Holding table
The holding table design with a transparent plate and annular support structure effectively prevents machining fluid from adhering to the imaging camera lens by suction-holding the plate and blowing air, addressing the adherence issue in existing glass plate designs.
Patent Information
- Application Number
- JP2021054383
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2021-03-26
- Publication Date
- 2025-11-05
- Estimated Expiration
- 2041-03-26
AI Technical Summary
Existing holding tables with glass plates allow machining fluid to enter the interface between the glass plate and support, leading to fluid adherence on the imaging camera lens, obstructing clear imaging.
A holding table design featuring a transparent plate with suction grooves and annular support parts, including annular grooves and suction grooves, connected to a suction source and air supply, to prevent fluid adherence by suction-holding the plate and blowing air to detach the workpiece.
Prevents machining fluid from adhering to the imaging camera lens, ensuring clear imaging and secure workpiece fixation without the need for elastic materials like rubber gaskets.
Smart Images

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Abstract
Description
[Technical Field]
[0001] The present invention relates to a holding table used in a processing device. [Background technology]
[0002] A typical holding table is formed by bonding a porous plate to a metal frame with adhesive. Because the adhesive causes the top surface of the porous plate to be uneven, the top surface of the porous plate and the frame are ground to flatten it after bonding. The holding table holds the workpiece by suction through openings in the holding surface, and after processing, air is blown onto the workpiece to release it from the holding surface.
[0003] On the other hand, the holding member that holds the workpiece is made of a transparent material such as a glass plate. accomplish A cutting device that can grind a glass plate together with a frame has also been proposed (see, for example, Patent Documents 1 and 2). Since it is difficult to grind a glass plate together with a frame, it is conceivable to support the glass plate with an annular support and clamp it from above and below with an upper pressing member to fix it without using adhesive. 。 [Prior art documents] [Patent documents]
[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2010-087141 [Patent Document 2] Japanese Patent Application Laid-Open No. 2010-082644 Summary of the Invention [Problem to be solved by the invention]
[0005] However, in the holding tables shown in Patent Documents 1 and 2, in which the holding member is made of a glass plate, the cutting fluid supplied to the workpiece or cutting blade during processing enters through the interface between the glass plate and the support, reaches the inside of the annular support, and drips, which can cause the cutting fluid to adhere to the objective lens of the imaging camera.
[0006] For example, it is conceivable to interpose a rubber packing between the support and the glass plate, but the packing may cause variations in the height of the upper surface of the holding surface.
[0007] If machining fluid adheres to the lens of the imaging camera, the machining fluid will appear in the captured image of the workpiece, making it difficult to obtain a clear captured image.
[0008] An object of the present invention is to provide a holding table that can prevent machining fluid from adhering to the lens of an imaging camera. [Means for solving the problem]
[0009] In order to solve the above-mentioned problems and achieve the object, the holding table of the present invention comprises a holding table for holding a workpiece, a processing means for processing the workpiece held by the holding table, a processing fluid supply means for supplying a processing fluid to the workpiece, and an imaging means disposed below the holding table for imaging the workpiece on the holding table. at least The holding table used in a processing device comprises a transparent plate including a holding surface for holding a workpiece, an annular support part including an annular support surface for supporting the outer edge of the transparent plate, and a presser part for clamping the outer edge of the transparent plate, which is supported directly on the annular support part, between the annular support surface of the annular support part and the annular support surface of the annular support part, wherein the transparent plate is formed with a holding surface-side opening that opens into the holding surface, a back surface-side opening on the back surface of the holding surface, and a transparent plate flow path from the holding surface-side opening to the back surface-side opening, and the annular support part is formed with an annular groove that is formed to connect to the back surface-side opening of the transparent plate, opens into the annular support surface, and is connected via a valve that can be switched between a suction source and an air supply source, and the annular groove, together with the transparent plate flow path, constitutes a workpiece flow path for sucking or blowing air onto the workpiece, and the annular support surface is formed with a pair of annular suction grooves that are formed on both the inner and outer peripheries of the annular groove, open into the annular support surface, and are located inner than the presser part, connected to the suction source, and for holding the transparent plate by suction. [Effects of the Invention]
[0010] The present invention has an effect of preventing machining fluid from adhering to the lens of the imaging camera. [Brief explanation of the drawings]
[0011] [Figure 1] FIG. 1 is a perspective view showing an example of the configuration of a processing device including a holding table according to the first embodiment. [Figure 2] 2 is a perspective view showing a holding table and a downward imaging camera of the processing apparatus shown in FIG. [Figure 3] FIG. 3 is a plan view of the holding table according to the first embodiment. [Figure 4] FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. [Figure 5] FIG. 5 is an enlarged cross-sectional view of part V in FIG. DETAILED DESCRIPTION OF THE INVENTION
[0012] Modes (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. Furthermore, the components described below include those that can be easily imagined by a person skilled in the art and those that are substantially the same. Furthermore, the configurations described below can be combined as appropriate. Furthermore, various omissions, substitutions, or modifications of the configuration can be made within the scope of the gist of the present invention.
[0013] [Embodiment 1] A holding table according to a first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing a configuration example of a processing device including a holding table according to the first embodiment. FIG. 2 is a perspective view showing the holding table and a downward imaging camera of the processing device shown in FIG. 1. FIG. 3 is a plan view of the holding table according to the first embodiment. FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. 3. FIG. 5 is a cross-sectional view showing an enlarged view of part V in FIG. 4.
[0014] The holding table 1 according to the first embodiment constitutes a processing apparatus 100 shown in Fig. 1. The processing apparatus 100 shown in Fig. 1 is a cutting apparatus that cuts (corresponding to processing) a workpiece 200. The workpiece 200 to be processed by the processing apparatus 100 shown in Fig. 1 is a wafer such as a disk-shaped semiconductor wafer or an optical device wafer, with silicon, sapphire, gallium arsenide, SiC (silicon carbide), or the like as a substrate 201. The workpiece 200 has devices 204 formed in regions defined in a grid pattern by a plurality of planned division lines 203 on a surface 202 of the substrate 201.
[0015] The device 204 is, for example, an integrated circuit such as an IC (Integrated Circuit) or an LSI (Large Scale Integration), or an image sensor such as a CCD (Charge Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor). In the first embodiment, the workpiece 200 has a metal film 206 formed on a back surface 205 behind a front surface 202 of a substrate 201. 。
[0016] In the first embodiment, the workpiece 200 has tape 211 attached to a front surface 202, and the outer periphery of the tape 211 is attached to an annular frame 210. The workpiece 200 is supported by the tape 211 on the inside of the frame 210, with the metal film 206 on the back surface 205 facing upward. Note that in the first embodiment, the workpiece 200 has the metal film 206 formed on the back surface 205 of the substrate 201, but in the present invention, the metal film 206 may not be formed, and the back surface 205 may be attached to the tape 211, with the front surface 202 facing upward.
[0017] The processing apparatus 100 shown in Fig. 1 is a cutting apparatus that holds a workpiece 200 on a holding table 1 and cuts it with a cutting blade 121 along a planned division line 203 to divide it into individual devices 204. As shown in Fig. 1, the processing apparatus 100 includes a holding unit 110, a cutting unit 120, a moving unit 130, an upward imaging camera 140, and a control unit 190.
[0018] As shown in FIG. 2, the holding unit 110 includes a housing 111 that is moved in the X-axis direction parallel to the horizontal direction by an X-axis moving unit 131 of the moving unit 130, and a holding table 1 that is rotatable on the housing 111 around an axis that is parallel to the Z-axis direction that is along the vertical direction.
[0019] In embodiment 1, the housing 111 comprises a lower plate 112 that is moved in the X-axis direction by an X-axis moving unit 131 and is parallel to the horizontal direction, a side plate 113 that stands upright from the outer edge of the lower plate 112, and an upper plate 114 whose outer edge is connected to the upper end of the side plate 113 and is parallel to the lower plate 112.
[0020] The holding table 1 is used in the processing device 100, and holds the workpiece 200 on a holding surface 21, and is supported by an upper plate 114 so as to be rotatable about its axis. As shown in Figures 2, 3, and 4, the holding table 1 includes a transparent plate 2, an annular support member 3 (corresponding to the annular support portion), a pressing member 4 (corresponding to the pressing portion), a frame holding portion 5, and a workpiece flow path 6 (shown in Figure 5).
[0021] The transparent plate 2 is formed in a disk shape with an outer diameter larger than that of the workpiece 200 and a uniform thickness, and when the holding table 1 is placed on the upper plate 114 of the housing 111, the upper surface is parallel to the horizontal direction. The upper surface of the transparent plate 2 is a holding surface 21 that holds the workpiece 200. In other words, the transparent plate 2 includes the holding surface 21 that holds the workpiece 200.
[0022] The transparent plate 2 is made of a transparent (translucent) and non-porous material that is air-tight, such as quartz glass, borosilicate glass, sapphire, calcium fluoride, lithium fluoride, or magnesium fluoride. The workpiece 200 is placed on the holding surface 21 of the transparent plate 2 via tape 211, and the transparent plate 2 holds the workpiece 200 and the tape 211 around the periphery of the workpiece 200. The transparent plate 2 has a thickness that gradually decreases around the outer periphery, which is the periphery, and when the holding table 1 is placed on the upper plate 114 of the housing 111, a step 22 (shown in FIGS. 4 and 5) is formed around the entire periphery, the upper surface of which is located below the holding surface 21.
[0023] In the first embodiment, as shown in FIG. 5, the transparent plate 2 is provided with a suction groove 23, which is a holding surface-side opening that opens to the holding surface 21, a rear-side opening 25 on the rear surface 24 of the transparent plate 2 on the rear (back) side of the holding surface 21, and a transparent plate flow path 26 that extends from the suction groove 23 to the rear-side opening 25. The suction groove 23 is formed as a recessed groove extending from the holding surface 21, and as shown in FIG. 3, includes an annular portion 231 that is coaxial with the holding surface 21, and multiple linear portions 232 whose both ends communicate with the annular portion 231 and intersect with each other at the center of the holding surface 21. The annular portion 231 is formed in a ring shape whose inner and outer diameters are smaller than the outer diameter of the workpiece 200. The linear portions 232 extend linearly parallel to the radial direction of the holding surface 21, and two are provided in the first embodiment.
[0024] The transparent plate flow path 26 is a hole that penetrates the transparent plate 2 in the thickness direction, and in the first embodiment, one end opens to the annular portion 231 of the suction groove 23. The other end of the transparent plate flow path 26 is a rear-side opening 25 that opens to the rear surface 24 of the transparent plate 2.
[0025] The annular support member 3 is made of stainless steel or the like, and is formed in a circular ring shape with an opening 33 in the center. The annular support member 3 is supported on the upper plate 114 of the housing 111 so as to be rotatable around an axis parallel to the Z-axis direction. The inner diameter of the annular support member 3 is smaller than the outer diameter of the transparent plate 2, and the outer diameter of the annular support member 3 is larger than the outer diameter of the transparent plate 2.
[0026] The annular support member 3 includes an annular support surface 31 around the entire periphery, on its inner edge, that supports the transparent plate 2. When the annular support member 3 is supported on the upper plate 114 of the housing 111, the annular support surface 31 becomes parallel to the horizontal direction. The outer edge, which is the outer periphery of the transparent plate 2, is placed on the annular support surface 31.
[0027] The holding member 4 clamps the outer edge of the transparent plate 2 supported on the annular support surface 31 of the annular support member 3 together with the annular support member 3. The holding member 4 is made of stainless steel or the like, and is formed in an annular shape with an inner diameter smaller than the outer diameter of the transparent plate 2 and an outer diameter larger than the outer diameter of the transparent plate 2.
[0028] The holding member 4 has a resting portion 41 on its inner edge that rests on the upper surface of the step portion 22, and a bolt-through hole 43 on its outer edge through which a bolt 42 passes. The holding member 4 is fixed to the annular support member 3 by placing the resting portion 41 on the upper surface of the step portion 22 and threading the bolt 42 that has passed through the bolt-through hole 43 into the screw hole 32 provided in the annular support member 3, and the outer edge of the transparent plate 2 is clamped together with the annular support member 3 to fix the transparent plate 2 to the annular support member 3. At least the upper surface of the resting portion 41 of the holding member 4 is located on the same plane as the holding surface 21.
[0029] In the first embodiment, the holding table 1 has the rest portion 41 of the pressing member 4 placed on the step portion 22 on the outer edge of the transparent plate 2 supported on the annular support surface 31 of the annular support member 3, and the transparent plate 2 is fixed to the annular support member 3 by threading the bolts 42 that pass through the bolt-through holes 43 into the screw holes 32 provided in the annular support member 3. In the first embodiment, the holding table 1 is arranged in a position where the transparent plate 2, the annular support member 3, and the pressing member 4 are coaxial with one another.
[0030] The frame holding parts 5 hold the frame 210, and are fixed to the outer edge of the annular support member 3, and are arranged on the outer periphery of the transparent plate 2, i.e., the holding surface 21. A plurality of frame holding parts 5 are arranged at intervals in the circumferential direction on the outer edge of the annular support member 3, and each includes frame support parts 51 on whose upper surface the frame 210 is placed, and vacuum pads 52 that suction-hold the frame 210 placed on the upper surface of the frame support parts 51. The vacuum pads 52 are connected to a suction source (not shown).
[0031] The workpiece flow path 6 is for sucking and holding the workpiece 200 on the holding surface 21, or for spraying pressurized gas (hereinafter referred to as air blowing) toward the workpiece 200 on the holding surface 21. As shown in Fig. 5, the workpiece flow path 6 includes the transparent plate flow path 26 described above, an annular groove 61 formed in the annular support member 3, an air supply source 62, a spray flow path 63, an ejector 64 which is a suction source, and a suction flow path 65.
[0032] The annular groove 61 is formed to connect to the back-side opening 25 of the transparent plate 2 and opens to the annular support surface 31. In the first embodiment, the annular groove 61 is formed as a groove recessed from the annular support surface 31 of the annular support member 3 and opens to the annular support surface 31. The annular groove 61 is formed in a ring shape that is coaxial with the annular support surface 31 and has inner and outer diameters equal to the inner and outer diameters of the annular portion 231 of the suction groove 23, and is connected (i.e., communicates) with the back-side opening 25 formed in the transparent plate 2 fixed to the annular support member 3. The annular groove 61 communicates with the back-side opening 25, thereby constituting the workpiece flow path 6 together with the transparent plate flow path 26.
[0033] The air supply source 62 supplies pressurized air. One end of the injection flow path 63 is connected to the air supply source 62, and the other end is connected to the annular groove 61. The injection flow path 63 supplies pressurized air from the air supply source 62 to the annular groove 61, causing the air to be injected from the suction groove 23. The injection flow path 63 is provided with a first valve 66 which is an on-off valve.
[0034] The ejector 64 is connected to the air supply source 62 via a flow path 67, and pressurized air is supplied from the air supply source 62 through the flow path 67. When pressurized air is supplied to the ejector 64, a negative pressure is generated. The flow path 67 is provided with a second valve 68 which is an on-off valve.
[0035] The suction flow path 65 has one end connected to the ejector 64 and the other end connected to the center of the injection flow path 63, and supplies the negative pressure generated by the ejector 64 to the annular groove 61 to suck gas or the like from the suction groove 23. The suction flow path 65 is provided with a third valve 69 which is an on-off valve.
[0036] The annular groove 61 is switchably connected to the ejector 64 and the air supply source 62 via the flow paths 63, 65, 67 and the valves 66, 68, 69 and the flow paths 63, 65, 67. When the first valve 66 is closed and the second valve 68 and the third valve 69 are opened, the annular groove 61 is supplied with negative pressure generated by the ejector 64, and the negative pressure from the ejector 64 sucks gas from the suction groove 23, thereby suction-holding the workpiece 200 on the holding surface 21 to the holding surface 21 via the tape 211.
[0037] When the first valve 66 and the second valve 68 are opened and the third valve 69 is closed, pressurized gas is supplied from the air supply source 62 to the annular groove 61, and the pressurized gas from the air supply source is sprayed from the suction groove 23, thereby blowing air through the tape 211 toward the workpiece 200 on the holding surface 21 and detaching the workpiece 200 from the holding surface 21.
[0038] Furthermore, the holding table 1 according to the first embodiment has a pair of annular suction grooves 7 formed in the annular support surface 31. That is, the holding table 1 according to the first embodiment further includes a pair of annular suction grooves 7 formed in the annular support surface 31.
[0039] The annular suction groove 7 is formed on the inner edge of the annular support surface 31 of the annular support member 3, on both the inner and outer periphery of the annular groove 61 of the annular support member 3, and opens onto the annular support surface 31 and is connected to an ejector 64. The annular suction groove 7 is formed as a recessed groove on the annular support surface 31 of the annular support member 3, and opens onto the annular support surface 31.
[0040] In the first embodiment, a pair of annular suction grooves 7 are provided and are arranged coaxially with the annular support surface 31, i.e., the annular groove 61. One of the annular suction grooves 7 is formed so that its inner and outer diameters are smaller than those of the annular groove 61, and is arranged closer to the inner circumference of the annular support surface 31 than the annular groove 61. The other annular suction groove 7 is formed so that its inner and outer diameters are larger than those of the annular groove 61, and is arranged closer to the outer circumference of the annular support surface 31 than the annular groove 61.
[0041] Each annular suction groove 7 is connected to a position between the ejector 64 and the third valve 69 of the suction flow path 65 by a second suction path 71. For this reason, the holding table 1 is provided with a second suction path 71 that connects the annular suction groove 7 and the ejector 64. One end of the second suction path 71 communicates with a position between the ejector 64 and the third valve 69 of the suction flow path 65, and the other end branches into two paths that each communicate with the annular suction groove 7. When the second valve 68 is opened, the annular suction groove 7 is supplied with negative pressure generated by the ejector 64, and the negative pressure from the ejector 64 suction-holds the transparent plate 2 onto the annular support surface 31 of the annular support member 3.
[0042] Furthermore, the annular suction grooves 7 use negative pressure from the ejector 64 to suck in liquid that has seeped between the transparent plate 2 and the annular support surface 31 of the annular support member 3. One annular suction groove sucks in liquid that has seeped in between the transparent plate 2 and the annular support surface 31 of the annular support member 3, preventing the liquid from dripping from the inner edge of the annular support member 3. The other annular suction groove sucks in liquid that has seeped in between the transparent plate 2 and the annular support surface 31 of the annular support member 3, preventing the liquid from dripping from the outer edge of the annular support member 3.
[0043] The holding table 1 has the first valve 66 closed, the second valve 68 and the third valve 69 open, and the negative pressure generated by the ejector 64 suction-holds the workpiece 200 on the holding surface 21 to the holding surface 21 via the tape 211, and the negative pressure generated by the ejector 64 also suction-holds the transparent plate 2 to the annular support surface 31 of the annular support member 3. Furthermore, the holding table 1 has the first valve 66 and the second valve 68 open, and the third valve 69 closed, and pressurized gas is supplied from the air supply source 62, and the pressurized gas from the air supply source 62 is blown toward the workpiece 200 on the holding surface 21 via the tape 211, and the negative pressure generated by the ejector 64 also suction-holds the transparent plate 2 to the annular support surface 31 of the annular support member 3.
[0044] In the first embodiment, the holding unit 10 has a circular through-hole 115 formed in the upper plate 114 of the housing 11. The through-hole 115 is arranged in a position where the transparent plate 2, the annular support member 3, and the pressing member 4 of the holding table 1 are coaxial with each other.
[0045] The moving unit 130 moves the holding table 1 and the cutting unit 120 relative to one another. The moving unit 130 includes an X-axis moving unit 131 which is a processing feed unit shown in FIG. 2, a Y-axis moving unit 132 which is an indexing feed unit shown in FIG. 1, a Z-axis moving unit 133 which is a cutting feed unit shown in FIG. 1, and a rotational moving unit 134 which rotates the holding table 1 shown in FIG. 2 around an axis parallel to the Z-axis direction.
[0046] The X-axis moving unit 131 moves the lower plate 112 of the housing 11 of the holding unit 10 in the X-axis direction, thereby relatively moving the holding table 1 and the cutting unit 120 in the X-axis direction. The X-axis moving unit 131 moves the holding table 1 in the X-axis direction across a carry-in / out area 103 where the workpiece 200 is carried in and out of the holding table 1, and a processing area 104 where the workpiece 200 held on the workpiece 200 is cut.
[0047] The Y-axis movement unit 132 moves the cutting unit 120 in the Y-axis direction, which is parallel to the horizontal direction and perpendicular to the X-axis direction, thereby moving the holding table 1 and the cutting unit 120 relatively in the Y-axis direction. The Z-axis movement unit 133 moves the cutting unit 120 in the Z-axis direction, which is parallel to the vertical direction and perpendicular to both the X-axis direction and the Y-axis direction, thereby moving the holding table 1 and the cutting unit 120 relatively in the Z-axis direction.
[0048] The X-axis moving unit 131, the Y-axis moving unit 132, and the Z-axis moving unit 133 are equipped with a well-known ball screw that is rotatable around its axis, a well-known motor that rotates the ball screw around its axis, and a well-known guide rail that supports the holding table 1 or the cutting unit 120 so that it can move freely in the X-axis, Y-axis, or Z-axis direction.
[0049] The rotary movement unit 134 rotates the holding table 1 around an axis parallel to the Z-axis direction. The rotary movement unit 134 rotates the holding table 1 around the axis within a range of more than 180 degrees but less than 360 degrees. The rotary movement unit 134 includes a motor 141 fixed to the side plate 113 of the housing 11, a pulley 142 connected to the output shaft of the motor 141, and a belt 143 wound around the outer periphery of the annular support member 3 of the holding table 1 and rotated around the axis by the pulley 142. When the motor 141 rotates, the rotary movement unit 134 rotates the holding table 1 around the axis via the pulley 142 and the belt 143. In addition, in the first embodiment, the rotary movement unit 134 can rotate the holding table 1 by 220 degrees in both one direction around the axis and in the other direction opposite to the one direction.
[0050] The cutting unit 120 is a processing means that performs cutting with a cutting blade 121 on the workpiece 200 held by the transparent plate 2 of the holding table 1. The cutting unit 120 is provided so as to be movable in the Y-axis direction by a Y-axis movement unit 132 and so as to be movable in the Z-axis direction by a Z-axis movement unit 133 relative to the workpiece 200 held by the transparent plate 2 of the holding table 1. The cutting unit 120 is provided on a support frame 102 that stands upright from the apparatus main body 101, via the Y-axis movement unit 132, the Z-axis movement unit 133, etc.
[0051] The cutting unit 120 is capable of positioning the cutting blade 121 at any position on the holding surface 21 of the holding table 1 by means of a Y-axis moving unit 132 and a Z-axis moving unit 133. The cutting unit 120 is equipped with the cutting blade 121, a spindle housing 122 provided so as to be movable in the Y-axis direction and the Z-axis direction by the Y-axis moving unit 132 and the Z-axis moving unit 133, a spindle 123 provided on the spindle housing 122 so as to be rotatable about its axis, rotated by a motor, and having the cutting blade 121 attached to its tip, and a cutting water nozzle 124 serving as a machining fluid supply means.
[0052] The cutting blade 121 is an extremely thin cutting grindstone having a substantially ring shape, and is used to cut the workpiece 200 held by the holding table 1. In the first embodiment, the cutting blade 121 is a so-called hub blade that includes an annular circular base and an annular cutting blade disposed on the outer periphery of the circular base and used to cut the workpiece 200. The cutting blade is made of abrasive grains such as diamond or CBN (Cubic Boron Nitride) and a bonding material such as metal or resin, and is formed to a predetermined thickness. In the present invention, the cutting blade 121 may also be a so-called washer blade that is made of only the cutting blade.
[0053] The spindle 123 is rotated about its axis by a motor, thereby rotating the cutting blade 121 about its axis. The axes of the cutting blade 121 and spindle 123 of the cutting unit 120 are parallel to the Y-axis direction. The cutting water nozzle 124 is provided at the tip of the spindle housing 122, and supplies cutting water, which is a machining fluid, from the machining fluid supply source 125 to the workpiece 200 and the cutting blade 121 while the cutting blade 121 is cutting the workpiece 200. In the first embodiment, the cutting water is pure water.
[0054] The upper imaging camera 140 is fixed to the cutting unit 120 so as to move integrally with the cutting unit 120. The upper imaging camera 140 has a plurality of imaging elements that capture images of the workpiece 200 held on the holding table 1 from above. The imaging elements are, for example, CCD (Charge-Coupled Device) imaging elements or CMOS (Complementary MOS) imaging elements. The upper imaging camera 140 captures an image of the workpiece 200 held on the transparent plate 2 of the holding table 1 and outputs the obtained image to the control unit 190.
[0055] As shown in FIG. 2, the processing device 100 is disposed below the transparent plate 2 of the holding table 1 and is positioned below the workpiece 200 held by the transparent plate 2. Face sideThe downward imaging camera 150 is an imaging means for imaging the workpiece 20 held on the transparent plate 2 of the holding table 1. 0 The workpiece 200 is imaged from below through the transparent plate 2. For this purpose, the workpiece 200 held by the transparent plate 2 is imaged by the downward imaging camera 150 through the opening 33 and the transparent plate 2.
[0056] 2 shows the downward imaging camera 150 next to the holding unit 10 in the Y-axis direction. However, in an actual processing apparatus 100, the downward imaging camera 150 is disposed below the transparent plate 2 of the holding table 1. The downward imaging camera 150 is disposed so as to be movable in the Y-axis direction by a second Y-axis movement unit 135 provided on the apparatus main body 101, and is disposed so as to be movable in the Z-axis direction by a second Z-axis movement unit 138 provided on an upright column 137 that stands up from a moving plate 136 that is moved in the Y-axis direction by the second Y-axis movement unit 135. In the first embodiment, the downward imaging camera 150 is attached to one end of a horizontally extending member 139, the other end of which is attached to an elevating member that is movable in the Z-axis direction by the second Z-axis movement unit 138.
[0057] The second Y-axis moving unit 135 and the second Z-axis moving unit 138 are equipped with a well-known ball screw that is rotatable around its axis, a well-known motor that rotates the ball screw around its axis, and a well-known guide rail that supports a moving plate or a downward imaging camera 150 so that it can move freely in the Y-axis or Z-axis direction.
[0058] The downward imaging camera 150 is equipped with an imaging element that captures an image of the workpiece 200 held on the holding table 1 from below through the transparent plate 2. The imaging element is, for example, a CCD (Charge-Coupled Device) imaging element or a CMOS (Complementary MOS) imaging element. The downward imaging camera 150 captures an image of the workpiece 200 held on the holding table 1 and outputs the obtained image to the control unit 190.
[0059] The machining apparatus 100 also includes an X-axis position detection unit 151 (shown in FIG. 2) for detecting the position of the holding table 1 in the X-axis direction, a Y-axis position detection unit (not shown) for detecting the position of the cutting unit 120 in the Y-axis direction, and a Z-axis position detection unit for detecting the position of the cutting unit 120 in the Z-axis direction. The X-axis position detection unit 151 and the Y-axis position detection unit may be configured with a linear scale parallel to the X-axis direction or the Y-axis direction, and a read head. The Z-axis position detection unit detects the position of the cutting unit 120 in the Z-axis direction using motor pulses. The X-axis position detection unit 151, the Y-axis position detection unit, and the Z-axis position detection unit output the position of the holding table 1 in the X-axis direction and the position of the cutting unit 120 in the Y-axis direction or the Z-axis direction to the control unit 190.
[0060] The processing apparatus 100 also includes a second Y-axis position detection unit 155 (shown in FIG. 2) that detects the position of the downward imaging camera 150 in the Y-axis direction. The second Y-axis position detection unit 155 can be configured with a linear scale parallel to the Y-axis direction and a read head. The second Y-axis position detection unit 155 outputs the position of the downward imaging camera 150 in the X-axis direction and the position of the cutting unit 120 in the Y-axis direction or the Z-axis direction to the control unit 190. The positions of the holding table 1, the cutting unit 120, and the downward imaging camera in each axial direction detected by each position detection unit 151, 155 are determined with reference to a predetermined reference position of the processing apparatus 100. That is, in the processing apparatus 100 according to the first embodiment, each position is determined with reference to a predetermined reference position.
[0061] The processing device 100 also includes a cassette elevator 161 on which a cassette 160 containing multiple workpieces 200 before and after cutting is placed and which moves the cassette 160 in the Z-axis direction, a cleaning unit 162 which cleans the workpieces 200 after cutting, and a transport unit (not shown) which moves the workpieces 200 in and out of the cassette 160 and transports the workpieces 200.
[0062] The control unit 190 controls each of the above-mentioned components of the machining apparatus 100 to cause the machining apparatus 100 to perform machining operations on the workpiece 200. The control unit 190 is a computer having an arithmetic processing device having a microprocessor such as a CPU (central processing unit), a storage device having a memory such as a ROM (read only memory) or RAM (random access memory), and an input / output interface device. The arithmetic processing device of the control unit 190 performs arithmetic processing in accordance with a computer program stored in the storage device, and outputs control signals for controlling the machining apparatus 100 to the above-mentioned components of the machining apparatus 100 via the input / output interface device.
[0063] The processing device 100 is also connected to a display unit (not shown) that is connected to the control unit 190 and is configured with a liquid crystal display device or the like for displaying the status of the processing operation, images, etc., and an input unit that is connected to the control unit 190 and is used by an operator to register processing content information, etc. In the first embodiment, the input unit is configured with at least one of a touch panel provided on the display unit and an external input device such as a keyboard.
[0064] In the processing device 100 configured as described above, the control unit 190 receives and registers processing content information input by an operator, and a cassette 160 containing a plurality of workpieces 200 before cutting is placed in the cassette elevator 161. When the control unit 190 receives an instruction to start the processing operation from the operator, the processing device 100 starts the processing operation, and the control unit 190 closes the first valve 66 and opens the second valve 68 to suction-hold the transparent plate 2 onto the annular support surface 31 of the annular support member 3.
[0065] In the first embodiment, in the processing operation, the control unit 190 of the processing apparatus 100 controls the transport unit to take out one workpiece 200 from the cassette 160, place the workpiece 200 on the holding surface 21 of the holding table 1 positioned in the carry-in / out area 103, and place the frame 210 on the frame holding section 5. In the processing apparatus 100, the control unit 190 suction-holds the workpiece 200 on the holding surface 21 of the holding table 1, and suction-holds the frame 210 on the frame holding section 5, for example, by opening the third valve 69.
[0066] In a processing operation, the control unit 190 of the processing apparatus 100 controls the X-axis moving unit 131 and the second Y-axis moving unit 135 to position the downward imaging camera 150 below the workpiece 200 held on the transparent plate 2 of the holding table 1. In a processing operation, the control unit 190 of the processing apparatus 100 uses the downward imaging camera 150 to image the workpiece 200 from below through the transparent plate 2, and acquires an image for performing alignment of the workpiece 200 and the cutting blade 121.
[0067] In the machining operation, the control unit 190 of the machining apparatus 100 detects the planned dividing line 203 from the image captured by the downward imaging camera 150 and performs alignment. In the machining operation, the control unit 190 of the machining apparatus 100 controls the X-axis moving unit 131 to move the holding table 1 to the machining area 104, and the control unit 190 controls the moving unit 130 and the cutting unit 120 to relatively move the holding table 1 and the cutting blade 121 of the cutting unit 120 along the planned dividing line 203, and while supplying cutting water from the cutting water nozzle 124, causes the cutting blade 121 to cut into the planned dividing line 203 until it reaches the tape 211, thereby cutting the workpiece 200 along the planned dividing line 203.
[0068] In the machining operation, when the machining device 100 cuts all of the planned division lines 203 of the workpiece 200 held by the holding table 1, the control unit 190 controls the X-axis movement unit 131 to move the holding table 1 to the load-unloading area 103 and positions the holding table 1 in the load-unloading area 103. In the machining operation, when the machining device 100 positions the holding table 1 in the load-unloading area 103, the control unit 190 closes the third valve 69, opens the first valve 66, etc., to blow air from the holding surface 21 to remove the workpiece 200 from the holding surface 21, and stops suction holding of the frame 210 of the frame holding section 5.
[0069] In the processing apparatus 100, the control unit 190 controls the transport unit to transport the workpieces 200 to the cleaning unit 162, and after cleaning in the cleaning unit 162, the workpieces 200 are stored in the cassette 160. When the processing apparatus 100 has cut all of the workpieces 200 in the cassette 160, the processing operation ends.
[0070] The holding table 1 according to the first embodiment described above has an annular groove 61 formed in the annular support surface 31 of the annular support member 3 for suction-holding the workpiece 200 on the holding surface 21, and annular suction grooves 7 for suction-holding the transparent plate 2 are provided on both the inner and outer peripheries of the annular groove 61 of the annular support surface 31 of the annular support member 3. Therefore, the holding table 1 can suck out machining fluid that has seeped between the annular support member 3 and the transparent plate 2 using one of the annular suction grooves 7 before it flows inside the annular support member 3, preventing the machining fluid from dripping onto the downward imaging camera 150. As a result, the holding table 1 has the effect of preventing machining fluid from adhering to the lens of the downward imaging camera 150.
[0071] Furthermore, the holding table 1 not only clamps the transparent plate 2 between the annular support member 3 and the presser member 4 but also holds the transparent plate 2 by suction, thereby more firmly fixing the transparent plate 2 and eliminating the risk of the transparent plate 2 floating up due to, for example, an air blow, which would change the height of the holding surface 21. Furthermore, the holding table 1 supports the transparent plate 2 on the annular support surface 31 of the annular support member 3, and has annular suction grooves 7 on both the inner and outer peripheries of the annular groove 61 to hold the transparent plate 2 by suction. Since machining fluid that seeps between the annular support member 3 and the transparent plate 2 can be sucked out by one of the annular suction grooves 7 before it flows inside the annular support member 3, this effectively prevents machining fluid from dripping onto the downward imaging camera 150 without the need for a gasket made of an elastic material such as rubber between the transparent plate 2 and the annular support surface 31 of the annular support member 3.
[0072] When the workpiece 200 is being transported, the machining fluid that drips from the workpiece 200 may be taken into the workpiece flow path 6 when the next workpiece 200 is held by suction, and may leak out when air is blown. However, the holding table 1 of embodiment 1 has annular suction grooves 7 on both sides of the annular groove 61, so that the leaked machining fluid can be sucked up by the annular suction grooves 7.
[0073] Furthermore, since the holding table 1 is provided with annular suction grooves 7 on both the inner and outer peripheries of the annular groove 61 on the annular support surface 31 of the annular support member 3, machining fluid that has seeped into the gap between the annular support member 3 and the transparent plate 2 can be sucked in by the other annular suction groove 7 before it flows outside the annular support member 3, preventing the machining fluid from dripping onto the moving units 131, 135. As a result, the holding table 1 has the effect of suppressing machining fluid from adhering to the moving units 131, 135.
[0074] The present invention is not limited to the above-described embodiment. That is, various modifications can be made without departing from the gist of the present invention. In the above-described embodiment, the front surface 202 of the workpiece 200 is attached to the tape 211, and the processing apparatus 100 captures an image of the workpiece 200 with the downward imaging camera 150. However, in the present invention, the back surface 205 of the workpiece 200 may be attached to the tape 211, and the processing apparatus 100 may capture an image of the workpiece 200 with the upward imaging camera 140. Furthermore, in the present invention, the processing apparatus 100 is not limited to a cutting apparatus that cuts the workpiece 200, and may be various processing apparatuses that perform processing other than cutting on the workpiece 200. [Explanation of symbols]
[0075] 1 Retaining table 2 transparent plate 3 Annular support member (annular support part) 4. Holding member (holding part) 6 Flow path for workpiece 7 Circular suction groove 21 Holding surface 23 Suction groove (opening on holding surface side) 24 Back 25 Rear opening 26 Transparent plate channel 31 Annular support surface 61 Annular groove 62 Air supply source 64 Ejector (suction source) 66 First valve (valve) 68 Second valve (valve) 69 Third valve (valve) 100 Processing equipment 120 Cutting unit (processing means) 124 Cutting water nozzle (machining fluid supply means) 150 downward imaging camera (imaging means) 200 Workpiece
Claims
[Claim 1] A holding table used in a processing device including at least a holding table for holding a workpiece, a processing means for processing the workpiece held by the holding table, a processing fluid supply means for supplying a processing fluid to the workpiece, and an imaging means disposed below the holding table for imaging the workpiece on the holding table, a transparent plate including a holding surface for holding a workpiece; an annular support portion including an annular support surface that supports an outer edge portion of the transparent plate; a pressing portion that holds an outer edge of the transparent plate supported directly on the annular support portion between the pressing portion and the annular support surface of the annular support portion, The transparent plate is formed with a holding surface side opening that opens on the holding surface, a back surface side opening on the back surface of the holding surface, and a transparent plate flow path that extends from the holding surface side opening to the back surface side opening, the annular support portion is formed with an annular groove that is formed to connect to the rear opening of the transparent plate, that opens onto the annular support surface, and that is connected via a valve to a suction source and an air supply source in a switchable manner; the annular groove, together with the transparent plate flow path, constitutes a flow path for a workpiece for sucking or blowing air onto the workpiece; The holding table has a pair of annular suction grooves formed on both the inner and outer periphery of the annular groove, which open onto the annular support surface, are positioned more inward than the pressing portion, and are connected to a suction source to hold the transparent plate by suction.
Citation Information
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