Manufacturing method for highly reliable light source module

Abstract

To provide a method of manufacturing a high-reliability light source module.SOLUTION: A method of manufacturing a high-reliability light source module includes the steps of: dividing a circuit board into a first sub circuit board and a second sub circuit board; fitting a plurality of light sources to the first sub circuit board and the second sub circuit board; arranging the first sub circuit board and the second sub circuit board on a profile; joining the first sub circuit board and the second sub circuit board to each other, and positioning a positive electrode pad and a negative electrode pad of the first sub circuit board and a positive electrode pad and a negative electrode pad of the second sub circuit board; welding one end of a first connection member to the positive electrode pad of the first sub circuit board; welding the other end of the first connection member to the positive electrode pad of the second sub circuit board; welding one end of a second connection member to the negative electrode pad of the first sub circuit board; and welding the other end of the second connection member to the negative electrode pad of the second sub circuit board.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a method for manufacturing a light source module, and more particularly to a method for manufacturing a highly reliable light source module. [Background technology]

[0002] The light source boards used in conventional lighting fixtures are typically fixed to a profile, and the lengths of the light source boards vary (e.g., 0.6 meters, 1.2 meters, 1.5 meters, 1.8 meters, and 2.4 meters). Conventional light source boards are divided into two types: rigid circuit boards (RPCBs) and flexible circuit boards (FPCBs). Flexible circuit boards are typically formed by cutting a large raw substrate. However, the lengths of light source boards currently mainstream on the market are limited to 0.6 meters, 1.2 meters, and 1.5 meters. Custom manufacturing of 1.8-meter and 2.4-meter light source boards requires expensive, large-scale equipment. Furthermore, most suppliers are unable to manufacture light source boards of this length. Therefore, the manufacturing costs of 1.8-meter and 2.4-meter light source boards increase significantly, which in turn increases the manufacturing costs of lighting fixtures. Summary of the Invention [Problem to be solved by the invention]

[0003] An object of the present invention is to provide a method for manufacturing a highly reliable light source module. [Means for solving the problem]

[0004] According to one embodiment of the present invention, there is provided a method for manufacturing a highly reliable light source module, the method including the steps of: dividing a circuit board into a first sub-circuit board and a second sub-circuit board; attaching a plurality of light sources to the first sub-circuit board and the second sub-circuit board; arranging the first sub-circuit board and the second sub-circuit board on a profile; bonding the first sub-circuit board and the second sub-circuit board together and aligning the positive and negative pads of the first sub-circuit board with the positive and negative pads of the second sub-circuit board; welding one end of a first connecting member to the positive pad of the first sub-circuit board, welding the other end of the first connecting member to the positive pad of the second sub-circuit board, welding one end of a second connecting member to the negative pad of the first sub-circuit board, and welding the other end of the second connecting member to the negative pad of the second sub-circuit board.

[0005] In one embodiment, the manufacturing method further includes bending the first connecting member to form a first bending region, the first bending region including a plurality of first bends. 2. The method for manufacturing a highly reliable light source module according to claim 1.

[0006] In one embodiment, the plurality of first bent portions are located above the positive electrode pads of the first sub-circuit board or above the positive electrode pads of the second sub-circuit board.

[0007] In one embodiment, the manufacturing method further includes bending the second connecting member to form a second bending region, the second bending region including a plurality of second bends.

[0008] In one embodiment, the plurality of second bent portions are located above the negative electrode pads of the first sub-circuit board or above the negative electrode pads of the second sub-circuit board.

[0009] In one embodiment, the manufacturing method further includes bending the first connecting member to form a first protrusion, and bending the second connecting member to form a second protrusion, wherein an upper end of the first protrusion faces an upper end of the second protrusion.

[0010] In one embodiment, the manufacturing method further includes cutting the circuit board to form the first groove and the second groove.

[0011] In one embodiment, the first groove is located between the first connecting member and the first side wall of the profile.

[0012] In one embodiment, the second groove is located between the second connecting member and the second side wall of the profile.

[0013] In one embodiment, the first connecting member and the second connecting member are welding strips, welding rods or copper wires. [Effects of the Invention]

[0014] Based on the above, the method for manufacturing a highly reliable light source module according to an embodiment of the present invention may have one or more of the following advantages. (1) In one embodiment of the present invention, a method for manufacturing a light source module includes the steps of dividing a circuit board into a first sub-circuit board and a second sub-circuit board; attaching a plurality of light sources to the first sub-circuit board and the second sub-circuit board; arranging the first sub-circuit board and the second sub-circuit board on a profile; joining the first sub-circuit board and the second sub-circuit board to each other and aligning the positive electrode pad and the negative electrode pad of the first sub-circuit board with the positive electrode pad and the negative electrode pad of the second sub-circuit board; welding one end of a first connecting member to the positive electrode pad of the first sub-circuit board, welding the other end of the first connecting member to the positive electrode pad of the second sub-circuit board, welding one end of a second connecting member to the negative electrode pad of the first sub-circuit board, and welding the other end of the second connecting member to the negative electrode pad of the second sub-circuit board. The above-mentioned manufacturing method of the light source module does not require large-scale equipment, and can manufacture light source substrates of different lengths (e.g., 0.6 meters, 1.2 meters, 1.5 meters, 1.8 meters, 2.4 meters, etc.) according to actual needs in simple steps, greatly reducing the manufacturing cost of the light source substrate, thereby significantly reducing the manufacturing cost of the lighting device and meeting market demands. (2) In one embodiment of the present invention, the first connecting member of the light source module has a first bending region of a plurality of first bending portions, and the plurality of first bending portions are stacked on one another. The second connecting member of the light source module has a second bending region of a plurality of second bending portions, and the plurality of second bending portions are stacked on one another. The above structural design allows the first bending region and the second bending region to be used as a buffer structure, effectively preventing damage to the first connecting member and the second connecting member due to external stress or thermal expansion and contraction during transportation. This greatly improves the reliability of the light source module and extends the service life of the lighting device. (3) In one embodiment of the present invention, the first connecting member of the light source module has a first protrusion, and the second connecting member of the light source module has a second protrusion, with the upper end of the first protrusion facing the upper end of the second protrusion. This structural design allows the first and second protrusions to be used as a buffer structure, effectively preventing damage to the first and second connecting members due to external stress or thermal expansion and contraction during transportation. This significantly improves the reliability of the light source module and extends the life of the lighting device. (4) In one embodiment of the present invention, the circuit board of the light source module has a first groove and a second groove. The first groove is located between the first connecting member and the first side wall of the profile, and the second groove is located between the second connecting member and the second side wall of the profile. This structural design can effectively increase the creepage distance between the pads of the light source module and the profile, thereby effectively improving the quality of the light source module and meeting the needs of actual applications. (5) In one embodiment of the present invention, the light sources of the light source module can be evenly distributed on the sub-circuit boards. Therefore, through the above structural design, the light generated by the light source module can be made more uniform, thereby improving the overall performance of the lighting device. Therefore, the lighting device can provide a better user experience. [Brief explanation of the drawings]

[0015] [Figure 1]FIG. 2 is a first explanatory diagram of a method for manufacturing a highly reliable light source module according to an embodiment of the present invention. [Figure 2] FIG. 10 is a second explanatory diagram of the method for manufacturing a highly reliable light source module according to one embodiment of the present invention. [Figure 3] FIG. 10 is a third explanatory diagram of the method for manufacturing a highly reliable light source module according to one embodiment of the present invention. [Figure 4] FIG. 10 is a fourth explanatory diagram of the method for manufacturing a highly reliable light source module according to one embodiment of the present invention. [Figure 5] FIG. 5 is a fifth explanatory diagram of the method for manufacturing a highly reliable light source module according to one embodiment of the present invention. [Figure 6] FIG. 6 is a sixth explanatory diagram of the method for manufacturing a highly reliable light source module according to one embodiment of the present invention. [Figure 7] FIG. 7 is a seventh explanatory diagram of the method for manufacturing a highly reliable light source module according to one embodiment of the present invention. [Figure 8] FIG. 8 is an eighth explanatory diagram of the method for manufacturing a highly reliable light source module according to one embodiment of the present invention. [Figure 9] FIG. 9 is a ninth explanatory diagram of the method for manufacturing a highly reliable light source module according to one embodiment of the present invention. [Figure 10] 1 is a flowchart of a method for manufacturing a highly reliable light source module according to an embodiment of the present invention. [Figure 11] 10A to 10C are explanatory diagrams of a method for manufacturing a highly reliable light source module according to another embodiment of the present invention. [Figure 12] 10 is a flowchart of a method for manufacturing a highly reliable light source module according to another embodiment of the present invention. [Figure 13] 10A and 10B are explanatory views of a first connecting member according to still another embodiment of the present invention. [Figure 14] 10A and 10B are explanatory views of a second connecting member according to still another embodiment of the present invention. [Figure 15] 10 is a flowchart of a method for manufacturing a highly reliable light source module according to yet another embodiment of the present invention. [Figure 16] FIG. 10 is a first explanatory diagram of a method for manufacturing a highly reliable light source module according to still another embodiment of the present invention. [Figure 17]FIG. 10 is a second explanatory diagram of the method for manufacturing a highly reliable light source module according to still another embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0016] In the following embodiments, detailed features and advantages of the present invention are described, the contents of which are sufficient to enable those skilled in the art to understand the technical contents of the present invention and implement them accordingly, and the disclosure contents, claims and drawings of this specification allow those skilled in the art to easily understand the objectives and advantages of the present invention.

[0017] Hereinafter, embodiments of the method for manufacturing a highly reliable light source module of the present invention will be described with reference to the associated drawings. For clarity and ease of explanation in the drawings, the dimensions and proportions of each component in the drawings may be exaggerated or reduced. In the following description and / or claims, when a component is described as being "connected" or "coupled" to another component, this may be directly connected or coupled to the other component, or an intervening component may be present. When a component is described as being "directly connected" or "directly coupled" to another component, this does not mean that an intervening component is present, and other terms used to describe the relationship between components or layers should be interpreted similarly. For ease of understanding, the same components in the following embodiments will be denoted and described with the same reference numerals.

[0018] 1 is a first explanatory diagram of a method for manufacturing a highly reliable light source module according to one embodiment of the present invention. As shown in the figure, first, a circuit board 1 is cut to form a first groove G1 and a second groove G2. In one embodiment, the circuit board 1 may be a flexible printed circuit board (FPCB). In another embodiment, the circuit board 1 may be a rigid printed circuit board (RPCB).

[0019] Of course, this embodiment is only used for illustrative purposes and does not limit the scope of the present invention, and any equivalent modifications or variations made based on the manufacturing method of the high-reliability light source module of this embodiment should still fall within the protection scope of the present invention.

[0020] FIG. 2 is a second explanatory diagram of a method for manufacturing a highly reliable light source module according to one embodiment of the present invention. As shown in FIG. 2, the circuit board 1 is divided into a first sub-circuit board 11 and a second sub-circuit board 12. Then, a plurality of light sources LD are attached to the first sub-circuit board 11 and the second sub-circuit board 12. In one embodiment, the plurality of light sources LD may be light-emitting diodes. In another embodiment, the plurality of light sources LD may be a light-emitting diode array. In one embodiment, the first sub-circuit board 11 and the second sub-circuit board 12 may be the same size. In another embodiment, the first sub-circuit board 11 and the second sub-circuit board 12 may be different sizes. In still another embodiment, the circuit board 1 may be divided into three or more sub-circuit boards.

[0021] Of course, this embodiment is only used for illustrative purposes and does not limit the scope of the present invention, and any equivalent modifications or variations made based on the manufacturing method of the high-reliability light source module of this embodiment should still fall within the protection scope of the present invention.

[0022] 3 is a third diagram illustrating a method for manufacturing a highly reliable light source module according to an embodiment of the present invention. As shown in FIG. 3, a first sub-circuit board 11 and a second sub-circuit board 12 are placed on a profile MF. Next, the first sub-circuit board 11 and the second sub-circuit board 12 are bonded together, and the positive electrode pad P1+ and the negative electrode pad P1- of the first sub-circuit board 11 are aligned with the positive electrode pad P2+ and the negative electrode pad P2- of the second sub-circuit board 12 (the first sub-circuit board 11 and the second sub-circuit board 12 are fixed together by welding or another similar method). The positive electrode pad P1+ and the negative electrode pad P1- of the first sub-circuit board 11 may be located between two light sources LD (the two light sources LD are adjacent to each other, and one light source LD is adjacent to the second sub-circuit board 12). Similarly, the positive electrode pad P2+ and the negative electrode pad P2− of the second sub-circuit board 12 can be located between two light sources LD (the two light sources LD are adjacent to each other, and one light source LD is adjacent to the first sub-circuit board 11). In this way, the first sub-circuit board 11 and the second sub-circuit board 12 can form a complete light source board.

[0023] Of course, this embodiment is only used for illustrative purposes and does not limit the scope of the present invention, and any equivalent modifications or variations made based on the manufacturing method of the high-reliability light source module of this embodiment should still fall within the protection scope of the present invention.

[0024] 4 and 5 are fourth and fifth explanatory views of a method for manufacturing a highly reliable light source module according to one embodiment of the present invention. As shown in FIG. 4, one end of a first connecting member C1 is welded to a positive electrode pad P1+ of a first sub-circuit board 11. Next, as shown in FIG. 5, the first connecting member C1 is bent to form a first bending region B1. The first bending region B1 includes two first bending portions BP1, which are stacked together to form an S-shape. Thus, the first bending portions BP1 are located above the positive electrode pad P1+ of the first sub-circuit board 11. In another embodiment, the first bending portions BP1 may be located above the positive electrode pad P2+ of the second sub-circuit board 12. In another embodiment, the first bending region B1 includes three or more first bending portions BP1, which are stacked together. In this embodiment, the first connecting member C1 is a welding strip. In other embodiments, the first connecting member C1 may be a welding rod, copper wire, or other similar member.

[0025] Of course, this embodiment is only used for illustrative purposes and does not limit the scope of the present invention, and any equivalent modifications or variations made based on the manufacturing method of the high-reliability light source module of this embodiment should still fall within the protection scope of the present invention.

[0026] 6 is a sixth explanatory diagram of the manufacturing method of a highly reliable light source module according to one embodiment of the present invention. As shown in the figure, the other end of the first connecting member C1 is then welded to the positive electrode pad P2+ of the second sub-circuit board 12. In this manner, the first groove G1 is located between the first connecting member C1 and the first side wall W1 of the profile MF.

[0027] Of course, this embodiment is only used for illustrative purposes and does not limit the scope of the present invention, and any equivalent modifications or variations made based on the manufacturing method of the high-reliability light source module of this embodiment should still fall within the protection scope of the present invention.

[0028] 7 and 8 are seventh and eighth explanatory views of a manufacturing method for a highly reliable light source module according to one embodiment of the present invention. Similarly, as shown in FIG. 7, one end of the second connection member C2 is welded to the negative electrode pad P1- of the first sub-circuit board 11. As shown in FIG. 8, the second connection member C2 is bent to form a second bending region B2. The second bending region B2 includes two second bending portions BP2, which are stacked together to form an S-shape. Thus, the multiple second bending portions BP2 are located above the negative electrode pad P1- of the first sub-circuit board 11. In another embodiment, the multiple second bending portions BP2 may be located above the negative electrode pad P2- of the second sub-circuit board 12. In another embodiment, the second bending region B2 includes three or more second bending portions BP2, which are stacked together. In this embodiment, the second connection member C1 is also a welding strip. In another embodiment, the second connecting member C2 may be a welding rod, a copper wire, or other similar member.

[0029] Of course, this embodiment is only used for illustrative purposes and does not limit the scope of the present invention, and any equivalent modifications or variations made based on the manufacturing method of the high-reliability light source module of this embodiment should still fall within the protection scope of the present invention.

[0030] 9 is a ninth explanatory view of the manufacturing method of a highly reliable light source module according to one embodiment of the present invention. As shown in the figure, the other end of the second connection member C2 is then welded to the negative electrode pad P2 of the second sub-circuit board 12. In this manner, the second groove G2 is located between the second connection member C2 and the second side wall W2 of the profile MF.

[0031] The above manufacturing method can be used to manufacture a complete light source module 2. Three or more sub-circuit boards can be joined together in the same way to increase the length of the light source board of the light source module 2. Next, the process of installing the power module, globe, and lamp holder can proceed.

[0032] The above-mentioned manufacturing method of the light source module does not require large-scale equipment, and can manufacture light source substrates of different lengths (e.g., 0.6 meters, 1.2 meters, 1.5 meters, 1.8 meters, 2.4 meters, etc.) according to actual needs in simple steps, greatly reducing the manufacturing cost of the light source substrate, thereby significantly reducing the manufacturing cost of the lighting device and meeting market demands.

[0033] As described above, the first connecting member C1 of the light source module 2 has a first bending region B1 with a plurality of first bending portions BP1, and the plurality of first bending portions BP1 are stacked on top of each other. The second connecting member C2 of the light source module 2 has a second bending region B2 with a plurality of second bending portions BP2, and the plurality of second bending portions BP2 are stacked on top of each other. This structural design allows the first bending region B1 and the second bending region B2 to be used as a buffer structure, effectively preventing damage to the first connecting member C1 and the second connecting member C2 due to external stress or thermal expansion and contraction during transportation. This significantly improves the reliability of the light source module 2 and extends the life of the lighting device.

[0034] The circuit board 1 of the light source module 2 also has a first groove G1 and a second groove G2. The first groove G1 is located between the first connecting member C1 and the first sidewall W1 of the profile MF, and the second groove G2 is located between the second connecting member C2 and the second sidewall W2 of the profile MF. This structural design effectively increases the creepage distance between the pads of the light source module 2 and the profile, thereby effectively improving the quality of the light source module 2 and meeting the needs of practical applications.

[0035] Of course, this embodiment is only used for illustrative purposes and does not limit the scope of the present invention, and any equivalent modifications or variations made based on the manufacturing method of the high-reliability light source module of this embodiment should still fall within the protection scope of the present invention.

[0036] 10 is a flowchart showing a method for manufacturing a highly reliable light source module according to an embodiment of the present invention. As shown in the figure, the method for manufacturing a highly reliable light source module according to this embodiment includes the following steps. Step S101: Divide the circuit board into a first sub-circuit board and a second sub-circuit board. Step S102: Mount a plurality of light sources on the first sub-circuit board and the second sub-circuit board. Step S103: Place the first sub-circuit board and the second sub-circuit board on the profile. Step S104: The first and second sub-circuit boards are joined together, and the positive and negative pads of the first sub-circuit board are aligned with the positive and negative pads of the second sub-circuit board. Step S105: One end of the first connecting member is welded to the positive electrode pad of the first sub-circuit board, and the first connecting member is bent to form a first bending region including a plurality of first bending portions. Step S106: Weld the other end of the first connecting member to the positive electrode pad of the second sub-circuit board. Step S107: One end of the second connecting member is welded to the negative electrode pad of the first sub-circuit board, and the second connecting member is bent to form a second bending region including a plurality of second bending portions. Step S108: Weld the other end of the second connecting member to the negative electrode pad of the second sub-circuit board.

[0037] Of course, this embodiment is only used for illustrative purposes and does not limit the scope of the present invention, and any equivalent modifications or variations made based on the manufacturing method of the high-reliability light source module of this embodiment should still fall within the protection scope of the present invention.

[0038] Although the steps of the methods described herein are shown and described in a particular order, the order of operations of each method may be changed, some steps may be performed in reverse order or simultaneously with other steps, and in other embodiments, different steps may be performed intermittently and / or alternately.

[0039] Currently, the mainstream lengths of light source boards on the market are limited to 0.6 meters, 1.2 meters, and 1.5 meters. 1.8-meter and 2.4-meter light source boards require customized manufacturing and require expensive, large-scale facilities. Most suppliers are unable to manufacture light source boards of this length. Therefore, the manufacturing costs of 1.8-meter and 2.4-meter light source boards increase significantly, which in turn increases the manufacturing costs of lighting fixtures. In contrast, according to an embodiment of the present invention, a method for manufacturing a light source module includes the steps of dividing a circuit board into a first sub-circuit board and a second sub-circuit board, attaching a plurality of light sources to the first sub-circuit board and the second sub-circuit board, arranging the first sub-circuit board and the second sub-circuit board on a profile, joining the first sub-circuit board and the second sub-circuit board to each other and aligning the positive electrode pad and the negative electrode pad of the first sub-circuit board with the positive electrode pad and the negative electrode pad of the second sub-circuit board, welding one end of a first connecting member to the positive electrode pad of the first sub-circuit board, welding the other end of the first connecting member to the positive electrode pad of the second sub-circuit board, welding one end of a second connecting member to the negative electrode pad of the first sub-circuit board, and welding the other end of the second connecting member to the negative electrode pad of the second sub-circuit board. The above-mentioned manufacturing method of the light source module does not require large-scale equipment, and can manufacture light source substrates of different lengths (e.g., 0.6 meters, 1.2 meters, 1.5 meters, 1.8 meters, 2.4 meters, etc.) according to actual needs in simple steps, greatly reducing the manufacturing cost of the light source substrate, thereby significantly reducing the manufacturing cost of the lighting device and meeting market demands.

[0040] According to an embodiment of the present invention, the first connecting member of the light source module has a first bending region of a plurality of first bending portions, and the plurality of first bending portions are stacked on one another. The second connecting member of the light source module has a second bending region of a plurality of second bending portions, and the plurality of second bending portions are stacked on one another. The above structural design allows the first bending region and the second bending region to be used as a buffer structure, effectively preventing damage to the first connecting member and the second connecting member due to external stress or thermal expansion and contraction during transportation. This greatly improves the reliability of the light source module and extends the service life of the lighting device.

[0041] According to an embodiment of the present invention, the circuit board of the light source module has a first groove and a second groove. The first groove is located between the first connecting member and the first side wall of the profile, and the second groove is located between the second connecting member and the second side wall of the profile. This structural design can effectively increase the creepage distance between the pads of the light source module and the profile, thereby effectively improving the quality of the light source module and meeting the needs of practical applications.

[0042] Furthermore, according to an embodiment of the present invention, the light sources of the light source module can be evenly distributed on the sub-circuit boards. Therefore, through the above structural design, the light generated by the light source module can be made more uniform, thereby improving the overall performance of the lighting device. Therefore, the lighting device can provide a better user experience.

[0043] 11 is an explanatory diagram of a method for manufacturing a highly reliable light source module according to another embodiment of the present invention. As shown in the figure, this embodiment differs from the previous embodiment in that the structures of the first connecting member C1 and the second connecting member C2 are changed.

[0044] After completing the steps of FIGS. 1 to 3, one end of the first connection member C1 is welded to the positive electrode pad P1+ of the first sub-circuit board 11. Next, the first connection member C1 is bent to form a first protrusion T1. The distance between the first protrusion T1 and the positive electrode pad P1+ of the first sub-circuit board 11 may be approximately equal to the distance between the first protrusion T1 and the positive electrode pad P2+ of the second sub-circuit board 12. The first protrusion T1 may be triangular. In another embodiment, the first protrusion T1 may be semicircular or have other shapes. The shape of the first protrusion T1 can be changed according to actual needs. In this embodiment, the first connection member C1 is a copper wire. Next, the other end of the first connection member C1 is welded to the positive electrode pad P2+ of the second sub-circuit board 12.

[0045] Similarly, one end of the second connection member C2 is welded to the negative electrode pad P1- of the first sub-circuit board 11. Next, the second connection member C2 is bent to form a second protrusion T2, and the upper end A1 of the first protrusion T1 faces the upper end A2 of the second protrusion T2. ​​The distance between the second protrusion T2 and the negative electrode pad P1- of the first sub-circuit board 11 may be approximately equal to the distance between the second protrusion T2 and the negative electrode pad P2- of the second sub-circuit board 12. The first protrusion T1 and the second protrusion T2 may have the same shape. The second protrusion T2 may be triangular. In another embodiment, the second protrusion T2 may be semicircular or have another shape. The shape of the second protrusion T2 can be changed according to actual needs. In this embodiment, the second connection member C2 is a copper wire. Next, the other end of the second connection member C2 is welded to the negative electrode pad P2- of the second sub-circuit board 12.

[0046] The above manufacturing method can be used to manufacture a complete light source module 2. Three or more sub-circuit boards can be joined together in the same way to increase the length of the light source board of the light source module 2. Next, the power module, globe, and lamp holder can be installed.

[0047] The above-mentioned manufacturing method of the light source module does not require large-scale equipment, and can manufacture light source substrates of different lengths (0.6 meters, 1.2 meters, 1.5 meters, 1.8 meters, 2.4 meters, etc.) according to actual needs in simple steps, greatly reducing the manufacturing cost of the light source substrate, thereby significantly reducing the manufacturing cost of the lighting device and meeting market demands.

[0048] As described above, the first connecting member C1 of the light source module 2 has a first protrusion T1, and the second connecting member C2 of the light source module 2 has a second protrusion T2, with the upper end A1 of the first protrusion T1 facing the upper end A2 of the second protrusion T2. ​​This structural design allows the first and second protrusions T1 and T2 to function as a buffer structure, effectively preventing damage to the first and second connecting members C1 and C2 due to external stress or thermal expansion and contraction during transportation. This significantly improves the reliability of the light source module 2 and extends the life of the lighting device.

[0049] Similarly, the circuit board 1 of the light source module 2 has a first groove G1 and a second groove G2. The first groove G1 is located between the first connecting member C1 and the first side wall W1 of the profile MF, and the second groove G2 is located between the second connecting member C2 and the second side wall W2 of the profile MF. The above structural design can effectively increase the creepage distance between the pads of the light source module 2 and the profile, thereby effectively improving the quality of the light source module 2 and meeting the needs of practical applications.

[0050] Furthermore, the structural design allows the upper end A1 of the first protrusion T1 and the upper end A2 of the second protrusion T2 to face each other, so that the first protrusion T1 extends toward the first sidewall W1 away from the profile, and the second protrusion T2 extends toward the second sidewall W2 away from the profile MF. This structural design further increases the creepage distance between the two components, thereby further improving the quality of the light source module and meeting the needs of practical applications.

[0051] Of course, this embodiment is only used for illustrative purposes and does not limit the scope of the present invention, and any equivalent modifications or variations made based on the manufacturing method of the high-reliability light source module of this embodiment should still fall within the protection scope of the present invention.

[0052] 12 is a flowchart of a method for manufacturing a highly reliable light source module according to another embodiment of the present invention. As shown in the figure, the method for manufacturing a highly reliable light source module according to this embodiment includes the following steps. Step S121: Divide the circuit board into a first sub-circuit board and a second sub-circuit board. Step S122: Mount a plurality of light sources on the first sub-circuit board and the second sub-circuit board. Step S123: The first and second sub-circuit boards are placed on the profile. Step S124: The first and second sub-circuit boards are bonded together, and the positive and negative pads of the first sub-circuit board are aligned with the positive and negative pads of the second sub-circuit board. Step S125: One end of the first connection member is welded to the positive electrode pad of the first sub-circuit board, and the first connection member is bent to form a first protrusion. Step S126: Weld the other end of the first connecting member to the positive electrode pad of the second sub-circuit board. Step S127: Weld one end of the second connecting member to the negative pad of the first sub-circuit board, and bend the second connecting member to form a plurality of second protrusions, the upper ends of the first protrusions facing the upper ends of the second protrusions. Step S128: Weld the other end of the second connecting member to the negative electrode pad of the second sub-circuit board.

[0053] Of course, this embodiment is only used for illustrative purposes and does not limit the scope of the present invention, and any equivalent modifications or variations made based on the manufacturing method of the high-reliability light source module of this embodiment should still fall within the protection scope of the present invention.

[0054] Although the steps of the methods described herein are shown and described in a particular order, the order of operations of each method may be changed, some steps may be performed in reverse order or simultaneously with other steps, and in other embodiments, different steps may be performed intermittently and / or alternately.

[0055] Please refer to Figures 13, 14, and 15. Figure 13 is an explanatory diagram of a first connecting member according to yet another embodiment of the present invention. Figure 14 is an explanatory diagram of a second connecting member according to yet another embodiment of the present invention. Figure 15 is a flowchart of a method for manufacturing a high-reliability light source module according to yet another embodiment of the present invention. As shown in the figures, what differs from the previous embodiments is that the structures of the first connecting member C1 and the second connecting member C2 of this embodiment are changed.

[0056] 1 to 3 are completed, the first connecting member C1 is bent to form two first connection pins UP1 at both ends of the first connecting member C1, with each first connection pin UP1 forming a 90° angle with the first connecting member C1. The positive pad P1+ of the first sub-circuit board 11 has a first positive pad hole K1+, and the positive pad P2+ of the second sub-circuit board 12 has a second positive pad hole K2+. The two first connection pins UP1 of the first connecting member C1 are inserted into the first positive pad hole K1+ and the second positive pad hole K2+, respectively, and welded to connect the positive pad P1+ of the first sub-circuit board 11 and the positive pad P2+ of the second sub-circuit board 12 to the first connecting member C1.

[0057] Similarly, the second connection member C2 can be bent to form two second connection pins UP2 at both ends of the second connection member C2, and the angle between each second connection pin UP2 and the second connection member C2 is 90°. The negative electrode pad P1- of the first sub-circuit board 11 has a first negative electrode pad hole K1-, and the negative electrode pad P2- of the second sub-circuit board 12 has a second negative electrode pad hole K2-. The two second connection pins UP2 of the second connection member C2 are inserted into the first negative electrode pad hole K1- and the second negative electrode pad hole K2-, respectively, and welded to connect the negative electrode pad P1- of the first sub-circuit board 11 and the negative electrode pad P2- of the second sub-circuit board 12 to the second connection member C2.

[0058] The above manufacturing method can be used to manufacture a complete light source module 2. Three or more sub-circuit boards can be joined together in the same way to increase the length of the light source board of the light source module 2. Next, the power module, globe, and lamp holder can be installed.

[0059] The above-mentioned manufacturing method of the light source module does not require large-scale equipment, and can manufacture light source substrates of different lengths (0.6 meters, 1.2 meters, 1.5 meters, 1.8 meters, 2.4 meters, etc.) according to actual needs in simple steps, greatly reducing the manufacturing cost of the light source substrate, thereby significantly reducing the manufacturing cost of the lighting device and meeting market demands.

[0060] Of course, this embodiment is only used for illustrative purposes and does not limit the scope of the present invention, and any equivalent modifications or variations made based on the manufacturing method of the high-reliability light source module of this embodiment should still fall within the protection scope of the present invention.

[0061] 16 and 17 are first and second explanatory views of a method for manufacturing a highly reliable light source module according to yet another embodiment of the present invention. As shown in the figures, this embodiment differs from the previous embodiment in that silicone wires are used instead of the first connecting member C1 and the second connecting member C2. The first sub-circuit board 11 further includes a pad P1x (the number of pads on the first sub-circuit board 11 exceeds two), and the second sub-circuit board 12 further includes a pad P2x (the number of pads on the first sub-circuit board 11 exceeds two). The pad P1x includes a pad hole K1x, and the pad P2x includes a pad hole K2x.

[0062] 1 and 2 are completed, one end of the first silicone wire Wr1 can be welded to the first positive pad hole K1+ of the first sub-circuit board 11, and the other end of the first silicone wire Wr1 can be welded to the second positive pad hole K2+ of the second sub-circuit board 12. Then, one end of the two silicone wires Wr2 can be welded to the first negative pad hole K1- of the first sub-circuit board 11, and the other end of the second silicone wire Wr2 can be welded to the second negative pad hole K2- of the second sub-circuit board 12. Similarly, one end of the three silicone wires Wr3 can be welded to the pad hole K1x of the first sub-circuit board 11, and the other end of the third silicone wire Wr1 can be welded to the pad hole K2x of the second sub-circuit board 12.

[0063] The first sub-circuit board 11 and the second sub-circuit board 12 are placed on the profile MF. Next, the first sub-circuit board 11 and the second sub-circuit board 12 are joined together, and the positive electrode pad P1+ and the negative electrode pad P1− of the first sub-circuit board 11 are aligned with the positive electrode pad P2+ and the negative electrode pad P2− of the second sub-circuit board 12 (the first sub-circuit board 11 and the second sub-circuit board 12 can be fixed by riveting or other methods). The positive electrode pad P1+ and the negative electrode pad P1− of the first sub-circuit board 11 can be positioned between two light sources LD (the two light sources LD are adjacent to each other, and one light source LD is adjacent to the second sub-circuit board 12). Similarly, the positive electrode pad P2+ and the negative electrode pad P2− of the second sub-circuit board 12 can be positioned between two light sources LD (the two light sources LD are adjacent to each other, and one light source LD is adjacent to the first sub-circuit board 11). In this way, the first sub-circuit board 11 and the second sub-circuit board 12 can form a complete light source board. By arranging the first silicone wire Wr1, the second silicone wire Wr2, and the third silicone wire Wr3 between the profile MF and the light source board, the space between the profile MF and the light source board can be effectively utilized.

[0064] The above manufacturing method can be used to manufacture a complete light source module 2. In the same way, three or more sub-circuit boards can be joined together to increase the length of the light source board of the light source module 2. Next, the power module, globe, and lamp holder can be installed.

[0065] Since the number of pads on the first sub-circuit board 11 is three or more, the number of pads on the second sub-circuit board 12 may also be three or more. Therefore, when the structure of the first connecting member C1 and the second connecting member C2 is adopted, a short circuit phenomenon is more likely to occur.

[0066] In contrast, the first silicone wire Wr1, second silicone wire Wr2, and third silicone wire Wr3 are elastic and bendable, allowing them to be placed between the profile MF and the light source substrate, preventing various problems caused by external stress and thermal expansion and contraction. The above structure not only makes effective use of the space between the profile MF and the light source substrate, but also prevents short circuits. This configuration also effectively reduces costs.

[0067] In summary, according to an embodiment of the present invention, a method for manufacturing a light source module includes the steps of dividing a circuit board into a first sub-circuit board and a second sub-circuit board; attaching a plurality of light sources to the first sub-circuit board and the second sub-circuit board; arranging the first sub-circuit board and the second sub-circuit board on a profile; bonding the first sub-circuit board and the second sub-circuit board together and aligning the positive electrode pad and the negative electrode pad of the first sub-circuit board with the positive electrode pad and the negative electrode pad of the second sub-circuit board; welding one end of a first connecting member to the positive electrode pad of the first sub-circuit board, welding the other end of the first connecting member to the positive electrode pad of the second sub-circuit board, welding one end of a second connecting member to the negative electrode pad of the first sub-circuit board, and welding the other end of the second connecting member to the negative electrode pad of the second sub-circuit board. The above-mentioned manufacturing method of the light source module does not require large-scale equipment, and can manufacture light source substrates of different lengths (e.g., 0.6 meters, 1.2 meters, 1.5 meters, 1.8 meters, 2.4 meters, etc.) according to actual needs in simple steps, greatly reducing the manufacturing cost of the light source substrate, thereby significantly reducing the manufacturing cost of the lighting device and meeting market demands.

[0068] According to an embodiment of the present invention, the first connecting member of the light source module has a first bending region of a plurality of first bending portions, and the plurality of first bending portions are stacked on one another. The second connecting member of the light source module has a second bending region of a plurality of second bending portions, and the plurality of second bending portions are stacked on one another. The above structural design allows the first bending region and the second bending region to be used as a buffer structure, effectively preventing damage to the first connecting member and the second connecting member due to external stress or thermal expansion and contraction during transportation. This greatly improves the reliability of the light source module and extends the service life of the lighting device.

[0069] According to an embodiment of the present invention, the first connecting member of the light source module has a first protrusion, and the second connecting member of the light source module has a second protrusion, with the upper end of the first protrusion facing the upper end of the second protrusion. This structural design allows the first and second protrusions to be used as a buffer structure, effectively preventing damage to the first and second connecting members due to external stress or thermal expansion and contraction during transportation. This significantly improves the reliability of the light source module and extends the life of the lighting device.

[0070] According to an embodiment of the present invention, the circuit board of the light source module has a first groove and a second groove. The first groove is located between the first connecting member and the first side wall of the profile, and the second groove is located between the second connecting member and the second side wall of the profile. This structural design can effectively increase the creepage distance between the pads of the light source module and the profile, thereby effectively improving the quality of the light source module and meeting the needs of practical applications.

[0071] Furthermore, according to an embodiment of the present invention, the light sources of the light source module can be evenly distributed on the sub-circuit boards. Therefore, through the above structural design, the light generated by the light source module can be made more uniform, thereby improving the overall performance of the lighting device. Therefore, the lighting device can provide a better user experience.

[0072] Although the above embodiments are described in this specification, it should be noted that they do not limit the scope of the claims of the present invention. Therefore, any changes and modifications to the embodiments described in this specification based on the innovative concept of the present invention, or the replacement of equivalent structures or equivalent processes made using the contents of the specification and drawings of the present invention, or the direct or indirect application of the above technical solutions to other related technical fields, are all within the scope of the claims of the present invention. [Explanation of symbols]

[0073] 1 circuit board 11 First sub-circuit board 12 Second sub-circuit board 2 Light Source Module LD light source MF Profile P1+ Positive pad of the first sub-circuit board K1+ 1st positive electrode pad hole P1- Negative pad of the first sub-circuit board K1- 1st negative electrode pad hole P1x Pad on the first sub-circuit board K1x Pad hole P2+ Positive pad of the second sub-circuit board K2+ Second positive electrode pad hole P2- Negative pad of the second sub-circuit board K2- 1st negative electrode pad hole P2x Pads on the second sub-circuit board K2x Pad Hole C1 First connecting member UP1 First connecting pin C2 Second connecting member UP2 Second connecting pin B1 First bending area B2 Second bending area BP1 1st bending part BP2 2nd bending part T1 1st protrusion A1 Upper end of first protrusion T2 2nd protrusion A2 Upper end of second protrusion Wr1 First silicone wire Wr2 Second silicone wire Wr3 3rd silicone wire W1 First side wall of the profile W2 profile second side wall G1 1st groove G2 2nd groove S101 Step S102 Step S103 Step S104 Step S105 Step S106 Step S107 Step S108 Step S121 Step S122 Step S123 Step S124 Step S125 Step S126 Step S127 Step S128 steps

Claims

1. Dividing the circuit board into a first sub-circuit board and a second sub-circuit board; mounting a plurality of light sources on the first sub-circuit board and the second sub-circuit board; placing the first sub-circuit board and the second sub-circuit board on a profile; bonding the first sub-circuit board and the second sub-circuit board together and aligning the positive and negative pads of the first sub-circuit board with the positive and negative pads of the second sub-circuit board; welding one end of a first connection member to a positive electrode pad of the first sub-circuit board; welding the other end of the first connection member to a positive electrode pad of the second sub-circuit board; welding one end of the second connection member to the negative electrode pad of the first sub-circuit board; welding the other end of the second connection member to the negative electrode pad of the second sub-circuit board; A method for manufacturing a highly reliable light source module, comprising:

2. The method for manufacturing a highly reliable light source module according to claim 1 , further comprising the step of bending the first connecting member to form a first bending region, the first bending region including a plurality of first bent portions.

3. 3. The method for manufacturing a high-reliability light source module according to claim 2, wherein the plurality of first bent portions are located above the positive electrode pads of the first sub-circuit board or above the positive electrode pads of the second sub-circuit board.

4. 2. The method for manufacturing a highly reliable light source module according to claim 1, further comprising the step of bending the second connecting member to form a second bending region, the second bending region including a plurality of second bent portions.

5. 5. The method for manufacturing a high-reliability light source module according to claim 4, wherein the plurality of second bent portions are located above the negative electrode pad of the first sub-circuit board or above the negative electrode pad of the second sub-circuit board.

6. bending the first connecting member to form a first protrusion; bending the second connection member to form a second protrusion; 2. The method for manufacturing a highly reliable light source module according to claim 1, further comprising: a first protrusion having an upper end facing an upper end of the second protrusion.

7. The method for manufacturing a highly reliable light source module according to claim 1 , further comprising the step of cutting the circuit board to form the first groove and the second groove.

8. 8. The method for manufacturing a highly reliable light source module according to claim 7, wherein the first groove is located between the first connecting member and the first side wall of the profile.

9. 8. The method for manufacturing a highly reliable light source module according to claim 7, wherein the second groove is located between the second connecting member and the second side wall of the profile.

10. 2. The method for manufacturing a highly reliable light source module according to claim 1, wherein the first connecting member and the second connecting member are a welding ribbon, a welding rod, or a copper wire.

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