Lead bending inspection equipment and component mounting machine

Abstract

To suppress delay of an inspection while securing an inspection accuracy.SOLUTION: A lead bending inspection device comprises a projection part, a light reception part, a storage part, an inspection part, and an adjustment part. The storage part stores a relation between a light reception amount and a measurement value detected by the right reception part. The inspection part derives the measurement value on the basis of the stored relation and the light reception amount detected by the light reception part in a state where a component is arranged in an inspection position where light from the projection part is irradiated to tip end parts of a plurality of leads with an optical axis in parallel with arrangement directions of the plurality of leads, and inspects lead bending of the component on the basis of the measurement value. The adjustment part performs shift adjustment processing for shifting the relation so that the light reception amount detected by the light reception part is corresponded to a reference value of the measurement value in a state where nothing is arranged in the inspection position before the inspection, and performs resetting processing for resetting the relation stored in the storage part on the basis of the light reception amount detected by the light reception part in the state where nothing is arranged in the inspection position when a predetermined condition is established.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] This specification discloses a lead bending inspection device and a component mounting machine. [Background technology]

[0002] Conventionally, there are known devices for inspecting the bending of multiple lead wires arranged on the side of an electronic component (component). For example, Patent Document 1 discloses a component mounter that includes a head having a suction means for suctioning the component, a moving device for moving the head, and a light source (light projecting unit) and an optical sensor (light receiving unit) arranged facing each other at a predetermined distance. The component mounter picks up the component, inspects the lead wires of the component for bending, and then mounts the component on a board. The lead wire inspection is performed by moving the component to a detection position where light is projected from the light source toward the tips of the multiple lead wires with an optical axis parallel to the arrangement direction of the multiple lead wires, measuring the thickness of the multiple lead wires as viewed from the side based on the amount of light received by the optical sensor (light receiving unit), and detecting the amount of deviation of the lead wires from their normal positions based on the measured thickness. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 3-208400 Summary of the Invention [Problem to be solved by the invention]

[0004] The relationship between the amount of received light and the measured value is initially set so that the amount of received light detected by the light-receiving unit when nothing is placed at the inspection position between the light-emitting unit and the light-receiving unit is the reference amount of received light. However, because the amount of received light detected by the light-receiving unit constantly changes due to disturbances in the optical sensor's installation environment and changes in the optical axis, it is difficult to maintain sufficient inspection accuracy with the initial setting. While it is possible to reset the reference amount of received light before each inspection, this requires writing the data to non-volatile memory, which takes a certain amount of time, resulting in waiting times and delays in the inspection, thereby reducing production efficiency. Furthermore, frequent resetting can shorten the memory's lifespan due to frequent writing to memory.

[0005] The main purpose of the present disclosure is to suppress delays in inspection while ensuring inspection accuracy in a device that irradiates light from a light-emitting unit in the direction of arrangement of lead wires and inspects lead bending based on the amount of light received detected by a light-receiving unit. [Means for solving the problem]

[0006] The present disclosure has adopted the following means to achieve the above-mentioned main object.

[0007] The lead bend inspection device disclosed herein is a lead bend inspection device that inspects lead bends of a component having a component body and a plurality of leads protruding outward from a side edge of the component body, and includes a light-projecting unit, a light-receiving unit installed facing the light-projecting unit at a predetermined distance, a memory unit that stores the relationship between the amount of received light detected by the light-receiving unit and a measurement value, an inspection unit that derives a measurement value based on the amount of received light detected by the light-receiving unit and the relationship stored in the memory unit when the component is placed at an inspection position where light from the light-projecting unit is irradiated onto the tips of the plurality of leads with an optical axis parallel to the arrangement direction of the plurality of leads, and inspects the lead bends of the component based on the measurement value, and a memory unit that calculates the relationship before inspection so that the amount of received light detected by the light-receiving unit corresponds to a reference value of the measurement value when nothing is placed at the inspection position. offset do offsetWhen the adjustment process is performed and a predetermined condition is met, offset The gist of the invention is that it includes an adjustment unit that performs a resetting process, instead of an adjustment process, to reset the relationship stored in the memory unit based on the amount of light received detected by the light receiving unit when nothing is placed at the inspection position.

[0008] The lead bend inspection device disclosed herein comprises a light-projecting unit, a light-receiving unit, a memory unit, an inspection unit, and an adjustment unit. The memory unit stores the relationship between the amount of received light detected by the light-receiving unit and a measurement value. The inspection unit derives a measurement value based on the amount of received light detected by the light-receiving unit and the relationship stored in the memory unit when a component is placed at an inspection position where light from the light-projecting unit is irradiated onto the tips of the multiple leads with an optical axis parallel to the arrangement direction of the multiple leads, and inspects the component for lead bend based on the measurement value. Before inspection, the adjustment unit adjusts the relationship so that the amount of received light detected by the light-receiving unit when nothing is placed at the inspection position corresponds to a reference value for the measurement value. offset do offset When the adjustment process is performed and the specified conditions are met, offset Instead of the adjustment process, a reset process is performed to reset the relationship stored in the memory unit based on the amount of light received by the light receiving unit when nothing is placed at the inspection position. This process is completed in a short time, although the accuracy is slightly lower than that of the reset process. offset By executing the adjustment process and the resetting process as necessary, it is possible to suppress delays in the examination while ensuring the examination accuracy.

[0009] The component mounting machine of the present disclosure is a component mounting machine equipped with the lead bend inspection device of the present disclosure described above, and is characterized by comprising a head having a holding member that holds the component, a head moving device that moves the head, and a control device that controls the head and the head moving device to hold the component on the holding member, move the held component to the inspection position, inspect the component for lead bends, and then mount the component on the board.

[0010] The component mounting machine of the present disclosure is equipped with the lead bending inspection device of the present disclosure, and therefore can suppress inspection delays while ensuring inspection accuracy, thereby shortening the mounting cycle time and improving production efficiency. [Brief explanation of the drawings]

[0011] [Figure 1] 1 is a schematic configuration diagram of a component mounter according to an embodiment of the present invention; [Figure 2] FIG. [Figure 3] FIG. 2 is a block diagram showing the electrical connection relationship between the component mounter and the management device. [Figure 4] FIG. 1 is a schematic diagram illustrating the configuration of a lead bending inspection device. [Figure 5] FIG. 2 is a perspective view of a lead bending inspection device. [Figure 6] FIG. 10 is an explanatory diagram showing the inspection of a component without bent leads. [Figure 7] FIG. 10 is an explanatory diagram showing how a component having bent leads is inspected. [Figure 8] 10 is a flowchart illustrating an example of a component mounting process. [Figure 9] FIG. 4 is an explanatory diagram showing an example of a measurement map. [Figure 10] 10 is a flowchart illustrating an example of an inspection preparation process. [Figure 11] 10 is an explanatory diagram illustrating the amount of received light detected by the light receiver when the optical axis of the light projector is not tilted relative to the light receiver. FIG. [Figure 12] 10 is an explanatory diagram illustrating the amount of received light detected by the light receiver when the optical axis of the light projector is inclined with respect to the light receiver. FIG. [Figure 13] 10A and 10B are explanatory diagrams illustrating a zero-point offset and a reference light-receiving amount setting. [Figure 14] 10A and 10B are explanatory diagrams illustrating mounting cycle times when a reference received light amount is reset and when a zero point offset is performed as preparation for inspection. [Figure 15] 10A and 10B are explanatory diagrams showing the time-dependent change in the zero-point offset amount and the amount of received light; DETAILED DESCRIPTION OF THE INVENTION

[0012] Next, a mode for carrying out the present invention will be described using examples.

[0013] FIG. 1 is a configuration diagram showing an outline of the configuration of a component mounter 10 of this embodiment. FIG. 2 is a top view of the component mounter 10. FIG. 3 is a block diagram showing the electrical connection relationship between the component mounter 10 and a management device 80. FIG. 4 is a schematic configuration diagram of a lead bend inspection device 50. FIG. 5 is a perspective view of the lead bend inspection device 50. Note that the left-right direction in FIG. 1 is the X-axis direction, the front (nearby) back (far) direction is the Y-axis direction, and the up-down direction is the Z-axis direction.

[0014] As shown in Figures 1 and 2, the component mounter 10 includes a component supply device 20, a board transport device 23, a head moving device 30, a head 40, a lead bend inspection device 50, and a control device 60 (see Figure 3). In addition to these, the component mounter 10 also includes a part camera 24, a mark camera 25, a disposal box 26, and the like. A plurality of component mounters 10 are arranged in the board transport direction (X-axis direction) to form a production line. The production line is managed by a management device 80.

[0015] The component supply device 20 is detachably installed at the front end of the base 11 of the component mounter 10. This component supply device 20 includes a tape feeder 21 and a tray feeder 22. The tape feeder 21 is installed so as to be aligned in the left-right direction (X-axis direction) and supplies components by pulling out a tape, in the front-rear direction (Y-axis direction), from a reel. The tape has components accommodated in each of a plurality of recesses formed at predetermined intervals in the longitudinal direction. The tray feeder 22 supplies components by feeding out trays in the front-rear direction (Y-axis direction), in which components are accommodated in each of a plurality of recesses formed in a lattice pattern. The tray feeder 22 is used to supply IC components such as SOPs (Small Outline Packages) and QFPs (Quad Flat Packages).

[0016] The substrate transport device 23 includes a pair of conveyor rails arranged on the base 11 at a distance in the front-to-rear direction (Y-axis direction). The substrate transport device 23 drives the pair of conveyor rails to transport the substrate S from left to right (substrate transport direction) in FIG.

[0017] As shown in FIG. 1, the head moving device 30 includes a pair of X-axis guide rails 31, an X-axis slider 32, a pair of Y-axis guide rails 35, and a Y-axis slider 36. The pair of Y-axis guide rails 35 are installed on the upper stage of the housing 12 so as to extend parallel to each other in the front-to-rear direction (Y-axis direction). The Y-axis slider 36 is hung between the pair of Y-axis guide rails 35 and is moved back and forth by a Y-axis actuator 37 (see FIG. 3). The pair of X-axis guide rails 31 are installed in front of the Y-axis slider 36 so as to extend parallel to each other in the left-to-right direction (X-axis direction). The X-axis slider 32 is hung between the pair of X-axis guide rails 31 and is moved left and right by an X-axis actuator 33 (see FIG. 3). A head 40 is attached to the X-axis slider 32, and the head moving device 30 moves the X-axis slider 32 and the Y-axis slider 36, thereby moving the head 40 in the horizontal direction (XY direction).

[0018] As shown in FIG. 3 , the head 40 includes a Z-axis actuator 41 and a θ-axis actuator 43. The Z-axis actuator 41 moves the suction nozzle 45 up and down (in the Z-axis direction). The θ-axis actuator 43 rotates the suction nozzle 45 around the Z-axis. The suction port of the suction nozzle 45 is selectively connected to a negative pressure source, a positive pressure source, and an air inlet by a solenoid valve (not shown). The head 40 can pick up a component by contacting the suction port of the suction nozzle 45 with the top surface of the component while the suction port of the suction nozzle 45 is connected to a negative pressure source. The head 40 can also release the component from suction by connecting the suction port of the suction nozzle 45 to a positive pressure source and releasing the suction of the component by positive pressure.

[0019] 2, the part camera 24 is installed between the part supply device 20 and the board transport device 23 on the base 11. The part camera 24 detects whether the part picked up by the suction nozzle 45 is a part. As the component passes above part camera 24, the bottom surface of the component is imaged from below. The image captured by part camera 24 is output to control device 60. Control device 60 performs image processing on the image captured by part camera 24 to recognize the component, thereby determining whether or not the component is being picked up by suction nozzle 45 and measuring the amount of positional deviation of the picked-up component.

[0020] As shown in Fig. 1, the mark camera 25 is attached to the X-axis slider 32. The mark camera 25 captures an image of the mark attached to the surface of the substrate S from above. The captured image captured by the mark camera 25 is output to the control device 60. The control device 60 performs image processing on the captured image of the mark camera 25 to recognize the mark, thereby confirming the position of the substrate S.

[0021] The disposal box 26 is installed adjacent to the parts camera 24, and is used to dispose of the part that is the subject of the abnormality when an abnormality occurs in the picked-up part.

[0022] The lead bending inspection device 50 inspects whether any of the leads 102 have any abnormalities when mounting a component 100, such as an SOP or QFP, that has multiple leads 102 protruding in a gull-wing (L-shape) shape from the side of the component body 101. Abnormalities in the leads 102 include lead lift, in which the leads 102 are bent outward from the component body 101, and lead break, in which the leads 102 are bent inward from the component body 101. Both of these abnormalities prevent all of the leads 102 protruding from the side of the component body 101 from making uniform contact with the board S (solder), which can result in defective products.

[0023] As shown in FIG. 2, lead bend inspection device 50 is installed between component supply device 20 and board transport device 23 on base 11, adjacent to part camera 24. As shown in FIG. 4, lead bend inspection device 50 includes light projector 51, light receiver 52 arranged to face light projector 51 at a predetermined distance, and external slits 53 and 54 arranged on the light projector 51 side and the light receiver 52 side, respectively, across the inspection position, for narrowing the width of light traveling from light projector 51 to light receiver 52. Alignment marks 55 and 56 are provided on the top surfaces of light projector 51 and light receiver 52 for aligning the position of component 100 with the inspection position of lead bend inspection device 50. Note that marks 55 and 56 may be omitted.

[0024] When conducting lead bend inspection using lead bend inspection device 50, control device 60 aligns component 100 at the inspection position while component 100 is being picked up by suction nozzle 45. As shown in FIGS. 4 and 5 , the inspection position is a position where the optical axis of projector 51 is parallel to the arrangement direction of multiple leads 102 protruding from one side of component body 101 and passes through the tips of the multiple leads 102. The component 100 is aligned by driving and controlling X-axis actuator 33 and Y-axis actuator 37 of head moving device 30 and driving and controlling Z-axis actuator 41 and θ-axis actuator 43 of head 40 to move suction nozzle 45, which is picking up component 100, in the X and Y axes directions and rotate it in the θ axis direction. The width of the light from projector 51 to receiver 52 is narrowed by external slits 53 and 54, allowing pinpoint light to be directed only at the tips of leads 102.

[0025] Next, the control device 60 drives and controls the light projector 51 so that light is projected from the light projector 51 towards the light receiver 52. As a result, part of the light from the light projector 51 is blocked by the tips of the multiple leads 102, and the remaining light is received by the light receiver 52. Here, if lead lifting or the like occurs in some of the multiple leads 102 protruding from one side of the component body 101, resulting in a mixture of normal and abnormal leads, the apparent thickness T of the multiple leads 102 in a side view becomes larger than when all of the multiple leads 102 are normal (see Figures 6 and 7). The thickness T becomes larger as the degree of lead lifting or the like becomes greater. And, when the thickness T becomes larger, As the thickness T increases, the rate at which the leads 102 block light from the light emitter 51 increases, and the amount of light received by the light receiver 52 decreases. Therefore, the control device 60 can determine the state of the leads 102 based on the amount of light received by the light receiver 52. That is, the control device 60 measures the thickness T based on the light reception signal from the light receiver 52, and if the thickness T is within the allowable range, it determines that all of the leads 102 protruding from one side of the component body 101 are normal, and if the thickness T is not within the allowable range, it determines that one of the leads 102 is abnormal.

[0026] If component 100 is configured as a QFP having multiple leads protruding from each of the four sides of component body 101, control device 60 determines the state of all of the leads protruding from the four sides by rotating component 100 by 90 degrees and directing light from projector 51 to the tips of the multiple leads protruding from the corresponding side at each rotation position. If component 100 is configured as an SOP or SSOP having multiple leads protruding from each of two opposing side edges of the body, control device 60 determines the state of all of the leads protruding from the two side edges by rotating component 100 by 180 degrees and directing light from projector 51 to the tips of the multiple leads protruding from the corresponding side at each rotation position.

[0027] As shown in FIG. 3 , the control device 60 is configured as a microprocessor centered around a CPU 61. In addition to the CPU 61, the control device 60 also includes a ROM 62, a RAM 63, a nonvolatile memory 64 such as an EEPROM, and an input / output interface 65. These components are electrically connected via a bus 66. Various detection signals are input to the control device 60 via the input / output interface 65. The various detection signals input to the control device 60 include a position signal from the X-axis position sensor 34 that detects the position of the X-axis slider 32, a position signal from the Y-axis position sensor 38 that detects the position of the Y-axis slider 36, a position signal from the Z-axis position sensor 42 that detects the position of the suction nozzle 45 in the Z-axis direction, and a position signal from the θ-axis position sensor 44 that detects the position of the suction nozzle 45 in the θ-axis direction. The various signals input to the control device 60 also include an image signal from the parts camera 24, an image signal from the mark camera 25, and a light-receiving signal from the light receiver 52 of the lead bend inspection device 50. Meanwhile, the control device 60 outputs various control signals via the input / output interface 65. The various control signals output from the control device 60 include a control signal to the component supply device 20 and a control signal to the board transport device 23. The various control signals output from the control device 60 also include a drive signal to the X-axis actuator 33, a drive signal to the Y-axis actuator 37, a drive signal to the Z-axis actuator 41, and a drive signal to the θ-axis actuator 43. The various control signals output from the control device 60 also include a control signal to the parts camera 24, a control signal to the mark camera 25, and a drive signal to the projector 51 of the lead bend inspection device 50. The control device 60 is also connected to the management device 80 so as to be able to communicate bidirectionally, and they exchange data and control signals with each other.

[0028] The management device 80 is, for example, a general-purpose computer, and as shown in FIG. 3 , includes a CPU 81, ROM 82, RAM 83, a storage device 84 such as an HDD or SSD, and an input / output interface 85. These are electrically connected via a bus 86. Input signals are input to the management device 80 from an input device 87 such as a mouse or keyboard via the input / output interface 85. In addition, image signals are output from the management device 80 to a display 88 via the input / output interface 85. The storage device 84 stores production jobs for the boards S. Here, the production jobs for the boards S include a production schedule, such as which components are to be mounted on the boards S in each mounter 10 and in what order, and how many boards S with components mounted in that manner are to be produced. The management device 80 generates production jobs based on various data input by an operator via the input device 87, and instructs each mounter 10 to produce a product by transmitting the generated production jobs to each mounter 10. do.

[0029] Next, the operation of the component mounter 10 of this embodiment configured as described above will be described. In particular, the operation when mounting a component 100 (IC component) having leads 102 protruding laterally from the component body 101 will be described. Fig. 8 is a flowchart showing an example of component mounting processing executed by the CPU 61 of the control device 60. This processing is repeatedly executed at predetermined time intervals when a production instruction is received from the management device 80.

[0030] When the component mounting process is executed, the CPU 61 of the control device 60 first controls the head moving device 30 to move the suction nozzle 45 above the component supply position where the component 100 is supplied from the component supply device 20 (tray feeder 22) (S100), and then performs a suction operation to have the suction nozzle 45 pick up the component 100 (S110). Specifically, the suction operation is performed by controlling the Z-axis actuator 41 to lower the suction nozzle 45 until the tip (suction port) of the suction nozzle 45 abuts the top surface of the component 100, and by controlling the solenoid valve to apply negative pressure to the suction port of the suction nozzle 45. Next, the CPU 61 starts preparations (inspection preparations) for inspecting the picked-up component 100 for lead bending (step S120). Details of the inspection preparations will be described later.

[0031] Next, CPU 61 controls the driving of head moving device 30 so that component 100 picked up by suction nozzle 45 moves above part camera 24 (S130). CPU 61 then captures an image of component 100 with part camera 24 (S140), and performs image processing to recognize picked-up component 100 based on the captured image (S150).

[0032] Next, CPU 61 controls and drives head moving device 30 so that component 100 picked up by suction nozzle 45 moves to the inspection position of lead bend inspection device 50 (S160). This process is performed as follows. That is, CPU 61 confirms the pickup position of component 100 through the image processing performed on the image of component 100 captured by part camera 24 in S150. Next, CPU 61 controls and drives head moving device 30 so that mark camera 25 moves above marks 55, 56 affixed to light projector 51 and light receiver 52, thereby capturing images of marks 55, 56 with mark camera 25. Next, CPU 61 confirms the inspection position of lead bend inspection device 50 (the position of the optical axis of light projector 51) based on the captured image. Then, the CPU 61 drives and controls the head moving device 30 so that the tips of the multiple leads 102 protruding from one side of the component 100 move to the inspection position based on the suction position of the component 100, the inspection position of the lead bend inspection device 50, and the size of the component 100 that was input in advance.

[0033] After moving the component 100 to the inspection position, the CPU 61 determines whether the inspection preparation started in S120 is complete (S170). If the CPU 61 determines that the inspection preparation is not complete, it returns to S170 and waits for the completion of the inspection preparation. If the CPU 61 determines that the inspection preparation is complete, it acquires the amount of received light δ detected by the light receiver 52 (S180) and measures the apparent thickness T of the multiple leads 102 in a side view based on the acquired amount of received light δ (S190). The thickness T is measured by previously determining the relationship between the amount of received light δ and the thickness T and storing it in the non-volatile memory 64 as a measurement map. When the amount of received light δ is given, the corresponding thickness T is derived from the measurement map. An example of this map is shown in FIG. 9. As shown in the figure, in the measurement map, the amount of received light δ and the thickness T have a monotonically decreasing proportional relationship, such that the thickness T decreases as the amount of received light δ increases.

[0034] When the CPU 61 measures the thickness T of the lead 102, it determines whether or not the zero point offset is being executed (S200). When it determines that the zero point offset is being executed, the CPU 61 performs an offset adjustment ( offset After performing the zero-point offset adjustment process (S210), the process proceeds to S220. If it is determined that zero-point offset is not being performed, the process skips S210 and proceeds to S220. Then, the CPU 61 determines whether the thickness T is less than the threshold value Tref (S220). If the CPU 61 determines that the thickness T is less than the threshold value Tref, it determines that no bend has occurred in any of the leads 102 of the component 100, and controls the drive of the head moving device 30 so that the component 100 picked up by the suction nozzle 45 moves above the mounting position on the board S (S230). Then, the CPU 61 performs a mounting operation to mount the component 100 on the board S (S240), and ends the component mounting process. Specifically, the mounting operation is performed by controlling the drive of the Z-axis actuator 41 so that the suction nozzle 45 moves downward until the component 100 picked up by the suction nozzle 45 abuts against the board S, and by controlling the drive of the solenoid valve so that a positive pressure acts on the suction port of the suction nozzle 45.

[0035] On the other hand, if CPU 61 determines that thickness T is equal to or greater than threshold value Tref, it determines that one of leads 102 of component 100 is bent, and controls the drive of head moving device 30 so that component 100 picked up by suction nozzle 45 moves above discard box 26 (S250). Then, CPU 61 discards component 100 in discard box 26 (S260), and ends the component mounting process.

[0036] Next, the inspection preparation executed in S120 will be described. Fig. 10 is a flowchart showing an example of the inspection preparation process. In the inspection preparation process, the CPU 61 first acquires the amount of received light δ detected by the light receiver 52 when nothing is placed at the inspection position (S300), and performs zero-point offset based on the acquired amount of received light δ (S310). The zero-point offset is a process for determining the offset amount F used in the offset adjustment in S210 described above. Specifically, the zero-point offset is performed by determining the amount of thickness T as the offset amount F so that the thickness T derived from the measurement map based on the amount of received light δ detected by the light receiver 52 when nothing is placed at the inspection position becomes zero.

[0037] After determining the offset amount F, the CPU 61 determines whether the offset amount F is equal to or greater than a predetermined amount Fref (S320). Here, the predetermined amount Fref is a threshold value for determining whether sufficient measurement accuracy can be ensured by the offset adjustment in S210. If the CPU 61 determines that the offset amount F is less than the predetermined amount Fref, it determines that the test preparation is complete (S380) and ends the test preparation process.

[0038] On the other hand, if the CPU 61 determines that the offset amount F is equal to or greater than the predetermined amount Fref, it determines that sufficient measurement accuracy cannot be ensured by offset adjustment, and further determines whether the amount of received light δ acquired in S300 is equal to or greater than the predetermined amount δref (S330). If the CPU 61 determines that the amount of received light δ is equal to or greater than the predetermined amount δref, it cancels the zero-point offset (S340) and executes a reference received light amount setting (resetting process) (S350). In this embodiment, the reference received light amount is set by determining in advance, through experiments, the thickness T when the amount of received light δ is 0 as the reference thickness T0, and the amount of received light δ detected by the light receiver 52 when nothing is placed at the inspection position as the reference received light amount δ0 when the thickness T is 0. The relationship (δ, T) between the amount of received light δ and the thickness T is defined as the linear relationship connecting the point (0, T0) indicating the reference thickness T0 and the point (δ0, 0) indicating the reference received light amount δ0. This creates a new measurement map. When the CPU 61 creates a new measurement map, it updates the measurement map stored in the non-volatile memory 64 with the newly created measurement map (S360). Then, the CPU 61 determines whether the updating of the measurement map is complete (S370), and if it determines that the updating of the measurement map is complete, it determines that the inspection preparation is complete (S380), and ends the inspection preparation process.

[0039] If the CPU 61 determines in S330 that the amount of received light δ acquired in S300 is less than the predetermined amount δref, the amount of received light is insufficient and the lead bending inspection cannot be performed with sufficient accuracy. The control unit 80 determines that the component mounter 10 is unable to perform the inspection, outputs an error (S390), and ends the inspection preparation process. The error is output by stopping the operation of the component mounter 10 and outputting an abnormality signal to the management device 80. Upon receiving the abnormality signal, the management device 80 displays a message on the display 88 to prompt the operator to perform maintenance on the lead bend inspection device 50. This makes it possible to perform maintenance on the lead bend inspection device 50 at an appropriate time. Furthermore, since the lead bend inspection device 50 can always perform inspections in a normal state, it is possible to prevent missed detections and false detections.

[0040] FIG. 11 is an explanatory diagram illustrating the amount of received light detected by the receiver when the optical axis of the transmitter is not tilted relative to the receiver. FIG. 12 is an explanatory diagram illustrating the amount of received light detected by the receiver when the optical axis of the transmitter is tilted relative to the receiver. As described above, the light emitted from the transmitter 51 is narrowed by the external slits 53 and 54 and received by the receiver 52. Therefore, as shown in FIG. 12, when the optical axis of the transmitter 51 is tilted, the amount of received light detected by the receiver 52 is smaller than the amount of received light detected by the receiver 52 when the optical axis of the transmitter 51 extends straight toward the receiver 52 as shown in FIG. 11. As a result, the thickness T is measured to be larger than the actual thickness. For example, if the amount of light received δ detected by the receiver 52 decreases from the amount of light received (reference amount of light received) δ0 to the amount of light received δ0' due to a change in the optical axis of the projector 51 when nothing is placed at the inspection position, the thickness T derived from the measurement map will be the value T' instead of the value 0 (see Figure 13), resulting in an erroneous measurement.

[0041] In contrast, by defining the amount of received light δ detected by the light receiver 52 when nothing is placed at the inspection position as the reference amount of received light δ0 when the thickness T is zero, and defining the relationship (δ, T) between the amount of received light δ and the thickness T as the relationship on the line (see the dashed-dotted line in Figure 13) connecting the point (0, T0) indicating the reference thickness T0 and the point (δ0, 0) indicating the reference amount of received light δ0, and creating a new measurement map based on this, sufficient measurement accuracy can be ensured even when the optical axis of the projector 51 changes. However, because updating the measurement map requires a certain amount of time, updating the measurement map every time a lead bend inspection is performed on a component 100 would result in waiting times for the lead bend inspection and reduced production efficiency. Furthermore, updating the measurement map requires writing data to the nonvolatile memory 64, and frequent writing shortens the life of the nonvolatile memory 64.

[0042] Therefore, in this embodiment, a zero-point offset (see the two-dot chain line in FIG. 13 ) is performed to determine the offset amount F for the thickness T' derived from the measurement map based on the amount of received light δ detected by the light receiver 52 when nothing is placed at the inspection position, thereby ensuring a certain degree of measurement accuracy against fluctuations in the amount of received light. The zero-point offset simply determines the offset amount F for offsetting the thickness T derived from the measurement map, and does not require updating the measurement map. Therefore, it is possible to complete preparation for inspection in a shorter time than when setting the reference amount of received light. As a result, as shown in FIG. 14 , in a mounting cycle that includes a lead bend inspection, completing inspection preparation in a shorter time using the zero-point offset reduces waiting time for inspection and shortens the mounting cycle time.

[0043] However, the larger the offset amount F, the greater the deviation of the zero-point offset from the reference received light amount setting, resulting in a larger measurement error. For this reason, in this embodiment, as shown in Fig. 15, the zero-point offset is executed until the offset amount F reaches a predetermined amount Fref, and then the setting is switched to the reference received light amount setting once the offset amount F reaches the predetermined amount Fref. In this way, by normally executing the zero-point offset, which is slightly less accurate than the reference received light amount setting but can be prepared in a short time, and then executing the reference received light amount setting as needed, it is possible to improve production efficiency while maintaining inspection accuracy.

[0044] Here, the correspondence between the main elements of the embodiment and the main elements of the invention described in the Disclosure of the Invention section will be described. Specifically, the light projector 51 of the embodiment corresponds to the light projecting unit, the light receiver 52 corresponds to the light receiving unit, the nonvolatile memory 64 corresponds to the storage unit, the CPU 61 that executes the processes of S180, S190, and S220 of the component mounting process corresponds to the inspection unit, and the CPU 61 that executes the processes of S120, S200, and S210 of the component mounting process and the inspection preparation process corresponds to the adjustment unit. Furthermore, the suction nozzle 45 corresponds to the holding member, the head 40 corresponds to the head, the head moving device 30 corresponds to the moving device, and the control device 60 corresponds to the control device.

[0045] It goes without saying that the present invention is not limited to the above-described embodiments, and can be embodied in various forms as long as they fall within the technical scope of the invention of this disclosure.

[0046] For example, in the above-described embodiment, the CPU 61 executes zero-point offsetting in the inspection preparation process until the offset amount F becomes equal to or greater than the predetermined amount Fref, and then executes reference received-light intensity setting instead of zero-point offsetting when the offset amount F becomes equal to or greater than the predetermined amount Fref. However, the CPU 61 may count the number of consecutive executions of zero-point offsetting, execute zero-point offsetting until the number of consecutive executions becomes equal to or greater than the predetermined number, and then execute reference received-light intensity setting when the number of consecutive executions becomes equal to or greater than the predetermined number. Alternatively, the CPU 61 may execute zero-point offsetting until a predetermined time has elapsed, and then execute reference received-light intensity setting when the predetermined time has elapsed.

[0047] In the above-described embodiment, the CPU 61 performs zero point offset or reference light reception setting as preparation for inspection every time the thickness T of the lead 102 is measured, but this is not limited to being performed every time, and may be performed every predetermined number of times.

[0048] As described above, the lead bend inspection device of the present disclosure includes a light-projecting unit, a light-receiving unit, a memory unit, an inspection unit, and an adjustment unit. The memory unit stores the relationship between the amount of received light detected by the light-receiving unit and a measurement value. The inspection unit derives a measurement value based on the amount of received light detected by the light-receiving unit and the relationship stored in the memory unit when a component is placed at an inspection position where light from the light-projecting unit is irradiated onto the tips of the multiple leads with an optical axis parallel to the arrangement direction of the multiple leads, and inspects the component for lead bend based on the measurement value. Before inspection, the adjustment unit adjusts the relationship so that the amount of received light detected by the light-receiving unit when nothing is placed at the inspection position corresponds to a reference value for the measurement value. offset do offset When the adjustment process is performed and the specified conditions are met, offsetInstead of the adjustment process, a reset process is performed to reset the relationship stored in the memory unit based on the amount of light received by the light receiving unit when nothing is placed at the inspection position. This process is completed in a short time, although the accuracy is slightly lower than that of the reset process. offset By executing the adjustment process and the resetting process as necessary, it is possible to suppress delays in the examination while ensuring the examination accuracy.

[0049] In the lead bending inspection device of the present disclosure, the predetermined condition is offset When you perform the adjustment process, offset Amount is specified offset The condition may be established when the amount is equal to or greater than the amount. offset If the measurement accuracy is insufficient in the adjustment process, a resetting process can be performed.

[0050] Furthermore, the lead bend inspection device of the present disclosure may include an error output unit that outputs an error when the amount of received light detected by the light receiving unit is less than a predetermined amount of received light when nothing is placed at the inspection position. This makes it possible to perform maintenance on the lead bend inspection device at an appropriate time. Of course, even if the amount of light decreases, the amount of received light is not affected until the amount of received light detected by the light receiving unit falls below the predetermined amount of received light. offset The adjustment and resetting processes ensure measurement accuracy, reducing the frequency of maintenance. This also allows the lead bend inspection device to perform inspections in a normal state at all times, reducing missed detections and false detections.

[0051] Furthermore, the lead bend inspection device of the present disclosure may include slits that are installed on both sides of the inspection position on the light-projecting unit side and the light-receiving unit side, and that narrow the width of the light traveling from the light-projecting unit to the light-receiving unit. This allows the light from the light-projecting unit to be aimed at the tip of the lead, thereby enabling more accurate lead inspection.

[0052] The present disclosure is not limited to the form of a lead bend inspection device, but may also be in the form of a component mounter equipped with a lead bend inspection device. [Industrial Applicability]

[0053] The present invention can be used in the manufacturing industry for lead bending inspection devices, component mounting machines, and the like. [Explanation of symbols]

[0054] 10 component mounter, 11 base, 12 housing, 20 component supply device, 21 tape food, 22 tray feeder, 23 board transport device, 24 parts camera, 25 mark camera, 26 waste box, 30 head movement device, 31 X-axis guide rail, 32 X-axis slider, 33 X-axis actuator, 34 X-axis position sensor, 35 Y-axis guide rail, 36 Y-axis slider, 37 Y-axis actuator, 38 Y-axis position sensor, 40 head, 41 Z-axis actuator, 42 Z-axis position sensor, 43 θ-axis actuator, 44 θ-axis position sensor, 45 suction nozzle, 50 lead bend inspection device, 51 light emitter, 52 light receiver, 53, 54 external slit, 55, 56 mark, 60 control device, 61 CPU, 62 ROM, 63 RAM, 64 non-volatile memory, 65 input / output interface, 66 bus, 74 Non-volatile memory, 80 management device, 81 CPU, 82 ROM, 83 RAM, 84 storage device, 85 input / output interface, 86 bus, 87 input device, 88 display, 100 component, 101 component body, 102 lead.

Claims

1. A lead bending inspection device for inspecting lead bending of a component having a component body and a plurality of leads protruding outward from a side edge of the component body, comprising: A light projecting unit; a light receiving unit disposed opposite the light projecting unit at a predetermined interval; a storage unit that stores a relationship between the amount of light received detected by the light receiving unit and a measurement value; an inspection unit that derives measurement values ​​that are apparent thicknesses of the leads in a side view based on the amount of light received by the light receiving unit and the relationship stored in the memory unit while the component is placed at an inspection position where light from the light projecting unit is irradiated onto the tip ends of the leads with an optical axis parallel to the arrangement direction of the leads, and inspects the lead bending of the component based on the measurement values; an adjustment unit that performs an offset adjustment process before an inspection to offset the relationship so that the amount of received light detected by the light receiving unit in a state where nothing is placed at the inspection position corresponds to a reference value of the measurement value, and when a predetermined condition is met, performs a resetting process instead of the offset adjustment process to reset the relationship stored in the storage unit based on the amount of received light detected by the light receiving unit in a state where nothing is placed at the inspection position; A lead bending inspection device comprising:

2. 2. The lead bending inspection device according to claim 1, The predetermined condition is a condition that is met when the offset amount becomes equal to or greater than a predetermined offset amount when the offset adjustment process is executed. Lead bending inspection device.

3. 3. The lead bending inspection device according to claim 1, an error output unit that outputs an error when the amount of received light detected by the light receiving unit is less than a predetermined amount of received light when nothing is placed at the inspection position; Lead bending inspection device.

4. 4. The lead bending inspection device according to claim 1, a slit section disposed on each of the light projecting section side and the light receiving section side across the inspection position, the slit section narrowing the width of light traveling from the light projecting section to the light receiving section; Lead bending inspection device.

5. A component mounter equipped with the lead bending inspection device according to any one of claims 1 to 4, a head having a holding member for holding the component; a head moving device that moves the head; a control device that controls the head and the head moving device so that the component is held by the holding member, the held component is moved to the inspection position, and the component is inspected for lead bending before being mounted on a board; A component mounting machine comprising:

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