LED Transparent Display Screen

The LED transparent display screen design addresses attachment and maintenance challenges by using a PCB substrate with vias and connection posts for adhesive-free attachment to transparent glass, ensuring easy removal and maintaining display quality.

JP7760769B1Active Publication Date: 2025-10-27ROE VISUAL CO LTD
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Patent Information

Application Number
JP2025013527
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Priority Date
2024-09-14
Filing Date
2025-01-30
Publication Date
2025-10-27
Estimated Expiration
2045-01-30

AI Technical Summary

Technical Problem

Current methods for attaching LED transparent display screens to transparent glass are difficult to remove and maintain, and applying adhesive directly to the chips affects the display effect.

Method used

An LED transparent display screen design featuring a PCB substrate with vias, connection pieces, and connection posts that penetrate the vias with adhesive, allowing attachment to transparent glass without direct adhesive contact with the chips, and incorporating a reinforcing plate for enhanced strength.

Benefits of technology

Facilitates easy removal and maintenance of the display screen while preserving the display effect by spacing the chips from the adhesive, ensuring strong attachment and improved transparency.

✦ Generated by Eureka AI based on patent content.

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Abstract

To provide an LED transparent display screen which can facilitate removal and maintenance of the transparent display screen and can avoid the influence on the display effect caused by applying an adhesive directly onto a chip. [Solution] The LED transparent display screen according to the embodiment of the present invention includes a PCB substrate, a plurality of connection pieces, and a plurality of LED chips arranged in an array on the PCB substrate, wherein the PCB substrate has a plurality of first vias, the LED chips are distributed around the plurality of first vias, the connection pieces are all distributed on a surface of the PCB substrate opposite the plurality of LED chips, and each of the connection pieces has a plurality of connection posts on a surface facing the PCB substrate, the connection posts passing through the plurality of first vias and having an adhesive on their end surfaces. In the LED transparent display screen according to the embodiment of the present invention, the transparent display screen can be fixed and connected to a transparent glass by the adhesive on the end surfaces of the connection posts.
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Description

[Technical Field]

[0001] This application claims priority from Chinese patent application No. 202422263408.X, the entire contents of which are incorporated herein by reference.

[0002] The present invention relates to the technical field of electronic display devices, and in particular to LED transparent display screens. [Background technology]

[0003] LED transparent display screens are now widely used and are often attached to transparent glass to enhance the strength and texture of the display screen. The current common method for attaching a display screen to transparent glass is to apply adhesive to the surface of the chip and then glue the lamp surface to the transparent glass through the adhesive. However, this structure makes removal and maintenance difficult, and applying adhesive directly to the chip also affects the display effect. Summary of the Invention [Problem to be solved by the invention]

[0004] In view of the above problems, embodiments of the present invention are proposed to provide an LED transparent display screen that solves the above problems or at least some of them. [Means for solving the problem]

[0005] An embodiment of the present invention provides an LED transparent display screen including a PCB substrate, a plurality of connection pieces, and a plurality of LED chips, the plurality of LED chips being arranged in an array on the PCB substrate, the PCB substrate being provided with a plurality of first vias, the plurality of LED chips being distributed around the plurality of first vias, the plurality of connection pieces being all distributed on a surface of the PCB substrate opposite to the plurality of LED chips, and a plurality of connection posts being provided on a surface of each of the connection pieces facing the PCB substrate, the plurality of connection posts penetrating the plurality of first vias and having adhesive applied to their end surfaces.

[0006] Furthermore, the connection piece is provided with second vias corresponding to the plurality of first vias.

[0007] Furthermore, the height of the connection post above the PCB substrate is equal to or greater than the height of the LED chip above the PCB substrate.

[0008] Furthermore, the connecting post and the connecting piece are of an integral structure.

[0009] Furthermore, the LED transparent display screen further includes a reinforcing plate disposed between the PCB substrate and the connecting piece, through which the ends of the connecting posts pass.

[0010] Furthermore, third vias corresponding to the plurality of first vias are provided in the reinforcing plate, and the ends of the plurality of connection posts pass through the third vias and the first vias in that order.

[0011] Furthermore, the reinforcing plate is a carbon fiber plate.

[0012] Furthermore, the plurality of connection posts in one of the connection pieces are respectively located on both sides of the joint between the two PCB substrates.

[0013] Furthermore, the four connection pieces are provided at the four corners of the surface of the PCB substrate opposite to the LED chips.

[0014] Furthermore, the plurality of connection pieces are provided at equal intervals on the surface of the PCB substrate opposite to the plurality of LED chips.

[0015] Furthermore, the radius of the second via is equal to or greater than the radius of the first via.

[0016] Furthermore, the diameter of the connection post is less than the diameter of the first via.

[0017] Furthermore, the difference between the radius of the first via and the radius of the connection post is 0.2 mm or more and 0.3 mm or less.

[0018] Furthermore, the connecting post has a guide surface at the end opposite to the PCB board in the circumferential direction.

[0019] Furthermore, the connection piece is provided with at least one connection post, At least one of the first vias is located between two adjacent connection posts.

[0020] Furthermore, at least the connecting rod and the portion of the connecting piece that is flush with the connecting rod are made of a transparent material.

[0021] Furthermore, the peripheral side surface of the connecting post is a matte surface.

[0022] Furthermore, the total supporting strength of the plurality of connecting pieces is more than eight times the weight of the LED transparent display screen. [Effects of the Invention]

[0023] In a technical solution according to an embodiment of the present invention, an LED transparent display screen includes a PCB substrate, a plurality of connecting pieces, and a plurality of LED chips, the PCB substrate having a plurality of first vias, the LED chips arranged in an array on the PCB substrate and distributed around the plurality of first vias, thereby forming a transparent display screen, the plurality of connecting pieces are all distributed on a surface of the PCB substrate opposite the plurality of LED chips, and a plurality of connecting posts are provided on a surface of each connecting piece facing the PCB substrate, the plurality of connecting posts penetrate the plurality of first vias and have adhesive on their end surfaces, the adhesive on the end surfaces of the connecting posts can fix and connect the transparent display screen to a transparent glass, which makes it easy to remove and maintain the transparent display screen and avoids the impact of directly applying adhesive on the chips on the display effect.

[0024] In order to more clearly describe the embodiments of the present invention or the technical solutions in the prior art, the drawings necessary for describing the embodiments or the prior art will be briefly described below. The drawings in the following description are some embodiments of the present invention, and it is obvious to those skilled in the art that other drawings can be obtained based on these drawings without any creative efforts. [Brief explanation of the drawings]

[0025] [Figure 1] 1 is a schematic diagram of a planar connection of an LED transparent display screen according to an embodiment of the present invention; [Figure 2] 1 is a schematic cross-sectional view of a cross section of an LED transparent display screen according to an embodiment of the present invention; [Figure 3] 1 is a schematic diagram of a further planar connection of an LED transparent display screen according to an embodiment of the present invention; [Figure 4] 3 is a schematic cross-sectional view of a further cross section of an LED transparent display screen according to an embodiment of the present invention; [Figure 5] 1 is a schematic planar cross-sectional view of two connected LED transparent display screens according to an embodiment of the present invention; FIG. DETAILED DESCRIPTION OF THE INVENTION

[0026] In order to clarify the objectives, technical solutions and advantages of the embodiments of the present invention, the technical solutions in the embodiments of the present invention will be described clearly and completely below with reference to the drawings in the embodiments of the present invention, but it is clear that the described embodiments are only a part of the embodiments of the present invention, and are not all of the embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative work fall within the protection scope of the embodiments of the present invention.

[0027] In the description of this invention, when terms such as "first" and "second" appear, they are used only to facilitate the description of different parts or names, and cannot be understood to indicate or imply the order, relative importance, or number of technical features shown. Therefore, a feature defined by "first" or "second" may explicitly or implicitly include at least one feature. Furthermore, when "and / or" appears throughout the text, its meaning includes three parallel forms, such as "A and / or B," which includes form A, form B, or a form where both A and B are satisfied simultaneously.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art. The terms used in the specification of the present invention are for describing specific embodiments only and are not intended to limit the present invention.

[0029] Referring to FIG. 1, a schematic diagram of a planar connection of a light-emitting diode (LED) transparent display screen according to an embodiment of the present invention is shown. Hereinafter, this transparent display screen will be simply referred to as an LED transparent display screen. The LED transparent display screen includes a printed circuit board (PCB) 10, a plurality of LED chips 20, and a plurality of connecting pieces 30.

[0030] The multiple chips 20 are coupled to the PCB substrate 10, and the PCB substrate 10 can transmit information and supply electrical energy to the chips 20. When the chips 20 receive commands transmitted from the PCB substrate 10, they emit specific lights at specific times as required by the commands, causing the LED transparent display screen to display various screens and videos.

[0031] In some embodiments of the present application, a controller capable of executing instructions is integrated into the LED chip 20, and the PCB substrate 10 only plays a role in transmitting instruction information and transporting electrical energy; therefore, there is no need to connect additional electronic elements to the PCB substrate 10 for processing information or issuing instructions, which makes the surface of the PCB substrate 10 cleaner, and the surface of the PCB substrate 10 on which the chip 20 is located has no protrusions, improving the appearance, and also ensuring that the surface opposite to the chip 20 is flat and can be mounted on the PCB substrate 10.

[0032] Typically, the surface of the PCB substrate 10 on which the chip 20 is located is black, which can prevent the chip 20 from protruding from the PCB substrate 10, thereby improving the appearance of the LED transparent display screen when not in use and providing a good viewing experience. Of course, the color of the PCB substrate 10 is not limited to black and can be customized according to customer needs, but it is preferable that the color of the PCB substrate 10 be the same color to ensure the appearance without adversely affecting the viewing experience.

[0033] Specifically, referring to Figures 2 to 5, the plurality of LED chips 20 are arranged in an array on the PCB substrate, the PCB substrate 10 has a plurality of first vias 110 provided therein, the plurality of LED chips 20 are distributed around the plurality of first vias 110, the plurality of connection pieces 30 are all provided on the side of the PCB substrate 10 opposite the plurality of LED chips 20, and a plurality of connection pillars 310 are provided on the surface of each connection piece 30 facing the PCB substrate 10, and the plurality of connection pillars 310 penetrate the plurality of first vias 110 and have adhesive 320 provided on their end faces.

[0034] The transparent glass abuts the end of the connecting post 310 and is bonded to the supporting end through adhesive 320, so there is no need to apply adhesive to the LED chip, and the LED chip and the supporting object are spaced apart or in close contact with each other without any connecting medium between them, thereby not affecting the removal or maintenance of the LED chip.

[0035] Specifically, the plurality of first vias 110 are formed in the PCB substrate 10, and the size of the plurality of first vias 110 may be determined according to the area and thickness of the PCB substrate 10 and the specific specifications of the display screen. The plurality of first vias 110 are distributed in an array on the PCB substrate 10, and the plurality of LED chips 20 are provided in the gaps between these first vias 110, so that the plurality of LED chips 20 are also arranged in an array on the PCB substrate. Generally, a plurality of first vias 110 are provided around one LED chip 20. In this way, by forming the plurality of first vias 110 in the PCB substrate 10 on which the plurality of LED chips 20 are arranged, the LED display screen becomes an LED transparent display screen, that is, it is possible to view from one side of the display screen to the other side.

[0036] The layout of the LED chips 20 is located at the center of the array of first vias 110. In this case, four penetrating first vias 110 are provided at equal intervals in the circumferential direction for each LED chip 20, and the angle between two adjacent first vias 110 is 90° with the LED chip 20 as the center of the circle. Similarly, four LED chips 20 are provided at equal intervals in the circumferential direction for each first via 110, and the angle between two adjacent LED chips 20 is also 90° with the first via 110 as the center of the circle. Only one LED chip 20 can be installed in the central space between four adjacent first vias 110, which allows the best transparency to be achieved without affecting the installation of the LED chips 20.

[0037] The surface of the PCB substrate 10 opposite the LED chips 20 is provided with the plurality of connection pieces 30. That is, the connection pieces 30 and the LED chips 20 are located on the front and rear surfaces of the PCB substrate 10, respectively. The connection pieces 30 are provided with the plurality of connection posts 310 extending toward the PCB substrate 10. The plurality of connection posts 310 are generally distributed in a one-to-one correspondence with the plurality of first vias 110 of the PCB substrate 10. The diameter of the connection posts 310 is slightly smaller than the inner diameter of the first vias 110. Thus, the plurality of connection posts 310 penetrate the plurality of first vias 110, and the ends of the connection posts 310 extend to the surface of the PCB substrate 10 where the LED chips 20 are located, and are higher than the surface of the LED chips 20. Furthermore, the adhesive 320, which has high adhesive strength, is provided on the end surfaces of the connection posts 310. When the LED transparent display screen needs to be fixed to a transparent glass, the connecting piece 30 can be adhered and fixed to the transparent glass by penetrating the adhesive 320 at the end of the connecting post 310 of the first via 110. The LED transparent display screen can be fixed and connected to the transparent glass through the adhesive 320 at the end of the connecting post 310, which makes it easy to remove and maintain the transparent display screen and avoids the display effect that would be impaired if adhesive were directly applied on the LED chip.

[0038] The distance between the connecting post 310 and the wall of the first via 110 is 0.2 mm to 0.3 mm, and it is sufficient if the connecting post 310 can be inserted into the first via 110. The larger the diameter of the connecting post 310, the higher the supporting strength. Therefore, it can be understood that the larger the diameter of the connecting post 310, the better, as long as it can pass through the first via 110.

[0039] In some embodiments of the present application, as shown in Figures 2 to 5, a guide surface is provided in the circumferential direction of the support end, and the guide surface is such that the end of the connecting post 310 opposite the connecting body is inclined circumferentially toward the support end, thereby guiding the connecting post 310 so that it can easily enter the first via 110.

[0040] Furthermore, in another preferred embodiment of the present invention, the connecting piece 30 is provided with second vias 330 corresponding to the plurality of first vias 110 .

[0041] The second vias 330 are coaxial with the first vias 110 and have a diameter equal to or larger than the first vias 110 so as not to block the first vias 110. The second vias 330 and the connecting posts 310 all correspond to the corresponding first vias, i.e., some of the first vias 110 are coaxial with the connecting posts 310, and the remaining first vias 110 are coaxial with the second vias 330. This design can ensure a good transparency effect of the LED transparent display screen.

[0042] If the connecting posts 310 are not made of a transparent material, the first vias 110 into which the connecting posts 310 are inserted lose their light transmittance due to shading by the connecting posts 310, which may affect the light transmittance of the LED transparent screen. Therefore, in some embodiments of the present application, as shown in FIGS. 2 to 5 , at least the connecting posts and the portions of the connecting pieces flush with the connecting posts are made of a transparent material to allow light to pass through easily. That is, the connecting posts 30 may be transparent only at the connection portions with the connecting posts 310, with the remaining portions being opaque, or may be made of the same transparent material as the connecting posts 310. In the latter case, the connecting posts are completely transparent, but this application is not particularly limited as long as it does not affect light transmittance. The transparent material may be polycarbonate (PC) or acrylic plastic, with acrylic plastic or PC plastic having excellent transparency.

[0043] Furthermore, in another preferred embodiment of the present invention, the height of the connecting post 310 above the PCB substrate 10 is equal to or greater than the height of the LED chip 20 above the PCB substrate 10 .

[0044] Specifically, on the side of the PCB substrate 10 opposite to the connecting piece 30, the height of the connecting post 310 is equal to or greater than the height of the chip 20. With this design, when the LED transparent display screen is fixed and connected to the transparent glass, the LED chip 20 can be ensured to be spaced apart from or in contact with the transparent glass, which not only serves to protect the LED chip 20 but also facilitates removal and maintenance when the LED panel is broken.

[0045] Furthermore, in another preferred embodiment of the present invention, as shown in FIGS. 2 to 5, the connecting post 310 and the connecting body are of an integral structure, that is, the connecting piece is an integrated piece.

[0046] Here, the connecting post 310 and the connecting plate may be integrally injection molded, which increases the strength of the connecting piece 30 and improves the reliability when the LED transparent display screen is fixed and connected to the transparent glass by the connecting piece 30.

[0047] In this design, when the LED transparent display screen is fixed and connected to the transparent glass, the LED chip 20 is spaced apart from or in contact with the transparent glass, which serves to protect the LED chip 20 and is also convenient for removal and maintenance if the LED panel is broken.

[0048] There are multiple chips around the connecting post 310, and when light from the chips enters the connecting post 310 made of transparent material, refraction and reflection are unavoidable, so it is understandable that the transparency at the location where the connecting post 310 is located and the display effect around the connecting post 310 will be affected.

[0049] To solve the above-mentioned problems, in some embodiments of the present application, as shown in Figures 2 to 5, the peripheral side of the connecting post 310 is a matte surface, so that when the light from the LED chip 20 hits the anti-refractive cross section, the refractive index is significantly reduced, thereby not affecting the display effect or transparency of the LED transparent display screen. When the light is irradiated onto the matte surface of the peripheral side of the connecting post 310, it is reflected to the maximum extent instead of being refracted within the connecting post 310.

[0050] Furthermore, in another preferred embodiment of the present invention, as shown in Figs. 2 to 5, the LED transparent display screen comprises:

[0051] The reinforcing plate 40 is disposed between the PCB board 10 and the connecting piece 30 and has ends of the connecting posts 310 passing through it.

[0052] Specifically, the reinforcing plate 40 is further provided on the back of the PCB substrate 10, i.e., between the PCB substrate 10 and the connecting piece 30, and the reinforcing plate 40 can improve the strength of the PCB substrate 10, i.e., improve the strength of the entire LED transparent display screen.

[0053] Furthermore, in another preferred embodiment of the present invention, the reinforcing plate 40 is provided with third vias 410 corresponding to the plurality of first vias 110, and the ends of the plurality of connecting posts 310 pass through the third vias 410 and the first vias 110 in sequence.

[0054] Here, to ensure the transparency of the entire LED transparent display screen, the corresponding third vias 410 must also be drilled in the reinforcing plate 40. Specifically, the reinforcing plate 40 is provided with the third vias 410, which correspond one-to-one to the first vias 110, and in a preferred embodiment, both of them have the same size. The ends of the connecting posts 310 pass through the third vias 410 and the first vias 110 in sequence, then extend above the PCB substrate 10, and are bonded to the transparent glass. In yet another preferred embodiment of the present invention, the reinforcing plate 40 is a carbon fiber plate.

[0055] Here, the carbon fiber plate has the advantages of being lightweight and strong, so by using the carbon fiber plate as the reinforcing plate 40, the strength requirement can be met, the thickness of the reinforcing plate 40 can be minimized, and the weight of the LED transparent display screen can be reduced, making it easier to install and fix.

[0056] Furthermore, in another preferred embodiment of the present invention, the plurality of connection posts 310 of one connection piece 30 are respectively located on both sides of the joint between the two PCB substrates 10. Here, the connection piece 30 has the function of bonding and connecting the PCB substrate 10 to the transparent glass, as well as the function of joining the plurality of PCB substrates 10. Specifically, the connection piece 30 is provided at the connection portion of the two PCB substrates 10, and the plurality of connection posts 310 of the connection piece 30 are respectively located on both sides of the joint between the two PCB substrates 10. In this way, when the plurality of connection posts 310 are respectively inserted into the first vias 110 of the two PCB substrates 10, the two PCB substrates 10 can be easily connected.

[0057] That is, at least one connection piece 30 is located between two adjacent PCB boards, and at least one connection pillar 310 on the connection piece 30 is located on another PCB board, in this case, the connection piece 30 serves to connect the two adjacent PCB boards. In this case, some of the multiple connection pillars 310 of the connection piece 30 are located in the first vias 110 of one PCB board, and the rest are located in the first vias 110 of the other PCB board. The number of connection pillars 310 located on the two adjacent PCB boards is the same. To balance the connections, half of the connection pillars 310 of the same connection piece 30 are located on one PCB board 10, and the other half are located on the other PCB board 10.

[0058] Furthermore, in another preferred embodiment of the present invention, the four connecting pieces 30 are located at the four corners of the surface of the PCB substrate 10 opposite to the LED chips 20, respectively.

[0059] Specifically, the LED transparent display screen is generally rectangular in cross section, and the PCB substrate 10 is also rectangular in cross section. To ensure strength when bonding the LED transparent display screen to the transparent glass, the connecting pieces 30 are generally provided at each of the four corners of the surface of the PCB substrate 10 opposite to the LED chips 20, thereby achieving a more balanced adhesive force between the PCB substrate 10 and the transparent glass.

[0060] Furthermore, in another preferred embodiment of the present invention, the plurality of connecting pieces 30 are provided at equal intervals on the surface of the PCB substrate 10 opposite to the surface on which the plurality of LED chips 20 are provided.

[0061] Specifically, when the area of ​​the PCB substrate 10 is large, in order to ensure a relatively uniform adhesive force between the LED transparent display screen and the transparent glass, a plurality of the connecting pieces 30 are provided on the side of the PCB substrate 10 opposite the plurality of LED chips 20, and these connecting pieces 30 are distributed at equal intervals.

[0062] Here, the specific number of the plurality of connecting pieces 30 is generally determined by the area of ​​the PCB board 10 and the specific size of a single connecting piece 30 .

[0063] The number of connecting posts 310 on a connecting piece 30 may be more than one. When a connecting piece 30 has only one connecting post 310, not only does it use less material but it also provides more flexible support to the transparent glass. The spacing between two adjacent connecting posts 310 may be equal or unequal. Additional connecting posts 30 may be installed in areas with weaker support. However, in a configuration with only one connecting post 310, the end of the connecting post 310 opposite the connecting piece 30 is prone to rotation if not glued to the transparent glass. Therefore, it is preferable that the number of connecting posts 310 on a connecting piece 30 is two or more. The more connecting posts 310 there are, the stronger the support provided by the connecting piece 30. However, when the number of connecting posts 310 is increased, although an anti-refractive surface is provided around the connecting post 310, a small amount of light cannot be completely prevented from being refracted within the connecting post 310, which affects the display effect of the portion of the LED transparent display screen corresponding to the connecting post 310. Therefore, there should not be too many connecting pillars 310, and two adjacent connecting pillars 310 are spaced apart by at least one first via 110, thereby avoiding light from being refracted within the connecting pillars 310 and adversely affecting the display effect.

[0064] Meanwhile, the specific number of connecting pieces 30 is generally determined by the area of ​​the PCB board 10, the specific size of a single connecting piece 30, and the weight of the transparent glass. Usually, the load force of all the connecting pieces 30 provided is more than eight times the weight of the LED transparent display screen.

[0065] It should be noted that the above embodiments are only used to explain the technical solutions of the present invention, and are not intended to limit the same. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that the technical solutions described in the above embodiments may be modified or some technical features may be replaced with equivalents. However, these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. An LED transparent display screen including: a PCB substrate; and a plurality of LED chips arranged in an array on the PCB substrate, wherein a plurality of first vias are provided in the PCB substrate, and the plurality of LED chips are distributed around the plurality of first vias; An LED transparent display screen further comprising a plurality of connecting pieces, all of which are distributed on the surface of the PCB substrate opposite the plurality of LED chips, each of which has a plurality of connecting posts on its surface facing the PCB substrate, which penetrate the plurality of first vias, and whose end surfaces are provided with adhesive.

2. 2. The LED transparent display screen according to claim 1, wherein the connecting piece is provided with second vias corresponding to the plurality of first vias.

3. 2. The LED transparent display screen as claimed in claim 1, wherein the height of the connecting posts above the PCB substrate is equal to or greater than the height of the LED chips above the PCB substrate.

4. 2. The LED transparent display screen as claimed in claim 1, wherein the connecting posts and the connecting pieces are of an integral structure.

5. 2. The LED transparent display screen according to claim 1, further comprising a reinforcing plate disposed between the PCB substrate and the connecting piece, through which the ends of the connecting posts pass.

6. 6. The LED transparent display screen of claim 5, wherein the reinforcing plate is provided with third vias corresponding to the plurality of first vias, and the ends of the plurality of connecting posts pass through the third vias and the first vias in sequence.

7. 6. The LED transparent display screen as claimed in claim 5, wherein the reinforcing plate is a carbon fiber plate.

8. The LED transparent display screen according to any one of claims 1 to 7, characterized in that the plurality of connection posts in one connection piece are respectively located on both sides of the joint between the two PCB substrates.

9. The LED transparent display screen according to any one of claims 1 to 7, characterized in that the four connecting pieces are respectively provided at the four corners of the surface of the PCB substrate opposite to the plurality of LED chips.

10. 8. The LED transparent display screen according to claim 1, wherein the plurality of connecting pieces are provided at equal intervals on the surface of the PCB substrate opposite to the surface on which the plurality of LED chips are provided.

11. 3. The LED transparent display screen of claim 2, wherein the radius of the second via is equal to or greater than the radius of the first via.

12. 8. The LED transparent display screen according to claim 1, wherein the diameter of the connecting post is less than the diameter of the first via.

13. 13. The LED transparent display screen as claimed in claim 12, wherein the difference between the radius of the first via and the radius of the connecting post is 0.2 mm or more and 0.3 mm or less.

14. The LED transparent display screen according to any one of claims 1 to 7, characterized in that the connecting posts have guide surfaces at their ends opposite to the PCB board in a circumferential direction.

15. The connection piece is provided with at least one connection post, 8. The LED transparent display screen according to claim 1, wherein at least one of the first vias is located between two adjacent connection posts.

16. The LED transparent display screen according to any one of claims 1 to 7, characterized in that at least the connecting posts and the portions of the connecting pieces that are flush with the connecting posts are made of a transparent material.

17. 13. The LED transparent display screen according to claim 12, wherein the peripheral side surface of the connecting post is a matte surface.

18. 8. The LED transparent display screen according to claim 1, wherein the total supporting strength of the plurality of connecting pieces is eight times or more the weight of the LED transparent display screen.

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