Wafer Vacuum Carrier

Abstract

To provide a wafer vacuum carrier.SOLUTION: A wafer vacuum carrier includes a connection portion arranged to be connected to a vacuum source, and a mounting portion adjacent to the connection portion and arranged to support a wafer, the mounting portion includes a plurality of through holes and a continuous closed path, the closed path communicates the through holes with the vacuum source, includes a plurality of connected rings and is arranged concentrically, the through holes are positioned above the closed path and arranged along the closed path, the closed path extends to the connection portion, and when the vacuum source is turned on, the mounting portion adsorbs the wafer by the closed path and the through holes.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present disclosure relates to wafer vacuum carriers. [Background technology]

[0002] Typically, during the manufacturing or inspection of semiconductor wafers, a robot fork must transfer the wafer from a wafer cassette to a wafer chuck on a stage for the associated semiconductor manufacturing process or measurement. After a step is completed, the robot fork must also transfer the wafer from the wafer chuck to the wafer cassette so that the wafer can be moved to a subsequent manufacturing process station for the subsequent step. Summary of the Invention [Problem to be solved by the invention]

[0003] However, for thin wafers, support by forks alone can easily cause the wafer to shift or shift angle during transport, resulting in misalignment. For example, warpage can cause the wafer to be low in the center and high on the periphery, or high in the center and low on the periphery. While vacuum suction nozzles or O-rings can be used to suction wafers, the nozzles and O-rings themselves are thick and are limited by the height of each layer in the wafer cassette. Alternatively, multiple robot forks can be designed to support different portions of the wafer, but this significantly increases cost and design complexity. [Means for solving the problem]

[0004] One technical aspect of the present disclosure is a wafer vacuum carrier.

[0005] According to some embodiments of the present disclosure, a wafer vacuum carrier includes a connection portion arranged to connect to a vacuum source, and a mounting portion adjacent to the connection portion and arranged to support a wafer, the mounting portion having a plurality of through holes and a continuous closed path, the closed path communicating the through holes with the vacuum source, having a plurality of connected rings and being concentric, the through holes being located above and arranged along the closed path, the closed path extending to the connection portion, and when the vacuum source is turned on, the mounting portion adsorbs the wafer by the closed path and the through holes.

[0006] In some embodiments, the receiving portion includes a groove and a sealing plate, the sealing plate covering the groove to define a closed path.

[0007] In some embodiments, the through holes of the mounting portion are provided concentrically.

[0008] In some embodiments, the through-hole has a smaller diameter near the center of the resting portion than near the edge of the resting portion, and the closed path has a smaller width near the center of the resting portion than near the edge of the resting portion.

[0009] In some embodiments, the through-hole has a larger diameter near the center of the mounting portion than near the edge of the mounting portion, and the closed path has a larger width near the center of the mounting portion than near the edge of the mounting portion.

[0010] In some embodiments, the multiple rings of the closed path are concentric circles or concentric polygons.

[0011] In some embodiments, the diameter of the mounting portion is greater than the width of the connecting portion.

[0012] In some embodiments, the closed path near the center of the rest is upstream of the closed path near the edge of the rest.

[0013] In some embodiments, the closure path near the center of the rest is downstream of the closure path near the edge of the rest.

[0014] In some embodiments, the diameter of the through-hole of the mounting portion is in the range of 0.5 mm to 5 mm.

[0015] In some embodiments, an edge of the rest is located between an outermost of the plurality of rings of the closed path and an edge of the wafer.

[0016] In some embodiments, the diameter of the mounting portion is greater than the diameter of the outermost of the plurality of loops of the closed path and less than the diameter of the wafer.

[0017] In some embodiments, the material of the mounting portion and the connecting portion includes metal, carbon fiber, ceramic, or engineering plastic.

[0018] In some embodiments, the diameter of the mounting portion is in the range of 50 millimeters to 190 millimeters. [Effects of the Invention]

[0019] In the above-described embodiment of the present disclosure, the closed path on the wafer vacuum carrier's mounting section communicates with the through-holes. When a vacuum source connected to the closed path is turned on, the mounting section can suction a wafer positioned thereon. Furthermore, the closed path is continuous and has multiple concentric rings, allowing different areas of the wafer to be suctioned by the through-holes on the mounting section. This prevents wafer movement and angular misalignment during transport, improving wafer alignment accuracy for thin wafers. In this way, wafers supported by the wafer vacuum carrier's mounting section are less likely to develop warpage, resulting in a low center and high periphery, or a high center and low periphery, thereby improving product yield. Furthermore, the wafer vacuum carrier eliminates the need for conventional vacuum suction nozzles or O-rings, reducing the overall thickness and allowing for more flexible wafer cassette selection. Furthermore, the wafer vacuum carrier's mounting section can support wafers over a wide area, eliminating the need for multiple robot forks, effectively saving costs. [Brief explanation of the drawings]

[0020] Aspects of the present disclosure may best be understood by the following embodiments when read in conjunction with the accompanying drawings. It should be noted that, according to standard industry practice, various features have not been drawn to scale. In fact, the sizes of various features may be arbitrarily increased or decreased for clarity of illustration. [Figure 1] FIG. 2 illustrates a top view of a wafer vacuum carrier according to one embodiment of the present disclosure. [Figure 2] FIG. 2 is a bottom view of the wafer vacuum carrier of FIG. 1. [Figure 3] FIG. 2 is a side view of the wafer vacuum carrier of FIG. [Figure 4] 2 is a top view showing the wafer vacuum carrier of FIG. 1 holding a wafer by suction. FIG. [Figure 5] FIG. 10 is a bottom view of a wafer vacuum carrier according to another embodiment of the present disclosure. [Figure 6]FIG. 10 is a bottom view of a wafer vacuum carrier according to yet another embodiment of the present disclosure. [Figure 7] FIG. 10 is a bottom view of a wafer vacuum carrier according to yet another embodiment of the present disclosure. [Figure 8] FIG. 2 illustrates a bottom view of a wafer vacuum carrier according to one embodiment of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0021] The subject matter of the embodiments disclosed below provides many different embodiments or examples for implementing different features of the provided subject matter. To simplify the present application, specific examples of elements and arrangements are described below. Of course, these examples are merely examples and are not intended to be limiting. Also, the present application may repeat element symbols and / or alphabets in each example. This repetition is for simplicity and clarity and does not itself specify a relationship between each embodiment and / or arrangement discussed.

[0022] Spatially relative terms such as "below," "under," "lower," "above," "top," and the like may be used herein for ease of description and describe the relationship of one element or feature to another element or feature as shown in the figures. These spatially relative terms are intended to encompass different orientations of the device during use or operation other than the orientation shown in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may likewise be interpreted accordingly.

[0023] FIG. 1 is a top view of a wafer vacuum carrier 100 according to an embodiment of the present disclosure. FIG. 2 is a bottom view of the wafer vacuum carrier 100 of FIG. 1. Referring simultaneously to FIGS. 1 and 2, the wafer vacuum carrier 100 includes a connection portion 110 and a mounting portion 120. The connection portion 110 is arranged to connect to a vacuum source 200. The mounting portion 120 is adjacent to the connection portion 110 and can be used to support a wafer. The mounting portion 120 has a plurality of through-holes 121 and a continuous closed passage 122. For clarity, FIG. 2 omits the sealing plate 124 shown in FIG. 3 and shows the closed passage 122 with a solid line. The closed passage 122 connects the through-holes 121 to the vacuum source 200. When the vacuum source 200 is turned on, the closed passage 122 becomes negative pressure, causing the through-holes 121 to have suction force. The closed passage 122 has a plurality of connected rings arranged concentrically. The through holes 121 are arranged along a closed path 122. The closed path 122 extends to the connecting portion 110.

[0024] In this embodiment, the multiple rings of the closed path 122 are concentric circles, but are not limited to circles and may be concentric polygons. The through-holes 121 of the mounting portion are also arranged concentrically along the closed path 122. The diameter of the through-holes 121 is within a range of 0.5 to 5 mm. The mounting portion 120 and the connecting portion 110 of the wafer vacuum carrier 100 may be integrally molded, and their materials may include metal, carbon fiber, ceramic, or engineering plastic. To ensure a sufficient wafer mounting area and to prevent warpage, the diameter of the mounting portion 120 is greater than the width of the connecting portion 110. The connecting portion 110 of the wafer vacuum carrier 100 may be connected to a robot arm so that the wafer vacuum carrier 100 can replace a conventional fork.

[0025] 3 is a side view showing the wafer vacuum carrier 100 of FIG. 2 and FIG. 3 simultaneously, the mounting portion 120 of the wafer vacuum carrier 100 may include a groove 123 and a sealing plate 124, and the sealing plate 124 covers the groove 123 to define a closed path 122. The through-holes 121 of the mounting portion 120 are located above and communicate with the closed path 122. In this embodiment, the closed path 122 closer to the center of the mounting portion 120 is upstream of the closed path 122 closer to the edge of the mounting portion 120. Therefore, when the vacuum source 200 is turned on, a suction force is sequentially applied from the central region of the mounting portion 120 along the closed path 122 to the edge region of the mounting portion 120, but the present disclosure is not limited thereto.

[0026] FIG. 4 is a top view showing the wafer vacuum carrier 100 of FIG. 1 holding a wafer W. Referring to FIGS. 2 and 4 simultaneously, the mounting portion 120 is positioned to support the wafer W. In this embodiment, the edge of the mounting portion 120 is located between the outermost portion of the closed path 122 and the edge of the wafer W. That is, the diameter of the mounting portion 120 is larger than the diameter of the outermost portion of the closed path 122 and smaller than the diameter of the wafer W. In some embodiments, the diameter of the mounting portion 120 is within a range of 50 to 190 mm, and the diameter of the wafer W is approximately 200 mm. A method of transferring a wafer may include: moving the mounting portion 120 of the wafer vacuum carrier 100 below the wafer W so as to contact the wafer W; and turning on a vacuum source 200 communicating with the closed path 122 to evacuate the closed path 122, thereby causing the mounting portion 120 to suction-hold the wafer W via the closed path 122 and the through-holes 121.

[0027] Specifically, the closed path 122 of the mounting portion 120 of the wafer vacuum carrier 100 communicates with the through-hole 121. When the vacuum source 200 connected to the closed path 122 is turned on, the mounting portion 120 can suction the wafer W positioned thereon. Furthermore, the closed path 122 is continuous and has multiple concentric rings. This allows different regions of the wafer W to be suctioned by the through-holes 121 of the mounting portion 120. This prevents movement or angular deviation of the wafer W during transport, improving the alignment accuracy of a thin wafer W. In this way, the wafer W supported by the mounting portion 120 of the wafer vacuum carrier 100 is less likely to be warped, resulting in a low center and high periphery, or a high center and low periphery, thereby improving product yield. Furthermore, the wafer vacuum carrier 100 eliminates the need for a conventional vacuum suction nozzle or O-ring, reducing the overall thickness and allowing for more flexible wafer cassette selection. Furthermore, the mounting portion 120 of the wafer vacuum carrier 100 can support the wafer W over a wide range, eliminating the need for multiple robot forks, and effectively saving costs.

[0028] It should be noted that the connection relationships, materials, and effects of the elements that have already been described will not be described repeatedly. In the following description, other types of wafer vacuum carriers will be described. For clarity of illustration, the sealing plate 124 of FIG. 3 and the vacuum source 200 of FIG. 2 are omitted in FIGS. 5 to 8.

[0029] FIG. 5 is a bottom view of a wafer vacuum carrier 100a according to another embodiment of the present disclosure. The wafer vacuum carrier 100a includes a connecting portion 110 and a mounting portion 120. The mounting portion 120 has a through-hole 121a and a closed passage 122a. This embodiment differs from the embodiment of FIG. 2 in that the diameter of the through-hole 121a in the mounting portion 120 of the wafer vacuum carrier 100a is smaller near the center of the mounting portion 120 than near the edge of the mounting portion 120, and the width of the closed passage 122a near the center of the mounting portion 120 is smaller than the width near the edge of the mounting portion 120. That is, the diameter of the through-hole 121a is different in different regions of the mounting portion 120, and the width of the closed passage 122a is different in different regions of the mounting portion 120. In this manner, by turning on the vacuum source 200 (see FIG. 2) communicating with the closed path 122a, a time difference can be present when different areas of the wafer W are attracted, which can be determined according to design requirements.

[0030] FIG. 6 is a bottom view of a wafer vacuum carrier 100b according to yet another embodiment of the present disclosure. The wafer vacuum carrier 100b includes a connecting portion 110 and a mounting portion 120. The mounting portion 120 has a through-hole 121b and a closed passage 122b. This embodiment differs from the embodiment of FIG. 2 in that the diameter of the through-hole 121b in the mounting portion 120 of the wafer vacuum carrier 100b is larger near the center of the mounting portion 120 than near the edge of the mounting portion 120, and the width of the closed passage 122b near the center of the mounting portion 120 is larger than near the edge of the mounting portion 120. That is, the diameters of the through-holes 121b in different regions of the mounting portion 120 are different, and the widths of the closed passages 122b in different regions of the mounting portion 120 are different. In this manner, by turning on the vacuum source 200 (see FIG. 2) communicating with the closed path 122b, a time difference can be present when different areas of the wafer W are attracted, which can be determined according to design requirements.

[0031] FIG. 7 is a bottom view showing a wafer vacuum carrier 100c according to another embodiment of the present disclosure. The wafer vacuum carrier 100c includes a connection portion 110 and a mounting portion 120. The mounting portion 120 has a through-hole 121 and a closed passage 122c. This embodiment differs from the embodiment of FIG. 2 in that the multiple rings of the closed passage 122c are concentric polygons, such as a square or a rectangle, although the present disclosure is not limited thereto. When the vacuum source 200 (see FIG. 2) communicating with the closed passage 122c is turned on, the mounting portion 120 adsorbs the wafer W via the closed passage 122c and the through-hole 121.

[0032] FIG. 8 is a bottom view illustrating a wafer vacuum carrier 100d according to one embodiment of the present disclosure. The wafer vacuum carrier 100d includes a connecting portion 110 and a mounting portion 120. The mounting portion 120 has a through-hole 121 and a closed path 122d. This embodiment differs from the embodiment of FIG. 2 in that the closed path 122d near the center of the mounting portion 120 of the wafer vacuum carrier 100d is downstream of the closed path 122d near the edge of the mounting portion 120. With this design, when the vacuum source 200 (see FIG. 2) communicating with the closed path 122d is turned on, a suction force is sequentially applied from the edge region of the mounting portion 120 along the closed path 122d to the central region of the mounting portion 120.

[0033] The foregoing has outlined features of several embodiments so that those skilled in the art may better understand aspects of the present disclosure. Those skilled in the art should appreciate that this disclosure may readily be used as a basis for designing or modifying other processes and structures to carry out the same purposes and / or achieve the same advantages as the embodiments introduced herein. Those skilled in the art should further realize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that various changes, substitutions, and alterations may be made therein without departing from the spirit and scope of the present disclosure. [Explanation of symbols]

[0034] 100, 100a, 100b, 100c, 100d Wafer Vacuum Carrier 110 Connection 120 Placement section 121, 121a, 121b through hole 122, 122a, 122b, 122c, 122d Closed pathway 123 Groove 124 Sealing plate 200 Vacuum source W wafer

Claims

1. a connection portion arranged to connect to a vacuum source; a mounting portion adjacent to the connection portion and arranged to support a wafer; Including, The mounting portion has a plurality of through holes and a continuous closed path, the closed path has a plurality of connected rings that connect the plurality of through holes to the vacuum source and are arranged concentrically, the plurality of through holes are located above the closed path and are arranged along the closed path, and the closed path extends to the connection portion, and when the vacuum source is turned on, the mounting portion adsorbs the wafer using the closed path and the plurality of through holes.

2. The wafer vacuum carrier of claim 1 , wherein the mounting portion includes a groove and a sealing plate, the sealing plate covering the groove to define the closed path.

3. The wafer vacuum carrier according to claim 1 or 2, wherein the plurality of through holes of the mounting portion are provided concentrically.

4. 3. A wafer vacuum carrier as described in claim 1 or 2, wherein the diameter of the plurality of through holes is smaller near the center of the mounting portion than near the edge of the mounting portion, and the width of the closed path is smaller near the center of the mounting portion than near the edge of the mounting portion.

5. 3. A wafer vacuum carrier as described in claim 1 or 2, wherein the diameter of the plurality of through holes is larger near the center of the mounting portion than near the edge of the mounting portion, and the width of the closed path is larger near the center of the mounting portion than near the edge of the mounting portion.

6. 3. The wafer vacuum carrier of claim 1, wherein the plurality of rings of the closed path are concentric circles or concentric polygons.

7. 3. The wafer vacuum carrier according to claim 1, wherein the diameter of the mounting portion is greater than the width of the connecting portion.

8. 3. The wafer vacuum carrier of claim 1, wherein the closed path closer to the center of the resting portion is upstream of the closed path closer to the edge of the resting portion.

9. 3. The wafer vacuum carrier of claim 1, wherein the closed path near the center of the resting portion is downstream of the closed path near the edge of the resting portion.

10. 3. The wafer vacuum carrier according to claim 1, wherein the diameter of the plurality of through holes in the mounting portion is within a range of 0.5 mm to 5 mm.

11. 3. The wafer vacuum carrier of claim 1, wherein an edge of the rest portion is located between an outermost one of the plurality of loops of the closed path and an edge of the wafer.

12. 3. The wafer vacuum carrier of claim 1, wherein the diameter of the mounting portion is larger than the diameter of the outermost of the plurality of loops of the closed path and smaller than the diameter of the wafer.

13. 3. The wafer vacuum carrier according to claim 1, wherein the material of the mounting portion and the connecting portion includes metal, carbon fiber, ceramic, or engineering plastic.

14. 3. The wafer vacuum carrier according to claim 1, wherein the diameter of the mounting portion is in the range of 50 mm to 190 mm.

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