Component Mounting Equipment

Abstract

To suppress interference between already mounted components and backup pins.SOLUTION: A component mounting equipment 1 for mounting a component E on a substrate P comprises a transport unit 11 that transports the substrate P to the target stop position A, a backup pin 30 that supports the substrate P from below at the target stop position A, and a control unit 18, when the component E is already mounted on the bottom surface 55B of the substrate P, the control unit 18 changes the allowable value T of the error G of the substrate stop position relative to the target stop position A for each substrate P transported to the target stop position A or for each type of the substrate.SELECTED DRAWING: Figure 11

Description

[Technical Field]

[0001] The present disclosure relates to a component mounting apparatus. [Background technology]

[0002] A component mounting device that mounts components on a board uses backup pins to support the bottom surface of the board that has been stopped at a predetermined target stopping position, and then mounts the components on the top surface of the board. In the production of double-sided mounting boards, where components are mounted on both sides of the board, the board is flipped over after the components are mounted on the top surface, and the components are mounted on the surface that will become the top surface after the flip. Since components are already mounted on the bottom surface after the flip, the backup pins are positioned so that they do not interfere with the components on the bottom surface. Patent Document 1 listed below discloses a component mounting device that avoids interference between components on the bottom surface (already mounted components) and backup pins (support pins). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2014-078580 Summary of the Invention [Problem to be solved by the invention]

[0004] In component mounting devices, the board stop position where the board actually stops does not necessarily match the target stop position. If there is a large error in the board stop position relative to the target stop position, there is a risk of interference with already mounted components when the backup pins are raised. Therefore, to prevent interference, an error tolerance is set, and the backup pins are raised only if the board stop position is within the tolerance. If the error exceeds the tolerance, the backup pins are not raised and board positioning is retried to avoid interference.

[0005] Conventionally, a fixed value was set as the tolerance, and if the error exceeded the tolerance range, a uniform positioning retry was performed. Even if the distance between the backup pin and the already mounted component was large enough that no interference would occur, unnecessary retries would be performed depending on the size of the error, resulting in tactile loss. Furthermore, the mounting positions of already mounted components differ between different types of boards. Therefore, even if the already mounted component and the backup pin interfere when the error exceeds the tolerance range on one type of board, this does not necessarily mean that interference will occur on another type of board with the same error. In this case, unnecessary retries were performed, resulting in tactile loss.

[0006] An object of the present invention is to prevent interference between an already mounted component and a backup pin, and to reduce unnecessary retries. [Means for solving the problem]

[0007] The component mounting device disclosed in this specification is a component mounting device that mounts components on a substrate, and includes a transport unit that transports the substrate to a target stop position, a backup pin that supports the substrate from below at the target stop position, and a control unit, and when a component has already been mounted on the underside of the substrate, the control unit changes the allowable error value of the substrate stop position relative to the target stop position for each substrate transported to the target stop position or for each type of substrate. [Effects of the Invention]

[0008] The component mounting device described above can prevent interference between the components mounted on the underside of the board and the backup pins, reducing the number of retries when positioning the board at the target stopping position and reducing the reduction in takt time. [Brief explanation of the drawings]

[0009] [Figure 1] Plan view of component mounting equipment [Figure 2] Side view of component mounting device [Figure 3]Perspective view of the backup device [Figure 4] Block diagram showing the electrical configuration of the component mounting device [Figure 5] A side view showing the error from the target stop position [Figure 6] Schematic diagram to explain the occurrence of interference (1) [Figure 7] Schematic diagram to explain the occurrence of interference (2) [Figure 8] Schematic diagram (3) to explain the occurrence of interference [Figure 9] Schematic diagram for explaining first to third data [Figure 10] Plan view showing the location of the fiducial marks [Figure 11] Flowchart of the process for changing tolerances DETAILED DESCRIPTION OF THE INVENTION

[0010] An embodiment of the present invention will be described with reference to Fig. 1 to Fig. 11. In the following description, the left-right direction shown in Fig. 1 will be referred to as the X-axis direction, the front-rear direction will be referred to as the Y-axis direction, and the up-down direction shown in Fig. 2 will be referred to as the Z-axis direction. In the following description, the left side shown in Fig. 1 may be referred to as the upstream side, and the right side as the downstream side. In the following description, the reference numerals in the drawings may be omitted for identical components, with some exceptions.

[0011] 1.Component Mounting Equipment Configuration The configuration of the component mounting apparatus 1 will be described with reference to Fig. 1. The component mounting apparatus 1 is an apparatus that mounts components E, such as electronic components, on a substrate P, and includes a base 10, a transport conveyor (an example of a transport unit) 11, a backup device 12 (see Figs. 2 and 3), four tape component supply devices 13, a head unit 14, a head moving unit 15, a component imaging camera 16, a substrate imaging camera (an example of an imaging unit) 17, a control unit 18 (see Fig. 4), an operation unit 19 (see Fig. 4), and the like.

[0012] The base 10 has a rectangular shape in a plan view. In Fig. 1, the dashed line A extending in the front-to-rear direction near the right side of the center of the base 10 is the target stop position A. The transport conveyor 11 carries in the board P from the upstream side in the X-axis direction, and stops the board P at a position where the downstream end of the board P overlaps with the target stop position A, as shown in Fig. 1. After mounting components E on the board P at the target stop position A, the transport conveyor 11 carries the board P out downstream.

[0013] The transport conveyor 11 includes a pair of conveyor belts 11A and 11B that are driven to rotate in the X-axis direction, a conveyor drive motor 50 (see FIG. 4) that drives these conveyor belts, etc. The rear conveyor belt 11A is movable in the front-rear direction, and the distance between the two conveyor belts 11A and 11B can be adjusted according to the width of the substrate P.

[0014] The board guide rails 25 have a board guide rail 25A located on the rear side of the conveyor belt 11A and a board guide rail 25B located on the front side of the conveyor belt 11B. The rear board guide rail 25A is movable in the front-to-rear direction together with the conveyor belt 11A. The distance between the board guide rails 25A and 25B is set to be larger than the size of the board P in the front-to-rear direction by a predetermined transport clearance C (see FIG. 6(a)). The board P transported by the transport conveyor 11 is positioned between the board guide rails 25A and 25B, and the displacement of the board P in the front-to-rear direction is restricted to within the range of the transport clearance C.

[0015] The backup device 12 (see FIGS. 2 and 3) is disposed below the target stop position A. The configuration of the backup device 12 will be described later.

[0016] The tape component supply devices 13 are arranged in four locations, two on each side in the X-axis direction on either side of the transport conveyor 11 in the Y-axis direction. A plurality of feeders 20 are attached to these tape component supply devices 13 and aligned horizontally in the X-axis direction. Each feeder 20 is a so-called tape feeder, and includes a reel around which a component tape containing a plurality of components E is wound, and an electric tape feeding device that unwinds the component tape from the reel, and supplies components E one by one from a component supply position located at the end of the transport conveyor 11 side.

[0017] In this embodiment, the tape component supply device 13 is used as an example of the component supply device, but the component supply device may be a so-called tray feeder that supplies trays on which components E are placed, or may be a device that supplies semiconductor wafers.

[0018] The head unit 14 is provided with a plurality of (here, five) mounting heads 21. The configuration of the head unit 14 will be described later.

[0019] Head moving section 15 moves head unit 14 in the X-axis direction and the Y-axis direction within a predetermined movable range. Head moving section 15 includes a beam 22 that supports head unit 14 so that it can move back and forth in the X-axis direction, a pair of Y-axis guide rails 23 that support beam 22 so that it can move back and forth in the Y-axis direction, an X-axis servo motor 46 that moves head unit 14 back and forth in the X-axis direction, and a Y-axis servo motor 47 that moves beam 22 back and forth in the Y-axis direction.

[0020] The two component imaging cameras 16 are provided between the two tape component supply devices 13 aligned in the X-axis direction. The component imaging cameras 16 are used to capture images of the components E picked up by the mounting head 21 from below, in order to recognize the rotation angle of the components E relative to the mounting head 21, the component shape, etc.

[0021] The board imaging camera 17 is attached to the head unit 14. The board imaging camera 17 is movable integrally with the head unit 14 within a horizontal plane.

[0022] The board imaging camera 17 captures an image of the fiducial marks (an example of a "mark") F of the board P from above. The fiducial marks F are formed on the top surface 55A of the board P, one at each of the four corners.

[0023] The image of the fiducial mark F is transmitted from the board imaging camera 17 to the image processing unit 43. Based on the transmitted image, the image processing unit 43 recognizes the stopped state of the board P. The stopped state of the board P will be described later.

[0024] 1.1 Head unit The configuration of the head unit 14 will be described with reference to Fig. 2. The head unit 14 is a so-called in-line type, with multiple mounting heads 21 arranged side by side in the X-axis direction. The head unit 14 is provided with a Z-axis servo motor 48 (see Fig. 4) that raises and lowers these mounting heads 21 individually, an R-axis servo motor 49 (see Fig. 4) that rotates these mounting heads 21 all at once around their axes, and the like.

[0025] Each mounting head 21 is used to pick up and release components E, and has a nozzle shaft 21A and a suction nozzle 21B that is detachably attached to the lower end of the nozzle shaft 21A. Negative and positive pressures are supplied to the suction nozzle 21B from an air supply device (not shown) via the nozzle shaft 21A. The suction nozzle 21B picks up components E when negative pressure is supplied, and releases the components E when positive pressure is supplied.

[0026] Moreover, in this embodiment, the head unit 14 has a laser sensor 24 that detects the position of the substrate P in the transport direction. The laser sensor 24 is movable within a horizontal plane together with the head unit 14. The laser sensor 24 is an optical sensor that detects the position of the substrate P using laser light. Specifically, the laser sensor 24 is configured to be able to irradiate laser light downward and to be able to detect laser light that is irradiated from the laser sensor 24 and reflected by a detection target. The laser sensor 24 can detect the position of the transported substrate P by an operation that will be described later. Furthermore, the laser sensor 24 can measure the warpage of the substrate P by calculating the distance to the substrate P based on the time difference and phase difference between the irradiated laser light and the reflected laser light.

[0027] The transport conveyor 11 operates to stop the substrate P at the target stop position A, but it does not necessarily stop exactly at the target stop position A. As shown in Figure 5, the actual substrate stop position is a position that is shifted in the transport direction from the target stop position A by an error G. Furthermore, the magnitude of the error G is not constant, but changes each time the substrate P is stopped at the target stop position A.

[0028] The laser sensor 24 irradiates laser light at two positions: one positioned a tolerance value T in the transport direction around the target stop position A, and the other positioned a tolerance value T back in the opposite direction to the transport direction. As shown in FIG. 5, if reflected light is detected at only one of the two positions, it can be determined that the substrate P is positioned within the tolerance value T. The tolerance value T is the magnitude (tolerance) of the allowable error G.

[0029] If reflected light is detected at both of the two locations, or if reflected light is not detected at both locations, the downstream end of substrate P is not within the range of tolerance T. In other words, in this case, it is clear that error G is greater than tolerance T, and the substrate stop position of substrate P is outside the range of tolerance T. In this way, laser sensor 24 detects whether or not the substrate stop position of substrate P is within the range of tolerance T. Laser sensor 24 is an example of a position detection unit.

[0030] Although the in-line type head unit 14 has been described as an example here, the head unit 14 may also be, for example, a so-called rotary head in which a plurality of mounting heads 21 are arranged on the circumference.

[0031] 1.2 Backup Device The backup device 12 will be described with reference to Figures 2 and 3. The backup device 12 shown below is an example, and the configuration of the backup device 12 is not limited to the configuration shown below.

[0032] As shown in FIG. 3, the backup device 12 includes an upper plate 31, a lower plate 32 disposed below the upper plate 31, four support posts 33, a plurality of backup pins 30, and a lifting mechanism 34 (see FIG. 2) for raising and lowering the lower plate 32.

[0033] The upper plate 31 is a flat metal member with a matrix of pin insertion holes 31A that penetrate through the plate in the thickness direction. The lower plate 32 is a flat metal member that is connected to the upper plate 31 via supports 33 that rise from the four corners.

[0034] 2, the lifting mechanism 34 includes a plurality of ball screws 34A extending downward from the lower plate 32, ball nuts 34B threadedly engaged with each ball screw 34A, a lifting motor 34C, and a belt 34D wound around the ball nuts 34B and the lifting motor 34C. When the lifting motor 34C is rotated, the ball nuts 34B rotate via the belt 34D, and the ball screws 34A move up and down. This causes the backup device 12 to move up and down.

[0035] 2 shows a state in which substrate P is supported from below by backup pins 30. Before substrate P is carried into target stop position A, backup pins 30 are lowered to a position where their upper ends are lower than substrate P. When substrate P is carried into target stop position A, backup pins 30 rise and substrate P is lifted up. As a result, substrate P is supported from below by backup pins 30.

[0036] 2. Electrical configuration of component mounting equipment 4, the component mounting apparatus 1 includes a control unit 18 and an operation unit 19. The control unit 18 includes an arithmetic processing unit 40, a motor control unit 41, a memory unit 42, an image processing unit 43, an external input / output unit 44, a feeder communication unit 45, and the like.

[0037] The arithmetic processing unit 40 includes a CPU, a ROM, a RAM, etc., and executes a control program stored in the ROM to control each unit of the component mounting apparatus 1. Under the control of the arithmetic processing unit 40, the motor control unit 41 controls the operation, stopping, and rotation speed of each motor, such as the X-axis servo motor 46, the Y-axis servo motor 47, the Z-axis servo motor 48, the R-axis servo motor 49, and the conveyor drive motor 50.

[0038] The storage unit 42 is a rewritable storage device (such as a hard disk) that retains data even when the power is turned off. The storage unit 42 stores various programs and various data such as first data and second data, which will be described later.

[0039] The image processing unit 43 is configured to take in image signals output from the component imaging camera 16 and the board imaging camera 17, and generates a digital image based on the output image signals.

[0040] The external input / output unit 44 is a so-called interface, and is configured to take in detection signals output from various sensors 51 provided in the main body of the component mounting apparatus 1. The external input / output unit 44 is also configured to control the operation of various actuators 52 (including an air supply device and a backup device 12, not shown) based on control signals output from the arithmetic processing unit 40.

[0041] Feeder communication unit 45 is connected to feeder 20 and controls feeder 20 in an integrated manner. Operation unit 19 has a display unit such as a liquid crystal display and an input unit consisting of a touch panel, keyboard, mouse, etc. An operator can operate operation unit 19 to make various settings for component mounting apparatus 1 and give instructions for operation, etc.

[0042] 3. Interference between already mounted components and backup pins The board P is first carried into the component mounting device with the leading surface, which is the surface on which components are to be mounted first, facing up, and components E are mounted only on the leading surface. The board P is then turned upside down so that the leading surface faces down, and the board P is carried into the component mounting device again with the trailing surface, which is the surface on which components are to be mounted after the leading surface, facing up, and components E are mounted on the trailing surface. When components E are to be mounted on the trailing surface (upper surface 55A), components E that have already been mounted on the leading surface (lower surface 55B) are referred to as already-mounted components E1. Interference between already-mounted components E1 and backup pins 30 will be described with reference to FIGS. 6 to 8.

[0043] 6(a) shows the designed positional relationship between the already-mounted component E1 and the backup pin 30 when the position of the board P coincides with the target stop position A. When the board P is at the target stop position A, the already-mounted component E1 and the backup pin 30 are aligned with a gap in the X-axis direction. The board P also abuts against the front board guide rail 25B. In this positional relationship, even if the backup pin 30 is raised, the backup pin 30 does not interfere with the already-mounted component E1.

[0044] 6(b) shows the positional relationship between the already-mounted component E1 and the backup pin 30 when the board P stops at a position shifted downstream from the target stop position A. The position of the backup pin 30 remains unchanged, but the already-mounted component E1 has been displaced downstream. In this positional relationship, if the backup pin 30 is raised, it will interfere with the already-mounted component E1.

[0045] 7 shows an example in which the backup pins 30 are arranged in the Y-axis direction when viewed from the already mounted component E1. FIG. 7(a) shows the designed positional relationship in which the position of the board P coincides with the target stop position A. In the state of FIG. 7(a), the already mounted component E1 and the backup pins 30 are aligned with a gap in the Y-axis direction. In this positional relationship, even if the backup pins 30 are raised, they do not interfere with the already mounted component E1.

[0046] 7(b) shows a state in which, compared to the state in Fig. 7(a), board P has been displaced rearward in parallel by transport clearance C, and the rear edge of board P has come into contact with and stopped in a state along rear board guide rail 25A. Backup pin 30 and already-mounted component E1 overlap in a plan view, and if backup pin 30 is raised in this state, it will interfere with already-mounted component E1.

[0047] 7(c) shows a state in which, compared to the state in Fig. 7(a), board P has rotated clockwise between board guide rails 25A and 25B. The apex located on the front downstream side of board P abuts against front board guide rail 25B, and the apex located on the rear upstream side of board P abuts against rear board guide rail 25A. In the state in Fig. 7(c), backup pin 30 and already-mounted component E1 overlap in a plan view, and if backup pin 30 is raised in this positional relationship, it will interfere with already-mounted component E1.

[0048] The position of the backup pin 30 shown in Figure 8 is different from that shown in Figures 6 and 7. Figure 8(a) shows the designed positional relationship when the board P is aligned with the target stop position A. In this positional relationship, the already-mounted component E1 and the backup pin 30 are aligned diagonally with a gap between them. Even if the backup pin 30 is raised in this state, it will not interfere with the already-mounted component E1. Furthermore, even if the board P is displaced from this state only in the X-axis direction or only in the Y-axis direction, no interference will occur.

[0049] 8(b) shows a state in which the substrate P has been displaced in both the X-axis direction and the Y-axis direction, as compared with the state in Fig. 8(a). In this state, the backup pin 30 and the already-mounted component E1 overlap in a plan view, and raising the backup pin 30 will cause interference with the already-mounted component E1.

[0050] Fig. 8(c) shows the state when the board P is shifted in the X-axis direction from the state shown in Fig. 8(a) and further rotated clockwise. In this state, the backup pin 30 and the already mounted component E1 overlap in a plan view, and if the backup pin 30 is raised, it will interfere with the already mounted component E1.

[0051] As explained above, although the already mounted component E1 and the backup pin 30 do not interfere with each other when the substrate P is stopped at the target stop position A, there is a risk of interference if the substrate P stops at a position shifted from the target stop position A.

[0052] 4. Distance between already mounted components and backup pins The various data stored in the memory unit 42 include the types of boards P scheduled for production, the order in which each type will be produced, and data for each type (number of boards to be produced, the design shape and size of the board P, the design type, shape and size of the component E to be mounted, the order in which the component E will be mounted, the mounting coordinates of the component E, the mounting angle, the pin diameter of the backup pin 30, the erection position data, etc.).

[0053] From the various data stored in the storage unit 42, the coordinates of the mounting point of the already mounted component E1 that has already been mounted on the preceding surface (lower surface 55B) can be determined when mounting the component E on the succeeding surface of the board P. The mounting point of the already mounted component E1 is expressed by the coordinates of the already mounted component E1 with the reference point of the board P as the origin.

[0054] The first data is a combination of data on the coordinates of the already-mounted component E1 and data on the shape and size of the already-mounted component E1 (see FIG. 9(a)). The first data is created in advance before the production of the board P. The first data is data that indicates the area occupied by the already-mounted component E1 on the lower surface 55B of the board P.

[0055] The various data stored in the storage unit 42 includes data on the erected positions of the backup pins 30. The erected positions of the backup pins 30 are expressed in coordinates with respect to a board origin set on the board P.

[0056] The second data is a combination of the coordinates of the backup pins 30 and data on the pin diameter (see FIG. 9(b)). The second data is created in advance before the production of the substrate P. The second data represents the area where each backup pin 30 abuts against the lower surface 55B of the substrate P when the backup device 12 supports the lower surface 55B of the substrate P from below. The rectangle Q indicated by the dashed line in FIGS. 9(b) to (d) is the ideal substrate position Q. The ideal substrate position Q is the position of the substrate P when it stops at an ideal position where the downstream end of the substrate P overlaps with the target stop position A.

[0057] The third data is data relating to the stopped state of the substrate P (see FIG. 9(c) and FIG. 10). The stopped state is the state of the substrate P when it is transported to the target stopping position A and stops at the substrate stopping position, and includes displacement, rotation, and expansion / contraction within the horizontal plane of the substrate P. The third data relating to the stopped state can be detected, for example, from the coordinates of the fiducial mark F recognized by the substrate imaging camera 17.

[0058] 10 shows an example of substrate P stopped at a substrate stop position. Substrate P has four fiducial marks F1 to F4. From the coordinates of each of fiducial marks F1 to F4, it is possible to detect how much substrate P has been displaced from ideal substrate position Q in the horizontal plane. The displacement of substrate P is detected as coordinate data with an arbitrary point on base 10 as the reference point.

[0059] Furthermore, for example, the rotation of the substrate P can be detected by determining the angle θ between the line connecting the fiducial marks F3 and F4 and the X axis. The angle θ may also be determined from the angle between the line connecting the fiducial marks F1 and F4 and the Y axis.

[0060] Furthermore, if the coordinates of two or more of the fiducial marks F1 to F4 are known, the expansion or contraction of the substrate P can be detected by comparing the distance between the fiducial marks F with the design value.

[0061] An example of the third data (displacement, rotation, and expansion / contraction in a horizontal plane) of the substrate P described above is shown in Fig. 9(c). The rectangle indicated by the dashed line is the target stop position A. Fig. 9(c) shows a state in which the substrate P and the fiducial mark F formed on the substrate P are displaced and rotated relative to the target stop position A. From the third data regarding the stop state, it is possible to determine whether or not there has been any displacement, rotation, or expansion / contraction of the substrate P in a horizontal plane, and the magnitude of such displacement, rotation, or expansion / contraction.

[0062] FIG. 9(d) is a diagram in which the substrate P and already-mounted components E1 shown in the first data (FIG. 9(a)) are rotated, etc., to match the stopped substrate P shown in the third data (FIG. 9(c)), and further superimposed on the backup pins 30 shown in the second data (FIG. 9(b)). While the position of the backup pins 30 relative to the base 10 remains unchanged, the position of the already-mounted components E1 changes depending on the stopped state of the substrate P. The distance D in the transport direction between the backup pins 30 and the already-mounted components E1 dynamically changes every time the stopped state changes, i.e., every time the substrate P is stopped at the target stopping position A, even if the type of substrate P being produced is the same.

[0063] By taking into consideration not only the first and second design data but also the third data relating to the actual stopping state of the substrate P transported to the target stopping position A, the positional relationship between the backup pin 30 and the already mounted component E1 can be accurately grasped.

[0064] The control unit 18 refers to the positional relationship between the backup pins 30 and the already-mounted components E1 (FIG. 9(d)) created based on the first to third data, and calculates, for each already-mounted component E1, the distance D from the already-mounted component E1 to the backup pin 30 that is closest in the transport direction. In FIG. 9(d), the distances D calculated for each already-mounted component E1 are denoted as D1, D2, and D3, respectively.

[0065] The smallest distance among the distances D calculated for all already-mounted components E1 is set as the minimum distance Dmin on the board P. In the example of Fig. 9(d), the distance D2 is the minimum distance Dmin.

[0066] As described above, based on the first data, second data, and third data, the control unit 18 calculates the minimum distance Dmin between the already-mounted component E1 and the backup pin 30. Each time the control unit 18 transports the board P and stops it at the target stop position A, it calculates the minimum distance Dmin on the board P.

[0067] 5. Dynamically change the tolerance T for each board As described above, the board stop position where the board P actually stops may be a position that is shifted in the transport direction by an error G from the target stop position A (see FIG. 5). If the magnitude of the error G is greater than the minimum distance Dmin, the backup pin 30 may interfere with the already mounted component E1. If the backup pin 30 interferes with the already mounted component E1 on the preceding surface, the already mounted component E1 may be damaged, or the backed-up board P may bend, resulting in a failure of mounting on the following surface.

[0068] On the other hand, if the error G is smaller than the minimum distance Dmin, there is no risk of interference with the already-mounted component E1 even if the backup pin 30 is raised. Therefore, the allowable value T of the error G is dynamically changed for each board P based on the value of the minimum distance Dmin calculated for each board P. Specifically, the allowable value T is changed to the value of the calculated minimum distance Dmin. Then, the backup pin 30 is raised only when it is confirmed using the laser sensor 24 that the error G of the board P is smaller than the allowable value T (minimum distance Dmin). As a result, the backup pin 30 is raised only when it does not interfere with the already-mounted component E1, thereby suppressing interference between the already-mounted component E1 and the backup pin 30.

[0069] 6. Flowchart explanation Next, a change in tolerance T by component mounting apparatus 1 will be described with reference to the flowchart of Fig. 11. Fig. 11 is a flowchart applied when attempting to mount component E on upper surface 55A of substrate P on which component E has already been mounted on lower surface 55B.

[0070] When the operator operates operation unit 19 to start the production program, control unit 18 operates transport conveyor 11 to carry board P into component mounting apparatus 1. Transport conveyor 11 transports board P and positions and stops it at target stop position A (S10). At this time, the board stop position where board P actually stops is shifted in the transport direction from target stop position A by an error G (see FIG. 5).

[0071] Next, the control unit 18 causes the board imaging camera 17 to capture and recognize the fiducial mark F (S20). Based on the captured image, the control unit 18 calculates third data relating to the stationary state (displacement, rotation, expansion / contraction) of the board P (S30).

[0072] Next, the control unit 18 calculates the positional relationship between the already-mounted component E1 and the backup pin 30 based on the first data, the second data stored in the storage unit 42, and the calculated third data (S40). Next, the control unit 18 calculates the distance D in the transport direction between the already-mounted component E1 and the backup pin 30, and the minimum distance Dmin, which is the minimum value of the distance D (S50).

[0073] Next, the control unit 18 changes the tolerance T based on the minimum distance Dmin, and stores the changed tolerance T in the storage unit 42 (S60). In this embodiment, the value of the tolerance T is changed to the value of the minimum distance Dmin.

[0074] Next, the control unit 18 operates the laser sensor 24 to detect whether the board stop position is within a range of the tolerance value T centered on the target stop position A (S70). If the board stop position is within the range of the tolerance value T (S70: YES), the control unit 18 raises the backup pins 30 to support the board P from below (S50). Thereafter, the component E is mounted on the following surface (upper surface 55A) of the board P.

[0075] On the other hand, if the substrate stop position is outside the range of the tolerance value T (S70: NO), the control unit 18 determines whether the number of positioning retries n for the substrate P in production has reached a predetermined upper limit (S90). The number of retries n starts from 0 when a new substrate P is carried in, and is counted up by 1 each time a positioning retry for the substrate P is performed.

[0076] If the number of retries has not reached the upper limit (S90: NO), the transfer conveyor 11 moves the board P and retries positioning (S100). At the same time as the positioning retry, the number of retries is counted up and the process returns to S20.

[0077] If the number of retries has reached the upper limit (S90: YES), the control unit 18 stops the component mounting apparatus 1 due to an error (S110). After the error stop, the control unit 18 notifies the operator of the error stop and waits until the operator cancels the stop.

[0078] 7.Effects The minimum distance Dmin, which is the minimum value of the distance D between the already mounted component E1 and the backup pin 30, changes depending on the stopped state (displacement, rotation, extension / contraction) of the board P. If the tolerance T is a fixed value, even if the error G of the board stopped position exceeds the range of the tolerance T, the backup pin 30 may not interfere with the already mounted component E1 depending on the stopped state of the board P. However, if the error G exceeds the range of the tolerance T, positioning retries are performed regardless of whether interference occurs, resulting in tactile loss.

[0079] In the configuration of this embodiment, the tolerance T for error G is dynamically changed for each substrate P transported to target stop position A, and the presence or absence of interference is determined using the tolerance T appropriate for the transported substrate P. As a result, if it is determined that interference will occur, a retry is performed, making it possible to suppress the interference. Furthermore, if it is determined that no interference will occur using the tolerance T appropriate for the transported substrate P, unnecessary retries can be reduced, eliminating tactile loss.

[0080] Furthermore, in the configuration of this embodiment, the allowable value T of the error G is changed based on first data related to the already-mounted component E1, second data related to the backup pins 30, and third data related to the stopped state of the board P transported to the target stop position A. Because the allowable value T can be changed based on the positional relationship calculated taking into account the actual stopped state, interference can be suppressed and unnecessary retries can be suppressed.

[0081] Furthermore, in the configuration of this embodiment, the board imaging camera 17 captures an image of the fiducial mark F on the board P to recognize the stationary state (displacement, rotation, expansion / contraction) of the board P. By recognizing the stationary state of the board P, the control unit 18 can more accurately estimate the positional relationship between the already-mounted component E1 and the backup pin 30. This makes it possible to suppress interference and unnecessary retries.

[0082] Furthermore, the component mounting apparatus 1 of this embodiment uses the laser sensor 24 to determine whether the error G of the board stop position is within the range of the tolerance T. If the error G is within the range of the tolerance T, the backup pin 30 is raised. If the error G exceeds the range of the tolerance T, the backup pin 30 is not raised and a positioning retry is performed. In this way, a retry is performed only when the error G exceeds the range of the tolerance T and there is a high possibility of interference, so interference is suppressed and unnecessary retries are reduced, preventing a decrease in takt time.

[0083] <Other embodiments> (1) In the above embodiment, the value of the tolerance T is changed to the minimum distance Dmin, but the changed tolerance T does not have to match the minimum distance Dmin. For example, the tolerance T may be changed to a value obtained by multiplying the minimum distance Dmin by a predetermined coefficient, or may be changed to a value obtained by adding or subtracting a predetermined margin from the minimum distance Dmin.

[0084] (2) In the above embodiment, data on the design position and shape of the already-mounted component E1 is used as the first data, but the first data may not be design data but may be measurement data based on actual results. For example, after mounting the component E on the preceding surface, information on the position and shape of the already-mounted component E1 may be obtained using an inspection machine, and this information may be used as the first data when mounting the component E on the succeeding surface.

[0085] (3) In the above embodiment, the third data regarding the stopped state of the substrate P was acquired based on the measurement coordinates of the fiducial mark F, but the third data may also be acquired without using the fiducial mark F. For example, the third data may be acquired by detecting the position of the outer edge of the substrate P using the laser sensor 24, or the third data may be acquired by detecting marks or patterns (wiring, lands, through-holes, etc.) on the substrate P other than the fiducial mark F with a camera.

[0086] (4) In the above embodiment, the third data is data relating to the stopped state of the substrate P, and includes three parameters: displacement, rotation, and expansion / contraction of the substrate P. The third data does not need to include all three of these parameters; it is sufficient if it includes at least one of the three.

[0087] (5) Although the example has been given in which four fiducial marks F are formed on the substrate P, the number of fiducial marks F may be two to three, or five or more.

[0088] (6) In the above embodiment, the fiducial mark F is recognized for each substrate P and the tolerance T for the error G is changed. The tolerance T for the error G may also be changed for each type of substrate P without recognizing the fiducial mark F.

[0089] For example, before production begins, an operator inputs the type of substrate P, or the control unit 18 acquires type information for the substrate P by having the substrate recognition camera 17 read the substrate ID printed on the surface of the substrate P. By applying a tolerance T for the error G that is set in advance so as to correspond one-to-one with the type to substrates P of the same type, the tolerance T for the error G can be changed for each type of substrate P. [Explanation of symbols]

[0090] 1: Component mounting equipment 11: Transport unit 18: Control unit 30: Backup pin 55B: Bottom surface P: Substrate E: Parts E1: Already mounted parts A: Target stopping position G:Error T: Tolerance

Claims

1. A component mounting apparatus that mounts components on a substrate, a transport unit that transports the substrate to a target stop position; a backup pin that supports the substrate from below at the target stop position; a control unit, When a component is already mounted on the underside of the substrate, the control unit A component mounting device that changes a tolerance for an error of a board stop position relative to the target stop position for each board transported to the target stop position or for each type of board.

2. 2. The component mounting apparatus according to claim 1, the control unit calculates an allowable error value of the substrate stop position relative to the target stop position based on the first to third data; the first data is data relating to components already mounted on the underside of the board, the second data is data relating to the backup pin, The component mounting device, wherein the third data is data relating to a stopping state of the board transported to the target stopping position.

3. 3. The component mounting apparatus according to claim 2, the first data is data indicating an area occupied by already-mounted components on the underside of the board, The second data is data indicating an area where the backup pin contacts the underside of the board.

4. 4. The component mounting apparatus according to claim 3, an imaging unit that images a mark provided on the substrate; the control unit recognizes a displacement of the board relative to the component mounting device based on the position of the mark captured by the imaging unit; The component mounting device, wherein the third data is data relating to a displacement of the board relative to the component mounting device.

5. 4. The component mounting apparatus according to claim 3, an imaging unit that images a mark provided on the substrate; the control unit recognizes the displacement and rotation of the board relative to the component mounting device based on the position of the mark captured by the imaging unit; The component mounting device, wherein the third data is data relating to displacement and rotation of the board relative to the component mounting device.

6. 4. The component mounting apparatus according to claim 3, an imaging unit that images a mark provided on the substrate; the control unit recognizes displacement and expansion / contraction of the board relative to the component mounting device based on the position of the mark imaged by the imaging unit, The third data is data relating to displacement and expansion / contraction of the board relative to the component mounting device.

7. 4. The component mounting apparatus according to claim 3, an imaging unit that images a mark provided on the substrate; the control unit recognizes displacement, rotation, and expansion / contraction of the board relative to the component mounting device based on the position of the mark captured by the imaging unit; The third data is data relating to displacement, rotation, and expansion / contraction of the board relative to the component mounting device.

8. The component mounting device according to any one of claims 1 to 7, a position detection unit for detecting a substrate stop position; The control unit determines whether an error in the board stop position relative to the target stop position is within the allowable range.

Images