Sensor arrangement for placement in a measurement chamber, device for fitting a mask, and method for fitting a mask - Patents.com

Abstract

To provide a sensor arrangement (100; 200; 300; 500) for placement in a measuring chamber (540).SOLUTION: A sensor arrangement (100; 200; 300; 500) includes a sensor (124; 224; 324; 524), an intake opening (131; 231; 331), and an outlet (132; 232; 332; 532). The sensor arrangement (100; 200; 300; 500) includes a fluid connection (133; 233; 333) between the intake opening (131; 231; 331) and the outlet (132; 232; 332; 532).SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] This application claims priority from German patent application DE 102023202135.8, filed on March 9, 2023, the contents of which are further incorporated by reference into the text of the present application.

[0002] The present invention relates to a sensor arrangement for placement in a measurement chamber, an apparatus for fitting a mask, and a method for fitting a mask. [Background technology]

[0003] In known sensor arrangements for arrangement in a measurement chamber, in particular for arrangement in a vacuum measurement chamber, particles and / or gases can enter the measurement chamber, in particular from the sensor arrangement, for example outgassing of an adhesive into the measurement chamber.

[0004] The prior art discloses devices and methods for qualifying masks for use in lithography. In this case, masks for use in lithography can be inspected, for example, by recording an optical image to find defects and / or soiling to improve quality in subsequent lithography steps for producing semiconductor elements. The method for qualifying a mask can be performed by an apparatus including a sensor arrangement. In sensor arrangements known from the prior art, particles or contaminants from parts of the sensor arrangement and / or from the measurement chamber can be deposited on the optical sensor or on optical surfaces, for example, on optical surfaces in the measurement chamber. This can lead to the formation of undesirable deposits on the optical components and / or on the sensor, particularly on the optical sensor, which can adversely affect the measurement results. The undesirable deposits can be, for example, organic. In addition to contaminants from the sensor arrangement, contaminants not originating from the sensor arrangement can alternatively or additionally be deposited on surfaces, particularly on the sensor surface. This may, for example, adversely affect the measurement results of a method for qualifying a mask for use in lithography, particularly contaminating the mask or optical components. This may, for example, adversely affect the reliability of defect detection, particularly in a manner that accumulates over time. Alternatively, or in addition, a mask intended to be suitable may become soiled by known methods, which may adversely affect lithography results. Alternatively, or in addition, the rate of false positive defect detection operations may increase and / or existing defects may not be detected. Summary of the Invention

[0005] It is therefore an object of the present invention to provide a sensor arrangement for placement in a measurement chamber, an apparatus for fitting a mask, and a method for fitting a mask, which sensor arrangement, apparatus, and method reduce contamination of the measurement chamber and / or mask.

[0006] The present invention therefore proposes a sensor arrangement for placement in a measurement chamber. The sensor arrangement comprises a sensor. The sensor can be an optical sensor, in particular an imaging sensor. The sensor can include, for example, a CCD (charge-coupled device) chip, a CMOS (complementary metal-oxide-semiconductor) chip, and / or a photodiode. The sensor can particularly preferably comprise a TDI (time delay and integration) sensor. The sensor arrangement can be, for example, a camera system. The sensor arrangement comprises an intake opening and an outlet. The sensor arrangement comprises a fluid connection between the intake opening and the outlet. The intake opening can be designed to allow a fluid to flow from the measurement chamber into the sensor arrangement, in particular into a cavity in the sensor arrangement. The fluid can be a gaseous and / or liquid medium, for example air. The intake opening can be completely or partially filled with a medium that is permeable to the fluid. The outlet can be designed to allow a fluid to flow out of the sensor arrangement via at least part of the fluid connection. The outlet can be configured as an opening. The outlet can be completely or partially filled with a medium that is permeable to the fluid. The fluid connection is designed to allow fluid to flow through at least a portion of the sensor arrangement. The fluid connection may be designed to allow fluid to flow from the intake opening to the outlet. The fluid connection may be at least partially configured as a cavity. The fluid connection may be at least partially filled with a medium that allows fluid to pass through.

[0007] The fluid connection may be designed to extract a medium from the measuring chamber by suction during operation of the sensor arrangement. The medium may preferably be a fluid. The medium may be a gas, in particular a gas mixture, and / or may contain particles and / or contaminants.

[0008] The sensor construction may include an adhesive layer. The adhesive layer may be designed to connect two or more elements of the sensor construction to one another. The adhesive layer may form a barrier against soiling. The adhesive layer may be designed to prevent contaminants from moving toward the measurement chamber. The fluid connection may be designed to dissipate outgassing from the adhesive layer during operation of the sensor construction, particularly to extract the outgassing by suction. This may prevent the outgassing from diffusing into the measurement chamber and / or allow the outgassing from the adhesive layer to flow through the intake opening and / or to the outlet via the fluid connection.

[0009] The sensor arrangement may include a first section and a second section. The first section may include an outlet. The second section may include an intake opening and a sensor. Additionally, the second section may include an adhesive layer. A fluid connection may connect the first section to the second section. The first section may be separated from the second section, for example, by a plane. In the case of arrangement of the sensor arrangement in a measurement chamber, the plane may be located on a wall of the measurement chamber. In the case of arrangement of the sensor arrangement in a measurement chamber, the first section of the sensor arrangement may be located substantially outside the measurement chamber. In the case of arrangement of the sensor arrangement in a measurement chamber, the second section of the sensor arrangement may substantially protrude into the measurement chamber. In the context of the present invention, expressions such as "first," "second," and "third," e.g., in "first section," for example, serve as pure designations, rather than indicating a particular order and the presence of other elements of the type referred to.

[0010] The sensor arrangement may comprise an electronics unit, in particular the first section, which may comprise an electronics unit, which may comprise electrical connections and / or a cable harness and / or a control unit and / or an evaluation unit.

[0011] The first section may include a carrier plate. The second section may include a sensor carrier. The carrier plate may be designed to place the sensor assembly in the measurement chamber. The carrier plate may be permanently or reversibly connected, for example, to the wall of the measurement chamber. The sensor assembly may include, for example, a sealing element, particularly a sealant, such as an O-ring, and / or a liquid-tight adhesive layer and / or a liquid-tight coating. For sealing purposes, a sealant, particularly an O-ring, may be arranged between the carrier plate and the wall of the measurement chamber. The carrier plate may include an opening, for example a circular opening. At least a portion of the electronics unit may be housed in the opening. The carrier plate and / or the sensor carrier and / or the sensor may be arranged substantially parallel to one another. In this example, substantially parallel may be understood to mean an angle between the two elements of less than 30°, particularly less than 10°, and particularly preferably less than 1°. An adhesive layer may be arranged between the sensor carrier and the sensor. The adhesive layer may be designed to connect the sensor carrier to the sensor. The electronics unit may be connected, in particular electrically connected, to the sensor carrier via the sensor carrier or an opening in the sensor carrier and / or via a passage through the adhesive layer. The electronics unit may, for example, be substantially cylindrical.

[0012] The second section may include an adhesive layer. The adhesive layer may be designed to prevent contamination from the first section, particularly from the electronics unit, into the measurement chamber. As a result, the electronics unit does not need to be configured to be suitable for vacuum. This may reduce costs. The adhesive layer may reduce the volume of the sensor assembly that needs to be designed to be suitable for vacuum. The adhesive layer may shield elements of the sensor assembly that are not suitable for vacuum.

[0013] The sensor arrangement may be designed to generate a decreasing pressure gradient from the first section to the second section, in particular by suctioning out released gas from the second section, in particular from the adhesive layer. The first section may include a first cavity. The second section may include a second cavity. The partial pressure in the first cavity may be lower than the partial pressure in the second cavity, in particular during operation of the sensor arrangement. The sensor arrangement may preferably be designed such that the partial pressure in the first cavity may be lower than the partial pressure in the second cavity, in particular during operation of the sensor arrangement. The first cavity may be, for example, part of the electronics unit. The second cavity may be, for example, a channel and / or an intake opening. The first cavity and / or the second cavity may be at least partially filled with a medium, for example, a porous medium. The second cavity may be, for example, arranged in the sensor carrier, in particular in a porous member of the sensor carrier, and / or in a cable bushing of the sensor carrier.

[0014] The sensor arrangement may include multiple sensors, particularly multiple imaging sensors, and particularly preferably multiple TDI sensors. The sensor arrangement may comprise, for example, multiple CCD (charge-coupled device) chips and / or multiple CMOS (complementary metal-oxide-semiconductor) chips and / or multiple photodiodes. The sensor arrangement may include, for example, 2 to 100 sensors, particularly 5 to 50 sensors, and particularly preferably 10 to 30 sensors. The sensor arrangement may be configured in such a way that each of the multiple sensors is designed to record a partial image, which may be added after a time offset. This allows the field of view of the sensor arrangement to be expanded when using small sensors and / or allows sensors to be replaced individually when worn. The sensor arrangement may include multiple TDI chips, which may be arranged in one plane as far as possible without overlapping.

[0015] The sensor, in particular the sensor arrangement, may be designed to detect radiation in the EUV range, which may have a wavelength between 1 nm and 250 nm, in particular between 10 nm and 100 nm, preferably between 13 nm and 14 nm.

[0016] The sensor arrangement may include a first connection element. The first connection element may be connectable to a vacuum source. The first connection element may be identical to the outlet.

[0017] The sensor arrangement may include a vacuum source. The vacuum source may be a pump. The vacuum source may be a vacuum system. The vacuum source may be designed to generate an ultra-high vacuum. In this example, ultra-high vacuum may be understood to mean a partial pressure of less than 10 Pascals, preferably less than 5 Pascals. Ultra-high vacuum may particularly preferably be understood to mean a partial pressure of less than 100 nanopascals. The sensor arrangement may include, for example, multiple pumps, in particular a primer pump and a main pump. The vacuum source may include one or more elements selected from the group including a lock valve pump, a rotary vane pump, a jet pump, a molecular pump, a turbomolecular pump, a cryopump, and a sorption pump. The sensor arrangement may include a heating device. This may prevent contaminants from entering the measurement chamber during operation.

[0018] The sensor arrangement may include a second connecting element. The second connecting element may be connected to a measurement chamber for operation in ultra-high vacuum. The second connecting element may be designed to permanently or reversibly connect the carrier plate to a wall of the measurement chamber. The connecting element may include an O-ring for sealing. The second connecting element may include, for example, a flange. The second connecting element may be designed to be threadedly fitted into the measurement chamber. The second connecting element may include one or more drilled holes.

[0019] The sensor arrangement may include a flushing device for flowing a flushing flow of a flushing medium. The flushing device may include one or more elements selected from the group including a flushing medium source, a line for flowing the flushing medium, and an outlet, particularly a nozzle, for delivering the flushing medium to one of the sensors. The flushing medium may include one or more gases selected from the group including helium, hydrogen, nitrogen, neon, argon, krypton, xenon, and oxygen. The flushing medium may be a pure gas. Alternatively, the gas may be a gas mixture. The flushing medium may preferably be a gas mixture including helium and hydrogen. The flushing device may be designed to generate a constant flushing flow. The flushing device may be designed to generate a laminar flushing flow. The flushing device may preferably be designed to direct the flushing flow onto at least a portion of the sensor, particularly onto the sensor edge of the sensor. The sensor may be cleaned by the flushing flow. Alternatively or additionally, for example, heat from the sensor can be dissipated by a flushing flow, particularly in the first section of the sensor assembly. This can improve the function of the sensor. The intake opening can be designed to draw in a flushing medium. The fluid connection can be designed to direct the flushing flow from the intake opening toward the outlet. The flushing flow can be designed to move with the contaminants and / or outgassed gases of the adhesive layer. The flushing device and / or the fluid connection can be designed to create a vacuum in a portion of the sensor assembly. This can be used, for example, to extract the contaminants and / or outgassed gases by suction, particularly toward the outlet.

[0020] The sensor configuration may include a first housing. At least a portion of the sensor configuration may be integrated into the first housing. For example, the electronics unit and / or carrier plate may be at least partially disposed in and / or mechanically connected to the first housing. For example, the first housing of the sensor configuration may include an outlet. For example, the sensor configuration may include a second housing. The second housing may at least partially include, for example, a sensor carrier and / or a sensor and / or a flushing device. This approach may simplify extraction of contaminants and / or outgassing from the electronics unit and / or from the adhesive layer of the sensor configuration, for example by suction.

[0021] The fluid connection may include one or more channels. The fluid connection may, for example, comprise an annular gap. The annular gap may have a constant gap width. The annular gap may have discontinuities, for example, for elements, particularly for stabilizing the sensor arrangement, and / or for electrical connections. The annular gap may be formed between the cylindrical electronics unit and the carrier plate, in particular by the electronics unit protruding into a circular opening in the carrier plate. The radius of the ring-shaped opening may, for example, be 0.1 mm to 1 cm, preferably 0.5 mm to 2 mm, particularly preferably 1 mm, greater than the radius of the electronics unit.

[0022] The path must be at least 0.1 mm 2 , especially at least 1 mm 2 , particularly preferably at least 5 mm 2The passage may be formed, for example, between the carrier plate and the electronics unit. Alternatively or additionally, the passage may be formed between the housing of the electronics unit and the carrier plate. The housing of the electronics unit and / or the electronics unit may be, for example, substantially tubular, can-shaped, or cylindrical. Alternatively, the housing of the electronics unit and / or the electronics unit may be, for example, substantially cubic. The housing of the electronics unit may be connected to the sensor carrier, for example, by an adhesive layer. The housing of the electronics unit may be connected to the first housing of the sensor arrangement, for example. The housing of the electronics unit may include openings for supplying electrical lines.

[0023] The sensor arrangement may include, for example, a third section. The third section may comprise a third cavity. The third cavity may be integrated, for example, into the housing of the electronics unit. The partial pressure in the third cavity may be higher than the partial pressure in the first cavity and / or the second cavity, particularly during operation of the sensor arrangement. The sensor arrangement may preferably be configured in such a way that the partial pressure in the third cavity may be higher than the partial pressure in the first cavity and / or the second cavity, particularly during operation of the sensor arrangement. The partial pressure in the cavity of the first section may preferably be higher than the partial pressure in the cavity of the second section. The third section may preferably comprise the electronics unit. The sensor arrangement may include, in particular, an additional adhesive layer between the housing of the electronics unit and the sensor carrier. The additional adhesive layer may, in particular, be configured in a ring shape, in such a way that a part of the electronics unit may be guided through the adhesive layer to the sensor carrier. The third section may be separated, particularly fluidically, from the first section and / or the second section by a liquid-tight wall and / or by the housing of the electronics unit and / or by an additional adhesive layer. Consequently, it is not necessary for the electronics unit to be configured to be suitable for vacuum. The sensor arrangement may be configured in such a way that the partial pressure in the first cavity and / or the partial pressure in the second cavity can be adjusted, for example, in a manner managed by the electronics unit. Particularly preferably, the sensor arrangement may be configured in such a way that the partial pressure in the first cavity and / or the partial pressure in the second cavity and / or the partial pressure in the third cavity can be adjusted, for example, in a manner managed by the electronics unit. For example, the vacuum source may be designed to adjust and / or control the partial pressure in the cavities of the sensor arrangement. The vacuum source may be designed to generate and / or manage different partial pressures in the first cavity and / or the second cavity. The vacuum source may preferably be designed to generate and / or manage different partial pressures in the first cavity and / or the second cavity and / or the third cavity.

[0024] The sensor arrangement may include, for example, a cooling device. The cooling device may comprise a Peltier element. The cooling device may be designed to cool the sensor. The fluid connection may be arranged so that a fluid flow and / or a wash flow passes over the hot side of the Peltier element, in particular in a manner that heat is vented to an outlet. Alternatively or additionally, the fluid connection may be arranged so that a fluid flow and / or a wash flow passes over the cold side of the Peltier element, in particular in a manner that condensed moisture is vented to an outlet. The fluid connection may, for example, be a gap between the sensor carrier and the cooling device, in particular the Peltier element. The fluid connection may be designed to allow moisture, in particular condensate, from the cooling device to flow to an outlet. The fluid connection, in particular a channel, may be at least partially arranged on the cooling device and / or the sensor carrier. This allows heat and / or moisture and / or contaminants to be dissipated from the sensor in a purposeful manner.

[0025] For example, the sensor arrangement may be configured in such a way that the partial pressure in the sensor arrangement may be managed in such a way that the electronics unit may have a lower partial pressure than the partial pressure in the measurement chamber. This has the advantage that the sensor and / or sensor carrier and / or cooling device, in particular the Peltier element, will bend less due to the smaller pressure difference, in particular between the measurement chamber and the electronics unit.

[0026] The fluid connection may include one or more valves. The valve may be designed to prevent fluid flow from the first section to the second section. This may prevent contaminants from the sensor assembly from entering the measurement chamber, for example, when the vacuum source is switched off. The valve may be, for example, a check valve. Alternatively or additionally, the outlet and / or fluid connection may include a device designed to close the outlet and / or fluid connection in a fluid-tight manner, particularly a liquid-tight slide, if required. The fluid connection and / or outlet may include, for example, a filter for filtering the fluid extracted by suction. The fluid connection and / or outlet may include a device for analyzing the fluid extracted by suction, such as a mass spectrometer. This may indicate a source of soiling, particularly a source of released gas. The sensor assembly may include one or more pressure sensors, which may allow the fluid flow to be managed and / or controlled by the sensor assembly.

[0027] In a further aspect, the present invention may comprise an apparatus for qualifying a mask for use in lithography, the apparatus comprising a sensor arrangement according to the present disclosure. Illustratively, qualifying the mask may include inspecting the mask. Alternatively, or in addition, qualifying the mask may include pre-processing the mask, e.g., correcting.

[0028] The mask can be a photolithographic mask, particularly preferably a photolithographic mask for the EUV wavelength range. The mask can comprise multiple layers, particularly planar layers. The mask can include an absorber structure with absorbing pattern elements.

[0029] The apparatus for fitting a mask may comprise an evaluation and control device, as well as a measurement chamber with an optical system. The evaluation and control device may comprise an independent evaluation device and an independent control device, and the two devices may be connected to each other by an interface. Alternatively, the evaluation and control device may be configured as one apparatus. The evaluation and control device may preferably comprise a data processing device. The evaluation and control device may be operated by a person, for example, via an interface. The interface device may be a keyboard or a touchpad.

[0030] The optical system may include an illumination unit and an imaging unit. The illumination unit may be designed to direct light, particularly illumination light, onto the mask. The illumination unit may include an EUV light source. The imaging unit may be designed to image the light reflected by the mask at an image plane.

[0031] The mask fitting apparatus may include at least one housing of the mask fitting apparatus. For example, the optical system may be disposed within the housing of the mask fitting apparatus, preferably completely disposed within the housing of the mask fitting apparatus. The evaluation and control device may be partially disposed within the housing of the mask fitting apparatus. For example, the evaluation and control device may be completely disposed within the housing of the mask fitting apparatus. Alternatively, the evaluation and control device may be completely disposed outside the housing of the mask fitting apparatus. For example, the sensor arrangement may be at least partially disposed within the housing of the mask fitting apparatus.

[0032] The apparatus may include a device for housing the mask. The device for housing the mask may be designed to deliver at least one flushing gas, in particular the flushing gas described above, to the mask. Instead of or in addition to the flushing device of the sensor arrangement, the device for housing the mask may also deliver flushing gas to the sensor of the sensor arrangement. By using the sensor arrangement according to the present disclosure, the apparatus may improve the detection of defects in the mask.

[0033] In a further aspect of the present invention, a method for fitting a mask for use in lithography is proposed. The method includes providing an apparatus for fitting a mask, the apparatus comprising a sensor arrangement according to the present disclosure. The apparatus may comprise an evaluation and control device and also a measurement chamber. An optical system may be disposed in the measurement chamber. The sensor arrangement comprises a sensor, an intake opening, and an outlet. The sensor arrangement includes a fluid connection between the intake opening and the outlet. The apparatus may include a vacuum source. The method further includes detecting at least one optical image of a portion of the mask by the sensor. The method further includes extracting a medium from the measurement chamber by suction via the fluid connection, particularly by the evaluation and control device. In a further step, one or more images generated by the sensor may be evaluated, particularly by the evaluation and control device. In a further step, defect detection may be performed, particularly by the evaluation and control device. For example, defects and / or soiling may be detected in the mask. In a further step, repair of the mask may be performed.

[0034] The sensor arrangement according to the present disclosure for placement in a measurement chamber, the apparatus according to the present disclosure for fitting a mask, and the method according to the present disclosure for fitting a mask have various advantages, at least in exemplary fine tuning. In particular, the reliability of the mask's fit may be increased, for example, by reducing outgassing of the adhesive layer into the measurement chamber, and / or by extracting contaminants and / or moisture by suction, and / or by transferring heat from the measurement chamber to the outside and / or from the sensor arrangement to the outside.

[0035] It goes without saying that the features mentioned above and those described below can be used not only in the combination specified in each case, but also in other combinations or by themselves, without departing from the scope of the present disclosure.

[0036] Exemplary embodiments of the present disclosure are illustrated in the drawings and will be explained in more detail with reference to the following description. [Brief explanation of the drawings]

[0037] [Figure 1] 1 is a schematic diagram of a first exemplary embodiment of a sensor arrangement according to the present invention; [Figure 2] FIG. 4 is a schematic diagram of a second exemplary embodiment of a sensor arrangement according to the present invention. [Figure 3] FIG. 4 is a schematic diagram of a third exemplary embodiment of a sensor arrangement according to the present invention. [Figure 4] 1 is a schematic view of an exemplary embodiment of a device according to the invention for fitting a mask; [Figure 5] 1 is a schematic diagram of a method according to the invention for fitting a mask; DETAILED DESCRIPTION OF THE INVENTION

[0038] 1 shows a first exemplary embodiment of a sensor arrangement 100 according to the invention for placement in a measurement chamber. The sensor arrangement 100 comprises a sensor 124, an intake opening 131, and an outlet 132. The sensor arrangement 100 comprises a fluid connection 133 between the intake opening 131 and the outlet 132. The fluid connection 133 is designed to extract a medium from the measurement chamber by suction during operation of the sensor arrangement 100. The sensor 124 may be designed to detect radiation in the EUV range. The sensor arrangement 100 may comprise a plurality of sensors 124, in particular a plurality of imaging sensors 124, in particular a plurality of sensors 124 that may be designed to detect radiation in the EUV range.

[0039] The sensor construction 100 includes an adhesive layer 123. The fluid connection 133 may be designed to extract outgassing 126 from the adhesive layer 123 by suction during operation of the sensor construction 100.

[0040] The sensor arrangement 100 includes a first section 190 and a second section 110. In the embodiment shown in Figure 1, dashed line 141 indicates a plane as a boundary between the first section 190 and the second section 110. The first section 190 includes an outlet 132. The second section 110 includes an intake opening 131 and a sensor 124. A fluid connection 133 connects the first section 190 to the second section 110.

[0041] The sensor arrangement 100 comprises an electronics unit 120. The first section 190 comprises the electronics unit 120. The first section 190 further comprises a carrier plate 121. The second section 110 comprises a sensor carrier 122. The sensor arrangement 100 can be designed to generate a decreasing pressure gradient from the first section 190 towards the second section 110.

[0042] The first section 190 includes a first cavity 134. The first cavity 134 may, for example, comprise the electronics unit 120. The second section 110 includes a second cavity 135. The second cavity 135 may be the intake opening 131. The partial pressure in the first cavity 134 may be lower than the partial pressure in the second cavity 135 during operation of the sensor arrangement 100 in a measurement chamber, especially under ultra-high vacuum.

[0043] The sensor configuration 100 may include a first housing 143. The outlet 132 and / or the carrier plate 121 and / or the electronics unit 120 may be at least partially integrated into the first housing 143. Alternatively, or in addition, the sensor configuration 100 may include a second housing. The second housing may, for example, at least partially enclose the sensor carrier 122 and / or the sensor 124 and / or the flushing device. This approach may simplify the extraction of contaminants and / or outgassing, for example, from the electronics unit 120 and / or from the adhesive layer 123 of the sensor configuration 100 by suction. The cavity of the first housing 143 may, for example, be a first cavity. The cavity of the second housing may, for example, be a second cavity.

[0044] The sensor arrangement 100 includes a first connection element 137. The first connection element 137 may be connectable to a vacuum source. Alternatively, the sensor arrangement 100 may include a vacuum source, such as a pump. The sensor arrangement 100 includes a second connection element 139. In the exemplary embodiment according to FIG. 1 , the second connection element 139 is the carrier plate 121. The second connection element 139 may be connectable to a measurement chamber for operation in an ultra-high vacuum.

[0045] The fluid connection 133 comprises a path 141. The path 141 according to FIG. 1 is designed substantially as an annular gap. The annular gap may have discontinuities, for example due to elements, in particular for the mechanical stabilization of the sensor arrangement 100, and / or due to electrical connections. The path 141 is formed by a gap between the electronics unit 120 and the carrier plate 121. The path 141 has a width of at least 0.1 mm. 2 , especially at least 1 mm 2 , particularly preferably at least 5 mm 2 The fluid connection 133 may include one or more valves. The sensor arrangement 100 may include a cooling device.

[0046] The electronics unit 120 is substantially cylindrical. Alternatively, the electronics unit 120 can be substantially cubic. The electronics unit 120 is housed in a circular opening in the carrier plate 121. The electronics unit 120 is connected to the sensor carrier 122, particularly by electrical connections. The sensor carrier 122 is connected to the sensor 124 by an adhesive layer 123. The sensor 124 can be a TDI sensor. The sensor 124 can include, for example, multiple TDI sensors. When a pump is connected to the outlet 132, a vacuum can be created in the first section 190, which includes the electronics unit 120, the outlet 132, the carrier plate 121, and at least a portion of the first housing 143 of the sensor arrangement 100, and the vacuum can create a fluid flow from the second section 110, which includes the sensor carrier 122, the adhesive layer 123, and the sensor 124, into the first section 190. This allows the outgassed gases 126 of the adhesive layer 123 to be directed out of the second section 110 and into the first section 190 .

[0047] The exemplary embodiment of the sensor configuration 200 according to FIG. 2 may be configured substantially similarly to the exemplary embodiment according to FIG. 1 . The exemplary embodiment according to FIG. 2 includes a flushing device 227 for flowing a flushing flow 228 of a flushing medium. The flushing medium may include one or more gases selected from the group including helium, hydrogen, nitrogen, neon, argon, krypton, xenon, and oxygen. The flushing device 227 may be configured, for example, as a ring-shaped nozzle configuration. The flushing device 227 may be designed to enhance the extraction of the released gas 226 from the adhesive layer 223 by suction. The flushing device 227 may be designed to direct the flushing flow 228 toward the edge of the sensor 224 and / or toward the edge zone of the adhesive layer 223. This may enhance the extraction of the released gas 226 from the adhesive layer 223 and / or the soiling of the sensor 224 by suction.

[0048] The sensor arrangement 200 may include a first housing 243. The outlet 232 and / or the carrier plate 221 and / or the electronics unit 220 may be at least partially integrated into the first housing 243.

[0049] The sensor arrangement 200 according to FIG. 2 comprises a second housing 244 of the sensor arrangement 200. The second housing 244 of the sensor arrangement 200 may, for example, at least partially enclose the sensor carrier 222 and / or the sensor 224 and / or the flushing device 227 and / or the adhesive layer 223. In this manner, extraction of contaminants and / or outgassing gases 226 from the electronics unit 220 and / or from the adhesive layer 223 of the sensor arrangement 200, for example by suction, may be simplified. The cavity of the first housing 243 may, for example, be the first cavity 234. The cavity of the second housing 244 may, for example, be the second cavity 235. During operation of the detection device 200, the partial pressure in the first cavity 234, particularly in the first housing 243, may be lower than the partial pressure in the second cavity 235, particularly in the second housing 244.

[0050] The exemplary embodiment of the sensor arrangement 300 according to Figure 3 may be configured substantially similarly to the sensor arrangement according to Figures 1 and / or 2 and may further include, for example, components not shown in Figure 3. The first section 390 comprises a carrier plate 321. The second section 310 comprises a sensor 324 and a sensor carrier 322, as well as an adhesive layer 323 connecting the sensor 324 to the sensor carrier 322.

[0051] The sensor configuration 300 comprises a further adhesive layer 323a, which may be designed to fluidically seal the housing 321a of the electronics unit 320 to the first section 390 and the second section 310, particularly to the sensor carrier 322. The sensor configuration 300 comprises a third section 340. The third section 340 comprises the electronics unit 320. The sensor configuration 300 comprises a first cavity 334 in the first section 390 and a second cavity 335 in the second section 310. The third section 340 may include a third cavity 345, which has a higher partial pressure than the first section 390 and the second section 310 during operation of the sensor configuration 300. The third cavity 345 may be at atmospheric pressure, particularly during operation of the sensor configuration 300. The sensor configuration 300 comprises a cooling device 342.

[0052] The sensor configuration 300 may include a first housing 343. The outlet 332 and / or the carrier plate 321 and / or the electronics unit 320 may be at least partially integrated into the first housing 343. Alternatively, or in addition, the sensor configuration 300 may include a second housing. The second housing may, for example, at least partially enclose the sensor carrier 322 and / or the sensor 324 and / or the flushing device 327 and / or the adhesive layer 323. This approach may simplify the extraction of contaminants and / or outgassing from the electronics unit 320 and / or from the adhesive layer 323 of the sensor configuration 300, for example, by suction. The cavity of the first housing 343 may be, for example, the first cavity 334. The cavity of the second housing may be, for example, the second cavity. During operation of the detection device 300, the partial pressure in the first cavity 334, particularly in the first housing 343, may be lower than the partial pressure in the second cavity, particularly in the second housing.

[0053] FIG. 4 shows an exemplary embodiment of an apparatus 550 according to the present invention for adapting a mask 530 for use in lithography, the apparatus 550 comprising a sensor arrangement 500 according to the present invention. The sensor arrangement 500 may be configured similarly to the sensor arrangements described above. FIG. 4 shows the sensor arrangement 500, in particular comprising a sensor 524 and an outlet 532. The sensor 524 may be designed to detect radiation 536 in the EUV range. The outlet 532 is a first connecting element 537. The outlet 532 is connected to a vacuum source 538. The vacuum source 538 is integrated into the sensor arrangement 500, in particular into a first housing 543 of the sensor arrangement 500. The apparatus 550 comprises an EUV source 510.

[0054] The device 550 comprises an evaluation and control device 543 and a measurement chamber 540 which further comprises an optical system 520. The evaluation and control device 543 can be connected to the sensor arrangement 500 and / or to the EUV source 510 and / or to the optical system 520 via an interface. The apparatus 550 comprises a housing 590. The housing 590 can, for example, delimit the measurement chamber 540. The apparatus 550 can be designed to perform the method according to the invention for fitting the mask 530.

[0055] FIG. 5 shows an exemplary embodiment of a method according to the present invention for fitting a mask for use in lithography. The method includes providing an apparatus for fitting a mask (1010). The apparatus can be, for example, the apparatus 550 shown in FIG. 4. The apparatus in particular includes a sensor arrangement according to the present invention, for example, as shown in FIG. 1, 2, 3, or 4. The apparatus can include an evaluation and control device and a measurement chamber with an optical system. The sensor arrangement includes a sensor, an intake opening, and an outlet. The sensor arrangement includes a fluid connection between the intake opening and the outlet. The apparatus can include a vacuum source. In a further step 1020, at least one optical image of at least a portion of the mask is detected by the sensor. For example, multiple images can be recorded. In a further step 1030, a medium is extracted from the measurement chamber by suction via the fluid connection by the evaluation and control device. In a further step, evaluation can be performed by the evaluation and control device, and in particular defect detection can be performed to identify defects or soiling of the mask. [Explanation of symbols]

[0056] 100, 200, 300, 500 sensor configurations 540 Measurement Chamber 124, 224, 324, 524 sensors 131, 231, 331 intake openings 132, 232, 332, 532 exit 133, 233, 333 Fluid connections 123, 223, 323 Adhesive layer 126, 226, 326 Released gas 190, 290, 390 First Section 110, 210, 310 Second Section 1010 Provide 1020 Detect 1030 Extract by suction 120, 220, 320 Electronics Unit 121, 221, 321 carrier plates 122, 222, 322 Sensor Carrier 134, 234, 334, 534 First Cavity 135, 235, 335, 535 Second Cavity 536 Radiation in the EUV range 137, 337, 537 First connecting element 538 Vacuum source 139, 239, 339 Second connecting element 227, 327 flushing device 228, 328 Washing flow 141, 241, 341 Route section 342 Cooling Device 530 Mask 543 Evaluation and Control Devices 520 Optical System 550 Devices for fitting masks 142, 242, 342 plane 323a Additional adhesive layer 321a Electronics unit housing 340 Third Section 510 EUV source 590 Housing for devices for fitting masks 143, 243, 343, 543 First housing of sensor assembly 244 Second housing of sensor assembly 345 Third Cavity

Claims

1. a sensor arrangement (100; 200; 300; 500) for placement in a measuring chamber (540), said sensor arrangement (100; 200; 300; 500) comprising a sensor (124; 224; 324; 524), an intake opening (131; 231; 331) and an outlet (132; 232; 332; 532), said sensor arrangement (100; 200; 300; 500) comprising a fluid connection (133; 233; 333) between said intake opening (131; 231; 331) and said outlet (132; 232; 332; 532), the sensor arrangement (100; 200; 300; 500) comprises an electronics unit (120; 220; 320); the fluid connection (133; 233; 333) is designed to extract released gases from the electronics unit (120; 220; 320) by suction during operation of the sensor arrangement (100; 200; 300; 500), Sensor construction (100; 200; 300; 500).

2. the fluid connection (133; 233; 333) is designed to extract a medium from the measuring chamber (540) by suction during operation of the sensor arrangement (100; 200; 300; 500), 2. The sensor arrangement (100; 200; 300; 500) of claim 1.

3. the sensor construction (100; 200; 300; 500) comprises an adhesive layer (123; 223; 323, 323a), A sensor arrangement (100; 200; 300; 500) according to claim 1 or 2.

4. the fluid connection (133; 233; 333) is designed to extract the released gas (126; 226; 326) of the adhesive layer (123; 223; 323, 323a) by suction during operation of the sensor arrangement (100; 200; 300; 500), A sensor arrangement (100; 200; 300; 500) according to claim 3.

5. the sensor arrangement (100; 200; 300; 500) comprises a first section (190; 290; 390) and a second section (110; 210; 310), the first section (190; 290; 390) comprising the outlet (132; 232; 332; 532), the second section (110; 210; 310) comprising the intake opening (131; 231; 331) and the sensor (124; 224; 324; 524), and the fluid connection (133; 233; 333) connecting the first section (190; 290; 390) to the second section (110; 210; 310), 2. The sensor arrangement (100; 200; 300; 500) of claim 1.

6. The first section (190; 290; 390) comprises the electronics unit (120; 220; 320), A sensor arrangement (100; 200; 300; 500) according to claim 5.

7. the first section (190; 290; 390) comprises a carrier plate (121, 221, 321) and the second section (110; 210; 310) comprises a sensor carrier (122; 222; 322); A sensor arrangement (100; 200; 300; 500) according to claim 5 or 6.

8. the sensor arrangement (100; 200; 300; 500) is designed to generate a decreasing pressure gradient from the first section (190; 290; 390) towards the second section (110; 210; 310), A sensor arrangement (100; 200; 300; 500) according to claim 5 or 6.

9. the first section (190; 290; 390) comprises a first cavity (134; 234; 334; 534), the second section (110; 210; 310) comprises a second cavity (135; 235; 335; 535), and a partial pressure in the first cavity (134; 234; 334; 534) is lower than a partial pressure in the second cavity (135; 235; 335; 535); A sensor arrangement (100; 200; 300; 500) according to claim 5 or 6.

10. the sensor arrangement (100; 200; 300; 500) comprises a third section (340), the third section (340) comprises a third cavity (345), and a partial pressure in the third cavity (345) is higher than a partial pressure in the first cavity (134; 234; 334; 534) and a partial pressure in the second cavity (135; 235; 335; 535); 10. The sensor arrangement (100; 200; 300; 500) according to claim 9.

11. the sensor arrangement (100; 200; 300; 500) comprises a plurality of sensors (124; 224; 324; 524); A sensor arrangement (100; 200; 300; 500) according to claim 1 or 2.

12. the sensor (124; 224; 324; 524) is designed to detect radiation (536) in the EUV range, A sensor arrangement (100; 200; 300; 500) according to claim 1 or 2.

13. the sensor arrangement (100; 200; 300; 500) comprises a first connecting element (137; 337; 537), the first connecting element (137; 337; 537) being connectable to a vacuum source (538); A sensor arrangement (100; 200; 300; 500) according to claim 1 or 2.

14. the sensor arrangement (100; 200; 300; 500) includes a vacuum source (538); A sensor arrangement (100; 200; 300; 500) according to claim 1 or 2.

15. the sensor arrangement (100; 200; 300; 500) comprises a second connecting element (139; 239; 339), the second connecting element (139; 239; 339) being connectable to the measuring chamber (540) for operation in ultra-high vacuum, A sensor arrangement (100; 200; 300; 500) according to claim 1 or 2.

16. the sensor arrangement (100; 200; 300; 500) comprises a flushing device (227; 327) for providing a flushing flow (228; 328) of a flushing medium, A sensor arrangement (100; 200; 300; 500) according to claim 1 or 2.

17. The method of claim 16, wherein the scrubbing medium comprises one or more gases selected from the group consisting of helium, hydrogen, nitrogen, neon, argon, krypton, xenon, and oxygen. A sensor arrangement (100; 200; 300; 500) according to claim 1 or 2.

18. the fluid connection (133; 233; 333) comprises one or more pathways (141; 241; 341), A sensor arrangement (100; 200; 300; 500) according to claim 1 or 2.

19. said fluid connection (133; 233; 333) comprising one or more valves; A sensor arrangement (100; 200; 300; 500) according to claim 1 or 2.

20. the sensor arrangement (100; 200; 300; 500) comprises a cooling device (342); A sensor arrangement (100; 200; 300; 500) according to claim 1 or 2.

21. A sensor arrangement (100; 200; 300; 500) for placement in a measuring chamber (540), said sensor arrangement (100; 200; 300; 500) comprising a sensor (124; 224; 324; 524), an intake opening (131; 231; 331) and an outlet (132; 232; 332; 532), said sensor arrangement (100; 200; 300; 500) comprising a fluid connection (133; 233; 333) between said intake opening (131; 231; 331) and said outlet (132; 232; 332; 532), the sensor construction (100; 200; 300; 500) comprises an adhesive layer (123; 223; 323, 323a), Sensor construction (100; 200; 300; 500).

22. A sensor arrangement (100; 200; 300; 500) for placement in a measurement chamber (540), said sensor arrangement (100; 200; 300; 500) comprising a sensor (124; 224; 324; 524), an intake opening (131; 231; 331) and an outlet (132; 232; 332; 532), said sensor arrangement (100; 200; 300; 500) comprising a fluid connection (133; 233; 333) between said intake opening (131; 231; 331) and said outlet (132; 232; 332; 532), said sensor arrangement (100; 200; 300; 500) comprising a first section (190; 290; 390) and a second section (110; 210; 310), said first section (190; 290; 390) comprising said outlet (132; 232; 332; 532), said second section (110; 210; 310) comprising said intake opening (131; 231; 331) and said sensor (124; 224; 324; 524), said fluid connection (133; 233; 333) connecting said first section (190; 290; 390) to said second section (110; 210; 310), the sensor arrangement (100; 200; 300; 500) comprises an electronics unit (120; 220; 320), and the first section (190; 290; 390) comprises the electronics unit (120; 220; 320), Sensor construction (100; 200; 300; 500).

23. A sensor arrangement (100; 200; 300; 500) for placement in a measurement chamber (540), said sensor arrangement (100; 200; 300; 500) comprising a sensor (124; 224; 324; 524), an intake opening (131; 231; 331) and an outlet (132; 232; 332; 532), said sensor arrangement (100; 200; 300; 500) comprising a fluid connection (133; 233; 333) between said intake opening (131; 231; 331) and said outlet (132; 232; 332; 532), said fluid connection (133; 233; 333) comprising one or more valves; Sensor construction (100; 200; 300; 500).

24. A sensor arrangement (100; 200; 300; 500) for placement in a measurement chamber (540), said sensor arrangement (100; 200; 300; 500) comprising a sensor (124; 224; 324; 524), an intake opening (131; 231; 331) and an outlet (132; 232; 332; 532), said sensor arrangement (100; 200; 300; 500) comprising a fluid connection (133; 233; 333) between said intake opening (131; 231; 331) and said outlet (132; 232; 332; 532), the sensor arrangement (100; 200; 300; 500) comprises a cooling device (342); Sensor construction (100; 200; 300; 500).

25. 10. An apparatus for qualifying a mask (530) for use in lithography, said apparatus comprising a sensor arrangement (100; 200; 300; 500) according to claim 1 or 2. Device.

26. the apparatus comprises an evaluation and control device (543) and further a measurement chamber (540) equipped with an optical system (520), 26. An apparatus (550) for fitting a mask (530) according to claim 25.

27. 1. A method for qualifying a mask (530) for use in lithography, comprising: a step (1010) of providing an apparatus (550) for fitting a mask (530), said apparatus comprising a sensor arrangement (100; 200; 300; 500) according to claim 1 or 2 in relation to said sensor arrangement (100; 200; 300; 500), said apparatus (550) comprising an evaluation and control device (543) and further a measurement chamber (540) with an optical system (520), said sensor arrangement (100; 200; 300; 500) being adapted to measure the mask (530); a step (1010) in which the sensor arrangement (100; 200; 300; 500) comprises a sensor (124; 224; 324; 524), an intake opening (131; 231; 331) and an outlet (132; 232; 332; 532), the sensor arrangement (100; 200; 300; 500) comprising a fluid connection (133; 233; 333) between the intake opening (131; 231; 331) and the outlet (132; 232; 332; 532), and the device (550) comprises a vacuum source (538); detecting (1020) at least one optical image of at least a portion of said mask (530) by said sensor (124; 224; 324; 524); - a step (1030) of extracting the medium from the measuring chamber (540) by suction via the fluid connection (133; 233; 333) by the evaluation and control device (543); A method comprising:

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