Cooling unit, objective lens module and semiconductor inspection device

Abstract

To provide a cooling unit, an objective lens module and a semiconductor which have improvable waterproof performance.SOLUTION: A cooling unit 21 comprises a jacket 31 for dissipating the heat of a semiconductor device. The jacket 31 has a center portion 32 and an outside portion 33. An opening for disposing a solid immersion lens is formed in the center portion 32. The center portion 32 has a space demarcation plane 32a demarcating a space S1 between the semiconductor device and the center portion. A supply flow channel in which cooling fluid supplied to the space S1 flows is formed in the jacket 31. The outside portion 33 constitutes a contact portion 39 which is in contact with a stage where the semiconductor device is disposed and demarcates the outer edge of the space S1. A groove portion 51 constituted in such a manner that the cooling fluid flows down from the space demarcation plane 32a to the groove 51 is formed between the center portion 32 and the outside portion 33 of the jacket 31, a discharge flow channel 62 in which the cooling fluid discharged to the outside flows is connected to the groove 51.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present invention relates to a cooling unit, an objective lens module, and a semiconductor inspection device. [Background technology]

[0002] Patent Documents 1 to 4 describe cooling units used in the inspection of semiconductor devices. These cooling units are used to observe semiconductor devices while cooling them during operation. In the cooling units described in Patent Documents 1 to 3, the semiconductor devices are cooled by spraying a cooling liquid onto the semiconductor devices. In the cooling unit described in Patent Document 4, the cooling unit is arranged so that a space is formed between the cooling unit and the semiconductor devices, and a cooling fluid is flowed into the space from a supply flow path provided in the cooling unit, thereby cooling the semiconductor devices. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] U.S. Patent No. 6,621,275 [Patent Document 2] Special Publication No. 2006-519359 [Patent Document 3] U.S. Patent Publication No. 2009-0095097 [Patent Document 4] Japanese Patent Application Publication No. 2020-106361 Summary of the Invention [Problem to be solved by the invention]

[0004] In the cooling unit described in Patent Document 4, an elastic member is disposed on the periphery of the cooling unit, and the outer edge of the above-mentioned space is sealed by the elastic member contacting the stage on which the semiconductor device is placed. Such a cooling unit is required to have improved waterproof performance and to prevent the cooling fluid from leaking from the outer edge of the space.

[0005] SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a cooling unit, an objective lens module, and a semiconductor inspection device that can improve waterproof performance. [Means for solving the problem]

[0006] The cooling unit of the present invention is a cooling unit used in inspecting semiconductor devices, and is equipped with a jacket for dissipating heat from the semiconductor device, the jacket having a central portion and an outer portion located around the central portion, the central portion having an opening through which light from the semiconductor device passes, the outer portion having a contact portion that comes into contact with a stage on which the semiconductor device is placed, the jacket having a supply flow path through which a cooling fluid for cooling the semiconductor device flows, and a groove portion formed between the central portion and the outer portion of the jacket so that the cooling fluid flows down from the upper surface of the central portion, and the groove portion is connected to a discharge flow path through which the cooling fluid flows to be discharged to the outside.

[0007] In this cooling unit, a groove is formed between the central portion and the outer portion of the jacket, allowing the cooling fluid to flow down from the upper surface of the central portion, and a discharge flow path through which the cooling fluid flows to be discharged to the outside is connected to the groove. This prevents the cooling fluid from reaching the outer edge of the space when the semiconductor device is cooled by flowing the cooling fluid from the supply flow path into the space formed by the contact portion of the outer portion in contact with the stage. As a result, leakage of the cooling fluid from the outer edge of the space can be prevented, improving waterproof performance.

[0008] A bridge portion may be formed between the central portion and the outer portion of the jacket to connect the central portion and the outer portion, and the supply flow path may be formed to pass through the bridge portion. In this case, the supply flow path can be formed appropriately.

[0009] A bridge portion that connects the central portion and the outer portion to each other may be formed between the central portion and the outer portion of the jacket, and the surface of the bridge portion connected to the upper surface of the central portion may have a portion that is located lower than the upper surface of the central portion. In this case, since the surface of the bridge portion connected to the upper surface of the central portion has a portion that is located lower than the upper surface of the central portion, it is possible to prevent the cooling fluid from flowing along the surface from the upper surface of the central portion to the outer edge of the space.

[0010] The groove may have a first portion and a second portion located on the opposite side of the central portion's top surface from the first portion in a direction perpendicular to the central portion's top surface, the second portion being narrower than the first portion, and the discharge channel may be connected to the second portion. In this case, the first portion located on the central portion's top surface side may be widened to increase the opening area of ​​the groove, making it easier for the cooling fluid to flow into the groove. Furthermore, the second portion located on the opposite side of the central portion's top surface may be narrowed to make it easier for the cooling fluid to accumulate in the second portion, thereby allowing the cooling fluid to be efficiently discharged from the discharge channel connected to the second portion.

[0011] The side where the central portion is located relative to the outer portion is defined as the inner side, the side where the outer portion is located relative to the central portion is defined as the outer side, and the side where the groove portion is located relative to the upper surface of the central portion is defined as the lower side. In this case, the volume of the groove portion can be increased and the cooling fluid that flows into the groove portion can be preferably directed downward.

[0012] The groove may have a ring-shaped portion that surrounds the upper surface when viewed from a direction perpendicular to the upper surface of the central portion. In this case, the cooling fluid can be efficiently stored in the groove and efficiently discharged to the outside.

[0013] The jacket has an air passage connecting the space formed by the contact portion of the outer portion contacting the stage to the outside of the jacket, allowing air to circulate between the space and the outside of the jacket. The air passage may be connected to a groove. In this case, the pressure in the space can be prevented from becoming negative. Therefore, when moving the cooling unit along the stage on which the semiconductor devices are placed while a cooling fluid is flowing, it is possible to avoid a situation in which the cooling unit sticks to the stage due to negative pressure, making it impossible to move the cooling unit or reducing the movement accuracy. As a result, it is possible to move the cooling unit with high accuracy while a cooling fluid is flowing.

[0014] The objective lens module of the present invention includes the cooling unit, an immersion lens disposed in the opening, and an objective lens facing the immersion lens. This objective lens module can improve waterproof performance for the reasons described above.

[0015] The semiconductor inspection device of the present invention includes the cooling unit, an immersion lens placed in the opening, a stage on which a semiconductor device is placed, an objective lens facing the immersion lens, and a photodetector that detects light from the semiconductor device through the immersion lens and the objective lens. For the reasons described above, this semiconductor inspection device can improve waterproof performance. [Effects of the Invention]

[0016] According to the present invention, it is possible to provide a cooling unit, an objective lens module, and a semiconductor inspection device that can improve waterproof performance. [Brief explanation of the drawings]

[0017] [Figure 1] 1 is a configuration diagram of a semiconductor inspection device according to an embodiment; [Figure 2] FIG. 2 is a cross-sectional view of the periphery of the objective lens module. [Figure 3]FIG. 2 is a plan view of an objective lens module. [Figure 4] 4 is a cross-sectional view of the cooling unit taken along line IV-IV in FIG. 3, and is a partially enlarged view of FIG. 2. [Figure 5] 4 is a cross-sectional view of the cooling unit taken along line VV in FIG. 3. [Figure 6] FIG. 6 is a partially enlarged view of FIG. 5. [Figure 7] 7 is a cross-sectional view of the cooling unit taken along line VII-VII in FIG. 3. [Figure 8] FIG. 8 is a partially enlarged view of FIG. [Figure 9] FIG. 2 is a perspective view of an objective lens module. [Figure 10] FIG. [Figure 11] 5A and 5B are diagrams illustrating the operation of the objective lens module according to the embodiment. [Figure 12] 5A and 5B are diagrams illustrating the operation of the objective lens module according to the embodiment. [Figure 13] 10(a) and 10(b) are diagrams for explaining the operation of the objective lens module according to the first modified example. [Figure 14] 10(a) and 10(b) are diagrams for explaining the operation of the objective lens module according to the first modified example. [Figure 15] FIG. 10 is a plan view of an objective lens module according to a second modified example. DETAILED DESCRIPTION OF THE INVENTION

[0018] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description, the same or equivalent elements are designated by the same reference numerals, and redundant description will be omitted. [Semiconductor inspection equipment]

[0019] 1 is an apparatus for observing and inspecting a semiconductor device 2, which is a device under test (DUT). The semiconductor inspection apparatus 1 is used, for example, to identify a fault location in the semiconductor device 2.

[0020] The semiconductor device 2 is, for example, a device including a logic LSI (Large Scale Integration). The logic LSI is composed of transistors with a MOS (Metal-Oxide-Semiconductor) structure, bipolar transistors, etc. The power consumption of the semiconductor device 2 is, for example, about 200 W. The semiconductor device 2 is placed (fixed) on a stage 3.

[0021] The semiconductor inspection apparatus 1 includes a signal input device 11, a light source 12, an optical system 13, a photodetector 14, and a control unit 15. The signal input device 11 is electrically connected to the semiconductor device 2 and inputs a signal to the semiconductor device 2 to drive the semiconductor device 2. The signal input device 11 is, for example, a pulse generator that applies a stimulus signal to the semiconductor device 2, or a tester unit that inputs a test signal to the semiconductor device 2. The signal input device 11 repeatedly inputs a signal such as a predetermined test pattern to the semiconductor device 2. The signal input by the signal input device 11 may be a modulated voltage signal or a DC voltage signal.

[0022] The light source 12 outputs light that illuminates the semiconductor device 2. The light source 12 is, for example, an LED (Light Emitting Diode), an LD (Laser Diode), an SLD (Super Luminescent Diode), a lamp light source, or the like. The wavelength of the light output from the light source 12 may be, for example, 1064 nm or more. The light output from the light source 12 is guided to the optical system 13.

[0023] The optical system 13 guides the light output from the light source 12 to the surface 2a of the semiconductor device 2 and guides the light from the surface 2a of the semiconductor device 2 to the photodetector 14. The optical system 13 includes, for example, an objective lens 16, an optical scanner (not shown), and a beam splitter (not shown). The objective lens 16 focuses the light output from the light source 12 and guided by the beam splitter and the optical scanner onto an observation area or scans the observation area. The optical system 13 is mounted on, for example, an XYZ stage (not shown). If the direction parallel to the optical axis of the objective lens 16 is defined as the Z direction, the XYZ stage is configured to be movable in the Z direction as well as in the X and Y directions perpendicular to the Z direction. The observation area is determined by the position of the XYZ stage.

[0024] Light output from the light source 12 and emitted from the optical system 13 is reflected by the semiconductor device 2 during operation and enters the photodetector 14 via the optical system 13. At this time, the intensity of the light reflected by the semiconductor device 2 is modulated according to the operating state of the semiconductor device 2.

[0025] The photodetector 14 detects the light modulated by the semiconductor device 2 and outputs waveform data. The photodetector 14 may also detect light incident on the semiconductor device 2 while the light is being scanned by the optical scanner, and output a measurement image. Based on this waveform data and measurement image, a fault location in the semiconductor device 2 can be identified.

[0026] The photodetector 14 may detect the light incident on the semiconductor device 2 while the light is being scanned over the semiconductor device 2, and output a pattern image. The pattern image is an image captured so as to enable confirmation of the circuit pattern of the semiconductor device 2. As the photodetector 14, for example, a photodiode, an APD (Avalanche Photodiode), a SiPM (Silicon Photomultiplier), or the like that can detect light of a wavelength that passes through the substrate of the semiconductor device 2 may be used.

[0027] The control unit 15 is electrically connected to the signal input device 11, the light source 12, the optical system 13, the photodetector 14, etc., and controls the entire semiconductor inspection apparatus 1. The control unit 15 is configured, for example, by a computer including a processor (CPU: Central Processing Unit) and storage media such as RAM (Random Access Memory), ROM (Read Only Memory), and HDD (Hard Disk Drive). The control unit 15 executes processing by the processor on data stored in the storage media. The control unit 15 performs processing to identify fault locations in the semiconductor device 2, for example, based on the detection results of the photodetector 14. [Configuration for cooling semiconductor devices]

[0028] The semiconductor inspection apparatus 1 further includes a cooling unit 21, a storage tank 22, four regulators (pressure adjustment units) 23, a drain tank 24, and a chiller 25. The cooling unit 21, the storage tank 22, the regulators 23, the drain tank 24, and the chiller 25 are used to cool the semiconductor device 2 during inspection. The cooling unit 21 is combined with the objective lens 16 to form an objective lens module 70. [Cooling unit]

[0029] 2 to 10, the cooling unit 21 will be described. The cooling unit 21 is disposed to face the semiconductor device 2, and defines a space (gap) S1 between the cooling unit 21 and the semiconductor device 2. In the semiconductor inspection apparatus 1, the semiconductor device 2 is cooled by flowing a cooling fluid 5 through the space S1. The cooling fluid 5 is, for example, water or pure water, but may also be a Fluorinert (registered trademark)-based liquid having electrical insulation properties.

[0030] The cooling unit 21 is arranged (attached to the stage 3) so as to be in contact with the stage 3 on which the semiconductor device 2 is arranged. In this example, the stage 3 includes a DUT board 3a and a holder 3b. The DUT board 3a is formed, for example, in a plate shape and forms a connection portion between the signal input device 11 and the semiconductor device 2. The DUT board 3a may have a socket built in that forms a connection portion between the signal input device 11 and the semiconductor device 2. In this example, the semiconductor device 2 has a package 2b and a die 2c protruding from the package 2b. As an example, the package 2b is a PC board, and the die 2c is a semiconductor portion mounted (bonded) on the package 2b.

[0031] The holding portion 3b is fixed to the DUT board 3a and holds the semiconductor device 2. The holding portion 3b is formed, for example, in a plate shape from metal. The holding portion 3b has an opening 3c in which the semiconductor device 2 is placed. The holding portion 3b has a locking portion 3d that comes into contact with the periphery of the package of the semiconductor device 2 and locks onto the semiconductor device 2 so that the semiconductor device 2 does not fall out of the opening 3c.

[0032] The cooling unit 21 includes a jacket 31 for dissipating heat from the semiconductor device 2. The jacket 31 is formed, for example, from a metal material in a substantially cylindrical shape with a bottom. The jacket 31 is disposed so as to face the semiconductor device 2 and the holder 3b. The above-mentioned objective lens 16 is disposed within the jacket 31.

[0033] In the following description, the direction parallel to the optical axis L of the objective lens 16 will be referred to as direction D1. Direction D1 is a direction parallel to the Z direction described above. Furthermore, when the semiconductor device 2 arranged on the stage 3 and the objective lens 16 face each other, the side where the objective lens 16 is located relative to the semiconductor device 2 will be referred to as the lower side, and the side where the semiconductor device 2 is located relative to the objective lens 16 will be referred to as the upper side. The cooling unit 21 is used with the semiconductor device 2 located above the objective lens 16 in the vertical direction.

[0034] When viewed from direction D1, the jacket 31 has a central portion 32, an outer portion 33, and an intermediate portion 34. The arrangement and shape of each portion when viewed from direction D1 will be described below. The central portion 32 is a portion that includes the center of the jacket 31, and in this example, is a circular portion. The outer portion 33 is a portion that is located around the central portion 32 and surrounds it. In this example, the outer portion 33 is an annular portion that forms the outer edge (outer periphery) of the jacket 31. The intermediate portion 34 is a portion that is located between the central portion 32 and the outer portion 33. The intermediate portion 34 is located inside the outer portion 33 and surrounds the central portion 32. In this example, the intermediate portion 34 is an annular portion. In the following description, the side where the central portion 32 is located relative to the outer portion 33 will be referred to as the inner side (radially inner side), and the side where the outer portion 33 is located relative to the central portion 32 will be referred to as the outer side (radially outer side).

[0035] As described above, the jacket 31 is formed in a generally cylindrical shape with a bottom, and is generally composed of a first member M1 constituting a portion including the upper bottom, a second member M2 constituting a cylindrical portion, and a third member M3 constituting a portion including the lower bottom. The jacket 31 is formed by connecting the first member M1 and the second member M2 to each other and connecting the second member M2 and the third member M3 to each other. The central portion 32 is formed from the first member M1, and the outer portion 33 and the intermediate portion 34 are each formed from the first member M1 and the second member M2. The central portion 32 is formed in a generally circular plate shape, and the outer portion 33 and the intermediate portion 34 are formed in a generally circular ring plate shape (cylindrical shape) that is thicker than the central portion 32.

[0036] An opening 35 is formed in the central portion 32, penetrating the central portion 32 along direction D1. When viewed from direction D1, the opening 35 has, for example, a substantially circular shape. The opening 35 is located on the optical axis L, and light from the semiconductor device 2 passes through the opening 35. A solid immersion lens 72, into which the light from the semiconductor device 2 is incident, is disposed in the opening 35. The solid immersion lens 72 will be described in detail later.

[0037] As shown in FIGS. 3 and 4, a flexible member 45 and fixing members 37 and 38 are further arranged in the opening 35. The flexible member 45 is formed of a resin such as silicone (for example, silicone rubber), and has a shape in which a planar member is partially bent like an accordion. The flexible member 45 has an opening in its center, and a solid immersion lens 72 is arranged in this opening. The flexible member 45 contacts the peripheral portion of the solid immersion lens 72 at the edge of the opening, thereby forming a watertight seal between the solid immersion lens 72 and the flexible member 45. The flexible member 45 is fixed to the central portion 32 by fixing members 37 and 38. The fixing member 37 is formed in the shape of an annular plate, and is fixed to the flexible member 45 by a fastening member 37a such as a bolt. The fixing member 38 is formed in the shape of an annular plate, and is arranged so as to surround the fixing member 37. The fixing member 38 is fixed to the central portion 32 by fastening members 38a such as bolts, and sandwiches the outer edge of the flexible member 45 between itself and the protrusions 35a formed on the edge of the opening 35. This provides a watertight seal between the flexible member 45 and the central portion 32.

[0038] When the cooling unit 21 is attached to the stage 3 (when the opening 35 faces the semiconductor device 2), the central portion 32 has a space-defining surface 32a that faces the semiconductor device 2 and defines a space S1 between the semiconductor device 2 and the central portion 32. The space-defining surface 32a is the upper surface of the central portion 32. In this example, the space-defining surface 32a is an annular flat surface extending along a plane perpendicular to the direction D1, and faces the semiconductor device 2 and the holder 3b. When viewed from the direction D1, the space-defining surface 32a is adjacent to the opening 35 and surrounds the opening 35. The thickness of the space S1 (the minimum thickness in the direction D1, i.e., the distance between the die 2c and the space-defining surface 32a in the direction D1) is, for example, approximately 0.05 mm or more and 1.0 mm or less.

[0039] The outer portion 33 has a contact portion 39 that contacts the stage 3 to define the outer edge of the space S1. That is, the space S1 is formed when the contact portion 39 of the outer portion 33 contacts the stage 3. A pair of arrangement grooves 33b is formed on the upper surface 33a of the outer portion 33, in which elastic members 41 and 42 are respectively arranged (FIG. 4). The elastic members 41 and 42 are members, such as O-rings, that are sandwiched between the jacket 31 and the holding portion 3b to seal the outer edge of the space S1. As shown in FIG. 3, the elastic members 41 and 42 are formed, for example, in a ring shape. In FIG. 3, the elastic members 41 and 42 are indicated by hatching for ease of understanding. In this example, the outer portion 33 and the elastic members 41 and 42 form the contact portion 39 that contacts the stage 3 to define the outer edge of the space S1.

[0040] As shown in FIGS. 3, 5, and 6, a groove 51 is formed in the intermediate portion 34, allowing the cooling fluid 5 to flow down from the space defining surface 32a. The groove 51 includes a first portion 52 and a second portion 53 located below the first portion 52 in the direction D1 (on the opposite side from the space defining surface 32a). The first portion 52 is generally ring-shaped and extends circumferentially when viewed from the direction D1. However, the first portion 52 is divided into multiple portions 52a by multiple (eight in this example) bridge portions 36. That is, the first portion 52 includes multiple portions 52a (pocket portions) separated by adjacent bridge portions 36. Each portion 52a has a generally annular sector shape when viewed from the direction D1. Each bridge portion 36 connects the central portion 32 and the outer portion 33 to each other. The multiple bridge portions 36 are arranged at regular intervals in the circumferential direction. Each bridge portion 36 is formed by a wall portion extending along the radial direction.

[0041] As shown in FIG. 4, the upper surface 36a of the bridge portion 36 has a portion 36b located lower than the space-defining surface 32a. The upper surface 36a is a surface of the bridge portion 36 connected to the space-defining surface 32a. In this example, the portion 36b is formed by forming a recess in the upper surface 36a. The portion 36b has an inclined surface 36b1 connected to the outer edge of the space-defining surface 32a, a flat surface 36b2 connected to the outer edge of the inclined surface 36b1, an inclined surface 36b3 connected to the outer edge of the flat surface 36b2, and a flat surface 36b4 connected to the outer edge of the inclined surface 36b3. The inclined surfaces 36b1 and 36b3 are inclined outward as they extend downward. The inclination angle of the inclined surface 36b3 relative to a plane parallel to the space-defining surface 32a is greater than the inclination angle of the inclined surface 36b1 relative to the plane. The flat surface 36b4 forms the bottom surface of the recess and is located below the flat surface 36b2. When viewed from direction D1, the flat surface 36b4 is adjacent to the outer portion 33. The flat surface 36b4 is located at a position lower than the upper surface 33a of the outer portion 33, thereby forming a step between the bridge portion 36 and the outer portion 33.

[0042] As shown in FIG. 6 , the second portion 53 is connected to the lower end of the first portion 52. When viewed from the direction D1, the second portion 53 is formed in a ring shape extending along the circumferential direction and surrounds the space defining surface 32a. That is, unlike the first portion 52, the second portion 53 is formed to be continuous around the entire circumference. The second portion 53 is formed narrower than the first portion 52. That is, the groove portion 51 is narrower at the boundary between the second portion 53 and the first portion 52. In this example, the width of the second portion 53 in the radial direction is narrower than the width of the first portion 52 in the radial direction, and therefore the second portion 53 is formed narrower than the first portion 52.

[0043] The inner surface 53a of the second portion 53 includes an inclined surface 53b that slopes inward as it extends downward. The inner surface 53a is the radially outer inner surface of the second portion 53, and constitutes part of the radially outer inner surface of the groove portion 51. The inclined surface 53b is formed at the boundary between the inner surface 53a and the first portion 52, and is connected to the first portion 52 at its upper end. In the circumferential direction, the inclined surface 53b is formed over the entire circumference.

[0044] The space within the groove 51 is connected to the space S1 defined between the space defining surface 32a and the semiconductor device 2. Alternatively, the space within the groove 51 can be considered to constitute a part of the space S1. The groove 51 extends downward from the space defining surface 32a. Therefore, the cooling fluid 5 flowing through the space S1 flows down from the space defining surface 32a into the groove 51. That is, the cooling fluid 5 falls due to gravity and moves from above the space defining surface 32a into the groove 51. The cooling fluid 5 that flows down into the groove 51 moves, for example, from the first portion 52 along the inclined surface 53b to the second portion 53, where it is stored. The cooling fluid 5 stored in the second portion 53 is discharged from a discharge flow path 62, which will be described later.

[0045] The jacket 31 is formed with four supply flow paths 61 through which the cooling fluid 5 supplied to the space S1 flows, and four discharge flow paths 62 through which the cooling fluid 5 flows to be discharged from the space S1 to the outside. As shown in Figures 2 and 4, the supply flow paths 61 open to the outside of the jacket 31 at the side of the jacket 31 and also open to the space defining surface 32a of the central portion 32. A pipe P1 through which the cooling fluid 5 supplied from the storage tank 22 flows is connected to the opening at the side of the jacket 31.

[0046] As shown in FIG. 4, the supply flow path 61 has a first portion 61a and a second portion 61b. The first portion 61a is formed to pass through the outer portion 33 and opens to the outside of the jacket 31. The second portion 61b is connected to the first portion 61a and formed to pass through the bridge portion 36, and has a supply port 61c that opens to the space defining surface 32a (FIGS. 3 and 4). The cooling fluid 5 is supplied from the supply port 61c to the space defining surface 32a (space S1). The second portion 61b extends along the radial direction and extends at an inclination upward as it moves inward. The four supply flow paths 61 are arranged side by side at regular intervals in the circumferential direction. In this example, the supply flow paths 61 are formed at positions corresponding to four of the eight bridge portions 36. The cooling fluid 5 supplied from the supply flow paths 61 to the space S1 flows within the space S1 toward the solid immersion lens 72 (opening 35). In FIG. 4, an example of the path along which the cooling fluid 5 is supplied through the supply channel 61 is shown by dashed arrows.

[0047] As shown in FIGS. 5 and 6 , the discharge flow passage 62 is formed to pass through the outer portion 33 and opens to the outside of the jacket 31 at a side of the jacket 31 and also opens to the second portion 53 of the groove portion 51. A pipe P2, through which the cooling fluid 5 flows and is discharged to the drain tank 24, is connected to the opening at the side of the jacket 31. The discharge flow passage 62 has a discharge port 62a that opens to the bottom of the second portion 53 and is connected to the second portion 53 at the discharge port 62a. The cooling fluid 5 is discharged from the second portion 53 through the discharge port 62a. The four discharge flow passages 62 may be arranged at any positions. In this example, each discharge flow passage 62 is arranged so as to be located between two bridge portions 36 adjacent to each other in the circumferential direction. In FIG. 6 , an example of a path along which the cooling fluid 5 is discharged through the groove portion 51 and the discharge flow passage 62 is indicated by dashed arrows.

[0048] Furthermore, the jacket 31 is formed with a ventilation path 65 that connects the space S1 (inside the outer portion 33) to the outside of the jacket 31 so as to allow air to circulate between the space S1 and the outside of the jacket 31 (open-to-atmosphere structure). As shown in Figures 8 to 10, the ventilation path 65 opens to the outside of the jacket 31 at the side of the jacket 31 and also opens to the groove portion 51 via a ventilation member 66. The opening at the side of the jacket 31 is open (not blocked).

[0049] The ventilation member 66 is disposed in the first portion 52 of the groove 51. The ventilation member 66 includes a main body 67 and a cover 68. The main body 67 is formed in a substantially rectangular parallelepiped shape and has a pair of opposing side surfaces 67a. A groove 67c is formed on a surface 67b of the main body 67. The surface 67b is the surface that is covered by the cover 68. The groove 67c extends from one side surface 67a to the other side surface 67a. In this example, the groove 67c includes a pair of linear portions 67c1 extending from the side surface 67a, a pair of linear portions 67c2 extending from the pair of linear portions 67c1 perpendicular to the linear portions 67c1, and a linear portion 67c3 extending parallel to the linear portions 67c1 so as to connect the pair of linear portions 67c2 to each other.

[0050] The upper portion of the groove 67c is covered with the cover 68, thereby defining an internal space S2 having a shape corresponding to the groove 67c. A through-hole 67d penetrating the main body 67 is formed in the linear portion 67c3 of the groove 67c. The internal space S2 (groove 67c) is connected to the ventilation path 65 via the through-hole 67d. Furthermore, since the groove 67c extends to each side surface 67a, the internal space S2 opens at each side surface 67a and is connected to the first portion 52 of the groove 51. In this example, the cover 68 is disposed on the main body 67 so as to protrude from each side surface 67a. That is, the length of the cover 68 in a direction perpendicular to the side surface 67a is longer than the length of the main body 67 in that direction (the distance between the pair of side surfaces 67a), and the cover 68 protrudes from each side surface 67a in that direction. This prevents the cooling fluid 5 flowing down from the space defining surface 32a into the groove 51 from entering the internal space S2. The cover 68 is located vertically above the main body 67 .

[0051] The cover 68 is fixed to the main body 67 with fastening members 68a such as bolts. The ventilation member 66 is fixed to the jacket 31 with fastening members 66a such as bolts. In this example, the jacket 31 has a fixing portion 311 formed to protrude from the outer portion 33 into the first portion 52 of the groove portion 51, and the ventilation member 66 is fixed to the fixing portion 311. The ventilation path 65 is formed to pass through the fixing portion 311. In FIG. 8, dashed arrows indicate an example of a path through which air flows between the space S1 and the outside of the jacket 31 through the ventilation path 65 and the ventilation member 66. As described above, the opening of the ventilation path 65 on the side of the jacket 31 is open, and the ventilation path 65 is always open. That is, in the cooling unit 21, air can always circulate between the space S1 and the outside of the jacket 31 (the space S1 is not sealed).

[0052] Referring again to FIG. 1 , the path through which the cooling fluid 5 flows will be described. The cooling fluid 5 is stored in the storage tank 22. The cooling fluid 5 in the storage tank 22 is pressurized by a compressor (not shown) and supplied to the supply flow path 61 via the regulators 23. The four regulators 23 are each connected to the supply flow path 61 via a pipe P1. Each regulator 23 is controlled by the control unit 15 to change the pressure of the fluid flowing through the supply flow path 61. This adjusts the pressure of the cooling fluid 5 flowing through the space S1. The drain tank 24 stores the cooling fluid 5 discharged from the discharge flow path 62. The chiller 25 cools the cooling fluid 5 to a predetermined set temperature. The cooling fluid 5 discharged from the discharge flow path 62 flows into the chiller 25. The chiller 25 cools the cooling fluid 5 that has flowed in. The cooling fluid 5 cooled by the chiller 25 is returned to the storage tank 22 and supplied to the supply flow path 61 again. The jacket 31 may be cooled by flowing a coolant through a coolant flow path formed in the jacket 31. In this case, the coolant may be, for example, water or air. That is, the jacket 31 may be cooled by liquid cooling or air cooling. [Objective lens module]

[0053] 2 and 4, cooling unit 21 is combined with objective lens 16 to constitute objective lens module 70. In addition to the cooling unit 21 and objective lens 16 described above, objective lens module 70 includes a solid immersion lens unit (immersion lens unit) 71 attached to objective lens 16. Solid immersion lens unit 71 includes a solid immersion lens 72 and a holder 73. Objective lens 16 is disposed so as to face semiconductor device 2 via opening 35 of jacket 31. Solid immersion lens 72 is held within opening 35 by holder 73, and is positioned on optical axis L of objective lens 16.

[0054] The solid immersion lens 72 has an abutment surface 72a, a spherical surface 72b, and a tapered surface 72c. The abutment surface 72a is a flat surface that abuts against the die 2c of the semiconductor device 2. The spherical surface 72b is a hemispherical surface that is convex downward and faces the objective lens 16. The tapered surface 72c is a truncated conical surface that widens downward and extends downward from the outer edge of the abutment surface 72a to connect to the outer edge of the spherical surface 72b. The apex of an imaginary cone that includes the tapered surface 72c coincides with the spherical center of the solid immersion lens 72 (center of curvature of the spherical surface 72b) and is located on the optical axis L of the objective lens 16 above the abutment surface 72a. The spherical center of the solid immersion lens 72 coincides with the focal point of the solid immersion lens 72. The solid immersion lens 72 may further have a cylindrical surface located between the spherical surface 72b and the tapered surface 72c. In addition to the solid immersion lens, other immersion lenses such as a liquid immersion lens or an oil immersion lens may also be used.

[0055] The solid immersion lens 72 is formed from a high refractive index material that is substantially the same as or close to the refractive index of the substrate material of the semiconductor device 2. Typical examples include Si, GaP, and GaAs. The solid immersion lens 72 transmits observation light. By optically contacting the solid immersion lens 72 with the semiconductor device 2, the semiconductor device 2 itself can be used as part of the solid immersion lens 72. In backside analysis of the semiconductor device 2 using the solid immersion lens 72, when the objective lens 16 is focused on an integrated circuit formed on the surface of the substrate of the semiconductor device 2, the effect of the solid immersion lens 72 allows a light beam with a high numerical aperture (NA) to pass through the semiconductor device 2, enabling high resolution.

[0056] The holder 73 is attached to the objective lens 16 and holds the solid immersion lens 72 together with the flexible member 45 described above. The holder 73 has a side wall portion 74 and a lid portion 75. The holder 73 is formed from a non-magnetic material (for example, aluminum, aluminum alloy, non-magnetic stainless steel, etc.). The side wall portion 74 is formed in a substantially cylindrical shape. The lid portion 75 is configured to close the upper opening of the side wall portion 74.

[0057] An opening 75a in which the solid immersion lens 72 is disposed is formed in the lid portion 75. The lid portion 75 has a plurality of (for example, three) protrusions 76 extending from the inner surface of the opening 75a toward the center of the opening 75a. The protrusions 76 have a tapered shape, and the surface on the semiconductor device 2 side is an inclined surface that is inclined so as to approach the objective lens 16 as it approaches the center of the opening 75a. The plurality of protrusions 76 are arranged, for example, at regular intervals in the circumferential direction.

[0058] The solid immersion lens 72 is disposed in the opening 75a so that the contact surface 72a and the tapered surface 72c protrude upward from the opening 75a of the lid portion 75, and the spherical surface 72b protrudes downward from the opening 75a of the lid portion 75. The spherical surface 72b is in contact with the tip of each protrusion 76, and the contact surface 72a and the tapered surface 72c are in contact with the flexible member 45 and protrude upward from the flexible member 45. The solid immersion lens 72 is swingable before the contact surface 72a comes into contact with the semiconductor device 2. For example, when the solid immersion lens 72 swings, the spherical surface 72b slides relative to the tip of the protrusion 76, and the flexible member 45 deforms in response to the swing of the solid immersion lens 72. Because the solid immersion lens 72 is swingable, when the contact surface 72a is brought into contact with the semiconductor device 2, the solid immersion lens 72 can be easily brought into close contact with the semiconductor device 2. As a result, even if the semiconductor device 2 is disposed at an angle with respect to the optical axis L, for example, the solid immersion lens 72 can be brought into good close contact with the semiconductor device 2, making it possible to observe the semiconductor device 2.

[0059] A plurality of (two in this example) first biasing members 81 are provided between the side wall portion 74 and the lid portion 75 of the holder 73, which bias the solid immersion lens 72 upward (toward the opposite side to the objective lens 16) by pressing the lid portion 75 upward. The first biasing members 81 are constituted by, for example, springs held within the side wall portion 74.

[0060] Between the second member M2 and the third member M3 in the jacket 31, a plurality of (four in this example) second biasing members 82 are provided, which bias the jacket 31 toward the stage 3 (upward) by pressing the second member M2 upward. The second biasing members 82 are configured, for example, by springs held by guide portions M3a. The guide portions M3a are cylindrical portions provided on the third member M3 and extend along the direction D1. The second biasing members 82 are provided separately / independently from the first biasing members 81, and the biasing force of the second biasing members 82 does not act on the solid immersion lens 72 (objective lens 16 and solid immersion lens unit 71). The lower portion of the objective lens 16 is held by the third member M3. [Semiconductor inspection method]

[0061] In the semiconductor inspection method using the semiconductor inspection apparatus 1, first, the semiconductor device 2 is placed (fixed) on the stage 3 (first step). Next, the cooling unit 21 is placed so that the opening 35 faces the semiconductor device 2 and a space S1 is defined between the space defining surface 32a and the semiconductor device 2 (second step). More specifically, for example, the objective lens module 70 is moved by the above-mentioned XYZ stage, and the cooling unit 21 is attached to the stage 3 so that the opening 35 faces the semiconductor device 2. This forms the space S1 between the cooling unit 21, the semiconductor device 2, and the stage 3. In the second step, the contact portion 39, which is composed of the outer portion 33 and the elastic members 41 and 42, comes into contact with the stage 3, thereby defining the outer edge of the space S1.

[0062] Next, the objective lens 16 is moved by the XYZ stage to move the solid immersion lens 72 closer to the semiconductor device 2, and the contact surface 72a of the solid immersion lens 72 is brought into contact with the semiconductor device 2 (third step). Next, the semiconductor device 2 is driven by the signal input device 11 (fourth step). Next, while the cooling fluid 5 is flowing in the space S1, the light coming from the semiconductor device 2 being driven and passing through the opening 35 is detected by the photodetector 14 (fifth step). Through the above steps, the semiconductor device 2 can be inspected. Note that the fourth step of driving the semiconductor device 2 may be performed before the second or third step.

[0063] A semiconductor inspection method using the semiconductor inspection apparatus 1 will be further described with reference to FIGS. 11 and 12. Each component is schematically illustrated in FIGS. 11 and 12. As described above, first, the semiconductor device 2 is placed (fixed) on the stage 3 (first step, FIG. 11(a)). Next, the XYZ stage is raised to move the objective lens module 70 upward, and the contact portion 39, which is composed of the outer portion 33 and the elastic members 41 and 42, is brought into contact with the stage 3. This forms a space S1 between the cooling unit 21 and the semiconductor device 2 and the stage 3 (second step, FIG. 11(b)). The contact between the contact portion 39 and the stage 3 is detected by, for example, a first sensor (not shown) provided on the jacket 31. In the second step, the control unit 15 controls the XYZ stage based on the detection result of the first sensor. The first sensor may be, for example, a photosensor that is turned on and off by blocking light.

[0064] Next, the XYZ stage is further raised. At this time, the cooling unit 21 does not move because it is in contact with the stage 3 at the contact portion 39, and the second biasing member 82 provided between the second member M2 and the third member M3 in the jacket 31 contracts. Meanwhile, the objective lens 16 and the solid immersion lens 72 rise as the XYZ stage moves, and the solid immersion lens 72 comes into contact with the semiconductor device 2 (third step, FIG. 12(a)). This contact between the solid immersion lens 72 and the semiconductor device 2 is detected by, for example, a second sensor (not shown) provided in the holder 73. In the third step, the control unit 15 controls the XYZ stage based on the detection result of the second sensor. The second sensor may be configured, for example, by a photosensor that is turned on and off by blocking light. The arrangement of this photosensor is not particularly limited. For example, the photosensor may be provided on the side wall portion 74, and a dog member that blocks light from the photosensor may be provided on the lid portion 75. Alternatively, the photosensor may be provided on the cover portion 75, and the dog member may be provided on the side wall portion 74. This also applies to the case where the third sensor described below is configured as a photosensor.

[0065] After the third step, and before the fourth step of driving the semiconductor device 2, an adjustment step may be performed in which the focal position is adjusted by further raising the XYZ stage (FIG. 12(b)). Even when the XYZ stage is raised in the adjustment step, the cooling unit 21 does not move because it is in contact with the stage 3 at the contact portion 39, and the second biasing member 82 contracts. Furthermore, the solid immersion lens 72 does not move because it is in contact with the semiconductor device 2, and the objective lens 16 rises in conjunction with the movement of the XYZ stage. At this time, the first biasing member 81 provided between the side wall portion 74 and the lid portion 75 of the holder 73 contracts. The holder 73 is provided with a third sensor (not shown) for preventing overrun of the XYZ stage (objective lens 16). The third sensor detects, for example, that the XYZ stage has risen to a predetermined position. The predetermined position corresponds to a position where raising the XYZ stage would cause damage to the device. In the adjustment step, the control unit 15 controls the XYZ stage based on the detection result of the third sensor. This makes it possible to prevent the XYZ stage from rising excessively, which could result in damage to the device. The third sensor may be configured, for example, by a photosensor that is turned on and off by blocking light.

[0066] Thereafter, as described above, the semiconductor device 2 is driven by the signal input device 11 (fourth step), and light from the driven semiconductor device 2 is detected by the photodetector 14 while the cooling fluid 5 is flowing in the space S1 (fifth step). This allows the semiconductor device 2 to be inspected.

[0067] Next, an example of a process for changing the observation area (inspection position) on the semiconductor device 2 will be described. In the semiconductor inspection apparatus 1 according to the embodiment, the observation area can be changed while the cooling fluid 5 is still flowing in the space S1. That is, the observation area can be changed while the semiconductor device 2 is still being driven and cooling performance is maintained. When changing the observation area, first, for example, the XYZ stage is lowered from the state shown in FIG. 12(a) or FIG. 12(b) to separate the solid immersion lens 72 from the semiconductor device 2 (FIG. 11(b)). This is because if the objective lens module 70 is moved in the X direction and / or Y direction while the solid immersion lens 72 remains in close contact with the semiconductor device 2, the solid immersion lens 72 or the semiconductor device 2 may be damaged. For example, the control unit 15 moves the XYZ stage down to a position where the second sensor is turned off, thereby separating the solid immersion lens 72 from the semiconductor device 2. At this time, the contact portion 39 of the cooling unit 21 remains in contact with the stage 3, and a space S1 remains formed between the cooling unit 21 and the semiconductor device 2 and stage 3. The supply of cooling fluid 5 to space S1 continues. Next, the objective lens module 70 is moved in the X direction and / or Y direction relative to the stage 3 by the XYZ stage, and the solid immersion lens 72 is moved to a position corresponding to the desired observation area. Next, the XYZ stage is raised to raise the objective lens 16 and solid immersion lens 72, and the solid immersion lens 72 is brought into contact with the semiconductor device. Through the above steps, the observation area can be changed while the cooling fluid 5 remains flowing in space S1. [Action and effect]

[0068] In the cooling unit 21, a groove 51 is formed between the central portion 32 and the outer portion 33 of the jacket 31, allowing the cooling fluid 5 to flow down from the space-defining surface 32a (the upper surface of the central portion 32). A discharge flow path 62, through which the cooling fluid 5 flows to be discharged to the outside, is connected to the groove 51. This prevents the cooling fluid 5 from reaching the outer edge of the space S1 (the area where the outer portion 33 of the jacket 31 contacts the stage 3) when the semiconductor device 2 is cooled by supplying the cooling fluid 5 from the supply flow path 61 to the space S1 formed by the contact portion 39 of the outer portion 33 contacting the stage 3. This prevents the cooling fluid 5 from leaking from the outer edge of the space S1, thereby improving waterproof performance. Furthermore, the formation of the groove 51 prevents the space S1 from being filled with the cooling fluid 5, thereby also improving waterproof performance. Since the cooling fluid 5 is prevented from reaching the outer edge of the space S1, the elastic members 41 and 42 for sealing the outer edge can be omitted or simplified. For example, the elastic members 41 and 42 may be replaced with flexible members.

[0069] A bridge portion 36 that connects the central portion 32 and the outer portion 33 to each other is formed between the central portion 32 and the outer portion 33 of the jacket 31 (at the intermediate portion 34), and the supply flow path 61 is formed to pass through the bridge portion 36. This allows the supply flow path 61 to be formed in a suitable manner. For example, the configuration of the supply flow path 61 can be simplified compared to when the supply flow path 61 is formed to go around the groove portion 51 without passing through the bridge portion 36.

[0070] The upper surface 36a of the bridge portion 36 (the surface connected to the space defining surface 32a) has a portion 36b located at a position lower than the space defining surface 32a, which makes it possible to prevent the cooling fluid 5 from flowing from the space defining surface 32a along the upper surface 36a and reaching the outer edge of the space S1.

[0071] The groove 51 has a first portion 52 and a second portion 53 located on the opposite side of the first portion 52 from the space defining surface 32a in direction D1 (a direction perpendicular to the space defining surface 32a), the second portion 53 being formed narrower than the first portion 52, and a discharge flow path 62 being connected to the second portion 53. This allows the first portion 52 located on the space defining surface 32a side to be formed wide, thereby increasing the opening area of ​​the groove 51 and making it easier for the cooling fluid 5 to flow into the groove 51. Furthermore, by forming the second portion 53 located on the opposite side from the space defining surface 32a narrower, the cooling fluid 5 is more likely to be stored in the second portion 53, and as a result, the cooling fluid 5 can be efficiently discharged from the discharge flow path 62 connected to the second portion 53.

[0072] The outer inner surface 53a of the groove 51 includes an inclined surface 53b that slopes inward as it goes downward, thereby increasing the volume of the groove 51 and allowing the cooling fluid 5 that has flowed into the groove 51 to flow downward in an appropriate manner.

[0073] Groove portion 51 has a ring-shaped second portion 53 that surrounds space defining surface 32a when viewed from direction D1. This allows cooling fluid 5 to be efficiently stored in groove portion 51 and the stored cooling fluid 5 to be efficiently discharged to the outside.

[0074] An air vent path 65 is formed in the jacket 31, connecting the space S1 to the outside of the jacket 31 so as to allow air to circulate between the space S1 and the outside of the jacket 31, and the air vent path 65 is connected to the groove portion 51. This prevents the pressure in the space S1 from becoming negative. Therefore, when the cooling unit 21 is moved along the stage 3 on which the semiconductor device 2 is arranged while the cooling fluid 5 is flowing, it is possible to prevent the cooling unit 21 from sticking to the stage 3 due to negative pressure, which could prevent the cooling unit 21 from being moved or reduce the accuracy of movement. As a result, it is possible to move the cooling unit 21 with high accuracy while the cooling fluid 5 is flowing.

[0075] A groove 51 is formed between the central portion 32 and the outer portion 33 (intermediate portion 34) of the jacket 31, and a ventilation path 65 is connected to the groove 51. As a result, the groove 51 is unlikely to be filled with the cooling fluid 5, and therefore, air can reliably circulate between the space S1 and the outside of the jacket 31 via the ventilation path 65.

[0076] The ventilation path 65 is connected to the groove 51 via a ventilation member 66 disposed in the groove 51. This makes it possible to prevent the cooling fluid 5 from entering the ventilation path 65.

[0077] The ventilation member 66 has an internal space S2 connected to the ventilation path 65, and the internal space S2 opens at a side surface 67a of the ventilation member 66 and is connected to the groove portion 51. This effectively prevents the cooling fluid 5 from entering the ventilation path 65 (internal space S2).

[0078] The ventilation member 66 has a main body 67 including a side surface 67a, and a cover 68, and the cover 68 is disposed on the main body 67 so as to protrude from the side surface 67a. This makes it possible to more effectively prevent the cooling fluid 5 from entering the ventilation path 65 (internal space S2).

[0079] The ventilation path 65 is always open, which reliably prevents the pressure in the space S1 between the space defining surface 32a and the semiconductor device 2 from becoming negative. [Variations]

[0080] 13 and 14, a cooling unit 21 of the first modified example shown in FIG. 13 is provided, instead of the second biasing member 82, between the jacket 31 and the holder 73, with a biasing member 83 that biases the jacket 31 toward the stage 3 (upward). While the second biasing member 82 of the above embodiment is provided separate / independently from the first biasing member 81 (in parallel with the first biasing member 81), the biasing member 83 of the first modified example is provided in series with the first biasing member 81, and in the first modified example, the biasing force of the biasing member 83 acts on the solid immersion lens 72. The spring constant of the biasing member 83 is smaller than the spring constant of the first biasing member 81. The spring constant of the biasing member 83 may be larger than the spring constant of the first biasing member 81.

[0081] An example of a semiconductor inspection method using the semiconductor inspection apparatus 1 according to the first modified example will be described. First, the semiconductor device 2 is placed (fixed) on the stage 3 (first step, FIG. 13(a)). Next, the XYZ stage is raised to move the objective lens module 70 upward, and the contact part 39 consisting of the outer part 33 and the elastic members 41, 42 is brought into contact with the stage 3. This forms a space S1 between the cooling unit 21 and the semiconductor device 2 / stage 3 (second step, FIG. 13(b)).

[0082] Next, the XYZ stage is further elevated. At this time, the cooling unit 21 does not move because it is in contact with the stage 3 at the contact portion 39, and the biasing member 83 provided between the jacket 31 and the holder 73 contracts. Meanwhile, the objective lens 16 and the solid immersion lens 72 rise as the XYZ stage moves, and the solid immersion lens 72 comes into contact with the semiconductor device 2 (third step, FIG. 14(a)). Next, an adjustment step can be performed in which the focal position is adjusted by further raising the XYZ stage (FIG. 14(b)). Even when the XYZ stage is elevated in the adjustment step, the cooling unit 21 does not move because it is in contact with the stage 3 at the contact portion 39. Furthermore, the solid immersion lens 72 does not move because it is in contact with the semiconductor device 2, and the objective lens 16 rises as the XYZ stage moves. At this time, the biasing member 83 does not contract, and the first biasing member 81 provided between the side wall portion 74 and the lid portion 75 of the holder 73 contracts. Thereafter, the semiconductor device 2 is driven by the signal input device 11 (fourth step), and light from the driven semiconductor device 2 is detected by the photodetector 14 while the cooling fluid 5 is flowing in the space S1 (fifth step).

[0083] In the semiconductor inspection device 1 according to the first modification, the observation area can be changed while the cooling fluid 5 is still flowing through the space S1. The process for changing the observation area is the same as in the above embodiment. This first modification also improves waterproof performance, similar to the above embodiment.

[0084] 15, the bridge portion 36 is not formed on the jacket 31, and the first portion 52 of the groove portion 51 (i.e., the entire groove portion 51) is formed in a ring shape extending along the circumferential direction when viewed from the direction D1. This second modification also improves waterproof performance, similar to the above embodiment.

[0085] In another modified example, the supply flow path 61 through which the cooling fluid 5 is supplied may be switchable depending on the observation position on the semiconductor device 2. For example, eight supply flow paths 61 may be arranged at regular intervals in the circumferential direction, and the cooling fluid 5 may be supplied from four of the eight supply flow paths 61 in the first state, and the cooling fluid 5 may be supplied from the remaining four of the eight supply flow paths 61 in the second state. For example, in the first state, the cooling fluid 5 may be supplied to the four supply flow paths 61 so that the cooling fluid 5 flows from four directions, on both sides in the X direction and both sides in the Y direction, relative to the solid immersion lens 72, and in the second state, the cooling fluid 5 may be supplied to the remaining four supply flow paths 61 so that the cooling fluid 5 flows from four directions shifted by 45 degrees from the four directions in the first state relative to the solid immersion lens 72. Because the heat-generating location can change depending on the observation position on the semiconductor device 2, employing such a configuration enables effective cooling depending on the observation position on the semiconductor device 2. The number of cooling fluids 5 and the switching pattern may be set appropriately.

[0086] The present invention is not limited to the above-described embodiment and modifications. For example, the materials and shapes of each component are not limited to those described above, and various materials and shapes can be used. Only one supply flow path 61 and / or one discharge flow path 62 may be provided. The elastic members 41 and 42 may be omitted or replaced with flexible members.

[0087] The upper surface 36a of the bridge portion 36 does not have to have a portion located lower than the space defining surface 32a, and may be flush with the space defining surface 32a, for example. The second portion 53 of the groove 51 does not have to be narrower than the first portion 52, and may have a width approximately the same as that of the first portion 52, for example. The outer inner surface 53a of the groove 51 does not have to include an inclined surface 53b. The groove 51 does not have to have a ring-shaped portion surrounding the space defining surface 32a when viewed from direction D1. The groove 51 may have any shape and arrangement as long as it is configured to allow the cooling fluid 5 to flow down from the space defining surface 32a. The ventilation path 65 does not have to be formed, and it does not have to allow air to circulate between the space S1 and the outside of the jacket 31.

[0088] The ventilation path 65 only needs to connect the space S1 to the outside of the jacket 31 so as to allow air to circulate between the space S1 and the outside of the jacket 31, and does not have to be connected to the groove portion 51. The ventilation member 66 may be omitted, and the ventilation path 65 may be connected to the groove portion 51 without the ventilation member 66 interposed therebetween.

[0089] The semiconductor device 2 is not limited to a device including a logic LSI. The semiconductor device 2 may be a discrete semiconductor element, an optoelectronic element, a sensor / actuator, a memory element, a linear IC (Integrated Circuit), or a hybrid device thereof. Discrete semiconductor elements include diodes, power transistors, and the like. The semiconductor device 2 may also be a package or a composite substrate including a semiconductor device. The semiconductor device 2 may be formed by, for example, incorporating multiple elements (such as capacitors) into a silicon substrate. [Explanation of symbols]

[0090] 1...semiconductor inspection apparatus, 2...semiconductor device, 3...stage, 5...cooling fluid, 14...photodetector, 16...objective lens, 21...cooling unit, 31...jacket, 32...central portion, 32a...space defining surface, 33...outer portion, 35...opening, 36...bridge portion, 36a...top surface, 36b...portion, 53b...inclined surface, 39...contact portion, 51...groove portion, 52...first portion, 53...second portion, 53a...inner surface, 53b...inclined surface, 61...supply flow path, 62...discharge flow path, 65...ventilation path, 66...ventilation member, 67...main body portion, 67a...side surface, 68...cover, 70...objective lens module, 72...solid immersion lens, S1...space, S2...internal space.

Claims

1. 1. A cooling unit for use in semiconductor device testing, comprising: a jacket for dissipating heat from the semiconductor device; The jacket has a central portion and an outer portion positioned around the central portion, an opening through which light from the semiconductor device passes is formed in the central portion; the outer portion has a contact portion that contacts a stage on which the semiconductor device is placed, a supply flow path through which a cooling fluid for cooling the semiconductor device flows is formed in the jacket; a groove formed between the central portion and the outer portion of the jacket, the groove being configured to allow the cooling fluid to flow down from an upper surface of the central portion; a discharge flow path through which the cooling fluid flows to be discharged to the outside is connected to the groove portion; a bridge portion is formed between the central portion and the outer portion of the jacket, the bridge portion connecting the central portion and the outer portion to each other; The supply flow path is formed to pass through the bridge portion.

2. 1. A cooling unit for use in semiconductor device testing, comprising: a jacket for dissipating heat from the semiconductor device; The jacket has a central portion and an outer portion positioned around the central portion, an opening through which light from the semiconductor device passes is formed in the central portion; the outer portion has a contact portion that contacts a stage on which the semiconductor device is placed, a supply flow path through which a cooling fluid for cooling the semiconductor device flows is formed in the jacket; a groove formed between the central portion and the outer portion of the jacket, the groove being configured to allow the cooling fluid to flow down from an upper surface of the central portion; a discharge flow path through which the cooling fluid flows to be discharged to the outside is connected to the groove portion; a bridge portion is formed between the central portion and the outer portion of the jacket, the bridge portion connecting the central portion and the outer portion to each other; A cooling unit, wherein a surface of the bridge portion connected to the upper surface of the central portion has a portion positioned lower than the upper surface of the central portion.

3. 1. A cooling unit for use in semiconductor device testing, comprising: a jacket for dissipating heat from the semiconductor device; The jacket has a central portion and an outer portion positioned around the central portion, an opening through which light from the semiconductor device passes is formed in the central portion; the outer portion has a contact portion that contacts a stage on which the semiconductor device is placed, a supply flow path through which a cooling fluid for cooling the semiconductor device flows is formed in the jacket; a groove formed between the central portion and the outer portion of the jacket, the groove being configured to allow the cooling fluid to flow down from an upper surface of the central portion; a discharge flow path through which the cooling fluid flows to be discharged to the outside is connected to the groove portion; an air passage is formed in the jacket, connecting the space formed by the contact portion of the outer portion contacting the stage to the outside of the jacket so as to enable air to circulate between the space and the outside of the jacket; The ventilation path is connected to the groove portion.

4. the groove portion has a first portion and a second portion located on an opposite side of the first portion from the top surface of the central portion in a direction perpendicular to the top surface of the central portion, The second portion is narrower than the first portion, The cooling unit according to any one of claims 1 to 3, wherein the exhaust flow path is connected to the second portion.

5. The side where the central portion is located relative to the outer portion is defined as the inner side, the side where the outer portion is located relative to the central portion is defined as the outer side, and the side where the groove portion is located relative to the upper surface of the central portion is defined as the lower side. The cooling unit according to any one of claims 1 to 4, wherein the outer inner surface of the groove portion includes an inclined surface that slopes inward as it approaches the lower side.

6. The cooling unit according to any one of claims 1 to 5, wherein the groove portion has a ring-shaped portion that surrounds the upper surface when viewed from a direction perpendicular to the upper surface of the central portion.

7. A cooling unit according to any one of claims 1 to 6; an immersion lens disposed in the opening; an objective lens facing the immersion lens;

8. A cooling unit according to any one of claims 1 to 6; an immersion lens disposed in the opening; a stage on which the semiconductor device is placed; an objective lens facing the immersion lens; a photodetector that detects light from the semiconductor device through the immersion lens and the objective lens.

Images