Pickup collet, pickup device and mounting device

Abstract

To provide a pick-up collet, a pick-up device, and a mounting device capable of picking up an electronic component without contact.SOLUTION: A pick-up collet 200 according to an embodiment that picks up an electronic component 2 by sucking and holding the electronic component includes a porous member 201 which has air permeability and supplies gas supplied inside through pores of a facing surface 201a facing the electronic component 2, and the porous member 201 is provided with a suction hole 201c having an opening 201d for sucking the electronic component 2 to the facing surface 201a by negative pressure on the facing surface 201a.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a pickup collet, a pickup device, and a mounting device. [Background technology]

[0002] When mounting electronic components, such as logic, memory, and image sensors, which are semiconductor elements, on a substrate, the wafer on which the semiconductor elements are formed is cut into individual chips, which are then picked up one by one, transferred to the substrate, and mounted thereon.

[0003] One surface of the chip is a functional surface on which fine circuits are formed. When picking up this chip from the wafer, if the picking member comes into direct contact with the functional surface, there is a risk of damaging the circuits, etc., so there is a demand to avoid such contact.

[0004] In addition, connection terminals on the surface of the chip are sometimes bonded to connection terminals on the substrate in a facing relationship. In this case, to ensure or improve the bondability between the connection terminals, the chip surface may be subjected to surface treatments such as plasma treatment or surface activation treatment. To maintain the condition of the surface of the chip after such treatment, there is a need to avoid direct contact of the pickup member with the chip surface.

[0005] In order to meet the requirement that no parts come into contact with the surface of the chip, conventionally, the surface of the collet, which is the part that picks up the chip, that holds the chip is made tapered so that only the peripheral edge, not the surface, of the chip is held in contact with the tapered surface of the collet (see Patent Document 1). [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Utility Model Application Publication No. 63-124746 Summary of the Invention [Problem to be solved by the invention]

[0007] However, even with the above-described conventional technology, the chip contacts the collet at its periphery. This can cause chipping or cracking due to contact with the periphery of the chip's surface. Furthermore, contact between the chip and the collet can lead to particle generation. Therefore, a collet that can hold the chip without contacting the periphery of the chip's surface is desired.

[0008] The present invention has been made to solve the above-mentioned problems, and its object is to provide a pickup collet, a pickup device, and a mounting device that can pick up electronic components without contact. [Means for solving the problem]

[0009] The present invention provides a pickup collet for suction-holding and picking up electronic components, the pickup collet having a porous member that is breathable and supplies gas supplied to the interior through pores on an opposing surface that faces the electronic component, the porous member being provided with suction holes having openings that suck the electronic component to the opposing surface by negative pressure, and when the opposing surface faces the rectangular electronic component, the openings are suction holes that suck the electronic component to the opposing surface. , a position overlapping at least two diagonally opposite corners of the four corners, or / and four sides The periphery of the casing is provided at a position overlapping the periphery of the casing.

[0010] In addition, the pickup device of the present invention is a pickup device that picks up the electronic component from a sheet to which the electronic component is attached, and has the pickup collet and a collet moving mechanism that moves the pickup collet close to a position on the sheet where the electronic component can be suction-held, and peels the suction-held electronic component from the sheet so that it can be transported.

[0011] The mounting device of the present invention also includes the pickup device, a bonding head that is movable relative to the pickup collet and receives the electronic component from the pickup collet, and a mounting section that transfers the electronic component held by the bonding head to a substrate and mounts it thereon. [Effects of the Invention]

[0012] The pickup collet, pickup device, and mounting device of the present invention can pick up electronic components in a non-contact manner. [Brief explanation of the drawings]

[0013] [Figure 1] FIG. 2 is a front view showing the transfer device and the mounting device according to the embodiment. [Figure 2] FIG. 2 is a plan view showing a transfer device and a mounting device according to the embodiment. [Figure 3] 1A is a schematic cross-sectional view showing the principle of holding an electronic component by a pickup collet, and FIG. 1B is a bottom perspective view showing the base. [Figure 4] FIG. 2 is a bottom perspective view showing the pickup collet and the attachment / detachment portion. [Figure 5] FIG. 2 is a top perspective view showing a pickup collet and a detachable portion. [Figure 6] FIG. 2 is a block diagram showing a control device of the transfer device and the mounting device. [Figure 7] 10 is a flowchart illustrating a procedure of a pickup operation according to an embodiment. [Figure 8] 10 is an explanation showing a pick-up operation according to an embodiment. [Figure 9] 10 is a bottom view showing a modified example of an opening provided at a position overlapping the edge of an electronic component without contacting the opening; FIG. [Figure 10] 10 is an explanatory diagram showing the principle of alignment of electronic components in the modified example of FIG. 9. FIG. [Figure 11] 10 is a bottom view showing another modified example of an opening provided at a position overlapping the edge of an electronic component without contacting the opening. FIG. [Figure 12]FIG. 10 is a bottom view showing a modified example of the arrangement of the openings. [Figure 13] FIG. 10 is a bottom perspective view showing a modified example of an opening including a base. DETAILED DESCRIPTION OF THE INVENTION

[0014] An embodiment of the present invention will be described with reference to the drawings. Note that the drawings are schematic views, and the size, proportions, etc. of each part are exaggerated for ease of understanding. As shown in FIGS. 1 and 2, a pickup collet 200 of this embodiment is used in a transfer device 1 for electronic components 2. The transfer device 1 includes a pickup device 20, a placement device 30, and a control device 50, and is a device that transfers electronic components 2 to the placement device 30 using the pickup device 20.

[0015] The electronic components 2 are, for example, chip-shaped components. In this embodiment, the electronic components 2 are semiconductor chips obtained by dividing a wafer into individual pieces. The mounting apparatus 100 is an apparatus that mounts the electronic components 2 supplied from the supply device 10 onto a substrate via transfer by the transfer device 1. That is, in addition to the configuration of the transfer device 1, the mounting apparatus 100 also includes the supply device 10 and a substrate stage 60 that supports the substrate.

[0016] The supply device 10 is a device that supplies electronic components 2 to the pickup device 20. The supply device 10 moves the electronic components 2 to be picked up to a supply position P1. The supply position P1 is a position where the pickup device 20 picks up the electronic components 2 to be picked up. The supply device 10 includes a supply stage 12 that supports a sheet 11 to which the electronic components 2 are attached, and a stage movement mechanism 13 that moves the supply stage 12. The stage movement mechanism 13 is, for example, a ball screw mechanism driven by a servo motor.

[0017] The sheet 11 to which the electronic components 2 are attached is an adhesive wafer sheet attached to a wafer ring (not shown). The electronic components 2 are arranged in a matrix on the sheet 11. In this embodiment, the electronic components 2 are arranged face-up with their functional surfaces exposed upward.

[0018] The supply stage 12 is a platform that horizontally supports the wafer ring to which the sheet 11 is attached. In other words, the supply stage 12 supports the sheet 11 to which the electronic components 2 are attached via the wafer ring. The supply stage 12 is provided so as to be movable in the horizontal direction by a stage movement mechanism 13. Since the sheet 11 is supported horizontally by the stage movement mechanism 13 together with the supply stage 12, the sheet 11 and the electronic components 2 placed on the sheet 11 are also provided so as to be movable in the horizontal direction.

[0019] 1, the horizontal direction in which the supply device 10 and the mounting device 30 are aligned is called the X-axis direction, and the direction perpendicular to the X-axis is called the Y-axis direction. The direction perpendicular to the plane of the sheet 11 is called the Z-axis direction or the up-down direction. The upward direction is the direction toward the side of the plane of the sheet 11 on which the electronic components 2 are placed, and the downward direction is the direction toward the side of the plane of the sheet 11 on which the electronic components 2 are not placed.

[0020] [Pickup device] The pickup device 20 is a device that picks up the electronic components 2 from the supply device 10 and transfers the picked-up electronic components 2 to the mounting device 30. The pickup device 20 includes a pickup collet 200, a collet moving mechanism 22, a direction changing unit 23, and a push-up pin 24.

[0021] 3 to 5, the pickup collet 200 is a member that sucks and holds the electronic component 2 and releases the sucked and held electronic component 2. The pickup collet 200 has a porous member 201 and a base 202.

[0022] The porous member 201 is breathable and supplies gas supplied to its interior through pores in the facing surface 201a that faces the electronic component 2. The porous member 201 of this embodiment has a rectangular parallelepiped plate shape, with fine, interconnected spaces densely and uniformly formed throughout. This structure provides the porous member 201 with breathability, but its conductance is very low. One of the surfaces of the porous member 201 serves as the facing surface 201a. When gas is supplied to the interior from the back surface 201b opposite the facing surface 201a, the gas is ejected from the dense, uniformly distributed pores in the facing surface 201a. This ejection is essentially planar, spreading across the entire surface of the facing surface 201a from which the gas is ejected. This ejection is extremely gentle, almost like oozing, and a slight airflow can be felt by placing a finger close to the surface. Note that the pores on surfaces other than the facing surface 201a and the back surface 201b may be blocked.

[0023] As described above, the porous member 201 is a continuous structure in which the pores, which are minute spaces inside, are interconnected and gas can pass between the pores. Materials such as sintered metal, ceramic, and resin can be used for such porous member 201. From the viewpoint that the particles inside are less likely to separate and flow out, sintered metal is preferred.

[0024] 3 and 4, the porous member 201 has an opening 201d on the opposing surface 201a, and is provided with a suction hole 201c, which is a through-hole that sucks the electronic component 2 by negative pressure. The suction hole 201c in this embodiment penetrates linearly from the center of the back surface 201b to the center of the opposing surface 201a.

[0025] The base 202 is a member that covers the surfaces of the porous member 201 except for the opposing surface 201a. In this embodiment, the base 202 is a rectangular box that is open at the bottom. The porous member 201 is inserted from the opening of the base 202 so that the bottom surface is exposed as the opposing surface 201a, and is assembled and fixed inside the base 202.

[0026] As shown in FIGS. 3 and 5, the top surface of the base 202 is provided with an air inlet 202a, an exhaust hole 202b, and a mounting hole 202c. The air inlet 202a is a through-hole for supplying air to the porous member 201. The air inlet 202a is formed near the outer edge of the base 202 for piping connected to the air inlet 202a. The exhaust hole 202b is a through-hole for generating negative pressure in the opening 201d via the suction hole 201c. The exhaust hole 202b extends downward and is formed to match the suction hole 201c of the porous member 201. A space for gas accumulation is formed between the inner surface of the base 202 and the porous member 201 around the exhaust hole 202b. The exhaust hole 202b may also pass through the suction hole 201c and reach the opposing surface 201a. In this case, suction holes 201c and openings 201d of porous member 201 are provided so as to be in close contact with the outside of exhaust holes 202b that reach opposing surface 201a of porous member 201. Mounting holes 202c are a pair of recessed holes that prevent misalignment when connecting with collet moving mechanism 22.

[0027] The air inlet 202a is connected to a gas supply circuit via a pipe (not shown). The supply circuit is configured to include a gas supply source, a pump, a valve, etc. Here, the gas supplied to the porous member 201 via the air inlet 202a is an inert gas. The exhaust hole 202b is connected to a negative pressure generating circuit including a vacuum pump, a valve, etc. via a pipe (not shown).

[0028] The collet moving mechanism 22 is a mechanism that moves the pickup head 21, to which the pickup collet 200 is attached, back and forth between a supply position P1 and a transfer position P2, and also moves the pickup head 21 up and down between the supply position P1 and the transfer position P2. The transfer position P2 is a position where the pickup device 20 transfers the electronic component 2 picked up at the supply position P1 to a bonding head 31 that functions as a receiving unit, which will be described later. The supply position P1 and the transfer position P2 refer mainly to positions in the XY directions, and do not necessarily refer to positions in the Z axis direction.

[0029] Furthermore, even when referring to the position (height) in the Z-axis direction, the height is assumed to have a predetermined width. The predetermined width includes the thickness of the electronic component 2, the distance to push up the electronic component 2, the distance over which the electronic component 2 can be picked up, etc., when transferring the electronic component 2. In particular, when referring to the position (height) in the Z-axis direction, at the supply position P1, the height at the approach position is assumed to be H1, and the height at the peeling position is assumed to be H2 (see FIG. 8).

[0030] The collet moving mechanism 22 has an arm 222a to which the pickup head 21 is attached, and by moving the arm 222a, the pickup collet 200 attached to the pickup head 21 is moved. A detachable part 222b is provided at the tip of the pickup head 21. The detachable part 222b has a magnet inside and attracts and holds the base 202 of the pickup collet 200 by the magnetic attraction. As shown in FIGS. 4 and 5, a pair of pins 222c are provided on the contact surface of the detachable part 222b with the base 202. The pins 222c fit into mounting holes 202c provided in the base 202, preventing the pickup collet 200 from shifting relative to the detachable part 222b. Although not shown, the piping connected to the exhaust hole 202b passes through the detachable part 222b, and the piping connected to the air inlet 202a is supported by the detachable part 222b.

[0031] The collet moving mechanism 22 includes a slide mechanism 221 and an elevating mechanism 222. The slide mechanism 221 moves an arm 222a to which the pickup head 21 is attached, thereby moving the pickup collet 200 back and forth between a supply position P1 and a transfer position P2. Here, the slide mechanism 221 extends parallel to the X-axis direction and includes a rail 221b fixed to a support frame 221a, and a slider 221c that runs on the rail 221b.

[0032] The lifting mechanism 222 moves the pickup collet 200 up and down by moving the arm 222a to which the pickup head 21 is attached. Specifically, the lifting mechanism 222 can use a ball screw mechanism driven by a servo motor. That is, the pickup collet 200 is raised and lowered along the Z-axis direction by driving the servo motor. The pickup collet 200 is elastically supported by the pickup head 21 via the detachable part 222b, and is provided so as to be slidable up and down in the Z-axis direction relative to the pickup head 21. The pickup head 21 has a sensor that detects this sliding movement.

[0033] The direction changing unit 23 is provided between the pickup collet 200 and the collet moving mechanism 22. Here, the direction changing unit 23 is an actuator including a drive source such as a motor that changes the direction of the pickup collet 200. The direction of the pickup collet 200 is defined as the direction from the base 202 side of the pickup collet 200 toward the opposing surface 201a. Changing the direction means rotating the pickup collet 200 by 0° to 180° in the vertical direction. For example, the pickup collet 200 with the opposing surface 201a facing the supply stage 12 sucks and holds the electronic component 2 at the supply position P1. Thereafter, the direction changing unit 23 changes the direction of the pickup collet 200 so that the suction surface faces upward. At this time, the rotation angle is 180°.

[0034] The push-up pin 24 is provided below the seat 11 of the supply device 10. The push-up pin 24 is a needle-shaped member with a sharp tip. The push-up pin 24 is provided inside the backup body 241 so that its length direction is parallel to the Z-axis direction.

[0035] The backup body 241 has a drive mechanism that advances or retreats the thrust pin 24 from or to its interior. This advancement or retreat occurs in the vertical direction. This drive mechanism is driven by, for example, an air cylinder or a cam mechanism.

[0036] [Onboard equipment] The mounting device 30 is a device that transports the electronic component 2 received from the pickup device 20 to a mounting position P3 and mounts it on a substrate. The mounting position P3 is a position where the electronic component 2 is mounted on a substrate. The mounting device 30 has a bonding head 31 and a head moving mechanism 32.

[0037] The bonding head 31 functions as a receiving unit that receives the electronic component 2 from the pickup collet 200 at the transfer position P2, and is also a device that mounts the electronic component 2 on the board at the mounting position P3. The bonding head 31 holds the electronic component 2, and after mounting, releases the held state to release the electronic component 2.

[0038] Specifically, the bonding head 31 has a nozzle 31a. The nozzle 31a holds the electronic component 2 and releases the held state to release the electronic component 2. The nozzle 31a has a nozzle hole. The nozzle hole opens to the suction surface at the tip of the nozzle 31a. The nozzle hole is connected to a negative pressure generating circuit (not shown) such as a vacuum pump, and the circuit generates negative pressure to suction and hold the electronic component 2 on the suction surface of the nozzle 31a. Furthermore, the held state of the electronic component 2 is released from the suction surface by releasing the negative pressure.

[0039] The head moving mechanism 32 is a mechanism that moves the bonding head 31 back and forth between the delivery position P2 and the mounting position P3, and also moves the bonding head 31 up and down between the delivery position P2 and the mounting position P3. Specifically, the head moving mechanism 32 includes a slide mechanism 321 and a lifting mechanism 322.

[0040] The slide mechanism 321 reciprocates the bonding head 31 between the transfer position P2 and the mounting position P3. Here, the slide mechanism 321 extends parallel to the X-axis direction and has two rails 321b fixed to a support frame 321a, and a slider 321c that runs on the rails 321b.

[0041] Although not shown, the slide mechanism 321 has a slide mechanism that slides the bonding head 31 in the Y-axis direction. This slide mechanism can also be configured with a rail in the Y-axis direction and a slider that runs on the rail. The lift mechanism 322 moves the bonding head 31 up and down. Specifically, the lift mechanism 322 can use a ball screw mechanism driven by a servo motor. That is, the bonding head 31 moves up and down along the Z-axis direction by driving the servo motor.

[0042] The substrate stage 60 is a platform that supports a substrate on which the electronic component 2 is to be mounted. The substrate stage 60 is provided on a stage movement mechanism 61. The stage movement mechanism 61 is a movement mechanism that slides the substrate stage 60 on the XY plane and aligns the planned mounting position of the electronic component 2 on the substrate with the mounting position P3. The stage movement mechanism 61 is, for example, a ball screw mechanism driven by a servo motor.

[0043] [Control device] The control device 50 controls the start, stop, speed, operation timing, etc. of the supply device 10, pickup device 20, mounting device 30, and substrate stage 60. In other words, the control device 50 is a control device for the transfer device 1 and mounting device 100. The control device 50 can be realized, for example, by a dedicated electronic circuit or a computer running on a predetermined program. The control device 50 is connected to an input device through which an operator inputs instructions and information necessary for control, and an output device through which the operator can check the status of the device. The input device can be a switch, touch panel, keyboard, mouse, etc. The output device can be a display unit such as a liquid crystal or organic electroluminescence (EL) display.

[0044] 6 is a functional block diagram of the control device 50. As shown in FIG. 6, the control device 50 has a supply device control unit 51, a push-up pin control unit 52, a pickup control unit 53, a bonding head control unit 54, a substrate stage control unit 56, and a memory unit 57.

[0045] The supply device control unit 51 controls the movement of the supply stage 12. That is, it controls the movement of the electronic components 2 to be picked up that are placed on the sheet 11. The push-up pin control unit 52 controls the movement of the push-up pins 24, that is, the operation of the backup body 241.

[0046] The pickup control unit 53 controls the movement of the pickup collet 200. That is, the pickup control unit 53 controls the operation of the collet moving mechanism 22 and the direction changing unit 23. The pickup control unit 53 also controls the supply circuit communicating with the air supply hole 202a and the negative pressure generating circuit communicating with the exhaust hole 202b, and controls the holding and release of the electronic component 2.

[0047] The bonding head control unit 54 controls the movement of the bonding head 31, i.e., the operation of the head moving mechanism 32. The bonding head control unit 54 also controls the negative pressure generating circuit that is connected to the nozzle hole of the bonding head 31, and controls the holding and release of the electronic component 2. The substrate stage control unit 56 controls the movement of the substrate stage 60, i.e., the operation of the stage moving mechanism 61.

[0048] The storage unit 57 is a recording medium including various types of memory, an HDD, an SSD, etc. The storage unit 57 pre-stores data and programs necessary for the operation of the transfer device 1, and also stores data necessary for the operation of the transfer device 1. This necessary data includes, for example, the gas supply amount, exhaust pressure, position coordinates of the supply position P1, the delivery position P2, and the mounting position P3, and the position coordinates of each movement mechanism. Each of the above-mentioned movement mechanisms controls the movement of each component based on these coordinates.

[0049] [Principle of suction holding by pickup collet] Next, the principle by which the pickup collet 200 described above can suction-hold the electronic component 2 will be described. As shown in FIG. 3A, the gas G supplied from the air supply holes 202a is ejected in a planar manner from the pores in the facing surface 201a, forming a gas layer between the electronic component 2 and the pickup collet 200. This layer is, for example, 2 to 10 μm thick. Then, with a negative pressure applied to the suction holes 201c by the negative pressure generating circuit, the facing surface 201a is brought close to the electronic component 2, thereby suction-holding the electronic component 2. At this time, because a gas layer is formed between the facing surface 201a and the electronic component 2, the facing surface 201a and the electronic component 2 remain out of contact with each other. Furthermore, by releasing the negative pressure generated by the negative pressure generating circuit, the negative pressure no longer acts on the suction holes 201c, and the electronic component 2 is released from the pickup collet 200.

[0050] [Operation] In the transfer device 1 as described above, the operation of picking up an electronic component 2 from the supply device 10 using the pickup device 20 and transferring the electronic component 2 to the mounting device 30 will be described below with reference to the flowchart in FIG. 7 and the explanatory diagram in FIG. 8 in addition to FIGS. 1 to 6.

[0051] First, the pickup device 20 and the supply device 10 move the pickup collet 200 to the supply position P1 where the push-up pins 24 are located, and the opposing surface 201a of the pickup collet 200 faces the push-up pins 24 (step S01). At this time, pressurized gas is supplied to the porous member 201 through the air supply hole 202a, and the gas is blown out from the opposing surface 201a. At this time, no exhaust is being performed from the exhaust hole 202b, and no suction is being performed from the opening 201d.

[0052] Meanwhile, the supply device 10 moves the supply stage 12 and positions the electronic component 2 to be picked up at the supply position P1, as shown in FIG. 8(A) (step S02). After this, the pickup collet 200, to which gas G is being supplied from the opposing surface 201a, descends together with the pickup head 21 and approaches the electronic component 2. When the pickup collet 200 approaches the electronic component 2, the gas G on the opposing surface 201a is sandwiched between the opposing surface 201a and the electronic component 2, forming a gas layer. The sandwiched gas layer at this time is considered to be a viscous flow layer. Then, as shown in FIG. 8(B), the pickup collet 200 stops descending toward the electronic component 2 due to the gas layer not being compressed any further (step S03).

[0053] Here, when the pickup collet 200 comes into contact with the electronic component 2, the pickup collet 200 itself stops. However, because the pickup collet 200 is elastically supported by the pickup head 21, even when the pickup collet 200 stops, the pickup head 21 continues to descend, sliding relative to the pickup collet 200. When this sliding is detected by a sensor, the pickup control unit 53 recognizes that the pickup collet 200 has come into contact with the electronic component 2 and stops the descent of the pickup head 21. At this time, the pickup collet 200 is not in contact with the electronic component 2. However, because a gas layer is formed between the opposing surface 201a and the electronic component 2, the opposing surface 201a cannot get any closer to the electronic component 2 and stops. The height position of the pickup collet 200 at this time is the approach position H1. In other words, the approach position H1 is not set in advance as a specific stop position.

[0054] In this way, with the pickup collet 200 stopped via the gas layer and the pickup head 21 also stopped, suction is started via the suction holes 201c by exhausting air from the exhaust holes 202b (step S04). That is, suction is started in a state where the pickup collet 200 presses the electronic component 2 against the sheet 11 supported by the backup body 241 via the gas layer, that is, in a state where the sheet 11 and the electronic component 2 are sandwiched between the pickup collet 200 and the backup body 241.

[0055] In this state, as shown in FIG. 8(C), the pickup collet 200 rises, and simultaneously, the push-up pins 24 begin to rise and push up (step S05). As a result, the sheet 11 begins to peel from the back surface of the electronic component 2. Furthermore, as shown in FIG. 8(D), the push-up pins 24 stop when they have risen a predetermined amount. Then, as the pickup collet 200 continues to rise, the electronic component 2, which has been sucked into the pickup collet 200 by negative pressure while maintaining a gap created by the gas layer, is peeled off from the sheet 11 and picked up (step S06). In this way, the height position at which the electronic component 2 is completely peeled off is the peeling position H2, but this is not a specific stop position that has been set in advance.

[0056] The pickup device 20 inverts the pickup collet 200 using the direction changing unit 23 (step S07). That is, the orientation of the pickup collet 200 is rotated 180° vertically so that the opposing surface 201a of the pickup collet 200 faces upward. Note that the inversion operation in step S07 is performed immediately after the electronic component 2 is picked up, but may be performed at any point between the supply position P1 and the transfer position P2.

[0057] The pickup device 20 moves the picked-up electronic component 2 to the transfer position P2 by the collet moving mechanism 22 (step S08). At the transfer position P2, the bonding head 31 of the mounting device 30 is waiting and faces the opposing surface 201a of the pickup collet 200 with the electronic component 2 interposed therebetween.

[0058] The bonding head 31 is lowered toward the pickup collet 200 positioned at the transfer position P2, and after the bonding head 31 holds the electronic component 2, the pickup collet 200 releases the negative pressure, thereby transferring the electronic component 2 from the pickup collet 200 to the bonding head 31 (step S09). After this, the bonding head 31 rises away from the pickup collet 200 and moves to the mounting position P3, where the electronic component 2 is mounted on the board.

[0059] [effect] (1) The pickup collet 200 of this embodiment is a pickup collet 200 that sucks and holds an electronic component 2 to pick it up, and has a porous member 201 that is breathable and supplies gas supplied to the interior through pores in an opposing surface 201a that faces the electronic component 2, and the porous member 201 has a suction hole 201c on the opposing surface 201a that has an opening 201d that sucks the electronic component 2 to the opposing surface 201a by negative pressure.

[0060] In addition, the pickup device 20 of this embodiment has a collet moving mechanism 22 that moves the pickup collet 200 close to a position where it can suction-hold the electronic component 2 on the sheet 11, and peels the suction-held electronic component 2 off the sheet 11 so that it can be transported.

[0061] Furthermore, the mounting device 100 of this embodiment has a bonding head 31 that is movable relative to the pickup collet 200 and receives the electronic component 2 from the tip of the pickup collet 200, and a mounting section that transfers the electronic component 2 held by the bonding head 31 to a substrate and mounts it thereon.

[0062] Therefore, when the electronic component 2 is picked up by suction through the suction holes 201c, the layer of gas discharged from the pores of the porous member 201 can keep the electronic component 2 from contacting the opposing surface 201a, thereby preventing damage to the electronic component 2. Furthermore, even when the electronic component 2 is being transferred, the electronic component 2 can be held and prevented from falling while reducing the possibility of the electronic component 2 being damaged by contact with the opposing surface 201a.

[0063] Consider a case in which electronic component 2 is held by a Bernoulli chuck, which generates a suction force by using the negative pressure generated by a large amount of airflow generated by flowing gas from the space between electronic component 2 and the surface facing electronic component 2. In this case, the suction force is very weak, and even if electronic component 2 can be held at a certain distance from the collet, it is not strong enough to remove electronic component 2 from sheet 11. Furthermore, since a very large amount of gas flow per unit time is required to achieve the Bernoulli effect, it is very difficult to adjust the suction force required for holding electronic component 2 while maintaining non-contact. Furthermore, blowing a large amount of gas around the pickup location may generate particles.

[0064] Furthermore, even if gas outlet holes of the same size as the suction holes are provided on the surface of the collet facing the electronic component 2, rather than pores like those in the porous member 201, and gas is sprayed toward the electronic component 2 to levitate it, and then the electronic component 2 is sucked up through the suction holes against the levitation force of the electronic component 2 caused by this spray, it is extremely difficult to adjust the suction force to hold the electronic component 2 while maintaining non-contact (levitation), as described above, and there is a risk of particles being generated due to the large amount of gas being blown out around the pickup location.

[0065] In contrast, in this embodiment, the flow rate of the gas blown out from the entire opposing surface 201a through the fine holes in the opposing surface 201a is extremely small. Therefore, there is no risk of generating particles. The gas blown out from the opposing surface 201a does not actively levitate the electronic component 2, but rather forms a viscous gas layer when the opposing surface 201a and the electronic component 2 come close to each other. Therefore, the stronger the suction force, the easier it is to keep the opposing surface 201a and the electronic component 2 out of contact. Even if the suction force due to the negative pressure from the suction holes 201c is strong enough to peel the electronic component 2 off the sheet 11, the gas layer between the opposing surface 201a and the electronic component 2 prevents contact, making it easy to obtain a strong suction force and to adjust the suction force.

[0066] As a result of investigations by the inventors of the present application, it was found that, for example, under the following conditions, the pickup collet 200 can suck and hold the electronic component 2 while maintaining non-contact with it. First, the porous member 201 used had an air permeability such that, for example, when the supply pressure was 0.3 MPa, the flow rate of the gas flowing out of the porous member 201 was approximately 0.7 L / min. The pressure of the gas (nitrogen gas) supplied to the porous member 201 was sufficient to be in the range of approximately 0.1 to 0.7 MPa. At this time, the flow rate of the gas flowing through the porous member 201 was in the range of approximately 0.3 to 1.5 L / min, and non-contact between the pickup collet 200 and the electronic component 2 could be reliably maintained. Furthermore, the suction pressure was in the range of -10 to -90 kPa, and the electronic component 2 could be reliably picked up from the sheet 11. At this time, the pressure in the gas layer between the electronic component 2 and the facing surface 201a was 0.1 to 0.5 MPa.

[0067] As a comparative example, a stainless steel (SUS) collet with the same size as the pickup collet 200 was used. When 50 0.3 mm diameter holes were arranged in a matrix on this collet and gas was supplied from the holes at a pressure of 0.02 MPa, the pressure between the electronic component 2 and the facing surface 201a, at which the suction pressure was -50 kPa and the electronic component 2 could maintain non-contact with the facing surface 201a, was extremely small at 0.025 to 0.035 MPa, and the range of this pressure was also narrow. In other words, unlike the pores in the porous member 201, when gas was blown through the multiple holes formed in the collet, even a slight pressure or suction force, or even a slight change in the pressure or suction force, easily caused the electronic component 2 to come into contact with the facing surface. Furthermore, when the supply pressure was increased to increase the pressure between the electronic component 2 and the facing surface 201a, the electronic component 2 easily fell off.

[0068] (2) When the facing surface 201a faces the electronic component 2, the opening 201d is provided within the projection plane of the electronic component 2, i.e., at a position overlapping the electronic component 2. In this embodiment, one opening 201d communicating with the suction hole 201c is provided in the center of the facing surface 201a. This prevents gas from flowing in from the outer edge of the electronic component 2, and a strong suction force can be ensured by utilizing atmospheric pressure. Note that there may be multiple openings 201d, and their positions are not limited to the center as long as they are positions where the facing surface 201a overlaps the electronic component 2.

[0069] [Variations] The present invention is not limited to the above-described embodiment, and the following modifications can also be applied while maintaining the same basic configuration as the above-described embodiment. (1) The number and size of the suction holes 201c and the openings 201d are not limited to the above. The suction-holding state and the non-contact state can be maintained by balancing the area of ​​the facing surface 201a of the porous member 201 where the electronic component 2 is supported by the gas layer and the total area of ​​the openings 201d.

[0070] (2) The positions and shapes of the suction holes 201c and the openings 201d are not limited to the above-described embodiments. With the opposing surface 201a facing a rectangular electronic component 2, the openings 201d may be provided at positions overlapping with multiple edge portions of the electronic component 2. For example, the openings 201d may be provided at positions overlapping with opposing edge portions of the electronic component 2 at intervals. More specifically, as shown in FIGS. 9(A) and 9(B), the openings 201d may be provided at positions overlapping with at least one of the four corners of the electronic component 2 indicated by dotted lines (four in FIG. 9). FIG. 9(A) shows an example of a circular opening 201d, and FIG. 9(B) shows an example of a rectangular opening 201d.

[0071] In this way, by positioning the openings 201d so that they overlap multiple edges of the electronic component 2 with a gap therebetween, misalignment of the electronic component 2 can be suppressed. FIG. 10 is a schematic diagram illustrating this function, showing a cross section of a diagonal line including the openings 201d at two opposing corners in FIG. 9A. As shown in FIG. 10A, air is drawn in through the openings that overlap the edges of the electronic component 2, generating an airflow that passes through the edges of the electronic component 2, creating a negative pressure area outside the electronic component 2. As shown in FIG. 10B, when the electronic component 2 shifts to one side (e.g., the left side of the figure), the airflow passing through one edge of the electronic component 2 decreases and the airflow passing through the other edge (e.g., the right side of the figure) increases, causing the negative pressure area on the other side of the electronic component 2 to expand more than the negative pressure area on the other side. As a result, the force toward one side decreases and the force toward the other side increases, causing the electronic component 2 to move to the other side and stop where the forces are balanced, thereby correcting the misalignment.

[0072] In the example of FIG. 9, the electronic component 2 is pulled point-symmetrically with respect to the center of the opposing surface 201a by the negative pressure areas generated near the openings 201d provided at the four corners, so that the electronic component 2 is positioned at the center of the pickup collet 200.

[0073] In this way, deviation of the electronic component 2 from the pickup collet 200 is corrected, so that positional deviation is less likely to occur when the electronic component 2 is turned over, transported, or delivered. Furthermore, even if the acceleration / deceleration speed is increased, deviation is less likely to occur, so the takt time can be shortened.

[0074] The shape of the opening 201d may be circular or rectangular as described above, or may be other shapes such as an ellipse, a polygon, a rounded polygon, a star, etc. Furthermore, as will be described later, the opening 201d may be groove-shaped so as to surround the outer edge of the electronic component 2.

[0075] As described above, when the opening 201d is provided at a position overlapping with multiple edge portions of the electronic component 2 with a gap when the facing surface 201a faces the electronic component 2, the opening 201d may be provided at a position overlapping with at least one of the four corners of the electronic component with a gap. Therefore, the opening 201d may be provided at a position overlapping with two opposing sides, two adjacent sides, three sides, or four sides of the four sides of the rectangular electronic component 2 (see FIG. 11(A)). Alternatively, the opening 201d may be provided at a position overlapping with one corner, two corners, or three corners. By providing multiple openings, the force for correcting misalignment can be increased. If at least one corner is provided, force can be applied to two sides simultaneously. Furthermore, the opening 201d may be provided at a position overlapping with the outer edge of the electronic component 2 (see FIG. 11(B)). In this case, the opening 201d is a groove, and suction is applied from the suction hole 201c that communicates with the depth of the groove.

[0076] The openings 201d positioned to overlap the outer edge of the electronic component 2 as described above may or may not be located next to the openings 201d within the projection plane of the electronic component 2, as in the aforementioned opening 201d provided in the central portion. For example, the openings 201d within the projection plane of the electronic component 2 are set to have a suction force necessary to hold the electronic component 2 and peel it off from the sheet 11, while the peripheral openings 201d positioned to overlap the outer edge of the electronic component 2 are set to have a suction force necessary to prevent misalignment. In this case, the openings 201d within the projection plane of the electronic component 2 and the peripheral openings 201d may be independent suction holes 201c from each other, or may be branched from a common suction hole 201c to form separate openings 201d, thereby simplifying the structure.

[0077] Furthermore, the central opening 201d does not have to be provided. For example, as described above, only the opening 201d that is positioned to overlap the outer edge of the electronic component 2 may be provided. In this case, by applying the suction force required to peel the electronic component 2 from the sheet 11 to the opening 201d that overlaps the outer edge, the electronic component 2 can be sucked and positioned.

[0078] Furthermore, as shown in FIGS. 12(A) and 12(B), the openings 201d within the projection plane of the electronic component 2 may be positioned at a location other than the center, and the positioning thereof may be determined as appropriate. For example, as shown in FIG. 12(A), the openings 201d may be positioned to correspond to the corners of the electronic component 2. Furthermore, as shown in FIG. 12(B), the openings 201d may be positioned to correspond to each side of the electronic component 2. The positions and number of the openings 201d can be determined as appropriate as long as the electronic component 2 can be sucked in. Note that in FIG. 12(B), the openings 201d that overlap the outer edge of the electronic component 2 are shown with different shapes and positions. However, this means that various shapes of the openings 201d may be combined, and it is not necessary to include all of the shapes shown.

[0079] Furthermore, the suction hole 201c and the opening 201d are not limited to being formed by through holes in the porous member 201. Part of the suction hole 201c and the opening 201d may be formed by part of another member, such as the inner wall of the base 202. For example, as shown in FIG. 13(A), one side of the suction hole 201c and one side of the opening 201d may form the inner wall of the base 202, or as shown in FIG. 13(B), two orthogonal side surfaces of the suction hole 201c and two orthogonal sides of the opening 201d may form inner corners of the base 202. In this case, a groove is formed in the porous member 201, and the suction hole 201c formed in the porous member 201 also includes an embodiment in which the pickup collet 200 has the suction hole 201c.

[0080] (3) By providing the pickup collet 200 as replaceable, it can be replaced depending on the shape and size of the electronic component 2. A simple structure for this replacement, which can be attracted and held by a magnet, makes the replacement process easy. However, any structure can be used as long as the pickup collet 200 is replaceable. For example, it can be held by suction using negative pressure, or it can be held mechanically.

[0081] [Other embodiments] The present invention is not limited to the above-described embodiments, but also includes other embodiments described below. The present invention also includes a combination of all or any of the above-described embodiments and the other embodiments described below. Furthermore, various omissions, substitutions, and modifications can be made to these embodiments without departing from the scope of the invention, and such modifications are also included in the present invention. [Explanation of symbols]

[0082] 1 Transfer device 2. Electronic Components 10 Feeding device 11 sheets 12 Supply Stage 13 Stage movement mechanism 20 Pickup device 21 Pickup head 22 Collet movement mechanism 23 Turning point 24 Push-up pin 30 Onboard equipment 31 Bonding head 31a Nozzle 32 Head movement mechanism 50 Control device 51 Supply device control section 52 Push-up pin control section 53 Pickup control section 54 Bonding head control unit 56 Substrate stage control unit 57 Memory section 60 Substrate Stage 61 Stage movement mechanism 100 Mounting equipment 200 Pickup Collet 201 Porous materials 201a Opposite side 201b back 201c Suction hole 201d aperture 202 Base 202a Air intake 202b Exhaust hole 202c mounting hole 221 Slide mechanism 221a Support frame 221b Rail 221c slider 222 Lifting mechanism 222a Arm 222b Detachable part 222c pin 241 Backup 321 Slide mechanism 321a Support frame 321b Rail 321c slider 322 Lifting mechanism

Claims

1. A pickup collet that picks up electronic components by suction and holding them, a porous member having air permeability and supplying gas supplied to the interior through pores on a surface facing the electronic component; the porous member is provided with a suction hole having an opening for sucking the electronic component to the opposing surface by negative pressure; A pickup collet characterized in that, when the opposing surface faces the rectangular electronic component, the opening is provided at a position overlapping at least two diagonally positioned corners of the four corners of the electronic component, and / or at a position overlapping with the edges of the four sides.

2. 2. The pickup collet according to claim 1, wherein the electronic component is held on the opposing surface via a gas layer formed by gas supplied from the opposing surface when the suction hole is under negative pressure.

3. 3. The pickup collet according to claim 1, wherein the opening is provided at a position that surrounds and overlaps the outer edge of the rectangular electronic component when the facing surface faces the rectangular electronic component.

4. A pickup device that picks up the electronic components from a sheet to which the electronic components are attached, A pickup collet according to any one of claims 1 to 3; a collet moving mechanism that moves the pickup collet close to a position on the sheet where the electronic component can be sucked and held, and peels the sucked and held electronic component from the sheet and transfers it; A pickup device comprising:

5. The pickup device according to claim 4, a bonding head that is provided so as to be movable relative to the pickup collet and that receives the electronic component from the pickup collet; a mounting unit that transfers the electronic component held by the bonding head to a substrate and mounts it thereon; A mounting device comprising:

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