Method for manufacturing substrate cooling structure, and substrate cooling structure

Abstract

This method for manufacturing a substrate cooling structure (1) includes: a step for disposing a lower substrate (3), having a lower connector (31) on an upper surface thereof, on a bottom surface of a housing (2) having an opening (21) formed in a side surface thereof; a step for inserting a cooling plate (5), having through-holes (51) formed therein, from the opening (21) in the side surface of the housing (2), and disposing the cooling plate (5) on the lower substrate (3); a step for passing a plurality of support members (4), having male thread ridges formed on tip sections thereof, through the through-holes (51) of the cooling plate (5), and fixing bottom end sections of the support members (4) to the lower substrate (3); a step for disposing, on a cooling plate (5), an upper substrate (6), which has a plurality of positioning through-holes (62) formed therein, and has an upper connector (61) provided to the lower surface thereof, and passing the distal end sections of the support members (4) through the positioning through-holes (62) of the upper substrate (6), thereby positioning the upper substrate (6); and a step for screwing nuts (7) onto the male thread ridges of the distal end sections of the support members (4), thereby drawing the lower substrate (3) and the upper substrate (6) relatively closer together while sandwiching the cooling plate (5), and causing the upper connector (61) and the lower connector (31) to pass through the through-hole (51) of the cooling plate (5) and be fitted.

Description

[Technical Field]

[0001] The present disclosure relates to a method for manufacturing a substrate cooling structure for cooling a substrate, and to a substrate cooling structure. [Background technology]

[0002] BACKGROUND ART A substrate cooling structure is known in which substrates are arranged on both side surfaces (rear surfaces) of a cooling plate (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2019-110245 Summary of the Invention [Problem to be solved by the invention]

[0004] In the substrate cooling structure described above, the substrates must be fixed to both sides of the cooling plate, which requires the housing surrounding each substrate to have openings for fixing the substrates to both sides of the cooling plate, which may reduce the strength of the housing.

[0005] An object of the present disclosure is to provide a method for manufacturing a substrate cooling structure and a substrate cooling structure that solves any of the above-mentioned problems. [Means for solving the problem]

[0006] In order to achieve the above object, one aspect of the present disclosure is to a step of placing a lower substrate having a lower connector on an upper surface thereof on a bottom surface of a housing having an opening formed on a side surface; inserting a cooling plate having through holes formed therein through an opening in a side surface of the housing and placing the cooling plate on the lower substrate; a step of inserting a plurality of support members each having a male screw thread formed at its tip end into the through holes of the cooling plate and fixing the rear end portions of the support members to the lower substrate; an upper substrate, the upper substrate having a plurality of positioning through holes formed therein and an upper connector provided on a lower surface thereof, being placed on the cooling plate, and the tip end of the support member is inserted into the positioning through holes of the upper substrate, thereby positioning the upper substrate; a step of threading a nut onto the male thread at the tip of the support member to draw the lower substrate and the upper substrate together with the cooling plate therebetween, and inserting the upper connector and the lower connector into the through-hole of the cooling plate to fit them together; Including, Method for manufacturing substrate cooling structure is. In order to achieve the above object, one aspect of the present disclosure is to a housing having an opening formed on a side surface; a lower substrate having a lower connector on its upper surface and disposed on the bottom surface of the housing; a plurality of support members each having a male screw thread formed at a tip end and provided on the lower substrate; a cooling plate that is inserted through the opening of the housing, is placed on the lower substrate, and has a through hole formed therein; an upper substrate having a plurality of positioning through holes formed therein, an upper connector provided on a lower surface thereof, and disposed on the cooling plate; The support member penetrates the cooling plate, and the tip end penetrates the positioning through-hole of the upper substrate. A nut is screwed onto the male thread of the tip end, thereby drawing the lower substrate and the upper substrate together across the cooling plate, and the upper connector and the lower connector are inserted through the through-hole of the cooling plate and fitted together. Substrate cooling structure is. [Effects of the Invention]

[0007] According to the present disclosure, it is possible to provide a method for manufacturing a substrate cooling structure and a substrate cooling structure that solves any of the above-mentioned problems. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a diagram showing a schematic configuration of a substrate cooling structure according to an embodiment of the present invention; [Figure 2] FIG. 10 is a view showing through holes formed in a cooling plate. [Figure 3] FIG. 10 is a diagram showing a state in which the upper substrate is placed on a cooling plate. [Figure 4] 1 is a flowchart showing a flow of a method for manufacturing a substrate cooling structure according to the present embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0009] The present invention will be described below through embodiments of the invention, but the invention according to the claims is not limited to the following embodiments. Furthermore, not all of the configurations described in the embodiments are necessarily essential as means for solving the problems.

[0010] 1 is a diagram showing a schematic configuration of a substrate cooling structure according to this embodiment. The substrate cooling structure 1 according to this embodiment includes a housing 2, a lower substrate 3 arranged on the bottom side of the housing 2, a plurality of support members 4 provided on the lower substrate 3, a cooling plate 5 arranged on the lower substrate 3, and an upper substrate 6 arranged on the cooling plate 5.

[0011] The housing 2 is, for example, a box-shaped member made of metal, and has an open top. One side of the housing 2 has a substantially rectangular opening 21 formed therein. A plurality of electronic components, such as semiconductors, are arranged on the lower substrate 3. A lower connector 31 is provided on the top surface of the lower substrate 3.

[0012] The support member 4 is, for example, a rod-shaped member made of metal. A male screw thread is formed on the tip end 41 of the support member 4. The support member 4 is fixed to the lower substrate 3. For example, the support member 4 is fixed to the lower substrate 3 by screwing the male screw thread formed on the rear end of the support member 4 into a female screw thread formed on the lower substrate 3.

[0013] 2, for example, ten support members 4 are provided on the lower substrate 3, but the present invention is not limited to this. The number of support members 4 provided on the lower substrate 3 may be any number as long as the upper substrate 6 is properly supported relative to the lower substrate 3.

[0014] 1, the upper substrate 6 and the lower substrate 3 are respectively arranged on both sides of the cooling plate 5, and the cooling plate 5 can simultaneously cool the upper substrate 6 and the lower substrate 3, providing excellent cooling efficiency. The cooling plate 5 is inserted through the opening 21 of the housing 2 and placed on the lower substrate 3.

[0015] 2, the cooling plate 5 is formed with through holes 51 for the support member 4, the lower connector 31, and the upper connector 61 to pass through. Note that the cooling plate 5 is formed with four substantially rectangular through holes 51, but is not limited to this. The number and shape of the through holes 51 may be arbitrary as long as the support member 4, the lower connector 31, and the upper connector 61 can pass through them.

[0016] Cooling fins 52 for heat dissipation are provided on the side edges of cooling plate 5. When cooling plate 5 is inserted through opening 21 of housing 2, cooling fins 52 protrude from opening 21 to the outside of housing 2, allowing heat inside housing 2 to be dissipated to the outside of housing 2.

[0017] A plurality of electronic components such as semiconductors are arranged on the upper substrate 6. As shown in Fig. 1, an upper connector 61 is provided on the lower surface of the upper substrate 6. A plurality of positioning through holes 62 are formed in the upper substrate 6 for positioning the upper substrate 6 by the support member 4. The positioning through holes 62 are formed in the upper substrate 6 so as to correspond to the positions of the support member 4.

[0018] The support member 4 penetrates the cooling plate 5, and its tip 41 penetrates the positioning through-hole 62 of the upper substrate 6. At this time, the upper substrate 6 is positioned relative to the lower substrate 3 via the support member 4. Then, by screwing a nut 7 onto the male thread of the tip 41 of the support member 4, the lower substrate 3 and the upper substrate 6 are pulled toward each other with the cooling plate 5 sandwiched therebetween.

[0019] As a result, the upper connector 61 and the lower connector 31 pass through and fit into the through-holes 51 of the cooling plate 5. This fitting electrically connects the upper connector 61 and the lower connector 31, and electrically connects the upper substrate 6 and the lower substrate 3.

[0020] In a substrate cooling structure in which substrates are arranged on both sides of a cooling plate inside a housing, it is generally necessary to fix each substrate to both sides of the cooling plate, which requires openings in the housing surrounding each substrate for fixing the substrates to both sides of the cooling plate, which may reduce the strength of the housing.

[0021] In contrast to this, in this embodiment, as described above, the support member 4 fixed to the lower substrate 3 penetrates the cooling plate 5, and the tip 41 thereof penetrates the positioning through-hole 62 of the upper substrate 6, and the nut 7 is screwed onto the male thread of the tip 41. As a result, the lower substrate 3 and the upper substrate 6 are drawn to each other with the cooling plate 5 sandwiched therebetween, and the upper connector 61 and the lower connector 31 are inserted through the through-hole 51 of the cooling plate 5 and fitted together.

[0022] In this way, the upper substrate 6 and the lower substrate 3 can be fixed to the cooling plate 5 simultaneously by tightening the nuts 7 from one side of the cooling plate 5. Therefore, it is only necessary to provide one opening 21 corresponding to one side of the cooling plate 5 on the side of the housing 2, which prevents a decrease in the strength of the housing 2. Furthermore, since the number of covers provided on the housing 2 can be reduced, a cost reduction effect can also be expected due to a reduction in the number of parts.

[0023] Next, a method for manufacturing the substrate cooling structure 1 according to this embodiment will be described. Fig. 4 is a flowchart showing the flow of the method for manufacturing the substrate cooling structure according to this embodiment.

[0024] First, the lower substrate 3 is placed on the bottom surface of the housing 2 (step S101).

[0025] Next, the cooling plate 5 is inserted through the opening 21 on the side of the housing 2, and the cooling plate 5 is placed on the lower substrate 3 (step S102).

[0026] The plurality of support members 4 are inserted through the through holes 51 of the cooling plate 5, and the rear ends of the support members 4 are fixed to the lower substrate 3 (FIG. 2) (step S103).

[0027] The upper substrate 6 is placed on the cooling plate 5 (FIG. 3), and the tip portions 41 of the support members 4 are inserted into the corresponding positioning through holes 62 of the upper substrate 6, thereby positioning the upper substrate 6 (step S104).

[0028] By screwing the nut 7 onto the male thread at the tip 41 of the support member 4, the lower substrate 3 and the upper substrate 6 are pulled toward each other with the cooling plate 5 sandwiched therebetween, and the upper connector 61 and the lower connector 31 are inserted through the through-hole 51 of the cooling plate 5 and fitted together (Figure 1) (step S105).

[0029] As described above, the substrate cooling structure 1 according to this embodiment includes a housing 2 having an opening 21 formed in a side surface, a lower substrate 3 having a lower connector 31 provided on its upper surface and disposed on the bottom side of the housing 2, a plurality of support members 4 having male threads formed on their tips 41 and disposed on the lower substrate 3, a cooling plate 5 inserted from the opening 21 of the housing 2, disposed on the lower substrate 3, and having through holes 51 formed therein, and an upper substrate 6 having a plurality of positioning through holes 62 formed therein, having the upper connector 61 provided on its lower surface, and disposed on the cooling plate 5. The support members 4 penetrate the cooling plate 5, and the tips 41 penetrate the positioning through holes 62 of the upper substrate 6. By screwing the nuts 7 onto the male threads of the tips 41, the lower substrate 3 and the upper substrate 6 are drawn to each other across the cooling plate 5, and the upper connector 61 and the lower connector 31 are inserted through the through holes 51 of the cooling plate 5 and fitted together.

[0030] As described above, the upper substrate 6 and the lower substrate 3 can be simultaneously fixed to the cooling plate 5 by tightening the nuts 7 from one side of the cooling plate 5. Therefore, it is only necessary to provide one opening 21 corresponding to one side of the cooling plate 5 on the side of the housing 2, which prevents a decrease in the strength of the housing 2.

[0031] The substrate cooling structure 1 according to this embodiment can be used as a cooling structure for cooling an electronic substrate used in a base station device, for example.

[0032] Although several embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be embodied in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their modifications are included within the scope and spirit of the invention, and are also included in the scope of the invention and its equivalents as defined in the claims. [Explanation of symbols]

[0033] 1 board cooling structure, 2 housing, 3 lower board, 4 support member, 5 cooling plate, 6 upper board, 7 nut, 21 opening, 31 lower connector, 41 tip portion, 51 through hole, 52 cooling fin, 61 upper connector, 62 positioning through hole

Claims

1. a step of placing a lower substrate having a lower connector on an upper surface thereof on a bottom surface of a housing having a rectangular opening formed on a side surface thereof; inserting a cooling plate having through holes formed therein through an opening in a side surface of the housing and placing the cooling plate on the lower substrate; a step of inserting a plurality of support members each having a male screw thread formed at its tip end into the through holes of the cooling plate and fixing the rear end portions of the support members to the lower substrate; an upper substrate, the upper substrate having a plurality of positioning through holes formed therein and an upper connector provided on a lower surface thereof, being placed on the cooling plate, and the tip end of the support member is inserted into the positioning through holes of the upper substrate, thereby positioning the upper substrate; a step of threading a nut onto the male thread at the tip of the support member to draw the lower substrate and the upper substrate together with the cooling plate therebetween, and inserting the upper connector and the lower connector into the through-hole of the cooling plate to fit them together; Including, A method for manufacturing a substrate cooling structure.

2. a housing having a rectangular opening formed on a side surface; a lower substrate having a lower connector on its upper surface and disposed on the bottom surface of the housing; a plurality of support members each having a male screw thread formed at a tip end and provided on the lower substrate; a cooling plate that is inserted through the opening of the housing, is placed on the lower substrate, and has a through hole formed therein; an upper substrate having a plurality of positioning through holes formed therein, an upper connector provided on a lower surface thereof, and disposed on the cooling plate; The support member penetrates the cooling plate, and the tip end penetrates the positioning through-hole of the upper substrate. A nut is screwed onto the male thread of the tip end, thereby drawing the lower substrate and the upper substrate together across the cooling plate, and the upper connector and the lower connector are inserted through the through-hole of the cooling plate and fitted together. Substrate cooling structure.

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