the first pad is located in the bind area, the drive circuit is electrically connected to the first pad, the drive circuit includes at least a transistor located in the display area, and a semiconductor layer of the transistor is embedded in the substrate; a flexible circuit board including a flexible substrate, a first wiring layer provided on the flexible substrate and including a main wiring portion and a second pad, and a first reinforcing plate provided on the first wiring layer on a side remote from the flexible substrate; an orthogonal projection of the main wiring portion onto the flexible substrate is located within an orthogonal projection of the first reinforcing plate onto the flexible substrate; the second pads are connected to the main wiring portion; at least a portion of the second pads is electrically connected to the first pads by a conductive paste, the conductive paste including conductive particles; Provided is a display module in which, in a first direction, the first reinforcing plate is located outside the display panel, the first reinforcing plate has a first edge facing the display panel, the first edge includes a convex portion curved toward the display panel and a concave portion curved away from the display panel, the concave portion and the convex portion are alternately arranged in a second direction to form a wavy shape, the first direction is a direction in which the second pad moves away from the display panel, and the second direction intersects with the first direction.

[0006] In some embodiments of the present application, both the convex portion and the concave portion are arc-shaped.

[0007] In some embodiments of the present application, the radius of the convex portion and the radius of the concave portion are both between 1.0 mm and 1.5 mm.

[0008] In some embodiments of the present application, the arc length of each of the single protrusions and the single recesses is between 1.0 mm and 1.6 mm.

[0009] In some embodiments of the present application, the length of a single protrusion in the second direction is equal to the length of a single recess in the second direction.

[0010] In some embodiments of the present application, there is a gap between the first edge and the display panel at any position on the first edge.

[0011] In some embodiments of the present application, the distance between the first edge and the display panel at any position is between 200 μm and 1500 μm.

[0012] In some embodiments of the present application, the flexible circuit board further includes a second reinforcing plate located on a side of the flexible board away from the first wiring layer, the second reinforcing plate including at least a first reinforcing portion, and the orthogonal projection of the second pad onto the flexible board is located within the orthogonal projection of the first reinforcing portion onto the flexible board.

[0013] In some embodiments of the present application, the second reinforcing plate further includes a second reinforcing portion, the second reinforcing portion and the first reinforcing portion are arranged sequentially in the first direction, and the orthogonal projection of the second reinforcing portion onto the flexible substrate is located within the orthogonal projection of the first reinforcing plate onto the flexible substrate.

[0014] In some embodiments of the present application, the first reinforcing portion and the second reinforcing portion of the second reinforcing plate have an integral structure.

[0015] In some embodiments of the present application, the second reinforcing portion has a size of 500 μm or more in the first direction.

[0016] In some embodiments of the present application, the flexible circuit board further includes a second wiring layer and a third reinforcing plate, the second wiring layer being located on a side of the flexible board away from the first wiring layer and electrically connected to the main wiring portion via a through hole, and the third reinforcing plate being located on a side of the second wiring layer away from the flexible board, The orthogonal projection of the second wiring layer onto the flexible substrate is located within the orthogonal projection of the first reinforcing plate onto the flexible substrate, and is located within the orthogonal projection of the third reinforcing plate onto the flexible substrate.

[0017] In some embodiments of the present application, the third reinforcing plate has a gap between it and the second reinforcing plate.

[0018] In some embodiments of the present application, a part of the third reinforcing plate is located on a side of the second wiring layer facing the second reinforcing portion.

[0019] In some embodiments of the present application, the conductive paste is an anisotropic conductive paste.

[0020] In some embodiments of the present application, the display panel further includes a light-emitting element located in the display area, the light-emitting element being provided on a side of the drive circuit away from the substrate and electrically connected to the transistor.

[0021] The present embodiment further provides a display device including the above display module. [Brief explanation of the drawings]

[0022] The drawings are intended to facilitate a further understanding of the present disclosure, constitute a part of the specification, and are used to explain the present disclosure together with the following embodiments, but are not intended to limit the present disclosure.

[0023] [Figure 1] 1 is a schematic diagram of a display module provided in some embodiments of the present disclosure. [Figure 2]1 is a schematic diagram of a display panel provided in some embodiments of the present disclosure. [Figure 3] FIG. 2 is a bottom view of a flexible circuit board provided in some embodiments of the present disclosure. [Figure 4] FIG. 4 is an enlarged view of region I in FIG. 3. [Figure 5] FIG. 5 is a cross-sectional view taken along the line AA′ in FIG. [Figure 6] 1 is a schematic diagram illustrating a connection between a flexible circuit board and a display panel provided in some embodiments of the present disclosure. [Figure 7] FIG. 2 is a bottom view showing a partial region of a flexible circuit board provided in a comparative example. [Figure 8] FIG. 10 is a schematic diagram showing the connection between a flexible circuit board and a display panel in a comparative example. DETAILED DESCRIPTION OF THE INVENTION

[0024] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. It should be understood that the specific embodiments described herein are merely for the purpose of illustrating or explaining the present disclosure, and are not intended to limit the present disclosure.

[0025] In order to clarify the objectives, technical solutions and advantages of the embodiments of the present disclosure, the following will provide a clear and complete description of the technical solutions of the embodiments of the present disclosure in combination with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are only some of the embodiments of the present disclosure, but not all of the embodiments. All other embodiments obtained by those skilled in the art based on the described embodiments of the present disclosure without exerting their creative efforts fall within the scope of protection of the present disclosure.

[0026] The terms used to describe the embodiments of the present disclosure are not intended to limit and / or restrict the scope of the present disclosure. For example, unless otherwise defined, technical and scientific terms used in the present disclosure have the meanings commonly understood by those skilled in the art to which the present disclosure belongs. It should be understood that the terms "first," "second," and similar terms used in the present disclosure do not denote any order, quantity, or importance, but are merely used to distinguish different components. The singular terms "a," "an," "one," "the," and the like also do not denote a quantitative limitation, but rather denote the presence of at least one, unless the context clearly indicates otherwise. The words "including" or "including" and other similar words mean that the elements or objects before the "including" or "including" encompass the elements or objects listed after the "including" or "including" and equivalents, and do not exclude other elements or objects. The terms "connected" or "connected to each other" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "up," "down," "left," and "right" only indicate relative positional relationships, and if the absolute position of the object being described changes, the relative positional relationships may also change accordingly.

[0027] Fig. 1 is a schematic diagram of a display module provided in some embodiments of the present disclosure. As shown in Fig. 1, the display module includes a display panel and a flexible circuit board. Fig. 2 is a schematic diagram of a display panel provided in some embodiments of the present disclosure. As shown in Figs. 1 and 2, the display panel 10 includes a display area 10a and a binding area 10b located on at least one side of the display area 10a. The display panel 10 also includes a substrate 102, a driving circuit, and a first pad 101, and the driving circuit and the first pad 101 are all provided on the substrate 102.

[0028] In some embodiments, the first pads 101 are located in the binding region 10b and may have a single-layer or multi-layer structure. They may also be made of, but are not limited to, a single-layer or multi-layer metal structure made of copper, molybdenum, aluminum, titanium, or other conductive materials. The first pads 101 are typically used for bonding to external components (e.g., flexible circuit boards 20) after the components in the display region 10a are manufactured, thereby supplying signals to the display panel 10. Here, there are multiple first pads, each of which is strip-shaped. The length of the first pad portion may be aligned along a first direction (the X direction in FIGS. 1 and 2 ), and the multiple first pads are arranged along a second direction (the Y direction in FIGS. 1 and 2 ) that intersects the first direction. For example, the second direction is perpendicular to the first direction.

[0029] In some embodiments, the substrate 102 is a silicon-based substrate, such as single-crystal silicon or high-purity silicon. A driving circuit is formed on the substrate 102, and the substrate 102 as a whole constitutes a driving substrate 105. The driving circuit may include a circuit configuration located in the display area 10a, or may include a circuit configuration located in the binding area 10b. The driving circuit provides signals to the display panel 10 by electrically connecting the first pad 101 in the binding area 10b bonded to the second pad 202a of the flexible circuit board 20.

[0030] 2, the driving circuit may include at least a pixel circuit located in the display region 10a and including a plurality of transistors 103. The pixel circuit may be formed on a silicon substrate by a semiconductor process, for example, by forming a semiconductor layer 1031 (i.e., an active layer), a source electrode 1032, and a drain electrode 1033 of the transistor 103 on the silicon substrate by an impurity doping process, forming an insulating layer 1034 by a silicon oxidation process, and forming a gate electrode 1035 and a plurality of conductive layers 106 and 107 by a sputtering process or the like. The semiconductor layer 1031 of the transistor 103 is embedded in the substrate 102. That is, when the substrate 102 is a silicon substrate, the semiconductor layer 1031 may be part of the silicon substrate.

[0031] The driving circuits may further include a gate driving circuit and a data driving circuit that are connected to the pixel circuits in the display area 10a and supply electrical signals. For example, the data driving circuit is used to supply data signals, and the gate driving circuit is used to supply scanning signals, as well as various control signals, power signals, etc.

[0032] The gate drive circuit and the data drive circuit may be integrated on a silicon substrate by the semiconductor process. That is, a silicon substrate may be used as the substrate 102 in the display panel 10, and the pixel circuits, gate drive circuit, and data drive circuit may be integrated on the silicon substrate. In this case, because silicon-based circuits can achieve high precision, the gate drive circuit and the data drive circuit do not necessarily need to be arranged in the non-display area 10b, and may be arranged in an area corresponding to the display area 10a of the display panel 10, for example.

[0033] Optionally, the display panel may further include a plurality of light-emitting elements, which may be, for example, organic light-emitting diodes (OLEDs), micro light-emitting diodes (Micro / Mini OLEDs), etc.

[0034] The light-emitting element 104 is provided on the side of the drive circuit away from the substrate 102 and is located in the display region 10a, but may be electrically connected to the transistor 103 in the pixel circuit. For example, the light-emitting element 104 may include an anode 1041, a light-emitting layer 1042, and a cathode 1043 formed in this order on the drive substrate 105, and the anode 1041 may be electrically connected to the drain electrode 1033 of the transistor 103 via a contact hole 108 filled with a conductive material (e.g., metallic tungsten) and multiple conductive layers 106 and 107.

[0035] Here, the anodes 1041 of the plurality of light-emitting elements 104 are spaced apart from each other, and the cathodes 1043 of the plurality of light-emitting elements 104 may be formed as a full-surface film layer. Here, a pixel definition layer (PDL) may or may not be provided between adjacent anodes 1041. This is determined depending on the situation.

[0036] To simplify the process, the first pad 101 on the substrate 102 may be disposed in the same layer as the conductive structure in the display region 10a. For example, the first pad 101 may be provided in the same layer as the conductive layer 107, which is the uppermost layer (the position farthest from the substrate 102) immediately below the light-emitting element 104 in the display region 10a.

[0037] In some embodiments, the conductive layer 107 is reflective and has, for example, a titanium / titanium nitride / aluminum laminate structure. For example, the conductive layer 107 includes multiple sublayers spaced apart from one another, each sublayer corresponding to the anode 1041 of each light-emitting element 104. In a top-emission structure, the conductive layer 107 can be provided as a reflective layer to reflect light emitted by the light-emitting element 104 and improve light extraction efficiency. For example, the orthogonal projection of the anode 1041 of each light-emitting element 104 onto the substrate 102 is included within the orthogonal projection of the corresponding conductive layer onto the substrate 102. In this case, the anode 1041 can be made of a transparent conductive oxide material with a high work function, such as ITO (indium tin oxide) or IZO (indium zinc oxide).

[0038] In some embodiments, the display panel 10 further includes an encapsulation layer 109, a color filter layer 110, a cover plate 111, and the like, located on the side of the light-emitting element 104 farther from the substrate 102. The first encapsulation layer 109, for example, encapsulates the light-emitting element 104 to prevent damage to the element due to intrusion of moisture or oxygen from the outside into the light-emitting element 104 or pixel circuit. For example, the first encapsulation layer 109 has a structure in which an inorganic thin film or organic and inorganic thin films are alternately stacked. The color filter layer 110 includes color blocks such as R (red), G (green), and B (blue). The cover plate 111 is, for example, a cover glass. The encapsulation layer 109 can also be disposed between the color filter layer 110 and the cover plate 111 to encapsulate the color filter layer 110.

[0039] Fig. 3 is a bottom view of a flexible circuit board provided in some embodiments of the present invention, Fig. 4 is an enlarged view of region I in Fig. 3, Fig. 5 is a cross-sectional view taken along line AA' in Fig. 4, and Fig. 6 is a schematic diagram showing a state in which a flexible circuit board provided in some embodiments of the present invention is connected to a display panel. As shown in Figs. 3 to 6, flexible circuit board 20 includes a flexible substrate 201, a first wiring layer, and a first reinforcing plate 203. A first wiring layer including main wiring portions 202b and second pads 202a is disposed on flexible substrate 201, and first reinforcing plate 203 is disposed on the side of the first wiring layer away from flexible substrate 201.

[0040] For example, since the orthogonal projection of the main wiring portion 202b onto the flexible substrate 201 is located within the orthogonal projection of the first reinforcing plate 203 onto the flexible substrate 201, the first reinforcing plate 203 can protect the main wiring portion 202b of the flexible circuit board 20 and also ensure the structural stability of the flexible circuit board 20, making it easier to assemble the entire product.

[0041] For example, there are multiple second pads 202a, which are connected to the first pads 101 in a one-to-one correspondence (for example, by crimping), and the length direction of each second pad 202a is the same as the length direction of the first pad 101, and extends, for example, in the X direction in Figures 1 and 3.

[0042] The second pad 202a is connected to the main wiring portion 202b, and at least a portion of the second pad 202a is electrically connected to the first pad 101 via a conductive paste containing conductive particles 30. For example, the conductive particles 30 are doped in a colloidal state. Note that, since the second connection portion 202a2 is electrically connected to the first pad 101, at least a portion of the orthogonal projection of the second connection portion 202a2 onto the flexible substrate 201 does not overlap with the orthogonal projection of the first reinforcing plate 203 onto the flexible substrate 201.

[0043] 6, for example, second pad 202a includes first connection portion 202a1 and second connection portion 202a2 aligned along the longitudinal direction thereof, with first connection portion 202a1 connected to main wiring portion 202b and second connection portion 202a2 electrically connected to first pad 101. Note that while FIG. 6 shows a case where second pad 202a is not covered with first reinforcing plate 203, in the process of manufacturing flexible circuit board 20, first reinforcing plate 203 may cover a portion of first connection portion 202a1 close to main wiring portion 202b so that the portion of main wiring portion 202b in contact with second pad 202a is not exposed, in order to prevent oxidation of the portion of main wiring portion 202b in contact with second pad 202a.

[0044] In some embodiments, the flexible substrate 201 and the first reinforcing plate 203 of the flexible circuit board 20 may have a single-layer structure or a multi-layer structure and may be formed from a material such as PI (polyimide). The first wiring layer may be made from a material such as Al (aluminum) or Cu (copper). To ensure the structural stability of the flexible circuit board 20, the thickness of the first reinforcing plate 203 may be greater than the thickness of the second pad 202a.

[0045] In some embodiments, the second pad 202a may be coated with a highly conductive anti-oxidation film layer such as gold (Au) to prevent oxidation of the second pad 202a in the portion not covered by the first reinforcing plate 203 and ensure the conductivity of the second pad 202a. Note that since the second pad portion 202a is covered with the anti-oxidation film layer, it is thicker than the main wiring portion 202b.

[0046] In some embodiments, the conductive paste may be an anisotropic conductive film (ACF). The anisotropic conductive film uses conductive particles 30 to bond the second pads 202a of the flexible circuit board 20 to the first pads 101 of the display panel 10, thereby providing electrical continuity between the flexible circuit board 20 and the display panel 10. At the same time, the anisotropic conductive paste is conductive only in the thickness direction of the flexible board 201, thereby preventing short circuits between horizontally adjacent pads and ensuring stable electrical connections between the flexible circuit board 20 and the display panel 10. Furthermore, because the anisotropic conductive paste is conductive only in the thickness direction of the flexible board 201, the anisotropic conductive paste may be applied to the entire surface to reduce the difficulty of bonding multiple pairs of first pads 101 and second pads 202a.

[0047] In some embodiments, the first reinforcing plate 203 is disposed on the outer side of the display panel 10 in the first direction, and has a first edge facing the display panel 10. As described above, the first direction is the length direction of the first pad 101, i.e., the direction in which the second pad 202a moves away from the display panel 10. Note that the first edge facing the display panel 10 means that the first edge E1 is the edge closer to the display panel 10, and the entire first edge E1 is aligned along the second direction.

[0048] Fig. 7 is a plan view showing a partial region of a flexible circuit board provided in a comparative example, and Fig. 8 is a schematic diagram showing the connection between the flexible circuit board and a display panel in the comparative example. Fig. 7 shows an area of ​​the same size as Fig. 4 to illustrate the differences between the flexible circuit boards of the embodiment of the present invention and the comparative example. As shown in Fig. 7, in the comparative example, the first edge E1 of the first reinforcing plate 203 is linear. As shown in Fig. 8, during the process of pressing the flexible circuit board 20 to the display panel 10, the conductive particles 30 in the conductive paste are expelled to the outside due to the pressing force, resulting in a large number of conductive particles 30 accumulating on the cross section of the flexible circuit board 20 facing the display panel 10, which ultimately reduces the reliability of the flexible circuit board 20.

[0049] In the presently disclosed embodiment, the first edge E1 can be wavy to disperse the conductive particles in the cross section of the flexible circuit board 20. For example, as shown in FIGS. 4 and 6 , the first edge E1 includes convex portions E11 that curve toward the display panel 10 and concave portions E12 that curve away from the display panel 10, with the convex portions E11 and concave portions E12 alternately arranged along the second direction to form a wavy shape. By providing the first edge E1 with a wavy shape, the length of the first edge E1 can be increased compared to the straight edge shown in FIG. 7 . Therefore, the conductive particles 30 in the conductive paste are dispersed along the first edge E1 when they are discharged to the outside under pressure. This reduces or prevents the accumulation of the conductive particles 30, improving the reliability of the flexible circuit board.

[0050] In some embodiments, by making both the protrusions E11 and the recesses E12 smooth, it is possible to prevent the conductive particles 30 from accumulating at any position on the protrusions E11 and the recesses E12. For example, by making both the protrusions E11 and the recesses E12 arc-shaped, it is possible to uniformly distribute the conductive particles in the conductive paste along the protrusions E11 and the recesses E12.

[0051] Alternatively, the radius of the convex portion E11 and the radius of the concave portion E12 are both set to 1.0 mm to 1.5 mm. For example, the radius of the convex portion E11 and the radius of the concave portion E12 are both set to 1.3 mm. Note that the radius of the convex portion E11 (or concave portion) refers to the radius of the circle described by the arc-shaped convex portion E11 (or concave portion).

[0052] In some embodiments, the length of a single protrusion E11 in the second direction is equal to the length of a single recess E12 in the second direction. Note that if the length of a single protrusion E11 in the second direction is equal to the length of a single recess E12 in the second direction and the radius of a single protrusion E11 is equal to the radius of a single recess E12, the arc length of a single protrusion E11 is equal to the arc length of a single recess E12, making it easier to uniformly distribute the conductive particles 30 along the first edge E1.

[0053] In some embodiments, the connecting lines of the second pads 202a near one end of the first reinforcing plate 203 may have approximately the same shape as the first edge E1. For example, the ends of the second pads 202a on the main wiring portion 202b side may be aligned with the first reinforcing plate 203, or a portion of each second pad 202a on the main wiring portion 202b side may be covered by the first reinforcing plate 203, and the lengths of the second pads 202a covered by the first reinforcing plate 203 may be the same.

[0054] In some embodiments, the first edge E1 of the first reinforcing plate 203 has a gap between it and the display panel 10 at any position. That is, the first edge E1 of the first reinforcing plate 203 does not contact the display panel 10 at any position. Therefore, when pressed, some of the conductive particles 30 are smoothly discharged between the first edge E1 and the first reinforcing plate 203 and dispersed along the wavy edge, thereby further ensuring the reliability of the flexible circuit board 20.

[0055] For example, the distance H1 between an arbitrary position of the first edge E1 and the display panel 10 is between 200 μm and 1500 μm. For example, after bonding the flexible circuit board 20 to the display panel 10 in the production process, paste is also applied to the area between the first edge E1 of the first reinforcing plate 203 and the display panel 10 so as to cover a portion of the first wiring layer exposed by the first reinforcing plate 203. At this time, the distance between the first edge E1 and the display panel 203 may be set according to the width of the paste application head. For example, if the width of the paste application head of the paste application device is 1000 μm, the closest distance between the protrusion E11 of the first edge E1 and the display panel 10 is set to at least 200 μm to prevent the accumulation of conductive particles 30 in the conductive paste. In addition, the closest distance between the recess E12 of the first edge E1 and the display panel 10 is set to 1000 μm or less, so that when paste is applied to the gap between the first edge E1 and the display panel 10 using a paste application device, the exposed portion of the first wiring layer can be reliably covered by the first reinforcing plate 203.

[0056] 6, the flexible circuit board 20 further includes a second reinforcing plate 204 made of a material such as PI (polyimide). The second reinforcing plate 204 is located on the side of the flexible substrate 201 that is away from the first wiring layer, and has at least a first reinforcing portion 204a. By designing the flexible substrate 201 so that the orthogonal projection of the second pad 202a onto the flexible substrate 201 is inside the orthogonal projection of the first reinforcing portion 204a onto the flexible substrate 201, the structural strength of the region of the flexible circuit board 20 where the second pad 202a is located can be increased.

[0057] Optionally, the second reinforcing plate 204 may further include a second reinforcing portion 204b. This second reinforcing portion 204b is arranged in sequence with the first reinforcing portion 204a in the first direction, so that the orthogonal projection of the second reinforcing portion 204b onto the flexible substrate 201 is located inside the orthogonal projection of the first reinforcing plate 203 onto the flexible substrate 201. In other words, a portion of the second reinforcing plate 204 extends to the region of the flexible circuit board 20 where the main wiring portion 202b is provided, and this extended portion is the second reinforcing portion 204. This makes it possible to prevent a sudden change in rigidity from occurring at the boundary between the region of the flexible circuit board 20 where the second pad 202a is formed and the region where the main wiring portion 202b is formed. Therefore, it is possible to prevent the boundary portion from being easily damaged during the process of pressing the second pad 202a and the first pad 101 together, i.e., the problem that the second pad 202a and the connection portion between the second pad 202a and the main wiring portion 202b are easily broken, and it is possible to ensure structural stability during the bonding process of the flexible circuit board 20.

[0058] Optionally, by setting the dimension H2 of the second reinforcing portion 204b in the first direction to 500 μm or more, the problem of breakage easily occurring at the second pad 202a and at the connection between the second pad 202a and the main wiring portion 202b can be further suppressed, and structural stability can be ensured during the bonding process of the flexible circuit board 20.

[0059] Note that the edge of second reinforcing portion 204b away from first reinforcing portion 203 may be linear, but the width of second reinforcing portion 204b varies depending on the position because first edge E1 of first reinforcing plate 203 is not linear. The above statement that "H2 is 500 μm or more" means that the minimum width of the portion where second reinforcing plate 204 and first reinforcing plate 203 overlap in the thickness direction of flexible substrate 201 is 500 μm or more.

[0060] In some embodiments, the flexible circuit board 20 further includes a second wiring layer 205 and a third reinforcing plate 206, as shown in FIG. 6 . The second wiring layer 205 is made of a material such as Al (aluminum) or Cu (copper) and is located on the side of the flexible substrate 201 that is away from the first wiring layer. The second wiring layer 205 is electrically connected to the main wiring portion 202b via a through hole 207. The third reinforcing plate 206 is made of a material such as PI (polyimide) and is located on the side of the second wiring layer 205 that is away from the flexible substrate 201. The orthogonal projection of the second wiring layer 205 onto the flexible substrate 201 is located within the orthogonal projection of the first reinforcing plate 203 onto the flexible substrate 201, and is also located within the orthogonal projection of the third reinforcing plate 206. In this embodiment, providing two wiring layers on the flexible circuit board 20 facilitates wiring, and providing the third reinforcing plate 206 protects the second wiring layer 205 and also increases the structural strength of the flexible circuit board 20.

[0061] The flexible wiring board 20 is not limited to two wiring layers, and may have three, four, or more wiring layers depending on actual needs, and is not particularly limited.

[0062] Furthermore, a plurality of through holes 207 connecting the first wiring layer and the second wiring layer 205 may be provided in order to ensure connection stability between the first wiring layer and the second wiring layer 205 .

[0063] In some embodiments, the third reinforcing plate 206 has a gap 208 between it and the second reinforcing portion 204b, which improves the bending performance of the flexible circuit board 20. The width of the gap 208 can be determined according to actual needs, and is not particularly limited in the embodiments disclosed herein.

[0064] In some embodiments, a portion of the third reinforcing plate 206 is positioned on the side of the second wiring layer 205 facing the second reinforcing portion 204b, thereby covering the end of the second wiring layer 205 that is closer to the second reinforcing portion 204b, thereby preventing oxidation of the second wiring layer 205 and ensuring good conductivity of the second wiring layer 205. This also makes it possible to prevent the second wiring layer 205 from accidentally coming into contact with other conductive members in the gap 208.

[0065] Here, by integrating the second reinforcing portion 204b of the second reinforcing plate 204 with the first reinforcing portion 204a, the manufacturing process can be simplified. When manufacturing the second reinforcing plate 204 and the third reinforcing plate 206, a film layer may be formed on the entire surface of the flexible substrate 201 on the side away from the first circuit layer, and then the entire film layer may be cut or etched at a position corresponding to the gap 208 to separate the second reinforcing plate 204 and the third reinforcing plate 206 from each other. Note that the manufacturing process for the second reinforcing plate 204 and the third reinforcing plate 206 is not limited to this, and they may also be formed independently. This can be determined according to the specific situation.

[0066] The present disclosure also provides a display device including the display module according to any one of the above embodiments. The specific type of the display device is not particularly limited, and may be a display device commonly used in the art, such as a monitor, a mobile device such as a mobile phone, a wearable device such as a wristwatch, or a VR device. Those skilled in the art can select an appropriate type depending on the specific application of the display device, and therefore, a detailed description thereof will be omitted here.

[0067] It should be noted that the above-described embodiment is merely an exemplary embodiment used to explain the principles of the present invention, and the present invention is not limited thereto. It is obvious that a person skilled in the art can make various modifications and improvements to the embodiment without departing from the gist of the present invention, and such modifications and improvements are also included in the scope of protection of the present invention.

Claims

1. a display panel including a display area and a bind area located on at least one side of the display area, the display panel comprising a substrate, a drive circuit, and a first pad, the drive circuit and the first pad are both provided on the substrate, the first pad is located in the bind area, the drive circuit is electrically connected to the first pad, the drive circuit includes at least a transistor located in the display area, and a semiconductor layer of the transistor is embedded in the substrate; a flexible circuit board including a flexible substrate, a first wiring layer provided on the flexible substrate and including a main wiring portion and a second pad, and a first reinforcing plate provided on the first wiring layer on a side remote from the flexible substrate; an orthogonal projection of the main wiring portion onto the flexible substrate is located within an orthogonal projection of the first reinforcing plate onto the flexible substrate; the second pads are connected to the main wiring portion; at least a portion of the second pads is electrically connected to the first pads by a conductive paste, the conductive paste including conductive particles; In a first direction, the first reinforcing plate is located outside the display panel, the first reinforcing plate has a first edge facing the display panel, the first edge includes a convex portion curved toward the display panel and a concave portion curved away from the display panel, the concave portion and the convex portion are alternately provided in a second direction to form a wavy shape, the first direction is a direction in which the second pad is away from the display panel, and the second direction intersects with the first direction, The convex portion and the concave portion are both arc-shaped, The conductive particles are uniformly dispersed along the protrusions and the recesses.

2. 2. The display module according to claim 1, wherein the radius of each of the convex portion and the concave portion is between 1.0 mm and 1.5 mm.

3. 2. The display module according to claim 1, wherein the arc length of each of the single protrusions and the single recesses is between 1.0 mm and 1.6 mm.

4. 2. The display module according to claim 1, wherein a length of a single protrusion in the second direction is equal to a length of a single recess in the second direction.

5. The display module according to claim 1 , wherein there is a gap between the first edge and the display panel at any position on the first edge.

6. 2. The display module according to claim 1, wherein the distance between the first edge and the display panel is between 200 μm and 1500 μm at any position on the first edge.

7. 2. The display module of claim 1, wherein the flexible circuit board further includes a second reinforcing plate located on a side of the flexible board away from the first wiring layer, the second reinforcing plate including at least a first reinforcing portion, and the orthogonal projection of the second pad onto the flexible board is located within the orthogonal projection of the first reinforcing portion onto the flexible board.

8. 8. The display module of claim 7, wherein the second reinforcing plate further includes a second reinforcing portion, the second reinforcing portion and the first reinforcing portion are arranged sequentially in the first direction, and the orthogonal projection of the second reinforcing portion onto the flexible substrate is located within the orthogonal projection of the first reinforcing plate onto the flexible substrate.

9. 9. The display module according to claim 8, wherein the first reinforcing portion and the second reinforcing portion of the second reinforcing plate are integrally formed.

10. 9. The display module according to claim 8, wherein the second reinforcing portion has a size of 500 μm or more in the first direction.

11. the flexible circuit board further includes a second wiring layer and a third reinforcing plate, the second wiring layer being located on a side of the flexible board away from the first wiring layer and being electrically connected to the main wiring portion via a through hole, and the third reinforcing plate being provided on the second wiring layer on a side of the flexible board away from the first wiring layer, 9. The display module of claim 8, wherein the orthogonal projection of the second wiring layer onto the flexible substrate is located within the orthogonal projection of the first reinforcing plate onto the flexible substrate and is located within the orthogonal projection of the third reinforcing plate onto the flexible substrate.

12. 12. The display module according to claim 11, wherein the third reinforcing plate has a gap between it and the second reinforcing plate.

13. 12. The display module according to claim 11, wherein a part of the third reinforcing plate is located on a side of the second wiring layer facing the second reinforcing portion.

14. 2. The display module according to claim 1, wherein the conductive paste is an anisotropic conductive paste.

15. 2. The display module of claim 1, wherein the display panel further comprises a light-emitting element located in the display area, the light-emitting element being provided on a side of the drive circuit away from the substrate and electrically connected to the transistor.

16. A display device comprising the display module according to claim 1.

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