Holding device

Abstract

A technology is provided for improving the uniformity of temperature distribution within a mounting surface. [Solution] A holding device comprising a plate-shaped member having a mounting surface on which an object is placed and having a flow path formed therein through which a refrigerant flows, wherein in a cross section of the plate-shaped member at the position where the flow path is formed, the flow path includes an isolated curved section in which the flow path is curved by 90 degrees or more, and the length of the non-formed portion where no flow path is formed between one end of the section and the other end of the section is equal to or longer than a set distance, and the set distance is the combined length of the width of the flow path at one end and the width of the flow path at the other end.

Description

[Technical Field]

[0001] The present invention relates to a retaining device. [Background technology]

[0002] BACKGROUND ART Conventionally, a holding device is known that includes a plate-like member having a mounting surface on which an object is placed and a flow path through which a refrigerant flows (for example, Patent Documents 1 and 2). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 7111460 [Patent Document 2] International Publication No. 2023 / 166866 Summary of the Invention [Problem to be solved by the invention]

[0004] However, in the holding devices such as those disclosed in Patent Documents 1 and 2, there is still room for improvement in the technology for improving the uniformity of the temperature distribution within the mounting surface.

[0005] The present invention has been made to solve at least part of the above-mentioned problems, and has an object to provide a technique for improving the uniformity of the temperature distribution within the mounting surface. [Means for solving the problem]

[0006] The present invention has been made to solve at least part of the above-mentioned problems, and can be realized in the following forms.

[0007] (1) According to one aspect of the present invention, there is provided a holding device comprising a plate-shaped member having a mounting surface on which an object is placed and having a flow path formed therein through which a refrigerant flows, wherein in a cross section of the plate-shaped member at a position where the flow path is formed, the flow path includes an isolated curved section, which is a section where the flow path is curved by 90 degrees or more, and where the length of a non-formed portion where the flow path is not formed between one end of the section and the other end of the section is equal to or longer than a set distance, and the set distance is the combined length of the width of the flow path at the one end and the other end.

[0008] The curved section is a section of the flow path where turbulence of the refrigerant is likely to occur, and because this turbulence creates a cooling effect, the curved section tends to have a relatively low temperature. On the other hand, the non-formed portion of the plate-like member where no flow path is formed tends to have a relatively high temperature. This configuration includes an isolated curved section in which the length of the non-formed portion between one end and the other end is equal to or greater than a set distance. In other words, a sufficiently large non-formed portion is ensured inside such an isolated curved section to heat the isolated curved section, thereby improving the uniformity of the temperature distribution within the mounting surface on which the object is placed.

[0009] (2) In the holding device of the above aspect, the flow path may include a flow path inlet through which the refrigerant flows into the flow path and a flow path outlet through which the refrigerant flows out of the flow path, and the flow path may include the isolated curved section that contains the flow path outlet. The flow path outlet is the location where the refrigerant reaches after passing through the entire length of the flow path and fully absorbing heat, so the temperature there tends to be relatively high. Thus, the flow path outlet is prone to becoming a temperature singularity that deviates to some extent from the average temperature of the entire plate-like member. Therefore, by including the flow path outlet in the isolated curved section, the cooling effect due to the generation of turbulence in the isolated curved section and adjusting the length of the non-forming section to a predetermined distance or more can further improve the uniformity of the temperature distribution within the support surface on which the object is placed.

[0010] (3) In the holding device of the above aspect, the flow path may be arranged between the flow path outlet contained in the isolating curved section and the flow path inlet not contained in the isolating curved section. With this configuration, the flow path inlet, which tends to be relatively low in temperature, and the flow path outlet, which tends to be relatively high in temperature, are separated by a flow path, so that heat transfer from the flow path outlet to the flow path inlet can be suppressed. Therefore, the refrigerant at the flow path inlet can be prevented from being heated by heat transfer from the flow path outlet, and the cooling effect of the refrigerant on the plate-like member from the flow path inlet to the flow path outlet can be ensured.

[0011] The present invention can be realized in various forms, such as a method for manufacturing a holding device, a system including a holding device, a control method for these devices and systems, a computer program for causing these devices and systems to process objects, a server device for distributing the computer program, and a non-transitory storage medium on which the computer program is stored. [Brief explanation of the drawings]

[0012] [Figure 1] FIG. 2 is a perspective view of the holding device according to the embodiment. [Figure 2] FIG. 2 is a first cross-sectional view of a retaining device. [Figure 3] FIG. 10 is a second cross-sectional view of the retaining device. [Figure 4] FIG. 10 is an enlarged view of an example of a wide curved section. [Figure 5] This is an explanatory diagram of the angle between two tangents. [Figure 6] FIG. 10 is an enlarged view of an example of a wide curved section. [Figure 7] FIG. 10 is an explanatory diagram showing a bonded body of a comparative example. [Figure 8] FIG. 10 is an enlarged view of an example of an isolated curved section. [Figure 9] FIG. 10 is an enlarged view of an example of an isolated curved section. DETAILED DESCRIPTION OF THE INVENTION

[0013] First Embodiment FIG. 1 is a perspective view of a holding device 1 according to this embodiment. FIG. 2 is a first cross-sectional view of the holding device 1 according to this embodiment. The holding device 1 according to this embodiment is an electrostatic chuck that attracts and holds a substrate W by electrostatic attraction. The electrostatic chuck is used, for example, as a table on which the substrate W is placed in an etching process using plasma in a chamber equipped with the electrostatic chuck. The holding device 1 according to this embodiment includes a base 10, a ceramic substrate 20, and a joint (not shown). In the holding device 1, as shown in FIG. 1, the base 10 and the ceramic substrate 20 are stacked in this order. The holding device 1 positions the substrate W relative to the holding device 1 using a focus ring FR installed on the outer periphery of the ceramic substrate 20. For convenience, in FIGS. 1 and 2, the stacking direction of the base 10 and the ceramic substrate 20 is indicated as the z-axis direction, the direction perpendicular to the z-axis is indicated as the x-axis direction, and the direction perpendicular to the z-axis and the x-axis is indicated as the y-axis direction. For convenience of explanation, the dimensional relationships between the base 10, the ceramic base 20, the substrate W, and the focus ring FR in FIGS. 1 and 2 differ from the actual relationships.

[0014] The base 10 is a sintered body mainly composed of silicon carbide (SiC), and is a substantially cylindrical member that serves as the base of the holding device 1. Here, "main component" refers to the component with the highest content. The material forming the base 10 is not limited to a material mainly composed of silicon carbide. The base 10 may also be formed from aluminum (Al), titanium (Ti), molybdenum (Mo), tungsten (W), alloys thereof, SUS, composites of metals and ceramics such as Al-SiC, or materials mainly composed of ceramics such as aluminum nitride (AlN) or alumina (Al2O3).

[0015] The base 10 has a first base 11 and a second base 12. The first base 11 and the second base 12 are bonded together by an adhesive layer (not shown). Note that the base 10 is not limited to a two-layer structure such as the first base 11 and the second base 12, and may have a single-layer structure or a three or more layer structure.

[0016] As shown in FIG. 2, the first base 11 is located on the most negative side in the z-axis direction of the holding device 1. The first base 11 is a substantially circular plate-like member and has a pair of main surfaces 11a and 11b. The second base 12 is stacked on the first base 11 on the positive side in the z-axis direction of the first base 11. The second base 12 is a substantially circular plate-like member of approximately the same size as the first base 11 and has a pair of main surfaces 12a and 12b. Of the pair of main surfaces 12a and 12b of the second base 12, the main surface 12b on the negative side in the z-axis direction has a groove 13 formed therein that serves as a flow path 30 through which a refrigerant flows. When the first base 11 and the second base 12 are joined, the first base 11 serves as a cover for the groove 13, thereby forming the flow path 30. The base 10 has a plurality of holes 14 formed along the z-axis direction of the holding device 1. The detailed shape of the flow path 30 will be described later.

[0017] The ceramic substrate 20 is a plate-shaped member disposed on the positive side of the base 10 in the z-axis direction. The ceramic substrate 20 is mainly composed of ceramic. The ceramic substrate 20 of this embodiment is formed from a material mainly composed of aluminum oxide. The ceramic substrate 20 may also be formed from other ceramics such as aluminum nitride or silicon carbide. The ceramic substrate 20 has a pair of main surfaces 20a and 20b.

[0018] The ceramic base 20 has a pair of main surfaces 20a, 20b, and a mounting surface 21 on which a substrate W is mounted is formed on one main surface 20a opposite the base 10. A focus ring mounting surface 22 on which a focus ring FR is mounted is formed on the outer periphery of the one main surface 20a of the ceramic base 20. The other main surface 20b of the pair of main surfaces 20a, 20b of the ceramic base 20 is joined to the second base 12 by a joint (not shown). The ceramic base 20 has holes 23 formed therein that communicate with the plurality of holes 14 formed in the base 10. Note that the method for joining the base 10 and the ceramic base 20 includes, but is not limited to, metal joining, resin joining, and joining using an inorganic material.

[0019] The ceramic base 20 of this embodiment has an electrode 24. The electrode 24 is disposed inside the ceramic base 20. The electrode 24 is formed of a conductive material such as tungsten or molybdenum. The electrode 24 is connected to an external power supply via an electrode terminal (not shown) inserted through the holes 14 and 23. Examples of the electrode 24 include a high-frequency electrode, a chuck electrode, and a heater electrode.

[0020] The holding device 1 of this embodiment has a hole 5a penetrating the bonded body 5 made of the base 10 and the ceramic substrate 20 in the z-axis direction by the hole 14 formed in the base 10 and the hole 23 formed in the ceramic substrate 20. The hole 5a in the bonded body 5 is used as a terminal hole for inserting a power supply terminal (not shown) for supplying power to the electrode 24 of the ceramic substrate 20, a gas hole for supplying helium gas to the backside of the substrate W, a lift pin hole for inserting a lift pin (not shown) for lifting the substrate W from the ceramic substrate 20, a sensor hole for inserting a temperature sensor (not shown) for measuring the temperature of the mounting surface 21, and the like. Note that although the hole 5a in the bonded body 5 of this embodiment is described as penetrating the bonded body 5 in the z-axis direction, it does not have to penetrate the bonded body 5. Specifically, the hole 5a may be configured by combining, for example, the hole 14 penetrating the base 10 with the other main surface 20b of the ceramic substrate 20 or a hole having a bottom surface formed on the other main surface 20b. In this case, the other main surface 20b of the ceramic base 20 or a bottom surface formed on the other main surface 20b becomes the bottom surface of the hole 5a. Alternatively, the hole 14 may be a non-through hole having a bottom surface.

[0021] The bonded body 5 corresponds to a "plate-like member" in the claims. That is, the bonded body 5 is a plate-like member having a mounting surface 21 on which a substrate W, which is an object, is mounted, and having a flow path 30 formed therein through which a coolant flows.

[0022] FIG. 3 is a second cross-sectional view of the holding device 1. FIG. 3 is a cross-sectional view taken along line AA in FIG. 2. FIG. 3 is a cross-sectional view of the bonded body 5 at a position where the groove 13 (flow path 30) is formed. As shown in FIG. 3, the flow path 30 is formed in a substantially spiral shape. The flow path 30 includes a flow path inlet IN through which the refrigerant flows into the flow path 30 and a flow path outlet OUT through which the refrigerant flows out of the flow path 30. The flow path inlet IN and the flow path outlet OUT in the cross-section are circular. The flow path 30 may also include a plurality of branching and merging sections where the flow path 30 branches into two flow paths and these flow paths merge into one flow path.

[0023] In addition to a flow path inlet IN and a flow path outlet OUT, the flow path 30 includes a wide curved section and an isolated curved section. Of the wide curved section and the isolated curved section, the wide curved section will be described first. The hatched section WC1 in FIG. 3 is an example of the wide curved section. In the cross section shown in FIG. 3, the wide curved section is a section in which the flow path 30 is curved by 90 degrees or more while including a wide section of the flow path 30 (illustrated as the wide section WD in FIG. 4). In this embodiment, the length of the wide curved section is 10% or less of the total length of the flow path 30 in the cross section shown in FIG. 3. That is, the length of the section WC1 is 10% or less of the total length of the flow path 30. Details of the section SC1 shown in FIG. 3 will be described later with reference to FIG. 8.

[0024] Fig. 4 is an enlarged view of section WC1 shown in Fig. 3 as an example of the wide curved section. Fig. 4 shows a center line Lw, one end Ew1, and the other end Ew2. The center line Lw is the center line of the flow path 30 within the wide curved section. In other words, the center line Lw is the bisector of the width of the flow path 30 at each position within the wide curved section. The one end Ew1 and the other end Ew2 are one end and the other end of the wide curved section.

[0025] Using FIG. 4, two requirements that a section deemed to be a wide curved section must satisfy are described. First, the first requirement is described. In section WC1, the angle between a tangent line Tw1 to the center line Lw at one end Ew1 and a tangent line Tw2 to the center line Lw at the other end Ew2 is 90 degrees or greater. FIG. 5 shows the angle α between the tangent lines Tw1 and Tw2 shown in FIG. 4. The angle α indicates the degree of curvature of the flow path 30 in section WC1, and therefore section WC1 is a section in which the flow path 30 is curved by 90 degrees or greater. In this way, a section of the flow path 30 that is deemed to be a wide curved section satisfies the requirement that the flow path 30 is curved by 90 degrees or greater (a curved section).

[0026] Next, the second requirement will be explained. The width of the flow path 30 in the wide section WD, which is indicated by dense hatching in FIG. 4, is wider than both the width Ws1 of the flow path 30 at one end Ew1 and the width Ws2 of the flow path 30 at the other end Ew2. The width of the flow path 30 here refers to the length of the flow path 30 in a direction perpendicular to the tangent line at each position of the center line Lw. The section WC1 contains such a wide section WD. In this way, a section of the flow path 30 that is considered to be a wide curved section satisfies both of the two requirements: that it is a curved section and that it contains a wide section.

[0027] FIG. 6 shows section WC2 included in flow path 30. Section WC2 is a wide curved section different from section WC1 shown in FIG. 3. Any section included in flow path 30 whose length is 10% or less of the total length of flow path 30 and that satisfies the two requirements described above is considered to be a wide curved section included in flow path 30. For example, section WC2 (shown in FIG. 6) has a different length from section WC1 (shown in FIG. 3), but satisfies the two requirements described above, and is therefore considered to be a wide curved section like section WC1. In this way, flow path 30 includes countless wide curved sections of different positions and lengths.

[0028] Because the positions of the flow path inlet IN and the flow path outlet OUT are determined by the relative positions of other components in the chamber, the flow path 30 may need to have a curved section (a section of the flow path 30 curved by 90 degrees or more). In this case, the temperature distribution of the portion of the support surface 21 (see FIGS. 1 and 2) on which the substrate W is placed, corresponding to the curved section, may be lower than the surrounding areas. FIG. 7 is an explanatory diagram showing a comparative bonded body 5c. The flow path 30c formed in the comparative bonded body 5c differs from the flow path 30 only in the shape of the portion corresponding to the section WC1 (see FIG. 3). The section WCc shown in FIG. 7 is a section of the flow path 30c that corresponds to the section WC1 (see FIG. 3) of the flow path 30. Although the section WCc is a section of the flow path 30c curved by 90 degrees or more, it does not include a wide section and is therefore considered a simple curved section rather than a wide curved section. A simple curved section without a wide section, such as the section WCc, is prone to turbulent refrigerant flow. Such turbulence produces a cooling effect, and the area around the position where the turbulence occurs becomes colder, which promotes non-uniformity of the temperature distribution on the support surface 21 (see FIGS. 1 and 2) on which the substrate W is placed.

[0029] In this regard, since the wide curved section (for example, section WC1 in FIG. 4) in the holding device 1 of this embodiment includes a wide section (for example, wide section WD in FIG. 4), the generation of turbulence in the wide curved section can be suppressed. As a result, the cooling effect caused by the generation of turbulence in the wide curved section is alleviated, and the uniformity of the temperature distribution in the support surface 21 on which the substrate W is placed can be improved.

[0030] Of the wide curved section and the isolated curved section included in the flow path 30, the isolated curved section will now be described. The section SC1 shown by hatching in FIG. 3 is an example of the isolated curved section. In the cross section shown in FIG. 3, the isolated curved section is a section in which the flow path 30 is bent by 90 degrees or more, and the length (illustrated as the non-formed section NF in FIG. 8) of the non-formed section in which the flow path 30 is not formed between one end and the other end of the section is a set distance or more. Details will be described using FIG. 8. Note that in this embodiment, the length of the isolated curved section is 10% or less of the total length of the flow path 30 in the cross section shown in FIG. 3. In other words, the length of the section SC1 is 10% or less of the total length of the flow path 30.

[0031] Figure 8 is an enlarged view of section SC1 shown in Figure 3. Figure 8 shows a center line Ls, one end Es1, and the other end Es2. The center line Ls is the center line of the flow path 30 in the isolated curved section. In other words, the center line Ls is the bisector of the width of the flow path 30 at each position in the isolated curved section. The one end Es1 and the other end Es2 are one end and the other end of the isolated curved section.

[0032] Using Figure 8, we will explain two requirements that a section considered to be an isolated curved section must meet. First, we will explain the first requirement. In section SC1, the angle between a tangent line Ts1 to the center line Ls at one end Es1 and a tangent line Ts2 to the center line Ls at the other end Es2 is 90 degrees or more, similar to the wide curved section described above (see Figure 5). In other words, section SC1 is a section in which the flow path 30 is curved by 90 degrees or more. In this way, a section of flow path 30 that is considered to be an isolated curved section meets the requirement of being a curved section, similar to the wide curved section described above.

[0033] Next, the second requirement will be explained. In section SC1, the length SP of the non-formed portion NF where no flow path 30 is formed between one end Es1 and the other end Es2 is equal to or greater than a set distance. The set distance refers to the combined length of the width Ss1 of the flow path at the one end Es1 and the width Ss2 of the flow path at the other end Es2. The width of the flow path 30 here refers to the length of the flow path 30 in a direction perpendicular to the tangent line at each position of the center line Ls. In this way, a section of the flow path 30 that is considered to be an isolated curved section satisfies both the two requirements of being a curved section and that the length of the non-formed portion be equal to or greater than a set distance.

[0034] FIG. 9 shows section SC2 included in flow path 30. Section SC2 is an isolated curved section different from section SC1 shown in FIGS. 3 and 8. Any section included in flow path 30 whose length is 10% or less of the total length of flow path 30 and that satisfies the two requirements described above is considered to be an isolated curved section included in flow path 30. For example, section SC2 (shown in FIG. 9) is a different section from section SC1 (shown in FIG. 8), but it satisfies the two requirements described above and is therefore considered to be a wide curved section like section SC1. Thus, flow path 30 includes countless isolated curved sections with different positions and lengths. Note that in section SC2, the width Ss4 of the flow path at the other end Es4 is very close to zero, so the set distance is approximately equal to the width Ss3 of the flow path at one end Es3.

[0035] Section SC2 shown in Figure 9 is also an isolated curved section that includes a channel outlet OUT. In addition, a channel 30 is disposed between the channel outlet OUT included in the isolated curved section and the channel inlet IN that is not included in the isolated curved section (see Figure 3). As described above, the length of the isolated curved section is 10% or less of the total length of the channel 30 in the cross section, and therefore, in this embodiment, there is no isolated curved section that includes both the channel inlet IN and the channel outlet OUT.

[0036] As described above, the curved section is a section of the flow path 30 where turbulence of the refrigerant is likely to occur. This turbulence creates a cooling effect, and the curved section tends to have a relatively low temperature. On the other hand, the non-formation portion NF of the bonded body 5, where the flow path 30 is not formed, tends to have a relatively high temperature. In the isolated curved section (e.g., section SC1 in FIG. 8 and section SC2 in FIG. 9) in the holding device 1 of the embodiment described above, the length of the non-formation portion between one end and the other end is equal to or greater than a set distance. That is, a sufficiently large non-formation portion NF for heating the isolated curved section is ensured inside the isolated curved section, thereby improving the uniformity of the temperature distribution within the support surface 21 on which the substrate W is placed.

[0037] The flow path outlet OUT is a position where the coolant reaches after passing through the entire length of the flow path 30 and fully absorbing heat, and therefore the temperature there tends to be relatively high. Thus, the flow path outlet OUT is likely to be a temperature singularity point that deviates to some extent from the average temperature of the entire bonded body 5. Therefore, by including the flow path outlet OUT in an isolated curved section (e.g., section SC1 in FIG. 8 or section SC2 in FIG. 9), the cooling effect due to the generation of turbulence in the isolated curved section and the adjustment of the length of the non-forming portion NF to a set distance or more can further improve the uniformity of the temperature distribution within the support surface 21 on which the substrate W is placed.

[0038] The flow path inlet IN is the position where the refrigerant arrives when it begins to absorb heat from the assembly 5. Therefore, the temperature of the flow path inlet IN tends to be relatively low, and therefore the temperature tends to become a temperature singularity that deviates somewhat from the average temperature of the entire assembly 5. In the holding device 1 of the above-described embodiment, the flow path 30 is disposed between the flow path outlet OUT included in the isolating curved section (e.g., section SC1 in FIG. 8 or section SC2 in FIG. 9) and the flow path inlet IN not included in the isolating curved section. Therefore, the flow path 30 separates the flow path inlet IN, which tends to be relatively low in temperature, from the flow path outlet OUT, which tends to be relatively high in temperature, thereby suppressing heat transfer from the flow path outlet OUT to the flow path inlet IN. Therefore, heating of the refrigerant at the flow path inlet IN due to heat transfer from the flow path outlet OUT can be suppressed, thereby ensuring the cooling effect of the refrigerant on the assembly 5 from the flow path inlet IN to the flow path outlet OUT. When the flow path inlet IN and the flow path outlet OUT are disposed relatively close to each other, it is preferable to separate the two by disposing the flow path 30 between them as described above.

[0039] As described above, in the cross section of the bonded body 5 shown in Fig. 3 etc., the temperature tends to be relatively high in the non-formed portion where the flow path 30 is not formed. Therefore, it is preferable to arrange curved sections at each position of the cross section so that the area of ​​the non-formed portion at each position of the cross section does not become large. Furthermore, since the area up to the outer edge of the outer peripheral portion of the cross section is limited, the area available for heat dissipation is also limited, so it is preferable to arrange curved sections at the outer peripheral portion.

[0040] <Modification of this embodiment> The present invention is not limited to the above-described embodiment, and can be embodied in various forms without departing from the spirit of the invention. For example, the following modifications are also possible.

[0041] In the above embodiment, the length of the wide curved section and the length of the isolating curved section are 10% or less of the total length of the flow path 30 in the cross section of the assembly 5, but are not limited to this. For example, if the cross section of the assembly 5 is provided with a plurality of flow paths (a plurality of pairs of flow path inlets IN and flow path outlets OUT) rather than with a single flow path 30 (a pair of flow path inlet IN and flow path outlet OUT) as in the above embodiment, the length of the wide curved section and the length of the isolating curved section may be 10% or less of the total length of the plurality of flow paths formed in the cross section of the assembly 5.

[0042] In the above embodiment, the flow path 30 includes both a wide curved section and an isolated curved section, but this is not limited thereto. The flow path 30 may include a section that is both a wide curved section and an isolated curved section. In other words, the flow path 30 may include a section that satisfies all of the following conditions: it is a curved section, it contains a wide section, and the length of the non-formed portion is equal to or greater than a set distance. Furthermore, the flow path 30 may include only one of a wide curved section and an isolated curved section.

[0043] In the above embodiment, the flow path 30 includes an isolated curved section including a flow path outlet OUT therein. However, this is not limiting. The flow path 30 may also include an isolated curved section including a flow path inlet IN therein. That is, the flow path 30 may include an isolated curved section including either the flow path inlet IN or the flow path outlet OUT therein. Furthermore, when the flow path 30 includes an isolated curved section including a flow path inlet IN therein, it is preferable to arrange the flow path 30 between the flow path inlet IN included in the isolated curved section and the flow path outlet OUT that is not included in the isolated curved section, from the viewpoint of ensuring the cooling effect of the refrigerant on the assembly 5 from the flow path inlet IN to the flow path outlet OUT.

[0044] This aspect has been described above based on embodiments and modifications. However, the above-described embodiments are intended to facilitate understanding of this aspect and are not intended to limit this aspect. This aspect may be modified or improved without departing from the spirit and scope of the claims, and equivalents thereof are included in this aspect. Furthermore, if a technical feature is not described as essential in this specification, it may be deleted as appropriate. [Explanation of symbols]

[0045] 1...Holding device 5…Zygote 5a…hole 10...Foundation 11...First Foundation 11a, 11b...(First base) main surface 12...Second Foundation 12a, 12b...(Second base) main surface 12b…main surface 14...hole 20...Ceramic substrate 20a, 20b...Main surfaces (of ceramic substrate) 21...Placement surface 22...Focus ring mounting surface 23...hole 24...Electrode 30...Flow path FR...Focus ring IN: Flow path inlet NF…Non-formed part OUT…Flow path outlet

Claims

1. A holding device, a plate-like member having a placement surface on which an object is placed and having a flow path formed therein through which a refrigerant flows; In a cross section of the plate-like member at a position where the flow path is formed, the flow path includes an isolated curved section, which is a section where the flow path is curved by 90 degrees or more, and the length of a non-formed portion where the flow path is not formed between one end of the section and the other end of the section is equal to or longer than a set distance, A holding device, wherein the set distance is a length obtained by adding together the width of the flow path at the one end position and the width of the flow path at the other end position.

2. 2. The holding device of claim 1, the flow path includes a flow path inlet through which the coolant flows into the flow path and a flow path outlet through which the coolant flows out of the flow path, A holding device, wherein the flow path includes the isolated curved section that contains the flow path outlet.

3. 3. The holding device according to claim 2, a holding device, characterized in that the flow path is disposed between the flow path outlet contained in the isolating curved section and the flow path inlet not contained in the isolating curved section.

4. A holding device as described in claim 2, The shape of the flow path outlet in the cross section is circular, A holding device characterized in that, in the isolated curved section containing the flow path outlet, the diameter of the flow path outlet in the cross section is larger than both the width of the flow path at the position of the one end and the width of the flow path at the position of the other end.

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