Light-emitting device

Abstract

A light emitting device characterized by comprising: a base portion having a mounting surface; a first light emitting element disposed on the mounting surface and having one or more light reflection members and a first light exit surface facing the one or more light reflection surfaces, the one or more light reflection members providing one or more light reflection surfaces on one virtual plane, the first light emitting element being disposed on the mounting surface with the first light exit surface when viewed from above being at an angle to the one or more light reflection surfaces, light exiting the first light exit surface irradiating the one or more light reflection surfaces; and a second light emitting element which has a second light exit surface facing the one or more light reflection surfaces and which is disposed on the mounting surface with the second light exit surface when viewed from above being at an angle to the first light exit surface, light exiting the second light exit surface irradiating the one or more light reflection surfaces. Light from the first light emitting element that has been reflected by the one or more light reflection surfaces and light from the second light emitting element become closer to each other and then enter a light extraction region of the light emitting device.

Description

[Technical Field]

[0001] The present disclosure relates to a light emitting device. [Background technology]

[0002] Patent Document 1 discloses a light source device in which light emitted from a plurality of light-emitting elements is reflected by a reflecting surface of a reflecting mirror and emitted to the outside. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2020-21761 Summary of the Invention [Problem to be solved by the invention]

[0004] In the light source device of Patent Document 1, the optical axes of the light emitted from each light-emitting element are parallel to each other, so it is generally considered that a light extraction area having a length greater than or equal to the distance between the light-emitting points of the light-emitting elements located at both ends is secured.

[0005] On the other hand, there is not always a demand for light emitting devices that have a large light extraction area, as in Patent Document 1. Depending on the size of the light extraction area and the characteristics of the light extracted therefrom, there is room for improvement in the arrangement of the components in the light emitting device. [Means for solving the problem]

[0006] The light emitting device disclosed in this specification comprises a base having a mounting surface, one or more light reflecting members arranged on the mounting surface and providing one or more light reflecting surfaces on a single virtual plane, a first light emitting element having a first light emitting surface facing the one or more light reflecting surfaces and arranged on the mounting surface so that the first light emitting surface is oblique to the one or more light reflecting surfaces in a top view, and light emitted from the first light emitting surface is irradiated onto the one or more light reflecting surfaces, and a second light emitting element having a second light emitting surface facing the one or more light reflecting surfaces and arranged on the mounting surface so that the second light emitting surface is oblique to the first light emitting surface in a top view, and light emitted from the second light emitting surface is irradiated onto the one or more light reflecting surfaces, and is characterized in that the light from the first light emitting element and the light from the second light emitting element reflected by the one or more light reflecting surfaces approach each other and enter a light extraction region of the light emitting device.

[0007] According to the embodiments of the present disclosure, a light emitting device is realized that collects light from a plurality of light emitting elements in a light extraction region and extracts light effectively. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a perspective view of a light emitting device according to an embodiment. [Figure 2] FIG. 2 is a top view corresponding to FIG. [Figure 3] FIG. 3 is a cross-sectional view of the light emitting device taken along line III-III in FIG. [Figure 4] FIG. 4 is a perspective view illustrating the internal structure of the light emitting device according to the embodiment. [Figure 5] FIG. 5 is a perspective view illustrating the internal structure of the light emitting device according to the embodiment. [Figure 6] FIG. 6 is a top view corresponding to FIG. [Figure 7] FIG. 7 is a perspective view of the wavelength conversion member and the light-transmitting member according to the embodiment in a joined state. [Figure 8] FIG. 8 is a top view corresponding to FIG. [Figure 9]FIG. 9 is a transparent top view of the upper surface side of the wavelength conversion member to explain the joint surface between the light-transmitting member and the wavelength conversion member according to the embodiment. [Figure 10] FIG. 10 is a bottom view of the wavelength conversion member according to the embodiment. [Figure 11] FIG. 11 is a top view of the light-transmitting member according to the embodiment. [Figure 12] FIG. 12 is an image showing the intensity distribution of light irradiated onto the light reflecting surface of the light emitting device according to the embodiment. [Figure 13] FIG. 13 is an image showing the intensity distribution of light incident on the wavelength conversion section of the light emitting device according to the embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0009] In this specification and claims, polygons such as triangles and quadrilaterals are referred to as polygons, including shapes in which the corners of the polygons have been rounded, chamfered, corner-cut, rounded, etc. Furthermore, shapes in which processing has been applied not only to the corners (edges of the sides) but also to the middle portions of the sides are also referred to as polygons. In other words, shapes in which partial processing has been applied while retaining the polygonal base are included in the interpretation of "polygon" described in this specification and claims.

[0010] The same applies to words that describe specific shapes, such as trapezoids, circles, and irregularities, not just polygons. The same also applies when dealing with the sides that form the shape. In other words, even if the corners or middle part of a side are processed, the interpretation of "side" includes the processed part. Note that when distinguishing a "polygon" or "side" that has no processing from a processed shape, the word "strict" is added, for example, "strict quadrangle."

[0011] Furthermore, in this specification or the claims, expressions such as up and down, left and right, front and back, front and back, front and back, etc. merely describe relationships such as relative positions, orientations, directions, etc., and do not necessarily correspond to the relationships when in use.

[0012] Furthermore, in this specification or the claims, when there are multiple equivalents to a certain element and each is to be expressed separately, the element may be distinguished by adding "first" or "second" to the beginning of the element. Furthermore, when the objects or viewpoints distinguished between this specification and the claims are different, the same notation may not refer to the same object between the specification and the claims.

[0013] For example, if there are objects in this specification that are distinguished by appending "first," "second," and "third," and the claims are written to refer only to the "first" and "third" in this specification, they may be distinguished by appending "first" and "second" in the claims for ease of reading. In this case, the objects appended with "first" and "second" in the claims refer to the objects appended with "first" and "third" in this specification.

[0014] Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings. However, although the illustrated embodiments embody the technical ideas of the present invention, they do not limit the present invention. Furthermore, in the following description, the same names and symbols indicate the same or similar components, and redundant explanations may be omitted as appropriate. Note that the size and positional relationship of components shown in each drawing may be exaggerated for clarity of explanation.

[0015] <Embodiment> FIG. 1 is a perspective view showing an example of a light emitting device 1 according to an embodiment. FIG. 2 is a top view of the light emitting device 1. FIG. 3 is a cross-sectional view of the light emitting device 1 taken along line III-III in FIG. 2. FIG. 4 is a perspective view of the light emitting device 1 from which a light-blocking member 90 has been removed to illustrate the internal structure. FIG. 5 is a perspective view of the light emitting device 1 from which a translucent member 82 and a wavelength conversion member 81 have been removed to illustrate the internal structure. FIG. 6 is a top view similar to FIG. 5. FIG. 7 is a perspective view showing a state in which a wavelength conversion member 81 according to an embodiment and a translucent member 82 are bonded together. FIG. 8 is a top view similar to FIG. 7. FIG. 9 is a top view showing the upper surface of the wavelength conversion member 81 to illustrate the bonded surface between the translucent member 82 and the wavelength conversion member 81. Note that in FIG. 9, the bonded region of the metal film 821 of the translucent member 82 and the conductive film 813 of the wavelength conversion member 81 are indicated by hatching. The finer hatching indicates the conductive film 813. Fig. 10 is a bottom view of a wavelength conversion member 81 according to an embodiment. Fig. 11 is a top view of a light-transmitting member 82 according to an embodiment.

[0016] The components of the light emitting device 1 include a base 10, a plurality of light emitting elements 20, one or a plurality of submounts 30, one or more light reflecting members 40, a protective element 50, a temperature measuring element 60, a plurality of wirings 70, a wavelength converting member 81, a light-transmitting member 82, and a light-shielding member 90. The light emitting device 1 may further include other components.

[0017] Next, each component will be described. (base 10) The base 10 has a plurality of upper surfaces 11, a lower surface 13, one or more inner surfaces 14, and one or more outer surfaces 15. The base 10 has a concave shape that is recessed from top to bottom. The outer shape of the base 10 is rectangular when viewed from above.

[0018] The multiple top surfaces 11 include a bottom surface 111. The bottom surface 111 is a mounting surface on which other components are arranged. The bottom surface 111 is the lowest of the multiple top surfaces 11. The multiple top surfaces 11 include a top surface 112, which is the uppermost top surface. The bottom surface 111 is surrounded by the top surface 112 when viewed from above.

[0019] The multiple top surfaces 11 include one or more top surfaces 11 located between the top surface 112 and the bottom surface 111. Here, when distinguishing between these one or more top surfaces 11, they will be numbered in order from the lowest height from the bottom surface 111, such as a first top surface 11, a second top surface 11, and so on.

[0020] The base 10 has a plurality of step portions 16 that differ in height from the bottom surface 111. Here, the step portions 16 are composed only of the upper surface 11 and all of the inner surfaces 14 that intersect with this upper surface 11 and extend downward. The plurality of step portions 16 includes a step portion 16 composed of the top surface 112 and all of the inner surfaces 14 that intersect with it and extend downward, and a step portion 16 composed of the first upper surface 11 and all of the inner surfaces 14 that intersect with it and extend downward.

[0021] Here, when distinguishing between the multiple step portions 16, they will be numbered in order from the shortest height from the bottom surface 111 to the top surface 11 of the step portion 16, such as first step portion 16, second step portion 16, etc. The illustrated example of the base 10 has one first top surface 11 and two second top surfaces 11 between the top surface 112 and the bottom surface 111, and has a first step portion 16 including the first top surface, two second step portions 16 each including the second top surface 11, and a third step portion 16 including the top surface 112.

[0022] The base 10 can be formed primarily from ceramic. For example, aluminum nitride, silicon nitride, aluminum oxide, or silicon carbide can be used as the ceramic. However, the base 10 is not limited to ceramic, and other insulating materials may also be used as the primary material.

[0023] Furthermore, one or more metal films are provided on the bottom surface 111 of the base 10. Furthermore, one or more metal films are provided on the top surface 11 of the step portion 16 of the base 10. Furthermore, a plurality of metal films 17 are provided on the top surface 112 of the base 10, and are electrically connected to the metal films provided on the bottom surface 111 and the step portion 16.

[0024] (Light-emitting element 20) The light emitting element 20 has an upper surface, a lower surface, and one or more side surfaces. The light emitting element 20 also has one or more light emitting surfaces that emit light within the upper surface, lower surface, and one or more side surfaces.

[0025] The light emitting element 20 is, for example, a semiconductor laser element. Note that the light emitting element 20 is not limited to a semiconductor laser element, and may be, for example, a light emitting diode (LED) or an organic light emitting diode (OLED). In the example of the light emitting device 1 shown in the figure, a semiconductor laser element is adopted as the light emitting element 20.

[0026] The semiconductor laser element has a rectangular outer shape when viewed from above. A side surface intersecting one of the two short sides of the rectangle serves as a light-emitting surface of the semiconductor laser element. The upper and lower surfaces of the semiconductor laser element have larger areas than the light-emitting surface.

[0027] The light (laser light) emitted from a semiconductor laser element has a spreading property and forms an elliptical far-field pattern (hereinafter referred to as "FFP") in a plane parallel to the light emission surface. Here, FFP refers to the shape and light intensity distribution of the emitted light at a position away from the light emission surface.

[0028] The light passing through the center of the elliptical shape of the FFP, in other words, the light with peak intensity in the light intensity distribution of the FFP, is called the light traveling along the optical axis. Also, the optical path of the light traveling along the optical axis is called the optical axis of that light. Also, in the light intensity distribution of the FFP, the light with a peak intensity of 1 / e 2 Light having an intensity equal to or greater than this will be referred to as the "main portion" of light.

[0029] In the elliptical shape of the FFP of light emitted from the light emitting element 20, which is a semiconductor laser element, the minor axis direction of the ellipse is the parallel direction of the FFP, and the major axis direction is the vertical direction of the FFP. Multiple layers, including an active layer, that make up the semiconductor laser element are stacked in the vertical direction of the FFP.

[0030] Based on the optical intensity distribution of the FFP of a semiconductor laser element, the angle equivalent to the full width at half maximum of the optical intensity distribution is called the optical divergence angle of that semiconductor laser element. The optical divergence angle in the direction perpendicular to the FFP is called the vertical divergence angle, and the optical divergence angle in the direction parallel to the FFP is called the parallel divergence angle.

[0031] The light-emitting element 20 is not limited to a semiconductor laser element, but may be a light-emitting element having at least some of the characteristics of the semiconductor laser element described above, or may be a light-emitting element that does not have these characteristics.

[0032] The light emitting element 20 emits light having an emission peak wavelength in the range of 320 nm to 530 nm, typically in the range of 430 nm to 480 nm. An example of the light emitting element 20 that emits such light is a semiconductor laser element containing a nitride semiconductor. Examples of nitride semiconductors that can be used include GaN, InGaN, and AlGaN. However, the light emitted from the light emitting element 20 is not limited to this wavelength range.

[0033] (Submount 30) The submount 30 has a bottom surface, a top surface, and one or more side surfaces. The submount 30 has a minimum width in the vertical direction. The submount 30 is configured in a rectangular parallelepiped shape. However, the shape is not limited to a rectangular parallelepiped. The submount 30 is formed using, for example, silicon nitride, aluminum nitride, or silicon carbide. However, other materials may also be used.

[0034] (Light reflecting member 40) The light reflecting member 40 has one or more light reflecting surfaces 41 that reflect light. For example, the light reflecting member 40 is provided with a light reflecting surface 41 that has a light reflectance of 90% or more for the peak wavelength of the irradiated light. The light reflectance here can be 100% or less or less than 100%.

[0035] The light reflecting surface 41 is a flat surface. The light reflecting surface 41 is inclined with respect to the lower surface of the light reflecting member 40. This inclination angle is in the range of 10 degrees to 80 degrees. The direction of a straight line passing through the light reflecting surface 41 and parallel to the lower surface of the light reflecting member 40 is referred to as the parallel direction of the light reflecting surface 41. The light reflecting surface 41 does not have to be flat, and may be, for example, a curved surface. In this case, the direction of a straight line passing through a plane connecting three points on the outer edge of the curved light reflecting surface 41 and parallel to the lower surface of the light reflecting member 40 is referred to as the parallel direction of the light reflecting surface 41.

[0036] In the illustrated example of light reflecting member 40, the inclination angle of light reflecting surface 41 is 45 degrees. Note that when a specific angle of inclination is mentioned, it is assumed that the angle of inclination of a manufactured product may vary from the specific angle by ±5 degrees, taking into account manufacturing precision.

[0037] The light reflecting member 40 can be formed of a main material such as glass or metal, which forms its exterior. The main material is preferably a heat-resistant material, such as glass such as quartz or BK7 (borosilicate glass), metal such as aluminum, or Si. The light reflecting surface can be formed of a metal such as Ag or Al, or a dielectric multilayer film such as Ta2O5 / SiO2, TiO2 / SiO2, or Nb2O5 / SiO2.

[0038] (protective element 50) The protective element 50 is a circuit element that prevents a specific element, such as a light-emitting element, from being destroyed by excessive current. A typical example of the protective element 50 is a constant voltage diode such as a Zener diode. For example, a Si diode can be used as the Zener diode.

[0039] (Temperature measuring element 60) The temperature measuring element 60 is an element used as a temperature sensor for measuring the ambient temperature. As the temperature measuring element 60, for example, a thermistor can be used.

[0040] (Wiring 70) The wiring 70 is made of a conductor having a linear shape with joints at both ends. In other words, the wiring 70 has joints at both ends of the linear portion that are joined to other components. The wiring 70 is used for electrical connection between two components. For example, a metal wire can be used as the wiring 70. Examples of metals include gold, aluminum, silver, copper, etc.

[0041] (wavelength conversion member 81) The wavelength conversion member 81 has an upper surface, a lower surface, and one or more side surfaces. The wavelength conversion member 81 also has a wavelength converting portion 811. The wavelength conversion member 81 also has an enclosure portion 812 that surrounds the wavelength converting portion 811. The wavelength conversion member 81 also has one or more conductive films 813 on the lower surface side. The wavelength conversion member 81 also has multiple metal films 814 on the lower surface side. The wavelength conversion member 81 also has a light-shielding film 815 on the upper surface side.

[0042] In the wavelength converting member 81, the wavelength converting portion 811 and the surrounding portion 812 are integrally formed. The inner surface of the surrounding portion 812 is in contact with the side surface of the wavelength converting portion 811, and one or more side surfaces of the wavelength converting portion 811 are surrounded by the surrounding portion 812. One or more outer surface of the surrounding portion 812 corresponds to one or more side surfaces of the wavelength converting member 81. The wavelength converting portion 811 and the surrounding portion 812 can be formed mainly using an inorganic material that is not easily decomposed by irradiation with light. However, the material does not have to be an inorganic material.

[0043] Furthermore, the wavelength conversion member 81 is formed of an integral sintered body in which the wavelength conversion portion 811 and the surrounding portion 812 are sintered together. Such an integral sintered body can be formed, for example, by integrally molding and sintering the wavelength conversion portion 811, which is made of a molded product such as a sintered body, and the powder material that forms the surrounding portion 812, to form a base material for the wavelength conversion member 81. For sintering, for example, atmospheric sintering, spark plasma sintering (SPS), hot press sintering (HP), or the like can be used.

[0044] The wavelength converting section 811 has a rectangular parallelepiped shape. The shape of the wavelength converting section 811 is not limited to a rectangular parallelepiped. The wavelength converting section 811 has a vertically elongated shape when viewed from above. The wavelength converting section 811 has a vertically elongated shape when viewed from below. Furthermore, the vertically elongated directions of the wavelength converting section 811 when viewed from above and below are the same.

[0045] Wavelength conversion section 811 converts incident light into light of a different wavelength. Wavelength conversion section 811 also emits the light converted into a different wavelength. Furthermore, part of the incident light is emitted from wavelength conversion section 811 without being converted by wavelength conversion section 811.

[0046] The wavelength converting portion 811 can be formed by using ceramic as the main material and containing a phosphor. However, the main material may be glass. Alternatively, the wavelength converting portion 811 may be formed of a polycrystal of a simple phosphor or a single crystal of a phosphor.

[0047] For example, when ceramics is used as the main material of wavelength converting section 811, it can be formed by sintering a phosphor and a light-transmitting material such as aluminum oxide. The phosphor content can be 0.05% to 50% by volume with respect to the total volume of the ceramic. Alternatively, for example, ceramics consisting essentially of phosphor, obtained by sintering phosphor powder, may be used.

[0048] Examples of phosphors include cerium-activated yttrium aluminum garnet (YAG), cerium-activated lutetium aluminum garnet (LAG), nitrogen-containing calcium aluminosilicate (CaO-Al2O3-SiO2) activated with europium and / or chromium, europium-activated silicate ((Sr,Ba)2SiO4), α-sialon phosphor, β-sialon phosphor, etc. Among these, it is preferable to use YAG phosphor, which has good heat resistance and can emit white light when combined with blue excitation light.

[0049] The surrounding portion 812 has a shape of a rectangular parallelepiped flat plate with a through-hole provided in the center. The wavelength converting portion 811 is provided so as to close the through-hole. The surrounding portion 812 can be formed using ceramics as the main material. However, without being limited to this, metal, a composite of ceramics and metal, etc. may also be used.

[0050] Furthermore, it is preferable that the surrounding portion 812 be made of a material with high thermal conductivity that can dissipate heat generated by the wavelength converting portion 811. The surrounding portion 812, which is mainly made of a material with high thermal conductivity, has a heat dissipation function that dissipates heat in the wavelength converting portion 811, and from this point of view, it can also be regarded as a heat dissipation member in place of the surrounding portion 812.

[0051] Furthermore, it is preferable that the surrounding portion 812 be made of a material that reflects, with high reflectance, the light emitted by the light emitting element 20 and the fluorescence emitted by the phosphor. It is also preferable that the surrounding portion 812 have high reflectance at least in the region that contacts one or more side surfaces of the wavelength conversion portion 811. The surrounding portion 812, which is mainly made of a highly reflective material, has high reflectivity for reflecting irradiated light, and from this perspective, the surrounding portion 812 can also be considered as a light-reflecting member. Note that an example of a material that has high reflectance and high thermal conductivity is alumina (Al2O3).

[0052] The surrounding portion 812 does not have a wavelength conversion function like the wavelength conversion portion 811. For example, the surrounding portion 812 does not contain a phosphor. The surrounding portion 812 also has a light-blocking property with a transmittance of 5% or less. From this perspective, the surrounding portion 812 can also be considered as a light-blocking member.

[0053] Furthermore, the conductive film 813 is provided in the surrounding portion 812. Furthermore, the conductive film 813 is provided outside the wavelength converting portion 811. In other words, the conductive film 813 is not provided in the wavelength converting portion 811. This allows light to be efficiently incident on the wavelength converting portion 811.

[0054] The conductive film 813 is provided at a position close to the wavelength converting portion 811. For example, the distance between the wavelength converting portion 811 and the conductive film 813 is 500 μm or less at the closest position, and preferably 300 μm or less. The conductive film 813 is provided so as to surround the wavelength converting portion 811. In the wavelength converting member 81 shown in the figure, the linear conductive film 813 surrounds the wavelength converting portion 811.

[0055] It is preferable that the conductive film 813 surrounds the wavelength converting portion 811 in a thin line shape. A thin line shape refers to a line shape whose line width is smaller than the width of the wavelength converting portion 811 and whose line length is longer than the outer periphery of the wavelength converting portion 811, for example, when viewed from below. Furthermore, for example, the line width may be equal to or less than half the width of the wavelength converting portion 811. Here, the width of the wavelength converting portion 811 is the width of the short side when the outer shape is rectangular, for example, or the width of the short diameter when the outer shape is elliptical, for example. Furthermore, for shapes other than these, the width is substantially specified based on these examples.

[0056] The conductive film 813 can be made of an oxide. Examples of oxides that form the conductive film 813 include indium tin oxide (ITO) and ruthenium oxide (RuO2). These oxides are more brittle and prone to cracking than metal materials such as gold, silver, and aluminum.

[0057] The plurality of metal films 814 are provided in the surrounding portion 812, and are provided outside the wavelength converting portion 811. In other words, the plurality of metal films 814 are not provided in the wavelength converting portion 811. This allows light to be efficiently incident on the wavelength converting portion 811. The plurality of metal films 814 also includes two metal films 814 each connected to a conductive film 813. One end of the linear conductive film 813 overlaps with one of the two metal films 814, and the other end of the conductive film 813 overlaps with the other metal film 814. The metal films 814 can be formed using, for example, Ti / Pt / Au.

[0058] The light-shielding film 815 is provided in the surrounding portion 812, and is provided outside the wavelength converting portion 811. In other words, the light-shielding film 815 is not provided in the wavelength converting portion 811. It is also desirable that the light-shielding film 815 reach the boundary between the wavelength converting portion 811 and the surrounding portion 812 on the upper surface side. This makes it possible to prevent light from being emitted from anywhere in the wavelength converting member 81 other than the wavelength converting portion 811. The light-shielding film 815 can be formed using, for example, a metal.

[0059] (Translucent member 82) The light-transmitting member 82 has a bottom surface, a top surface, and one or more side surfaces. The light-transmitting member 82 has translucency that allows light to pass through. Here, translucency means that the light transmittance is 80% or more. The light-transmitting member 82 has a base material formed in the shape of a rectangular parallelepiped flat plate. However, the shape is not limited to a rectangular parallelepiped.

[0060] The light-transmitting member 82 can be formed using sapphire as the main material. Sapphire is a material with relatively high transmittance and relatively high strength. Note that, in addition to sapphire, the main material can also be, for example, quartz, silicon carbide, or glass.

[0061] The light-transmitting member 82 also has a plurality of metal films 821. The plurality of metal films 821 are provided on the upper surface side of the light-transmitting member 82. The plurality of metal films 821 include two metal films 821 provided for wiring. The two metal films 821 are provided in the outer peripheral region of the light-transmitting member 82. The two metal films 821 are not provided in the central region of the light-transmitting member 82.

[0062] The two metal films 821 have a junction region in part. The metal film 821 can be formed by providing, for example, Ti / Pt / Au. The junction region can also be formed by further providing, for example, AuSn thereon.

[0063] (Light blocking member 90) The light-shielding member 90 is made of a resin having light-shielding properties. Here, light-shielding properties refer to the property of not transmitting light, and light-shielding properties may be realized by utilizing properties such as absorbing or reflecting light in addition to the property of blocking light. For example, the light-shielding member 90 can be formed by adding a filler such as a light diffusing material and / or a light absorbing material to the resin.

[0064] Examples of the resin that forms the light-shielding member 90 include epoxy resin, silicone resin, acrylate resin, urethane resin, phenol resin, and BT resin. Examples of the light-absorbing filler include dark-colored pigments such as carbon black.

[0065] (Light-emitting device 1) Next, a light emitting device 1 manufactured using these components will be described. First, one or more light reflecting members 40 are arranged on the mounting surface of the base 10. The bottom surfaces of the one or more light reflecting members 40 are joined to the mounting surface of the base 10. The inclination angle of the light reflecting surface 41 with respect to the mounting surface of the base 10 is the same as the inclination angle of the light reflecting surface 41 with respect to the bottom surface of the light reflecting member 40.

[0066] By arranging one or more light reflecting members 40, one or more light reflecting surfaces 41 are provided on one virtual plane. In the example of the light emitting device 1 shown in the figure, one light reflecting member 40 is arranged, and one light reflecting surface 41 is provided on one virtual plane. Note that multiple light reflecting members 40 each having a size obtained by dividing the illustrated light reflecting member 40 into two or more parts may be arranged. In this case, multiple light reflecting surfaces 41 are provided on one virtual plane.

[0067] Next, the protection element 50 and the temperature measurement element 60 are placed on the mounting surface of the base 10. On the mounting surface, the protection element 50 is positioned in a direction opposite to the direction in which the one or more light reflecting surfaces 41 face relative to the one or more light reflecting members 40. On the mounting surface, the temperature measurement element 60 is positioned in a direction opposite to the direction in which the one or more light reflecting surfaces 41 face relative to the one or more light reflecting members 40. By effectively utilizing the space behind the light reflecting surface 41, the light emitting device 1 can be made smaller.

[0068] Next, one or more submounts 30 are placed on the mounting surface of the base 10. In one or more submounts 30, multiple side surfaces face one or more light-reflecting surfaces 41. These multiple side surfaces have different orientations relative to the parallel direction of the light-reflecting surfaces 41 in a top view. These multiple side surfaces include one or more side surfaces whose intersection line with the top surface of the submount 30 is parallel to the parallel direction of the one or more light-reflecting surfaces 41 in a top view. These multiple side surfaces also include one or more side surfaces whose intersection line with the top surface of the submount 30 is not parallel to the parallel direction of the one or more light-reflecting surfaces 41 in a top view. Note that the term "parallel" here includes a difference of ±5 degrees.

[0069] In the illustrated example of the light-emitting device 1, three submounts 30 are arranged on the mounting surface. Each of the three submounts 30 has a side surface facing the light-reflecting surface 41. When viewed from above, the three submounts 30 are composed of one submount 30 arranged in the center and two submounts 30 arranged on either side of it. For the two submounts 30 arranged on both sides, the side surfaces facing the light-reflecting surface 41 also face the submount 30 arranged in the center.

[0070] In top view, the side surface of the centrally arranged submount 30 facing the light reflecting surface 41 is surrounded by two imaginary straight lines parallel to the direction parallel to the light reflecting surface 41. One of the two straight lines is a straight line connecting one end of each of the two side surfaces of the two submounts 30 arranged on both sides that face the light reflecting surface 41, which is closer to the centrally arranged submount 30. The other is a straight line connecting one end of each of the two side surfaces of the two submounts 30 arranged on both sides that face the light reflecting surface 41, which is farther from the centrally arranged submount 30.

[0071] The centrally located submount 30 has an intersection line between the side surface facing the light reflecting surface 41 and the top surface that is parallel to the parallel direction of the light reflecting surface 41. Note that "parallel" here includes a difference of ±5 degrees due to manufacturing precision. Furthermore, the two submounts 30 located at both ends have an intersection line between the side surface facing the light reflecting surface 41 and the top surface that is not parallel to the parallel direction of the light reflecting surface 41.

[0072] The side surfaces of the two submounts 30 arranged on both sides, facing the light reflecting surface 41, form the same angle with the parallel direction of the light reflecting surface 41 when viewed from above. Note that "same" here includes a difference of ±5 degrees due to manufacturing precision.

[0073] Next, a plurality of light emitting elements 20 are placed on the mounting surface. The plurality of light emitting elements 20 are placed on the mounting surface via one or more submounts 30. The plurality of light emitting elements 20 are bonded to the one or more submounts 30.

[0074] Each of the plurality of light-emitting elements 20 has a light emission surface facing the light reflecting surface 41. In each of the plurality of light-emitting elements 20, at least one side surface serves as the light emission surface. In addition, the at least one side surface serving as the light emission surface includes a light emission surface facing the light reflecting surface 41.

[0075] In each of the plurality of light-emitting elements 20, light emitted from the light-emitting surface is irradiated onto one or more light-reflecting surfaces 41. In addition, in each of the plurality of light-emitting elements 20, light emitted from the side surface facing the light-reflecting surface 41 is irradiated onto one or more light-reflecting surfaces 41.

[0076] The side surface of each of the plurality of light-emitting elements 20 facing the light reflecting surface 41 has a different orientation relative to the parallel direction of the light reflecting surface 41 in a top view. The plurality of light-emitting elements 20 includes one or more light-emitting elements 20 whose side surface facing the light reflecting surface 41 in a top view is parallel to the parallel direction of the one or more light reflecting surfaces 41. It can be said that the light-emitting surface of this light-emitting element 20 directly faces the one or more light reflecting surfaces 41.

[0077] The plurality of light-emitting elements 20 include one or more light-emitting elements 20 whose side surface facing the light-reflecting surface 41 in top view is not parallel to the parallel direction of the one or more light-reflecting surfaces 41. It can be said that the light-emitting surface of this light-emitting element 20 is disposed at an angle to the one or more light-reflecting surfaces 41.

[0078] When viewed among the plurality of light-emitting elements 20, the side surfaces of two light-emitting elements 20 arbitrarily selected from the plurality of light-emitting elements 20 that face the light-reflecting surface 41 are arranged so that one is oblique to the other in a top view. By making the sides oblique, the light irradiated from each light-emitting element 20 to one or more light-reflecting surfaces 41 can be brought closer to each other.

[0079] In the illustrated example of the light emitting device 1, three light emitting elements 20 are arranged on the mounting surface via three submounts 30. Furthermore, the number of light emitting elements 20 bonded to one submount 30 is one.

[0080] In addition, one light-emitting element 20 is arranged such that, when viewed from above, its light-emitting surface faces one or more light-reflecting surfaces 41. Furthermore, this light-emitting element 20 is positioned in the center, and one light-emitting element 20 is arranged on each side of it such that its light-emitting surface is oblique to the one or more light-reflecting surfaces 41.

[0081] In addition, when viewed from above, the light emitting elements 20 on both sides are arranged symmetrically with respect to a line that passes through the side surface of the central light emitting element 20 facing one or more light reflecting surfaces 41 and is perpendicular to the parallel direction of the one or more light reflecting surfaces 41.

[0082] Furthermore, when viewed from above, when the one or more light reflecting surfaces 41 are divided in half by a straight line that passes through the side of the central light emitting element 20 facing the one or more light reflecting surfaces 41 and is perpendicular to the parallel direction of the one or more light reflecting surfaces 41, each of the light emitting elements 20 on both sides irradiates the main portion of light onto the area that is closer to the divided area.

[0083] In the illustrated example of the light emitting device 1, each of the plurality of light emitting elements 20 is a semiconductor laser element. Light passing through an optical axis emitted from each of the plurality of semiconductor laser elements travels in different directions from each light emitting surface and is irradiated onto one or more light reflecting surfaces 41.

[0084] The plurality of semiconductor laser elements includes a semiconductor laser element in which the direction in which light passing through the optical axis travels from the light emitting surface is perpendicular to the parallel direction of one or more light reflecting surfaces 41. The plurality of semiconductor laser elements also includes two semiconductor laser elements that are arranged line-symmetrically with respect to the direction in which light passing through the optical axis travels from the light emitting surface.

[0085] The semiconductor laser element whose optical axis is perpendicular to the parallel direction of one or more light reflecting surfaces 41 is the central light emitting element 20. The two semiconductor laser elements arranged symmetrically with respect to the axis are the light emitting elements 20 on both sides.

[0086] Furthermore, the semiconductor laser elements on both sides are designated as a first semiconductor laser element and a second semiconductor laser element, respectively, and one or more light reflecting surfaces 41 are divided into two by a plane that is perpendicular to the mounting surface and passes through a straight line extending in a direction in which light having an optical axis emitted from the central semiconductor laser element travels from the light emitting surface. In this case, if the region on the side where the first semiconductor laser element is disposed is designated as a first reflecting region and the region on the side where the second semiconductor laser element is disposed is designated as a second reflecting region, the light having an optical axis emitted from the first semiconductor laser element is irradiated onto the first reflecting region, and the light having an optical axis emitted from the second semiconductor laser element is irradiated onto the second reflecting region.

[0087] Next, a plurality of wirings 70 (first wirings 71) are joined to electrically connect the light emitting element 20, the protection element 50, and the temperature measuring element 60. For the electrical connection, a metal film provided on the bottom surface 111 of the base 10 is used. This allows these elements to be electrically connected to an external power source via the metal film on the top surface 11 of the base 10.

[0088] Next, the wavelength conversion member 81 is arranged. The wavelength conversion member 81 is supported by the base 10. The wavelength conversion member 81 is arranged above the mounting surface. The wavelength conversion member 81 is also arranged above the plurality of light-emitting elements 20 and one or more light reflecting members 40.

[0089] Light emitted from the plurality of light-emitting elements 20 and reflected by one or more light reflecting members 40 enters the wavelength conversion member 81. A major portion of the light emitted by the plurality of light-emitting elements 20 enters the wavelength conversion member 81.

[0090] In the illustrated example of the light emitting device 1, all of the light emitted from the three semiconductor laser elements is reflected by one or more light reflecting surfaces 41 and enters the wavelength conversion member 81. The lower surface of the wavelength conversion member 81 serves as an entrance surface for the light emitted from the plurality of light emitting elements 20, and the upper surface of the wavelength conversion member 81 serves as an exit surface for the wavelength-converted light or the light emitted from the plurality of light emitting elements 20.

[0091] Furthermore, the wavelength conversion member 81 is fixed to the base 10 via the light-transmitting member 82. In the illustrated example of the light-emitting device 1, the wavelength conversion member 81 and the light-transmitting member 82 are joined together, and the light-transmitting member 82 is then joined to the base 10, thereby fixing the wavelength conversion member 81 to the base 10. Note that the wavelength conversion member 81 may also be fixed directly to the base 10.

[0092] The light-transmitting member 82 is disposed on the upper surface 11 of the base 10. The lower surface of the light-transmitting member 82 is joined to the base 10. The light-transmitting member 82 is also joined to the upper surface 11 of the step portion 16 formed below the top surface 112 of the base 10.

[0093] The plurality of light-emitting elements 20 are arranged in a closed space of the light-emitting device 1. This closed space is created by joining the base 10 and the light-transmitting member 82. The light-transmitting member 82 can serve as a lid member. In the illustrated example of the light-emitting device 1, this closed space is formed in an airtight sealed state. By being airtight sealed, it is possible to prevent organic matter and the like from collecting on the light-emitting surface of the semiconductor laser element.

[0094] The wavelength conversion member 81 has a light extraction region for extracting light. The light extraction region includes an exit surface for light emitted from the light emitting device 1 to the outside and an incident surface for light incident thereon to emit light to the outside. Note that in the light emitting device 1, the light extraction region may be provided by a component other than the wavelength conversion member 81. The other component here includes a component not shown in the illustrated light emitting device 1.

[0095] In the light emitting device 1, the light extraction region is smaller than the mounting surface of the base 10 in a top view. In addition, the length of the light extraction region in the same direction as the distance between the two light emitting elements 20 that are located furthest apart in a top view among the plurality of light emitting elements 20 is smaller than this distance.

[0096] In the illustrated example of the light emitting device 1, the wavelength converting portion 811 has a light extraction region. The lower surface of the wavelength converting portion 811 is the light incident surface of the light extraction region, and the upper surface of the wavelength converting portion 811 is the light exit surface of the light extraction region. The light extraction region is surrounded by the surrounding portion 812.

[0097] 12 and 13 respectively show the light intensity distribution on the light reflecting surface 41 of the light emitted from the three semiconductor laser elements and the light intensity distribution on the light incident surface of the wavelength converting unit 811 in the illustrated example of the light emitting device 1. Note that the images in the figures have both strong and weak light intensity parts blackened due to monochrome processing, but the black part in the center of the elliptical FFP light is the part with strong light intensity, and the black part on the periphery of the FFP light is the part with weak light intensity.

[0098] As can be seen from these figures, in the light emitting device 1, light from the multiple light emitting elements 20 reflected by one or more light reflecting surfaces 41 approaches each other and enters the light extraction region of the light emitting device 1. For any two light emitting elements 20 selected from the multiple light emitting elements 20, the light emitted from each light emitting element 20 includes light that is irradiated at a specific point on the light reflecting surface 41. Furthermore, the light irradiated at this specific point is incident at a specific point on the incident surface of the light extraction region. In this case, the distance between the two points on the light reflecting surface 41 is shorter than the distance between the two points. Furthermore, this relationship in magnitude between the distances between the two points on the light reflecting surface 41 and the light extraction region holds true for all irradiation points where the main portion of the light is irradiated.

[0099] Furthermore, on one or more light reflecting surfaces 41, the light from the multiple light emitting elements 20 is not aligned parallel to one another in a plan view parallel to the one or more light reflecting surfaces 41, but is oblique to one another. On the other hand, on the light incident surface of the wavelength converting section 811, the three light beams overlap. That is, on the incident surface of the light extraction region, the light from the multiple light emitting elements 20 is aligned parallel to one another in a plan view parallel to this incident surface. For example, if the multiple light emitting elements 20 are semiconductor laser elements, this relationship holds true for the major axis direction or the minor axis direction of the elliptical FFP. Note that the term "parallel" here includes a difference of ±5 degrees.

[0100] Furthermore, light from multiple light-emitting elements 20 that have the same light emission shape (e.g., FFP in the case of semiconductor laser elements) of light emitted from the light emission surface can be overlapped to a high degree on the light incident surface in the light extraction region. By aligning the light emission shapes of the light emitted from the multiple light-emitting elements 20, for example, it is possible to overlap 50% or more of the main parts of the light, and even 80% or more of the main parts of the light.

[0101] In the light emitting device 1, when viewed from above, at least a part of the region where the wavelength converting section 811 is provided overlaps with a part of the region where one or more light reflecting surfaces 41 are provided. Also, when viewed from above, at least a part of the light extraction region overlaps with a part of the region where one or more light reflecting surfaces 41 are provided. Also, when viewed from above, at least a part of the region where the light incident surface in the light extraction region is provided overlaps with a part of the region where one or more light reflecting surfaces 41 are provided.

[0102] Furthermore, in a top view, the length of the wavelength converting portion 811 is shorter than the length of both ends of the one or more light reflecting members 40 in the direction parallel to the one or more light reflecting surfaces 41. The length of the wavelength converting portion 811 in the direction parallel to the one or more light reflecting surfaces 41 is shorter than the length of both ends of the one or more light reflecting members 40 divided by the number of light emitting elements 20 that irradiate the one or more light reflecting surfaces 41. In the example of the light emitting device 1 shown in the figures, three semiconductor laser elements are used for illumination, so the length of the wavelength converting portion 811 in the direction parallel to the light reflecting surfaces 41 is shorter than one-third of the length of both ends of the light reflecting member 40.

[0103] Furthermore, when viewed from above, the length of the light incident surface of the wavelength converting unit 811 in a direction perpendicular to the light reflecting surface 41 is greater than the length of the light incident surface in a direction parallel to the one or more light reflecting surfaces 41. In the example of the light emitting device 1 shown in the figure, when viewed from above, the length of the light reflecting member 40 in a direction parallel to the light reflecting surface 41 is greater than the length of the light incident surface in a direction perpendicular to the light reflecting surface 41, while the length of the light incident surface of the wavelength converting unit 811 in a direction parallel to the light reflecting surface 41 is smaller than the length of the light incident surface in a direction perpendicular to the light reflecting surface 41. In this way, light from multiple light emitting elements 20 can be concentrated into a small irradiation area on the light incident surface.

[0104] A part or all of the light incident on the wavelength converting section 811 is converted into light of a different wavelength by the wavelength converting section 811. The light from the plurality of light emitting elements 20 or the wavelength-converted light is emitted from the upper surface of the wavelength converting section 811 to the outside of the light emitting device 1.

[0105] Here, the bonding between the wavelength conversion member 81 and the light-transmitting member 82 will be described. The wavelength conversion member 81 is bonded to the upper surface of the light-transmitting member 82. Furthermore, the surrounding portion 812 of the wavelength conversion member 81 is bonded to the light-transmitting member 82. Furthermore, the wavelength conversion member 81 and the light-transmitting member 82 are bonded such that the metal film 814 of the wavelength conversion member 81 and the metal film 821 of the light-transmitting member 82 are electrically connected. Specifically, the metal film 814 of the wavelength conversion member 81 and the metal film 821 of the light-transmitting member 82 are bonded to each other.

[0106] The conductive film 813 is a thin linear film that surrounds the wavelength conversion unit 811 in the vicinity thereof. Therefore, if an abnormality such as a crack occurs in the wavelength conversion unit 811, the conductive film 813 will also crack in response to the impact, causing a change in the electrical connection state. An abnormality in the wavelength conversion unit 811 can be detected by detecting a significant increase in resistance value. For this reason, the conductive film 813 can be considered an abnormality detection element, which is a sensor that detects an abnormality in the wavelength conversion unit 811. By using the conductive film 813 formed from an oxide that is more brittle and prone to cracking than metal materials, the accuracy of detecting damage to the wavelength conversion unit can be improved.

[0107] The conductive film 813 is provided on the incident surface side of the wavelength conversion member 81, on which light from the light emitting element 20 is incident. The conductive film 813 is also provided on the side of the wavelength conversion member 81 facing the light-transmitting member 82. Therefore, the light-transmitting member 82 is arranged near the conductive film 813 without contacting it, or in contact with it.

[0108] The conductive film 813 is not provided directly below the light extraction region. In addition, the metal film 821 of the light-transmitting member 82 is not provided directly below the light extraction region. In this way, light can be incident on the wavelength conversion unit 811 without being blocked by the conductive film 813.

[0109] The upper surface of the light-transmitting member 82 is larger than the lower surface of the wavelength conversion member 81. In addition, when viewed from above, the upper surface of the light-transmitting member 82 surrounds the lower surface of the wavelength conversion member 81. Alternatively, it surrounds the wavelength conversion member 81. When viewed from above, the two metal films 821 on the upper surface of the light-transmitting member 82 are each provided from a region that overlaps with the lower surface of the wavelength conversion member 81 to a region that does not overlap with it.

[0110] Returning to the description of the manufacturing process of the light emitting device 1, once the wavelength conversion member 81 is placed, next, the wiring 70 (second wiring 72) for electrically connecting the anomaly detection element is joined. For the electrical connection, a metal film provided on the step portion 16 of the base 10 is used. This allows the anomaly detection element to be electrically connected to an external power supply via the metal film on the upper surface 11 of the base 10.

[0111] Next, the light-shielding member 90 is formed inside the frame formed by the upper surface 11 of the base 10. The light-shielding member 90 is formed so as to fill the gap between the base 10 and the wavelength conversion member 81. The light-shielding member 90 can be formed, for example, by pouring a thermosetting resin and hardening it with heat. By providing the light-shielding member 90, leakage of light from other than the light extraction surface is suppressed.

[0112] The light-shielding member 90 does not reach the upper surface of the wavelength converting member 81. Alternatively, even if it reaches the upper surface of the enclosure portion 812, it does not reach the upper surface of the wavelength converting portion 811. This allows the light-shielding member 90 to be provided so as to fill the gap while avoiding the wavelength converting portion 811, which is the light extraction surface.

[0113] As explained above, the present invention, which has the technical features disclosed in the specification, is not limited to the structure described in the embodiments of the specification. For example, the present invention can be applied to a light-emitting device having components not disclosed in the embodiments, and differences from the disclosed structure do not constitute grounds for the inapplicability of the present invention. Furthermore, from the perspective of the minimum components required to complete the invention, the components possessed by the light-emitting device disclosed in the embodiments may include non-essential components.

[0114] This means that the light emitting device disclosed in the embodiments of this specification includes not only the perspective of completing the invention, but also the perspective of disclosing a rational configuration that assumes one use form. While the application of the invention is not limited to the exemplary use form, there are aspects that will work effectively when applied to that use form.

[0115] For this reason, it may not be necessary for the present invention (claims) to include all of the components disclosed in one embodiment. For example, if the claims do not state some of the components of a light-emitting device disclosed in an embodiment, the claims claim that the components are not limited to those disclosed in this embodiment, and that the freedom of design by a person skilled in the art, such as substitution, omission, modification of shape, or change of material, is recognized, and the invention described in the claims is applied. [Industrial Applicability]

[0116] The light-emitting device described in the embodiment can be used in an in-vehicle headlight. In other words, an in-vehicle headlight can be considered one application form to which the present disclosure is applied. However, the present disclosure is not limited to this and can be used as a light source for lighting, a projector, a head-mounted display, a backlight for other displays, etc. [Explanation of symbols]

[0117] 1. Light-emitting device 10 base 11 Top side 111 bottom 112 Top surface 13 Bottom side 14 Inner surface 15 External surface 16 Step 17 Metal Film 20 Light-emitting element 30 Submount 40 Light reflecting member 41 Light reflective surface 50 Protection element 60 Temperature measuring element 70 Wiring 71 1st wiring 72 2nd wiring 81 Wavelength conversion material 811 Wavelength conversion unit 812 Siege 813 Conductive film 814 Metal Film 815 Light-shielding film 82 Translucent material 821 Metal Film 90 Light blocking material

Claims

1. A light emitting device, comprising: a base having a mounting surface; one or more light reflecting members disposed on the mounting surface, the light reflecting members providing one or more light reflecting surfaces on a single virtual plane; a first light-emitting element having an upper surface, a lower surface, and a side surface serving as a first light-emitting surface facing the one or more light-reflecting surfaces, the first light-emitting element being disposed on the mounting surface such that the first light-emitting surface is oblique to the one or more light-reflecting surfaces in a top view, and light passing through an optical axis emitted from the first light-emitting surface travels in a first direction from the first light-emitting surface and is irradiated onto the one or more light-reflecting surfaces; a second light-emitting element having an upper surface, a lower surface, and a side surface serving as a second light-emitting surface facing the one or more light-reflecting surfaces, the second light-emitting surface being disposed on the mounting surface so that the second light-emitting surface is oblique to the first light-emitting surface in a top view, and light passing through an optical axis emitted from the second light-emitting surface travels from the second light-emitting surface in a second direction different from the first direction and is irradiated onto the one or more light-reflecting surfaces; a third light-emitting element having an upper surface, a lower surface, and a side surface that is a third light-emitting surface that emits light, wherein light passing through an optical axis that is emitted from the third light-emitting surface travels from the third light-emitting surface in a third direction that is different from the first direction and the second direction, and is irradiated toward the one imaginary plane; and A light emitting device, characterized in that the light from the first light emitting element and the light from the second light emitting element reflected by the one or more light reflecting surfaces approach each other and enter a light extraction region of the light emitting device.

2. The light emitting device according to claim 1 , wherein each of the first light emitting element, the second light emitting element, and the third light emitting element is a semiconductor laser element.

3. 3. The light emitting device according to claim 2, further comprising a wavelength conversion member into which light emitted from the first light emitting element and reflected by the one or more light reflecting members, light emitted from the second light emitting element and reflected by the one or more light reflecting members, and light emitted from the third light emitting element and reflected by the one or more light reflecting members are incident.

4. the wavelength conversion member has a light extraction region, The light emitting device according to claim 3 , wherein at least a part of a light extraction region of the wavelength conversion member overlaps with a part of a region where the one or more light reflecting surfaces are provided in a plan view of the mounting surface from above.

5. The light emitting device according to claim 1 , wherein a parallel direction of the one or more light reflecting surfaces is perpendicular to the third direction.

6. The light emitting device according to claim 2 , wherein the first light emitting element and the second light emitting element are arranged line-symmetrically with respect to the third direction in a plan view of the mounting surface from above.

7. When the one or more light reflecting surfaces are divided into two by a plane that is perpendicular to the mounting surface and passes through a straight line that passes through the optical axis of the light emitted from the third light emitting element and extends in the third direction, the area on the side where the first light emitting element is arranged is defined as a first reflecting area, and the area on the side where the second light emitting element is arranged is defined as a second reflecting area, The light emitted from the first light-emitting element and passing through an optical axis is irradiated onto the first reflection area, The light emitting device according to claim 2 , wherein the light emitted from the second light emitting element and passing through an optical axis is irradiated onto the second reflective area.

8. 8. The light-emitting device according to claim 2, wherein, in a planar view of the mounting surface from above, the intersection of a line passing through the optical axis of the light emitted from the first light-emitting element and extending in the first direction with a line passing through the optical axis of the light emitted from the second light-emitting element and extending in the second direction is on a line passing through the optical axis of the light emitted from the third light-emitting element and extending in the third direction, and is outside the one or more reflective surfaces.

9. the one or more light reflecting members are constituted by one light reflecting member, The light emitting device according to claim 1 , wherein the one or more reflecting surfaces are configured by one reflecting surface provided on the one light reflecting member.

10. 10. The light emitting device according to claim 1, wherein the third light emitting element is arranged between the first light emitting element and the second light emitting element so that the light emitted from the third light emitting element is closer to the light emitted from the first light emitting element and the light emitted from the second light emitting element and enters the light extraction area.

11. a first submount supporting the first light emitting element; a second submount supporting the second light emitting element; a third submount supporting the third light emitting element; 11. The light emitting device according to claim 1, comprising:

12. The light emitting device of claim 11 , wherein the first submount, the second submount, and the third submount each have a side surface facing the one or more light reflecting surfaces.

Images