High density substrate processing system and method

Abstract

An exemplary substrate processing system may include a load lock coupled to the factory interface and the factory field interface. The system may include a transfer chamber coupled to the load lock. The transfer chamber may include a robot configured to retrieve substrates from the load lock. The system may include a chamber system coupled to and disposed adjacent to the transfer chamber. The chamber system may include a transfer region laterally accessible to the robot. The transfer region may include multiple substrate supports disposed about the transfer region. Each substrate support of the multiple substrate supports may be vertically translatable. The transfer region may also include a transfer apparatus rotatable about a central axis and configured to engage and transfer substrates between the multiple substrate supports. The chamber system may also include multiple processing regions that are vertically offset and axially aligned with associated substrate supports.

Description

[Technical Field]

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS This application claims the benefit of priority to U.S. Provisional Patent Application No. 62 / 873,503, filed July 12, 2019, the contents of which are incorporated herein by reference in their entirety for all purposes.

[0002] This technology is related to the following applications, filed concurrently on July 12, 2019, entitled "ROBOT FOR SIMULTANEOUS SUBSTRATE TRANSFER" (U.S. Provisional Application No. 62 / 873,400), "ROBOT FOR SIMULTANEOUS SUBSTRATE TRANSFER" (U.S. Provisional Application No. 62 / 873,432), "ROBOT FOR SIMULTANEOUS SUBSTRATE TRANSFER" (U.S. Provisional Application No. 62 / 873,458), "ROBOT FOR SIMULTANEOUS SUBSTRATE TRANSFER" (U.S. Provisional Application No. 62 / 873,480), and "MULTI-LID STRUCTURE FOR SEMICONDUCTOR PROCESSING SYSTEMS" (U.S. Provisional Application No. 62 / 873,518), each of which is incorporated herein by reference in its entirety for all purposes.

[0003] Technical Field TECHNICAL FIELD The present technology relates to semiconductor processes and equipment, and more particularly to substrate processing systems and methods of substrate processing. [Background technology]

[0004] background Semiconductor processing systems often utilize cluster tools to integrate multiple process chambers. This configuration may facilitate the performance of several sequential processing operations without removing the substrate from the controlled processing environment, or may allow similar processes to be performed on multiple substrates at once in various chambers. These chambers may include, for example, degassing chambers, pre-treatment chambers, transfer chambers, chemical vapor deposition chambers, physical vapor deposition chambers, etch chambers, metrology chambers, and other chambers. The combination of chambers in a cluster tool, and the operating conditions and parameters under which these chambers are run, are selected to produce a particular structure using a particular process recipe and process flow.

[0005] Cluster tools often process large numbers of substrates by passing the substrates serially through a series of chambers for processing operations. The process recipe and sequence is typically programmed into a microprocessor controller that directs, controls, and monitors the processing of each substrate through the cluster tool. Once an entire cassette of wafers has been successfully processed through the cluster tool, the cassette may be passed to yet another cluster tool or a stand-alone tool, such as a chemical mechanical polisher, for further processing.

[0006] Robots are typically used to transfer wafers through the various processing and holding chambers. The time required for each process and processing operation directly affects the throughput of substrates per unit time. The substrate throughput of a cluster tool can be directly related to the speed of the substrate processing robot located within the transfer chamber. As processing chamber configurations become more developed, traditional wafer transfer systems may become insufficient.

[0007] Therefore, there is a need for improved systems and methods that can be used to efficiently orient substrates within a cluster tool environment. These and other needs are addressed by the present technology.

[0008] An exemplary substrate processing system may include a factory interface and a load lock coupled to the factory interface. The system may include a transfer chamber coupled to the load lock. The transfer chamber may include a robot configured to retrieve substrates from the load lock. The system may include a chamber system coupled to and disposed adjacent to the transfer chamber. The chamber system may include a transfer region laterally accessible to the robot. The transfer region may include multiple substrate supports disposed about the transfer region. Each substrate support of the multiple substrate supports may be vertically translatable along a central axis of the substrate support between a first position and a second position. The transfer region may also include a transfer apparatus rotatable about the central axis and configured to engage and transfer substrates between the multiple substrate supports. The chamber system may also include multiple processing regions vertically offset from the transfer region. Each processing region of the multiple processing regions may be axially aligned with an associated substrate support of the multiple substrate supports. Each processing region may be defined from below by an associated substrate support at the second position.

[0009] In some embodiments, the plurality of substrate supports in the transfer region of the chamber system may include at least four substrate supports. Each processing region of the plurality of processing regions may be fluidly coupled to the transfer region and fluidly isolated from each other processing region of the plurality of processing regions from above. The system may include at least two additional chamber systems coupled to and positioned adjacent to the transfer chamber. Each chamber system may define two accesses along a surface of the housing of the transfer region adjacent to the transfer chamber. A first of the two accesses may be aligned with a first substrate support of the plurality of substrate supports. A second of the two accesses may be aligned with a second substrate support of the plurality of substrate supports. The robot may include two arms configured to deliver or retrieve a first substrate from the first substrate support through the first access and simultaneously deliver or retrieve a second substrate from the second substrate support through the second access. The system may include at least three additional chamber systems coupled to and positioned adjacent to the transfer chamber. Each chamber system may define one access along a surface of the housing of the transfer region adjacent to the transfer chamber. The one access can be aligned with a first substrate support of the plurality of substrate supports. The robot can include an arm configured to deliver or retrieve a substrate from the first substrate support through the one access. The one arm of the robot can extend through the one access of each chamber system at an angle other than perpendicular to the one access.

[0010] Some embodiments of the present technology may include a method for processing a substrate in a substrate processing system. The method may include using a transfer chamber robot to deliver a substrate to a first substrate support in a transfer region of a chamber system. The method may include engaging the substrate on the first substrate support with a transfer apparatus housed in the transfer region of the chamber system. The method may include using the transfer apparatus to transfer the substrate to a second substrate support in the transfer region of the chamber system. The method may include lifting the substrate using the second substrate support along a central axis of the second substrate support to a first processing region above the transfer region. The second substrate support may at least partially define the first processing region from below. The method may also include processing the substrate in the first processing region.

[0011] In some embodiments, engaging a substrate with a transfer apparatus may include engaging at least three substrates with the transfer apparatus. Transferring the substrates may include transferring the at least three substrates to at least three other substrate supports within a transfer region using the transfer apparatus. Processing the substrates may include depositing one or more layers of material on the substrates. The method may also include lowering the substrate using a second substrate support to a position within the transfer region accessible by the transfer apparatus. The method may include engaging the substrate at the second substrate support with the transfer apparatus. The method may include transferring the substrate to a third substrate support within the transfer region of the chamber system using the transfer apparatus. The method may include lifting the substrate using the third substrate support along a central axis of the second substrate support to a second processing region above the transfer region. The third substrate support may at least partially define the second processing region from below.

[0012] The method may include depositing one or more additional layers of material on the substrate. The second processing region may be fluidly separated from the first processing region from above. The transfer apparatus may be rotatable about a central axis within the transfer region and configured to engage and transfer the substrate between the plurality of substrate supports. The chamber system may include multiple substrate supports arranged around the transfer region of the chamber system. Each substrate support of the plurality of substrate supports may be vertically translatable along the central axis of the substrate support between a first position and a second position. The chamber system may include multiple processing regions vertically offset from the transfer region of the chamber system. Each processing region of the multiple processing regions may be axially aligned with an associated substrate support of the plurality of substrate supports. The processing region may be defined from below by the associated substrate support at the second position. The transfer chamber robot may be housed in a transfer chamber adjacent to the chamber system.

[0013] Some embodiments of the present technology may include a chamber system including a transfer region. A housing of the transfer region may define at least one access for delivering or retrieving a substrate. The transfer region may include multiple substrate supports arranged around the transfer region. Each substrate support of the multiple substrate supports may be vertically translatable along a central axis of the substrate support between a first position and a second position. The system may include a transfer device within the transfer region. The transfer device may be rotatable about a central axis and configured to engage and transfer a substrate between the multiple substrate supports. The system may also include multiple processing regions vertically offset from the transfer region. Each processing region of the multiple processing regions may be axially aligned with an associated substrate support of the multiple substrate supports. The processing region may be defined from below by an associated substrate support at the second position.

[0014] Such techniques may offer many advantages over conventional systems and techniques. For example, processing systems may provide multi-substrate processing capabilities that can be expanded far beyond conventional designs within an economical footprint. Furthermore, each chamber system may provide multi-substrate processing, as well as a transfer apparatus that can reduce processing times. These and other embodiments, along with many of their advantages and features, are described in more detail in conjunction with the following description and accompanying figures.

[0015] A better understanding of the nature and advantages of the disclosed technology may be realized by reference to the remaining portions of the specification and the drawings. [Brief explanation of the drawings]

[0016] [Figure 1A] 1 shows a schematic top view of an exemplary processing system in accordance with some embodiments of the present technique; [Figure 1B] 1 shows a schematic partial cross-sectional view of an exemplary chamber system in accordance with some embodiments of the present technique; [Figure 2A] 1 shows a schematic isometric view of a transfer region of an exemplary chamber system in accordance with some embodiments of the present technique; [Figure 2B] 1 shows a schematic top plan view of a transfer region of an exemplary chamber system in accordance with some embodiments of the present technique. [Figure 3] 1 shows a schematic top view of an exemplary processing system in accordance with some embodiments of the present technique; [Figure 4] 1 shows a schematic top view of an exemplary processing system in accordance with some embodiments of the present technique; [Figure 5] 1 shows a schematic top view of an exemplary processing system in accordance with some embodiments of the present technique; [Figure 6] 1 illustrates exemplary operations in a method of processing a substrate in accordance with some embodiments of the present technique. [Figure 7A-7C] 7A-7C show schematic diagrams of a substrate being processed in accordance with some embodiments of the present technique. [Figure 7D-7E]7D-E show schematic diagrams of a substrate being processed in accordance with some embodiments of the present technique. DETAILED DESCRIPTION OF THE INVENTION

[0017] Some of the figures are included as schematic diagrams. It is understood that these figures are for illustrative purposes and should not be considered to be to scale or proportion unless specifically stated to be so. Furthermore, as schematic diagrams, the drawings are provided to aid in understanding and may not include all aspects or information compared to realistic depictions and may include exaggerated material for illustrative purposes.

[0018] In the accompanying figures, similar components and / or features may have the same reference label. Furthermore, various components of the same type may be distinguished by tracing the reference number with a letter that distinguishes the similar components. When only a first reference number is used herein, the description is applicable to any one of the similar components having the same first reference number, regardless of the letter.

[0019] Substrate processing can involve time-consuming operations to add, remove, or otherwise modify material on wafers or semiconductor substrates. Efficient material movement can reduce queue times and increase material throughput. To improve the number of substrates processed within a cluster tool, additional chambers can be incorporated into the mainframe. While tool lengthening allows for the continued addition of transfer robots and processing chambers, space inefficiencies can result as the cluster tool footprint expands. Therefore, the present technology can include cluster tools with an increased number of processing chambers within a defined footprint. To accommodate the limited footprint associated with the transfer robot, the technology can increase the number of processing chambers laterally outward from the robot. For example, some conventional cluster tools may include one or two processing chambers arranged about a centrally located section of the transfer robot to maximize the number of chambers radially about the robot. The present technology can extend this concept by incorporating additional chambers laterally outward as separate rows or groups of chambers. For example, the techniques may be applied to cluster tools that include three, four, five, six, or more processing chambers accessible at each of one or more robot access locations.

[0020] However, as additional process locations are added, accessing these locations from a central robot may no longer be feasible without additional transfer capabilities at each location. Some conventional techniques may include a wafer carrier on which the substrate remains seated during transfer. However, the wafer carrier can contribute to thermal non-uniformities and particle contamination on the substrate. The present technique overcomes these problems by incorporating a transfer section vertically aligned with the processing chamber area and a carousel or transfer device that can operate in coordination with the central robot to access additional wafer locations. In some embodiments, the present technique does not use a conventional wafer carrier and can transfer a particular wafer from one substrate support to a different substrate support within the transfer area. While the remaining disclosure routinely identifies specific structures, such as a four-position transfer area, in which the present structure and method may be used, it will be readily understood that the systems and methods are equally applicable to any number of structures and devices that may benefit from the described transfer capabilities. Thus, the present technique should not be considered limited to use with only specific structures. Furthermore, while an exemplary tool system is described to provide a foundation for the present technology, it should be understood that the present technology can be incorporated into any number of semiconductor processing chambers and tools that may benefit from some or all of the described operations and systems.

[0021] 1A shows a top view of one embodiment of a deposition, etch, bake, and cure chamber substrate processing tool or processing system 100 in accordance with some embodiments of the present technology. In the figure, a set of front-opening unified pods 102 supplies substrates of various sizes that are received within a factory interface 103 by robotic arms 104a and 104b and placed in a load lock or low-pressure holding area 106 before being delivered to one of the substrate processing regions 108, and placed in a chamber system or quad section 109a-c, each of which may be a substrate processing system having a transfer region fluidly coupled to multiple processing regions 108. While a quad system is shown, it should be understood that platforms incorporating standalone chambers, twin chambers, and other multi-chamber systems are equally encompassed by the present technology. A second robot arm 110 housed within a transfer chamber 112 can be used to transport substrate wafers from the holding area 106 to the quad section 109 and vice versa, and the second robot arm 110 can be housed in the transfer chamber to which each of the quad sections or processing systems can be connected. Each substrate processing area 108 can be equipped to perform several substrate processing operations, including any number of deposition processes, including cyclic layer deposition, atomic layer deposition, chemical vapor deposition, physical vapor deposition, as well as etching, pre-cleaning, annealing, plasma treatment, degassing, alignment, and other substrate processes.

[0022] Each quad section 109 may include a transfer region capable of receiving and delivering substrates from the second robot arm 110. The transfer region of the chamber system may be aligned with the transfer chamber having the second robot arm 110. In some embodiments, the transfer region may be laterally accessible to the robot. For subsequent operations, components of the transfer section may vertically translate the substrate to the overlying processing region 108. Similarly, the transfer region may also be operable to rotate the substrate between positions within each transfer region. The substrate processing region 108 may include any number of system components for depositing, annealing, curing, and / or etching a material film on a substrate or wafer. In one configuration, two sets of processing regions, such as the processing regions in quad sections 109a and 109b, may be used to deposit material on the substrate, and a third set of processing chambers, such as the processing chambers or region in quad section 109c, may be used to cure, anneal, or otherwise process the deposited film. In another configuration, all three sets of chambers, such as all 12 chambers shown, may be configured to deposit and / or cure a film on a substrate.

[0023] As shown, the second robot arm 110 may include two arms for simultaneously delivering and / or retrieving multiple substrates. For example, each quad section 109 may include two accesses 107 along a surface of the transfer region housing that may be laterally aligned with the second robot arm. The accesses may be defined along a surface adjacent to the transfer chamber 112. In some embodiments, as shown, the first access may be aligned with a first substrate support of the quad section's plurality of substrate supports. Additionally, the second access may be aligned with a second substrate support of the quad section's plurality of substrate supports. The first substrate support may be adjacent to the second substrate support, and the two substrate supports may define a first row of substrate supports in some embodiments. As shown in the illustrated configuration, the second row of substrate supports may be positioned laterally outward from the transfer chamber 112 behind the first row of substrate supports. The two arms of the second robot arm 110 can be spaced apart so that both arms can simultaneously enter the quad section or chamber system and deliver or retrieve one or two substrates to or from a substrate support in the transfer region.

[0024] Any one or more of the described transfer areas may be incorporated with additional chambers separate from the fabrication system shown in different embodiments. It will be understood that additional configurations of deposition, etching, annealing, and curing chambers for material films are contemplated by processing system 100. Furthermore, any number of other processing systems may be utilized with the present technology, which may incorporate transfer systems for performing any of the specific operations, such as substrate movement. In some embodiments, a processing system that may provide access to multiple processing chamber areas while maintaining a vacuum environment in sections such as the holding area and transfer area described above may enable operations to be performed in multiple chambers while maintaining a specific vacuum environment between individual processes.

[0025] FIG. 1B illustrates a schematic cross-sectional elevation view of one embodiment of an exemplary processing tool, e.g., through a chamber system, in accordance with some embodiments of the present technique. FIG. 1B may illustrate a cross-sectional view of any two adjacent processing regions 108 within any quad section 109. The elevation view may illustrate the configuration or fluidic coupling of one or more processing regions 108 with the transfer region 120. For example, the continuous transfer region 120 may be defined by a transfer region housing 125. The housing may define an open interior region within which multiple substrate supports 130 may be positioned. For example, as illustrated in FIG. 1A, an exemplary processing system may include four or more substrate supports 130 distributed within the housing around the transfer region. The substrate support may be a pedestal, as illustrated, although many other configurations may be used. In some embodiments, a pedestal may be vertically translatable between the transfer region 120 and the processing region overlying the transfer region. The substrate support may be vertically translatable along a central axis of the substrate support along a path between a first position and a second position within the chamber system. Thus, in some embodiments, each substrate support 130 may be axially aligned with an overlying processing region 108 defined by one or more chamber components.

[0026] The open transfer region can provide the ability for a transfer device 135, such as a carousel, to engage and rotate, for example, a substrate between various substrate supports. The transfer device 135 can be rotatable about a central axis, thereby positioning the substrate for processing in any of the processing regions 108 within the processing system. The transfer device 135 can include one or more end effectors that can engage the substrate from above, below, or can engage the outer edge of the substrate to move around the substrate support. The transfer device can receive a substrate from a transfer chamber robot, such as the robot 110 described above. The transfer device can then rotate the substrate to an alternate substrate support to facilitate the delivery of additional substrates.

[0027] Once positioned and awaiting processing, the transfer apparatus can position an end effector or arm between the substrate supports, thereby raising the substrate support above the transfer apparatus 135 and delivering the substrate to the processing region 108, which may be vertically offset from the transfer region. For example, and as shown, substrate support 130a can deliver the substrate to processing region 108a, while substrate support 130b can deliver the substrate to processing region 108b. This can occur with two other substrate supports and processing regions, as well as additional substrate supports and processing regions in embodiments where additional processing regions are included. In this configuration, a substrate support, when operably engaged to process a substrate, such as in a second position, can at least partially define the processing region 108 from below, and the processing region can be axially aligned with the associated substrate support. The processing region can be defined from above by a faceplate 140 and other lid stack components. In some embodiments, each processing region can have an individual lid stack component, while in some embodiments, a component can accommodate multiple processing regions 108. Based on this configuration, in some embodiments, each processing region 108 can be fluidly coupled to the transfer region while being fluidly isolated from above from other processing regions within the chamber system or quad section.

[0028] In some embodiments, the faceplate 140 can operate as an electrode in the system for generating a localized plasma within the processing region 108. As shown, each processing region can utilize or incorporate a separate faceplate. For example, faceplate 140a can be included to define the upper processing region 108a, and faceplate 140b can be included to define the upper processing region 108b. In some embodiments, the substrate support can operate as a companion electrode for generating a capacitively coupled plasma between the faceplate and the substrate support. The pumping liner 145 can at least partially define the processing region 108 radially or laterally, depending on the region geometry. Again, separate pumping liners can be utilized for each processing region. For example, pumping liner 145a can at least partially define the processing region 108a radially, and pumping liner 145b can at least partially define the processing region 108b radially. In embodiments, blocker plate 150 can be disposed between lid 155 and faceplate 140, and separate blocker plates can be included to facilitate fluid distribution within each processing region. For example, blocker plate 150a can be included for distribution to processing region 108a, and blocker plate 150b can be included for distribution to processing region 108b.

[0029] The lid 155 may be a separate component for each processing region or may include one or more common features. In some embodiments, as shown, the lid 155 may be a single component defining multiple apertures 160 for fluid delivery to the individual processing regions. For example, the lid 155 may define a first aperture 160a for fluid delivery to processing region 108a, and the lid 155 may define a second aperture 160b for fluid delivery to processing region 108b. Additional apertures, if included, may be defined for additional processing regions within each section. In some embodiments, each quad section 109 or multi-processing region section capable of accommodating more or less than four substrates may include one or more remote plasma units 165 for delivering plasma effluent to the processing chambers. In some embodiments, individual plasma units may be incorporated into each chamber processing region, while in some embodiments, fewer remote plasma units may be used. For example, as shown, a single remote plasma unit 165 can be used to service multiple chambers, such as two, three, four, or more chambers, up to all chambers in a particular quad section. Plumbing can extend from the remote plasma unit 165 to each aperture 160 for delivery of plasma effluent for processing or cleaning in embodiments of the present technology.

[0030] As previously mentioned, processing system 100, or more specifically, a quad section or chamber system incorporated with system 100 or other processing systems, may include a transfer section disposed below the illustrated processing chamber region. FIG. 2 shows a schematic isometric view of the transfer section of an exemplary chamber system 200 in accordance with some embodiments of the present technique. FIG. 2 may illustrate additional aspects or variations of aspects of the transfer region 120 described above, which may include any of the components or features described. The illustrated system may include a transfer region housing 205 defining a transfer region in which several components may be included. The transfer region 108 may be further defined from above, at least in part, by a processing chamber or processing region fluidly coupled to the transfer region, such as the processing chamber region shown in quad section 109 of FIG. 1A. Sidewalls of the transfer region housing may define one or more access locations 207 through which substrates may be delivered and retrieved, such as by the second robot arm 110, as described above. The access locations 205, in some embodiments, may be slit valves or other sealable access locations, including doors or other sealing mechanisms to provide an airtight environment within the transfer region housing 205. While shown with two such access locations 205, it should be understood that in some embodiments, only a single access location 205 may be included, as well as access locations on multiple sides of the transfer region housing. It should also be understood that the transfer section shown may be sized to accommodate any substrate size, including larger or smaller substrates, including substrates characterized by 200 mm, 300 mm, 450 mm, or any number of geometries or shapes.

[0031] Within the transfer region housing 205, there can be multiple substrate supports 210 arranged about the transfer region volume. While four substrate supports are shown, it should be understood that any number of substrate supports is similarly encompassed by embodiments of the present technology. For example, according to embodiments of the present technology, approximately three, four, five, six, eight, or more substrate supports 210 can be housed in the transfer region. The second robot arm 110 can deliver substrates to either or both of the substrate supports 210a or 210b via the access 205. Similarly, the second robot arm 110 can retrieve substrates from these locations. Lift pins 212 can protrude from the substrate support 210, allowing the robot to access underneath the substrate. The lift pins can be fixed on the substrate support or where the substrate support can retract downward, or the lift pins can be further raised or lowered through the substrate support in some embodiments. The substrate support 210 may be vertically translatable and, in some embodiments, may extend to a processing chamber region of a substrate processing system, such as processing chamber region 108 disposed above the transfer region housing 205 .

[0032] The transfer region housing 205 can extend through the transfer region apertures as shown and can operate in conjunction with lasers, cameras, or other monitoring devices projecting or transmitting through adjacent apertures to provide access 215 for an alignment system to properly position the translated substrate. The transfer region housing 205 can also include a transfer apparatus 220 that can be operated in several ways to position and move substrates between various substrate supports. In one example, the transfer apparatus 220 can move substrates on substrate supports 210a and 210b to substrate supports 210c and 210d, thereby delivering additional substrates to the transfer chamber. Additional transfer operations can include rotating substrates between substrate supports for additional processing in the overlying processing region.

[0033] The transfer apparatus 220 may include a central hub 225 that may include one or more shafts extending into the transfer chamber. Coupled with the shafts may be an end effector 235. The end effector 235 may include multiple arms 237 extending radially or laterally outward from the central hub. While shown with a central body from which arms extend, the end effector, in various embodiments, may further include separate arms, each coupled to a shaft or central hub. Embodiments of the present technology may include any number of arms. In some embodiments, the number of arms 237 may be similar to or equal to the number of substrate supports 210 included in the chamber. Thus, as shown, for four substrate supports, the transfer apparatus 220 may include four arms extending from the end effector. The arms may be characterized by any number of shapes and profiles, such as linear or arcuate profiles, and / or to provide access to the substrate, such as for alignment or engagement.

[0034] The end effector 235, or components or portions of the end effector, may be used to move or contact the substrate during movement. These components and end effectors may be made from or include many materials, including conductive and / or insulating materials. In some embodiments, the materials may be coated or plated to withstand contact with precursors or other chemicals that may enter the transfer region from the overlying processing chamber.

[0035] Additionally, materials can be provided or selected to withstand other environmental characteristics, such as temperature. In some embodiments, the substrate support can be operable to heat a substrate disposed thereon. The substrate support can be configured to elevate the surface or substrate temperature to about 100°C or higher, about 200°C or higher, about 300°C or higher, about 400°C or higher, about 500°C or higher, about 600°C or higher, about 700°C or higher, about 800°C or higher, or higher. Any of these temperatures can be maintained during operation, and thus components of the transfer apparatus 220 can be exposed to any of these listed or included temperatures. As a result, in some embodiments, any material can be selected to accommodate these temperature regimes and can include materials such as ceramics and metals, which can be characterized by relatively low coefficients of thermal expansion or other beneficial properties.

[0036] The coupling of the components can also be adapted for operation in high-temperature and / or corrosive environments. For example, if the end effector and end piece are each ceramic, the coupling can include press fittings, snap fittings, or fittings such as bolts that may not include additional materials that expand and contract with temperature and potentially crack the ceramic. In some embodiments, the terminal portion can be continuous with the end effector or monolithically formed therewith. Any number of other materials that can facilitate movement or resistance during movement can be utilized and are also within the scope of the present technology. The transfer device 220 can include several components and configurations that can facilitate movement of the end effector in multiple directions, which can facilitate rotational movement as well as vertical or lateral movement in one or more ways using drive system components to which the end effector can be coupled.

[0037] 2B shows a schematic top plan view of the transfer region of an exemplary chamber system in accordance with some embodiments of the present technique. This view may include additional components that may be incorporated into the transfer region of a processing system. For example, an aligner may be included via access 215 through the transfer region housing 205, although additional components may also be incorporated. As previously mentioned, in some embodiments, one or more processing regions may be formed that cover the transfer region housing. While fluidly coupled to the transfer region of the system, the transfer region may be relatively isolated within the system and substantially purged to provide a clean environment in which one or more parameters may be characterized.

[0038] For example, in some embodiments, passing through aperture 215 can be an in-chamber measurement location where one or more metrological characterizations can be performed. Optical characterizations can include one or more of reflectance, interferometry, and polarization measurements. An exemplary optical setup can orient one or more light sources 250 to impinge at an angle or perpendicularly on the surface of the substrate, and imaging or non-imaging light collection can be performed by detectors 255 of an integrated detection system. Depending on the characteristics of the transfer apparatus and the available motion of the substrate, multi-point measurements can be performed using rotational measurements along the azimuthal angle of the substrate and / or sweep measurements across a radial position across the substrate as the substrate is swept across the detector. As shown, a light source 250 or laser can extend through the transfer region housing 205 at each position between substrate supports and direct the light source at the substrate during transfer. The light source can be continuous or variable intensity and, in some embodiments, can operate at single or multiple wavelengths. Additionally, sweeping and rotation can occur at different substrate heights by adjusting the transport device or utilizing multiple angled receivers. Noise suppression can be incorporated into code division multiplexing of the optical signal, such as by modulation, followed by decoding of the collected optical signal, allowing for an improved signal-to-noise ratio.

[0039] The present technology may produce several cluster tool configurations that can increase processing capacity within a controlled footprint. Figures 3-5 illustrate exemplary substrate processing system configurations and variations included in the present technology, which, in some embodiments, may alter the specific positioning relative to Figure 1 . The described processing system should not be considered limiting, but rather is intended to illustrate some of the various configurations and adjustments that can be made to produce a cluster tool that can increase the number of processing regions within a specified footprint. Depending on the dimensional constraints of the cluster tool, the present technology may provide multiple adjustments and configurations to accommodate system length constraints. Many other modifications of the described adjustments may similarly be made to further extend the cluster tool beyond the illustrated configuration and are similarly encompassed by the present technology.

[0040] FIG. 3 shows a schematic top view of one embodiment of an exemplary processing system 300 in accordance with some embodiments of the present technique. System 300 can include some or all of the components of system 100 described above and, in some embodiments, can include a variation in the number of chamber systems coupled with a transfer chamber. For example, system 300 can include several front-opening unified pods 302 for providing substrates to a processing system or cluster tool. One or more robots, such as robot 304, can be housed in a factory interface of the processing system and can retrieve substrates from and deliver substrates to pod 302. Robot 304 can also deliver substrates to a load lock 306 coupled on the opposite side of the factory interface as shown. Load lock 306 can include access on each side for transferring substrates between the factory interface and a controlled processing environment.

[0041] The diagram also includes variations on the factory interface and / or load lock chamber, which may be incorporated into any of the designs or configurations described elsewhere. In some embodiments, a single load lock chamber 306 may be included in the tool. Additionally, in some embodiments, the factory interface 303 may be laterally offset in either direction from the center. This offset and / or the single load lock chamber may provide a service access 320 that may access or service the transfer chamber 312. While a single robot 304 is shown in the factory interface, in some embodiments, multiple robots may be included that may transfer substrates between each other for delivery to and from the pods 302 and load locks 306, as previously described.

[0042] The transfer chamber 312 can be coupled to the opposite side of the load lock 306 from the factory interface 303 and can house the transfer chamber robot 310 as shown. The robot 310 can include each of the features and functionality described above for the transfer chamber robot, and the robot 310 can be configured to deliver substrates to and retrieve substrates from each of the chamber systems 309 distributed around the transfer chamber. The chamber system 309 can include any of the components, properties, and materials of the chamber systems or quad sections described above, which can include a transfer region including a transfer apparatus, and an overlying processing region 308 as previously described. Figure 3 can show variations that allow access to additional chamber systems for the transfer chamber by reducing the number of accesses to each chamber system.

[0043] For example, while system 100 shows quad sections laterally aligned with each face of the transfer chamber, system 300 may offset each chamber system 309 to align its single access 307 with the transfer chamber 312. As a result, in such a configuration, four chamber systems 309a, 309b, 309c, 309d may be positioned along two opposing faces of the transfer chamber 312. Two chamber accesses may be accessible along each surface of the transfer chamber 312, although in the configuration shown, each access may be associated with a different chamber system 309. In some embodiments, a chamber system 309 may include only a single access 307, or only a single access 307 may be positioned accessible to the robot 310, although the chamber system 309 may still include two accesses along the surface of the transfer chamber, as described above, which may maximize hardware modulation and accommodate multiple configurations.

[0044] The access 307 of each chamber system 309 may be at least partially aligned with a first substrate support in the transfer region of the chamber system, as described above. In some embodiments, the robot 310 may be a dual-blade robot, as described above, and may include two arms for delivering two substrates at a time. Thus, for chamber systems 309a and 309b, the robot 310 can simultaneously deliver substrates to each chamber system via a single access 307 for each chamber system. The robot can similarly deliver substrates to chamber systems 309c and 309d. Chamber system 309e may optionally be included in the processing system 300, or chamber system 309e may be omitted in some embodiments to further reduce the processing system's footprint. Chamber system 309e may have a configuration similar to that described above for system 100. For example, chamber system 309e may include two accesses aligned with the two substrate supports, which may be accessible to the robot 310 for dual substrate delivery, as described above.

[0045] While the chamber system 300 may include a dual-blade robot as described, in some embodiments, the chamber system 300 may include a single-blade robot 310, as shown, which can deliver a single substrate to a processing region at a particular time. Furthermore, the robot may include three, four, or six blades, and in some embodiments, in the configuration shown, the complete delivery or retrieval of a substrate may be performed in a single operation. Because a chamber system may be shut down for maintenance, when using a dual-blade robot such as the one described above, the second chamber system may also become inaccessible. Therefore, a single-blade or single-arm robot may be used, which may allow access to each chamber system at any time. Other configurations are also encompassed by the present technology, including vertically offset blades on a single robot, or vertically offset robots, such as a single inverted robot. These robots may process more than one substrate in the transfer chamber at a time, but can deliver or retrieve a single substrate to or from each chamber system 309 at a time.

[0046] Furthermore, when a robot 310 with a single arm is used due to the chamber configuration and offsets as shown, the robot can be centrally located within the transfer chamber 312, which may or may not accommodate direct delivery to any individual chamber system. For example, in some embodiments, the robot 310 can deliver substrates directly or linearly to a chamber system, although in some embodiments, the robot can extend through one or more of the accesses 307 at an angle other than perpendicular to a plane along the access. As shown in chamber system 309c, delivery through an access to an available substrate support can occur perpendicular to the plane of the chamber system or at an angle offset from perpendicular as shown, depending on the robot configuration. Thus, in some embodiments, the robot 310 and / or access 307 can be sized or positioned to provide angled access to the transfer region. For example, the access 307 can be larger than for linear access or can be offset from direct alignment with the substrate support to accommodate the delivery trajectory of the robot 310. By aligning the chamber system around the transfer chamber of the processing system, the present technique can increase the number of accessible processing regions without additional transfer robots and in a space-efficient manner.

[0047] FIG. 4 illustrates a schematic top view of one embodiment of an exemplary processing system 400 in accordance with some embodiments of the present technique. FIG. 4 may illustrate an exemplary system that extends the platform described above for FIG. 1. System 400 may include any of the components or configurations described above for system 100 or system 300. System 400 may illustrate a system including dual load locks 406 and dual transfer chambers 412, which may increase the number of directly aligned chamber systems 409 that may be incorporated into a cluster tool or processing system. For example, by removing chamber system 109b, an additional load lock 406, which may also be a pass-through, may be included in the system, which may be on the opposite side of transfer chamber 412a from load lock 406a. If a pass-through is included, the transfer chamber may share a common environment with the pass-through, but the additional load lock may separate the two transfer chambers. Coupled to the opposite side of load lock 406b may be an additional transfer chamber 412b, which may provide access to the additional chamber system 409. It should be understood that system 400 may also include expansion along other directions, such as including additional load lock chambers along other sides of either transfer chamber 510, which may allow the system to be expanded in any other lateral direction as well.

[0048] FIG. 5 illustrates a schematic top view of one embodiment of an exemplary processing system 500 in accordance with some embodiments of the present technique. FIG. 5 may illustrate an exemplary system that extends the platform described above for FIG. 3. System 500 may include any of the components or configurations described above for system 100, system 300, or system 400. System 500 may also illustrate a system including dual load locks 506 and dual transfer chambers 510, which may increase the number of directly aligned chamber systems 509 that can be incorporated into a cluster tool or processing system. System 500 may illustrate a more space-efficient expansion of a system or combination of the above processing systems. For example, a first set of chamber systems 509 may be incorporated with a transfer chamber 512a and may be offset similar to the system configuration described above for system 300. Additionally, a second load lock 506b, or pass-through, may be located on the opposite side of the transfer chamber 512a from the load lock 506a. A second transfer chamber 512b can be coupled to the opposite side of the second load lock 506b and can provide access to chamber system 515 in a configuration similar to system 100. Chamber systems 515a and 515c can extend further in the chamber direction, and in some embodiments, chamber system 515b can optionally be included in an end position depending on lateral constraints on the system footprint.

[0049] Thus, embodiments in accordance with the present technology can include any combination of coupling chambers to further expand the system in some ways. Additionally, while the illustrated configuration depicts a single-blade robot for each of robots 510a and 510b, in some embodiments, either or both robots can be dual-blade robots as described above. As one non-limiting example, in some embodiments, robot 510a can include one or more single-blade robots, and robot 510b can include a dual-blade robot as described above. Again, any number of other configurations or variations along these described embodiments are similarly encompassed by the present technology.

[0050] FIG. 6 illustrates exemplary operations in a method 600 for processing a substrate in accordance with some embodiments of the present technique. Method 600 can be performed in one or more processing systems, such as any of the systems or components described above, including any of the system configurations described above. The method can include several optional operations, as illustrated in the figures, which may or may not be specifically associated with some embodiments of methods in accordance with the present technique. Method 600 describes operations shown generally in FIGS. 6A-6F, which are described in conjunction with the operations of method 600. FIG. 7 illustrates only a partial schematic view with limited detail; in some embodiments, the system may include more or less substrate support and other components, as well as alternative structural aspects that can still benefit from any aspect of the present technique.

[0051] FIG. 7A may illustrate an embodiment of a chamber system 700, as previously described, in which a processing region may not be visible in this view but may include any of the features and aspects of the chamber systems described above, including a transfer region and an overlying processing region. The figure may illustrate a configuration of the present technology during initial operation of method 600, which may include delivering a substrate 701 to a first substrate support 710a in operation 605, such as via access 707 with a robot 703, such as any of the transfer chamber robots described above. While shown delivering a single substrate, the robot may deliver one, two, or more substrates to the transfer region 705 and onto the substrate support near the access or slit valve. It should be understood that the same process can be performed with any number of substrates, including delivering one substrate at a time to the transfer region. The transfer apparatus 720 may be rotatable about a central axis of the transfer apparatus and may include several arms, including a number equal to the number of substrate supports, as described above.

[0052] As shown in FIG. 7B , the transfer device 720 can be rotated within the transfer region 705 to engage the substrate 701 in operation 610. Depending on the aspects of the end effector of the transfer device 720, the substrate can be engaged above, below, or along the edge of the substrate 701 in various embodiments. Once engaged, the substrate 701 can be repositioned or transferred to a second substrate support 710 b within the transfer region 705 in operation 615, as shown in FIG. 7C . Again, in embodiments, the transfer device can engage and / or transfer two, three, four, or any number of substrates in embodiments of the present technology. During transfer, in some embodiments, an alignment operation can occur, in which case a camera, laser, or other component can read or operate through the aperture 712 to identify whether the substrate 701 is properly aligned for processing. In some embodiments, an additional aligner 715 can be used to reposition the substrate. For example, the substrate can be received by the aligner 715, which can reposition the substrate in some embodiments. The substrate can then be recollected by the transfer device 720 and transferred to the second substrate support 710b.

[0053] In embodiments, delivery can occur to any substrate support within the transfer region, and the operations described are intended to illustrate operations that may be performed, although the specific illustrations are not intended to limit the operations. The transfer apparatus 720 can further reposition the substrate 710 before delivery to the second substrate support 710b, which can include lateral repositioning of the substrate in some embodiments where the transfer apparatus is configured to provide lateral motion in addition to rotational motion. Once properly positioned, the transfer apparatus 720 can deliver the substrate to the second substrate support 710b. Delivery can be by lowering the substrate using the transfer apparatus or a component of the transfer apparatus, or in some embodiments, the substrate support can be raised to accept the substrate from the transfer apparatus including lift pins on the substrate support, and in either case, the substrate support can be in a vertical first position within the chamber system.

[0054] FIG. 7D may show a cross-sectional elevation view through the chamber system 700, such as through substrate supports 710a and 710b and overlying processing regions 725a and 725b. The chamber system and each processing region may include any of the components described above, including a front plate 730, a blocker plate 735, and a lid component that may define access for delivering precursors to the individual processing regions. FIG. 7D may show an elevation view after the substrate 701 has been transferred to a second substrate support 710b in the transfer region 705. The transfer apparatus 720 may be rotated away from the substrate supports, such as to a retracted position, which may be similar to the position shown in FIG. 7A or any other position where the end effector should not interfere with the vertical translation of one or more substrate supports.

[0055] In operation 620, the second substrate support can be raised, as shown in FIG. 7E, to deliver the substrate to processing region 725b for processing, which can position the substrate support at a second vertical position relative to the first. As shown, the transfer apparatus 720 does not interfere with or contact the substrate support, which can extend vertically along the central axis of the substrate support to the axially aligned processing region above. When positioned for processing, the substrate support 710b can at least partially define the substrate processing region from below, which may indicate fluid coupling between the individual processing regions and the transfer region. In operation 625, the substrate 701 can be processed through any number of processing operations that can be performed in a processing region according to the present technology, which can include, by way of non-limiting example, depositing one or more layers of material on the substrate. In some embodiments, the substrate support 710b and faceplate 730 or other lid stack components can act as electrodes for generating a plasma in processing region 725b. The substrate support can also be configured to heat the substrate, as described above. Although shown as a single substrate being processed, it should be understood that any number of substrates may be processed simultaneously, including a substrate on each substrate support in the chamber system, each of which may be configured for operation similar to substrate support 710b, as described.

[0056] Method 600 may optionally include additional processing in additional processing regions of the chamber system. For example, in optional operation 630, substrate 701 may be rotated or transferred to any of the other substrate supports in the chamber system. This transfer may include returning the substrate to the first position using substrate support 710b, which may be below transfer apparatus 720, allowing the transfer apparatus to re-engage the substrate with a second substrate support. In some embodiments, the operation may include lowering and transferring all substrates in the system. One or more substrates may then be transferred to any other substrate support in the system for retrieval from the transfer chamber by a robot or for further processing.

[0057] When further processing is being performed, the substrate can be transferred to a third substrate support in the transfer region 720, which can be any of the previously illustrated substrate supports, including the first substrate support 710a in some embodiments. The third substrate support can then be lifted to an associated processing region, similar to that described above. The substrate can then be further processed in optional operation 635. In some embodiments, subsequent processing can also include depositing one or more layers of material on the substrate or any other processing operation. While the transfer region 705 can be open between the substrate and the transfer apparatus, the processing regions can be at least partially isolated from one another, as shown, and can be fluidically isolated from the other processing regions from above.

[0058] The present technology includes substrate processing systems that can accommodate additional substrate supports that may not otherwise be accessible by a centrally located transfer robot as described above. By incorporating a transfer apparatus according to embodiments of the present technology, multiple substrate supports can be utilized and accessed during substrate processing. Furthermore, by incorporating a chamber system into any of the configurations described throughout this disclosure, a limited footprint can be maximized to incorporate several different chamber configurations.

[0059] In the foregoing description, for purposes of explanation, numerous details have been set forth in order to provide an understanding of various embodiments of the present technology. However, it will be apparent to one skilled in the art that particular embodiments may be practiced without some of these details or with additional details.

[0060] While several embodiments have been disclosed, those skilled in the art will recognize that various modifications, alternative structures, and equivalents may be used without departing from the spirit of the embodiments. Moreover, in order to avoid unnecessarily obscuring the present technology, some well-known processes and elements have not been described. Therefore, the above description should not be construed as limiting the scope of the present technology. In addition, while a method or process may be described as sequential or stepwise, it should be understood that these steps may be performed simultaneously or in a different order than described.

[0061] Where a range of values ​​is presented, unless the context clearly dictates otherwise, it is understood that each intervening value between the upper and lower limits of that range is also specifically disclosed, to the smallest unit of the unit of the lower limit. Any narrower ranges between any stated or unstated intervening value in a stated range, and any other stated or intervening value in that stated range, are also encompassed. The upper and lower limits of these smaller ranges may be individually included or excluded from the range, and each range in which either, neither, or both limits are included in the smaller range is also encompassed within the technical scope, subject to any explicitly excluded limit in the stated range. When a stated range includes one or both limits, ranges excluding either or both of those included limits are also included.

[0062] As used in this specification and the appended claims, the singular forms "a," "an," and "the" include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to a "substrate" includes a plurality of such substrates, reference to an "arm" includes a reference to one or more arms and equivalents thereof known to those skilled in the art, and so forth.

[0063] Additionally, the terms "comprise(s)", "comprising", "contain(s)", "containing", "include(s)", and "including", when used in this specification and claims, are intended to specify the presence of stated features, integers, components, or steps, but do not exclude the presence or addition of one or more other features, integers, components, steps, operations, or groups.

Claims

1. 1. A substrate processing system, comprising: A factory interface, a load lock coupled to the factory interface; a transfer chamber including a robot coupled to the load lock and configured to retrieve substrates from the load lock; a chamber system disposed adjacent to and coupled to the transfer chamber; the chamber system comprising: a transfer area laterally accessible to the robot, the transfer area comprising: a plurality of substrate supports arranged about the transfer region, each substrate support of the plurality of substrate supports being vertically translatable along a central axis of the substrate support between a first position and a second position; and a transfer region including a transfer device rotatable about another central axis and configured to engage the substrate and transfer the substrate between the plurality of substrate supports; and a plurality of processing regions vertically offset from the transfer region, each processing region of the plurality of processing regions axially aligned with an associated substrate support of the plurality of substrate supports, each processing region of the plurality of processing regions being defined below by an associated substrate support in the second position; the transfer apparatus includes an end effector having a plurality of arms that are positionable by rotating the transfer apparatus to a retracted position in which the end effector does not impede vertical translation of the plurality of substrate supports; the second position is vertically above the end effector; an aligner for repositioning the substrate is provided within the transfer region; Substrate processing system.

2. The substrate processing system of claim 1 , wherein the plurality of substrate supports in the transfer region of the chamber system comprises at least four substrate supports.

3. 10. The substrate processing system of claim 1, wherein each processing region of the plurality of processing regions is fluidly coupled to the transfer region and fluidly isolated from each other processing region of the plurality of processing regions above.

4. The substrate processing system of claim 1 , further comprising at least two additional chamber systems positioned adjacent to and coupled to the transfer chamber.

5. 5. The substrate processing system of claim 4, wherein each chamber system defines two accesses along a surface of a housing of the transfer region adjacent to the transfer chamber, a first of the two accesses being aligned with a first substrate support of the plurality of substrate supports, and a second of the two accesses being aligned with a second substrate support of the plurality of substrate supports.

6. 6. The substrate processing system of claim 5, wherein the robot includes two arms configured to deliver or retrieve a first substrate from the first substrate support via the first access and simultaneously deliver or retrieve a second substrate from the second substrate support via the second access.

7. The substrate processing system of claim 1 , further comprising at least three additional chamber systems positioned adjacent to and coupled to the transfer chamber.

8. 8. The substrate processing system of claim 7, wherein each chamber system defines one access along a surface of a housing of the transfer region adjacent to the transfer chamber, the one access being aligned with a first substrate support of the plurality of substrate supports, the robot including one arm configured to deliver or retrieve a substrate from the first substrate support through the one access, and the one arm of the robot extending through the one access of each chamber system at an angle other than perpendicular to the one access.

9. 1. A method of processing a substrate in a substrate processing system, comprising: delivering the substrate to a first substrate support in a transfer region of the chamber system using a transfer chamber robot; engaging the substrate on the first substrate support with a transfer apparatus housed in the transfer region of the chamber system; transferring the substrate to a second substrate support in the transfer region of the chamber system using the transfer apparatus; prior to raising the substrate, rotating the transfer apparatus to a retracted position in which each of one or more end effectors of the transfer apparatus does not impede vertical translation of the first substrate support or the second substrate support; lifting the substrate with the second substrate support along a central axis of the second substrate support to a first processing region above the transfer region, the second substrate support at least partially defining the first processing region from below; processing the substrate in the first processing region; Including, an aligner disposed within the transfer region capable of repositioning the substrate; A method for processing a substrate.

10. 10. The method of processing a substrate according to claim 9, wherein engaging the substrate with the transfer device comprises engaging at least three substrates with the transfer device, and transferring the substrates comprises using the transfer device to transfer the at least three substrates to at least three other substrate supports within the transfer region.

11. using the second substrate support to lower the substrate to a position within the transfer region accessible by the transfer device; engaging the substrate with the transfer device at the second substrate support; transferring the substrate to a third substrate support in the transfer region of the chamber system using the transfer apparatus; lifting the substrate with the third substrate support along a central axis of the second substrate support to a second processing region above the transfer region, the third substrate support at least partially defining the second processing region from below; depositing one or more additional layers of material onto the substrate; The method of processing a substrate according to claim 10, further comprising:

12. 10. The method of processing a substrate of claim 9, wherein the transfer apparatus is rotatable about a central axis and configured to engage a substrate within the transfer region and transfer the substrate between a plurality of substrate supports.

13. 10. The method of processing a substrate of claim 9, wherein the chamber system includes a plurality of substrate supports arranged about the transfer region of the chamber system, each substrate support of the plurality of substrate supports being vertically translatable along a central axis of the substrate support between a first position and a second position, the chamber system including a plurality of processing regions vertically offset from the transfer region of the chamber system, each processing region of the plurality of processing regions being axially aligned with an associated substrate support of the plurality of substrate supports, and a processing region being defined from below by an associated substrate support at the second position.

14. The method of processing a substrate of claim 9 , wherein the transfer chamber robot is housed in a transfer chamber adjacent to the chamber system.

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