Expanding device and method for manufacturing semiconductor chips

Abstract

To provide an expanding device, a semiconductor chip manufacturing method, and a semiconductor chip that allow a sheet member to expand smoothly on an expand ring when expanding the sheet member.SOLUTION: An expanding device 100 includes an expand ring 208 that divides a wafer W1 along a dividing line by expanding a sheet member W2 with a ring-shaped member W3 being gripped by a clamp portion 214. The expand ring 208 includes a sphere 281b rotatably arranged at a portion that contacts the sheet member W2 during expansion, and a housing space 281a that rotatably accommodates the sphere 281b.SELECTED DRAWING: Figure 14

Description

[Technical Field]

[0001] The present invention relates to an expanding device, and, How semiconductor chips are manufactured By law In particular, an expanding device having a ring-shaped expanding ring, and, How semiconductor chips are manufactured By law Regarding. [Background technology]

[0002] BACKGROUND ART Conventionally, an expanding device provided with a ring-shaped expanding ring is known (see, for example, Patent Document 1).

[0003] The above-mentioned Patent Document 1 discloses an adhesive tape expanding device including a clamp and an expanding member including a plurality of cylindrical rollers. The adhesive tape expanding device is configured to expand a heat-shrinkable adhesive tape having a wafer attached to an annular frame. The clamp is configured to hold the annular frame. The expanding member is configured to expand the heat-shrinkable adhesive tape by pressing the heat-shrinkable adhesive tape from below upward. The expanding member has a circular ring shape in a plan view.

[0004] The expansion member of Patent Document 1 has an annular groove formed in a plan view on its upper end surface. The groove is formed by recessing the upper end surface of the expansion member downward. Each of a plurality of cylindrical rollers is rotatably housed in the groove with its outer circumferential surface exposed from the groove. The rollers are housed in the annular groove with their rotational axes extending linearly along the tangential direction. The cylindrical rollers are aligned along the circumferential direction of the annular groove.

[0005] In the adhesive tape expansion device of Patent Document 1, when the heat-shrinkable adhesive tape is expanded by raising the expansion member, the heat-shrinkable adhesive tape expands as multiple cylindrical rollers that the heat-shrinkable adhesive tape contacts rotate. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Patent Application Laid-Open No. 2007-123658 Summary of the Invention [Problem to be solved by the invention]

[0007] However, in the adhesive tape expanding device of Patent Document 1, a linearly extending cylindrical roller is housed in an annular groove so as to extend in the tangential direction. In a plan view, the linearly extending tangential shape of the roller does not match the annular shape of the groove. As a result, the edges of both ends of the roller in the rotational axis direction (the linearly extending tangential direction) rather than the outer peripheral surface of the roller abut against the inner surface of the outer annular groove. As a result, in the adhesive tape expanding device of Patent Document 1, when the roller rotates in the groove, the edges of both ends of the cylindrical roller in the rotational axis direction are caught in the groove, preventing smooth rotation of the cylindrical roller. Therefore, the adhesive tape expanding device of Patent Document 1 has the problem that it is difficult to smoothly expand the expanding tape on the expanding member when expanding the expanding tape.

[0008] The present invention has been made to solve the above-mentioned problems, and one object of the present invention is to provide an expanding device that can smoothly expand an expanding tape on an expanding ring when expanding a sheet member; and, How semiconductor chips are manufactured The law The purpose is to provide. [Means for solving the problem]

[0009] In order to achieve the above-mentioned object, an expanding device in a first aspect of the present invention comprises a clamping portion that grasps the ring-shaped member of a wafer ring structure including a wafer that can be divided along a dividing line, a stretchable sheet member to which the wafer is attached, and a ring-shaped ring-shaped member that is attached to the sheet member while surrounding the wafer, and a ring-shaped expanding ring that divides the wafer along the dividing line by expanding the sheet member while the ring-shaped member is grasped by the clamping portion, and the expanding ring includes a sphere that is rotatably arranged in a portion that contacts the sheet member during expansion, and a storage space that rotatably accommodates the sphere.

[0010] In the expanding device according to the first aspect of the present invention, as described above, the expanding ring includes spheres rotatably arranged in a portion that contacts the sheet member during expansion, and a storage space that rotatably houses the spheres. Because the spheres are housed in the storage space, when expanding the sheet member with the expanding ring, the number of contact points between the spheres and the expanding ring within the storage space can be reduced compared to when cylindrical rollers are used, thereby reducing friction between the spheres and the expanding ring. As a result, compared to when cylindrical rollers are used, the spheres are more likely to rotate relative to the expanding ring, allowing the sheet member to expand more smoothly on the expanding ring.

[0011] In the expanding device according to the first aspect, preferably, in a cross section taken along the radial direction of the expand ring, the sphere extends across the top and side surfaces of the expand ring, and an arc portion of the sphere's circumference is exposed from the expand ring, the arc portion corresponding to a central angle of the sphere of 90 degrees or more and less than 180 degrees. This configuration allows the sphere to be exposed near the radial outer edge of the expand ring, thereby allowing the sphere and the sheet member to come into contact near the outer edge of the expand ring. As a result, by bringing the sphere and the sheet member into contact near the outer edge of the expand ring, where the extension direction of the sheet member changes from horizontal to downward relative to the sheet member located inside the outer edge of the expand ring, the sheet member can be expanded in a state in which the sphere can easily rotate relative to the expand ring, thereby enabling smooth expansion of the sheet member.

[0012] In the expanding device according to the first aspect, the expanding ring preferably further includes a first member arranged on the inner periphery and a second member arranged on the outer periphery, and the storage space is formed by being surrounded by the first member and the second member. With this configuration, the first member and the second member can be processed separately, and then the storage space can be formed by combining the processed first member and second member, making it easy to form a storage space that rotatably stores spheres while exposing part of the spheres.

[0013] In the expanding device according to the first aspect, the spheres are preferably made of ceramic having low thermal conductivity. With this configuration, when the sheet member is heated in an expanded state, the heat applied to the sheet member can be prevented from escaping through the spheres, compared to when the spheres are made of a material having high thermal conductivity, thereby suppressing heat imbalance in the sheet member.

[0014] The expanding device according to the first aspect preferably further includes an expansion maintaining ring disposed above the expansion ring for maintaining the expanded state of the sheet member near the wafer, the expansion maintaining ring being configured to maintain the expanded state of the sheet member near the wafer by pressing a portion of the sheet member outside the spherical center in the radial direction of the expansion maintaining ring. This configuration allows the length of the sheet member from the contact point between the expansion maintaining ring and the sheet member to the wafer to be longer than when the expansion maintaining ring presses a portion of the sheet member inside the spherical center in the radial cross section of the expansion maintaining ring. As a result, even if the sheet member near the expansion maintaining ring lifts up when the expansion maintaining ring separates from the sheet member, the sheet member near the wafer can be prevented from lifting up as well, thereby preventing the separated wafers from peeling off from the sheet member due to the lifting of the sheet member.

[0015] In this case, preferably, the diameter of the expansion maintaining ring is such that, in the radial direction of the expansion maintaining ring, when the expansion maintaining ring presses the sheet member at a portion outside the center of the sphere, the lower end of the expansion maintaining ring is positioned below the upper end of the sphere and positioned outside the center of the sphere. With this configuration, the expansion maintaining ring is positioned farther away from the wafer in the radial direction of the expansion maintaining ring than when the lower end of the expansion maintaining ring is positioned inside the center of the sphere. Furthermore, since the lower end of the expansion maintaining ring is positioned below the upper end of the sphere, the position at which the expansion maintaining ring separates from the sheet member can be relatively lower in the vertical direction. Therefore, the position at which the expansion maintaining ring separates from the sheet member can be lower than the height of the sheet member inside the center of the sphere. This makes it more difficult for the sheet member inside the center of the sphere to lift up in the radial direction of the expansion maintaining ring, thereby further preventing the divided wafer from peeling off from the sheet member due to the sheet member lifting up.

[0016] In the expanding device according to the first aspect, the expanding ring preferably rotatably holds the sphere in the storage space by contacting at least two points among the upper portion of the sphere, the lower end of the sphere, the outer end of the sphere in the radial direction of the expanding ring, and the inner end of the sphere in the radial direction of the expanding ring. This configuration allows the expanding ring to hold the sphere in the storage space by point contact between the expanding ring and the sphere, thereby reducing the number of contact points between the expanding ring and the sphere. As a result, the sphere can be smoothly rotated within the storage space.

[0017] In the expanding device according to the first aspect, the storage space preferably has a ring shape in plan view, and a plurality of spheres are arranged around the entire circumference of the ring-shaped storage space in plan view. This configuration allows the sheet member and the spheres to be in contact with each other around the entire circumference of the radially outer outer edge of the expanding ring. This makes it possible to make the resistance around the entire circumference of the radially outer outer edge of the expanding ring uniform, unlike when the sheet member and the spheres are in contact with each other only part of the entire circumference of the radially outer outer edge of the expanding ring. Therefore, when the sheet member is expanded by the expanding ring, the sheet member can be expanded evenly. As a result, when the sheet member is expanded, expansion of the sheet member on the expanding ring can be performed more smoothly.

[0018] In the expanding device according to the first aspect, the storage space is preferably disposed at the outer upper end of the expanding ring and stores the spheres so that the surfaces of the spheres are partially exposed from the expanding ring. With this configuration, it is possible to bring the spheres into contact with the sheet member near the outer edge of the expanding ring where the extending direction of the sheet member changes downward relative to the sheet member that is more inward than the outer edge of the expanding ring. Therefore, when the sheet member is expanded, the spheres can be expanded in a state where they can easily rotate relative to the expanding ring, thereby enabling smoother expansion of the sheet member.

[0019] A method for manufacturing semiconductor chips according to a second aspect of the present invention includes a step of forming a modified layer in a wafer by irradiating the wafer with laser light from a laser irradiation unit that irradiates laser light, and a step of dividing the wafer into a plurality of individual semiconductor chips along the modified layer by expanding the sheet member using an expanding ring that has a sphere rotatably arranged in a portion that contacts the sheet member during expansion and a storage space that rotatably stores the sphere, while holding the ring-shaped member with a clamp unit that grips the ring-shaped member of a wafer ring structure that includes a ring-shaped member attached to an elastic sheet member to which the wafer is attached.

[0020] A semiconductor chip manufacturing method according to a second aspect of the present invention includes a step of dividing the wafer into individual semiconductor chips along the modified layer by expanding the sheet member using an expand ring having rotatably arranged spheres in contact with the sheet member and a storage space for rotatably storing the spheres, as described above. Since the spheres are stored in the storage space, when expanding the sheet member using the expand ring, the number of contact points between the spheres and the expand ring within the storage space can be reduced compared to when using cylindrical rollers, thereby reducing friction between the spheres rotating on the sheet member and the expand ring. As a result, compared to when using cylindrical rollers, the spheres are more easily rotated relative to the expand ring, resulting in a semiconductor chip manufacturing method that allows the sheet member to be expanded more smoothly on the expand ring. [Effects of the Invention]

[0023] According to the present invention, as described above, when expanding a sheet member, the expanding tape can be smoothly expanded on the expanding ring. [Brief explanation of the drawings]

[0024] [Figure 1]1 is a plan view showing a semiconductor wafer processing device provided with a dicing device and an expanding device according to a first embodiment. [Figure 2] 1 is a plan view showing a wafer ring structure processed in the semiconductor wafer processing apparatus according to the first embodiment. [Figure 3] FIG. 3 is a cross-sectional view taken along line III-III in FIG. 2. [Figure 4] FIG. 2 is a plan view of a dicing device disposed adjacent to the expanding device according to the first embodiment. [Figure 5] 10 is a side view of the dicing device arranged adjacent to the expanding device according to the first embodiment, as viewed from the Y2 direction side. FIG. [Figure 6] FIG. 1 is a plan view of an expanding device according to a first embodiment. [Figure 7] FIG. 2 is a side view of the expanding device according to the first embodiment as viewed from the Y2 direction side. [Figure 8] FIG. 2 is a side view of the expanding device according to the first embodiment as viewed from the X1 direction side. [Figure 9] 1 is a block diagram showing a control configuration of a semiconductor wafer processing apparatus according to a first embodiment. [Figure 10] 4 is a flowchart of the first half of a semiconductor chip manufacturing process by the semiconductor wafer processing apparatus according to the first embodiment. [Figure 11] 10 is a flowchart of the second half of the semiconductor chip manufacturing process of the semiconductor wafer processing apparatus according to the first embodiment. [Figure 12] FIG. 2 is a plan view of an expanding ring of the expanding device according to the first embodiment. [Figure 13] FIG. 13 is a cross-sectional view taken along line XIII-XIII in FIG. 12. [Figure 14] FIG. 14 is an enlarged view of the Zm portion of FIG. [Figure 15] 14 is an enlarged view corresponding to the Zm portion in FIG. 13, illustrating a state in which a pressing ring portion presses a sheet member in the expanding device according to the first embodiment. FIG. [Figure 16]14 is an enlarged view corresponding to the Zm portion in FIG. 13, illustrating a state in which a sphere is held by an expanding ring in the expanding device according to the first embodiment. FIG. [Figure 17] FIG. 10 is a plan view showing a semiconductor wafer processing apparatus provided with a dicing apparatus and an expanding apparatus according to a second embodiment. [Figure 18] 10 is a side view of a semiconductor wafer processing apparatus provided with a dicing apparatus and an expanding apparatus according to a second embodiment, as viewed from the Y2 direction. FIG. [Figure 19] 10 is a side view of a semiconductor wafer processing apparatus provided with a dicing apparatus and an expanding apparatus according to a second embodiment, as viewed from the X1 direction. FIG. [Figure 20] FIG. 10 is a block diagram showing a control configuration of a semiconductor wafer processing apparatus according to a second embodiment. [Figure 21] 10 is a flowchart of the first half of a semiconductor chip manufacturing process by the semiconductor wafer processing apparatus according to the second embodiment. [Figure 22] 10 is a flowchart of the second half of the semiconductor chip manufacturing process of the semiconductor wafer processing apparatus according to the second embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0025] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, specific embodiments of the present invention will be described with reference to the accompanying drawings.

[0026] [First embodiment] The configuration of a semiconductor wafer processing apparatus 100 according to a first embodiment of the present invention will be described with reference to FIGS.

[0027] (Semiconductor wafer processing equipment) 1, the semiconductor wafer processing apparatus 100 is an apparatus for processing a wafer W1 provided in a wafer ring structure W. The semiconductor wafer processing apparatus 100 is configured to form a modified layer on the wafer W1 and to divide the wafer W1 along the modified layer to form a plurality of semiconductor chips Ch (see FIG. 8).

[0028] 2 and 3, the wafer ring structure W will be described. The wafer ring structure W includes a wafer W1, a sheet member W2, and a ring-shaped member W3.

[0029] The wafer W1 is a thin, circular plate made of crystals of a semiconductor material that is used to make semiconductor integrated circuits. A modified layer is formed inside the wafer W1 along the dividing line by processing the wafer in the semiconductor wafer processing apparatus 100. That is, the wafer W1 is processed so that it can be divided along the dividing line. The sheet member W2 is a stretchable adhesive tape. An adhesive layer is provided on the upper surface W21 of the sheet member W2. The wafer W1 is attached to the adhesive layer of the sheet member W2. The ring-shaped member W3 is a metal frame that is ring-shaped in a plan view. The ring-shaped member W3 is attached to the adhesive layer of the sheet member W2 while surrounding the wafer W1.

[0030] The semiconductor wafer processing apparatus 100 is equipped with a dicing apparatus 1 and an expanding apparatus 2. The vertical direction is the Z direction, the upward direction is the Z1 direction, and the downward direction is the Z2 direction. The horizontal direction perpendicular to the Z direction in which the dicing apparatus 1 and the expanding apparatus 2 are lined up is the X direction, the X1 direction is the expanding apparatus 2 side of the X direction, and the X2 direction is the dicing apparatus 1 side of the X direction. The horizontal direction perpendicular to the X direction is the Y direction, one side of the Y direction is the Y1 direction, and the other side of the Y direction is the Y2 direction.

[0031] (dicing equipment) As shown in Figures 1, 4, and 5, the dicing device 1 is configured to form a modified layer by irradiating a laser having a wavelength that is transparent to the wafer W1 along the parting lines (streets). The modified layer refers to cracks and voids formed inside the wafer W1 by the laser. The method of forming a modified layer on the wafer W1 in this way is called dicing.

[0032] Specifically, the dicing device 1 includes a base 11, a chuck table unit 12, a laser unit 13, and an imaging unit .

[0033] The base 11 is a base on which the chuck table 12 is placed. The base 11 has a rectangular shape in a plan view.

[0034] <Chuck table section> The chuck table 12 includes a suction unit 12a, a clamp unit 12b, a rotation mechanism 12c, and a table movement mechanism 12d. The suction unit 12a is configured to suction the upper surface of the wafer ring structure W in the Z1 direction. The suction unit 12a is a table provided with suction holes and suction lines for suctioning the lower surface of the ring-shaped member W3 of the wafer ring structure W in the Z2 direction. The suction unit 12a is supported by the table movement mechanism 12d via the rotation mechanism 12c. The clamp unit 12b is provided at the upper end of the suction unit 12a. The clamp unit 12b is configured to hold the wafer ring structure W held by the suction unit 12a. The clamp unit 12b holds the ring-shaped member W3 of the wafer ring structure W held by the suction unit 11c from the Z1 direction. In this manner, the wafer ring structure W is gripped by the suction unit 12a and the clamp unit 12b.

[0035] The rotation mechanism 12c is configured to rotate the suction unit 12a in the circumferential direction around a rotation center axis C extending parallel to the Z direction. The rotation mechanism 12c is attached to the upper end of the table movement mechanism 12d. The table movement mechanism 12d is configured to move the wafer ring structure W in the X direction and the Y direction. The table movement mechanism 12d has an X-direction movement mechanism 121 and a Y-direction movement mechanism 122. The X-direction movement mechanism 121 is configured to move the rotation mechanism 12c in the X1 direction or the X2 direction. The X-direction movement mechanism 121 has a linear conveyor module or a drive unit having a ball screw and a motor with an encoder. The Y-direction movement mechanism 122 is configured to move the rotation mechanism 12c in the Y1 direction or the Y2 direction. The Y-direction movement mechanism 122 has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder.

[0036] <Laser section> The laser unit 13 is configured to irradiate a wafer W1 of the wafer ring structure W held by the chuck table 12 with laser light. The laser unit 13 is disposed on the Z1 side of the chuck table 12. The laser unit 13 includes a laser irradiation unit 13a, a mounting member 13b, and a Z-direction movement mechanism 13c. The laser irradiation unit 13a is configured to irradiate a pulsed laser light. The mounting member 13b is a frame to which the laser unit 13 and the imaging unit 14 are attached. The Z-direction movement mechanism 13c is configured to move the laser unit 13 in the Z1 direction or the Z2 direction. The Z-direction movement mechanism 13c includes, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder. Note that the laser irradiation unit 13a may be a laser irradiation unit that oscillates a continuous-wave laser light as the laser light, other than a pulsed laser light, as long as it is capable of forming a modified layer through multiphoton absorption.

[0037] <Imaging unit> The imaging unit 14 is configured to capture an image of the wafer W1 of the wafer ring structure W held by the chuck table 12. The imaging unit 14 is disposed on the Z1 direction side of the chuck table 12. The imaging unit 14 has a high-resolution camera 14a, a wide-angle camera 14b, a Z-direction movement mechanism 14c, and a Z-direction movement mechanism 14d.

[0038] The high-resolution camera 14a and the wide-angle camera 14b are near-infrared imaging cameras. The high-resolution camera 14a has a narrower viewing angle than the wide-angle camera 14b. The high-resolution camera 14a has higher resolution than the wide-angle camera 14b. The wide-angle camera 14b has a wider viewing angle than the high-resolution camera 14a. The wide-angle camera 14b has lower resolution than the high-resolution camera 14a. The high-resolution camera 14a is arranged on the X1 direction side of the laser irradiation unit 13a. The wide-angle camera 14b is arranged on the X2 direction side of the laser irradiation unit 13a. In this way, the high-resolution camera 14a, the laser irradiation unit 13a, and the wide-angle camera 14b are arranged adjacent to each other in this order from the X1 direction side.

[0039] The Z-direction movement mechanism 14c is configured to move the high-resolution camera 14a in the Z1 direction or the Z2 direction. The Z-direction movement mechanism 14c has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder. The Z-direction movement mechanism 14d is configured to move the wide-angle camera 14b in the Z1 direction or the Z2 direction. The Z-direction movement mechanism 14d has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder.

[0040] (Expanding device) As shown in FIGS. 1, 6, and 7, the expanding device 2 is configured to divide the wafer W1 to form a plurality of semiconductor chips Ch (see FIG. 8). The expanding device 2 is also configured to form sufficient gaps between the plurality of semiconductor chips Ch. Here, a modified layer is formed on the wafer W1 by irradiating the wafer W1 with a laser having a wavelength that is transparent to the wafer W1 along the dividing lines (streets) in the dicing device 1. In the expanding device 2, the wafer W1 is divided along the modified layer that was previously formed in the dicing device 1, thereby forming a plurality of semiconductor chips Ch.

[0041] Therefore, in the expanding device 2, the wafer W1 is divided along the modified layer by expanding the sheet member W2. In addition, in the expanding device 2, the sheet member W2 is expanded, and thus the gaps between the plurality of semiconductor chips Ch formed by division are widened.

[0042] The expansion device 2 includes a base 201, a cassette section 202, a lift-up hand section 203, a suction hand section 204, a base 205, a cold air supply section 206, a cooling unit 207, an expansion section 208, a base 209, an expansion maintenance member 210, a heat shrink section 211, an ultraviolet irradiation section 212, a squeegee section 213, and a clamp section 214.

[0043] <base> The base 201 is a base on which the cassette unit 202 and the lift-up hand unit 203 are installed. The base 201 has a rectangular shape in a plan view.

[0044] <Cassette section> The cassette unit 202 is configured to be able to accommodate a plurality (five) of wafer ring structures W. The cassette unit 202 includes a wafer cassette 202a, a Z-direction moving mechanism 202b, and a pair of mounting units 202c.

[0045] A plurality of (three) wafer cassettes 202a are arranged in the Z direction. Each wafer cassette 202a has a storage space capable of storing a plurality of wafer ring structures W. The wafer ring structures W are manually supplied and placed in the wafer cassette 202a. The wafer cassette 202a may store one to four wafer ring structures W, or may store six or more wafer ring structures W. One, two, or four or more wafer cassettes 202a may be arranged in the Z direction.

[0046] The Z-direction movement mechanism 202b is configured to move the wafer cassette 202a in the Z1 direction or the Z2 direction. The Z-direction movement mechanism 202b has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder. The Z-direction movement mechanism 202b also has a mounting table 202d that supports the wafer cassette 202a from below. Multiple mounting tables 202d (three in total) are arranged to match the positions of the multiple wafer cassettes 202a.

[0047] A plurality (five) of pairs of mounting portions 202c are arranged inside the wafer cassette 202a. The ring-shaped member W3 of the wafer ring structure W is placed on the pair of mounting portions 202c from the Z1 direction side. One of the pair of mounting portions 202c protrudes in the X2 direction from the inner surface of the wafer cassette 202a on the X1 direction side. The other of the pair of mounting portions 202c protrudes in the X1 direction from the inner surface of the wafer cassette 202a on the X2 direction side.

[0048] <Lift-up hand part> The lift-up hand section 203 is configured to be able to take out the wafer ring structure W from the cassette section 202. The lift-up hand section 203 is also configured to be able to store the wafer ring structure W in the cassette section 202.

[0049] Specifically, the lift-up hand unit 203 includes a Y-direction movement mechanism 203a and a lift-up hand 203b. The Y-direction movement mechanism 203a has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder. The lift-up hand 203b is configured to support the ring-shaped member W3 of the wafer ring structure W from the Z2 direction side.

[0050] <Suction hand section> The suction hand portion 204 is configured to suck the ring-shaped member W3 of the wafer ring structure W from the Z1 direction side.

[0051] Specifically, the suction hand unit 204 includes an X-direction movement mechanism 204a, a Z-direction movement mechanism 204b, and a suction hand 204c. The X-direction movement mechanism 204a is configured to move the suction hand 204c in the X direction. The Z-direction movement mechanism 204b is configured to move the suction hand 204c in the Z direction. The X-direction movement mechanism 204a and the Z-direction movement mechanism 204b each have a drive unit including, for example, a linear conveyor module or a ball screw and a motor with an encoder. The suction hand 204c is configured to suck and support the ring-shaped member W3 of the wafer ring structure W from the Z1 direction. Here, the suction hand 204c generates negative pressure to support the ring-shaped member W3 of the wafer ring structure W.

[0052] <base> 7 and 8, the base 205 is a base on which the expanding section 208, the cooling unit 207, the ultraviolet irradiation section 212, and the squeegee section 213 are mounted. The base 205 has a rectangular shape in a plan view. In FIG. 8, the clamp section 214, which is positioned in the Z1 direction of the cooling unit 207, is indicated by a dotted line.

[0053] <Cold air supply section> The cool air supplying section 206 is configured to supply cool air to the sheet member W2 from the Z1 direction side when the expanding section 208 expands the sheet member W2.

[0054] Specifically, the cold air supply unit 206 has a supply unit main body 206a, a cold air supply port 206b, and a movement mechanism 206c. The cold air supply port 206b is configured to allow cold air supplied from the cold air supply device to flow out. The cold air supply port 206b is provided at the end of the supply unit main body 206a on the Z2 direction side. The cold air supply port 206b is located in the center of the end of the supply unit main body 206a on the Z2 direction side. The movement mechanism 206c has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder.

[0055] The cold air supply device is a device for generating cold air. The cold air supply device supplies air cooled by, for example, a heat pump. Such a cold air supply device is installed on base 205. Cold air supply unit 206 and the cold air supply device are connected by a hose (not shown).

[0056] <Cooling unit> The cooling unit 207 is configured to cool the sheet member W2 from the Z2 direction side.

[0057] Specifically, the cooling unit 207 includes a cooling member 207a having a cooling body 271 and a Peltier element 272, and a Z-direction movement mechanism 207b. The cooling body 271 is made of a material with a large heat capacity and high thermal conductivity. The cooling body 271 is made of a metal such as aluminum. The Peltier element 272 is configured to cool the cooling body 271. Note that the cooling body 271 is not limited to aluminum, and may be made of another material with a large heat capacity and high thermal conductivity. The Z-direction movement mechanism 207b is a cylinder.

[0058] The cooling unit 207 is configured to be movable in the Z1 direction or the Z2 direction by a Z-direction movement mechanism 207b, which allows the cooling unit 207 to move to a position where it contacts the sheet member W2 and a position away from the sheet member W2.

[0059] <Expanding section> The expanding section 208 is configured to expand the sheet member W2 of the wafer ring structure W, thereby dividing the wafer W1 along the dividing lines.

[0060] Specifically, the expanding section 208 has an expanding ring 281. The expanding ring 281 is configured to support the sheet member W2 from the Z2 direction side, thereby expanding (expanding) the sheet member W2. The expanding ring 281 has a ring shape in a plan view. The structure of the expanding ring 281 will be described in detail later.

[0061] <base> The base 209 is a base on which the cold air supply unit 206, the expansion and maintenance member 210, and the heat shrink unit 211 are installed.

[0062] <Expansion maintenance member> As shown in FIGS. 7 and 8, the expansion maintaining member 210 is configured to press the sheet member W2 from the Z1 direction side so that the sheet member W2 near the wafer W1 does not shrink due to heating by the heating ring 211a.

[0063] Specifically, the expansion-retaining member 210 includes a pressure ring portion 210a, a lid portion 210b, and an intake portion 210c. The pressure ring portion 210a has a ring shape in a plan view. The lid portion 210b is attached to the pressure ring portion 210a so as to close the opening of the pressure ring portion 210a. The intake portion 210c is an intake ring having a ring shape in a plan view. Multiple intake ports are formed on the underside of the intake portion 210c on the Z2 direction side. The pressure ring portion 210a is configured to move in the Z direction by a Z-direction movement mechanism 210d. That is, the Z-direction movement mechanism 210d is configured to move the pressure ring portion 210a to a position where it presses the sheet member W2 and to a position away from the sheet member W2. The Z-direction movement mechanism 210d includes, for example, a linear conveyor module or a drive unit including a ball screw and a motor with an encoder.

[0064] <Heat shrink section> The heat shrink section 211 is configured to shrink the sheet member W2 expanded by the expanding section 208 by heating while maintaining the gaps between the plurality of semiconductor chips Ch.

[0065] The heat shrink unit 211 has a heating ring 211a and a Z-direction movement mechanism 211b. The heating ring 211a has a ring shape in a plan view. The heating ring 211a also has a sheathed heater that heats the sheet member W2. The Z-direction movement mechanism 211b is configured to move the heating ring 211a in the Z direction. The Z-direction movement mechanism 211b has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder.

[0066] <Ultraviolet irradiation section> The ultraviolet irradiating unit 212 is configured to irradiate the sheet member W2 with ultraviolet rays in order to reduce the adhesive strength of the adhesive layer of the sheet member W2. Specifically, the ultraviolet irradiating unit 212 has an ultraviolet illuminator. The ultraviolet irradiating unit 212 is disposed at the end of the squeegee unit 213 on the Z1 direction side of a pressing unit 213a (described later). The ultraviolet irradiating unit 212 is configured to irradiate the sheet member W2 with ultraviolet rays while moving together with the squeegee unit 213.

[0067] <Squeegee Section> The squeegee unit 213 is configured to expand the sheet member W2 and then locally press the wafer W1 from the Z2 direction side to further divide the wafer W1 along the modified layer. Specifically, the squeegee unit 213 has a pressing unit 213a, a Z-direction moving mechanism 213b, an X-direction moving mechanism 213c, and a rotating mechanism 213d.

[0068] The pressing unit 213a is configured to press the wafer W1 from the Z2 direction side via the sheet member W2 and move using the rotation mechanism 213d and the X-direction movement mechanism 213c, thereby generating bending stress in the wafer W1 and dividing the wafer W1 along the modified layer. The pressing unit 213a presses the wafer W1 by contacting the wafer W1 via the sheet member W2 when raised to an elevated position on the Z1 direction side by the Z-direction movement mechanism 213b. The pressing unit 213a is lowered to a lower position on the Z2 direction side by the Z-direction movement mechanism 213b, thereby releasing the pressing unit 213a from contact with the wafer W1 and no longer pressing the wafer W1. The pressing unit 213a is a squeegee.

[0069] The pressing unit 213a is attached to the Z1-direction end of the Z-direction movement mechanism 213b. The Z-direction movement mechanism 213b is configured to move the pressing unit 213a linearly in the Z1 direction or the Z2 direction. The Z-direction movement mechanism 213b is, for example, a cylinder. The Z-direction movement mechanism 213b is attached to the Z1-direction end of the X-direction movement mechanism 213c.

[0070] The X-direction movement mechanism 213c is attached to the end of the rotation mechanism 213d on the Z1 direction side. The X-direction movement mechanism 213c is configured to move the pressing unit 213a linearly in one direction. The X-direction movement mechanism 213c has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder.

[0071] In the squeegee unit 213, the pressing unit 213a is raised to a raised position by the Z-direction movement mechanism 213b. In the squeegee unit 213, the pressing unit 213a locally presses the wafer W1 from the Z2 direction side via the sheet member W2, while the X-direction movement mechanism 213c moves the pressing unit 213a in the Y direction, thereby dividing the wafer W1. In the squeegee unit 213, the Z-direction movement mechanism 213b lowers the pressing unit 213a to a lowered position. In the squeegee unit 213, after the movement of the pressing unit 213a in the Y direction has finished, the rotation mechanism 213d rotates the pressing unit 213a by 90 degrees.

[0072] In the squeegee unit 213, the pressing unit 213a is raised to an elevated position by the Z-direction movement mechanism 213b. In the squeegee unit 213, after the pressing unit 213a rotates 90 degrees, the pressing unit 213a locally presses the wafer W1 from the Z2 direction side via the sheet member W2, while the pressing unit 213a is moved in the X direction by the X-direction movement mechanism 213c, thereby dividing the wafer W1.

[0073] <Clamp section> The clamp unit 214 is configured to grip the ring-shaped member W3 of the wafer ring structure W. Specifically, the clamp unit 214 has a gripping unit 214a, a Z-direction movement mechanism 214b, and a Y-direction movement mechanism 214c. The gripping unit 214a supports the ring-shaped member W3 from the Z2 direction side and presses the ring-shaped member W3 from the Z1 direction side. In this manner, the ring-shaped member W3 is gripped by the gripping unit 214a. The gripping unit 214a is attached to the Z-direction movement mechanism 214b.

[0074] The Z-direction movement mechanism 214b is configured to move the clamp unit 214 in the Z direction. Specifically, the Z-direction movement mechanism 214b is configured to move the gripper 214a in the Z1 direction or the Z2 direction. The Z-direction movement mechanism 214b is configured to move the gripper 214a in the Z1 direction or the Z2 direction. The Z-direction movement mechanism 214b has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder. The Z-direction movement mechanism 214b is attached to the Y-direction movement mechanism 214c. The Y-direction movement mechanism 214c is configured to move the Z-direction movement mechanism 214b in the Y1 direction or the Y2 direction. The Y-direction movement mechanism 214c has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder.

[0075] (Control configuration of semiconductor wafer processing equipment) As shown in FIG. 9, the semiconductor wafer processing apparatus 100 includes a first control unit 101, a second control unit 102, a third control unit 103, a fourth control unit 104, a fifth control unit 105, a sixth control unit 106, a seventh control unit 107, an eighth control unit 108, an expansion control calculation unit 109, a handling control calculation unit 110, a dicing control calculation unit 111, and a memory unit 112.

[0076] The first control unit 101 is configured to control the squeegee unit 213. The first control unit 101 includes a central processing unit (CPU) and a storage unit having a read-only memory (ROM) and a random access memory (RAM). The first control unit 101 may include a hard disk drive (HDD) as the storage unit, in which stored information is retained even after the voltage is cut off. The HDD may be shared by the first control unit 101, the second control unit 102, the third control unit 103, the fourth control unit 104, the fifth control unit 105, the sixth control unit 106, the seventh control unit 107, and the eighth control unit 108.

[0077] The second control unit 102 is configured to control the cool air supply unit 206 and the cooling unit 207. The second control unit 102 includes a CPU and a storage unit having a ROM, RAM, etc. The third control unit 103 is configured to control the heat shrink unit 211 and the ultraviolet ray irradiation unit 212. The third control unit 103 includes a CPU and a storage unit having a ROM, RAM, etc. Note that the second control unit 102 and the third control unit 103 may include a storage unit such as an HDD that retains stored information even after the voltage is cut off.

[0078] The fourth control unit 104 is configured to control the cassette unit 202 and the lift-up hand unit 203. The fourth control unit 104 includes a CPU and a storage unit having a ROM, RAM, etc. The fifth control unit 105 is configured to control the suction hand unit 204. The fifth control unit 105 includes a CPU and a storage unit having a ROM, RAM, etc. Note that the fourth control unit 104 and the fifth control unit 105 may include a storage unit such as an HDD that retains stored information even after the voltage is cut off.

[0079] The sixth control unit 106 is configured to control the chuck table unit 12. The sixth control unit 106 includes a CPU and a storage unit having a ROM, RAM, etc. The seventh control unit 107 is configured to control the laser unit 13. The seventh control unit 107 includes a CPU and a storage unit having a ROM, RAM, etc. The eighth control unit 108 is configured to control the imaging unit 14. The eighth control unit 108 includes a CPU and a storage unit having a ROM, RAM, etc. Note that the sixth control unit 106, the seventh control unit 107, and the eighth control unit 108 may each include a storage unit such as an HDD that retains stored information even after the voltage is cut off.

[0080] The expansion control calculation unit 109 is configured to perform calculations related to the expansion process of the sheet member W2 based on the processing results of the first control unit 101, the second control unit 102, and the third control unit 103. The expansion control calculation unit 109 includes a CPU and a storage unit having a ROM, a RAM, etc.

[0081] The handling control calculation unit 110 is configured to perform calculations related to the movement process of the wafer ring structure W based on the processing results of the fourth control unit 104 and the fifth control unit 105. The handling control calculation unit 110 includes a CPU and a storage unit having a ROM, a RAM, etc.

[0082] The dicing control calculation unit 111 is configured to perform calculations related to the dicing process of the wafer W1 based on the processing results of the sixth control unit 106, the seventh control unit 107, and the eighth control unit 108. The dicing control calculation unit 111 includes a CPU and a storage unit having a ROM, a RAM, etc.

[0083] The storage unit 112 stores programs for operating the dicing device 1 and the expanding device 2. The storage unit 112 includes a ROM, a RAM, an HDD, and the like.

[0084] (Semiconductor chip manufacturing process) The overall operation of the semiconductor wafer processing apparatus 100 will be described below with reference to FIGS.

[0085] In step S1, the wafer ring structure W is removed from the cassette unit 202. That is, after the wafer ring structure W accommodated in the cassette unit 202 is supported by the lift-up hand 203b, the lift-up hand 203b is moved in the Y1 direction by the Y-direction movement mechanism 203a, thereby removing the wafer ring structure W from the cassette unit 202. In step S2, the wafer ring structure W is transferred to the chuck table unit 12 of the dicing apparatus 1 by the suction hand 204c. That is, the wafer ring structure W removed from the cassette unit 202 is moved in the X2 direction by the X-direction movement mechanism 204a while being sucked by the suction hand 204c. Then, the wafer ring structure W moved in the X2 direction is transferred from the suction hand 204c to the chuck table unit 12, and then gripped by the chuck table unit 12.

[0086] In step S3, a modified layer is formed on the wafer W1 by the laser unit 13. In step S4, the wafer ring structure W having the wafer W1 on which the modified layer has been formed is transferred to the clamp unit 214 by the suction hand 204c. In step S5, the sheet member W2 is cooled by the cold air supply unit 206 and the cooling unit 207. That is, the wafer ring structure W held by the clamp unit 214 is moved (lowered) in the Z2 direction by the Z-direction movement mechanism 214b so as to contact the cooling unit 207, and cold air is supplied from the Z1 direction by the cold air supply unit 206, thereby cooling the sheet member W2.

[0087] In step S6, the wafer ring structure W is moved to the expanding unit 208 by the clamping unit 214. That is, the wafer ring structure W, from which the sheet member W2 has been cooled, is moved in the Y1 direction by the Y-direction moving mechanism 214c while being held by the clamping unit 214. In step S7, the sheet member W2 is expanded by the expanding unit 208. That is, the wafer ring structure W is moved in the Z2 direction by the Z-direction moving mechanism 214b while being held by the clamping unit 214. Then, the sheet member W2 comes into contact with the expanding ring 281 and is expanded by being pulled by the expanding ring 281. As a result, the wafer W1 is divided along the dividing line.

[0088] In step S8, the sheet member W2 in the state where the wafer W1 is divided is pressed from the Z1 direction side by the expansion maintaining member 210. That is, the pressing ring portion 210a is moved (lowered) in the Z2 direction by the Z direction moving mechanism 210d until it abuts against the sheet member W2. Then, the process proceeds from point A in FIG. 10 via point A in FIG. 11 to step S9.

[0089] 11, in step S9, after the sheet member W2 is pressed by the expansion maintaining member 210, ultraviolet rays are irradiated onto the sheet member W2 by the ultraviolet irradiating unit 212 while the wafer W1 is pressed by the squeegee unit 213. As a result, the wafer W1 is further divided by the squeegee unit 213. In addition, the adhesive strength of the sheet member W2 is reduced by the ultraviolet rays irradiated from the ultraviolet irradiating unit 212.

[0090] In step S10, the sheet material W2 is heated and shrunk by the heat shrink unit 211, while the clamp unit 214 is raised. At this time, the intake unit 210c sucks in air near the heated sheet material W2. In step S11, the wafer ring structure W is transferred from the clamp unit 214 to the suction hand 204c. That is, the wafer ring structure W is moved in the Y2 direction by the Y-direction movement mechanism 214c while being held by the clamp unit 214. Then, at a position on the Z1 direction side of the cooling unit 207, the wafer ring structure W is released from the clamp unit 214 and then sucked by the suction hand 204c.

[0091] In step S12, the wafer ring structure W is transferred to the lift-up hand 203b by the suction hand 204c. In step S13, the wafer ring structure W is accommodated in the cassette unit 202. That is, the wafer ring structure W supported by the lift-up hand 203b is moved in the Y1 direction by the Y-direction movement mechanism 203a, and the wafer ring structure W is accommodated in the cassette unit 202. This completes the processing performed on one wafer ring structure W. Then, the process returns from point B in FIG. 11 via point B in FIG. 10 to step S1.

[0092] (Detailed configuration of the expansion ring and pressure ring) 12 to 16, the detailed configuration of the expanding ring 281 of the expanding section 208 will be described. Here, the circumferential direction around an axis Ac of the expanding ring 281 extending parallel to the Z direction is defined as the R direction, and the direction perpendicular to the direction in which the axis Ac extends is defined as the D direction.

[0093] As shown in FIGS. 12 and 13, the expand ring 281 has an accommodation space 281a, a sphere 281b, a first member 281c, and a second member 281d.

[0094] The accommodation space 281a is a space that accommodates the sphere 281b. The accommodation space 281a has a ring shape in a plan view. That is, the accommodation space 281a extends along the R direction. The accommodation space 281a is disposed at the Z1 direction end (upper end) on the outer side in the D direction of the expand ring 281. The accommodation space 281a is formed by a first member 281c and a second member 281d. The accommodation space 281a accommodates the sphere 281b so that a surface 2811 (see FIG. 14) of the sphere 281b is partially exposed.

[0095] Spheres 281b are bearing balls made of ceramic with low thermal conductivity, such as zirconia (thermal conductivity of approximately 3 W / m·K). The thermal conductivity of spheres 281b is lower than that of stainless steel bearing balls used in metal ball bearings (thermal conductivity of approximately 16 to 20 W / m·K). Note that spheres 281b may be made of glass (for example, soda glass (thermal conductivity of approximately 0.55 to 0.75 W / m·K)) as long as their thermal conductivity is lower than that of stainless steel bearing balls (thermal conductivity of approximately 16 to 20 W / m·K).

[0096] In plan view, the plurality of spheres 281b are arranged around the entire circumference of the ring-shaped accommodation space 281a. In plan view, the plurality of spheres 281b are arranged in contact with each other in the R direction in the ring-shaped accommodation space 281a.

[0097] 14, the sphere 281b is rotatably disposed at a portion that contacts the sheet member W2 during expansion. In a cross section taken along the D direction, the outer portion of the upper portion of the sphere 281b in the D direction is exposed from the expand ring 281. That is, in a cross section taken along the D direction, the sphere 281b straddles the upper surface 281e and the side surface 281f of the expand ring 281, and an arc portion of the entire circumference of the sphere 281b is exposed from the expand ring 281, where the central angle θ of the sphere 281b is equal to or greater than 90 degrees and less than 180 degrees. Specifically, in a cross section taken along the D direction, the sphere 281b straddles the upper surface 281e and the side surface 281f of the expand ring 281, and an arc portion of the entire circumference of the sphere 281b is exposed from the expand ring 281, where the central angle θ of the sphere 281b is equal to or greater than 90 degrees and less than 150 degrees.

[0098] The first member 281c is disposed on the inner circumferential side in the D direction of the expand ring 281. The first member 281c is a cylindrical member. The first member 281c has a first convex portion 2811c. The first convex portion 2811c protrudes outward in the D direction from the Z1 direction end portion (upper end portion) on the outer side in the D direction of the first member 281c. The Z2 direction side surface of the first convex portion 2811c is an inclined surface 2812c that inclines toward the Z1 direction as it extends outward in the D direction. An outer surface 2813c on the outer side in the D direction of the first member 281c is a circumferential surface along the R direction.

[0099] The second member 281d is disposed on the outer periphery of the expand ring 281 in the D direction. The second member 281d is a cylindrical member. The second member 281d has a second convex portion 2811d. The second convex portion 2811d protrudes in the Z1 direction from the outer portion in the D direction of the Z1 direction side end (upper end) of the second member 281d. The inner surface in the D direction of the second convex portion 2811d is an inclined surface 2812d that inclines inward in the D direction as it approaches the Z2 direction. An upper end surface 2813d on the Z1 direction side of the second member 281d is an annular surface when viewed from the Z1 direction side.

[0100] The first member 281c and the second member 281d are in contact with each other in the D direction.

[0101] As shown in Fig. 15, a line passing through the center Bc of the sphere 281b and a contact point Pa between the outer portion of the sphere 281b in the D direction and the inclined surface 2812d is defined as a straight line L1. Note that the sphere 281b and the inclined surface 2812d are not always in contact with each other at the contact point Pa. Also, a line passing through the center Bc of the sphere 281b and a contact point Pb between the top of the sphere 281b in the Z direction and the inclined surface 2812c is defined as a straight line L2. Note that the sphere 281b and the inclined surface 2812c are not always in contact with each other at the contact point Pb.

[0102] A line passing through the center Bc of the sphere 281b and a contact point Pc between the inner end of the sphere 281b in the D direction and the outer surface 2813c is defined as a straight line L3. Note that the sphere 281b and the outer surface 2813c are not always in contact at the contact point Pc. Also, a line passing through the center Bc of the sphere 281b and a contact point Pd between the lower end of the sphere 281b in the Z direction and the upper end surface 2813d is defined as a straight line L4. Note that the sphere 281b and the upper end surface 2813d are not always in contact at the contact point Pd.

[0103] That is, when the sheet member W2 is in contact with the sphere 281b while the sphere 281b is not rotating, a force Fs is applied from the sheet member W2 to the sphere 281b, causing the sphere 281b to come into contact with the expanding ring 281 at contact points Pc and Pd. Also, gaps are provided between the sphere 281b and the expanding ring 281 at contact points Pa and Pb.

[0104] Furthermore, there are cases where the sphere 281b and the sphere 281b adjacent thereto in the R direction come into contact with each other, or where a gap is provided between the sphere 281b and the sphere 281b adjacent thereto in the R direction. There are cases where the sphere 281b and the sphere 281b adjacent thereto in the opposite direction to the R direction come into contact with each other, or where a gap is provided between the sphere 281b and the sphere 281b adjacent thereto in the opposite direction to the R direction.

[0105] Furthermore, when a force Fs is applied to the sphere 281b from the sheet member W2 while the sphere 281b is rotating, the sphere 281b rotates due to the force Fs, and is elastically deformed by the force Fs. As a result, the sphere 281b expands and contracts, and as the sphere 281b rotates, the sphere 281b and the expand ring 281 come into temporary contact with each other at least at two locations among the contact point Pa, the contact point Pb, the contact point Pc, and the contact point Pd.

[0106] In this way, the expand ring 281 rotatably holds the sphere 281b in the storage space 281a so as to abut at least two points among the upper part of the sphere 281b, the lower end part of the sphere 281b, the outer end part of the sphere 281b in the D direction, and the inner end part of the sphere 281b in the D direction.

[0107] 16, the pressure ring portion 210a is configured to maintain the expanded state of the sheet member W2 near the wafer W1 while pressing a portion of the sheet member W2 that corresponds to the outer portion of the sphere 281b in the D direction. The diameter of the pressure ring portion 210a is such that, when the pressure ring portion 210a presses a portion of the sheet member W2 that is outer than the center Bc of the sphere 281b of the expand ring 281, the lower end 210e of the pressure ring portion 210a is positioned closer to the Z2 direction than the upper end 2811b of the sphere 281b and is positioned outer in the D direction than the center Bc of the sphere 281b. In other words, the diameter of the pressure ring portion 210a is such that the outer portion of the pressure ring portion 210a in the D direction and the outer portion of the expand ring 281 in the D direction can overlap when viewed from the Z1 direction.

[0108] In a method for manufacturing semiconductor chips Ch (the above-described semiconductor chip manufacturing process), which is a manufacturing method for manufacturing semiconductor chips Ch, a step of forming a modified layer in the wafer W1 by irradiating the wafer W1 with laser light from the laser irradiation unit 13a that irradiates the laser light is performed by the dicing control calculation unit 111. In the manufacturing method for semiconductor chips Ch, a step of dividing the wafer W1 along the modified layer by expanding the sheet member W2 with an expand ring 281 having a sphere 281b and a housing space 281a during expansion is performed by the expansion control calculation unit 109, in a state where the ring-shaped member W3 of the wafer ring structure W is held by the clamp unit 214 that holds the ring-shaped member W3.

[0109] The semiconductor chip Ch manufactured by such a manufacturing method of the semiconductor chip Ch comprises the clamp portion and the expand ring, and the expand ring is manufactured by an expand device 2 including the sphere and the storage space.

[0110] (Effects of the first embodiment) In the first embodiment, the following effects can be obtained.

[0111] In the first embodiment, as described above, the expand ring 281 includes a sphere 281b rotatably arranged in a portion that contacts the sheet member W2 during expansion, and an accommodation space 281a that rotatably accommodates the sphere 281b. Thus, since the sphere 281b is accommodated in the accommodation space 281a, when the sheet member W2 is expanded by the expand ring 281, unlike when cylindrical rollers are used, the number of contact points between the sphere 281b and the expand ring 281 within the accommodation space 281a can be reduced, thereby reducing friction between the sphere 281b and the expand ring 281. As a result, compared to when cylindrical rollers are used, the sphere 281b is more likely to rotate relative to the expand ring 281, and therefore, when the sheet member W2 is expanded, the sheet member W2 can be smoothly expanded on the expand ring 281.

[0112] Furthermore, in the first embodiment, as described above, in a cross section of the expanding ring 281 taken along the D direction, the sphere 281b straddles the upper surface 281e and the side surface 281f of the expanding ring 281, and an arc portion of the entire circumference of the sphere 281b, which corresponds to a central angle θ of the sphere 281b of 90 degrees or more and less than 180 degrees, is exposed from the expanding ring 281. This allows the sphere 281b to be exposed near the outer edge of the expanding ring 281 in the D direction, and therefore allows the sphere 281b to come into contact with the sheet member W2 near the outer edge of the expanding ring 281. As a result, by bringing the sphere 281b into contact with the sheet member W2 near the outer edge of the expand ring 281 where the extension direction of the sheet member W2 changes from horizontal to downward with respect to the sheet member W2 that is inside the outer edge of the expand ring 281, when expanding the sheet member W2, the sheet member W2 can be expanded in a state in which the sphere 281b can easily rotate relative to the expand ring 281, so that the expansion of the sheet member W2 can be carried out smoothly.

[0113] Furthermore, in the first embodiment, as described above, the expand ring 281 includes a first member 281c arranged on the inner periphery side and a second member 281d arranged on the outer periphery side. The accommodation space 281a is formed by being surrounded by the first member 281c and the second member 281d. As a result, the first member 281c and the second member 281d are each processed separately, and then the processed first member 281c and second member 281d are combined to form the accommodation space 281a. This makes it possible to easily form the accommodation space 281a that rotatably accommodates the sphere 281b while exposing a portion of the sphere 281b.

[0114] Furthermore, in the first embodiment, as described above, the spheres 281b are made of ceramic with low thermal conductivity. As a result, when the sheet member W2 is heated in an expanded state, the heat applied to the sheet member W2 can be prevented from escaping through the spheres 281b, compared to when the spheres 281b are made of a material with high thermal conductivity, thereby suppressing heat imbalance in the sheet member W2.

[0115] Furthermore, in the first embodiment, as described above, the expanding device 2 is provided with a ring-shaped pressing ring unit 210a that is disposed above the expand ring 281 and that maintains the expanded state of the sheet member W2 near the wafer W1. The pressing ring unit 210a is configured to maintain the expanded state of the sheet member W2 near the wafer W1 while pressing the sheet member W2 outside the center Bc of the sphere 281b in the direction D of the pressing ring unit 210a. This allows the length of the sheet member W2 from the contact point between the pressing ring unit 210a and the sheet member W2 to the wafer W1 to be longer in the cross section of the pressing ring unit 210a in the direction D compared to when the pressing ring unit 210a presses the sheet member W2 inside the center Bc of the sphere 281b. As a result, even if the sheet member W2 near the pressing ring portion 210a rises when the pressing ring portion 210a separates from the sheet member W2, the sheet member W2 near the wafer W1 can be prevented from rising as well, thereby preventing the divided wafer W1 from peeling off from the sheet member W2 due to the sheet member W2 rising up.

[0116] Furthermore, in the first embodiment, as described above, the diameter of the pressing ring portion 210a has a length such that, in the direction D of the pressing ring portion 210a, when the pressing ring portion 210a presses the sheet member W2 at a portion outside the center Bc of the sphere 281b of the expand ring 281, the lower end portion 210e of the pressing ring portion 210a is positioned below the upper end portion 2811b of the sphere 281b and is positioned outside the center Bc of the sphere 281b. As a result, the pressing ring portion 210a is positioned farther away from the wafer W1 than when the lower end portion 210e of the pressing ring portion 210a is positioned inside the center Bc of the sphere 281b in the direction D of the pressing ring portion 210a. Furthermore, since the lower end 210e of the pressing ring portion 210a is positioned lower than the upper end 2811b of the sphere 281b, the position at which the pressing ring portion 210a separates from the sheet member W2 can be set to a relatively low position in the Z direction, and therefore the position at which the pressing ring portion 210a separates from the sheet member W2 can be set to a position lower than the height position of the sheet member W2 inside the center Bc of the sphere 281b. As a result, the sheet member W2 inside the center Bc of the sphere 281b can be made less likely to float up in the D direction of the expand ring 281, and therefore, peeling of the divided wafers W1 from the sheet member W2 due to the sheet member W2 floating up can be further suppressed.

[0117] Furthermore, in the first embodiment, as described above, the expand ring 281 rotatably holds the sphere 281b in the accommodation space 281a so as to abut at least two points among the upper part of the sphere 281b, the lower end of the sphere 281b, the outer end of the sphere 281b in the direction D, and the inner end of the sphere 281b in the direction D. This allows the expand ring 281 to hold the sphere 281b in the accommodation space 281a by bringing the expand ring 281 and the sphere 281b into point contact, thereby making it possible to relatively reduce the number of contact points between the expand ring 281 and the sphere 281b. As a result, the sphere 281b can be smoothly rotated within the accommodation space 281a.

[0118] Furthermore, in the first embodiment, as described above, the storage space 281a has a ring shape in a plan view. A plurality of spheres 281b are arranged around the entire circumference of the ring-shaped storage space 281a in a plan view. This allows the sheet member W2 and the spheres 281b to be in contact with each other around the entire outer edge of the expand ring 281 in the D direction. This makes it possible to make the resistance around the entire outer edge of the expand ring 281 in the D direction uniform, unlike when the sheet member W2 and the spheres 281b are in contact with each other only partly around the entire circumference of the outer edge of the expand ring 281 in the D direction. Therefore, when the sheet member W2 is expanded by the expand ring 281, the sheet member W2 can be expanded evenly. As a result, when the sheet member W2 is expanded, the sheet member W2 can be expanded more smoothly on the expand ring 281.

[0119] Furthermore, in the first embodiment, as described above, a portion of the sphere 281b can be brought into contact with the sheet member W2 near the outer edge of the expand ring 281 where the extension direction of the sheet member W2 changes downward relative to the sheet member W2 that is more inward than the outer edge of the expand ring 281. Therefore, when expanding the sheet member W2, the sheet member W2 can be expanded in a state in which the sphere 281b can easily rotate relative to the expand ring 281, and therefore the expansion of the sheet member W2 can be performed more smoothly.

[0120] Furthermore, in the first embodiment, as described above, the manufacturing method for semiconductor chips Ch includes a step of dividing the wafer W1 along the modified layer by expanding the sheet member W2 using an expand ring 281 having spheres 281b rotatably arranged in a portion that contacts the sheet member W2 and an accommodation space 281a that rotatably accommodates the spheres 281b. As a result, since the spheres 281b are accommodated in the accommodation space 281a, when expanding the sheet member W2 with the expand ring 281, the number of contact points between the spheres 281b and the expand ring 281 in the accommodation space 281a can be reduced compared to when cylindrical rollers are used. Therefore, friction between the spheres 281b rotated by the sheet member W2 and the expand ring 281 can be reduced. As a result, compared to when a cylindrical roller is used, the sphere 281b is easier to rotate relative to the expand ring 281, so that when expanding the sheet member W2, a manufacturing method for semiconductor chips Ch can be obtained that enables the sheet member W2 to be smoothly expanded on the expand ring 281.

[0121] Furthermore, in the first embodiment, as described above, the semiconductor chip Ch is manufactured by the expanding device 2 in which the expand ring 281 includes the spheres 281b rotatably arranged in a portion that contacts the sheet member W2 during expansion, and the accommodation space 281a that rotatably accommodates the spheres 281b. As a result, since the spheres 281b are accommodated in the accommodation space 281a, when the sheet member W2 is expanded by the expand ring 281, the number of contact points between the spheres 281b and the expand ring 281 in the accommodation space 281a can be reduced compared to when cylindrical rollers are used. Therefore, friction between the spheres 281b that rotate due to the sheet member W2 and the expand ring 281 can be reduced. As a result, compared to when a cylindrical roller is used, the sphere 281b is easier to rotate relative to the expand ring 281, so when expanding the sheet member W2, a semiconductor chip Ch can be obtained that can smoothly expand the sheet member W2 on the expand ring 281.

[0122] [Second embodiment] 17 to 22, the configuration of a semiconductor wafer processing apparatus 300 according to the second embodiment will be described. Unlike the first embodiment, the second embodiment has a squeegee unit 3213 disposed outside an expand ring 3281. Note that in the second embodiment, detailed description of the same configuration as in the first embodiment will be omitted.

[0123] (Semiconductor wafer processing equipment) As shown in FIGS. 17 and 18, the semiconductor wafer processing apparatus 300 is an apparatus for processing a wafer W1 provided on a wafer ring structure W.

[0124] The semiconductor wafer processing apparatus 300 is equipped with a dicing apparatus 1 and an expanding apparatus 302. The vertical direction is the Z direction, the upward direction is the Z1 direction, and the downward direction is the Z2 direction. The horizontal direction perpendicular to the Z direction in which the dicing apparatus 1 and the expanding apparatus 302 are lined up is the X direction, the X1 direction is the expanding apparatus 302 side of the X direction, and the X2 direction is the dicing apparatus 1 side of the X direction. The horizontal direction perpendicular to the X direction is the Y direction, one side of the Y direction is the Y1 direction, and the other side of the Y direction is the Y2 direction.

[0125] (dicing equipment) The dicing device 1 is configured to form a modified layer by irradiating the wafer W1 with a laser having a wavelength that is transparent to the wafer W1 along the dividing lines (streets).

[0126] Specifically, the dicing device 1 includes a base 11, a chuck table unit 12, a laser unit 13, and an imaging unit .

[0127] (Expanding device) As shown in FIGS. 18 and 19, the expanding apparatus 302 is configured to divide the wafer W1 into a plurality of semiconductor chips Ch.

[0128] The expansion device 302 includes a base 201, a cassette section 202, a lift-up hand section 203, a suction hand section 204, a base 205, a cold air supply section 206, a cooling unit 207, an expansion section 3208, a base 209, an expansion maintenance member 210, a heat shrink section 211, an ultraviolet irradiation section 212, a squeegee section 3213, and a clamp section 214.

[0129] <Expanding section> The expanding section 3208 is configured to expand the sheet member W2 of the wafer ring structure W, thereby dividing the wafer W1 along the dividing line.

[0130] Specifically, the expanding section 3208 has an expanding ring 3281 and a Z-direction moving mechanism 3282 .

[0131] The expand ring 3281 is configured to support the sheet member W2 from the Z2 direction side, thereby expanding (expanding) the sheet member W2. The expand ring 3281 has a ring shape in a plan view. The Z-direction movement mechanism 3282 is configured to move the expand ring 3281 in the Z1 direction or the Z2 direction. The Z-direction movement mechanism 3282 has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder. The Z-direction movement mechanism 3282 is attached to the base 201.

[0132] <Squeegee Section> The squeegee unit 3213 is configured to expand the sheet member W2 and then press the wafer W1 from the Z2 direction to further divide the wafer W1 along the modified layer. Specifically, the squeegee unit 3213 has a pressing unit 3213a, an X-direction moving mechanism 3213b, a Z-direction moving mechanism 3213c, and a rotating mechanism 3213d.

[0133] The pressing unit 3213a is configured to move in the Z1 direction by the Z-direction moving mechanism 3213c, and then move by the rotating mechanism 3213d and the X-direction moving mechanism 3213b while pressing the wafer W1 from the Z2 direction via the sheet member W2, thereby generating bending stress in the wafer W1 and dividing the wafer W1 along the modified layer. The pressing unit 3213a is a squeegee. The pressing unit 3213a is attached to the Z1 direction end of the rotating mechanism 3213d. The Z-direction moving mechanism 3213c is configured to move the rotating mechanism 3213d in the Z1 direction or the Z2 direction. The Z-direction moving mechanism 3213c has, for example, a cylinder. The Z-direction moving mechanism 3213c is attached to the Z1 direction end of the X-direction moving mechanism 3213b. The X-direction moving mechanism 3213b has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder. The X-direction movement mechanism 3213b is attached to the end of the base 205 on the Z1 direction side.

[0134] In the squeegee unit 3213, after being moved in the Z1 direction by the Z-direction moving mechanism 3213c, the pressing unit 3213a presses the wafer W1 from the Z2 direction side via the sheet member W2, while the X-direction moving mechanism 3213b moves the pressing unit 3213a in the Y direction, thereby dividing the wafer W1. Furthermore, in the squeegee unit 3213, after the pressing unit 3213a has completed moving in the Y direction, the rotating mechanism 3213d rotates the pressing unit 3213a by 90 degrees. Furthermore, in the squeegee unit 3213, after being rotated 90 degrees, the X-direction moving mechanism 3213b moves the pressing unit 3213a in the X direction while the pressing unit 3213a presses the wafer W1 from the Z2 direction side via the sheet member W2, thereby dividing the wafer W1.

[0135] (Control configuration of semiconductor wafer processing equipment) As shown in FIG. 20, semiconductor wafer processing apparatus 300 includes a first control unit 101, a second control unit 102, a third control unit 103, a fourth control unit 3104, a fifth control unit 3105, a sixth control unit 3106, a seventh control unit 3107, an eighth control unit 3108, a ninth control unit 3109, an expansion control calculation unit 3110, a handling control calculation unit 3111, a dicing control calculation unit 3112, and a memory unit 3113. The first control unit 101, the second control unit 102, the third control unit 103, the fifth control unit 3105, the sixth control unit 3106, the seventh control unit 3107, the eighth control unit 3108, the ninth control unit 3109, the expansion control calculation unit 3110, the handling control calculation unit 3111, the dicing control calculation unit 3112, and the memory unit 3113 have the same configuration as the first control unit 101, the second control unit 102, the third control unit 103, the fourth control unit 104, the fifth control unit 105, the sixth control unit 106, the seventh control unit 107, the eighth control unit 108, the expansion control calculation unit 109, the handling control calculation unit 110, the dicing control calculation unit 111, and the memory unit 112 of the first embodiment, respectively, and therefore their explanations will be omitted.

[0136] The fourth control unit 3104 is configured to control the expanding unit 3208. The fourth control unit 104 includes a CPU and a storage unit having a ROM, a RAM, etc. The fourth control unit 3104 may include, as the storage unit, an HDD or the like that retains stored information even after the voltage is cut off.

[0137] (Semiconductor chip manufacturing process) The overall operation of the semiconductor wafer processing apparatus 300 will now be described with reference to FIGS.

[0138] Steps S1 to S6, step S8, and step S11 are the same as steps S1 to S6, step S8, and step S11 in the semiconductor chip manufacturing process of the first embodiment, respectively, and therefore will not be described.

[0139] In step S307, the sheet member W2 is expanded by the expanding unit 3208. That is, the expanding ring 3281 is moved in the Z1 direction by the Z-direction moving mechanism 3282. The wafer ring structure W is moved in the Z2 direction by the Z-direction moving mechanism 214b while being held by the clamping unit 214. Then, the sheet member W2 comes into contact with the expanding ring 3281 and is expanded by being pulled by the expanding ring 3281. As a result, the wafer W1 is divided along the division line.

[0140] 22, in step S309, the heat shrink unit 211 heats and shrinks the sheet member W2, and the ultraviolet irradiation unit 212 irradiates ultraviolet light onto the sheet member W2 while the clamp unit 214 rises. At this time, the air intake unit 210c sucks in air near the heated sheet member W2. In step S310, the clamp unit 214 moves the wafer ring structure W to the squeegee unit 3213. That is, the wafer ring structure W, while held by the clamp unit 214, is moved in the Y2 direction by the Y-direction movement mechanism 214c.

[0141] In step S311, after the wafer ring structure W is moved to the squeegee portion 3213, the wafer W1 is pressed by the squeegee portion 3213. As a result, the wafer W1 is further divided by the squeegee portion 3213.

[0142] (Detailed configuration of expansion ring and expansion retention member) The detailed configuration of the expanding ring 3281 of the expanding section 3208 is the same as the detailed configuration of the expanding ring 281 of the expanding section 208 of the first embodiment, so a description thereof will be omitted. Also, the detailed configuration of the pressing ring portion 210a of the expansion-retaining member 210 is the same as the detailed configuration of the pressing ring portion 210a of the expansion-retaining member 210 of the first embodiment, so a description thereof will be omitted. Note that the other configurations of the second embodiment are the same as the configurations of the first embodiment, so a description thereof will be omitted.

[0143] (Effects of the second embodiment) In the second embodiment, the following effects can be obtained.

[0144] In the second embodiment, similarly to the first embodiment, the expand ring 3281 includes a sphere 281b rotatably arranged at a portion that contacts the sheet member W2 during expansion, and an accommodation space 281a that accommodates the sphere 281b. This allows the sheet member W2 to be smoothly expanded on the expand ring 3281 when expanding. Note that other effects of the second embodiment are similar to those of the first embodiment, and therefore description thereof will be omitted.

[0145] [Variations] The embodiments disclosed herein should be considered to be illustrative and not restrictive in all respects. The scope of the present invention is defined by the claims rather than the above description of the embodiments, and further includes all modifications (variations) within the meaning and scope of the claims.

[0146] For example, in the first and second embodiments, the expanding device 2 (302) has the ultraviolet ray irradiation unit 212, but the present invention is not limited to this. In the present invention, the expanding device does not have to have the ultraviolet ray irradiation unit.

[0147] In the second embodiment, the sheet member W2 is expanded by the expanding ring 3281 moved in the Z1 direction by the Z-direction moving mechanism 3282 coming into contact with the sheet member W2 held by the clamping unit 214 moved in the Z2 direction by the Z-direction moving mechanism 214b, but the present invention is not limited to this. In the present invention, the sheet member may be expanded by the expanding ring raised by the Z-direction moving mechanism coming into contact with the sheet member held by the clamping unit.

[0148] In the first and second embodiments, the housing space 281a is formed by the first member 281c and the second member 281d, but the present invention is not limited to this. In the present invention, the housing space may be formed within a single member.

[0149] In the first and second embodiments, the spheres 281b are made of ceramic, which has low thermal conductivity, but the present invention is not limited to this. In the present invention, the spheres may be made of resin or metal.

[0150] In the first and second embodiments, the pressing ring portion 210a (expansion maintaining ring) is configured to maintain the expanded state of the sheet member W2 near the wafer W1 by pressing the portion of the sheet member W2 that corresponds to the outer portion of the sphere 281b, but the present invention is not limited to this. In the present invention, the expansion maintaining ring may be configured to maintain the expanded state of the sheet member near the wafer by pressing the portion of the sheet member that corresponds to the inner portion of the sphere.

[0151] In the first and second embodiments, the first member 281c and the second member 281d are in contact with each other in the direction D, but the present invention is not limited to this. In the present invention, the first member and the second member may be arranged side by side with a partial gap therebetween in the radial direction. [Explanation of symbols]

[0152] 2, 302 Expanding device 210a Pressing ring part (expansion maintaining ring) 210d Lower end (of expansion retaining ring) 214 Clamp section 281, 3281 Expanding Ring 281a Containment Space 281b Sphere 281c First Component 281d Second member 281e Top 281f side 2811 (sphere) surface 2811b (Top of the sphere) Bc (center of sphere) W wafer ring structure W1 wafer W2 sheet material W21 Top W3 Ring-shaped member

Claims

1. a clamping portion configured to grip a ring-shaped member of a wafer ring structure including a wafer that can be divided along a dividing line, a stretchable sheet member to which the wafer is attached, and a ring-shaped member that is attached to the sheet member in a state where the ring-shaped member surrounds the wafer; a ring-shaped expand ring that divides the wafer along the division line by expanding the sheet member while the ring-shaped member is gripped by the clamp portion, The expand ring is A sphere rotatably arranged in a portion that contacts the sheet member during expansion; and an accommodation space that accommodates the sphere in a rotatable manner.

2. 2. The expanding device according to claim 1, wherein in a cross section along the radial direction of the expanding ring, an arc portion of the sphere is exposed from the expanding ring, spanning the top and side surfaces of the expanding ring and corresponding to a central angle of the sphere of 90 degrees or more and less than 180 degrees of the entire circumference of the sphere.

3. The expand ring is a first member disposed on the inner circumferential side; a second member disposed on the outer circumferential side, The expanding device according to claim 1 , wherein the storage space is formed by being surrounded by the first member and the second member.

4. The expanding device according to claim 1 , wherein the spheres are made of ceramic with low thermal conductivity.

5. an expansion maintaining ring disposed above the expansion ring for maintaining the expanded state of the sheet member near the wafer; The expansion device of claim 1, wherein the expansion maintaining ring is configured to maintain the expanded state of the sheet member near the wafer while pressing the sheet member outside the center of the sphere in the radial direction of the expansion maintaining ring.

6. The expansion device according to claim 5, wherein the diameter of the expansion maintaining ring is such that, in the radial direction of the expansion maintaining ring, when the expansion maintaining ring presses the sheet member at a portion of the expansion ring that is outside the center of the sphere, the lower end of the expansion maintaining ring is positioned below the upper end of the sphere, and the lower end of the expansion maintaining ring is positioned outside the center of the sphere.

7. 2. The expansion device according to claim 1, wherein the expand ring rotatably holds the sphere in the storage space so as to abut against at least two points among the upper portion of the sphere, the lower end portion of the sphere, the outer end portion of the sphere in the radial direction of the expand ring, and the inner end portion of the sphere in the radial direction of the expand ring.

8. The accommodation space has a ring shape in a plan view, The expanding device according to claim 1 , wherein a plurality of the spheres are arranged around the entire circumference of the ring-shaped accommodation space in a plan view.

9. The expansion device according to claim 1, wherein the storage space is disposed at an outer upper end of the expansion ring and stores the sphere so that a surface of the sphere is partially exposed from the expansion ring.

10. a step of irradiating a wafer having a plurality of semiconductor chips with laser light from a laser irradiation unit that irradiates the laser light, thereby forming a modified layer in the wafer; a wafer ring structure including a ring-shaped member attached to an elastic sheet member to which the wafer is attached, the ring-shaped member being held by a clamp that holds the ring-shaped member, and during expansion, dividing the wafer into the plurality of individual semiconductor chips along the modified layer by expanding the sheet member with an expanding ring having a sphere rotatably arranged in a portion that contacts the sheet member and an accommodation space that rotatably accommodates the sphere.

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