Immersion cooling equipment and systems

Abstract

The embodiments of the present disclosure provide an immersion cooling apparatus and an immersion cooling system, the immersion cooling apparatus comprising: a cooling groove suitable for sealingly receiving a main cooling liquid so that an electronic device requiring cooling is immersed in the main cooling liquid; a main heat dissipation device including a lumen attached to the cooling groove and surrounded by a case; a main circulation member and a heat exchanger received in the lumen, the lumen sealingly communicating with the cooling groove, the main circulation member suitable for circulating the main cooling liquid between the cooling groove and an outside of the heat exchanger; and a cooling source interface coupled to the main heat dissipation device and configured to allow an auxiliary cooling liquid to circulate inside the cooling groove and the heat exchanger to exchange heat between the auxiliary cooling liquid and the main cooling liquid in the heat exchanger. The adoption of the modularized immersion cooling apparatus significantly simplifies the deployment of the immersion cooling system in a data center, makes the deployment of the immersion cooling system more flexible, and greatly improves the deployment efficiency.

Description

[Technical Field]

[0001] (CROSS-REFERENCE TO RELATED APPLICATIONS) This application claims priority to Chinese application No. 202111580493.7, entitled "Immersion Cooling Equipment and Immersion Cooling System," filed on December 22, 2021, the entire disclosure of which is incorporated herein by reference.

[0002] FIELD Embodiments of the present disclosure relate generally to the data center field, and more particularly to immersion cooling equipment and systems for providing cooling to data centers. [Background technology]

[0003] With the rapid development of the Internet, artificial intelligence, cloud computing, and high-performance computing, data centers are not only driving major changes in business operations, but also significantly improving the quality of life. Data centers have now been formally incorporated into new infrastructure construction, expanding from serving a select few companies to serving the entire society, becoming a new kind of infrastructure.

[0004] New infrastructure is placing higher requirements on data center heat dissipation solutions and overall energy efficiency. Meanwhile, with the advent of the big data era, data is growing at an unimaginable rate. Massive data processing, storage, and transmission require IT equipment to double its power consumption, posing a major challenge to chip heat dissipation. Traditional data center cooling solutions are already struggling to meet the demand for efficient heat dissipation of electronic information devices. Meanwhile, national, local, and industry energy policies are being implemented, placing higher demands on data center energy-saving indicators. Demand for more energy-efficient, intensive, and efficient IT equipment and overall data center solutions is growing, and immersion cooling solutions are gaining popularity due to their advantages in energy efficiency and rapid delivery. Summary of the Invention [Problem to be solved by the invention]

[0005] SUMMARY OF THE INVENTION Embodiments of the present disclosure provide immersion cooling equipment and systems to at least partially address the above-mentioned problems and other potential problems present in the prior art. [Means for solving the problem]

[0006] One aspect of the present disclosure provides an immersion cooling device including: a cooling groove adapted to sealingly receive a main coolant so that an electronic device requiring cooling is immersed in the main coolant; a main heat dissipation device including a lumen attached to the cooling groove and surrounded by a case, a main circulation member and a heat exchanger received in the lumen, the lumen sealingly communicating with the cooling groove, and the main circulation member adapted to circulate the main coolant between the cooling groove and an exterior of the heat exchanger; and a cooling source interface coupled to the main heat dissipation device and configured to allow an auxiliary coolant to circulate between an external cooling source and the heat exchanger to exchange heat between the auxiliary coolant and the main coolant in the heat exchanger.

[0007] By deploying an immersion cooling device according to an embodiment of the present disclosure, on the one hand, the main heat dissipation device itself has an internal circulation capacity (main coolant circulation) and an external circulation interface (allowing auxiliary coolant circulation), so the main heat dissipation device itself does not require an additional cooling amount allocation unit, forming a modular device. In this manner, the immersion cooling device according to an embodiment of the present disclosure can improve cooling efficiency by providing main heat dissipation devices with various specifications for factors such as different electronic devices. On the other hand, by adding a main heat dissipation device with an internal circulation capacity and an external circulation interface and a cooling channel, a modular immersion cooling device can be further formed. When deploying an immersion cooling device according to an embodiment of the present disclosure, deployment is completed by simply connecting the data center's reserved interface with the immersion cooling device's cooling source interface, thereby forming a distributed immersion cooling system. This method significantly simplifies the deployment of immersion cooling devices. Furthermore, users can select different numbers of immersion cooling devices depending on the required scale. Only a certain number of reserved interfaces are required, and users can increase or decrease the number of immersion cooling devices as needed depending on business volume adjustments. This makes the deployment of immersion cooling equipment in data centers more flexible and significantly improves deployment efficiency.

[0008] In some embodiments, the main heat dissipation device is removably attached to the cooling channel. For example, in some embodiments, the main heat dissipation device may be indirectly attached to the cooling channel via a bracket. This method allows different specifications of the main heat dissipation device to be selected for different electronic devices, thereby improving cooling efficiency and further promoting carbon neutrality.

[0009] In some embodiments, the immersion cooling apparatus further includes a bracket suitable for mounting the cooling channel and the main heat dissipation device. Employing a bracket to mount the cooling channel and the main heat dissipation device makes the immersion cooling apparatus easier to deploy.

[0010] In some embodiments, multiple electronic devices are arranged in the cooling groove along its extension direction, and the size of the immersion cooling device in the extension direction is 1.5 times or less the height of the immersion cooling device. Compared to conventional immersion cooling devices, in which the length of the cooling groove itself is 2 to 3 times its height, and thus even larger, the size of the immersion cooling device according to the present disclosure, including the main heat dissipation device, in the extension direction is 1.5 times or less, e.g., 1 time or less, the height. This approach allows for a compact immersion cooling device. The compact size offers many advantages, including flexibility in adjusting the size according to the required cooling scale. This improves the utilization rate of the immersion cooling system and the immersion cooling medium therein. On the other hand, the compact size allows for more precise control of the cooling liquid, thereby saving the cooling medium and improving precise cooling control of the electronic devices.

[0011] In some embodiments, the size of the immersion cooling device in the extension direction is smaller than the height of the immersion cooling device.

[0012] In some embodiments, the size of the immersion cooling device in the extension direction is less than half the height of the immersion cooling device, which allows for further miniaturization of the immersion cooling device, thereby further saving cooling medium and improving precise cooling control of the electronic device.

[0013] In some embodiments, the submersion cooling apparatus further includes a plurality of access holes sealingly disposed between the cooling channel and the lumen of the main heat dissipation device for circulating the main coolant between the cooling channel and the exterior of the heat exchanger, thereby improving the reliability of the submersion cooling apparatus by providing a redundant arrangement of access holes.

[0014] In some embodiments, the cooling grooves have various specifications, the cooling grooves of the various specifications have different depths and / or different sizes in the extension direction, and the bracket is suitable for receiving the cooling grooves of at least one of the various specifications. In this manner, users can rationally select the cooling grooves of the required specifications according to the size of the electronic device that needs to be cooled, thereby further saving the main coolant and enabling precise control of the main coolant.

[0015] In some embodiments, the immersion cooling apparatus further includes an elevated rack coupled to the bracket and adapted to support at least one of the cooling channel and the main heat dissipation device. The elevated rack can improve the structural stability and reliability of the immersion cooling apparatus by elevating the relatively shallow cooling channel. This arrangement also improves the convenience of coupling the cooling source interface and the storage interface of the immersion cooling system.

[0016] In some embodiments, the main heat dissipation device has various specifications, the main heat dissipation devices of the various specifications have different heat circulation and dissipation capacities, and the bracket is suitable for receiving the main heat dissipation device of at least one of the various specifications, so that users can improve the circulation and cooling efficiency of the main heat dissipation device by selecting a main heat dissipation device of a required specification according to different specifications of cooling grooves and / or the number of electronic devices.

[0017] In some embodiments, the immersion cooling equipment further includes a lid coupled to the cooling channel to seal a top opening of the cooling channel, which facilitates easier maintenance of the primary coolant and electronics in the cooling channel, thereby improving maintenance efficiency.

[0018] In some embodiments, the lid is pivotally coupled to the cooling channel via a hinge, which further improves the convenience and thereby the efficiency of maintenance of the immersion cooling equipment.

[0019] In some embodiments, the main heat dissipation device further includes a liquid occupying block disposed in the lumen, which can reduce the cost of the immersion cooling device by effectively reducing the amount of main coolant used.

[0020] In some embodiments, the cooling source interfaces include at least two sets of cooling source interfaces, in this manner the cooling source interfaces also form a redundant arrangement, thereby further improving the reliability of the immersion cooling equipment.

[0021] In some embodiments, the cooling source interface is at least partially disposed in the case, which facilitates easier deployment of the immersion cooling device.

[0022] A second aspect of the present disclosure provides an immersion cooling system, comprising at least one immersion cooling apparatus as described in the first aspect of the preamble, and an auxiliary cooling device coupled to a cooling source interface of the at least one immersion cooling apparatus and adapted to circulate an auxiliary cooling liquid between an external cooling source and an interior of the heat exchanger.

[0023] In some embodiments, the at least one immersion cooling device comprises a plurality of immersion cooling devices, and the immersion cooling system further comprises a plurality of reservation interfaces, the plurality of reservation interfaces adapted to be coupled to the cooling source interface.

[0024] In some embodiments, the immersion cooling system further includes a base including a plurality of receiving sections installed at predetermined positions for installing the plurality of immersion cooling devices, the receiving sections corresponding to the plurality of reserved interfaces. When large-scale deployment is performed on servers, installing the base can further reduce deployment time in data centers.

[0025] In some embodiments, the primary coolant comprises a fluorinated liquid or a mineral oil, and / or the secondary coolant comprises deionized water.

[0026] A third aspect of the present disclosure provides an immersion cooling system for deployment in large-scale clusters. The immersion cooling system includes a base including a plurality of receiving sections installed at predetermined locations, a plurality of reserved interfaces corresponding to the positions of the receiving sections, an auxiliary cooling device installed between the reserved interfaces and an external cooling source, and a plurality of immersion cooling devices as described in the first aspect of the preceding paragraph, installed in the receiving sections, with the cooling source interfaces of the immersion cooling devices connected to the reserved interfaces. When deploying the immersion cooling devices in large-scale clusters, the immersion cooling system can be formed by first installing the base and reserved interfaces in a data center, placing the immersion cooling devices in a machine room in the data center, connecting the return water pipes to the external cooling source, and completing a trial run, without first installing the electronic equipment and the main cooling fluid. When business demand arises, electronic equipment is purchased and installed in the system, and the immersion cooling devices where the electronic equipment is installed are finally filled with the main cooling fluid. This completes the deployment of the entire data center. This method significantly reduces the deployment time of data centers.

[0027] It should be understood that this section is not intended to identify key or important features of the embodiments of the present disclosure, nor is it intended to limit the scope of the present disclosure. Other features of the present disclosure will become more readily apparent from the following description. [Brief explanation of the drawings]

[0028] The above and other objects, features, and advantages of the present disclosure will become more apparent from the following detailed description of exemplary embodiments of the present disclosure taken in conjunction with the drawings, in which like reference numerals generally represent like elements. [Figure 1] 1 shows a schematic diagram of a cooling channel used in a conventional immersion cooling system. [Figure 2] 1 shows a perspective schematic view of an immersion cooling device according to an embodiment of the present disclosure. [Figure 3] 1 shows a perspective schematic view of an immersion cooling apparatus according to an embodiment of the present disclosure viewed from another angle. [Figure 4] 1 shows a perspective schematic view of an immersion cooling device according to an embodiment of the present disclosure as viewed from another angle, where the lid is opened to easily view the electronics therein. [Figure 5] 1 shows a schematic side view of an immersion cooling device according to an embodiment of the present disclosure. [Figure 6] 1A-1C show schematic diagrams of various types of electronic devices arranged in an immersion cooling device according to embodiments of the present disclosure. [Figure 7] 1A-1C show schematic diagrams of various types of electronic devices arranged in an immersion cooling device according to embodiments of the present disclosure. [Figure 8] 1A-1C show schematic diagrams of various types of electronic devices arranged in an immersion cooling device according to embodiments of the present disclosure. [Figure 9] 1 shows a schematic diagram of a main heat dissipation device of an immersion cooling apparatus being pulled out from a bracket according to an embodiment of the present disclosure. FIG. [Figure 10] 1 shows a schematic diagram of a main coolant circulating inside an immersion cooling device according to an embodiment of the present disclosure. [Figure 11] 1 shows a schematic side view of a main heat dissipation device according to an embodiment of the present disclosure. [Figure 12] 1 shows a schematic diagram of a deployment of an immersion cooling system according to an embodiment of the present disclosure. [Figure 13] 1 shows a schematic diagram of an array of immersion cooling equipment in an immersion cooling system according to an embodiment of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0029] The principles of the present disclosure will now be described with reference to various exemplary embodiments shown in the drawings. It should be understood that the description of these embodiments is merely intended to enable those skilled in the art to better understand and further realize the present disclosure, and is not intended to limit the scope of the present disclosure in any manner. It should be noted that similar or identical reference numerals may be used in the figures where possible. Furthermore, similar or identical reference numerals may represent similar or identical functions. Those skilled in the art will readily recognize from the following description that alternative embodiments of the structures and methods described herein may be employed without departing from the principles of the present disclosure described herein.

[0030] With the rapid development of the information and communications industry, the integration density and heat density of electronic devices are becoming increasingly higher. As the power consumption of chips continues to rise and the integration density of electronic devices continues to grow, the traditional technology of using air as a medium to dissipate heat from electronic products is increasingly unable to meet the demand. The industry has begun to seek more intensive heat dissipation solutions, and immersion cooling has begun to come into people's sights.

[0031] Immersion cooling, also known as liquid immersion cooling, involves immersing an electronic device 200, such as a server, in a non-conductive liquid to dissipate heat and thereby control the temperature within a reasonable range. The following description of the concept of the present disclosure primarily uses various types of servers employed in data centers as examples of the electronic device. It should be understood that the liquid immersion cooling device 100 or liquid immersion cooling system according to the embodiments of the present disclosure can be equally applied to any other suitable cases where electronic devices need to be cooled. FIG. 1 shows a cooling channel 500 typically used in a conventional immersion cooling scheme. In a data center, electronic devices employing immersion cooling are immersed in a cooling liquid in the cooling channel 500, and the cooling liquid exchanges heat with a supplemental cooling liquid, such as air or water, in a heat exchanger, thereby achieving efficient cooling.

[0032] In the early days of immersion cooling, cooling channels 500 with relatively large capacities were typically used to accommodate a relatively large number of electronic devices in each cooling channel 500 to meet the demands of larger data centers. Multiple electronic devices, such as servers, were aligned along the cooling channel 500. The size (i.e., length) of a conventional cooling channel 500 in the extension direction generally reached 50U or more, with a physical length of approximately 2-3 meters or even longer. U is a unit used to represent the external size of an electronic device and is an abbreviation of "unit." With the rapid development of the information and communications industry, cooling channels 500 with relatively large capacities also face many challenges. For example, their relatively large capacity limits deployment flexibility, thereby increasing operational and maintenance complexity and costs. Furthermore, due to the relatively long length of the cooling channel, users are generally only able to operate and maintain the electronic devices immersed in the cooling channel 500 in the width direction, which causes inconvenience during maintenance.

[0033] Furthermore, the cooling fluid in the current cooling channel 500 is usually relatively expensive. Because the cooling channel 500 has a relatively large capacity, a large amount of cooling fluid is required. This inevitably leads to increased costs, especially in some cases where not many electronic devices are required in the cooling channel 500. For example, if the cooling channel 500 has a capacity to accommodate 50 electronic devices, some small businesses may only need 10 electronic devices. When using such a cooling channel 500, the installation of 10 electronic devices and the installation of 50 electronic devices require the same cooling channel, and therefore, more cooling fluid, resulting in a significant increase in costs.

[0034] In addition, the current immersion cooling system has a relatively poor stability, which increases the risk of problems such as clogging at the coolant inlet and outlet interface, which increases the risk of the electronic devices immersed in the cooling channel 500 becoming inoperable, and further increases the risk of relatively large losses.

[0035] As mentioned above, the submersion cooling system can cool various models and sizes of electronic devices. However, current cooling channels 500 generally have a uniform, relatively large depth to accommodate the largest size of electronic devices. In such cases, when a relatively small size electronic device is submerged therein, most of the space therein becomes empty, which also leads to waste of space and cooling liquid therein.

[0036] Furthermore, conventional cooling channels 500 currently cannot independently achieve heat exchange between the coolant and an auxiliary coolant, such as water, in a heat exchanger. Conventional cooling channels 500 currently require the installation of a specialized cooling distribution unit (CDU) to achieve heat exchange. However, the installation of the cooling distribution unit, the installation of the cooling channel 500, and the installation of the electronic devices therein all require certain correlations and proportional relationships, which makes the design of conventional immersion cooling systems complicated, resulting in problems such as slow design and construction and reduced efficiency. Furthermore, due to the correlations and proportional relationships between the cooling distribution unit, the cooling channel, and the electronic devices, the immersion cooling system makes it difficult to adjust the number of electronic devices to accommodate changes in workload after installation, resulting in various problems such as poor flexibility.

[0037] Embodiments of the present disclosure provide an immersion cooling apparatus 100 and an immersion cooling system 300 that at least overcomes or at least partially overcomes the above and other potential problems with conventional immersion cooling apparatuses and systems. Figures 2, 3, and 4 show perspective schematic views of an immersion cooling apparatus 100 according to an embodiment of the present disclosure viewed from different angles. Figure 5 shows a side schematic view of the immersion cooling apparatus 100, where in Figure 4 the lid 106 of the immersion cooling apparatus 100 has been opened to readily reveal the electronics therein.

[0038] As shown in FIGS. 2 to 5 , an immersion cooling device 100 according to an embodiment of the present disclosure generally includes a cooling channel 102, a main heat dissipation device 103, and a cooling source interface 104. The cooling channel 102 is used to hermetically receive a cooling liquid and the electronic device 200 requiring cooling so that the electronic device 200 is immersed in the cooling liquid. One or more electronic devices 200 may be installed in the cooling channel 102. The multiple electronic devices 200 may be arranged in the cooling channel 102 along the extension direction E. The electronic devices 200 in the cooling channel 102 may be various types of servers. For example, as shown in FIGS. 6 to 8 , the electronic devices 200 may include, but are not limited to, a storage-based server, a computing-based server, and an integrated computing-storage-based server.

[0039] 6 to 8 show top views of the cooling groove 102. Various types of electronic devices 200 accommodated in the cooling groove 102 are shown. As can be seen from FIGS. 6 to 8, in order to maximize the deployment density, the electronic devices 200 in the cooling groove 102 may be inserted into the cooling groove 102 substantially vertically along the extension direction E. A structure or module for inserting the electronic devices 200 may be provided in the cooling groove 102 to facilitate the arrangement of the electronic devices 200. This approach allows the electronic devices 200 to be arranged in the cooling groove 102 with greater density, and also makes it easier for an operator to perform maintenance on the electronic devices 200.

[0040] The cooling liquid stored in the cooling groove 102 is a non-conductive liquid, which may include, but is not limited to, a fluorinated liquid or mineral oil. Hereinafter, the cooling liquid in the cooling groove 102 will be referred to as a main cooling liquid to distinguish it from other cooling liquids.

[0041] To facilitate maintenance of the electronic device 200 and the main coolant therein, the cooling channel 102 has a top opening. In some embodiments, the entire top area of ​​the cooling channel 102 may be a top-opening area to facilitate maintenance of the electronic device 200 and the main coolant. To achieve a tight seal, the immersion cooling device 100 further includes a lid 106 disposed at the top opening of the cooling channel 102. The lid 106 is sealingly coupled to the cooling channel 102 to achieve a tight seal for the coolant. In some embodiments, the lid 106 may be rotatably disposed on the cooling channel 102 using a hinge or other method. When maintenance of the electronic device 200 or the main coolant needs to be performed, the lid 106 can be opened by rotating the lid 106 around the hinge. To provide a tight seal, a seal ring may be disposed at the location where the lid 106 and the cooling channel 102 join.

[0042] It should be understood that the embodiment in which the lid 106 is coupled to the cooling channel 102 in a manner such as a hinge is merely schematic and is not intended to limit the scope of protection of the present disclosure. Any other suitable manner or arrangement is possible. For example, in some alternative embodiments, the lid 106 may be placed directly on the cooling channel 102 or may be removed from the cooling channel 102 altogether.

[0043] To facilitate placement of the main heat dissipation device 103 and the cooling channels 102, in some embodiments, the immersion cooling apparatus 100 according to embodiments of the present disclosure may further include a bracket 101. The bracket 101 may be a load-bearing structure for supporting the cooling channels 102 and the main heat dissipation device 103. While FIGS. 2 through 5 illustrate the bracket 101 having a generally frame-type structure, it should be understood that such an arrangement as shown in FIGS. 2 through 5 is merely schematic and is not intended to limit the scope of protection provided by the present disclosure. Any other suitable structure or arrangement is also possible. For example, in some alternative embodiments, the bracket 101 may be a fully or semi-enclosed case 1031 structure constructed of plate-like members.

[0044] In some embodiments, the cooling channel 102 may be fixedly mounted to a first portion of the bracket 101. The main heat dissipation device 103 may be mounted to a second portion adjacent to the first portion. The cooling channel 102 may be fixedly mounted to the first portion by, for example, welding, fastener connection, interference fit, etc. The main heat dissipation device 103 may be disposed in a removable manner on the second portion of the bracket 101 to facilitate maintenance and replacement of the main heat dissipation device 103.

[0045] In some embodiments, to save space and facilitate deployment, a first portion of the bracket 101 for receiving the cooling grooves 102 and a second portion of the bracket 101 for receiving the main heat dissipation device 103 may have different heights. For example, as shown in FIG. 4 , the height of the portion of the bracket 101 for receiving the cooling grooves 102 may be greater than the height of the portion of the bracket 101 for receiving the main heat dissipation device 103. Of course, it should be understood that this is merely a schematic representation and is not intended to limit the scope of protection of the present disclosure. In some alternative embodiments, each portion of the bracket 101 may have a uniform height. The use of the bracket 101 promotes modularity of the immersion cooling apparatus 100, thereby making deployment of the immersion cooling apparatus 100 easier.

[0046] To facilitate removal of the main heat dissipation device 103, in some embodiments, the main heat dissipation device 103 may include a handle 1035 installed at a predetermined position. For example, FIG. 9 shows the handle 1035 installed on the ceiling wall of the main heat dissipation device 103. Note that, to facilitate locking the main heat dissipation device 103 to the bracket 101, in some embodiments, a locking device may be installed on the bracket 101. A locking structure, such as a groove, hole, or buckle, that engages with the locking device may be installed at a corresponding position on the main heat dissipation device 103. After the main heat dissipation device 103 is placed in a predetermined position on the bracket 101, the locking device can be automatically or manually engaged with the locking structure to lock the main heat dissipation device 103 to the bracket 101. When replacement or maintenance of the main heat dissipation device 103 is required, the main heat dissipation device 103 can be removed from the bracket 101 and replaced with a new main heat dissipation device 103 simply by operating the locking device to unlock it and then operating the handle 1035.

[0047] It should be understood that the above embodiment in which the main heat dissipation device 103 is indirectly attached to the cooling groove 102 using the bracket 101 is merely schematic and is not intended to limit the scope of protection of the present disclosure. The main heat dissipation device 103 and the cooling groove 102 may adopt any other suitable attachment manner. For example, in some alternative embodiments, the main heat dissipation device 103 may be directly and detachably attached to the cooling groove 102 by means of, for example, a card buckle, a fastener, and a locking groove. The following mainly describes the concept according to the present disclosure in the manner in which the main heat dissipation device 103 and the cooling groove 102 are coupled to and deployed on the bracket 101. It should be understood that other coupling manners between the main heat dissipation device 103 and the cooling groove 102 are similar, and therefore, detailed descriptions thereof will be omitted below.

[0048] The main heat dissipation device 103 has a sealed structure. It includes an inner cavity sealed by a case 1031, and a main circulation member 1032 and a heat exchanger 1033 received in the inner cavity. In this manner, the main heat dissipation device 103 forms a modular device. When the main heat dissipation device 103 is placed on the bracket 101, it is located adjacent to the cooling groove 102. The inner cavity of the main heat dissipation device 103 is in sealing communication with the cooling groove 102. The main circulation member 1032 is used to circulate the main coolant through the cooling groove 102 and the inner cavity, more specifically, to circulate the main coolant to the outside of the cooling groove 102 and the heat exchanger 1033.

[0049] The heat exchanger 1033, also known as a heat exchanger, is a device that transfers heat from one medium to another. In the present disclosure, the heat exchanger 1033 is a device for transferring heat from the electronic device 200 from a main coolant to an auxiliary coolant, such as deionized water. Heat is conducted through the structure and materials of the heat exchanger 1033. The structure of the heat exchanger 1033 separates the main coolant from the auxiliary coolant. For example, the main coolant flows outside the heat exchanger 1033, while the auxiliary coolant flows inside the heat exchanger. In this specification, the liquid outside the heat exchanger 1033 is referred to as the main coolant, and the liquid inside the heat exchanger 1033 is referred to as the auxiliary coolant. However, it should be understood that this is merely a way to distinguish between the coolants and is not intended to represent a difference in cooling effect. In the present disclosure, heat exchange between the main coolant and the auxiliary coolant in the heat exchanger 1033 achieves effective cooling of the electronic device 200. In some cases, the main coolant is also referred to as a primary coolant, an auxiliary coolant, or a secondary coolant.

[0050] In this manner, the main heat dissipation device 103 forms a modularized device due to the above-described arrangement of the main circulation member 1032 and the heat exchanger 1033 in the main heat dissipation device 103. Main heat dissipation devices 103 with various specifications may be installed according to different circulation heat dissipation capacities. Users can further improve the cooling efficiency by selecting a main heat dissipation device 103 with an appropriate specification according to different electronic devices 200 to be cooled and different cooling channels 102, as will be further described below.

[0051] In some embodiments, to improve cooling efficiency, the heat exchanger 1033 may have a microstructure, such as a labyrinth structure, which can ensure a large contact area between the cooling medium and the heat exchanger, thereby enabling the heat dissipation of the electronic device 200 to be more efficient.

[0052] 10 illustrates a side cross-sectional view of an immersion cooling apparatus 100 according to an embodiment of the present disclosure. As shown in FIG. 10 , in some embodiments, the immersion cooling apparatus 100 further includes a plurality of access through-holes. The access through-holes are located between the cooling groove 102 and the lumen of the main heat dissipation device 103. For example, in some embodiments, the access through-holes may be located in a plate or wall disposed between the cooling groove 102 and the lumen of the main heat dissipation device 103. The access through-holes provide communication of the main coolant between the cooling groove 102 and the lumen of the main heat dissipation device 103.

[0053] In some embodiments, the inlet / outlet through-holes may include multiple inlets arranged above and multiple outlets arranged below. Here, "inlet" and "outlet" refer to the flow direction of the main coolant relative to the inner cavity of the main heat dissipation device 103. The main circulation member 1032 causes the main coolant to enter the cooling channel 102 from the lower outlet. Driven by the main circulation member 1032, the main coolant entering the cooling channel 102 flows from bottom to top and finally re-enters the inner cavity of the main heat dissipation device 103 from the upper inlet. The main coolant passes through the outside of the heat exchanger 1033 in the inner cavity of the main heat dissipation device 103, loses heat, and cools down, before re-entering the cooling channel 102 from the lower outlet. This reciprocating circulation achieves cooling of the electronic device 200 in the cooling channel 102.

[0054] On the one hand, such a bottom-to-top circulation manner of the main coolant in the cooling groove 102 is more advantageous in removing heat from the electronic device 200. On the other hand, in the inner cavity of the main heat dissipation device 103, the main coolant passes through the heat exchanger 1033 from top to bottom under the action of gravity and the driving force of the main circulation member 1032, which is more advantageous in heat exchange between the main coolant and the auxiliary coolant inside the heat exchanger 1033, and further improves the heat exchange efficiency. In some embodiments, the main circulation member 1032 may include one or more circulation pumps.

[0055] As can be seen from the above description, the heat exchanger 1033 employed in this specification employs liquid-liquid heat exchange, which is more efficient than the conventional gas-liquid heat exchange method, thereby improving the cooling efficiency of the entire immersion cooling equipment 100.

[0056] In some embodiments, a plurality of access holes may be provided for communication between the cooling groove 102 and the lumen of the main heat dissipation device 103. This provides a redundant design for the access holes, and even if one of the holes is clogged or otherwise fails, it will not affect the effective flow and circulation of the main coolant between the cooling groove 102 and the lumen of the main heat dissipation device 103, thereby ensuring the cooling effect.

[0057] It should be further explained that the immersion cooling device 100 according to the embodiments of the present disclosure is a miniaturized device. Specifically, in some embodiments, the size of the immersion cooling device 100 in the extension direction E may be 1.5 times or less its height H, or the size of the immersion cooling device 100 may be up to 30 μm. For example, the size of the immersion cooling device 100 in the extension direction E may be smaller than its height H. In some alternative embodiments, the size of the immersion cooling device 100 in the extension direction E may be smaller than half the height H. Considering the size of many electronic devices 200, the height H of the immersion cooling device 100 is generally about 1 meter. That is, in some embodiments, the size of the immersion cooling device 100 in the extension direction E may be 1.5 meters or less, for example, smaller than 1 meter or 0.5 meters. This allows the immersion cooling device 100 to have a miniaturized size. As mentioned above, in the conventional immersion cooling equipment 100, the length (i.e., the size in the extension direction E) of a single cooling groove 102 is about 2 to 3 meters, which does not include the necessary immersion cooling allocation units, etc. As mentioned above, the large capacity of the cooling groove 102 also brings about various problems.

[0058] In contrast, for the immersion cooling equipment 100 according to the present disclosure, the size of the entire immersion cooling equipment 100 (including the cooling grooves 102 and the main heat dissipation device 103) in the extension direction E is 1.5 meters or less, for example, 1 meter or less. The immersion cooling equipment 100 according to the embodiment of the present disclosure adopts a compact size, which on the one hand allows an operator to operate and maintain the electronic equipment 200 therein in all directions of the immersion cooling equipment 100, making maintenance easier and thus avoiding operational errors. This improves the reliability and efficiency of maintenance.

[0059] On the other hand, because the compact immersion cooling apparatus 100 employs compact cooling channels 102, the number of electronic devices 200 placed in each cooling channel 102 is small. This can reduce the operating costs of the electronic devices 200 for some companies that require only a relatively small number of electronic devices 200, but does not affect the application of the immersion cooling apparatus 100 according to the embodiments of the present disclosure to large data centers. Specifically, although the number of electronic devices 200 placed in the cooling channels 102 according to the embodiments of the present disclosure is not large, due to the advantages of the modular structure and ease of deployment mentioned above, multiple immersion cooling modules can be quickly and conveniently deployed to meet the needs of large data centers in a more convenient manner.

[0060] Furthermore, an advantage of adopting a compact immersion cooling device 100 is that because the number of electronic devices 200 placed in the cooling groove 102 is not large, if one of the immersion cooling devices 100 fails, the resulting impact and loss is significantly reduced compared to a conventional large cooling groove 102, thereby further reducing failure costs and maintenance costs.

[0061] Furthermore, the combination of the miniaturized cooling channel 102 and the main heat dissipation device 103 allows for more precise control of the main coolant level in the cooling channel 102. In the conventional design with a large cooling channel 102, the control precision of the coolant level can be up to the centimeter level. In the immersion cooling device 100 according to the embodiment of the present disclosure, the control precision of the main coolant level can be down to the millimeter level. The improved control precision of the main coolant level is also beneficial for further optimizing the heat dissipation and cost of the electronic device 200.

[0062] In some embodiments, the cooling grooves 102 may have different specifications to accommodate different types and sizes of electronic devices 200. The depths of the cooling grooves 102 with different specifications may be different. For some electronic devices 200 with relatively small sizes, cooling grooves 102 with relatively small depth specifications may be employed. For some electronic devices 200 with relatively large sizes, cooling grooves 102 with relatively large depth specifications may be employed. This arrangement can further reduce waste of the main coolant, thereby improving the utilization rate of the main coolant.

[0063] To facilitate deployment of cooling channels 102 of different depths, in some embodiments, the immersion cooling equipment 100 may further include an elevated rack 105 for use with cooling channels 102 having relatively smaller specifications. The elevated rack 105 can be used to compensate for the height deficiency of the immersion cooling equipment 100 with cooling channels 102 having relatively smaller specifications, thereby matching the immersion cooling equipment 100 with cooling channels 102 having relatively higher specifications. For example, the cooling source interface 104 may be maintained at the same level to more easily deploy the immersion cooling equipment 100 on a large scale.

[0064] In some embodiments, alternatively or additionally, the sizes of the cooling grooves 102 with various specifications in the extension direction E may be different. In this manner, the cooling grooves 102 with various specifications may be used to accommodate different numbers or types of electronic devices 200. This makes it possible to avoid wasting the main coolant and further reduce costs by selecting the cooling grooves 102 with appropriate specifications depending on the type and number of electronic devices that require cooling.

[0065] Similar to the cooling channels 102, in some embodiments, due to the modular design of the main heat dissipation device 103, the main heat dissipation device 103 may have a variety of different specifications to facilitate application to cooling channels 102 and / or electronic devices 200 with different specifications. Main heat dissipation devices 103 with different specifications may have different heat dissipation capacities through the circulation of coolant and can be sized to fit cooling channels 102 with different specifications. First, main heat dissipation devices 103 with different specifications may have different circulation capacities. The circulation capacity represents the amount of coolant that can be processed per unit time. The higher the circulation capacity, the greater the amount of coolant that can be processed per unit time, and the lower the circulation capacity, the less the amount of coolant that can be processed per unit time. For example, some cooling channels 102 with relatively small depth specifications can be mated with main heat dissipation devices 103 with relatively small circulation capacities because relatively little main coolant is used therein. Similarly, for some cooling grooves 102 with a relatively large depth specification, since a relatively large amount of main coolant is used therein, it can be mated with a main heat dissipation device 103 with a relatively large circulation capacity. Such an arrangement is advantageous by providing more precise control over the heat dissipation of the electronic device 200 in a more cost-effective manner.

[0066] Alternatively or additionally, the heat dissipation capacities of main heat dissipation devices 103 with different specifications may be different. The heat dissipation capacity may be embodied by differences in the volume and / or microstructure of the heat exchanger. For example, the larger the volume of the heat exchanger and / or the more optimized the microstructure of the heat exchanger, the better the heat dissipation capacity may be, and the smaller the volume of the heat exchanger and / or the larger the microstructure of the heat exchanger, the worse the heat dissipation capacity may be. In this manner, a main heat dissipation device 103 with an appropriate heat dissipation capacity can be selected depending on factors such as the number of electronic devices 200 to be cooled. This can provide more precise control over the heat dissipation of the electronic devices 200 in a more cost-effective manner.

[0067] As mentioned above, since the main heat dissipation device 103 is removably mounted on the bracket 101, as shown in FIG. 9 , if the main heat dissipation device 103 malfunctions or if the circulation capacity of the current main heat dissipation device 103 is insufficient, the original main heat dissipation device 103 can be removed from the bracket 101 and a new main heat dissipation device 103 can be assembled in place on the bracket 101. Then, a sealing ring is used to seal the access hole between the inner cavity of the main heat dissipation device 103 and the cooling grooves 102 to prevent leakage of the main coolant. After assembly, a main circulation member 1032 with appropriate circulation capacity can be used to circulate the main coolant between the inner cavity of the main heat dissipation device 103 and the cooling grooves 102. On the one hand, the modular and detachable installation of the main heat dissipation device 103 makes it easier to maintain the main heat dissipation device 103 or the entire immersion cooling equipment 100. On the other hand, the main heat dissipation device 103 can be flexibly adjusted according to the conditions of the cooling groove 102 and the electronic device 200, so that the cooling effect can be ensured with a relatively high cooling efficiency.

[0068] In some embodiments, considering the space occupied by the main circulation member 1032 and the heat exchanger 1033 in the main heat dissipation device 103, a liquid occupying block 1034 may be further installed in the main heat dissipation device 103 to further reduce the amount of main coolant used, as shown in FIG. 11 . The liquid occupying block 1034 is a suitable object for occupying the empty space in the inner cavity of the main heat dissipation device 103. In some embodiments, the liquid occupying block 1034 is also installed above the heat exchanger 1033. Using the liquid occupying block 1034 can further reduce the amount of main coolant used, thereby further reducing costs.

[0069] The liquid occupying block 1034 can occupy volume in the lumen of the main heat dissipation device 103 to reduce the amount of main coolant used, while allowing the main coolant to flow through or near it, thereby not impeding the circulation of the main coolant. The liquid occupying block 1034 may adopt a variety of different structures or forms. For example, in some embodiments, the liquid occupying block 1034 may include multiple independent small blocks. The multiple independent small blocks may be arranged in an empty space in the lumen of the main heat dissipation device 103 in a stacked or parallel arrangement, for example, with gaps between them to facilitate the flow of the main coolant and avoid obstruction of the flow of the main coolant by the liquid occupying block 1034. Alternatively or additionally, in some embodiments, the liquid occupying block 1034 may adopt a porous structure to facilitate the flow of the main coolant.

[0070] Of course, it should be understood that the above-described embodiments of the main heat dissipation device 103 in conjunction with Figures 9-11 are merely schematic and are not intended to limit the scope of protection of the present disclosure. The main heat dissipation device 103 may have any other suitable structure or configuration. For example, in some embodiments, the liquid occupation block 1034 may be located below the heat exchanger 1033 or in any other suitable location.

[0071] In some embodiments, a control device may be provided in the main heat dissipation device 103 to enable at least monitoring of the state (e.g., liquid level, temperature, etc.) of the main coolant in the immersion cooling apparatus 100 and / or controlling the main circulation member 1033. In some embodiments, the control device may further include a display unit. The display unit may have a touch unit to facilitate control of the main circulation member 1033. Of course, in some alternative embodiments, the control device may further include buttons or the like to facilitate control of the main circulation member 1033.

[0072] By employing a control device, parameters such as the power of the main circulation member 1033 can be controlled in response to information such as the heat generation and number of electronic devices 200 to be cooled in the cooling channel 102, thereby improving cooling efficiency and reducing cooling costs. For example, if the number of electronic devices 200 placed in the cooling channel 102 decreases, the device can be controlled to reduce the power of the main circulation member 1033, further reducing operating costs. Of course, in some alternative embodiments, the control device can display other information and / or control other components. For example, in some embodiments, the display unit of the control device can display the type and number of electronic devices 200 to be cooled in the immersion cooling device 100.

[0073] For ease of deployment, the immersion cooling apparatus 100 includes a cooling source interface 104 coupled to the main heat dissipation device 103. For example, in some embodiments, the cooling source interface 104 may be at least partially disposed on a case 1031 of the main heat dissipation device 103. The cooling source interface 104 is adapted to communicate an auxiliary coolant with the external cooling source 302 inside the heat exchanger 1033, thereby allowing heat exchange between the auxiliary coolant in the external cooling source 302 and the main coolant in the heat exchanger 1033. In some embodiments, the auxiliary coolant may include deionized water. The use of deionized water can effectively avoid corrosion and damage to the internal structure of the heat exchanger 1033 and the metal of the cooling lines, thereby improving the reliability of the immersion cooling system.

[0074] In some embodiments, the cooling source interface 104 may be configured to have at least two sets. This provides a redundant design of the cooling source interface 104. The auxiliary cooling liquid processing capacity of each set of cooling source interface 104 can fully meet the circulation demand of the auxiliary cooling liquid. In this case, even if a problem such as clogging occurs in one set of cooling source interface 104, it will not affect the circulation of the auxiliary cooling liquid at all, thereby ensuring the cooling effect.

[0075] A modularized immersion cooling device is formed by integrating the main heat dissipation device 103 with internal and external circulation capabilities and the cooling channel 102. When deploying the immersion cooling device 100 according to an embodiment of the present disclosure, the deployment can be completed by simply connecting the reserved port of the data center with the cooling source interface 104 of the immersion cooling device, thereby forming a distributed immersion cooling system 300. This method significantly simplifies the deployment of the immersion cooling device.

[0076] 12 shows a schematic diagram of the system architecture of an immersion cooling system 300 employing an immersion cooling apparatus 100 according to an embodiment of the present disclosure. FIG. 13 shows a schematic diagram of an immersion cooling system 300 in which multiple immersion cooling apparatuses 100 are arranged in an array according to an embodiment of the present disclosure.

[0077] Generally, an immersion cooling system 300 according to an embodiment of the present disclosure includes at least one immersion cooling apparatus 100 as described above and an auxiliary cooling device 301. Although there are multiple immersion cooling apparatuses 100 in the immersion cooling system 300 shown in Figures 12 and 13, it should be understood that this is merely schematic and is not intended to limit the scope of protection of the present disclosure. Depending on the needs of different data centers, the number of immersion cooling apparatuses 100 may be one or more.

[0078] As mentioned above, in some embodiments, the immersion cooling system 300 may include multiple reserve interfaces to facilitate deployment of the immersion cooling apparatus 100. The reserve interfaces may be in communication with the external cooling source 302 via the auxiliary cooling device and may be used to couple to multiple cooling source interfaces 104 of the immersion cooling apparatus 100 according to embodiments of the present disclosure. In this manner, the heat exchanger 1033 in the immersion cooling apparatus 100 may be in communication with the external cooling source 302 via the auxiliary cooling device 301. The external cooling source 302 may be a cooling tower in some embodiments.

[0079] This method effectively reduces data center investment and overall operating costs, and can control the center's overall power consumption efficiency index to 1.1 or even lower. For example, when designing an immersion cooling system for a data center, taking into account the future relatively large scale of the data center, a predetermined number of reserved interfaces and immersion cooling devices 100 can be configured when designing the immersion cooling system 300 to meet the future demand for a large number of servers in the data center. Regarding the number of electronic devices 200, considering that the data center initially requires a relatively small number of servers, a relatively small number of electronic devices 200 can be adopted and placed in some of the immersion cooling devices 100. For immersion cooling devices 100 that do not have electronic devices 200, the main coolant can be temporarily not installed and no longer circulates. With the continuous development of business, if the scale of the data center needs to be expanded later, it is only necessary to increase the required number of servers and install them in the immersion cooling equipment 100 where the main cooling liquid is installed, eliminating the need to redesign and remanufacture the entire immersion cooling system, thereby effectively reducing the initial investment and overall operating costs of the data center and making the adjustment of the center easier and more flexible.

[0080] Of course, in some alternative embodiments, only the number of immersion cooling devices 100 corresponding to the number of servers may be deployed, and these servers may be effectively cooled by coupling the cooling source interfaces 104 of these immersion cooling devices 100 with some of the reserved interfaces. If an increase in the number of servers is required due to an increase in business volume, the number of servers may be increased accordingly, and the number of immersion cooling devices 100 may be increased accordingly according to the increased number of servers, and finally, the cooling source interfaces 104 of the immersion cooling devices 100 may be coupled with the remaining reserved interfaces until the deployment of the entire immersion cooling system is completed.

[0081] It should be noted that when deploying the immersion cooling equipment 100 of the embodiment of the present disclosure, no additional cooling amount allocation unit is required, and it is only necessary to connect a cooling source to the immersion cooling equipment 100 via the cooling source interface 104. This significantly simplifies the design and deployment difficulties of the immersion cooling system 300, thereby effectively improving efficiency and reducing costs.

[0082] In some embodiments, to further simplify deployment, the immersion cooling system 300 may further include a base 303. A groove or receiving portion for installing the immersion cooling apparatus 100 and a corresponding holding interface may be provided at a predetermined position on the base 303. In this manner, when the immersion cooling apparatus 100 needs to be deployed, it is only necessary to install the immersion cooling apparatus 100 in the receiving portion of the base 303 and connect its cooling source interface 104 to the corresponding holding interface. This further simplifies deployment of the immersion cooling system 300.

[0083] For example, when deploying a large-scale cluster of electronic devices 200, the base 303 can be installed in the data center in advance to complete the external cooling source 302, auxiliary cooling device 301, and pending interface debugging. In the early stages of data center construction, only a relatively small number of electronic devices 200 can be used to meet the needs of the relatively small amount of business in the initial stage. As business continues to grow, the deployment of the entire system can be completed by purchasing more electronic devices 200 and installing them in the immersion cooling system 300. The adoption of the base 303 can further shorten the deployment time of the data center and improve deployment efficiency.

[0084] It should be understood that the above detailed embodiments of the present disclosure are only used to exemplify or explain the principles of the present disclosure, and are not intended to limit the present disclosure. Therefore, any modifications, equivalent replacements, improvements, etc. made in the spirit and principles of the present disclosure should fall within the scope of protection of the present disclosure. At the same time, the claims appended to the present disclosure are intended to include all changes and modifications within the scope and boundaries of the claims, or within the equivalents of the scope and boundaries.

Claims

1. a cooling channel (102) adapted to sealingly receive a primary cooling liquid such that an electronic device (200) requiring cooling is immersed in said primary cooling liquid; a main heat dissipation device (103) including a cavity attached to the cooling groove (102) and surrounded by a case (1031), a main circulation member (1032) received in the cavity, and a heat exchanger (1033), wherein the cavity is in sealing communication with the cooling groove (102), and the main circulation member (1032) is suitable for circulating the main coolant between the cooling groove (102) and the outside of the heat exchanger (1033); a cooling source interface (104) coupled to the main heat dissipation device (103) and configured to circulate an auxiliary cooling liquid between the external cooling source (302) and the inside of the heat exchanger (1033) to exchange heat between the auxiliary cooling liquid and the main cooling liquid in the heat exchanger (1033); Equipped with The immersion cooling apparatus, wherein the main heat dissipation device (103) further comprises a liquid occupying block (1034) disposed in the lumen.

2. The main heat dissipation device (103) is removably attached to the cooling groove (102). The immersion cooling device of claim 1 .

3. and a bracket (101) suitable for mounting the cooling groove (102) and the main heat dissipation device (103). The immersion cooling device of claim 1 .

4. One or more of the electronic devices (200) are arranged in the cooling groove (102) along an extension direction (E); and The size of the immersion cooling equipment (100) in the extension direction (E) is 1.5 times or less the size of the height (H) of the immersion cooling equipment. The immersion cooling device of claim 1 .

5. The size of the immersion cooling device (100) in the extension direction (E) is smaller than the size of the height (H) of the immersion cooling device. The immersion cooling device according to claim 4.

6. The size of the immersion cooling device (100) in the extension direction (E) is smaller than half the height (H) of the immersion cooling device. The immersion cooling device according to claim 4.

7. and a plurality of inlet and outlet through-holes disposed between the cooling groove (102) and the inner cavity of the main heat dissipation device (103) for circulating the main cooling liquid between the cooling groove (102) and the outside of the heat exchanger (1033). The immersion cooling device according to claim 3 .

8. the cooling grooves (102) have different specifications, the cooling grooves (102) of the different specifications having different depths and / or different sizes in the extension direction (E); and The bracket (101) is adapted to receive cooling grooves (102) of at least one of the various specifications. The immersion cooling device according to claim 7.

9. and an overhead rack (105) coupled to the bracket (101) and suitable for supporting at least one of the cooling channel (102) and the main heat dissipation device (103). The immersion cooling device of claim 8.

10. The main heat dissipation device (103) has various specifications, and the main heat dissipation devices (103) of various specifications have different circulation heat dissipation capabilities; and The bracket (101) is suitable for receiving the main heat dissipation device (103) of at least one of the various specifications. The liquid immersion cooling equipment according to claim 8 or 9.

11. a lid (106) coupled to the cooling groove (102) to seal a top opening of the cooling groove (102); The immersion cooling device of claim 1 .

12. The lid (106) is pivotally coupled to the cooling channel (102) via a hinge.

12. The immersion cooling device of claim 11.

13. The cooling source interface (104) includes at least two sets of cooling source interfaces (104). The liquid immersion cooling equipment according to any one of claims 1, 2, 5, 6, 8, 9 and 12.

14. The cooling source interface (104) is at least partially disposed in the case (1031). The liquid immersion cooling equipment according to any one of claims 1, 2, 5, 6, 8, 9 and 12.

15. At least one immersion cooling device (100) according to any one of claims 1, 2, 5, 6, 8, 9 and 12; an auxiliary cooling device (301) coupled to the cooling source interface (104) of the at least one immersion cooling device (100), and adapted to circulate the auxiliary cooling liquid between the external cooling source (302) and the interior of the heat exchanger (1033); An immersion cooling system comprising:

16. the at least one immersion cooling device (100) comprises a plurality of immersion cooling devices; and The immersion cooling system further comprises a plurality of reserve interfaces, the plurality of reserve interfaces being adapted to be coupled to the cooling source interface (104).

16. The immersion cooling system of claim 15.

17. a base (303) including a plurality of receiving portions installed at predetermined positions for installing the plurality of immersion cooling devices (100), the plurality of receiving portions corresponding to the plurality of holding interfaces; 17. The immersion cooling system of claim 16.

18. the main coolant comprises a fluorinated liquid or a mineral oil; and / or The auxiliary cooling fluid comprises deionized water.

16. The immersion cooling system of claim 15.

19. 1. A liquid immersion cooling system for deployment in a large cluster, comprising: a base (303) including a plurality of receiving portions to be installed at predetermined positions; a plurality of reservation interfaces corresponding to the positions of the plurality of receivers; an auxiliary cooling device (301) disposed between the plurality of retention interfaces and an external cooling source (302); a plurality of immersion cooling devices (100) according to any one of claims 1, 2, 5, 6, 8, 9, and 12, disposed in the receiving portion, wherein a cooling source interface (104) of the immersion cooling devices (100) is coupled to the plurality of reserve interfaces; An immersion cooling system comprising:

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