Component Mounting System

Abstract

To reduce a burden on an operator generated when a head is replaced.SOLUTION: A component mounting system includes: a plurality of types of nozzles; a plurality of types of calibration jigs provided according to the type of the nozzle; a calibration jig housing station for housing the plurality of types of calibration jigs; a plurality of types of heads on which the nozzle and the calibration jig are mounted; and a plurality of component mounting machines. Each component mounting machine includes: a substrate conveyance device for conveying a substrate or the calibration jig housing station; a head holding unit; and a control unit. The control unit is configured to be capable of executing: carry-in processing of the substrate or the calibration jig housing station; component mounting processing; calibration processing of taking out the calibration jig from the calibration jig housing station and executing calibration work for calibrating a position of the head in a state in which the head is mounted onto the head holding unit while no nozzle is mounted on the head; and carrying-out processing for carrying out the substrate or the calibration jig housing station as of after the processing.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The technology disclosed in this specification relates to a component mounting system that mounts electronic components on a substrate. [Background technology]

[0002] A component mounter that mounts electronic components on a board may use a nozzle to pick up the electronic components and then move the picked-up electronic components onto the board to mount them on the board. To mount various electronic components on a board, this type of component mounter may use different types of nozzles depending on the type of electronic components. The types of electronic components to be mounted on a board vary depending on the production plan. Therefore, different nozzles may be used for each production plan. When performing component mounting processing according to the next production plan, the component mounter may not be equipped with the nozzles required for that production plan. For example, Patent Document 1 discloses a technology for supplying nozzles required for performing component mounting processing according to the next production plan. Patent Document 1 uses a nozzle transport plate that can accommodate nozzles. The nozzle transport plate is transported by a board transport device that transports boards. The nozzle transport plate accommodates the nozzles required for performing component mounting processing according to the next production plan. The nozzle transport plate is transported to the component mounter by the board transport device, thereby supplying the required nozzles to the component mounter. This allows the required nozzles to be automatically supplied to the component mounter. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2004 / 066701 Summary of the Invention [Problem to be solved by the invention]

[0004] The mounter described above may use different heads depending on the type of nozzle. Specifically, the mounter is equipped with a head to which the nozzle is attached and a head holder to which the head can be attached. The head holder is configured to hold different heads. By changing the type of head held by the head holder, various nozzles can be attached to the head depending on the type of head. Because different nozzles are used for each production plan, the head held by the head holder may also be replaced for each production plan. When the head held by the head holder is replaced, the head position must be calibrated. To calibrate the head position, a calibration jig suited to that head is used. The calibration jig is installed on the mounter by an operator. This required an operator to install the calibration jig on the mounter for each production plan.

[0005] This specification discloses a technique for reducing the burden on the worker when the head is replaced. [Means for solving the problem]

[0006] The component mounting system disclosed in this specification mounts multiple types of electronic components on a substrate. The component mounting system includes multiple types of nozzles that pick up different types of electronic components depending on the nozzle type, multiple types of calibration jigs provided corresponding to the nozzle types, a calibration jig holding station that holds the multiple types of calibration jigs, multiple types of heads to which the nozzles and calibration jigs are detachably attached, the multiple types of heads to which different types of nozzles and calibration jigs are attached corresponding to the head types, and multiple component mounters, the multiple component mounters being arranged adjacent to each other in order, each component mounter including a board transport device that loads a board or calibration jig holding station into the component mounter through an entrance and loads the board or calibration jig holding station from the component mounter to the entrance of an adjacent component mounter in order, a head holding unit that can detachably mount each of the multiple types of heads, and a control unit that controls the board or calibration jig holding station transported to the entrance of the component mounter by the board transport device. a component mounting process in which, when the board is carried into the work position by the board transport device with the head attached to the head holding part and the nozzle attached to the head, an electronic component adsorbed to the nozzle is mounted on the board; a calibration process in which, when the calibration jig accommodation station is carried into the work position by the board transport device with the head attached to the head holding part but no nozzle attached to the head, a calibration jig of a type corresponding to the type of head attached to the head holding part is removed from the calibration jig accommodation station and a calibration work is performed to calibrate the position of the head relative to the head holding part using the removed calibration jig; and an unloading process in which, when the component mounting process is completed or at least after the calibration jig has been removed, the processed board or the calibration jig accommodation station is carried out by the board transport device to the carry-in entrance of the next component mounter in the order.

[0007] In the above-described component mounting system, the calibration jig accommodation station is loaded into the component mounters in sequence, and the component mounters requiring calibration perform the calibration process using the corresponding type of calibration jig stored in the calibration jig accommodation station. Furthermore, after at least the calibration jig is removed, the calibration jig accommodation station is carried out toward the next component mounter in the sequence. This eliminates the need for an operator to supply calibration jigs to multiple component mounters requiring calibration jigs when heads are replaced on multiple component mounters. This reduces the burden on the operator. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a diagram showing a schematic configuration of a component mounting line provided in a component mounting system according to an embodiment; [Figure 2] FIG. 1 is a diagram showing a schematic configuration of a component mounter. [Figure 3] FIG. 3 is a cross-sectional view taken along line III-III in FIG. 2. [Figure 4] FIG. 2 is a block diagram showing a control system of the component mounter. [Figure 5] FIG. 2 is a diagram showing a schematic configuration of a calibration jig accommodation station. [Figure 6] 10 is a flowchart showing an example of a process for calibrating the position of a mounting head when the mounting head is replaced. DETAILED DESCRIPTION OF THE INVENTION

[0009] The main features of the embodiments described below are listed below. Note that the technical elements described below are independent technical elements that exhibit technical utility alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing.

[0010] In the component mounting system disclosed in this specification, the calibration process may be configured to store a corresponding type of calibration jig in a calibration jig storage station when the calibration work is completed. In the unloading process, once the corresponding type of calibration jig is stored in the calibration jig storage station, the calibration jig storage station may be transported to an adjacent component mounter. With this configuration, when heads using the same type of calibration jig are replaced in multiple component mounters, the calibration jig storage station is transported to these component mounters in turn, allowing the head calibration process to be performed using the calibration jig stored in the calibration jig storage station. This allows the head calibration process to be performed automatically in multiple component mounters.

[0011] In the component mounting system disclosed in this specification, each mounter may further include an imaging device that images the nozzle or calibration jig attached to the head. The calibration process may include an imaging process that images the calibration jig attached to the head with the imaging device, and a measurement process that measures the position of the calibration jig from the image captured in the imaging process. [Example]

[0012] A component mounting system 1 according to an embodiment will be described with reference to the drawings. As shown in Fig. 1, the component mounting system 1 includes a plurality of component mounters 10, a management device 8, and a calibration jig accommodation station 40 (see Fig. 5).

[0013] As shown in FIG. 1 , each mounter 10 is communicatively connected to a management device 8. The management device 8 is communicatively connected to multiple mounters 10 and manages the multiple mounters 10. A component mounting line 100 is configured with the management device 8 and the multiple mounters 10. The management device 8 is configured using a computer equipped with a CPU and a storage device. The management device 8 controls the operation of each mounter 10, thereby controlling the entire component mounting line 100. That is, the management device 8 determines, for each of the multiple mounters 10, the type and position of the electronic components 4 to be mounted on the circuit board 2 by that mounter 10, and instructs the mounters 10 accordingly. The mounters 10 operate based on the instructions from the management device 8, thereby mounting the necessary electronic components 4 on the circuit board 2.

[0014] First, the component mounter 10 will be described. The component mounter 10 mounts electronic components 4 on a circuit board 2. The circuit board 2 is fed from one end to the other end of the component mounting line 100. Predetermined electronic components 4 are mounted on the circuit board 2 by each component mounter 10. The circuit board 2 fed to the other end of the component mounting line 100 is shipped as a final product or sent to a subsequent process as a semi-finished product. Multiple component feeders 12 can be installed on the component mounter 10. By installing the component feeders 12 on the component mounter 10, electronic components 4 are supplied from the component feeders 12 to the component mounter 10. Note that the component feeders 12 can be installed for any of the multiple component mounters 10 on the component mounting line 100. The type of component feeder 12 to be installed on the component mounter 10 is determined by the management device 8.

[0015] 2 and 3, the component mounter 10 includes a plurality of component feeders 12, a feeder holder 14, a mounting head 16, a head moving device 18, a board conveyor 20, a first imaging device 30, a second imaging device 32, a nozzle holder 34, a control device 26, and a touch panel 24. A management device 8 configured to be able to communicate with the component mounter 10 is disposed outside the component mounter 10.

[0016] Each component feeder 12 stores a plurality of electronic components 4. The component feeders 12 are detachably attached to the feeder holder 14 and supply the electronic components 4 to the mounting head 16. The specific configuration of the component feeders 12 is not particularly limited. Each component feeder 12 may be, for example, a tape feeder that supplies a plurality of electronic components 4 stored on a tape, a tray feeder that supplies a plurality of electronic components 4 stored on a tray, or a bulk feeder that supplies a plurality of electronic components 4 stored randomly in a container.

[0017] The feeder holding unit 14 has a plurality of slots, each of which can detachably accommodate a component feeder 12. The feeder holding unit 14 may be fixed to the component mounter 10, or may be detachable from the component mounter 10.

[0018] The placement head 16 is detachably attached to a head holding unit 19 provided on a moving base 18a (described later) of the head moving device 18. The placement head 16 has a nozzle 6 that picks up an electronic component 4. The nozzle 6 is detachably attached to the placement head 16. The placement head 16 is capable of moving the nozzle 6 in the Z direction (here, the vertical direction) to move the nozzle 6 toward and away from the component feeder 12 and the circuit board 2. The placement head 16 can pick up electronic components 4 from the component feeder 12 using the nozzle 6 and place the electronic components 4 picked up by the nozzle 6 onto the circuit board 2. In this embodiment, the placement head 16 is equipped with multiple nozzles 6. However, the placement head 16 may be equipped with only a single nozzle 6.

[0019] Different types of nozzles 6 are used depending on the types of electronic components 4 to be mounted on the circuit board 2. Multiple types of electronic components 4 are mounted on the circuit board 2. The same type of nozzle 6 may not be able to pick up different types of electronic components 4. For this reason, when mounting electronic components 4 on the circuit board 2, an appropriate nozzle 6 is selected from the multiple types of nozzles 6 according to the type of electronic component 4 to be mounted on the circuit board 2, and the selected nozzle 6 is attached to the mounting head 16. Similarly, the same type of mounting head 16 may not be able to attach different types of nozzles 6. For this reason, when mounting electronic components 4 on the circuit board 2, an appropriate mounting head 16 is selected from the multiple types of mounting heads 16 according to the type of nozzle 6 to be used, and the selected mounting head 16 is attached to the head holding unit 19. All of the multiple types of mounting heads 16 are configured to be attachable to the head holding unit 19.

[0020] The head moving device 18 moves the mounting head 16 and the second imaging device 32 (described later) between the component feeder 12 and the circuit board 2. As an example, the head moving device 18 in this embodiment is an XY robot that moves a moving base 18a in the X and Y directions, and the mounting head 16 and the second imaging device 32 are fixed to the moving base 18a. The moving base 18a is provided with a head holding unit 19 to which the mounting head 16 can be detachably attached, and the mounting head 16 is attached to the head holding unit 19. The head moving device 18 is capable of translating the nozzle 6 in a plane parallel to the surface of the circuit board 2 (the XY plane).

[0021] The board conveyor 20 is a device that carries in, positions, and carries out the circuit board 2. Specifically, the board conveyor 20 carries the circuit board 2 into the component mounter 10 through an inlet (not shown) of the component mounter 10 and positions the circuit board 2 at a mounting work position (the position shown in FIG. 3) within the component mounter 10. The board conveyor 20 also carries out the circuit board 2 to an inlet (not shown) of an adjacent component mounter 10. That is, the board conveyor 20 transports the circuit board 2 to the adjacent component mounters 10 in order. As an example, the board conveyor 20 in this embodiment has a pair of belt conveyors and a support device (not shown) that supports the circuit board 2 from below. The board conveyor 20 also transports the circuit board 2 through the calibration jig housing station 40 in the same manner.

[0022] The first imaging device 30 is disposed between the component feeder 12 and the board conveyor 20 (more specifically, the board conveyor 20 of the pair of board conveyors 20 that is installed on the component feeder 12 side). The first imaging device 30 includes a camera and a light source. The camera is disposed so that its imaging direction faces upward, and captures an image of the nozzle 6 from below while it is holding an electronic component 4. That is, when the nozzle 6 picks up the electronic component 4, the camera captures an image of the bottom surface of the electronic component 4 held by the nozzle 6. For example, a CCD camera is used as the camera. The light source is constituted by an LED, and illuminates the bottom surface (imaging surface) of the electronic component 4 held by the nozzle 6. Image data of the image captured by the first imaging device 30 is stored in a memory (not shown) of the control device 26.

[0023] The second imaging device 32 is fixed to the movable base 18a and moves integrally with the movable base 18a. The second imaging device 32 is equipped with a camera and a light source. The camera is positioned so that its imaging direction faces downward, and captures images of the upper surface of the circuit board 2 and the upper surface of the calibration jig accommodation station 40 (described later). The camera may be, for example, a CCD camera. The light source is composed of an LED and illuminates the upper surface of the circuit board 2 and the upper surface of the calibration jig accommodation station 40. Image data of the image captured by the second imaging device 32 is stored in a memory (not shown) of the control device 26.

[0024] The nozzle holder 34 is disposed between the component feeder 12 and the board conveyor 20 (more specifically, the board conveyor 20 of the pair of board conveyors 20 that is installed on the component feeder 12 side). The nozzle holder 34 can accommodate multiple nozzles 6, and transfers the nozzles 6 to and from the mounting head 16. The nozzles 6 are accommodated in the nozzle holder 34 while a process for calibrating the position of the mounting head 16, which will be described later, is being executed.

[0025] The control device 26 is configured using a computer including a CPU and a storage device. The control device 26 controls the operation of each part of the component mounter 10 based on a production program transmitted from the management device 8. As shown in Fig. 4, the control device 26 is connected to the head moving device 18, the board conveyor 20, the touch panel 24, the first imaging device 30, and the second imaging device 32, and controls each part of the head moving device 18, the board conveyor 20, the touch panel 24, the first imaging device 30, and the second imaging device 32. The touch panel 24 is a display device that provides various information about the component mounter 10 to the worker, and is also an input device that receives instructions and information from the worker.

[0026] Next, the calibration jig accommodating station 40 will be described. As shown in Fig. 5, the calibration jig accommodating station 40 accommodates multiple types of calibration jigs 42 and 46 and calibration components 48. The calibration jig accommodating station 40 has a shape (i.e., a plate shape) that can be transported by the board conveyor 20. When calibrating the position of the mounting head 16, the calibration jig accommodating station 40 is transported in turn by the board conveyor 20 to adjacently arranged component mounters 10.

[0027] The calibration jigs 42, 46 are used to calibrate the position of the mounting head 16 relative to the head holding unit 19 when the mounting head 16 attached to the head holding unit 19 is replaced. The calibration jig accommodation station 40 accommodates two types of calibration jigs 42, 46, one for each type of mounting head 16. Hereinafter, the calibration jig 42 may be referred to as the "first calibration jig 42," and the calibration jig 46 may be referred to as the "second calibration jig 46."

[0028] The first calibration jig 42 is configured to be attachable to the corresponding mounting head 16. That is, the attachment portion of the first calibration jig 42 to the mounting head 16 (in this embodiment, the upper end of the first calibration jig 42) has the same shape as the attachment portion of the corresponding nozzle 6 to the mounting head 16 (in this embodiment, the upper end of the nozzle 6). The first calibration jig 42 also has a protrusion 44 on its underside. When calibrating the position of the mounting head 16 using the first calibration jig 42, the mounting head 16 is attached to the head holding portion 19, and the first calibration jig 42 corresponding to the type of that mounting head 16 is attached to the mounting head 16. Then, with the first calibration jig 42 attached to the mounting head 16, an image of the first calibration jig 42 is taken from below using the first imaging device 30. This results in an image of the protrusion 44. The position of the mounting head 16 relative to the head holding portion 19 is detected from the position of the imaged protrusion 44. Based on the detected position, the positional deviation of the mounting head 16 relative to the head holding portion 19 can be identified.

[0029] The second calibration jig 46 has the same shape as the nozzle 6 attached to the corresponding placement head 16. When calibrating the position of a placement head 16 using the second calibration jig 46, the placement head 16 is attached to the head holding unit 19, and the second calibration jig 46 corresponding to the type of placement head 16 is attached to the placement head 16. A calibration component 48 is then picked up by the second calibration jig 46, and the calibration component 48 is placed at a predetermined position (not shown) on the calibration jig receiving station 40. An image of the calibration component 48 placed at the predetermined position is then taken using the second imaging device 32. A mark (not shown) is provided on the top surface of the calibration component 48. Therefore, from the position of the imaged mark, it is possible to identify any deviation in the mounting position when the nozzle 6 is attached to the placement head 16 attached to the head holding unit 19 and electronic components 4 are mounted using the nozzle 6.

[0030] The calibration jig accommodating station 40 accommodates all types of calibration jigs 42, 46 that can be used in the component mounter 10, as well as multiple types of calibration components 48. The calibration jig accommodating station 40 shown in Fig. 5 accommodates five types of first calibration jigs 42a to 42e and five types of second calibration jigs 46a to 46e that correspond to the five types of mounting heads 16, respectively.

[0031] For example, the first calibration jig 42a and the second calibration jig 46a are used to calibrate a mounting head 16 that can simultaneously mount 24 nozzles 6. The calibration jig housing station 40 houses 24 first calibration jig 42a and one second calibration jig 46a. When performing calibration using the first calibration jig 42a, all 24 first calibration jig 42a are mounted on the corresponding mounting head 16. Then, for each of the 24 mounted first calibration jig 42a, the position of the first calibration jig 42a (specifically, the position of the protrusion 44 of each first calibration jig 42a) is detected. When performing calibration using the second calibration jig 46a, the second calibration jig 46a is mounted in one of the 24 nozzle mounting positions on the corresponding mounting head 16. Then, the calibration component 48a is sucked onto the second calibration jig 46a, and the calibration component 48a is placed at a predetermined position, and the position of the calibration component 48a is detected.

[0032] The first calibration jig 42b and the second calibration jig 46b are used to calibrate a mounting head 16 that can simultaneously mount twelve nozzles 6. The calibration jig housing station 40 houses twelve first calibration jigs 42b and one second calibration jig 46b. The first calibration jig 42c and the second calibration jig 46c are used to calibrate a mounting head 16 that can simultaneously mount four nozzles 6. The calibration jig housing station 40 houses four first calibration jigs 42c and one second calibration jig 46c. The first calibration jig 42d and the second calibration jig 46d are used to calibrate a mounting head 16 that can simultaneously mount four nozzles 6. The first calibration jigs 42c and the second calibration jigs 46c, and the first calibration jigs 42d and the second calibration jigs 46d correspond to different types of mounting heads 16. The calibration jig housing station 40 houses four first calibration jigs 42d and one second calibration jig 46d. The first calibration jigs 42e and the second calibration jig 46e are used to calibrate a mounting head 16 that can simultaneously mount two nozzles 6. The calibration jig housing station 40 houses two first calibration jigs 42e and one second calibration jig 46e. The calibration method using the first calibration jigs 42b-e and the second calibration jigs 46b-e is the same as the calibration method using the first calibration jigs 42a and the second calibration jig 46a described above, so a detailed description thereof will be omitted.

[0033] The calibration parts 48a and 48b are used when performing calibration using the second calibration jig 46. When performing calibration using the second calibration jig 46, either the calibration part 48a or 48b is used depending on the type of the second calibration jig 46. Specifically, when performing calibration using the second calibration jig 46a to 46c, the calibration part 48a is used, and when performing calibration using the second calibration jig 46d or 46e, the calibration part 48b is used.

[0034] Next, a process for calibrating the position of the placement head 16 when the placement head 16 is replaced will be described. When the type of circuit board 2 produced on the component mounting line 100 changes and the next type of circuit board 2 is produced according to the next production plan, a different type of electronic component 4 than that in the previous production plan will be mounted on the circuit board 2. In this case, the type of nozzle 6 used may also change depending on the type of electronic component 4 to be mounted on the circuit board 2. Consequently, the type of placement head 16 attached to the head holding unit 19 will also change depending on the type of nozzle 6 used. When the placement head 16 is replaced with another placement head 16 on the head holding unit 19, it becomes necessary to calibrate the position of the placement head 16 relative to the head holding unit 19. Below, a process for automatically calibrating the position of the placement head 16 relative to the head holding unit 19 when the placement head 16 attached to the head holding unit 19 is replaced will be described.

[0035] 6, first, the control device 26 causes the board conveyor 20 to carry the calibration jig accommodating station 40 into the component mounter 10 (S12). As described above, the calibration jig accommodating station 40 has a shape that allows it to be transported by the board conveyor 20. Therefore, the calibration jig accommodating station 40 can be transported into the component mounter 10 by the board conveyor 20. In other words, the calibration jig accommodating station 40 can be transported into the component mounter 10 without adding a separate component for carrying the calibration jig accommodating station 40 into the component mounter 10.

[0036] Next, the control device 26 mounts the first calibration jig 42 on the mounting head 16 attached to the head holding unit 19 (S14). Specifically, the control device 26 selects a type of first calibration jig 42 that corresponds to the type of mounting head 16 attached to the head holding unit 19 from the multiple types of first calibration jigs 42a to 42e housed in the calibration jig housing station 40. The control device 26 then mounts the selected first calibration jig 42 to each of the multiple nozzle mounting positions of the mounting head 16 attached to the head holding unit 19. For example, if the mounting head 16 attached to the head holding unit 19 is capable of simultaneously mounting 24 nozzles 6, the control device 26 selects the first calibration jig 42a from the multiple types of first calibration jigs 42a to 42e. The control device 26 then mounts the first calibration jig 42a to each of the 24 nozzle mounting positions.

[0037] Next, the control device 26 uses the first imaging device 30 to capture an image of the first calibration jig 42 attached to the mounting head 16 (S16). Specifically, the control device 26 moves the movable base 18a so that the first calibration jig 42 is positioned above the first imaging device 30. The control device 26 then uses the first imaging device 30 to capture an image of the first calibration jig 42 from below. By capturing an image of the first calibration jig 42 from below, the protrusions 44 disposed on the underside of the first calibration jig 42 are captured. At this time, if all of the first calibration jigs 42 attached to the mounting head 16 fit within the imaging range of the first imaging device 30, the control device 26 moves the movable base 18a so that all of the first calibration jigs 42 attached to the mounting head 16 fit within the imaging range of the first imaging device 30. As a result, it is possible to image the undersides of all of the first calibration jigs 42 attached to the mounting head 16 by capturing an image once with the first imaging device 30. On the other hand, if all of the first calibration jigs 42 attached to the mounting head 16 do not fit within the imaging range of the first imaging device 30, the first calibration jigs 42 are moved and images of the first calibration jigs 42 are captured multiple times so that the undersides of all of the first calibration jigs 42 attached to the mounting head 16 are captured.

[0038] Next, the control device 26 detects the position of each of the protrusions 44 arranged on the underside of the plurality of first calibration jigs 42 from the captured image (S18). When the mounting head 16 is attached to the head holding unit 19 without any misalignment, the protrusions 44 are detected at positions that match the preset positions. By detecting the position of each protrusion 44, it is possible to determine how much each nozzle mounting portion of the mounting head 16 is misaligned from the preset position. When mounting the electronic components 4 on the circuit board 2, the mounting positions of the electronic components 4 are corrected based on the determined amount of misalignment. This allows the electronic components 4 to be mounted in more accurate positions.

[0039] Next, the control device 26 accommodates the first calibration jig 42 mounted on the mounting head 16 in the calibration jig accommodating station 40 (S20). This returns the calibration jig accommodating station 40 to a state in which all of the calibration jigs 42, 46 are accommodated therein.

[0040] Next, the control device 26 mounts the second calibration jig 46 on the mounting head 16 mounted on the head holding unit 19 (S22). Specifically, the control device 26 selects a type of second calibration jig 46 that corresponds to the type of mounting head 16 mounted on the head holding unit 19 from the multiple types of second calibration jig 46a to 46e housed in the calibration jig housing station 40. The control device 26 then mounts the selected second calibration jig 46 on one of the multiple nozzle mounting positions of the mounting head 16. For example, if the mounting head 16 mounted on the head holding unit 19 is capable of simultaneously mounting 24 nozzles 6, the control device 26 selects the second calibration jig 46a from the multiple types of second calibration jig 46a to 46e. The control device 26 then mounts the second calibration jig 46a on one of the multiple nozzle mounting positions of the mounting head 16.

[0041] Next, the control device 26 adsorbs the calibration component 48 onto the second calibration jig 46 (S24). In this embodiment, two types of calibration components 48a, 48b are accommodated in the calibration jig accommodation station 40. The control device 26 selects an appropriate one from the two types of calibration components 48a, 48b depending on the type of second calibration jig 46 attached to the mounting head 16. The control device 26 then adsorbs the selected calibration component 48 onto the second calibration jig 46. For example, if the second calibration jig 46a is attached to the mounting head 16, the control device 26 selects the calibration component 48a corresponding to the second calibration jig 46a and adsorbs the calibration component 48a onto the second calibration jig 46a.

[0042] Next, the control device 26 places the calibration component 48 picked up by the second calibration jig 46 at a predetermined position (not shown) on the calibration jig accommodation station 40 (S26). At this time, the predetermined position at which the calibration component 48 is to be placed is corrected based on the amount of deviation identified in step S18. As a result, the calibration component 48 is placed while taking into consideration the positional deviation of the mounting head 16 relative to the head holding unit 19. Next, the control device 26 uses the second imaging device 32 to capture an image of the calibration component 48 placed at the predetermined position (S28). Specifically, the control device 26 moves the moving base 18a so that the second imaging device 32 is positioned above the predetermined position. Then, the control device 26 images the calibration component 48 from above using the second imaging device 32. By imaging the calibration component 48 from above, a mark (not shown) provided on the top surface of the calibration component 48 is captured.

[0043] Next, the control device 26 detects the position of the calibration component 48 from the captured image (S30). Specifically, the control device 26 detects the position of the calibration component 48 by detecting a mark in the captured image. When the second calibration jig 46 is attached to the mounting head 16 without any misalignment, the mark on the upper surface of the calibration component 48 is detected at a position that coincides with a preset position. By detecting the position of the calibration component 48 (specifically, the position of the mark on the upper surface of the calibration component 48), it is possible to determine the amount of misalignment of the electronic component 4 when the nozzle 6 is attached to the mounting head 16 attached to the head holding unit 19 and the electronic component 4 is mounted using the nozzle 6. When the electronic component 4 is mounted on the circuit board 2, the mounting position of the electronic component 4 is corrected based on the determined amount of misalignment. This allows the electronic component 4 to be mounted in a more accurate position.

[0044] Next, the control device 26 causes the second calibration jig 46 to suck the calibration component 48 again, and stores the calibration component 48 in the calibration jig storing station 40 (S32). Thereafter, the control device 26 stores the second calibration jig 46 mounted on the mounting head 16 in the calibration jig storing station 40 (S34). This returns the calibration jig storing station 40 to a state in which all of the calibration jigs 42, 46 and calibration components 48 are stored therein.

[0045] Next, the control device 26 determines whether the second calibration jig 46 has been attached to all of the nozzle mounting positions of the mounting head 16 attached to the head holding unit 19 (S36). That is, the control device 26 determines whether a mounting position deviation has been detected for all of the nozzle mounting positions of the mounting head 16. If the second calibration jig 46 has not been attached to all of the nozzle mounting positions of the mounting head 16 (NO in step S36), the process returns to step S22. At this time, the same second calibration jig 46 as above is attached to another one of the multiple nozzle mounting positions of the mounting head 16. Then, the processes of steps S22 to S36 are repeated.

[0046] On the other hand, if the second calibration jig 46 has been attached to all of the nozzle attachment positions of the mounting head 16 (YES in step S36), the control device 26 causes the board conveyor 20 to carry the calibration jig accommodation station 40 out of the component mounter 10 (S38). Then, the calibration jig accommodation station 40 is transported to an adjacent component mounter 10. Thereafter, the same process as described above is executed in the adjacent component mounter 10.

[0047] The processes of steps S22 to S34 described above may be performed for only one of the multiple nozzle mounting sites of the mounting head 16. In this case, the process of step S26 is omitted. In this case, based on the amount of deviation of the mounting position identified for one of the multiple nozzle mounting sites of the mounting head 16, the mounting positions for all the other nozzle mounting sites are corrected.

[0048] In this embodiment, the calibration jig accommodation station 40 is carried into the component mounter 10 by the board conveyor 20, and the calibration jig 42 accommodated in the calibration jig accommodation station 40 is used to perform calibration when the placement head 16 is replaced. This eliminates the need for an operator to supply the calibration jig 42 to the component mounter 10, thereby reducing the burden on the operator. Furthermore, the calibration jig accommodation station 40 is sequentially carried into the multiple component mounters 10 constituting the component mounting line 100. The calibration jig accommodation station 40 accommodates all types of calibration jigs 42, 46 that can be used by the component mounters 10. As a result, even if different types of placement heads 16 are attached to the head holders 19 of the component mounters 10, the calibration process performed by the component mounters 10 can be performed by carrying in the same calibration jig accommodation station 40. This allows the calibration process to be automatically performed when the placement head 16 is replaced in the multiple component mounters 10 constituting the component mounting line 100.

[0049] In this embodiment, the calibration process using the first calibration jig 42 is performed first, and then the calibration process using the second calibration jig 46 is performed, but the present invention is not limited to this configuration. For example, only the calibration process using the first calibration jig 42 may be performed, and the calibration process using the second calibration jig 46 may be omitted.

[0050] In addition, in this embodiment, the first calibration jig 42 and the second calibration jig 46 are removed, and the first calibration jig 42 and the second calibration jig 46 are returned to the calibration jig accommodation station 40, and then the calibration jig accommodation station 40 is transported toward the adjacent component mounter 10. However, this configuration is not limited to this. For example, the calibration jig accommodation station 40 may be transported toward the adjacent component mounter 10 with the first calibration jig 42 and the second calibration jig 46 removed. The multiple component mounters 10 that make up the component mounting line 100 may use different types of placement heads 16 for each component mounter 10. In this case, the calibration process for the next component mounter 10 uses calibration jigs 42, 46 that are different from the calibration jigs 42, 46 used in the calibration process for the previous component mounter 10. Therefore, even if a calibration jig accommodation station 40 that does not accommodate the calibration jigs 42, 46 used in the calibration process of the previous mounter 10 is carried into the next mounter 10, the calibration jigs 42, 46 used in that mounter 10 are accommodated in the calibration jig accommodation station 40, and the calibration process can be properly performed in the next mounter 10. In this way, by transporting the calibration jig accommodation station 40 to the next mounter 10 without waiting for the calibration process of the previous mounter 10 to be completed, the time required for the calibration process for all mounters 10 that make up the component mounting line 100 can be shortened.

[0051] When the calibration jig accommodation station 40 is carried out toward the next mounter 10 with the first calibration jig 42 and the second calibration jig 46 removed from the previous mounter 10, after the calibration process in the previous mounter 10, the board conveyor 20 is driven in the reverse direction to return the calibration jig accommodation station 40 from the next mounter 10 to the previous mounter 10. Then, the first calibration jig 42 and the second calibration jig 46 used in the previous mounter 10 are accommodated again in the calibration jig accommodation station 40. This allows the first calibration jig 42 and the second calibration jig 46 used in the previous mounter 10 to be accommodated again in the calibration jig accommodation station 40. Also, instead of reversing the calibration jig accommodation station 40 to return it to the previous mounter 10, an empty calibration jig accommodation station 40 that does not accommodate the first calibration jig 42 and the second calibration jig 46 may be carried into the previous mounter 10. By carrying an empty calibration jig storage station 40 into the previous component mounting machine 10, the first calibration jig 42 and the second calibration jig 46 used in the previous component mounting machine 10 can be stored in the calibration jig storage station 40 again.

[0052] Points to note regarding the component mounting system 1 described in the embodiment will be described below. The mounting head 16 in the embodiment is an example of a "head," the board conveyor 20 is an example of a "board transport device," and the first imaging device 30 is an example of an "imaging device."

[0053] Although specific examples of the technology disclosed in this specification have been described in detail above, these are merely examples and do not limit the scope of the claims. The technology described in the claims includes various modifications and variations of the specific examples exemplified above. Furthermore, the technical elements described in this specification or drawings exhibit technical utility alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. Furthermore, the technology exemplified in this specification or drawings simultaneously achieves multiple objectives, and achieving one of those objectives itself has technical utility. [Explanation of symbols]

[0054] 1: Component mounting system 2: Circuit board 4: Electronic components 6: Nozzle 10: Component mounter 12: Parts feeder 14: Feeder holder 16: Mounting head 18: Head moving device 20: PCB conveyor 24: Touch panel 26: Control device 30: First imaging device 32: Second imaging device 40: Calibration fixture station 42: First calibration jig 44:Protrusion 46: Second calibration jig 48: Calibration parts 100: Component mounting line

Claims

1. A component mounting system that mounts multiple types of electronic components on a substrate, a plurality of types of nozzles, each of which picks up a different type of electronic component; a plurality of types of calibration jigs provided according to the types of the nozzles; a calibration jig accommodation station that accommodates the plurality of types of calibration jigs; a plurality of types of heads to which the nozzles and the calibration jigs are detachably attached, the plurality of types of heads being attached with different types of nozzles and calibration jigs depending on the types of the heads; A plurality of component mounters, the plurality of component mounters being arranged adjacent to each other in order, each of the component mounters comprising: a substrate transport device that carries the substrate or the calibration jig accommodation station into the component mounter through an entrance and carries the substrate or the calibration jig accommodation station out of the component mounter to an entrance of an adjacent component mounter in the next order; a head holding unit to which the plurality of types of heads can be attached and detached; A control unit, a carry-in process in which the board or the calibration jig accommodation station transported to the carry-in entrance of the component mounter is transported by the board transport device to a work position provided within the component mounter; a component mounting process in which, when the board is carried into the work position by the board transport device with the head attached to the head holding portion and the nozzle attached to the head, the electronic component sucked by the nozzle is mounted on the board; a calibration process in which, when the calibration jig accommodating station is carried into the work position by the substrate transport device while the head is attached to the head holding portion but the nozzle is not attached to the head, a calibration jig of a type corresponding to the type of head attached to the head holding portion is taken out of the calibration jig accommodating station and the removed calibration jig is used to perform a calibration operation to calibrate the position of the head relative to the head holding portion; a control unit configured to be able to execute a carry-out process in which, when the component mounting process is completed or after the calibration jig is at least removed, the processed board or the calibration jig accommodation station is carried out by the board transport device to an entrance of a next component mounter; A component mounting system comprising:

2. the calibration process is configured to accommodate the corresponding type of calibration jig in the calibration jig accommodation station when the calibration work is completed; 2. The component mounting system according to claim 1, wherein, in the carrying-out process, when the corresponding type of calibration jig is accommodated in the calibration jig accommodation station, the calibration jig accommodation station is transported to an adjacent component mounter.

3. each mounter further includes an imaging device that images the nozzle or the calibration jig attached to the head; The calibration process includes: an imaging process of imaging the calibration jig attached to the head with the imaging device; 3. The component mounting system according to claim 1, further comprising: a measurement process for measuring the position of the calibration jig from the image captured in the imaging process.

Images