Component Mounting Equipment

Abstract

To provide a component mounting apparatus capable of determining the risk of interference between a mounting head and previously mounted components on a substrate when the mounting head mounts a retained component at a target position on the substrate, and of suppressing as much as possible the discarding of the retained component when there is a risk of interference.SOLUTION: A control unit 4 controls a head unit 25 so that a mounting head 251 mounts a retained component P1 at the target mounting position A1 on the substrate PP. The control unit 4 executes the calculation process S4 to calculate the holding position misalignment data DD and the interference process S5 to determine the risk of interference between the mounting head 251 and the previously mounted component P2 based on the previously mounted component data DA and the head data during mounting DB. In the interference process S5, if the control unit 4 determines that there is a risk of interference, the target mounting position A1 of the retained component P1 and the target mounting position C1 of the same kind of part are swapped.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a component mounting apparatus that holds a component by a mounting head of a head unit and mounts it on a substrate. [Background technology]

[0002] Conventionally, component mounting devices that mount electronic components (hereinafter simply referred to as "components") on substrates such as printed wiring boards have been known. This type of component mounting device has a mounting head that holds the components and mounts the components on the substrate, and the operation of the mounting head is controlled so that the components held by the mounting head are mounted on the substrate.

[0003] When a mounting head places a component at a target placement position on a board, interference between the mounting head and a component already placed on the board can occur. This interference affects the quality of component placement on the board. Therefore, technology is needed to prevent interference between the mounting head and a component already placed on the board.

[0004] Patent Document 1 discloses a method for determining the order in which components are to be mounted on a board so as to prevent interference between the mounting head and components already mounted. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2006-245537 Summary of the Invention [Problem to be solved by the invention]

[0006] Even if the operation of the mounting head is controlled according to a control program including parameters such as a preset mounting order, as in the technology disclosed in Patent Document 1, if the amount of deviation of the holding position of the held component relative to the holding surface of the mounting head exceeds an allowable range, there is a risk of interference between the mounting head and a previously mounted component when the held component is mounted at the target mounting position on the board. When there is a risk of interference between the mounting head and a previously mounted component, for example, a measure is taken to discard the held component held by the mounting head.

[0007] An object of the present invention is to provide a component mounting device that is capable of determining the risk of interference between a mounting head and a component already mounted on a board when the mounting head mounts a held component at a target mounting position on the board, and that can minimize the discarding of held components when there is a risk of interference. [Means for solving the problem]

[0008] According to one aspect of the present invention, a component mounting apparatus includes a head unit including a mounting head having a holding surface for holding components and mounting the components held on the holding surface at target mounting positions on a board, a first imaging unit for capturing an image of the held components held on the holding surface of the mounting head and acquiring a held-component image, and a control unit for controlling the head unit so that the mounting head mounts the held components at the target mounting positions on the board according to a predetermined mounting order. The control unit performs a calculation process for calculating holding position deviation data indicating a deviation amount of a holding position of the held component relative to the holding surface of the mounting head based on the held-component image, and an interference process for determining, before the mounting head mounts the held component at the target mounting position, whether or not there is a risk of interference between the mounting head and the already-mounted component based on previously-mounted component data regarding components already mounted on the board around the target mounting position and on-mounting head data regarding the mounting head at the time of component mounting, the holding position deviation data being included in the holding position deviation data. If it is determined that there is a risk of interference, the control unit replaces the target mounting position of the held component with the target mounting position of a similar component of the same type that is later in the mounting order than the held component.

[0009] According to this component mounting device, the control unit controls the head unit so that the mounting head mounts the held component at the target mounting position on the board. The control unit executes a calculation process to calculate holding position deviation data based on the held component image acquired by the first imaging unit, and an interference process to determine the risk of interference between the mounting head and a component already mounted on the board.

[0010] In the interference processing, the control unit determines the risk of interference between the mounting head and the already-mounted component based on already-mounted component data related to the already-mounted component and on-mount head data related to the mounting head at the time of component mounting, which data includes holding position deviation data. The holding position deviation data is data indicating the amount of deviation of the holding position of the held component relative to the holding surface of the mounting head. Therefore, by determining the risk of interference based on the at-mount head data including the holding position deviation data, it is possible to accurately determine whether or not there is a risk of interference between the mounting head and the already-mounted component due to the position deviation of the held component relative to the holding surface when the mounting head mounts the held component at the target mounting position.

[0011] Furthermore, in the interference processing, if the control unit determines that there is a risk of interference between the mounting head and a previously mounted component, it replaces the target mounting position of the held component with the target mounting position of a similar component of the same type that is later in the mounting order than the held component. In this case, the control unit does not immediately discard the held component held by the mounting head when there is a risk of interference due to misalignment of the held component with respect to the holding surface. This makes it possible to minimize the discarding of held components when there is a risk of interference between the mounting head and a previously mounted component.

[0012] In the component mounting device described above, the already-mounted component data may include already-mounted component position data indicating the position of the already-mounted component on the board, and already-mounted component type data indicating the type of the already-mounted component, and the mounting head data may include, in addition to the holding position deviation data, held component type data indicating the type of the held component.

[0013] In this aspect, the control unit can recognize the positions and component types of already-mounted components around the target mounting position on the board based on the already-mounted component data, including the already-mounted component position data and the already-mounted component type data. That is, the control unit can recognize the positions of already-mounted components on the board based on the already-mounted component position data, and recognize the component types of already-mounted components based on the already-mounted component type data. Meanwhile, the control unit can recognize the mounting head at the time of component mounting, assuming a scenario in which the held component will be mounted at the target mounting position on the board, based on the at-mount head data, including the holding position deviation data and the held component type data. That is, the control unit can recognize the component type of the held component to be mounted at the target mounting position based on the held component type data, and recognize the range of the holding surface of the mounting head when mounting the held component at the target mounting position, taking into account the amount of positional deviation of the held component relative to the holding surface based on the holding position deviation data. The control unit can then accurately determine the risk of interference between the mounting head and the already-mounted component based on the recognition results of the already-mounted component based on the already-mounted component data and the recognition results of the mounting head at the time of component mounting based on the at-mount head data.

[0014] In the component mounting apparatus, the mounting head data may further include holding surface size data indicating a size of the holding surface.

[0015] In this aspect, the control unit can more accurately recognize the range of the holding surface of the mounting head when mounting the held component at the target mounting position by referring to the holding surface size data included in the head data at the time of mounting.

[0016] The component mounting apparatus may further include a storage unit that stores production plan data indicating a production plan to be referenced by the control unit when controlling the head unit. The production plan data includes mounting order data indicating an order in which components will be mounted on the board, component data regarding the components to be mounted on the board, target mounting position data indicating target mounting positions of the components on the board, and head data regarding the mounting head. The control unit acquires the already-mounted component data and the at-mounting head data based on the production plan data.

[0017] In this aspect, the control unit controls the head unit based on the production plan data stored in the storage unit. When determining the risk of interference between the mounting head and already-mounted components in the interference processing, the control unit can acquire already-mounted component data and at-time-mounting head data to be used when determining the risk of interference, based on the production plan data.

[0018] In the component mounting device, the control unit may, in the interference processing, calculate a head interference determination range indicating the possible range within which the mounting head can exist when mounting the held component at the target mounting position on the substrate based on the head data at the time of mounting, and determine that there is a risk of interference if at least a portion of the already mounted component indicated by the already mounted component data is inside the head interference determination range.

[0019] In this aspect, the control unit calculates, based on the mounting head data, a head interference determination range that indicates a range within which the mounting head can exist when mounting the held component at the target mounting position on the board. If at least a portion of the already-mounted component indicated by the already-mounted component data is present within the head interference determination range, the control unit can determine that there is a risk of interference between the mounting head and the already-mounted component.

[0020] In the component mounting device, the control unit may, in the interference processing, calculate an existing component interference judgment range indicating the possible range within which the already mounted components can exist on the board based on the already mounted component data, and determine that there is a risk of interference if at least a portion of the mounting head at the time of component mounting indicated by the head data at the time of mounting is inside the existing component interference judgment range.

[0021] In this aspect, the control unit calculates an existing component interference determination range that indicates the range within which already-mounted components can exist on the board based on the already-mounted component data. Then, if at least a portion of the mounting head at the time of component mounting, indicated by the at-mounting head data, is present within the existing component interference determination range, the control unit can determine that there is a risk of interference between the mounting head and the already-mounted component.

[0022] In the component mounting device, the control unit may, in the interference processing, calculate, based on the head data at the time of mounting, a head interference judgment range indicating the possible range within which the mounting head can exist when mounting the held component at the target mounting position on the board, and calculate, based on the already-mounted component data, an existing-component interference judgment range indicating the possible range within which the already-mounted component can exist on the board, and determine that there is a risk of interference if the head interference judgment range and the already-mounted component interference judgment range overlap.

[0023] In this aspect, the control unit calculates, based on the head data at the time of mounting, a head interference determination range indicating the possible range of the mounting head when mounting the held component at the target mounting position on the board. The control unit also calculates, based on the data on previously mounted components, a previous component interference determination range indicating the possible range of the previously mounted components on the board. If the head interference determination range and the previous component interference determination range overlap, the control unit can determine that there is a risk of interference between the mounting head and the previously mounted component.

[0024] In the component mounting device described above, if the control unit determines in the interference processing that there is a risk of interference, the control unit may replace the target mounting position of the held component with the target mounting position of the same type of component that is located within a predetermined range from the target mounting position.

[0025] In this aspect, the control unit sets the target mounting positions of the same type of component within a predetermined range from the target mounting position corresponding to the held component as the target mounting positions to be replaced when there is a risk of interference between the mounting head and the already mounted component. In this case, since the distance between the target mounting positions before and after the replacement falls within a predetermined range, it is possible to minimize a decrease in the mounting efficiency when the mounting head mounts the held component at the target mounting position due to the replacement of the target mounting positions.

[0026] In the component mounting device described above, when the target mounting position of the held component is swapped with the target mounting position of the same type of component during the interference processing, the control unit may determine whether or not there is a risk of interference with the target mounting position after the swap.

[0027] In this embodiment, the control unit determines the risk of interference between the mounting head and the already-mounted component for the mounting target position after the replacement. After determining the risk of interference for the mounting target position after the replacement, if there is no risk of interference, the mounting head performs the mounting operation of the held component for the mounting target position after the replacement.

[0028] The component mounting apparatus may further include a second imaging unit attached to the head unit and configured to capture images of the already-mounted components on the board and acquire images of the already-mounted components. When the control unit determines in the interference processing that there is a risk of interference based on the already-mounted component data and the head data at the time of mounting, the control unit determines again whether there is a risk of interference based on the already-mounted component image and the head data at the time of mounting.

[0029] In this aspect, the control unit can recognize the actual mounting state of the already-mounted components on the board based on the already-mounted component image acquired by the second imaging unit. Then, if it is determined that there is a risk of interference based on the already-mounted component data and the head data at the time of mounting, the control unit re-evaluates the risk of interference based on the already-mounted component image and the head data at the time of mounting. This allows the control unit to determine the risk of interference between the mounting head and the already-mounted components in accordance with the actual mounting state of the already-mounted components.

[0030] In the component mounting apparatus, the mounting head may be rotatable about an axis perpendicular to the holding surface, and the control unit, in the interference processing, may assume a first state and a second state obtained by rotating the mounting head by a predetermined angle from the first state, and determine whether there is a risk of interference in each state.

[0031] Depending on the positional relationship between the target mounting position of the held component and the position of the already-mounted component, the risk of interference between the mounting head and the already-mounted component changes when the mounting head is rotated around an axis perpendicular to the holding surface, depending on the positional deviation of the held component relative to the holding surface of the mounting head. Therefore, the control unit determines the risk of interference between the mounting head in the first and second states and the already-mounted component, assuming a case where the mounting head is rotated. For example, even if there is a risk of interference between the mounting head in the first state and the already-mounted component, there may be no risk of interference with the already-mounted component when the mounting head is in the second state, which is rotated by a predetermined angle from the first state.

[0032] In the component mounting device, the mounting head data may include tolerance data indicating a tolerance range of a deviation amount of the holding position of the held component with respect to the holding surface of the mounting head. When determining the risk of interference in the interference processing, the control unit determines whether the deviation amount of the holding position indicated by the holding position deviation data is within the tolerance range indicated by the tolerance data, and determines that there is a risk of interference if it is not within the tolerance range.

[0033] In this aspect, the control unit determines the risk of interference between the mounting head and a previously mounted component using tolerance data that indicates the tolerance range of the amount of deviation of the mounting position of the held component relative to the holding surface of the mounting head, thereby reducing the calculation load on the control unit when controlling the mounting operation of the held component by the mounting head and improving the efficiency of determining the risk of interference. [Effects of the Invention]

[0034] As described above, according to the present invention, it is possible to determine the risk of interference between the mounting head and components already mounted on the substrate when the mounting head mounts the held component at the target mounting position on the substrate, and it is possible to minimize the discarding of the held component when there is a risk of interference. [Brief explanation of the drawings]

[0035] [Figure 1] 1 is a block diagram of a component mounting apparatus according to an embodiment of the present invention. [Figure 2] FIG. 2 is a plan view showing the configuration of a mounting machine main body of the component mounting apparatus. [Figure 3] FIG. 2 is an enlarged view showing a head unit provided in the mounting machine main body. [Figure 4] 5A to 5C are diagrams illustrating processes performed when a control unit of the component mounting apparatus controls a head unit. [Figure 5] 10A and 10B are diagrams illustrating a process for determining the risk of interference between a mounting head and an already-mounted component, in the interference process according to the first example executed by the control unit. [Figure 6] 10A and 10B are diagrams illustrating a first example of interference processing executed by the control unit, in which the target mounting position of a held component held by the mounting head is replaced with the target mounting position of a component of the same type. [Figure 7] 10 is a flowchart showing a processing flow of interference processing according to a first example executed by a control unit. [Figure 8] 10A and 10B are diagrams illustrating a process for determining the risk of interference between the mounting head and an already-mounted component, in the interference process according to the second example executed by the control unit. [Figure 9]10 is a flowchart showing a processing flow of interference processing according to a second example executed by the control unit. [Figure 10] 10A and 10B are diagrams illustrating a process for determining the risk of interference between a mounting head and an already-mounted component, in an interference identification process according to a third example executed by a control unit. [Figure 11] 10 is a flowchart showing a processing flow of interference processing according to a third example executed by the control unit. [Figure 12] 10 is a flowchart showing a processing flow of interference processing according to a fourth example executed by the control unit. DETAILED DESCRIPTION OF THE INVENTION

[0036] Hereinafter, a component mounting apparatus according to an embodiment of the present invention will be described with reference to the drawings.

[0037] [Overall configuration of component mounting equipment] The component mounting apparatus 1 shown in the block diagram of FIG. 1 is an apparatus for producing electronic circuit boards in which electronic components (hereinafter referred to as "components") are mounted on printed circuit boards (hereinafter referred to as "boards"). The component mounting apparatus 1 comprises a mounting machine main body 2, a storage unit 3, and a control unit 4. The mounting machine main body 2 constitutes a structural portion that performs component mounting operations. The storage unit 3 stores production plan data D1 that is referenced when the mounting machine main body 2 performs component mounting operations. The control unit 4 reads out the production plan data D1 stored in the storage unit 3, and controls the component mounting operations of the mounting machine main body 2 based on the production plan data D1.

[0038] First, the mounting machine main body 2 will be described with reference to Fig. 2 and Fig. 3 in addition to Fig. 1. Fig. 2 is a plan view showing the configuration of the mounting machine main body 2, and Fig. 3 is an enlarged view of the head unit 25. Note that directional relationships will be described below using XY Cartesian coordinates that are orthogonal to each other on a horizontal plane. Also, one side in the X-axis direction will be referred to as the "+X side," and the other side opposite to the one side in the X-axis direction will be referred to as the "-X side." Similarly, one side in the Y-axis direction will be referred to as the "+Y side," and the other side opposite to the one side in the Y-axis direction will be referred to as the "-Y side."

[0039] A solder paste pattern is printed on the substrate PP before components are mounted by the mounting machine main body 2. In other words, the mounting machine main body 2 mounts components onto the substrate PP on which a solder paste pattern has been printed by a pattern forming device. The mounting machine main body 2 includes a main body frame 21, a conveyor 23, a component supply unit 24, a head unit 25, and a substrate support unit 28.

[0040] The main body frame 21 is a structure on which the various components of the mounting machine main body 2 are arranged, and has a generally rectangular shape in a plan view seen from a direction (vertical direction) perpendicular to both the X-axis direction and the Y-axis direction. The conveyor 23 extends in the X-axis direction and is arranged on the main body frame 21. The conveyor 23 transports the board PP in the X-axis direction. The board PP transported on the conveyor 23 is positioned by the board support unit 28 at a predetermined work position (a component mounting position where components are mounted on the board PP). The board support unit 28 positions the board PP by supporting the board PP with push-up pins.

[0041] The component supply units 24 are arranged in respective regions on the +Y and −Y sides of the main frame 21 in the Y-axis direction, with the conveyor 23 sandwiched between them. The component supply unit 24 is an area in the main frame 21 where multiple feeders 24F are installed side by side, and a set position for each feeder 24F is defined for each component to be held by a mounting head 251 provided in the head unit 25 (described below). The feeders 24F are detachably attached to the component supply unit 24. There are no particular limitations on the feeder 24F as long as it can hold multiple components and supply the held components to predetermined component supply positions set within the feeder, and it is, for example, a tape feeder. The tape feeder is equipped with a reel around which a component storage tape is wound, storing components at predetermined intervals, and is configured to supply components by feeding the component storage tape from the reel. The feeder 24F will feed the same type of components as long as the components it holds are the same, for example, in the case of a tape feeder, as long as it is equipped with a reel around which a component storage tape containing components of the same type is wound.

[0042] The head unit 25 is held by a moving frame 27. A fixed rail 261 extending in the Y-axis direction and a ball screw shaft 262 rotated by a Y-axis servo motor 263 are arranged on the main body frame 21. The moving frame 27 is placed on the fixed rail 261, and a nut portion 271 provided on the moving frame 27 is threadedly engaged with the ball screw shaft 262. The moving frame 27 is also provided with a guide member 272 extending in the X-axis direction and a ball screw shaft 273 driven by an X-axis servo motor 274. The head unit 25 is movably held by the guide member 272, and a nut portion provided on the head unit 25 is threadedly engaged with the ball screw shaft 273. The moving frame 27 moves in the Y-axis direction when the Y-axis servo motor 263 is operated, and the head unit 25 moves in the X-axis direction relative to the moving frame 27 when the X-axis servo motor 274 is operated. That is, head unit 25 is movable in the Y-axis direction in conjunction with the movement of movable frame 27, and is also movable in the X-axis direction along movable frame 27. Head unit 25 is movable between component supply unit 24 and a predetermined working position for board PP transported by conveyor 23.

[0043] As shown in FIG. 3, the head unit 25 includes multiple mounting heads 251. Each mounting head 251 performs a component mounting operation, picking up components from the component supply unit 24 and mounting (mounting) the picked-up components on the board PP. A holding nozzle 2511 is attached to the tip (bottom end) of each mounting head 251. The holding nozzle 2511 is a holder having a holding surface 251A that picks up and holds components supplied by the feeders 24F arranged in the component supply unit 24. The holding nozzle 2511 can be connected to a negative pressure generator, a positive pressure generator, or the atmosphere via an electric switching valve. In other words, supplying negative pressure to the holding nozzle 2511 enables the holding nozzle 2511 to pick up and hold a component (remove a component), and then supplying positive pressure releases the component from the suction-holding state.

[0044] The mounting head 251 is movable up and down in the Z-axis direction (vertical direction) relative to the frame of the head unit 25, and is rotatable about a head axis extending in the Z-axis direction perpendicular to the holding surface 251A. The mounting head 251 is movable up and down along the Z-axis between a holdable position where the holding nozzle 2511 can hold a component supplied to the component supply position by the feeder 24F, and a retracted position above the holdable position. That is, when the holding nozzle 2511 holds a component supplied to the component supply position, the mounting head 251 descends from the retracted position to the holdable position and holds the component at the holdable position. After holding the component, the mounting head 251 rises from the holdable position to the retracted position. Furthermore, the mounting head 251 is movable up and down along the Z-axis between the retracted position and a mountable position where the component held by the holding nozzle 2511 can be placed at a predetermined target mounting position on the board PP. That is, when mounting the held component onto the substrate PP, the mounting head 251 descends from the retracted position toward the mountable position, and mounts the component onto the substrate PP at the mountable position. After mounting the component, the mounting head 251 ascends from the mountable position toward the retracted position.

[0045] 2, a first imaging unit 29A is installed on the main frame 21 between the component supply unit 24 and the conveyor 23. The first imaging unit 29A is an imaging camera equipped with an imaging element such as a CMOS (Complementary Metal-Oxide-Semiconductor) or a CCD (Charged-Coupled Device). While the head unit 25 is moving from the component supply position of the feeder 24F to the work position for the board PP, the first imaging unit 29A captures an image of the held component held by the holding nozzle 2511 of the mounting head 251 from below, thereby acquiring a held component image G1. The held component image G1 acquired by the first imaging unit 29A is input to the control unit 4.

[0046] Further, a second imaging unit 29B is attached to the head unit 25. The second imaging unit 29B is an imaging camera equipped with an imaging element such as a CMOS or CCD. The second imaging unit 29B captures an image of marks and the like affixed to the upper surface of the board PP transported by the conveyor 23 from above, and acquires a board recognition image G2 for recognizing the board PP. Furthermore, as will be described in detail later, the second imaging unit 29B captures an image of already-mounted components that have been mounted on the board PP from above, and acquires an already-mounted component image G3. The board recognition image G2 and already-mounted component image G3 acquired by the second imaging unit 29B are input to the control unit 4.

[0047] 1, the storage unit 3 stores production plan data D1. The production plan data D1 is data indicating a production plan that is referenced when the control unit 4 controls the head unit 25. The production plan data D1 includes, for example, mounting order data D2, feeder data D3, component data D4, target mounting position data D5, tolerance data D6, and head data D7.

[0048] The mounting order data D2 is data that indicates the order in which components are mounted on the board PP by the mounting head 251. The feeder data D3 is data that indicates information about the feeders 24F that supply components. The feeder data D3 includes, for example, the type of feeder 24F and the set position of the feeder 24F in the component supply unit 24.

[0049] The component data D4 is data that indicates information about the components to be mounted on the board PP. The component data D4 includes component type data D41 that indicates the type of component, and component size data D42 that indicates the size of the component, such as the external dimensions of the component in the X-axis and Y-axis directions, and the height of the component in the Z-axis direction. Note that the component types indicated by the component type data D41 may be classified by component size. In this case, since the component size is determined according to the component type, it is possible to manage the component types and sizes based on the component type data D41 even if the component data D4 does not include the component size data D42.

[0050] The target mounting position data D5 is data indicating coordinate information relating to the target mounting position of the component set on the board PP. The target mounting position data D5 includes, for example, a coordinate X relating to the target mounting position of the component in the X-axis direction on the board PP, and a coordinate Y relating to the target mounting position of the component in the Y-axis direction on the board PP. The tolerance data D6 is data indicating an allowable range of deviation of the holding position of the component held by the mounting head 251 relative to the holding surface 251A of the mounting head 251. The tolerance data D6 defines the center position on the holding surface of the component held by the mounting head 251 as a reference holding position, and includes registered values ​​for the maximum allowable deviation on the +X side, the -X side, the +Y side, and the -Y side relative to the reference holding position.

[0051] The head data D7 is data relating to the mounting head 251 including the holding nozzle 2511. The head data D7 includes holding surface size data D71 indicating the size of the holding surface 251A of the holding nozzle 2511 in terms of the external dimensions in the X-axis direction and Y-axis direction, and lowered position data D72 indicating the position of the mounting head 251 when the mounting head 251 is lowered to mount a component on the board PP. Note that the head data D7 does not necessarily have to include the holding surface size data D71.

[0052] The control unit 4 is composed of a CPU (Central Processing Unit), a ROM (Read Only Memory) that stores a control program, a RAM (Random Access Memory) that is used as a work area for the CPU, etc. The control unit 4 controls the operation of each component, including the head unit 25 of the mounting machine main body 2, by the CPU executing the control program stored in the ROM, and referring to the production plan data D1 stored in the storage unit 3.

[0053] The control unit 4 controls the conveyance operation of the conveyor 23 to transport the board PP, and also controls the component supply operation of each of the plurality of feeders 24F arranged in the component supply unit 24.

[0054] Furthermore, the control unit 4 controls the movement of the head unit 25 in the X-axis and Y-axis directions, and the lifting and rotation of the mounting head 251, thereby controlling the component holding operation by the mounting head 251 and the component mounting operation on the board PP. At this time, the control unit 4 refers to the production plan data D1, the held component image G1 acquired by the first imaging unit 29A, and, as necessary, the already-mounted component image G3 acquired by the second imaging unit 29B.

[0055] [Control of the head unit by the control unit] The control of the head unit 25 by the control unit 4 will be described with reference to Fig. 4. The control unit 4 executes a first movement process S1, a component holding process S2, a second movement process S3, a calculation process S4, an interference process S5, and a mounting process S6 as a series of processes in which the mounting head 251 of the head unit 25 mounts the component P1 at the target mounting position A1 on the board PP.

[0056] The control unit 4 identifies the component P1 to be held by the mounting head 251 based on the component data D4, in accordance with the mounting order of the components P1 on the board PP indicated by the mounting order data D2. In a first movement process S1, the control unit 4 identifies the set position of the feeder 24F that supplies the component P1 to be held by the mounting head 251 based on the feeder data D3, and controls the movement operation of the head unit 25 so that the head unit 25 moves toward the set position. When the head unit 25 arrives directly above the set position, the control unit 4 controls the lifting and rotation operation of the mounting head 251 in a component holding process S2, causing the component P1 to be held on the holding surface 251A of the mounting head 251.

[0057] When the component P1 is held on the holding surface 251A of the mounting head 251, the control unit 4 controls the movement operation of the head unit 25 in a second movement process S3 so that the head unit 25 moves toward the mounting target position A1 on the substrate PP, which is indicated by the mounting target position data D5 of the held component P1 held by the mounting head 251. At this time, while the head unit 25 moves from the feeder 24F toward the mounting target position A1 on the substrate PP, the first imaging unit 29A acquires a held component image G1 of the held component P1 held on the holding surface 251A of the mounting head 251. When the held component image G1 is acquired by the first imaging unit 29A, the control unit 4 calculates, in a calculation process S4, holding position deviation data DD, which indicates the amount of deviation of the holding position of the held component P1 relative to the holding surface 251A, based on the held component image G1. The holding position deviation data DD is based on the center of the holding part P1 held on the holding surface 251A and includes information on the distance from the center to each edge in four directions of the +X side, -X side, +Y side, and -Y side of the holding surface 251A.

[0058] When the head unit 25 arrives directly above the mounting target position A1 on the substrate PP corresponding to the held component P1 held by the mounting head 251, the control unit 4 executes interference processing S5 before the mounting head 251 places the held component P1 at the mounting target position A1. In interference processing S5, the control unit 4 acquires, based on the production plan data D1, already-mounted component data DA related to already-mounted components P2 that have already been placed on the substrate PP around the mounting target position A1 corresponding to the held component P1, and at-the-time head data DB related to the mounting head 251 at the time of component mounting, assuming a scenario in which the held component P1 is to be placed at the mounting target position A1. The at-the-time head data DB includes the holding position deviation data DD calculated in calculation processing S4. Then, based on the already-mounted component data DA and the at-the-time head data DB, the control unit 4 determines whether there is a risk of interference between the mounting head 251 and the already-mounted component P2 when the mounting head 251 places the held component P1 at the mounting target position A1.

[0059] As described above, in interference processing S5, the control unit 4 determines the risk of interference between the mounting head 251 and the already-mounted component P2 based on the already-mounted component data DA related to the already-mounted component P2 and the at-mounting head data DB related to the mounting head 251 at the time of component mounting, which includes the holding position deviation data DD. The holding position deviation data DD is data indicating the amount of deviation in the holding position of the held component P1 relative to the holding surface 251A of the mounting head 251. Therefore, by determining the risk of interference based on the at-mounting head data DB including the holding position deviation data DD, it is possible to accurately determine whether or not there is a risk of interference between the mounting head 251 and the already-mounted component P2 due to the position deviation of the held component P1 relative to the holding surface 251A when the mounting head 251 places the held component P1 on the mounting target position A1.

[0060] If it is determined in interference process S5 that there is no risk of interference between the mounting head 251 and the already-mounted component P2, the control unit 4 executes mounting process S6 to mount the held component P1 at the original mounting target position A1 corresponding to the held component P1. In mounting process S6, the control unit 4 controls the lifting and rotating operations of the mounting head 251 based on the lowering position data D72 and the holding position deviation data DD included in the head data D7 so that the held component P1 held by the mounting head 251 is mounted at the mounting target position A1, and mounts the held component P1 on the board PP.

[0061] On the other hand, if it is determined that there is a risk of interference between the mounting head 251 and the already-mounted component P2, the control unit 4 recognizes a mounting target position corresponding to a component of the same type that is to be mounted later than the held component P1 held by the mounting head 251, based on the mounting order data D2, component data D4, and target mounting position data D5 included in the production plan data D1. The control unit 4 then replaces the mounting target position A1 corresponding to the held component P1 with the mounting target position corresponding to the same type of component. In this case, the control unit 4 does not immediately discard the held component P1 held by the mounting head 251 when there is a risk of interference due to misalignment of the held component P1 with respect to the holding surface 251A. This makes it possible to minimize the possibility of the held component P1 being immediately discarded when there is a risk of interference between the mounting head 251 and the already-mounted component P2.

[0062] If there is no risk of interference between the mounting head 251 and the already-mounted component P2 at the target mounting position after the replacement, the control unit 4 executes mounting process S6 to mount the held component P1 at the target mounting position after the replacement. In mounting process S6, the control unit 4 controls the lifting and rotating operations of the mounting head 251 based on the lowering position data D72 and the holding position deviation data DD included in the head data D7 so that the held component P1 held by the mounting head 251 is mounted at the target mounting position after the replacement, and mounts the held component P1 on the board PP.

[0063] [Details of interference processing in the control section] The interference processing S5 executed by the control unit 4 will now be described in detail.

[0064] The already-mounted component data DA used by the control unit 4 in the interference processing S5 includes already-mounted component position data indicating the position of the already-mounted component P2 on the board PP and already-mounted component type data indicating the type of the already-mounted component P2. The control unit 4 acquires the already-mounted component position data and already-mounted component type data included in the already-mounted component data DA based on the production plan data D1. Specifically, the control unit 4 acquires the mounting target position data D5 corresponding to the already-mounted component P2 as the already-mounted component position data and the component type data D41 included in the component data D4 corresponding to the already-mounted component P2 as the already-mounted component type data based on the production plan data D1. Based on the already-mounted component data DA including the already-mounted component position data and the already-mounted component type data, the control unit 4 can recognize the position and component type of the already-mounted component P2 around the mounting target position A1 on the board PP corresponding to the held component P1. In other words, the control unit 4 can recognize the mounting target position B1 of the already mounted component P2 on the board PP based on the mounting target position data D5 corresponding to the already mounted component P2 as already mounted component position data, and can recognize the component type of the already mounted component P2 based on the component type data D41 corresponding to the already mounted component P2 as already mounted component type data.

[0065] The already-mounted component data DA may further include already-mounted component size data. In this case, the control unit 4 acquires the component size data D42 included in the component data D4 corresponding to the already-mounted component P2 as the already-mounted component size data. The control unit 4 can then recognize the component size of the already-mounted component P2 based on the component size data D42 corresponding to the already-mounted component P2 as the already-mounted component size data.

[0066] Furthermore, the mounting head data DB used by the control unit 4 in the interference processing S5 includes, in addition to the holding position deviation data DD, held component type data indicating the type of held component P1. The control unit 4 acquires the held component type data included in the mounting head data DB based on the production plan data D1. Specifically, the control unit 4 acquires, as held component type data, component type data D41 included in the component data D4 corresponding to the held component P1 based on the production plan data D1. Based on the mounting head data DB including the holding position deviation data DD and the held component type data, the control unit 4 can recognize the mounting head 251 at the time of component mounting assuming a scenario in which the held component P1 is to be mounted at the mounting target position A1 on the board PP. That is, the control unit 4 recognizes the component type of the held component P1 to be mounted at the mounting target position A1 based on the component type data D41 corresponding to the held component P1 as the held component type data, and can recognize the range of the holding surface 251A of the mounting head 251 when mounting the held component P1 at the mounting target position A1, taking into account the amount of positional deviation of the held component P1 relative to the holding surface 251A based on the holding position deviation data DD.

[0067] The mounting head data DB may further include held component size data. In this case, the control unit 4 acquires the component size data D42 included in the component data D4 corresponding to the held component P1 as the held component size data. The control unit 4 can then recognize the component size of the held component P1 based on the component size data D42 corresponding to the held component P1 as the held component size data.

[0068] Furthermore, the mounting head data DB may further include holding surface size data D71 included in the head data D7 of the production plan data D1 as data indicating the size of the holding surface 251A of the mounting head 251. In this case, by referring to the holding surface size data D71 included in the mounting head data DB, the control unit 4 can more accurately recognize the range of the holding surface 251A of the mounting head 251 when mounting the held component P1 at the mounting target position A1.

[0069] The control unit 4 can then accurately determine the risk of interference between the mounting head 251 and the already mounted component P2 based on the recognition result of the already mounted component P2 based on the already mounted component data DA and the recognition result of the mounting head 251 at the time of component mounting based on the head data DB at the time of mounting.

[0070] Next, the interference processing S5 executed by the control unit 4 will be described in more detail using several examples.

[0071] (First example of interference processing) The interference processing S5 according to the first example, which is executed by the control unit 4, will be described below with reference to the flowcharts of FIGS.

[0072] Based on the mounting order data D2, component data D4, and target mounting position data D5 included in the production plan data D1, the control unit 4 determines (step S5A1) whether or not there is an already-mounted component P2 at positions on the +X side, -X side, +Y side, and -Y side around the mounting target position A1 corresponding to the held component P1 held by the mounting head 251. If there is no already-mounted component P2 around the mounting target position A1 (NO in step S5A1), the control unit 4 executes mounting process S6 to mount the held component P1 at the original mounting target position A1 corresponding to the held component P1.

[0073] On the other hand, if there is an already-mounted component P2 around the mounting target position A1 (YES in step S5A1), the control unit 4 acquires, based on the production plan data D1, already-mounted component data DA related to the already-mounted component P2 around the mounting target position A1 and mounting head data DB related to the mounting head 251 at the time of component mounting, assuming a scenario in which the held component P1 is to be mounted at the mounting target position A1. Then, the control unit 4 determines whether the height of the already-mounted component P2 is equal to or greater than the height of the held component P1, based on the component type data D41 corresponding to the already-mounted component P2 as already-mounted component type data included in the already-mounted component data DA and the component type data D41 corresponding to the held component P1 as held component type data included in the mounting head data DB (step S5A2). If the height of the already-mounted component P2 is not equal to or greater than the height of the held component P1 (NO in step S5A2), the control unit 4 executes mounting process S6 to mount the held component P1 at the original mounting target position A1 corresponding to the held component P1.

[0074] On the other hand, if the height of the already mounted component P2 is equal to or greater than the height of the held component P1 (YES in step S5A2), the control unit 4 calculates, based on the head data DB at the time of mounting, a head interference determination range A4 indicating the possible range within which the mounting head 251 can exist when mounting the held component P1 at the target mounting position A1, and also calculates, based on the already mounted component data DA, an existing component interference determination range B4 indicating the possible range within which the already mounted component P2 can exist on the board PP (step S5A3).

[0075] Specifically, when calculating the head interference determination range A4, the control unit 4 calculates a held component range A2, which indicates the range of the held component P1 centered on the target mounting position A1 indicated by the target mounting position data D5 corresponding to the held component P1, based on component type data D41 corresponding to the held component P1 as the held component type data included in the head data DB at the time of mounting. The control unit 4 may calculate the held component range A2 by referring to component size data D42 corresponding to the held component P1 as the held component size data included in the head data DB at the time of mounting. Furthermore, the control unit 4 calculates a head range A3, which indicates the range of the holding surface 251A of the mounting head 251, so as to surround the held component range A2 from the outside, based on the holding position deviation data DD included in the head data DB at the time of mounting. The control unit 4 calculates the head range A3 by taking into account the mounting accuracy when the mounting head 251 mounts the held component P1 on the board PP. The control unit 4 may calculate the head range A3 by referring to the holding surface size data D71 included in the head data DB at the time of mounting. Then, the control unit 4 calculates a range that is slightly larger than the head range A3 and surrounds the head range A3 from the outside as a head interference determination range A4 that indicates the range within which the mounted head 251 can exist.

[0076] Meanwhile, when calculating the already-mounted component interference determination range B4, the control unit 4 calculates the already-mounted component range B2, which indicates the range of the already-mounted component P2 centered on the target mounting position B1 indicated by the target mounting position data D5 corresponding to the already-mounted component P2 as the already-mounted component position data, based on the component type data D41 corresponding to the already-mounted component P2 as the already-mounted component type data included in the already-mounted component data DA. In this case, the control unit 4 may calculate the already-mounted component range B2 by referring to the component size data D42 corresponding to the already-mounted component P2 as the already-mounted component size data included in the already-mounted component data DA. Furthermore, the control unit 4 calculates the accuracy consideration range B3, which indicates the range surrounding the already-mounted component range B2 from the outside, taking into account the mounting accuracy of the already-mounted component P2 mounted on the board PP by the mounting operation of the mounting head 251. The control unit 4 then calculates the already-mounted component interference determination range B4, which is slightly larger than the accuracy consideration range B3 and which surrounds the accuracy consideration range B3 from the outside, as the range in which the already-mounted component P2 can exist.

[0077] After calculating the head interference determination range A4 and the existing component interference determination range B4, the control unit 4 determines whether there is a risk of interference between the mounting head 251 and the already-mounted component P2, depending on whether the head interference determination range A4 and the existing component interference determination range B4 overlap (step S5A4). As shown in FIG. 5(A), if the head interference determination range A4 and the existing component interference determination range B4 do not overlap, the control unit 4 determines that there is no risk of interference between the mounting head 251 and the already-mounted component P2. On the other hand, as shown in FIG. 5(B), if the head interference determination range A4 and the existing component interference determination range B4 overlap, the control unit 4 determines that there is a risk of interference between the mounting head 251 and the already-mounted component P2.

[0078] If there is no risk of interference between the mounting head 251 and the already-mounted component P2 (NO in step S5A4), the control unit 4 executes a mounting process S6 to mount the held component P1 at the original mounting target position A1 corresponding to the held component P1. On the other hand, if there is a risk of interference between the mounting head 251 and the already-mounted component P2 (YES in step S5A4), the control unit 4 determines whether there is a similar component of the same type that is placed later in the mounting order than the held component P1 held by the mounting head 251, based on the mounting order data D2 and component data D4 included in the production plan data D1 (step S5A5). If there is no similar component (NO in step S5A5), the control unit 4 executes a held component discard process to control the head unit 25 to discard the held component P1 held by the mounting head 251 (step S5AZ).

[0079] On the other hand, if a component of the same type is present (YES in step S5A5), the control unit 4 recognizes the target mounting position C1 of the component of the same type based on the target mounting position data D5 corresponding to the component of the same type, as shown in Fig. 6. Then, the control unit 4 replaces the target mounting position A1 corresponding to the held component P1 with the target mounting position C1 corresponding to the component of the same type, and sets the target mounting position C1 corresponding to the component of the same type as the target mounting position when the mounting head 251 mounts the held component P1 (step S5A6).

[0080] When swapping the mounting target position A1 corresponding to the held component P1 with the mounting target position C1 corresponding to the same type of component, the control unit 4 swaps the mounting target position A1 corresponding to the held component P1 with the mounting target position C1 of the same type of component located within a predetermined range from the mounting target position A1, based on the mounting order data D2, component data D4, and mounting target position data D5 included in the production plan data D1. That is, the control unit 4 sets the mounting target position C1 of the same type of component located within a predetermined range from the mounting target position A1 corresponding to the held component P1 as the mounting target position to be swapped when there is a risk of interference between the mounting head 251 and the already-mounted component P2. In this case, because the distance between the mounting target positions A1 and C1 before and after the swap falls within a predetermined range, it is possible to minimize any decrease in the mounting efficiency when the mounting head 251 mounts the held component P1 at the mounting target position due to the swapping of the mounting target positions. For example, the control unit 4 replaces the target mounting position A1 corresponding to the held component P1 with the target mounting position C1 of the same kind of component that is closest within a predetermined range from the target mounting position A1.

[0081] In addition, the control unit 4 may set the target mounting position C1 corresponding to the same type of component that is closest to the held component P1 in the mounting order indicated by the mounting order data D2 as the target mounting position to be replaced when there is a risk of interference between the mounting head 251 and the already mounted component P2.

[0082] When the mounting target position A1 of the held component P1 is swapped with the mounting target position C1 of the same type of component in step S5A6, the control unit 4 repeats the processes of steps S5A1 to S5A5 for the mounting target position C1 after the swap until the mounting target position for mounting the held component P1 held by the mounting head 251 is determined or until it is determined to execute a held-component discarding process for discarding the held component P1. That is, as shown in FIG. 6 , the control unit 4 calculates a head interference determination range A4 for the mounting target position C1 after the swap, and also calculates a previous-component interference determination range B4 for the already-mounted component P2 around the mounting target position C1. Then, the control unit 4 determines whether there is a risk of interference between the mounting head 251 and the already-mounted component P2 depending on whether the head interference determination range A4 and the already-mounted component interference determination range B4 overlap for the mounting target position C1 after the swap. The control unit 4 determines the risk of interference with the mounting target position C1 after the replacement, and if there is no risk of interference, causes the mounting head 251 to perform the mounting operation of the held component P1 at the mounting target position C1 after the replacement.

[0083] In the above, we have explained that the head interference judgment range A4 is calculated based on the head data DB at the time of mounting, and the existing component interference judgment range B4 is calculated based on the already mounted component data DA, and the risk of interference between the mounting head 251 and the already mounted component P2 is judged, but the present invention is not limited to such judgment.

[0084] For example, the control unit 4 may calculate the head interference determination range A4 based on the at-mounting head data DB, and determine the risk of interference between the mounting head 251 and the already-mounted component P2 based on the calculated head interference determination range A4 and the already-mounted component data DA. In this case, the control unit 4 determines the risk of interference depending on whether or not at least a portion of the already-mounted component P2 indicated by the already-mounted component data DA is inside the head interference determination range A4. The control unit 4 can determine that there is a risk of interference when at least a portion of the already-mounted component P2 indicated by the already-mounted component data DA is inside the head interference determination range A4.

[0085] Furthermore, the control unit 4 may calculate an existing component interference determination range B4 based on the already-mounted component data DA, and determine the risk of interference between the mounting head 251 and the already-mounted component P2 based on the calculated existing component interference determination range B4 and the at-mounting head data DB. In this case, the control unit 4 determines the risk of interference depending on whether at least a portion of the mounting head 251 at the time of component mounting, indicated by the at-mounting head data DB, is inside the existing component interference determination range B4. The control unit 4 can determine that there is a risk of interference when at least a portion of the mounting head 251 at the time of component mounting, indicated by the at-mounting head data DB, is inside the existing component interference determination range B4.

[0086] Furthermore, the control unit 4 can also determine the risk of interference between the mounting head 251 and the already-mounted component P2 based on the already-mounted component data DA and the at-mounting head data DB, without calculating the head interference determination range A4 and the already-mounted component interference determination range B4. In this case, the control unit 4 recognizes the position of each edge in four directions, +X side, -X side, +Y side, and -Y side, of the holding surface 251A, based on the center of the held component P1 held on the holding surface 251A, for example, based on the holding position deviation data DD included in the at-mounting head data DB. Then, the control unit 4 can determine that there is a risk of interference when at least a part of the already-mounted component P2 indicated by the already-mounted component data DA overlaps with the recognized position of each edge of the holding surface 251A.

[0087] In addition, the control unit 4 can also determine that there is a risk of interference when at least a portion of the already mounted component P2 indicated by the already mounted component data DA is present within a predetermined range from the center of the holding surface 251A of the mounting head 251 at the time of component mounting indicated by the mounting head data DB.

[0088] (Second example of interference processing) Among the components to be mounted on the substrate PP, there are specific components that are permitted to be mounted in a first orientation relative to the substrate PP and that are permitted to be mounted in a second orientation rotated by a predetermined angle, for example, 180 degrees, from the first orientation. When the held component P1 held by the mounting head 251 is the specific component, depending on the positional relationship between the target mounting position A1 of the held component P1 and the target mounting position B1 of the already-mounted component P2, the risk of interference between the mounting head 251 and the already-mounted component P2 changes when the mounting head 251 is rotated around a head axis perpendicular to the holding surface 251A, depending on the state of positional deviation of the held component P1 with respect to the holding surface 251A of the mounting head 251. Therefore, in the interference processing S5 according to the second example, when determining the risk of interference between the mounting head 251 and the already-mounted component P2, the control unit 4 assumes a first state and a second state obtained by rotating the mounting head 251 at a predetermined angle (for example, 180 degrees) from the first state, and determines whether or not there is a risk of interference between the mounting head 251 and the already-mounted component P2 in each state. For example, even if there is a risk of interference between the mounting head 251 in the first state and the already-mounted component P2, there may be no risk of interference with the already-mounted component P2 in the mounting head 251 in the second state obtained by rotating the mounting head 251 at a predetermined angle from the first state.

[0089] The interference processing S5 according to the second example executed by the control unit 4 will be described below with reference to the flowcharts of Figures 8 and 9. Note that the interference processing S5 according to the second example is the same as the interference processing S5 according to the first example described above, except that it assumes a case where the mounting head 251 is rotated when determining the risk of interference between the mounting head 251 and the already-mounted component P2. Therefore, the processing content common to the interference processing S5 according to the first example described above will be described in a simplified manner.

[0090] The control unit 4 determines, based on the production plan data D1, whether or not there is an already-mounted component P2 around the mounting target position A1 corresponding to the held component P1 held by the mounting head 251 (step S5B1). If there is an already-mounted component P2 around the mounting target position A1 (YES in step S5B1), the control unit 4 acquires, based on the production plan data D1, already-mounted component data DA related to the already-mounted component P2 around the mounting target position A1 and mounting head data DB related to the mounting head 251 at the time of component mounting, assuming a scenario in which the held component P1 is mounted at the mounting target position A1. Then, based on the already-mounted component data DA and the mounting head data DB, the control unit 4 determines whether or not the height of the already-mounted component P2 is equal to or greater than the height of the held component P1 (step S5B2). If the height of the already mounted component P2 is equal to or greater than the height of the held component P1 (YES in step S5B2), the control unit 4 calculates, based on the head data DB at the time of mounting, a head interference judgment range A4 indicating the possible range within which the mounting head 251 can exist when mounting the held component P1 at the target mounting position A1, and also calculates, based on the already mounted component data DA, an existing component interference judgment range B4 indicating the possible range within which the already mounted component P2 can exist on the board PP (step S5B3).

[0091] After calculating the head interference determination range A4 and the existing component interference determination range B4, the control unit 4 determines whether there is a risk of interference between the mounting head 251 and the already-mounted component P2, depending on whether the head interference determination range A4 and the existing component interference determination range B4 overlap (step S5B4). As shown in Fig. 8(A), if the head interference determination range A4 and the existing component interference determination range B4 overlap, the control unit 4 determines that there is a risk of interference between the mounting head 251 and the already-mounted component P2.

[0092] 8(B), the control unit 4 rotates the head interference determination range A4 by a predetermined angle around the target mounting position A1 corresponding to the held component P1, assuming that the mounting head 251 is rotated by a predetermined angle (e.g., 180 degrees) (step S5B5). Then, the control unit 4 determines whether there is a risk of interference between the rotated mounting head 251 and the already-mounted component P2, depending on whether the head interference determination range A4 after the rotation overlaps with the already-mounted component interference determination range B4 (step S5B6).

[0093] If there is no risk of interference between the rotated mounting head 251 and the previously mounted component P2 (NO in step S5B6), the control unit 4 executes the mounting process S6 so that the mounting head 251 rotated by the predetermined angle mounts the held component P1 at the original mounting target position A1. On the other hand, if there is a risk of interference between the rotated mounting head 251 and the previously mounted component P2 (YES in step S5B6), the control unit 4 determines whether there is a similar component of the same type that is placed later in the mounting order than the held component P1 held by the mounting head 251, based on the mounting order data D2 and component data D4 included in the production plan data D1 (step S5B7). If there is no similar component (NO in step S5B7), the control unit 4 executes a held component discard process that controls the head unit 25 to discard the held component P1 held by the mounting head 251 (step S5BZ).

[0094] On the other hand, if a component of the same type is present (YES in step S5B7), the control unit 4 recognizes the target mounting position C1 of the component of the same type based on the target mounting position data D5 corresponding to the component of the same type. Then, the control unit 4 replaces the target mounting position A1 corresponding to the held component P1 with the target mounting position C1 corresponding to the component of the same type, and sets the target mounting position C1 corresponding to the component of the same type as the target mounting position when the mounting head 251 mounts the held component P1 (step S5B8).

[0095] When the target mounting position A1 of the held component P1 is swapped with the target mounting position C1 of the same type of component in step S5B8, the control unit 4 repeats the processes of steps S5B1 to S5B7 for the target mounting position C1 after the swap.

[0096] (Third example of interference processing) In the interference processing S5 of the third example, if it is determined that there is a risk of interference between the mounting head 251 and the already mounted component P2 in a judgment based on the overlap between the head interference judgment range A4 based on the head data DB at the time of mounting and the already mounted component interference judgment range B4 based on the already mounted component data DA, the control unit 4 again determines whether there is a risk of interference between the mounting head 251 and the already mounted component P2 based on the already mounted component image G3 acquired by the second imaging unit 29B and the head data DB at the time of mounting.

[0097] The interference processing S5 according to the third example executed by the control unit 4 will be described below with reference to the flowcharts of Figures 10 and 11. Note that the interference processing S5 according to the third example is the same as the interference processing S5 according to the first example described above, except that re-determination is performed based on the already-mounted component image G3 when determining the risk of interference between the mounting head 251 and the already-mounted component P2. Therefore, the processing content common to the interference processing S5 according to the first example described above will be described in a simplified manner.

[0098] The control unit 4 determines, based on the production plan data D1, whether or not there is an already-mounted component P2 around the mounting target position A1 corresponding to the held component P1 held by the mounting head 251 (step S5C1). If there is an already-mounted component P2 around the mounting target position A1 (YES in step S5C1), the control unit 4 acquires, based on the production plan data D1, already-mounted component data DA related to the already-mounted component P2 around the mounting target position A1 and mounting head data DB related to the mounting head 251 at the time of component mounting, assuming a scenario in which the held component P1 is mounted at the mounting target position A1. Then, based on the already-mounted component data DA and the mounting head data DB, the control unit 4 determines whether or not the height of the already-mounted component P2 is equal to or greater than the height of the held component P1 (step S5C2). If the height of the already mounted component P2 is equal to or greater than the height of the held component P1 (YES in step S5C2), the control unit 4 calculates, based on the head data DB at the time of mounting, a head interference judgment range A4 indicating the possible range within which the mounting head 251 can exist when mounting the held component P1 at the target mounting position A1, and also calculates, based on the already mounted component data DA, an already mounted component interference judgment range B4 indicating the possible range within which the already mounted component P2 can exist on the board PP (step S5C3).

[0099] After calculating the head interference determination range A4 and the existing component interference determination range B4, the control unit 4 determines whether there is a risk of interference between the mounting head 251 and the already-mounted component P2, depending on whether the head interference determination range A4 and the existing component interference determination range B4 overlap (step S5C4). As shown in Fig. 10(A), if the head interference determination range A4 and the existing component interference determination range B4 overlap, the control unit 4 determines that there is a risk of interference between the mounting head 251 and the already-mounted component P2.

[0100] 10(B), the control unit 4 calculates an already-mounted component range BS indicating the range of the already-mounted component P2 on the board PP based on the already-mounted component image G3 acquired by the second imaging unit 29B, and performs a re-determination based on the already-mounted component image G3 (step S5C5). In this case, the control unit 4 re-determines whether there is a risk of interference between the mounting head 251 and the already-mounted component P2 depending on whether the head interference determination range A4 and the already-mounted component range BS overlap (step S5C6).

[0101] By calculating the already-mounted component area BS based on the already-mounted component image G3, the control unit 4 can calculate the already-mounted component area BS corresponding to the actual mounting state of the already-mounted component P2 on the board PP. This allows the control unit 4 to determine the risk of interference between the mounting head 251 and the already-mounted component P2 corresponding to the actual mounting state of the already-mounted component P2. Even if it is determined that there is a risk of interference between the mounting head 251 and the already-mounted component P2 in the determination based on the overlap between the head interference determination area A4 and the already-mounted component interference determination area B4, it may be determined that there is no risk of interference in the determination based on the overlap between the already-mounted component area BS based on the already-mounted component image G3 and the head interference determination area A4.

[0102] If the re-determination based on the already-mounted component image G3 indicates no risk of interference between the mounting head 251 and the already-mounted component P2 (NO in step S5C6), the control unit 4 executes mounting process S6 to mount the held component P1 at the original mounting target position A1 corresponding to the held component P1. On the other hand, if the re-determination based on the already-mounted component image G3 indicates a risk of interference between the mounting head 251 and the already-mounted component P2 (YES in step S5C6), the control unit 4 determines whether there is a similar component of the same type that is placed later in the mounting order than the held component P1 held by the mounting head 251, based on the mounting order data D2 and component data D4 included in the production plan data D1 (step S5C7). If there is no similar component (NO in step S5C7), the control unit 4 executes held component discarding process to control the head unit 25 to discard the held component P1 held by the mounting head 251 (step S5CZ).

[0103] On the other hand, if a component of the same type is present (YES in step S5C7), the control unit 4 recognizes the target mounting position C1 of the component of the same type based on the target mounting position data D5 corresponding to the component of the same type. Then, the control unit 4 replaces the target mounting position A1 corresponding to the held component P1 with the target mounting position C1 corresponding to the component of the same type, and sets the target mounting position C1 corresponding to the component of the same type as the target mounting position when the mounting head 251 mounts the held component P1 (step S5C8).

[0104] When the mounting target position A1 of the held component P1 is swapped with the mounting target position C1 of the same type of component in step S5C8, the control unit 4 repeats the processes of steps S5C1 to S5C7 for the mounting target position C1 after the swap.

[0105] (Fourth example of interference processing) In the interference processing S5 according to the fourth example, the control unit 4 acquires the tolerance data D6 based on the production plan data D1, and determines the risk of interference between the mounting head 251 and the already-mounted component P2 using the mounting head data DB including the tolerance data D6. This reduces the calculation load on the control unit 4 when controlling the mounting operation of the mounting head 251 to mount the held component P1, and improves the efficiency of determining the risk of interference.

[0106] The interference processing S5 according to the fourth example, which is executed by the control unit 4, will be described below with reference to the flowchart of FIG.

[0107] The control unit 4 determines, based on the production plan data D1, whether or not a previously mounted component P2 exists around the mounting target position A1 corresponding to the held component P1 held by the mounting head 251 (step S5D1). If a previously mounted component P2 exists around the mounting target position A1 (YES in step S5D1), the control unit 4 determines whether or not the height of the previously mounted component P2 is equal to or greater than the height of the held component P1 (step S5D2). If the height of the previously mounted component P2 is equal to or greater than the height of the held component P1 (YES in step S5D2), the control unit 4 makes a determination based on the tolerance data D6 included in the production plan data D1 (step S5D3).

[0108] As described above, the tolerance data D6 indicates the tolerance of the amount of deviation of the holding position of the held component P1 held by the mounting head 251 relative to the holding surface 251A of the mounting head 251. In this case, the control unit 4 determines whether there is a risk of interference between the mounting head 251 and the previously mounted component P2, depending on whether the amount of deviation of the holding position indicated by the holding position deviation data DD calculated based on the held component image G1 falls within the tolerance range indicated by the tolerance data D6 (step S5D4). If the amount of deviation of the holding position indicated by the holding position deviation data DD falls within the tolerance range indicated by the tolerance data D6, the control unit 4 determines that there is no risk of interference between the mounting head 251 and the previously mounted component P2. On the other hand, if the amount of deviation of the holding position indicated by the holding position deviation data DD does not fall within the tolerance range indicated by the tolerance data D6, the control unit 4 determines that there is a risk of interference between the mounting head 251 and the previously mounted component P2.

[0109] If there is no risk of interference between the mounting head 251 and the already-mounted component P2 (NO in step S5D4), the control unit 4 executes a mounting process S6 to mount the held component P1 at the original mounting target position A1 corresponding to the held component P1. On the other hand, if there is a risk of interference between the mounting head 251 and the already-mounted component P2 (YES in step S5D4), the control unit 4 determines whether there is a similar component of the same type that is placed later in the mounting order than the held component P1 held by the mounting head 251, based on the mounting order data D2 and component data D4 included in the production plan data D1 (step S5D5). If there is no similar component (NO in step S5D5), the control unit 4 executes a held component discard process to control the head unit 25 to discard the held component P1 held by the mounting head 251 (step S5DZ).

[0110] On the other hand, if a component of the same type exists (YES in step S5D5), the control unit 4 recognizes the target mounting position C1 of the component of the same type based on the target mounting position data D5 corresponding to the component of the same type. Then, the control unit 4 replaces the target mounting position A1 corresponding to the held component P1 with the target mounting position C1 corresponding to the component of the same type, and sets the target mounting position C1 corresponding to the component of the same type as the target mounting position when the mounting head 251 mounts the held component P1 (step S5D6).

[0111] When the target mounting position A1 of the held component P1 is swapped with the target mounting position C1 of the same type of component in step S5D6, the control unit 4 repeats the processes of steps S5D1 to S5D5 for the target mounting position C1 after the swap. [Explanation of symbols]

[0112] 1. Component mounting equipment 2 Mounting machine body 25 Head Unit 251 Mounting Head 2511 Retaining nozzle 251A Holding surface 29A First Imaging Unit 29B Second imaging unit 3 Storage section 4. Control section D1 Production planning data DA: Data of already installed parts Head data when DB is installed DD Holding position deviation data G1 holding part image G2 PCB recognition image G3 Images of already installed parts P1 Holding part P2 Already installed parts

Claims

1. a head unit including a mounting head having a holding surface for holding a component and for mounting the component held by the holding surface at a target mounting position on a substrate; a first imaging unit that captures an image of a held component held on the holding surface of the mounting head and acquires a held component image; a control unit that controls the head unit so that the mounting head mounts the held components at target mounting positions on the substrate in accordance with a predetermined mounting order, The control unit a calculation process for calculating, based on the held component image, holding position deviation data indicating a deviation amount of the holding position of the held component relative to the holding surface of the mounting head; before the mounting head mounts the held component at the target mounting position, it is determined whether or not there is a risk of interference between the mounting head and the already mounted component based on already mounted component data relating to components already mounted on the board around the target mounting position and head data at the time of mounting relating to the mounting head at the time of component mounting, including the holding position deviation data, and if it is determined that there is a risk of interference, it executes an interference process of replacing the target mounting position of the held component with the target mounting position of a similar component of the same type that is placed later in the mounting order than the held component; a second imaging unit attached to the head unit, which captures images of the already-mounted components on the board and acquires images of the already-mounted components; A component mounting device in which, if the control unit determines in the interference processing that there is a risk of interference based on the already mounted component data and the head data at the time of mounting, it again determines whether there is a risk of interference based on the already mounted component image and the head data at the time of mounting.

2. the already-mounted component data includes already-mounted component position data indicating the positions of the already-mounted components on the board, and already-mounted component type data indicating the types of the already-mounted components; 2. The component mounting apparatus according to claim 1, wherein the mounting head data includes held component type data indicating a type of the held component in addition to the held position deviation data.

3. The component mounting apparatus according to claim 2 , wherein the mounting head data further includes holding surface size data indicating a size of the holding surface.

4. a storage unit that stores production plan data indicating a production plan to be referenced when the control unit controls the head unit; the production plan data includes mounting order data indicating an order in which components are to be mounted on the board, component data relating to the components to be mounted on the board, target mounting position data indicating target mounting positions of the components on the board, and head data relating to the mounting head; 4. The component mounting device according to claim 1, wherein the control unit acquires the already-mounted component data and the head data at the time of mounting based on the production plan data.

5. The control unit, in the interference processing, calculating a head interference determination range indicating a range within which the mounting head can be present when mounting the held component at the target mounting position on the substrate based on the mounting head data; A component mounting device according to any one of claims 1 to 4, which determines that there is a risk of interference when at least a portion of the already mounted component indicated by the already mounted component data is inside the head interference determination range.

6. The control unit, in the interference processing, calculating an existing component interference determination range indicating a range in which the already-mounted components can exist on the board based on the already-mounted component data; A component mounting device as described in any one of claims 1 to 4, which determines that there is a risk of interference when at least a portion of the mounting head at the time of component mounting indicated by the mounting head data is inside the existing component interference judgment range.

7. The control unit, in the interference processing, calculating a head interference determination range indicating a range within which the mounting head can be present when mounting the held component at the target mounting position on the substrate based on the mounting head data; calculating an existing component interference determination range indicating a range in which the already-mounted components can exist on the board based on the already-mounted component data; 5. The component mounting device according to claim 1, wherein when the head interference determination range and the existing component interference determination range overlap, it is determined that there is a risk of interference.

8. The component mounting device according to any one of claims 1 to 7, wherein, when the control unit determines in the interference processing that there is a risk of interference, the control unit replaces the target mounting position of the held component with the target mounting position of the same type of component that is within a predetermined range from the target mounting position.

9. The component mounting device according to any one of claims 1 to 8, wherein, in the interference processing, when the target mounting position of the held component is swapped with the target mounting position of the same type of component, the control unit determines whether there is a risk of interference with the target mounting position after the swap.

10. the mounting head is rotatable about an axis perpendicular to the holding surface; The component mounting device according to any one of claims 1 to 9, wherein the control unit, in the interference processing, assumes a first state and a second state rotated from the first state by a predetermined angle as the state of the mounting head, and determines whether there is a risk of interference in each state.

11. the mounting head data includes tolerance data indicating a tolerance range of a deviation amount of the holding position of the held component with respect to the holding surface of the mounting head, 2. The component mounting device according to claim 1, wherein, when determining the risk of interference in the interference processing, the control unit determines whether the amount of deviation of the holding position indicated by the holding position deviation data is within the allowable range indicated by the allowable range data, and determines that there is a risk of interference if the amount of deviation is not within the allowable range.

Images