Surface mounting machine and surface mounting method

Abstract

Mounting work according to the present invention includes a plurality of mounting work units U(1), U(2), U(3), U(4). The plurality of mounting work units U(1), U(2), U(3), U(4) involve mounting a die Wp on a board B from different types of wafers W1, W2, W3, W4. Each of the plurality of mounting work units U(1), U(2), U(3), U(4) involves installing a nozzle N1, N2 of a type that corresponds to the wafer W1, W2, W3, W4 supplied to a wafer supply position 32 at a mounting head 421. The plurality of mounting work units U(4), U(3), U(2), U(1) are executed at a board B(2) in an execution order that corresponds to a final tool state (wafer W4 and nozzle N2) that is the tool state at the time at which mounting work at a board B(1) is completed.

Description

[Technical Field]

[0001] The present invention relates to a surface mounting technique for mounting a die picked up by a nozzle from a wafer comprising a plurality of dies onto a substrate. [Background technology]

[0002] Patent Document 1 discloses a component mounter that mounts components having packages such as QFPs (Quad Flat Packages) onto a board. This component mounter uses a nozzle detachably attached to a mounting head to mount the components. In particular, the order in which components are mounted onto the board is controlled to reduce the number of times the nozzle needs to be replaced. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2004-111998 Summary of the Invention [Problem to be solved by the invention]

[0004] In a surface mounter, multiple mounted boards are produced by repeatedly carrying out the following steps: loading a board into a mounting position, mounting components onto the board at the mounting position, and unloading the board from the mounting position after the mounting operation is completed. In a surface mounter that mounts dies onto a board by nozzles from a wafer containing multiple dies, multiple types of dies are mounted onto the board by appropriately replacing the wafer depending on the progress of die mounting on the board. Therefore, the state of tools such as nozzles or wafers may differ between the start and end of board production. Therefore, when completing board production for one board and starting board production for the next board, the tool state must be restored from the state at the end of board production to the state at the start, leaving room for improvement in terms of improving production efficiency.

[0005] This invention has been made in consideration of the above-mentioned problems, and aims to prevent a decrease in production efficiency due to the time required to return the tool state to its original state in order to change the target substrate for substrate production, which involves substrate loading, die mounting, and substrate unloading operations. [Means for solving the problem]

[0006] A surface mounter according to the present invention includes a wafer storage unit that stores a plurality of wafers, a wafer supply unit that supplies wafers from the wafer storage unit to a wafer supply position, a substrate transport unit that carries in a target substrate to a predetermined mounting work position, a mounting unit that mounts dies constituting the wafer supplied to the wafer supply position onto the target substrate at the mounting work position using a detachably attached nozzle, and a control unit that controls execution of substrate production including a carry-in operation of carrying in the target substrate to the mounting work position using the substrate transport unit, a mounting operation of mounting the dies onto the target substrate at the mounting work position using the mounting unit, and an unloading operation of unloading the target substrate from the mounting work position after the mounting work has been completed, wherein the mounting work includes a plurality of mounting work units, and the plurality of mounting work units are different from one another. a wafer supply unit that changes the type of wafer supplied to the wafer supply position in accordance with the execution of a plurality of mounting work units; in each of the plurality of mounting work units, a nozzle of a type corresponding to the wafer supplied to the wafer supply position for the execution of that mounting work unit is attached to the mounting unit; and when starting substrate production of a second substrate as the target substrate following completion of substrate production of a first substrate as the target substrate, the control unit executes the plurality of mounting work units for the second substrate in an execution order corresponding to a final tool state that indicates at least one of the type of wafer located at the wafer supply position and the type of nozzle attached to the mounting unit at the time the mounting work on the first substrate is completed.

[0007] A surface mounting method according to the present invention includes the steps of: carrying a first substrate into a mounting position; performing a mounting operation using the first substrate as a target substrate; removing the first substrate from the mounting position after the mounting operation has been completed; carrying a second substrate into the mounting position; performing a mounting operation using the second substrate as a target substrate; and removing the second substrate from the mounting position after the mounting operation has been completed. In the mounting operation, dies constituting a wafer supplied to a wafer supply position from a wafer storage unit that stores a plurality of wafers are mounted on the target substrate at the mounting position by a nozzle detachably attached to the mounting unit. The mounting work units include work units, and the multiple mounting work units mount dies from different types of wafers onto a target substrate, the type of wafer supplied to the wafer supply position is changed depending on the execution of the multiple mounting work units, and in each of the multiple mounting work units, a nozzle of a type corresponding to the wafer supplied to the wafer supply position for the execution of the mounting work unit is attached to the mounting unit, and the multiple mounting work units for the second substrate are executed in an execution order depending on a final tool state indicating at least one of the type of wafer located at the wafer supply position and the type of nozzle attached to the mounting unit at the time the mounting work for the first substrate is completed.

[0008] In the present invention (surface mounter and surface mounting method) configured as described above, a loading operation for loading a target substrate into a mounting work position, a mounting operation for mounting a die onto the target substrate at the mounting work position, and an unloading operation for unloading the target substrate from the mounting work position after the mounting operation is completed are performed on the target substrate (board production). The mounting operation includes multiple mounting work units, each of which mounts a die onto the target substrate from a different type of wafer. Correspondingly, the type of wafer supplied to the wafer supply position is changed depending on the execution of the multiple mounting work units. Furthermore, in each of the multiple mounting work units, a nozzle of a type corresponding to the wafer supplied to the wafer supply position for execution of the mounting work unit is attached to the mounting unit. Therefore, the tool status, such as the type of wafer supplied to the wafer supply position or the type of nozzle attached to the mounting unit, may differ between the start and completion of the mounting work on the first substrate. Therefore, if the multiple mounting work units in the mounting work on the first substrate and the multiple mounting work units in the mounting work on the second substrate following the first substrate are executed in the same order, it may be necessary to restore the tool status upon completion of the mounting work on the first substrate. In contrast, in the present invention, multiple mounting task units for the second board are executed in an execution order that corresponds to the final tool state, which is the tool state at the time when the mounting task for the first board is completed. This makes it possible to prevent a decrease in production efficiency due to the time required to return the tool state in order to change the target board in board production from the first board to the second board.

[0009] The final tool state may indicate a combination of the type of wafer positioned at the wafer supply position and the type of nozzle attached to the mounting unit at the time when the mounting operation on the first substrate is completed.

[0010] The control unit may also be configured to execute multiple mounting work units for the first substrate in a predetermined first order and multiple mounting work units for the second substrate in a second order that is the reverse of the first order, thereby starting multiple mounting work units for the second substrate from the mounting work unit in which the combination of the type of wafer located at the wafer supply position and the type of nozzle attached to the mounting unit matches the combination indicated by the final tool state. With this configuration, when the mounting work for the first substrate is completed, it is not necessary to return the tool state to start the mounting work for the second substrate. This makes it possible to prevent a decrease in production efficiency due to the time required to return the tool state to change the target substrate in substrate production from the first substrate to the second substrate.

[0011] The control unit may also be configured to perform a search process to search for a mounting task unit that satisfies a predetermined first search condition between the first and second tool states and the final tool state from among the multiple mounting task units for the second board, and to start the multiple mounting task units for the second board from the corresponding mounting task unit. By controlling the execution order of the multiple mounting task units for the second board based on the results of this search process, it is possible to prevent a decrease in production efficiency due to the time required to return the tool state to change the target board in board production from the first board to the second board.

[0012] The surface mounter may also be configured so that the first search condition is that the combination of the type of wafer positioned at the wafer supply position and the type of nozzle attached to the mounting unit for executing the corresponding mounting task unit matches the combination indicated by the final tool state. With this configuration, when the mounting task for the first board is completed, there is no need to return the tool state to start the mounting task for the second board. This makes it possible to prevent a decrease in production efficiency due to the time required to return the tool state to change the target board in the board production from the first board to the second board.

[0013] It should be noted that various specific search orders can be considered when searching for a mounting task unit that satisfies the search conditions from among a plurality of mounting task units.

[0014] For example, the surface mounter may be configured to further include a memory unit that stores a first order indicating the order of the multiple mounting work units, and the search process searches for a mounting work unit that satisfies a first search condition from among the multiple mounting work units in the first order to search for the relevant mounting work unit, and the control unit, in board production for the second board, executes in the first order from the relevant mounting work unit to the last mounting work unit of the multiple mounting work units, and then executes from the first mounting work unit of the multiple mounting work units to the mounting work unit immediately before the relevant mounting work unit.

[0015] Alternatively, the surface mounter may be configured to further include a memory unit that stores a first order indicating the order of the multiple mounting work units, and the search process searches for a mounting work unit that satisfies the first search condition from among the multiple mounting work units in a second order that is the opposite of the first order, thereby searching for the relevant mounting work unit, and the control unit, in board production for the second board, executes in the second order from the relevant mounting work unit to the last mounting work unit of the multiple mounting work units, and then executes from the first mounting work unit of the multiple mounting work units to the mounting work unit immediately before the relevant mounting work unit.

[0016] The surface mounter may also be configured so that, if a corresponding mounting task unit that satisfies the first search condition is not found in the search process, a corresponding mounting task unit that satisfies a second search condition, namely, that the number of nozzles that need to be replaced to change the types of the respective nozzles indicated by the final tool state to the types of the respective nozzles that should be attached to the mounting unit for executing the corresponding mounting task unit, is searched for among the multiple mounting task units for the second board. With this configuration, when the mounting task for the first board is completed, the time required to restore the nozzle state in order to start the mounting task for the second board can be reduced. As a result, it is possible to prevent a decrease in production efficiency due to the time required to restore the tool state in order to change the target board in the board production from the first board to the second board.

[0017] Furthermore, the surface mounter may be configured such that the board production includes a pre-inspection that inspects the state of the target board carried into the mounting work position by the carry-in work before the mounting work, and a post-inspection that inspects the state of the target board after the mounting work is completed before the carry-out work, and the control unit executes the pre-inspection before the mounting work and the post-inspection after the mounting work in both the board production for the first board and the board production for the second board. With such a configuration, the pre-inspection and post-inspection of the boards can be executed at appropriate timing.

[0018] The surface mounter may also be configured so that it further includes a component supply unit that supplies components to the component supply position, the mounting work unit includes a die mounting period for mounting dies from a wafer onto a target board and a component mounting period for mounting components from the component supply position onto the target board, the die mounting period and component mounting period belonging to the same mounting work unit use the same type of nozzle attached to the mounting unit, and the wafer supply unit replaces wafers supplied to the wafer supply position in parallel with the component mounting period. With this configuration, the component mounting period can be effectively used to change the type of wafer, thereby improving production efficiency. [Effects of the Invention]

[0019] According to the present invention, it is possible to suppress a decrease in production efficiency due to the time required to return the tool state to change the target substrate for substrate production, which involves performing substrate loading, die mounting, and substrate unloading operations. [Brief explanation of the drawings]

[0020] [Figure 1] 1 is a plan view schematically showing an example of a surface mounter according to the present invention; [Figure 2] FIG. 2 is a block diagram showing an electrical configuration of the surface mounter shown in FIG. 1. [Figure 3] 10 is a flowchart showing an example of an execution mode of a production plan. [Figure 4] 10 is a flowchart showing a modified example of board production. [Figure 5]FIG. 5 is a diagram showing, in table form, the execution order of the mounting work units in the board production of FIG. 4. [Figure 6] 10 is a flowchart showing an example of determining an order. [Figure 7] 10 is a flowchart showing another example of determining an order. [Figure 8A] FIG. 5 is a diagram showing, in table form, the execution order of the mounting work units in the board production of FIG. 4. [Figure 8B] FIG. 8B is a diagram showing, in tabular form, an example of operations executed in accordance with the execution sequence of FIG. 8A. [Figure 9] 10 is a flowchart showing another modified example of substrate production. DETAILED DESCRIPTION OF THE INVENTION

[0021] Fig. 1 is a plan view schematically showing an example of a surface mounter according to the present invention, and Fig. 2 is a block diagram showing the electrical configuration of the surface mounter shown in Fig. 1. As shown in Fig. 1, this specification appropriately uses XYZ orthogonal coordinate axes consisting of a conveying direction X, a width direction Y, and a vertical direction Z. The conveying direction X and the width direction Y are parallel to the horizontal direction and perpendicular to each other, and the vertical direction Z is perpendicular to the conveying direction X and the width direction Y.

[0022] The surface mounter 10 mounts a die Wp on a substrate B carried in from the upstream side in the transport direction X and then carries the substrate B downstream in the transport direction X. As shown in FIG. 2 , the controller 100 includes a control unit 110, which is a processor that executes calculations to control the entire surface mounter 10; an image processing unit 120 that executes image processing based on commands from the control unit 110; and a drive control unit 130 that controls the operation of a substrate transport unit 2, a die supply mechanism 3, a mounting unit 4, a component supply mechanism 6, and a nozzle exchanger 7 (described later) based on commands from the control unit 110. The controller 100 also includes a storage unit 140 that includes a solid-state drive (SSD) or a hard disk drive (HDD). The storage unit 140 stores a mounting program 150 and other programs for causing the control unit 110 to execute the control described later. The implementation program 150 is provided by being recorded on a recording medium 170 such as a DVD (Digital Versatile Disc) or a USB (Universal Serial Bus) memory, and the control unit 110 reads the implementation program 150 from the recording medium 170 and stores it in the storage unit 140. Note that the provision form of the implementation program 150 is not limited to this, and the implementation program 150 may be provided, for example, by being downloaded from an Internet server that records the implementation program 150.

[0023] This surface mounter 10 is equipped with a board transport unit 2 that transports a board B in a transport direction X. This board transport unit 2 has a mounting work position 21, and transports the board B into the mounting work position 21 from the upstream side in the transport direction X. In addition, the board transport unit 2 transports the board B, on which the die Wp and components P have been mounted at the mounting work position 21, from the mounting work position 21 to the downstream side in the transport direction X.

[0024] The surface mounter 10 also includes a die supply mechanism 3 that supplies dies Wp included in a wafer W. The wafer W is composed of a plurality of dies Wp (bare chips) that have been separated by dicing. The die supply mechanism 3 has a wafer storage section 31 that can store a plurality of wafers W, and a wafer extraction section 33 that extracts the wafers W from the wafer storage section 31 to a wafer supply position 32. The wafer storage section 31 raises and lowers a rack in the vertical direction Z that stores a plurality of wafer holders Wh, each holding a wafer W, arranged in the vertical direction Z, so that one wafer holder Wh can be positioned at a height at which the wafer extraction section 33 can receive the wafer W, and the wafer holder Wh can be pushed out into the wafer extraction section 33.

[0025] The wafer extracting unit 33 includes a wafer support table 331 that supports the wafer holder Wh, fixed rails 332 that support the wafer support table 331 movably in the width direction Y, a ball screw 333 that is provided in the width direction Y and attached to the wafer support table 331, and a Y-axis motor 334 that drives the ball screw 333. Therefore, the drive control unit 130 can move the wafer support table 331 in the width direction Y along the fixed rail 332 by rotating the ball screw 333 using the Y-axis motor 334. As shown in FIG. 1 , the wafer storage unit 31 and the wafer supply position 32 are disposed so as to sandwich the substrate transport unit 2 in the width direction Y, and the wafer support table 331 passes below the substrate transport unit 2. The wafer support table 331 receives the wafer holder Wh from the wafer storage unit 31 at a receiving position adjacent to the wafer storage unit 31 and moves from the receiving position to the wafer supply position 32 to extract the wafer W to the wafer supply position 32.

[0026] The die supply mechanism 3 further includes a die removal unit 35 that removes the die Wp from the wafer supply position 32. The die removal unit 35 includes a removal head 36 that removes the die Wp from the wafer supply position 32, and the removal head 36 is movable in the X and Y directions. Specifically, the die removal unit 35 includes a support member 351 that supports the removal head 36 movably in the transport direction X, and an X-axis motor 352 that is provided in the transport direction X and drives a ball screw attached to the removal head 36. Therefore, the drive control unit 130 can move the removal head 36 in the transport direction X by rotating the X-axis motor 352. The die removal unit 35 also includes a fixed rail 353 that supports the support member 351 movably in the width direction Y, a ball screw 354 that is provided in the width direction Y and attached to the fixed rail 353, and a Y-axis motor 355 that drives the ball screw 354. Therefore, the drive control unit 130 can move the take-out head 36 together with the support member 351 in the width direction Y by rotating the Y-axis motor 355.

[0027] The take-out head 36 has a bracket 361 extending in the conveying direction X and two nozzles 362 rotatably supported by the bracket 361. Each nozzle 362 rotates about a rotation axis parallel to the conveying direction X, and is positioned at either a suction position facing downward or a delivery position (position in FIG. 1) facing upward. The bracket 361 can move up and down together with each nozzle 362.

[0028] Furthermore, the die removal unit 35 has a movable camera 356 that captures images of the die Wp at the wafer supply position 32 from above, and this movable camera 356 is movable in the X and Y directions. That is, in the die removal unit 35, the movable camera 356 is supported by a support member 351 so as to be movable in the transport direction X. The die removal unit 35 also has an X-axis motor 357 that is provided in the transport direction X and drives a ball screw attached to the movable camera 356. Therefore, the drive control unit 130 can move the movable camera 356 in the transport direction X by rotating the X-axis motor 357, and can move the movable camera 356 together with the support member 351 in the width direction Y by rotating the Y-axis motor 355.

[0029] In the die supply mechanism 3, the die Wp is supplied as follows. That is, the drive control unit 130 moves the movable camera 356 above a die Wp to be supplied from among the multiple dies Wp on the wafer W supplied to the wafer supply position 32. The movable camera 356 captures an image of the die Wp and transfers the captured image to the image processing unit 120, which then recognizes the position of the die Wp from the captured image. The drive control unit 130 then drives the nozzle 362 based on the recognition result from the image processing unit 120, thereby positioning the nozzle 362 at the suction position to face the die Wp from above, and then lowers the nozzle 362 to contact the die Wp. Furthermore, the drive control unit 130 applies negative pressure to the nozzle 362 while raising it, thereby picking up the die Wp from the wafer supply position 32. The drive control unit 130 then positions the nozzle 362 at the delivery position to supply the die Wp.

[0030] The surface mounter 10 includes a mounting unit 4 that mounts the die Wp supplied by the die supply mechanism 3 onto the substrate B. The mounting unit 4 includes a support member 41 that is movable along fixed rails provided on the ceiling of the surface mounter 10 in the width direction Y, and a head unit 42 that is supported by the support member 41 so as to be movable in the transport direction X. The surface mounter 10 further includes an X-axis motor 43 that drives a ball screw provided in the transport direction X and attached to the head unit 42, and a Y-axis motor 44 that is provided in the width direction Y and attached to the support member 41. Therefore, the drive control unit 130 can move the head unit 42 in the transport direction X by rotating the X-axis motor 43, and can move the head unit 42 along with the support member 41 in the width direction Y by rotating the Y-axis motor 44.

[0031] The head unit 42 has two mounting heads 421 and two nozzles N detachably attached to the lower ends of the two mounting heads 421, respectively. When picking up the die Wp, the head unit 42 moves above the take-out head 36, positions the nozzle N to face the die Wp held by the nozzle 362 positioned at the delivery position from above, and then lowers the nozzle N to contact the die Wp. Next, the die supply mechanism 3 releases the negative pressure on the nozzle 362, and the mounting unit 4 applies negative pressure to the nozzle N, causing the nozzle N to adsorb the die Wp and then raises the nozzle N while applying negative pressure. In this way, the head unit 42 picks up the die Wp with the nozzle N.

[0032] The die supply mechanism 3 has two nozzles 362, and can simultaneously supply two dies Wp using these nozzles 362. On the other hand, the head unit 42 has two nozzles N corresponding to the two nozzles 362 of the die supply mechanism 3, and can simultaneously pick up the two dies Wp supplied by the die supply mechanism 3 using the two nozzles N. However, it is not essential to simultaneously supply and pick up two dies Wp.

[0033] Furthermore, the mounting unit 4 has a movable camera 45 that is provided facing downward. The movable camera 45 captures images from above of the die Wp supplied by the die supply mechanism 3 and the die Wp mounted on the substrate B. The movable camera 45 is attached to the head unit 42, and the drive control unit 130 can move the movable camera 45 in the X and Y directions in the same way as the head unit 42 by rotating the X-axis motor 43 and the Y-axis motor 44.

[0034] The surface mounter 10 further includes a component supply mechanism 6 located on the opposite side of the die supply mechanism 3 in the width direction Y. The component supply mechanism 6 includes multiple feeders F arranged in the transport direction X. Each feeder F has a component supply position Fs at its tip on the mounting work position 21 side in the width direction Y, and supplies packaged components P (packaged components) such as integrated circuits, capacitors, or resistors to the component supply position Fs. Specifically, a component storage tape, each having multiple pockets for storing components P, is attached to the feeder F. The feeder F supplies the components P to the component supply position Fs by intermittently feeding the component storage tape in the width direction Y. In particular, the multiple feeders F1, F2, F3, and F4 supply different types of components P to the component supply position Fs. The head unit 42 of the mounting unit 4 then picks up the components P supplied to the component supply position Fs using a nozzle N and mounts them on the board B at the mounting work position 21.

[0035] The surface mounter 10 also includes a fixed camera 5. The fixed camera 5 is fixed to a base and faces upward, and captures an image of the die Wp or component P picked up by the nozzle N from below. The image (recognized image) of the die Wp or component P picked up by the fixed camera 5 is sent to the image processing unit 120, which then confirms the position of the die Wp or component P picked up by the nozzle N based on the recognized image of the die Wp or component P.

[0036] The surface mounter 10 also includes a nozzle exchanger 7 that exchanges the nozzle N to be attached to the head unit 42 of the mounting section 4. The nozzle exchanger 7 performs operations on the head unit 42 facing the nozzle exchanger 7 from above, such as attaching a nozzle N to a head unit 42 to which no nozzle N has been attached, removing a nozzle N attached to the head unit 42 from the head unit 42 and storing it, and exchanging the nozzle N attached to the head unit 42.

[0037] In the surface mounter 10, board production is carried out under the control of the control unit 110, including a carry-in operation in which the board transport unit 2 carries the board B (target board) into the mounting work position 21, a mounting operation in which the mounting unit 4 mounts the die Wp and components P on the board B at the mounting work position 21, and an unloading operation in which the board B after the mounting work is completed is unloaded from the mounting work position 21. In particular, by carrying out board production on a plurality of boards B, a plurality of boards B (mounted boards) on each of which the die Wp and components P are mounted are produced. Next, a description will be given of how a production plan for producing such a plurality of mounted boards is executed.

[0038] Fig. 3 is a flowchart showing an example of how a production plan is executed. The flowchart in Fig. 3 is executed under the control of control unit 110. This flowchart includes board production for the first board B ("steps S101 to S116" on the left), board production for even-numbered boards B ("steps S201 to S214" in the middle), and board production for odd-numbered boards B from the third board onwards ("steps S101, S104 to S116" on the right).

[0039] In the following, in order to distinguish between multiple substrates B, the notation "substrate B(I)" will be used where appropriate, along with a count value I indicating the execution order of substrate production. Also, in FIG. 3, wafers W1, W2, W3, and W4 are different types of wafers W. Here, different types of wafers W correspond to different types of dies Wp constituting wafers W. Furthermore, nozzles N1 and N2 are different types of nozzles N.

[0040] In step S101, the substrate B(1) is carried into the mounting work position 21 by the substrate transport unit 2. Then, the nozzle N1 is attached to the head unit 42 by the nozzle exchanger 7 (step S102), and the wafer W1 is supplied to the wafer supply position 32 by the wafer pull-out unit 33 (step S103).

[0041] In step S104, a die Wp taken out from the wafer W1 supplied to the wafer supply position 32 is mounted by the nozzle N1 of the mounting unit 4 onto the board B(1) at the mounting work position 21. In the following step S105, a component P supplied to the component supply position Fs by the feeder F1 is mounted by the nozzle N1 of the mounting unit 4 onto the board B(1) at the mounting work position 21. Also, in parallel with step S105, the wafer W supplied to the wafer supply position 32 is changed from wafer W1 to wafer W2 (step S106).

[0042] In step S107, a die Wp taken out from a wafer W2 supplied to the wafer supply position 32 is mounted on a board B(1) at the mounting work position 21 by a nozzle N1 of the mounting unit 4. In the following step S108, a component P supplied to a component supply position Fs by a feeder F2 is mounted on a board B(1) at the mounting work position 21 by a nozzle N1 of the mounting unit 4. As described above, the wafer W2 and feeder F2 used for mounting in steps S107 and S108 are different from the wafer W1 and feeder F1 used for mounting in steps S104 and S105. Meanwhile, the nozzle N used for mounting in steps S107 and S108 and the nozzle N used for mounting in steps S104 and S105 are both nozzle N1. In parallel with step S108, the wafer W supplied to the wafer supply position 32 is changed from wafer W2 to wafer W3 (step S109).

[0043] In step S110, the nozzle N attached to the head unit 42 is changed by the nozzle exchanger 7 from the nozzle N1 to the nozzle N2.

[0044] In step S111, a die Wp taken out from a wafer W3 supplied to the wafer supply position 32 is mounted on a board B(1) at the mounting work position 21 by a nozzle N2 of the mounting unit 4. In the following step S112, a component P supplied to a component supply position Fs by a feeder F3 is mounted on a board B(1) at the mounting work position 21 by a nozzle N2 of the mounting unit 4. As described above, the wafer W3 and feeder F3 used for mounting in steps S111 and S112 are different from the wafer W2 and feeder F2 used for mounting in steps S107 and S108. Furthermore, the nozzle N1 used for mounting in steps S111 and S112 is different from the nozzle N2 used for mounting in S107 and S108. Furthermore, in parallel with step S112, the wafer W supplied to the wafer supply position 32 is changed from wafer W3 to wafer W4 (step S113).

[0045] In step S114, a die Wp taken out from a wafer W4 supplied to wafer supply position 32 is mounted on a board B(1) at mounting work position 21 by nozzle N2 of mounting unit 4. In the following step S115, a component P supplied to component supply position Fs by feeder F4 is mounted on a board B(1) at mounting work position 21 by nozzle N2 of mounting unit 4. Thus, the wafer W4 and feeder F4 used for mounting in steps S114 and S115 are different from the wafer W3 and feeder F3 used for mounting in steps S111 and S112. Meanwhile, the nozzle N used for mounting in steps S114 and S114 and the nozzle N used for mounting in steps S111 and S112 are both nozzle N2.

[0046] In step S116, the board B(1) is carried out from the mounting work position 21 by the board transport section 2.

[0047] In this way, the board B(1) undergoes the carry-in operation (step S101), the mounting operation (steps S104, S105, S107, S108, S111, S112, S114, S115), and the carry-out operation (step S116). Mounting work unit U(1)...mounting of die Wp constituting wafer W1 and mounting of components P supplied by feeder F1 (steps S104, S105) Mounting work unit U(2)...mounting of die Wp constituting wafer W2 and mounting of components P supplied by feeder F2 (steps S107, S108) Mounting work unit U(3)...mounting of die Wp constituting wafer W3 and mounting of components P supplied by feeder F3 (steps S111, S112) Mounting work unit U(4)...mounting of die Wp constituting wafer W4 and mounting of components P supplied by feeder F4 (steps S114, S115) are executed in this order.

[0048] In step S201, the board B(2) is carried into the mounting work position 21 by the board transport section 2.

[0049] In step S202, the component P supplied to the component supply position Fs by the feeder F4 is mounted by the nozzle N2 of the mounting unit 4 onto the board B(2) at the mounting work position 21. In the following step S203, the die Wp taken out from the wafer W4 supplied to the wafer supply position 32 is mounted onto the board B(2) at the mounting work position 21 by the nozzle N2 of the mounting unit 4.

[0050] In step S204, the component P delivered to the component supply position Fs by the feeder F3 is mounted on the board B(2) at the mounting work position 21 by the nozzle N2 of the mounting unit 4. Also, in parallel with step S204, the wafer W supplied to the wafer supply position 32 is changed from wafer W4 to wafer W3 (step S205). In the following step S206, the die Wp taken out from the wafer W3 supplied to the wafer supply position 32 is mounted on the board B(2) at the mounting work position 21 by the nozzle N2 of the mounting unit 4.

[0051] In step S207, the nozzle N attached to the head unit 42 is changed by the nozzle exchanger 7 from the nozzle N2 to the nozzle N1.

[0052] In step S208, the component P delivered to the component supply position Fs by the feeder F2 is mounted on the board B(2) at the mounting work position 21 by the nozzle N1 of the mounting unit 4. Also, in parallel with step S208, the wafer W supplied to the wafer supply position 32 is changed from wafer W3 to wafer W2 (step S209). In the following step S210, the die Wp taken out from the wafer W2 supplied to the wafer supply position 32 is mounted on the board B(2) at the mounting work position 21 by the nozzle N1 of the mounting unit 4.

[0053] In step S211, the component P delivered to the component supply position Fs by the feeder F1 is mounted on the board B(2) at the mounting work position 21 by the nozzle N1 of the mounting unit 4. Also, in parallel with step S211, the wafer W supplied to the wafer supply position 32 is changed from wafer W2 to wafer W1 (step S212). In the following step S213, the die Wp taken out from the wafer W1 supplied to the wafer supply position 32 is mounted on the board B(2) at the mounting work position 21 by the nozzle N1 of the mounting unit 4.

[0054] In step S214, the board B(2) is carried out from the mounting work position 21 by the board transport section 2.

[0055] In this way, the board B(2) undergoes the carry-in operation (step S201), the mounting operation (steps S202, S203, S204, S206, S208, S210, S211, S213), and the carry-out operation (step S214). Mounting work unit U(4)...mounting of die Wp constituting wafer W4 and mounting of components P supplied by feeder F4 (steps S202, S203) Mounting work unit U(3)...mounting of die Wp constituting wafer W3 and mounting of components P supplied by feeder F3 (steps S204, S206) Mounting work unit U(2)...mounting of die Wp constituting wafer W2 and mounting of components P supplied by feeder F2 (steps S208, S210) Mounting work unit U(1)...mounting of die Wp constituting wafer W1 and mounting of components P supplied by feeder F1 (steps S211, S213) are executed in this order.

[0056] In step S301, board B(3) is carried into mounting position 21 by board transport section 2. Subsequently, steps S304 to S316 are performed on board B(2) in the same manner as steps S104 to S116.

[0057] That is, for the board B(3), a carry-in operation (step S301), a mounting operation (steps S304, S305, S307, S308, S311, S312, S314, S315), and a carry-out operation (step S316) are performed. Mounting work unit U(1)...mounting of die Wp constituting wafer W1 and mounting of components P supplied by feeder F1 (steps S304, S305) Mounting work unit U(2)...mounting of die Wp constituting wafer W2 and mounting of components P supplied by feeder F2 (steps S307, S308) Mounting work unit U(3)...mounting of die Wp constituting wafer W3 and mounting of components P supplied by feeder F3 (steps S311, S312) Mounting work unit U(4)...mounting of die Wp constituting wafer W4 and mounting of components P supplied by feeder F4 (steps S314, S315) are executed in this order.

[0058] Thereafter, steps S201 to S214 are executed for the even-numbered substrates B (even numbers), and steps S301 to S316 are executed for the odd-numbered substrates B (odd numbers).

[0059] 3 , a carry-in operation for carrying in a substrate B (target substrate) to the mounting work position 21, a mounting operation for mounting a die Wp on the substrate B at the mounting work position 21, and an unloading operation for unloading the substrate B after the mounting work is completed from the mounting work position 21 are performed on the substrate B (substrate production). The mounting operation includes a plurality of mounting work units U(1), U(2), U(3), and U(4), and the plurality of mounting work units U(1), U(2), U(3), and U(4) mount a die Wp onto the substrate B from wafers W1, W2, W3, and W4 of different types. Correspondingly, the type of wafer W supplied to the wafer supply position 32 is changed in accordance with the execution of the plurality of mounting work units U(1), U(2), U(3), and U(4) (e.g., steps S103, S106, S109, and S113). Furthermore, in each of the multiple mounting work units U(1), U(2), U(3), and U(4), a type of nozzle N1 or N2 corresponding to the wafer W1, W2, W3, or W4 supplied to the wafer supply position 32 is attached to the mounting head 421. Therefore, the tool state, which is the combination of the type of wafer W supplied to the wafer supply position 32 and the type of nozzle N attached to the mounting head 421, differs between the start and completion of the mounting work on the substrate B(1) (first substrate). Therefore, if the multiple mounting work units U(1), U(2), U(3), and U(4) in the mounting work on the substrate B(1) and the multiple mounting work units U(1), U(2), U(3), and U(4) in the mounting work on the substrate B(2) (second substrate) subsequent to the substrate B(2) are performed in the same order, it becomes necessary to restore the tool state when the mounting work on the substrate B(1) is completed. In contrast, in this embodiment, multiple mounting task units U(4), U(3), U(2), and U(1) for substrate B(2) are executed in an execution order that corresponds to the final tool state (wafer W4 and nozzle N2), which is the tool state at the time when the mounting task for substrate B(1) is completed. This makes it possible to prevent a decrease in production efficiency due to the time required to return the tool state in order to change the target substrate B for substrate production from substrate B(1) to substrate B(2).

[0060] Similar control is also executed for changes from substrate B (even) to substrate B (odd) and from substrate B (odd) to substrate B (even). This makes it possible to suppress a decrease in production efficiency due to the time required to return the tool state to normal in order to change the target substrate B in substrate production from substrate B (even) to substrate B (odd), and also makes it possible to suppress a decrease in production efficiency due to the time required to return the tool state to normal in order to change the target substrate B in substrate production from substrate B (odd) to substrate B (even).

[0061] In particular, the control unit 110 executes multiple mounting work units U for the substrate B(1) (first substrate) in a predetermined first order (U(1), U(2), U(3), U(4)), and executes multiple mounting work units U for the substrate B(2) (second substrate) in a second order U(4), U(3), U(2), U(1), which is the reverse of the first order. As a result, multiple mounting work units U(4), U(3), U(2), U(1) for the substrate B(2) are started from the mounting work unit U(4) in which the combination of the type of wafer W positioned at the wafer supply position 32 and the type of nozzle N attached to the mounting head 421 matches the combination indicated by the final tool state (wafer W4 and nozzle N2). With this configuration, when the mounting work for the substrate B(1) is completed, there is no need to restore the tool state to start the mounting work for the substrate B(2). Therefore, it is possible to prevent a decrease in production efficiency due to the time required to return the tool state in order to change the target substrate in substrate production from substrate B(1) to substrate B(2).

[0062] Similar control is also executed for changes from substrate B (even) to substrate B (odd) and from substrate B (odd) to substrate B (even). This makes it possible to suppress a decrease in production efficiency due to the time required to return the tool state to normal in order to change the target substrate B in substrate production from substrate B (even) to substrate B (odd), and also makes it possible to suppress a decrease in production efficiency due to the time required to return the tool state to normal in order to change the target substrate B in substrate production from substrate B (odd) to substrate B (even).

[0063] Also, a component supply mechanism 6 (feeders F1-F4) is provided that supplies components P to the component supply position Fs. Each of the mounting work units U(1), U(2), U(3), and U(4) includes a die mounting period (e.g., steps S104, S107, S111, and S114) in which a die Wp is mounted from a wafer W onto a substrate B, and a component mounting period (e.g., steps S105, S108, S112, and S115) in which a component P is mounted from the component supply position Fs onto a substrate B. The die mounting period and the component mounting period belonging to the same mounting work unit U share the same type of nozzle N attached to the mounting head 421. The wafer pull-out unit 33 (wafer supply unit) replaces the wafer W supplied to the wafer supply position 32 in parallel with the component mounting period (e.g., steps S103, S106, S109, and S113). In this configuration, the component mounting period can be effectively used to change the type of wafer W, thereby improving production efficiency.

[0064] In the example of FIG. 3, in each of the mounting work units U(1), U(2), U(3), and U(4) for odd-numbered boards B (odd numbers), the die Wp constituting the wafer W is mounted first, followed by the component P supplied from the feeder F. Also, in each of the mounting work units U(4), U(3), U(2), and U(1) for even-numbered boards B (even numbers), the die Wp constituting the wafer W is mounted first, followed by the component P supplied from the feeder F. However, the execution order can be changed as appropriate. For example, in each of the mounting work units U(4), U(3), U(2), and U(1) for even-numbered boards B (even numbers), the die Wp constituting the wafer W may be mounted first, followed by the component P supplied from the feeder F. This example also provides the same effects as described above.

[0065] FIG. 4 is a flowchart showing one modified example of board production, and FIG. 5 is a diagram showing, in tabular form, the execution order of mounting work units in the board production of FIG. 4. The flowchart of FIG. 4 is executed under the control of the control unit 110. The execution order O1 shown in FIG. 5 is stored, for example, in the recording medium 170. This execution order O1 indicates that the mounting work units U(1), U(2), U(3), and U(4) are executed in this order. Furthermore, the execution order O1 indicates that in each of the mounting work units U(1), U(2), U(3), and U(4), the mounting of the components P supplied from the feeder F is performed after the mounting of the dies Wp that make up the wafer W (intra-unit order).

[0066] In the flowchart of FIG. 4, in step S401, board B(1) is carried into mounting work position 21. Then, mounting work units U(1), U(2), U(3), and U(4) are executed in execution order O1 (steps S402 and S403). Note that the timing of supplying wafer W to wafer supply position 32 and replacing nozzle N is the same as described above. When the execution of mounting work units U(1), U(2), U(3), and U(4) is completed ("YES" in step S403), it is confirmed whether there is a die Wp or component P that failed to be mounted in mounting work units U(1), U(2), U(3), and U(4) (step S404).

[0067] Specifically, the state of the die Wp or component P picked up by the nozzle N before mounting on the board B(1) and the state of the nozzle N after mounting on the board B(1) can be determined based on images captured by the fixed camera 5. In other words, if the attitude of the die Wp or component P picked up by the nozzle N before mounting is tilted, or if the die Wp or component P is attached to the nozzle N after mounting, it is determined that a mounting failure has occurred.

[0068] If there is no mounting failure ("NO" in step S404), the process proceeds to step S406, and the board B(1) is carried out from the mounting work position 21. On the other hand, if there is a mounting failure ("YES" in step S404), step S405 is executed, and then step S406 is executed.

[0069] In step S405, the mounting of the failed die Wp or component P is re-executed. In this example, assume that mounting of the die Wp constituting wafer W2 in mounting task unit U(2) has failed. In this case, since mounting task unit U(2) is incomplete, mounting of the die Wp is re-executed. Note that, when it is confirmed in step S403 that the mounting task units U(1), U(2), U(3), and U(4) have been completed, wafer W4 has been supplied to wafer supply position 32, and nozzle N2 has been attached to mounting head 421. Therefore, in step S405, the wafer W supplied to wafer supply position 32 is changed from wafer W4 to wafer W2, and the nozzle N attached to mounting head 421 is changed from nozzle N2 to nozzle N1. Then, when mounting of the die Wp constituting wafer W2 is successful, mounting task unit U(2) is completed. As a result, all of the dies Wp and components P to be mounted by the mounting work units U(1), U(2), U(3), and U(4) are successfully mounted on the board B(1), and the mounting work units U(1), U(2), U(3), and U(4) are completed.

[0070] 4 for board B(2) following board B(1), the order in which the mounting task units U are to be executed for board B(2) is determined (FIG. 6). FIG. 6 is a flowchart showing an example of determining the order. The flowchart in FIG. 6 is executed under the control of the control unit 110.

[0071] In step S501, the final tool state is confirmed, which is the tool state at the time when the mounting work units U(1), U(2), U(3), and U(4) on the board B(1) are completed, i.e., the time when the mounting work is completed. Here, the time when the mounting work is completed is not the time when the mounting work units U(1), U(2), U(3), and U(4) are completed (the time when step S403 returns "YES"), but the time when the mounting of the die Wp or component P is successfully re-executed in step S405. In other words, at the former time, the mounting work unit U(2), which failed to be mounted, is incomplete, so it cannot be determined that the mounting work is complete. The time when all of the die Wp and component P to be mounted in the mounting work units U(1), U(2), U(3), and U(4) are successfully mounted is the time when the mounting work is completed. Therefore, the final tool state confirmed in step S501 indicates the combination of wafer W3 and nozzle N2.

[0072] In step S502, the identifier J (J=1, 2, 3, 4) that identifies the mounting task unit U(J) is reset to zero, and in step S503, the identifier J is incremented by 1. Then, it is determined whether the tool state, which is the combination of the type of wafer W and the type of nozzle N used in the mounting task unit U(J), matches the final tool state (wafer W2, nozzle N1) (step S504). In the execution order O1, the tool state (wafer W1 and nozzle N1) when executing the mounting task unit U(1) is different from the final tool state ("NO" in step S504), so the process returns to step S503 and the identifier J is incremented by 1. In this way, steps S503 and S504 are repeated until a mounting task unit U(J) having a tool state that matches the final tool state is found (until "YES" in step S504). As a result, in this example, the mounting task unit U(2) is searched for.

[0073] In step S505, it is determined that mounting work units U(1), U(2), U(3), and U(4) for board B(2) will be executed cyclically according to execution order O1, starting with the corresponding mounting work unit U(2) found in step S504. Here, executing cyclically according to execution order O1 means executing mounting work units U(1), U(2), U(3), and U(4) in order from the first mounting work unit U(1) in execution order O1 after executing mounting work units U(2) through the last mounting work unit U(4) in execution order O1. Therefore, in execution order O1, after executing mounting work units U(2) through the last mounting work unit U(4), the first mounting work unit U(1) is executed, and then mounting work units U(1), U(2), U(3), and U(4) are executed.

[0074] 6, the control unit 110 executes a search process to search for a mounting task unit U(2) that satisfies a search condition (first search condition) that the tool state of the mounting task units U(1), U(2), U(3), and U(4) for the board B(2) (second board) matches the final tool state (steps S501 to S504). The control unit 110 then searches for the mounting task units U(1), U(2), U(3), and U(4) for the board B(2), starting with the mounting task unit U(2). By controlling the execution order of the mounting task units U(1), U(2), U(3), and U(4) for the board B(2) based on the results of this search process, it is possible to prevent a decrease in production efficiency due to the time required to restore the tool state in order to change the target board in board production from board B(1) to board B(2).

[0075] Specifically, a mounting task unit U(2) is searched for that satisfies the search condition that the combination of the type of wafer W (wafer W2) located at wafer supply position 32 and the type of nozzle N (nozzle N1) attached to mounting head 421 for executing the corresponding mounting task unit U(2) matches the combination (wafer W2 and nozzle N1) indicated by the final tool state. As a result, when the mounting task for substrate B(1) is completed, there is no need to return the combination of wafer W and nozzle N to start the mounting task for substrate B(2). This makes it possible to prevent a decrease in production efficiency due to the time required to return the combination of wafer W and nozzle N to change the target substrate in substrate production from substrate B(1) to substrate B(2).

[0076] Note that various specific search orders can be considered when searching for a corresponding implementation work unit U(2) that satisfies the search conditions from among the multiple implementation work units U(1), U(2), U(3), and U(4). That is, in the example of Figure 6, a search is performed in execution order O1 (first order) for a corresponding implementation work unit U(2) that satisfies the search conditions from among the multiple implementation work units U(1), U(2), U(3), and U(4), and it is determined that the execution order O1 is executed cyclically starting from the corresponding implementation work unit U(2). However, the order determination may also be performed as shown in Figure 7.

[0077] FIG. 7 is a flowchart showing another example of order determination. The flowchart in FIG. 7 is executed under the control of the control unit 110. In step S601, the final tool state is confirmed, which is the tool state at the time when mounting work units U(1), U(2), U(3), and U(4) for board B(1) are completed, i.e., at the time when the mounting work is completed. In step S602, the identifier J (J=1, 2, 3, 4) that identifies the mounting work unit U(J) is set to Jx+1. Here, Jx is the number of mounting work units U(J), i.e., the maximum value of the identifier J=4. In addition, in step S603, the identifier J is decremented by 1.

[0078] Then, it is determined whether the tool state, which is the combination of the type of wafer W and the type of nozzle N used in the mounting work unit U(J), matches the final tool state (wafer W2, nozzle N1) (step S604). In the execution order O1, the tool state (wafer W4 and nozzle N2) when executing the mounting work unit U(4) is different from the final tool state ("NO" in step S604), so the process returns to step S603 and decrements the identifier J by 1. In this manner, steps S603 and S604 are repeated until a mounting work unit U(J) having a tool state matching the final tool state is found (until "YES" in step S604). As a result, in this example, mounting work unit U(2) is searched for.

[0079] In step S605, it is determined that the mounting work units U(1), U(2), U(3), and U(4) for board B(2) will be cyclically executed in the reverse order of execution order O1, starting from the corresponding mounting work unit U(2) found in step S604. Here, cyclically executing in the reverse order of execution order O1 means that in execution order O1, the mounting work units are executed in reverse order from the corresponding mounting work unit U(2) to the first, and then executed in reverse order from the last mounting work unit U(1), thereby executing the mounting work units U(1), U(2), U(3), and U(4). Therefore, in execution order O1, the mounting work units are executed in reverse order from the corresponding mounting work unit U(2) to the first mounting work unit U(1), and then the last mounting work unit U(4) to mounting work unit U(3) are executed in reverse order, resulting in the execution of mounting work units U(1), U(2), U(3), and U(4). At this time, similarly to steps S202 to S213 in the example of FIG. 3, the order within the unit is also reversed, and after the components P supplied by the feeder F are mounted, the dies Wp constituting the wafer W are mounted.

[0080] In other words, in the example of Figure 7, a search is made for the corresponding implementation work unit U(2) that satisfies the search conditions from among the multiple implementation work units U(1), U(2), U(3), and U(4) in the reverse order (second order) of the execution order O1 (first order), and it is determined that the corresponding implementation work unit U(2) will be executed cyclically in the reverse order of the execution order O1.

[0081] FIG. 8A is a diagram showing, in tabular form, the execution order of the mounting work units in the board production of FIG. 4, and FIG. 8B is a diagram showing, in tabular form, an example of the operations executed in accordance with the execution order of FIG. 8A. The execution order O2 shown in FIG. 8A indicates that the mounting work units U(1) and U(2) are executed in this order. Furthermore, the execution order O2 indicates that in the mounting work unit U(1), after the die Wp constituting the wafer W is mounted, the component P supplied from the feeder F is mounted (intra-unit order). In the example of FIG. 8A, the head unit 42 is provided with three mounting heads 421, and the three mounting heads 421 are identified by head numbers H1, H2, and H3. According to this execution order O2, in the mounting work unit U(1), a nozzle N1 is attached to each mounting head 421, and in the mounting work unit U(2), a nozzle N2 is attached to each mounting head 421.

[0082] In this example, we will assume a situation in which the execution order of mounting task units U(1) and U(2) for board B(2) is determined after mounting task units U(1) and U(2) for board B(1) have been completed in accordance with execution order O2. In particular, suppose that in mounting task unit U(1) for board B(1), when nozzle N1 is mounting component P supplied by feeder F1, mounting head 421 with head number H2 fails to mount component P.

[0083] Due to this mounting failure, after the execution of mounting task unit U(2), mounting of component P is re-executed on board B by mounting head 421 with head number H2 in mounting task unit U(1) using nozzle N1 (step S405). In this way, mounting task units U(1) and U(2) on board B(1) are completed. As a result, in the final tool state, wafer W2 is positioned at wafer supply position 32, and nozzles N2, N1, and N2 are attached to each of the three mounting heads 421 (FIG. 8B).

[0084] 6, there is no corresponding mounting task unit U among the mounting task units U(1) and U(2) shown in the execution order O2 that has a tool state that matches the final tool state. Therefore, the control unit 110 searches among the mounting task units U(1) and U(2) for a mounting task unit U that satisfies the search condition (second search condition) that the number of nozzles N that needs to be replaced in order to change the types of the multiple nozzles N2, N1, N2 indicated by the final tool state to the types of the multiple nozzles N that should be attached to the multiple mounting heads 421 in order to execute the corresponding mounting task unit U is the smallest.

[0085] In the example of FIG. 8A, to change from the final tool state (FIG. 8B) to nozzles N1, N1, N1 that should be installed to execute mounting task unit U(1), two nozzles N with head numbers H1 and H3 must be changed from nozzle N2 to nozzle N1. In contrast, to change from the final tool state (FIG. 8B) to nozzles N2, N2, N2 that should be installed to execute mounting task unit U(2), one nozzle N with head number H2 must be changed from nozzle N1 to nozzle N2. Therefore, mounting task unit U(2) is determined to satisfy the search conditions. As a result, it is determined that execution of mounting task units U(1) and U(2) for board B(2) will begin with the corresponding mounting task unit U(2).

[0086] In this embodiment, when the mounting work on the substrate B(1) (first substrate) is completed, the time required to return the state of the nozzle N to start the mounting work on the substrate B(2) (second substrate) can be reduced. As a result, it is possible to prevent a decrease in production efficiency due to the time required to return the tool state to change the target substrate in the substrate production from the substrate B(1) to the substrate B(2).

[0087] FIG. 9 is a flowchart showing another modified example of board production. In the board production of FIG. 9, a pre-inspection is performed (step S307) after board B is carried into mounting position 21 in step S301 and before the mounting work on board B (steps S302 to S305) begins. In this pre-inspection, for example, control unit 110 inspects board B for abnormalities based on an image of board B captured by mobile camera 45. Furthermore, in the board production of FIG. 9, a post-inspection is performed (step S308) after the mounting work on board B (steps S302 to S305) is completed and before board B is carried out from mounting position 21. In this post-inspection, for example, control unit 110 inspects whether or not there are abnormalities in die Wp or component P mounted on board B based on an image of die Wp or component P captured by mobile camera 356.

[0088] 9 is then executed for multiple boards B. In this case, when board production for board B(1) is completed and board production for board B(2) begins, the order in which multiple mounting work units U are executed for board B(2) is determined according to the final tool state after the mounting work for board B(1) is completed. However, the order of executing pre-inspection (step S307) followed by execution of multiple mounting work units U and the order of executing multiple mounting work units U followed by post-inspection (step S308) are maintained for boards B(1) and B(2).

[0089] That is, board production includes a pre-inspection (step S307) in which the state of board B carried into mounting position 21 by the carry-in operation (step S301) is inspected before the mounting operation (steps S302 to S305), and a post-inspection (step S308) in which the state of board B after the mounting operation (steps S302 to S305) is inspected before the carry-out operation (step S306). In response to this, control unit 110 performs the pre-inspection (step S307) before the mounting operation (steps S302 to S305) and the post-inspection (step S308) after the mounting operation (steps S302 to S305) in both board production for board B(1) and board production for board B(2). This configuration allows the pre-inspection (step S307) and post-inspection (step S308) of board B to be performed at appropriate times.

[0090] As described above, in the above embodiment, the surface mounter 10 corresponds to an example of the "surface mounter" of the present invention, the control unit 110 corresponds to an example of the "control unit" of the present invention, the memory unit 140 corresponds to an example of the "memory unit" of the present invention, the substrate transport unit 2 corresponds to an example of the "substrate transport unit" of the present invention, the mounting work position 21 corresponds to an example of the "mounting work position" of the present invention, the wafer storage unit 31 corresponds to an example of the "wafer storage unit" of the present invention, the wafer supply position 32 corresponds to an example of the "wafer supply position" of the present invention, the wafer pull-out unit 33 corresponds to an example of the "wafer supply unit" of the present invention, the mounting unit 4 corresponds to an example of the "mounting unit" of the present invention, the component supply mechanism 6 corresponds to an example of the "component supply unit" of the present invention, the substrate B corresponds to an example of the "target substrate" of the present invention, the nozzle N corresponds to an example of the "nozzle" of the present invention, the mounting work unit U corresponds to an example of the "mounting work unit" of the present invention, the wafer W corresponds to an example of the "wafer" of the present invention, and the die Wp corresponds to an example of the "die" of the present invention.

[0091] The present invention is not limited to the above-described embodiment, and various modifications can be made to the above-described embodiment without departing from the spirit of the present invention. For example, the tool state is not limited to the combination of the type of wafer W and the type of nozzle N, and may be one of these types.

[0092] Furthermore, in the above example, the surface mounter 10 functions as a flip-chip die bonder, but it may also function as a die bonder that does not flip the die. [Explanation of symbols]

[0093] 10...Surface mounter 110...Control unit 140...Storage section 2...Board transport section 21...Mounting work position 31...Wafer storage section 32...Wafer supply position 33...Wafer extraction section (wafer supply section) 4...Mounting section 6...Parts supply mechanism (parts supply unit) B...Substrate (target substrate) N...Nozzle U...Implementation Work Unit W...wafer Wp…Die

Claims

1. A wafer storage unit for storing a plurality of wafers; a wafer supply unit that supplies the wafer from the wafer storage unit to a wafer supply position; a substrate transport unit that transports a target substrate to a predetermined mounting work position; a mounting unit that mounts the die constituting the wafer supplied to the wafer supply position onto the target substrate at the mounting operation position using a detachably attached nozzle; a control unit that controls execution of board production, the control unit including a carry-in operation of carrying the target board into the mounting work position by the board transport unit, a mounting operation of mounting the die on the target board at the mounting work position by the mounting unit, and a carry-out operation of carrying the target board out of the mounting work position after the mounting work has been completed; Equipped with the mounting work includes a plurality of mounting work units, each mounting the die from a different type of wafer onto the target substrate; the wafer supply unit changes the type of the wafer supplied to the wafer supply position in accordance with execution of the plurality of mounting work units; In each of the plurality of mounting work units, the nozzle of a type corresponding to the wafer to be supplied to the wafer supply position for execution of the mounting work unit is attached to the mounting unit; when starting the board production of a second board as the target board following the completion of the board production of a first board as the target board, the control unit executes the plurality of mounting work units for the second board in an execution order corresponding to a final tool state indicating at least one of the type of the wafer positioned at the wafer supply position and the type of the nozzle attached to the mounting unit at the time when the mounting work on the first board is completed, the final tool state indicates a combination of the type of the wafer located at the wafer supply position and the type of the nozzle attached to the mounting unit at the time when the mounting operation on the first substrate is completed, The control unit executes the plurality of mounting work units for the first substrate in a predetermined first order, and executes the plurality of mounting work units for the second substrate in a second order that is the reverse of the first order, thereby starting the plurality of mounting work units for the second substrate from the mounting work unit in which the combination of the type of wafer located at the wafer supply position and the type of nozzle attached to the mounting unit matches the combination indicated by the final tool state.

2. A wafer storage section for storing a plurality of wafers; a wafer supply unit that supplies the wafer from the wafer storage unit to a wafer supply position; a substrate transport unit that transports a target substrate to a predetermined mounting work position; a mounting unit that mounts the die constituting the wafer supplied to the wafer supply position onto the target substrate at the mounting operation position using a detachably attached nozzle; a control unit that controls execution of board production, the control unit including a carry-in operation of carrying the target board into the mounting work position by the board transport unit, a mounting operation of mounting the die on the target board at the mounting work position by the mounting unit, and a carry-out operation of carrying the target board out of the mounting work position after the mounting work has been completed; Equipped with the mounting work includes a plurality of mounting work units, each mounting the die from a different type of wafer onto the target substrate; the wafer supply unit changes the type of the wafer supplied to the wafer supply position in accordance with execution of the plurality of mounting work units; In each of the plurality of mounting work units, the nozzle of a type corresponding to the wafer to be supplied to the wafer supply position for execution of the mounting work unit is attached to the mounting unit; when starting the board production of a second board as the target board following the completion of the board production of a first board as the target board, the control unit executes the plurality of mounting work units for the second board in an execution order corresponding to a final tool state indicating at least one of the type of the wafer positioned at the wafer supply position and the type of the nozzle attached to the mounting unit at the time when the mounting work on the first board is completed, the final tool state indicates a combination of the type of the wafer located at the wafer supply position and the type of the nozzle attached to the mounting unit at the time when the mounting operation on the first substrate is completed, The control unit executes a search process to search for a corresponding mounting work unit that satisfies a predetermined first search condition between the plurality of mounting work units for the second board and the final tool state, and searches for the plurality of mounting work units for the second board starting from the corresponding mounting work unit.

3. 3. The surface mounter according to claim 2, wherein the first search condition is that a combination of the type of the wafer located at the wafer supply position and the type of the nozzle attached to the mounting unit for executing the corresponding mounting work unit matches a combination indicated by the final tool state.

4. a storage unit configured to store a first order indicating an order of the plurality of mounting task units; the search process searches for the mounting task unit that satisfies the first search condition from among the plurality of mounting task units in the first order, thereby searching for the corresponding mounting task unit; 4. The surface mounter according to claim 3, wherein in the board production for the second board, the control unit executes, in the first order, from the corresponding mounting work unit to the last mounting work unit of the plurality of mounting work units, and then executes from the first mounting work unit of the plurality of mounting work units to the mounting work unit immediately preceding the corresponding mounting work unit.

5. a storage unit configured to store a first order indicating an order of the plurality of mounting task units; the search process searches for the mounting task unit that satisfies the first search condition from among the plurality of mounting task units in a second order that is the reverse of the first order, thereby searching for the corresponding mounting task unit; 4. The surface mounter according to claim 3, wherein in the board production for the second board, the control unit executes, in the second order, from the corresponding mounting work unit to the last mounting work unit of the plurality of mounting work units, and then executes from the first mounting work unit of the plurality of mounting work units to the mounting work unit immediately preceding the corresponding mounting work unit.

6. A plurality of nozzles are detachably attached to the mounting portion, 6. The surface mounter according to claim 3, wherein, in the search process, if the corresponding mounting work unit that satisfies the first search condition does not exist, the corresponding mounting work unit that satisfies a second search condition, namely, that the number of nozzles that need to be replaced in order to change the types of each of the plurality of nozzles indicated by the final tool state to the types of each of the plurality of nozzles that should be attached to the mounting unit in order to execute the corresponding mounting work unit, is the smallest, from among the plurality of mounting work units for the second board.

7. the board production includes a pre-inspection in which a state of the target board carried into the mounting work position by the carry-in work is inspected before the mounting work, and a post-inspection in which a state of the target board after the mounting work is completed is inspected before the carry-out work, 3. The surface mounter according to claim 1, wherein the control unit performs the pre-inspection before the mounting work and the post-inspection after the mounting work in both the board production for the first board and the board production for the second board.

8. a component supply unit that supplies components to the component supply position; the mounting work unit includes a die mounting period in which the die is mounted from the wafer onto the target substrate, and a component mounting period in which the component is mounted from the component supply position onto the target substrate, the type of nozzle attached to the mounting unit is the same during the die mounting period and the component mounting period that belong to the same mounting work unit; 3. The surface mounter according to claim 1, wherein the wafer supply unit exchanges the wafers supplied to the wafer supply position in parallel with the component mounting period.

9. A wafer storage section for storing a plurality of wafers; a wafer supply unit that supplies the wafer from the wafer storage unit to a wafer supply position; a substrate transport unit that transports a target substrate to a predetermined mounting work position; a mounting unit that mounts the die constituting the wafer supplied to the wafer supply position onto the target substrate at the mounting operation position using a detachably attached nozzle; a control unit that controls execution of board production, the control unit including a carry-in operation of carrying the target board into the mounting work position by the board transport unit, a mounting operation of mounting the die on the target board at the mounting work position by the mounting unit, and a carry-out operation of carrying the target board out of the mounting work position after the mounting work has been completed; Equipped with the mounting work includes a plurality of mounting work units, each mounting the die from a different type of wafer onto the target substrate; the wafer supply unit changes the type of the wafer supplied to the wafer supply position in accordance with execution of the plurality of mounting work units; In each of the plurality of mounting work units, the nozzle of a type corresponding to the wafer to be supplied to the wafer supply position for execution of the mounting work unit is attached to the mounting unit; when starting the board production of a second board as the target board following the completion of the board production of a first board as the target board, the control unit executes the plurality of mounting work units for the second board in an execution order corresponding to a final tool state indicating at least one of the type of the wafer positioned at the wafer supply position and the type of the nozzle attached to the mounting unit at the time when the mounting work on the first board is completed, the board production includes a pre-inspection in which a state of the target board carried into the mounting work position by the carry-in work is inspected before the mounting work, and a post-inspection in which a state of the target board after the mounting work is completed is inspected before the carry-out work, the control unit performs the pre-inspection before the mounting work and the post-inspection after the mounting work in both the board production for the first board and the board production for the second board.

10. A wafer storage section for storing a plurality of wafers; a wafer supply unit that supplies the wafer from the wafer storage unit to a wafer supply position; a substrate transport unit that transports a target substrate to a predetermined mounting work position; a mounting unit that mounts the die constituting the wafer supplied to the wafer supply position onto the target substrate at the mounting operation position using a detachably attached nozzle; a control unit that controls execution of board production, the control unit including a carry-in operation of carrying the target board into the mounting work position by the board transport unit, a mounting operation of mounting the die on the target board at the mounting work position by the mounting unit, and a carry-out operation of carrying the target board out of the mounting work position after the mounting work has been completed; Equipped with the mounting work includes a plurality of mounting work units, each mounting the die from a different type of wafer onto the target substrate; the wafer supply unit changes the type of the wafer supplied to the wafer supply position in accordance with execution of the plurality of mounting work units; In each of the plurality of mounting work units, the nozzle of a type corresponding to the wafer to be supplied to the wafer supply position for execution of the mounting work unit is attached to the mounting unit; when starting the board production of a second board as the target board following the completion of the board production of a first board as the target board, the control unit executes the plurality of mounting work units for the second board in an execution order corresponding to a final tool state indicating at least one of the type of the wafer positioned at the wafer supply position and the type of the nozzle attached to the mounting unit at the time when the mounting work on the first board is completed, a component supply unit that supplies components to the component supply position; the mounting work unit includes a die mounting period in which the die is mounted from the wafer onto the target substrate, and a component mounting period in which the component is mounted from the component supply position onto the target substrate, the type of nozzle attached to the mounting unit is the same during the die mounting period and the component mounting period that belong to the same mounting work unit; The wafer supply unit is a surface mounter that performs replacement of the wafers supplied to the wafer supply position in parallel with the component mounting period.

11. a step of carrying the first substrate into a mounting operation position; performing a mounting operation on the first substrate as a target substrate; a step of removing the first substrate from the mounting position after the mounting operation has been completed; carrying the second substrate into a mounting position; performing the mounting operation using the second substrate as a target substrate; a step of removing the second substrate on which the mounting work has been completed from the mounting work position; Equipped with In the mounting operation, a die constituting a wafer supplied to a wafer supply position from a wafer storage unit that stores a plurality of wafers is mounted on the target substrate at the mounting operation position by a nozzle to which a mounting unit is detachably attached; the mounting work includes a plurality of mounting work units, each mounting the die from a different type of wafer onto the target substrate; the type of the wafer supplied to the wafer supply position is changed in accordance with the execution of the plurality of mounting work units; In each of the plurality of mounting work units, the nozzle of a type corresponding to the wafer to be supplied to the wafer supply position for execution of the mounting work unit is attached to the mounting unit; execute the plurality of mounting task units for the second substrate in an execution order according to a final tool state indicating at least one of the type of the wafer located at the wafer supply position and the type of the nozzle attached to the mounting unit at the time when the mounting task for the first substrate is completed; the final tool state indicates a combination of the type of the wafer located at the wafer supply position and the type of the nozzle attached to the mounting unit at the time when the mounting operation on the first substrate is completed, A surface mounting method in which a control unit executes the plurality of mounting work units for the first substrate in a predetermined first order, and executes the plurality of mounting work units for the second substrate in a second order that is the reverse of the first order, thereby starting the plurality of mounting work units for the second substrate from the mounting work unit in which the combination of the type of wafer located at the wafer supply position and the type of nozzle attached to the mounting unit matches the combination indicated by the final tool state.

12. a step of carrying the first substrate into a mounting operation position; performing a mounting operation on the first substrate as a target substrate; a step of removing the first substrate from the mounting position after the mounting operation has been completed; carrying the second substrate into a mounting position; performing the mounting operation using the second substrate as a target substrate; a step of removing the second substrate on which the mounting work has been completed from the mounting work position; Equipped with In the mounting operation, a die constituting a wafer supplied to a wafer supply position from a wafer storage unit that stores a plurality of wafers is mounted on the target substrate at the mounting operation position by a nozzle to which a mounting unit is detachably attached; the mounting work includes a plurality of mounting work units, each mounting the die from a different type of wafer onto the target substrate; the type of the wafer supplied to the wafer supply position is changed in accordance with the execution of the plurality of mounting work units; In each of the plurality of mounting work units, the nozzle of a type corresponding to the wafer to be supplied to the wafer supply position for execution of the mounting work unit is attached to the mounting unit; execute the plurality of mounting task units for the second substrate in an execution order according to a final tool state indicating at least one of the type of the wafer located at the wafer supply position and the type of the nozzle attached to the mounting unit at the time when the mounting task for the first substrate is completed; the final tool state indicates a combination of the type of the wafer located at the wafer supply position and the type of the nozzle attached to the mounting unit at the time when the mounting operation on the first substrate is completed, a control unit executes a search process to search for a corresponding mounting work unit that satisfies a predetermined first search condition between the plurality of mounting work units for the second board and the final tool state, and searches for the plurality of mounting work units for the second board starting from the corresponding mounting work unit.

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