deposition mask

Abstract

To achieve a large size in a vapor deposition mask while suppressing the increase of manufacturing cost.SOLUTION: A vapor deposition mask includes: a mask main body 2 including a vapor deposition pattern 6 consisting of a lot of independent vapor deposition through-holes 5; a vapor deposition mask body 50 constituted with a frame body 3 arranged around the mask main body 2; a support frame 46 arranged on a lower surface side of the vapor deposition mask body 50 and for supporting the plurality of vapor deposition mask bodies 50; and an auxiliary frame 47 arranged on a lower surface side of the support frame 46. The support frame 46 has a frame opening 48 corresponding to the mask opening 11 of the frame body 3 formed therein, and the auxiliary frame 47 supports a peripheral edge of the support frame 46.SELECTED DRAWING: Figure 21

Description

[Technical Field]

[0001] The present invention relates to a deposition mask, and more particularly to a deposition mask having a mask body supported by a frame. The present invention is applicable to a deposition mask that is preferably used when forming a light-emitting layer of an organic EL element, for example. [Background technology]

[0002] Mobile devices with display devices, such as smartphones and tablet terminals, are beginning to adopt lighter, less power-consuming organic light-emitting diode (OLED) displays instead of liquid crystal displays (LCDs) in order to reduce device weight and extend operating times. Organic EL displays are manufactured by forming the light-emitting layer (evaporation layer) of an organic EL element on a substrate (evaporation target) using a deposition mask method. By using a larger deposition mask with more mask bodies, more products can be produced in a single deposition run, reducing the manufacturing cost of organic EL displays. Therefore, manufacturers of organic EL displays are increasingly demanding larger deposition masks.

[0003] A deposition mask used in the deposition mask method is disclosed, for example, in Patent Document 1. In Patent Document 1, the deposition mask is composed of a metal mask (mask body) having multiple mask portions (deposition patterns) and a frame (frame body) made of Invar material that is shaped like a picture frame and fixes and holds the metal mask in a tensed state. The metal mask is joined to the frame by spot welding.

[0004] This type of deposition mask has also been proposed by the present applicant and is disclosed, for example, in Patent Document 1. This deposition mask comprises multiple mask bodies each having a deposition pattern and a reinforcing frame body joined to the mask bodies. The frame body is made of Invar (a material with a low coefficient of linear thermal expansion), and the outer periphery of each mask body is integrally joined with a metal layer formed on the frame body that surrounds the mask body. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2004-323888 [Patent Document 2] Japanese Patent Application Laid-Open No. 2005-15908 Summary of the Invention [Problem to be solved by the invention]

[0006] As with the deposition masks of Patent Documents 1 and 2, the frame that fixes and holds the metal mask and the frame that reinforces the mask body are made of Invar material, which prevents the deposition mask from expanding even in high-temperature working environments during deposition, ensuring the reproducibility and deposition accuracy of the deposition layer (light-emitting layer). However, although the metal mask of the deposition mask of Patent Document 1 is fixed and held in place by the frame in a tensile state, when the deposition mask is made larger, the area of ​​the metal mask that is not supported by the frame increases, causing the metal mask to warp and deform due to its own weight. As a result, a decrease in reproducibility and deposition accuracy is unavoidable.

[0007] In contrast, in the deposition mask of Patent Document 2, each mask body is joined to a frame surrounding the mask body. This means that even when the deposition mask is enlarged, the mask body is less likely to warp due to its own weight, ensuring the reproducibility and deposition accuracy of the deposition layer. However, even frames made of Invar material expand slightly during deposition. Furthermore, the frame is formed from an Invar metal plate, but commonly available metal plate materials typically have thickness variations, resulting in thickness variations across different parts of the frame. This difference in expansion can result in distortion of the entire deposition mask. Distortion in the deposition mask reduces the flatness of the deposition mask, significantly reducing reproducibility and deposition accuracy. This distortion becomes more pronounced as the frame size increases. While distortion due to thickness variations in the base material can be suppressed by controlling the manufacturing process of the metal plate and exclusively manufacturing and using base materials with small thickness variations, this increases the cost of the base material, thereby increasing the manufacturing cost of the deposition mask. Here, the plate thickness deviation means the width of variation in thickness relative to the standard dimensions of the metal plate material.

[0008] An object of the present invention is to provide a deposition mask in which the mask body is supported by a frame, which is capable of suppressing deformation of the mask body even when affected by expansion of each part due to heat, enabling a deposition mask to be made larger, maintaining flatness of the deposition mask, and ensuring excellent heat resistance, as well as high reproducibility and deposition accuracy of the deposition layer. [Means for solving the problem]

[0009] The deposition mask of the present invention includes a deposition mask body 50 including a mask body 2 having a deposition pattern 6 consisting of a large number of independent deposition through-holes 5 and a frame body 3 arranged around the mask body 2, a support frame 46 arranged on the underside of the deposition mask body 50 to support a plurality of the deposition mask bodies 50, and an auxiliary frame 47 arranged on the underside of the support frame 46. The support frame 46 has frame openings 48 formed therein that correspond to the mask openings 11 of the frame body 3. The periphery of the support frame 46 is supported by the auxiliary frame 47.

[0010] The frame body 3 comprises an outer peripheral frame 10, and vertical and horizontal frames 12 and 13 that define a mask opening 11 within the outer peripheral frame 10, and the entire vertical and horizontal frames 12 and 13 are supported by a support frame 46.

[0011] The frame opening 48 is formed in an opening shape that is slightly larger than the mask opening 11 .

[0012] The frame body 3, the support frame 46, and the auxiliary frame 47 are integrated by welding.

[0013] Welding points 49 are provided at the four corners and at the peripheral edges of the frame body 3 on the extensions of the vertical frames 12 and horizontal frames 13.

[0014] Each deposition mask body 50 is formed in a strip shape, and the outer shape of the support frame 46 is formed in a rectangular shape, and the multiple deposition mask bodies 50 are supported by the support frame 46 in a state where they are arranged side by side along the short length direction of the strip. The four peripheral edges of the support frame 46 are supported by auxiliary frames 47 in the shape of a rectangular picture frame.

[0015] The deposition mask of the present invention includes a mask body 2 having a deposition pattern 6 consisting of a large number of independent deposition through-holes 5, and a frame body 3 arranged around the mask body 2. A support frame 46 is fixed to the lower surface side of the frame body 3. The support frame 46 is formed with a frame opening 48 corresponding to the mask opening 11 of the frame body 3, and the frame opening 48 is formed with an opening shape slightly larger than the mask opening 11. An auxiliary frame 47 is also fixed to the lower surface side of the support frame 46.

[0016] The frame body 3 includes a peripheral frame 10, and vertical frames 12 and horizontal frames 13 that define a mask opening 11 within the peripheral frame 10. The entire vertical frames 12 and horizontal frames 13 are supported by a support frame 46, and the auxiliary frame 47 is formed in a frame shape, and the periphery of the support frame 46 is supported by the auxiliary frame 47.

[0017] The frame body 3, the support frame 46, and the auxiliary frame 47 are integrated by welding, and the welding points 49 are provided at the four corners and on the peripheral portions of the frame body 3 on the extension lines of the vertical frames 12 and horizontal frames 13.

[0018] The mask body 2 and the frame body 3 are characterized by being integrally joined via a metal layer 8.

[0019] A plurality of frame bodies 3·3 are stacked, and the frame bodies 3·3 adjacent to each other in the stacking direction are joined together via an adhesive layer 19.

[0020] The deposition mask according to the deposition mask manufacturing method of the present invention includes a mask body 2 having a deposition pattern 6 consisting of a large number of independent deposition through-holes 5, and a frame 3 arranged around the mask body 2. The deposition mask manufacturing method is characterized by including the steps of: preparing the mask body 2 and the frame 3; integrally joining the mask body 2 and the frame 3; joining a support frame 46 to the lower surface of the frame 3; and joining an auxiliary frame 47 to the lower surface of the support frame 46.

[0021] The process for preparing the mask body 2 and the frame body 3 includes a frame body forming process for forming the frame body 3, a primary patterning process for forming a primary pattern resist 29 having a resist body 29a corresponding to the vapor deposition through-holes 5 on the surface of the matrix 24, and a first electroforming process for electroforming an electrodeposited metal on the surface of the matrix 24 that is not covered by the resist body 29a to form a primary electroforming layer 30, and the process for integrally bonding the mask body 2 and the frame body 3 is characterized in that the mask body 2 and the frame body 3 are integrally bonded via a metal layer formed by electroforming.

[0022] A plurality of deposition mask bodies 50 are prepared, each having a mask body 2 and a frame body 3 integrally joined via a metal layer, and the deposition mask bodies 50 are joined one by one to a support frame 46, and then an auxiliary frame 47 is joined to the side of the support frame 46 opposite to the side to which the deposition mask bodies 50 are fixed.

[0023] The frame body 3, the support frame 46, and the auxiliary frame 47 are joined together by welding, and the welded points 49 are located at the four corners and on the peripheral edges of the vertical and horizontal frames 12 and 13 of the frame body 3. [Effects of the Invention]

[0024] According to the deposition mask of the present invention, the entire frame 3 (vertical frames 12 and horizontal frames 13) is supported by the support frame 46, which further enhances the structural strength and rigidity of the entire deposition mask, prevents the deposition mask from sagging and deforming, and maintains flatness, thereby improving the reproducibility and deposition accuracy of the deposition layer. In addition, by supporting the support frame 46 (periphery) with the auxiliary frame 47, the reproducibility and deposition accuracy of the deposition layer can be further improved. [Brief explanation of the drawings]

[0025] [Figure 1] FIG. 2 is a longitudinal sectional front view showing a main part of a deposition mask according to a first reference example. [Figure 2] FIG. 2 is a perspective view showing the entire vapor deposition mask according to the first reference example. [Figure 3] FIG. 2 is a plan view showing a main part of a deposition mask according to a first reference example. [Figure 4] FIG. 10 is a plan view of a frame of a vapor deposition mask according to a first reference example. [Figure 5] FIG. 10 is an explanatory view showing a frame forming step in the method for manufacturing a deposition mask according to the first reference example. [Figure 6] FIG. 10 is an explanatory view showing a modified example of a frame forming step in the method for manufacturing a deposition mask according to the first reference example. [Figure 7] FIG. 10 is a plan view showing a modified example of a frame of the deposition mask according to the first reference example. [Figure 8] 10A and 10B are explanatory views showing a primary patterning step and a first electroforming step in a method for manufacturing a deposition mask according to a first reference example. [Figure 9] FIG. 10 is an explanatory view showing an activation treatment step in the method for manufacturing a deposition mask according to the first reference example. [Figure 10] 10A to 10C are explanatory views showing a secondary patterning step, a frame providing step, a second electroforming step, and a peeling step in the method for manufacturing a vapor deposition mask according to the first reference example. [Figure 11]FIG. 10 is a vertical sectional front view showing a main part of a deposition mask according to a second reference example. [Figure 12] 10A to 10C are explanatory views showing a frame providing step, a second electroforming step, and a peeling step of a deposition mask according to a second reference example. [Figure 13] FIG. 11 is a vertical sectional front view showing a main part of a deposition mask according to a third reference example. [Figure 14] 10A and 10B are explanatory views showing a primary patterning step and a first electroforming step in a method for manufacturing a deposition mask according to a third reference example. [Figure 15] 10A and 10B are explanatory views showing a secondary patterning step, a frame providing step, a second electroforming step, and a peeling step in the method for manufacturing a deposition mask according to a third reference example. [Figure 16] FIG. 11 is a vertical sectional front view showing a main part of a deposition mask according to a fourth reference example. [Figure 17] 10A and 10B are explanatory views showing a method for manufacturing a deposition mask according to a fourth reference example. [Figure 18] FIG. 11 is a longitudinal sectional front view showing a deposition mask according to a fifth reference example. [Figure 19] FIG. 11 is an exploded perspective view of a deposition mask according to a fifth reference example. [Figure 20] FIG. 11 is a plan view of a deposition mask according to a fifth reference example. [Figure 21] FIG. 1 is an exploded perspective view showing a deposition mask according to a first embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0026] 1 to 10 show a vapor deposition mask and a manufacturing method thereof according to a first reference example. Note that the dimensions such as thickness and width in Fig. 1 to Fig. 10 of this reference example are not shown as actual dimensions but are shown as schematic representations. The same applies to the following reference examples and the drawings of the first embodiment.

[0027] As shown in Figures 2 and 3, the deposition mask 1 includes a plurality of mask bodies 2 and a reinforcing frame body 3 arranged around the mask bodies 2. The mask bodies 2 are formed in a rectangular shape with rounded corners, and include a pattern formation region 4 therein. In the pattern formation region 4, a deposition pattern 6 is formed, which is made up of a large number of independent deposition through-holes 5 through which a deposition material from a deposition source passes. As shown in Figure 3, the mask bodies 2 are provided with a large number of connecting through-holes 7 along the entire periphery 4a of the pattern formation region 4.

[0028] The mask body 2 is formed by electroforming using an electrodeposited metal material such as nickel or a nickel alloy such as nickel-cobalt. The thickness of the mask body 2 is preferably in the range of 3 to 20 μm, and is set to 8 μm in this example. The dimensions of the mask body 2 in plan view are set to 108 mm in the longitudinal direction and 62 mm in the lateral direction, and 30 mask bodies 2 are arranged in a matrix of 6 rows and 5 columns. When the deposition mask 1 of this example is used as a deposition mask for an organic EL element, the deposition pattern 6 is formed to correspond to the light-emitting layer of the organic EL element.

[0029] As shown in FIG. 4 , the frame 3 includes a peripheral frame 10 and lattice-like vertical and horizontal frames 12 and 13 that define a mask opening 11 within the peripheral frame 10. The vertical frames 12 are arranged parallel to the long sides of the mask body 2, and the horizontal frames 13 are arranged parallel to the short sides of the mask body 2. The frame 3 can be made of various materials, including metals such as aluminum and iron, and resins, and can have a variety of shapes and dimensions. However, the frame 3 in this example is made of a metal plate material with a low coefficient of linear thermal expansion, made of Invar, a nickel-iron alloy, and is formed to be significantly thicker than the mask body 2. The thickness is in the range of 0.5 to 5 mm, and in this example, it is set to 1.0 mm. Furthermore, in a plan view, the dimensions of the frame 3 are set to 460 × 730 mm, and the dimensions of the mask opening 11 are set to 110 mm in the longitudinal direction and 64 mm in the lateral direction. The frame 3 may be made of Super Invar, a nickel-iron-cobalt alloy, ceramic, etc. The reason for using Invar, Super Invar, or ceramic as the material for forming the frame 3 is that they have an extremely small coefficient of linear thermal expansion, which effectively suppresses dimensional changes in the mask body 2 due to the heat influence during the deposition process.

[0030] Assuming that the width dimension of the vertical frame 12 is W1 and the width dimension of the horizontal frame 13 is W2, the width dimension W1 of the vertical frame 12 and the width dimension W2 of the horizontal frame 13 are set to satisfy the inequality (W1≦W2≦W1×1.1). In this reference example, the width dimension W1 of the vertical frame 12 is set to 10 mm, and the width dimension W2 of the horizontal frame 13 is set to 10.64 mm. By setting the width dimension W2 of the horizontal frame 13 appropriately larger than the width dimension W1 of the vertical frame 12, the cross-sectional area of ​​the horizontal frame 13 can be made larger than that of the vertical frame 12. Furthermore, the length of the horizontal frame 13 is shorter than that of the vertical frame 12. Therefore, the horizontal frame 13 firmly supports the vertical frame 12, preventing the long vertical frame 12 from sagging and deforming due to its own weight. Therefore, deformation of the frame body 3 due to its own weight can be prevented, enabling the deposition mask 1 to be enlarged. Furthermore, the flatness of the deposition mask 1 can be maintained, resulting in high accuracy in reproducing the deposition pattern and deposition precision. Furthermore, because the rigidity of the vertical frames 12 and the horizontal frames 13 can be made approximately uniform overall, when an external force that causes deflection and deformation of the deposition mask 1 is applied, the external force can be evenly dispersed to prevent localized concentration, effectively preventing deformation and damage to the deposition mask 1. In addition, because the width dimension W2 of the horizontal frames 13 is set to (W2≦W1 × 1.1), an increase in the weight of the frame body 3 due to an unnecessarily large cross-sectional area of ​​the horizontal frames 13 is suppressed, and the structural strength and rigidity of the frame body 3 can be increased while preventing an unnecessary increase in the weight of the entire deposition mask.

[0031] The frame 3 may be cut from a single metal plate. However, in this embodiment, as shown in FIGS. 1 and 5(a), it is composed of an upper frame 16 and a lower frame 17 formed to the same shape and thickness, and the upper frame 16 and the lower frame 17 are joined together via an adhesive layer 18. Specifically, as shown in FIG. 5(b), the upper frame 16 and the lower frame 17 are joined with their protruding arc surfaces facing each other, resulting in a flat frame 3 with the two-dimensional curved warp offset. Note that the two-dimensional curved warp is a slight warp resulting from the metal plate material, and it may also be a three-dimensional curved warp. In this embodiment, the adhesive layer 18 is a sheet-like uncured photosensitive dry film resist. After joining the upper frame 16 and the lower frame 17, the unnecessary portions of the adhesive layer 18 are removed. Various commercially available adhesives may be used for the adhesive layer 18. The upper and lower frames 16 and 17 that make up the frame 3 are made the same thickness so that they can be joined together in a state where the two-dimensional curved warp is offset, making it easier to form the frame 3 flat. The convex arc surfaces may be concave arc surfaces, or they may include both. The upper and lower frames 16 and 17 may have different thicknesses as long as they can be joined together in a flat state with the two-dimensional curved warp offset. Joining the upper and lower frames 16 and 17 in this way so that the two-dimensional curved warp is offset and the frame 3 is formed flat eliminates slight warp inherent in the metal plate, further improving flatness and ensuring better reproducibility and deposition accuracy of the deposition layer.

[0032] As described above, by joining the upper frame 16 and the lower frame 17 in a state where the two-dimensional curved warp of the frames is offset and forming the frame body 3 into a flat shape, the slight warp caused by the metal plate material can be eliminated, further improving flatness and ensuring better reproduction accuracy and deposition accuracy of the vapor deposition layer.

[0033] 6 and 7, the frame body 3 can be formed by stacking a pair (or multiple) of frame bodies 3·3 formed by the above-mentioned method, and joining adjacent frame bodies 3·3 in the stacking direction via an adhesive layer 19. The thicknesses of the upper and lower frame bodies 3 may be the same or different. When the thicknesses of the upper and lower frame bodies 3·3 are the same, for example, the thicknesses of the upper and lower frames 16·17 constituting the upper frame body 3 and the thicknesses of the upper and lower frames 16·17 constituting the lower frame body 3 can be set to 0.25 mm. When the thicknesses of the upper and lower frame bodies 3·3 are different, for example, the thicknesses of the upper and lower frames 16·17 constituting the upper frame body 3 can be set to 0.2 mm each, and the thicknesses of the upper and lower frames 16·17 constituting the lower frame 3 can be set to 0.3 mm each.

[0034] In FIG. 1 , reference numeral 8 denotes a metal layer formed on the upper surface of the outer periphery 4 a of the pattern formation region 4 of the mask body 2. The metal layer 8 is formed by plating (electroforming) nickel. Each mask body 2 is disposed in a mask opening 11 of the frame 3, and the outer periphery 4 a of the pattern formation region 4 of the mask body 2 is inseparably bonded to the frame 3 by the metal layer 8 formed by plating (electroforming). As shown in FIGS. 1 and 4 , the metal layer 8 has a hat-shaped cross section and extends over the upper surface of the outer periphery 4 a of the pattern formation region 4, the upper surface of the frame 3 and the side surface facing the pattern formation region 4, and the gap between the mask body 2 and the frame 3. The metal layer 8 is also formed inside the bonding through-holes 7, thereby improving the bonding strength between the mask body 2 and the frame 3. Like the mask body 2, the metal layer 8 can be formed from nickel, copper, or other electrodeposited metals or alloys in addition to nickel alloys.

[0035] Fig. 5 shows a frame forming step for forming a reinforcing frame 3. Fig. 8 to Fig. 10 show a manufacturing method of the deposition mask 1 according to this reference example using the frame 3 obtained in the frame forming step.

[0036] (Frame formation process) First, a cutting process is performed in which a metal plate is cut to the size of the upper frame 16 and the lower frame 17, for example, using a wire electric discharge machine or the like, which has little thermal effect on the metal plate. Next, a mask opening forming process is performed in which the cut upper frame 16 and lower frame 17 are etched or laser processed to form multiple openings that will become mask openings 11, as shown in FIG. 5(a). Next, a joining process is performed in which the upper frame 16 and the lower frame 17, which are derived from the metal plate, are joined with an adhesive layer 18 with their protruding surfaces facing each other, as shown in FIG. 5(b), to form the frame body 3 into a flat shape with the two-dimensional curved surface warpage offset. The adhesive layer 18 is made of a sheet of uncured photosensitive dry film resist.

[0037] Next, as shown in Figure 5(c), a fixing process is performed in which the mask is passed through upper and lower rolling rolls 22, 22 arranged with a predetermined roll spacing, and then clamped. Furthermore, unnecessary portions of the adhesive layer 18 (portions exposed outside the mask opening 11 and the peripheral frame 10) are removed (developed), thereby obtaining the frame 3. The reason for using a sheet-like uncured photosensitive dry film resist for the adhesive layer 18 is that uncured photosensitive dry film resist has adhesive properties and is also used in the primary patterning process described below. This eliminates the need for a commercially available adhesive, thereby reducing the manufacturing cost of the deposition mask 1. In the cutting process, the upper and lower frames 16, 17 can also be cut out using a laser cutting machine while the metal plate is cooled.

[0038] Here, for example, metal plates of different thicknesses are prepared, and the above-mentioned steps are performed to produce a pair of frames 3·3 as shown in Fig. 6(a), and these frames 3·3 are then stacked as shown in Fig. 6(b) and joined together with an adhesive layer 19 made of a sheet of uncured photosensitive dry film resist. After that, as shown in Fig. 6(c), a lamination step is performed in which the frames are passed between upper and lower rolling rolls 22·22 arranged with a predetermined distance between the rolls to press them together, thereby obtaining a pair of stacked frames 3·3 as shown in Fig. 7. In this case, the pair of stacked frames 3·3 may be made by stacking frames 3·3 of the same thickness.

[0039] (Patterning pre-stage formation process) As shown in Figure 8(a), a photoresist layer 25 is formed on the surface of a conductive matrix 24 made of, for example, stainless steel or brass. This photoresist layer 25 is formed by laminating one or more negative-type photosensitive dry film resist sheets and thermocompressing them to a predetermined thickness. Next, a pattern film 26 (glass mask) having light-transmitting holes 26a corresponding to the vapor deposition through-holes 5 and the bonding through-holes 7 (primary patterning) is adhered to the photoresist layer 25, thereby obtaining a patterning precursor 27.

[0040] (Preheating process) The patterning pre-stage body 27 (particularly the matrix 24 and pattern film 26) is preheated to the temperature inside the oven of the ultraviolet irradiation device (exposure device) during the exposure operation, for example, using a heater plate, a preheating oven, etc. At this time, it is advisable to preheat the oven of the ultraviolet irradiation device to the temperature inside the oven during the exposure operation in parallel with the preheating of the patterning pre-stage body 27.

[0041] (Primary patterning process) After preheating the UV irradiation furnace and the patterning pre-stage 27, the patterning pre-stage 27 is placed in the UV irradiation furnace. As shown in Figure 8(a), the UV lamp 28 is used for UV exposure, followed by development and drying. The unexposed portions are then dissolved and removed, forming a primary pattern resist 29 on the matrix 24, as shown in Figure 8(b). This preheating of the UV irradiation furnace and the patterning pre-stage 27 to the furnace temperature required for exposure prevents the patterning pre-stage 27 from expanding due to UV irradiation, resulting in misalignment of the relative positions of the three elements 24, 25, and 26 during exposure. This allows the primary pattern resist 29 to be positioned accurately and accurately on the matrix 24, contributing to improved reproducibility of the deposition layer and deposition accuracy.

[0042] (First electroforming process) Next, the matrix 24 was placed in an electroforming tank, and as shown in Figure 8(c), a nickel electrodeposited metal was primarily electroformed on the surface of the matrix 24 not covered by the resist layer 29a, within the height range of the resist layer 29a, to form a primary electroformed layer 30, i.e., a layer that would become the mask body 2. Next, the resist layer 29a was dissolved and removed, yielding the mask body 2, as shown in Figure 8(d), which has a deposition pattern 6 consisting of numerous independent deposition through-holes 5 and connecting through-holes 7. In Figure 8(d), reference numeral 30a denotes the primary electrodeposited layer formed between the mask bodies 2, which will be removed in the peeling process described below.

[0043] (Activation treatment process) Here, an activation process can be performed to improve the bonding strength between the mask body 2 (primary electroformed layer 30) and the metal layer 8. Specifically, as shown in FIG. 9(a), a photoresist layer 33 is formed over the entire surface of the primary electroformed layer 30 / 30a. Then, a pattern film 34 having light-transmitting holes 34a corresponding to the peripheral portions of the bonding through-holes 7 is adhered to the surface. The pattern film 34 is then placed in a furnace of an ultraviolet irradiation device, exposed to ultraviolet light from an ultraviolet lamp 28, and then developed and dried. The photoresist layer 33 here is formed by laminating one or more sheets of negative-type photosensitive dry film resist using thermocompression bonding, as described above, to a predetermined thickness. Next, the unexposed portions of the photoresist layer 33 are dissolved and removed to obtain a pattern resist 35 having openings 35a corresponding to the peripheral portions of the bonding through-holes 7, as shown in FIG. 9(b). In other words, the pattern resist 35 is formed so that only the peripheral portions of the bonding through-holes 7 are exposed to the surface.

[0044] Next, the portion of the primary electroformed layer 30 exposed through the opening 35a of the pattern resist 35, i.e., the primary electroformed layer 30 around the bonding through-hole 7, was subjected to an activation treatment such as acid treatment or electrolysis, and then the pattern resist 35 was dissolved and removed as shown in FIG. 9(c). In FIG. 9(c), reference numeral 36 indicates the activated portion. Specifically, the activation treatment was performed on the inner wall surface of the bonding through-hole 7 and the upper surface of the primary electroformed layer 30 around the bonding through-hole 7. Performing the activation treatment around the bonding through-hole 7 in this manner significantly improves the bond strength between the primary electroformed layer 30 and the metal layer 8 formed in the second electroforming process described below, compared to when no activation treatment is performed. Alternatively, instead of the activation treatment, a thin layer may be formed on the primary electroformed layer 30 around the bonding through-hole 7 using strike nickel plating, matte nickel plating, or the like. This also improves the bond strength between the portion around the bonding through-hole 7 and the metal layer 8.

[0045] (Secondary patterning process and frame placement process) As shown in Figure 10(a), a photoresist layer 38 is formed on the entire surface of the matrix 24, including the areas where the primary electroforming layers 30 and 30a are to be formed. This photoresist layer 38 is formed by laminating one or more negative-type photosensitive dry film resist sheets and thermocompressing them together to a predetermined thickness, as described above. Next, a pattern film 39 having light-transmitting holes 39a corresponding to the pattern-forming region 4 is tightly attached to the matrix 24, and the matrix 24 is then placed in the oven of an ultraviolet irradiation device. The matrix 24 is then exposed to ultraviolet light from the ultraviolet lamp 28, and then developed and dried. In this state, the photoresist layer 38 is obtained, with the portion (38a) corresponding to the pattern-forming region 4 exposed and the remaining portion (38b) remaining unexposed (see Figure 10(b)).

[0046] Next, as shown in FIG. 10(b), the frame 3 was aligned and placed on the matrix 24 so as to surround the primary electroformed layer 30. Here, the frame 3 was temporarily fixed onto the matrix 24 (primary electroformed layer 30a) by utilizing the adhesive properties of the unexposed photoresist layer 38b. Furthermore, as shown in FIG. 10(c), the unexposed photoresist layer 38b exposed on the surface was dissolved and removed to form a secondary pattern resist 40 having a resist body 40a covering the pattern formation region 4. At this time, the unexposed photoresist layer 38b on the underside of the frame 3 is covered by the frame 3 and remains on the matrix 24 without being dissolved and removed. Alternatively, a frame 3 with an adhesive layer formed thereon may be prepared, and the frame 3 may be placed on the matrix 24 before or after forming the secondary pattern resist 40.

[0047] (Second electroforming process) 10(d), a metal layer 8 was formed by electroforming a nickel electrodeposited metal on the upper surface of the primary electroformed layer 30 facing the outer peripheral edge 4a of the pattern formation region 4, on the surface of the frame 3, on the surface of the matrix 24 exposed between the frame 3 and the primary electroformed layer 30, and in the bonding through-holes 7. This allows the primary electroformed layer 30 and the frame 3 to be bonded inseparably by the metal layer 8.

[0048] (peeling process) The primary electroformed layer 30 and the metal layer 8 were peeled off from the matrix 24, and then the primary electroformed layer 30a located on the lower surface of the frame 3 was peeled off from both the layers 30 and 8. Finally, the secondary pattern resist 40 and the unexposed photoresist layer 38b were removed to obtain the deposition mask 1 shown in FIG.

[0049] In this reference example, the temperature range of the electroforming liquid in the first electroforming step was set to a temperature range higher than room temperature (normal temperature) and the temperature range of the electroforming liquid in the second electroforming step. This allows the mask body 2 to be held relative to the frame 3 under tension that applies stress in an inward contraction direction to the mask body 2. Therefore, the expansion of the mask body 2 that occurs when the temperature rises in the vapor deposition furnace is absorbed by this tension, preventing the mask body 2 from shifting position relative to the frame 3 or wrinkling due to the expansion. Another method for applying tension to the mask body 2 that applies stress in an inward contraction direction is to use a matrix 10 made of a material with a low coefficient of linear thermal expansion (e.g., Invar, 42 alloy, or SUS430) and utilize the difference in thermal expansion coefficient between the matrix 10 and the primary electroformed layer 30 (electrodeposited metal) due to the temperature difference caused by the increase in the temperature inside the electroforming tank during the formation of the primary electrodeposition layer 15. Alternatively, this can be achieved by adjusting the carbon content of the additive (brightener) added to the electroforming tank when forming the primary electrodeposition layer 30 that will become the mask body 2. Furthermore, by adjusting the carbon content of the additive (brightener) added to the electroforming tank during the second electroforming step, the metal layer 8 can be formed under tension that applies stress that pulls the mask body 2 (primary electroformed layer 30) toward the frame 3. Therefore, the expansion of the mask body 2 due to the temperature increase during vapor deposition can be absorbed by this tension, preventing the mask body 2 from shifting position relative to the frame 3 or wrinkling due to the expansion.

[0050] 11 and 12 show a vapor deposition mask and a manufacturing method thereof according to a second reference example. This reference example differs from the first reference example in that, as shown in Fig. 11, in order to prevent distortion of the frame 3 resulting from internal stress in the metal layer 8 that bonds the mask body 2 and the frame 3 together inseparably, the metal layer 8 is not formed on the upper surface of the frame 3 except on the periphery of the mask opening 11, but is divided to provide stress relaxation portions 42, and a pair of frame bodies 3·3 are stacked, and adjacent frame bodies 3·3 in the stacking direction are joined together via an adhesive layer 19.

[0051] The frame 3 according to the first reference example is surrounded by a metal layer 8 on three sides, including its top surface and both edges of the mask opening 11 that are continuous with the top surface. Therefore, if the metal layer 8 is formed by electroforming while internal stress is present, the internal stress may cause distortion in the frame 3, adversely affecting the flatness of the deposition mask 1. However, by providing the stress relief portions 42 as in this reference example, the internal stress of the metal layer 8 can be released by the stress relief portions 42, preventing distortion in the frame 3. Note that "dividing the metal layer 8" here means that the metal layer 8 need not be formed in a continuous manner across the entire top surface of the frame 3, and this aspect is not limited to this reference example. Since the other aspects are the same as those of the first reference example, the same components are denoted by the same reference symbols and their description will be omitted. This also applies to the following reference examples and the first embodiment.

[0052] In the method for manufacturing the deposition mask 1 according to this reference example, in the final stage of the frame body forming step, a step of forming a resist body 42a corresponding to the stress relaxation portion 42 on the upper surface of the frame body 3 is performed, and the resist body 42a is provided on the upper surface of the frame body 3. The subsequent patterning pre-stage body forming step to the secondary patterning step are similar to the methods shown in FIGS. 8(a) to 8(d), 9(a) to 9(c), and 10(a) described in the first reference example.

[0053] (Frame installation process) As shown in FIG. 12(a), a frame 3 provided with a resist body 42a was positioned on the matrix 24 so as to surround the primary electroforming layer 30. Here, the frame 3 was temporarily fixed to the matrix 24 by utilizing the adhesiveness of the unexposed photoresist layer 38b. Then, as shown in FIG. 12(b), the unexposed photoresist layer 38b exposed on the surface was dissolved and removed to form a secondary pattern resist 40 having a resist body 40a covering the pattern formation region 4. At this time, the unexposed photoresist layer 38b on the underside of the frame 3 was covered by the frame 3 and was not dissolved and removed, remaining on the matrix 24.

[0054] (Second electroforming process) The matrix 24 was placed in an electroforming tank, and as shown in FIG. 12( c), a nickel electrodeposited metal was electroformed on the upper surface of the primary electroformed layer 30 facing the outer periphery 4 a of the pattern formation region 4, the surface of the frame 3 not covered with the resist layer 42 a, the surface of the matrix 24 exposed between the frame 3 and the primary electroformed layer 30, and the inside of the bonding through-holes 7 to form a metal layer 8. This allows the primary electroformed layer 30 and the frame 3 to be inseparably bonded together by the metal layer 8. In this reference example, the temperature ranges of the electroforming liquid used in the first electroforming step and the second electroforming step were set to be approximately the same (temperature difference of ±3°C). This minimizes the thermal expansion of the primary electroformed layer 30, i.e., the mask body 2, when bonded to the frame 3. This improves the positional accuracy of the bonding position of the mask body 2 relative to the frame 3, resulting in a deposition mask with higher accuracy in the reproducibility and deposition of the deposition layer. In both the first electroforming step and the second electroforming step, the lower the temperature of the electroforming liquid in the electroforming tank is set, the more effectively the thermal expansion of the primary electroformed layer 30 and the metal layer 8 can be suppressed.

[0055] (peeling process) The primary electroformed layer 30 and the metal layer 8 were peeled off from the matrix 24, and then the primary electroformed layer 30a located on the lower surface of the frame 3 was peeled off from these layers 30 and 8. Finally, the secondary pattern resist 40, the resist body 42a, and the unexposed photoresist layer 38b were removed to obtain the deposition mask 1 provided with the stress relaxation portions 42 shown in FIG.

[0056] 13 to 15 show a vapor deposition mask and a manufacturing method thereof according to a third reference example. This reference example differs from the first reference example in that, as shown in FIG. 13, the bonding through-holes 7 in the mask body 2 through which the metal layer 8 penetrates are eliminated. The upper frame 16 and lower frame 17 constituting the frame body 3 in this reference example are formed using a metal plate as the base material, and the frame body 3 has the same thickness dimension as that of the first reference example.

[0057] 14 and 15 show a manufacturing method of the deposition mask 1 according to this reference example, and first, a frame body forming step is performed to form a reinforcing frame body 3. Note that the frame body forming step is as shown in FIG. 5 of the first reference example, and therefore, description thereof will be omitted.

[0058] (Patterning pre-stage formation process) As shown in Figure 14(a), a photoresist layer 25 is formed on the surface of a conductive matrix 24 made of, for example, stainless steel or brass. This photoresist layer 25 is formed by laminating one or more negative-type photosensitive dry film resist sheets and thermocompressing them to a predetermined thickness. Next, a pattern film 26 (glass mask) having light-transmitting holes 26a corresponding to the vapor deposition through-holes 5 is adhered to the photoresist layer 25, thereby obtaining a patterning precursor 27.

[0059] (Preheating process) The patterning pre-stage body 27 is preheated to the temperature inside the oven of the ultraviolet irradiation device (exposure device) during the exposure operation, for example, using a heater plate, a preheating oven, etc. At this time, in parallel with the preheating of the patterning pre-stage body 27, it is advisable to preheat the inside of the oven of the ultraviolet irradiation device to the temperature inside the oven during the exposure operation.

[0060] (Primary patterning process) After preheating the UV irradiation furnace and the patterning pre-stage 27, the patterning pre-stage 27 is placed in the UV irradiation furnace. As shown in Figure 14(a), the UV lamp 28 is used for UV exposure, followed by development and drying. The unexposed portions are then dissolved and removed, forming a primary pattern resist 29 on the matrix 24, as shown in Figure 14(b), with resist layers 29a corresponding to the deposition through-holes 5 (primary patterning). By preheating the UV irradiation furnace and the patterning pre-stage 27 to the temperature required for exposure, the patterning pre-stage 27 is heated and expanded by UV irradiation, eliminating the problem of misalignment of the three elements 24, 25, and 26 during exposure. This allows the primary pattern resist 29 to be positioned accurately and accurately on the matrix 24, contributing to improved deposition accuracy and deposition precision.

[0061] (First electroforming process) Next, the matrix 24 was placed in an electroforming tank, and as shown in Figure 14(c), a nickel metal electrodeposit was primarily electroformed on the surface of the matrix 24 not covered by the resist layer 29a, within the height range of the resist layer 29a, to form a primary electroformed layer 30, i.e., a layer that would become the mask body 2. Next, the resist layer 29a was dissolved and removed, yielding the mask body 2, as shown in Figure 14(d), which has a vapor deposition pattern 6 consisting of numerous independent vapor deposition through-holes 5. Alternatively, as in the first reference example, the primary electroformed layer 30a may be formed between the mask bodies 2, and the frame 3 may be placed on the primary electroformed layer 30a.

[0062] (Secondary patterning process and frame placement process) As shown in FIG. 15( a), a photoresist layer 38 was formed on the entire surface of the matrix 24, including the area where the primary electroforming layer 30 was to be formed. This photoresist layer 38 was formed by laminating one or more negative-type photosensitive dry film resist sheets and thermocompressing them together to a predetermined thickness, as described above. Next, a pattern film 39 having light-transmitting holes 39a corresponding to the pattern-forming region 4 was placed in close contact with the matrix 24, and the matrix 24 was then placed in the oven of an ultraviolet irradiation device and exposed to ultraviolet light from an ultraviolet lamp 28. In this state, the photoresist layer 38 was obtained with the portion (38a) corresponding to the pattern-forming region 4 exposed and the remaining portion (38b) unexposed (see FIG. 15( b)). In this example, prior to the secondary patterning step, activation treatment or strike plating was performed on the outer periphery 4a of the pattern-forming region 4 of the primary electroforming layer 30 to improve the bonding strength between the primary electroforming layer 30 and the metal layer 8, which will be described later.

[0063] Next, as shown in Figure 15(b), the frame 3 was positioned on the matrix 24 so as to surround the primary electroformed layer 30. Here, the frame 3 was temporarily fixed onto the matrix 24 by utilizing the adhesive properties of the unexposed photoresist layer 38b. Then, as shown in Figure 15(c), the unexposed photoresist layer 38b exposed on the surface was dissolved and removed to form a secondary pattern resist 40 having a resist body 40a covering the pattern formation region 4. At this time, the unexposed photoresist layer 38b on the underside of the frame 3 is covered by the frame 3 and is not dissolved and removed, remaining on the matrix 24.

[0064] (Second electroforming process) 15(d), a metal layer 8 was formed by electroforming a nickel electrodeposited metal onto the upper surface of the primary electroformed layer 30 facing the outer peripheral edge 4a of the pattern formation region 4, the surface of the frame 3, and the surface of the matrix 24 exposed between the frame 3 and the primary electroformed layer 30. This allows the primary electroformed layer 30 and the frame 3 to be inseparably bonded together by the metal layer 8.

[0065] (peeling process) The primary electroformed layer 30 and the metal layer 8 were peeled off from the matrix 24, and then the primary electroformed layer 30a located on the lower surface of the frame 3 was peeled off from both the layers 30 and 8. Finally, the secondary pattern resist 40 and the unexposed photoresist layer 38b were removed to obtain the deposition mask 1 shown in FIG.

[0066] 16 and 17 show a vapor deposition mask and a manufacturing method thereof according to a fourth reference example. In this reference example, as shown in FIG. 16, the mask body 2 and the frame body 3 are inseparably joined by a metal layer 8, but this reference example differs from the previous reference examples in that the primary electroforming layer 30 constituting the mask body 2 and the metal layer 8 are integrally formed. In this way, forming the metal layer 8 integrally with the mask body 2 eliminates the need to separately form the metal layer 8 and then join the mask body 2 and the frame body 3. This eliminates the steps required for manufacturing and shortens the time, thereby reducing the manufacturing cost of the vapor deposition mask 1.

[0067] 17 shows a manufacturing method of the deposition mask 1 according to this reference example, and first, a frame body forming step is performed to form a reinforcing frame body 3. Note that the frame body forming step is as shown in FIG. 5 described in the first reference example, and therefore, description thereof will be omitted.

[0068] (Patterning pre-stage formation process) First, as shown in Figure 17(a), a photoresist layer 25 is formed on the surface of a conductive matrix 24 made of, for example, stainless steel or brass. This photoresist layer 25 is formed by laminating one or more negative-type photosensitive dry film resist sheets and thermocompressing them to a predetermined thickness. Next, a pattern film 26 (glass mask) having light-transmitting holes 26a corresponding to the mask body 2 is adhered to the photoresist layer 25, thereby obtaining a patterning precursor 27.

[0069] (Preheating process) The patterning pre-stage body 27 is preheated to the temperature inside the oven of the ultraviolet irradiation device (exposure device) during the exposure operation, for example, using a heater plate, a preheating oven, etc. At this time, it is advisable to preheat the oven of the ultraviolet irradiation device to the temperature inside the oven during the exposure operation in parallel with the preheating of the patterning pre-stage body 27.

[0070] (Primary patterning process) After preheating the UV irradiation furnace and the patterning pre-stage 27, the patterning pre-stage 27 is placed in the UV irradiation furnace. As shown in Figure 17(a), the UV lamp 28 irradiates the patterning pre-stage 27 with UV light for exposure, followed by development and drying. The unexposed portions are then dissolved and removed, forming a primary pattern resist 29 on the matrix 24, as shown in Figure 17(b). By preheating the UV irradiation furnace and the patterning pre-stage 27 to the furnace temperature during the exposure process, the patterning pre-stage 27 is heated and expanded by UV irradiation, eliminating the problem of the exposure process being performed with the relative positions of the three elements 24, 25, and 26 misaligned. This allows the primary pattern resist 29 to be formed on the matrix 24 with high positional accuracy and in the intended shape, contributing to high accuracy in reproducing the deposited layer and deposition.

[0071] (Frame installation process) As shown in Figure 17(c), an adhesive resist 43 was formed on the entire surface of the matrix 24, including the area where the primary pattern resist 29 was to be formed. As before, this adhesive resist 43 was formed by laminating one or more negative-type photosensitive dry film resist sheets and thermocompressing them to a predetermined thickness. Next, a frame 3 was positioned on the matrix 24 so as to surround the primary pattern resist 29. Here, the adhesive properties of the unexposed adhesive resist 43 were utilized to temporarily fix the frame 3 to the matrix 24. Furthermore, as shown in Figure 17(d), the unexposed adhesive resist 43 exposed on the surface was dissolved and removed. At this time, the adhesive resist 43 on the underside of the frame 3 was covered by the frame 3 and was not dissolved and removed, remaining on the matrix 24.

[0072] (integrated electroforming process) Next, the matrix 24 was placed in an electroforming tank, and as shown in Fig. 17(e), nickel was electroformed onto the surface of the matrix 24 not covered with the resist layer 29a and onto the surface of the frame 3 to form a metal layer 8. This allows the primary electroformed layer 30 that constitutes the mask body 2 and the metal layer 8 that joins the mask body 2 and the frame 3 to be formed integrally.

[0073] (peeling process) The primary electroforming layer 30, metal layer 8, and frame 3 were peeled off together from the matrix 24, and the adhesive resist 43 located on the underside of the frame 3 was removed from both layers 30 and 8 to obtain the deposition mask 1 shown in Figure 16.

[0074] According to the manufacturing method of the fourth reference example described above, it is possible to eliminate the time and effort required for forming the metal layer 8, omit the steps required for manufacturing, and shorten the time, while increasing the rigidity of the frame 3 in the same manner as described above. Therefore, it is possible to obtain a deposition mask 1 that can be made larger while further suppressing an increase in manufacturing cost, can maintain flatness, and can ensure good reproducibility and deposition accuracy of the deposition layer.

[0075] 18 to 20 show a vapor deposition mask according to a fifth reference example. As shown in FIG. 18, the vapor deposition mask 1 in this reference example includes a support frame 46 fixed to the lower surface (the substrate-side vapor deposition target side) of the frame 3, and an auxiliary frame 47 fixed to the lower surface (the substrate-side vapor deposition target side) of the support frame 46. That is, the frame 3 is provided on one surface (the vapor deposition source side) of the support frame 46, and the auxiliary frame 47 is provided on the other surface (the substrate-side vapor deposition target side) of the support frame 46. The outer shapes of the support frame 46 and the auxiliary frame 47 match those of the frame 3. As shown in FIGS. 19 and 20, the support frame 46 has a frame opening 48 formed therein that corresponds to the mask opening 11 of the frame 3. The frame opening 48 has an opening shape that is the same as or slightly larger than the mask opening 11. The vertical frames 12 and horizontal frames 13 of the frame 3 are entirely supported by the support frame 46. Furthermore, the auxiliary frame 47 is formed in a frame-like shape, and the four peripheral edges of the support frame 46 are supported by the auxiliary frame 47. The frame body 3, support frame 46, and auxiliary frame 47 are aligned, and then the three parts 3, 46, and 47 are joined together by spot welding to form an integrated unit. Spot welding points 49 are provided at the four corners and on the four peripheral edges of the vertical and horizontal frames 12, 13 on extensions of their associated lines (see Figure 20).

[0076] As described above, the support frame 46 supports the entire vertical frame 12 and horizontal frame 13 of the frame body 3, and the auxiliary frame 47 supports the four peripheral edges of the support frame 46. This further enhances the structural strength and rigidity of the entire deposition mask, prevents the deposition mask 1 from bending and deforming, and maintains its flatness, thereby improving the reproducibility and deposition accuracy of the deposition layer.

[0077] (First embodiment) FIG. 21 shows a first embodiment of a deposition mask according to the present invention. The deposition mask 1 in this embodiment is manufactured by manufacturing three deposition mask bodies 50, each of which includes ten mask bodies 2 arranged in a 2-row, 5-column matrix and a frame body arranged around the mask bodies 2 and inseparably joined together with a metal layer. These three deposition mask bodies 50 are supported by a support frame 46 and an auxiliary frame 47. Specifically, one deposition mask body 50 is first prepared, and its position and tension are adjusted using a tensioning device before it is fixed to the support frame 46. This fixation is achieved by spot welding the corners of the frame body 3 and the peripheral edges of the vertical and horizontal frames 12 and 13 on the extension lines. The remaining two deposition mask bodies 50 are fixed to the support frame 46 in the same manner. Finally, the auxiliary frame 47 is fixed (by spot welding) to the side of the support frame 46 opposite to the side to which the deposition mask bodies 50 are fixed. In this manner, when multiple deposition mask bodies 50 are supported by the support frame 46 and the auxiliary frame 47, the relative positions of adjacent deposition mask bodies 50 can be finely adjusted and positioned, improving the relative positional accuracy of the mask bodies 2 of adjacent deposition mask bodies 50. Therefore, good reproducibility and deposition accuracy can be ensured. Furthermore, the deposition mask 1 can be freely set to a desired size. Note that the smaller the shape of the deposition mask body 50, the better the dimensional accuracy, so large adjustments are not required, fine adjustments are easier, and positional accuracy can be more easily ensured. Furthermore, if the shape of the deposition mask body 50 is rectangular, fine adjustments are easier to make.

[0078] As described above, in the deposition masks and deposition mask manufacturing methods of the above-described reference examples, the frame 3 is composed of an upper frame 16 and a lower frame 17, and these upper and lower frames 16 and 17 are joined together via an adhesive layer 18. Therefore, when forming a frame 3 of the same thickness as in the conventional method, a thinner metal plate can be used to form the frame 3, thereby reducing the thickness variation of the entire frame 3. This is because, as the thickness of a commonly available metal plate used as the base material for the frame 3 decreases, the number of times it passes through the rolling rolls in the manufacturing process increases, and therefore, the thinner the plate thickness, the smaller the thickness tends to be. Therefore, even in large deposition masks 1, distortion due to thermal expansion resulting from thickness variation of the metal plate can be suppressed. Furthermore, because the base material is simply a commonly available thin metal plate, there is no need to use a dedicated metal plate to form the frame 3. As described above, the deposition masks of the above-described reference examples enable the deposition mask 1 to be enlarged while suppressing increases in manufacturing costs. Furthermore, the flatness of the deposition mask 1 can be maintained, ensuring good reproducibility and deposition accuracy. Furthermore, with the frame 3 having the adhesive layer 18 interposed between the upper frame 16 and the lower frame 17, when an external force that causes deflection deformation of the deposition mask 1 is applied, the frame 3 flexibly and elastically deforms by the amount of the adhesive layer 18, effectively preventing damage to the deposition mask 1. Furthermore, by joining the upper frame 16 and the lower frame 17 in a state where the two-dimensional or three-dimensional curved warpage of the frames is offset, the frame 3 is formed flat, eliminating slight warpage derived from the metal plate material, further improving flatness and ensuring better reproducibility and deposition accuracy of the deposition layer. This also contributes to realizing larger masks while suppressing increases in manufacturing costs.

[0079] Furthermore, in the deposition masks of the first, second, fourth, and fifth reference examples, multiple frame bodies 3·3 are stacked and adjacent frame bodies 3·3 in the stacking direction are bonded via adhesive layers 19. Therefore, when forming a frame body 3 of the same thickness as conventional ones, a thinner metal plate material can be used to form the frame body 3, thereby further suppressing distortion due to thermal expansion resulting from thickness variations in the metal plate material. This allows for larger deposition masks, maintains the flatness of the deposition mask, and ensures better deposition layer reproducibility and deposition accuracy. Furthermore, the increased number of adhesive layers 18·19 bonding the frame bodies 3 together allows for more flexible elastic deformation in response to external forces, thereby more effectively preventing damage to the deposition mask.

[0080] Unlike the above-described reference examples and the first embodiment, the number and arrangement of the mask bodies 2 of the deposition mask 1 are not limited to those described in the reference examples and the first embodiment. The mask body 2 does not need to be multiple; it may be a single mask body. The material of the mask body 2 is not limited to metal; it may be formed from resin, or even formed by etching or laser. Furthermore, the frame body 3 can be formed into a two-dimensional or three-dimensional curved surface by press-forming the cut upper and lower frames 16 and 17 using upper and lower molds for providing curved surfaces prior to the bonding process of the upper and lower frames 16 and 17. In this case, providing a two-dimensional or three-dimensional curved surface that is symmetrical with respect to the axis makes it easy to form the frame body 3 into a flat shape in the subsequent bonding process. Furthermore, the metal layer 8 may have a multilayer structure of two or more layers, like the mask body 2 (primary electroformed layer 30) described above.

[0081] In the above-described reference examples and the first embodiment, the support frame 46 and the auxiliary frame 47, like the frame body 3, can be made of various materials, including resins and not limited to metals such as aluminum and iron. However, it is preferable to use materials with a low coefficient of linear thermal expansion, such as Invar, Super Invar, or ceramic. The support frame 46 and the auxiliary frame 47 may be composed of an upper frame and a lower frame, as in the frame body 3, and these upper and lower frames may be joined together via an adhesive layer. Furthermore, multiple support frames 46 and auxiliary frames 47 may be prepared, and adjacent support frames 46·46 and auxiliary frames 47·47 in the stacking direction may be joined together via an adhesive layer. This reduces the thickness variation of the support frame 46 and the auxiliary frame 47. The frame body 3 and the support frame 46 may be made of different materials for the outer periphery and the frame borders defining the openings (mask opening 11, frame opening 48). [Explanation of symbols]

[0082] 1. Deposition mask 2 Mask body 3 Frame 4 Pattern formation area 4a outer edge 5 Vapor deposition hole 6. Deposition pattern 8 metal layer 10 Outer frame 11 Mask opening 12 Vertical Frame 13 Horizontal frame 16 Upper frame 17 Bottom frame 18 Adhesive layer 19 Adhesive layer 24 matrix 25 Photoresist layer 26 Patterned Film 26a Transparent hole 27 Patterning Pre-stage 29 Primary pattern resist 29a Resist body 30 Primary electroformed layer 43 Adhesive Resist 46 Support Frame 47 Auxiliary Frame 48 Frame opening 50 deposition mask body W1 Width of vertical frame W2 Width of the horizontal frame

Claims

1. a deposition mask body (50) including a mask body (2) having a deposition pattern (6) consisting of a large number of independent deposition through-holes (5), and a frame body (3) formed thicker than the mask body (2) and arranged around the mask body (2); a support frame (46) arranged on the lower surface side of the deposition mask body (50) and supporting a plurality of the deposition mask bodies (50); An auxiliary frame (47) arranged on the underside of the support frame (46); Equipped with The support frame (46) is formed with a frame opening (48) corresponding to the mask opening (11) of the frame body (3), A deposition mask characterized in that the peripheral edge of the support frame (46) is supported by the auxiliary frame (47).

2. 2. The deposition mask according to claim 1, wherein the frame body (3) comprises an outer peripheral frame (10), and vertical frames (12) and horizontal frames (13) that define the mask opening (11) within the outer peripheral frame (10), and the entire vertical frames (12) and horizontal frames (13) are supported by the support frame (46).

3. 3. The deposition mask according to claim 1, wherein the frame opening (48) is formed in a shape slightly larger than the mask opening (11).

4. 3. The deposition mask according to claim 2, wherein the frame body (3), the support frame (46), and the auxiliary frame (47) are integrated together by welding.

5. 5. The deposition mask according to claim 4, wherein welding points (49) are provided at four corners and at peripheral edges of the frame body (3) on extensions of the vertical frames (12) and the horizontal frames (13).

6. Each deposition mask body (50) is formed in a strip shape, The outer shape of the support frame (46) is formed in a rectangular shape, and a plurality of the deposition mask bodies (50) are supported by the support frame (46) in a state where they are arranged side by side along the short length direction of the strips, 2. The deposition mask according to claim 1, wherein four peripheral edges of the support frame (46) are supported by auxiliary frames (47) in the form of square frames.

Images