Film forming apparatus and method for cleaning the film forming apparatus

Abstract

To provide a technique capable of promptly and stably detecting a shutter member covering the mounting surface of a mounting table.SOLUTION: A film deposition apparatus includes: a treatment vessel; a sputtering target provided in the treatment vessel; a mounting table having a mounting surface for mounting a substrate in the treatment vessel; a shutter member capable of covering the mounting surface; a transfer mechanism for transferring the shutter member in and out the mounting table; a detector provided in the own conveyance mechanism and detecting an index related to the existence of the shutter member; and a processing part for determining the existence of the shutter member to the conveyance mechanism on the basis of the detection result of the detector.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present disclosure relates to a film forming apparatus and a method for cleaning the film forming apparatus. [Background technology]

[0002] Patent Document 1 discloses a film formation apparatus that forms a film of a target material on a substrate by sputtering the target. This type of film formation apparatus periodically performs cleaning to condition the target surface (for example, to remove a natural oxide film).

[0003] During cleaning, a target discharge (dummy discharge) is performed without a substrate being present on the mounting surface of the mounting table. During this process, the film-forming apparatus protects the mounting surface from substances released during the dummy discharge by covering it with a shutter member. Specifically, the film-forming apparatus keeps the shutter member in a retracted position during sputtering, places the shutter member on the mounting surface during cleaning, and returns the shutter member to the retracted position after cleaning. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2002-302763 Summary of the Invention [Problem to be solved by the invention]

[0005] The present disclosure provides a technique that can quickly and stably detect a shutter member when the shutter member is transported during cleaning. [Means for solving the problem]

[0006] According to one aspect of the present disclosure, there is provided a processing vessel, a sputtering target provided in the processing vessel, a mounting table having a mounting surface on which a substrate is placed in the processing vessel, a shutter member capable of covering the mounting surface, a transport mechanism for transporting the shutter member into and out of the mounting table, and a shutter member provided in the transport mechanism itself for closing the shutter member. position a detection unit that detects an index relating to the shutter member relative to the transport mechanism based on the detection result of the detection unit; position a processing unit for determining whether the shutter member is formed of a non-magnetic material and has one or more chips formed of a magnetic material on a surface facing the transport mechanism, and the detection unit includes a magnetic sensor provided at a location on the transport mechanism that is scheduled to face the chips. A deposition apparatus is provided. [Effects of the Invention]

[0007] According to one aspect, when the shutter member used during cleaning is transported, the shutter member can be detected quickly and stably. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a schematic plan view showing an example of the configuration of a substrate processing system having a film forming apparatus. [Figure 2] FIG. 1 is a schematic vertical cross-sectional view showing a film forming apparatus. [Figure 3] FIG. 2 is a schematic plan view showing a shutter mechanism, a processing vessel, and a mounting table according to the first embodiment. [Figure 4] 10 is a flowchart showing a process flow of a cleaning method for a film forming apparatus. [Figure 5] 10 is a view showing a shutter mechanism of a film forming apparatus according to a second embodiment. [Figure 6] FIG. 10 is a schematic vertical cross-sectional view showing a shutter mechanism according to a modified example. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In the drawings, the same components are denoted by the same reference numerals, and redundant explanations may be omitted.

[0010] Fig. 1 is a schematic plan view showing an example of the configuration of a substrate processing system 100 including a film forming apparatus 1. As shown in Fig. 1, the film forming apparatus 1 according to the embodiment is provided in the substrate processing system 100 that processes a wafer W, which is an example of a substrate.

[0011] The substrate processing system 100 is a cluster structure (multi-chamber type) system. The substrate processing system 100 includes multiple processing chambers 111-115, a vacuum transfer chamber 120, multiple load lock chambers 131 and 132, an atmospheric transfer chamber 140, a load port 150, and a control device 160. The multiple processing chambers 111-115 are depressurized to an appropriate vacuum atmosphere, and perform predetermined processes (cleaning process, etching process, film formation process, etc.) on wafers W.

[0012] 1, each of the processing chambers 111-115 is arranged adjacent to a vacuum transfer chamber 120, and a wafer W is transferred to each of the processing chambers 111-115 via the vacuum transfer chamber 120. Each of the processing chambers 111-115 has a gate valve 111G-115G that opens and closes the vacuum transfer chamber 120 and the corresponding chamber.

[0013] The vacuum transfer chamber 120 of the substrate processing system 100 is connected to multiple chambers (processing chambers 111-115, load lock chambers 131, 132) and is depressurized to a predetermined vacuum atmosphere. The vacuum transfer chamber 120 is equipped with a vacuum transfer device 121 therein for transferring a wafer W. The vacuum transfer device 121 transfers the wafer W between each of the processing chambers 111-115 and the vacuum transfer chamber 120 in response to the opening and closing of gate valves 111G-115G of each of the processing chambers 111-115. The vacuum transfer device 121 also transfers the wafer W between each of the load lock chambers 131, 132 and the vacuum transfer chamber 120 in response to the opening and closing of gate valves 131a, 131a of each of the load lock chambers 131, 132.

[0014] Each load lock chamber 131, 132 is provided between the vacuum transfer chamber 120 and the atmospheric transfer chamber 140, and its interior can be switched between atmospheric and vacuum atmospheres. Each load lock chamber 131, 132 includes a stage (not shown) for placing a wafer W, gate valves 131a, 132a on the vacuum transfer chamber 120 side, and door valves 131b, 132b on the atmospheric transfer chamber 140 side. Each load lock chamber 131, 132 communicates with the vacuum transfer chamber 120 in a vacuum atmosphere state by opening or closing the gate valves 131a, 132a. Furthermore, each load lock chamber 131, 132 communicates with the atmospheric transfer chamber 140 in an atmospheric atmosphere state by opening or closing the door valves 131b, 132b.

[0015] The atmospheric transfer chamber 140 has an atmospheric atmosphere, and for example, a downflow of clean air is formed. The atmospheric transfer chamber 140 also includes an atmospheric transfer device 141 that transfers the wafer W, and an aligner 142 that aligns the wafer W.

[0016] Furthermore, a load port 150 is provided on a wall surface of the atmospheric transfer chamber 140. A carrier F containing a wafer W or an empty carrier F is attached to the load port 150. As the carrier F, for example, a FOUP (Front Opening Unified Pod) or the like can be used.

[0017] The atmospheric transfer device 141 loads and unloads wafers W between each of the load lock chambers 131, 132 and the atmospheric transfer chamber 140 in response to the opening and closing of each of the door valves 131b, 132b. The atmospheric transfer device 141 also loads and unloads wafers W between the aligner 142 and the atmospheric transfer chamber 140. The atmospheric transfer device 141 also loads and unloads wafers W between a carrier F attached to a load port 150 and the atmospheric transfer chamber 140.

[0018] The control device 160 is a control computer having one or more processors, memory, input / output interfaces, and electronic circuits (not shown). The processor of the control device 160 executes programs and recipes stored in the memory, thereby issuing commands to each of the processing chambers 111-115 to process the wafer W and controlling the transfer of the wafer W. Specifically, the control device 160 first controls the atmospheric transfer device 141 and the vacuum transfer device 121, adjusts the position of the wafer W on the carrier F attached to the load port 150 with the aligner 142, and transfers the wafer W to the vacuum transfer chamber 120 via the load lock chamber 131.

[0019] The control device 160 then transfers the wafers W from the vacuum transfer chamber 120 to and from each of the processing chambers 111 to 115, and performs predetermined processes (cleaning, etching, film formation, etc.) on the wafers W in each of the processing chambers 111 to 115. The film formation apparatus 1 according to one embodiment is installed in an appropriate processing chamber among the processing chambers 111 to 115 as an apparatus for performing film formation. The film formation apparatus 1 installed in the processing chamber 112 will be described below as a representative example.

[0020] 2 is a schematic vertical cross-sectional view showing the film formation apparatus 1. As shown in FIG. 2, the film formation apparatus 1 includes a processing chamber 10 having an internal space 10a. The film formation apparatus 1 also includes a stage mechanism 20, a target holding unit 30, a target cover unit 40, a gas supply unit 50, a gas exhaust unit 60, and a shutter mechanism 70 as components for performing a film formation process on a wafer W within the processing chamber 10. The film formation apparatus 1 also includes a control unit 90 that controls the operation of each component.

[0021] The processing vessel 10 of the film forming apparatus 1 is made of, for example, aluminum and is connected to a ground potential. In the film forming apparatus 1, the processing vessel 10 may be installed in a processing chamber 112, or the internal space 10a of the processing vessel 10 may form the processing chamber 112. The processing vessel 10 includes a transfer port 11 that connects the internal space 10a to the outside of the processing vessel 10, and a gate valve 12 that opens and closes the transfer port 11. The gate valve 12 corresponds to the gate valve 112G of the processing chamber 112 in FIG. 1. When the gate valve 12 is open, the film forming apparatus 1 loads and unloads a wafer W through the transfer port 11 using a transfer device (not shown).

[0022] The processing vessel 10 has a processing central axis X that is located at the center of the film formation process on the wafer W in the internal space 10a and extends along the vertical direction. This processing central axis X is set to pass through the exact center of the wafer W placed on the stage mechanism 20. Furthermore, the processing vessel 10 has a conical portion 13 that is approximately conical in shape (e.g., approximately quadrangular pyramid, cone, etc.) on the ceiling located above the stage mechanism 20. The processing central axis X passes through the center (top) of the conical portion 13.

[0023] The stage mechanism 20 includes a mounting table 21 disposed in the processing vessel 10 and a support drive unit 22 that operably supports the mounting table 21. The mounting table 21 has a substantially disk-shaped base 21a and an electrostatic chuck 21b fixed on the base 21a.

[0024] The base portion 21a is made of, for example, aluminum. The base portion 21a is fixed to the upper end of the support drive portion 22, and the electrostatic chuck 21b is disposed at a predetermined height position in the internal space 10a. The stage mechanism portion 20 may include a temperature control mechanism (not shown) that adjusts the temperature of the base portion 21a to control the temperature of the wafer W placed on the mounting table 21.

[0025] The electrostatic chuck 21b has a dielectric film and an electrode provided on the inner layer of the dielectric film (both not shown). The upper surface of the electrostatic chuck 21b constitutes a mounting surface 211 on which the wafer W is mounted in the stage mechanism unit 20 (mounting table 21). A DC power supply 23 is connected to the electrode of the electrostatic chuck 21b. The electrostatic chuck 21b attracts the wafer W mounted on the mounting surface 211 by generating an electrostatic force in the dielectric film by a DC voltage supplied to the electrode from the DC power supply 23. The center of the mounting surface 211 coincides with the processing central axis X.

[0026] The mounting table 21 also has a plurality of (e.g., three) lift pins 212 that protrude from the mounting surface 211 and can support the wafer W, and a vertical movement unit (not shown) that moves the plurality of lift pins 212 in the vertical direction. When the wafer W is transferred to the internal space 10a by the vacuum transfer device 121, the stage mechanism unit 20 causes the lift pins 212 to protrude from the mounting surface 211 using the vertical movement unit, and receives the wafer W at the upper ends of the lift pins 212. Furthermore, the stage mechanism unit 20 causes the lift pins 212 to retract toward the mounting surface 211 using the vertical movement unit, thereby mounting the wafer W on the mounting surface 211. Conversely, when the wafer W is to be removed, the lift pins 212 protrude upward to lift the wafer W from the mounting surface 211 and transfer it to the vacuum transfer device 121.

[0027] The support drive unit 22 has a columnar support shaft 24 that holds the base unit 21a, and an operating device 25 that operates the support shaft 24. The support shaft 24 extends vertically from the internal space 10a of the processing vessel 10 through the bottom 14 to the outside of the processing vessel 10. The axis of the support shaft 24 overlaps with the processing central axis X.

[0028] The operating device 25 is provided outside the processing vessel 10 and holds the lower end of the support shaft 24. The operating device 25 rotates the support shaft 24 around the processing central axis X and moves it up and down in the vertical direction under the control of the control unit 90. The operation of the operating device 25 causes the mounting table 21 to rotate and move up and down within the processing vessel 10.

[0029] Furthermore, the stage mechanism 20 has a sealing structure 26 between the bottom 14 of the processing vessel 10 and the support shaft 24, which seals the gap while allowing the support shaft 24 to operate. As the sealing structure 26, for example, a magnetic fluid seal can be used.

[0030] The target holding unit 30 of the film forming apparatus 1 holds a plurality of targets T, which are cathode targets, at a position spaced above the mounting table 21. The target holding unit 30 has a metal holder 31 that holds each of the plurality of targets T, and an insulating member 32 that supports the holders 31 by fixing the outer peripheries of the plurality of holders 31.

[0031] The targets T held by each holder 31 are formed of a material containing a film-forming substance and are rectangular flat plates. The multiple targets T may be made of different materials, or some or all of the targets T may be made of the same material.

[0032] Each holder 31 is formed in a rectangular shape that is slightly larger than the target T in a plan view. Each holder 31 is fixed to the inclined surface of the conical portion 13 via an insulating member 32. Therefore, each holder 31 holds the surfaces of the multiple targets T (sputtering surfaces exposed to the internal space 10a) in a state inclined with respect to the processing central axis X.

[0033] Furthermore, the target holding unit 30 electrically connects a power supply 33 to each target T held by each holder 31. Each of the multiple power supplies 33 applies a negative DC voltage to the connected target T. Note that the power supply 33 may be a single power supply that selectively applies a voltage to the multiple targets T.

[0034] Furthermore, the target holding unit 30 includes a magnet 35 and a magnet operating unit 36 ​​that operates the magnet 35 on the back side (opposite the holding surface of the target T) of each holder 31. The multiple magnets 35 apply a magnetic field H to each of the placed targets T, thereby inducing plasma to the target T. Each magnet 35 is arranged so that the bottom surface (facing surface) of the magnet 35 is parallel to the holder 31 and the target T, corresponding to the inclination of the holder 31 fixed to the conical portion 13.

[0035] The magnet operating unit 36 ​​reciprocates the magnet 35 in a direction parallel to the extension direction of the target T (holder 31). For example, the magnet operating unit 36 ​​has a rail extending in the longitudinal direction of the target T and a movable body that holds the magnet 35 and is movable along the rail (both not shown).

[0036] The target cover 40 of the film formation apparatus 1 includes an umbrella body 41 disposed in the processing vessel 10 and an umbrella body driver 42 that movably supports the umbrella body 41. The umbrella body 41 is disposed between the targets T and the mounting table 21. The umbrella body 41 is formed in a cone shape that is approximately parallel to the inclined surface of the conical portion 13 of the processing vessel 10, and is capable of facing the sputtering surfaces of the targets T. The umbrella body 41 also has one opening 41a that is slightly larger than the target T. The opening 41a is positioned opposite one of the targets T by the umbrella body driver 42. As a result, the umbrella body 41 exposes only the selected target Ts to the mounting table 21, and the other targets T are not exposed.

[0037] The umbrella body driving unit 42 has a columnar rotation shaft 43 and a rotation unit 44 that rotates the rotation shaft 43. The axis of the rotation shaft 43 overlaps with the central processing axis X of the processing vessel 10. The rotation shaft 43 extends vertically, and the center (apex) of the umbrella body 41 is fixed at its lower end. The rotation shaft 43 passes through the center of the conical portion 13 and protrudes to the outside of the processing vessel 10.

[0038] The rotating unit 44 is provided outside the processing vessel 10, and rotates the rotating shaft 43 relative to the upper end (connector 55a) that holds the rotating shaft 43 via a rotation transmission unit (not shown). This causes the rotating shaft 43 and the umbrella body 41 to rotate around the processing central axis X. Therefore, under the control of the control unit 90, the target cover unit 40 adjusts the circumferential position of the opening 41a so that the opening 41a faces the selected target Ts to be sputtered.

[0039] The gas supply unit 50 of the film forming apparatus 1 is provided in the conical portion 13 and supplies an excitation gas. Note that the gas supply unit 50 may also include an oxidation gas unit (not shown) that supplies an oxidation gas for oxidizing metal (sputtered particles) deposited on the wafer W, in addition to the supply of the excitation gas.

[0040] The gas supply unit 50 has a pipe 52 for distributing gas outside the processing vessel 10, and includes, in order from the upstream side to the downstream side of the pipe 52, a gas source 53, a flow rate controller 54, and a gas introduction unit 55. The gas source 53 stores an excitation gas (e.g., Ar gas) and outputs the gas to the pipe 52. The flow rate controller 54 is, for example, a mass flow controller, and adjusts the flow rate of the gas supplied into the processing vessel 10. The gas introduction unit 55 introduces gas from the outside to the inside of the processing vessel 10. The gas introduction unit 55 includes a connector 55a connected to the pipe 52 outside the processing vessel 10 and a gas passage 43a formed in the rotation shaft 43 of the target cover 40.

[0041] The gas exhaust unit 60 of the film forming apparatus 1 includes a vacuum pump 61 and an adapter 62 for fixing the vacuum pump 61 to the bottom 14 of the processing chamber 10. The gas exhaust unit 60 reduces the pressure in the internal space 10a of the processing chamber 10 under the control of the control unit 90.

[0042] The above-described configurations of the substrate processing system 100 and the film forming apparatus 1 are common to the film forming apparatus 1 according to the present disclosure. Next, the configuration of the shutter mechanism 70 of the film forming apparatus 1 according to the first embodiment will be described with reference to Figures 2 and 3. Figure 3 is a schematic plan view showing the shutter mechanism, processing vessel, and mounting table according to the first embodiment, in which (a) shows a state in which the shutter member 71 is located at the retracted position SP, and (b) shows a state in which the shutter member 71 is located at the mounting position PP.

[0043] [First embodiment] The shutter mechanism 70 is a mechanism for protecting the mounting table 21 when a dummy discharge is performed during cleaning (conditioning of the target T) inside the processing vessel 10. The shutter mechanism 70 has a disk-shaped shutter member 71 having an appropriate thickness, and a transport mechanism 72 that transports the shutter member 71 onto and out of the mounting table 21.

[0044] The shutter member 71 of the shutter mechanism 70 covers the entire mounting surface 211 of the mounting table 21, thereby preventing the mounting surface 211 from being exposed during dummy discharge. For this reason, the planar shape of the shutter member 71 corresponds to (is similar to) the shape of the mounting surface 211 and is formed in a perfect circle. The diameter of the shutter member 71 is set to be the same as or slightly larger than the diameter of the mounting surface 211 of the mounting table 21. The diameter of the shutter member 71 may be, for example, in the range of approximately 200 mm to 500 mm. In one embodiment, the upper and lower surfaces of the shutter member 71 are formed flat.

[0045] The material of the shutter member 71 is not particularly limited as long as it has appropriate rigidity, and stainless steel (SUS), aluminum, etc. can be used. In the first embodiment, a magnetic SUS made of a magnetic material is used to detect magnetic changes caused by the presence or absence of the shutter member 71 in a detection unit 80 described below.

[0046] The shutter member 71 is detachably supported by the transport mechanism 72. When the shutter member 71 is transported onto the mounting table 21 by the transport mechanism 72, the shutter member 71 covers the mounting surface 211 in a state where it is detached from the transport mechanism 72.

[0047] The shutter mechanism 70 uses the transport mechanism 72 to transport the shutter member 71 between a mounting position PP above the mounting table 21 where the shutter member 71 can be transferred and a retracted position SP where the shutter member 71 is retracted from the mounting table 21. For this reason, a part of the side wall of the processing vessel 10 is formed to protrude outward in the horizontal direction, and the processing vessel 10 has an evacuation section 10as inside this protruding part (internal space 10a) that serves as the retracted position SP of the shutter member 71.

[0048] The retracted position SP is spaced horizontally from the placement position PP so that the placement surface 211 is exposed upward when the shutter member 71 is in a retracted state. The distance D from the center of the placement position PP (the center of the placement surface 211) to the center of the retracted position SP (the center of the retracted shutter member 71) is preferably set to, for example, within a range of approximately 1.1 to 2 times the diameter of the shutter member 71. This allows the film forming apparatus 1 to minimize the size of the processing chamber 10 even when the film forming apparatus 1 has the retracted compartment 10as.

[0049] The transfer mechanism 72 of the shutter mechanism 70 has a support arm 73 that supports the shutter member 71, a shaft 74 connected to the support arm 73, and a rotation device 75 that rotates the shaft 74. Furthermore, the shutter mechanism 70 has a sealing structure 76 between the bottom 14 of the processing vessel 10 and the shaft 74 that seals the gap while allowing the shaft 74 to rotate. A magnetic fluid seal, for example, can be used as the sealing structure 76.

[0050] The support arm 73 includes a support body 73a that supports the shutter member 71, and a connecting bar 73b that extends between the support body 73a and the shaft portion 74. The support body 73a and the connecting bar 73b operate together.

[0051] The support body 73a is formed in an appropriate shape that can support the shutter member 71 in a plan view and does not interfere with the multiple lift pins 212 of the mounting table 21, and supports the inside of the outer periphery of the shutter member 71. The upper and lower surfaces of the support body 73a extend parallel to (along the horizontal direction with) the mounting surface 211.

[0052] The support body 73a has a plurality of (e.g., three) contact terminals 77 that protrude from the upper surface of the support body 73a and contact the lower surface of the shutter member 71 (see FIG. 2). The contact terminals 77 are arranged at positions spaced a predetermined radius from the center of the support body 73a and at approximately equal intervals from one another along the circumferential direction in order to stably support the shutter member 71. The contact terminals 77 are formed, for example, from a resin material that is softer than the shutter member 71.

[0053] The connecting bar 73b has enough rigidity to support the support body 73a in the horizontal direction. A shaft 74 is firmly fixed to one end of the connecting bar 73b. The support arm 73 moves the support body 73a and the shutter member 71 in an arc shape by the connecting bar 73b extending from the shaft 74.

[0054] The shaft 74 extends in a direction (vertical direction) parallel to the processing central axis X, and supports the connecting bar 73b at its upper end. The shaft 74 protrudes outside the processing vessel 10 and is connected to a rotation device 75 on the outside.

[0055] The rotation device 75 has a motor 75a as a drive source and a gear mechanism 75b provided between the rotation shaft of the motor 75a and the lower end of the shaft portion 74, and rotates the shaft portion 74 at an appropriate rotation speed and rotation angle. The motor 75a is connected to a control unit 90 via a drive driver (not shown), and the rotation angle is controlled under the control of the control unit 90. The gear mechanism 75b, for example, reduces the rotation speed of the motor 75a. The rotation device 75 may have a limiter function that limits the rotation angle of the shaft portion 74 (i.e., the support arm 73) to a range from the placement position PP to the retracted position SP.

[0056] Furthermore, the shutter mechanism 70 includes a detection unit 80 in the transport mechanism 72 itself that detects an indicator related to the presence or absence of the shutter member 71. In one embodiment, the detection unit 80 is implemented by a torque sensor 81 provided in the rotation device 75 and a magnetic sensor 82 provided in the support arm 73. Note that the detection unit 80 may be implemented by only one of the torque sensor 81 and the magnetic sensor 82.

[0057] The torque sensor 81 may be, for example, a contactless or contact type provided around the rotation shaft of the motor 75a and continuously detects the torque of the rotation shaft. That is, the torque when the shutter member 71 is supported by the support arm 73 is greater than the torque when the shutter member 71 is not supported by the support arm 73. Therefore, the film forming apparatus 1 can detect whether the support arm 73 supports the shutter member 71 (the presence or absence of the shutter member 71) by obtaining the torque of the torque sensor 81 as an index. Alternatively, the torque sensor 81 may be an ammeter provided between the rotation device 75 and the driver. The control unit 90 can recognize that the shutter member 71 is being supported by the support arm 73 based on an increase in the current value of the ammeter.

[0058] The magnetic sensor 82 may be, for example, a non-contact type provided at the center of the support body 73a and capable of continuously detecting magnetic changes. That is, the magnetic sensor 82 detects different magnetic fields (detects magnetic changes) when the shutter member 71 is supported by the support arm 73 and when the shutter member 71 is not supported by the support arm 73. Therefore, the film forming apparatus 1 can detect whether the support arm 73 supports the shutter member 71 by using the magnetic change of the magnetic sensor 82 as an indicator. It goes without saying that the number and positions of the magnetic sensors 82 are not particularly limited as long as they can appropriately detect the presence or absence of the shutter member 71 on the support body 73a.

[0059] The control unit 90 of the film forming apparatus 1 is a control computer having one or more processors 91, a memory 92, an input / output interface (not shown), and an electronic circuit. The one or more processors 91 are one or a combination of a CPU, an ASIC, an FPGA, a circuit made up of a plurality of discrete semiconductors, etc. The memory 92 includes a non-volatile memory and a volatile memory, and forms a storage unit of the control unit 90. Note that a portion of the memory 92 may be built into the one or more processors 91.

[0060] The processor 91 executes a program stored in the memory 92 to perform a film formation process (a sputtering process for depositing metal on a wafer W) in the film formation apparatus 1. During the film formation process, the processor 91 controls the operation of each component of the film formation apparatus 1 based on a recipe stored in the memory 92.

[0061] In the film formation process, the processor 91 causes the shutter member 71 of the shutter mechanism 70 to wait at the retracted position SP, exposing the mounting surface 211 upward in a plan view. As a result, when the substrate processing system 100 transfers the wafer W into the processing vessel 10, the wafer W is accurately mounted on the mounting surface 211. The processor 91 then controls the gas supply unit 50 to supply an excitation gas into the processing vessel 10 and controls the gas exhaust unit 60 to set the interior of the processing vessel 10 to a predetermined pressure. Furthermore, the processor 91 controls the rotation of the umbrella drive unit 42 to position the opening 41 a facing the target T, and controls the magnet operation unit 36 ​​to operate the magnets 35. The control unit 90 then applies a negative DC voltage from the power supply 33 to the target T to generate plasma, and performs sputtering by colliding the plasma with the target T. The target T, which is struck by the plasma, emits metal sputter particles into the internal space 10a, and these sputter particles are deposited on the wafer W, thereby forming a film on the wafer W.

[0062] Furthermore, the processor 91 cleans the inside of the processing chamber 10 (conditions the target T) at an appropriate timing different from the film formation process or based on a user operation. At this time, the processor 91 controls the transport mechanism 72 to move the shutter member 71, which has been waiting at the retracted position SP, to the placement position PP, and cover the placement surface 211 of the placement table 21 with the shutter member 71. By performing a dummy discharge with the placement table 21 protected by the shutter member 71, the film formation apparatus 1 can prepare the surface condition of the target T while preventing particles from adhering to the placement surface 211 during the dummy discharge. This cleaning operation will be described in detail later.

[0063] Furthermore, the processor 91 recognizes each step in the cleaning process, and determines whether or not the shutter member 71 is present on the support arm 73 based on the detection result of the detection unit 80 in each step. For example, the processor 91 has a torque threshold value corresponding to the detected torque of the torque sensor 81, and determines whether or not the detected torque is equal to or greater than the torque threshold value. If the detected torque is equal to or greater than the torque threshold value, the processor 91 determines that the shutter member 71 is present on the support arm 73, and if the detected torque is less than the torque threshold value, the processor 91 determines that the shutter member 71 is not present on the support arm 73.

[0064] Similarly, the processor 91 has a magnetic threshold value corresponding to the magnetic field detected by the magnetic sensor 82, and determines whether the detected magnetic field is equal to or greater than the magnetic threshold value. If the detected magnetic field is equal to or greater than the magnetic threshold value, the processor 91 determines that the shutter member 71 is present on the support arm 73, and if the detected magnetic field is less than the magnetic threshold value, the processor 91 determines that the shutter member 71 is not present on the support arm 73.

[0065] The processor 91 recognizes that the shutter member 71 is supported by the support arm 73 when both the determination result of the detected torque by the torque sensor 81 and the determination result of the detected magnetism by the magnetic sensor 82 determine that the shutter member 71 is present. On the other hand, the processor 91 recognizes that the shutter member 71 is not supported by the support arm 73 when both the determination result of the detected torque by the torque sensor 81 and the determination result of the detected magnetism by the magnetic sensor 82 determine that the shutter member 71 is not present. Note that the processor 91 may determine that the detection unit 80 has failed when one of the determination result of the detected torque by the torque sensor 81 and the determination result of the detected magnetism by the magnetic sensor 82 indicates that the shutter member 71 is present and the other indicates that the shutter member 71 is not present. Alternatively, the processor 91 may determine the presence or absence of the shutter member 71 using only either the determination result of the detected torque by the torque sensor 81 or the determination result of the detected magnetism by the magnetic sensor 82.

[0066] If the processor 91 determines that the shutter member 71 is not present at the timing when the support arm 73 is to support the shutter member 71, it notifies the user of an error, for example, that the shutter member 71 is not being supported. This allows the user to deal with the error in the film forming apparatus 1 at an early stage. Note that if the processor 91 determines that the shutter member 71 is not present at the timing when the shutter member 71 is to be received from the mounting table 21, the processor 91 may attempt to receive the shutter member 71 from the mounting table 21 onto the support arm 73 again (multiple times). This allows the film forming apparatus 1 to increase the possibility that the support arm 73 will support the shutter member 71 without notifying an error.

[0067] The film forming apparatus 1 according to one embodiment is basically configured as described above, and its operation and effects will be described below.

[0068] Fig. 4 is a flowchart showing a process flow of a cleaning method for the film forming apparatus 1. As shown in Fig. 4, when the control unit 90 of the film forming apparatus 1 performs the cleaning method, first, it controls the operation of the transport mechanism 72 to move (carry in) the shutter member 71 from the retracted position SP to the placement position PP (step S1: carry in process). At this time, the control unit 90 rotates the support arm 73 by the rotation device 75 until the support body 73a of the support arm 73 reaches the placement position PP (see also Fig. 3(a)).

[0069] During this loading process, the control unit 90, for example, sets a flag indicating the loading process and performs detection by the detection unit 80, and determines whether the support arm 73 is supporting the shutter member 71 (presence or absence of the shutter member 71) based on the detected torque and detected magnetism. During the loading process, the normal state is when the support arm 73 is supporting the shutter member 71. Therefore, if the control unit 90 determines that the shutter member 71 is present, it continues the loading process. However, if the control unit 90 determines that the shutter member 71 is not present, it recognizes an abnormality in the transportation of the shutter member 71 and notifies the user of the abnormality. In this case, for example, if the control unit 90 determines that the shutter member 71 has come off the support arm 73 at the beginning of the loading process and notifies the user of the abnormality, or if the control unit 90 determines that the shutter member 71 has fallen off at the middle or later stage of the loading process and notifies the user of the abnormality. This allows the user to immediately take appropriate action in the event of an abnormality.

[0070] When the shutter member 71 is moved to the placement position PP, the control unit 90 raises the plurality of lift pins 212 from the placement table 21 and transfers the shutter member 71 from the support arm 73 to each lift pin 212 (step S2: transfer step). In this transfer step as well, the control unit 90 can determine whether or not the transfer from the support body 73a to each lift pin 212 has been successful, based on, for example, a change in the magnetism detected by the magnetic sensor 82.

[0071] Thereafter, the control unit 90 operates the transport mechanism 72 in the absence of the shutter member 71 to move the support arm 73 from the placement position PP to the retracted position SP (step S3: retraction process, see also FIG. 3(b)). In this retraction process, the control unit 90 also sets a flag indicating the retraction process and performs detection by the detection unit 80, and determines whether the support arm 73 is not supporting the shutter member 71 based on the detected torque and detected magnetism. In the retraction process, it is normal for the support arm 73 not to support the shutter member 71.

[0072] Therefore, when the control unit 90 determines that the shutter member 71 is not present, it continues the retraction process, whereas when it determines that the shutter member 71 is present, it recognizes an abnormality in the transfer of the shutter member 71 and notifies the user of the abnormality. Note that when the control unit 90 recognizes an abnormality in the transfer of the shutter member 71, it may immediately return to step S2 and retry the transfer process, or may notify the user of the abnormality after multiple attempts. This allows the user to recognize a malfunction or the like of each lift pin 212 at an early stage.

[0073] Thereafter, the control unit 90 lowers the plurality of lift pins 212 to place the shutter member 71 in contact with the mounting table 21, and the shutter member 71 covers the entire mounting surface 211 (step S4). Then, the control unit 90 applies an appropriate DC voltage from the power supply 33 to the target T to generate plasma, and irradiates the surface of the target T with positive ions in the plasma (step S5: dummy discharge step). This causes sputtered particles to be emitted from the target T, and the surface of the target T is smoothed (the natural oxide film is removed). During the dummy discharge, the film forming apparatus 1 covers the mounting surface 211 with the shutter member 71, thereby preventing sputtered particles emitted from the target T from accumulating on the mounting surface 211.

[0074] After the dummy discharge step, the control unit 90 raises the plurality of lift pins 212 again to place the shutter member 71 at the placement position PP, thereby enabling the transfer mechanism 72 to receive the shutter member 71 (step S6). Then, the control unit 90 operates the transfer mechanism 72 to move the support arm 73 from the retracted position SP to the placement position PP (step S7: re-movement step). In the re-movement step, the support body 73a of the support arm 73 enters between the placement surface 211 and the lower surface of the shutter member 71.

[0075] Thereafter, the control unit 90 lowers the plurality of lift pins 212, thereby causing the support body 73a of the support arm 73 to receive the shutter member 71 from the plurality of lift pins 212 (step S8: receiving step). In this receiving step as well, the control unit 90 can determine whether or not the shutter member 71 has been received normally, based on, for example, a change in the magnetism detected by the magnetic sensor 82.

[0076] Then, with the shutter member 71 supported by the support arm 73, the control unit 90 operates the transport mechanism 72 to move (carry out) the shutter member 71 from the placement position PP to the retracted position SP (step S9: carrying out step). At this time, the control unit 90 rotates the support arm 73 using the rotation device 75 until the support body 73a of the support arm 73 reaches the retracted position SP.

[0077] In this unloading process, the control unit 90 also sets a flag indicating the unloading process and performs detection by the detection unit 80, and determines whether or not the support arm 73 supports the shutter member 71 based on the detected torque and detected magnetism. In the unloading process, the normal state is when the support arm 73 supports the shutter member 71. Therefore, when the control unit 90 determines that the shutter member 71 is present, it continues the unloading process, but when it determines that the shutter member 71 is not present, it recognizes an abnormality in the transportation of the shutter member 71 and notifies the user of the abnormality. This allows the user to immediately take appropriate action when an abnormality occurs.

[0078] When the shutter member 71 is returned to the retracted position, the control unit 90 ends the cleaning. As described above, the control unit 90 can accurately determine the presence or absence of the shutter member 71 during the transport of the shutter member 71 during cleaning, at the time of delivery, or at the time of receipt.

[0079] In a conventional film forming apparatus, an optical sensor (photoelectric sensor) is installed in the evacuation section 10as to determine whether the shutter member is supported by the support arm based on the detection of the shutter member by the optical sensor. The use of such an optical sensor complicates the structure of the evacuation section 10as, which increases the size of the processing vessel 10. Furthermore, a configuration with an optical sensor at the evacuation position SP cannot determine whether the shutter member is present until the shutter member is returned to the evacuation position SP, resulting in a delayed detection timing of the shutter member.

[0080] In contrast, the film forming apparatus 1 having the detection unit 80 in the transfer mechanism 72 itself can simplify the evacuation compartment 10as where the shutter member 71 is retracted, which can facilitate downsizing of the processing vessel 10. Furthermore, the film forming apparatus 1 can immediately detect the presence or absence of the shutter member 71 by the detection unit 80 in the loading process, delivery process, evacuation process, receiving process, unloading process, etc., so that necessary measures can be taken early.

[0081] The film forming apparatus 1 and cleaning method according to the present disclosure are not limited to the above and can be modified in various ways. For example, the film forming apparatus 1 may use a sensor other than the torque sensor 81 or the magnetic sensor 82 as the detection unit 80 provided in the transport mechanism 72 itself. As one example, the detection unit 80 may use a strain sensor that detects the distortion of the support arm 73 that deforms in response to the shutter member 71 or the distortion of the shutter member 71 itself. As another example, the detection unit 80 may use a load sensor that is provided in the support arm 73, the shaft 74, or the like and detects a change in load caused by the shutter member 71.

[0082] Furthermore, the film forming apparatus 1 is not limited to the transport mechanism 72 including the support arm 73, the shaft 74, and the rotation device 75, and may also include, for example, a mechanism that linearly slides the shutter member 71. In this case, the detection unit 80 also detects, as an index, a change in the load applied to a movable body (not shown) that slides together with the shutter member 71 or an operating unit that operates the movable body. This allows the control unit 90 to accurately determine the presence or absence of the shutter member 71. Alternatively, by providing a magnetic sensor 82 on the movable body, the control unit 90 can determine the presence or absence of the shutter member 71 based on the magnetic change of the magnetic sensor 82.

[0083] It is preferable that the shutter member 71 be configured so that the user can remove it from the processing vessel 10 and replace it with a new shutter member 71. Furthermore, the substrate processing system 100 may be configured so that the shutter member 71 is transported between the processing chamber in which the film forming apparatus 1 is installed and the load port 150 (see also FIG. 1). This allows the substrate processing system 100 to replace the shutter member 71 without the user having to directly access the inside of the processing vessel 10.

[0084] Second Embodiment FIG. 5 illustrates a shutter mechanism 70A of a film forming apparatus 1A according to a second embodiment. FIG. 5(a) is a schematic longitudinal cross-sectional view of the shutter mechanism 70A, FIG. 5(b) is an enlarged longitudinal cross-sectional view of the shutter member 71 when the shutter member 71 is properly positioned, and FIG. 5(c) is an enlarged longitudinal cross-sectional view of the shutter member 71 when the shutter member 71 is not properly positioned. As shown in FIG. 5(a), the shutter mechanism 70A may include a detector 80A that detects the relative position of the shutter member 71 with respect to the support arm 73. For example, the support arm 73 may include multiple sensor terminals 84, each of which combines a magnetic sensor 82 and a contact pad 83, instead of the contact terminals 77. The multiple sensor terminals 84 are installed on the upper surface of the support body 73a of the support arm 73 (the surface facing the shutter member 71), with the magnetic sensors 82 and contact pads 83 stacked in ascending order. Like the contact terminals 77 in FIG. 2, the contact pads 83 are formed of a resin material that is softer than the shutter member 71.

[0085] Meanwhile, the shutter member 71 is made of a non-magnetic material and has recesses 71a at locations where the sensor terminals 84 are to come into contact. As shown in Fig. 5(b), the recesses 71a are preferably formed in a tapered shape with a larger opening and a smaller bottom (rear side). In other words, the shutter mechanism 70A has a positioning structure 78 that positions the shutter member 71 by inserting the multiple sensor terminals 84 into the multiple recesses 71a, respectively.

[0086] The shutter member 71 has a chip 71b made of a magnetic material on the bottom surface of the recess 71a, so that the magnetic sensor 82 of the sensor terminal 84 detects a magnetic change when the sensor terminal 84 is inserted into the recess 71a and the magnetic sensor 82 comes close to the chip 71b.

[0087] In the film forming apparatus 1A having the shutter mechanism 70A described above, when the shutter member 71 is normally supported by the transport mechanism 72, the positioning structure 78 (recess 71a, sensor terminal 83) ensures that the shutter member 71 and the support arm 73 are properly engaged with each other. This prevents the shutter member 71 from becoming misaligned with respect to the support arm 73 during the loading and unloading processes, etc.

[0088] Furthermore, in the receiving process, when the shutter mechanism 70A lowers the shutter member 71 relative to the support arm 73, the multiple sensor terminals 84 of the support arm 73 are guided into the recess 71a. When the sensor terminals 84 are inserted into the recess 71a, the magnetic sensor 82 comes close to the chip 71b and detects a magnetic change. This allows the control unit 90 to determine that the sensor terminals 84 have been properly inserted into the recess 71a, i.e., that the shutter member 71 and the support arm 73 are aligned.

[0089] 5(c), if the sensor terminal 84 is not inserted into the recess 71a when the shutter member 71 is lowered, the magnetic sensor 82 is separated from the chip 71b and does not detect a magnetic change. Therefore, the control unit 90 can determine that the sensor terminal 84 is not inserted into the recess 71a, i.e., that the shutter member 71 and the support arm 73 are misaligned.

[0090] In this way, the film forming apparatus 1A can more accurately place the shutter member 71 on the transport mechanism 72 by using the detection unit 80A to detect the relative position of the shutter member 71 with respect to the support arm 73. In particular, the shutter mechanism unit 70A can engage the shutter member 71 with the support arm 73 using the positioning structure 78, making it possible to more stably support the shutter member 71.

[0091] The film forming apparatus 1A according to the second embodiment is not limited to the above configuration and may take various modifications. For example, the detection unit 80A of the shutter mechanism 70A does not need to replace all of the contact terminals 77 with the sensor terminals 84, and the sensor terminals 84 may be applied to some of the contact terminals 77.

[0092] Fig. 6 is a schematic vertical cross-sectional view showing a shutter mechanism 70B according to a modified example. As shown in Fig. 6, the shutter mechanism 70B has a chip 71b made of a magnetic material on the flat opposing surface (lower surface) of the shutter member 71 that faces the support arm 73. The shutter mechanism 70B also has contact terminals 77 instead of sensor terminals 84, and a magnetic sensor 82 (detection unit 80B) at a predetermined position opposing the chip 71b on the upper surface of the support arm 73. Although Fig. 6 shows a configuration including one chip 71b and one magnetic sensor 82, the shutter mechanism 70B may have a plurality of chips 71b and a plurality of magnetic sensors 82 at positions opposing the chips 71b.

[0093] The magnetic sensor 82 provided on the support arm 73 is positioned in close proximity to but not in contact with the chip 71b when the support arm 73 supports the shutter member 71, thereby detecting magnetic changes. Conversely, if the shutter member 71 is misaligned with respect to the support arm 73, the magnetic sensor 82 will also be misaligned with respect to the chip 71b and will not detect magnetic changes. In this way, the film formation apparatus 1A can determine the relative positions of the shutter member 71 and the support arm 73 by detecting the chip 71b on the opposing surface of the shutter member 71 using the magnetic sensor 82 provided on the support arm 73.

[0094] As described above, the film forming apparatus 1 according to the first aspect of the present disclosure includes a processing vessel 10, a sputtering target T provided within the processing vessel 10, a mounting table 21 having a mounting surface 211 on which a substrate (wafer W) is placed within the processing vessel 10, a shutter member 71 capable of covering the mounting surface 211, a transport mechanism 72 for transporting the shutter member 71 into and out of the mounting table 21, a detection unit 80 provided within the transport mechanism 72 itself for detecting an indicator related to the presence or absence of the shutter member 71, and a processing unit (control unit 90) for determining the presence or absence of the shutter member 71 for the transport mechanism 72 based on the detection result of the detection unit 80.

[0095] The above-described film forming apparatus 1 can quickly and stably determine the presence or absence of the shutter member 71 in each cleaning process by monitoring the shutter member 71 using the detection unit 80 provided in the transfer mechanism 72 itself. This eliminates the need for a separate detection unit in the processing vessel 10 to detect the movement of the shutter member 71, thereby facilitating the miniaturization of the processing vessel 10.

[0096] The transport mechanism 72 also has a support arm 73 that supports the shutter member 71 and a rotation device 75 that rotates the support arm 73, and the detection unit 80 is provided on the rotation device 75 and includes a torque sensor 81 that detects, as an index, the torque applied from the support arm 73 to the rotation device 75 when the support arm 73 rotates. This allows the control unit 90 of the film forming apparatus 1 to accurately detect the presence or absence of the shutter member 71 based on the torque applied to the rotation device 75.

[0097] Furthermore, the torque sensor 81 is provided outside the processing chamber 10. This allows the film forming apparatus 1 to further simplify the configuration of the transfer mechanism 72 inside the processing chamber 10.

[0098] Furthermore, the shutter member 71 is made of a magnetic material, and the detection unit 80 includes a magnetic sensor 82 that detects, as an index, a magnetic change when the shutter member 71 approaches. This allows the control unit 90 of the film forming apparatus 1 to accurately detect the presence or absence of the shutter member 71 based on the magnetic change when the shutter member 71 is supported by the transport mechanism 72.

[0099] Furthermore, the processing unit (control unit 90) continues to determine the presence or absence of the shutter member 71 relative to the transport mechanism 72 while the shutter member 71 is being transported by the transport mechanism 72. This allows the film forming apparatus 1 to immediately detect a situation such as when the shutter member 71 falls during transport, and prompt the user to take appropriate action.

[0100] Furthermore, the processing unit (control unit 90) determines whether the shutter member 71 is present on the transport mechanism 72 when the shutter member 71 is transferred from the transport mechanism 72 to the mounting table 21 and when the shutter member 71 is received by the transport mechanism 72 from the mounting table 21. This allows the film forming apparatus 1 to quickly recognize whether the shutter member 71 is present when transferring or receiving the shutter member 71, and allows the transfer or receiving to be attempted again.

[0101] Furthermore, a film formation apparatus 1A according to a second aspect of the present disclosure includes a processing vessel 10, a sputtering target T provided within the processing vessel 10, a mounting table 21 having a mounting surface 211 on which a substrate (wafer W) is placed within the processing vessel 10, a shutter member 71 capable of covering the mounting surface 211, a transfer mechanism 72 that transfers the shutter member 71 to and from the mounting table 21, detection units 80A and 80B provided within the transfer mechanism 72 itself that detect an index related to the position of the shutter member 71, and a processing unit (controller 90) that determines the position of the shutter member 71 relative to the transfer mechanism 72 based on the detection results of the detection units 80A and 80B. Even in this case, the film formation apparatus 1A can quickly and stably detect the position of the shutter member 71 relative to the transfer mechanism 72.

[0102] Moreover, the shutter member 71 is made of a non-magnetic material and has one or more chips 71b made of a magnetic material on the surface facing the transport mechanism 72, and the detection units 80A and 80B include a magnetic sensor 82 provided at a location on the transport mechanism 72 that is scheduled to face the chip 71b. This allows the film formation apparatus 1A to accurately recognize whether the position of the shutter member 71 relative to the transport mechanism 72 is normal or abnormal (misaligned) based on the magnetic change of the magnetic sensor 82 relative to the chip 71b.

[0103] Furthermore, the shutter member 71 has a recess 71a formed on the opposing surface and a chip 71b at the back of the recess 71a, and the detection unit 80A includes a sensor terminal 84 equipped with a magnetic sensor 82, and the sensor terminal 84 protrudes from the transport mechanism 72 and can be inserted into the recess 71a. This allows the film forming apparatus 1A to engage the sensor terminal 84 with the recess 71a, making it possible to transport the shutter member 71 even more safely.

[0104] Furthermore, a third aspect of the present disclosure is a cleaning method for a film forming apparatus 1 that includes a processing vessel 10, a sputtering target T provided within the processing vessel 10, and a mounting table 21 having a mounting surface 211 on which a substrate (wafer W) is placed within the processing vessel 10, wherein a shutter member 71 capable of covering the mounting surface 211 is transported in and out of the mounting table 21 by a transport mechanism 72, an indicator related to the presence or absence of the shutter member 71 is detected by a detection unit 80 provided in the transport mechanism 72 itself, and the presence or absence of the shutter member 71 relative to the transport mechanism 72 is determined based on the detection result of the detection unit 80.

[0105] Furthermore, a fourth aspect of the present disclosure is a cleaning method for a film forming apparatus 1 that includes a processing vessel 10, a sputtering target T provided within the processing vessel 10, and a mounting table 21 having a mounting surface 211 on which a substrate (wafer W) is placed within the processing vessel 10, wherein a shutter member 71 capable of covering the mounting surface 211 is transported in and out of the mounting table 21 by a transport mechanism 72, and indicators related to the position of the shutter member 71 are detected by detection units 80A and 80B provided in the transport mechanism 72 itself, and the position of the shutter member 71 relative to the transport mechanism 72 is determined based on the detection results of the detection units 80A and 80B.

[0106] In the cleaning methods for the film forming apparatus 1 according to the third and fourth aspects described above, the shutter member 71 covering the mounting surface 211 of the mounting table 21 can also be detected quickly and stably.

[0107] The film forming apparatus 1 according to the presently disclosed embodiment is illustrative in all respects and is not limiting. The embodiment can be modified and improved in various ways without departing from the spirit and scope of the appended claims. The matters described in the above-described embodiments can be configured in other ways as long as they are not inconsistent, and can be combined as long as they are not inconsistent. [Explanation of symbols]

[0108] 1, 1A film deposition equipment 10 Processing container 21 Mounting table 211 Placement surface 71 Shutter member 71a Recess 71b Chip 72 Transport mechanism 73 Support Arm 74 Shaft 75 Rotating Device 80, 80A, 80B detector 81 Torque sensor 82 Magnetic Sensor 84 Sensor terminal 90 Control Unit W wafer

Claims

1. A processing vessel; a sputtering target provided in the processing vessel; a mounting table having a mounting surface on which a substrate is placed in the processing chamber; a shutter member capable of covering the placement surface; a transport mechanism that transports the shutter member into and out of the mounting table; a detection unit provided in the transport mechanism itself and detecting an index relating to the position of the shutter member; a processing unit that determines a position of the shutter member relative to the transport mechanism based on a detection result of the detection unit, the shutter member is made of a non-magnetic material and has one or more chips made of a magnetic material on a surface facing the transport mechanism, the detection unit includes a magnetic sensor provided at a location in the transport mechanism that is intended to face the chip; Film deposition equipment.

2. the shutter member has a recess formed in the opposing surface, and the tip is located at the deepest part of the recess; the detection unit includes a sensor terminal equipped with the magnetic sensor, the sensor terminal protrudes from the transport mechanism and is thereby insertable into the recess; The film forming apparatus according to claim 1.

3. A processing vessel; a sputtering target provided in the processing vessel; a mounting table having a mounting surface on which a substrate is placed in the processing chamber, the method comprising: a step of carrying a shutter member, which is capable of covering the mounting surface and is made of a non-magnetic material, and has one or more chips made of a magnetic material on a surface facing a transport mechanism, into and out of the mounting table by the transport mechanism; a step of detecting an index relating to the position of the shutter member by a detection unit provided in the transport mechanism itself and including a magnetic sensor provided at a location in the transport mechanism that is scheduled to face the chip; and determining a position of the shutter member relative to the transport mechanism based on a detection result of the detection unit. A method for cleaning a film forming apparatus.

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