Substrate Processing Equipment

Abstract

To suppress a reattachment of a processing liquid in a substrate surface, and improve a substrate quality.SOLUTION: A substrate processing apparatus according to an embodiment, comprises: a rotational table rotating a substrate; and a plurality of fixing members fixing the substrate to the rotational table by gripping the substrate so as to be contacted to an outer periphery of the substrate. The fixing member includes a curve surface on the side contacted to the substrate in the case where it is viewed from a rotational shaft direction of the rotational table, and is formed so as to be connected to an end part of the curve surface in the case where it is viewed from the rotational shaft direction of the rotational table, and includes a reduction part of which a width in a direction orthogonal to a first direction separated from a side contacted with the substrate is continuously reduced toward a first direction from a boundary with the curve surface, a first inclination surface that is orthogonal to the rotational shaft direction of the rotational table, and is dropped and inclined to a top part toward the first direction in the case where it is viewed from a direction orthogonal to the first direction, and includes a support part that is formed on the curve surface, and supports the substrate so that a top surface of the top part and an upper surface of the substrate are existed on the same flat surface in a state where the substrate is gripped.SELECTED DRAWING: Figure 2A

Description

[Technical Field]

[0001] FIELD An embodiment of the present invention relates to a substrate processing apparatus. [Background technology]

[0002] Substrate processing equipment that performs chemical processing or cleaning processing on substrates such as semiconductor wafers widely uses a single-wafer processing method, in which substrates are processed one at a time, from the perspective of uniformity and reproducibility of processing. In a single-wafer processing equipment, the substrate is fixed to a rotary table, rotated around an axis perpendicular to the center of the substrate, and a processing liquid (e.g., chemical liquid or pure water) is flowed through the center of the substrate, and centrifugal force causes the processing liquid to spread toward the edge of the substrate, supplying the processing liquid to the substrate surface and processing the substrate surface.

[0003] Such substrate processing apparatuses are equipped with a chuck mechanism that grips and chucks the substrate to fix it to the rotary table. The chuck mechanism is provided with a plurality of chuck pins (fixing members) for gripping the edge of the substrate, which are arranged along the circumferential direction of the substrate. The chuck pins grip the edge of the substrate at a plurality of positions along the circumferential direction of the substrate, thereby fixing the substrate to the rotary table. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 6734666 Summary of the Invention [Problem to be solved by the invention]

[0005] In the substrate processing apparatus described above, the processing liquid spread by centrifugal force separates from the edge of the substrate and is received by the inner circumferential surface of the cup surrounding the rotary table. However, after the processing liquid strikes the chuck pins that grip the edge of the substrate, it may become mist and float up due to the disturbance of the airflow caused by the chuck pins rotating with the rotary table, and may re-adhere to the substrate surface. Such re-adhered mist can cause watermarks (water stains) on the substrate surface, resulting in defective products. Therefore, preventing the mist of processing liquid from re-adhering to the substrate surface is extremely important for improving product quality.

[0006] As described above, the re-adhesion of the mist-formed processing liquid to the substrate surface occurs due to the disturbance of the airflow caused by the chuck pin, but the original cause of the disturbance of the airflow is thought to be the flow of processing liquid flowing over the upper surface of the substrate. Specifically, the flow of processing liquid flowing from the upper surface of the substrate toward the chuck pin rotating together with the turntable generates a gas flow (airflow), and when this airflow separates from the chuck pin, a wake (a swirling airflow) is formed near the rear end of the chuck pin, which causes the disturbance of the airflow.

[0007] FIG. 9 is a diagram illustrating the disturbance of an airflow caused by a chuck pin. Here, FIG. 9 is a schematic plan view of a chuck pin gripping a substrate and rotating together with the turntable. When the turntable is rotated and a processing liquid is supplied to the substrate surface to process the substrate surface, a flow of processing liquid is formed on the upper surface of the substrate W from the substrate W side toward the chuck pin, as shown in FIG. 9 . Here, the processing liquid flowing on the upper surface of the substrate W toward the chuck pin entrains surrounding gas. In other words, while the turntable is rotating, an airflow is formed from the substrate W side toward the chuck pin, as shown in FIG. 9 . Note that hereinafter, the source of the flow of the processing liquid and gas described above will be referred to as upstream, and the destination thereof will be referred to as downstream.

[0008] When the gas (airflow) flowing together with the processing liquid hits the chuck pin, the processing liquid and airflow received by the chuck pin flow along the side surface of the chuck pin and are separated from the chuck pin at the separation position, as shown by the solid arrow in Fig. 9. Here, if the width d of the surface between the separation positions has a predetermined width, a region R2 where no airflow flows is formed downstream of the rear end of the chuck pin. This region R2 is in a negative pressure state (a state where pressure is reduced) compared to the region where the airflow flows, and airflow flows in from the surroundings, forming a vortex flow (wake flow), which causes disturbances in the airflow.

[0009] In this way, while the turntable is rotating, the flow of the processing liquid generates an air current, and when this air current hits the chuck pin, it causes a disturbance in the air current. This disturbance in the air current causes the processing liquid adhering to the chuck pin to peel off and become a mist, which then scatters onto the upper surface of the substrate and re-adheres to the substrate surface.

[0010] This phenomenon is particularly evident in the drying process, in which the processing liquid (including cleaning liquid) supplied to the upper surface of the substrate is shaken off and the upper surface of the substrate is dried. In the drying process, the substrate is rotated at a high speed of 1500 rpm (revolutions per minute) to 2000 rpm to shake off the processing liquid from the upper surface of the substrate. At this time, if mist of processing liquid that is blown up by the rear end of the chuck pin adheres to the upper surface of the substrate after the drying process has been completed, watermarks will be formed on the upper surface of the substrate.

[0011] To address this problem, the chuck pins themselves have been reduced in size to reduce the amount of processing liquid that hits the chuck pins and minimize airflow disturbances. However, when the chuck pins themselves are reduced in size, the mechanism for fixing the substrate is weakened, and this has certain limitations.

[0012] The present invention has been made to solve the above-mentioned problems, and its purpose is to provide a substrate processing apparatus that can prevent re-adhesion of processing liquid on the substrate surface and improve substrate quality. [Means for solving the problem]

[0013] In order to solve the above-mentioned problems and achieve the object, a substrate processing apparatus according to one aspect of the present invention includes a turntable that rotates a substrate, and a plurality of fixing members that fix the substrate to the turntable by contacting the outer periphery of the substrate and gripping the substrate, wherein the fixing members have a curved surface on the side that contacts the substrate when viewed from the direction of the rotation axis of the turntable, and when viewed from the direction of the rotation axis of the turntable, the fixing members have a tapered portion that is formed to connect to an end of the curved surface and has a width in a direction perpendicular to a first direction away from the side that contacts the substrate and that continuously reduces from a boundary with the curved surface toward the first direction, and when viewed from the direction perpendicular to the rotation axis of the turntable and perpendicular to the first direction, the fixing members have a first inclined surface at a top that slopes downward toward the first direction, and the first inclined surface is formed on the curved surface and supports the substrate such that a top surface of the top surface and an upper surface of the substrate are on the same plane when the substrate is gripped. When viewed from a direction perpendicular to the rotation axis direction of the rotary table and perpendicular to the first direction, the top has a horizontal surface on the side supporting the substrate, and the first inclined surface is inclined downward from an end of the horizontal surface toward the first direction. do. Further, a substrate processing apparatus according to one aspect of the present invention includes a turntable that rotates a substrate, and a plurality of fixing members that fix the substrate to the turntable by contacting an outer periphery of the substrate and gripping the substrate, wherein the fixing members have a top, a base that holds the top, and a support that supports the substrate, the top has a curved surface on the side that contacts the substrate when viewed from the direction of the rotation axis of the turntable, the top is formed to be connected to an end of the curved surface when viewed from the direction of the rotation axis of the turntable, and the width in a direction perpendicular to a first direction away from the side that contacts the substrate is 100 mm or more from the front boundary with the curved surface. The support portion has a reducing portion that continuously reduces in the first direction, and has a first inclined surface that is perpendicular to the rotation axis direction of the rotary table and that slopes downward toward the first direction when viewed from a direction perpendicular to the first direction, and the support portion supports the substrate so that the top surface of the top portion and the upper surface of the substrate are on the same plane when the substrate is held, and when viewed from a direction perpendicular to the rotation axis direction of the rotary table and a direction perpendicular to the first direction, the top portion has a horizontal surface on the side that supports the substrate, and the first inclined surface slopes downward from the end of the horizontal surface toward the first direction. Further, a substrate processing apparatus according to an aspect of the present invention includes a turntable that rotates a substrate, and a plurality of fixing members that fix the substrate to the turntable by contacting an outer periphery of the substrate and gripping the substrate, wherein the fixing members have a top, a base that holds the top, and a support that supports the substrate, and the top has a curved surface on the side that contacts the substrate when viewed from the direction of the rotation axis of the turntable, and is formed so as to be connected to an end of the curved surface when viewed from the direction of the rotation axis of the turntable, and is perpendicular to a first direction away from the side that contacts the substrate. The rotating table has a first inclined surface that is perpendicular to the rotation axis direction of the rotary table and that slopes downward toward the first direction when viewed from a direction perpendicular to the first direction, the support portion supports the substrate so that the top surface of the top portion and the upper surface of the substrate are on the same plane when the substrate is held, and the fixing member is arranged so that the orientation of the narrowing portion that continuously narrows in width toward the first direction is parallel to the splash direction of the processing liquid supplied to the substrate. Further, a substrate processing apparatus according to one aspect of the present invention includes a turntable that rotates a substrate, and a plurality of fixing members that fix the substrate to the turntable by contacting an outer periphery of the substrate and gripping the substrate, wherein the fixing members have a top, a base that holds the top, and a support that supports the substrate, the top has a curved surface on the side that contacts the substrate when viewed from the direction of the rotation axis of the turntable, the top is formed to be connected to an end of the curved surface when viewed from the direction of the rotation axis of the turntable, and the width in a direction perpendicular to a first direction away from the side that contacts the substrate is greater than or equal to the width of the curved surface. The support portion has a reducing portion that continuously reduces from the boundary toward the first direction, and has a first inclined surface that is perpendicular to the rotation axis direction of the rotary table and that slopes downward toward the first direction when viewed from a direction perpendicular to the first direction, the support portion supports the substrate so that the top surface of the top portion and the upper surface of the substrate are on the same plane when the substrate is gripped, and the fixing member further has a second inclined surface that is perpendicular to the rotation axis direction of the rotary table and that slopes downward from the end of the first inclined surface toward the first direction when viewed from a direction perpendicular to the first direction. [Effects of the Invention]

[0014] According to one aspect of the present invention, it is possible to prevent re-adhesion of a processing liquid on a substrate surface, thereby improving substrate quality. [Brief explanation of the drawings]

[0015] [Figure 1] FIG. 1 is a cross-sectional view showing a schematic configuration of a substrate processing apparatus according to a first embodiment. [Figure 2A] FIG. 2A is a perspective view showing a schematic configuration of a chuck pin according to the first embodiment. [Figure 2B] FIG. 2B is a top view showing a schematic configuration of the chuck pin according to the first embodiment. [Figure 3A] FIG. 3A is a top view showing a schematic configuration of the rotary table according to the first embodiment. [Figure 3B]FIG. 3B is a cross-sectional view showing a schematic configuration of the chuck pin according to the first embodiment. [Figure 3C] FIG. 3C is a cross-sectional view showing a schematic configuration of the chuck pin according to the first embodiment. [Figure 4A] FIG. 4A is a diagram for explaining the dimensions of the first inclined surface according to the first embodiment. [Figure 4B] FIG. 4B is a diagram for explaining the dimensions of the first inclined surface according to the first embodiment. [Figure 5A] FIG. 5A is a diagram for explaining the installation direction of the chuck pin according to the first embodiment. [Figure 5B] FIG. 5B is a view for explaining the installation direction of the chuck pin according to the first embodiment. [Figure 6A] FIG. 6A is a top view showing a schematic configuration of a chuck pin according to Modification 1. FIG. [Figure 6B] FIG. 6B is a cross-sectional view showing a schematic configuration of a chuck pin according to Modification 1. As shown in FIG. [Figure 7A] FIG. 7A is a perspective view showing a schematic configuration of a chuck pin according to Modification 2. FIG. [Figure 7B] FIG. 7B is a diagram for explaining the dimensions of the second inclined surface according to the second modification. [Figure 8A] FIG. 8A is a perspective view showing a schematic configuration of a chuck pin according to the second embodiment. [Figure 8B] FIG. 8B is a top view showing a schematic configuration of the chuck pin according to the second embodiment. [Figure 9] FIG. 9 is a diagram for explaining the disturbance of the airflow caused by the chuck pin. DETAILED DESCRIPTION OF THE INVENTION

[0016] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the substrate processing apparatus disclosed herein will be described in detail below with reference to the accompanying drawings. However, the substrate processing apparatus disclosed herein is not limited to the following embodiments.

[0017] (First embodiment) Fig. 1 is a cross-sectional view showing a schematic configuration of a substrate processing apparatus 1 according to a first embodiment. As shown in Fig. 1, the substrate processing apparatus 1 includes a base body 2 having a through-hole 2a in the center, a turntable 3 rotatably provided above the base body 2, a motor 4 serving as a drive source for the turntable 3, an annular liquid receiving portion 5 surrounding the turntable 3, and a control device 6 for controlling the motor 4.

[0018] The turntable 3 includes a cylindrical power transmission body 3a that transmits power from the motor 4, a cover 3b that covers each part, and a ring-shaped rotation plate 3c fixed to the upper end side of the power transmission body 3a. The turntable 3 also includes a plurality of (e.g., six) clamp parts 3d that grip the substrate W, a plurality of (e.g., six) pinion gears 3e individually provided below each clamp part 3d, and a master gear 3f that meshes with the pinion gears 3e. A grip release mechanism 3g for releasing the gripped substrate is also fixedly disposed on the base body 2.

[0019] The motor 4 is composed of a cylindrical stator 4a and a cylindrical rotor 4b rotatably inserted into the stator 4a. The stator 4a is attached to the underside of the base body 2, and the upper end side of the rotor 4b is located inside the through-hole 2a of the base body 2. The motor 4 is an example of a drive source for rotating the turntable 3. The motor 4 is electrically connected to the control device 6 and is driven under the control of the control device 6.

[0020] The liquid receiving section (cup) 5 is composed of an annular movable liquid receiving section 5a that receives the processing liquid that has splashed or flowed down from the substrate W, and an annular fixing liquid receiving section 5b. The liquid receiving section 5 is formed to surround the turntable 3. The movable liquid receiving section 5a is configured to be movable up and down by a lifting mechanism (not shown), such as a cylinder. The fixing liquid receiving section 5b is fixed to the upper surface of the base body 2, and a pipe 5c that collects the processing liquid (e.g., chemical solution, pure water, etc.) is connected to the bottom surface of the fixing liquid receiving section 5b.

[0021] The power transmission body 3a is fixed to the upper end of the rotor 4b of the motor 4 so that its central axis coincides with the rotation axis of the motor 4. Therefore, the power transmission body 3a rotates when driven by the motor 4. The central rotation axis of the power transmission body 3a and the motor 4 becomes the substrate rotation axis A1.

[0022] The transmission body 3a and the rotor 4b are hollow shafts, and a non-rotating holding cylinder 11 is provided in the internal space of these transmission body 3a and rotor 4b. A nozzle head 12 is provided on the top of the holding cylinder 11, and the nozzle head 12 is formed with a nozzle 12a that ejects a processing liquid (e.g., a chemical solution or pure water) toward the back surface (the bottom surface in FIG. 1) of the substrate W gripped by each clamp portion 3d. A portion of the processing liquid reflected by the back surface of the substrate W is discharged to the outside through a discharge pipe 13. In addition, a nozzle 12b that supplies the processing liquid to the front surface (the top surface in FIG. 1) of the substrate W is provided above the turntable 3.

[0023] The cover 3b is formed in a case shape with an opening on the bottom and is attached to the rotating plate 3c so as to rotate together with the rotating plate 3c. The cover 3b covers the parts that rotate with the rotation of the transmission body 3a to prevent the generation of turbulence. The cover 3b is formed with an opening 14 for allowing the processing liquid discharged from the nozzle 12a of the nozzle head 12 to pass upward, and with a through hole 15 for each clamp portion 3d.

[0024] The rotating plate 3c has a plurality of support cylinders 16 that individually hold each clamp 3d. The rotating plate 3c is fixed to the outer circumferential surface of the power transmission body 3a, forming an integral part of the rotating plate, and rotates together with the power transmission body 3a. Therefore, each clamp 3d held by the rotating plate 3c also rotates together with the rotating plate 3c around the central axis of rotation of the power transmission body 3a, i.e., the substrate rotation axis A1. The support cylinders 16 are provided at equal intervals on a circle centered on the substrate rotation axis A1 on the outer circumferential side of the disc-shaped rotating plate 3c.

[0025] The clamp unit 3d includes chuck pins (fixing members) 21 that come into contact with the substrate W, a rotating plate 22 that rotates while holding the chuck pins 21, and a pin rotor 23 that rotates while holding the rotating plate 22. The chuck pins 21 are fixed on the rotating plate 22 at a certain distance eccentric from the rotation center axis of the pin rotor 23 (the rotation center axis parallel to the substrate rotation axis A1), i.e., the pin rotation axis A2. The chuck pins 21 rotate eccentrically with respect to the pin rotation axis A2 in accordance with the rotation of the pin rotor 23. Here, the chuck pins 21 according to this embodiment are formed to prevent re-adhesion of the processing liquid to the substrate W, which will be described in detail later.

[0026] The pin rotor 23 is rotatably held by the support cylinder portion 16 of the rotating plate 3c. A pin gear 3e is fixed to the lower end of the pin rotor 23 and meshes with a master gear 3f whose rotation axis is the substrate rotation axis A1. The master gear 3f is mounted on a bearing (for example, a bearing) 24 fixed to the power transmission body 3a and is capable of rotating around the power transmission body 3a.

[0027] As a result, when the master gear 3f rotates around the substrate rotation axis A1 relative to the clamp unit 3d, the respective child gears 3e meshing with the master gear 3f rotate, and the pin rotors 23 of each clamp unit 3d all rotate synchronously around the pin rotation axis A2. When the master gear 3f rotates in the rotation direction for gripping the substrate W, the individual chuck pins 21 of each clamp unit 3d all rotate eccentrically in synchronization and come into contact with the peripheral end face (outer peripheral surface) of the substrate W, gripping the substrate W while centering the center of the substrate W on the substrate rotation axis A1. On the other hand, when the master gear 3f rotates in the direction opposite to the rotation direction for gripping, the individual chuck pins 21 of each clamp unit 3d all rotate synchronously in the opposite direction to the above and move away from the outer peripheral surface of the substrate W, releasing the gripped substrate W. By operating each clamp unit 3d in this manner, a chuck mechanism is realized that grips the substrate W by centering the center of the substrate W on the substrate rotation axis A1.

[0028] Below the master gear 3f, multiple (e.g., two) clamp springs 25 are connected between the master gear 3f and the rotating plate 3c. The master gear 3f is biased by each clamp spring 25 in a rotational direction for gripping the substrate W. As a result, each of the child gears 3e and each of the chuck pins 21 meshing with the master gear 3f are uniformly biased in the rotational direction for gripping the substrate W. One end of each clamp spring 25 is hooked on a spring post (not shown) fixed to the master gear 3f, and the other end is hooked on a spring post (not shown) fixed to the rotating plate 3c. These clamp springs 25 are provided at positions facing each other with respect to the substrate rotation axis A1. The spring force of each clamp spring 25 is transmitted from the master gear 3f to each of the child gears 3e, causing each chuck pin 21 to rotate eccentrically about the pin rotation axis A2 and gripping the substrate W by pressing against the peripheral edge surface of the substrate W.

[0029] In this way, the master gear 3f rotates independently of the rotating plate 3c about the substrate rotation axis A1. Furthermore, when the substrate W is being gripped by each chuck pin 21, the rotating plate 3c and the master gear 3f are locked together by the clamp spring 25 (they are integrated by the spring), and the master gear 3f rotates together with the rotating plate 3c. In other words, the master gear 3f is provided so as to be rotatable both together with the rotating plate 3c and independently about the substrate rotation axis A1.

[0030] As shown in FIG. 1, the grip release mechanism 3g includes a cylinder 31 and a stop pin 32. The cylinder 31 has a cylinder shaft 31a that moves up and down. The stop pin 32 is attached to the tip of the cylinder shaft 31a. When the cylinder shaft 31a of the cylinder 31 rises, the stop pin 32 at the tip of the cylinder shaft 31a also rises, and the master gear 3f is locked by the stop pin 32. When the rotating plate 3c rotates in the direction to release the substrate W while the master gear 3f is stationary, each clamping portion 3d that rotates together with the rotating plate 3c moves around the master gear 3f in the same direction as the rotating plate 3c. At this time, each chuck pin 21 rotates eccentrically about the pin rotation axis A2 in the direction opposite to the direction in which the substrate W is gripped, and moves away from the peripheral end surface of the substrate W. The cylinder 31 is electrically connected to the control device 6 and is driven according to the control of the control device 6.

[0031] The chuck pin 21 according to the first embodiment will be described in detail below. FIG. 2A is a perspective view showing a schematic configuration of the chuck pin 21 according to the first embodiment. FIG. 2B is a top view showing a schematic configuration of the chuck pin 21 according to the first embodiment. Here, the upper and lower sides shown in FIG. 2A refer to the up-down direction when the chuck pin 21 is supported by the rotating plate 22. The front and rear sides shown in FIGS. 2A and 2B refer to the front-rear direction when the side of the chuck pin 21 that contacts the substrate W while gripping the substrate W is defined as the front side. The chuck pin 21 according to the first embodiment is a fixing member that fixes the substrate W to the turntable 3 by contacting the outer periphery of the substrate W to grip the substrate W. For example, as shown in FIGS. 2A and 2B, the chuck pin 21 is formed in a columnar shape that is teardrop-shaped in plan view and has a top portion 211 and a base portion 212.

[0032] 2A, the top portion 211 is an upper portion of the chuck pin 21 when the chuck pin 21 is supported by the rotating plate 22. Specifically, the top portion 211 is an upper end portion of the chuck pin 21 that is used when the chuck pin 21 supports the substrate W. The base portion 212 is a portion below the top portion 211 when the chuck pin 21 is supported by the rotating plate 22, as shown in FIG. 2A, and is a portion whose lower end is connected to the rotating plate 22.

[0033] 2A and 2B, when viewed from the rotation axis direction of the turntable 3 (when viewed from a plan view), the chuck pin 21 has a curved surface 21a on the side that contacts the substrate W (the front side in the figure), and when viewed from the rotation axis direction of the turntable 3, the chuck pin 21 has a reduced portion 21b that is formed by connecting the end of the curved surface 21a and whose width in a direction perpendicular to the first direction, away from the side that contacts the substrate W, continuously reduces from the boundary with the curved surface 21a toward the first direction. Furthermore, when viewed from a direction perpendicular to the rotation axis direction of the turntable 3 and perpendicular to the first direction (when viewed from the side), the chuck pin 21 has a first inclined surface 21c at its top 211 that slopes downward toward the first direction, and a support portion 21d that is formed on the curved surface 21a and supports the substrate W such that a top surface 21e of the top portion 211 and the upper surface of the substrate W are on the same plane when the substrate W is gripped.

[0034] The chuck pins 21 are held by the rotating plate 22 so as to abut against the substrate W at the front side shown in FIGS. 2A and 2B. That is, the bases 212 of the chuck pins 21 are connected to the rotating plate 22 so as to support the substrate W at the front side in the drawings. FIG. 3A is a top view showing a schematic configuration of the turntable 3 according to the first embodiment. For example, as shown in FIG. 3A, the turntable 3 holds six chuck pins 21. Each chuck pin 21 supports the substrate W at its respective holding position by a support portion 21d formed on the front side shown in FIGS. 2A and 2B. That is, when the master gear 3f rotates in a rotation direction for gripping the substrate W, the support portion 21d abuts against the substrate W, thereby gripping the substrate W.

[0035] FIG. 3B is a cross-sectional view showing a schematic configuration of the chuck pin 21 according to the first embodiment. Here, FIG. 3B shows a cross-sectional view of the AA section in FIG. 3A. As shown in FIG. 3B, the chuck pin 21 has a top surface 21e and a first inclined surface 21c on a top portion 211. The top surface 21e is a horizontal surface and is formed on the side (front side) that supports the substrate W. Specifically, the top surface 21e is formed closer to the front than the first inclined surface. The first inclined surface 21c is an inclined surface that slopes downward in direction D1 (first direction) away from the side that supports the substrate W. Specifically, the first inclined surface 21c is an inclined surface that slopes downward in direction D1 from an end of the top surface 21e (the rear end shown in FIG. 2). More specifically, the first inclined surface 21c is an inclined surface formed on the direction D1 side of the top surface 21e, and is an inclined surface that continuously descends in the direction D1 to the rear end of the chuck pin 21. That is, the first inclined surface 21c is an inclined surface that continuously slopes downward as shown in FIG. 2A as it approaches the direction D1 side. Note that the top portion 211 according to the first embodiment refers to the vertical portion from the top surface 21e to the rear end of the first inclined surface 21c, as shown in FIG. 3B.

[0036] Here, the first inclined surface 21c may be formed so as to start inclining from near the center of the chuck pin 21 in the direction D1 shown in FIG. 3B , or may be formed so as to start inclining from the rear side (D1 direction side) of the center in the direction D1. For example, the first inclined surface 21c is formed as an inclined surface that continuously descends from near the center of the chuck pin 21 (top portion 211) in the direction D1 toward the direction D1 to the rear end of the chuck pin 21. Alternatively, the first inclined surface 21c is formed as an inclined surface that continuously descends from a position rearward of the center of the chuck pin 21 (top portion 211) in the direction D1 toward the direction D1 to the rear end of the chuck pin 21. Note that the above example is merely an example, and the first inclined surface 21c may be formed as an inclined surface that continuously descends from a position forward of the center of the chuck pin 21 (top portion 211) in the direction D1 toward the direction D1 to the rear end of the chuck pin 21.

[0037] The support portion 21d is provided on the top portion 211. Specifically, the support portion 21d is composed of a surface connected to the top surface 21e (a vertical surface connected to the top surface 21e in FIG. 3B) and a surface connected to the curved surface 21a (a horizontal surface connected to the curved surface 21a in FIG. 3B), and is formed above the curved surface 21a. That is, the support portion 21d is formed of a vertical surface that abuts against the outer periphery of the side surface of the substrate W and a horizontal surface on which the outer periphery of the back surface of the substrate W is placed. Here, the horizontal surface of the support portion 21d is formed below the top surface 21e by the thickness of the substrate W. In other words, the horizontal surface of the support portion 21d is formed at a position lower than the height of the top surface 21e by the thickness of the substrate W in the up-down direction shown in FIG. 2A. By forming the horizontal surface of the support portion 21d as described above, the support portion 21d can support the substrate W so that the top surface 21e and the upper surface of the substrate W are on the same plane, as shown in FIG. 3B. Note that the term "same plane" here also includes a state in which there is a step that does not obstruct the flow of processing liquid flowing over the top surface of the substrate W and / or does not turn the processing liquid into mist even when the processing liquid flowing over the substrate hits the chuck pin.

[0038] FIG. 3C is a cross-sectional view showing a schematic configuration of the chuck pin 21 according to the first embodiment. Here, FIG. 3C shows a cross-sectional view of the BB cross section in FIG. 3B. That is, the cross-sectional view of FIG. 3C is a plan view showing a horizontal cross section of the chuck pin 21 excluding the support portion 21d. As shown in FIG. 3C, the curved surface 21a of the chuck pin 21 is shown as a curve in the horizontal cross section. That is, the curved surface 21a is a curved surface formed by continuing a horizontal curve in the vertical direction. As shown in FIG. 3B, this curved surface 21a is formed below the support portion 21d on the front side (the side that supports the substrate W) of the chuck pin 21. That is, the curved surface 21a is formed below the support portion 21d on the side surface on the front side of the chuck pin 21.

[0039] 3C, the chuck pin 21 has a reduced portion 21b whose width continuously reduces in the direction D1 in a direction perpendicular to the direction D1. Here, the reduced portion 21b refers to a portion of the region R1 from the position where the reduction in width in the direction perpendicular to the direction D1 starts (the end point of the curved surface 21a) to the rear end of the chuck pin 21. For example, as shown in FIG. 3C, the chuck pin 21 has reduced portion 21b, which is a region up to the rear end 213 of the chuck pin 21 where the side surfaces come closer to each other as they move away from the end of the curved surface 21a (the end point of the curved surface 21a).

[0040] In this way, the chuck pin 21 according to the first embodiment is formed so that the horizontal cross section including the curved surface 21a and the reduced portion 21b has, for example, a teardrop shape.

[0041] The substrate processing apparatus 1 according to the first embodiment includes the chuck pin 21 configured as described above, thereby preventing re-adhesion of the processing liquid to the substrate W and improving substrate quality. Specifically, the chuck pin 21 has the reduced portion 21b and the first inclined surface 21c, which reduces the size of the chuck pin 21 in the direction of scattering of the processing liquid, thereby reducing the occurrence of airflow disturbances behind the chuck pin 21. Specifically, the reduced size of the chuck pin 21 reduces the width (surface) of the rear end 213 of the chuck pin 21, thereby reducing the area where negative pressure occurs downstream of the rear end 213 of the chuck pin 21. That is, the chuck pin 21 reduces the area where a vortex airflow is formed by drawing in airflow from the surroundings, thereby reducing the occurrence of airflow disturbances (vortexes). As a result, the chuck pin 21 can prevent mist of the processing liquid detached from the chuck pin 21 from scattering (floating up). That is, the chuck pins 21 can reduce the mist of the processing liquid scattering toward the substrate W, and can prevent the processing liquid from re-adhering to the substrate W, thereby improving the quality of the substrate. The substrate W processed by such a substrate processing apparatus 1 is a high-quality substrate that can be used right up to the edge.

[0042] Furthermore, the chuck pin 21 configured as described above smoothly discharges the processing liquid toward the liquid receiving portion (cup) 5, suppresses the processing liquid from turning into mist, and prevents the processing liquid from re-adhering to the substrate W. For example, the first inclined surface 21c is formed on the chuck pin 21, so that the processing liquid peeled off from the chuck pin 21 can be discharged downward. In other words, the chuck pin 21 can discharge the processing liquid so that the peeled processing liquid is directed toward the inner surface of the liquid receiving portion (cup) 5.

[0043] Furthermore, for example, the chuck pin 21 has a curved surface 21a formed on the front side and a reduced portion 21b formed on the rear side, so that the processing liquid that reaches the chuck pin 21 from the upper or lower surface of the substrate W can be quickly discharged into the liquid receiving portion (cup) 5. In other words, the curved surface 21a and reduced portion 21b of the chuck pin 21 allow the processing liquid adhering to the chuck pin 21 to be quickly discharged into the liquid receiving portion (cup) 5 without being splashed onto the upper surface of the substrate W.

[0044] Furthermore, for example, the chuck pins 21 are formed so that the top surfaces 21e are flush with the upper surface of the substrate W when the substrate W is supported, thereby preventing the processing liquid flowing over the upper surface of the substrate W from colliding with the top portions 211 of the chuck pins 21 and splashing. In other words, the chuck pins 21 can smoothly discharge the processing liquid without impeding the flow of the processing liquid flowing over the upper surface of the substrate W.

[0045] Next, the dimensions of the first inclined surface 21c will be described with reference to FIGS. 4A and 4B. FIGS. 4A and 4B are diagrams for explaining the dimensions of the first inclined surface 21c according to the first embodiment. Here, FIGS. 4A and 4B show cross-sectional views of the AA cross section in FIG. 3A. For example, the first inclined surface 21c is formed so that the length "a" of the first inclined surface 21c in the direction D1 shown in FIG. 4A is "1 mm." Furthermore, for example, the first inclined surface 21c may be formed so that the inclination angle "θ" of the first inclined surface 21c shown in FIG. 4A (the angle when the upper surface of the substrate W is "0°") is within the range of "5° to 80°."

[0046] Here, the chuck pin 21 can further suppress disturbance of the airflow by making the length "a" of the first inclined surface 21c in the direction D1 equal to or greater than half of the length of the entire chuck pin 21 (top portion 211) in the direction D1. Specifically, as shown in FIG. 4B, the length "a" of the first inclined surface 21c in the direction D1 is equal to or greater than half of the length "b" of the entire chuck pin 21 (top portion 211) in the direction D1 shown in FIG. 4B. In other words, by making the length "a" longer without changing the height of the rear end of the first inclined surface 21c, the inclination angle of the first inclined surface 21c becomes gentler. For example, the first inclined surface 21c may be formed so that the length "a" is within a range of "1 mm to 50 mm."

[0047] For example, if the inclination angle of the first inclined surface 21c is too large, the flow of airflow along with the processing liquid on the inclined surface will be reduced, making it more likely to become negative pressure. That is, the pressure above the first inclined surface 21c will be lower than that around the inclined surface. In this state, airflow will be drawn in from the surroundings above the first inclined surface 21c, and a disturbance (vortex) in the airflow will be formed on the first inclined surface 21c. As a result, the mist of the processing liquid peeled off from the first inclined surface 21c will be scattered toward the upper surface of the substrate W due to the disturbance in the airflow.

[0048] Therefore, by making the inclination angle of the first inclined surface 21c gentle as described above, an airflow that flows together with the processing liquid on the first inclined surface 21c is created, reducing the formation of a negative pressure region on the first inclined surface 21c and suppressing the occurrence of disturbance of the airflow. As a result, it is possible to prevent the mist of the processing liquid that has separated from the first inclined surface 21c from scattering onto the upper surface of the substrate W.

[0049] The length "a" of the first inclined surface 21c in the direction D1 and the inclination angle "θ" of the first inclined surface 21c are optimally determined through experiments, simulations, and the like.

[0050] Next, the installation direction of the chuck pin 21 will be described. The chuck pin 21 may be provided so that the direction D1 (the direction of the narrowing portion 21b whose width continuously narrows toward the direction D1) is parallel to the splash direction of the processing liquid supplied to the substrate W. FIGS. 5A and 5B are diagrams for explaining the installation direction of the chuck pin 21 according to the first embodiment. Here, FIGS. 5A and 5B show top views of the chuck pin 21 in a state in which it supports the substrate W. That is, FIGS. 5A and 5B show a state in which the master gear 3f rotates in a rotation direction for gripping the substrate W and the support portion 21d abuts against the substrate W.

[0051] As shown in Fig. 5A, for example, the substrate W is rotated in direction D3 (Counter Clock Wise: CCW direction) while being held by the chuck pins 21, and a processing liquid is supplied to the substrate W. Here, for example, when the substrate W is rotated at 500 rpm (revolutions per minute), the direction in which the processing liquid flowing over the upper surface of the substrate W splashes is direction D2 shown in Fig. 5A. In the substrate processing apparatus 1 that processes the substrate W at such a rotation speed, the chuck pins 21 are held by the rotating plate 22 so that direction D1 is the direction shown in Fig. 5A when the support portions 21d are in contact with the substrate W.

[0052] Furthermore, for example, when the substrate W is rotated at 1000 rpm, the scattering direction of the processing liquid flowing over the upper surface of the substrate W is direction D2 shown in Fig. 5B. In the substrate processing apparatus 1 that processes the substrate W at such a rotation speed, the chuck pins 21 are held by the rotating plate 22 so that the direction D1 is the direction shown in Fig. 5B when the support portions 21d are in contact with the substrate W.

[0053] 5A and 5B are merely examples, and direction D1 does not necessarily have to be parallel to direction D2. As described above, the phenomenon in which mist of the processing liquid stirred up by disturbance of the air flow re-adheres to the substrate surface is particularly evident in the drying process in which the turntable 3 is rotated at a high speed of 1500 rpm to 2000 rpm. Therefore, the installation direction of the chuck pins 21 may be determined taking into consideration the rotation speed during the drying process. That is, the chuck pins 21 are installed so that direction D1 (the orientation of the narrowing portions 21b whose width continuously narrows toward direction D1) and the scattering direction of the processing liquid are parallel at the rotation speed during the drying process. In other processes, direction D1 and the scattering direction of the processing liquid may not be parallel.

[0054] If the substrate processing apparatus 1 has a mechanism capable of changing the orientation of the chuck pins 21 while holding the substrate W, the orientation of the chuck pins 21 may be changed depending on the rotation speed in each process.

[0055] As described above, the chuck pin 21 is held so that the direction D1 (the direction of the narrowing portion 21b whose width continuously narrows toward the direction D1) is parallel to the direction D2 in which the processing liquid supplied to the substrate W splashes, thereby enabling the processing liquid peeled off from the substrate W to be smoothly discharged along the side surface of the chuck pin 21. In other words, by not impeding the flow of the processing liquid, splashing of the processing liquid can be prevented, and the generation of mist of the processing liquid can be suppressed.

[0056] (Variation 1) The support portion 21d of the chuck pin 21 is not limited to the above-described shape and can be formed in various shapes. Fig. 6A is a top view showing a schematic configuration of the chuck pin 21 according to Modification 1. For example, the vertical surface (vertical surface) of the support portion 21d connected to the top surface 21e may be formed as a curved surface 21f, as shown in Fig. 6A. That is, the surface that abuts against the outer peripheral surface of the substrate W may be formed as a curved surface 21f. Note that the horizontal surface of the support portion 21d connected to the curved surface 21a may also be formed as a curved surface.

[0057] Fig. 6B is a cross-sectional view showing a schematic configuration of the chuck pin 21 according to Modification 1. Here, Fig. 6B is a cross-sectional view of the above-mentioned AA cross section. For example, as shown in Fig. 6B, the vertical surface of the support portion 21d may be formed as an inclined surface 21g so that the angle formed between the vertical surface connected to the top surface 21e and the horizontal surface (horizontal plane) connected to the curved surface 21a is an acute angle. In other words, the surface that abuts against the outer peripheral surface of the substrate W may be formed as an inclined surface 21g. Note that the horizontal surfaces of the support portion 21d may also be formed as inclined surfaces.

[0058] (Variation 2) The shape of the rear side of the chuck pin 21 is not limited to the shape described in the first embodiment, and can be formed in various shapes. Fig. 7A is a perspective view showing a schematic configuration of the chuck pin 21 according to Modification 2. For example, as shown in Fig. 7A, the chuck pin 21 can further have a second inclined surface 21h that slopes downward from the end of the first inclined surface 21c toward the first direction when viewed from a direction perpendicular to the rotation axis direction of the turntable 3 and perpendicular to the first direction. By providing the second inclined surface 21h on the rear side of the chuck pin 21, the change in the flow of the airflow flowing together with the processing liquid from the first inclined surface 21c to the second inclined surface 21h can be made gentler, thereby more effectively suppressing disturbance of the airflow.

[0059] The airflow separated from the rear end of the first inclined surface 21c flows along an extension of the first inclined surface 21c. Therefore, for example, if the second inclined surface 21h is provided perpendicular to the top surface 21e, the airflow descending from the upper portion of the second inclined surface 21h (near the connection with the first inclined surface 21c) along the second inclined surface 21h will be small. That is, the pressure in the upper portion of the second inclined surface 21h will be lower than the surrounding pressure, forming a negative pressure region. When a negative pressure region is formed in this way, the surrounding airflow is taken in at the upper portion of the second inclined surface 21h, causing a disturbance in the airflow. As a result, the mist of the processing liquid separated from the chuck pin 21 (the processing liquid flowing along the inclined surface of the chuck pin) will be scattered toward the substrate W due to the disturbance in the airflow.

[0060] Therefore, by increasing the inclination angle of the second inclined surface 21h, the airflow that flows along the first inclined surface 21c with the processing liquid also flows along the second inclined surface 21h, thereby preventing a negative pressure region from being formed above the second inclined surface 21h. This prevents the airflow from being disturbed, and prevents the mist of the processing liquid that peels off from the chuck pins 21 from scattering toward the substrate W.

[0061] FIG. 7B is a diagram illustrating the dimensions of the second inclined surface 21h according to Modification 2. Here, FIG. 7B shows a cross-sectional view of the above-mentioned AA cross section. For example, the second inclined surface 21h may be formed so that the inclination angle "φ" shown in FIG. 7B (the angle when the vertical direction is "0°") is in the range of "1° to 80°." However, the inclination angle "φ" of the second inclined surface 21h is optimally determined through experiments, simulations, etc. Note that the second inclined surface 21h may also be a ridgeline (a boundary line of the side surfaces) formed by the contact of the side surfaces of the reduced portions 21b that approach each other as they move away from the end of the curved surface 21a (the end point of the curved surface 21a).

[0062] As described above, according to the first embodiment, the substrate processing apparatus 1 includes the turntable 3 that rotates the substrate W, and a plurality of chuck pins 21 that contact the outer periphery of the substrate W to grip the substrate W and thereby secure the substrate W to the turntable 3. When viewed from the direction of the rotation axis of the turntable 3, the chuck pin 21 has a curved surface 21a on the side that contacts the substrate W, and when viewed from the direction of the rotation axis of the turntable 3, the chuck pin 21 has a reduced portion 21b that is formed to connect to the end of the curved surface 21a and whose width in a direction perpendicular to a first direction (direction D1) away from the side that contacts the substrate W continuously reduces from the boundary with the curved surface 21a toward the first direction. Furthermore, when viewed from a direction perpendicular to the rotation axis direction of the turntable 3 and perpendicular to the first direction, the chuck pin 21 has a first inclined surface 21c on its top portion 211 that slopes downward toward the first direction, and is formed on the curved surface 21a. The chuck pin 21 has a support portion 21d that supports the substrate W such that the top surface 21e of the top portion 211 and the upper surface of the substrate W are flush with each other when the substrate W is gripped. Therefore, the substrate processing apparatus 1 according to the first embodiment can reduce the occurrence of airflow disturbance behind (downstream from) the chuck pin 21, and can prevent mist of the processing liquid detached from the chuck pin 21 from flying up due to the airflow disturbance and scattering toward the substrate W. As a result, the substrate processing apparatus 1 can prevent the processing liquid from re-adhering to the substrate W, thereby improving substrate quality.

[0063] Furthermore, according to the first embodiment, the support portion 21d is provided on the top portion 211. Therefore, the substrate processing apparatus 1 according to the first embodiment makes it possible to easily form the support portion 21d formed so that the top surface 21e of the top portion 211 and the upper surface of the substrate W are on the same plane.

[0064] According to the first embodiment, when viewed from a direction perpendicular to the rotation axis direction of the turntable 3 and perpendicular to the first direction, the top 211 has a horizontal surface (top surface 21e) on the side supporting the substrate W (front side), and the first inclined surface 21c slopes downward from the end of the horizontal surface toward the first direction (direction D1). According to the first embodiment, the length of the first inclined surface 21c in the first direction (direction D1) is equal to or greater than half the length of the entire chuck pin 21 (top 211) in the first direction. Therefore, by making the inclination angle of the first inclined surface 21c gentle, the substrate processing apparatus 1 according to the first embodiment can direct the airflow flowing with the processing liquid along with the first inclined surface 21c, thereby making it difficult for a negative pressure region to form on the first inclined surface 21c. As a result, the substrate processing apparatus 1 can suppress the occurrence of airflow disturbances and prevent mist of the processing liquid from floating up toward the substrate W.

[0065] According to the first embodiment, the chuck pins 21 are provided such that the direction of the narrowing portions 21b, whose widths continuously narrow in the first direction (direction D1), is parallel to the direction in which the processing liquid supplied to the substrate splashes (direction D2). Therefore, the substrate processing apparatus 1 according to the first embodiment can avoid impeding the flow of the processing liquid, and can prevent the processing liquid from splashing, thereby suppressing the generation of mist from the processing liquid.

[0066] According to the first embodiment, the chuck pin 21 further includes a second inclined surface 21h that is perpendicular to the rotation axis direction of the turntable 3 and slopes downward from the end of the first inclined surface 21c toward the first direction (direction D1) when viewed from a direction perpendicular to the first direction. Therefore, the substrate processing apparatus 1 according to the first embodiment can gently change the flow of the airflow flowing together with the processing liquid from the first inclined surface 21c to the second inclined surface 21h, thereby further suppressing turbulence of the airflow. That is, by providing the second inclined surface 21h, the substrate processing apparatus 1 allows the airflow flowing along the first inclined surface 21c together with the processing liquid to also flow along the second inclined surface 21h, thereby suppressing the formation of a negative pressure region above the second inclined surface 21h. As a result, the substrate processing apparatus 1 can suppress turbulence of the airflow and prevent the mist of the processing liquid detached from the chuck pin 21 from scattering toward the substrate W. Furthermore, in the substrate processing apparatus 1, the turbulence of the airflow occurring behind (downstream of) the chuck pin 21 is suppressed, so that the mist of the processing liquid detached from the chuck pin 21 is discharged onto the inner surface of the liquid receiving portion (cup) 5 without scattering toward the substrate W.

[0067] (Second embodiment) In the first embodiment described above, the case where the curved surface 21a, the reduced portion 21b, the first inclined surface 21c, and the support portion 21d are formed on the entire chuck pin is described. In the second embodiment, the case where the curved surface 21a, the reduced portion 21b, the first inclined surface 21c, and the support portion 21d are formed on a part of the chuck pin is described. The substrate processing apparatus 1 according to the second embodiment differs from the first embodiment only in the chuck pin. That is, the substrate processing apparatus 1 according to the second embodiment has a configuration in which the chuck pin 21 in the configuration shown in FIG. 1 is replaced with a chuck pin 100 described below.

[0068] Fig. 8A is a perspective view showing a schematic configuration of a chuck pin 100 according to the second embodiment. Fig. 8B is a top view showing a schematic configuration of the chuck pin 100 according to the second embodiment. As shown in Fig. 8A, the chuck pin 100 according to the second embodiment has a base portion 111, a top portion 112, and a protrusion portion 113 that supports a substrate W.

[0069] Base 111 holds top 112 and protrusion 113, and is held by rotating plate 22. As shown in Fig. 8A, top 112 is formed with curved surface 21a, reduced portion 21b, first inclined surface 21c, top surface 21e, and second inclined surface 21h. 8B , when viewed from the rotation axis direction of the turntable 3 (when viewed from a plan view), the top 112 has a curved surface 21a on the side that abuts against the substrate W, and when viewed from the rotation axis direction of the turntable 3 (when viewed from a plan view), the top 112 has a reduced portion 21b that is formed by connecting to the end of the curved surface 21a and whose width in a direction perpendicular to the first direction, away from the side that abuts against the substrate W, continuously reduces from the boundary with the curved surface 21a toward the first direction, and has a first inclined surface 21c that is perpendicular to the rotation axis direction of the turntable 3 and slopes downward toward the first direction when viewed from a direction perpendicular to the first direction (when viewed from a side). In addition, the top 112 has a second inclined surface 21h that is perpendicular to the rotation axis direction of the turntable 3 and slopes downward toward the first direction from the end of the first inclined surface 21c when viewed from a direction perpendicular to the first direction (when viewed from a side).

[0070] Here, the curved surface 21a, the reduced portion 21b, the first inclined surface 21c, and the top surface 21e according to the second embodiment are formed in the same manner as the respective configurations in the first embodiment. Note that the length of the first inclined surface 21c according to the second embodiment in the first direction is determined by comparison with the length of the top 112 in the first direction. For example, the length of the first inclined surface 21c according to the second embodiment in the first direction is formed to be at least half the length of the top 112 in the first direction.

[0071] The support portion 21d according to the second embodiment is composed of the tapered surface of the protrusion 113 and the curved surface 21a. That is, the chuck pin 100 supports the substrate W by the tapered surface of the protrusion 113, and when the master gear 3f rotates in the rotation direction for gripping the substrate W, the curved surface 21a comes into contact with the substrate W, thereby gripping the substrate W. Here, the portion of the tapered surface of the protrusion 113 that comes into contact with the vertical surface (vertical surface) connected to the top surface 21e is formed below the top surface 21e of the top portion 112 by the thickness of the substrate W. In other words, the portion of the tapered surface of the protrusion 113 that comes into contact with the vertical surface (vertical surface) connected to the top surface 21e is formed at a position lower than the height of the top surface 21e by the thickness of the substrate W. This allows the support portion 21d to support the substrate W so that the top surface 21e and the upper surface of the substrate W are on the same plane. The tapered surface of the protrusion 113 is inclined downward from the portion where it meets the vertical surface (vertical surface) connected to the top surface 21e toward the substrate W. That is, the tapered surface of the protrusion 113 is inclined downward from the top 112 side toward the tip of the protrusion 113.

[0072] 8A are merely examples, and the base 111 and the protrusions 113 may be formed in various other shapes. For example, the base 111 may be formed in a cylindrical shape.

[0073] As described above, according to the second embodiment, the substrate processing apparatus 1 includes the turntable 3 that rotates the substrate W, and a plurality of chuck pins 100 that secure the substrate W to the turntable 3 by contacting the outer periphery of the substrate W to grip the substrate W. The chuck pin 100 includes a top portion 112, a base portion 111 that holds the top portion 112, and a protrusion 113 that supports the substrate W. When viewed from the direction of the rotation axis of the turntable 3, the top portion 112 has a curved surface 21a on the side that contacts the substrate W, and when viewed from the direction of the rotation axis of the turntable 3, the top portion 112 has a reduced portion 21b that is formed to connect to the end of the curved surface 21a and whose width in a direction perpendicular to the first direction and away from the side that contacts the substrate W continuously reduces from the boundary with the curved surface 21a toward the first direction. The top portion 112 also has a first inclined surface 21c that is perpendicular to the rotation axis direction of the turntable 3 and that slopes downward toward the first direction when viewed from a direction perpendicular to the first direction. The protrusions 113 support the substrate W so that the top surface 21e of the top portion 112 and the upper surface of the substrate W are flush with each other when the substrate W is gripped. Therefore, similar to the first embodiment, the substrate processing apparatus 1 according to the second embodiment can reduce the occurrence of airflow disturbances behind (downstream of) the chuck pins 100 and can prevent mist of the processing liquid detached from the chuck pins 21 from flying up due to the airflow disturbances and scattering toward the substrate W. As a result, the substrate processing apparatus 1 can prevent the processing liquid from re-adhering to the substrate W and improve substrate quality.

[0074] Furthermore, according to the second embodiment, the chuck pin 100 can be formed by forming the curved surface 21a, the reduced portion 21b, and the first inclined surface 21c on the top of the chuck pin. That is, the chuck pin 100 can be formed by modifying a part of an existing chuck pin, which makes it possible to easily realize the chuck pin according to the present application.

[0075] (Other embodiments) In the above-described first and second embodiments, a case has been described in which a chuck mechanism is used that controls gripping and releasing of the substrate W by rotating the chuck pins. However, the embodiments are not limited to this, and other methods may be used as the chuck mechanism employed in the substrate processing apparatus 1. For example, a chuck mechanism that controls gripping and releasing of the substrate W by changing the inclination of the chuck pins using an elastic member such as a spring may be used. [Explanation of symbols]

[0076] 1. Substrate processing equipment 21, 100 chuck pin 21a Curved surface 21b Reduced section 21c First Inclined Plane 21d Support part 21e top surface 21h Second inclined plane 112, 211 top

Claims

1. a rotary table for rotating the substrate; a plurality of fixing members that fix the substrate to the rotary table by contacting the outer periphery of the substrate and gripping the substrate; Equipped with The fixing member is When viewed from the direction of the rotation axis of the turntable, the turntable has a curved surface on the side that comes into contact with the substrate, a tapered portion that is formed to connect to an end of the curved surface when viewed from the direction of the rotation axis of the turntable, and whose width in a direction perpendicular to a first direction away from the side that abuts against the substrate continuously decreases from a boundary with the curved surface toward the first direction, a first inclined surface at a top thereof that is inclined downward toward the first direction when viewed from a direction perpendicular to the rotation axis direction of the rotary table and perpendicular to the first direction; a support portion formed on the curved surface and configured to support the substrate such that a top surface of the top portion and an upper surface of the substrate are on the same plane when the substrate is held; When viewed from a direction perpendicular to the rotation axis direction of the rotary table and perpendicular to the first direction, the top has a horizontal surface on the side supporting the substrate; The substrate processing apparatus, wherein the first inclined surface slopes downward from an end of the horizontal surface in the first direction.

2. a rotary table for rotating the substrate; a plurality of fixing members that fix the substrate to the rotary table by contacting the outer periphery of the substrate and gripping the substrate; Equipped with the fixing member has a top portion, a base portion that holds the top portion, and a support portion that supports the substrate; The top portion is When viewed from the direction of the rotation axis of the turntable, the turntable has a curved surface on the side that comes into contact with the substrate, a tapered portion that is formed to connect to an end of the curved surface when viewed from the direction of the rotation axis of the turntable, and whose width in a direction perpendicular to a first direction away from the side that abuts against the substrate continuously decreases from a boundary with the curved surface toward the first direction, a first inclined surface that is perpendicular to the rotation axis direction of the rotary table and that is inclined downward toward the first direction when viewed from a direction perpendicular to the first direction; the support portion supports the substrate such that a top surface of the top portion and an upper surface of the substrate are on the same plane when the substrate is held; When viewed from a direction perpendicular to the rotation axis direction of the rotary table and perpendicular to the first direction, the top has a horizontal surface on the side supporting the substrate; The substrate processing apparatus, wherein the first inclined surface slopes downward from an end of the horizontal surface in the first direction.

3. 3. The substrate processing apparatus according to claim 1, wherein the length of the first inclined surface in the first direction is equal to or greater than half the length of the top portion in the first direction.

4. 3. The substrate processing apparatus according to claim 1, wherein the fixing member is arranged so that a direction of a narrowing portion in which the width continuously narrows in the first direction is parallel to a direction in which the processing liquid supplied to the substrate splashes.

5. 3. The substrate processing apparatus according to claim 1, wherein the fixing member further has a second inclined surface that is perpendicular to the rotation axis direction of the rotary table and that slopes downward from an end of the first inclined surface toward the first direction when viewed from a direction perpendicular to the first direction.

6. A rotary table for rotating the substrate; a plurality of fixing members that fix the substrate to the rotary table by contacting the outer periphery of the substrate and gripping the substrate; Equipped with the fixing member has a top portion, a base portion that holds the top portion, and a support portion that supports the substrate; The top portion is When viewed from the direction of the rotation axis of the turntable, the turntable has a curved surface on the side that comes into contact with the substrate, a tapered portion that is formed to connect to an end of the curved surface when viewed from the direction of the rotation axis of the turntable, and whose width in a direction perpendicular to a first direction away from the side that abuts against the substrate continuously decreases from a boundary with the curved surface toward the first direction, a first inclined surface that is perpendicular to the rotation axis direction of the rotary table and that is inclined downward toward the first direction when viewed from a direction perpendicular to the first direction; the support portion supports the substrate such that a top surface of the top portion and an upper surface of the substrate are on the same plane when the substrate is held; The fixing member is provided so that a direction of a narrowing portion whose width continuously narrows in the first direction is parallel to a direction in which a processing liquid supplied to the substrate splashes.

7. A rotary table for rotating the substrate; a plurality of fixing members that fix the substrate to the rotary table by contacting the outer periphery of the substrate and gripping the substrate; Equipped with the fixing member has a top portion, a base portion that holds the top portion, and a support portion that supports the substrate; The top portion is When viewed from the direction of the rotation axis of the turntable, the turntable has a curved surface on the side that comes into contact with the substrate, a tapered portion that is formed to connect to an end of the curved surface when viewed from the direction of the rotation axis of the turntable, and whose width in a direction perpendicular to a first direction away from the side that abuts against the substrate continuously decreases from a boundary with the curved surface toward the first direction, a first inclined surface that is perpendicular to the rotation axis direction of the rotary table and that is inclined downward toward the first direction when viewed from a direction perpendicular to the first direction; the support portion supports the substrate such that a top surface of the top portion and an upper surface of the substrate are on the same plane when the substrate is held; the fixing member further has a second inclined surface that is perpendicular to the rotation axis direction of the rotary table and that slopes downward from an end of the first inclined surface toward the first direction when viewed from a direction perpendicular to the first direction.

Images