Cutting device

Abstract

To provide a cutting device that is able to suppress even slight static electricity generated by vacuum leakage.SOLUTION: A cutting device 1 comprises: a cutting unit 20 that attaches a cutting blade 21 to a spindle 23 and cuts a workpiece; a chuck table 10 in which a holding surface 11 is sectioned into a plurality of areas by relief grooves of the cutting blade 21 and suction holes for sucking and holding a to-be-processed object are open in the areas of the holding surface 11; and a moving unit 40 that relatively moves the cutting unit 20 and the chuck table 10; wherein the cutting device further comprises a static electricity suppression unit 50 that suppresses static electricity generated by a vacuum leak between the holding surface 11 of the chuck table 10 and the workpiece.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a cutting device. [Background technology]

[0002] Dicers, which use cutting blades, are used to divide various electronic components such as resin package substrates, glass substrates, and ceramic substrates. For dividing semiconductor wafers, the wafer is often fixed to an annular frame with adhesive tape, creating a frame unit that allows for easy transportation after division into individual chips. However, for resin package substrates, which have a relatively low unit price, a so-called jig dicer is often used, which does not use adhesive tape to divide the substrate by fixing it directly to a chuck table, in order to reduce the cost of adhesive tape and frames (see, for example, Patent Document 1).

[0003] The jig dicer disclosed in Patent Document 1 fixes the workpiece directly to the chuck table, so vacuum leaks occur in the small gap between the workpiece and the holding surface of the chuck table. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 6173173 Summary of the Invention [Problem to be solved by the invention]

[0005] As devices become more precise and denser than ever before, measures to prevent electrostatic breakdown of devices have become stricter, and there is a demand to suppress even the slightest static electricity generated by vacuum leaks.

[0006] An object of the present invention is to provide a cutting device that can suppress even slight static electricity generated by vacuum leaks. [Means for solving the problem]

[0007] In order to solve the above-mentioned problems and achieve the object, the cutting device of the present invention is a cutting device comprising: a cutting unit having a cutting blade attached to a spindle for cutting a package substrate having a chip embedded in a mold resin; a chuck table having a holding surface divided into a plurality of regions by relief grooves in the cutting blade, and having suction holes opening in the regions of the holding surface for suction-holding the package substrate; and a moving unit for relatively moving the cutting unit and the chuck table, and further comprising an electrostatic suppression section for suppressing static electricity generated from vacuum leakage in a gap between the holding surface of the chuck table and the package substrate, the chuck table being configured by a metal main body with a resin layer laid thereon to form the holding surface, and the electrostatic suppression section Located opposite the holding surface, The water supply unit electrically connects the main body and the resin layer with water having a lower specific resistance than the supplied pure water, and the cutting blade is caused to cut into the package substrate until it enters the relief groove, thereby dividing the package substrate into package device chips.

[0009] The present invention cutting equipment is a cutting device comprising: a cutting unit having a cutting blade attached to a spindle for cutting a package substrate having a chip embedded in a molding resin; a chuck table having a holding surface divided into a plurality of regions by relief grooves in the cutting blade, and having suction holes for suction-holding the package substrate in the regions of the holding surface; and a moving unit for relatively moving the cutting unit and the chuck table, the cutting device further comprising an electrostatic suppression unit for suppressing static electricity generated from vacuum leakage in a gap between the holding surface of the chuck table and the package substrate, The chuck table has a metal body. Nigi A layer of fat is laid The resin layer has the relief groove and the suction hole formed therein, and the surface of the resin layer serves as a holding surface for holding the package substrate; The electrostatic suppression section is made of the conductive resin layer. The resin layer is fixed to the metal body with a conductive adhesive, and the cutting blade is caused to cut into the package substrate until it enters the relief groove, thereby dividing the package substrate into package device chips.

[0011] In the cutting device, the chuck table includes a first chuck table and a second chuck table, and the transport unit is configured to suction-hold the workpiece with one of the chuck tables. Package substrate While machining, the other chuck table is Package substrate before processing. Package substrate The Package substrate The substrate may be held by suction and wait before processing. [Effects of the Invention]

[0012] The present invention has the effect of being able to suppress even slight static electricity generated by vacuum leaks. [Brief explanation of the drawings]

[0013] [Figure 1] FIG. 1 is a perspective view showing an example of the configuration of a cutting device according to the first embodiment. [Figure 2] FIG. 2 is a perspective view showing an example of a workpiece to be machined by the cutting device shown in FIG. [Figure 3] FIG. 3 is a perspective view of the workpiece shown in FIG. 2 as seen from the back side. [Figure 4] 4 is a perspective view of a chuck table of the cutting machine shown in FIG. 1. FIG. [Figure 5] FIG. 5 is a cross-sectional view of a main part of the chuck table shown in FIG. [Figure 6] FIG. 6 is a front view schematically showing a state in which a workpiece held by suction on a first chuck table of the cutting device shown in FIG. 1 is being cut. [Figure 7] FIG. 7 is a front view schematically showing a state in which a workpiece is being loaded onto the second chuck table of the cutting device shown in FIG. [Figure 8] FIG. 8 is a side view schematically showing a state in which a workpiece held by suction on the first chuck table of the cutting device shown in FIG. 1 is being cut. [Figure 9] FIG. 9 is a side view schematically showing the second chuck table that holds the workpiece by suction of the cutting device shown in FIG. [Figure 10] FIG. 10 is a cross-sectional view of a main part of a chuck table of a cutting device according to the second embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0014] Modes (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. Furthermore, the components described below include those that can be easily imagined by a person skilled in the art and those that are substantially the same. Furthermore, the configurations described below can be combined as appropriate. Furthermore, various omissions, substitutions, or modifications of the configuration can be made within the scope of the gist of the present invention.

[0015] [Embodiment 1] A cutting device according to a first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing an example of the configuration of the cutting device according to the first embodiment. FIG. 2 is a perspective view showing an example of a workpiece to be machined by the cutting device shown in FIG. 1. FIG. 3 is a perspective view of the workpiece shown in FIG. 2, viewed from the back side. FIG. 4 is a perspective view of a chuck table of the cutting device shown in FIG. 1. FIG. 5 is a cross-sectional view of a main part of the chuck table shown in FIG. 4.

[0016] The cutting device 1 shown in Fig. 1 according to the first embodiment is a processing device that cuts a workpiece 200 shown in Fig. 2 and Fig. 3. In the first embodiment, the workpiece 200 to be processed by the cutting device 1 is formed in a rectangular flat plate shape in plan view, as shown in Fig. 2 and Fig. 3. The workpiece 200 includes a substrate 201 made of metal, and a plurality of planned dividing lines 203 are formed in a grid pattern on a surface 202 of the substrate 201.

[0017] The workpiece 200 has a plurality of regions defined by a plurality of planned division lines 203, and a chip (not shown) is disposed on the rear surface 204 of the substrate 201 in each of these regions. The chip is covered with a molding resin 205 laminated on the rear surface 204 of the substrate 201. In the first embodiment, the workpiece 200 is a so-called resin package substrate in which the chip is embedded in the molding resin 205.

[0018] 1 along planned division lines 203, and is divided into individual package device chips 206. In the first embodiment, the workpiece 200 is a resin package substrate, but the present invention is not limited to a resin package substrate and may be a glass substrate, a ceramic substrate, or the like.

[0019] 1 is a processing device that holds a workpiece 200 on a chuck table 10 and cuts the workpiece 200 along a plurality of planned division lines 203. In the first embodiment, the cutting device 1 is a processing device (a so-called jig dicer) that holds the workpiece 200, to which no dicing tape is attached, directly on the chuck table 10 and performs a so-called full cut on the workpiece 200 to divide it into package device chips 206.

[0020] 1, the cutting device 1 includes a chuck table 10 that holds a workpiece 200 by suction on a holding surface 11, a cutting unit 20 that cuts a planned division line 203 with a cutting blade 21 while supplying cutting water to the workpiece 200 held by suction on the chuck table 10, thereby dividing the workpiece 200 into a plurality of package device chips 206, an imaging unit 30, and a control unit 100. As shown in FIG. 1, the cutting device 1 includes two cutting units 20, i.e., a two-spindle dicer, a so-called facing dual type cutting device.

[0021] 1, the cutting device 1 is equipped with a first chuck table 10-1 and a second chuck table 10-2 as chuck tables 10. In the following, this specification will refer to these as the first chuck table 10-1 and the second chuck table 10-2 when they need to be distinguished, and will simply refer to them as the chuck table 10 when they do not need to be distinguished. The configuration of the first chuck table 10-1 and the configuration of the second chuck table 10-2 are the same.

[0022] The cutting device 1 also includes a moving unit 40 that moves the cutting unit 20 and the chuck table 10 relative to each other. The moving unit 40 includes an X-axis moving unit 41, which is a processing feed unit that moves the chuck table 10 in the X-axis direction parallel to the horizontal direction, a Y-axis moving unit 42, which is an indexing feed unit that moves the cutting unit 20 in the Y-axis direction, which is an indexing feed direction parallel to the horizontal direction and perpendicular to the X-axis direction, a Z-axis moving unit 43 that moves the cutting unit 20 in the Z-axis direction, which is a cutting feed direction parallel to the vertical direction and perpendicular to the X-axis and Y-axis directions, and a rotational moving unit 44 that rotates the chuck table 10 around an axis parallel to the Z-axis direction. That is, the moving unit 40 moves the chuck table 10 and the cutting unit 20 relatively in the X-axis, Y-axis, and Z-axis directions.

[0023] The X-axis moving unit 41 moves the chuck table 10 in the X-axis direction, which is the processing feed direction, together with the rotational moving unit 44, thereby moving the chuck table 10 in the X-axis direction relative to the cutting unit 20. The X-axis moving unit 41 moves the chuck table 10 along the X-axis direction between a processing area where the cutting unit 20 cuts the workpiece 200 held on the chuck table 10, and a carry-in / out area where the workpiece 200 is carried in and out of the chuck table 10. In the first embodiment, two X-axis moving units 41 are provided in one-to-one correspondence with the chuck tables 10. The X-axis moving unit 41 moves the corresponding chuck table 10 in the X-axis direction between the processing area and the carry-in / out area.

[0024] The Y-axis movement unit 42 moves the cutting unit 20 in the Y-axis direction, which is the indexing feed direction, relative to the chuck table 10, thereby moving the chuck table 10 in the Y-axis direction relative to the cutting unit 20. The Z-axis movement unit 43 moves the cutting unit 20 in the Z-axis direction, which is the cutting feed direction, thereby moving the chuck table 10 in the Z-axis direction relative to the cutting unit 20.

[0025] The rotational movement unit 44 is moved in the X-axis direction by the X-axis movement unit 41, and rotates the chuck table 10 around an axis parallel to the Z-axis direction. In the first embodiment, two rotational movement units 44 are provided in one-to-one correspondence with the chuck tables 10. The rotational movement unit 44 rotates the corresponding chuck table 10 around an axis parallel to the Z-axis direction.

[0026] The X-axis moving unit 41, the Y-axis moving unit 42, and the Z-axis moving unit 43 are each equipped with a well-known ball screw that is rotatable around its axis, a well-known motor that rotates the ball screw around its axis, and a well-known guide rail that supports the chuck table 10 or the cutting unit 20 so that it can move freely in the X-axis, Y-axis, or Z-axis direction.

[0027] As shown in Fig. 4, chuck table 10 is formed in a rectangular shape and includes holding surface 11 for holding workpiece 200. As shown in Fig. 4, chuck table 10 includes main body 12 made of conductive metal and installed on rotational movement unit 44, and plate-shaped resin layer 13 made of elastic non-conductive resin such as rubber and provided on the surface of main body 12.

[0028] The planar shapes of the main body 12 and the resin layer 13 are formed into a rectangular shape larger than the planar shape of the workpiece 200. The surfaces of the main body 12 and the resin layer 13 are formed flat along the horizontal direction. The surface of the resin layer 13 forms the holding surface 11 that holds the workpiece 200. That is, the holding surface 11 of the chuck table 10 is made of the resin layer 13. Furthermore, as shown in FIG. 5, the resin layer 13 is fixed to the surface of the main body 12 with an adhesive 14. In this way, the chuck table 10 is configured by laying the resin layer 13, which becomes the holding surface 11, on the metal main body 12.

[0029] The chuck table 10 has a holding surface 11 divided into a plurality of regions by clearance grooves 15 into which the cutting blade 21 enters during cutting, and suction holes 16 for sucking the workpiece 200 and package device chip 206 are opened in each of the regions divided by the clearance grooves 15 of the holding surface 11. The clearance grooves 15 are provided at positions corresponding to the planned division lines 203 (positions overlapping the planned division lines 203 of the workpiece 200 held on the holding surface 11) and are recessed from the holding surface 11. In the first embodiment, the clearance grooves 15 penetrate the resin layer 13 to divide the resin layer 13 into regions, etc.

[0030] The suction holes 16 are provided at positions corresponding to the package device chips 206 (i.e., positions overlapping the package device chips 206 of the workpiece 200 held on the holding surface 11) and open to each region of the holding surface 11. In the first embodiment, the suction holes 16 correspond one-to-one to the package device chips 206. The suction holes 16 are connected to a suction source 19 via a suction path 17 and an on-off valve 18 shown in FIG. 1 .

[0031] The chuck table 10 sucks and holds the workpiece 200 and the packaged device chip 206 on the holding surface 11 by the suction source 19 sucking the suction holes 16. When the chuck table 10 sucks and holds the workpiece 200 and the packaged device chip 206 on the holding surface 11, the negative pressure from the suction source 19 may leak from gaps between the holding surface 11 and the workpiece 200 and the packaged device chip 206 (i.e., this is called vacuum leakage). When the chuck table 10 sucks and holds the workpiece 200 and the packaged device chip 206, the vacuum leakage may cause static electricity to be generated between the holding surface 11 and the workpiece 200 and the packaged device chip 206, causing them to become charged.

[0032] Furthermore, each of the chuck tables 10-1 and 10-2 is moved in the X-axis direction together with the rotational movement unit 44 by the X-axis movement unit 41, and rotated about an axis parallel to the Z-axis direction by the rotational movement unit 44. In the first embodiment, each of the chuck tables 10-1 and 10-2 is installed on the corresponding rotational movement unit 44.

[0033] The cutting units 20 are processing units that cut the workpiece 200 held by the chuck table 10. The cutting units 20 are each provided so as to be movable relatively in the Y-axis direction with respect to the chuck table 10 by a Y-axis moving unit 42, and are also provided so as to be movable relatively in the Z-axis direction with respect to the chuck table 10 by a Z-axis moving unit 43.

[0034] 1, the cutting unit 20 is mounted on a gate-shaped support frame 3 that stands upright from the device main body 2 via a Y-axis movement unit 42, a Z-axis movement unit 43, etc. The cutting unit 20 is capable of positioning the cutting blade 21 at any position on the holding surface 11 of the chuck table 10 by the Y-axis movement unit 42 and the Z-axis movement unit 43.

[0035] Each cutting unit 20 has a cutting blade 21 attached to a spindle 23 and cuts a workpiece 200. As shown in Fig. 1, the cutting unit 20 has: a cutting blade 21 that cuts the workpiece 200 held by the chuck table 10; a spindle housing 22 that is provided so as to be movable in the Y-axis direction and the Z-axis direction by a Y-axis movement unit 42 and a Z-axis movement unit 43; a spindle 23 that is provided on the spindle housing 22 so as to be rotatable about its axis and that is rotated by a motor (not shown), and has the cutting blade 21 attached to its tip; and a cutting water supply nozzle that supplies cutting water to the cutting blade 21.

[0036] In the first embodiment, each cutting blade 21 is a so-called hub blade that includes an annular circular base and an annular cutting blade disposed on the outer periphery of the circular base and used to cut the workpiece 200. The cutting blade is formed into a ring shape with a constant thickness and is made of abrasive grains such as diamond or CBN (Cubic Boron Nitride) and a bonding material such as metal or resin that fixes the abrasive grains. In the present invention, the cutting blade 21 may also be a so-called washer blade that is made up of only a cutting blade.

[0037] The imaging unit 30 is disposed so as to move integrally with the cutting unit 20. The imaging unit 30 is provided with an imaging element that captures an image of an area to be divided of the workpiece 200 held on the chuck table 10 before cutting. The imaging element is, for example, a CCD (Charge-Coupled Device) imaging element or a CMOS (Complementary MOS) imaging element. The imaging unit 30 captures an image of the workpiece 200 held on the chuck table 10 to obtain an image for performing alignment between the workpiece 200 and the cutting blade 21, and outputs the obtained image to the control unit 100.

[0038] The cutting device 1 also includes an X-axis position detection unit (not shown) for detecting the position of the chuck table 10 in the X-axis direction, a Y-axis position detection unit (not shown) for detecting the position of the cutting unit 20 in the Y-axis direction, and a Z-axis position detection unit for detecting the position of the cutting unit 20 in the Z-axis direction. The X-axis position detection unit and the Y-axis position detection unit may be configured with a linear scale parallel to the X-axis direction or the Y-axis direction and a read head. The Z-axis position detection unit detects the position of the cutting unit 20 in the Z-axis direction using motor pulses. The X-axis position detection unit, the Y-axis position detection unit, and the Z-axis position detection unit output the position of the chuck table 10 in the X-axis direction and the position of the cutting unit 20 in the Y-axis direction or the Z-axis direction to the control unit 100. Note that in the first embodiment, the positions of the chuck table 10 and the cutting unit 20 in the X-axis direction, the Y-axis direction, and the Z-axis direction of the cutting device 1 are determined relative to a predetermined origin position (not shown).

[0039] The cutting device 1 further includes an electrostatic suppression unit 50 that suppresses static electricity generated by vacuum leakage in gaps between the resin layer 13, i.e., the holding surface 11, and the workpiece 200 and package device chip 206. In the first embodiment, the electrostatic suppression unit 50 is a water supply unit 51 that electrically connects the main body 12 and the resin layer 13 with supplied water 52. Note that the water 52 supplied by the water supply unit 51, which is the electrostatic suppression unit 50 of the cutting device 1 according to the first embodiment, is preferably water with a lower resistivity than pure water.

[0040] In the first embodiment, the water supply units 51 are provided in one-to-one correspondence with the chuck tables 10 and supply water 52 to the holding surface 11 of the corresponding chuck table 10. In the first embodiment, the water supply units 51 are supplied with water 52 from a water supply unit (not shown). The water supply units 51 are pipes extending along the Y-axis direction and fixed to the apparatus body 2. The water supply units 51 have outlets for discharging the supplied water 52 that face the holding surface 11 and are spaced apart in the longitudinal direction. The water supply units 51 can pass the chuck table 10, which is moved by the X-axis moving unit 41, below the water supply units 51. The water supply units 51 discharge water 52 from the outlets, and pass the chuck table 10, which is moved in the X-axis direction by the X-axis moving unit 41, below the water supply units 51, thereby supplying the water 52 to the holding surface 11. The supplied water 52 electrically connects the main body 12 and the resin layer 13, thereby discharging static electricity generated by vacuum leakage to the main body 12.

[0041] The cutting device 1 also includes a transport unit 60 (shown in FIG. 7) that transports the workpiece 200 before cutting onto the holding surface 11 of the chuck table 10 and transports the package device chip 206 on the holding surface 11 after cutting from the holding surface 11.

[0042] The control unit 100 controls each of the above-mentioned units of the cutting device 1, causing the cutting device 1 to perform a machining operation on the workpiece 200. The control unit 100 is a computer having an arithmetic processing device with a microprocessor such as a CPU (central processing unit), a storage device with memory such as a ROM (read only memory) or RAM (random access memory), and an input / output interface device. The arithmetic processing device of the control unit 100 performs arithmetic processing in accordance with a computer program stored in the storage device, and outputs control signals for controlling the cutting device 1 to the above-mentioned components of the cutting device 1 via the input / output interface device.

[0043] The control unit 100 is also connected to a display unit configured with a liquid crystal display device or the like that displays the status of the machining operation, images, etc., and an input unit that the operator uses to register machining conditions, etc. The input unit is configured with at least one of a touch panel provided on the display unit and an external input device such as a keyboard.

[0044] Next, the machining operation of the cutting device 1 having the above-described configuration will be described. Fig. 6 is a front view schematically showing a state in which a workpiece held by suction on the first chuck table of the cutting device shown in Fig. 1 is being cut. Fig. 7 is a front view schematically showing a state in which a workpiece is being carried into the second chuck table of the cutting device shown in Fig. 6. Fig. 8 is a side view schematically showing a state in which a workpiece held by suction on the first chuck table of the cutting device shown in Fig. 1 is being cut. Fig. 9 is a side view schematically showing the second chuck table holding the workpiece by suction on the cutting device shown in Fig. 8.

[0045] In the cutting device 1 having the above-described configuration, an operator operates an input unit or the like to set processing conditions in the control unit 100. When the control unit 100 receives an instruction to start the processing operation from an operator or the like, the cutting device 1 starts the processing operation.

[0046] When the machining operation starts, the control unit 100 of the cutting device 1 controls the transport unit 60 to place the mold resin 205 of the workpiece 200 on the holding surface 11 of the first chuck table 10-1 in the carry-in / out area. During the machining operation, the cutting device 1 opens the on-off valve 18 to suction-hold the mold resin 205 of the workpiece 200 on the holding surface 11 of the first chuck table 10-1, rotates the spindle 23 about its axis, and supplies cutting water to the cutting blade 21. The control unit 100 of the cutting device 1 controls the movement unit 40 to move the first chuck table 10 from the carry-in / out area toward the machining area to below the imaging unit 30, and the imaging unit 30 captures an image of the workpiece 200 held by suction on the first chuck table 10 to perform alignment.

[0047] During the machining operation, the control unit 100 of the cutting device 1 controls the moving unit 40 etc. based on the machining conditions, and as shown in Figure 6, moves the cutting blades 21 of both cutting units 20 and the workpiece 200 held by suction on the first chuck table 10-1 relatively along the planned division line 203, causing the cutting blades 21 to cut into the planned division line 203 of the workpiece 200 until they enter the clearance groove 15, thereby cutting the workpiece 200 held by suction on the first chuck table 10-1.

[0048] During the machining operation, the control unit 100 of the cutting device 1 closes the on-off valve 18 connected to the second chuck table 10-2 while cutting the workpiece 200 held by suction on the first chuck table 10-1, and controls the movement unit 40 to move the second chuck table 10-2 below the water supply unit 51, which is the electrostatic suppression unit 50, as shown in Fig. 6, while supplying water 52 from the water supply unit 51 to the holding surface 11 of the second chuck table 10-2. The supplied water 52 covers the holding surface 11 of the second chuck table 10-2 due to surface tension or the like, and electrically connects the resin layer 13 and the main body 12, as shown in Fig. 7.

[0049] During the machining operation, while the workpiece 200 held by suction on the first chuck table 10-1 is being cut, the control unit 100 of the cutting device 1 controls the moving unit 40 to position the second chuck table 10-2 in the carry-in / out area, as shown in FIG. 7, and then controls the transport unit 60 to place the molding resin 205 of the workpiece 200 on the holding surface 11 of the second chuck table 10-2 in the carry-in / out area. During the machining operation, the cutting device 1 opens the on-off valve 18 to hold the molding resin 205 of the workpiece 200 by suction on the holding surface 11 of the second chuck table 10-2. At this time, the water 52 electrically connects the resin layer 13 and the main body 12, and static electricity generated by vacuum leakage on the holding surface 11 of the second chuck table 10-2 is discharged to the main body 12 and suppressed.

[0050] In a machining operation, the control unit 100 of the cutting device 1 positions the second chuck table 10-2, which holds the workpiece 200 by suction, in the carry-in / out area and waits there while cutting the workpiece 200 held by suction on the first chuck table 10-1 as shown in Fig. 8. In this way, the transport unit 60 loads the workpiece 200 onto the second chuck table 10-2 while cutting the workpiece 200 held by suction on the first chuck table 10-1, and the workpiece 200 held by the second chuck table 10-2 waits in the carry-in / out area while being held by suction before cutting.

[0051] The cutting device 1 cuts the planned dividing lines 203 of the workpiece 200 held by suction on the first chuck table 10-1 in accordance with the processing conditions, and divides the workpiece 200 into individual package device chips 206. After cutting all of the planned dividing lines 203 of the workpiece 200 held by suction on the first chuck table 10-1 and dividing it into package device chips 206, the cutting device 1 moves the first chuck table 10-1 from the processing area toward the carry-in / out area. In addition, the cutting device 1 moves the second chuck table 10-2 from the loading / unloading area toward the processing area, and moves the second chuck table 10 to below the imaging unit 30, uses the imaging unit 30 to capture an image of the workpiece 200 held by suction on the second chuck table 10, performs alignment, and cuts the cutting blades 21 of both cutting units 20 into the planned dividing line 203 of the workpiece 200 until the cutting blades 21 enter the clearance groove 15, thereby cutting the workpiece 200 held by suction on the second chuck table 10-2.

[0052] During the processing operation, while the cutting device 1 is cutting the workpiece 200 held by suction on the second chuck table 10-2, it controls the transport unit 60 to transport the workpiece 200 after cutting, i.e., the package device chip 206, from the holding surface 11 of the second chuck table 10-2 positioned in the loading / unloading area. During the machining operation, while the workpiece 200 held by suction on the second chuck table 10-2 is being cut, the cutting device 1 controls the moving unit 40 to move the second chuck table 10-2 below the water supply unit 51, which is the electrostatic suppression unit 50, while supplying water 52 from the water supply unit 51 to the holding surface 11 of the first chuck table 10-1, controls the moving unit 40 to position the first chuck table 10-1 in the loading / unloading area, and then controls the transport unit 60 to load the workpiece 200 before cutting onto the first chuck table 10-1, and while the workpiece 200 held by suction on the second chuck table 10-2 is being cut, the first chuck table 10-1 holding the workpiece 200 by suction is positioned in the loading / unloading area and waits.

[0053] In this way, while the workpiece 200 held by suction on the second chuck table 10-2 is being cut, the transport unit 60 takes out the cut workpiece 200, i.e., the package device chip 206, held by the first chuck table 10-1 and carries in the workpiece 200 before cutting, so that the workpiece 200 held by the first chuck table 10-1 waits in the carry-in / out area in the state in which it was held by suction before cutting. In this way, while the transport unit 60 is cutting the workpiece 200 held by suction on one of the chuck tables 10-1, 10-2, it takes out the cut workpiece 200 held by suction on the other chuck table and carries in the workpiece 200 before cutting, so that the workpiece 200 waits in the state in which it was held by suction on the other chuck table before cutting. In this way, the cutting device 1 alternately cuts the workpiece 200 held by suction on the first chuck table 10-1 and the workpiece 200 held by suction on the second chuck table 10-2, dividing the workpiece 200 into individual package device chips 206.

[0054] The cutting device 1 according to the first embodiment described above includes an electrostatic suppression unit 50 that suppresses static electricity generated by vacuum leakage. The electrostatic suppression unit 50 is a water supply unit 51 that supplies water 52 that electrically connects the resin layer 13 and the metal main body 12. As a result, the cutting device 1 can suppress even slight static electricity generated on the holding surface 11 of the chuck table 10 due to vacuum leakage by the water supply unit 51, which is the electrostatic suppression unit 50, thereby achieving the effect of reducing electrostatic damage to the workpiece 200.

[0055] [Embodiment 2] A cutting device according to a second embodiment of the present invention will be described with reference to the drawings. Fig. 10 is a cross-sectional view of a main part of a chuck table of the cutting device according to the second embodiment. In Fig. 10, the same parts as those in the first embodiment are denoted by the same reference numerals and description thereof will be omitted.

[0056] The cutting device 1 according to the second embodiment is the same as the first embodiment except for the configuration of the electrostatic suppression unit 50. In the cutting device 1 according to the second embodiment, the resin layer 13-2 shown in FIG. 10 of the chuck table 10 is conductive because a conductive material such as carbon particles is mixed into an elastic resin such as rubber. Also, in the cutting device 1 according to the second embodiment, the adhesive 14-2 shown in FIG. 10 of the chuck table 10 is conductive because a conductive material such as carbon particles is mixed into a resin. Therefore, the resin layer 13-2 is electrically connected to the main body 12 via the adhesive 14-2.

[0057] Thus, in embodiment 2, the electrostatic suppression section 50 is a conductive resin layer 13, and the chuck table 10 has a conductive resin layer 13-2 fixed to the metal main body section 12 with a conductive adhesive 14-2.

[0058] The cutting device 1 according to the second embodiment includes an electrostatic suppression unit 50 that suppresses static electricity generated by vacuum leakage. The electrostatic suppression unit 50 is a conductive resin layer 13 of the chuck table 10. As a result, the cutting device 1 can suppress even slight static electricity generated on the holding surface 11 of the chuck table 10 due to vacuum leakage by the resin layer 13 that is the electrostatic suppression unit 50, thereby achieving the effect of reducing electrostatic damage to the workpiece 200.

[0059] The present invention is not limited to the above-described embodiment, and can be implemented in various modifications without departing from the gist of the present invention. [Explanation of symbols]

[0060] 1 Cutting equipment 10 Chuck table 10-1 First chuck table 10-2 Second chuck table 11 Holding surface 12 Main body 13 Resin layer 13-2 Resin layer (static suppression part) 14-2 Adhesive 15 Relief groove 16 Suction hole 20 Cutting unit 21 Cutting blade 23 Spindle 40 Mobile Units 50 Static electricity suppression unit 51 Water supply section 52 water 60 Transport Unit 200 Workpiece

Claims

1. a cutting unit having a cutting blade attached to a spindle for cutting a package substrate on which a chip is embedded in a molding resin; a chuck table in which a holding surface is divided into a plurality of regions by the relief grooves of the cutting blade, and suction holes for suction-holding the package substrate are opened in the regions of the holding surface; a moving unit that moves the cutting unit and the chuck table relatively, further comprising an electrostatic suppression unit that suppresses static electricity generated from a vacuum leak in a gap between the holding surface of the chuck table and the package substrate, The chuck table is configured by laying a resin layer serving as the holding surface on a metal main body, the electrostatic suppression unit is a water supply unit that is located opposite the holding surface and electrically connects the main body and the resin layer with water that has a lower specific resistance than supplied pure water, A cutting device cuts the package substrate into package device chips by causing the cutting blade to enter the relief groove.

2. a cutting unit having a cutting blade attached to a spindle for cutting a package substrate on which a chip is embedded in a molding resin; a chuck table in which a holding surface is divided into a plurality of regions by the relief grooves of the cutting blade, and suction holes for suction-holding the package substrate are opened in the regions of the holding surface; a moving unit that moves the cutting unit and the chuck table relatively, further comprising an electrostatic suppression unit that suppresses static electricity generated from a vacuum leak in a gap between the holding surface of the chuck table and the package substrate, The chuck table has a metal body and a resin layer laid thereon, the resin layer having the relief grooves and the suction holes formed therein, and a surface of the resin layer serving as a holding surface for holding the package substrate; the static electricity suppression section is the resin layer having electrical conductivity, the resin layer is fixed to the metal body with a conductive adhesive; A cutting device cuts the package substrate into package device chips by causing the cutting blade to enter the relief groove.

3. The chuck table includes a first chuck table and a second chuck table, 3. The cutting device according to claim 1, wherein, while a package substrate held by suction on one of the chuck tables is being processed, the transport unit unloads the processed package substrate from the other chuck table and loads the unprocessed package substrate, and the package substrate waits in a state where it is held by suction before being processed.

Images